Mechanical hand and semiconductor transfer apparatus

Abstract

The application discloses a mechanical hand and a semiconductor conveying device. The disclosed mechanical hand comprises a mechanical hand body and a blowing device. The mechanical hand body is provided with a supporting surface and a gas flow-through space. The supporting surface can be used for supporting a to-be-carried object. The gas flow-through space is located below the to-be-carried object supported on the supporting surface. The blowing device is arranged on the mechanical hand body. The blowing device is provided with a blowing port. The blowing port is used for blowing cooling gas to the gas flow-through space in a direction parallel to the supporting surface, so as to form a negative pressure area for adsorbing the to-be-carried object in the gas flow-through space. By using the pressure difference on both sides of the to-be-carried object, the to-be-carried object can be pressed on the supporting surface, so that the friction between the to-be-carried object and the mechanical hand body is increased. In the case that the mechanical hand runs at a large acceleration, the to-be-carried object is not prone to slipping and falling, and the conveying efficiency and the production capacity of the to-be-carried object are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular, to a mechanical hand and a semiconductor conveying device. BACKGROUND

[0002] In a semiconductor processing process, for example, wafer processing, a mechanical hand is usually mounted at the front end of a wafer processing device such as a photolithography machine, an ion implantation machine, a cleaning machine, and a thin film deposition device, to realize the circulation of the wafer between various stations. The running speed of the mechanical hand determines the production capacity to a certain extent.

[0003] In related technologies, the mechanical hand can be divided into three categories according to its working principle, namely vacuum adsorption, clamping, and passive friction. For example, the passive friction is achieved by supporting the wafer by the mechanical hand and using the friction between the mechanical hand and the wafer to keep the wafer relatively stationary with the mechanical hand. However, when the acceleration of the mechanical hand is too large during operation, the wafer is prone to slip or even fall off due to insufficient friction between the wafer and the mechanical hand. SUMMARY

[0004] The present application discloses a mechanical hand and a semiconductor conveying device to solve the problem of wafer slip or even falling off when the acceleration of the mechanical hand is too large during operation in related technologies.

[0005] To solve the above technical problems, the present application is implemented as follows:

[0006] In a first aspect, the present application discloses a mechanical hand, which comprises a mechanical hand body and a gas blowing device.

[0007] The mechanical hand body is provided with a supporting surface and a gas flow-through space. The supporting surface is used to support a to-be-carried object. The gas flow-through space is located below the to-be-carried object supported on the supporting surface.

[0008] The gas blowing device is arranged on the mechanical hand body. The gas blowing device has a gas blowing port. The gas blowing port is used to blow cooling gas into the gas flow-through space in a direction parallel to the supporting surface, so as to form a negative pressure area in the gas flow-through space for adsorbing the to-be-carried object.

[0009] In a second aspect, the present application discloses a semiconductor conveying device, which comprises a mechanical arm and a mechanical hand connected with the mechanical arm. The mechanical hand is as described above. The mechanical arm is used to drive the mechanical hand to move.

[0010] The technical solution adopted by the present application can achieve the following technical effects:

[0011] The mechanical hand disclosed by the embodiment of the application improves the related art, the blowing device is arranged on the mechanical hand body, the blowing port of the blowing device can form a negative pressure area for adsorbing the to-be-carried object in the gas flow space below the to-be-carried object in the case that the to-be-carried object is placed on the bearing surface, the to-be-carried object can be pressed on the bearing surface by using the pressure difference on both sides of the to-be-carried object, thereby increasing the friction force between the to-be-carried object and the mechanical hand body; and the cooling gas swept by the blowing port can also cool the to-be-carried object, so that the friction coefficient between the to-be-carried object and the bearing surface is increased, further increasing the friction force between the to-be-carried object and the mechanical hand body, thereby ensuring that the to-be-carried object is not prone to slipping and falling in the case that the mechanical hand runs at a large acceleration, and further improving the transmission efficiency and productivity of the to-be-carried object. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 A structural schematic diagram of the mechanical hand disclosed by the embodiment of the application is shown in the figure.

[0013] Figure 2 A structural schematic diagram of the mechanical hand disclosed by the embodiment of the application is shown in the figure. Figure 1 A sectional view along the direction A-A.

[0014] Mark explanation:

[0015] 100-mechanical hand body, 110-carrier, 111-bearing surface, 120-film placing groove, 121-first area, 122-second area, 123-third area,

[0016] 200-blowing device, 210-blowing port, 211-first sub-blowing port, 212-second sub-blowing port, 213-third sub-blowing port, 220-gas inlet pipeline, 221-first sub-pipeline, 222-second sub-pipeline, 223-third sub-pipeline, 230-temperature controller, 240-flow controller, 250-temperature sensor,

[0017] 300-gas source. DETAILED DESCRIPTION

[0018] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described below in conjunction with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0019] The terms "first", "second", and the like in the description and in the claims of the present application are used for distinguishing between similar objects and are not necessarily used to describe a particular sequential or chronological order. It is to be understood that the use of the term "first", "second", and the like does not limit the order in which the objects are used, and that the objects are not limited to a single number of objects. For example, a first object can be one or more, and a second object can also be one or more.

[0020] The technical solutions disclosed in the various embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0021] In the semiconductor processing process, it is necessary to use a robot to realize the transfer operation of a to-be-carried object, which can be a wafer, a solar cell, etc. Taking wafer processing as an example, the robot is usually carried at the front end of a photolithography machine, an ion implantation machine, a cleaning machine, a thin film deposition device, etc. wafer processing equipment, used to realize the circulation of wafers between various stations, and the running speed of the robot determines the production capacity to a certain extent.

[0022] In the related art, the robot can be divided into three categories according to its working principle: vacuum adsorption, clamping, and passive friction. Taking passive friction as an example, the wafer is supported by the robot, and the friction between the robot and the wafer is used to make the wafer relatively stationary with the robot. However, when the acceleration of the robot is too large during operation, such as during the start-up or stop process of the robot, the wafer and the robot are prone to slip or even fall off due to insufficient friction.

[0023] Based on the above problems, please refer to Figure 1 and Figure 2 The robot disclosed in the embodiments of the present application can include a robot body 100 and a blowing device 200. The robot body 100 is mainly used to support the to-be-carried object. In order to facilitate the placement of the to-be-carried object, the robot body 100 is provided with a supporting surface 111 and a gas flow-through space. The supporting surface 111 can be a plane, which can support the to-be-carried object. The gas flow-through space is located below the to-be-carried object supported on the supporting surface 111.

[0024] In specific implementation, the to-be-carried object described above can be a wafer, a solar cell, etc. Taking a wafer as an example, in order to facilitate the placement of the wafer, the robot body 100 can be provided with an arc-shaped supporting surface 111. The arc-shaped design of the supporting surface 111 is to better match the profile of the wafer.

[0025] It should be noted that when the robotic arm body 100 is used to place solar cells, the supporting surface 111 can also adopt a shape design that matches the solar cells, such as rectangular or square. The specific shape of the supporting surface 111 is not limited in the embodiments of this application.

[0026] Continuing with the wafer as a reference embodiment, the wafer has a first surface, a second surface, and a side surface. The first and second surfaces are two opposing surfaces of the wafer, and are connected by the side surface. When the wafer is placed on the support surface 111, a portion of the first or second surface of the wafer will contact the support surface 111. This gas flow space is located below the wafer and adjacent to the first or second surface. There is a certain friction between the first or second surface of the wafer and the support surface 111, so that the robot arm body 100 can carry and transport the wafer through passive friction.

[0027] Considering the significant acceleration experienced by the robotic arm 100 during startup and shutdown, a substantial frictional force is required between the wafer surface and the support surface 111 to ensure stable placement of the wafer on the support surface 111. Therefore, an air blowing device 200 can be installed on the robotic arm 100. This device has air blowing ports 210, which can be one, two, or more. The ports 210 blow cooling gas into the gas flow space in a direction parallel to the support surface 111. The cooling gas can be an inert gas such as nitrogen or helium. According to Bernoulli's principle, the flow of cooling gas within the gas flow space reduces the pressure, thus creating a negative pressure region within the gas flow space for wafer adsorption.

[0028] In specific application scenarios, the first surface of the wafer can be in contact with the support surface 111. When the gas flow space is adjacent to the first surface of the wafer, and the air blowing port 210 blows cooling gas into the gas flow space in a direction parallel to the support surface 111, the airflow near the first surface of the wafer accelerates and the pressure decreases. This creates a pressure difference between the first and second surfaces of the wafer. It can be understood that the pressure on the second surface of the wafer will be greater than the pressure on the first surface, thus pressing the first surface of the wafer tightly onto the support surface 111, thereby increasing the friction between the wafer and the support surface 111.

[0029] As described above, the robotic arm disclosed in this application improves upon related technologies by providing an air blowing device 200 on the robotic arm body 100. When the object to be carried is placed on the support surface 111, the air blowing port 210 of the air blowing device 200 can form a negative pressure area for adsorbing the object in the gas flow space below the object. By utilizing the pressure difference on both sides of the object, the object can be pressed tightly onto the support surface 111, thereby increasing the friction between the object and the robotic arm body 100. Furthermore, the cooling gas blown by the air blowing port 210 can also cool the object, increasing the coefficient of friction between the object and the support surface 111, further increasing the friction between the object and the robotic arm body 100. This ensures that even when the robotic arm operates at a large acceleration, the object is less likely to slip or fall off, thereby improving the transport efficiency and production capacity of the object.

[0030] like Figure 1 As shown, the robot body 100 may include an arc-shaped platform 110, with a supporting surface 111 being the top surface of the platform 110. The area defined by the platform 110 can form the aforementioned gas flow space, and the air inlet 210 can be disposed on the inner surface of the platform 110. The robot body 100 may also include a base, which serves as the structural foundation of the robot body 100. The base can be a plate-like structure, and the platform 110 can be integrally formed on the surface of the base. Alternatively, the platform 110 and the base can be manufactured separately and then assembled together by welding, bonding, or other methods. By integrating the supporting surface 111 and the air inlet 210 onto the top and inner surfaces of the platform 110, respectively, the number of parts in the robot body 100 can be reduced.

[0031] As described above, relying solely on the friction between the supporting surface 111 and the object to be supported to fix the object still carries the risk of slippage and detachment. In an optional embodiment of this application, the robotic arm body 100 also has a wafer placement slot 120. The shape of the wafer placement slot 120 matches the contour of the object to be supported. Taking a wafer as an example, the shape of the wafer placement slot 120 can be circular, semi-circular, etc. The stage 110 can be set at the bottom of the wafer placement slot 120. Along the depth direction of the wafer placement slot 120, the stage 110 is lower than the side wall of the wafer placement slot 120, and the gas flow space is located between the bottom of the wafer placement slot 120 and the object to be supported. When the object to be supported is placed in the wafer placement slot 120, the side wall of the wafer placement slot 120 can cooperate with the side of the object to be supported for limiting. Combined with the friction between the supporting surface 111 and the object to be supported, and the negative pressure area provided by the gas flow space, the risk of slippage and detachment of the object to be supported can be further reduced.

[0032] In one specific embodiment of this application, such as Figure 1 andFigure 2 As shown, the arc-shaped platform 110 described above can be C-shaped, with the opening of the C-shape located on the side of the robot body 100 away from the air inlet 210. The C-shaped design of the platform 110 allows the cooling gas blown by the air inlet 210 to exit through the C-shaped opening, preventing airflow accumulation in the gas flow space and thus avoiding airflow disturbance. Simultaneously, after heat exchange with the object being carried, the cooling gas can quickly transfer heat to the outside of the gas flow space, facilitating rapid heat dissipation from the object.

[0033] In a specific implementation, the wafer placement slot 120 has an opening on the side away from the air blowing port 210, and the bottom of the slot on the side away from the air blowing port 210 has a notch that is recessed towards the air blowing port 210, so that the robot arm can avoid the pins on the base when picking up and placing wafers in the semiconductor cavity.

[0034] Considering that different areas of the surface of the object to be supported may have certain temperature differences, it is necessary to perform zoning treatment on the surface of the object. Specifically, for example... Figure 1 As shown, the film placement slot 120 may have a first region 121, a second region 122, and a third region 123. The second region 122 and the third region 123 are located on both sides of the first region 121. When the object to be carried is placed in the film placement slot 120, the first region 121, the second region 122, and the third region 123 may correspond to different regions on the surface of the object to be carried. Correspondingly, the air outlet 210 of the air blowing device 200 may include a first sub-air outlet 211, a second sub-air outlet 212, and a third sub-air outlet 213. The first sub-air outlet 211, the second sub-air outlet 212, and the third sub-air outlet 213 are respectively provided on the inner side of the platform 110 facing the C-shaped opening, which is conducive to the smooth discharge of cooling gas through the C-shaped opening. The second sub-air outlet 212 and the third sub-air outlet 213 are located on both sides of the first sub-air outlet 211. The first sub-air outlet 211 faces the first region 121, the second sub-air outlet 212 faces the second region 122, and the third sub-air outlet 213 faces the third region 123. That is to say, the first sub-air outlet 211, the second sub-air outlet 212, and the third sub-air outlet 213 can also blow cooling gas onto different regions of the surface of the object to be supported.

[0035] By employing the aforementioned partitioned design, when temperature differences exist in different areas of the surface of the object to be supported, the temperature, flow rate, and other parameters of the cooling gas blown by the first sub-air outlet 211, the second sub-air outlet 212, and the third sub-air outlet 213 can be adjusted accordingly. This allows for partitioned control of the surface of the object to be supported, preventing warping or damage due to large internal temperature differences. It should be noted that this embodiment only illustrates a three-partition scheme; of course, the number of partitions can also be two, four, five, etc. Correspondingly, the number of sub-air outlets 210 is equal to and corresponds one-to-one with the number of partitions. The specific number of partitions in the film loading slot 120 can be selected according to the size of the film loading slot 120 and the actual temperature control requirements; this embodiment does not limit this.

[0036] Regarding the three-zone scheme described above, the first zone 121 corresponds to the central area of ​​the object to be supported, and the second zone 122 and the third zone 123 correspond to the edge areas on both sides of the object to be supported, respectively. Considering that the central area of ​​the object to be supported may not dissipate heat in time, the temperature of the central area may be slightly higher than that of the edge areas on both sides. Based on this, the flow area of ​​the second sub-air outlet 212 and the flow area of ​​the third sub-air outlet 213 can be smaller than the flow area of ​​the first sub-air outlet 211. Correspondingly, the flow rate of the cooling gas blown by the first sub-air outlet 211 will be greater than that of the second sub-air outlet 212 and the third sub-air outlet 213. Therefore, the heat dissipation efficiency of the central area of ​​the object to be supported corresponding to the first sub-air outlet 211 will be improved, which is conducive to maintaining the temperature consistency of each area of ​​the object to be supported and avoiding warping and damage.

[0037] like Figure 1 and Figure 2 As shown, the air blowing device 200 includes an air inlet pipe 220. The air inlet end of the air inlet pipe 220 is connected to an air source 300, which can be a compressed nitrogen tank, a compressed helium tank, etc. The air outlet end of the air inlet pipe 220 is provided with an air blowing port 210. The air source 300 can blow cooling gas into the gas flow space through the air inlet pipe 220 and the air blowing port 210. The air inlet pipe 220 can be set on the surface of the robot body 100 and fixed by a structure such as a snap-fit; of course, the air inlet pipe 220 can also be arranged inside the robot body 100 to avoid interference between the air inlet pipe 220 and other components of the robot body 100, and at the same time, it can also improve the uniformity of the appearance of the robot body 100.

[0038] like Figure 1 and Figure 2As shown, since the air inlet 210 includes a first sub-air inlet 211, a second sub-air inlet 212 and a third sub-air inlet 213, the corresponding air inlet pipe 220 may include a first sub-pipe 221, a second sub-pipe 222 and a third sub-pipe 223, and the first sub-pipe 221, the second sub-pipe 222 and the third sub-pipe 223 are all arranged inside the robot body 100.

[0039] The first sub-pipe 221 is connected to the air source 300 at one end, and has a first sub-air outlet 211 at the other end. The second sub-pipe 222 is connected to the air source 300 at one end, and has a second sub-air outlet 212 at the other end. The third sub-pipe 223 is connected to the air source 300 at one end, and has a third sub-air outlet 213 at the other end. This correspondence between the sub-pipes and sub-air outlets 210 facilitates zoned control of parameters such as temperature and flow rate of the cooling gas on the surface of the object to be supported.

[0040] In one optional embodiment of this application, such as Figure 1 As shown, along the airflow direction, the cross-sectional areas of the first sub-pipe 221, the second sub-pipe 222, and the third sub-pipe 223 gradually increase, so that the cooling gas provided by the air source 300 can be evenly transmitted to the corresponding sub-air outlet 210 along the above-mentioned sub-pipes, ensuring that the airflow at the air outlet 210 is evenly distributed and avoiding local jet phenomenon.

[0041] like Figure 1 As shown, the air blowing device 200 may further include a temperature controller 230. The temperature controller 230 may be located between the first sub-pipe 221 and the air source 300 to regulate the temperature of the cooling gas blown by the first sub-blowing port 211; and / or, the temperature controller 230 may be located between the second sub-pipe 222 and the air source 300 to regulate the temperature of the cooling gas blown by the second sub-blowing port 212; and / or, the temperature controller 230 may be located between the third sub-pipe 223 and the air source 300 to regulate the temperature of the cooling gas blown by the third sub-blowing port 213. It should be noted that the temperature controller 230 may be located inside the corresponding sub-pipe, or the temperature controller 230 itself may have an inlet and an outlet, which are respectively connected to the air source 300 and the corresponding sub-pipe. When the cooling gas passes through the temperature controller 230, it may be heated or cooled by the temperature controller 230 to achieve temperature regulation of the cooling gas.

[0042] By setting the temperature controller 230 at the aforementioned locations, the temperature of the cooling gas blown by the first sub-air outlet 211, the second sub-air outlet 212, and the third sub-air outlet 213 can be flexibly adjusted according to the temperature distribution of different areas of the object to be supported, thereby achieving zoned temperature control of the surface of the object to be supported. For example, if the temperature is high in the area of ​​the object to be supported opposite to the first area 121, the temperature of the cooling gas blown by the first sub-air outlet 211 can be correspondingly reduced to achieve rapid cooling; if the temperature is high in the area of ​​the object to be supported opposite to the second area 122, the temperature of the cooling gas blown by the second sub-air outlet 212 can be correspondingly reduced to achieve rapid cooling; similarly, if the temperature is high in the area of ​​the object to be supported opposite to the third area 123, the temperature of the cooling gas blown by the third sub-air outlet 213 can be correspondingly reduced to achieve rapid cooling. The adjustment logic can also be applied to other areas of the object to be supported, and will not be elaborated further in this embodiment.

[0043] Regarding the temperature zone control method for the surface of the object to be supported, it can also be achieved by controlling the flow rate of the cooling gas blown by the first sub-air blowing port 211, the second sub-air blowing port 212, and the third sub-air blowing port 213. Specifically, the blowing device 200 may also include a flow controller 240, which may be set between the first sub-pipe 221 and the air source 300 to adjust the flow rate of the cooling gas blown by the first sub-air blowing port 211; and / or, the flow controller 240 may be set between the second sub-pipe 222 and the air source 300 to adjust the flow rate of the cooling gas blown by the second sub-air blowing port 212; and / or, the flow controller 240 may be set between the third sub-pipe 223 and the air source 300 to adjust the flow rate of the cooling gas blown by the third sub-air blowing port 213. It should be noted that the flow controller 240 can be installed inside the corresponding sub-pipeline, or the flow controller 240 itself has an inlet end and an outlet end, which are respectively connected to the air source 300 and the corresponding sub-pipeline. When the cooling gas passes through the flow controller 240, the flow rate can be regulated.

[0044] By setting the flow controller 240 at the aforementioned locations, the flow rates of the cooling gas blown by the first sub-air outlet 211, the second sub-air outlet 212, and the third sub-air outlet 213 can be flexibly adjusted according to the temperature distribution of different areas of the object to be supported, thereby achieving temperature zone control of the surface of the object to be supported. For example, if the temperature is high in the area of ​​the object to be supported opposite to the first area 121, the flow rate of the cooling gas blown by the first sub-air outlet 211 can be increased to achieve rapid cooling; if the temperature is high in the area of ​​the object to be supported opposite to the second area 122, the flow rate of the cooling gas blown by the second sub-air outlet 212 can be increased to achieve rapid cooling; similarly, if the temperature is high in the area of ​​the object to be supported opposite to the third area 123, the flow rate of the cooling gas blown by the third sub-air outlet 213 can be increased to achieve rapid cooling. The adjustment logic can also be applied to other areas of the object to be supported, and will not be elaborated further in this embodiment.

[0045] like Figure 1 As shown, the film loading slot 120 is divided into a first region 121, a second region 122, and a third region 123. The first region 121, the second region 122, and the third region 123 correspond to different areas of the surface of the object to be loaded. A temperature sensor 250 can be installed in at least one of the first region 121, the second region 122, and the third region 123 to detect the temperature of different areas of the surface of the object to be loaded. The temperature data detected by the temperature sensor 250 can be used as the basis for adjusting the aforementioned temperature controller 230 and flow controller 240. For example, since the temperature difference in the central area of ​​the object to be loaded is more significant, three temperature sensors 250 can be installed in the first region 121, with the three temperature sensors 250 arranged radially spaced along the film loading slot 120. One temperature sensor 250 can be installed in each of the second region 122 and the third region 123.

[0046] It should be added that the robotic arm disclosed in this application embodiment may also include a control module, which can be electrically connected to the temperature sensor 250, the temperature controller 230, and the flow controller 240 respectively to form a feedback adjustment mechanism. For example, when the temperature sensor 250 detects a high temperature on the surface of the object to be carried corresponding to the first region 121, the control module can control the temperature controller 230 and / or the flow controller 240 corresponding to the first sub-air outlet 211 to perform corresponding actions based on the temperature data detected by the temperature sensor 250, thereby achieving rapid feedback adjustment.

[0047] Please refer to Figure 1 and Figure 2This application also discloses a semiconductor transmission device, which may include a robotic arm and the aforementioned robotic hand. The robotic arm is connected to the robotic hand and is used to drive the robotic hand to move in order to realize the transfer of the object to be carried.

[0048] As described above, the robotic arm disclosed in this application improves upon related technologies by providing an air blowing device 200 on the robotic arm body 100. When the object to be carried is placed on the support surface 111, the air blowing port 210 of the air blowing device 200 can form a negative pressure area for adsorbing the object in the gas flow space below the object. By utilizing the pressure difference on both sides of the object, the object can be pressed tightly onto the support surface 111, thereby increasing the friction between the object and the robotic arm body 100. Furthermore, the cooling gas blown by the air blowing port 210 can also cool the object, further increasing the friction between the object and the robotic arm body 100. This ensures that even when the robotic arm operates at a large acceleration, the object is less likely to slip or fall off, thereby improving the transport efficiency and production capacity of the object.

[0049] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different technical features between the various embodiments are not contradictory, they can be combined to form more specific embodiments. For the sake of brevity, they will not be described in detail here.

[0050] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A robot, characterized in that The robot body (100) and the blowing device (200) are included. The robot body (100) is provided with a supporting surface (111) for supporting a to-be-carried object and a gas flow-through space below the to-be-carried object supported on the supporting surface (111). The blowing device (200) is arranged on the robot body (100) and has a blowing port (210) for blowing cooling gas in a direction parallel to the supporting surface (111) to the gas flow-through space to form a negative pressure area for adsorbing the to-be-carried object in the gas flow-through space. The robot body (100) includes a table (110) in an arc structure, the supporting surface (111) is the top surface of the table (110), the area defined by the table (110) forms the gas flow-through space, and the blowing port (210) is arranged on the inner side surface of the table (110). The robot body (100) is provided with a film placing groove (120), the table (110) is arranged on the groove bottom of the film placing groove (120), the table (110) is lower than the groove side wall of the film placing groove (120) in the depth direction of the film placing groove (120), and the groove side wall of the film placing groove (120) is used for limiting cooperation with the side surface of the to-be-carried object. The gas flow-through space is located between the groove bottom of the film placing groove (120) and the to-be-carried object, the arc structure is in a C shape, and the opening of the C shape is located on the side of the robot body (100) away from the blowing port (210).

2. The robot according to claim 1, characterized in that The film placing groove (120) has a first area (121), a second area (122) and a third area (123), the second area (122) and the third area (123) are respectively located on the two sides of the first area (121). The blowing port (210) includes a first sub-blowing port (211), a second sub-blowing port (212) and a third sub-blowing port (213), the first sub-blowing port (211), the second sub-blowing port (212) and the third sub-blowing port (213) are respectively arranged on the inner side surface of the table (110) facing the opening of the C shape, the second sub-blowing port (212) and the third sub-blowing port (213) are respectively located on the two sides of the first sub-blowing port (211), the first sub-blowing port (211) faces the first area (121), the second sub-blowing port (212) faces the second area (122), and the third sub-blowing port (213) faces the third area (123).

3. The robot of claim 2, wherein, The flow-through area of the second sub-blowing port (212) and the flow-through area of the third sub-blowing port (213) are both smaller than the flow-through area of the first sub-blowing port (211).

4. The robot of claim 2, wherein, The blowing device (200) comprises an air inlet pipeline (220) arranged in the interior of the manipulator body (100), an air inlet end of the air inlet pipeline (220) is used for communicating with an air source (300), and an air outlet end of the air inlet pipeline (220) is provided with the blowing port (210).

5. The robot of claim 4, wherein, The air inlet pipeline (220) comprises a first sub-pipeline (221), a second sub-pipeline (222) and a third sub-pipeline (223), and the first sub-pipeline (221), the second sub-pipeline (222) and the third sub-pipeline (223) are all arranged in the interior of the manipulator body (100). One end of the first sub-pipeline (221) is used for communicating with the air source (300), the other end of the first sub-pipeline (221) is provided with the first sub-blowing port (211), one end of the second sub-pipeline (222) is used for communicating with the air source (300), the other end of the second sub-pipeline (222) is provided with the second sub-blowing port (212), one end of the third sub-pipeline (223) is used for communicating with the air source (300), and the other end of the third sub-pipeline (223) is provided with the third sub-blowing port (213).

6. The robot of claim 5, wherein, In the direction of air flow, the cross-sectional areas of the first sub-pipeline (221), the second sub-pipeline (222) and the third sub-pipeline (223) gradually increase.

7. The robot of claim 5, wherein, The blowing device (200) further comprises a temperature controller (230), and at least one of the first sub-pipeline (221) and the air source (300), the second sub-pipeline (222) and the air source (300) and the third sub-pipeline (223) and the air source (300) is provided with the temperature controller (230).

8. The robot of claim 5, wherein, The blowing device (200) further comprises a flow controller (240), and at least one of the first sub-pipeline (221) and the air source (300), the second sub-pipeline (222) and the air source (300) and the third sub-pipeline (223) and the air source (300) is provided with the flow controller (240).

9. The robot of claim 2, wherein, The blowing device (200) further comprises a temperature sensor (250), and at least one of the first region (121), the second region (122) and the third region (123) is provided with the temperature sensor (250).

10. A semiconductor transmission device, characterized by comprising: The manipulator comprises a manipulator arm and the manipulator connected with the manipulator arm, and the manipulator arm is used for driving the manipulator to move.

Images