Optical module

Abstract

The invention provides an optical module which comprises a circuit board, a substrate, a heater and a laser chip, the heater and the laser chip are mounted on the substrate, a signal line and a grounding bonding pad are arranged on the circuit board, a high-frequency transmission line in routing connection with the signal line and a grounding metal area in routing connection with the grounding bonding pad are arranged on the substrate, and the laser chip is mounted on the grounding metal area. The high-frequency transmission line is in routing connection with the laser chip; the heat conductivity between the heater and the substrate is low, the heater is provided with a first power supply end, a second power supply end and a grounding end, the second power supply end is electrically connected with the circuit board, and the grounding end is connected with the grounding metal area to supply power to the heater; the first power supply end is electrically connected with the circuit board so as to transmit the driving current to the heater, and the heater is connected with the laser chip through a gold wire so as to transmit the driving current and conduct heat to the laser chip. The heater transmits driving current and conducts heat to the laser chip through the gold wire, so that the laser chip generates an optical signal, and the laser chip is prevented from generating low-temperature condensation.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment. In addition, with the development of optical communication technology, the transmission rate of optical modules is constantly increasing.

[0003] An optical module generally includes a circuit board and an optical transmitter component. The optical transmitter component is usually composed of a laser chip, etc. The laser chip is used to convert the electrical signal transmitted by the circuit board into an optical signal to achieve light emission. Among them, the packaging of the laser chip includes airtight packaging and non-airtight packaging. For non-airtight packaging, the laser chip is easily affected by the external environment.

[0004] However, for non-hermetic packaging of laser chips, when the optical module is in a low-temperature environment and the laser chip is working normally, air may condense on the laser chip due to the low temperature, which may damage the laser chip and affect the emission performance of the laser chip. Summary of the invention

[0005] The disclosed embodiments provide an optical module to prevent the laser chip of the optical module from being damaged by condensation due to low temperature.

[0006] In a first aspect, the present disclosure provides an optical module, comprising:

[0007] A circuit board, on which a signal line and a ground pad are arranged;

[0008] A substrate, on which a high-frequency transmission line and a grounding metal area are arranged, wherein the high-frequency transmission line is connected to the signal line by wire bonding, and the grounding metal area is connected to the grounding pad by wire bonding;

[0009] a heater mounted on the substrate, wherein the thermal conductivity between the heater and the substrate is low, the heater comprising a first power supply terminal, a second power supply terminal and a ground terminal, the second power supply terminal being electrically connected to the circuit board, the ground terminal being connected to the grounded metal area to supply power to the heater; the first power supply terminal being electrically connected to the circuit board to transmit a driving current to the heater;

[0010] A laser chip is mounted on the grounded metal area. The heater is located on one side of the laser chip. The laser chip is connected to the high-frequency transmission line by wire bonding. The heater is connected to the laser chip through a gold wire to transmit the driving current and conduct heat to the laser chip. The laser chip is used to generate an optical signal.

[0011] In a second aspect, the present disclosure provides an optical module, including:

[0012] A circuit board, on which a signal line, a ground pad, a first electric pad and a second electric pad are arranged;

[0013] a substrate, on which a high-frequency transmission line, a grounding metal area, a first power transmission line, and a second power transmission line are arranged, the high-frequency transmission line is connected to the signal line by wire bonding, the grounding metal area is connected to the grounding pad by wire bonding, the first power transmission line is electrically connected to the first electrical pad by wire bonding, and the second power transmission line is electrically connected to the second electrical pad by wire bonding;

[0014] A heater is mounted on the substrate, the thermal conductivity between the heater and the substrate is low, the heater is electrically connected to the second power transmission line by wire bonding, and the heater is used to generate heat;

[0015] A laser chip is mounted on the grounded metal area, the heater is located on one side of the laser chip, the laser chip is electrically connected to the first power supply transmission line by wire bonding, and the laser chip is connected to the high-frequency transmission line by wire bonding, so that the laser chip generates an optical signal; the heater is connected to the laser chip by a gold wire to conduct heat to the laser chip.

[0016] It can be seen from the above embodiments that the optical module provided by the embodiments of the present disclosure includes a circuit board, a substrate, a laser chip and a heater. A signal line and a grounding pad are provided on the circuit board, and a high-frequency transmission line and a grounding metal area are provided on the substrate. The high-frequency transmission line and the signal line are connected by wire bonding to transmit the electrical signal transmitted by the signal line to the high-frequency transmission line, and the grounding metal area is connected by wire bonding to realize signal reflux; the heater is installed on the substrate, and the thermal conductivity between the heater and the substrate is low to reduce the heat conduction of the heater to the substrate; the heater has a first power supply end, a second power supply end and a grounding end, the second power supply end is electrically connected to the circuit board, and the grounding end is connected to the grounding metal area, so that the heating current transmitted by the circuit board is input into the heater through the second power supply end, so that the heater generates heat when it works. Due to the low thermal conductivity between the heater and the substrate, heat loss can be reduced; the first power supply end and the circuit The board is electrically connected to transmit the driving current transmitted by the circuit board to the heater via the first power supply end; the laser chip is installed on the grounded metal area, the heater is located on one side of the laser chip, the heater is connected to the laser chip through a gold wire, the gold wire serves as an electrical channel, and transmits the driving current transmitted to the heater to the laser chip, so that the laser chip emits light; the laser chip is wire-bonded to the high-frequency transmission line to transmit the high-frequency signal transmitted by the high-frequency transmission line to the laser chip, so that the laser chip generates an optical signal; at the same time, the heat of the heater is conducted to the laser chip through the gold wire, and the gold wire serves as a heat channel to conduct the heat generated by the heater to the laser chip, so that when the optical module is in a low-temperature environment and the laser chip is working normally, the heat conducted by the gold wire can increase the temperature of the surface of the laser chip, thereby preventing air from condensing on the laser chip, and also preventing condensation from damaging the laser chip.

[0017] The optical module provided by the present invention adds a heater on one side of the laser chip. The heater transmits driving current and conducts heat to the laser chip through gold wires to enable the laser chip to generate an optical signal and increase the temperature of the surface of the laser chip, thereby preventing the laser chip from generating low-temperature condensation under low power consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0019] Figure 1 A partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0020] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0021] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0022] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0023] Figure 5 A partial structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0024] Figure 6 A top view of a wire bonding device of a laser in an optical module provided according to some embodiments of the present disclosure;

[0025] Figure 7 A local wire bonding amplification device for a laser in an optical module according to some embodiments of the present disclosure Figure 1 ;

[0026] Figure 8 A local wire bonding amplification device for a laser in an optical module according to some embodiments of the present disclosure Figure 2 ;

[0027] Fig. 9 A structural diagram of a heater in an optical module provided according to some embodiments of the present disclosure;

[0028] Fig.10 An exploded view of a heater in an optical module according to some embodiments of the present disclosure;

[0029] Fig.11 A bonding diagram of a laser and a heater in an optical module provided according to some embodiments of the present disclosure;

[0030] Fig.12 A schematic diagram of electrical connections of a laser in an optical module according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0031] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0032] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0033] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0034] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0035] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0036] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0037] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0038] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0039] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0040] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0041] Figure 2 1 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0042] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0043] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0044] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0045] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0046] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0047] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0048] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300, the light emitting component 400 and the light receiving component 500, etc., it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.

[0049] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0050] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0051] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0052] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). The chip may include a microcontroller unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (Limiting Amplifier, LA), a clock and data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip.

[0053] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0054] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0055] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0056] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0057] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0058] Figure 5 FIG. 1 is a partial structural diagram of an optical module provided according to some embodiments of the present disclosure. Figure 5 As shown, the light emitting component 400 generally includes a emitting shell, a laser chip, a lens group and other devices. The emitting shell can be directly mounted on the surface of the circuit board 300, and the laser chip, the lens group and other devices are mounted in the emitting shell. The laser chip receives the electrical signal from the circuit board 300 and converts the electrical signal into an optical signal. The optical signal is emitted through the lens group and other devices to realize the emission of the optical signal.

[0059] The optical receiving component 500 generally includes a receiving shell, an optical receiving chip, a transimpedance amplifier chip and other devices. The optical receiving chip, the transimpedance amplifier chip and other devices can be directly mounted on the surface of the circuit board 300. The receiving shell covers the optical receiving chip, the transimpedance amplifier chip and other devices. The optical fiber adapter transmits the external optical signal to the optical receiving chip via the receiving optical fiber. The optical receiving chip converts the external optical signal into an electrical signal. The electrical signal is amplified by the transimpedance amplifier chip and other devices and then transmitted to the circuit board 300. The electrical signal is transmitted to the host computer 100 via the gold finger to realize the reception of the optical signal.

[0060] Figure 6 A top view of a laser wire bonding device in an optical module provided according to some embodiments of the present disclosure. Figure 7 A local wire bonding amplification device for a laser in an optical module according to some embodiments of the present disclosure Figure 1 .like Figure 6 and Figure 7 As shown, for optical signal transmission, a DSP chip 302 is installed on the surface of the circuit board 300, and the DSP chip 302 is connected to the gold finger 301 through a signal line. The electrical signal provided by the host computer 100 is transmitted to the DSP chip 302 via the gold finger 301; a high-speed signal line is arranged on the surface of the circuit board 300, and the high-speed signal line extends from the DSP chip 302 to the optical emitting component 400. The high-speed signal line transmits the high-frequency electrical signal output by the DSP chip 302 to the optical emitting component 400, so as to drive the laser chip of the optical emitting component 400 to generate an optical signal.

[0061] In some embodiments, in order to provide a flat optical bearing surface for the laser chip 403, the laser chip 403 is usually arranged on the substrate 402, the surface of the substrate 402 is provided with a power transmission line, and the circuit board 300 is provided with an electric pad. One end of the power transmission line is electrically connected to the electric pad through a wire, and the other end of the power transmission line is electrically connected to the light-emitting area of ​​the laser chip 403 through a wire. The bias current transmitted by the circuit board 300 is transmitted to the light-emitting area of ​​the laser chip 403 via the power transmission line to drive the laser chip 403 to generate a laser beam. In some embodiments, the substrate 402 can be a ceramic substrate.

[0062] A high-frequency transmission line 4023 is also arranged on the surface of the substrate 402, and one end of the high-frequency transmission line 4023 is connected to the high-speed signal line by bonding, so as to transmit the electrical signal transmitted by the signal line to the high-frequency transmission line 4023; the other end of the high-frequency transmission line 4023 is connected to the laser chip 403 by bonding, and the high-frequency electrical signal output by the DSP chip 302 is transmitted to the laser chip 403 through the high-frequency transmission line 4023, so that the laser chip 403 generates an optical signal.

[0063] In order to realize the signal return of high-speed electrical signals, a grounding pad is also provided on the circuit board 300, and a first grounding metal area 4021 is also arranged on the surface of the substrate 402. The bottom surface of the laser chip 403 is installed on the first grounding metal area 4021. The power supply transmission line is not connected to the high-frequency transmission line 4023 and the first grounding metal area 4021. The grounding pad on the circuit board 300 is connected to the first grounding metal area 4021 by bonding wires, so that the first grounding metal area 4021 on the substrate 402 is grounded.

[0064] In some embodiments, the assembly of devices such as the substrate 402 and the laser chip 403 can be airtightly packaged, that is, the transmitting shell is a sealed shell, and the laser chip 403 is isolated from the external environment. When the optical module is in a low-temperature environment, the external cold air will not enter the transmitting shell, and condensation will not be generated on the laser chip 403 due to the low temperature, thereby avoiding damage to the laser chip 403 due to condensation.

[0065] The assembly of components such as the substrate 402 and the laser chip 403 can also be non-hermetic packaging, that is, the transmitting shell is a non-sealed shell, and the laser chip 403 is connected to the external environment. When the optical module is in a low-temperature environment, the external cold air will enter the transmitting shell, and condensation may occur on the laser chip 403 due to the low temperature, and the condensation may cause damage to the laser chip 403.

[0066] In order to prevent condensation from forming on the laser chip 403 of the optical module in a low-temperature environment when the light emitting component 400 is not hermetically sealed, the optical module provided in the embodiment of the present disclosure has a heater added to the substrate 402. The heater is located on one side of the laser chip. One end of the heater is electrically connected to the circuit board 300, and the other end of the heater is connected to the laser chip 403 via a gold wire. The heater generates heat under the current signal transmitted by the circuit board 300. The heat is conducted to the surface of the laser chip 403 via the gold wire to heat the surface of the laser chip 403, thereby preventing condensation from forming on the laser chip 403 due to the low temperature.

[0067] Figure 8 A local wire bonding amplification device for a laser in an optical module according to some embodiments of the present disclosure Figure 2 .like Figure 8 As shown, a signal line, a ground pad, a first electric pad 303 and a second electric pad 304 are provided on the circuit board 300. The ground pad may include a first ground pad and a second ground pad. The signal line is located between the first ground pad and the second ground pad to form a GSG structure.

[0068] The first electric pad 303 and the second electric pad 304 can be located on the upper side of the first ground pad. The first electric pad 303 is electrically connected to the light-emitting area of ​​the laser chip 403 through wire bonding to provide a bias current to the laser chip 403; the second electric pad 304 is electrically connected to the heater through wire bonding to provide an operating current to the heater.

[0069] In some embodiments, a notch may be formed on the first ground pad, and the first electric pad 303 and the second electric pad 304 are located in the notch. The first electric pad 303 is electrically connected to the light-emitting area of ​​the laser chip 403 through wire bonding to provide a bias current to the laser chip 403; the second electric pad 304 is electrically connected to the heater through wire bonding to provide an operating current to the heater.

[0070] Compared with disposing the first and second electrical pads 303 and 304 on the upper side of the first ground pad, disposing the first and second electrical pads 303 and 304 in the gap of the first ground pad can shorten the wire bonding distance, thereby reducing the power consumption of the optical module.

[0071] In some embodiments, in order to further shorten the bonding distance, a first power transmission line 4022 and a second power transmission line 4027 are further provided on the substrate 402. The first power transmission line 4022 and the second power transmission line 4027 extend from the edge of the substrate 402 toward the laser chip 403. The first power transmission line 4022 and the second power transmission line 4027 can be arranged side by side on the same side of the laser chip 403; the first power transmission line 4022 and the second power transmission line 4027 can also be arranged on different sides of the laser chip 403, for example, the first power transmission line 4022 is located on the upper side of the laser chip 403, and the second power transmission line 4027 is located on the lower side of the laser chip 403.

[0072] One end of the first power transmission line 4022 is electrically connected to the first electrical pad 303 through wire bonding, and the other end of the first power transmission line 4022 is electrically connected to the light-emitting area of ​​the laser chip 403 through wire bonding, so as to transmit a bias current to the laser chip 403 through the first power transmission line 4022, so that the laser chip 403 generates a laser beam.

[0073] One end of the second power transmission line 4027 is electrically connected to the second electrical pad 304 through wire bonding, and the other end of the second power transmission line 4027 is electrically connected to the heater 404 on the substrate 402 through wire bonding, so as to transmit the working current to the heater 404 through the second power transmission line 4027, so that the heater 404 generates heat when it works.

[0074] In some embodiments, when the arrangement of the electric pads and the signal pads on the circuit board 300 is GSG, the grounding metal area on the substrate 402 includes a first grounding metal area 4021 and a second grounding metal area 4024, the high-frequency transmission line 4023 is located between the first grounding metal area 4021 and the second grounding metal area 4024, the first grounding metal area 4021 is located at the upper part of the substrate 402, the second grounding metal area 4024 is located at the lower part of the substrate 402, the first grounding metal area 4021 is not connected to the second grounding metal area 4024, the first grounding pad is connected to the first grounding metal area 4021 by wire bonding, and the second grounding pad is connected to the second grounding metal area 4024 by wire bonding.

[0075] In order to reduce the bonding loss, the substrate 402 can be installed on the carrier 401, and the mounting height of the substrate 402 can be raised by the carrier 401 so that the bonding surface of the substrate 402 is flush with the surface of the circuit board 300, thereby reducing the bonding distance between the circuit board 300 and the substrate 402.

[0076] In some embodiments, the heater 404 can be embedded in a groove on the substrate 402, or the heater 404 can be installed on the first grounded metal area 4021 of the substrate 402. The heater 404 can be located between the second power transmission line 4027 and the left edge of the substrate 402, that is, the heater 404 is close to the left end of the second power transmission line 4027 to reduce the wire bonding distance connecting the second power transmission line 4027 and the heater 404, and reduce the gold wire distance connecting the heater 404 and the laser chip 403.

[0077] The heater 404 generates heat under the action of the working current transmitted by the second power supply transmission line 4027. The gold wire serves as a heat channel to transfer the heat to the laser chip 403, thereby heating the surface of the laser chip 403. In this way, when the optical module is in a low-temperature environment, since the surface temperature of the laser chip 403 is relatively high, condensation will not be generated on the surface of the laser chip 403, thereby avoiding damage to the laser chip 403 caused by condensation.

[0078] In some embodiments, when the heater 404 conducts heat to the laser chip 403 through the gold wires, in order to increase the temperature of the surface of the laser chip 403, the number of gold wires connecting the heater 404 and the laser chip 403 can be increased. For example, 2, 3 or 4 gold wires can be used to conduct heat to the laser chip 403 through multiple heat channels, thereby increasing the heat conduction rate and preventing condensation from occurring on the surface of the laser chip 403.

[0079] In some embodiments, the heater 404 may be a heating resistor, and the heating resistor may be one resistor or multiple resistors.

[0080] However, when the heater 404 is a heating resistor, since the heater 404 is installed on the first grounded metal area 4021 of the substrate 402, the heat generated by the heater 404 may be conducted to the first grounded metal area 4021, resulting in less heat conducted by the gold wire. In order to ensure the temperature of the surface of the laser chip 403, the heater 404 needs to generate more heat, which increases the power consumption of the optical module.

[0081] Fig. 9 is a structural diagram of a heater in an optical module provided according to some embodiments of the present disclosure, Fig.10 FIG. 1 is an exploded view of a heater in an optical module according to some embodiments of the present disclosure. Fig. 9 and Fig.10As shown, in order to reduce the power consumption of the optical module, the heater 404 may include a base 4041, a heating resistor 4043 and a heat conducting plate 4042, the base 4041 is installed on the first grounded metal area 4021, the heating resistor 4043 is arranged on the base 4041, and the heating resistor 4043 is electrically connected to the second power supply transmission line 4027 to supply power to the heating resistor 4043 through the second power supply transmission line 4027, so that the heating resistor 4043 generates heat when it works.

[0082] Since the thermal conductivity of the gold wire is 317W / mK, while the thermal conductivity of the quartz glass is 1W / mK, the thermal conductivity thereof is very small. In order to prevent the heat generated by the heating resistor 4043 from being conducted to the substrate 402 via the base 4041, the base 4041 may be a quartz base or a silicon dioxide base, that is, the thermal conductivity between the base 4041 and the substrate 402 is low. In this way, the heat diffused from the heating resistor 4043 to the substrate 402 via the base 4041 is reduced, and most of the heat generated by the heating resistor 4043 is conducted to the laser chip 403 via the gold wire, thereby reducing the power consumption of the optical module.

[0083] In some embodiments, a first power supply pad (i.e., the second power supply end) 4044 and a ground pad (i.e., the ground end) 4045 are provided on the top surface of the base 4041, and the first power supply pad 4044 and the ground pad 4045 are located on both sides of the heating resistor 4043. The first power supply pad 4044 is located at one end of the base 4041 close to the second power supply transmission line 4027, and the ground pad 4045 is located at one end of the base 4041 away from the second power supply transmission line 4027. The first power supply pad 4044 is electrically connected to the second power supply transmission line 4027, and the ground pad 4045 is electrically connected to the first grounding metal area 4021, so as to supply power to the heating resistor 4043 through the second power supply transmission line 4027 to drive the heating resistor 4043 to generate heat.

[0084] Since the thermal conductivity of the base 4041 is relatively low, in order to transfer the heat generated by the heating resistor 4043 to the laser chip 403, the heat conducting plate 4042 is covered on the heating resistor 4043, and the heat conducting plate 4042 is in contact with the heating resistor 4043. The thermal conductivity between the heat conducting plate 4042 and the heating resistor 4043 is relatively high, and the electrical conductivity between the heat conducting plate 4042 and the heating resistor 4043 is relatively low, that is, the heat conducting plate 4042 is heat-conductive and insulated, so that the heat of the heating resistor 4043 is transferred to the heat conducting plate 4042, but the heat conducting plate 4042 does not affect the electrical signal channel of the heating resistor 4043 at its bottom.

[0085] In some embodiments, the heat conducting plate 4042 may be an aluminum nitride ceramic plate. The thermal conductivity of aluminum nitride ceramic is 160 W / mK, and aluminum nitride ceramic is insulating. Heat is conducted through the heat conducting plate 4042 without affecting the electrical signal channel of the heating resistor 4043.

[0086] The heat conducting plate 4042 can be connected to the laser chip 403 via a gold wire, and the heat of the heat conducting plate 4042 can be transferred to the laser chip 403 via the gold wire, thereby transferring the heat generated by the heating resistor 4043 to the laser chip 403, and only less power consumption is required.

[0087] In some embodiments, the gold wire conducts heat to the laser chip 403, and the first power transmission line 4022 transmits bias current to the laser chip 403 through bonding. The gold wire is a bonding wire made of metal material, and the gold wire can be used as a heat channel as well as an electrical channel. Therefore, in order to reduce loss, the gold wire can be used as a heat channel and an electrical channel, that is, the first power transmission line 4022 transmits the bias current to the heat conducting plate 4042, so that the heat conducting plate 4042 transmits current signals and heat at the same time, and then transfers the current signal and heat to the laser chip 403 through the gold wire.

[0088] Since the heat conducting plate 4042 is heat conductive and insulated, in order to enable the heat conducting plate 4042 to transmit current signals, a metal layer 4048 is plated on the side (top surface) of the heat conducting plate 4042 away from the base 4041. The metal layer 4048 can occupy part of the top surface of the heat conducting plate 4042, and the metal layer 4048 can also cover the entire top surface of the heat conducting plate 4042, but the side and bottom surfaces of the heat conducting plate 4042 are not plated with a metal layer.

[0089] After the metal layer 4048 is plated on the top surface of the heat conducting plate 4042, one end of the metal layer 4048 is electrically connected to the first power transmission line 4022 through wire bonding, and the other end of the metal layer 4048 is connected to the laser chip 403 through a gold wire. The first power transmission line 4022 transmits the driving current to the metal layer 4048, and the metal layer 4048 transfers the driving current to the laser chip 403 through the gold wire to drive the laser chip 403 to emit light; the heat generated by the heating resistor 4043 is transferred to the metal layer 4048 via the heat conducting plate 4042, and the metal layer 4048 transfers the heat to the laser chip 403 through the gold wire to heat the laser chip 403.

[0090] In this way, the gold wire acts as an electrical channel and a thermal channel to transfer the driving current and heat to the laser chip 403, thereby ensuring the normal operation of the laser chip 403 and increasing the surface temperature of the laser chip 403. The laser chip 403 will not produce condensation due to low temperature during normal operation.

[0091] Reference Figure 8In order to facilitate the wire bonding connection between the first power transmission line 4022 and the metal layer 4048, the metal layer 4048 and the laser chip 403 are wired together, the first power transmission line 4022 is close to the upper edge of the substrate 402, the second power transmission line 4027 is located between the first power transmission line 4022 and the laser chip 403, the heater 404 is located on the upper side of the laser chip 403, the heater 404 is located on the left side of the first power transmission line 4022 and the second power transmission line 4027, the heating resistor 4043 is arranged in the left-right direction, and the heat conducting plate 4042 is arranged in the up-down direction.

[0092] Fig.11 FIG. 1 is a wiring diagram of a laser and a heater in an optical module according to some embodiments of the present disclosure. Fig.11 As shown, in order to facilitate the wire bonding connection between the metal layer 4048 and the first power transmission line 4022 and the laser chip 403, a second power supply pad (i.e., the first power supply end) 4046 and a heat supply pad (i.e., the heat supply end) 4047 are also provided on the top surface of the base 4041. The second power supply pad 4046 is located at the end of the base 4041 away from the laser chip 403, and the heat supply pad 4047 is located at the end of the base 4041 close to the laser chip 403. The heat conducting plate 4042 is pressed on the top surface. On the second power supply pad 4046, the heating resistor 4043 and the heat supply pad 4047, the second power supply pad 4046 is electrically connected to the first power supply transmission line 4022, the second power supply pad 4046 is electrically connected to the metal layer 4048, the metal layer 4048 is electrically connected to the heat supply pad 4047, and the heat supply pad 4047 is connected to the laser chip through a gold wire, thereby transmitting the driving current and heat conduction to the laser chip 403 through the heater 404.

[0093] Fig.12 FIG. 1 is a schematic diagram of electrical connections of a laser in an optical module according to some embodiments of the present disclosure. Figure 8 and Fig.12 As shown, the base 4041 is installed on the first grounding metal area 4021 of the substrate 402, and then the heat conducting plate 4042 is pressed onto the heating resistor 4043 on the base 4041, and then one end of the first power transmission line 4022 is electrically connected to the first electric pad 303 on the circuit board 300, and the other end of the first power transmission line 4022 is electrically connected to the second power pad 4046, and the second power pad 4046 is electrically connected to one end of the metal layer 4048 on the heat conducting plate 4042, and the other end of the metal layer 4048 is electrically connected to the heating pad 4047, and the heating pad 4047 is connected to the laser chip 403 through a plurality of gold wires to transmit a driving current to the laser chip 403, thereby driving the laser chip 403 to generate a laser beam.

[0094] In some embodiments, there may be noise in the current signal transmitted by the first power transmission line 4022. In order to filter out the noise, a capacitor 4028 is also provided on the substrate 402. The capacitor 4028 is located on one side of the base 4041. One end of the first power transmission line 4022 is electrically connected to the capacitor 4028, and the capacitor 4028 is electrically connected to the second power pad 4046.

[0095] Then, the signal line on the circuit board 300 is connected to the high-frequency transmission line 4023 on the substrate 402, and the high-frequency transmission line 4023 is connected to the laser chip 403 to transmit the electrical signal output by the DSP chip 302 to the laser chip 403, so that the laser chip 403 generates an optical signal.

[0096] In some embodiments, when the light emitting component 400 sends a signal, the signal line is connected to the high-frequency transmission line 4023 by bonding, and the high-frequency transmission line 4023 is connected to the laser chip 403 by bonding. The bonding has a certain characteristic impedance. When the impedance output by the laser chip 403 does not match the characteristic impedance of the high-frequency transmission line 4023, the signal transmitted between the laser chip 403 and the signal line will be lost, reducing the integrity of the signal. Therefore, in order to ensure the integrity of the signal, it is necessary to ensure that the impedance output by the laser chip 403 matches the characteristic impedance of the high-frequency transmission line 4023.

[0097] In order to match the impedance output by the laser chip 403 with the characteristic impedance of the high-frequency transmission line 4023, a first matching resistor 4025 is further provided on the substrate 402. Two pads are provided on both sides of the first matching resistor 4025. The laser chip 403 is electrically connected to the pad on one side of the first matching resistor 4025 through bonding, and the pad on the other side of the first matching resistor 4025 is electrically connected to the first grounding metal area 4021 through bonding, so that the first matching resistor 4025 and the laser chip 403 are connected in parallel in the circuit, and the resistance value of the first matching resistor 4025 is equal to the resistance value of the high-frequency transmission line 4023, so as to achieve impedance matching between the laser chip 403 and the high-frequency transmission line 4023.

[0098] In some embodiments, the signal line on the circuit board 300 may be a differential signal line. When the differential signal line is connected to the high-frequency transmission line 4023 by bonding, a second matching resistor 4026 is further provided on the substrate 402, and two soldering pads are provided on both sides of the second matching resistor. A differential signal line on the circuit board 300 is electrically connected to the soldering pad on one side of the second matching resistor 4026 by bonding, and the soldering pad on the other side of the second matching resistor 4026 is electrically connected to the first grounding metal area 4021 by bonding, so that a differential signal line on the circuit board 300 is grounded, and the other differential signal line is connected to the high-frequency transmission line 4023 by bonding, and the resistance value of the second matching resistor 4026 is equal to the resistance value of the differential signal line, so as to achieve impedance matching between the differential signal line and the high-frequency transmission line 4023.

[0099] Then, one end of the second power transmission line 4027 is electrically connected to the second electric pad 304 on the circuit board 300, the other end of the second power transmission line 4027 is electrically connected to the first power pad 4044, and the ground pad 4045 is electrically connected to the first ground metal area 4021, so as to transmit a heating current to the heating resistor 4043, so that the heating resistor 4043 generates heat, and the heat is conducted to the metal layer 4048 on the top surface of the heat conducting plate 4042. The metal layer 4048 conducts the heat to the laser chip 403 through the gold wire to heat the laser chip 403, thereby avoiding condensation on the surface of the laser chip 403 due to low temperature.

[0100] In some embodiments, the laser chip 403 may be an electroabsorption modulated laser chip (EML), and the heating pad 4047 of the heater 404 is connected to the light-emitting area of ​​the EML laser chip through a gold wire to make the EML laser chip emit light; the high-frequency transmission line 4023 on the substrate 402 is connected to the modulation area of ​​the EML laser chip, and the modulation area modulates the electrical signal onto the light beam generated by the laser chip to generate a modulated light signal.

[0101] In some embodiments, the heating resistor 4043 in the heater 404 can heat or stop heating according to actual conditions. For example, when the temperature of the laser chip 403 is lower than a certain temperature, the heating resistor 4043 starts to work and generate heat, and conducts the heat to the laser chip 403 through the gold wire to avoid condensation on the surface of the laser chip 403; when the temperature of the laser chip 403 is higher than a certain temperature, the heating resistor 4043 stops working to reduce the loss of the optical module.

[0102] In order to control the start and stop of the heating resistor 4043, the optical module provided in the embodiment of the present disclosure also includes a temperature sensor and an MCU. The temperature sensor can be installed on the substrate 402, and the MCU is installed on the circuit board 300. The MCU is connected to the temperature sensor. The temperature sensor is used to detect the temperature of the laser chip 403. The temperature sensor transmits the detected temperature to the MCU. The MCU controls the connection between the heating resistor 4043 and the circuit board 300 according to the detected temperature to control the start and stop of the heating resistor 4043.

[0103] In some embodiments, a temperature sensor may also be integrated into the MCU.

[0104] When the temperature detected by the temperature sensor is lower than the preset temperature, the MCU controls the first power supply pad 4044 of the heater 404 to be connected to the wiring of the circuit board 300. The circuit board 300 supplies power to the heating resistor 4043 through the first power supply pad 4044, so that the heating resistor 4043 generates heat. The heat is conducted to the laser chip 403 through the gold wire to heat the laser chip 403, thereby avoiding condensation on the surface of the laser chip 403 due to low temperature.

[0105] When the temperature detected by the temperature sensor is greater than the preset temperature, the MCU controls the first power supply pad 4044 of the heater 404 to disconnect the bonding wire with the circuit board 300, and the power supply current of the circuit board 300 cannot be transmitted to the heating resistor 4043, so that the heating resistor 4043 stops heating, and the gold wire connecting the laser chip 403 and the heating pad 4047 only transmits a driving current signal, so that the laser chip 403 generates a laser beam.

[0106] In some embodiments, the preset temperature for the MCU to control the start and stop of the heating resistor 4043 may be 10°C.

[0107] In some embodiments, the structure of the heater 404 is not limited to the above structure. As long as the heater 404 can transmit driving current and conduct heat to the laser chip 403, it belongs to the protection scope of the embodiments of the present disclosure.

[0108] The optical module provided by the present disclosure has a heater added on one side of the laser chip, the heater consists of a base, a heating resistor and a heat conducting plate, the base is installed on the substrate, the heating resistor is arranged on the top surface of the base, the heat conducting plate is pressed on the heating resistor, a metal layer is plated on the top surface of the heat conducting plate, the driving current transmitted by the circuit board is transmitted to the metal layer, the driving current transmitted by the metal layer is transmitted to the light-emitting area of ​​the laser chip through the gold wire, so that the laser chip generates a laser beam; the heating resistor generates heat under the action of the current signal transmitted by the circuit board, the heat is transmitted to the heat conducting plate, and the heat conducting plate conducts heat to the laser chip through the gold wire, so that the gold wire acts as an electrical channel and a thermal channel to transmit the driving current and heat to the laser chip, thereby increasing the temperature of the surface of the laser chip, so that the laser chip will not generate condensation due to low temperature during normal operation, thereby avoiding the generation of low-temperature condensation on the laser chip under low power consumption.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: A circuit board, on which a signal line and a ground pad are arranged; A substrate, on which a high-frequency transmission line and a grounding metal area are arranged, wherein the high-frequency transmission line is connected to the signal line by wire bonding, and the grounding metal area is connected to the grounding pad by wire bonding; a heater mounted on the substrate, wherein the thermal conductivity between the heater and the substrate is low, the heater comprising a first power supply terminal, a second power supply terminal and a ground terminal, the second power supply terminal being electrically connected to the circuit board, and the ground terminal being connected to the grounded metal area to supply power to the heater; The first power supply end is electrically connected to the circuit board to transmit the driving current to the heater; A laser chip is mounted on the grounded metal area. The heater is located on one side of the laser chip. The laser chip is connected to the high-frequency transmission line by wire bonding. The heater is connected to the laser chip through a gold wire to transmit the driving current and conduct heat to the laser chip. The laser chip is used to generate an optical signal.

2. The optical module according to claim 1, characterized in that: The heater comprises: A base is installed on the substrate, the thermal conductivity between the base and the substrate is low, and the first power supply end, the second power supply end and the ground end are located on the base; A heating resistor is disposed on the base, two ends of the heating resistor are electrically connected to the second power supply end and the ground end, and the heating resistor is used to generate heat; A heat conducting plate is covered on the heating resistor, the thermal conductivity between the heat conducting plate and the heating resistor is high, and the electrical conductivity between the heat conducting plate and the heating resistor is low, a metal layer is plated on a side of the heat conducting plate away from the base, one end of the metal layer is electrically connected to the first power supply end by wire bonding, and the other end of the metal layer is connected to the laser chip through a gold wire, and the heat conducting plate is used to transmit the driving current and conduct heat.

3. The optical module according to claim 2, characterized in that: A heating end is also provided on the base, the heat conducting plate covers the first power supply end, the heating resistor and the heating end, the other end of the metal layer is connected with the heating end by wire bonding, and the heating end is connected with the laser chip through a gold wire.

4. The optical module according to claim 1, characterized in that: Also includes: A temperature sensor is mounted on the substrate, and is used to detect the temperature of the laser chip; The MCU is installed on the circuit board, the MCU is connected to the temperature sensor, and the MCU is used to control the connection between the second power supply end and the circuit board according to the detected temperature.

5. The optical module according to claim 4, characterized in that: When the detected temperature is lower than a preset temperature, the MCU controls the second power supply end to be connected to the circuit board by wire bonding, so that the heater works to generate heat; When the detected temperature is greater than the preset temperature, the MCU controls the second power supply end to be disconnected from the circuit board so that the heater stops heating.

6. The optical module according to claim 1, characterized in that: The circuit board is provided with a first electric pad and a second electric pad, the substrate is provided with a first power transmission line and a second power transmission line, one end of the first power transmission line is electrically connected to the first electric pad, the other end of the first power transmission line is electrically connected to the second power supply end, and the first power transmission line is used to transmit the driving current to the heater; One end of the second power transmission line is electrically connected to the second electrical pad, and the other end of the second power transmission line is electrically connected to the second power supply end. The second power transmission line is used to transmit a heating current to the heater.

7. The optical module according to claim 6, characterized in that: It also includes a first matching resistor, which is arranged on the grounding metal area. The heater is located between the second power transmission line and the first matching resistor, and both ends of the first matching resistor are connected to the laser chip and the grounding metal area by wire bonding.

8. The optical module according to claim 2, characterized in that: The base is a quartz base, and the heat conducting plate is an aluminum nitride ceramic plate.

9. An optical module, characterized in that: include: A circuit board, on which a signal line, a ground pad, a first electric pad and a second electric pad are arranged; a substrate, on which a high-frequency transmission line, a grounding metal area, a first power transmission line, and a second power transmission line are arranged, the high-frequency transmission line is connected to the signal line by wire bonding, the grounding metal area is connected to the grounding pad by wire bonding, the first power transmission line is electrically connected to the first electrical pad by wire bonding, and the second power transmission line is electrically connected to the second electrical pad by wire bonding; A heater is mounted on the substrate, the thermal conductivity between the heater and the substrate is low, the heater is electrically connected to the second power transmission line by wire bonding, and the heater is used to generate heat; A laser chip is mounted on the grounded metal area, the heater is located on one side of the laser chip, the laser chip is electrically connected to the first power supply transmission line by wire bonding, and the laser chip is connected to the high-frequency transmission line by wire bonding, so that the laser chip generates an optical signal; the heater is connected to the laser chip by a gold wire to conduct heat to the laser chip.

10. The optical module according to claim 9, characterized in that: The heater is connected to the laser chip through at least two gold wires.

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