Display panel, preparation method of display panel and display device

Abstract

The invention relates to a display panel, a preparation method of the display panel and a display device. The display panel includes: a substrate; the isolation structure is arranged on one side of the substrate, an isolation opening is defined by the isolation structure, the isolation structure comprises a first isolation part and a second isolation part, and the second isolation part is provided with a convex eave part protruding towards one side of the isolation opening from the first isolation part; at least part of the structure of the light-emitting device is located in the isolation opening; the first packaging structure is arranged on the side, away from the substrate, of the light-emitting device, the first packaging structure comprises a first branch, a second branch and a third branch, the first branch covers the side, away from the substrate, of the light-emitting device, and the second branch covers the side, facing the isolation opening, of the first isolation part; at least part of the third part is located on the side, facing the substrate, of the second isolation part and at least part of the third part is attached to the convex eave part, the first part, the second part and the third part define a gap space, and at least part of the third part and the first part are connected to form a connecting part.

Description

Display panel, method for manufacturing display panel, and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Chinese patent application No. 202410364325.1, entitled “Display panel and display device”, filed on March 27, 2024, the priority of Chinese patent application No. 202311733473.8, entitled “Display panel, display device and method for preparing display panel”, filed on December 15, 2023, and the priority of Chinese patent application No. 202310944339.6, entitled “Display panel and display device”, filed on July 28, 2023. The entire contents of the foregoing applications are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0004] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body, and wide range of applications, becoming the mainstream display device.

[0005] However, the process performance of current OLED display products needs to be improved.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the packaging effect of the display panel.

[0008] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure, arranged on one side of the substrate and enclosing a plurality of isolation openings, the isolation structure comprising a first isolation portion and a second isolation portion located on a side of the first isolation portion facing away from the substrate, the second isolation portion having a convex portion protruding from the first isolation portion toward a side of the isolation opening; a plurality of light-emitting devices, at least part of the structure of the light-emitting devices being located within the isolation openings; a first encapsulation structure, arranged on a side of the light-emitting devices facing away from the substrate, the first encapsulation structure comprising a first section, a second section, and a third section, the first section covering a side of the light-emitting devices facing away from the substrate, the second section covering a side of the first isolation portion facing the isolation opening, the third section at least partially located on a side of the second isolation portion facing the substrate and at least partially attached to the convex portion, the first section, the second section, and the third section enclosing a gap space, the third section being at least partially connected to the first section to form a connecting portion.

[0009] The embodiment of the first aspect of the present application further provides a display panel, comprising: a substrate; an isolation structure, arranged on one side of the substrate and enclosing a plurality of isolation openings, the isolation structure comprising a first isolation portion and a second isolation portion located on a side of the first isolation portion facing away from the substrate, the second isolation portion having a convex portion protruding from the first isolation portion toward a side of the isolation opening; a plurality of light-emitting devices, at least part of the structure of the light-emitting device being located within the isolation opening, the light-emitting device comprising a light-emitting unit and a first electrode located on a side of the light-emitting unit facing away from the substrate; a first packaging structure, arranged on a side of the light-emitting device facing away from the substrate, the first packaging structure comprising a first isolation portion. The first division, the second division and the third division, the first division covers the side of the light-emitting device away from the substrate, the second division covers the side of the first isolation portion facing the isolation opening, the third division is at least partially located on the side of the second isolation portion facing the substrate and is at least partially attached to the convex eaves portion, the first division, the second division and the third division are enclosed to form a gap space, the first division and the third division in at least part of the isolation opening are at least partially spaced apart and form a connecting opening, and the minimum size of the connecting opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thickness of the light-emitting unit and the first electrode of at least part of the light-emitting device and the sealing coefficient.

[0010] An embodiment of the first aspect of the present application also provides a display panel, comprising: a substrate; an isolation structure, arranged on one side of the substrate and enclosing an isolation opening; a light-emitting device, at least partially located within the isolation opening; a first packaging structure, arranged on a side of the light-emitting device facing away from the substrate, the first packaging structure comprising a first section and a second segment, the first section being located within the isolation opening and arranged on a side of the light-emitting device facing away from the substrate, the second segment being located on a side of the isolation structure facing the isolation opening, a surface on a side of the first section facing away from the substrate and a surface on a side of the second segment facing away from the isolation structure being at least partially interconnected to enclose a gap space.

[0011] An embodiment of the second aspect of the present application further provides a method for manufacturing a display panel, comprising:

[0012] An isolation structure is prepared on the substrate, the isolation structure enclosing an isolation opening, the isolation opening including a first opening and a second opening, the isolation structure including a first isolation portion and a second isolation portion located on a side of the first isolation portion facing away from the substrate, the second isolation portion having a convex portion protruding from the first isolation portion toward a side of the isolation opening;

[0013] sequentially preparing a first device material layer and a first packaging material layer on the entire surface;

[0014] The first packaging material layer and the first device material layer outside the first opening are etched and removed to form a first light-emitting device corresponding to the first opening and a first packaging unit located on a side of the first light-emitting device facing away from the substrate. The first packaging unit includes a first sub-section, a second sub-section, and a third sub-section. The first sub-section covers a side of the light-emitting device facing away from the substrate. The second sub-section covers a side of the first isolation portion facing the isolation opening. The third sub-section is at least partially located on a side of the second isolation portion facing the substrate and is at least partially attached to the convex portion. The first sub-section, the second sub-section, and the third sub-section of the first packaging unit enclose a gap space, and the gap space of the first packaging unit has a communicating opening.

[0015] Sequentially preparing a second device material layer and a second packaging material layer on the entire surface, wherein the second device material layer includes a light-emitting unit material layer and a first electrode material layer, wherein the first electrode material layer of the second device material layer is continuous on a side of the first packaging unit away from the substrate and blocks a communication opening of the first packaging unit;

[0016] The second packaging material layer outside the second opening is etched away using a first etching method, and then the second device material layer is etched away using a second etching method to form a second light emitting device corresponding to the second opening and a second packaging unit located on a side of the second light emitting device away from the substrate.

[0017] An embodiment of the third aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments or a display panel prepared by the preparation method according to any of the above embodiments.

[0018] In a display panel provided in an embodiment of the present application, the display panel includes a substrate, an isolation structure, a light-emitting device, and a first encapsulation structure. The isolation structure is disposed on one side of the substrate and encloses a plurality of isolation openings. At least a portion of the structure of the light-emitting device is located within the isolation openings. The isolation structure can be used to divide sub-pixels of the display panel. The isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion facing away from the substrate. The second isolation portion has a convex portion that protrudes from the first isolation portion toward the isolation openings, so that when manufacturing the light-emitting device of the display panel, at least a portion of the material of the light-emitting device can be directly evaporated on the entire surface. The convex portion of the second isolation portion can shield at least a portion of the material used to manufacture the light-emitting device, thereby isolating the material of the light-emitting device between adjacent sub-pixels, thereby facilitating the formation of multiple light-emitting devices spaced apart and located within the isolation openings. This eliminates the need for a high-precision mask when manufacturing the light-emitting device of the display panel. For example, a high-precision fine metal mask (FMM) is not required when evaporating the material of the light-emitting device, thereby significantly reducing the production cost of the display panel.

[0019] The first encapsulation structure is disposed on a side of the light-emitting device facing away from the substrate. The first encapsulation structure can be used to encapsulate the light-emitting device. The first encapsulation structure includes a first subsection, a second subsection, and a third subsection. The first subsection covers the side of the light-emitting device facing away from the substrate. The second subsection covers the side of the first isolation portion facing the isolation opening. The third subsection is at least partially located on the side of the second isolation portion facing the substrate and is at least partially attached to the convex portion. This allows the first encapsulation structure to have a larger size, effectively extending the encapsulation path of the first encapsulation structure.

[0020] The first division, the second division and the third division are enclosed to form a gap space, which can effectively reduce the mutual interference between the first division, the second division and the third division when the first packaging structure is formed, so that the first division can be better formed on the side of the light-emitting device away from the substrate, and the second division can be better formed on the side of the second isolation portion facing the isolation opening, and the third division can be better formed on the side of the second isolation portion facing the substrate, thereby effectively improving the packaging effect of the first packaging structure on the display panel.

[0021] By at least partially connecting the third segment to the first segment to form a connecting portion, the first segment can effectively support the second segment, making it difficult for the second segment to separate from the isolation structure, thereby effectively improving the packaging effect of the first packaging structure on the display panel. Furthermore, when a subsequent film layer is prepared on the first packaging structure, the material of the subsequent film layer can be more continuous at the connecting portion, which can facilitate the molding or patterning of the subsequent film layer, allowing the subsequent film layer to effectively cover the first packaging structure and provide a certain degree of protection for the first packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings, which are not drawn to scale.

[0023] FIG1 is a schematic diagram of a partial structure of a display panel provided in an embodiment of the present application;

[0024] FIG2 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0025] FIG3 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0026] FIG4 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0027] FIG5 is a schematic structural diagram of a connection portion provided in an embodiment of the present application;

[0028] FIG6 is a structural diagram of a connection portion provided by another embodiment of the present application;

[0029] FIG7 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0030] FIG8 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0031] FIG9 is a structural diagram of a connection portion provided in yet another embodiment of the present application;

[0032] FIG10 is a schematic diagram of a partial structure of a first packaging structure provided in an embodiment of the present application;

[0033] FIG11 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0034] FIG12 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0035] FIG13 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0036] FIG14 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0037] FIG15 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0038] FIG16 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0039] FIG17 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0040] FIG18 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0041] FIG19 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0042] FIG20 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0043] FIG21 is a schematic diagram of a partial structure of an isolation structure provided in an embodiment of the present application;

[0044] FIG22 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0045] FIG23 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0046] FIG24 is a schematic structural diagram of a first segment provided in an embodiment of the present application;

[0047] FIG25 is a schematic structural diagram of a first segment provided by another embodiment of the present application;

[0048] FIG26 is a schematic structural diagram of a first segment provided in yet another embodiment of the present application;

[0049] FIG27 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0050] FIG28 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0051] FIG29 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0052] FIG30 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0053] FIG31 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0054] FIG32 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0055] FIG33 is a partial schematic diagram of an isolation structure provided by another embodiment of the present application;

[0056] FIG34 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0057] FIG35 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0058] FIG36 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0059] 37 to 46 are schematic diagrams of a manufacturing process of a display panel manufacturing method provided in an embodiment of the present application;

[0060] FIG47 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0061] FIG48 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0062] FIG49 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0063] FIG50 is a schematic diagram of a planar structure of a display panel provided in one embodiment of the present disclosure;

[0064] FIG51 is an enlarged view of region S1 of the display panel shown in FIG50 ;

[0065] FIG52 is a cross-sectional view of the display panel shown in FIG51 along line MN;

[0066] FIG53 is an enlarged view of a portion of the display panel shown in FIG52;

[0067] FIG54 is a schematic structural diagram of another display panel provided as a comparative example according to an embodiment of the present disclosure;

[0068] 55A to 55D are process diagrams of a method for forming a display panel as shown in FIG. 5 , provided in one embodiment of the present disclosure;

[0069] FIG56 is a schematic diagram showing the positional relationship between a portion of a film layer of a display panel and an evaporation source during evaporation, provided by one embodiment of the present disclosure;

[0070] FIG57 is a cross-sectional view of a partial area of ​​a display panel provided by an embodiment of the present disclosure;

[0071] FIG58 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application;

[0072] 59 to 62 are schematic diagrams showing a manufacturing process of a method for manufacturing a display panel according to another embodiment of the present application;

[0073] FIG63 is a schematic flow chart of a method for manufacturing a display panel according to another embodiment of the present application;

[0074] 64 to 70 are schematic diagrams of a manufacturing process of a method for manufacturing a display panel provided in another embodiment of the present application.

[0075] Description of reference numerals:

[0076] 10-display panel; 10a-first encapsulation material layer; 10b-first support material layer; 10c-second encapsulation material layer; 10d-second support material layer; 10e-third encapsulation material layer; 10f-third support material layer; 10g-first device material layer; 10h-second device material layer; 10i-third device material layer; 11-first covering section; 12-second covering section; 13-third covering section; 14-first initial section; 15-second initial section; 16-third initial section; 17-first gap space; 18-second gap space; 19-third gap space; 101-light-emitting unit material layer; 102-first electrode material layer;

[0077] 100 - substrate; 110 - underlay; 120 - first insulating layer; 130 - second insulating layer; 140 - third insulating layer; 150 - driving circuit; 151 - transistor; 151a - gate; 151b - source and drain; 152 - storage capacitor; 152a - first plate; 152b - second plate;

[0078] 200 - light-emitting device; 200a - first light-emitting device; 200b - second light-emitting device; 200c - third light-emitting device; 210 - second electrode; 220 - light-emitting unit; 221 - first functional layer; 222 - light-emitting layer; 223 - second functional layer; 230 - first electrode;

[0079] 300-defining structure; 300a-defining opening; 310-isolating structure; 310a-isolating opening; 310aa-first opening; 310ab-second opening; 310ac-third opening; 310b-first end; 310c-second end; 311-first isolating portion; 312-second isolating portion; 312a-convex portion; 312aa-first isolating portion; 312ab-second isolating portion; 312ac-third isolating portion; 313-third isolating portion; 320-pixel defining layer; 320a-pixel opening; 321-pixel defining portion;

[0080] 400 - first packaging structure; 400a - gap space; 400b - communication opening; 400ba - first type of communication opening; 400bb - second type of communication opening; 400c - connection portion; 400d - first packaging area; 400e - second packaging area; 400f - third packaging area; 401 - first packaging unit; 402 - second packaging unit; 403 - third packaging unit; 410 - first subsection; 411 - main body; 411a - first main subsection; 411b - second main subsection; 411ba - first main subsection; 411bb - second main subsection; 412 - support portion; 420 - side section; 421 - second subsection; 421a - second subsection; 421b - third subsection; 422 - fourth subsection;

[0081] 500-second packaging layer;

[0082] 600-third encapsulation layer;

[0083] P-support structure; P1-first packaging part; P1a-light-transmitting opening; P2-second packaging part; P3-third packaging part; P4-fourth packaging part;

[0084] F-sealing structure;

[0085] AA-display area;

[0086] NA - Border area. DETAILED DESCRIPTION

[0087] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are set forth in order to provide a comprehensive understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the well-known structures and technologies are not shown in order to avoid unnecessary ambiguity in the present application; and, for clarity, the sizes of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0088] Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Hereinafter, various embodiments of the display panel, the method for manufacturing a display panel, and the display device will be described with reference to the accompanying drawings.

[0089] Figure 1 is a schematic diagram of a partial structure of a display panel 10 provided in an embodiment of the present application, and Figure 2 is a partial cross-sectional view of a display panel 10 provided in an embodiment of the present application, where the X direction in the figure may be the thickness direction of the display panel 10. Optionally, Figure 2 may be a partial cross-sectional view of an embodiment at AA in Figure 1.

[0090] The embodiment of the first aspect of the present application provides a display panel 10, comprising: a substrate 100; an isolation structure 310, which is arranged on one side of the substrate 100 and encloses a plurality of isolation openings 310a, the isolation structure 310 comprising a first isolation portion 311 and a second isolation portion 312 located on a side of the first isolation portion 311 facing away from the substrate 100, the second isolation portion 312 having a convex portion 312a protruding from the first isolation portion 311 toward the isolation opening 310a; a plurality of light-emitting devices 200, at least part of the structure of the light-emitting device 200 being located within the isolation opening 310a; a first encapsulation structure 400, which is arranged on a side of the light-emitting device 200 facing away from the substrate 100. On one side, the first packaging structure 400 includes a first division 410, a second division 421a and a third division 421b. The first division 410 covers the side of the light-emitting device 200 facing away from the substrate 100, the second division 421a covers the side of the first isolation portion 311 facing the isolation opening 310a, and the third division 421b is at least partially located on the side of the second isolation portion 312 facing the substrate 100 and is at least partially attached to the eaves portion 312a. The first division 410, the second division 421a and the third division 421b enclose a gap space 400a, and the third division 421b is at least partially connected to the first division 410 to form a connecting portion 400c.

[0091] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and encloses a plurality of isolation openings 310a. At least a portion of the structure of the light-emitting device 200 is located within the isolation openings 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10.

[0092] 1 , the isolation structure 310 may be in a grid shape, so that the isolation structure 310 can divide the sub-pixels in the display panel 10. The hollow regions in the grid-shaped isolation structure 310 may be isolation openings 310a.

[0093] The isolation structure 310 includes a first isolation portion 311 and a second isolation portion 312 located on the side of the first isolation portion 311 away from the substrate 100. The second isolation portion 312 has a convex portion 312a protruding from the first isolation portion 311 toward the side of the isolation opening 310a, so that when preparing the light-emitting device 200 of the display panel 10, at least part of the material of the light-emitting device 200 can be directly evaporated on the entire surface. The convex portion 312a of the second isolation portion 312 can block at least part of the material used to prepare the light-emitting device 200 to separate the material of the light-emitting device 200 between adjacent sub-pixels, so as to form a plurality of light-emitting devices 200 that are spaced apart and located in the isolation opening 310a, so that when preparing the light-emitting device 200 of the display panel 10, there is no need to set a mask with high precision. For example, there is no need to set a high-precision metal mask (Fine Metal Mask, FMM) when evaporating the material of the light-emitting device 200, thereby effectively reducing the production and preparation cost of the display panel 10.

[0094] The first encapsulation structure 400 is disposed on a side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. The first encapsulation structure 400 includes a first sub-portion 410, a second sub-portion 421a, and a third sub-portion 421b. The first sub-portion 410 covers the side of the light-emitting device 200 facing away from the substrate 100. The second sub-portion 421a covers the side of the first isolation portion 311 facing the isolation opening 310a. The third sub-portion 421b is at least partially located on the side of the second isolation portion 312 facing the substrate 100 and is at least partially attached to the convex portion 312a. This allows the first encapsulation structure 400 to have a larger size, thereby effectively extending the encapsulation path of the first encapsulation structure 400.

[0095] Optionally, in the embodiments of the present application, "one covering the other" may mean that the two are in direct contact with each other; or, it may mean that the two are not in direct contact, and another film layer structure may be interposed between them. For example, another film layer may be disposed between the second subsection 421a and the first isolation section 311, and another film layer may be disposed between the third subsection 421b and the second isolation section 312.

[0096] Optionally, the first subsection 410, the second subsection 421a, and the third subsection 421b may be connected in sequence. Specifically, the side of the first subsection 410 facing the first isolation portion 311 may be connected to the side of the second subsection 421a close to the substrate 100, and the side of the second subsection 421a close to the second isolation portion 312 may be connected to the side of the third subsection 421b close to the first isolation portion 311.

[0097] The first division 410, the second division 421a and the third division 421b are enclosed to form a gap space 400a, which can effectively reduce the mutual interference between the first division 410, the second division 421a and the third division 421b when the first packaging structure 400 is formed, so that the first division 410 can be better formed on the side of the light-emitting device 200 away from the substrate 100, and the second division 421a can be better formed on the side of the second isolation portion 312 facing the isolation opening 310a, and the third division 421b can be better formed on the side of the second isolation portion 312 facing the substrate 100, thereby effectively improving the packaging effect of the first packaging structure 400 on the display panel 10.

[0098] By providing the third segment 421b to be at least partially connected to the first segment 410 to form the connecting portion 400c, the first segment can provide better support for the second segment, preventing the second segment from being easily separated from the isolation structure 310, thereby effectively improving the encapsulation effect of the first encapsulation structure 400 on the display panel 10. Furthermore, when a subsequent film layer is prepared on the first encapsulation structure 400, the material of the subsequent film layer can be better continuous at the connecting portion 400c, facilitating the molding or patterning of the subsequent film layer, allowing the subsequent film layer to better cover the first encapsulation structure 400 and providing a certain degree of protection for the first encapsulation structure 400.

[0099] In some embodiments of the present application, the light emitting device 200 may include a light emitting unit 220 and a first electrode 230 . The first electrode 230 may be located on a side of the light emitting unit 220 facing away from the substrate 100 .

[0100] Optionally, the light emitting unit 220 may include a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer, an electron injection layer (EIL), and an electron transport layer (ETL).

[0101] Optionally, the light emitting device 200 may further include a second electrode 210 disposed on a side of the light emitting unit 220 facing the substrate 100 . The second electrode 210 may be located between the light emitting device 200 and the substrate 100 .

[0102] Optionally, the first electrode 230 and the second electrode 210 can serve as pixel electrodes of the display panel 10. One of the first electrode 230 and the second electrode 210 can serve as an anode, and the other can serve as a cathode to drive the light-emitting unit 220 to emit light. In the embodiment of the present application, the first electrode 230 is used as the cathode of the display panel 10, and the second electrode 210 is used as the anode of the display panel 10.

[0103] In some embodiments of the present application, the substrate 100 can be configured in various ways. Optionally, the substrate 100 includes a substrate 110 and a driving circuit 150 disposed on the side of the substrate 110 facing the isolation structure 310. The driving circuit 150 may include a transistor 151, a storage capacitor 152, and driving signal lines for connecting various devices. The transistor 151 includes a semiconductor, a gate 151a, and a source and drain 151b. The storage capacitor 152 includes a first plate 152a and a second plate 152b.

[0104] As an example, the substrate 100 may further include a first insulating layer 120, a second insulating layer 130, and a third insulating layer 140, which are located on a side of the substrate 110 facing the driving circuit 150 and are sequentially stacked on the substrate 110. The gate 151a and the first electrode 152a may be provided on the same layer. For example, the gate 151a and the first electrode 152a may be located on a side of the first insulating layer 120 facing the substrate 110. The second electrode 152b may be located between the first insulating layer 120 and the second insulating layer 130, and the source and drain 151b may be located between the second insulating layer 130 and the third insulating layer 140.

[0105] In some optional embodiments, the material of the isolation structure 310 may include a conductive material, and the first electrode 230 may be connected to the isolation structure 310, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the isolation structure 310. That is, the first electrodes 230 of adjacent sub-pixels can be electrically connected to each other through the isolation structure 310 to form a surface electrode, thereby facilitating control of the first electrodes 230 in the display panel 10. Optionally, the material of the first isolation portion 311 may include a conductive material, and the first electrode 230 may be connected to the first isolation portion 311, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the first isolation portion 311.

[0106] Fig. 3 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application. Alternatively, Fig. 3 may be a partial cross-sectional view of another embodiment taken at AA in Fig. 1 .

[0107] As shown in FIG3 , in some optional embodiments, the isolation structure 310 further includes a third isolation portion 313 disposed on the side of the first isolation portion 311 facing the substrate 100. The third isolation portion 313 is disposed protruding from the first isolation portion 311 toward the isolation opening 310a, i.e., it includes a protrusion protruding from the first isolation portion 311 toward the isolation opening 310a. The material of the third isolation portion 313 may include a conductive material, and the first electrode 230 may be connected to the third isolation portion 313, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the third isolation portion 313. By providing the third isolation portion 313 protruding from the first isolation portion 311 toward the isolation opening 310a, the third isolation portion 313 can have a larger size to facilitate connection with the first electrode 230.

[0108] Optionally, the display panel 10 also includes a pixel definition layer 320 arranged on the side of the substrate 100 facing the light-emitting device 200, the pixel definition layer 320 includes a pixel defining portion 321 and a pixel opening 320a formed by the pixel defining portion 321, and the isolation structure 310 is arranged on the side of the pixel defining portion 321 facing away from the substrate 100, and the pixel opening 320a can be connected to the isolation opening 310a.

[0109] Optionally, the orthographic projection of the pixel opening 320a on the substrate 100 may be located within the orthographic projection of the isolation opening 310a on the substrate 100. The orthographic projection of the pixel opening 320a on the substrate 100 may refer to the orthographic projection area enclosed by the orthographic projection of the inner wall enclosing the pixel opening 320a on the substrate 100. The orthographic projection of the isolation opening 310a on the substrate 100 may refer to the orthographic projection area enclosed by the orthographic projection of the inner wall enclosing the isolation opening 310a on the substrate 100.

[0110] Optionally, the pixel defining portion 321 may be disposed between adjacent second electrodes 210 , and the adjacent second electrodes 210 may be insulated by the pixel defining portion 321 . The provision of the pixel defining portion 321 may also facilitate the division of sub-pixels in the display panel 10 .

[0111] Optionally, the pixel defining portion 321 may also be located between the second electrode 210 and the isolation structure 310, and the isolation structure 310 and the second electrode 210 may also be insulated by the pixel defining portion 321, so that a short circuit connection between the first electrode 230 and the second electrode 210 is not likely to occur through the isolation structure 310, thereby improving the working reliability of the display panel 10.

[0112] In these optional embodiments, the relative positioning of the isolation structure 310 and the pixel defining portion 321 can be arranged in various ways. Optionally, as shown in Figures 2 and 3, the isolation structure 310 can be arranged on the side of the pixel defining portion 321 facing away from the substrate 100, or the pixel defining portion 321 can be provided with a receiving groove, with at least a portion of the isolation structure 310 located within the receiving groove. This prevents the isolation structure 310 from being taller than the substrate 100, thereby effectively reducing the thickness of the display panel 10. For ease of description, the following embodiments are described using the example of the isolation structure 310 being arranged on the side of the pixel defining portion 321 facing away from the substrate 100.

[0113] FIG4 is a partial cross-sectional view of a display panel 10 provided in yet another embodiment of the present application. FIG4 may be a partial cross-sectional view of yet another embodiment taken at AA in FIG1 .

[0114] As shown in FIG4 , in some optional embodiments, the isolation opening 310a may include a first opening 310aa and a third opening 310ac, and the light emitting device 200 includes a first light emitting device 200a disposed corresponding to the first opening 310aa and a third light emitting device 200c disposed corresponding to the third opening 310ac.

[0115] Optionally, the first light emitting device 200a and the third light emitting device 200c emit different colors, and the display panel 10 can display multiple colors through the first light emitting device 200a and the third light emitting device 200c that emit different colors.

[0116] Optionally, the first light-emitting device 200a disposed corresponding to the first opening 310aa may mean that the orthographic projection of the first light-emitting device 200a on the substrate 100 may be located within the orthographic projection of the first opening 310aa on the substrate 100. Optionally, the third light-emitting device 200c disposed corresponding to the third opening 310ac may mean that the orthographic projection of the third light-emitting device 200c on the substrate 100 may be located within the orthographic projection of the third opening 310ac on the substrate 100.

[0117] Optionally, the material of the light emitting unit 220 of the first light emitting device 200a and the material of the light emitting unit 220 of the third light emitting device 200c may be at least partially different, so as to achieve different luminous colors of the first light emitting device 200a and the third light emitting device 200c.

[0118] Optionally, the first encapsulation structure 400 may include a first encapsulation unit 401 at least partially located within the first opening 310aa and a third encapsulation unit 403 at least partially located within the third opening 310ac. The first encapsulation unit 401 may relatively independently encapsulate the first light-emitting device 200a within the first opening 310aa, and the third encapsulation unit 403 may relatively independently encapsulate the third light-emitting device 200c within the third opening 310ac. This ensures that the encapsulation of the first encapsulation unit 401 and the encapsulation of the third encapsulation unit 403 do not affect each other. That is, if one of the first encapsulation unit 401 and the third encapsulation unit 403 is damaged, the encapsulation effect of the other is unlikely to be affected, thereby significantly improving the encapsulation effect of the display panel 10.

[0119] Optionally, the first encapsulation unit 401 and the third encapsulation unit 403 may be spaced apart from each other, so that the encapsulation effect of the first encapsulation unit 401 and the encapsulation effect of the third encapsulation unit 403 are less likely to affect each other.

[0120] Optionally, during the manufacturing process of the display panel 10, the manufacturing step of the first light-emitting device 200a may be performed before the manufacturing step of the third light-emitting device 200c. For example, during the manufacturing process of the display panel 10, the first light-emitting device 200a and the first encapsulation unit 401 may be manufactured first, and then the third light-emitting device 200c and the third encapsulation unit 403 may be manufactured. Specifically, the second electrodes 210 of the first light-emitting device 200a and the third light-emitting device 200c may be manufactured simultaneously. Then, the light-emitting unit 220 and the first electrode 230 of the first light-emitting device 200a may be manufactured to complete the manufacturing of the first light-emitting device 200a. The first encapsulation unit 401 may be formed on the first light-emitting device 200a. Then, the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c may be manufactured to complete the manufacturing of the third light-emitting device 200c. Finally, the third encapsulation unit 403 may be formed on the third light-emitting device 200c.

[0121] In some optional embodiments, the isolation opening 310a further includes a second opening 310ab, and the light-emitting device 200 includes a second light-emitting device 200b disposed corresponding to the second opening 310ab.

[0122] Optionally, the first light-emitting device 200a, the second light-emitting device 200b, and the third light-emitting device 200c emit different colors, and the display panel 10 can display multiple colors by using the first light-emitting device 200a, the second light-emitting device 200b, and the third light-emitting device 200c that emit different colors. For example, the first light-emitting device 200a can be used to emit red light, the second light-emitting device 200b can be used to emit green light, and the third light-emitting device 200c can be used to emit blue light.

[0123] Optionally, the second light-emitting device 200 b provided corresponding to the second opening 310 ab may mean that the orthographic projection of the second light-emitting device 200 b on the substrate 100 may be located within the orthographic projection of the second opening 310 ab on the substrate 100 .

[0124] Optionally, the material of the light-emitting unit 220 of the first light-emitting device 200a, the material of the light-emitting unit 220 of the second light-emitting device 200b and the material of the light-emitting unit 220 of the third light-emitting device 200c may be at least partially different to achieve different light-emitting colors of the first light-emitting device 200a, the second light-emitting device 200b and the third light-emitting device 200c.

[0125] Optionally, the first encapsulation structure 400 includes a second encapsulation unit 402 at least partially located within the second opening 310ab. The second encapsulation unit 402 can independently encapsulate the second light-emitting device 200b within the second opening 310ab, so that the encapsulation of the first encapsulation unit 401, the encapsulation of the second encapsulation unit 402, and the encapsulation of the third encapsulation unit 403 do not affect each other. That is, if one of the first encapsulation unit 401, the second encapsulation unit 402, and the third encapsulation unit 403 is damaged, it is unlikely to affect the encapsulation effect of the other, thereby effectively improving the encapsulation effect of the display panel 10.

[0126] Optionally, the first encapsulation unit 401 , the second encapsulation unit 402 and the third encapsulation unit 403 may be arranged in pairs.

[0127] Optionally, during the manufacturing process of the display panel 10, the manufacturing step of the second light-emitting device 200b is located between the manufacturing steps of the first light-emitting device 200a and the manufacturing steps of the third light-emitting device 200c. For example, during the manufacturing process of the display panel 10, the first light-emitting device 200a and the first packaging unit 401 may be manufactured first, followed by the manufacturing steps of the second light-emitting device 200b and the second packaging unit 402, and then the manufacturing steps of the third light-emitting device 200c and the third packaging unit 403. Specifically, the preparation of the second electrode 210 of the first light-emitting device 200a, the second light-emitting device 200b and the third light-emitting device 200c can be completed simultaneously first, and then the light-emitting unit 220 and the first electrode 230 of the first light-emitting device 200a can be prepared to complete the preparation of the first light-emitting device 200a, and then the first packaging unit 401 is prepared on the first light-emitting device 200a, and then the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b are prepared to complete the preparation of the second light-emitting device 200b, and then the second packaging unit 402 is prepared on the second light-emitting device 200b, and then the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c are prepared to complete the preparation of the third light-emitting device 200c, and finally the third packaging unit 403 is prepared on the third light-emitting device 200c.

[0128] In some embodiments of the present application, the material of the first encapsulation structure 400 may include an inorganic material, so that the first encapsulation structure 400 has a good encapsulation capability to reduce the impact of water vapor on the light-emitting device 200. Optionally, the first encapsulation structure 400 can be prepared by a chemical vapor deposition (CVD) process.

[0129] In some optional embodiments, the third division 421b is at least partially connected to the first division 410 to form a connecting portion 400c, which may mean that a side of the third division 421b close to the isolation opening 310a may be at least partially connected to a surface of the first division 410 facing away from the substrate 100 to form a connecting portion 400c.

[0130] It can be understood that the surface of the first division 410 on the side facing away from the substrate 100 will not be connected to the side of the third division 421b close to the isolation opening 310a in its entirety, that is, the side of the third division 421b close to the isolation opening 310a is at least partially connected to the surface of the first division 410 on the side facing away from the substrate 100 to form the connecting portion 400c. This means that the surface of the first division 410 on the side facing away from the substrate 100 is connected everywhere to the surface of the third division 421b on the side facing away from the isolation opening 310a, or the surface of the first division 410 on the side facing away from the substrate 100 is partially connected to the surface of the third division 421b on the side facing away from the isolation opening 310a.

[0131] Alternatively, the third subsection 421b and the first subsection 410 may not have a distinct interface at the connection portion 400c. For example, the third subsection 421b and the first subsection 410 may be integrally formed at the connection portion 400c, i.e., the material of the third subsection 421b may be integrated with the material of the first subsection 410 at the connection portion 400c. Alternatively, the third subsection 421b and the first subsection 410 may have a distinct interface at the connection portion 400c, i.e., the surface of the third subsection 421b near the isolation opening 310a and the surface of the first subsection 410 facing away from the substrate 100 may be in contact with each other but not integrated.

[0132] In some optional embodiments, the third portion 421 b may also partially cover the end portion of the second isolation portion 312 facing the isolation opening 310 a .

[0133] Optionally, the side of the third division 421b away from the first isolation portion 311 can be arranged to protrude from the second isolation portion 312, so that the side of the third division 421b close to the isolation opening 310a can be at least partially connected to the surface of the side of the first division 410 away from the substrate 100 to form a connecting portion 400c, that is, the first division 410 can provide better support for the third division 421b.

[0134] In some optional embodiments, the first section 410 may include a first main section 411a and a second main section 411b connected to each other, wherein the first main section 411a is located in the pixel opening 320a and the second main section 411b is located on a side of the pixel defining portion 321 facing away from the substrate 100 .

[0135] Optionally, the orthographic projection of the first body portion 411a on the substrate 100 may be located within the orthographic projection of the pixel opening 320a on the substrate 100 , and the orthographic projection of the second body portion 411b on the substrate 100 may be located within the orthographic projection of the pixel defining portion 321 on the substrate 100 .

[0136] Optionally, the connecting portion 400 c may be formed by at least partially connecting a side of the third portion 421 b close to the isolation opening 310 a and a surface of the second main portion 411 b facing away from the substrate 100 .

[0137] Optionally, the side of the second main portion 411b facing the isolation structure 310 may be connected to the side of the second portion 421a facing the substrate 100. The gap space 400a may be formed by the second main portion 411b, the second portion 421a, and the third portion 421b.

[0138] Optionally, the orthographic projection of the connecting portion 400c on the substrate 100 may be arranged to at least partially overlap with the orthographic projection of the pixel defining portion 321 on the substrate 100, that is, at least part of the connecting portion 400c may be located on the side of the pixel defining portion 321 facing away from the substrate 100, wherein the pixel defining portion 321 may raise the position of the second main body division 411b to facilitate the connection between the side of the third division 421b close to the isolation opening 310a and the surface of the second main body division 411b facing away from the substrate 100.

[0139] FIG5 is a schematic structural diagram of a connecting portion 400c provided in an embodiment of the present application.

[0140] As shown in FIG. 4 and FIG. 5 , in some optional embodiments, the orthographic projection of the connecting portion 400 c within at least a portion of the isolation opening 310 a on the substrate 100 is annular, so that the gap space 400 a is a closed space.

[0141] Optionally, the gap space 400a within at least part of the isolation opening 310a is a closed space, specifically, the first sub-portion 410, the second sub-portion 421a and the third sub-portion 421b within at least part of the isolation opening 310a can be enclosed to form the closed gap space 400a.

[0142] Optionally, the orthographic projection of the connecting portion 400c on the substrate 100 is annular, which may mean that the orthographic projection of the connecting portion 400c on the substrate 100 is a closed annular shape, so as to form a sealed gap space 400a. The sealed gap space 400a formed by the first subsection 410, the second subsection 421a, and the third subsection 421b may not be connected to other external spaces, thereby further improving the structural stability of the first subsection 410, the second subsection 421a, and the third subsection 421b.

[0143] Optionally, the orthographic projection of the connecting portion 400 c on the substrate 100 may be arranged around the orthographic projection of the pixel opening 320 a on the substrate 100 .

[0144] In these optional embodiments, by arranging that the positive projection shape of the connection portion 400c in at least part of the isolation opening 310a on the substrate 100 is annular, a larger connection area is provided between the first division 410 in the isolation opening 310a and the third division 421b on the peripheral side of the isolation structure 310, so that the first division 410 in the isolation opening 310a can better support the second division 421a and the third division 421b on the peripheral side of the isolation structure 310, thereby better improving the supporting effect of the first division 410 on the second division 421a and the third division 421b, making it difficult for the second division 421a and the third division 421b to separate from the isolation structure 310, and better improving the packaging effect of the first packaging structure 400 on the display panel 10. Moreover, when preparing a subsequent film layer on the first packaging structure 400, the material of the subsequent film layer can be better continuous at the annular connecting portion 400c, which can facilitate the molding of the subsequent film layer or facilitate the patterning of the subsequent film layer, so that the subsequent film layer can better cover at least part of the first packaging structure 400 within the isolation opening 310a, and the subsequent film layer can provide a certain degree of protection to the first packaging structure 400.

[0145] In some optional embodiments, the gap space 400a within the first opening 310aa is a closed space. For example, the first subsection 410 of the first packaging unit 401, the second subsection 421a of the first packaging unit 401, and the third subsection 421b of the first packaging unit 401 can enclose and form the closed gap space 400a.

[0146] Optionally, the third subsection 421b within the first opening 310aa is connected to the first subsection 410 to form a connecting portion 400c, and the orthographic projection of the connecting portion 400c within the first opening 310aa onto the substrate 100 is annular. For example, a surface of the first subsection 410 in the first packaging unit 401 facing away from the substrate 100 may be connected to a surface of the third subsection 421b covering the second isolation portion 312, facing away from the first isolation portion 311, to form an annular connecting portion 400c.

[0147] In these optional embodiments, by setting the gap space 400a within the first opening 310aa as a closed space, the first section 410 in the first packaging unit 401 can provide better support for the third section 421b, so that the first packaging unit 401 can have better structural stability, thereby making the first packaging unit 401 less susceptible to damage from subsequent processes. For example, the first packaging unit 401 is less susceptible to damage during the preparation of the second light-emitting device 200b, the second packaging unit 402, the third light-emitting device 200c and the third packaging unit 403, thereby better improving the packaging stability of the first packaging unit 401.

[0148] Moreover, when preparing a subsequent film layer on the first packaging unit 401, the material of the subsequent film layer can be better continuous at the connection portion 400c, which can facilitate the molding of the subsequent film layer or facilitate the patterning of the subsequent film layer, so that the subsequent film layer can better cover the first packaging unit 401 and the subsequent film layer can provide a certain degree of protection to the first packaging unit 401.

[0149] For example, in the subsequent process of preparing the light-emitting unit 220, the second electrode 210 and the second packaging unit 402 of the second light-emitting device 200b, after the materials of the light-emitting unit 220 and the second electrode 210 of the second light-emitting device 200b are prepared on the entire surface, the materials of the light-emitting unit 220 and the second electrode 210 of the second light-emitting device 200b can be relatively continuous on the first packaging unit 401, so that when the light-emitting unit 220 of the second light-emitting device 200b and the second packaging unit 402 on the second electrode 210 are patterned, that is, when the material of the second packaging unit 402 outside the second opening 310ab is removed, the material of the light-emitting unit 220 and the second electrode 210 of the second light-emitting device 200b can be used to protect the first packaging unit 401 within the first opening 310aa, so that the etching material is not easy to damage the first packaging unit 401, thereby better improving the structural stability of the first packaging unit 401. Moreover, when preparing the second light-emitting device 200b or the second packaging unit 402, the etching material is not easy to enter the gap space 400a of the first packaging unit 401, which can effectively reduce the etching damage of the etching material to the inner wall of the gap space 400a in the first packaging unit 401, thereby effectively improving the structural stability of the first packaging structure 400.

[0150] For another example, in the subsequent process of preparing the light-emitting unit 220, the second electrode 210 and the third packaging unit 403 of the third light-emitting device 200c, after the materials of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c are prepared on the entire surface, the materials of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c can be relatively continuous on the first packaging unit 401, so that when the light-emitting unit 220 of the third light-emitting device 200c and the third packaging unit 403 on the second electrode 210 are patterned, that is, when the material of the third packaging unit 403 outside the third opening 310ac is removed, the material of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c can be used to protect the first packaging unit 401 within the first opening 310aa, so that the etching material is not easy to damage the first packaging unit 401, thereby better improving the structural stability of the first packaging unit 401. Moreover, when preparing the third light-emitting device 200c or the third packaging unit 403, the etching material is not easy to enter the gap space 400a of the first packaging unit 401, which can effectively reduce the etching damage of the etching material to the inner wall of the gap space 400a in the first packaging unit 401, thereby effectively improving the structural stability of the first packaging structure 400.

[0151] Figure 6 is a schematic structural diagram of a connection portion 400c provided in another embodiment of the present application. Figure 7 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application, and Figure 7 may be a partial cross-sectional view of another embodiment at AA in Figure 1 .

[0152] As shown in Figures 6 and 7, in some optional embodiments, the first subsection 410 and the third subsection 421b within the at least partially isolated opening 310a may be at least partially spaced apart to form a communicating opening 400b. For example, the first subsection 410 and the third subsection 421b within the second opening 310ab may be at least partially spaced apart to form a communicating opening 400b, and / or the first subsection 410 and the third subsection 421b within the third opening 310ac may be at least partially spaced apart to form a communicating opening 400b.

[0153] Optionally, a surface of at least a portion of the first section 410 in the isolation opening 310a facing away from the substrate 100 and a surface of at least a portion of the third section 421b close to the isolation opening 310a are at least partially spaced apart to form at least one communicating opening 400b.

[0154] In these optional embodiments, by providing a connecting opening 400b, material can be subsequently filled into the gap space 400a through the connecting opening 400b to better support the second division 421a and the third division 421b, so that the second division 421a and the third division 421b are not easily separated from the isolation structure 310, which can better improve the packaging effect of the first packaging structure 400 on the display panel 10.

[0155] In some optional embodiments, at least a portion of the gap space 400a is filled with a support structure P. The support structure P can provide good support for the second sub-portion 421a and the third sub-portion 421b. Specifically, the support structure P can provide good support for the second sub-portion 421a and the third sub-portion 421b, so that the second sub-portion 421a and the third sub-portion 421b are not easily separated from the isolation structure 310, thereby effectively improving the packaging effect of the first packaging structure 400 on the display panel 10.

[0156] Optionally, when preparing the display panel 10 , the material of the support structure P may be filled into the gap space 400 a through the communication opening 400 b .

[0157] Optionally, the material of the support structure P may include an organic material, so that the material of the support structure P may have good fluidity, so that the support structure P can be filled into the gap space 400a through the communication opening 400b.

[0158] In some optional embodiments of the present application, there are multiple methods for preparing the support structure P.

[0159] In some optional embodiments, the support structure P may be prepared independently. Specifically, the support structure P may be prepared after the first encapsulation structure 400 in the partial isolation opening 310 a is prepared.

[0160] For example, the gap space 400a in the second opening 310ab may form at least one communicating opening 400b, that is, the second packaging unit 402 may have at least one communicating opening 400b. After the preparation of the second packaging unit 402 is completed and before the preparation of the third light-emitting device 200c, the material of the support structure P may be filled into the gap space 400a of the second packaging unit 402 through the communicating opening 400b to complete the preparation of at least part of the support structure P. The support structure P filled in the gap space 400a of the second packaging unit 402 can be used to support the second packaging unit 400. 2, and the support structure P filled in the gap space 400a of the second packaging unit 402 can also be used to protect the second packaging unit 402 at the gap space 400a, so that when preparing the third light-emitting device 200c or the third packaging unit 403, the etching material is not easy to enter the gap space 400a of the second packaging unit 402, which can better reduce the etching damage of the etching material to the inner wall of the gap space 400a in the second packaging unit 402, thereby better improving the structural stability of the first packaging structure 400.

[0161] For another example, the gap space 400a within the third opening 310ac may form at least one connecting opening 400b, that is, the third packaging unit 403 may have at least one connecting opening 400b. After the preparation of the third packaging unit 403 is completed, the material of the support structure P may be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b to complete the preparation of at least part of the support structure P.

[0162] FIG8 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application. FIG8 may be a partial cross-sectional view of another embodiment at AA in FIG1 .

[0163] As shown in FIG. 8 , in some other optional embodiments, when preparing other film layer structures in the display panel 10 , materials of other film layer structures may be filled into the gap space 400 a through the connecting opening 400 b to form a support structure P.

[0164] Optionally, the display panel 10 further includes a second encapsulation layer 500 disposed on a side of the first encapsulation structure 400 facing away from the substrate 100. A surface of the first sub-portion 410 facing away from the substrate 100 within at least a portion of the isolation opening 310a is at least partially spaced apart from a surface of the third sub-portion 421b adjacent to the isolation opening 310a to form a communicating opening 400b. At least a portion of the second encapsulation layer 500 is located within the gap space 400a to form a support structure P. The material of the second encapsulation layer 500 is the same as that of the support structure P.

[0165] For example, when the second encapsulation layer 500 is prepared after the first encapsulation structure 400 is prepared, at least a portion of the material of the second encapsulation layer 500 may extend into the gap space 400 a through the communication opening 400 b to form the support structure P.

[0166] In these optional embodiments, the second encapsulation layer 500 can also be used to encapsulate the light-emitting device 200 of the display panel 10. When preparing the second encapsulation layer 500, the material of the second encapsulation layer 500 can enter the gap space 400a through the communication opening 400b to form a support structure P, so that part of the material of the second encapsulation layer 500 can also be used to support the second sub-portion 421a and the third sub-portion 421b, thereby further improving the structural stability of the first encapsulation structure 400 in the gap space 400a. The provision of the second encapsulation layer 500 can also further improve the encapsulation effect of the display panel 10.

[0167] Optionally, the material of the second encapsulation layer 500 includes an organic material, so that the second encapsulation layer 500 can have good fluidity, so that the material of the second encapsulation layer 500 can be easily extended into the gap space 400a through the communication opening 400b during the preparation of the second encapsulation layer 500. Optionally, the second encapsulation layer 500 can be prepared by inkjet printing (IJP).

[0168] Optionally, the display panel 10 may further include a third encapsulation layer 600 disposed on a side of the second encapsulation layer 500 facing away from the substrate 100 , so as to further enhance the encapsulation effect of the light-emitting device 200 .

[0169] Optionally, the material of the third encapsulation layer 600 may include an inorganic material, so that the third encapsulation layer 600 has a good encapsulation capability to reduce the impact of water vapor on the light-emitting device 200. Optionally, the third encapsulation layer 600 may be prepared by a chemical vapor deposition process.

[0170] It is understandable that the display panel 10 may further include a filter layer, an optical adhesive or a cover structure located on a side of the third encapsulation layer 600 away from the second encapsulation layer 500 .

[0171] In some optional embodiments, the first encapsulation structure 400 may further include a fourth sub-portion 422 located on a side of the second isolation portion 312 facing away from the substrate 100 and spaced apart from the isolation structure 310. The fourth sub-portion 422 located on the side of the isolation structure 310 facing away from the substrate 100 may effectively reduce the path for water vapor (which may include etching materials) to intrude into the light-emitting device 200, thereby effectively improving the encapsulation effect of the first encapsulation structure 400 on the light-emitting device 200.

[0172] Optionally, the first section 410 , the second section 421 a , the third section 421 b and the fourth section 422 may be connected in sequence.

[0173] Specifically, a side of the second portion 421 a facing away from the substrate 100 may be connected to a side of the fourth portion 422 facing the isolation opening 310 a .

[0174] Optionally, a support structure P may be filled between the fourth subsection 422 and the isolation structure 310. The support structure P filled between the fourth subsection 422 and the isolation structure 310 may effectively limit the fourth subsection 422. For example, the support structure P filled between the fourth subsection 422 and the isolation structure 310 may be used to support the fourth subsection 422, preventing the fourth subsection 422 from breaking and falling toward the isolation structure 310, thereby effectively improving the structural stability of the first packaging structure 400.

[0175] Optionally, when at least part of the second packaging layer 500 is reused as the support structure P, at least part of the material of the second packaging layer 500 can also extend between the fourth division 422 and the isolation structure 310 to form the support structure P, so that part of the material of the second packaging layer 500 can also be used to support the fourth division 422.

[0176] In some optional embodiments, at least part of the support structure P may also be located on the side of the fourth section 422 away from the isolation structure 310, so that the fourth section 422 can be better wrapped by the support structure P, so as to further enhance the limiting effect of the support structure P on the fourth section 422, so that the support structure P can limit the fourth section 422 from falling off and breaking toward the pixel opening 320a, thereby better improving the structural stability of the first packaging structure 400.

[0177] Optionally, adjacent fourth subsections 422 may be spaced apart. For example, the side of the isolation structure 310 facing away from the substrate 100 may have at least two fourth subsections 422, each of which may be connected to a second subsection 421a within a different isolation opening 310a. By spacing adjacent fourth subsections 422 apart, when preparing the support structure P, the material of the support structure P can extend through the spaces between the adjacent fourth subsections 422 to between the fourth subsections 422 and the isolation structure 310, thereby facilitating the formation of a support structure P that is well wrapped around the sides of the fourth subsections 422.

[0178] In some embodiments of the present application, there are various arrangements of the communication openings 400 b.

[0179] As shown in Figure 6, in some optional embodiments, there are multiple communication openings 400b in at least part of the isolation opening 310a, and the multiple communication openings 400b are arranged at intervals. For example, there can be multiple communication openings 400b in the second opening 310ab.

[0180] Optionally, a plurality of communication openings 400 b may be arranged at intervals around the pixel opening 320 a .

[0181] In these optional embodiments, by reasonably setting the number of connecting openings 400b, the connection area between the first division 410 and the third division 421b can be better controlled, so that the first division 410 can provide better support for the third division 421b to improve the structural stability of the first packaging structure 400, while also reducing the material blocking effect of the connecting part 400c on the support structure P, so that the material of the support structure P can be more fully filled in the gap space 400a, thereby improving the packaging effect of the first packaging structure 400 on the light-emitting device 200.

[0182] Optionally, the positive projection shape of the connecting portion 400c within at least part of the isolation opening 310a on the substrate 100 may not be a closed ring. For example, the number of connecting portions 400c may be multiple, and the multiple connecting portions 400c may be arranged at intervals around the pixel opening 320a, and the connecting opening 400b may be located between adjacent connecting portions 400c.

[0183] Optionally, the plurality of communication openings 400b may be arranged at equal intervals.

[0184] There are various ways to set the size of the communication opening 400b. Optionally, as shown in FIG6 , the orthographic projection areas of the communication openings 400b on the substrate 100 may be equal, and / or the orthographic projection shapes of the communication openings 400b on the substrate 100 may be the same. This allows the connecting portion 400c to more evenly support the third subsection 421b of the isolation structure 310 toward the inner side of the isolation opening 310a, thereby improving the structural stability of the first packaging structure 400. Furthermore, the material of the support structure P can be more evenly filled into the gap space 400a of the isolation structure 310 toward the inner side of the isolation opening 310a through the communication opening 400b.

[0185] FIG9 is a schematic structural diagram of a connecting portion 400 c provided in yet another embodiment of the present application.

[0186] Optionally, as shown in FIG9 , the communication openings 400b include first-type communication openings 400ba and second-type communication openings 400bb, wherein the orthographic projection area of ​​the first-type communication openings 400ba on the substrate 100 is larger than the orthographic projection area of ​​the second-type communication openings 400bb on the substrate 100. By providing the first-type communication openings 400ba and the second-type communication openings 400bb of unequal areas, the first-type communication openings 400ba with larger areas facilitate subsequent filling of the gap space 400a with material, and the first sections 410 on both sides of the second-type communication openings 400bb with smaller areas can better support the third section 421b. Thus, the first section 410 can provide better support for the third section 421b, thereby improving the structural stability of the first packaging structure 400. Furthermore, the material blocking effect of the connection portion 400c on the support structure P can be reduced, so that the material of the support structure P can be more fully filled into the gap space 400a.

[0187] Optionally, the first-type communication openings 400ba and the second-type communication openings 400bb may be arranged alternately, i.e., the first-type communication openings 400ba may be located between adjacent second-type communication openings 400bb, and / or the second-type communication openings 400bb may be located between adjacent first-type communication openings 400ba. For example, on the inner side of the isolation structure 310 facing the isolation opening 310a, the first-type communication openings 400ba and the second-type communication openings 400bb may be arranged alternately, to better balance the structural strength of the first packaging structure 400 and the ability of the first packaging structure 400 to facilitate material filling of the support structure P.

[0188] FIG10 is a schematic diagram of a partial structure of a first packaging structure 400 provided in an embodiment of the present application.

[0189] In some optional embodiments, the connecting opening 400b within at least part of the isolation opening 310a has a ring-shaped orthographic projection on the substrate 100, so as to better reduce the mutual interference between the first section 410, the second section 421a and the third section 421b when the first packaging structure 400 is formed, and allow the material of the supporting structure P to better enter the gap space 400a through the connecting opening 400b.

[0190] In some optional embodiments, the connecting opening 400b within the third opening 310ac may be annular, that is, the third packaging unit 403 may have an annular connecting opening 400b, and the side surface of the first section 410 in the third packaging unit 403 facing away from the substrate 100 may be spaced apart from the third section 421b at each location in the third packaging unit 403.

[0191] In this optional embodiment, since the preparation step of the third packaging unit 403 is located after the preparation steps of the first light-emitting device 200a, the first packaging unit 401, the second light-emitting device 200b and the second packaging unit 402, the preparation processes of the first light-emitting device 200a, the first packaging unit 401, the second light-emitting device 200b and the second packaging unit 402 are not likely to affect the subsequently formed third packaging unit 403. Therefore, the side surface of the first division 410 in the third packaging unit 403 facing away from the substrate 100 can be spaced apart from the side surface of the third division 421b covering the second isolation portion 312 away from the first isolation portion 311, that is, the first division 410 in the third packaging unit 403 does not need to provide excessive support to the third division 421b in the third packaging unit 403. Therefore, the communicating opening 400b in the third opening 310ac can be annular to reduce the mutual interference among the first section 410, the second section 421a and the third section 421b in the third packaging unit 403 when the third packaging unit 403 is formed.

[0192] In some embodiments of the present application, the gap space 400a of the first packaging unit 401 corresponding to the first opening 310aa can be a closed space, and the communication opening 400b of the third packaging unit 403 corresponding to the third opening 310ac can be annular, so that the first packaging unit 401 and the third packaging unit 403 can have the corresponding beneficial effects of the aforementioned embodiments. The second packaging unit 402 corresponding to the second opening 310ab can be configured in various ways.

[0193] In some optional embodiments, as described in the above embodiments, the first section 410 and the third section 421b in the second opening 310ab may be at least partially spaced apart and form a connecting opening 400b, that is, the second packaging unit 402 corresponding to the second opening 310ab may have a connecting opening 400b.

[0194] For example, as shown in Figures 4, 7 and 8, the first division 410 and the third division 421b in the second opening 310ab can be partially spaced apart and form a connecting opening 400b, and the first division 410 and the third division 421b in the second opening 310ab can be partially connected to form a connecting portion 400c, that is, the second packaging unit 402 corresponding to the second opening 310ab can have both the connecting portion 400c and the connecting opening 400b.

[0195] FIG11 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application. FIG11 may be a partial cross-sectional view of another embodiment at AA in FIG1 .

[0196] For another example, the first section 410 and the third section 421b in the second opening 310ab may be spaced apart to form an annular communication opening 400b, that is, the second packaging unit 402 corresponding to the second opening 310ab may have an annular communication opening 400b.

[0197] In these optional embodiments, since the preparation step of the second packaging unit 402 is located after the preparation step of the first light-emitting device 200a and the first packaging unit 401, the preparation process of the first light-emitting device 200a and the first packaging unit 401 is not likely to affect the subsequently formed second packaging unit 402. Therefore, the side surface of the first section 410 in the second packaging unit 402 facing away from the substrate 100 can be spaced apart from the side surface of the third section 421b at least partially covered by the second isolation portion 312 and away from the first isolation portion 311, that is, the first section 410 in the second packaging unit 402 does not need to provide excessive support to the third section 421b in the second packaging unit 402.

[0198] Since the preparation step of the second packaging unit 402 is located before the third light-emitting device 200c and the third packaging unit 403, as shown in Figures 4, 7 and 8, by setting the side surface of the first division 410 in the second packaging unit 402 facing away from the substrate 100 to be partially connected with the third division 421b in the second packaging unit 402, part of the first division 410 can provide a certain support to the third division 421b, so that the second packaging unit 402 is not easily damaged during the preparation of the third light-emitting device 200c and the third packaging unit 403, thereby better improving the packaging stability of the second packaging unit 402.

[0199] FIG12 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application. FIG12 may be a partial cross-sectional view of another embodiment at AA in FIG1 .

[0200] In other optional embodiments, as shown in FIG12 , the gap space 400a within the second opening 310ab is a sealed space, that is, the gap space 400a of the second packaging unit 402 corresponding to the second opening 310ab can be a sealed space. For example, the first subsection 410 of the second packaging unit 402, the second subsection 421a of the second packaging unit 402, and the third subsection 421b of the second packaging unit 402 can enclose and form the sealed gap space 400a.

[0201] Optionally, the third subsection 421b within the second opening 310ab is connected to the first subsection 410 to form a connecting portion 400c, and the orthographic projection of the connecting portion 400c within the second opening 310ab on the substrate 100 is annular. For example, a surface of the first subsection 410 in the second packaging unit 402 facing away from the substrate 100 may be connected to a surface of the third subsection 421b covering the second isolation portion 312, facing away from the first isolation portion 311, to form an annular connecting portion 400c.

[0202] In these optional embodiments, a closed gap space 400a is formed by setting the first division 410 of the second packaging unit 402, the second division 421a of the second packaging unit 402 and the third division 421b of the second packaging unit 402, so that the first division 410 in the second packaging unit 402 can better support the third division 421b, so that the second packaging unit 402 can have better structural stability, so that the second packaging unit 402 is not easily affected by subsequent processes and damaged, for example, the second packaging unit 402 is not easily damaged during the preparation of the third light-emitting device 200c and the third packaging unit 403, thereby better improving the packaging stability of the second packaging unit 402.

[0203] Moreover, when preparing a subsequent film layer on the second packaging unit 402, the material of the subsequent film layer can be better continuous at the connection portion 400c, which can facilitate the molding of the subsequent film layer or facilitate the patterning of the subsequent film layer, so that the subsequent film layer can better cover the second packaging unit 402 and the subsequent film layer can provide a certain degree of protection to the second packaging unit 402.

[0204] For example, in the subsequent process of preparing the light-emitting unit 220, the second electrode 210 and the third packaging unit 403 of the third light-emitting device 200c, after the materials of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c are prepared on the entire surface, the materials of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c can be relatively continuous on the second packaging unit 402, so that when the light-emitting unit 220 of the third light-emitting device 200c and the third packaging unit 403 on the second electrode 210 are patterned, that is, when the material of the third packaging unit 403 outside the third opening 310ac is removed, the material of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c can be used to protect the second packaging unit 402 within the second opening 310ab, so that the etching material is not easy to damage the second packaging unit 402, thereby better improving the structural stability of the second packaging unit 402. Moreover, when preparing the third light-emitting device 200c or the third packaging unit 403, the etching material is not easy to enter the gap space 400a of the second packaging unit 402, which can effectively reduce the etching damage of the etching material to the inner wall of the gap space 400a in the second packaging unit 402, thereby effectively improving the structural stability of the second packaging structure.

[0205] FIG13 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application. FIG13 may be a partial cross-sectional view of another embodiment at AA in FIG1 .

[0206] As shown in Figure 13, in some optional embodiments, when the first packaging structure 400 has a connecting opening 400b, a sealing structure F may be provided at at least part of the connecting opening 400b, one side of the sealing structure F is connected to the surface of the first division 410, and the other side of the sealing structure F is connected to the surface of the third division 421b.

[0207] Optionally, the sealing structure F can be set to completely cover the connecting opening 400b, so that the connecting opening 400b can be blocked by the sealing structure F, so that the sealing structure F can be jointly enclosed with the first division 410, the second division 421a and the third division 421b to form a closed gap space 400a, or the sealing structure F may not completely cover the connecting opening 400b.

[0208] Optionally, as shown in FIG. 13 , the display panel 10 may include only the sealing structure F without the supporting structure P.

[0209] Alternatively, the display panel 10 may include both the sealing structure F and the supporting structure P. For example, the supporting structure P may be prepared first, so that the material of the supporting structure P can enter the gap space 400a through the connecting opening 400b, and then the supporting structure P may be prepared. For another example, when the sealing structure F does not completely cover the connecting opening 400b, the material of the supporting structure P can enter the gap space 400a through the connecting opening 400b not covered by the connecting structure.

[0210] Optionally, there are various ways to configure the material of the sealing structure F. For example, the material of the sealing structure F may include organic material or inorganic material.

[0211] Optionally, the material of the sealing structure F may have greater viscosity, so that when the display panel 10 only includes the sealing structure F but not the supporting structure P, the sealing structure F can better cover the connecting opening 400b, and the sealing structure F is not easy to flow into the gap space 400a through the connecting opening 400b.

[0212] In these optional embodiments, the sealing structure F connected between the surface of the first subsection 410 facing away from the substrate 100 and the surface of the third subsection 421b near the isolation opening 310a can also be used to support the third subsection 421b, thereby effectively improving the structural stability of the first packaging structure 400. Furthermore, when a subsequent film layer is prepared on the first packaging structure 400, the material of the subsequent film layer can be better connected at the sealing structure F, which can facilitate the molding or patterning of the subsequent film layer, so that the subsequent film layer can better cover the first packaging structure 400 and provide a certain degree of protection for the first packaging structure 400.

[0213] In some embodiments of the present application, there are multiple ways to adjust the relative position between the side surface of the first section 410 facing away from the substrate 100 and the side surface of the third section 421b facing away from the isolation structure 310, that is, there are multiple ways to achieve at least partial interconnection between the first section 410 and the third section 421b, and there are also multiple ways to achieve at least partial separation between the first section 410 and the third section 421b and form a connecting opening 400b.

[0214] FIG14 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application. FIG14 may be a partial cross-sectional view of another embodiment at AA in FIG1 .

[0215] As shown in FIG. 14 , in some optional embodiments of the present application, the relative position between the side surface of the first section 410 facing away from the substrate 100 and the side surface of the third section 421b facing away from the isolation structure 310 can be adjusted by changing the thickness of the first packaging structure 400 .

[0216] In some optional embodiments, the maximum thickness of the first encapsulation structure 400 in a portion of the isolation opening 310 a is greater than the maximum thickness of the first encapsulation structure 400 in another portion of the isolation opening 310 a .

[0217] Optionally, the maximum thickness of the first packaging structure 400 within the isolation opening 310a may refer to the thickness of the first packaging structure 400 at the middle of the sub-pixel corresponding to the isolation opening 310a. For example, the maximum thickness of the first packaging structure 400 within the isolation opening 310a may be the thickness of the first main body section 411a of the first packaging structure 400 within the isolation opening 310a.

[0218] Optionally, the maximum thickness of the first sub-portion 410 of the first package structure 400 in one portion of the isolation opening 310 a is greater than the maximum thickness of the first sub-portion 410 of the first package structure 400 in another portion of the isolation opening 310 a .

[0219] Optionally, the maximum thickness of the second sub-portion 421 a of the first package structure 400 in one portion of the isolation opening 310 a is greater than the maximum thickness of the second sub-portion 421 a of the first package structure 400 in another portion of the isolation opening 310 a .

[0220] Optionally, the maximum thickness of the third section 421 b of the first package structure 400 in one portion of the isolation opening 310 a is greater than the maximum thickness of the third section 421 b of the first package structure 400 in another portion of the isolation opening 310 a .

[0221] In these optional embodiments, when the thickness of the first packaging structure 400 at the partial isolation opening 310a is relatively thick, the side surface of the first section 410 at the partial isolation opening 310a facing away from the substrate 100 can be interconnected with the side surface of the third section 421b covering the second isolation portion 312 away from the first isolation portion 311, so that the first section 410 at the partial isolation opening 310a can provide better support to the third section 421b, and the thicker first packaging structure 400 at the partial isolation opening 310a is not easily damaged by etching.

[0222] When the thickness of the first packaging structure 400 at the partial isolation opening 310a is relatively thin, the side surface of the first division 410 at the partial isolation opening 310a facing away from the substrate 100 can be spaced apart from the side surface of the third division 421b covering the second isolation portion 312 away from the first isolation portion 311 to form a connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100, so that the material of the supporting structure P can be filled into the gap space 400a through the connecting opening 400b to better support the structure of the first packaging structure 400 at the partial isolation opening 310a.

[0223] When the thickness of the first packaging structure 400 at the partial isolation opening 310a is relatively moderate, the side surface of the first division 410 at the partial isolation opening 310a facing away from the substrate 100 can be spaced apart from a portion of the third division 421b, and the side surface of the first division 410 at the partial isolation opening 310a facing away from the substrate 100 can be connected to another portion of the third division 421b, so that the partial first division 410 at the partial isolation opening 310a can provide better support to the third division 421b, and the material of the supporting structure P can be filled into the gap space 400a through the connecting opening 400b formed between the partial first division 410 and the second division 421a.

[0224] In some optional embodiments, the maximum thickness of the first packaging unit 401 is greater than the maximum thickness of the third packaging unit 403 .

[0225] Optionally, the thickness of the first section 410 in the first packaging unit 401 may represent the maximum thickness of the first packaging unit 401 . Specifically, the thickness of the first main section 411 a in the first packaging unit 401 may represent the maximum thickness of the first packaging unit 401 .

[0226] Optionally, the thickness of the first section 410 in the third packaging unit 403 may represent the maximum thickness of the third packaging unit 403 . Specifically, the thickness of the first main section 411 a in the third packaging unit 403 may represent the maximum thickness of the third packaging unit 403 .

[0227] Optionally, the maximum thickness of the first division 410 of the first packaging unit 401 is greater than the maximum thickness of the first division 410 of the third packaging unit 403; and / or, the maximum thickness of the second division 421a of the first packaging unit 401 is greater than the maximum thickness of the second division 421a of the third packaging unit 403; and / or, the maximum thickness of the third division 421b of the first packaging unit 401 is greater than the maximum thickness of the third division 421b of the third packaging unit 403.

[0228] In these optional embodiments, by setting the maximum thickness of the first encapsulation unit 401 to be greater than the maximum thickness of the third encapsulation unit 403, the first encapsulation unit 401 is less susceptible to damage during subsequent etching processes during the fabrication of the display panel 10. For example, the first encapsulation unit 401 is less susceptible to damage from etching material during the etching process of the second light-emitting device 200b, the second encapsulation unit 402, the third light-emitting device 200c, and the third encapsulation unit 403, thereby effectively improving the packaging stability of the first encapsulation unit 401. Furthermore, the first subsection 410 of the first encapsulation unit 401, the second subsection 421a of the first encapsulation unit 401, and the third subsection 421b of the first encapsulation unit 401 can be combined to form a sealed gap 400a, so that the first subsection 410 of the first encapsulation unit 401 can effectively support the third subsection 421b, thereby ensuring that the first encapsulation unit 401 has better structural stability. Moreover, it is also possible to facilitate the spacing of the side surface of the first section 410 of the third packaging unit 403 away from the substrate 100 and the side surface of the partial third section 421b of the third packaging unit 403 away from the isolation structure 310 to form a connecting opening 400b located on the side of the gap space 400a away from the substrate 100, so that the material of the supporting structure P can be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b.

[0229] In some optional embodiments, the maximum thickness of the second package unit 402 is greater than or equal to the maximum thickness of the third package unit 403 ; and / or the maximum thickness of the second package unit 402 is less than or equal to the maximum thickness of the first package unit 401 .

[0230] Optionally, the thickness of the first section 410 in the second packaging unit 402 may represent the maximum thickness of the second packaging unit 402 . Specifically, the thickness of the first main section 411 a in the second packaging unit 402 may represent the maximum thickness of the second packaging unit 402 .

[0231] For example, as shown in FIG14 , the maximum thickness of the second encapsulation unit 402 may be greater than the maximum thickness of the third encapsulation unit 403, and the maximum thickness of the second encapsulation unit 402 may be less than the maximum thickness of the first encapsulation unit 401. By setting the maximum thickness of the second encapsulation unit 402 to be greater than the maximum thickness of the third encapsulation unit 403, during the manufacturing process of the display panel 10, the second encapsulation unit 402 is less likely to be damaged by etching material during the etching process of the third light-emitting device 200 c and the third encapsulation unit 403, thereby effectively improving the encapsulation stability of the second encapsulation unit 402. By setting the maximum thickness of the second packaging unit 402 to be smaller than the maximum thickness of the first packaging unit 401, it is possible to facilitate the arrangement of a side surface of the first section 410 in the second packaging unit 402 facing away from the substrate 100 and a third section 421b of a portion of the second packaging unit 402, and a side surface of the first section 410 in the second packaging unit 402 facing away from the substrate 100 and a third section 421b of another portion of the second packaging unit 402, thereby achieving similar beneficial effects as those of the second packaging unit 402 having a similar structure in some of the aforementioned embodiments, which will not be elaborated in this application.

[0232] Or for example, the maximum thickness of the second packaging unit 402 can be equal to the maximum thickness of the first packaging unit 401 (not shown in the figure), so that the structure of the second packaging unit 402 can be similar to the structure of the first packaging unit 401, so that the second packaging unit 402 is not easily damaged by the etching material during the etching process of the third light-emitting device 200c and the third packaging unit 403, and it is also convenient to realize that the first section 410 of the second packaging unit 402, the second section 421a of the second packaging unit 402 and the third section 421b of the second packaging unit 402 are enclosed to form a closed gap space 400a, so as to achieve similar beneficial effects as the first packaging unit 401 with a similar structure in some of the aforementioned embodiments, and this application will not go into details.

[0233] Or for example, the maximum thickness of the second packaging unit 402 can be equal to the maximum thickness of the third packaging unit 403 (not shown in the figure), so that the structure of the second packaging unit 402 can be similar to that of the third packaging unit 403, so that the surface of the side of the first section 410 in the second packaging unit 402 facing away from the substrate 100 can be spaced apart from the third section 421b in the second packaging unit 402 to form an annular connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100, so as to achieve similar beneficial effects as the third packaging unit 403 with a similar structure in some of the aforementioned embodiments, and this application will not go into details.

[0234] In some optional embodiments, there is a first spacing between the surface of the eaves portion 312a facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100, and the ratio of the maximum thickness of at least part of the first main body portion 411a to the first spacing is not less than 1.25; and / or, the ratio of the maximum thickness of at least part of the second main body portion 411b to the first spacing is not less than 1.25.

[0235] Optionally, the maximum thickness of the first main body section 411 a may be slightly greater than the maximum thickness of the second main body section 411 b .

[0236] Optionally, the ratio of the maximum thickness of the first main body section 411a to the first spacing is 1.5-2.5. Further, optionally, the ratio of the maximum thickness of the first main body section 411a to the first spacing can be 1.6-2.

[0237] Optionally, the second main body section 411b includes a first main body sub-section 411ba and a second main body sub-section 411bb that are connected to each other, the orthographic projection of the first main body sub-section 411ba on the substrate 100 is located outside the orthographic projection of the second isolation section 312 on the substrate 100, and the orthographic projection of the second main body sub-section 411bb on the substrate 100 is located within the orthographic projection of the second isolation section 312 on the substrate 100.

[0238] Optionally, the connection between the first section 410 and the third section 421 b may refer to the connection between the first main body subsection 411 ba and the third section 421 b .

[0239] Optionally, the maximum thickness of the second main body sub-portion 411b may be the maximum thickness of the first main body sub-portion 411ba, and the ratio of the maximum thickness of at least part of the first main body sub-portion 411ba to the first interval may be no less than 1.25.

[0240] Optionally, the ratio of the maximum thickness of at least part of the first main body section 411a of the first packaging unit 401 to the first spacing is not less than 1.25; and / or the ratio of the maximum thickness of at least part of the second main body section 411b of the first packaging unit 401 to the first spacing is not less than 1.25.

[0241] Optionally, the convex portion 312a includes a first convex portion 312aa corresponding to the first opening 310aa and a third convex portion 312ac corresponding to the third opening 310ac. Optionally, the first opening 310aa can be enclosed by the first convex portion 312aa. Optionally, the third opening 310ac can be enclosed by the third convex portion 312ac.

[0242] Specifically, the first spacing may refer to the spacing between the surface of the first protruding eaves portion 312aa facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100, the ratio of the maximum thickness of the first main body portion 411a of the first packaging unit 401 to the first spacing corresponding to the first protruding eaves portion 312aa is not less than 1.25, and / or the ratio of the maximum thickness of the second main body portion 411b of the first packaging unit 401 to the first spacing corresponding to the first protruding eaves portion 312aa is not less than 1.25.

[0243] Optionally, the ratio of the maximum thickness of at least part of the first main body section 411a of the second packaging unit 402 to the first spacing may also be not less than 1.25; and / or, the ratio of the maximum thickness of at least part of the second main body section 411b of the second packaging unit 402 to the first spacing may also be not less than 1.25.

[0244] Optionally, the convex portion 312a further includes a second convex portion 312ab corresponding to the second opening 310ab. Optionally, the second opening 310ab can be enclosed and formed by the second convex portion 312ab.

[0245] Specifically, the first spacing may also refer to the spacing between the surface of the second convex portion 312ab facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100, the ratio of the maximum thickness of the first main body division 411a of the second packaging unit 402 to the first spacing corresponding to the second convex portion 312ab is not less than 1.25, and / or the ratio of the maximum thickness of the second main body division 411b of the second packaging unit 402 to the first spacing corresponding to the second convex portion 312ab is not less than 1.25.

[0246] Among them, the distance between the surface of the first convex portion 312aa facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100 may be equal to the distance between the surface of the second convex portion 312ab facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100, or the distance between the surface of the first convex portion 312aa facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100 may not be equal to the distance between the surface of the second convex portion 312ab facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100. This application does not make any specific restrictions on this.

[0247] In these optional embodiments, by reasonably setting the ratio of the maximum thickness of the first main body division 411a to the first spacing, and reasonably setting the ratio of the maximum thickness of the second main body division 411b to the first spacing, the thickness of at least part of the first main body division 411a and at least part of the second main body division 411b in the first packaging structure 400 can be better adjusted according to the shielding ability of the eaves portion 312a on the first packaging structure 400, so as to facilitate the connection between the first division 410 in at least part of the first packaging structure 400 and the third division 421b, thereby facilitating the support of the third division 421b by the first division 410.

[0248] Specifically, when the first spacing is large, the eaves portion 312a will be closer to the preparation equipment of the first packaging structure 400 during the preparation of the first packaging structure 400, so that the eaves portion 312a has a greater impact on the material shielding of the first packaging structure 400, that is, the eaves portion 312a can have better shielding ability. Therefore, according to the larger first spacing, at least part of the first main body division 411a and at least part of the second main body division 411b can be set to have a larger thickness to facilitate the connection between at least part of the first division 410 and the third division 421b, so as to facilitate the support of the first division 410 to the third division 421b.

[0249] When the first spacing is small, the eaves portion 312a will be relatively far away from the preparation equipment of the first packaging structure 400 during the preparation of the first packaging structure 400, so that the eaves portion 312a has less influence on the material shielding of the first packaging structure 400, that is, the eaves portion 312a has poor shielding ability for the first packaging structure 400. Therefore, according to the smaller first spacing, at least part of the first main body division 411a and at least part of the second main body division 411b can be set to have a reasonable thickness to facilitate the connection between at least part of the first division 410 and the third division 421b, while not easily increasing the thickness of the display panel 10 too much.

[0250] There are many ways to adjust the first distance. For example, the first distance can be adjusted by adjusting the size of the first isolation portion 311 in the thickness direction.

[0251] In some optional embodiments, the dimension of the first isolation portion 311 in the thickness direction of the display panel 10 is a first height, and the ratio of the maximum thickness of at least part of the first main body division 411a to the first height is not less than 1.25, so as to achieve a ratio of the maximum thickness of at least part of the first main body division 411a to the first spacing of not less than 1.25, and / or, the ratio of the maximum thickness of at least part of the second main body division 411b to the first height is not less than 1.25, so as to achieve a ratio of the maximum thickness of at least part of the second main body division 411b to the first spacing of not less than 1.25.

[0252] Alternatively, the first height may also refer to the maximum distance between the surface of the first isolation portion 311 facing the substrate 100 and the surface of the first isolation portion 311 facing away from the substrate 100. Alternatively, the first height may be equal to the first distance.

[0253] Optionally, the maximum thickness of the first main body section 411 a may be slightly greater than the maximum thickness of the second main body section 411 b .

[0254] Optionally, the ratio of the maximum thickness of at least a portion of the first main body section 411a to the first height is not less than 1.4. Further, the ratio of the maximum thickness of at least a portion of the first main body section 411a to the first height is not less than 1.617, and / or the ratio of the maximum thickness of at least a portion of the second main body section 411b to the first height is not less than 1.389.

[0255] In some optional embodiments, there is a second distance between the surface of the protruding eaves portion 312a facing the substrate 100 and the surface of the light-emitting device 200 facing away from the substrate 100, and the ratio of the maximum thickness of at least part of the first main body portion 411a to the second distance is not less than 1, and / or the ratio of the maximum thickness of at least part of the second main body portion 411b to the second distance is not less than 1.

[0256] Optionally, at least part of the light-emitting device 200 may be located on the side of the pixel defining portion 321 facing away from the substrate 100, and a second distance may be present between the surface of the convex portion 312a facing the substrate 100 and the surface of the light-emitting device 200 located on the pixel defining portion 321 facing away from the substrate 100.

[0257] Optionally, the ratio of the maximum thickness of at least part of the first main body section 411a of the first packaging unit 401 to the second spacing is not less than 1; and / or the ratio of the maximum thickness of at least part of the second main body section 411b of the first packaging unit 401 to the second spacing is not less than 1.

[0258] Specifically, the second spacing may refer to the spacing between the surface of the first convex portion 312aa facing the substrate 100 and the surface of the light-emitting device 200 facing away from the substrate 100, the ratio of the maximum thickness of the first main body portion 411a of the first packaging unit 401 to the second spacing corresponding to the first convex portion 312aa is not less than 1, and / or the ratio of the maximum thickness of the second main body portion 411b of the first packaging unit 401 to the second spacing corresponding to the first convex portion 312aa is not less than 1.

[0259] Optionally, the ratio of the maximum thickness of at least part of the first main body section 411a of the second packaging unit 402 to the second spacing may also be not less than 1; and / or, the ratio of the maximum thickness of at least part of the second main body section 411b of the second packaging unit 402 to the second spacing may also be not less than 1.

[0260] Specifically, the second spacing may also refer to the spacing between the surface of the second convex portion 312ab facing the substrate 100 and the surface of the light-emitting device 200 facing away from the substrate 100, the ratio of the maximum thickness of the first main body portion 411a of the second packaging unit 402 to the second spacing corresponding to the second convex portion 312ab is not less than 1, and / or the ratio of the maximum thickness of the second main body portion 411b of the second packaging unit 402 to the second spacing corresponding to the second convex portion 312ab is not less than 1.

[0261] Among them, the distance between the surface of the first convex portion 312aa facing the substrate 100 and the surface of the light-emitting device 200 facing away from the substrate 100 may be equal to the distance between the surface of the second convex portion 312ab facing the substrate 100 and the surface of the light-emitting device 200 facing away from the substrate 100, or the distance between the surface of the first convex portion 312aa facing the substrate 100 and the surface of the light-emitting device 200 facing away from the substrate 100 may not be equal to the distance between the surface of the second convex portion 312ab facing the substrate 100 and the surface of the light-emitting device 200 facing away from the substrate 100. This application does not make any specific restrictions on this.

[0262] In these alternative embodiments, the thickness of the light-emitting device 200 located on the pixel-defining portion 321 can affect the spacing between the first sub-portion 410 and the convex portion 312a. Specifically, the thickness of the light-emitting device 200 located on the pixel-defining portion 321 can affect the spacing between the first sub-portion 410 and the third sub-portion 421b covering the convex portion 312a. Therefore, by further defining the ratio between the maximum thickness of the first main sub-portion 411a and the second spacing, and by appropriately setting the ratio between the maximum thickness of the second main sub-portion 411b and the second spacing, the thickness of at least a portion of the first main sub-portion 411a and at least a portion of the second main sub-portion 411b in the first package structure 400 can be more accurately adjusted based on the spacing between the convex portion 312a and the light-emitting device 200. This allows the first sub-portion 410 in at least a portion of the first package structure 400 to be connected to the third sub-portion 421b, thereby facilitating support of the third sub-portion 421b by the first sub-portion 410.

[0263] FIG15 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application. FIG15 may be a partial cross-sectional view of another embodiment at AA in FIG1 .

[0264] As shown in FIG15 , in some optional embodiments of the present application, the relative position between the side surface of the first section 410 facing away from the substrate 100 and the side surface of the third section 421b facing away from the isolation structure 310 can be adjusted by changing the morphology of the isolation structure 310 .

[0265] In some optional embodiments, the protruding length of at least a portion of the convex portion 312a corresponding to a portion of the isolation opening 310a is greater than that of at least a portion of the convex portion 312a corresponding to another portion of the isolation opening 310a.

[0266] Optionally, the protruding length of the convex portion 312a may refer to the distance between the orthographic projection of the edge of the convex portion 312a facing the isolation opening 310a on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing away from the substrate 100 on the substrate 100.

[0267] Optionally, the convex portion 312a provided corresponding to a certain isolation opening 310a may refer to the convex portion 312a that participates in enclosing and forming the part of the isolation opening 310a.

[0268] In these optional embodiments, by reasonably setting the protruding lengths of the isolation convex portions 312a corresponding to different isolation openings 310a to be different, during the preparation process of the display panel 10, the convex portions 312a with longer protruding lengths in a part of the isolation openings 310a can have better blocking and isolation capabilities, while the convex portions 312a with shorter protruding lengths in another part of the isolation openings 310a have smaller blocking and isolation capabilities.

[0269] Therefore, when preparing the first packaging structure 400, the protruding eaves portion 312a with a longer protruding length in a portion of the isolation opening 310a can better cover the material of the first packaging structure 400, so that the surface of the side of the first division 410 in the partial isolation opening 310a facing away from the substrate 100 is not easily connected with the surface of the side of the third division 421b away from the first isolation portion 311, so that the third division 421b can be spaced apart from the first division 410, so as to form a connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100 in the partial isolation opening 310a.

[0270] The convex portion 312a with a shorter protruding length in the other partial isolation opening 310a is not likely to cause excessive obstruction to the material of the first packaging structure 400, so that the side surface of the first branch 410 in the other partial isolation opening 310a facing away from the substrate 100 can be more easily connected to the side surface of the third branch 421b away from the first isolation portion 311, so that the first branch 410 can better support the third branch 421b, thereby better improving the packaging effect of the first packaging structure 400 on the display panel 10.

[0271] In some optional embodiments, the protruding length of the first eaves portion 312aa is smaller than the protruding length of the third eaves portion 312ac, that is, the protruding length of the second isolation portion 312 toward the first opening 310aa relative to the first isolation portion 311 is smaller than the protruding length of the second isolation portion 312 toward the third opening 310ac relative to the first isolation portion 311.

[0272] Alternatively, the protruding length of the first protruding portion 312aa may refer to the minimum distance between the orthographic projection of the edge of the first protruding portion 312aa facing the first opening 310aa on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the first protruding portion 312aa on the substrate 100. Alternatively, the length a1 in FIG. 15 may represent the protruding length of the first protruding portion 312aa.

[0273] Alternatively, the protruding length of the third protruding portion 312ac may refer to the minimum distance between the orthographic projection of the edge of the third protruding portion 312ac facing the third opening 310ac on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the third protruding portion 312ac on the substrate 100. Alternatively, the length a3 in FIG. 15 may represent the protruding length of the third protruding portion 312ac.

[0274] In these optional embodiments, under the influence of the smaller shielding provided by the first eaves portion 312aa with a shorter protruding length, the first division 410 of the first packaging unit 401 at the first opening 310aa, the second division 421a of the first packaging unit 401 and the third division 421b of the first packaging unit 401 can be enclosed to form a closed gap space 400a, so that the first division 410 in the first packaging unit 401 can better support the third division 421b, so that the first packaging unit 401 can have better structural stability, so that the first packaging unit 401 is not easily affected by subsequent processes and damaged.

[0275] Under the greater shielding effect provided by the third protruding eaves portion 312ac with a longer protruding length, the surface of the first section 410 in the third packaging unit 403 at the third opening 310ac, which faces away from the substrate 100, can be spaced apart from the third sections 421b at various locations in the third packaging unit 403, so as to form an annular connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100, so that the material of the supporting structure P can be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b, thereby better supporting the third packaging unit 403.

[0276] In some optional embodiments, the protruding length of the second eaves portion 312ab is less than or equal to the protruding length of the third eaves portion 312ac; and / or, the protruding length of the second eaves portion 312ab is greater than or equal to the protruding length of the first eaves portion 312aa.

[0277] That is, the protruding length of the second isolation portion 312 toward the second opening 310ab relative to the first isolation portion 311 is less than or equal to the protruding length of the second isolation portion 312 toward the third opening 310ac relative to the first isolation portion 311, and / or the protruding length of the second isolation portion 312 toward the second opening 310ab relative to the first isolation portion 311 is greater than or equal to the protruding length of the second isolation portion 312 toward the first opening 310aa relative to the first isolation portion 311.

[0278] Optionally, the protruding length of the second eaves portion 312ab may refer to the minimum distance between the orthographic projection of the edge of the second eaves portion 312ab facing the second opening 310ab on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the second eaves portion 312ab on the substrate 100.

[0279] Optionally, the length of a2 in Figure 15 may represent the protruding length of the second convex portion 312ab. Here, a2 may include a21 and a22. Specifically, when the protruding length of the second convex portion 312ab is greater than or equal to the protruding length of the first convex portion 312aa, the length of a21 may represent the protruding length of the second convex portion 312ab; when the protruding length of the second convex portion 312ab is less than or equal to the protruding length of the third convex portion 312ac, the length of a22 may represent the protruding length of the second convex portion 312ab.

[0280] In some embodiments, as shown in Figure 15, the protruding length of a portion of the second eaves portion 312ab may be equal to the protruding length of the third eaves portion 312ac, and the protruding length of another portion of the second eaves portion 312ab may be equal to the protruding length of the first eaves portion 312aa, so that under the influence of the greater shielding provided by the portion of the second eaves portion 312ab with a longer protruding length, the third section 421b in the second packaging unit 402 can be spaced apart from the portion of the first section 410 to form a connecting opening 400b on the second packaging unit 402 located on the side of the gap space 400a away from the substrate 100, so that the material of the supporting structure P can be filled into the gap space 400a of the second packaging unit 402 through the connecting opening 400b to better support the structure of the second packaging unit 402. Moreover, under the influence of the smaller shielding provided by the other part of the second protruding eaves 312ab with a shorter protruding length, the third section 421b in the second packaging unit 402 can be interconnected with part of the first section 410, so that part of the first section 410 in the second packaging unit 402 can provide a certain support to the third section 421b, so that the second packaging unit 402 is not easily damaged during the preparation of the third light-emitting device 200c and the third packaging unit 403, thereby better improving the packaging stability of the second packaging unit 402.

[0281] In other embodiments, the protruding length of the second convex portion 312ab may be smaller than the protruding length of the third convex portion 312ac, and the protruding length of the second convex portion 312ab may be equal to the protruding length of the first convex portion 312aa, so that under the greater shielding effect provided by the second convex portion 312ab with a longer protruding length, the structure of the second packaging unit 402 at the second opening 310ab can be similar to the structure of the first packaging unit 401 in the first opening 310aa, so that the first section 410 of the second packaging unit 402, the second section 421a of the second packaging unit 402 and the third section 421b of the second packaging unit 402 can be enclosed to form a closed gap space 400a, so as to achieve similar beneficial effects as the first packaging unit 401 with a similar structure in some of the aforementioned embodiments, and this application will not go into details.

[0282] In other embodiments, the protruding length of the second protruding eaves portion 312ab may be equal to the protruding length of the third protruding eaves portion 312ac, and the protruding length of the second protruding eaves portion 312ab may be greater than the protruding length of the first protruding eaves portion 312aa, so that under the smaller shielding effect provided by the second protruding eaves portion 312ab with a shorter protruding length, the structure of the second packaging unit 402 at the second opening 310ab may be similar to the structure of the third packaging unit 403 in the third opening 310ac, so that the surface of the side of the first section 410 in the second packaging unit 402 at the second opening 310ab facing away from the substrate 100 may be spaced apart from the third sections 421b at various locations in the second packaging unit 402 to form an annular connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100, so as to achieve similar beneficial effects as the third packaging unit 403 with a similar structure in some of the aforementioned embodiments. This application will not elaborate on this.

[0283] In some optional embodiments, the ratio of the protruding length of at least a portion of the protruding eaves portion 312a to the first height is not greater than 1.25.

[0284] Optionally, the ratio of the protruding length of the first convex eave portion 312aa to the first height may be no greater than 1.25, and / or the ratio of the protruding length of at least part of the second convex eave portion 312ab to the first height may be no greater than 1.25.

[0285] In these optional embodiments, by setting the ratio of the protruding length of at least part of the eaves portion 312a to the first height to be no greater than 1.25, that is, by reasonably limiting the protruding length of the part of the eaves portion 312a according to the size of the first isolation portion 311, the protruding length of at least part of the eaves portion 312a is not likely to be too large relative to the height of the first isolation portion 311, so that the shielding and isolation effect of the material of the first packaging structure 400 by the part of the eaves portion 312a is relatively small, which can facilitate the connection between the first section 410 and the third section 421b in the isolation opening 310a corresponding to the part of the eaves portion 312a, that is, it can facilitate the first section 410 in the isolation opening 310a corresponding to the part of the eaves portion 312a to provide better support effect to the third section 421b, thereby improving the structural stability of the first packaging structure 400 in the part of the isolation opening 310a.

[0286] For example, when the ratio of the protruding length of the first eaves portion 312aa to the first height is not greater than 1.25, under the smaller shielding influence provided by the first eaves portion 312aa having a shorter protruding length relative to the height of the first isolation portion 311, the connection between the first division 410 and the third division 421b in the first opening 310aa can be facilitated, that is, the first division 410 in the first opening 310aa can provide better support effect to the third division 421b, thereby improving the structural stability of the first packaging structure 400 in the first opening 310aa.

[0287] For another example, when the ratio of the protruding length of at least part of the second protruding eaves portion 312ab to the first height is not greater than 1.25, under the smaller shielding influence provided by the second protruding eaves portion 312ab having a shorter protruding length relative to the height of the first isolation portion 311, it can facilitate the connection between at least part of the first section 410 and the third section 421b in the second opening 310ab, that is, it can facilitate the first section 410 in the second opening 310ab to provide better support effect to the third section 421b, thereby improving the structural stability of the first packaging structure 400 in the second opening 310ab.

[0288] FIG16 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application. FIG16 may be a partial cross-sectional view of another embodiment at AA in FIG1 .

[0289] As shown in FIG16 , in some optional embodiments, the distance between at least a portion of the second isolation portion 312 forming the first opening 310aa and the substrate 100 is smaller than the distance between the second isolation portion 312 forming the third opening 310ac and the substrate 100 .

[0290] Optionally, the distance between the second isolation portion 312 and the substrate 100 may refer to the distance between the surface of the second isolation portion 312 facing the substrate 100 and the substrate 100 .

[0291] Optionally, the distance between the first protruding eave portion 312 aa and the substrate 100 may be smaller than the distance between the third protruding eave portion 312 ac and the substrate 100 .

[0292] In these optional embodiments, by arranging the distance between at least a portion of the second isolation portion 312 that participates in enclosing and forming the first opening 310aa and the substrate 100 to be smaller than the distance between the second isolation portion 312 that participates in enclosing and forming the third opening 310ac and the substrate 100, during the preparation process of the first packaging structure 400, compared with the first convex portion 312aa, the third convex portion 312ac can be closer to the preparation equipment of the first packaging structure 400, so that the first convex portion 312aa has less influence on the material shielding of the first packaging structure 400, and can facilitate the connection between the first section 410 and the third section 421b in the first opening 310aa, that is, can facilitate the first section 410 in the first opening 310aa to provide better support effect to the third section 421b, thereby improving the structural stability of the first packaging structure 400 in the first opening 310aa. Moreover, the third protruding eaves portion 312ac has a greater effect on the material shielding of the first packaging structure 400, which facilitates the first section 410 and the third section 421b in the third opening 310ac to be at least partially separated to form a connecting opening 400b, so that the material of the subsequent supporting structure P can be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b to better support the third packaging unit 403.

[0293] There are many ways to adjust the distance between the second isolation portion 312 and the substrate 100 . For example, the distance between the second isolation portion 312 and the substrate 100 can be adjusted by adjusting the size of the first isolation portion 311 in the thickness direction.

[0294] Optionally, the size of at least a portion of the first isolation portion 311 that participates in the enclosing and forming of the first opening 310aa in the thickness direction of the display panel 10 may be smaller than the size of the first isolation portion 311 that participates in the enclosing and forming of the third opening 310ac in the thickness direction of the display panel 10, so as to facilitate the realization that the distance between at least a portion of the second isolation portion 312 that participates in the enclosing and forming of the first opening 310aa and the substrate 100 is smaller than the distance between the second isolation portion 312 that participates in the enclosing and forming of the third opening 310ac and the substrate 100.

[0295] In some optional embodiments, the distance between at least a portion of the second isolation portion 312 that participates in forming the second opening 310ab and the substrate 100 is greater than or equal to the distance between the second isolation portion 312 that participates in forming the first opening 310aa and the substrate 100; and / or, the distance between at least a portion of the second isolation portion 312 that participates in forming the second opening 310ab and the substrate 100 is less than or equal to the distance between the second isolation portion 312 that participates in forming the third opening 310ac and the substrate 100.

[0296] Optionally, the distance between at least part of the second eaves portion 312ab and the substrate 100 is greater than or equal to the distance between the first eaves portion 312aa and the substrate 100; and / or, the distance between at least part of the second eaves portion 312ab and the substrate 100 is less than or equal to the distance between the third eaves portion 312ac and the substrate 100.

[0297] Optionally, the size of at least a portion of the first isolation portion 311 participating in the enclosing formation of the second opening 310ab in the thickness direction of the display panel 10 is greater than or equal to the size of the first isolation portion 311 participating in the enclosing formation of the first opening 310aa in the thickness direction of the display panel 10, so as to achieve that the distance between at least a portion of the second isolation portion 312 participating in the enclosing formation of the second opening 310ab and the substrate 100 is greater than or equal to the distance between the second isolation portion 312 participating in the enclosing formation of the first opening 310aa and the substrate 100; and / or, the size of at least a portion of the first isolation portion 311 participating in the enclosing formation of the second opening 310ab in the thickness direction of the display panel 10 is less than or equal to the size of the first isolation portion 311 participating in the enclosing formation of the third opening 310ac in the thickness direction of the display panel 10, so as to achieve that the distance between at least a portion of the second isolation portion 312 participating in the enclosing formation of the second opening 310ab and the substrate 100 is less than or equal to the distance between the second isolation portion 312 participating in the enclosing formation of the third opening 310ac and the substrate 100.

[0298] In these optional embodiments, the distance between at least a portion of the second protruding eaves portion 312ab and the substrate 100 may be between the distance between the first protruding eaves portion 312aa and the substrate 100 and the distance between the third protruding eaves portion 312ac and the substrate 100, and / or the distance between at least a portion of the second protruding eaves portion 312ab and the substrate 100 may be equal to the distance between the first protruding eaves portion 312aa and the substrate 100, and / or the distance between at least a portion of the second protruding eaves portion 312ab and the substrate 100 may be equal to the distance between the third protruding eaves portion 312ac and the substrate 100. For ease of description, an example is used in which the distance between a portion of the second protruding eaves portion 312ab is equal to the distance between the first protruding eaves portion 312aa and the substrate 100, and the distance between another portion of the second protruding eaves portion 312ab is equal to the distance between the third protruding eaves portion 312ac and the substrate 100.

[0299] During the preparation process of the first packaging structure 400, the portion of the second protruding eaves 312ab that has a larger distance from the substrate 100 can be closer to the preparation equipment of the first packaging structure 400, so that the portion of the second protruding eaves 312ab has a greater impact on the material blocking of the first packaging structure 400, which is convenient for the first section 410 and the third section 421b in the third opening 310ac to be at least partially separated to form a connecting opening 400b, so that the material of the subsequent supporting structure P can be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b to better support the third packaging unit 403. The other part of the second convex portion 312ab that has a smaller distance from the substrate 100 can be relatively far away from the preparation equipment of the first packaging structure 400, so that the other part of the second convex portion 312ab has less influence on the material blocking of the first packaging structure 400, and can facilitate the connection between the part of the first division 410 and the third division 421b in the second opening 310ab, that is, it can facilitate the part of the first division 410 in the second opening 310ab to provide better support effect to the third division 421b, thereby improving the structural stability of the first packaging structure 400 in the second opening 310ab.

[0300] FIG17 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0301] 1 to 17 , an embodiment of the first aspect of the present application further provides a display panel 10, comprising: a substrate 100; an isolation structure 310, disposed on one side of the substrate 100 and enclosing a plurality of isolation openings 310 a, the isolation structure 310 comprising a first isolation portion 311 and a second isolation portion 312 located on the side of the first isolation portion 311 facing away from the substrate 100, the second isolation portion 312 having a convex portion 312 a protruding from the first isolation portion 311 toward the side of the isolation opening 310 a; a plurality of light-emitting devices 200, at least part of the structure of the light-emitting device 200 being located within the isolation opening 310 a, the light-emitting device 200 comprising a light-emitting unit 220 and a first electrode 230 located on the side of the light-emitting unit 220 facing away from the substrate 100; a first packaging structure 400, disposed on the side of the light-emitting device 200 facing away from the substrate 100, the first packaging structure 400 comprising a first The first division 410, the second division 421a and the third division 421b, the first division 410 covers the side of the light-emitting device 200 facing away from the substrate 100, the second division 421a covers the side of the first isolation portion 311 facing the isolation opening 310a, the third division 421b is at least partially located on the side of the second isolation portion 312 facing the substrate 100 and is at least partially attached to the eaves portion 312a, the first division 410, the second division 421a and the third division 421b enclose a gap space 400a, the first division 410 and the third division 421b in at least part of the isolation opening 310a are at least partially spaced apart and form a connecting opening 400b, and the minimum size of the connecting opening 400b in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 and the first electrode 230 of at least part of the light-emitting device 200 and the sealing coefficient.

[0302] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and encloses a plurality of isolation openings 310a. At least a portion of the structure of the light-emitting device 200 is located within the isolation openings 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10. The isolation structure 310 includes a first isolation portion 311 and a second isolation portion 312 located on a side of the first isolation portion 311 facing away from the substrate 100. The second isolation portion 312 has a convex portion 312a that protrudes from the first isolation portion 311 toward the isolation opening 310a. This allows for direct, full-surface vapor deposition of at least a portion of the material used to form the light-emitting devices 200 when fabricating the light-emitting devices 200 of the display panel 10. The convex portion 312a of the second isolation portion 312 can shield at least a portion of the material used to fabricate the light-emitting devices 200, thereby separating the material of the light-emitting devices 200 between adjacent sub-pixels. This facilitates the formation of multiple light-emitting devices 200 spaced apart and located within the isolation opening 310a. This eliminates the need for a high-precision mask when fabricating the light-emitting devices 200 of the display panel 10. For example, a high-precision metal mask is not required when vapor-depositing the material of the light-emitting devices 200, thereby significantly reducing the production cost of the display panel 10. The isolation structure 310 can be used to independently fabricate different light-emitting devices 200.

[0303] The first encapsulation structure 400 is disposed on a side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. The first encapsulation structure 400 includes a first sub-portion 410, a second sub-portion 421a, and a third sub-portion 421b. The first sub-portion 410 covers the side of the light-emitting device 200 facing away from the substrate 100. The second sub-portion 421a covers the side of the first isolation portion 311 facing the isolation opening 310a. The third sub-portion 421b is at least partially located on the side of the second isolation portion 312 facing the substrate 100 and is at least partially attached to the convex portion 312a. This allows the first encapsulation structure 400 to have a larger size, thereby effectively extending the encapsulation path of the first encapsulation structure 400.

[0304] The first division 410, the second division 421a and the third division 421b are enclosed to form a gap space 400a, which can effectively reduce the mutual interference between the first division 410, the second division 421a and the third division 421b when the first packaging structure 400 is formed, so that the first division 410 can be better formed on the side of the light-emitting device 200 away from the substrate 100, and the second division 421a can be better formed on the side of the second isolation portion 312 facing the isolation opening 310a, and the third division 421b can be better formed on the side of the second isolation portion 312 facing the substrate 100, thereby effectively improving the packaging effect of the first packaging structure 400 on the display panel 10.

[0305] The first subsection 410 and the third subsection 421b within at least a portion of the isolation opening 310a are at least partially spaced apart to form a communication opening 400b. By setting the minimum dimension of the communication opening 400b in the thickness direction of the display panel 10 to be less than or equal to the product of the sum of the thicknesses of the light-emitting units 220 and the first electrode 230 of at least a portion of the light-emitting devices 200 and the sealing coefficient, when different light-emitting devices 200 are separately prepared during the preparation process of the display panel 10, the materials of the light-emitting units 220 and the first electrode 230 of the light-emitting device 200 prepared later can better block the communication opening 400 of the first encapsulation structure 400 above the previously prepared light-emitting device 200. 0b, that is, the materials of the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 prepared later can be better continuous at the connecting opening 400b of the first packaging structure 400 above the light-emitting device 200 prepared earlier, so that when the light-emitting unit 220 and the film layer structure above the first electrode 230 of the light-emitting device 200 prepared later are patterned, the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 prepared later can better cover and protect the first packaging structure 400 below, so that the etching material is not easy to enter the gap space 400a through the connecting opening 400b, thereby better improving the structural stability of the display panel 10.

[0306] Specifically, regarding the beneficial effects of setting the minimum size of the communication opening 400 b in the thickness direction of the display panel 10 during the preparation of the display panel 10 , reference may be made to the corresponding preparation methods and drawings in the following embodiments.

[0307] Optionally, the embodiment of the first aspect of the present application also provides a display panel 10 which may be the display panel 10 in any of the aforementioned embodiments. Therefore, the embodiment of the present application also provides a display panel 10 which may have the beneficial effects of the display panel 10 in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0308] For example, the isolation structure 310 may be the isolation structure 310 described in any of the aforementioned embodiments, and the isolation structure 310 may include the first isolation portion 311, the second isolation portion 312, and the third isolation portion 313 described in any of the aforementioned embodiments. The isolation opening 310a may include the first opening 310aa, the second opening 310ab, and the third opening 310ac described in any of the aforementioned embodiments.

[0309] For example, the display panel 10 also includes a pixel definition layer 320 arranged on the side of the substrate 100 facing the light-emitting device 200, the pixel definition layer 320 includes a pixel defining portion 321 and a pixel opening 320a formed by the pixel defining portion 321, and the isolation structure 310 is arranged on the side of the pixel defining portion 321 facing away from the substrate 100, and the pixel opening 320a is connected to the isolation opening 310a.

[0310] For example, the light-emitting device 200 may be the light-emitting device 200 described in any of the aforementioned embodiments, and the light-emitting device 200 may include a first light-emitting device 200a arranged corresponding to the first opening 310aa in any of the aforementioned embodiments, a second light-emitting device 200b arranged corresponding to the second opening 310ab, and a third light-emitting device 200c arranged corresponding to the third opening 310ac.

[0311] For example, the first package structure 400 may include a first package unit 401 at least partially located in the first opening 310aa , a second package unit 402 at least partially located in the second opening 310ab , and a third package unit 403 at least partially located in the third opening 310ac .

[0312] In some embodiments, the first embodiment of the present application further provides a first encapsulation structure 400 in a display panel 10 that can be configured in accordance with any of the aforementioned embodiments. Specifically, the first sub-portion 410 in the first encapsulation structure 400 can be at least partially connected to the third sub-portion 421b to form the connection portion 400c described in any of the aforementioned embodiments. For example, a side of the third sub-portion 421b within the first opening 310aa that is adjacent to the isolation opening 310a is at least partially connected to a surface of the first sub-portion 410 that faces away from the substrate 100 to form the connection portion 400c. Furthermore, the orthographic projection of the connection portion 400c within the first opening 310aa onto the substrate 100 is annular, such that the gap 400a within the first opening 310aa is a sealed space. For example, the side of the third section 421b in the second opening 310ab close to the isolation opening 310a is at least partially connected to the surface of the first section 410 facing away from the substrate 100 to form a connecting portion 400c, and the positive projection shape of the connecting portion 400c in the second opening 310ab on the substrate 100 is annular so that the gap space 400a in the second opening 310ab forms a closed gap space 400a.

[0313] In other embodiments, the first embodiment of the present application further provides a first encapsulation structure 400 in a display panel 10 that can be configured at least partially differently from the first encapsulation structure 400 in the display panel 10 in any of the aforementioned embodiments, that is, the first subsection 410 of the first encapsulation structure 400 in each isolation opening 310a can be spaced apart from the third subsection 421b and form a connecting opening 400b, that is, the connecting opening 400b in each isolation opening 310a can be annular. For example, the gap space 400a in the first opening 310aa forms at least one connecting opening 400b. For example, the gap space 400a in the second opening 310ab forms at least one connecting opening 400b. For example, the gap space 400a in the third opening 310ac forms at least one connecting opening 400b.

[0314] For ease of description, the following embodiments are described by taking the example of the first sub-portions 410 of the first packaging structure 400 in each isolation opening 310a shown in FIG. 17 as being spaced apart from the third sub-portion 421b to form an annular communicating opening 400b.

[0315] In some embodiments of the present application, the minimum size of the communication opening 400b in the thickness direction of the display panel 10 may be the minimum distance between the first sub-portion 410 and the third sub-portion 421b in the isolation opening 310a in the thickness direction of the display panel 10 .

[0316] In some optional embodiments, the minimum size of the communication opening 400 b in the thickness direction of the display panel 10 may be smaller than or equal to the size of the opening that can be blocked by at least a portion of the light emitting unit 220 of the light emitting device 200 and the first electrode 230 .

[0317] Optionally, the size of the opening that can be blocked by the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 may refer to the maximum value that can be set as the minimum size of the connecting opening 400b of the front first packaging structure 400 that can be blocked by the material of the light-emitting unit 220 and the first electrode 230 of the rear light-emitting device 200 in the thickness direction of the display panel 10 when the rear light-emitting device 200 is prepared after the preparation of the front part of the light-emitting device 200 and the first packaging structure 400 is completed.

[0318] Among them, the blocking of the opening by the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 may mean that the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 can fill the opening, or may mean that the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 can completely cover the opening.

[0319] Alternatively, the sealing coefficient can be obtained experimentally. For example, during a display panel 10 experiment, after simulating the preparation of a specific light-emitting device 200 and a portion of the first encapsulation structure 400 located above the specific light-emitting device 200, the corresponding virtual light-emitting unit 220 and virtual first electrode 230 film layers are prepared using the same method as the light-emitting unit 220 and first electrode 230 of other light-emitting devices 200 other than the specific light-emitting device 200. If these film layers are able to seal the communication opening 400b of the portion of the first encapsulation structure 400 located above the specific light-emitting device 200 and the corresponding film layer of the first electrode 230 is not disconnected at the communication opening 400b, the maximum allowable minimum dimension of the communication opening 400b located above the specific light-emitting device 200 in the thickness direction of the display panel 10 can be a first reference value, and the sum of the thicknesses of the virtual light-emitting unit 220 and the virtual first electrode 230 can be a second reference value. The sealing coefficient can refer to the ratio of the first reference value to the second reference value.

[0320] Among them, the maximum value that can be set for the minimum size of the connecting opening 400b above the specific light-emitting device 200 in the thickness direction of the display panel 10 may refer to the maximum value among the minimum sizes of the connecting opening 400b above the specific light-emitting devices 200 in the thickness direction of the display panel 10 that meet the requirements obtained through multiple experiments.

[0321] For example, in order to make the minimum size of the communication opening 400b in the thickness direction of the display panel 10 different in each experiment, at least one relevant parameter can be adjusted according to product design requirements (for example, other parameters can be kept unchanged, and only one parameter can be adjusted, such as by adjusting only the film thickness of the first encapsulation structure 400). Specifically, in order to achieve "the minimum size of the communication opening 400b in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 and the first electrode 230 of at least part of the light-emitting device 200 and the sealing coefficient", the corresponding parameters used in the experiment for obtaining the "maximum value that can be set for the minimum size of the communication opening 400b in the thickness direction of the display panel 10" can be used as a reference, and one or more parameters that can reduce the "minimum size of the communication opening 400b in the thickness direction of the display panel 10" can be adjusted, such as increasing the film thickness of the first encapsulation structure.

[0322] In these optional embodiments, by setting the minimum size of the connecting opening 400b in the thickness direction of the display panel 10 to be less than or equal to the product of the sum of the thicknesses of the light-emitting units 220 and the first electrode 230 of at least part of the light-emitting device 200 and the sealing coefficient, the size of the connecting opening 400b can be more accurately controlled so that the size setting of the connecting opening 400b is not too large, so that when different light-emitting devices 200 are prepared separately during the preparation process of the display panel 10, the materials of the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 prepared later can better block the connecting opening 400b of the first packaging structure 400 above the light-emitting device 200 prepared previously.

[0323] Optionally, the sealing coefficient may be 1. Optionally, the minimum dimension of the communication opening 400 b in the thickness direction of the display panel 10 may be less than or equal to the sum of the thicknesses of at least part of the light emitting unit 220 and the first electrode 230 of the light emitting device 200 .

[0324] In some optional embodiments, during the manufacturing process of the display panel 10, the manufacturing step of the first light-emitting device 200a may be performed before the manufacturing step of the third light-emitting device 200c. For example, during the manufacturing process of the display panel 10, the first light-emitting device 200a and the first encapsulation unit 401 may be manufactured first, and then the third light-emitting device 200c and the third encapsulation unit 403 may be manufactured. Specifically, the second electrodes 210 of the first light-emitting device 200a and the third light-emitting device 200c may be manufactured simultaneously, and then the light-emitting unit 220 and the first electrode 230 of the first light-emitting device 200a may be manufactured to complete the manufacturing of the first light-emitting device 200a. The first encapsulation unit 401 may be formed on the first light-emitting device 200a. The light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c may be manufactured to complete the manufacturing of the third light-emitting device 200c. Finally, the third encapsulation unit 403 may be formed on the third light-emitting device 200c.

[0325] Optionally, during the manufacturing process of the display panel 10, the manufacturing step of the second light-emitting device 200b is located between the manufacturing steps of the first light-emitting device 200a and the manufacturing steps of the third light-emitting device 200c. For example, during the manufacturing process of the display panel 10, the first light-emitting device 200a and the first packaging unit 401 may be manufactured first, followed by the manufacturing steps of the second light-emitting device 200b and the second packaging unit 402, and then the manufacturing steps of the third light-emitting device 200c and the third packaging unit 403. Specifically, the preparation of the second electrode 210 of the first light-emitting device 200a, the second light-emitting device 200b and the third light-emitting device 200c can be completed simultaneously first, and then the light-emitting unit 220 and the first electrode 230 of the first light-emitting device 200a can be prepared to complete the preparation of the first light-emitting device 200a, and then the first packaging unit 401 is prepared on the first light-emitting device 200a, and then the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b are prepared to complete the preparation of the second light-emitting device 200b, and then the second packaging unit 402 is prepared on the second light-emitting device 200b, and then the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c are prepared to complete the preparation of the third light-emitting device 200c, and finally the third packaging unit 403 is prepared on the third light-emitting device 200c.

[0326] In some embodiments of the present application, the sealing coefficient varies with the shape and structure of the corresponding communication opening 400 b and the film material and thickness of the light emitting unit 220 and the first electrode 230 of the corresponding light emitting device 200 of different colors.

[0327] In some optional embodiments, the minimum size of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the corresponding sealing coefficient; and / or, the minimum size of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c and the corresponding sealing coefficient.

[0328] Optionally, the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the corresponding sealing coefficient, which may mean that the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the first sealing coefficient.

[0329] Alternatively, the first sealing coefficient can be obtained experimentally. For example, during an experiment with the display panel 10, after simulating the preparation of the first light-emitting device 200a within the first opening 310aa and the first encapsulation unit 401 above the first light-emitting device 200a, the corresponding virtual light-emitting unit 220 and virtual first electrode 230 film layers are prepared using the same method as the light-emitting unit 220 and first electrode 230 of the second light-emitting device 200b. Under the conditions that these film layers can seal the communication opening 400b of the first encapsulation unit 401 and the corresponding film layers of the first electrode 230 are not disconnected at the communication opening 400b of the first encapsulation unit 401, the maximum allowable minimum dimension of the communication opening 400b in the thickness direction of the display panel 10 can be a third reference value, and the sum of the thicknesses of the first electrodes 230 of the second light-emitting devices 200b can be a fourth reference value. The first sealing coefficient can be the ratio of the third reference value to the fourth reference value.

[0330] The maximum value of the minimum size of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10 that can be set may refer to the maximum value of multiple minimum sizes of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10 that meet the requirements and are obtained through multiple experiments.

[0331] Optionally, the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c and the corresponding sealing coefficient, which may mean that the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c and the second sealing coefficient.

[0332] Alternatively, the second sealing coefficient can be obtained experimentally. For example, during an experiment with the display panel 10, after simulating the preparation of the first light-emitting device 200a within the first opening 310aa and the first encapsulation unit 401 above the first light-emitting device 200a, the corresponding virtual light-emitting unit 220 and virtual first electrode 230 film layers are prepared using the same method as the light-emitting unit 220 and first electrode 230 of the third light-emitting device 200c. Under the conditions that these film layers can block the communication opening 400b of the first encapsulation unit 401 and the corresponding film layers of the first electrode 230 are not disconnected at the communication opening 400b of the first encapsulation unit 401, the maximum allowable minimum dimension of the communication opening 400b of the first encapsulation unit 401 in the thickness direction of the display panel 10 can be set to the fifth reference value, and the sum of the thicknesses of the first electrodes 230 of the third light-emitting device 200c can be set to the sixth reference value. The second sealing coefficient can be referred to as the ratio of the fifth reference value to the sixth reference value.

[0333] The maximum value of the minimum size of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10 that can be set may refer to the maximum value of multiple minimum sizes of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10 that meet the requirements and are obtained through multiple experiments.

[0334] In these optional embodiments, the minimum size of the communication opening 400b in the first opening 310aa in the thickness direction of the display panel 10 is set according to the thickness of the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the thickness of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c. This allows the size of the communication opening 400b in the first opening 310aa to be more accurately controlled. When the second light-emitting device 200b and the second packaging unit 402 are prepared, the materials of the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b, which are prepared later, can better block the first light-emitting device 200a. The connecting opening 400b of the first packaging unit 401 above, that is, the materials of the light-emitting unit 220 of the second light-emitting device and the first electrode 230 can be better continuous at the connecting opening 400b of the first packaging unit 401 above the first light-emitting device 200a, so that when the material of the second packaging unit 402 is patterned, the materials of the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b can better cover and protect the first packaging unit 401 below, so that the etching material is not easy to enter the gap space 400a of the first packaging unit 401 through the connecting opening 400b, thereby better improving the structural stability of the display panel 10.

[0335] Moreover, when preparing the third light-emitting device 200c and the third packaging unit 403, the materials of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c prepared later can better block the connecting opening 400b of the first packaging unit 401 above the first light-emitting device 200a, that is, the materials of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device can be better continuous at the connecting opening 400b of the first packaging unit 401 above the first light-emitting device 200a, so that when the material of the third packaging unit 403 is patterned, the materials of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c can better cover and protect the first packaging unit 401 below, so that the etching material is not easy to enter the gap space 400a of the first packaging unit 401 through the connecting opening 400b, thereby better improving the structural stability of the display panel 10.

[0336] Optionally, the first sealing coefficient may be 1, and / or the second sealing coefficient may be 1. Optionally, the dimension of the communication opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the thickness of the light-emitting unit 220 of the second light-emitting device 200b; and / or the dimension of the communication opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the thickness of the light-emitting unit 220 of the third light-emitting device 200c.

[0337] In some optional embodiments, the minimum dimension of the connecting opening 400b within the second opening 310ab in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c and the fourth sealing coefficient.

[0338] Alternatively, the fourth sealing coefficient can be obtained experimentally. For example, during an experiment with the display panel 10, after simulating the preparation of the second light-emitting device 200b within the second opening 310ab and the second encapsulation unit 402 above the second light-emitting device 200b, the corresponding virtual light-emitting unit 220 and virtual first electrode 230 film layers are prepared using the same method as the light-emitting unit 220 and first electrode 230 of the third light-emitting device 200c. Under the condition that these film layers can seal the communication opening 400b of the second encapsulation unit 402 and are not disconnected at the communication opening 400b of the second encapsulation unit 402, the maximum allowable minimum dimension of the communication opening 400b in the thickness direction of the display panel 10 can be the seventh reference value, and the sum of the thicknesses of the first electrodes 230 of the third light-emitting devices 200c can be the eighth reference value. The fourth sealing coefficient can be the ratio of the seventh reference value to the eighth reference value.

[0339] The maximum value that can be set for the minimum size of the communication opening 400b of the second packaging unit 402 in the thickness direction of the display panel 10 may refer to the maximum value among multiple minimum sizes of the communication opening 400b of the second packaging unit 402 in the thickness direction of the display panel 10 that meet the requirements and are obtained through multiple experiments.

[0340] In these optional embodiments, the minimum size of the communication opening 400b in the second opening 310ab in the thickness direction of the display panel 10 is set according to the thickness of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c, so as to more accurately control the size of the communication opening 400b in the second opening 310ab. When the third light-emitting device 200c and the third packaging unit 403 are prepared, the materials of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c prepared later can better block the communication of the second packaging unit 402 above the second light-emitting device 200b. The opening 400b, that is, the materials of the light-emitting unit 220 of the third light-emitting device and the first electrode 230 can be well continuous at the connecting opening 400b of the second packaging unit 402 above the second light-emitting device 200b, so that when the material of the third packaging unit 403 is patterned, the materials of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c can well cover and protect the second packaging unit 402 below, so that the etching material is not easy to enter the gap space 400a of the second packaging unit 402 through the connecting opening 400b, thereby better improving the structural stability of the display panel 10.

[0341] Optionally, the fourth sealing coefficient may be 1. Optionally, a dimension of the communication opening 400b within the second opening 310ab in the thickness direction of the display panel 10 is smaller than or equal to the thickness of the light emitting unit 220 of the third light emitting device 200c.

[0342] In some embodiments of the present application, since it is not necessary to continue preparing the light-emitting device 200 and the first encapsulation structure 400 after the third light-emitting device 200c and the third encapsulation unit 403 are prepared, the present application does not impose any specific restrictions on the minimum size of the communication opening 400b in the third encapsulation unit 403 in the thickness direction of the display panel 10. For example, the communication opening 400b in the third encapsulation unit 403 may have a larger size in the thickness direction of the display panel 10 to facilitate the preparation of the third encapsulation unit 403.

[0343] In some optional embodiments, the size of the connecting opening 400b in the first opening 310aa in the thickness direction of the display panel 10 is smaller than the size of the connecting opening 400b in the third opening 310ac in the thickness direction of the display panel 10, so that the connecting opening 400b in the first opening 310aa can have a smaller size to facilitate the blocking of the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the third light-emitting device 200c.

[0344] Optionally, the size of the connecting opening 400b within the second opening 310ab in the thickness direction of the display panel 10 is smaller than or equal to the size of the connecting opening 400b within the third opening 310ac in the thickness direction of the display panel 10, so that the connecting opening 400b within the second opening 310ab can have a smaller size to facilitate the sealing of the light-emitting unit 220 of the third light-emitting device 200c and the first electrode 230.

[0345] Optionally, the size of the connecting opening 400b in the second opening 310ab in the thickness direction of the display panel 10 is greater than or equal to the size of the connecting opening 400b in the first opening 310aa in the thickness direction of the display panel 10, so that the connecting opening 400b in the first opening 310aa can be smaller, so that the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the third light-emitting device 200c can block the connecting opening 400b in the first opening 310aa.

[0346] There are multiple methods for adjusting the size of the connecting opening 400b in the thickness direction of the display panel 10, that is, there are multiple methods for adjusting the spacing between the side surface of the first section 410 facing away from the substrate 100 and the side surface of the third section 421b facing away from the isolation structure 310.

[0347] Optionally, the size of the communication opening 400b in the thickness direction of the display panel 10 may be adjusted by referring to the method described in any of the aforementioned embodiments. For example, the size of the communication opening 400b in the thickness direction of the display panel 10 may be adjusted by referring to the method described in the aforementioned embodiments by adjusting the thickness of the first encapsulation structure 400. For example, the size of the communication opening 400b in the thickness direction of the display panel 10 may be adjusted by referring to the method described in the aforementioned embodiments by adjusting the topography of the isolation structure 310.

[0348] FIG18 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0349] As shown in FIG. 18 , in some optional embodiments, the maximum thickness of the first packaging unit 401 is greater than the maximum thickness of the third packaging unit 403 .

[0350] Optionally, the thickness of the first section 410 in the first packaging unit 401 may represent the maximum thickness of the first packaging unit 401 . Specifically, the thickness of the first main section 411 a in the first packaging unit 401 may represent the maximum thickness of the first packaging unit 401 .

[0351] Optionally, the thickness of the first section 410 in the third packaging unit 403 may represent the maximum thickness of the third packaging unit 403 . Specifically, the thickness of the first main section 411 a in the third packaging unit 403 may represent the maximum thickness of the third packaging unit 403 .

[0352] In these optional embodiments, by setting the maximum thickness of the first encapsulation unit 401 to be greater than the maximum thickness of the third encapsulation unit 403, the first encapsulation unit 401 is less susceptible to damage during subsequent etching processes during the fabrication of the display panel 10. For example, the first encapsulation unit 401 is less susceptible to damage from etching material during the etching process of the second light-emitting device 200b, the second encapsulation unit 402, the third light-emitting device 200c, and the third encapsulation unit 403, thereby effectively improving the packaging stability of the first encapsulation unit 401. Furthermore, the first subsection 410 of the first encapsulation unit 401 is closer to the third subsection 421b of the first encapsulation unit 401, resulting in a smaller communication opening 400b of the first encapsulation unit 401 in the thickness direction of the display panel 10. This facilitates the sealing of the communication opening 400b of the first encapsulation unit 401 by the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the third light-emitting device 200c.

[0353] In some optional embodiments, the maximum thickness of the second packaging unit 402 is greater than or equal to the maximum thickness of the third packaging unit 403 .

[0354] Optionally, the maximum thickness of the second packaging unit 402 is less than or equal to the maximum thickness of the first packaging unit 401 .

[0355] Optionally, the thickness of the first section 410 in the second packaging unit 402 may represent the maximum thickness of the second packaging unit 402 . Specifically, the thickness of the first main section 411 a in the second packaging unit 402 may represent the maximum thickness of the second packaging unit 402 .

[0356] In these optional embodiments, by setting the maximum thickness of the second encapsulation unit 402 to be greater than the maximum thickness of the third encapsulation unit 403, the second encapsulation unit 402 is less susceptible to damage during subsequent etching processes during the fabrication of the display panel 10. For example, the second encapsulation unit 402 is less susceptible to damage from etching material during the etching process of the third light-emitting device 200c and the third encapsulation unit 403, thereby effectively improving the packaging stability of the second encapsulation unit 402. Furthermore, the first subsection 410 of the second encapsulation unit 402 can be closer to the third subsection 421b of the second encapsulation unit 402, resulting in a smaller communication opening 400b of the second encapsulation unit 402 in the thickness direction of the display panel 10, thereby facilitating the sealing of the communication opening 400b of the second encapsulation unit 402 by the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c.

[0357] In some optional embodiments, there is a first spacing between the surface of the protruding eaves portion 312a facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100, and the ratio of the maximum thickness of at least a portion of the first main body portion 411a of the first packaging unit 401 to the first spacing is not less than 1; and / or, the ratio of the maximum thickness of at least a portion of the second main body portion 411b of the first packaging unit 401 to the first spacing is not less than 1.

[0358] Optionally, the eaves portion 312a includes a first eaves portion 312aa corresponding to the first opening 310aa, a second eaves portion 312ab corresponding to the second opening 310ab, and a third eaves portion 312ac corresponding to the third opening 310ac. The first spacing may refer to the spacing between the surface of the first eaves portion 312aa facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100. The ratio of the maximum thickness of the first main body division 411a of the first packaging unit 401 to the first spacing corresponding to the first eaves portion 312aa is not less than 1, and / or the ratio of the maximum thickness of the second main body division 411b of the first packaging unit 401 to the first spacing corresponding to the first eaves portion 312aa is not less than 1.

[0359] In these optional embodiments, by reasonably setting the ratio of the maximum thickness of the first main body division 411a of the first packaging unit 401 to the first spacing, and reasonably setting the ratio of the maximum thickness of the second main body division 411b of the first packaging unit 401 to the first spacing, the thickness of at least part of the first main body division 411a and at least part of the second main body division 411b in the first packaging unit 401 can be better adjusted according to the shielding ability of the convex portion 312a on the first packaging structure 400, so as to reduce the size of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10, thereby facilitating the blocking of the communication opening 400b of the first packaging unit 401 by the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the third light-emitting device 200c.

[0360] Specifically, when the first spacing is large, the eaves portion 312a will be closer to the preparation equipment of the first packaging structure 400 during the preparation of the first packaging structure 400, so that the eaves portion 312a has a greater impact on the material shielding of the first packaging structure 400, that is, the eaves portion 312a can have better shielding ability. Therefore, according to the larger first spacing, the first main body division 411a and at least part of the second main body division 411b of the first packaging unit 401 can be set to have a larger thickness, so that the first division 410 and the third division 421b of the first packaging unit 401 can be closer, so as to reduce the size of the connecting opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10.

[0361] When the first spacing is small, the convex portion 312a will be relatively far away from the preparation equipment of the first packaging structure 400 during the preparation of the first packaging structure 400, so that the convex portion 312a has less influence on the material shielding of the first packaging structure 400, that is, the convex portion 312a has poor shielding ability on the first packaging structure 400. Therefore, according to the smaller first spacing, at least part of the first main body division 411a and at least part of the second main body division 411b of the first packaging unit 401 can be set to have a reasonable thickness, so that the first division 410 and the third division 421b of the first packaging unit 401 can be relatively close, while not easily increasing the thickness of the display panel 10 too much.

[0362] FIG19 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0363] As shown in FIG. 19 , in some optional embodiments, the distance between at least a portion of the second isolation portion 312 forming the first opening 310aa and the substrate 100 is smaller than the distance between the second isolation portion 312 forming the third opening 310ac and the substrate 100 .

[0364] Optionally, the distance between the second isolation portion 312 and the substrate 100 may refer to the distance between the surface of the second isolation portion 312 facing the substrate 100 and the substrate 100 .

[0365] Optionally, the distance between the first protruding eave portion 312 aa and the substrate 100 may be smaller than the distance between the third protruding eave portion 312 ac and the substrate 100 .

[0366] In these optional embodiments, by arranging the spacing between at least a portion of the second isolation portion 312 that participates in enclosing and forming the first opening 310aa and the substrate 100 to be smaller than the spacing between the second isolation portion 312 that participates in enclosing and forming the third opening 310ac and the substrate 100, during the preparation process of the first packaging structure 400, compared with the first convex portion 312aa, the third convex portion 312ac can be closer to the preparation equipment of the first packaging structure 400, so that the first convex portion 312aa has less influence on the material shielding of the first packaging structure 400, which can facilitate reducing the size of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10, thereby facilitating the blocking of the communication opening 400b of the first packaging unit 401 by the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the third light-emitting device 200c.

[0367] There are many ways to adjust the distance between the second isolation portion 312 and the substrate 100 . For example, the distance between the second isolation portion 312 and the substrate 100 can be adjusted by adjusting the size of the first isolation portion 311 in the thickness direction.

[0368] Optionally, the size of at least a portion of the first isolation portion 311 that participates in the enclosing formation of the first opening 310aa in the thickness direction of the display panel 10 is smaller than the size of the first isolation portion 311 that participates in the enclosing formation of the second opening 310ab in the thickness direction of the display panel 10, so as to facilitate the realization that the distance between at least a portion of the second isolation portion 312 that participates in the enclosing formation of the first opening 310aa and the substrate 100 is smaller than the distance between the second isolation portion 312 that participates in the enclosing formation of the third opening 310ac and the substrate 100.

[0369] In some optional embodiments, the distance between at least a portion of the second isolation portion 312 that participates in forming the second opening 310ab and the substrate 100 is greater than or equal to the distance between the second isolation portion 312 that participates in forming the first opening 310aa and the substrate 100; and / or, the distance between at least a portion of the second isolation portion 312 that participates in forming the second opening 310ab and the substrate 100 is less than or equal to the distance between the second isolation portion 312 that participates in forming the third opening 310ac and the substrate 100.

[0370] Optionally, the distance between at least part of the second convex portion 312ab and the substrate 100 is greater than or equal to the distance between the first convex portion 312aa and the substrate 100; and / or, the distance between at least part of the second convex portion 312ab and the substrate 100 is less than or equal to the distance between the third convex portion 312ac and the substrate 100.

[0371] Optionally, the size of at least a portion of the first isolation portion 311 participating in the enclosing formation of the second opening 310ab in the thickness direction of the display panel 10 is greater than or equal to the size of the first isolation portion 311 participating in the enclosing formation of the first opening 310aa in the thickness direction of the display panel 10, so as to achieve that the distance between at least a portion of the second isolation portion 312 participating in the enclosing formation of the second opening 310ab and the substrate 100 is greater than or equal to the distance between the second isolation portion 312 participating in the enclosing formation of the first opening 310aa and the substrate 100; and / or, the size of at least a portion of the first isolation portion 311 participating in the enclosing formation of the second opening 310ab in the thickness direction of the display panel 10 is less than or equal to the size of the first isolation portion 311 participating in the enclosing formation of the third opening 310ac in the thickness direction of the display panel 10, so as to achieve that the distance between at least a portion of the second isolation portion 312 participating in the enclosing formation of the second opening 310ab and the substrate 100 is less than or equal to the distance between the second isolation portion 312 participating in the enclosing formation of the third opening 310ac and the substrate 100.

[0372] In these optional embodiments, by arranging the distance between at least a portion of the second isolation portion 312 that participates in enclosing and forming the second opening 310ab and the substrate 100 to be smaller than the distance between the second isolation portion 312 that participates in enclosing and forming the third opening 310ac and the substrate 100, during the preparation process of the first packaging structure 400, compared with the second convex eaves portion 312ab, the third convex eaves portion 312ac can be closer to the preparation equipment of the first packaging structure 400, so that the second convex eaves portion 312ab has less influence on the material shielding of the first packaging structure 400, which can facilitate reducing the size of the connecting opening 400b of the second packaging unit 402 in the thickness direction of the display panel 10, thereby facilitating the blocking of the connecting opening 400b of the second packaging unit 402 by the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c.

[0373] FIG20 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0374] As shown in Figure 20, in some optional embodiments, the protruding length of the first eaves portion 312aa is smaller than the protruding length of the third eaves portion 312ac, that is, the protruding length of the second isolation portion 312 toward the first opening 310aa relative to the first isolation portion 311 is smaller than the protruding length of the second isolation portion 312 toward the third opening 310ac relative to the first isolation portion 311.

[0375] Alternatively, the protruding length of the first protruding eaves portion 312aa may refer to the minimum distance between the orthographic projection of the edge of the first protruding eaves portion 312aa facing the first opening 310aa on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the first protruding eaves portion 312aa on the substrate 100. Alternatively, the length a1 in FIG. 20 may represent the protruding length of the first protruding eaves portion 312aa.

[0376] Alternatively, the protruding length of the third protruding portion 312ac may refer to the minimum distance between the orthographic projection of the edge of the third protruding portion 312ac facing the third opening 310ac on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the third protruding portion 312ac on the substrate 100. Alternatively, the length a3 in FIG. 20 may represent the protruding length of the third protruding portion 312ac.

[0377] In these optional embodiments, under the smaller shielding effect provided by the first protruding eaves portion 312aa with a shorter protruding length, it is possible to reduce the size of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10, thereby facilitating the blocking of the communication opening 400b of the first packaging unit 401 by the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the third light-emitting device 200c.

[0378] In some optional embodiments, the protruding length of the second eaves portion 312ab is less than or equal to the protruding length of the third eaves portion 312ac; and / or, the protruding length of the second eaves portion 312ab is greater than or equal to the protruding length of the first eaves portion 312aa.

[0379] That is, the protruding length of the second isolation portion 312 toward the second opening 310ab relative to the first isolation portion 311 is less than or equal to the protruding length of the second isolation portion 312 toward the third opening 310ac relative to the first isolation portion 311, and / or the protruding length of the second isolation portion 312 toward the second opening 310ab relative to the first isolation portion 311 is greater than or equal to the protruding length of the second isolation portion 312 toward the first opening 310aa relative to the first isolation portion 311.

[0380] Alternatively, the protruding length of the second protruding eaves portion 312ab may refer to the minimum distance between the orthographic projection of the edge of the second protruding eaves portion 312ab facing the second opening 310ab on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the second protruding eaves portion 312ab on the substrate 100. Alternatively, the length a2 in FIG. 20 may represent the protruding length of the second protruding eaves portion 312ab.

[0381] In these optional embodiments, under the smaller shielding effect provided by the second protruding eaves portion 312ab with a shorter protruding length, it is possible to reduce the size of the communication opening 400b of the second packaging unit 402 in the thickness direction of the display panel 10, thereby facilitating the blocking of the communication opening 400b of the second packaging unit 402 by the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c.

[0382] FIG21 is a schematic diagram of a partial structure of an isolation structure 310 provided in an embodiment of the present application, and FIG22 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0383] 1 to 22 , an embodiment of the first aspect of the present application further provides a display panel 10, comprising: a substrate 100; an isolation structure 310, disposed on one side of the substrate 100 and enclosing an isolation opening 310a; a light-emitting device 200, at least partially located within the isolation opening 310a; a first encapsulation structure 400, disposed on a side of the light-emitting device 200 facing away from the substrate 100, the first encapsulation structure 400 comprising a first section 410 and a second section 421, the first section 410 being located within the isolation opening 310a and disposed on a side of the light-emitting device 200 facing away from the substrate 100, the second section 421 being located on a side of the isolation structure 310 facing the isolation opening 310a, a surface on one side of the first section 410 facing away from the substrate 100 and a surface on the other side of the second section 421 facing away from the isolation structure 310 being at least partially connected to each other to enclose a gap space 400a.

[0384] In a display panel 10 further provided in an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and encloses an isolation opening 310a. The light-emitting device 200 is at least partially located within the isolation opening 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10.

[0385] The first encapsulation structure 400 is disposed on a side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 includes a first segment 410 and a second segment 421. The first segment 410 is located within the isolation opening 310a and disposed on the side of the light-emitting device 200 facing away from the substrate 100. The second segment 421 is located on the side of the isolation structure 310 facing the isolation opening 310a. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. By at least partially connecting the surface of the first segment 410 facing away from the substrate 100 and the surface of the second segment 421 facing away from the isolation structure 310 to form a gap space 400a, the first segment 410 can effectively support the second segment 421, preventing the second segment 421 from separating from the isolation structure 310, thereby effectively improving the encapsulation effect of the first encapsulation structure 400 on the display panel 10.

[0386] Optionally, the embodiment of the first aspect of the present application also provides a display panel 10 which may be the display panel 10 in any of the aforementioned embodiments. Therefore, the embodiment of the present application also provides a display panel 10 which may have the beneficial effects of the display panel 10 in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0387] In some embodiments of the present application, there are multiple ways to set the shape of the isolation structure 310. The shape of the isolation structure 310 can be any shape that can block and isolate the material of the light-emitting device 200 to facilitate the preparation of the light-emitting device 200.

[0388] In some optional embodiments, the isolation structure 310 includes a first isolation portion 311 and a second isolation portion 312 located on a side of the first isolation portion 311 facing away from the substrate 100. The second isolation portion 312 is provided to protrude from the first isolation portion 311 toward the isolation opening 310a. By providing the second isolation portion 312 to protrude from the first isolation portion 311 toward the isolation opening 310a, when manufacturing the light-emitting device 200 of the display panel 10, the material of the light-emitting device 200 can be directly evaporated on the entire surface. The second isolation portion 312 can shield at least a portion of the material used to manufacture the light-emitting device 200, thereby isolating the material of the light-emitting device 200 between adjacent sub-pixels, thereby facilitating the formation of multiple light-emitting devices 200 spaced apart and located within the isolation opening 310a. This eliminates the need for a high-precision mask when manufacturing the light-emitting device 200 of the display panel 10. For example, a high-precision metal mask is not required when evaporating the material of the light-emitting device 200, thereby effectively reducing the production cost of the display panel 10.

[0389] 21 , the isolation structure 310 may be in a grid shape, so that the isolation structure 310 can divide the sub-pixels in the display panel 10. The hollow areas in the grid-shaped isolation structure 310 may be isolation openings 310a.

[0390] In some optional embodiments, the material of the isolation structure 310 may include a conductive material, and the first electrode 230 may be connected to the isolation structure 310, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the isolation structure 310. That is, the first electrodes 230 of adjacent sub-pixels can be electrically connected to each other through the isolation structure 310 to form a surface electrode, thereby facilitating control of the first electrodes 230 in the display panel 10. Optionally, the material of the first isolation portion 311 may include a conductive material, and the first electrode 230 may be connected to the first isolation portion 311, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the first isolation portion 311.

[0391] FIG23 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0392] As shown in FIG23 , in some optional embodiments, the isolation structure 310 further includes a third isolation portion 313 disposed on the side of the first isolation portion 311 facing the substrate 100. The third isolation portion 313 is disposed protruding from the first isolation portion 311 toward the isolation opening 310a. The third isolation portion 313 may be made of a conductive material, and the first electrode 230 may be connected to the third isolation portion 313, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected via the third isolation portion 313. By providing the third isolation portion 313 protruding from the first isolation portion 311 toward the isolation opening 310a, the third isolation portion 313 can have a larger size to facilitate connection with the first electrode 230.

[0393] Optionally, the display panel 10 may further include a pixel definition layer 320 disposed on the side of the substrate 100 facing the second electrode 210. The pixel definition layer 320 may include a pixel defining portion 321 and a pixel opening 320a enclosed by the pixel defining portion 321. The orthographic projection of the pixel opening 320a on the substrate 100 may be located within the orthographic projection of the isolation opening 310a on the substrate 100. The orthographic projection of the pixel opening 320a on the substrate 100 may refer to the orthographic projection area enclosed by the orthographic projection of the inner wall enclosing the pixel opening 320a on the substrate 100. The orthographic projection of the isolation opening 310a on the substrate 100 may refer to the orthographic projection area enclosed by the orthographic projection of the inner wall enclosing the isolation opening 310a on the substrate 100.

[0394] Optionally, the pixel defining portion 321 may be disposed between adjacent second electrodes 210, and the adjacent second electrodes 210 may be insulated by the pixel defining portion 321. The provision of the pixel defining portion 321 may also facilitate the division of sub-pixels in the display panel 10. Optionally, the pixel defining portion 321 may be located between the second electrode 210 and the isolation structure 310, and the isolation structure 310 and the second electrode 210 may also be insulated by the pixel defining portion 321. This reduces the likelihood of a short circuit between the first electrode 230 and the second electrode 210 through the isolation structure 310, thereby improving the operational reliability of the display panel 10.

[0395] In this optional embodiment, the relative positioning of the isolation structure 310 and the pixel defining portion 321 can be arranged in a variety of ways. Optionally, as shown in FIG22 , the isolation structure 310 can be arranged on the side of the pixel defining portion 321 facing away from the substrate 100, or the pixel defining portion 321 can be provided with a receiving groove, with at least a portion of the isolation structure 310 located within the receiving groove. This prevents the isolation structure 310 from being taller than the substrate 100, thereby effectively reducing the thickness of the display panel 10. For ease of description, the following embodiments will be described using the example of the isolation structure 310 being arranged on the side of the pixel defining portion 321 facing away from the substrate 100.

[0396] In some embodiments of the present application, the material of the first encapsulation structure 400 may include an inorganic material, so that the first encapsulation structure 400 has a good encapsulation capability to reduce the impact of water vapor on the light-emitting device 200. Optionally, the first encapsulation structure 400 may be prepared by a chemical vapor deposition process.

[0397] As shown in Figure 22, in some optional embodiments, the first section 410 may include a main body 411 and a support portion 412 protruding from the main body 411 toward the second segment 421, and the support portion 412 and the second segment 421 are interconnected so that the first section 410 and the second segment 421 can participate in enclosing and forming a gap space 400a.

[0398] Optionally, one end of the main body 411 facing the isolation structure 310 and one end of the second segment 421 facing the substrate 100 are connected to each other, so that the gap space 400a can be formed by the main body 411, the support portion 412 and the second segment 421, and there are two connection points between the first segment 410 and the second segment 421, which can better improve the structural stability of the first packaging structure 400, and further make it difficult to separate from the isolation structure 310, thereby better improving the packaging effect of the first packaging structure 400 on the display panel 10.

[0399] Optionally, the main body 411 may include a first main section 411a and a second main section 411b that are interconnected. The orthographic projection of the first main section 411a on the substrate 100 may be located within the orthographic projection of the pixel opening 320a on the substrate 100, and the orthographic projection of the second main section 411b on the substrate 100 may be located within the orthographic projection of the pixel defining portion 321 on the substrate 100. The end of the main body 411 facing the isolation structure 310 and the end of the second section 421 facing the substrate 100 are interconnected, which may refer to the end of the second main section 411b facing the isolation structure 310 and the end of the second section 421 facing the substrate 100 being interconnected. The gap space 400a may be enclosed by the second main section 411b, the support portion 412, and the second section 421.

[0400] Optionally, the orthographic projection of the supporting portion 412 on the substrate 100 may be arranged to at least partially overlap with the orthographic projection of the pixel defining portion 321 on the substrate 100, that is, at least part of the supporting portion 412 may be located on the side of the pixel defining portion 321 facing away from the substrate 100, so that the pixel defining portion 321 can raise the position of the supporting portion 412 to facilitate the connection between the supporting portion 412 and the second segment 421.

[0401] In some optional embodiments, the second segment 421 may include a third segment 421b disposed on the side of the second isolation portion 312 facing the isolation opening 310a. The support portion 412 and the third segment 421b are interconnected to enclose a gap space 400a. Optionally, at least a portion of the gap space 400a is located between the second isolation portion 312 and the substrate 100. Since the second isolation portion 312 is disposed protruding from the first isolation portion 311 toward the isolation opening 310a, the third segment 421b disposed on the side of the second isolation portion 312 facing the isolation opening 310a can be easily connected to the support portion 412, that is, it can facilitate the support portion 412 to support the second segment 421, so that the second segment 421 is not easily separated from the isolation structure 310.

[0402] Optionally, the second segment 421 also includes a second segment 421a arranged on the side of the first isolation portion 311 facing the isolation opening 310a, the third segment 421b is spaced apart from the main body portion 411, and the second segment 421a is spaced apart from the support portion 412. The third segment 421b, the second segment 421a, the support portion 412 and the main body portion 411 are enclosed to form a gap space 400a.

[0403] Optionally, the end of the second subsection 421a facing away from the substrate 100 may be connected to the third subsection 421b. Specifically, the end of the second subsection 421a facing away from the substrate 100 may be integrally connected to the third subsection 421b covering the surface of the second isolation portion 312 facing the substrate 100. Optionally, the end of the second subsection 421a facing the substrate 100 may be interconnected with the end of the main body portion 411 facing the isolation structure 310. For example, the end of the second subsection 421a facing the substrate 100 may be interconnected with the end of the second main body subsection 411b facing the isolation structure 310. Optionally, the gap space 400a may be enclosed by the third subsection 421b, the second subsection 421a, the second main body subsection 411b, and the support portion 412.

[0404] FIG24 is a schematic structural diagram of a first segment 610 provided in an embodiment of the present application.

[0405] As shown in Figures 22 to 24, in some optional embodiments, the support portion 412 has a ring-shaped projection on the substrate 100, and the support portion 412 and the second segment 421 are interconnected so that the first segment 410 and the second segment 421 enclose a closed gap space 400a.

[0406] Optionally, the orthographic projection of the support portion 412 on the substrate 100 is annular, which may mean that the orthographic projection of the support portion 412 on the substrate 100 is a closed annular shape, so as to form a sealed gap space 400a. The sealed gap space 400a formed by the first subsection 410 and the second segment 421 may not be connected to other external spaces, thereby further improving the structural stability of the first subsection 410 and the second segment 421.

[0407] Optionally, the orthographic projection of the support portion 412 on the substrate 100 may surround the orthographic projection of the pixel opening 320 a on the substrate 100. Optionally, the orthographic projection of the second segment 421 on the substrate 100 may surround the orthographic projection of the support portion 412 on the substrate 100.

[0408] In these optional embodiments, by setting the support portion 412 to have a ring-shaped projection on the substrate 100, a larger connection area is provided between the support portion 412 in the isolation opening 310a and the second segment 421 on the peripheral side of the isolation structure 310. This allows the support portion 412 in the isolation opening 310a to better support the second segment 421 on the peripheral side of the isolation structure 310, thereby better enhancing the supporting effect of the support portion 412 on the second segment 421, making it difficult for the first segment 410 to separate from the isolation structure 310, and better enhancing the packaging effect of the first packaging structure 400 on the display panel 10.

[0409] Figure 25 is a structural schematic diagram of a first segment 610 provided in another embodiment of the present application, Figure 26 is a structural schematic diagram of a first segment 610 provided in yet another embodiment of the present application, and Figure 27 is a partial cross-sectional view of a display panel 10 provided in yet another embodiment of the present application.

[0410] As shown in Figures 25 to 27, in other optional embodiments, the positive projection shape of the support portion 412 on the substrate 100 may not be annular. For example, there may be multiple support portions 412, and the multiple support portions 412 may be spaced apart around the pixel opening 320a.

[0411] Optionally, a surface of the first segment 410 facing away from the substrate 100 is spaced apart from a surface of a portion of the second segment 421 facing away from the isolation structure 310 to form a communication opening 400b located on a side of the gap space 400a facing away from the substrate 100. Optionally, the communication opening 400b may be located between adjacent support portions 412.

[0412] FIG28 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0413] As shown in Figure 28, in some optional embodiments, the gap space 400a may be filled with a support structure P, which can provide better support for the second segment 421. Specifically, the support structure P can provide better support for the third segment 421b, so that the second segment 421 is not easily separated from the isolation structure 310, thereby better improving the packaging effect of the first packaging structure 400 on the display panel 10.

[0414] Optionally, when preparing the display panel 10 , the material of the support structure P may be filled into the gap space 400 a through the communication opening 400 b .

[0415] Optionally, the material of the support structure P may include an organic material, so that the material of the support structure P may have good fluidity, so that the support structure P can be filled into the gap space 400a through the communication opening 400b.

[0416] FIG29 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0417] As shown in FIG. 29 , optionally, the display panel 10 further includes a second encapsulation layer 500 disposed on the side of the first encapsulation structure 400 facing away from the substrate 100 , and at least a portion of the material of the second encapsulation layer 500 extends into the gap space 400 a through the connecting opening 400 b to form a support structure P.

[0418] In these optional embodiments, the second encapsulation layer 500 can also be used to encapsulate the light-emitting device 200 of the display panel 10. When preparing the second encapsulation layer 500, the material of the second encapsulation layer 500 can enter the gap space 400a through the communication opening 400b to form a support structure P. Therefore, part of the material of the second encapsulation layer 500 can also be used to support the second segment 421, thereby further improving the structural stability of the first encapsulation structure 400 in the gap space 400a. The provision of the second encapsulation layer 500 can also further improve the encapsulation effect of the display panel 10.

[0419] Optionally, the material of the second encapsulation layer 500 includes an organic material, so that the second encapsulation layer 500 can have good fluidity, so that the material of the second encapsulation layer 500 can be easily extended into the gap space 400a through the communication opening 400b during the preparation of the second encapsulation layer 500. Optionally, the second encapsulation layer 500 can be prepared using inkjet printing technology.

[0420] In some optional embodiments, as shown in Figures 25 and 26, there are multiple communication openings 400b, and the multiple communication openings 400b are spaced apart. For example, the multiple communication openings 400b can be spaced apart around the periphery of the pixel opening 320a. By properly setting the number of communication openings 400b, the connection area between the support portion 412 and the second segment 421 can be effectively controlled, so that the support portion 412 can provide better support for the second segment 421 to improve the structural stability of the first packaging structure 400. At the same time, the material blocking effect of the support portion 412 on the support structure P can be reduced, so that the material of the support structure P can be more fully filled in the gap space 400a, thereby improving the packaging effect of the first packaging structure 400 and the second packaging layer 500 on the light-emitting device 200.

[0421] In some optional embodiments, the plurality of communication openings 400b are arranged at equal intervals.

[0422] There are various ways to set the size of the communication opening 400b. Optionally, as shown in FIG25 , the orthographic projection areas of the communication openings 400b on the substrate 100 may be equal, and / or the orthographic projection shapes of the communication openings 400b on the substrate 100 may be equal. This allows the support portion 412 to more evenly support the second segment 421 of the isolation structure 310 facing the inner side of the isolation opening 310a, thereby improving the structural stability of the first packaging structure 400. Furthermore, the material of the support structure P can more evenly pass through the communication openings 400b and fill the gap space 400a of the isolation structure 310 facing the inner side of the isolation opening 310a.

[0423] Optionally, as shown in FIG26 , the communication openings 400b include first-type communication openings 400ba and second-type communication openings 400bb, wherein the orthographic projection area of ​​the first-type communication openings 400ba on the substrate 100 is larger than the orthographic projection area of ​​the second-type communication openings 400bb on the substrate 100. By providing the first-type communication openings 400ba and the second-type communication openings 400bb of unequal areas, the first-type communication openings 400ba with larger areas facilitate more sufficient filling of the material of the support structure P into the gap space 400a, while also enabling the support portions 412 on both sides of the second-type communication openings 600c with smaller areas to better support the second segment 421. Thus, the support portions 412 can provide better support for the second segment 421, thereby improving the structural stability of the first packaging structure 400. This can also reduce the material blocking effect of the support portions 412 on the support structure P, thereby facilitating more sufficient filling of the material of the support structure P into the gap space 400a.

[0424] Optionally, the first-type communication openings 400ba are located between adjacent second-type communication openings 400bb, and / or the second-type communication openings 400bb are located between adjacent first-type communication openings 400ba. For example, on the inner side of the isolation structure 310 facing the isolation opening 310a, the first-type communication openings 400ba and the second-type communication openings 400bb may be alternately arranged to better balance the structural strength of the first packaging structure 400 and the ability of the first packaging structure 400 to facilitate material filling of the support structure P.

[0425] In some optional embodiments, the first encapsulation structure 400 further includes a fourth sub-portion 422 located on a side of the isolation structure 310 facing away from the substrate 100 and spaced apart from the isolation structure 310. The fourth sub-portion 422 located on the side of the isolation structure 310 facing away from the substrate 100 can effectively reduce the path for water vapor (which may include etching materials) to intrude into the light-emitting device 200, thereby effectively improving the encapsulation effect of the first encapsulation structure 400 on the light-emitting device 200.

[0426] Optionally, the fourth section 422 can be connected to the end of the second section 421 facing away from the substrate 100. By setting the side surface of the first section 410 facing away from the substrate 100 and the side surface of the second section 421 facing away from the isolation structure 310 to be at least partially connected to each other to enclose a gap space 400a, the first section 410 can better support the second section 421, so that the fourth section 422 set at a distance from the isolation structure 310 is not easy to fall off toward the pixel opening 320a, which can better improve the structural stability of the display panel 10.

[0427] Optionally, a support structure P may be filled between the fourth subsection 422 and the isolation structure 310. The support structure P filled between the fourth subsection 422 and the isolation structure 310 may effectively limit the fourth subsection 422. For example, the support structure P filled between the fourth subsection 422 and the isolation structure 310 may be used to support the fourth subsection 422, thereby preventing the fourth subsection 422 from breaking and falling toward the isolation structure 310, thereby effectively improving the structural stability of the first packaging structure 400.

[0428] Optionally, at least a portion of the material of the second encapsulation layer 500 may extend between the fourth sub-portion 422 and the isolation structure 310 to form a support structure P, so that a portion of the material of the second encapsulation layer 500 may also be used to support the fourth sub-portion 422 .

[0429] Optionally, at least part of the second packaging layer 500 may also be located on the side of the fourth section 422 away from the isolation structure 310, so that the fourth section 422 can be better wrapped by the second packaging layer 500, so as to further enhance the limiting effect of the second packaging layer 500 on the fourth section 422, so that the second packaging layer 500 can limit the fourth section 422 from falling off and breaking toward the pixel opening 320a, thereby better improving the structural stability of the first packaging structure 400.

[0430] Optionally, adjacent fourth subsections 422 may be spaced apart. For example, the side of the isolation structure 310 facing away from the substrate 100 may have at least two fourth subsections 422, each of which may be connected to the second segment 421 within a different isolation opening 310a. By spacing adjacent fourth subsections 422 apart, when forming the second encapsulation layer 500, the material of the second encapsulation layer 500 can extend through the spaces between adjacent fourth subsections 422 to between the fourth subsections 422 and the isolation structure 310, thereby facilitating the formation of a second encapsulation layer 500 that effectively covers the periphery of the fourth subsections 422.

[0431] FIG30 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0432] As shown in FIG. 30 , in some optional embodiments, the display panel 10 may further include a third encapsulation layer 600 disposed on a side of the second encapsulation layer 500 facing away from the substrate 100 , so as to further enhance the encapsulation effect of the light-emitting device 200 .

[0433] Optionally, the material of the third encapsulation layer 600 may include an inorganic material, so that the third encapsulation layer 600 has a good encapsulation capability to reduce the impact of water vapor on the light-emitting device 200. Optionally, the third encapsulation layer 600 may be prepared by a chemical vapor deposition process.

[0434] It is understandable that the display panel 10 may further include a filter layer, an optical adhesive or a cover structure located on a side of the third encapsulation layer 600 away from the second encapsulation layer 500 .

[0435] 1 to 30 , an embodiment of the first aspect of the present application further provides a display panel 10, comprising: a substrate 100; an isolation structure 310, disposed on one side of the substrate 100 and enclosing an isolation opening 310a, the isolation structure 310 comprising a first isolation portion 311 and a second isolation portion 312 located on a side of the first isolation portion 311 facing away from the substrate 100, the second isolation portion 312 being disposed protruding from the first isolation portion 311 toward the isolation opening 310a; a light-emitting device 200, at least partially located within the isolation opening 310a; a first encapsulation structure 400, disposed on a side of the light-emitting device 200 facing away from the substrate 100, the first encapsulation structure 400 comprising a first section 410 and a second section 421, the first section 410 being located within the isolation opening 310a and disposed on a side of the light-emitting device 200 facing away from the substrate 100, at least a portion of the second section 421 covering a side of the second isolation portion 312 facing the isolation opening 310a and interconnected with the first section 410.

[0436] In a display panel 10 further provided in an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and encloses an isolation opening 310a. The light-emitting device 200 is at least partially located within the isolation opening 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10. The first encapsulation structure 400 is disposed on a side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 includes a first segment 410 and a second segment 421. The first segment 410 is located within the isolation opening 310a and is disposed on a side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. By setting at least a portion of the second segment 421 to cover the side of the second isolation portion 312 facing the isolation opening 310a and to be interconnected with the first segment 410, the first segment 410 can provide better support for the second segment 421, making it difficult for the second segment 421 to separate from the isolation structure 310, thereby better improving the packaging effect of the first packaging structure 400 on the display panel 10.

[0437] Optionally, the display panel 10 provided in the embodiment of the first aspect of the present application may be the display panel 10 in any of the aforementioned embodiments. Therefore, the display panel 10 provided in the embodiment of the present application may have the beneficial effects of the display panel 10 in any of the aforementioned embodiments, and this application will not elaborate on them in detail. For example, the isolation structure 310 may be the isolation structure 310 described in any of the aforementioned embodiments. The isolation structure 310 may include the first isolation portion 311, the second isolation portion 312, and the third isolation portion 313 in any of the aforementioned embodiments, so that the isolation structure 310 can be used to isolate the materials of the light-emitting unit 220 and the first electrode 230 when preparing the light-emitting device 200. For example, the first packaging structure 400 may be the first packaging structure 400 described in any of the aforementioned embodiments. Under the support of the first section 410, the second section 421 may not easily fall off the isolation structure 310, and the first section 410 and the second section 421 may be enclosed to form the gap space 400a in any of the aforementioned embodiments, wherein the first section 410 and the second section 421 may be enclosed to form a closed gap space 400a, or the first section 410 and the second section 421 may be enclosed to form a non-gap space 400a having a connecting opening 400b, and the shape and size of the connecting opening 400b may be set with reference to any of the aforementioned embodiments.

[0438] Optionally, an embodiment of the first aspect of the present application further provides a display panel 10 that may further include the support structure P described in any of the aforementioned embodiments. The support structure P may provide a good support for the second segment 421 and the fourth segment 422, so that the second segment 421 and the fourth segment 422 are not easily separated from the isolation structure 310. Optionally, an embodiment of the first aspect of the present application further provides a display panel 10 that may further include the second encapsulation layer 500 described in any of the aforementioned embodiments. The second encapsulation layer 500 may extend into the gap space 400a or between the fourth segment 422 and the isolation structure 310 through the connecting opening 400b to form the support structure P. The second encapsulation layer 500 may also extend between the fourth segment 422 of the first encapsulation structure 400 and the isolation structure 310 to further enhance the encapsulation effect and structural stability of the display panel 10.

[0439] Optionally, the embodiment of the first aspect of the present application further provides a display panel 10 which may further include the third encapsulation layer 600 and the pixel definition layer 320 described in any of the aforementioned embodiments.

[0440] FIG31 is a partial cross-sectional view of a display panel 10 provided in accordance with another embodiment of the present application. FIG32 is a partial cross-sectional view of a display panel 10 provided in accordance with another embodiment of the present application.

[0441] Please refer to Figures 1 to 30 and Figures 31 and 32. The embodiment of the first aspect of the present application further provides a display panel 10, including: a substrate 100; an isolation structure 310, which is arranged on one side of the substrate 100 and encloses an isolation opening 310a; a light-emitting device 200, at least partially located in the isolation opening 310a; a first packaging structure 400, which is arranged on the side of the light-emitting device 200 away from the substrate 100, and the first packaging structure 400 includes a first section 410 and a second section 421, the first section 410 is located in the isolation opening 310a and is arranged on the side of the light-emitting device 200 away from the substrate 100, the second section 421 is located on the side of the isolation structure 310 facing the isolation opening 310a, the first section 410 and the second section 421 enclose a gap space 400a, and the gap space 400a is filled with a support structure P.

[0442] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and encloses an isolation opening 310a. The light-emitting device 200 is at least partially located within the isolation opening 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10.

[0443] The first encapsulation structure 400 is disposed on a side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 includes a first segment 410 and a second segment 421. The first segment 410 is located within the isolation opening 310a and disposed on the side of the light-emitting device 200 facing away from the substrate 100. The second segment 421 is located on the side of the isolation structure 310 facing the isolation opening 310a. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. The first segment 410 and the second segment 421 enclose a gap space 400a. By filling the gap space 400a with a support structure P, the support structure P can effectively support the second segment 421, preventing the second segment 421 from separating from the isolation structure 310, thereby effectively improving the encapsulation effect of the first encapsulation structure 400 on the display panel 10.

[0444] Optionally, the display panel 10 provided in the embodiment of the first aspect of the present application may be the display panel 10 in any of the aforementioned embodiments. Therefore, the display panel 10 provided in the embodiment of the present application may have the beneficial effects of the display panel 10 in any of the aforementioned embodiments, and this application will not elaborate on them in detail. For example, the isolation structure 310 may be the isolation structure 310 described in any of the aforementioned embodiments. The isolation structure 310 may include the first isolation portion 311, the second isolation portion 312, and the third isolation portion 313 in any of the aforementioned embodiments, so that the isolation structure 310 can be used to isolate the materials of the light-emitting unit 220 and the first electrode 230 when preparing the light-emitting device 200. For example, the support structure P may be the support structure P described in any of the aforementioned embodiments, and the support structure P supports the second segment 421 and the fourth segment 422.

[0445] Optionally, the first section 410 may not be used to support the second segment 421. For example, as shown in Figures 31 and 32, the second segment 421 covering the side of the second isolation portion 312 facing the isolation opening 310a may not be completely connected to the first section 410. Alternatively, as shown in Figures 1 to 30, the first packaging structure 400 may be the first packaging structure 400 described in any of the aforementioned embodiments, and the first section 410 may be used to support at least part of the second segment 421, so that the second segment 421 is not easily detached from the isolation structure 310.

[0446] Optionally, the first section 410 and the second section 421 can be enclosed to form the gap space 400a in any of the aforementioned embodiments, wherein the first section 410 and the second section 421 can be enclosed to form a closed gap space 400a, or the first section 410 and the second section 421 can be enclosed to form a gap space 400a having a connecting opening 400b, and the shape and size of the connecting opening 400b can be set with reference to any of the aforementioned embodiments.

[0447] Optionally, an embodiment of the first aspect of the present application also provides a display panel 10 that may also include the second packaging layer 500 described in any of the aforementioned embodiments. The second packaging layer 500 may extend into the gap space 400a or extend to between the fourth division 422 and the isolation structure 310 through the connecting opening 400b to form a support structure P, and the second packaging layer 500 may also extend to between the fourth division 422 of the first packaging structure 400 and the isolation structure 310 to further enhance the packaging effect and structural stability of the display panel 10.

[0448] Optionally, the embodiment of the first aspect of the present application further provides a display panel 10 which may further include the third encapsulation layer 600 and the pixel definition layer 320 described in any of the aforementioned embodiments.

[0449] It can be understood that the setting method of the first packaging structure 400 in the display panel 10 can be adjusted according to actual conditions, that is, within the partial isolation opening 310a, the side surface of the first section 410 facing away from the substrate 100 and the side surface of the second section 421 facing away from the isolation structure 310 are partially connected to each other; within the partial isolation opening 310a, the side surface of the first section 410 facing away from the substrate 100 and the side surface of the second section 421 facing away from the isolation structure 310 are completely connected to each other; within the partial isolation opening 310a, the side surface of the first section 410 facing away from the substrate 100 and the side surface of the second section 421 facing away from the isolation structure 310 are not connected.

[0450] FIG33 is a partial schematic diagram of a limiting structure 300 provided in another embodiment of the present application, and FIG34 is a partial cross-sectional view of a display panel 10 provided in an embodiment of the present application.

[0451] As shown in FIG33 and FIG34 , the embodiment of the first aspect of the present application further provides a display panel 10, comprising: a substrate 100; a defining structure 300, disposed on one side of the substrate 100 and enclosing a defining opening 300a, the defining structure 300 comprising an isolation structure 310, the isolation structure 310 having a first end 310b and a second end 310c opposite to each other, the second end 310c being located on a side of the first end 310b facing away from the substrate 100, the orthographic projection of the first end 310b on the substrate 100 being located within the orthographic projection of the second end 310c on the substrate 100; a light-emitting device 200, located within the defining opening 300a; and a first encapsulation structure 400. Arranged on the side of the light-emitting device 200 facing away from the substrate 100, the first packaging structure 400 includes a first section 410 and a side section 420 connected to each other, the first section 410 is located in the defined opening 300a and is arranged on the side of the light-emitting device 200 facing away from the substrate 100, at least part of the side section 420 is located on the side of the limiting structure 300 facing the defined opening 300a, a gap space 400a is formed between the first section 410 and the side section 420, the gap space 400a is at least partially located on the lower side of the second end 310c, and the side of the gap space 400a facing away from the substrate 100 has a connecting opening 400b; the support structure P includes a first packaging part P1 arranged on the side of the side section 420 facing the defined opening 300a, at least part of the first packaging part P1 is arranged in the gap space 400a and is located between the second end 310c and the substrate 100.

[0452] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, a defining structure 300, a light-emitting device 200, a first encapsulation structure 400, and a support structure P. The defining structure 300 is disposed on one side of the substrate 100 and encloses a defining opening 300a. The light-emitting device 200 is disposed within the defining opening 300a. The defining structure 300 can be used to divide the sub-pixels of the display panel 10. The limiting structure 300 includes an isolation structure 310, which has a first end 310b and a second end 310c relative to each other. The second end 310c is located on the side of the first end 310b away from the substrate 100. By setting the positive projection of the first end 310b on the substrate 100 to be located within the positive projection of the second end 310c on the substrate 100, when preparing the light-emitting device 200 of the display panel 10, the material of the light-emitting device 200 can be directly evaporated on the entire surface. The second end 310c can block at least part of the material used to prepare the light-emitting device 200 to separate the material of the light-emitting device 200 between adjacent sub-pixels, so as to form a plurality of light-emitting devices 200 that are spaced apart and located in the limiting opening 300a, so that when preparing the light-emitting device 200 of the display panel 10, there is no need to set a mask with high precision. For example, there is no need to set a high-precision metal mask when evaporating the material of the light-emitting device 200, which can effectively reduce the production and preparation cost of the display panel 10.

[0453] Optionally, the defining structure 300 may be in a grid shape, so that the defining structure 300 can divide the sub-pixels in the display panel 10. The hollow areas in the grid-shaped defining structure 300 may be defining openings 300a.

[0454] Optionally, the defined opening 300 a may include an isolation opening 310 a enclosed by an isolation structure 310 .

[0455] The first packaging layer is arranged on the side of the light-emitting device 200 facing away from the substrate 100. The first packaging structure 400 includes a first section 410 and a side section 420 that are connected to each other. The first section 410 is located in the limiting opening 300a and is arranged on the side of the light-emitting device 200 facing away from the substrate 100. At least part of the side section 420 is located on the side of the limiting structure 300 facing the limiting opening 300a. The first packaging structure 400 can be used to encapsulate the light-emitting device 200. A gap space 400a can be enclosed between the first section 410 and the side section 420, and the gap space 400a is at least partially located on the lower side of the second end 310c, and the side of the gap space 400a facing away from the substrate 100 has a connecting opening 400b, and the support structure P includes a first packaging portion P1 arranged on the side of the side section 420 facing the limited opening 300a, wherein at least a portion of the first packaging portion P1 is arranged in the gap space 400a and is located between the second end 310c and the substrate 100, so that the first packaging portion P1 can be used to protect a portion of the first packaging structure 400 between the second end 310c and the substrate 100, so that when the etching material is used to pattern the subsequently formed film layer structure, the etching material is not easy to enter the gap space 400a to etch the first packaging structure 400, so that the side section 420 can have better structural stability, thereby better improving the packaging effect of the first packaging structure 400.

[0456] Optionally, the embodiment of the first aspect of the present application also provides a display panel 10 which may be the display panel 10 in any of the aforementioned embodiments. Therefore, the embodiment of the present application also provides a display panel 10 which may have the beneficial effects of the display panel 10 in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0457] In some embodiments of the present application, the first section 410 can be mainly used to encapsulate the light-emitting device 200, so that interference factors such as external water vapor are not likely to affect the working reliability of the light-emitting device 200. The side section 420 connected to the first section 410 and at least partially located on the side of the limiting structure 300 facing the limiting opening 300a can be used to extend the invasion path of interference factors to improve the packaging effect of the display panel 10.

[0458] Since a portion of the first encapsulation structure 400 covers the surface of the confining structure 300, the shape of the first encapsulation structure 400 is easily affected by the shape of the confining structure 300. For example, under the influence of the shape of the isolation structure 310, the first segment 410 and the side segment 420 are easily enclosed to form a gap space 400a at a position between the second end portion 310c and the substrate 100. Therefore, if other film structures are formed directly on the first encapsulation structure 400, the material of the other film structures is unlikely to fall into the gap space 400a due to the blocking effect of the second end portion 310c. In other words, at least a portion of the first encapsulation structure 400 within the gap space 400a is easily exposed at the fracture of the film structure. Therefore, when the film structure on the first encapsulation structure 400 is subsequently patterned using an etching material, the first encapsulation structure 400 is easily etched and damaged, thereby easily affecting the encapsulation effect of the first encapsulation structure 400. Therefore, by setting at least part of the first packaging part P1 in the gap space 400a and between the second end 310c and the substrate 100, the first packaging part P1 can be used to protect part of the first packaging structure 400 between the second end 310c and the substrate 100, thereby better improving the packaging effect of the display panel 10.

[0459] FIG35 is a partial cross-sectional view of a display panel provided in another embodiment of the present application.

[0460] 35 , optionally, a portion of the first packaging portion P1 may be located outside the gap space 400 a . Optionally, in a direction away from the substrate 100 , a surface of the first packaging portion P1 located outside the gap space 400 a that faces away from the side segment 420 may be tilted toward the side segment 420 .

[0461] Optionally, under the influence of the shape of the isolation structure 310, in the direction away from the substrate 100, the side segment 420 located at the second end 310c toward the defined opening 300a in the first packaging structure 400 is prone to a certain degree of inclination toward the defined opening 300a, that is, in the direction away from the substrate 100, the surface of the side segment 420 located at the second end 310c toward the defined opening 300a on the side facing the defined opening 300a is prone to inclination toward the defined opening 300a, so that if other film layer structures are formed directly on the first packaging structure 400, the other film layer structures are prone to fracture on the surface of the side segment 420 toward the side facing the defined opening 300a, that is, at least part of the side segment 420 is prone to exposure from the fracture of the film layer structure, so that when the film layer structure on the side segment 420 is subsequently patterned using an etching material, the side segment 420 is easily damaged by etching, thereby easily affecting the packaging effect of the first packaging structure 400. By setting the first packaging part P1 on the surface of the side section 420 facing the defined opening 300a, and setting the surface of the first packaging part P1 on the side away from the side section 420 to be inclined toward the side section 420, the first packaging part P1 can be smooth with the surface of the side section 420 facing the defined opening 300a, so that when other film layer structures are formed subsequently, the other film layer structures can be better formed on the first packaging part P1 and can be better continuous on the first packaging part P1, so that the first packaging structure 400 and the support structure P are not easily damaged by etching, thereby better improving the packaging effect of the display panel 10.

[0462] Optionally, the material of the support structure P can be configured in a variety of ways. For example, the material of the support structure P can include an organic material, so that the material of the support structure P has good fluidity, thereby facilitating the formation of the support structure P. For example, it can facilitate the flow of the support structure P into the gap space 400a. Optionally, the material of the support structure P can also be configured based on the etching material used when etching other subsequently formed film layers, so that the support structure P is not easily damaged by the etching material when etching other subsequently formed film layers. Optionally, the material of the support structure P can include at least one of OC glue and polyimide glue that are resistant to stripping liquids.

[0463] FIG36 is a partial cross-sectional view of a display panel 10 provided in yet another embodiment of the present application.

[0464] As shown in Figure 36, in some optional embodiments, at least part of the side segment 420 is located on the side of the defining structure 300 away from the substrate 100 and is spaced apart from the defining structure 300, and at least part of the support structure P is located between the side segment 420 and the defining structure 300.

[0465] Optionally, the side segment 420 includes a fourth section 422 spaced apart from the limiting structure 300 and a second section 421 located on the side of the limiting structure 300 facing the limiting opening 300a, and the support structure P includes a second packaging portion P2 and a third packaging portion P3 connected to each other, the second packaging portion P2 is located between the fourth section 422 and the limiting structure 300, and the third packaging portion P3 is arranged on a side surface of the fourth section 422 facing away from the limiting opening 300a.

[0466] In these optional embodiments, by arranging at least a portion of the supporting structure P between the side segment 420 and the limiting structure 300, that is, by arranging a second packaging portion P2 between the fourth division 422 and the limiting structure 300, the supporting structure P can be used to support the portion of the side segment 420 located on the side of the limiting structure 300 away from the substrate 100, so that the portion of the side segment 420 spaced apart from the limiting structure 300 is not easily dropped toward the limiting structure 300, and / or, the supporting structure P can be used to connect the portion of the side segment 420 located on the side of the limiting structure 300 away from the substrate 100, so that the side segment 420 is not easily dropped relative to the limiting structure 300 toward the limiting opening 300a, thereby better improving the structural stability of the side segment 420.

[0467] By providing a third packaging portion P3 connected to the second packaging portion P2 and provided on the surface of the fourth section 422 facing away from the limiting opening 300a, the connection area between the support structure P and the side section 420 can be further increased to further limit the movement of the side section 420 relative to the limiting structure 300, thereby further improving the structural stability of the side section 420.

[0468] Optionally, the first packaging portion P1 is arranged on a side surface of the fourth section 422 and the second section 421 facing the limiting opening 300a, and the third packaging portion P3 is connected to the first packaging portion P1, so that the support structure P can be better wrapped around the outside of the side section 420 to further limit the movement of the side section 420 relative to the limiting structure 300, thereby further improving the structural stability of the side section 420.

[0469] Optionally, the gap space 400 a may be formed by enclosing the end of the first section 410 facing the limiting structure 300 and the fourth section 422 .

[0470] In these optional embodiments, when preparing the support structure P, the material of the support structure P can enter the gap space 400a through the communication opening 400b to form at least a portion of the first encapsulation portion P1. By providing the first encapsulation portion P1 filling the gap space 400a, when preparing other film structures on the support structure P, the material of the other film structures is unlikely to enter the gap space 400a and is unlikely to break at the communication opening 400b. This allows the etching material to better contact the film structure when patterning the film structure on the support structure P, thereby facilitating the patterning of the film structure.

[0471] In some embodiments of the present application, the display panel 10 may include light emitting devices 200 that emit light of multiple colors. For example, the display panel 10 may include light emitting devices 200 that can emit red, green, blue, and other colors.

[0472] Optionally, the light-emitting device 200 may include a first light-emitting device 200a, a second light-emitting device 200b, and a third light-emitting device 200c, each disposed within a different defined opening 300a. Optionally, the first light-emitting device 200a, the second light-emitting device 200b, and the third light-emitting device 200c may emit different colors. For example, the first light-emitting device 200a may be configured to emit red light, the second light-emitting device 200b may be configured to emit green light, and the third light-emitting device 200c may be configured to emit blue light.

[0473] Alternatively, the defined opening 300a may include a first opening 310aa for accommodating the first light emitting device 200a, a second opening 310ab for accommodating the second light emitting device 200b, and a third opening 310ac for accommodating the third light emitting device 200c. For example, the isolated opening 310a may include a first opening 310aa, a second opening 310ab, and a third opening 310ac.

[0474] In some optional embodiments, the first encapsulation structure 400 has a first encapsulation region 400d, a second encapsulation region 400e, and a third encapsulation region 400f, which are provided corresponding to the light-emitting devices 200 of different luminous colors.

[0475] In this optional embodiment, the first packaging structure 400 has a first packaging area 400d, a second packaging area 400e and a third packaging area 400f which are set corresponding to light-emitting devices 200 of different luminous colors. It may refer to the first packaging structure 400 located in the first packaging area 400d, the first packaging structure 400 located in the second packaging area 400e and the first packaging structure 400 located in the third packaging area 400f, which can be used to encapsulate light-emitting devices 200 of different luminous colors, respectively.

[0476] Optionally, the first packaging structure 400 within the first packaging area 400d corresponds to the light-emitting device 200 that emits red light, and the first packaging structure 400 located in the first packaging area 400d can be used to encapsulate the light-emitting device 200 that emits red light; the first packaging structure 400 within the second packaging area 400e corresponds to the light-emitting device 200 that emits green light, and the first packaging structure 400 located in the second packaging area 400e can be used to encapsulate the light-emitting device 200 that emits green light; the first packaging structure 400 within the third packaging area 400f corresponds to the light-emitting device 200 that emits blue light, and the first packaging structure 400 located in the third packaging area 400f can be used to encapsulate the light-emitting device 200 that emits blue light.

[0477] Optionally, the first packaging structure 400 in the first packaging area 400d corresponds to the first light-emitting device 200a, the first packaging structure 400 in the second packaging area 400e corresponds to the second light-emitting device 200b, and the first packaging structure 400 in the third packaging area 400f corresponds to the third light-emitting device 200c.

[0478] Optionally, the first packaging structure 400 within the first packaging area 400d may be located within the first opening 310aa and on the side of the limiting structure 300 that encloses the first opening 310aa away from the substrate 100; the first packaging structure 400 within the second packaging area 400e may be located within the second opening 310ab and on the side of the limiting structure 300 that encloses the second opening 310ab away from the substrate 100; the first packaging structure 400 within the third packaging area 400f may be located within the third opening 310ac and on the side of the limiting structure 300 that encloses the third opening 310ac away from the substrate 100.

[0479] Optionally, in the first packaging area 400d, the second packaging area 400e and the third packaging area 400f, the side sections 420 in at least two of them are arranged at intervals, so that the second packaging part P2 and the third packaging part P3 of the supporting structure P can pass through the interval between the side sections 420 of the two adjacent ones in the first packaging area 400d, the second packaging area 400e and the third packaging area 400f, and cover the surface of the side section 420 facing away from the defined opening 300a, so as to improve the structural stability of the side section 420.

[0480] 37 to 46 are schematic diagrams of a manufacturing process of a method for manufacturing a display panel 10 provided in an embodiment of the present application.

[0481] In these optional embodiments, there are multiple ways to form the light-emitting device 200 and the first encapsulation structure 400. For example, as shown in Figures 37 to 46, during the preparation process of the display panel 10, under the shielding and partitioning effect of the isolation structure 310 on the material of the light-emitting device 200, the light-emitting devices 200 with different luminous colors in the display panel 10 and the corresponding parts of the first encapsulation structure 400 can be prepared relatively independently. Specifically, after the preparation of the light-emitting device 200 of one color and the part of the first encapsulation structure 400 material above it is completed, the material of the support structure P can be prepared separately above the material of the part of the first encapsulation structure 400, so that the material of the first encapsulation part P1 can be formed above the material of the part of the first encapsulation structure 400, so that the first encapsulation structure 400 is not easily etched and damaged in the subsequent patterning process of other film layer structures, thereby improving the structural stability of the first encapsulation structure 400.

[0482] In some optional embodiments, the first packaging portion P1 is located in the gap space 400a in at least two of the first packaging region 400d, the second packaging region 400e, and the third packaging region 400f.

[0483] Optionally, part of the first packaging portion P1 is located in the accommodating space 500d in the first packaging area 400d, and part of the first packaging portion P1 is located in the accommodating space 500d in the second packaging area 400e.

[0484] In these optional embodiments, during the manufacturing process of the display panel 10, for example, when manufacturing each light-emitting device 200 in the display panel 10, as shown in Figures 37 and 38, the material of the first light-emitting device 200a (such as the first device material layer 10g in the figure) can first be evaporated on the entire surface, so that the material of the first light-emitting device 200a is present in each defined opening 300a. Then, the material of the first encapsulation structure 400 (such as the first encapsulation material layer 10a in the figure) is prepared on the entire surface, so that the material of the first light-emitting device 200a in each defined opening 300a is covered by the material of the first encapsulation structure 400. Then, as shown in FIG39 , the materials of the first light-emitting device 200a and the first packaging structure 400 other than the first opening 310aa that define the opening 300a may be removed to form the material of the first light-emitting device 200a that is at least partially located within the first opening 310aa and the material of the first packaging structure 400 that is at least partially located within the first opening 310aa, wherein the material of the portion of the first packaging structure 400 can be used to participate in the formation of the first packaging structure 400 located in the first packaging area 400d.

[0485] Then, as shown in FIG40 , a material for a support structure P (such as the first support material layer 10b in the figure) may be prepared above the material of the first encapsulation structure 400 corresponding to the first light-emitting device 200a to form a portion of the support structure P, for example, to form a portion of the first encapsulation portion P1 located within the accommodating space 500d, and / or to form a portion of the second encapsulation portion P2 and a portion of the third encapsulation portion P3 located on the limiting structure 300 that encloses the first opening 310aa.

[0486] As shown in FIG41 , the entire surface of the second light-emitting device 200b material (such as the second device material layer 10h in the figure) is then evaporated, so that each defined opening 300a is filled with the material of the second light-emitting device 200b. The material of the first encapsulation structure 400 (such as the second encapsulation material layer 10c in the figure) is then prepared on the entire surface, so that the material of the second light-emitting device 200b in each defined opening 300a can be covered by the material of the first encapsulation structure 400. As shown in FIG42 , the material of the second light-emitting device 200b in the other defined openings 300a except the second opening 310ab and the material of the first encapsulation structure 400 can be removed to form the material of the second light-emitting device 200b at least partially located in the second opening 310ab and the material of the first encapsulation structure 400 at least partially located in the second opening 310ab. The material of this portion of the first encapsulation structure 400 can be used to participate in forming the first encapsulation structure 400 located in the second encapsulation region 400e.

[0487] During this process, when preparing the material of the second light-emitting device 200b and the material of the first packaging structure 400 on the entire surface, at least a portion of the first packaging part P1 is set above the material that participates in forming the first packaging structure 400 located in the first packaging area 400d, so that the first packaging structure 400 that encloses the gap space 400a can be protected by the first packaging part P1, and the material of the second light-emitting device 200b above the connecting opening 400b of the gap space 400a and the material of the first packaging structure 400 can have good continuity, so that when removing the material of the second light-emitting device 200b and the material of the first packaging structure 400 in other limited openings 300a outside the second opening 310ab, the etching material is not likely to cause excessive etching damage to the part of the first packaging structure 400, which can better improve the structural stability of the first packaging structure 400 finally formed, thereby better improving the packaging reliability of the display panel 10, and further improving the packaging effect of the display panel 10.

[0488] Then, as shown in Figure 43, the material of the support structure P (such as the second support material layer 10d in the figure) can be prepared again above the material of the first packaging structure 400 corresponding to the second light-emitting device 200b to form another part of the support structure P, for example, to form another part of the first packaging part P1 located in the gap space 400a, and / or to form another part of the second packaging part P2 and another part of the third packaging part P3 located on the limiting structure 300 that encloses the first opening 310aa.

[0489] As shown in FIG44 , the entire surface of the third light-emitting device 200c material is then evaporated, so that each defined opening 300a is filled with the material of the third light-emitting device 200c (such as the third device material layer 10i in the figure). The material of the first encapsulation structure 400 is then prepared on the entire surface (such as the third encapsulation material layer 10e in the figure), so that the material of the third light-emitting device 200c in each defined opening 300a can be covered by the material of the first encapsulation structure 400. As shown in FIG45 , the material of the third light-emitting device 200c and the material of the first encapsulation structure 400 in the other defined openings 300a except the third opening 310ac can be removed to form the material of the third light-emitting device 200c at least partially located in the third opening 310ac and the material of the first encapsulation structure 400 at least partially located in the third opening 310ac. The material of this portion of the first encapsulation structure 400 can be used to participate in forming the first encapsulation structure 400 located in the third encapsulation region 400f.

[0490] During this process, when preparing the material of the third light-emitting device 200c and the material of the first packaging structure 400 on the entire surface, at least a portion of the first packaging part P1 is set above the material participating in the formation of the first packaging structure 400 located in the second packaging area 400e, so that the first packaging structure 400 enclosed to form the gap space 400a can be protected by the first packaging part P1, and the material of the third light-emitting device 200c and the material of the first packaging structure 400 above the connecting opening 400b of the gap space 400a can have good continuity, so that when removing the material of the third light-emitting device 200c and the material of the first packaging structure 400 in other limited openings 300a outside the third opening 310ac, the etching material is not likely to cause excessive etching damage to the part of the first packaging structure 400, which can better improve the structural stability of the first packaging structure 400 finally formed, thereby better improving the packaging reliability of the display panel 10, and further improving the packaging effect of the display panel 10.

[0491] In some optional embodiments, the support structure P may not be provided above the first packaging structure 400 located in the third packaging area 400f to reduce material costs, reduce the preparation process steps of the support structure P, and improve the preparation efficiency of the display panel 10.

[0492] In some other optional embodiments, part of the first packaging portion P1 may also be located on a side surface of the side segment 420 within the third packaging region 400 f facing the opening 300 a .

[0493] In this optional embodiment, as shown in Figure 46, after preparing the third light-emitting device 200c and the first packaging structure 400 in the third area above the third light-emitting device 200c, the material of the support structure P (such as the third supporting material layer 10f in the figure) can also be prepared above the first packaging structure 400 in the third area to form another part of the support structure P, for example, to form another part of the first packaging part P1 located in the accommodating space 500d, and / or to form another part of the second packaging part P2 and another part of the third packaging part P3 located on the limiting structure 300 that encloses the first opening 310aa. When other film layer structures are subsequently prepared on the first packaging structure 400 in the third area, the first packaging structure 400 that encloses the gap space 400a can be protected by the first packaging part P1, and the other film layer structures can be better formed above the connecting opening 400b of the gap space 400a in the third area and can have better continuity. When the etching material is used to pattern the film layer structure on the first packaging structure 400 in the third area, the first packaging structure 400 is not easily etched and damaged by the etching material, so that the first packaging structure 400 can have better structural stability, thereby further improving the overall packaging effect of the display panel 10.

[0494] FIG47 is a partial cross-sectional view of a display panel 10 provided in yet another embodiment of the present application.

[0495] Please refer to Figures 33 to 46 and Figure 47. The embodiment of the first aspect of the present application further provides a display panel 10, including: a substrate 100; a limiting structure 300, which is arranged on one side of the substrate 100 and encloses a limiting opening 300a, and the limiting structure 300 includes an isolation structure 310, and the isolation structure 310 has a first end 310b and a second end 310c opposite to each other, and the second end 310c is located on the side of the first end 310b away from the substrate 100, and the orthographic projection of the first end 310b on the substrate 100 is located on the second end 310c on the substrate 100. In the orthographic projection; the light-emitting device 200 is located in the defined opening 300a; the first encapsulation structure 400 is arranged on the side of the light-emitting device 200 facing away from the substrate 100, and the first encapsulation structure 400 includes a first section 410 and a side section 420 connected to each other, the first section 410 is located in the defined opening 300a and is arranged on the side of the light-emitting device 200 facing away from the substrate 100, at least part of the side section 420 is located on the side of the defining structure 300 facing away from the substrate 100 and is spaced apart from the defining structure 300; the support structure P is at least partially located between the side section 420 and the defining structure 300.

[0496] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, a defining structure 300, a light-emitting device 200, a first encapsulation structure 400, and a support structure P. The light-emitting device 200 may be the light-emitting device 200 described in any of the aforementioned embodiments. Optionally, the display panel 10 may further include a second electrode 210 disposed within the defining opening 300a. The second electrode 210 may be located between the light-emitting device 200 and the substrate 100. Optionally, the first electrode 230 and the second electrode 210 of the light-emitting device 200 may serve as pixel electrodes of the display panel 10. One of the first electrode 230 and the second electrode 210 may serve as an anode, and the other may serve as a cathode to drive the light-emitting unit 220 of the light-emitting device 200 to emit light. The first encapsulation structure 400 may also be the first encapsulation structure 400 described in any of the aforementioned embodiments. The first encapsulation structure 400 may be used to encapsulate the light-emitting device 200.

[0497] Furthermore, the limiting structure 300 may be the limiting structure 300 in any of the aforementioned embodiments. The limiting structure 300 can be used to divide the sub-pixels of the display panel 10, and can be used to block and separate the material of the light-emitting device 200, so as to form a plurality of light-emitting devices 200 that are spaced apart and located within the limiting opening 300a, thereby eliminating the need to set a mask with high precision when preparing the light-emitting device 200 of the display panel 10. For example, there is no need to set a high-precision metal mask when evaporating the material of the light-emitting device 200, thereby effectively reducing the production and preparation cost of the display panel 10.

[0498] By arranging at least a portion of the supporting structure P between the side segment 420 and the limiting structure 300, the supporting structure P can be used to support the portion of the side segment 420 located on the side of the limiting structure 300 away from the substrate 100, so that the portion of the side segment 420 spaced apart from the limiting structure 300 is not easily dropped toward the limiting structure 300, and / or, the supporting structure P can be used to connect the portion of the side segment 420 located on the side of the limiting structure 300 away from the substrate 100, so that the side segment 420 is not easily dropped relative to the limiting structure 300 toward the limiting opening 300a, thereby better improving the structural stability of the side segment 420 and thereby better improving the packaging effect of the display panel 10.

[0499] Optionally, there are various ways to set the material of the support structure P. For example, the material of the support structure P may include an organic material, so that the material of the support structure P has good fluidity to facilitate the formation of the support structure P.

[0500] In some optional embodiments, the side segment 420 includes a fourth section 422 spaced apart from the limiting structure 300 and a second section 421 located on the side of the limiting structure 300 facing the limiting opening 300a, and the support structure P includes a second packaging portion P2 and a third packaging portion P3 connected to each other, the second packaging portion P2 is located between the fourth section 422 and the limiting structure 300, and the third packaging portion P3 is arranged on a side surface of the fourth section 422 facing away from the limiting opening 300a.

[0501] By providing a second packaging portion P2 located between the fourth division 422 and the limiting structure 300, and providing a third packaging portion P3 connected to the second packaging portion P2 and provided on the surface of the fourth division 422 facing away from the limiting opening 300a, the connection area between the support structure P and the side segment 420 can be further increased to further limit the movement of the side segment 420 relative to the limiting structure 300, thereby further improving the structural stability of the side segment 420.

[0502] In some optional embodiments, the support structure P includes a first packaging portion P1 , and at least a portion of the first packaging portion P1 is disposed on a side surface of the side segment 420 facing the opening 300 a .

[0503] Optionally, in a direction away from the substrate 100 , a surface of a side of the first packaging portion P1 that is away from the side segment 420 is tilted toward the side segment 420 .

[0504] In these optional embodiments, the first packaging part P1 can be used to smooth the surface of the side section 420 toward the side defining the opening 300a. By setting the side surface of the first packaging part P1 that is away from the side section 420 to be inclined toward the side section 420, when other film layer structures are prepared on the first packaging part P1, the other film layer structures can be better formed on the first packaging part P1 and can be better continuous on the first packaging part P1. When the film layer structure on the first packaging part P1 is patterned using an etching material, the first packaging part P1 is not easily etched and damaged by the etching material, so that the side section 420 can have better structural stability, thereby better improving the packaging effect of the first packaging structure 400.

[0505] Optionally, the first packaging portion P1 is arranged on a side surface of the fourth section 422 and the second section 421 facing the limiting opening 300a, and the third packaging portion P3 is connected to the first packaging portion P1, so that the support structure P can be better wrapped around the outside of the side section 420 to further limit the movement of the side section 420 relative to the limiting structure 300, thereby further improving the structural stability of the side section 420.

[0506] In some optional embodiments, a gap space 400a may be enclosed between the first section 410 and the side section 420, and the gap space 400a is at least partially located on the lower side of the second end portion 310c, and the side of the gap space 400a facing away from the substrate 100 has a connecting opening 400b, and at least a portion of the first packaging portion P1 is arranged in the gap space 400a and is located between the second end portion 310c and the substrate 100.

[0507] Optionally, the gap space 400 a may be formed by enclosing the end of the first section 410 facing the limiting structure 300 and the fourth section 422 .

[0508] In these optional embodiments, when preparing the support structure P, the material of the support structure P can enter the gap space 400a through the communication opening 400b to form at least a portion of the first encapsulation structure 400. By providing the first encapsulation structure 400 filling the gap space 400a, when preparing other film structures on the support structure P, the material of the other film structures is unlikely to enter the gap space 400a and is unlikely to be broken at the communication opening 400b. Therefore, when using an etching material to pattern the film structure on the support structure P, the etching material can better contact the film structure, thereby facilitating the patterning of the film structure.

[0509] In some optional embodiments, the first packaging structure 400 may be similar to the first packaging structure 400 in any of the aforementioned embodiments, having a first packaging area 400d, a second packaging area 400e and a third packaging area 400f corresponding to light-emitting devices 200 of different luminous colors.

[0510] Optionally, the first packaging structure 400 within the first packaging area 400d corresponds to the light-emitting device 200 that emits red light, and the first packaging structure 400 located in the first packaging area 400d can be used to encapsulate the light-emitting device 200 that emits red light; the first packaging structure 400 within the second packaging area 400e corresponds to the light-emitting device 200 that emits green light, and the first packaging structure 400 located in the second packaging area 400e can be used to encapsulate the light-emitting device 200 that emits green light; the first packaging structure 400 within the third packaging area 400f corresponds to the light-emitting device 200 that emits blue light, and the first packaging structure 400 located in the third packaging area 400f can be used to encapsulate the light-emitting device 200 that emits blue light.

[0511] Optionally, the first packaging structure 400 in the first packaging area 400d corresponds to the first light-emitting device 200a, the first packaging structure 400 in the second packaging area 400e corresponds to the second light-emitting device 200b, and the first packaging structure 400 in the third packaging area 400f corresponds to the third light-emitting device 200c.

[0512] Optionally, in the first packaging area 400d, the second packaging area 400e and the third packaging area 400f, the side sections 420 in at least two of them are arranged at intervals, so that the second packaging part P2 and the third packaging part P3 of the supporting structure P can pass through the interval between the side sections 420 of the two adjacent ones in the first packaging area 400d, the second packaging area 400e and the third packaging area 400f, and cover the surface of the side section 420 facing away from the defined opening 300a, so as to improve the structural stability of the side section 420.

[0513] In these optional embodiments, there are various ways to form the light-emitting device 200 and the first encapsulation structure 400. For example, as shown in Figures 37 to 46, during the manufacturing process of the display panel 10, under the shielding and partitioning effect of the isolation structure 310 on the material of the light-emitting device 200, the light-emitting devices 200 of different luminous colors and their corresponding portions of the first encapsulation structure 400 in the display panel 10 can be independently manufactured. Specifically, after the material of the light-emitting device 200 of one color and the portion of the first encapsulation structure 400 above it are manufactured, the material of the support structure P can be separately manufactured above the material of the portion of the first encapsulation structure 400, so that the material of the second encapsulation portion P2 can be formed above the material of the portion of the first encapsulation structure 400. This ensures that during the subsequent manufacturing or patterning of the film structure, the manufactured portion of the side segment 420 is less likely to fall off or drop relative to the limiting structure 300, thereby effectively improving the structural stability of the side segment 420 and thereby effectively improving the encapsulation effect of the display panel 10.

[0514] In some optional embodiments, in the first packaging area 400d, the second packaging area 400e, and the third packaging area 400f, at least a portion of the support structure P is located between the side segment 420 and the limiting structure 300 in at least two of them.

[0515] Optionally, at least part of the support structure P is located between the side segment 420 and the defining structure 300 in the first packaging area 400d, and at least part of the support structure P is located between the side segment 420 and the defining structure 300 in the second packaging area 400e.

[0516] In these optional embodiments, during the manufacturing process of the display panel 10, for example, when preparing each light-emitting device 200 in the display panel 10, as shown in Figures 37 and 38, the material of the first light-emitting device 200a can first be evaporated over the entire surface, so that the material of the first light-emitting device 200a is present within each defined opening 300a. Then, the material of the first encapsulation structure 400 is formed over the entire surface, so that the material of the first light-emitting device 200a within each defined opening 300a is covered by the material of the first encapsulation structure 400. Then, as shown in Figure 39, the material of the first light-emitting device 200a within the defined openings 300a other than the first opening 310aa and the material of the first encapsulation structure 400 can be removed to form the material of the first light-emitting device 200a at least partially located within the first opening 310aa and the material of the first encapsulation structure 400 at least partially located within the first opening 310aa. This portion of the material of the first encapsulation structure 400 can be used to form the first encapsulation structure 400 located in the first encapsulation region 400d.

[0517] Then, as shown in FIG40 , a material for a support structure P may be prepared over the material of the first encapsulation structure 400 corresponding to the first light-emitting device 200a to form a portion of the support structure P. For example, this may form a portion of the first encapsulation portion P1 located within the first opening 310aa, and / or a portion of the second encapsulation portion P2 and a portion of the third encapsulation portion P3 located on the defining structure 300 that encloses the first opening 310aa. At least a portion of the material for the support structure P may be located between the defining structure 300 that encloses the first opening 310aa and the material of the first encapsulation structure 400.

[0518] As shown in FIG41 , the entire surface of the second light-emitting device 200b material is then evaporated, so that each defined opening 300a is filled with the material of the second light-emitting device 200b. The material of the first encapsulation structure 400 is then prepared on the entire surface, so that the material of the second light-emitting device 200b in each defined opening 300a is covered by the material of the first encapsulation structure 400. As shown in FIG42 , the material of the second light-emitting device 200b in the other defined openings 300a except the second opening 310ab and the material of the first encapsulation structure 400 are then removed to form the material of the second light-emitting device 200b at least partially located in the second opening 310ab and the material of the first encapsulation structure 400 at least partially located in the second opening 310ab. The material of this portion of the first encapsulation structure 400 can be used to form the first encapsulation structure 400 located in the second encapsulation region 400e.

[0519] During this process, when preparing the material of the second light-emitting device 200b and the material of the first packaging structure 400 on the entire surface, by setting at least a portion of the material of the supporting structure P between the limiting structure 300 that encloses the first opening 310aa and the material of the first packaging structure 400, the material of this portion of the supporting structure P can better support and connect the material of the first packaging structure 400 spaced apart from the limiting structure 300 that encloses the first opening 310aa, so that when preparing or patterning the material of the second light-emitting device 200b and the material of the first packaging structure 400, the material of this portion of the first packaging structure 400 is not easy to fall off or drop, which can better improve the structural stability of the finally formed first packaging structure 400 and the supporting structure P, thereby better improving the packaging reliability of the display panel 10, and then improving the packaging effect of the display panel 10.

[0520] Then, as shown in FIG43 , the material of the support structure P may be further prepared above the material of the first encapsulation structure 400 corresponding to the second light-emitting device 200 b to form another portion of the support structure P. For example, this may form another portion of the first encapsulation portion P1 located within the first opening 310 aa and / or another portion of the second encapsulation portion P2 and another portion of the third encapsulation portion P3 located on the defining structure 300 that encloses the first opening 310 aa. At least a portion of the material of the support structure P may be located between the defining structure 300 that encloses the second opening 310 ab and the material of the first encapsulation structure 400.

[0521] As shown in FIG44 , the entire surface of the third light-emitting device 200c is then evaporated, so that each defined opening 300a is filled with the third light-emitting device 200c material. The first encapsulation structure 400 material is then formed on the entire surface, so that each defined opening 300a is covered with the third light-emitting device 200c material. As shown in FIG45 , the third light-emitting device 200c material and the first encapsulation structure 400 material within the other defined openings 300a, except for the third opening 310ac, are removed to form the third light-emitting device 200c at least partially located within the third opening 310ac and the first encapsulation structure 400 material at least partially located within the third opening 310ac. This portion of the first encapsulation structure 400 material can be used to form the first encapsulation structure 400 located in the third encapsulation region 400f.

[0522] During this process, when preparing the material of the third light-emitting device 200c and the material of the first packaging structure 400 on the entire surface, by setting at least a portion of the material of the supporting structure P between the limiting structure 300 that encloses the second opening 310ab and the material of the first packaging structure 400, the material of this portion of the supporting structure P can better support and connect the material of the first packaging structure 400 spaced apart from the limiting structure 300 that encloses the second opening 310ab, so that when preparing or patterning the material of the third light-emitting device 200c and the material of the first packaging structure 400, the material of this portion of the first packaging structure 400 is not easy to fall off or drop, which can better improve the structural stability of the finally formed first packaging structure 400 and the supporting structure P, thereby better improving the packaging reliability of the display panel 10, and then improving the packaging effect of the display panel 10.

[0523] In some optional embodiments, the support structure P may not be provided above the first packaging structure 400 located in the third packaging area 400f to reduce material costs, reduce the preparation process steps of the support structure P, and improve the preparation efficiency of the display panel 10.

[0524] In some other optional embodiments, at least a portion of the support structure P may also be located between the side segment 420 and the defining structure 300 within the third packaging region 400 f .

[0525] In this optional embodiment, as shown in Figure 46, after preparing the third light-emitting device 200c and the first packaging structure 400 in the third area above the third light-emitting device 200c, the material of the support structure P can also be prepared above the first packaging structure 400 in the third area to form another part of the support structure P, for example, to form another part of the first packaging part P1 located in the first opening 310aa, and / or to form another part of the second packaging part P2 and another part of the third packaging part P3 located on the limiting structure 300 that encloses the first opening 310aa. Among them, at least part of the supporting structure P is located between the side section 420 and the limiting structure 300 in the third packaging area 400f, so that the material of this part of the supporting structure P can better support and connect the material of the first packaging structure 400 separated by the limiting structure 300 that encloses the third opening 310ac, so that when other film layer structures are subsequently prepared or patterned, the material of this part of the first packaging structure 400 is not easy to fall off or drop, which can better improve the structural stability of the finally formed first packaging structure 400 and the supporting structure P, thereby better improving the packaging reliability of the display panel 10, and then improving the packaging effect of the display panel 10.

[0526] In the display panel 10 of any of the aforementioned embodiments, optionally, the first packaging portion P1 can be enclosed to form a light-transmitting opening P1a, and the orthographic projection of the light-transmitting opening P1a on the substrate 100 is at least partially overlapped with the orthographic projection of the light-emitting device 200 on the substrate 100, so that the light emitted by the light-emitting device 200 can be emitted outward through the light-transmitting opening P1a, which can reduce the blocking effect of the supporting structure P on the light emitted by the light-emitting device 200, and can better improve the display effect of the display panel 10.

[0527] FIG48 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0528] Alternatively, as shown in FIG48 , the support structure P may not be provided with the light-transmitting opening P1a. For example, the support structure P may further include a fourth encapsulation portion P4 provided on a side of the first sub-portion 410 facing away from the substrate 100 and connected to the first encapsulation portion P1. This eliminates the need for the additional process step of providing the light-transmitting opening P1a during the preparation of the support structure P, thereby improving the preparation efficiency of the support structure P. The fourth encapsulation portion P4 may be prepared together with at least one of the first encapsulation portion P1, the second encapsulation portion P2, and the third encapsulation portion P3. For example, the first encapsulation portion P1, the second encapsulation portion P2, the third encapsulation portion P3, and the fourth encapsulation portion P4 may be integrally formed.

[0529] Optionally, the material of the support structure P includes a transparent organic material, so that the light emitted by the light-emitting device 200 can pass through the support structure P better, thereby reducing the shielding effect of the support structure P on the light emitted by the light-emitting device 200.

[0530] In some optional embodiments, the defining structure 300 may further include a third isolation portion 313 disposed on the side of the isolation structure 310 facing the substrate 100 , and at least a portion of the third isolation portion 313 protrudes relative to the isolation structure 310 toward the defining opening 300 a to connect to the first electrode 230 .

[0531] Optionally, the material of the third isolation portion 313 may include a conductive material.

[0532] In these optional embodiments, by providing a third isolation portion 313 below the isolation structure 310 and connecting the third isolation portion 313 to the first electrode 230, the first electrodes 230 within adjacent defined openings 300a can be electrically con...

Claims

1. A display panel, wherein: include: substrate; An isolation structure is arranged on one side of the substrate and encloses a plurality of isolation openings, the isolation structure comprising a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, the second isolation portion having a convex eave portion protruding from the first isolation portion toward one side of the isolation opening; a plurality of light emitting devices, at least a portion of the structure of the light emitting devices being located within the isolation opening; A first packaging structure is arranged on a side of the light-emitting device away from the substrate, and the first packaging structure includes a first section, a second section and a third section. The first section covers the side of the light-emitting device away from the substrate, the second section covers the side of the first isolation portion facing the isolation opening, the third section is at least partially located on the side of the second isolation portion facing the substrate and is at least partially attached to the convex eaves portion, the first section, the second section and the third section enclose a gap space, and the third section is at least partially connected to the first section to form a connecting portion.

2. The display panel according to claim 1, wherein: The orthographic projection shape of the connecting portion in at least part of the isolation opening on the substrate is annular so that the gap space is a closed space; And / or, the first sub-portion and the third sub-portion in at least part of the isolation opening are at least partially spaced apart from each other to form a connecting opening.

3. The display panel according to claim 2, wherein: A side surface of at least a portion of the first sub-portion in the isolation opening facing away from the substrate and a side surface of at least a portion of the third sub-portion close to the isolation opening are at least partially spaced apart to form at least one communicating opening. The orthographic projection shape of at least part of the communicating openings in the isolation openings on the substrate is annular; And / or, at least part of the isolation openings includes a plurality of communication openings, and the plurality of communication openings are arranged at intervals.

4. The display panel according to claim 3, wherein: A sealing structure is provided at at least a portion of the communicating openings, one side of the sealing structure is connected to the surface of the first section, and the other side of the sealing structure is connected to the surface of the third section.

5. The display panel according to claim 1, wherein: At least a portion of the gap space is filled with a support structure.

6. The display panel according to claim 5, wherein: It also includes a second packaging layer arranged on the side of the first packaging structure facing away from the substrate, and at least a part of the surface of the first section facing away from the substrate in the isolation opening and a part of the surface of the third section close to the isolation opening are at least partially spaced apart to form a connecting opening, and at least a part of the second packaging layer is located in the gap space to form the support structure.

7. The display panel according to any one of claims 1 to 6, wherein: The protruding length of at least a portion of the convex eaves portion arranged corresponding to a portion of the isolation opening is greater than that of at least a portion of the convex eaves portion arranged corresponding to another portion of the isolation opening.

8. The display panel according to claim 1, wherein: The dimension of the first isolation portion in the thickness direction of the display panel is a first height, and the ratio of the protruding length of at least part of the convex eaves portion to the first height is not greater than 1.

25.

9. The display panel according to claim 1, wherein: It also includes a pixel definition layer disposed on a side of the substrate facing the light-emitting device, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the isolation structure is disposed on a side of the pixel defining portion away from the substrate, and the pixel opening is connected to the isolation opening. The first section includes a first main section and a second main section connected to each other, the first main section is located in the pixel opening, and the second main section is located on a side of the pixel defining portion away from the substrate. There is a first distance between the surface of the convex portion facing the substrate and the surface of the pixel defining portion facing away from the substrate. The ratio of the maximum thickness of at least part of the first main body section to the first spacing is not less than 1.25; and / or the ratio of the maximum thickness of at least part of the second main body section to the first spacing is not less than 1.

25.

10. The display panel according to claim 9, wherein: A ratio of a maximum thickness of at least a portion of the first body section to the first spacing is 1.5-2.

5.

11. The display panel according to claim 9, wherein: The dimension of the first isolation portion in the thickness direction of the display panel is a first height, and the ratio of the maximum thickness of at least part of the first main body division to the first height is not less than 1.4, and / or the ratio of the maximum thickness of at least part of the second main body division to the first height is not less than 1.

25.

12. The display panel according to claim 11, wherein: The ratio of the maximum thickness of at least part of the first main body section to the first height is not less than 1.617, and / or the ratio of the maximum thickness of at least part of the second main body section to the first height is not less than 1.

389.

13. The display panel according to claim 9, wherein: There is a second distance between the surface of the convex portion facing the substrate and the surface of the light-emitting device facing away from the substrate, and the ratio of the maximum thickness of at least part of the first main body section to the second distance is not less than 1, and / or the ratio of the maximum thickness of at least part of the second main body section to the second distance is not less than 1.

14. The display panel according to any one of claims 9 to 13, wherein: The second main body section includes a first main body sub-section and a second main body sub-section connected to each other, the orthographic projection of the first main body sub-section on the substrate is located outside the orthographic projection of the second isolation section on the substrate, and the orthographic projection of the second main body sub-section on the substrate is located within the orthographic projection of the second isolation section on the substrate, A ratio of a maximum thickness of at least a portion of the first body sub-portions to the first spacing is not less than 1.

25.

15. The display panel according to claim 1, wherein: The isolation opening includes a first opening and a third opening, the light emitting device includes a first light emitting device arranged corresponding to the first opening and a third light emitting device arranged corresponding to the third opening, and the gap space in the first opening is a closed space; And / or, the gap space in the third opening forms at least one communicating opening, and the communicating opening in the third opening is annular.

16. The display panel according to claim 15, wherein: The first packaging structure includes a first packaging unit at least partially located in the first opening and a third packaging unit at least partially located in the third opening, and a maximum thickness of the first packaging unit is greater than a maximum thickness of the third packaging unit.

17. The display panel according to claim 16, wherein: The display panel further comprises a pixel definition layer disposed on a side of the substrate facing the light emitting device, the pixel definition layer comprising a pixel defining portion and a pixel opening formed by the pixel defining portion, the isolation structure being disposed on a side of the pixel defining portion away from the substrate, the pixel opening being connected to the isolation opening, The first section includes a first main section and a second main section connected to each other, the first main section is located in the pixel opening, and the second main section is located on a side of the pixel defining portion away from the substrate. There is a first distance between the surface of the convex portion facing the substrate and the surface of the pixel defining portion facing away from the substrate. The ratio of the maximum thickness of at least part of the first main body section of the first packaging unit to the first spacing is not less than 1.25; and / or the ratio of the maximum thickness of at least part of the second main body section of the first packaging unit to the first spacing is not less than 1.

25.

18. The display panel according to claim 15, wherein: The distance between at least a portion of the second isolation portion that participates in enclosing and forming the first opening and the substrate is smaller than the distance between the second isolation portion that participates in enclosing and forming the third opening and the substrate.

19. The display panel according to claim 15, wherein: The convex eave portion includes a first convex eave portion corresponding to the first opening and a third convex eave portion corresponding to the third opening, and a protruding length of the first convex eave portion is smaller than a protruding length of the third convex eave portion.

20. The display panel according to any one of claims 15 to 19, wherein: The isolation opening further includes a second opening, the light emitting device includes a second light emitting device arranged corresponding to the second opening, and the gap space in the second opening is a closed space; Alternatively, the gap space within the second opening forms at least one communicating opening.

21. The display panel according to claim 20, wherein: The first packaging structure includes a first packaging unit at least partially located in the first opening, a second packaging unit at least partially located in the second opening, and a third packaging unit at least partially located in the third opening, wherein the maximum thickness of the second packaging unit is greater than or equal to the maximum thickness of the third packaging unit; And / or, the maximum thickness of the second packaging unit is less than or equal to the maximum thickness of the first packaging unit.

22. The display panel according to claim 20, wherein: The distance between at least a portion of the second isolation portion that participates in enclosing and forming the second opening and the substrate is greater than or equal to the distance between the second isolation portion that participates in enclosing and forming the first opening and the substrate; And / or, a distance between at least a portion of the second isolation portion that participates in enclosing and forming the second opening and the substrate is less than or equal to a distance between the second isolation portion that participates in enclosing and forming the third opening and the substrate.

23. The display panel according to claim 22, wherein: The size of at least a portion of the first isolation portion involved in enclosing and forming the second opening in the thickness direction of the display panel is greater than or equal to the size of the first isolation portion involved in enclosing and forming the first opening in the thickness direction of the display panel; And / or, a dimension of at least a portion of the first isolation portion involved in enclosing and forming the second opening in the thickness direction of the display panel is smaller than or equal to a dimension of the first isolation portion involved in enclosing and forming the third opening in the thickness direction of the display panel.

24. The display panel according to claim 20, wherein: The convex eaves portion includes a first convex eaves portion corresponding to the first opening, a second convex eaves portion corresponding to the second opening, and a third convex eaves portion corresponding to the third opening. The protruding length of the second convex eave portion is less than or equal to the protruding length of the third convex eave portion; And / or, the protruding length of the second convex eave portion is greater than or equal to the protruding length of the first convex eave portion.

25. A display panel, wherein: include: substrate; An isolation structure is arranged on one side of the substrate and encloses a plurality of isolation openings, the isolation structure comprising a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, the second isolation portion having a convex eave portion protruding from the first isolation portion toward one side of the isolation opening; A plurality of light-emitting devices, at least a portion of the structure of the light-emitting devices is located in the isolation opening, and the light-emitting devices include a light-emitting unit and a first electrode located on a side of the light-emitting unit away from the substrate; a first packaging structure, arranged on a side of the light-emitting device away from the substrate, the first packaging structure comprising a first sub-section, a second sub-section and a third sub-section, the first sub-section covers the side of the light-emitting device away from the substrate, the second sub-section covers the side of the first isolation portion facing the isolation opening, the third sub-section is at least partially located on the side of the second isolation portion facing the substrate and at least partially attached to the convex eaves portion, the first sub-section, the second sub-section and the third sub-section enclose a gap space, and the first sub-section and the third sub-section in at least part of the isolation opening are at least partially spaced apart and form a connecting opening, The minimum dimension of the communication opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thicknesses of at least part of the light-emitting unit and the first electrode of the light-emitting device and a sealing coefficient.

26. The display panel according to claim 25, wherein: The minimum size of the communication opening in the thickness direction of the display panel is smaller than or equal to the size of an opening that can be blocked by the light emitting unit of at least a part of the light emitting device and the first electrode.

27. The display panel according to claim 25, wherein: A minimum dimension of the communication opening in a thickness direction of the display panel is smaller than or equal to a sum of thicknesses of at least a portion of the light emitting units of the light emitting device and the first electrode.

28. The display panel according to claim 25, wherein: The isolation opening includes a first opening, a second opening and a third opening, and the light emitting device includes a first light emitting device arranged corresponding to the first opening, a second light emitting device arranged corresponding to the second opening, and a third light emitting device arranged corresponding to the third opening. A side of the third subsection in the first opening close to the isolation opening is at least partially connected to a surface of a side of the first subsection facing away from the substrate to form a connection portion, and an orthographic projection of the connection portion in the first opening on the substrate is annular so that the gap space in the first opening is a closed space; Alternatively, the gap space within the first opening forms at least one of the communicating openings.

29. The display panel according to claim 28, wherein: The gap space in the first opening forms at least one communication opening, and the minimum size of the communication opening in the first opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thickness of the light-emitting unit of the second light-emitting device and the first electrode and the corresponding sealing coefficient; And / or, the minimum dimension of the connecting opening in the first opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thicknesses of the light-emitting unit of the third light-emitting device and the first electrode and the corresponding sealing coefficient.

30. The display panel according to claim 29, wherein: The size of the communication opening in the first opening in the thickness direction of the display panel is less than or equal to the thickness of the light emitting unit of the second light emitting device; And / or, a dimension of the communication opening in the first opening in a thickness direction of the display panel is smaller than or equal to a thickness of the light emitting unit of the third light emitting device.

31. The display panel according to claim 28, wherein: A side of the third subsection in the second opening close to the isolation opening is at least partially connected to a surface of a side of the first subsection facing away from the substrate to form a connection portion, and an orthographic projection of the connection portion in the second opening on the substrate is annular so that the gap space in the second opening forms a closed gap space; Alternatively, the gap space within the second opening forms at least one of the communicating openings.

32. The display panel according to claim 31, wherein: The gap space within the second opening forms at least one connecting opening, and the minimum size of the connecting opening within the second opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thicknesses of the light-emitting unit of the third light-emitting device and the first electrode and the corresponding sealing coefficient.

33. The display panel according to claim 32, wherein: A dimension of the communication opening in the second opening in a thickness direction of the display panel is smaller than or equal to a thickness of the light emitting unit of the third light emitting device.

34. The display panel according to any one of claims 28 to 33, wherein: The first opening and the gap space within the third opening form at least one connecting opening, and a size of the connecting opening within the first opening in the thickness direction of the display panel is smaller than a size of the connecting opening within the third opening in the thickness direction of the display panel.

35. The display panel according to claim 34, wherein: The first packaging structure includes a first packaging unit at least partially located in the first opening and a third packaging unit at least partially located in the third opening, and a maximum thickness of the first packaging unit is greater than a maximum thickness of the third packaging unit.

36. The display panel according to claim 34, wherein: The gap space in the second opening forms at least one communication opening, The size of the communication opening in the second opening in the thickness direction of the display panel is smaller than or equal to the size of the communication opening in the third opening in the thickness direction of the display panel; And / or, a size of the communication opening in the second opening in the thickness direction of the display panel is greater than or equal to a size of the communication opening in the first opening in the thickness direction of the display panel.

37. The display panel according to claim 36, wherein: The first packaging structure includes a first packaging unit at least partially located in the first opening, a second packaging unit at least partially located in the second opening, and a third packaging unit at least partially located in the third opening. The maximum thickness of the second packaging unit is greater than or equal to the maximum thickness of the third packaging unit; And / or, the maximum thickness of the second packaging unit is less than or equal to the maximum thickness of the first packaging unit.

38. The display panel according to claim 36, wherein: The distance between at least a portion of the second isolation portion that participates in enclosing and forming the second opening and the substrate is greater than or equal to the distance between the second isolation portion that participates in enclosing and forming the first opening and the substrate; And / or, a distance between at least a portion of the second isolation portion that participates in enclosing and forming the second opening and the substrate is less than or equal to a distance between the second isolation portion that participates in enclosing and forming the third opening and the substrate.

39. The display panel according to claim 38, wherein: The size of at least a portion of the first isolation portion involved in enclosing and forming the second opening in the thickness direction of the display panel is greater than or equal to the size of the first isolation portion involved in enclosing and forming the first opening in the thickness direction of the display panel; And / or, a dimension of at least a portion of the first isolation portion involved in enclosing and forming the second opening in the thickness direction of the display panel is smaller than or equal to a dimension of the first isolation portion involved in enclosing and forming the third opening in the thickness direction of the display panel.

40. The display panel according to claim 36, wherein: The convex eaves portion includes a first convex eaves portion corresponding to the first opening, a second convex eaves portion corresponding to the second opening, and a third convex eaves portion corresponding to the third opening. The protruding length of the second convex eave portion is less than or equal to the protruding length of the third convex eave portion; And / or, the protruding length of the second convex eave portion is greater than or equal to the protruding length of the first convex eave portion.

41. A display panel, wherein: include: substrate; An isolation structure is disposed on one side of the substrate and encloses the isolation opening; a light emitting device, at least partially located in the isolation opening; A first packaging structure is arranged on a side of the light-emitting device away from the substrate, and the first packaging structure includes a first section and a second section. The first section is located in the isolation opening and is arranged on a side of the light-emitting device away from the substrate, and the second section is located on a side of the isolation structure facing the isolation opening. A surface of a side of the first section away from the substrate and a surface of a side of the second section away from the isolation structure are at least partially connected to each other to enclose a gap space.

42. The display panel according to claim 41, wherein: The first section includes a main body and a support portion protruding from the main body toward the second section, and the support portion is connected to the second section.

43. The display panel according to claim 42, wherein: The isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, wherein the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening. The second segment includes a third section arranged on a side of the second isolation portion facing the isolation opening, and the support portion and the third section are connected to each other to enclose and form the gap space.

44. The display panel according to claim 42, wherein: The orthographic projection of the support portion on the substrate is annular, and the support portion and the second segment are connected to each other so that the first segment and the second segment enclose the closed gap space.

45. A method for preparing a display panel, wherein: include: An isolation structure is prepared on the substrate, wherein the isolation structure encloses an isolation opening, wherein the isolation opening includes a first opening and a second opening, wherein the isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, wherein the second isolation portion has a convex eave portion protruding from the first isolation portion toward a side of the isolation opening; sequentially preparing a first device material layer and a first packaging material layer on the entire surface; The first packaging material layer and the first device material layer outside the first opening are removed by etching to form a first light-emitting device corresponding to the first opening and a first packaging unit located on a side of the first light-emitting device away from the substrate, wherein the first packaging unit comprises a first sub-portion, a second sub-portion and a third sub-portion, wherein the first sub-portion covers a side of the light-emitting device away from the substrate, the second sub-portion covers a side of the first isolation portion facing the isolation opening, the third sub-portion is at least partially located on a side of the second isolation portion facing the substrate and is at least partially attached to the convex eaves portion, the first sub-portion, the second sub-portion and the third sub-portion of the first packaging unit enclose a gap space, and the gap space of the first packaging unit has a connecting opening; Sequentially preparing a second device material layer and a second packaging material layer on the entire surface, wherein the second device material layer includes a light-emitting unit material layer and a first electrode material layer, and the first electrode material layer of the second device material layer is continuous on a side of the first packaging unit away from the substrate and blocks the communication opening of the first packaging unit; The second packaging material layer outside the second opening is etched away by a first etching method, and then the second device material layer is etched away by a second etching method to form a second light-emitting device corresponding to the second opening and a second packaging unit located on a side of the second light-emitting device away from the substrate.

46. ​​The preparation method according to claim 45, wherein The first packaging unit and the second packaging unit both include the first sub-section, the second sub-section and the third sub-section, the first sub-section, the second sub-section and the third sub-section of the second packaging unit enclose a gap space, and the gap space of the second packaging unit has a connecting opening, the isolation opening also includes a third opening, and after the steps of etching and removing the second packaging material layer outside the second opening by using a first etching method, and then etching and removing the second device material layer by using a second etching method, the step further includes: Sequentially preparing a third device material layer and a third packaging material layer on the entire surface, the third device material layer comprising a light-emitting unit material layer and a first electrode material layer, the first electrode material layer of the third device material layer being continuous on a side of the first packaging unit away from the substrate and blocking the connecting opening of the first packaging unit, and / or the third device material layer being continuous on a side of the second packaging unit away from the substrate and blocking the connecting opening of the second packaging unit; The third packaging material layer outside the third opening is etched away using the first etching method, and then the third device material layer is etched away using the second etching method to form a third light-emitting device corresponding to the third opening and a third packaging unit located on the side of the third light-emitting device away from the substrate.

47. A display device, wherein: Comprising a display panel as described in any one of claims 1 to 44 or a display panel prepared by the preparation method according to any one of claims 45 to 46.

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