bonding device between electrode plate and adhesive film ring

Abstract

This invention relates to the field of fuel cell technology, specifically disclosing a bonding device for electrode plates and a film ring. The device includes a worktable, a conveying mechanism, a cutting mechanism, a waste removal mechanism, and a bonding mechanism. The worktable comprises a cutting worktable, a waste removal worktable, and a bonding worktable arranged sequentially along a first horizontal direction. The conveying mechanism conveys the base film along the first horizontal direction, allowing the film strip to slide sequentially over the cutting worktable, the waste removal worktable, and the bonding worktable. The cutting mechanism cuts the film on the cutting worktable to obtain a film ring. The waste removal mechanism removes inner film waste from the inner side of the film ring on the waste removal worktable. The bonding mechanism bonds the electrode plate to the film ring on the bonding worktable. When cutting the film strip, after cutting through the film, the cutting depth to the base film is less than the thickness of the base film. Therefore, the base film retains its own strength, improving the strength and rigidity of the film ring during transport and effectively mitigating warping and wrinkling issues.

Description

Technical Field

[0001] This invention relates to the field of fuel cell technology, and in particular to a bonding device for electrode plates and a film ring. Background Technology

[0002] A fuel cell single cell consists of a sandwich structure comprising a cathode single plate and an anode single plate with adhesive wires, sandwiching a membrane electrode assembly. The cathode single plate, anode single plate, and the frame of the membrane electrode assembly are all bonded together using adhesives. Hot melt adhesives, as environmentally friendly and pollution-free adhesives, can effectively bond the membrane electrode frame and metal bipolar plates. Hot melt adhesive membranes, due to their ultra-high self-adhesive precision, are an excellent choice for the fabrication of integrated metal bipolar plate single cells.

[0003] Currently, the bonding process between the electrode plates and the membrane in a fuel cell single cell mainly involves slicing the membrane and transferring it in sheet form. However, the membrane itself is thin and has extremely poor rigidity, inevitably causing wrinkles and warping during sheet transfer. Furthermore, the bonding precision between the membrane and the electrode plate is difficult to guarantee. For example, the earlier patent CN117594804A disclosed a high-speed bonding method for single cells, which uses slicing of rolled material and single-sheet thermal bonding for pre-bonding the electrode plates and membrane. This patent employs adsorption and transfer of sheet-like membranes, and the adsorption and transfer process can lead to warping and wrinkling of the membrane sheet, affecting the bonding quality.

[0004] Therefore, there is an urgent need for a bonding device between the electrode plate and the adhesive film ring to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a bonding device for an electrode plate and an adhesive film ring, so as to solve the problem in related technologies that use the adsorption and transfer of sheet-like adhesive films or finished sheet-like adhesive films. The adsorption and transfer process can cause problems such as warping and wrinkling of the adhesive film sheet, which affects the bonding quality.

[0006] This invention provides a bonding device for an electrode plate and an adhesive film ring, used to cut the adhesive film on an adhesive film strip into an adhesive film ring, and to bond the adhesive film ring to an electrode plate. The adhesive film strip includes a base film and an adhesive film. The bonding device for the electrode plate and the adhesive film ring includes:

[0007] The workbench includes a cutting workbench, a waste removal workbench, and a bonding workbench arranged sequentially along the first horizontal direction;

[0008] A conveying mechanism is used to convey the base film along the first horizontal direction, and to make the adhesive film strip slide sequentially over the cutting worktable, the waste discharge worktable and the bonding worktable. The cutting worktable, the waste discharge worktable and the bonding worktable are respectively used to support the adhesive film strip. The adhesive film is located on the side of the base film away from the worktable.

[0009] A cutting mechanism is used to cut the adhesive film on the cutting worktable to obtain the adhesive film ring. The cutting depth of the cutting mechanism on the adhesive film strip is less than the thickness of the adhesive film strip and greater than the thickness of the adhesive film.

[0010] Waste removal mechanism, used to remove inner adhesive film waste from the inner side of the adhesive film ring on the waste removal workbench;

[0011] A bonding mechanism is used to bond the electrode plate to the adhesive film ring on the bonding worktable.

[0012] As a preferred technical solution for the bonding device of electrode plate and adhesive film ring, the conveying mechanism includes an unwinding roller and a take-up roller located on both sides of the worktable along the first horizontal direction. The unwinding roller and the take-up roller are configured to respectively wind the adhesive film strip. The take-up roller and the unwinding roller rotate synchronously so that the adhesive film strip slides sequentially over the cutting worktable, the waste discharge worktable and the bonding worktable.

[0013] As a preferred technical solution for the bonding device of the electrode plate and the adhesive film ring, the conveying mechanism further includes multiple limiting roller groups, which are used to support the adhesive film strip so that the adhesive film strip on both sides of the cutting worktable along the first horizontal direction is coplanar with the adhesive film strip on the cutting worktable, the adhesive film strip on both sides of the waste discharge worktable along the first horizontal direction is coplanar with the adhesive film strip on the waste discharge worktable, and the adhesive film strip on both sides of the bonding worktable along the first horizontal direction is coplanar with the adhesive film strip on the bonding worktable.

[0014] As a preferred technical solution for the bonding device of electrode plate and adhesive film ring, the cutting mechanism is located above the cutting worktable. The cutting mechanism includes a cutting die and a first driving component. The first driving component drives the cutting die to move closer to the cutting worktable in the vertical direction. The depth to which the cutting die extends into the adhesive film strip is less than the thickness of the adhesive film strip.

[0015] As a preferred technical solution for the bonding device of electrode plate and adhesive film ring, the waste discharge mechanism is located above the waste discharge workbench. The waste discharge mechanism includes a waste discharge gripper, a second drive assembly and a waste bin. The second drive assembly drives the waste discharge gripper to grip the inner adhesive film waste on the waste discharge workbench and moves the inner adhesive film waste gripped by the waste discharge gripper into the waste bin.

[0016] As a preferred technical solution for the bonding device of electrode plate and adhesive film ring, the worktable further includes a slide rail, a feeding worktable and a feeding worktable. The feeding worktable and the feeding worktable are arranged sequentially along the first horizontal direction on the side of the bonding worktable away from the waste discharge worktable. The feeding worktable is used to place the electrode plate that has not been bonded to the adhesive film ring, and the feeding worktable is used to place the electrode plate that has been bonded to the adhesive film ring. The slide rail is laid along the first horizontal direction.

[0017] The bonding mechanism includes a first sliding frame, a third driving component, and a bonding mold. The third driving component is disposed on the first sliding frame and drives the bonding mold to move in the vertical direction. The first sliding frame slides in cooperation with the slide rail, and the bonding mold can selectively face one of the bonding worktable, the unloading worktable, and the loading worktable in the vertical direction. The bonding mold can grasp the electrode plate.

[0018] As a preferred technical solution for the bonding device of electrode plate and adhesive film ring, the bonding mold includes a plate body, a pressing part and a bonding gripper. The pressing part is provided on the side of the plate body opposite to the worktable. The pressing part has the same shape as the adhesive film ring. The bonding gripper for gripping the electrode plate is provided on the side of the plate body where the pressing part is provided. The bonding gripper is attracted to the electrode plate and the pressing part abuts against the electrode plate.

[0019] As a preferred technical solution for the bonding device of electrode plate and adhesive film ring, the bonding worktable includes a support plate and an elastic plate stacked on top of each other, and the bottom support film is located on the side of the elastic plate away from the support plate.

[0020] As a preferred technical solution for the bonding device of electrode plate and adhesive film ring, it further includes a loading and unloading mechanism, a loading frame and an unloading frame. The loading frame and the unloading frame are sequentially arranged along the first horizontal direction on the side of the loading worktable away from the unloading worktable. The loading and unloading mechanism is located along the first horizontal direction on the side of the bonding mechanism away from the waste discharge mechanism. The loading and unloading mechanism includes a second sliding frame, a fourth driving assembly and a loading and unloading gripper. The fourth driving assembly is disposed on the second sliding frame and drives the loading and unloading gripper to move along the vertical direction. The second sliding frame slides in cooperation with the slide rail, so that the loading and unloading gripper can selectively face one of the unloading worktable, the loading worktable, the loading frame and the unloading frame along the vertical direction.

[0021] As a preferred technical solution for the bonding device of electrode plate and adhesive film ring, the feeding worktable can adjust the position of the electrode plate located on the feeding worktable;

[0022] It also includes a first visual inspection mechanism and a second visual inspection mechanism. The first visual inspection mechanism is used to be opposite to the bonding worktable and to inspect the adhesive film ring on the bonding worktable. The second visual inspection mechanism is used to be opposite to the loading worktable and to inspect the electrode plate on the loading worktable.

[0023] The beneficial effects of this invention are as follows:

[0024] This invention provides a bonding device for electrode plates and adhesive film rings, used to cut adhesive film from an adhesive film strip into adhesive film rings and to bond the adhesive film rings to electrode plates. The adhesive film strip includes a base film and an adhesive film. The bonding device for electrode plates and adhesive film rings includes a worktable, a conveying mechanism, a cutting mechanism, a waste removal mechanism, and a bonding mechanism. The worktable includes a cutting worktable, a waste removal worktable, and a bonding worktable arranged sequentially along a first horizontal direction. The conveying mechanism is used to convey the base film along the first horizontal direction and to allow the adhesive film strip to slide sequentially over the cutting worktable. The system includes a cutting table, a waste removal table, and a bonding table. The cutting table, waste removal table, and bonding table are used to support the adhesive film strip, with the adhesive film located on the side of the base film away from the worktable. The cutting mechanism is used to cut the adhesive film on the cutting table to obtain an adhesive film ring. The cutting depth of the cutting mechanism on the adhesive film strip is less than the thickness of the adhesive film strip but greater than the thickness of the adhesive film. The waste removal mechanism is used to remove the inner adhesive film waste on the inner side of the adhesive film ring on the waste removal table. The bonding mechanism is used to bond the electrode plate to the adhesive film ring on the bonding table. When the electrode plate and adhesive film ring bonding device is working, the conveying mechanism conveys the adhesive film belt to move along the first horizontal direction, so that the adhesive film belt slides sequentially over the cutting worktable, the waste removal worktable and the bonding worktable. During this process, the cutting mechanism cuts the adhesive film on the adhesive film belt located on the cutting worktable, thereby obtaining the adhesive film ring and the inner adhesive film waste located inside the adhesive film ring and the outer adhesive film waste located outside the adhesive film ring. The waste removal mechanism removes the inner adhesive film waste located inside the adhesive film ring on the waste removal worktable to avoid the inner adhesive film waste inside the adhesive film ring being attached to the electrode plate together when the electrode plate and adhesive film ring are bonded in the next step. The bonding mechanism is used to bond the electrode plate to the adhesive film ring (with the inner adhesive film waste removed) on the bonding worktable, thus completing the bonding of the electrode plate and the adhesive film ring. After removing the electrode plate with the adhesive film ring bonded to it, the conveying mechanism starts and sends the adhesive film ring, inner adhesive film waste, and outer adhesive film waste located on the cutting worktable to the waste discharge worktable. The adhesive film ring (with the inner adhesive film waste removed) and outer adhesive film waste are then sent to the bonding worktable. At this time, there is a piece of adhesive film to be cut on the cutting worktable. The cutting mechanism, waste discharge mechanism, and bonding mechanism repeat the above operations to achieve continuous bonding processing of the electrode plate and the adhesive film ring. When cutting the adhesive film, because the cutting depth of the adhesive film is less than the thickness of the adhesive film, the cutting mechanism fails to cut through the bottom support film after cutting the adhesive film. Therefore, the bottom support film retains its own strength, which improves the strength and rigidity of the adhesive film ring during the transport process, and effectively improves the problem of warping and wrinkling of the adhesive film ring. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the bonding device between the electrode plate and the adhesive film ring in an embodiment of the present invention. Figure 1 ;

[0026] Figure 2 This is a schematic diagram of the bonding device between the electrode plate and the adhesive film ring in an embodiment of the present invention. Figure 2;

[0027] Figure 3 This is a schematic diagram of the bonding device between the electrode plate and the adhesive film ring in an embodiment of the present invention (excluding the cutting mechanism, waste removal mechanism and bonding mechanism);

[0028] Figure 4 This is an assembly diagram of the conveying mechanism and the worktable in an embodiment of the present invention;

[0029] Figure 5 This is an assembly diagram of the bonding mold and bonding worktable in an embodiment of the present invention.

[0030] In the picture:

[0031] 100. Adhesive film tape; 101. Base support film; 102. Adhesive film; 1021. Adhesive film ring; 200. Electrode plate;

[0032] X, first horizontal direction; Y, second horizontal direction; Z, vertical direction;

[0033] 11. Cutting workbench; 12. Waste removal workbench; 13. Fitting workbench; 131. Support plate; 132. Elastic plate; 14. Slide rail; 15. Unloading workbench; 16. Loading workbench;

[0034] 21. Unwinding roll; 22. Rewinding roll; 23. Limiting roll assembly; 231. Upper pressure roll; 232. Lower pressure roll;

[0035] 3. Cutting mechanism; 31. Cutting die; 32. First drive assembly; 33. Cutting bracket;

[0036] 4. Waste discharge mechanism; 41. Waste discharge gripper; 42. Second drive assembly; 43. Waste discharge bracket;

[0037] 5. Bonding mechanism; 51. First sliding frame; 52. Third drive assembly; 53. Bonding mold; 531. Plate; 532. Pressing part; 533. Bonding gripper;

[0038] 6. Loading / unloading mechanism; 61. Second sliding frame; 62. Fourth drive assembly; 63. Loading / unloading gripper;

[0039] 7. Feeding frame; 8. Unloading frame; 9. First vision inspection mechanism; 10. Second vision inspection mechanism. Detailed Implementation

[0040] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Furthermore, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0042] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the communication between the inner sides of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0044] like Figures 1-5As shown, this embodiment provides a bonding device for an electrode plate and an adhesive film ring, used to cut the adhesive film 102 on the adhesive film strip 100 into an adhesive film ring 1021, and to bond the adhesive film ring 1021 to the electrode plate 200. The adhesive film strip 100 includes a base film 101 and an adhesive film 102. The bonding device for the electrode plate and the adhesive film ring includes a worktable, a conveying mechanism, a cutting mechanism 3, a waste removal mechanism 4, and a bonding mechanism 5. The worktable includes a cutting worktable 11, a waste removal worktable 12, and a bonding worktable 13 arranged sequentially along a first horizontal direction X. The conveying mechanism is used to convey the base film 101 along the first horizontal direction X, and to make the adhesive film strip 100 slide sequentially over the cutting worktable 11 and the waste removal worktable 5. The worktable 12 and bonding worktable 13, the cutting worktable 11, the waste removal worktable 12 and the bonding worktable 13 are used to support the adhesive film strip 100, and the adhesive film 102 is located on the side of the bottom support film 101 away from the worktable; the cutting mechanism 3 is used to cut the adhesive film 102 on the cutting worktable 11 to obtain the adhesive film ring 1021. The cutting depth of the cutting mechanism 3 on the adhesive film strip 100 is less than the thickness of the adhesive film strip 100 and greater than the thickness of the adhesive film 102; the waste removal mechanism 4 is used to remove the inner adhesive film waste on the inner side of the adhesive film ring 1021 on the waste removal worktable 12; the bonding mechanism 5 is used to bond the electrode plate 200 to the adhesive film ring 1021 on the bonding worktable 13. When the electrode plate and adhesive film ring bonding device is working, the conveying mechanism conveys the adhesive film belt 100 to move along the first horizontal direction X, so that the adhesive film belt 100 slides sequentially over the cutting worktable 11, the waste removal worktable 12 and the bonding worktable 13. During this process, the cutting mechanism 3 cuts the adhesive film 102 of the adhesive film belt 100 located on the cutting worktable 11, thereby obtaining the adhesive film ring 1021 and the inner adhesive film waste located inside the adhesive film ring 1021 and the outer adhesive film waste located outside the adhesive film ring 1021; the waste removal mechanism 4 removes the inner adhesive film waste located inside the adhesive film ring 1021 located on the waste removal worktable 12 to avoid the inner adhesive film waste inside the adhesive film ring 1021 being bonded to the electrode plate 200 together with the electrode plate 200 when bonding the electrode plate 200 to the adhesive film ring 1021 in the next step; The bonding mechanism 5 is used to bond the electrode plate 200 to the adhesive film ring 1021 on the bonding worktable 13 after removing the inner adhesive film waste, thus completing the bonding of the electrode plate 200 and the adhesive film ring 1021. After removing the electrode plate 200 with the adhesive film ring 1021 bonded thereto, the conveying mechanism is started to send the adhesive film ring 1021, the inner adhesive film waste and the outer adhesive film waste located on the cutting worktable 11 to the waste discharge worktable 12. The adhesive film ring 1021 with the inner adhesive film waste removed and the outer adhesive film waste are sent to the bonding worktable 13. At this time, there is uncut adhesive film 102 on the cutting worktable 11. The cutting mechanism 3, the waste discharge mechanism 4 and the bonding mechanism 5 repeat the above operations to achieve continuous bonding processing of the electrode plate 200 and the adhesive film ring 1021.When cutting the adhesive film 100, the cutting depth of the cutting mechanism 3 on the adhesive film 100 is less than the thickness of the adhesive film 100 and greater than the thickness of the adhesive film 102. Therefore, after the cutting mechanism 3 cuts the adhesive film 102, it fails to cut through the bottom support film 101. As a result, the bottom support film 101 retains its own strength. During the transfer of the adhesive film ring 1021, the strength and rigidity of the adhesive film ring 1021 are improved, effectively improving the problems of warping and wrinkling of the adhesive film ring 1021.

[0045] Specifically, the bottom film 101 is made of PET, which has high material hardness. The bottom film 101 and the adhesive film 102 are connected with low adhesion, which ensures the flatness of the adhesive film 102 on the one hand, and facilitates the discharge of adhesive film waste on the other hand.

[0046] Specifically, the conveying mechanism drives the base film 101 to move, thereby realizing the movement of the adhesive film 102. The conveying mechanism operates intermittently, and during intermittent rest periods, the cutting mechanism 3, waste removal mechanism 4, and bonding mechanism 5 complete their respective operations. When the conveying mechanism operates intermittently, it moves the adhesive film belt 100 as a whole to the position of one worktable. Specifically, the cutting worktable 11, waste removal worktable 12, and bonding worktable 13 are equally spaced along the first horizontal direction X.

[0047] Optionally, the conveying mechanism can drive the adhesive film belt 100 to move along the first horizontal direction X. This conveying mechanism includes an unwinding roller 21 and a take-up roller 22 located on both sides of the worktable along the first horizontal direction X. The unwinding roller 21 and the take-up roller 22 are configured to respectively wind the adhesive film belt 100. The take-up roller 22 and the unwinding roller 21 rotate synchronously, causing the adhesive film belt 100 to sequentially slide over the cutting worktable 11, the waste removal worktable 12, and the laminating worktable 13. The adhesive film belt 100 can be wound into an adhesive film roll. The unwinding roller 21 is configured to be coaxially fixed to the adhesive film roll, and the take-up roller 22 is configured to be fixed to the free end of the adhesive film roll. The take-up roller 22 rotates, causing the adhesive film belt 100 wound into an adhesive film roll to sequentially slide over the cutting worktable 11, the waste removal worktable 12, and the laminating worktable 13. In this embodiment, the film roll is sleeved on and fixedly connected to the unwinding roller 21. The take-up roller 22 rotates, causing the film strip 100 of the film roll to be wound around the take-up roller 22. Since the unwinding roller 21 and the take-up roller 22 are arranged on both sides of the worktable along the first horizontal direction X, the film strip 100 between the unwinding roller 21 and the take-up roller 22 slides sequentially over the cutting worktable 11, the waste removal worktable 12, and the bonding worktable 13. The take-up roller 22 winds the base film 101 and the outer film waste located on the base film 101. The unwinding roller 21 and the take-up roller 22 can control the tension of the base film 101, ensuring the flatness of the film 102 and the stability of the film 102 transfer process.

[0048] Optionally, the conveying mechanism further includes multiple limiting roller groups 23, which are used to support the adhesive film belt 100 so that the adhesive film belt 100 on both sides of the cutting worktable 11 along the first horizontal direction X is coplanar with the adhesive film belt 100 on the cutting worktable 11, so that the adhesive film belt 100 on both sides of the waste discharge worktable 12 along the first horizontal direction X is coplanar with the adhesive film belt 100 on the waste discharge worktable 12, and so that the adhesive film belt 100 on both sides of the bonding worktable 13 along the first horizontal direction X is coplanar with the adhesive film belt 100 on the bonding worktable 13. In this embodiment, four limiting roller groups 23 are provided. The first group is located between the cutting worktable 11 and the unwinding roller 21, such that the adhesive strip 100 on the side of the cutting worktable 11 closest to the unwinding roller 21 is on the same plane as the adhesive strip 100 on the cutting worktable 11. The second group is located between the cutting worktable 11 and the waste discharge worktable 12, such that the adhesive strip 100 between the cutting worktable 11 and the waste discharge worktable 12 is on the same plane as the adhesive strip 100 on the cutting worktable 11, and the adhesive strip 100 between the cutting worktable 11 and the waste discharge worktable 12 is on the same plane as the adhesive strip 100 on the waste discharge worktable 12. The third one is set between the waste discharge workbench 12 and the bonding workbench 13. This arrangement makes the adhesive tape 100 between the waste discharge workbench 12 and the bonding workbench 13 and the adhesive tape 100 on the waste discharge workbench 12 lie on the same plane. The fourth one is set between the bonding workbench 13 and the take-up roller 22. This arrangement makes the adhesive tape 100 on the side of the bonding workbench 13 closest to the take-up roller 22 lie on the same plane as the adhesive tape 100 on the cutting workbench 11. The above-mentioned arrangement allows the adhesive tape 100 on the cutting workbench 11, the adhesive tape 100 on the waste removal workbench 12, and the adhesive tape 100 on the bonding workbench 13 to be more evenly attached to the cutting workbench 11, the waste removal workbench 12, and the bonding workbench 13. On the other hand, it can prevent the edges of the cutting workbench 11, the waste removal workbench 12, and the bonding workbench 13 from scratching the adhesive tape 100.

[0049] Optionally, the limiting roller group 23 may include an upper pressure roller 231 and a lower pressure roller 232, with the adhesive film 100 disposed between the upper pressure roller 231 and the lower pressure roller 232. This arrangement can limit the adhesive film 100 along the vertical direction Z and make the adhesive film 100 flatter.

[0050] Optionally, the cutting mechanism 3 is located above the cutting worktable 11. The cutting mechanism 3 includes a cutting die 31 and a first driving assembly 32. The first driving assembly 32 drives the cutting die 31 to move closer to the cutting worktable 11 in the vertical direction Z. The depth to which the cutting die 31 extends into the adhesive film 100 is less than the thickness of the adhesive film 100. In this embodiment, the cutting mechanism 3 also includes a cutting bracket 33, which is disposed on the cutting worktable 11. The first driving assembly 32 is fixed to the cutting bracket 33. The first driving assembly 32 drives the cutting die 31 to slide in the vertical direction Z, thereby causing the cutting die 31 to extend into the adhesive film 102 to cut an adhesive film ring 1021 on the adhesive film 102 on the cutting worktable 11. The cutting die 31 extends into the adhesive film strip 100 to a depth less than the thickness of the adhesive film strip 100. This arrangement prevents the cutting die 31 from cutting through the base film 101 during the cutting process of the adhesive film 102. Specifically, the thickness of the base film 101 is a, the thickness of the adhesive film 102 is b, and the depth of the cutting die 31 extending into the adhesive film strip 100 is h, where b < h < a + b.

[0051] Optionally, the first drive assembly 32 can be one of a hydraulic cylinder, a pneumatic cylinder, a lead screw and nut structure, or a gear and rack structure.

[0052] Optionally, the waste discharge mechanism 4 is located above the waste discharge workbench 12. The waste discharge mechanism 4 includes a waste discharge gripper 41, a second drive assembly 42, and a waste bin. The second drive assembly 42 drives the waste discharge gripper 41 to grip the inner adhesive film waste on the waste discharge workbench 12 and moves the inner adhesive film waste gripped by the waste discharge gripper 41 into the waste bin. In this embodiment, the waste discharge mechanism 4 also includes a waste discharge bracket 43. The second drive assembly 42 is disposed on the waste discharge workbench 12, and the waste bin is disposed on one side of the waste discharge workbench 12 along the second horizontal direction Y. The second drive assembly 42 can drive the waste discharge gripper 41 to move in the vertical direction Z or the second horizontal direction Y. When gripping the inner adhesive film waste in the adhesive film ring 1021, the second drive assembly 42 first drives the waste discharge gripper 41 to move along the vertical direction Z towards the waste discharge workbench 12. The waste removal gripper 41 grips the inner adhesive film waste inside the adhesive film ring 1021. Then, the second drive assembly 42 drives the waste removal gripper 41 to move away from the waste removal workbench 12 in the vertical direction Z, so that the inner adhesive film waste inside the adhesive film ring 1021 is spaced apart from the adhesive film ring 1021 in the vertical direction Z. Finally, the second drive assembly drives the waste removal gripper 41 to move in the second horizontal direction Y, so that the waste removal gripper 41 is opposite to the waste bin. At this time, the waste removal gripper 41 can place the inner adhesive film waste into the waste bin.

[0053] Specifically, the waste removal gripper 41 includes a waste removal suction cup and a vacuum pump connected to the waste removal suction cup. By controlling the opening and closing of the vacuum pump, the waste removal suction cup can be controlled to pick up the inner film waste.

[0054] Optionally, the worktable also includes a slide rail 14, a unloading worktable 15, and a loading worktable 16. The unloading worktable 15 and the loading worktable 16 are sequentially arranged along the first horizontal direction X on the side of the bonding worktable 13 away from the waste discharge worktable 12. The loading worktable 16 is used to place the electrode plate 200 of the unbonded adhesive film ring 1021, and the unloading worktable 15 is used to place the electrode plate 200 of the bonded adhesive film ring 1021. The slide rail 14 is laid along the first horizontal direction X; bonding mechanism 5 It includes a first sliding frame 51, a third drive assembly 52, and a bonding mold 53. The third drive assembly 52 is disposed on the first sliding frame 51 and drives the bonding mold 53 to move in the vertical direction Z. The first sliding frame 51 is slidably engaged with the slide rail 14, and the bonding mold 53 can selectively face one of the bonding worktable 13, the unloading worktable 15, and the loading worktable 16 in the vertical direction Z. The bonding mold 53 can grasp the electrode plate 200. In this embodiment, the loading worktable 16 is provided with an electrode plate 200 that is not attached to the adhesive film ring 1021. When the first sliding frame 51 slides to the loading worktable 16, the third driving component 52 drives the bonding mold 53 to move in the vertical direction Z and grabs the electrode plate 200 on the loading worktable 16. Then the first sliding frame 51 slides to the bonding worktable 13. When it reaches the bonding worktable 13, the third driving component 52 drives the bonding mold 53 to move in the vertical direction Z toward the adhesive film ring 1021, so that the electrode plate 200 on the bonding mold 53 is attached to the adhesive film ring 1021 on the bonding worktable 13. Finally, when the first sliding frame 51 slides to the unloading worktable 15, the third driving component 52 can drive the bonding mold 53 to place the electrode plate 200 with the adhesive film ring 1021 attached on the unloading worktable 15. The bonding mechanism 5 repeats the above operation to achieve bonding of the electrode plate 200 and the adhesive film ring 1021, and to send the electrode plate 200 with the adhesive film ring 1021 bonded to the unloading worktable 15.

[0055] Optionally, the bonding mold 53 includes a plate 531, a pressing part 532, and a bonding gripper 533. The pressing part 532 is provided on the side of the plate 531 opposite to the worktable. The pressing part 532 has the same shape as the adhesive film ring 1021. The bonding gripper 533 for gripping the electrode plate 200 is provided on the side of the plate 531 where the pressing part 532 is provided. The bonding gripper 533 grips the electrode plate 200, and the pressing part 532 abuts against the electrode plate 200. In this embodiment, the bonding gripper 533 includes a bonding suction cup and a vacuum pump. By controlling the opening and closing of the vacuum pump, the bonding suction cup can be controlled to hold the electrode plate 200. The pressing part 532 has the same shape as the adhesive film ring 1021. When the third driving assembly 52 drives the plate body 531 to move closer to the bonding worktable 13, so that the electrode plate 200 and the adhesive film ring 1021 are pressed together, the pressing part 532 is opposite to the adhesive film ring 1021 in the vertical direction Z, thereby making the electrode plate 200 and the adhesive film ring 1021 adhere more firmly. Optionally, the pressing part 532 is provided with a heating function. Optionally, the heating temperature of the pressing part 532 is set to 85°C, and the speed at which the third driving assembly 52 drives the plate body 531 to move closer to the bonding worktable 13 is 0.05 mm / s.

[0056] Optionally, the bonding worktable 13 includes a support plate 131 and an elastic plate 132 stacked on top of each other, with the bottom support film 101 located on the side of the elastic plate 132 away from the support plate 131. In this embodiment, this arrangement ensures uniform pressure distribution at the bonding position of the electrode plate 200 and the adhesive film ring 1021, reduces the processing accuracy requirements of the bonding mold 53 and the bonding worktable 13, and ensures uniform bonding between the adhesive film ring 1021 and the electrode plate 200 without air bubbles.

[0057] Optionally, the bonding device between the electrode plate and the adhesive film ring further includes a loading / unloading mechanism 6, a loading frame 7, and a unloading frame 8. The loading frame 7 and the unloading frame 8 are sequentially arranged along the first horizontal direction X on the side of the loading worktable 16 away from the unloading worktable 15. The loading / unloading mechanism 6 is located along the first horizontal direction X on the side of the bonding mechanism 5 away from the waste discharge mechanism 4. The loading / unloading mechanism 6 includes a second sliding frame 61, a fourth drive assembly 62, and a loading / unloading gripper 63. The fourth drive assembly 62 is disposed on the second sliding frame 61 and drives the loading / unloading gripper 63 to move along the vertical direction Z. The second sliding frame 61 is slidably engaged with the slide rail 14, so that the loading / unloading gripper 63 can selectively be opposite one of the unloading worktable 15, the loading worktable 16, the loading frame 7, and the unloading frame 8 along the vertical direction Z. In this embodiment, the fourth drive assembly 62 is disposed on the second sliding frame 61 and is used to drive the loading / unloading gripper 63 to move along the vertical direction Z. The loading frame 7 contains an electrode plate 200 without an adhesive film ring 1021. When the electrode plate 200 on the loading worktable 16 is moved to the bonding worktable 13 by the bonding mechanism 5 and bonded with the adhesive film ring 1021 on the bonding worktable 13, the second sliding frame 61 moves along the first horizontal direction X and moves to the loading frame 7. The fourth drive assembly 62 drives the loading and unloading gripper 63 to move and grab the electrode plate 200 in the loading frame 7. Then the second sliding frame 61 moves along the first horizontal direction X and moves to the loading worktable 16. The fourth drive assembly 62 drives the loading and unloading gripper 63 to place the grabbed electrode plate 200 on the loading worktable 16 so that the electrode plate 200 on the loading worktable 16 is waiting to be picked up by the bonding mechanism 5. When the bonding mechanism 5 delivers the electrode plate 200 with the adhesive film ring 1021 bonded to the unloading worktable 15, the second sliding frame 61 moves along the first horizontal direction X and moves to the unloading worktable 15. The fourth drive assembly 62 drives the unloading gripper 63 to grip the electrode plate 200 on the unloading worktable 15, so as to transport the electrode plate 200 with the adhesive film ring 1021 bonded to the unloading frame 8.

[0058] Specifically, the loading and unloading gripper 63 includes a loading and unloading suction cup and a vacuum pump. By controlling the opening and closing of the vacuum pump, the loading and unloading suction cup can be controlled to hold the electrode plate 200.

[0059] Optionally, the loading table 16 can adjust the position of the electrode plate 200 located on the loading table 16; specifically, the loading table 16 can adjust the electrode plate 200 to move along a first horizontal direction X or a second horizontal direction Y, or to rotate the electrode plate 200 around a vertical direction Z. The bonding device between the electrode plate and the adhesive film ring also includes a first visual inspection mechanism 9 and a second visual inspection mechanism 10. The first visual inspection mechanism 9 is used to be opposite to the bonding table 13 and to inspect the adhesive film ring 1021 on the bonding table 13, and the second visual inspection mechanism 10 is used to be opposite to the loading table 16 and to inspect the electrode plate 200 on the loading table 16. In this embodiment, to improve the accuracy of the bonding between the electrode plate 200 and the adhesive ring 1021, a first visual inspection mechanism 9 and a second visual inspection mechanism 10 are provided. The first visual inspection mechanism 9 detects the position of the adhesive ring 1021 on the bonding worktable 13, and the second visual inspection mechanism 10 detects the position of the electrode plate 200 on the loading worktable 16. It is determined whether the photo of the electrode plate 200 taken by the second visual inspection mechanism 10 overlaps with the photo of the adhesive ring 1021 on the bonding worktable 13 taken by the first visual inspection mechanism 9 through translation. This determines whether the electrode plate 200 and the adhesive ring 1021 can be precisely matched. If not, the angle and position of the electrode plate 200 are adjusted by the loading worktable 16 so that when the electrode plate 200 moves along the first horizontal direction X to above the adhesive ring 1021 on the bonding worktable 13, the electrode plate 200 and the adhesive ring 1021 can be precisely matched. In addition, the first vision inspection unit 9 can detect whether the inner adhesive film waste inside the adhesive film ring 1021 on the bonding worktable 13 has been completely removed. If it has not been completely removed, the staff can manually remove the adhesive film waste, or the conveying mechanism can be started directly to discard the adhesive film ring 1021 on the bonding worktable 13.

[0060] The usage process of this electrode plate and adhesive film ring bonding device includes:

[0061] S10: The conveying mechanism operates intermittently, causing the adhesive film belt 100 to slide intermittently on the worktable. The unwinding roller 21 and the take-up roller 22 work together to maintain a constant tension on the base film 101 between them, preventing deformation or warping of the adhesive film 102 on the base film 101. The worktable includes a cutting worktable 11, a waste removal worktable 12, and a bonding worktable 13. The adhesive film belt 100 between the unwinding roller 21 and the take-up roller 22 slides sequentially across the cutting worktable 11, the waste removal worktable 12, and the bonding worktable 13.

[0062] S20: The cutting mechanism 3 cuts the adhesive film 102 on the cutting station to obtain an adhesive film ring 1021 and inner adhesive film waste located inside the adhesive film ring 1021 and outer adhesive film waste located outside the adhesive film ring 1021. The cutting mechanism 3 does not cut through the bottom support film 101.

[0063] S30: The conveying mechanism delivers the film ring 1021 located on the cutting station, the inner film waste located inside the film ring 1021, and the outer film waste located outside the film ring 1021 to the waste discharge workbench 12; the waste discharge mechanism 4 removes the inner film waste located inside the film ring 1021 on the waste discharge workbench 12; the cutting mechanism 3 cuts the film 102 on the cutting workbench 11.

[0064] S40: The conveying mechanism sends the film ring 1021, inner film waste, and outer film waste located on the cutting worktable 11 to the waste discharge worktable 12. The film ring 1021 with the inner film waste removed and the outer film waste on the waste discharge worktable 12 are sent to the bonding worktable 13. The bonding mechanism 5 grabs the electrode plate 200 on the loading worktable 16 and transfers it to the bonding worktable 13. The bonding mechanism 5 bonds the grabbed electrode plate 200 to the film ring 1021 and sends the electrode plate 200 with the film ring 1021 bonded to the unloading worktable 15. The waste discharge mechanism 4 removes the inner film waste located inside the film ring 1021 on the waste discharge worktable 12. The cutting mechanism 3 cuts the film 102 on the cutting worktable 11.

[0065] S50: The loading and unloading mechanism 6 sends the electrode plate 200 with the adhesive film ring 1021 attached to the unloading worktable 15 to the unloading frame 8, and sends the electrode plate 200 without the adhesive film ring 1021 attached to the loading frame 7 to the loading worktable 16, and returns to S40.

[0066] Optionally, in S30 and S40, the first vision inspection mechanism 9 detects the position of the adhesive film ring 1021 and at the same time detects whether the inner adhesive film waste has been completely removed, ensuring that all the inner adhesive film waste has been removed.

[0067] In S40, the heating temperature of the bonding mechanism 5 pairs of electrode plates 200 is set to 85℃, the bonding speed is set to 0.05mm / s, the bonding pressure is 0.1-0.6MPa, and the bonding time is controlled to be 10-40s.

[0068] In S50: the second vision inspection mechanism 10 is used to inspect the electrode plate 200 on the loading worktable 16, and the loading worktable 16 corrects the position of the electrode plate 200.

[0069] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A device for bonding a film ring (1021) and a polar plate (200), the device being used for cutting a film (102) on a film tape (100) into the film ring (1021) and bonding the film ring (1021) and the polar plate (200), the film tape (100) comprising a bottom support film (101) and the film (102), the device being characterized in that, The polar plate and the film ring fitting device comprises: The workbench comprises a cutting workbench (11), a waste removal workbench (12) and a fitting workbench (13) arranged in sequence along a first horizontal direction X; A conveying mechanism is used to convey the film strip (100) along the first horizontal direction X, and make the film strip (100) slide through the cutting workbench (11), the waste removal workbench (12) and the fitting workbench (13) in sequence, the cutting workbench (11), the waste removal workbench (12) and the fitting workbench (13) are used to support the film strip (100), and the film (102) is located on the side of the bottom support film (101) away from the workbench; A cutting mechanism (3) is used to cut the film (102) on the cutting workbench (11) to obtain the film ring (1021), the cutting depth of the cutting mechanism (3) on the film strip (100) is less than the thickness of the film strip (100) and greater than the thickness of the film (102); A waste removal mechanism (4) is used to remove the inside film waste on the inside of the film ring (1021) on the waste removal workbench (12); A fitting mechanism (5) is used to fit the polar plate (200) with the film ring (1021) on the fitting workbench (13); The workbench further comprises a sliding rail (14), a feeding workbench (15) and a feeding workbench (16), the feeding workbench (15) and the feeding workbench (16) are arranged in sequence along the first horizontal direction X on the side of the fitting workbench (13) away from the waste removal workbench (12), the feeding workbench (16) is used to place the polar plate (200) without fitting the film ring (1021), the feeding workbench (15) is used to place the polar plate (200) fitted with the film ring (1021), and the sliding rail (14) is laid along the first horizontal direction X; The fitting mechanism (5) comprises a first sliding frame (51), a third driving assembly (52) and a fitting die (53), the third driving assembly (52) is arranged on the first sliding frame (51), the third driving assembly (52) drives the fitting die (53) to move along the vertical direction Z, the first sliding frame (51) is in sliding fit with the sliding rail (14), and the fitting die (53) can selectively be opposite to one of the fitting workbench (13), the feeding workbench (15) and the feeding workbench (16) along the vertical direction Z, and the fitting die (53) can grab the polar plate (200).

2. The polar plate and film ring laminating device according to claim 1, wherein The conveying mechanism comprises unwinding rollers (21) and winding rollers (22) located on both sides of the workbench along the first horizontal direction X, the unwinding rollers (21) and the winding rollers (22) are configured to wind the adhesive film strip (100) respectively, and the winding rollers (22) and the unwinding rollers (21) rotate synchronously to make the adhesive film strip (100) slide through the cutting workbench (11), the waste removal workbench (12) and the laminating workbench (13) in turn.

3. The polar plate and film ring lamination device of claim 2, wherein, The conveying mechanism further comprises a plurality of limiting roller groups (23) for supporting the adhesive film strip (100) so that the adhesive film strip (100) on both sides of the cutting workbench (11) along the first horizontal direction X is coplanar with the adhesive film strip (100) on the cutting workbench (11), the adhesive film strip (100) on both sides of the waste removal workbench (12) along the first horizontal direction X is coplanar with the adhesive film strip (100) on the waste removal workbench (12), and the adhesive film strip (100) on both sides of the laminating workbench (13) along the first horizontal direction X is coplanar with the adhesive film strip (100) on the laminating workbench (13).

4. The polar plate and film ring lamination device of claim 1, wherein, The cutting mechanism (3) is located above the cutting workbench (11), the cutting mechanism (3) comprises a cutting knife die (31) and a first driving assembly (32), the first driving assembly (32) drives the cutting knife die (31) to move towards the cutting workbench (11) along the vertical direction Z, and the depth of the cutting knife die (31) extending into the adhesive film strip (100) is less than the thickness of the adhesive film strip (100).

5. The polar plate and film ring lamination device of claim 1, wherein, The waste removal mechanism (4) is located above the waste removal workbench (12), the waste removal mechanism (4) comprises a waste removal grabbing part (41), a second driving assembly (42) and a waste box, the second driving assembly (42) drives the waste removal grabbing part (41) to grab the inner side adhesive film waste on the waste removal workbench (12), and moves the inner side adhesive film waste grabbed by the waste removal grabbing part (41) into the waste box.

6. The polar plate and film ring lamination device of claim 1, wherein, The laminating die (53) comprises a plate body (531), a pressing part (532) and a laminating grabbing part (533), the plate body (531) is provided with the pressing part (532) on the side opposite to the workbench, the pressing part (532) is consistent with the shape of the adhesive film ring (1021), the plate body (531) is provided with the laminating grabbing part (533) on the side provided with the pressing part (532), the laminating grabbing part (533) is attracted to the polar plate (200), and the pressing part (532) is in abutment with the polar plate (200).

7. The polar plate and film ring lamination device of claim 6, wherein, The laminating workbench (13) comprises a support plate (131) and an elastic plate (132) stacked with each other, and the bottom supporting film (101) is located on the side of the elastic plate (132) away from the support plate (131).

8. The polar plate and film ring lamination device of claim 1, wherein, Further comprising an upper and lower feeding mechanism (6), an upper feeding frame (7) and a lower feeding frame (8), the upper feeding frame (7) and the lower feeding frame (8) are sequentially arranged on the side of the upper feeding workbench (16) away from the lower feeding workbench (15) along the first horizontal direction X, the upper and lower feeding mechanism (6) is located on the side of the laminating mechanism (5) away from the waste discharging mechanism (4) along the first horizontal direction X, the upper and lower feeding mechanism (6) comprises a second sliding frame (61), a fourth driving assembly (62) and an upper and lower feeding grabbing piece (63), the fourth driving assembly (62) is arranged on the second sliding frame (61), the fourth driving assembly (62) drives the upper and lower feeding grabbing piece (63) to move along the vertical direction Z, the second sliding frame (61) is in sliding fit with the sliding rail (14), so that the upper and lower feeding grabbing piece (63) can selectively be opposite to one of the lower feeding workbench (15), the upper feeding workbench (16), the upper feeding frame (7) and the lower feeding frame (8) along the vertical direction Z.

9. The polar plate and film ring lamination device of claim 8, wherein, The upper feeding workbench (16) can adjust the position of the polar plate (200) on the upper feeding workbench (16); Further comprising a first visual detection mechanism (9) and a second visual detection mechanism (10), the first visual detection mechanism (9) is used to be opposite to the laminating workbench (13) and detect the adhesive film ring (1021) on the laminating workbench (13), and the second visual detection mechanism (10) is used to be opposite to the upper feeding workbench (16) and detect the polar plate (200) on the upper feeding workbench (16).

Images