Electronic device

Abstract

The embodiment of the invention provides electronic equipment, which comprises a first machine body, a second machine body, a first optical communication chip, a second optical communication chip and a light guide structure, and is characterized in that the first machine body is provided with a first circuit board; the second machine body is movably connected with the first machine body and is provided with a second circuit board; the first optical communication chip is arranged on the first circuit board and is electrically connected with the first circuit board; the second optical communication chip is arranged on the second circuit board and is electrically connected with the second circuit board; the light guide structure is used for conducting the first optical communication chip and the second optical communication chip so that the first circuit board and the second circuit board can conduct optical communication through the first optical communication chip and the second optical communication chip. The optical communication mode is used for replacing a traditional mode of transmitting electric signals through entity lines, electromagnetic interference is not likely to happen, the problem that loss exists in the mode of transmitting the electric signals through the entity lines and consequently signal transmission is affected is solved, and the signal transmission performance between circuit boards can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of terminal products, and in particular to an electronic device. Background Art

[0002] As the various hardware upgrades of smart terminal products gradually develop to a bottleneck, the traditional hardware upgrade to achieve product upgrades can no longer meet the user's demand for replacement. In response to this, some terminal products such as foldable terminals, sliding terminals, split terminals, etc. have appeared on the market, broadening the use functions and scenarios of smart terminal products, and gradually becoming the development direction of terminal products. This type of terminal product has multiple bodies, and each body is usually equipped with a circuit board to maintain the independent operation of each body. To facilitate the use of terminal products, signals can also be transmitted between the circuit boards of different bodies.

[0003] In the related art, in order to realize signal transmission between circuit boards of different bodies of terminal products, physical lines such as conductive cables, wiring terminals, etc. are usually used for communication connection. However, there is a certain loss in the transmission of electrical signals through physical lines, and it is easy to be affected by external electromagnetic interference, which affects the signal transmission between circuit boards. Summary of the invention

[0004] The present application provides an electronic device to improve the signal transmission performance between circuit boards of the electronic device.

[0005] In a first aspect, the present application provides an electronic device, including:

[0006] A first body is provided with a first circuit board;

[0007] A second body, movably connected to the first body, the second body being provided with a second circuit board;

[0008] A first optical communication chip is disposed on the first circuit board and is electrically connected to the first circuit board;

[0009] a second optical communication chip, disposed on the second circuit board and electrically connected to the second circuit board; and

[0010] The light-guiding structure is used to conduct light between the first optical communication chip and the second optical communication chip, so that the first circuit board and the second circuit board perform optical communication through the first optical communication chip and the second optical communication chip.

[0011] In a second aspect, the present application further provides an electronic device, including:

[0012] A first body is provided with a first circuit board;

[0013] a second body, detachably connected to the first body, so that the first body and the second body can be connected as one or can be separated from each other, and the second body is provided with a second circuit board;

[0014] A first optical communication chip is disposed on the first circuit board and is electrically connected to the first circuit board;

[0015] a second optical communication chip, disposed on the second circuit board and electrically connected to the second circuit board; and

[0016] The light-guiding structure is used to conduct light between the first optical communication chip and the second optical communication chip when the first body and the second body are connected, so that the first circuit board and the second circuit board can perform optical communication through the first optical communication chip and the second optical communication chip.

[0017] In the electronic device of the embodiment of the present application, the first circuit board and the second circuit board perform optical communication through the first optical communication chip, the second optical communication chip and the light-guiding structure, and the optical communication replaces the traditional method of transmitting electrical signals through physical lines, thereby solving the problem of loss in traditional transmission of electrical signals through physical lines that affects signal transmission. In addition, optical communication is not easily affected by electromagnetic interference and has a faster transmission speed, so that signals can be transmitted more stably and quickly, thereby improving the signal transmission performance between different circuit boards of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0019] Figure 1 A first structural diagram of a first embodiment of an electronic device provided in an embodiment of the present application.

[0020] Figure 2 A second structural diagram of the first embodiment of the electronic device provided in an embodiment of the present application.

[0021] Figure 3 A schematic diagram of the structure of the rotating shaft of the first embodiment of the electronic device provided in the embodiments of the present application.

[0022] Figure 4 This is a schematic diagram of the cooperation between the rotating shaft and the light guide structure of the first embodiment of the electronic device provided in the embodiment of the present application in the unfolded state.

[0023] Figure 5A schematic diagram of the cooperation between the rotating shaft and the light guide structure of the first embodiment of the electronic device provided in the embodiment of the present application in a folded state at an angle.

[0024] Figure 6 This is a schematic diagram of the cooperation between the rotating shaft and the light guide structure of the first embodiment of the electronic device provided in the embodiment of the present application in a folded state at another angle.

[0025] Figure 7 A schematic diagram of optical communication between a first optical communication chip and a second optical communication chip of a first embodiment of an electronic device provided in an embodiment of the present application.

[0026] Figure 8 It is a structural schematic diagram of a foldable terminal in the related art.

[0027] Fig. 9 A third structural diagram of the first embodiment of the electronic device provided in an embodiment of the present application.

[0028] Fig.10 for Fig. 9 A partial enlarged view of point A in the middle.

[0029] Fig.11 A first structural diagram of a second embodiment of an electronic device provided in an embodiment of the present application.

[0030] Fig.12 A second structural diagram of a second embodiment of an electronic device provided in an embodiment of the present application.

[0031] Fig.13 A third structural diagram of the second embodiment of the electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The following will be combined with the attached examples of the present application Figure 1 To Attachment Fig.13 , the technical solutions in the embodiments of the present application are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0033] An embodiment of the present application provides an electronic device.

[0034] As used herein, "electronic equipment" (or simply "terminal") includes, but is not limited to, a device configured to receive / send communication signals via a wireline connection (such as via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (for example, for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal".

[0035] Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communication System (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communications capabilities; PDAs that may include radiotelephones, pagers, Internet / Intranet access, Web browsers, notepads, calendars, and / or Global Positioning System (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device that is equipped with a cellular communications module.

[0036] Please refer to Figure 1 , Figure 1 The first structural diagram of the first embodiment of the electronic device provided in the embodiment of the present application is as follows. The electronic device 10 includes a body.

[0037] The housing is used to form the outer contour of the electronic device 10, so as to accommodate the electronic devices and functional components of the electronic device 10, and at the same time to seal and protect the electronic devices and functional components inside the electronic device 10. For example, the electronic devices and functional components such as the battery, circuit board, and sensor of the electronic device 10 can be arranged inside the housing.

[0038] In the embodiment of the present application, the body includes a first body 100 and a second body 200 , and the second body 200 is movably connected to the first body 100 .

[0039] In the description of this application, it should be understood that terms such as "first" and "second" are only used to distinguish similar objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0040] It is understood that the movable connection between the first body 100 and the second body 200 means that the first body 100 and the second body 200 can move relative to each other. For example, the first body 100 and the second body 200 can be slidably connected via a slide rail assembly, and the sliding action of the slide rail assembly enables the first body 100 to slide relative to the second body 200. For another example, the first body 100 and the second body 200 can be rotationally connected via a shaft assembly, and the first body 100 can rotate relative to the second body 200 under the rotation action of the shaft assembly.

[0041] The first body 100 may include a first middle frame 110 , a first back cover 120 , a first display screen 130 and the like.

[0042] The first display screen 130 is disposed on the housing to form a display surface of the first body 100 for displaying information such as images and texts. In addition, the first display screen 130 may also have a touch function for a user to touch so that the first body 100 performs a corresponding touch operation. The first display screen 130 may include a liquid crystal display (LCD) or an organic light-emitting diode display (OLED).

[0043] The first middle frame 110 may be a plate-like structure or a hollow frame structure. The first middle frame 110 is used to provide support for the electronic devices or functional components in the first body 100 so as to install the electronic devices and functional components of the electronic device 10 together. For example, the first middle frame 110 may be provided with grooves, protrusions and other structures to facilitate the installation of the electronic devices or functional components of the electronic device 10. It is understandable that the material of the first middle frame 110 may include metal and / or plastic.

[0044] The first back cover 120 is used to seal the electronic components and functional components of the first body 100 inside the first body 100 together with the first middle frame 110 and the first display screen 130, so as to protect the electronic components and functional components in the first body 100. It can be understood that the material of the first back cover 120 can also include metal and / or plastic.

[0045] The first body 100 may further include a first camera module 140, which may be used to realize functions such as taking photos, recording videos, face recognition unlocking, or scanning code payment of the first body 100. The first camera module 140 may be used as a front camera or a rear camera.

[0046] It is understandable that the second body 200 may include the same structure and components as the first body 100 .

[0047] Of course, in other optional embodiments of the present application, the structure and internal components of the second body 200 may also be different from those of the first body 100, and the structures and internal components of the first body 100 and the second body 200 may be specifically configured according to the product positioning and actual functional requirements of the electronic device 10.

[0048] Exemplarily, the second body 200 may include a second middle frame 210, a second display screen 220, and a second camera module 230. In some cases, the second display screen 220 may be integrated with the first display screen 130, which may increase the area of ​​the display screen and the screen-to-body ratio of the electronic device 10.

[0049] Please refer to Figure 2 , Figure 2 The second structural diagram of the first embodiment of the electronic device provided in the embodiment of the present application is as follows. In the embodiment of the present application, the first body 100 is provided with a first circuit board 400 .

[0050] Specifically, the first circuit board 400 can be set on the first middle frame 110 of the first body 100, the first circuit board 400 can be electrically connected to the power supply in the first body 100, and the first circuit board 400 is used to provide power and control signals to various electronic devices and functional devices in the first body 100.

[0051] Please continue to refer to Figure 2 , the second body 200 is provided with a second circuit board 500 .

[0052] Specifically, the second circuit board 500 can be set on the second middle frame 210 of the second body 200, and the second circuit board 500 can be electrically connected to the power supply in the second body 200. The second circuit board 500 is used to provide power and control signals to various electronic devices and functional devices in the second body 200.

[0053] It is understandable that in some cases, the first circuit board 400 needs to send a control signal to the second circuit board 500 so that the second circuit board 500 controls the second body 200 to perform corresponding processing according to the control signal. Alternatively, the second circuit board 500 needs to send a control signal to the first circuit board 400 so that the first circuit board 400 controls the first body 100 to perform corresponding processing according to the control signal. Then, in order to realize the above functions, the first circuit board 400 and the second circuit board 500 need to be connected in communication.

[0054] In the related art, for terminal devices with multiple bodies, different circuit boards of different bodies are often connected by physical lines such as conductive cables and wiring terminals for communication. There is a certain loss in the transmission of electrical signals through physical lines, and it is easy to be affected by external electromagnetic interference, which affects the signal transmission between the circuit boards.

[0055] To solve the above problems, the electronic device 10 in the embodiment of the present application further includes a first optical communication chip 410 , a second optical communication chip 510 and a light guide structure 600 .

[0056] Please continue to refer to Figure 2 The first optical communication chip 410 is disposed on the first circuit board 400 and is electrically connected to the first circuit board 400, the second optical communication chip 510 is disposed on the second circuit board 500 and is electrically connected to the second circuit board 500, and the light guide structure 600 is used to conduct light between the first optical communication chip 410 and the second optical communication chip 510, so that the first circuit board 400 and the second circuit board 500 can perform optical communication through the first optical communication chip 410 and the second optical communication chip 510.

[0057] Among them, the optical communication chip is an integrated circuit chip that can perform photoelectric conversion. The first optical communication chip 410 can be used to convert the electrical signal sent by the first circuit board 400 into an optical signal for transmission, and can also be used to convert the received optical signal into an electrical signal and send it to the first circuit board 400 for processing. Similarly, the second optical communication chip 510 can be used to convert the electrical signal sent by the second circuit board 500 into an optical signal for transmission, and can also be used to convert the received optical signal into an electrical signal and send it to the second circuit board 500 for processing.

[0058] As a carrier for optical signal transmission, the light guide structure 600 can guide the transmission of the optical signal and enable the optical signal to be transmitted to a preset position in a certain direction. For example, the light guide structure 600 can be an optical fiber, one end of which is connected to the first optical communication chip 410, and the other end is connected to the second optical communication chip 510. The light emitted by the first optical communication chip 410 or the second optical communication chip 510 can be transmitted in the optical fiber.

[0059] Specifically, taking the example of the first circuit board 400 sending a signal to the second circuit board 500, the first circuit board 400 can send an electrical signal to the first optical communication chip 410, the first optical communication chip 410 converts the electrical signal into an optical signal, and transmits it to the second optical communication chip 510 through the light guide structure 600, the second optical communication chip 510 converts the received optical signal into an electrical signal, and sends the electrical signal to the second circuit board 500 for processing. In this way, the first circuit board 400 and the second circuit board 500 realize optical communication through the first optical communication chip 410, the second optical communication chip 510 and the light guide structure 600.

[0060] In the electronic device 10 of the embodiment of the present application, the first circuit board 400 and the second circuit board 500 perform optical communication through the first optical communication chip 410, the second optical communication chip 510 and the light-guiding structure 600, and the optical communication replaces the traditional method of transmitting electrical signals through physical lines, thereby solving the problem of loss in traditional transmission of electrical signals through physical lines that affects signal transmission. In addition, optical communication is not easily affected by electromagnetic interference and has a faster transmission speed, so that signals can be transmitted more stably and quickly, thereby improving the signal transmission performance between different circuit boards of the electronic device 10.

[0061] In order to better understand the present solution, the following description will be given by taking the electronic device 10 as a foldable terminal as an example. Figure 2 The electronic device 10 includes a shaft 300, which is rotatably connected between the first body 100 and the second body 200, so that the first body 100 can be unfolded or folded relative to the second body 200.

[0062] The rotating shaft 300 rotatably connects the first body 100 and the second body 200, that is, the electronic device 10 is a foldable terminal device, and the electronic device 10 can be rotatably switched between the unfolded state and the folded state. Specifically, when the electronic device 10 is in the unfolded state, the angle formed between the first body 100 and the second body 200 is equal to 180°; when the electronic device 10 is in the folded state, the angle formed between the first body 100 and the second body 200 is greater than or equal to 0° and less than 180°, wherein when the angle between the first body 100 and the second body 200 is equal to 0°, the first body 100 and the second body 200 overlap in the thickness direction.

[0063] Optionally, the shaft 300 may be a damping shaft 300. The damping shaft 300 is used to provide a certain damping force, which can hinder the relative rotation of the first body 100 and the second body 200 within a certain angle range, so that the first body 100 and the second body 200 can be maintained in a folded state at a certain angle without being affected by external forces.

[0064] Taking the case where the first optical communication chip 410 sends an optical signal to the second optical communication chip 510 as an example, when the first body 100 is folded relative to the second body 200, the angle formed between the first body 100 and the second body 200 is less than 180°, then the first optical communication chip 410 and the second optical communication chip 510 are in different planes, and light can only propagate in a straight line direction, and the light emitted by the first optical communication chip 410 cannot directly irradiate the second optical communication chip 510. In order to enable the light emitted by the first optical communication chip 410 to be transmitted to the second optical communication chip 510, it is necessary to change the transmission direction of the light. For example, the structure of the light guide structure 600 can be designed by utilizing the refraction or reflection of the light, so that the light emitted by the first optical communication chip 410 can change direction through the light guide structure 600 and propagate toward the second optical communication chip 510.

[0065] Illustratively, in this embodiment, at least a portion of the light guide structure 600 is disposed on the rotation axis 300 , and the portion of the light guide structure 600 disposed on the rotation axis 300 can reflect light.

[0066] The light emitted by the first optical communication chip 410 must pass through the rotating shaft 300 to reach the second optical communication chip 510. In this embodiment, at least a portion of the light-guiding structure 600 is disposed at the rotating shaft 300, and the portion of the light-guiding structure 600 disposed at the rotating shaft 300 can reflect the light. Then, when the electronic device 10 is in a folded state, the light emitted by the first optical communication chip 410 to the rotating shaft 300 can change the initial transmission direction through the reflection effect of the light-guiding structure 600, so that the light can be transmitted to the second optical communication chip 510.

[0067] For example, please combine Figure 2 And refer to Figures 3 to 6 , Figure 3 This is a schematic diagram of the structure of the rotating shaft of the first embodiment of the electronic device provided in the embodiment of the present application, Figure 4 This is a schematic diagram of the cooperation between the rotating shaft and the light guide structure of the first embodiment of the electronic device provided by the embodiment of the present application in the unfolded state, Figure 5 A schematic diagram of the cooperation between the rotating shaft and the light guide structure of the first embodiment of the electronic device provided by the present application in a folded state at an angle, Figure 6 This is a schematic diagram of the cooperation between the rotating shaft and the light guide structure of the first embodiment of the electronic device provided in the embodiment of the present application in a folded state at another angle.

[0068] The light guide structure 600 includes a first light guide portion 610 , a second light guide portion 620 and a reflective portion 630 .

[0069] The first light guide portion 610 is disposed on the first body 100 and connected to the first optical communication chip 410, and the first light guide portion 610 extends toward the direction of the rotation axis 300, and the first light guide portion 610 has a first light-transmitting surface 611. The second light guide portion 620 is disposed on the second body 200 and connected to the second optical communication chip 510, and the second light guide portion 620 extends toward the direction of the rotation axis 300, and the second light guide portion 620 has a second light-transmitting surface 621. The reflecting portion 630 is disposed on the rotation axis 300, and the reflecting portion 630 is used to reflect light. Among them, when the first body 100 is in an unfolded state relative to the second body 200, the first light-transmitting surface 611 and the second light-transmitting surface 621 are arranged opposite to each other; when the first body 100 is in a folded state relative to the second body 200, the first light-transmitting surface 611 faces the reflecting portion 630, and the second light-transmitting surface 621 faces the reflecting portion 630.

[0070] The first light guide portion 610 is used to guide the light emitted by the first optical communication chip 410, and the first light guide portion 610 extends toward the rotation axis 300, so that the first light guide portion 610 can guide the light emitted by the first optical communication chip 410 to the rotation axis 300 through the first light-transmitting surface 611, and then be reflected by the reflection portion 630 at the rotation axis 300. Of course, the first light guide portion 610 can also guide the light it receives to the first optical communication chip 410 through the first light-transmitting surface 611.

[0071] It is understandable that the first light guide part 610 needs to have a good light guiding effect. For example, the material and structure of the first light guide part 610 can be designed so that the light emitted by the first optical communication chip 410 can be totally reflected multiple times in the first light guide part 610, so that the light is transmitted in the first light guide part 610 with almost no loss. Exemplarily, the first light guide part 610 can be a first optical fiber.

[0072] Similarly, the second light guide portion 620 is used to guide the light emitted by the second optical communication chip 510. The second light guide portion 620 extends toward the rotation axis 300, so that the second light guide portion 620 can guide the light emitted by the second optical communication chip 510 to the rotation axis 300 through the second light-transmitting surface 621, and then be reflected by the reflection portion 630 at the rotation axis 300. The second light guide portion 620 can also guide the light it receives to the second optical communication chip 510 through the second light-transmitting surface 621.

[0073] The second light guide 620 also needs to have a good light guiding function. For example, the material and structure of the second light guide 620 can also be designed so that the light emitted by the second optical communication chip 510 can be totally reflected multiple times in the second light guide 620, so that the light is transmitted in the second light guide 620 with almost no loss. Exemplarily, the second light guide 620 can be a second optical fiber.

[0074] The reflective portion 630 is used to reflect the light directed to itself by the first light guide portion 610 and / or the second light guide portion 620. It can be understood that the reflective portion 630 can be a mirror structure with high reflective ability such as a reflector to better reflect the light.

[0075] The reflective portion 630 may be a mirror structure or a combination of multiple mirror structures. The reflective portion 630 may be made of metal material or glass material.

[0076] Specifically, taking the example of the first circuit board 400 sending a signal to the second circuit board 500, the first circuit board 400 sends a first electrical signal to the first optical communication chip 410, the first optical communication chip 410 converts the first electrical signal into a first optical signal and transmits it, and the first light guide 610 guides the first optical signal through the first light-transmitting surface 611. When the first body 100 is in an unfolded state relative to the second body 200, as shown in FIG. Figure 4 As shown, the first light-transmitting surface 611 and the second light-transmitting surface 621 are arranged face to face, and the first optical signal is transmitted to the second light-transmitting surface 621 through the gap between the first light-transmitting surface 611 and the second light-transmitting surface 621, and the second light-guiding portion 620 receives the first optical signal through the second light-transmitting surface 621 and transmits it to the second optical communication chip 510, thereby enabling the second optical communication chip 510 to convert the first optical signal into an electrical signal and transmit it to the second circuit board 500 for processing.

[0077] When the first body 100 is in a folded state relative to the second body 200, Figure 5 and Figure 6 As shown, the first light-transmitting surface 611 and the second light-transmitting surface 621 are respectively facing the reflecting part 630 located at the rotating shaft 300, and the first light signal derived from the first light-transmitting surface 611 can be irradiated to the reflecting part 630. Through the reflection effect of the reflecting part 630, the reflecting part 630 can reflect the first light signal to the second light-transmitting surface 621, so that the second light-guiding part 620 receives the first light signal through the second light-transmitting surface 621 and transmits it to the second optical communication chip 510, and then the second optical communication chip 510 converts the first light signal into an electrical signal and transmits it to the second circuit board 500 for processing.

[0078] It should be noted that the first optical communication chip 410 can emit multiple beams of light at various angles at the same time to ensure that no matter what angle the first body 100 and the second body 200 are in the folded state, among the many angles of light emitted from the first light-transmitting surface 611, there will always be a portion of light that can irradiate the reflective portion 630 and be reflected by the reflective portion 630 to the second light-transmitting surface 621. Similarly, the second optical communication chip 510 can also emit multiple beams of light at various angles at the same time.

[0079] Then, the light-guiding structure 600 of the present embodiment includes a first light-guiding portion 610, a second light-guiding portion 620 and a reflecting portion 630. By utilizing the linear propagation characteristics and the reflection characteristics of light, when the electronic device 10 is in the unfolded state, the first light-guiding portion 610 and the second light-guiding portion 620 are directly used to realize optical communication between the first circuit board 400 and the second circuit board 500. When the electronic device 10 is in the folded state, the reflecting portion 630 reflects the light guided out by the first light-guiding portion 610 or the second light-guiding portion 620 to realize optical communication between the first circuit board 400 and the second circuit board 500. In this way, the electronic device 10 can realize optical communication between the first circuit board 400 and the second circuit board 500 regardless of whether it is in the unfolded state or the folded state.

[0080] In the foldable terminal of the related art, the circuit boards of different bodies are connected by physical wiring. Figure 7 , Figure 7 It is a schematic diagram of the structure of a foldable terminal in the related art. The main board and the sub-board are electrically connected through a flexible printed circuit (FPC) passing through the hinge. The inside of the flexible printed circuit is a metal wiring, which is prone to breakage after frequent bending, resulting in failure of the signal transmission function. Moreover, the flexible printed circuit board needs to pass through the hinge to connect with the main board and the sub-board, so it is necessary to reserve space for the flexible printed circuit board to pass through and avoid, resulting in a reduction in the design length of the shaft, affecting the stability and reliability of the rotation of the foldable terminal. At the same time, when the flexible printed circuit board is connected to the sub-board or the main board, it needs to occupy the longitudinal space of the fuselage, resulting in a reduction in the longitudinal space inside the fuselage, resulting in a reduction in the design size of internal devices such as batteries, and it is impossible to configure more devices.

[0081] The light-guiding structure 600 of the present embodiment is a split structure formed by a first light-guiding portion 610, a second light-guiding portion 620 and a reflecting portion 630, rather than a continuous integrated structure. The present embodiment realizes optical communication by replacing the flexible circuit board of the related technology with the light-guiding structure 600, and the transmission of the optical signal will not be affected by the rotation of the shaft 300. Moreover, the light-guiding structure 600 cooperates with the rotation of the shaft 300, and the reflection of the reflecting portion 630 can realize optical communication between the first circuit board 400 and the second circuit board 500 in a folded state, thereby eliminating the problem in the related technology of failure of the signal transmission function due to breakage caused by frequent bending of the flexible circuit board.

[0082] Moreover, the reflective portion 630 of the light guide structure 600 of the present embodiment is arranged on the rotating shaft 300, and there is no avoidance problem. There is no need to reserve additional avoidance space for the reflective portion 630, so there is no need to reduce the design length of the rotating shaft 300, and the stability and reliability of the folding or unfolding movement of the electronic device 10 can be ensured. In addition, the first light guide portion 610 can be arranged on the first circuit board 400, and the second light guide portion 620 can be arranged on the second circuit board 500. The first light guide portion 610 and the second light guide portion 620 do not need to occupy additional space of the first body 100 and the second body 200, and there is no need to reduce the design size of the internal components of the electronic device 10, and more internal components can be configured.

[0083] Optional, please refer again Figure 3 The rotating shaft 300 includes a fixing member 310, a first rotating arm 320 and a second rotating arm 330. The first rotating arm 320 is rotatably connected to the fixing member 310 and fixed to the first body 100. The second rotating arm 330 is connected to the fixing member 310 and fixed to the second body 200. The reflecting portion 630 is disposed on the fixing member 310.

[0084] Specifically, the first rotating arm 320 can be fixedly connected to the first middle frame 110 of the first body 100, and the connection strength between the first rotating arm 320 and the first body 100 can be enhanced, so that the first rotating arm 320 drives the first body 100 to rotate stably. Similarly, the second rotating arm 330 can be fixedly connected to the second middle frame 210 of the second body 200, and the connection strength between the second rotating arm 330 and the second body 200 can be enhanced, so that the second rotating arm 330 drives the second body 200 to rotate stably.

[0085] The fixing member 310 is used as a rotating carrier of the first rotating arm 320 and the second rotating arm 330, so that the first rotating arm 320 and the second rotating arm 330 can rotate better. There can be various connection structures between the first rotating arm 320 and the second rotating arm 330 and the fixing member 310. For example, one end of the first rotating arm 320 / the second rotating arm 330 connected to the fixing member 310 can be rotatably connected to the fixing member 310 through a rotating shaft, or can be rotatably engaged with the fixing member 310 through a gear set, which is not limited in the embodiment of the present application.

[0086] The reflecting part 630 is disposed on the fixing part 310 , so the reflecting part 630 will not be affected by the rotation of the rotating shaft 300 , and the position of the reflecting part 630 will never change, to ensure that there will always be a part of the light emitted from the first light guiding part 610 or the second light guiding part 620 that can illuminate the reflecting part 630 .

[0087] Optionally, in one embodiment, please refer to Figures 4 to 6The first light guide portion 610 may extend toward the rotation axis 300 to the first rotating arm 320 , and the second light guide portion 620 may also extend toward the rotation axis 300 to the second rotating arm 330 .

[0088] Since the first rotating arm 320 drives the first body 100 to rotate as a whole, the portion of the first light guide 610 located on the first circuit board 400 and the portion located on the first rotating arm 320 will rotate along with the first rotating arm 320, without affecting the first light guide 610, and thus ensuring the transmission of the optical signal. Similarly, since the second rotating arm 330 drives the second body 200 to rotate as a whole, the portion of the second light guide 620 located on the second circuit board 500 and the portion located on the second rotating arm 330 will rotate along with the second rotating arm 330, without affecting the second light guide 620, and thus ensuring the transmission of the optical signal.

[0089] In this embodiment, by extending the first light guiding portion 610 to the first rotating arm 320, and extending the second light guiding portion 620 to the second rotating arm 330, when the first body 100 is in an unfolded state relative to the second body 200, the distance between the first light-transmitting surface 611 and the second light-transmitting surface 621 can be reduced; when the first body 100 is in a folded state relative to the second body 200, the distance between the first light-transmitting surface 611 and the reflecting portion 630 can be reduced, and the distance between the second light-transmitting surface 621 and the reflecting portion 630 can be reduced, which is more conducive to the transmission of optical signals.

[0090] Optionally, in one embodiment, the reflective portion 630 is formed by polishing at least a portion of the fixing member 310 .

[0091] By directly polishing the fixing part 310 to form the reflecting part 630, that is, the reflecting part 630 is formed by the structure of the rotating shaft 300 itself, then, there is no need to set up other mirror structures at the rotating shaft 300, and the connection step of the mirror structure is omitted, which can simplify the structure and assembly of the rotating shaft 300, thereby simplifying the overall structure and assembly of the electronic device 10.

[0092] For example, please refer to Figure 3 The fixing member 310 includes a first surface 311, and the first surface 311 is configured to be parallel to the outer surfaces of the first body 100 and the second body 200 when the first body 100 is in an unfolded state relative to the second body 200. The reflective portion 630 can be formed on at least a portion of the first surface 311 by a polishing process.

[0093] For example, the entire first surface 311 may be polished to form the reflective portion 630 , or only the middle region of the first surface 311 may be polished to form the reflective portion 630 .

[0094] Of course, in other optional implementations of this embodiment, the reflective portion 630 may also be disposed at other positions of the fixing member 310. For example, in order to reduce the volume of the rotating shaft 300, the fixing member 310 may be provided with a receiving groove for the first rotating arm 320 and the second rotating arm 330 to be rotatably connected, and the reflective portion 630 may also be polished to form a groove wall formed in the receiving groove while ensuring that the light emitted by the first light guide portion 610 or the second light guide portion 620 can irradiate the receiving groove.

[0095] The drawings of the embodiments of the present application only illustrate the reflection portion 630 formed on the first surface 311 of the fixing member 310 as an example, which cannot be regarded as a limitation of the present application.

[0096] In the embodiment of the present application, to implement the first optical communication chip 410 to send an optical signal to the second optical communication chip 510, please refer to Figure 8 , Figure 8 A schematic diagram of optical communication between a first optical communication chip and a second optical communication chip of a first embodiment of an electronic device provided in an embodiment of the present application.

[0097] The first optical communication chip 410 includes a first transmitting module 411 , and the first transmitting module 411 is used to transmit a first optical signal to the light guiding structure 600 .

[0098] The second optical communication chip 510 includes a first receiving module 512 , and the first receiving module 512 is used to receive a first optical signal through the light guiding structure 600 .

[0099] The first transmitting module 411 may be a first micro light source, which may emit first light signals at various angles; the first receiving module 512 may be a first photosensitive element, which may decode the received first light signal.

[0100] Optionally, to implement the second optical communication chip 510 sending an optical signal to the first optical communication chip 410, please continue to refer to Figure 8 The second optical communication chip 510 includes a second transmitting module 511, and the second transmitting module 511 is used to transmit a second optical signal to the light guide structure 600. The first optical communication chip 410 includes a second receiving module 412, and the second receiving module 412 is used to receive the second optical signal through the light guide structure 600.

[0101] The second transmitting module 511 may be a second micro light source, which may emit second light signals at various angles; the second receiving module 412 may be a second photosensitive element, which may decode the received second light signal.

[0102] It can be understood that the first transmitting module 411 and the second receiving module 412 of the first optical communication chip 410 can be arranged adjacent to each other, so that the first light guide 610 can simultaneously cover the first transmitting module 411 and the second receiving module 412 in a smaller volume. Similarly, the second transmitting module 511 and the first receiving module 512 of the second optical communication chip 510 can be arranged adjacent to each other, so that the second light guide 620 can simultaneously cover the second transmitting module 511 and the second receiving module 412 in a smaller volume.

[0103] Optional, please refer again Figure 2 The electronic device 10 further includes a plurality of first control chips 420, which are disposed on the first circuit board 400 and are communicatively connected to the first optical communication chip 410. The first optical communication chip 410 is used to convert an electrical signal sent by at least one first control chip 420 into a first optical signal output.

[0104] Among them, multiple first control chips 420 are electrically connected to the first circuit board 400, and multiple first control chips 420 can be respectively connected to the first optical communication chip 410 through the lines on the first circuit board 400, so that multiple first control chips 420 respectively establish wired communication with the first optical communication chip 410, so that multiple first control chips 420 can respectively send multiple electrical signals to the first optical communication chip 410 through the first circuit board 400, and the first optical communication chip 410 can perform serial-to-parallel conversion encoding on the multiple electrical signals and convert them into first optical signals for transmission. Of course, the first optical communication chip 410 can also decode the optical signal it receives into multiple electrical signals and send them to the corresponding first control chip 420 for processing.

[0105] The plurality of first control chips 420 may include a central processing unit chip, a baseband chip, a radio frequency chip, a memory chip, an image processing chip, a power management chip, and the like.

[0106] Optionally, the electronic device 10 further includes a plurality of second control chips 520, which are disposed on the second circuit board 500 and are communicatively connected to the second optical communication chip 510. The second optical communication chip 510 is used to convert an electrical signal sent by at least one second control chip 520 into a second optical signal output.

[0107] Among them, multiple second control chips 520 are electrically connected to the second circuit board 500, and multiple second control chips 520 can be respectively connected to the second optical communication chip 510 through the lines on the second circuit board 500, so that multiple second control chips 520 respectively establish wired communication with the second optical communication chip 510, so that multiple second control chips 520 can respectively send multiple electrical signals to the second optical communication chip 510 through the second circuit board 500, and the second optical communication chip 510 can perform serial-to-parallel conversion encoding on the multiple electrical signals and convert them into second optical signals for transmission. Of course, the second optical communication chip 510 can also decode the optical signal it receives into multiple electrical signals and send them to the corresponding second control chip 520 for processing.

[0108] The plurality of second control chips 520 may also include a processor chip, a baseband chip, a radio frequency chip, a storage chip, an image processing chip, a power management chip, and the like.

[0109] Specifically, taking the example of the first circuit board 400 sending a signal to the second circuit board 500, when the first circuit board 400 needs to control the second circuit board 500 to perform multiple processing operations, multiple first control chips 420 send multiple electrical signals to the first optical communication chip 410 through the first circuit board 400, the first optical communication chip 410 serial-to-parallel conversion encoding of the multiple electrical signals, and convert them into a first optical signal for emission, the first optical signal is transmitted to the second optical communication chip 510 through the light guiding structure 600, the second optical communication chip 510 decodes the received first optical signal into multiple electrical signals, and sends them to the corresponding second control chip 520 through the second circuit board 500 for processing.

[0110] Optional, please refer to Fig. 9 and Fig.10 , Fig. 9 A third structural diagram of the first embodiment of the electronic device provided in the embodiment of the present application, Fig.10 for Fig. 9 A partial enlarged view of A in the middle. In this embodiment, the electronic device 10 further includes a first antenna 700 and a second antenna 800 .

[0111] The first antenna 700 is disposed on the first body 100 and electrically connected to the first circuit board 400, and the second antenna 800 is disposed on the second body 200 and electrically connected to the second circuit board 500. The first antenna 700 can receive the second RF signal sent by the second antenna 800, and / or the second antenna 800 can receive the first RF signal sent by the first antenna 700.

[0112] Specifically, taking the example of the first circuit board 400 sending a signal to the second circuit board 500, the first circuit board 400 can process the electrical signal to be sent to convert it into a first radio frequency signal, and radiate it outward through the first antenna 700. The second antenna 800 can receive the first radio frequency signal reflected back by external obstacles, and transmit it to the second circuit board 500 for processing, so that the first circuit board 400 and the second circuit board 500 can achieve wireless communication.

[0113] In this embodiment, the first antenna 700 and the second antenna 800 are provided to enable wireless communication between the first circuit board 400 and the second circuit board 500. The wireless communication replaces the traditional line transmission of electrical signals, which can improve the problem of loss of electrical signals transmitted by physical lines and thus affecting signal transmission. In addition, since the physical lines are removed, the problem of frequent bending and breakage of physical lines in the foldable terminal in the related art, which leads to failure of signal transmission function, can be solved, thereby improving the signal transmission performance between different circuit boards of the electronic device 10.

[0114] Moreover, in the electronic device 10 of the present embodiment, not only can optical communication be achieved between the first circuit board 400 and the second circuit board 500 through the first optical communication chip 410, the second optical communication chip 510 and the light-guiding structure 600, but wireless communication can also be achieved through the first antenna 700 and the second antenna 800, thereby increasing the communication path between the first circuit board 400 and the second circuit board 500 of the electronic device 10. When one of the communication methods is abnormal, another communication method can be used for communication.

[0115] Optionally, the first antenna 700 is disposed on the first middle frame 110 of the first body 100. Fig.10 As shown, the first antenna 700 can be formed on the outer wall of the first middle frame 110, and extend into the first body 100 through a metal spring or a wire to be electrically connected to the first circuit board 400, so that there is no other device blocking the first antenna 700, so that the first antenna 700 has a larger clearance area, which can enhance the strength of the first antenna 700 receiving and sending radio frequency signals.

[0116] The second antenna 800 is disposed on the second middle frame 210 of the second body 200. Fig.10 As shown, the second antenna 800 can be formed on the outer wall of the second middle frame 210, and extend into the second body 200 through a metal spring or a wire to be electrically connected to the second circuit board 500, so that there is no other device blocking the second antenna 800, so that the second antenna 800 has a larger clearance area, which can enhance the strength of the second antenna 800 receiving and sending radio frequency signals.

[0117] The first circuit board 400 is provided with a first RF circuit and a first feed source, and the first antenna 700 is connected to the first RF circuit. The first RF circuit can perform matching, filtering and other processing operations on the first RF signal emitted by the first feed source, and radiate the first RF signal outward through the first antenna 700. The first RF circuit can also perform processing operations such as adjusting the signal gain and sensitivity of the RF signal received by the first antenna 700.

[0118] The second circuit board 500 is provided with a second RF circuit and a second feed source, and the second antenna 800 is connected to the second RF circuit. The second RF circuit can perform processing operations such as matching and filtering on the second RF signal emitted by the second feed source, and radiate the second RF signal outward through the second antenna 800. The second RF circuit can also perform processing operations such as adjusting the signal gain and sensitivity of the RF signal received by the second antenna 800.

[0119] Optional, please refer to Fig. 9 , the electronic device 10 may further include a first RF chip 430 and a second RF chip 530. The first RF chip 430 is disposed and connected to the first circuit board 400, the first RF chip 430 may integrate the first RF circuit and the first feed source, and the first RF chip 430 is electrically connected to the first antenna 700. The second RF chip 530 is disposed and connected to the second circuit board 500, the second RF chip 530 may integrate the second RF circuit and the second feed source, and the second RF chip 530 is electrically connected to the second antenna 800.

[0120] This application also provides another electronic device. Please refer to Fig.11 and Fig.12 , Fig.11 This is a first structural diagram of a second embodiment of an electronic device provided in an embodiment of the present application, Fig.12 A second structural diagram of a second embodiment of an electronic device provided in an embodiment of the present application. In this embodiment, the electronic device 10 includes a first body 100 and a second body 200.

[0121] The main difference between this embodiment and the above-mentioned first embodiment is that the first body 100 and the second body 200 of this embodiment are detachably connected, so that the first body 100 and the second body 200 can be connected as one or separated from each other.

[0122] That is, the electronic device 10 of the present embodiment is a split terminal device. When the first body 100 and the second body 200 are connected as one, the electronic device 10 is used as an integrated device; when the first body 100 and the second body 200 are separated from each other, the electronic device 10 can be used as either the first body 100 or the second body 200 alone.

[0123] Specifically, at least one of the first body 100 and the second body 200 may be provided with a detachable connection portion 900 , so that the first body 100 and the second body 200 can be connected as one body or separated from each other through the detachable connection portion 900 .

[0124] It is understandable that the detachable connection part 900 can adopt a variety of connection structures, and this embodiment does not limit this. For example, the detachable connection part 900 can be a buckle assembly, one of the first body 100 and the second body 200 can be provided with a buckle, and the other can be provided with a slot, so that the first body 100 and the second body 200 can be mutually connected; for another example, the detachable connection part 900 can also be a magnetic attraction assembly, one of the first body 100 and the second body 200 can be provided with a first magnet, and the other can be provided with a second magnet, so that the first body 100 and the second body 200 are magnetically connected.

[0125] The first body 100 is provided with a first circuit board 400. Specifically, the first circuit board 400 can be electrically connected to a power source in the first body 100, and the first circuit board 400 is used to provide power and control signals to various electronic devices and functional devices in the first body 100.

[0126] The second body 200 is provided with a second circuit board 500. The second circuit board 500 can be electrically connected to a power source in the second body 200, and the second circuit board 500 is used to provide power and control signals to various electronic devices and functional devices in the second body 200.

[0127] It is understandable that when the first body 100 and the second body 200 are connected as a whole for use, in some cases, the first circuit board 400 needs to send a control signal to the second circuit board 500, so that the second circuit board 500 controls the second body 200 to perform corresponding processing according to the control signal. Alternatively, the second circuit board 500 needs to send a control signal to the first circuit board 400, so that the first circuit board 400 controls the first body 100 to perform corresponding processing according to the control signal. Then, in order to realize the above functions, the first circuit board 400 and the second circuit board 500 need to be connected in communication.

[0128] In order to realize the communication connection between the first circuit board 400 and the second circuit board 500, the electronic device 10 of this embodiment is provided with a first optical communication chip 410, a second optical communication chip 510 and a light guide structure 600. The first optical communication chip 410 is arranged on the first circuit board 400 and is electrically connected to the first circuit board 400. The second optical communication chip 510 is arranged on the second circuit board 500 and is electrically connected to the second circuit board 500. The light guide structure 600 is used to conduct light between the first optical communication chip 410 and the second optical communication chip 510 when the first body 100 and the second body 200 are connected, so that the first circuit board 400 and the second circuit board 500 can perform optical communication through the first optical communication chip 410 and the second optical communication chip 510.

[0129] Among them, the optical communication chip is an integrated circuit chip that can perform photoelectric conversion. The first optical communication chip 410 can be used to convert the electrical signal sent by the first circuit board 400 into an optical signal for transmission, and can also be used to convert the received optical signal into an electrical signal and send it to the first circuit board 400 for processing. Similarly, the second optical communication chip 510 can be used to convert the electrical signal sent by the second circuit board 500 into an optical signal for transmission, and can also be used to convert the received optical signal into an electrical signal and send it to the second circuit board 500 for processing.

[0130] As a carrier for optical signal transmission, the light guide structure 600 can guide the transmission of the optical signal and enable the optical signal to be transmitted to a preset position in a certain direction.

[0131] Specifically, taking the example of the first circuit board 400 sending a signal to the second circuit board 500, the first circuit board 400 can send an electrical signal to the first optical communication chip 410, the first optical communication chip 410 converts the electrical signal into an optical signal, and transmits it to the second optical communication chip 510 through the light guide structure 600, the second optical communication chip 510 converts the received optical signal into an electrical signal, and sends the electrical signal to the second circuit board 500 for processing. In this way, the first circuit board 400 and the second circuit board 500 realize optical communication through the first optical communication chip 410, the second optical communication chip 510 and the light guide structure 600.

[0132] In the electronic device 10 of the embodiment of the present application, when the first body 100 and the second body 200 are connected as one, the first circuit board 400 and the second circuit board 500 perform optical communication through the first optical communication chip 410, the second optical communication chip 510 and the light guiding structure 600, and the optical communication replaces the traditional transmission of electrical signals through physical lines. The optical communication is not easily affected by electromagnetic interference, and solves the problem of loss in the traditional transmission of electrical signals through physical lines that affects signal transmission. The optical signal has a faster transmission speed, so that the signal can be transmitted more stably and quickly, which can improve the signal transmission performance between different circuit boards of the electronic device 10.

[0133] For example, please continue to refer to Fig.10 and Fig.11 , the light guide structure 600 includes a first light-transmitting portion 640 and a second light-transmitting portion 650 .

[0134] The first light-transmitting portion 640 is disposed on the first body 100 and is opposite to the first optical communication chip 410, and the first light-transmitting portion 640 is at least partially exposed outside the first body 100. The second light-transmitting portion 650 is disposed on the second body 200 and is opposite to the second optical communication chip 510, and the second light-transmitting portion 650 is at least partially exposed outside the second body 200. When the first body 100 and the second body 200 are connected as one body through the detachable connection portion, the first light-transmitting portion 640 is opposite to or in contact with the second light-transmitting portion 650.

[0135] Specifically, taking the example of the first circuit board 400 sending a signal to the second circuit board 500, when the first body 100 and the second body 200 are connected as one, the first circuit board 400 sends a first electrical signal to the first optical communication chip 410, and the first optical communication chip 410 converts the first electrical signal into a first optical signal and emits it, and transmits it to the first light-transmitting portion 640. Since the first light-transmitting portion 640 is opposite to or in contact with the second light-transmitting portion 650, the first optical signal emitted from the first light-transmitting portion 640 can directly enter the second light-transmitting portion 650, and pass through the second light-transmitting portion 650 to illuminate the second optical communication chip 510, so that the second optical communication chip 510 converts the first optical signal into an electrical signal and transmits it to the second circuit board 500 for processing.

[0136] The first body 100 may be provided with a first through hole (not shown) communicating with the outside, and the first light-transmitting portion 640 is embedded in the first through hole, so that the light emitted by the first optical communication chip 410 is emitted to the outside of the first body 100 through the first light-transmitting portion 640. The second middle frame 210 of the second body 200 may be provided with a second through hole (not shown) communicating with the outside, and the second light-transmitting portion 650 is embedded in the second through hole, so that the light emitted by the second optical communication chip 510 is emitted to the outside of the second body 200 through the second light-transmitting portion 650.

[0137] In the split-type terminal in the related art, when different bodies are connected as one, electrical connection terminals such as USB interfaces are used for signal transmission. Frequent plugging and unplugging can easily cause the mechanical connection of the electrical connection terminals to become loose, resulting in poor contact of the electrical connection terminals or even connection failure, affecting signal transmission.

[0138] In the electronic device 10 of the present embodiment, when the first body 100 and the second body 200 are connected as a whole, the first light-transmitting portion 640 and the second light-transmitting portion 650 are opposite to or in contact with each other, thereby realizing optical communication between the first optical communication chip 410 and the second optical communication chip 510. Compared with the split terminal in the related art, there is no mechanical connection process of the electrical connection terminal, which can avoid the problem of mechanical loosening due to frequent connection, resulting in poor contact of the electrical connection terminal or even connection failure, thereby affecting signal transmission, and can ensure the signal transmission performance between different circuit boards of the electronic device 10.

[0139] Optionally, in one embodiment, in order to better transmit light, the light guide structure 600 may further include a third light guide portion 660 and a fourth light guide portion 670 .

[0140] One end of the third light guide portion 660 is connected to the first optical communication chip 410, and the other end is connected to the first light transparent portion 640, so that the light emitted by the first optical communication chip 410 is transmitted to the first light transparent portion 640 through the third light guide portion 660. Of course, the light received by the first light transparent portion 640 can also be transmitted to the first optical communication chip 410 through the third light guide portion 660. Exemplarily, the third light guide portion 660 can be a third optical fiber.

[0141] One end of the fourth light guide portion 670 is connected to the second optical communication chip 510, and the other end is connected to the second light-transmitting portion 650, so that the light emitted by the second optical communication chip 510 is transmitted to the second light-transmitting portion 650 through the fourth light guide portion 670. Of course, the light received by the second light-transmitting portion 650 can also be transmitted to the second optical communication chip 510 through the fourth light guide portion 670. Exemplarily, the fourth light guide portion 670 can be a fourth optical fiber.

[0142] Optional, please refer to Fig.13 , Fig.13 The third structural diagram of the second embodiment of the electronic device provided in the embodiment of the present application. When the first body 100 and the second body 200 are separated from each other, in order to realize signal transmission between the first circuit board 400 and the second circuit board 500, in this embodiment, the electronic device 10 further includes a first antenna 700 and a second antenna 800.

[0143] The first antenna 700 is disposed on the first body 100 and electrically connected to the first circuit board 400, and the second antenna 800 is disposed on the second body 200 and electrically connected to the second circuit board 500. The first antenna 700 can receive the second radio frequency signal sent by the second antenna 800, and / or the second antenna 800 can receive the first radio frequency signal sent by the first antenna 700.

[0144] Specifically, taking the example of the first circuit board 400 sending a signal to the second circuit board 500, the first circuit board 400 can process the electrical signal to be sent to convert it into a first radio frequency signal, and radiate it outward through the first antenna 700. The second antenna 800 can receive the first radio frequency signal reflected back by external obstacles, and transmit it to the second circuit board 500 for processing, so that the first circuit board 400 and the second circuit board 500 can achieve wireless communication.

[0145] In this embodiment, by providing the first antenna 700 and the second antenna 800, wireless communication can be performed between the first circuit board 400 and the second circuit board 500. Wireless communication replaces the traditional transmission of electrical signals through electrical connection terminals, which can avoid the problem of mechanical loosening, poor contact or even connection failure caused by frequent connection of electrical connection terminals in related technologies, which affects signal transmission. In addition, by providing the first antenna 700 and the second antenna 800, in this embodiment, when the first body 100 and the second body 200 are separated from each other, that is, when the first body 100 and the second body 200 are used separately, signal transmission between the first circuit board 400 and the second circuit board 500 can be achieved through wireless communication.

[0146] Then, the electronic device 10 provided in this embodiment can set the optical communication as the first communication mode, and set the wireless communication as the second communication mode. When the first body 100 and the second body 200 are connected as one, the first body 100 and the second body 200 communicate in the first communication mode; when the first body 100 and the second body 200 are separated from each other, the first body 100 and the second body 200 communicate in the second communication mode.

[0147] Optionally, the first antenna 700 is disposed on the first middle frame 110 of the first body 100. For example, the first antenna 700 can be formed on the outer wall of the first middle frame 110, and extend into the first body 100 through a metal spring or a wire to be electrically connected to the first circuit board 400, so that there is no other device blocking the first antenna 700, so that the first antenna 700 has a larger clearance area, which can enhance the strength of the first antenna 700 in sending and receiving radio frequency signals.

[0148] The second antenna 800 is disposed on the second middle frame 210 of the second body 200. For example, the second antenna 800 can be formed on the outer wall of the second middle frame 210, and is extended into the second body 200 through a metal spring or a wire to be electrically connected to the second circuit board 500, so that there is no other device blocking around the second antenna 800, so that the second antenna 800 has a larger clearance area, which can enhance the strength of the second antenna 800 in sending and receiving radio frequency signals.

[0149] The first circuit board 400 is provided with a first RF circuit and a first feed source, and the first antenna 700 is connected to the first RF circuit. The first RF circuit can perform matching, filtering and other processing operations on the first RF signal emitted by the first feed source, and radiate the first RF signal outward through the first antenna 700. The first RF circuit can also perform processing operations such as adjusting the signal gain and sensitivity of the RF signal received by the first antenna 700.

[0150] The second circuit board 500 is provided with a second RF circuit and a second feed source, and the second antenna 800 is connected to the second RF circuit. The second RF circuit can perform processing operations such as matching and filtering on the second RF signal emitted by the second feed source, and radiate the second RF signal outward through the second antenna 800. The second RF circuit can also perform processing operations such as adjusting the signal gain and sensitivity of the RF signal received by the second antenna 800.

[0151] Optionally, the electronic device 10 may further include a first RF chip 430 and a second RF chip 530. The first RF chip 430 is disposed and connected to the first circuit board 400, the first RF chip 430 may be integrated with the first RF circuit and the first feed source, and the first RF chip 430 is electrically connected to the first antenna 700. The second RF chip 530 is disposed and connected to the second circuit board 500, the second RF chip 530 may be integrated with the second RF circuit and the second feed source, and the second RF chip 530 is electrically connected to the second antenna 800.

[0152] The electronic device provided by the embodiment of the present application is described in detail above. The principle and implementation method of the present application are described in detail using specific examples herein, and the description of the above embodiments is only used to help understand the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. An electronic device, characterized in that: include: A first body is provided with a first circuit board; A second body, movably connected to the first body, the second body being provided with a second circuit board; A first optical communication chip is disposed on the first circuit board and is electrically connected to the first circuit board; a second optical communication chip, disposed on the second circuit board and electrically connected to the second circuit board; and The light-guiding structure is used to conduct light between the first optical communication chip and the second optical communication chip, so that the first circuit board and the second circuit board perform optical communication through the first optical communication chip and the second optical communication chip.

2. The electronic device according to claim 1, characterized in that: The electronic device comprises a rotating shaft, and the rotating shaft is rotatably connected between the first body and the second body, so that the first body can be unfolded or folded relative to the second body; At least a portion of the light-guiding structure is disposed on the rotating shaft, and the portion of the light-guiding structure disposed on the rotating shaft can reflect light.

3. The electronic device according to claim 2, characterized in that: The light guide structure comprises: A first light guide portion, disposed on the first body and connected to the first optical communication chip, and the first light guide portion extends toward the rotation axis, and the first light guide portion has a first light-transmitting surface; a second light guide portion, disposed on the second body and connected to the second optical communication chip, the second light guide portion extending toward the rotation axis, and having a second light-transmitting surface; and A reflecting part, disposed on the rotating shaft, and used for reflecting light; When the first body is in an unfolded state relative to the second body, the first light-transmitting surface and the second light-transmitting surface are arranged opposite to each other; when the first body is in a folded state relative to the second body, the first light-transmitting surface faces the reflecting part, and the second light-transmitting surface faces the reflecting part.

4. The electronic device according to claim 3, characterized in that: The rotating shaft includes a fixing member, a first rotating arm and a second rotating arm, the first rotating arm is rotatably connected to the fixing member and fixed to the first body, and the second rotating arm is rotatably connected to the fixing member and fixed to the second body; Wherein, the reflecting part is arranged on the fixing part.

5. The electronic device according to claim 4, characterized in that: The reflecting portion is formed by polishing at least a portion of the fixing member.

6. The electronic device according to claim 4, characterized in that: The first light guide portion extends toward the rotation axis to the first rotation arm, and the second light guide portion extends toward the rotation axis to the second rotation arm.

7. The electronic device according to claim 1, characterized in that: The light guiding structure is an optical fiber.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The first optical communication chip includes a first transmitting module, and the first transmitting module is used to transmit a first optical signal to the light guiding structure; The second optical communication chip includes a first receiving module, and the first receiving module is used to receive the first optical signal through the light guiding structure; and / or, The second optical communication chip includes a second transmitting module, and the second transmitting module is used to transmit a second optical signal to the light guiding structure; The first optical communication chip includes a second receiving module, and the second receiving module is used to receive the second optical signal through the light guiding structure.

9. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device further includes a plurality of first control chips, the plurality of first control chips are arranged on the first circuit board, and the plurality of first control chips are communicatively connected with the first optical communication chip; The first optical communication chip is used to convert the electrical signal sent by at least one of the first control chips into a first optical signal output; and / or, The electronic device comprises a plurality of second control chips, the plurality of second control chips are arranged on the second circuit board, and the plurality of second control chips are communicatively connected with the second optical communication chip; The second optical communication chip is used to convert an electrical signal sent by at least one of the second control chips into a second optical signal for output.

10. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device further comprises: A first antenna, disposed on the first body and electrically connected to the first circuit board; and A second antenna, disposed on the second body and electrically connected to the second circuit board; The first antenna may receive a second radio frequency signal sent by the second antenna, and / or the second antenna may receive a first radio frequency signal sent by the first antenna.

11. An electronic device, characterized in that: include: A first body is provided with a first circuit board; a second body, detachably connected to the first body, so that the first body and the second body can be connected as one or can be separated from each other, and the second body is provided with a second circuit board; A first optical communication chip is disposed on the first circuit board and is electrically connected to the first circuit board; a second optical communication chip, disposed on the second circuit board and electrically connected to the second circuit board; and The light-guiding structure is used to conduct light between the first optical communication chip and the second optical communication chip when the first body and the second body are connected, so that the first circuit board and the second circuit board can perform optical communication through the first optical communication chip and the second optical communication chip.

12. The electronic device according to claim 11, characterized in that: The light guide structure comprises: a first light-transmitting portion, disposed on the first body and opposite to the first optical communication chip, and at least partially exposed outside the first body; and A second light-transmitting portion is disposed on the second body and opposite to the second optical communication chip, and the second light-transmitting portion is at least partially exposed outside the second body; When the first body and the second body are connected as one, the first light-transmitting portion is opposite to or in contact with the second light-transmitting portion.

13. The electronic device according to claim 11, characterized in that: The electronic device further comprises: A first antenna, disposed on the first body and electrically connected to the first circuit board; and A second antenna, disposed on the second body and electrically connected to the second circuit board; The first antenna may receive a first radio frequency signal sent by the second antenna, and / or the second antenna may receive a second radio frequency signal sent by the first antenna.

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