On-demand stiffness adjustable system for pedestrian protection

Abstract

The invention relates to an on-demand adjustable stiffness system for pedestrian protection. The present application also relates to a vehicle comprising a first vehicle component having a shape memory polymer (SMP) comprising a first elastic modulus in a first state and a second elastic modulus in a second state, the second elastic modulus being less than the first elastic modulus, a heating element is selectively movable from an off-state to an on-state to supply heat to the SMP, the SMP moving from a first state to a second state in response to the heating element moving from the off-state to the on-state, and at least one sensor, the at least one sensor is attached to the vehicle and is configured to generate an electrical signal in response to a force of a predetermined magnitude being applied to the vehicle to move the heating element from the closed state to the open state.

Description

[0001] introduction

[0002] The information provided in this section is for the purpose of generally presenting the context of the present disclosure. The work of the presently named inventors, to the extent described in this section and in aspects of the description that may not otherwise be identified as prior art at the time of filing, is neither explicitly nor implicitly admitted to be prior art against the present disclosure. Technical Field

[0003] The present disclosure is generally directed to a system for on-demand adjustable stiffness of components under the hood or behind the front fascia (bumper cover) of a vehicle to meet safety-related regulatory and consumer metric requirements, and more specifically, to protect pedestrians during a collision with a moving vehicle. The present disclosure is not limited to the following exemplary configurations in its concepts or methods, but can be extended to other automotive or non-automotive applications where on-demand changes in component stiffness are required in real time. Background Art

[0004] Vehicle components are designed to meet cross-functional, often conflicting requirements. In some cases, these components may need to deform in a predetermined manner to meet regulatory and consumer safety requirements. For example, a component may need to deform to meet regulatory and consumer safety requirements for pedestrian protection or occupant safety while maintaining its material and geometric stiffness to meet durability, modal, and other cross-functional requirements. In other cases, an interior component beneath an otherwise deformable component (such as an exterior body panel) may maintain its stiffness and geometry when in contact with an object. For example, while a vehicle hood may deform in response to a head impact event, the underlying vehicle components are typically non-deformable when subjected to such an impact event. Summary of the invention

[0005] In one configuration, a vehicle is provided that includes a first vehicle component having a shape memory polymer (SMP), the SMP including a first elastic modulus in a first state and a second elastic modulus in a second state, the second elastic modulus being less than the first elastic modulus, a heating element selectively movable from an OFF state to an ON state to supply heat to the SMP, the SMP moving from the first state to the second state in response to the heating element moving from the OFF state to the ON state, and at least one sensor attached to the vehicle and configured to generate an electrical signal in response to a predetermined amount of force being applied to the vehicle to cause the heating element to move from the OFF state to the ON state.

[0006] The vehicle may include one or more of the following optional features. For example, at least one sensor may be a piezoelectric sensor. Additionally or alternatively, at least one sensor may be disposed proximate a front fascia of the vehicle.

[0007] The first vehicle component may be located beneath a hood panel of the vehicle.

[0008] In one configuration, the heating element can be a wire. The wire can be embedded in the SMP. In addition, the wire can be in electrical communication with a power source of the vehicle, and when moving from the off state to the on state, the wire receives current from the power source.

[0009] The switch may be in electrical communication with at least one sensor. The switch may move from an open state to a closed state in response to at least one sensor generating an electrical signal to supply current to the heating element. Additionally or alternatively, the heating element may be a wire embedded within the SMP.

[0010] In another configuration, a vehicle includes a first component having a first portion formed of a first material and a second portion formed of a shape memory polymer (SMP), the SMP having a first elastic modulus in a first state and a second elastic modulus in a second state, the second elastic modulus being less than the first elastic modulus, a wire embedded in the second portion and selectively receiving an electric current in an energized state to move the SMP from the first state to the second state, and at least one sensor attached to the vehicle and configured to generate an electrical signal in response to a predetermined magnitude of force being applied to the vehicle to move the wire to the energized state.

[0011] The vehicle may include one or more of the following optional features. For example, at least one sensor may be a piezoelectric sensor. Additionally or alternatively, at least one sensor may be disposed proximate a front fascia of the vehicle.

[0012] The first vehicle component may be located beneath a hood panel of the vehicle.

[0013] In one configuration, the wire can be in electrical communication with a power source of the vehicle, and when in an energized state, the wire receives current from the power source. The switch can be in electrical communication with at least one sensor. In response to at least one sensor generating an electrical signal to supply current to the wire, the switch can move from an open state to a closed state.

[0014] In yet another configuration, a vehicle includes a first component having a first portion formed from a first material and a second portion formed from a shape memory polymer (SMP), the shape memory polymer having a first elastic modulus in a first state and a second elastic modulus in a second state, the second elastic modulus being less than the first elastic modulus, and at least one piezoelectric sensor is attached to the vehicle and is configured to generate an electrical signal in response to a predetermined magnitude of force being applied to the vehicle to cause the SMP to move from the first state to the second state.

[0015] The vehicle may include one or more of the following optional features. For example, the heating element may be selectively moved from an off state to an on state to supply heat to the SMP, the SMP moving from a first state to a second state in response to the heating element moving from the off state to the on state. The switch may be in electrical communication with at least one piezoelectric sensor, the switch being configured to move the heating element from an off state to an on state in response to the at least one piezoelectric sensor generating an electrical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are for illustrative purposes only of selected configurations and are not intended to limit the scope of the present disclosure.

[0017] Figure 1 is a perspective view of a vehicle according to the principles of the present disclosure;

[0018] Figure 2 yes Figure 1 A partially exploded view of a vehicle of , showing a hood, a front trunk (frunk), a hood closure panel, and a sightshield having shape memory polymers (SMP) at discrete locations;

[0019] Figure 3 yes Figure 1 a partially exploded view of a vehicle showing a hood, a front trunk, a hood closure panel, and a view hood in a softened state at one or more locations of the SMP;

[0020] Figure 4 is a functional block diagram showing a piezoelectric sensor in communication with a logic board that selectively allows current to flow into the SMP in response to an electrical signal from the piezoelectric sensor;

[0021] Figure 5 It is relative to the crash test dummy in the first impact position. Figure 1 a partial side view of a vehicle; and

[0022] Figure 6 is relative to the crash test dummy in the second impact position Figure 1 A partial side view of a vehicle.

[0023] Corresponding reference characters indicate corresponding parts throughout the several views of the drawings. DETAILED DESCRIPTION

[0024] Example configurations will now be described more fully with reference to the accompanying drawings. Example configurations are provided so that the present disclosure will be thorough and will fully convey the scope of the present disclosure to those of ordinary skill in the art. Specific details, such as examples of specific components, devices, and methods, are set forth to provide a thorough understanding of the configurations of the present disclosure. It will be apparent to those of ordinary skill in the art that specific details need not be employed, that example configurations may be implemented in many different forms, and that the specific details and example configurations should not be construed as limiting the scope of the present disclosure.

[0025] Special References Figure 1 and Figure 4 , a vehicle 10 is provided, the vehicle 10 including a tunable stiffness system (TSS) 12 ( Figure 4 ). As will be described in more detail below, the TSS 12 responds to pedestrian impact events in real time by softening the vehicle structure at specific locations of the vehicle 10 to allow the vehicle structure to dissipate the forces associated with the vehicle 10 contacting a pedestrian or other vulnerable road user (VRU) in a controlled manner. Specifically, the TSS 12 reduces the head injury criterion (HIC) by enabling the first peak on the deceleration curve (caused by the pedestrian's head or VRU contacting the vehicle 10) to be reached within three (3) milliseconds of the sudden drop after the impact. The TSS 12 achieves the aforementioned reduction in HIC by softening the vehicle structure in real time in the area of ​​impact with the pedestrian's or VRU's head.

[0026] The TSS 12 includes a series of sensors 14, switches 16, and shape memory polymers (SMPs) 18 located at various areas of the vehicle 10. As will be described, the sensors 14 are configured to detect a pedestrian impact event, which in turn causes the switches 16 to allow current to flow into the SMP 18. The SMP 18 softens in response to the applied current, thereby allowing the SMP 18 to deform more easily when subjected to the forces associated with the impact event.

[0027] The sensor 14 may be a piezoelectric sensor 14 that measures changes in pressure, acceleration, temperature, strain, or force using the piezoelectric effect by converting the aforementioned changes into electric charge. In the present application, the piezoelectric sensor 14 generates an electrical (voltage) signal in response to the strain field. Specifically, when the piezoelectric sensor 14 detects an impact event, the sensor 14 generates an electrical signal. In one configuration, when an impact event is detected, the piezoelectric sensor 14 generates an electrical signal in less than ten (10) milliseconds. When the vehicle 10 contacts a pedestrian or other VRU (such as a cyclist), an impact event may occur. Alternatively, when the vehicle contacts different movable or immovable objects, an impact event may occur. No matter what the vehicle 10 contacts, the piezoelectric sensor 14 is configured to detect the impact and generate an electrical signal in response to the event.

[0028] The switch 16 communicates with the piezoelectric sensor 14 and may be a logic board or printed circuit board (PCB) that causes current to flow into the SMP 18 via a wire 19 embedded within the SMP 18 in response to the electrical signal(s) from the piezoelectric sensor(s) 14. The current directed into the SMP 18 may be supplied to the SMP 18 via the switch 16, which allows current from an onboard power source (e.g., a vehicle battery 21) to flow into the SMP 18. In doing so, the current softens the SMP 18.

[0029] The SMPs 18 may be located at various locations on the vehicle 10 where local softening of the vehicle structure is desired to reduce the HIC value if the vehicle 10 strikes a pedestrian or other VRU. Specifically, the SMPs 18 may be located at locations where a pedestrian's head may strike the vehicle 10 to allow those areas of the vehicle 10 to more easily deform and absorb the energy associated with the applied load. The SMPs 18 may be distributed at multiple locations as desired.

[0030] Special References Figure 1 and Figure 2, the piezoelectric sensors 14 are shown as being located at five (5) locations behind the front fascia 20 of the vehicle 10. Although the piezoelectric sensors 14 are described and shown as being located at five (5) locations behind the front fascia 20, there may be more or fewer piezoelectric sensors 14 behind the front fascia 20. Regardless of the number of piezoelectric sensors 14, the sensors 14 are positioned at equal distances from each other along the length of the front fascia 20 and are positioned in the height direction (i.e., the Z direction) such that when a pedestrian stands near the front fascia 20 of the vehicle 10, the sensors 14 are proximate to the legs of the pedestrian. The sensors 14 may be positioned in the Z direction such that the sensors 14 are located near the knees of a 50th percentile male crash test dummy. Although the positions of the piezoelectric sensors 14 in the Z direction are described with respect to the 50th percentile male crash test dummy, the piezoelectric sensors 14 may be positioned at any height in the Z direction that may first impact a pedestrian or other VRU based on the front end architecture and shape of the vehicle 10. Although the piezoelectric sensor 14 is described and shown below and in the figures as being disposed within the front fascia 20 of the vehicle 10, the sensor 14 may additionally or alternatively be located at any location of the vehicle 10 where an occupant, pedestrian, or other VRU may impact the vehicle structure and may therefore benefit from softening of the vehicle structure. For example, the piezoelectric sensor 14 may be used within the passenger compartment 22 of the vehicle 10 at a location where an occupant may contact the vehicle structure. For example, the sensor may be placed near or within an instrument panel (IP) such that one or more sensors 14 are positioned to detect an impact event of the IP. In this configuration, the IP may include a support structure that includes the SMP 18 to soften the IP, thereby reducing HIC during an impact event.

[0031] Continue to refer Figure 1 and Figure 2 , the SMP 18 is shown as being implemented in various vehicle structures located below a hood panel 24 of the vehicle 10. Specifically, the vehicle 10 of the present application can be an electric vehicle (EV) such that the vehicle 10 is powered by one or more electric motors (not shown). Therefore, there is no conventional internal combustion engine (ICE) that is typically located below the hood panel 24. Instead, a front trunk 26 (i.e., a combination of the terms "front" and "trunk") is provided where the ICE would be located in an effort to provide additional storage space for the vehicle 10. Although the TSS 12 will be described and shown below as being used in conjunction with an EV, the TSS 12 may be used in conjunction with vehicle structures associated with ICE-powered vehicles and / or with a hybrid electric vehicle (HEV) that includes an ICE and one or more electric motors.

[0032] like Figure 2As shown, the front trunk 26 is generally disposed below the hood panel 24 and includes a series of walls 28 that cooperate with a bottom panel 30 to define a storage space 32. The front trunk 26 can be sealed by a hood closure panel 34 that is fixed to move with the hood panel 24. The hood closure panel 34 includes a top panel 36 that is opposite the hood panel 24 and a series of walls 38 that cooperate with the top panel 36 to define a portion of the storage space 32 when the hood panel 24 is in a closed position and the hood closure panel 34 is in contact with the front trunk 26. Finally, a view hood 40 can surround the front trunk 26 when the front trunk 26 is installed in the vehicle 10. Although the TSS 12 will be described and shown in conjunction with the front trunk 26, the hood closure panel 34, and the view hood 40, the TSS 12 can be used with any component below the hood panel 24, such as a headlight (not shown).

[0033] Each of the front trunk 26, the hood closure panel 34, and the view hood 40 may include SMPs 18 at discrete locations. For example, the front trunk 26 may include SMPs 18 at discrete locations on the wall 28. Similarly, the hood closure panel 34 may include SMPs 18 at discrete locations on the wall 38, and the view hood may include SMPs 18 at one or more side walls 42 and the rear wall 44. Figure 2 As shown, the SMP 18 may include a substantially uniform height, or alternatively, may vary in height along a particular component 26, 34, 40. For example, the SMP 18 may include a substantially uniform height relative to an SMP 18 that extends along and forms a portion of the wall 28 of the front trunk 26. The SMP 18 may include a variable height (i.e., a non-uniform height) relative to an SMP 18 that extends along and forms a portion of the side wall 42 of the view hood 40.

[0034] The specific position and height of the SMP 18 in each of the aforementioned components 26, 34, 40 can be determined by using computer-aided engineering (CAE) software to simulate the performance of various components 26, 34, 40 in response to the applied loads associated with a head impact event. The CAE analysis will identify where the SMP 18 should be located within a specific component (i.e., position, height, and / or uniform or non-uniform height) in an attempt to optimize the ability of the component to soften and reduce HIC. Therefore, the position, height, and configuration of the SMP 18 for each component 26, 34, 40 can be customized for the specific component 26, 34, 40 and the vehicle 10 in which the component 26, 34, 40 is installed. In addition, the CAE analysis can take into account the surrounding components when running the simulation to optimize the performance of the entire vehicle structure at a specific location. In this example, the CAE analysis can analyze and run the simulation to determine the collective ability of the front trunk 26, the hood closure panel 34, and the visor 40 to reduce HIC by softening at discrete locations of each component 26, 34, 40 in response to a head impact event. In short, the CAE software and simulation will dictate the areas in the component that need to be softer to meet pedestrian and VRU head impact requirements. Local areas of the components 26, 34, 40 can be replaced with SMPs 18 based on CAE analysis to determine the exact location and amount of SMPs 18 to optimize the performance of the specific components 26, 34, 40 and the system as a whole in response to the loads associated with a head impact event.

[0035] The SMP 18 can be integrally formed with the aforementioned components 26, 34, 40 by utilizing dual-shot materials. Specifically, the SMP 18 can be compression molded with other polymers into the shapes shown in the front trunk 26, the hood closure panel 34, and the hood 40. By molding the SMP 18 at the locations specified by the CAE analysis, the aforementioned components 26, 34, 40 can be softened and customized to reduce HIC in the event that the vehicle 10 contacts a pedestrian or other VRU. When molding the components 26, 34, 40, the wire 19 can be embedded within the SMP 18 to allow the wire 19 to quickly heat the SMP 18 from the inside during use.

[0036] The SMP 18 associated with the aforementioned components 26, 34, 40 can be in electrical communication with an onboard power source such as a vehicle battery 21. Specifically, when the switch 16 moves from an open state to a closed state, the SMP 18 can selectively receive current from the battery 21. As will be described in more detail below, the switch 16 can move from an open state to a closed state in response to the piezoelectric sensor 14 generating an electrical signal. Figure 4As shown, the switch 16 is functionally disposed between the piezoelectric sensors 14 and the SMP 18. When one or more of the piezoelectric sensors 14 generates an electrical signal in response to an impact event, the electrical signal causes the switch 16 to move from an open state to a closed state to allow current to flow from the battery 21 to the SMP 18. The flow of current from the battery 21 to the SMP 18 causes the SMP 18 to soften, thereby allowing the components 26, 34, 40 to deform more easily in response to an impact or downward force (i.e., in a direction substantially normal to the outer surface 48 of the hood panel 24).

[0037] Due to the material properties of SMP 18, SMP 18 softens in response to the applied current. For example, SMP 18 is a so-called smart polymer material that, when heated, transitions from a normal state having a first stiffness to a softened state having a second stiffness that is less than 100 times the first stiffness. In the present application, the current supplied by battery 21 through switch 16 causes the current to flow within SMP 18 via wire 19, and in doing so, heats SMP 18. When SMP 18 is heated, SMP 18 undergoes a phase change, causing the material properties of SMP 18 (i.e., elastic modulus (E)) to change. In this example, the elastic modulus of SMP 18 decreases, thereby reducing the ability of SMP 18 to resist deformation when subjected to a load. Thus, when a load is applied to the hood panel 24 and the forces associated with the applied load are transmitted to one or more of the front trunk 26, the hood closure panel 34, and the hood 40, the location of the SMP 18 within the aforementioned components 26, 34, 40 will soften, thereby reducing the ability of the components 26, 34, 40 to resist deformation. The location and amount of the SMP 18 associated with each component 26, 34, 40 and the applied current can be controlled in a desired manner to obtain an optimal solution.

[0038] When the switch 16 is returned to the open state so that current is no longer supplied from the battery 21 to the components 26, 34, 40, and the SMP 18 is allowed to cool, the SMP 18 returns to its elastic modulus (E). In doing so, the SMP 18 returns to its original stiffness. In addition, when current is no longer flowing through the SMP 18 and the SMP 18 is allowed to cool, the SMP 18 will return to its original shape. Therefore, in the case where the switch 16 is moved to the closed state and current is supplied to the SMP 18 but the vehicle 10 has not experienced an impact event, when the switch 16 is moved to the open state and the SMP 18 is allowed to cool, the SMP 18 will return to its original stiffness (i.e., elastic modulus (E)) and its original shape.

[0039] Specific reference Figure 1 , 56, the operation of the TSS 12 will be described in detail. During operation of the vehicle 10, the piezoelectric sensor 14 continuously monitors the applied load of the front fascia 20 of the vehicle 10 for changes that indicate an impact event. Specifically, the piezoelectric sensor 14 continuously monitors the front fascia 14 for a load of a predetermined magnitude. The load applied to the front fascia 20 allows the sensor 14 to identify an impact event in which a load is applied to one or more sensors 14 due to an impact of the front fascia 20 with a stationary or non-stationary object.

[0040] In one configuration, the sensors 14 may be tuned so that once a threshold load is applied thereto, the sensors 14 identify an impact event. In one configuration, the threshold load may be associated with the vehicle 10 contacting a particular crash test dummy at or above a predetermined speed. For example, the threshold load may be associated with the vehicle 10 contacting a fifth percentile female crash test dummy 50 at a speed equal to or greater than five (5) miles per hour. When a load equal to or greater than the predetermined load is applied to one or more of the sensors 14, the sensors 14 may be tuned to generate an electrical (voltage) signal.

[0041] When one or more of the sensors 14 detect a load equal to or greater than a predetermined load, an electrical signal generated by the one or more sensors 14 causes the switch 16 to move from an open state to a closed state. In doing so, and as described above, the switch 16 allows current to flow from the battery 21 to the SMP 18 of the front trunk 26, the hood closure panel 34, and the visor 40. The current causes the SMP 18 of the aforementioned components 26, 34, 40 to soften (i.e., have a lower elastic modulus (E)), which in turn allows the components 26, 34, 40—at the location of the SMP 18—to deform more easily in a controlled manner.

[0042] Continue to refer Figure 5 and Figure 6 , a change in the load detected by the sensor 14 may be achieved due to a change in the strain field of one or more of the sensors 14. Specifically, when the vehicle 10 initially contacts the fifth percentile crash test dummy 50 ( Figure 5), one or more sensors 14 immediately detect the change in the strain field of the particular sensor 14. The change in strain field causes the sensor 14 to generate an electrical signal, which in turn moves the switch 16 from an open state to a closed state. When the switch 16 moves from an open state to a closed state, current from the battery 21 is allowed to flow into the SMP 18. It should be noted that the detection of the load change upon initial impact with the crash test dummy 50 occurs in less than ten (10) milliseconds. Therefore, within ten (10) milliseconds, the sensor 14 detects the impact event and moves the switch 16 from an open state to a closed state. In the closed state, the switch 16 will supply current to the SMP 18 for a predetermined length of time, which is based on how much change in elasticity (E) and temperature is required.

[0043] When current flows into the front trunk 26, hood closure panel 34, and visor 40 at the SMP 18 of each component 26, 34, 40, the SMP 18 associated with each component 26, 34, 40 is heated and thus softened. Figure 6 The illustrated position is such that the SMP 18 is already heated and in a softened state when the head of the dummy 50 contacts the outer surface 48 of the hood panel 24. Therefore, as the head of the dummy 50 deforms the hood panel 24, the underlying components 26, 34, 40 are softened and the energy associated with the dummy's head contacting the hood panel 24 is absorbed more quickly in a controlled manner. As a result, the dummy 50 experiences a lower HIC.

[0044] In the event of an impact event where one or more of the sensors 14 detects a load change that exceeds a threshold load but does not require softening of the components 26, 34, 40 via the SMP 18 (i.e., if the vehicle 10 contacts a pole or other stationary object rather than a pedestrian or other VRU), the switch 16 will still move from the open state to the closed state to heat the SMP 18. However, if no force is applied to the hood panel 24 in a direction substantially normal to the outer surface 48 of the hood panel 24, the SMP 18 will not deform. Therefore, when the switch 16 returns to the open state and current is no longer applied to the SMP 18, the SMP 18 is allowed to cool and return to its original state. This situation may be referred to as a false positive incident because softening of the SMP 18 is not required to absorb the forces associated with contact between the pedestrian or other VRU and the hood panel 24 of the vehicle 10. When a false positive incident occurs, once cooled due to the nature of the SMP 18, the SMP 18 and therefore the associated components 26, 34, 40 automatically return to their original state. No further maintenance or repair is required to return the SMP 18 or any associated components 26, 34, 40 to their original condition.

[0045] As described, the TSS 12 utilizes the SMP 18 within the vehicle components (i.e., components 26, 34, 40 in the aforementioned example) to provide the vehicle 10 with an on-demand response to the vehicle 10 striking a pedestrian or VRU, while allowing the components to meet normal use requirements during the use of the vehicle 10. The TSS 12 supplies current to the SMP 18 to heat the SMP 18, and thus soften the SMP 18 in response to the vehicle 10 striking the pedestrian or VRU. In doing so, the TSS 12 reduces the HIC value in an effort to protect the pedestrian or VRU. The components of the vehicle 10 provided with the SMP 18, the exact locations of the SMP 18, and the amount of the SMP 18 at each location of each component can be determined by using CAE analysis. Therefore, the TSS 12 can be customized for a specific vehicle 10.

[0046] The terms used herein are only used for the purpose of describing specific exemplary configurations and are not intended to be limiting. As used herein, the singular articles "a", "an" and "the" may also be intended to include plural forms unless the context clearly indicates otherwise. The terms "comprises", "comprising", "including" and "having" are inclusive and therefore specify the presence of features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts and / or groups thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0047] When an element or layer is referred to as being "on another element or layer," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly on, directly engaged with, connected to, attached to, or coupled to another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on another element or layer," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more associated listed items.

[0048] The terms "first", "second", "third", etc. can be used here to describe various elements, components, regions, layers and / or parts. These elements, components, regions, layers and / or parts should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or part from another region, layer or part. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence. Therefore, without departing from the teaching of the example configuration, the first element, component, region, layer or part discussed below can be referred to as the second element, component, region, layer or part.

[0049] In this application, including the definitions below, the term "module" may be replaced with the term "circuit". The term "module" may refer to, be part of, or include: an application specific integrated circuit (ASIC); a digital, analog, or mixed analog / digital discrete circuit; a digital, analog, or mixed analog / digital integrated circuit; a combinational logic circuit; a field programmable gate array (FPGA); a processor (shared, dedicated, or grouped) that executes code; a processor (shared, dedicated, or grouped) that stores code executed by a memory; other suitable hardware components that provide the described functionality; or a combination of some or all of the above, such as in a system on a chip.

[0050] The term "code" as used above may include software, firmware and / or microcode, and may refer to a program, a routine, a function, a class and / or an object. The term "shared processor" covers a single processor that executes some or all codes from multiple modules. The term "group processor" covers a processor that executes some or all codes from one or more modules in combination with an additional processor. The term "shared memory" covers a single memory that stores some or all codes from multiple modules. The term "group memory" includes a memory that stores some or all codes from one or more modules in combination with an additional memory. The term "memory" may be a subset of the term "computer-readable medium". The term "computer-readable medium" does not include transient electrical signals and electromagnetic signals propagated through the medium, and therefore can be considered to be tangible and non-transient memory. Non-limiting examples of non-temporary memory include tangible computer-readable media, which include non-volatile memory, magnetic memory, and optical memory.

[0051] The apparatus and methods described in this application may be implemented in part or in whole by one or more computer programs executed by one or more processors. The computer program includes processor executable instructions stored on at least one non-transitory tangible computer readable medium. The computer program may also include and / or rely on stored data.

[0052] A software application (i.e., software resource) may refer to computer software that enables a computing device to perform tasks. In some examples, a software application may be referred to as an "application," "app," or "program." Example applications include, but are not limited to, system diagnostic applications, system management applications, system maintenance applications, word processing applications, spreadsheet applications, messaging applications, media streaming applications, social networking applications, and gaming applications.

[0053] Non-transitory memory can be a physical device used to temporarily or permanently store programs (e.g., sequences of instructions) or data (e.g., program state information) for use by a computing device. Non-transitory memory can be volatile and / or non-volatile addressable semiconductor memory. Examples of non-volatile memory include, but are not limited to, flash memory and read-only memory (ROM) / programmable read-only memory (PROM) / erasable programmable read-only memory (EPROM) / electrically erasable programmable read-only memory (EEPROM) (e.g., commonly used for firmware, such as bootloaders). Examples of volatile memory include, but are not limited to, random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), phase change memory (PCM), and disk or tape.

[0054] These computer programs (also referred to as programs, software, software applications, or code) include machine instructions for a programmable processor and may be implemented in high-level procedural and / or object-oriented programming languages ​​and / or assembly / machine languages. As used herein, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, non-transitory computer-readable medium, apparatus, and / or device (e.g., disk, optical disk, processor, programmable logic device (PLD)) for providing machine instructions and / or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to any signal for providing machine instructions and / or data to a programmable processor.

[0055] Various implementations of the systems and techniques described herein can be realized in digital electronic and / or optical circuits, integrated circuits, specially designed ASICs (application specific integrated circuits), computer hardware, firmware, software, and / or combinations thereof. These various implementations may include implementations in one or more computer programs executable and / or interpretable on a programmable system that includes at least one programmable processor, which may be special-purpose or general-purpose, coupled to receive data and instructions from a storage system, at least one input device, and at least one output device, and to send data and instructions to the storage system, at least one input device, and at least one output device.

[0056] The process and logic flow described in this specification can be performed by one or more programmable processors (also referred to as data processing hardware), which execute one or more computer programs to perform functions by operating on input data and generating output. The process and logic flow can also be performed by a dedicated logic circuit (e.g., FPGA (field programmable gate array) or ASIC (application-specific integrated circuit)). As an example, a processor suitable for executing a computer program includes both general-purpose and special-purpose microprocessors, and any one or more processors of any type of digital computer. Typically, the processor will receive instructions and data from a read-only memory or a random access memory or both. The basic elements of a computer are a processor for executing instructions and one or more memory devices for storing instructions and data. Typically, a computer will also include one or more mass storage devices (e.g., magnetic disks, magneto-optical disks, or optical disks) for storing data, or be operably connected to receive data from it or transmit data to it or both. However, a computer does not need to have such a device. Computer-readable media suitable for storing computer program instructions and data include all forms of nonvolatile memory, media, and memory devices, including, for example, semiconductor memory devices, such as EPROM, EEPROM, and flash memory devices; magnetic disks, such as internal hard disks or removable disks; magneto-optical disks; and CD ROM and DVD-ROM disks. The processor and memory may be supplemented by, or incorporated in, special purpose logic circuitry.

[0057] To provide interaction with a user, one or more aspects of the present disclosure may be implemented on a computer having a display device (e.g., a CRT (cathode ray tube), LCD (liquid crystal display) monitor, or touch screen) for displaying information to the user and optionally a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other kinds of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user may be received in any form, including sound, voice, or tactile input. In addition, the computer may interact with the user by sending documents to and receiving documents from a device used by the user; for example, by sending a web page to a web browser on a user's client device in response to a request received from the web browser.

[0058] Many embodiments have been described. However, it should be understood that various modifications can be made without departing from the spirit and scope of the present disclosure. Therefore, other embodiments are within the scope of the appended claims.

[0059] The foregoing description is provided for the purpose of illustration and description. It is not intended to be exhaustive or to limit the present disclosure. The individual elements or features of a particular configuration are generally not limited to that particular configuration, but are interchangeable where applicable and can be used in a selected configuration, even if not specifically shown or described. It can also be varied in many ways. Such variations should not be considered as departing from the present disclosure, and all such modifications are intended to be included within the scope of the present disclosure.

Claims

1. A vehicle comprising: a first vehicle component comprising a shape memory polymer (SMP) having a first elastic modulus in a first state and a second elastic modulus in a second state, the second elastic modulus being less than the first elastic modulus; a heating element selectively movable from an off state to an on state to supply heat to the SMP, the SMP moving from a first state to a second state in response to the heating element moving from the off state to the on state; as well as At least one sensor is attached to the vehicle and is configured to generate an electrical signal in response to a predetermined amount of force being applied to the vehicle to move the heating element from the off state to the on state.

2. The vehicle of claim 1, wherein at least one sensor is a piezoelectric sensor.

3. The vehicle of claim 1, wherein at least one sensor is disposed proximate a front fascia of the vehicle. The vehicle of claim 3 , wherein the first vehicle component is located beneath a hood panel of the vehicle.

5. The vehicle of claim 1, wherein the heating element is a wire.

6. The vehicle of claim 5, wherein the wires are embedded within the SMP.

7. The vehicle of claim 5, wherein the conductor is in electrical communication with a power source of the vehicle, the conductor receiving electrical current from the power source when moved from the off state to the on state.

8. The vehicle of claim 1 further comprising a switch in electrical communication with the at least one sensor.

9. The vehicle of claim 8, wherein the switch is movable from an open state to a closed state in response to at least one sensor generating the electrical signal to supply current to the heating element.

10. The vehicle of claim 9, wherein the heating element is a wire embedded within the SMP.

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