Light-emitting device and display device

Abstract

The invention discloses a light-emitting device and a display device. The light-emitting device comprises a bearing substrate, an electrode, a light-emitting element and a filling layer, the electrode is arranged on the bearing substrate, the light-emitting element is arranged on the side, away from the bearing substrate, of the electrode, the filling layer comprises filling glue and filling particles, the filling particles are mixed in the filling glue, and the filling particles comprise conductive particles and an insulating outer surface layer. The insulating outer surface layer covers the outer surfaces of the conductive particles, and the insulating outer surface layer of the filling particles at least partially located between the light-emitting element and the electrode is broken under extrusion of the light-emitting element and the electrode, so that the light-emitting element and the electrode are electrically connected through the conductive particles. The insulating outer surface layer of the filling particles is kept complete when not extruded, so that the filling layer is good in overall insulativity and fractures under extrusion, the light-emitting element is electrically connected with the electrode, and therefore the connecting stability and the conductive effect between the light-emitting element and the electrode are improved through the filling glue and the filling particles, and the light-emitting element is more stable in connection. Therefore, the risk of poor contact between the light-emitting element and the electrode is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting device and a display device. Background Art

[0002] In display manufacturing processes, the existing light bar substrate and the lamp beads are usually electrically connected through solder pads and conductive solder paste.

[0003] However, the solder pad has a poor tin absorption rate, and the solder paste has a high hollowing rate and bubble rate, which results in an unstable connection between the light strip substrate and the lamp beads, and a greater risk of poor contact of the lamp beads. Summary of the invention

[0004] The main purpose of the present application is to provide a light-emitting device and a display device, aiming to solve the above-mentioned technical problems existing in the prior art.

[0005] To solve the above problems, the present application provides a light-emitting device, which includes a carrier substrate, an electrode, a light-emitting element and a filling layer, wherein the electrode is arranged on the carrier substrate, the light-emitting element is arranged on the side of the electrode away from the carrier substrate, the filling layer includes a filling glue and filling particles, the filling particles are mixed in the filling glue, the filling particles include conductive particles and an insulating outer layer, the insulating outer layer covers the outer surface of the conductive particles, and the insulating outer layer of the filling particles at least partially located between the light-emitting element and the electrode is broken under the extrusion of the light-emitting element and the electrode, so that the light-emitting element and the electrode are electrically connected through the conductive particles.

[0006] In some embodiments, at least a portion of the insulating outer layer of the filling particles is broken under the pressure of the light-emitting element and the electrode, and the conductive particles are exposed in the direction opposite to the light-emitting element and the electrode, so that the light-emitting element and the electrode are electrically connected through the conductive particles.

[0007] In some embodiments, the electrode includes a first sub-electrode and a second sub-electrode spaced apart in the direction in which the carrier substrate extends, and the filling layer is also filled between the first sub-electrode and the second sub-electrode.

[0008] In some embodiments, the light-emitting device further includes a functional layer group protruding from the carrier substrate and forming a receiving groove, the electrode is located in the receiving groove, the filling layer fills the receiving groove, and the light-emitting element is arranged at the notch of the receiving groove.

[0009] In some embodiments, the receiving groove includes a first groove and a second groove spaced apart from each other, the first sub-electrode is located in the first groove, and the second sub-electrode is located in the second groove.

[0010] In some embodiments, the functional layer group includes an insulating layer, which protrudes from the carrier substrate and is disposed in the same layer as the electrode.

[0011] In some embodiments, the functional layer group further includes a reflective layer, which covers at least a portion of the insulating layer on a side away from the carrier substrate, and is used to reflect the light beam emitted by the light-emitting element.

[0012] In some embodiments, the carrier substrate includes a glass substrate and a buffer layer, the buffer layer is disposed on a side of the glass substrate facing the electrode, and the carrier substrate is connected to the electrode through the buffer layer.

[0013] In some embodiments, the light emitting device further includes a transparent protective glue, which covers a side of the light emitting element away from the supporting substrate to transmit the light beam emitted by the light emitting element.

[0014] In order to solve the above problems, the present application provides a display device, which includes the above light-emitting device.

[0015] The beneficial effects of the present invention are as follows: Different from the prior art, the present application provides a light-emitting device, the light-emitting device includes a carrier substrate, an electrode, a light-emitting element and a filling layer, the electrode is arranged on the carrier substrate, the light-emitting element is arranged on the side of the electrode away from the carrier substrate, the filling layer includes a filling glue and filling particles, the filling particles are mixed in the filling glue, the filling particles include conductive particles and an insulating outer layer, the insulating outer layer covers the outer surface of the conductive particles, and the insulating outer layer of the filling particles at least partially located between the light-emitting element and the electrode is broken under the pressure of the light-emitting element and the electrode, so that the light-emitting element and the electrode are electrically connected through the conductive particles. Through the above-mentioned embodiment, the insulating outer layer of the filling particles remains intact when not squeezed, so that the overall insulation of the filling layer is good, and it is broken under the pressure of the light-emitting element and the electrode, so that the light-emitting element and the electrode can be electrically connected through the conductive particles, thereby, the filling glue improves the connection stability between the light-emitting element and the electrode, and the filling particles improve the conductive effect between the light-emitting element and the electrode, thereby reducing the risk of poor contact between the light-emitting element and the electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a schematic structural diagram of a display device according to one or more embodiments of the present application;

[0018] Figure 2 is a first structural schematic diagram of a light emitting device according to one or more embodiments of the present application;

[0019] Figure 3 is a second structural schematic diagram of a light emitting device according to one or more embodiments of the present application;

[0020] Figure 4 is a schematic structural diagram of a filling layer of a light emitting device according to one or more embodiments of the present application;

[0021] Figure 5 is a schematic structural diagram of a carrier substrate, a functional layer group and electrodes of a light-emitting device according to one or more embodiments of the present application;

[0022] Figure 6 is a first structural schematic diagram of a light-emitting device according to one or more embodiments of the present application when a filling layer is not squeezed by a light-emitting element;

[0023] Figure 7 is a second structural schematic diagram of a light-emitting device according to one or more embodiments of the present application when the filling layer is not squeezed by the light-emitting element;

[0024] Figure 8 is based on Figure 7 The light-emitting device shown is a schematic structural diagram after the light-emitting element is provided.

[0025] Reference numerals: display device 1; light-emitting device 2; carrier substrate 10; glass substrate 11; buffer layer 12; electrode 20; first sub-electrode 21; second sub-electrode 22; light-emitting element 30; filling layer 40; filling glue 41; filling particles 42; conductive particles 421; insulating outer layer 422; functional layer group 50; receiving groove 51; first groove 511; second groove 512; insulating layer 52; reflective layer 53; transparent protective glue 60. DETAILED DESCRIPTION

[0026] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0028] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0029] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0030] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0031] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0032] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0033] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0034] Please refer to Figure 1 , Figure 1 is a schematic diagram of the structure of a display device according to one or more embodiments of the present application.

[0035] The present application provides a display device 1, which may include but is not limited to a mobile phone, a tablet, a laptop, a desktop, a terminal, an interactive display, a digital audio and video device, an Internet of Things device, etc. Among them, the interactive display may include an interactive whiteboard, a digital advertising interactive screen, a game interactive display, etc., and the Internet of Things device may include a smart home device and a smart wearable device, etc. Among them, the display device 1 may include a light emitting device 2, and the light emitting device 2 may provide a light source for the display device 1. For example, when the display device 1 is a display such as a mini LED display or a liquid crystal display, the light emitting device 2 may serve as a backlight for the display device 1. Exemplarily, the display device 1 may also include a display panel, an optical adjustment control, a light guide plate, and a back plate arranged in sequence, and the light emitting device 2 may be located on the side of the light guide plate, and the light incident side of the light guide plate is located on the light path of the light beam emitted by the light emitting device 2. In some application scenarios, when the display device 1 is a direct display such as a micro LED display, the light emitting device 2 may serve as an image source of the display device 1, such as a pixel.

[0036] Please refer to Figure 2-Figure 8 , Figure 2 is a first structural schematic diagram of a light emitting device according to one or more embodiments of the present application; Figure 3 is a second structural schematic diagram of a light emitting device according to one or more embodiments of the present application; Figure 4 is a schematic structural diagram of a filling layer of a light emitting device according to one or more embodiments of the present application; Figure 5 is a schematic structural diagram of a carrier substrate, a functional layer group and electrodes of a light-emitting device according to one or more embodiments of the present application; Figure 6 is a first structural schematic diagram of a light-emitting device according to one or more embodiments of the present application when a filling layer is not squeezed by a light-emitting element;

[0037] Figure 7 is a second structural schematic diagram of a light-emitting device according to one or more embodiments of the present application when the filling layer is not squeezed by the light-emitting element; Figure 8 is based on Figure 7 The light-emitting device shown is a schematic structural diagram after the light-emitting element is provided.

[0038] To solve the above problems, the present application provides a light-emitting device 2, which includes a supporting substrate 10, an electrode 20, a light-emitting element 30 and a filling layer 40. The electrode 20 is arranged on the supporting substrate 10, and the light-emitting element 30 is arranged on the side of the electrode 20 away from the supporting substrate 10. The filling layer 40 includes a filling glue 41 and filling particles 42. The filling particles 42 are mixed in the filling glue 41. The filling particles 42 include conductive particles 421 and an insulating outer layer 422. The insulating outer layer 422 covers the outer surface of the conductive particles 421. The insulating outer layer 422 of the filling particles 42 at least partially located between the light-emitting element 30 and the electrode 20 is broken under the extrusion of the light-emitting element 30 and the electrode 20, so that the light-emitting element 30 and the electrode 20 are electrically connected through the conductive particles 421.

[0039] The carrier substrate 10 can provide support and protection for the electrode 20, the light-emitting element 30 and the filling layer 40. The carrier substrate 10 can include but is not limited to a glass carrier substrate or a PCB carrier substrate. In some application scenarios, the glass substrate in the display array substrate process and other processes can be used to prepare the carrier substrate. It should be noted that, taking the carrier substrate 10 as a glass carrier substrate as an example, when the light-emitting element 30 is soldered to the glass carrier substrate, the tinning rate of the glass carrier substrate pad is poor. If the conductive solder paste is directly coated on the glass carrier substrate, the risk of hollowing and bubble generation of the conductive solder paste is high. Compared with the carrier substrate 10 being a PCB carrier substrate, the risk of poor tinning of the glass carrier substrate is higher. The material of the electrode 20 can include but is not limited to conductive materials such as copper. The electrode 20 is electrically connected to the light-emitting element 30 and is used to light up the light-emitting element 30.

[0040] The light-emitting element 30 can be used to emit a light beam, and the light-emitting element 30 can include but is not limited to a light-emitting diode, etc., wherein the light-emitting diode can be a micro light-emitting diode, etc. Exemplarily, the light-emitting element 30 can be a micro light-emitting diode, and the micro light-emitting diode is provided with a positive and negative electrode on the side close to the electrode 20, and the positive and negative electrodes are connected to the electrode 20 through the filling layer 40, so as to facilitate the electrical connection between the light-emitting element 20 and the electrode 20. The filling layer 40 can be filled at least between the electrode 20 and the light-emitting element 30, and the filling layer 40 includes a filling glue 41 and filling particles 42. It should be noted that when setting the filling layer 40, the filling layer 40 can have fluidity and can gradually solidify over time. The filling layer 40 can be set by inkjet printing and the like. The filling glue 41 can have viscosity and insulation. Exemplarily, the material of the filling glue 41 can include but is not limited to epoxy resin, acrylic resin, etc. The filling particles 42 are mixed in the filling glue 41. The filling particles 42 include conductive particles 421 and an insulating outer layer 422. The conductive particles 421 have good conductivity. For example, the material of the conductive particles 421 may include but is not limited to silver, copper, and graphite. The radial size of the conductive particles 421 may be between 2μm and 8μm. For example, the radial size of the conductive particles 421 may be between 2μm and 4μm, between 4μm and 6μm, between 6μm and 8μm, between 7μm and 8μm, etc. Specifically, the radial size of the conductive particles 421 may be 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, etc. The tolerance between the radial sizes of different conductive particles 421 is between 3% and 5%. The insulating outer layer 422 has good insulation. For example, the material of the insulating outer layer 422 may include but is not limited to polyimide, polytetrafluoroethylene, boron nitride, etc. The insulating outer layer 422 can be formed on the outer surface of the conductive particles 421 by electrochemical plating and other techniques. It should be noted that, in the natural state, the insulating outer layer 422 of the filler particles 42 covers the surface of the conductive particles 421, so that the filler particles 42 are insulated as a whole. It is understandable that when the filler particles 42 are squeezed by an external force, the insulating outer layer 422 will rupture under the pressure of the external force, and the conductive particles 421 will be exposed, so that the filler particles 42 have conductivity. The insulating outer layer 422 of the filler particles 42 that is at least partially located between the light-emitting element 30 and the electrode 20 ruptures under the pressure of the light-emitting element 30 and the electrode 20, so that the light-emitting element 30 and the electrode 20 are electrically connected through the conductive particles 421.

[0041] Through the above-mentioned embodiment, the insulating outer layer 422 of the filling particles 42 remains intact when not squeezed, so that the filling layer 40 has good overall insulation, and breaks under the squeezing of the light-emitting element 30 and the electrode 20, so that the light-emitting element 30 and the electrode 20 can be electrically connected through the conductive particles 421. Therefore, the filling glue 41 improves the connection stability between the light-emitting element 30 and the electrode 20, and the filling particles 42 improve the conductive effect between the light-emitting element 30 and the electrode 20, thereby reducing the risk of poor contact between the light-emitting element 30 and the electrode 20.

[0042] In some embodiments, the insulating outer layer 422 of at least a portion of the filling particles 42 is broken under the pressure of the light-emitting element 30 and the electrode 20, and the conductive particles 421 are exposed in the direction opposite to the light-emitting element 30 and the electrode 20, so that the light-emitting element 30 and the electrode 20 are electrically connected through the conductive particles 421. It can be understood that in the process of manufacturing the light-emitting device 2, when the light-emitting element 30 is arranged on the side of the filling layer 40 away from the electrode 20, the light-emitting element 30 and the electrode 20 will squeeze the filling particles 42, so that the insulating outer layer 422 of at least a portion of the filling particles 42 is broken under the pressure, and the insulating outer layer 422 in the pressure direction of the light-emitting element 30 and the electrode 20, that is, the direction opposite to the electrode 20, is broken to expose the conductive particles 421, so that the filling particles 42 have conductivity in the direction opposite to the light-emitting element 30 and the electrode 20, and then the light-emitting element 30 and the electrode 20 are electrically connected through the exposed conductive particles 421. It should be noted that, since the insulating outer layer 422 is not squeezed in other directions, the insulating outer layer 422 is not broken in other directions, that is, the filling particles 42 are conductive in the direction in which the light-emitting element 30 and the electrode 20 are relative to each other, and are insulating in other directions. For example, in the direction perpendicular to the relative direction of the light-emitting element 30 and the electrode 20, the filling particles 42 are still insulating through the insulating outer layer 422. Thus, the light-emitting element 30 and the electrode 20 can be electrically connected through the filling particles 42, and the filling particles 42 are insulating in other directions, which reduces the risk of short circuits at some locations due to the conductivity of the filling particles 42 in all directions, thereby improving the reliability of the light-emitting device 2.

[0043] In some embodiments, the electrode 20 includes a first sub-electrode 21 and a second sub-electrode 22 spaced apart in the direction in which the carrier substrate 10 extends, and the filling layer 40 is also filled between the first sub-electrode 21 and the second sub-electrode 22. One of the first sub-electrode 21 and the second sub-electrode 22 may correspond to one of the positive electrode and the negative electrode, and the other of the first sub-electrode 21 and the second sub-electrode 22 may correspond to the other of the positive electrode and the negative electrode. Exemplarily, the first sub-electrode 21 corresponds to the positive electrode, and the second sub-electrode 22 corresponds to the negative electrode. The filling layer 40 is filled between the first sub-electrode 21 and the second sub-electrode 22. It should be noted that the filling particles 42 in the filling layer 40 are not squeezed between the first sub-electrode 21 and the second sub-electrode 22, so in the spacing direction between the first sub-electrode 21 and the second sub-electrode 22, the insulating outer layer 422 of the filling particles 42 is not broken, and the filling particles 42 have insulation. Thus, the risk of the filling particles 42 causing an electrical connection between the first sub-electrode 21 and the second sub-electrode 22 and causing a short circuit between the first sub-electrode 21 and the second sub-electrode 22 is reduced. In addition, there is no need to provide other additional insulating barrier parts between the first sub-electrode 21 and the second sub-electrode 22, thereby saving production costs.

[0044] In some embodiments, the light emitting device 2 further comprises a functional layer group 50, the functional layer group 50 protrudes from the carrier substrate 10 and is formed with a receiving groove 51, the electrode 20 is located in the receiving groove 51, the filling layer 40 is filled in the receiving groove 51, and the light emitting element 30 is arranged at the notch of the receiving groove 51. The functional layer group 50 can be protruded from the carrier substrate 10 and form a receiving groove 51, so that the electrode 20 can be accommodated through the receiving groove 51, and the flow space of the filling layer 40 can be limited by the receiving groove 51, thereby reducing the risk of the filling layer 40 flowing to other areas when it is not solidified. The light emitting element 30 is arranged at the notch of the receiving groove 51, and the light emitting element 30 can be arranged by a hot pressing process, and the temperature of the hot pressing process can be between 170 degrees Celsius and 230 degrees Celsius, specifically, the temperature of the hot pressing process can be 170 degrees Celsius, 180 degrees Celsius, 190 degrees Celsius, 200 degrees Celsius, 210 degrees Celsius, 225 degrees Celsius, 230 degrees Celsius, and the like. The pressure of the hot pressing process may be between 100 KPa and 200 KPa, specifically, the pressure of the hot pressing process may be 100 KPa, 120 KPa, 140 KPa, 160 KPa, 180 KPa, 200 KPa, etc. For example, the light emitting element 30 may be hot pressed onto the filling layer 40 at a temperature of 200 degrees Celsius and a pressure of 150 KPa.

[0045] In some embodiments, the accommodating groove 51 includes a first groove 511 and a second groove 512 spaced apart from each other, the first sub-electrode 21 is located in the first groove 511, and the second sub-electrode 22 is located in the second groove 512. The functional layer group 50 may be formed with a first groove 511 and a second groove 512 spaced apart from each other, and in some application scenarios, the filling layer 40 may be filled in the first groove 511 and the second groove 512, respectively. Thus, part of the functional layer group 50 is located between the first sub-electrode 21 and the second sub-electrode 22 to form the first groove 511 and the second groove 512 so that the first sub-electrode 21 and the second sub-electrode 22 are spaced apart, thereby further reducing the risk of short circuit between the first sub-electrode 21 and the second sub-electrode 22.

[0046] In some embodiments, the functional layer group 50 includes an insulating layer 52, which protrudes from the carrier substrate 10 and is disposed in the same layer as the electrode 20. The functional layer group 50 may form a receiving groove 51 through the insulating layer 52, and the electrode 20 is located in the receiving groove 51, thereby reducing the risk of short circuit of the electrode 20. Figure 7-Figure 8 As shown, the electrode 20 includes a first sub-electrode 21 and a second sub-electrode 22 , and part of the insulating layer 52 may also be located between the first sub-electrode 21 and the second sub-electrode 22 , thereby further reducing the risk of short circuit between the first sub-electrode 21 and the second sub-electrode 22 .

[0047] In some embodiments, the functional layer group 50 further includes a reflective layer 53 . The reflective layer 53 covers at least a portion of the insulating layer 52 on a side away from the carrier substrate 10 . The reflective layer 53 is used to reflect the light beam emitted by the light emitting element 30 .

[0048] In some embodiments, the carrier substrate 10 includes a glass substrate 11 and a buffer layer 12, the buffer layer 12 is disposed on the side of the glass substrate 11 facing the electrode 20, and the carrier substrate 10 is connected to the electrode 20 through the buffer layer 12. The buffer layer 12 can be used to improve the adhesion between the carrier substrate 10 and the electrode 20 and the functional layer group 50, and the material of the buffer layer 12 can include but is not limited to silicon dioxide. The glass substrate 11 can provide support and protection for the buffer layer 12. Thus, the tightness of the connection between the glass substrate 11 and the electrode 20 and the functional layer group 50 can be improved through the buffer layer 12, and the risk of peeling and falling off between the electrode 20 and the functional layer group 50 and the glass substrate 11 can be alleviated.

[0049] In some embodiments, the light emitting device 2 further includes a transparent protective glue 60, which covers the side of the light emitting element 30 away from the carrier substrate 10 to transmit the light beam emitted by the light emitting element 30. The transparent protective glue 60 can provide protection for the light emitting element 30, and allow the light beam emitted by the light emitting element 30 to be transmitted outward through the transparent protective glue 60. Thus, the risk of damage to the light emitting element 30 can be reduced by the transparent protective glue 60.

[0050] In summary, the present application provides a light-emitting device 2, which includes a supporting substrate 10, an electrode 20, a light-emitting element 30 and a filling layer 40. The electrode 20 is arranged on the supporting substrate 10, and the light-emitting element 30 is arranged on the side of the electrode 20 away from the supporting substrate 10. The filling layer 40 includes a filling glue 41 and filling particles 42. The filling particles 42 are mixed in the filling glue 41. The filling particles 42 include conductive particles 421 and an insulating outer layer 422. The insulating outer layer 422 covers the outer surface of the conductive particles 421. The insulating outer layer 422 of the filling particles 42 at least partially located between the light-emitting element 30 and the electrode 20 is broken under the extrusion of the light-emitting element 30 and the electrode 20, so that the light-emitting element 30 and the electrode 20 are electrically connected through the conductive particles 421. Through the above-mentioned embodiment, the insulating outer layer 422 of the filling particles 42 remains intact when not squeezed, so that the filling layer 40 has good overall insulation, and breaks under the squeezing of the light-emitting element 30 and the electrode 20, so that the light-emitting element 30 and the electrode 20 can be electrically connected through the conductive particles 421. Therefore, the filling glue 41 improves the connection stability between the light-emitting element 30 and the electrode 20, and the filling particles 42 improve the conductive effect between the light-emitting element 30 and the electrode 20, thereby reducing the risk of poor contact between the light-emitting element 30 and the electrode 20.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A light emitting device, characterized in that: The light emitting device comprises: A carrier substrate; An electrode, disposed on the supporting substrate; A light emitting element is arranged on a side of the electrode away from the supporting substrate; A filling layer, wherein the filling layer comprises a filling glue and filling particles, wherein the filling particles are mixed in the filling glue, wherein the filling particles comprise conductive particles and an insulating outer layer, wherein the insulating outer layer covers the outer surface of the conductive particles, wherein the insulating outer layer of the filling particles at least partially located between the light-emitting element and the electrode is broken under the pressure of the light-emitting element and the electrode, so that the light-emitting element and the electrode are electrically connected through the conductive particles.

2. The light emitting device according to claim 1, characterized in that: At least part of the insulating outer layer of the filling particles is broken under the pressure of the light-emitting element and the electrode, and the conductive particles are exposed in the direction opposite to the light-emitting element and the electrode, so that the light-emitting element and the electrode are electrically connected through the conductive particles.

3. The light emitting device according to claim 2, characterized in that: The electrode comprises a first sub-electrode and a second sub-electrode which are spaced apart in the extending direction of the carrier substrate, and the filling layer is also filled between the first sub-electrode and the second sub-electrode.

4. The light emitting device according to claim 3, characterized in that: The light-emitting device further comprises a functional layer group, which protrudes from the carrier substrate and forms a receiving groove, the electrode is located in the receiving groove, the filling layer fills the receiving groove, and the light-emitting element is arranged at the notch of the receiving groove.

5. The light emitting device according to claim 4, characterized in that: The receiving groove includes a first groove and a second groove spaced apart from each other, the first sub-electrode is located in the first groove, and the second sub-electrode is located in the second groove.

6. The light emitting device according to claim 4, characterized in that: The functional layer group includes an insulating layer, which protrudes from the supporting substrate and is arranged in the same layer as the electrode.

7. The light emitting device according to claim 6, characterized in that: The functional layer group further includes a reflective layer, which covers at least a portion of the insulating layer on a side away from the carrier substrate, and is used to reflect the light beam emitted by the light-emitting element.

8. The light emitting device according to claim 1, characterized in that: The carrier substrate comprises a glass substrate and a buffer layer. The buffer layer is arranged on a side of the glass substrate facing the electrode. The carrier substrate is connected to the electrode through the buffer layer.

9. The light emitting device according to claim 1, characterized in that: The light emitting device further comprises a transparent protective glue, and the transparent protective glue covers a side of the light emitting element away from the supporting substrate to transmit the light beam emitted by the light emitting element.

10. A display device, characterized in that: The display device comprises the light emitting device according to any one of claims 1-9.

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