Display device and manufacturing method thereof

Abstract

A display device and a method of manufacturing the same are disclosed. The display device includes a substrate on which pixels are defined, each pixel including a plurality of sub-pixels; a step forming layer disposed on the substrate; an adhesive layer disposed on the step-forming layer; and a plurality of light emitting elements disposed in the plurality of sub-pixels, respectively, and disposed on the adhesive layer, in which the adhesive layer includes: a plurality of first portions overlapping the light emitting elements, respectively, and a plurality of non-adhesive regions disposed adjacent to the first portions, respectively; and a second portion other than the plurality of first portions and the plurality of non-adhesive regions. Accordingly, the transfer process may be simplified and the transfer process time may be reduced.

Description

Technical Field

[0001] The present disclosure relates to a display device and a method of manufacturing the display device, and more particularly, to a display device using an LED (Light Emitting Diode) and a method of manufacturing the display device. Background Art

[0002] Display devices used in computer monitors, TVs, mobile phones, etc. include organic light emitting display devices (OLED) that emit light by themselves and liquid crystal display devices (LCD) that require a separate light source, etc.

[0003] The application range of display devices is becoming more diverse, ranging from computer monitors and TVs to personal portable devices. Therefore, research is being conducted on display devices having a large display area size but reduced volume and weight.

[0004] In addition, recently, a display device including an LED (light emitting diode) as an inorganic light emitting element has attracted attention as a next-generation display device. Since the LED is not made of an organic material but of an inorganic material, the display device including the LED has excellent reliability and a long life compared to a liquid crystal display device or an organic light emitting display device. In addition, the LED not only has a fast turn-on / off speed, but also has excellent luminous efficiency, strong impact resistance, excellent stability, and can display high-brightness images. Summary of the invention

[0005] One technical objective that the present disclosure aims to achieve is to provide a display device and a method for manufacturing the display device in which only a portion of an adhesive layer to which a light-emitting element is to be transferred in a transfer process has adhesion, while the rest of the adhesive layer has no adhesion.

[0006] Another technical object that the present disclosure aims to achieve is to provide a display device in which the adhesion of a portion of an adhesive layer corresponding to a light emitting element is enhanced, and a method of manufacturing the display device.

[0007] Another technical objective that the present disclosure aims to achieve is to provide a display device in which some of a plurality of light-emitting elements on a donor are selectively transferred to a region corresponding to a sub-pixel and a method for manufacturing the display device.

[0008] Still another technical objective that the present disclosure aims to achieve is to provide a display device and a method for manufacturing the display device in which a transfer process is simplified and a transfer process time is reduced.

[0009] Still another technical objective that the present disclosure aims to achieve is to provide a display device and a method for manufacturing the display device in which a plurality of transfer processes can be continuously performed using one donor.

[0010] The purpose according to the present disclosure is not limited to the above-mentioned purpose. Other purposes and advantages according to the present disclosure that are not mentioned can be understood based on the following description, and can be more clearly understood based on the embodiments according to the present disclosure. In addition, it will be easily understood that the purposes and advantages according to the present invention can be achieved using the means shown in the claims or their combination.

[0011] One aspect of the present disclosure provides a display device, comprising: a substrate, on which pixels are defined, each pixel comprising a plurality of sub-pixels; a step-forming layer, the step-forming layer being disposed on the substrate; an adhesive layer, the adhesive layer being disposed on the step-forming layer; and a plurality of light-emitting elements, the plurality of light-emitting elements being respectively disposed in the plurality of sub-pixels and on the adhesive layer, wherein the adhesive layer comprises: a plurality of first portions, the plurality of first portions respectively overlapping the light-emitting elements, a plurality of non-adhesive regions, the plurality of non-adhesive regions respectively disposed adjacent to the first portions; and a second portion outside the plurality of first portions and the plurality of non-adhesive regions.

[0012] Another aspect of the present disclosure provides a method for manufacturing a display device, wherein the method includes: transferring a plurality of light-emitting elements on a chip to a donor; providing a step-forming layer on a substrate of a display panel; patterning the step-forming layer to form an opening defined therein; providing an adhesive layer on the step-forming layer; providing a mask on the adhesive layer and irradiating light thereto; and transferring the plurality of light-emitting elements on the donor to the display panel, wherein the adhesive layer includes a plurality of first portions overlapping with the mask, and a plurality of non-adhesive areas that do not overlap with the mask and are exposed to light, wherein the opening overlaps with each of the plurality of first portions and each of the plurality of non-adhesive areas, and wherein only the light-emitting elements among the plurality of light-emitting elements that are respectively in contact with the plurality of first portions are transferred to the display panel.

[0013] Details of other implementations are included in the detailed description and accompanying drawings.

[0014] The technical solutions according to the implementation methods of the present disclosure are not limited to the above solutions, and those skilled in the art can clearly understand other solutions not mentioned from the following description.

[0015] According to the display device and the method of manufacturing the display device of the present disclosure, only the portion of the adhesive layer to which the light emitting element is to be transferred in the transfer process has adhesion, and the rest of the adhesive layer has no adhesion.

[0016] According to the display device and the method of manufacturing the display device of the present disclosure, the adhesive force of the portion of the adhesive layer corresponding to the light emitting element is enhanced.

[0017] According to the display device and the method of manufacturing the display device of the present disclosure, some of the plurality of light emitting elements on the donor are selectively transferred to the region corresponding to the sub-pixel.

[0018] According to the display device and the method of manufacturing the display device of the present disclosure, the transfer process is simplified and the transfer process time is reduced.

[0019] According to the display device and the method of manufacturing the display device of the present disclosure, a plurality of transfer processes may be continuously performed using one donor.

[0020] The effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

[0021] In addition to the above-described effects, while describing specific details for carrying out the present disclosure, specific effects of the present disclosure are also described together. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of a display device according to one embodiment of the present disclosure.

[0023] Figure 2A is a cross-sectional view of a portion of a display device according to one embodiment of the present disclosure.

[0024] Figure 2B is a stereoscopic diagram of a spliced ​​display device according to an embodiment of the present disclosure.

[0025] Figure 3A is an enlarged plan view of a display device according to one embodiment of the present disclosure.

[0026] Figure 3B is a cross-sectional view of a display device according to one embodiment of the present disclosure.

[0027] FIG. 4A to FIG. 4I A method of manufacturing a display device according to one embodiment of the present disclosure is illustrated.

[0028] Figures 5A to 5E A method of manufacturing a display device according to one embodiment of the present disclosure is illustrated.

[0029] Figure 6 is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0030] Fig. 7A is a top view of a display device according to another embodiment of the present disclosure.

[0031] Figure 7B yes Fig. 7A Cross-sectional view of area AA' in FIG.

[0032] Figure 7C yes Fig. 7A Cross-sectional view of area BB' in FIG.

[0033] Figure 8 is a top view of a display device according to yet another embodiment of the present disclosure. DETAILED DESCRIPTION

[0034] The advantages and features of the present disclosure and the methods for achieving these advantages and features will become apparent with reference to the embodiments described in detail below and the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms. Therefore, these embodiments are described only to complete the present disclosure and fully inform the ordinary technicians in the technical field to which the present disclosure belongs.

[0035] For the sake of brevity and clarity of explanation, the elements in the accompanying drawings are not necessarily drawn to scale. The same reference numerals in different drawings represent the same or similar elements, and therefore perform similar functions. In addition, in order to simplify the description, the description and details of known steps and elements are omitted. In addition, in the following detailed description of the present disclosure, many specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it should be understood that the present disclosure can be practiced without these specific details. In other cases, known methods, steps, components and circuits are not described in detail to avoid making the various aspects of the present disclosure unnecessarily vague. The examples of various embodiments are further described and described below. It will be understood that the description herein is not intended to limit the claims to the specific embodiments described. On the contrary, it is intended to cover substitutions, modifications and equivalents that may be included in the spirit and scope of the present disclosure defined by the appended claims.

[0036] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for describing the embodiments of the present disclosure are exemplary, and the present disclosure is not limited thereto.

[0037] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "one" and "an" are also intended to include plural forms, unless the context clearly states otherwise. It will be further understood that when the terms "include", "comprise" and "contain" are used in this application, the existence of the features, integers, operations, elements and / or parts described is specified, but the existence or addition of one or more other features, integers, operations, elements, parts and / or parts thereof is not excluded. As used herein, the term "and / or" includes any and all combinations of one or more related listed items. When expressions such as "at least one" are adjacent to a series of elements, the expression can modify the elements of the entire series and does not modify the individual elements in the series. When explaining numerical values, even if there is no clear description, errors or tolerances can also occur therein.

[0038] It will be understood that when an element or layer is referred to as being “connected to” or “coupled to” another element or layer, it can be directly on, connected to or coupled to the other element or layer, or one or more intervening elements or layers may be present. Additionally, it will be understood that when an element or layer is referred to as being “between” two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers may also be present.

[0039] In addition, as used herein, when a layer, film, region, plate, etc. is disposed "on" or "on top" of another layer, film, region, plate, etc., the former may directly contact the latter, or one or more layers, films, regions, plates, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed directly "on" or "on top" of another layer, film, region, plate, etc., the former directly contacts the latter and no further layer, film, region, plate, etc. is disposed between the former and the latter. In addition, as used herein, when a layer, film, region, plate, etc. is disposed "under" or "below" another layer, film, region, plate, etc., the former may directly contact the latter, or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed directly "under" or "below" another layer, film, region, plate, etc., the former directly contacts the latter and no further layer, film, region, plate, etc. is disposed between the former and the latter.

[0040] When describing a temporal relationship, for example, a temporal precedence relationship between two events such as "after", "subsequently", "before", etc., another event may occur between them unless "directly after", "directly after", or "directly before" is indicated.

[0041] When a certain embodiment can be implemented differently, the function or operation specified in a particular block may occur in an order different from the order specified in the flow chart. For example, two consecutive blocks may actually be executed substantially simultaneously, or the two blocks may be executed in reverse order, depending on the function or operation involved.

[0042] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part, and may not limit the order or sequence. Thus, without departing from the spirit and scope of the present disclosure, the first element, component, region, layer or part described below may be referred to as a second element, component, region, layer or part.

[0043] For ease of explanation, spatially relative terms such as "below", "under", "lower", "below", "above", "upper", etc. may be used herein to describe the relationship of one element or feature shown in the figures to another element or feature. It will be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, when the device in the accompanying drawings can be turned over, the elements described as "below" or "below" or "below" other elements or features will then be oriented as "above" other elements or features. Therefore, the example terms "below" and "below" may include both above and below orientations. The device may be oriented otherwise, such as rotated 90 degrees or other orientations, and the spatially relative descriptors used herein should be interpreted accordingly.

[0044] The features of various embodiments of the present disclosure can be combined with each other in part or in whole, and can be technically associated with each other or operate with each other. These embodiments can be implemented independently of each other, or can be implemented together in an associated relationship.

[0045] When interpreting numerical values, the values ​​are interpreted as including the error range unless there is explicit description thereof separately.

[0046] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly so defined herein.

[0047] As used herein, "embodiment," "example," "aspect," etc. should not be construed as making any aspect or design described preferred or advantageous over other aspects or designs.

[0048] Furthermore, the term “or” means an inclusive or rather than an exclusive or. For example, unless stated otherwise or clear from the context, a statement such as 'x employs a or b' means any of the natural inclusive permutations.

[0049] The terms used in the following description have been selected to be general and commonly used in the relevant technical field. However, other terms besides the terms may exist according to the development and / or change of technology, convention, preference of technicians, etc. Therefore, the terms used in the following description should not be understood as limiting the technical concept, but should be understood as examples of terms used to describe the embodiments.

[0050] In addition, in certain cases, the applicant may arbitrarily select terms, and in this case, the detailed meanings thereof will be described in the corresponding description section. Therefore, the terms used in the following description should not be simply based on the names of the terms, but should be understood based on the meanings of the terms and the contents of the entire detailed description.

[0051] In the description of a signal flow, for example, when a signal is transmitted from node A to node B, unless the phrase “transmitted immediately” or “transmitted directly” is used, this may include a case where the signal is transmitted from node A to node B via another node.

[0052] Hereinafter, the present disclosure will be described with reference to the accompanying drawings.

[0053] Figure 1 is a schematic diagram of a display device according to an embodiment of the present disclosure. For ease of explanation, Figure 1 Only the display panel PN, the gate driver GD, the data driver DD, and the timing controller TC among the various components of the display device 100 are shown.

[0054] Reference Figure 1 The display device 100 includes a display panel PN including a plurality of sub-pixels SP, a gate driver GD and a data driver DD providing various signals to the display panel PN, and a timing controller TC controlling the gate driver GD and the data driver DD.

[0055] The gate driver GD provides a plurality of scan signals to a plurality of scan lines SL according to a plurality of gate control signals provided from the timing controller TC. Figure 1 , one gate driver GD is illustrated as being disposed on and spaced apart from one side of the display panel PN. However, the number and configuration of the gate drivers GD are not limited thereto.

[0056] The data driver DD converts image data input from the timing controller TC into data voltages using reference gamma voltages according to a plurality of data control signals provided from the timing controller TC. The data driver DD may provide the converted data voltages to the plurality of data lines DL.

[0057] The timing controller TC arranges the image data input from the external source and provides the arranged data to the data driver DD. The timing controller TC may generate a gate control signal and a data control signal using synchronization signals (e.g., a dot clock signal, a data enable signal, and a horizontal / vertical synchronization signal) input from the external source. The timing controller TC may provide the generated gate control signal and the generated data control signal to the gate driver GD and the data driver DD, respectively, to control the gate driver GD and the data driver DD.

[0058] The display panel PN is a component for displaying an image to a user, and includes a plurality of sub-pixels SP. In the display panel PN, a plurality of scan lines SL and a plurality of data lines DL intersect each other, and each of the plurality of sub-pixels SP is connected to the scan line SL and the data line DL. Although not shown in the figure, each of the plurality of sub-pixels SP may be connected to a high potential power line, a low potential power line, a reference voltage line, etc.

[0059] A display area AA and a non-display area NA surrounding the display area AA may be defined in the display panel PN.

[0060] The display area AA is an area in the display device 100 where an image is displayed. A plurality of sub-pixels SP constituting each of a plurality of pixels PX and a circuit for driving the plurality of sub-pixels SP may be provided in the display area AA. Each of the plurality of sub-pixels SP refers to a minimum unit constituting the display area AA, and n sub-pixels SP may constitute one pixel PX. A light-emitting element and a thin film transistor for driving the light-emitting element may be provided in each of the plurality of sub-pixels SP. The types of the plurality of light-emitting elements may vary according to the type of the display panel PN. For example, when the display panel PN is an inorganic light-emitting display panel, the light-emitting element 120 may be a light-emitting diode (LED) or a micro light-emitting diode (micro-LED).

[0061] In the display area AA, a plurality of signal lines for transmitting various signals to a plurality of sub-pixels SP are provided. For example, the plurality of signal lines may include a plurality of data lines DL for providing a data voltage to each of the plurality of sub-pixels SP, and a plurality of scan lines SL for providing a gate voltage to each of the plurality of sub-pixels SP, etc. The plurality of scan lines SL may extend in one direction in the display area AA and may be connected to the plurality of sub-pixels SP, and the plurality of data lines DL may extend in a direction different from the one direction in the display area AA and may be connected to the plurality of sub-pixels SP. In addition, a low potential power line, a high potential power line, etc. may be further provided in the display area AA. However, the embodiments of the present disclosure are not limited thereto.

[0062] The non-display area NA is an area where no image is displayed, and may be defined as an area extending from the display area AA. In the non-display area NA, wiring and pad electrodes for transmitting signals to the sub-pixels SP of the display area AA, or driver ICs such as a gate driver IC and a data driver IC may be disposed.

[0063] In one example, the non-display area NA may be located on the rear surface of the display panel PN, that is, on a surface where the sub-pixel SP does not exist, or may be omitted. However, the present disclosure is not limited to what is shown in the drawings.

[0064] In one example, drivers such as a gate driver GD, a data driver DD, and a timing controller TC may be connected to the display panel PN in various schemes. For example, the gate driver GD may be installed in the non-display area NA in a GIP (gate in panel) scheme, or may be installed between a plurality of sub-pixels SP in the display area AA in a GIA (gate in active area) scheme. For example, the data driver DD and the timing controller TC may be formed in a separate flexible film and a printed circuit board, and the flexible film and the printed circuit board may be bonded to a pad electrode formed in the non-display area NA of the display panel PN, so that the data driver DD and the timing controller TC may be electrically connected to the display panel PN. When the gate driver GD is implemented in a GIP scheme and the data driver DD and the timing controller TC transmit signals to the display panel PN via the pad electrode in the non-display area NA, it is necessary to ensure the area of ​​the non-display area NA where the gate driver GD and the pad electrode are set, so that the frame size may increase.

[0065] Alternatively, the gate driver GD may be installed in the display area AA using the GIA scheme, and a side line SRL connecting the signal line on the front surface of the display panel PN and the pad electrode on the rear surface of the display panel PN may be formed, and the flexible film and the printed circuit board are bonded to the rear surface of the display panel PN. In this case, the size of the non-display area NA on the front surface of the display panel PN can be reduced to a minimum size. In other words, when the gate driver GD, the data driver DD, and the timing controller TC are connected to the display panel PN using the above scheme, this can achieve a zero border with substantially no border. A description thereof is provided with reference to Figure 2A and Figure 2B .

[0066] Figure 2A is a cross-sectional view of a portion of a display device according to one embodiment of the present disclosure. Figure 2B is a stereoscopic diagram of a spliced ​​display device according to an embodiment of the present disclosure.

[0067] A plurality of pad electrodes are provided in the non-display area NA of the display panel PN to transmit various signals to the plurality of sub-pixels SP. For example, a first pad electrode PAD1 for transmitting signals to the plurality of sub-pixels SP may be provided in the non-display area NA of the front surface of the display panel PN. A second pad electrode PAD2 may be provided in the non-display area NA of the rear surface of the display panel PN and may be electrically connected to a driving component such as a flexible film and a printed circuit board.

[0068] In this case, although not shown in the drawings, various signal lines connected to the plurality of sub-pixels SP, for example, scan lines SL or data lines DL may extend from the non-display area NA to the display area AA and may be electrically connected to the first pad electrode PAD1.

[0069] The side line SRL is disposed along the side surface of the display panel PN. The side line SRL may electrically connect the first pad electrode PAD1 of the front surface of the display panel PN and the second pad electrode PAD2 of the rear surface of the display panel PN to each other. Therefore, a signal of a driving part from the rear surface of the display panel PN may be transmitted to a plurality of sub-pixels SP through the second pad electrode PAD2, the side line SRL, and the first pad electrode PAD1. Therefore, the area size of the non-display area NA of the display panel PN may be minimized by forming a signal transmission path from the front surface to the side surface to the rear surface of the display panel PN.

[0070] In addition, refer to Figure 2B By connecting a plurality of display devices 100 to each other, a spliced ​​display device TD having a large screen can be realized. Figure 2AAs shown in , when a spliced ​​display device TD is implemented using a display device 100 having a minimum frame, a seam area where no image is displayed between adjacent display devices 100 can be minimized, so that display quality can be improved.

[0071] For example, a plurality of sub-pixels SP may constitute one pixel PX, and an interval D1 between an outermost pixel PX of one display device 100 and an outermost pixel PX of another display device 100 adjacent thereto may be equal to an interval D1 between adjacent pixels PX within one display device 100. Therefore, an interval between pixels PX of adjacent display devices 100 and an interval between pixels PX in a display device 100 may be constant, thereby minimizing a seam area.

[0072] However, Figure 2A and Figure 2B This is just an example, and the display device 100 according to one embodiment of the present disclosure may be a general display device having a bezel. However, embodiments of the present disclosure are not limited thereto.

[0073] Figure 3A is an enlarged plan view of a display device according to one embodiment of the present disclosure. Figure 3B is a cross-sectional view of a display device according to one embodiment of the present disclosure.

[0074] First, refer to Figure 3A , the display panel PN includes a plurality of pixels PX, each pixel including a plurality of sub-pixels SP. Each of the plurality of sub-pixels SP may include a light-emitting element and a pixel circuit, and thus emit light independently. For example, the first sub-pixel SP1 may be a red sub-pixel, the second sub-pixel SP2 may be a green sub-pixel, and the third sub-pixel SP3 may be a blue sub-pixel. However, embodiments of the present disclosure are not limited thereto.

[0075] One pixel PX may include one or more first subpixels SP1, one or more second subpixels SP2, and one or more third subpixels SP3. For example, one pixel PX may be composed of two first subpixels SP1, two second subpixels SP2, and two third subpixels SP3.

[0076] Hereinafter, an example is described in which one pixel PX includes a pair of first sub-pixels SP1, a pair of second sub-pixels SP2, and a pair of third sub-pixels SP3. However, the configuration of the pixel PX is not limited thereto.

[0077] The plurality of sub-pixels SP included in one pixel PX may be arranged in pairs of rows. For example, in the first row, one first sub-pixel SP1, one second sub-pixel SP2, and one third sub-pixel SP3 may be sequentially arranged. In the second row, the remaining first sub-pixels SP1, the remaining second sub-pixels SP2, and the remaining third sub-pixels SP3 may be sequentially arranged.

[0078] Only one type of subpixel SP may be provided in one column. For example, in one pixel PX, only the first subpixel SP1 may be provided in the first column, only the second subpixel SP2 may be provided in the second column, and only the third subpixel SP3 may be provided in the third column. An area corresponding to a column in which the first subpixel SP1 is provided may be defined as a first area A1, an area corresponding to a column in which the second subpixel SP2 is provided may be defined as a second area A2, and an area corresponding to a column in which the third subpixel SP3 is provided may be defined as a third area A3.

[0079] The plurality of pixels PX may be arranged to be spaced apart from each other at equal intervals in the row direction. For example, in the row direction, the plurality of pixels PX may be arranged to be spaced apart from each other at equal intervals equal to the first length D1. That is, the spacing of the pixels PX may be the first length D1. In addition, although not shown in the drawings, the plurality of pixels PX may be arranged to be spaced apart from each other at equal intervals in the column direction.

[0080] The sub-pixels SP arranged in the same row in one pixel PX may be arranged to be separated from each other at equal intervals. For example, the sub-pixels SP arranged in the same row in one pixel PX may be arranged to be separated from each other at equal intervals equal to the second length D2. In other words, the width of each of the plurality of first areas A1, each of the plurality of second areas A2, and each of the plurality of third areas A3 may be the second length D2. In addition, the sub-pixels SP arranged in the same column in one pixel PX may be arranged to be separated from each other at equal intervals equal to the third length D3.

[0081] Next, refer to Figure 3B According to an embodiment of the present disclosure, each of the plurality of sub-pixels SP of the display panel PN of the display device 100 may include: a substrate 110, a buffer layer 111, a gate insulating layer 112, a first interlayer insulating layer 113a, a second interlayer insulating layer 113b, a first passivation layer 114a, a first planarization layer 115a, a second passivation layer 114b, an adhesive layer AD, a second planarization layer 115b, a third planarization layer 115c, a protective layer 116, a dam BB, a driving transistor DT, a light emitting element 120, a reflective layer RF, a first connection electrode CE1, a second connection electrode CE2, a light shielding layer LS, and an auxiliary electrode LE.

[0082] First, the substrate 110 is a component for supporting various components included in the display device 100, and may be made of an insulating material. For example, the substrate 110 may be made of glass or resin. In addition, the substrate 110 may be made of a polymer or plastic, and may be made of a material having flexibility.

[0083] A light shielding layer LS is disposed on the substrate 110 in each of the plurality of sub-pixels SP. The light shielding layer LS prevents light incident from a position below the substrate 110 from entering an active layer ACT of a driving transistor DT to be described later. The light shielding layer LS can prevent light from being incident on the active layer ACT of the driving transistor DT, thereby minimizing leakage current.

[0084] A buffer layer 111 is disposed on the substrate 110 and the light shielding layer LS. The buffer layer 111 can reduce the penetration of moisture or impurities through the substrate 110. The buffer layer 111 can be composed of a single layer or multiple layers made of, for example, silicon oxide (SiOx) or silicon nitride (SiNx). However, the present disclosure is not limited thereto. However, depending on the type of the substrate 110 or the type of the transistor, the buffer layer 111 can be omitted. However, the present disclosure is not limited thereto.

[0085] The driving transistor DT is disposed on the buffer layer 111. The driving transistor DT includes an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0086] An active layer ACT is disposed on the buffer layer 111. The active layer ACT may be made of a semiconductor material such as an oxide semiconductor, amorphous silicon, or polycrystalline silicon. However, the present disclosure is not limited thereto.

[0087] A gate insulating layer 112 is disposed on the active layer ACT. The gate insulating layer 112 is an insulating layer for insulating the active layer ACT and the gate electrode GE from each other, and may be composed of a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx). However, the present disclosure is not limited thereto.

[0088] The gate electrode GE is disposed on the gate insulating layer 112. The gate electrode GE may be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof. However, the present disclosure is not limited thereto.

[0089] A first interlayer insulating layer 113a and a second interlayer insulating layer 113b are disposed on the gate electrode GE. The first interlayer insulating layer 113a and the second interlayer insulating layer 113b have contact holes defined therein for connecting the source electrode SE and the drain electrode DE to the active layer ACT, respectively. The first interlayer insulating layer 113a and the second interlayer insulating layer 113b each serve as an insulating layer for protecting components below the first interlayer insulating layer 113a and the second interlayer insulating layer 113b, and may be composed of a single layer or a double layer made of silicon oxide (SiOx) or silicon nitride (SiNx). However, the present disclosure is not limited thereto.

[0090] A source electrode SE and a drain electrode DE electrically connected to the active layer ACT are disposed on the second interlayer insulating layer 113 b. The source electrode SE and the drain electrode DE may each be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof. However, the present disclosure is not limited thereto.

[0091] In one example, the present disclosure describes an example in which a first interlayer insulating layer 113a and a second interlayer insulating layer 113b, that is, a plurality of insulating layers, are provided between the gate electrode GE and the source electrode SE and the drain electrode DE. However, the present disclosure is not limited thereto. Only one insulating layer may be provided between the gate electrode GE and the source electrode SE and the drain electrode DE.

[0092] In addition, when a plurality of insulating layers such as the first interlayer insulating layer 113a and the second interlayer insulating layer 113b are provided between the gate electrode GE and the source electrode SE and the drain electrode DE, an electrode may be additionally formed between the first interlayer insulating layer 113a and the second interlayer insulating layer 113b. The additionally formed electrode and other components provided under the first interlayer insulating layer 113a or on top of the second interlayer insulating layer 113b may constitute a capacitor.

[0093] An auxiliary electrode LE is provided on the gate insulating layer 112. The auxiliary electrode LE serves as an electrode for electrically connecting the light shielding layer LS provided under the buffer layer 111 to one of the source electrode SE and the drain electrode DE provided on the second interlayer insulating layer 113b. For example, since the light shielding layer LS is electrically connected to the source electrode SE or the drain electrode DE via the auxiliary electrode LE and does not operate as a floating gate, the threshold voltage change of the driving transistor DT caused by the floating light shielding layer LS can be minimized. In the figure, the light shielding layer LS is shown as being connected to the drain electrode DE. However, the present disclosure is not limited thereto. The light shielding layer LS may be connected to the source electrode SE.

[0094] A first passivation layer 114a is disposed on the driving transistor DT. The first passivation layer 114a may be an insulating layer for protecting a structure below the first passivation layer 114a, and may be composed of a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx). However, the present disclosure is not limited thereto.

[0095] A first planarization layer 115a is disposed on the first passivation layer 114a. The first planarization layer 115a may planarize the top of a portion of the substrate 110 where the driving transistor DT is disposed. The first planarization layer 115a may be composed of a single layer or multiple layers made of, for example, a photoresist or an acrylic organic material. However, embodiments of the present disclosure are not limited thereto.

[0096] A reflective layer RF is disposed on the first planarization layer 115a. The reflective layer RF can electrically connect the light emitting element 120 to the driving transistor DT, and can reflect the light emitted from the light emitting element 120 therefrom to be directed toward the upper side of the light emitting element 120. The reflective layer RF can be made of a conductive material having excellent reflective properties, and can reflect the light emitted from the light emitting element 120 therefrom to be directed toward the upper side of the light emitting element.

[0097] A second passivation layer 114b is disposed on the reflective layer RF. The second passivation layer 114b may be an insulating layer for protecting a structure below the second passivation layer 114b, and may be composed of a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx). However, embodiments of the present disclosure are not limited thereto.

[0098] An adhesive layer AD is disposed on the second passivation layer 114b. The adhesive layer AD may be coated on the entire surface of the substrate 110 to fix the light emitting element 120 disposed on the adhesive layer AD to the substrate. The adhesive layer AD may be made of a light-curable adhesive material that can be cured by light. For example, the adhesive layer AD may be made of an acrylic material containing a photosensitizer. However, the embodiments of the present disclosure are not limited thereto. The adhesive layer AD may be formed on the entire surface of the display panel PN except for the area where the pad electrode is disposed. For example, Figure 2A As shown in , when a plurality of first pad electrodes PAD1 are formed on the front surface of the display panel PN, the adhesive layer AD may be formed in the remaining regions other than the region where the first pad electrodes PAD1 are formed.

[0099] The adhesive layer AD may be composed of a plurality of first portions AD1 respectively overlapping the plurality of light emitting elements 120, and a second portion AD2 which is the remaining portion other than the plurality of first portions AD1. The second portion AD2 of the adhesive layer AD may be cured before the light emitting elements 120 are transferred to the display panel PN, and the plurality of first portions AD1 of the adhesive layer AD may be cured after the light emitting elements 120 are transferred to the display panel PN. The plurality of first portions AD1 and the second portion AD2 of the adhesive layer AD may be cured at different times, so that only the light emitting elements 120 overlapping the plurality of sub-pixels SP among the plurality of light emitting elements 120 disposed on the donor may be selectively transferred to the display panel PN. This will be referred to later. FIG. 4A to FIG. 4I Describe it in more detail.

[0100] A plurality of light emitting elements 120 are disposed in each of the plurality of sub-pixels SP and disposed on the adhesive layer AD. The plurality of light emitting elements 120 may refer to elements that emit light based on current, and may include light emitting elements 120 that emit red light, green light, blue light, etc., respectively, and may emit light of a combination thereof to generate white light. For example, each of the plurality of light emitting elements 120 may be implemented as an LED (light emitting diode) or (micro LED). However, the embodiments of the present disclosure are not limited thereto.

[0101] The light emitting element 120 includes a first semiconductor layer 121 , a light emitting layer 122 , a second semiconductor layer 123 , a first electrode 124 , a second electrode 125 , and an encapsulation film 126 .

[0102] A first semiconductor layer 121 is disposed on the adhesive layer AD, and a second semiconductor layer 123 is disposed on the first semiconductor layer 121. The first semiconductor layer 121 and the second semiconductor layer 123 may be formed by doping n-type impurities and p-type impurities into specific materials, respectively. For example, the first semiconductor layer 121 and the second semiconductor layer 123 may contain doped n-type impurities and p-type impurities, respectively, in a matrix made of gallium nitride (GaN), indium aluminum phosphide (InAlP), or gallium arsenide (GaAs). At this point, the p-type impurity may be magnesium (Mg), zinc (Zn), beryllium (Be), etc., and the n-type impurity may be silicon (Si), germanium (Ge), tin (Sn), etc. However, the embodiments of the present disclosure are not limited thereto.

[0103] The light emitting layer 122 is disposed between the first semiconductor layer 121 and the second semiconductor layer 123. The light emitting layer 122 may emit light when receiving holes and electrons from the first semiconductor layer 121 and the second semiconductor layer 123, respectively. The light emitting layer 122 may be made of a single layer or a multi-quantum well (MQW) structure, and may be made of, for example, indium gallium nitride (InGaN) or gallium nitride (GaN). However, embodiments of the present disclosure are not limited thereto.

[0104] A first electrode 124 is provided on the first semiconductor layer 121. The first electrode 124 is an electrode for electrically connecting the driving transistor DT and the first semiconductor layer 121 to each other. The first electrode 124 may be provided on a portion of the upper surface of the first semiconductor layer 121 that is not covered by the light emitting layer 122 and the second semiconductor layer 123. The first electrode 124 may be made of a conductive material, for example, a transparent conductive material such as ITO (indium tin oxide) or IZO (indium zinc oxide), or an opaque conductive material such as titanium (Ti), gold (Au), silver (Ag), copper (Cu), or an alloy thereof. However, embodiments of the present disclosure are not limited thereto.

[0105] A second electrode 125 is disposed on the second semiconductor layer 123. The second electrode 125 may be disposed on an upper surface of the second semiconductor layer 123. The second electrode 125 is an electrode for electrically connecting a power line to the second semiconductor layer 123. The second electrode 125 may be made of a conductive material, for example, a transparent conductive material such as ITO (indium tin oxide) or IZO (indium zinc oxide), or an opaque conductive material such as titanium (Ti), gold (Au), silver (Ag), copper (Cu), or an alloy thereof. However, embodiments of the present disclosure are not limited thereto.

[0106] Next, an encapsulation film 126 is provided around the first semiconductor layer 121, the light emitting layer 122, the second semiconductor layer 123, the first electrode 124, and the second electrode 125. The encapsulation film 126 may be made of an insulating material and may protect the first semiconductor layer 121, the light emitting layer 122, and the second semiconductor layer 123. In addition, a contact hole exposing the first electrode 124 and the second electrode 125 may be formed in the encapsulation film 126, so that the first connection electrode CE1, the second connection electrode CE2, and the first electrode 124 and the second electrode 125 may be electrically connected to each other via the contact hole.

[0107] In one example, a portion of the side surface of the first semiconductor layer 121 may not be covered by the encapsulation film 126. The light emitting element 120 manufactured on the wafer may be removed from the wafer and transferred to the display panel PN. However, in the process of removing the light emitting element 120 from the wafer, a portion of the encapsulation film 126 may be torn. For example, in the process of removing the light emitting element 120 from the wafer, a portion of the encapsulation film 126 adjacent to the lower edge of the first semiconductor layer 121 of the light emitting element 120 may be torn, so that a portion of the lower side surface of the semiconductor layer 121 may be exposed to the outside. However, even when a portion of the lower side surface of the light emitting element 120 is not covered by the encapsulation film 126, the second planarization layer 115b and the third planarization layer 115c may be formed to cover the side surface of the first semiconductor layer 121, and then, the first connection electrode CE1 and the second connection electrode CE2 may be formed, so that the short circuit defect can be reduced.

[0108] Next, a second planarization layer 115b and a third planarization layer 115c are sequentially disposed on the adhesive layer AD and the light emitting element 120. The second planarization layer 115b may overlap a portion of the side surface of each of the plurality of light emitting elements 120, and may fix and protect the plurality of light emitting elements 120. The third planarization layer 115c may be formed to cover the second planarization layer 115b and the upper portion of the light emitting element 120. A contact hole exposing the first electrode 124 and the second electrode 125 of the light emitting element 120 may be formed in the third planarization layer 115c. The first electrode 124 and the second electrode 125 of the light emitting element 120 may not be covered by the third planarization layer 115c. The third planarization layer 115c may be partially disposed in a region between the first electrode 124 and the second electrode 125 to reduce short circuit defects. The combination of the second planarization layer 115b and the third planarization layer 115c may be composed of, for example, a single layer or multiple layers made of a photoresist or an acryl-based organic material. However, embodiments of the present disclosure are not limited thereto. In one example, in the present disclosure, an example in which the second planarization layer 115b and the third planarization layer 115c are provided is described. However, the planarization layer may be composed of a single layer. However, the embodiments of the present disclosure are not limited thereto.

[0109] In one example, the third planarization layer 115c may cover only the light emitting element 120 and the region adjacent to the light emitting element 120. The third planarization layer 115c may be formed only in the region where the bank BB is not formed. The third planarization layer 115c may be disposed in the region of the sub-pixel SP surrounded by the bank BB and may be disposed in an island shape. Therefore, the bank BB may be disposed on a portion of the upper surface of the second planarization layer 115b, and the third planarization layer 115c may be disposed on another portion of the upper surface of the second planarization layer 115b.

[0110] A first connection electrode CE1 and a second connection electrode CE2 are disposed on the third planarization layer 115c. The first connection electrode CE1 may be an electrode that electrically connects the second electrode 125 of the light emitting element 120 and a power line to each other. The first connection electrode CE1 may be electrically connected to the second electrode 125 of the light emitting element 120 via a contact hole formed in the third planarization layer 115c.

[0111] The second connection electrode CE2 may be an electrode electrically connecting the first electrode 124 of the light emitting element 120 to the driving transistor DT. The second connection electrode CE2 may be connected to the reflective layer RF of each of the plurality of sub-pixels SP via a contact hole extending through the third planarization layer 115c, the second planarization layer 115b, the adhesive layer AD, and the second passivation layer 114b. At this point, since the reflective layer RF is connected to the source electrode SE of the driving transistor DT, the source electrode SE of the driving transistor DT may be electrically connected to the first electrode 124 of the light emitting element 120 via the reflective layer RF and the second connection electrode CE2.

[0112] In one example, in the drawings, the first electrode 124, the second connection electrode CE2, and the reflective layer RF are shown as being electrically connected to the source electrode SE of the driving transistor DT. However, the first electrode 124, the second connection electrode CE2, and the reflective layer RF may be connected to the drain electrode DE of the driving transistor DT. However, embodiments of the present disclosure are not limited thereto.

[0113] A bank BB is provided on a portion of the second planarization layer 115b that is not covered by the third planarization layer 115c, and the first connection electrode CE1 and the second connection electrode CE2. The bank BB may be provided to be separated from the light emitting element 120 by a certain distance. For example, the bank BB may be provided on the second planarization layer 115b while being separated from the light emitting element 120 by a certain distance. The bank BB may cover a portion of the second connection electrode CE2 formed in a contact hole extending through the third planarization layer 115c and the second planarization layer 115b. The bank BB may be made of an opaque material to reduce color mixing between a plurality of sub-pixels SP. For example, the bank BB may be made of a black resin. However, embodiments of the present disclosure are not limited thereto.

[0114] A protective layer 116 is disposed on the connection electrode and the bank BB. The protective layer 116 may serve as a layer for protecting the structure below the protective layer 116, and may be composed of a single layer or multiple layers made of transmissive epoxy resin, silicon oxide (SiOx), or silicon nitride (SiNx). However, embodiments of the present disclosure are not limited thereto.

[0115] Regarding the display device 100 according to one embodiment of the present disclosure, when manufacturing the display device 100, the light emitting element 120 from the donor can be easily transferred to the sub-pixel by position-selectively controlling the adhesion of the adhesive layer AD. 4A to 4H A method of manufacturing the display device 100 according to one embodiment of the present disclosure is described.

[0116] FIG. 4A to FIG. 4I A method for manufacturing a display device according to an embodiment of the present disclosure is illustrated. For ease of explanation, FIG. 4A to FIG. 4IOnly the transfer of the light emitting element 120 to Figure 3A Although not shown in the drawings, the process of transferring the light emitting element 120 to the second sub-pixel SP2 and the third sub-pixel SP3 is substantially the same as the process of transferring the light emitting element 120 to the first sub-pixel SP1. For ease of explanation, the cured portion of the adhesive layer AD is shown in a non-hatched manner, and only the uncured portion thereof is shown in a hatched manner.

[0117] Reference Figure 4A , a wafer WF on which a plurality of light emitting elements 120 are formed is placed on the donor DN.

[0118] The wafer WF is used as a substrate on which a plurality of light emitting elements 120 are formed. After a material constituting the plurality of light emitting elements 120, such as gallium nitride (GaN) or indium gallium nitride (InGaN), is deposited on the wafer WF and its crystal layer is grown, the crystal layer may be cut into individual chips and electrodes may be formed on the chips to form the plurality of light emitting elements 120. The wafer WF may be composed of sapphire, silicon carbide (SiC), gallium nitride (GaN), zinc oxide (ZnO), etc. However, embodiments of the present disclosure are not limited thereto.

[0119] The donor DN is used as a transfer member for transferring the plurality of light emitting elements 120 on the wafer WF to the display panel PN. The plurality of light emitting elements 120 may be transferred to the donor DN so as to be arranged to be separated from each other at equal intervals, and then, the plurality of light emitting elements 120 may be simultaneously transferred to the display panel PN. The donor DN may include a polymer resin having viscoelasticity so that the plurality of light emitting elements 120 may be attached thereto.

[0120] After the plurality of light emitting elements 120 on the wafer WF are oriented to face the donor DN, some of the plurality of light emitting elements 120 on the wafer WF may be selectively transferred to the donor DN. For example, the laser LAS may be irradiated to some of the plurality of light emitting elements 120 on the wafer WF, and thus, some of the light emitting elements 120 irradiated with the laser LAS may be separated from the wafer WF and may be attached to the donor DN.

[0121] Reference Figure 4B as well as Figure 4A, the plurality of light emitting elements 120 transferred to the donor DN may be disposed in each of the plurality of first regions A1 of the donor DN. Each of the plurality of first regions A1 is a region corresponding to a column in which the plurality of first sub-pixels SP1 are disposed. Each of the plurality of light emitting elements 120 disposed in each of the plurality of first regions A1 may be transferred to the first sub-pixel SP1. The plurality of first regions A1 may be arranged to be separated from each other by an interval equal to a first length D1 that is an interval between adjacent pixels in the plurality of pixels PX. A distance from one side edge of a first region A1 to one side edge of a first region A1 adjacent thereto may be the first length D1.

[0122] The donor DN includes a plurality of first areas A1, a plurality of second areas A2, and a plurality of third areas A3. Each of the plurality of second areas A2 is an area corresponding to a column in which a plurality of second sub-pixels SP2 are arranged. Each of the plurality of third areas A3 is an area corresponding to a column in which a plurality of third sub-pixels SP3 are arranged. Therefore, when each light-emitting element 120 is transferred to each of the plurality of second sub-pixels SP2, the plurality of light-emitting elements 120 may be arranged in each of the plurality of second areas A2 of the donor DN. Similarly, when each light-emitting element 120 is transferred to each of the plurality of third sub-pixels SP3, the plurality of light-emitting elements 120 may be arranged in each of the plurality of third areas A3 of the donor DN.

[0123] In one example, the plurality of light emitting elements 120 transferred to each of the plurality of first regions A1 of the donor DN may be transferred to constitute a plurality of groups 120G. The plurality of groups 120G respectively have a plurality of light emitting elements 120. When the donor DN is coupled to the display panel PN, each of the plurality of groups 120G may correspond to one sub-pixel SP and an area adjacent to the one sub-pixel SP. For example, when the group 120G is disposed in the first sub-pixel SP1 and an area adjacent thereto, one group 120G may partially overlap with an area between one side edge of the first sub-pixel SP1 and one side edge of the second sub-pixel SP2 in the row direction, and partially overlap with an area between one side edge of the first sub-pixel SP1 and one side edge of the first sub-pixel SP1 adjacent thereto in the column direction.

[0124] The plurality of light emitting elements 120 constituting one group 120G may be arranged to be separated from each other by an interval smaller than an interval between adjacent sub-pixels SP in each of the row direction and the column direction. For example, the interval between adjacent light emitting elements of the plurality of light emitting elements 120 constituting one group 120G may be smaller than the second length D2 in the row direction, and may be smaller than the third length D3 in the column direction.

[0125] The number of light-emitting elements 120 included in each group 120G may vary according to the number of times one donor DN is used continuously in the transfer process. For example, when one donor DN is used continuously n times in the transfer process of transferring the light-emitting element 120 to the display panel PN, one group 120G may include n light-emitting elements 120. In each of the multiple transfer processes, each of the multiple light-emitting elements 120 included in one group 120G may be transferred to respective sub-pixels SP at different positions. Only the adhesive layer AD in the area to which each of the multiple light-emitting elements 120 is to be transferred selectively has adhesion. Therefore, only one of the multiple light-emitting elements 120 included in one group 120G may be selectively transferred to one sub-pixel SP, and thus multiple transfer processes may be performed continuously using one donor DN. FIG. 5A to FIG. 5E Provide a more detailed description thereof.

[0126] Next, refer to Figure 4C and Figure 4D , a mask MASK is set on the display panel PN on which the adhesive layer AD is formed, and light LT is irradiated to the adhesive layer AD. The mask MASK may be placed to cover the region to which the plurality of light emitting elements 120 are to be transferred, so that the light LT may be irradiated only to the remaining region to which the plurality of light emitting elements 120 are not transferred. Therefore, the adhesive layer AD may be composed of a plurality of first portions AD1 to which the light LT is not irradiated and a plurality of second portions AD2 to which the light LT is irradiated.

[0127] The plurality of first portions AD1 may correspond to the plurality of sub-pixels SP, respectively, and each of the second portions AD2 may correspond to a region between adjacent sub-pixels in the sub-pixel SP. The second portion AD2 of the adhesive layer AD to which the light LT is irradiated is solidified and has no adhesion, while the plurality of first portions AD1 of the adhesive layer AD to which the light LT is not irradiated may have adhesion. Therefore, only the plurality of first portions AD1 corresponding to the plurality of sub-pixels SP in the adhesive layer AD formed on the front surface of the display panel PN may have adhesion, while the second portions AD2 have no adhesion.

[0128] Next, refer to FIG. 4E to FIG. 4H , the plurality of light emitting elements 120 on the donor DN are transferred to the adhesive layer AD of the display panel PN. Figure 4E and Figure 4F The display panel PN and the donor DN on which the adhesive layer AD is formed are aligned with each other. The donor DN is oriented so that the plurality of light emitting elements 120 of the donor DN and the adhesive layer AD of the display panel PN face each other, and the display panel PN and the donor DN are combined with each other. Figure 4F As shown in FIG. 1 , when the donor DN and the display panel PN are coupled to each other, the adhesive layer AD of the display panel PN and the plurality of light emitting elements 120 of the donor DN overlap each other.

[0129] Refer to Figure 4G and Figure 4H , the donor DN and the display panel PN are combined with each other so that the light emitting element 120 on the donor DN is transferred to the adhesive layer AD, and then, the donor DN may be separated from the display panel PN.

[0130] The light emitting elements 120 respectively attached to the plurality of first portions AD1 of the adhesive layer AD may be separated from the donor DN and transferred to the display panel PN. However, the light emitting element 120 in contact with the second portion AD2 of the adhesive layer AD whose adhesion is removed by curing the second portion AD2 in the previous exposure process may remain in a state of being attached to the donor DN. Therefore, the light emitting element 120 in contact with only each of the plurality of first portions AD1 of the adhesive layer AD to which the light LT is not irradiated to maintain adhesion may be separated from the donor DN.

[0131] At this point, the plurality of light-emitting elements 120 correspond only to the plurality of first regions A1 disposed on the donor DN. Therefore, the plurality of light-emitting elements 120 of the donor DN may overlap only with each of the plurality of first regions A1 of the plurality of first sub-pixels SP1 of the display panel PN arranged. Only one light-emitting element 120 of the plurality of light-emitting elements 120 included in one group 120G may be in contact with the first portion AD1 of the first region A1 and may be transferred to the display panel PN. The remaining light-emitting elements 120 may remain on the donor DN while being in contact with the second portion AD2. Since the light-emitting element 120 does not exist on the region of the donor DN corresponding to the plurality of second regions A2 and the plurality of third regions A3, the light-emitting element 120 is not transferred to each of the plurality of first portions AD1 in the plurality of second regions A2 and the plurality of third regions A3. Therefore, the plurality of light-emitting elements 120 may be transferred to all of the plurality of first sub-pixels SP1 disposed in each of the plurality of first regions A1, respectively. The remaining plurality of light emitting elements 120 in each of the plurality of groups 120G of the donor DN may be later transferred to the display panel PN in another transfer process.

[0132] Thereafter, the light emitting element 120 may be transferred to each of the plurality of second sub-pixels SP2 disposed in each of the plurality of second regions A2. The light emitting element 120 may be transferred to each of the plurality of third sub-pixels SP3 disposed in each of the plurality of third regions A3. The transfer process may be repeated. The light emitting element 120 may be transferred to each of all the plurality of sub-pixels SP. Specifically, as Figure 4A and Figure 4B As shown in FIG. 1 , a plurality of light emitting elements 120 on the wafer WF may be transferred to each of a plurality of second regions A2 of the donor DN. FIG. 4E to FIG. 4HAs shown in FIG. 1 , the light emitting element 120 of the donor DN may be transferred to the plurality of first portions AD1 of the adhesive layer AD in each of the plurality of second regions A2, that is, to each of the second sub-pixels SP2. Then, the light emitting element 120 of the donor DN may be transferred to the plurality of first portions AD1 of the adhesive layer AD in each of the plurality of second regions A2, that is, to each of the second sub-pixels SP2. Figure 4A and Figure 4B as well as FIG. 4E to FIG. 4H The light emitting element 120 may be transferred to each of the plurality of third sub-pixels SP3 by the same process as in the process.

[0133] Finally, refer to Fig. 4I After the transfer process of the light emitting element 120 to all the plurality of sub-pixels SP is completed, the light LT may be irradiated to the entire area of ​​the adhesive layer AD to cure the entire area. The light LT may be irradiated to the entire adhesive layer AD without a separate mask MASK, so that all of the plurality of first portions AD1 of the adhesive layer AD may be cured.

[0134] Although not shown in the figure, after the entire adhesive layer AD is cured, a second planarization layer 115b, a third planarization layer 115c, a bank BB, a first connection electrode CE1, a second connection electrode CE2, and a protective layer 116 may be formed on the adhesive layer AD. In this way, the manufacturing process of the display device 100 is completed.

[0135] Therefore, in the display device 100 and the method for manufacturing the display device 100 according to one embodiment of the present disclosure, although the plurality of light-emitting elements 120 may be provided on the donor DN and may be arranged to be separated from each other at intervals smaller than the intervals between adjacent sub-pixels SP among the plurality of sub-pixels SP, only the plurality of first portions AD1 corresponding to the plurality of sub-pixels SP in the adhesive layer AD of the display panel PN have adhesion. In this state, the transfer process may be performed. Therefore, only the light-emitting elements 120 respectively overlapping the plurality of sub-pixels SP among the plurality of light-emitting elements 120 on the donor DN may be selectively transferred to the display panel PN. Therefore, the transfer defect in which the light-emitting element 120 is transferred to the region other than the plurality of sub-pixels SP in the display panel PN may be minimized.

[0136] In addition, in the method of manufacturing the display device 100 according to one embodiment of the present disclosure, the transfer process time can be shortened by continuously performing the transfer process multiple times using one donor DN. FIG. 5A to FIG. 5E Describe this.

[0137] Figures 5A to 5E A method of manufacturing a display device according to one embodiment of the present disclosure is illustrated. FIG. 5A to FIG. 5E It illustrates a process of transferring a plurality of light emitting elements 120 on the donor DN to the display panel PN when the display panel PN has a size larger than that of the donor DN.

[0138] Reference Figure 5A , the display panel PN may have a size larger than that of the donor DN. For example, the size of the display panel PN is about 4 times the size of the donor DN. In this case, in order to transfer the light emitting element 120 to the entire display panel PN, 4 donor DNs or 4 transfer processes may be required. However, in the method of manufacturing the display device 100 according to one embodiment of the present disclosure, the adhesive layer AD may have adhesion only in the area corresponding to each of the plurality of sub-pixels SP. Therefore, only some of the plurality of light emitting elements 120 disposed on one donor DN may be selectively transferred to the display panel PN, and the transfer process may be performed multiple times using one donor DN.

[0139] Hereinafter, for convenience of description, description will be made based on an example in which the size of the display panel PN is about 4 times the size of the donor DN. However, the size ratio of the donor DN and the display panel PN is only an example. Embodiments of the present disclosure are not limited thereto.

[0140] In this case, when the light emitting element 120 is transferred to all of the plurality of sub-pixels SP of the display panel PN in four transfer processes, the display panel PN may be divided into four regions. A transfer process is performed once in each of the four regions. The four regions may include, for example, a first transfer target region AR1, a second transfer target region AR2, a third transfer target region AR3, and a fourth transfer target region AR4. The light emitting element 120 may be transferred to one of the first transfer target region AR1, the second transfer target region AR2, the third transfer target region AR3, and the fourth transfer target region AR4 in one transfer process.

[0141] Before the light emitting element 120 is transferred from the donor DN to the display panel PN, a mask MASK may be set on the adhesive layer AD formed on the entire display panel PN, and light LT may be irradiated thereto so that the adhesive layer AD may be divided into a plurality of first portions AD1 corresponding to the plurality of sub-pixels SP and not irradiated with light and having adhesion, and a second portion AD2 irradiated with light and having no adhesion. Thus, the adhesive layer AD may be formed on the entire display panel PN, and only a region of the adhesive layer AD corresponding to each of the plurality of sub-pixels SP may have adhesion.

[0142] All of the plurality of light emitting elements 120 to be transferred to the first transfer target area AR1, the second transfer target area AR2, the third transfer target area AR3, and the fourth transfer target area AR4 may be disposed on the donor DN. For example, when 15 light emitting elements 120 are respectively transferred to 15 sub-pixels SP in each of the first transfer target area AR1, the second transfer target area AR2, the third transfer target area AR3, and the fourth transfer target area AR4, 15 groups 120G, each group 120G including four light emitting elements 120 used in four transfer processes, respectively, that is, 60 light emitting elements 120, may be disposed on the donor DN.

[0143] Reference Figure 5B , the plurality of light emitting elements 120 on the donor DN may be transferred to the first transfer target region of the display panel PN by bonding the donor DN to the first transfer target region AR1 of the display panel PN. At this point, all of the plurality of light emitting elements 120 on the donor DN may be in contact with the adhesive layer AD of the first transfer target region AR1, or only the light emitting elements 120 in contact with the plurality of first portions AD1 having adhesion may be selectively transferred to the first transfer target region AR1, while the light emitting elements 120 in contact with the second portions AD2 thereof remain on the donor DN.

[0144] Next, refer to Figure 5C , the donor DN is bonded to the second transfer target area AR2. In this case, the donor DN may be moved so that one of the plurality of light emitting elements 120 in each of the plurality of groups 120G on the donor DN contacts one of the plurality of first portions AD1 of the adhesive layer AD, and the donor DN may be bonded to the second transfer target area AR2. The donor DN and the display panel PN may be aligned with each other so that one of the plurality of light emitting elements 120 in each group 120G overlaps with the first portion AD1 of the adhesive layer AD, and then the donor DN may be bonded to the display panel PN. Therefore, the plurality of light emitting elements 120 of the donor DN may contact the plurality of first portions AD1, respectively. Therefore, the light emitting elements 120 may be transferred to the plurality of sub-pixels SP of the second transfer target area AR2, respectively. The remaining light emitting elements 120 contacting the second portion AD2 of the second transfer target area AR2 may remain in a state of being attached to the donor DN.

[0145] Reference Figure 5D, as in the process of transferring to the second transfer target area AR2, the donor DN may be moved and bonded to the third transfer target area AR3. Specifically, the donor DN may be aligned with the display panel so that one of the plurality of light emitting elements 120 in each group 120G corresponds to the first portion AD1 of the adhesive layer AD, and then, the donor DN may be bonded to the third transfer target area AR3. Therefore, one of the light emitting elements 120 of each group 120G may be transferred to a corresponding one of the plurality of sub-pixels SP of the third transfer target area AR3.

[0146] Finally, refer to Figure 5E , the donor DN may be aligned so that the remaining light emitting elements 120 in each of the plurality of groups 120G on the donor DN correspond to the remaining first portion AD1 of the adhesive layer AD. Then, the donor may be bonded to the fourth transfer target area AR4. Therefore, all of the plurality of light emitting elements 120 disposed on the donor DN may be transferred to the display panel PN.

[0147] For example, in order to transfer the light-emitting element on the donor to a plurality of sub-pixels while the adhesive layer as a whole has adhesion, the light-emitting element should only have an arrangement corresponding to the arrangement of the plurality of sub-pixels on the donor. When the light-emitting element is located in an area that does not correspond to each of the plurality of sub-pixels, during the bonding process between the donor and the display panel, a defect may occur in which the light-emitting element is transferred to an area other than the area corresponding to the sub-pixel. Therefore, when the display panel has a size larger than that of the donor, a plurality of donors on which the light-emitting elements are arranged to have an arrangement corresponding to the arrangement of the plurality of sub-pixels may be used to manufacture a display device. However, with the use of a plurality of donors, the light-emitting elements on the wafer should be selectively transferred to each donor. Therefore, the number of transfer processes will increase, and thus the transfer process time may increase.

[0148] However, in the display device 100 and the method for manufacturing the display device 100 according to one embodiment of the present disclosure, a plurality of light-emitting elements 120 are transferred to the donor DN at the same time. Then, only the region of the adhesive layer AD corresponding to each of the plurality of sub-pixels SP of the display panel PN has adhesion. Therefore, only some of the plurality of light-emitting elements 120 on the donor DN can be selectively transferred to the sub-pixels SP. Therefore, the light-emitting element 120 can be transferred to a plurality of regions of the display panel PN using one donor DN, thereby reducing the number of donor DNs required in the entire transfer process. Therefore, the number of processes and the process time for transferring the light-emitting element 120 from the wafer WF to the donor DN can be reduced.

[0149] Figure 6 is a cross-sectional view of a display device according to another embodiment of the present disclosure. Fig. 7Ais a top view of a display device according to another embodiment of the present disclosure. Figure 7B yes Fig. 7A Cross-sectional view of area AA' in FIG. Figure 7C yes Fig. 7A Cross-sectional view of area BB' in FIG.

[0150] Figure 6 The display device 600 and Figures 1 to 5E The display device 100 in FIG. 1 is different only in the step-forming layer DC and the adhesive layer AD, and the other components are substantially the same as each other. Therefore, the repeated description thereof is omitted. For the convenience of explanation, Figure 7B and Figure 7C Only the substrate 110 , the step-forming layer DC, and the adhesive layer AD are shown among the components of the display panel PN.

[0151] Reference Figure 6 and Fig. 7A According to another embodiment of the present disclosure, a step-forming layer DC may be provided on the substrate 110 of the display device 600. The step-forming layer DC may overlap with the light-emitting element 120 or have an opening DCO defined therein in a region adjacent to the light-emitting element 120. The adhesive layer AD may be provided on the step-forming layer DC. In this regard, due to the opening DCO formed in the step-forming layer DC, the adhesive layer AD may be composed of a first portion AD1 having a relatively large first thickness T1 and a second portion AD2 having a relatively small second thickness T2.

[0152] Since the first portion AD1 of the adhesive layer AD is formed to fill the opening DCO formed in the step-forming layer DC, the first portion may have a relatively large first thickness T1. The second portion AD2 of the adhesive layer AD is formed to cover the upper surface of the portion of the step-forming layer DC disposed between adjacent openings DCO, and thus has a relatively smaller second thickness T2 than the first thickness T1. The vertical level of the top surface of the first portion AD1 may be lower than the vertical level of the top surface of the second portion AD2. The step-forming layer DC may be made of an organic material such as an acrylic resin or polyimide, or an inorganic material such as SiOx or SiON. However, embodiments of the present disclosure are not limited thereto.

[0153] Each of the plurality of first portions AD1 of the adhesive layer AD that are in contact with the plurality of light-emitting elements 120, respectively, may be disposed in the opening DCO. Furthermore, the second portion AD2 of the adhesive layer AD to which each of the plurality of light-emitting elements 120 is not transferred may be disposed in an area that does not overlap with the opening DCO. In an embodiment according to the present disclosure, the plurality of first portions AD1 of the adhesive layer AD may be divided into a transfer target area to which the light-emitting element 120 is transferred, and a non-transfer target area to which the light-emitting element 120 is not transferred. At this point, the non-transfer target area may be referred to as a non-adhesion area. In this case, the adhesive layer AD may have different thicknesses in the transfer target area and the non-transfer target area. This will be described below. 7A to 7C Further described in .

[0154] Reference Figure 6 and Fig. 7A In a display device 600 according to another embodiment of the present disclosure, the adhesive layer may further have a non-adhesion area AD3 as an area to which the light emitting element 120 is not transferred but overlaps with the opening DCO. Therefore, the adhesive layer AD may include a transfer target area to which the light emitting element 120 is transferred, and a non-transfer target area to which the light emitting element 120 is not transferred. At this point, the transfer target area may be referred to as an adhesion area, and the non-transfer target area may be referred to as a non-adhesion area. During the process in which the light emitting element 120 is transferred from the donor DN to the display panel PN, the non-adhesion area AD3 overlaps with the light emitting element 120 that is not transferred to the display panel PN.

[0155] The vertical level of the top surface of the adhesion area of ​​the first part AD1 may be equal to the vertical level of the top surface of the non-adhesion area AD3. However, the embodiments of the present disclosure are not limited thereto. In the transfer process, the remaining light-emitting elements 120 other than the light-emitting elements 120r, 120g and 120b transferred to the first part AD1 among the plurality of light-emitting elements 120 attached to the donor should not be transferred to the display panel PN. For this purpose, the light LT may be irradiated to the non-adhesion area AD3 using a mask MASK. Therefore, the non-adhesion area AD3 of the adhesive layer AD irradiated with the light LT is cured and has no adhesion, while the first part AD1 not irradiated with the light LT may have adhesion. Therefore, in the adhesive layer AD formed on the front surface of the display panel PN, the plurality of first parts AD1 corresponding to the plurality of sub-pixels SP have adhesion. The non-adhesion area AD3 to which the light-emitting element 120 is not transferred has no adhesion. In a plan view, the non-adhesion area AD3 may be square or circular. However, the embodiments of the present disclosure are not limited thereto.

[0156] Then, when the donor DN is bonded to the display panel PN, the light emitting elements 120r, 120g, and 120b are respectively attached only to the plurality of first portions AD1 of the adhesive layer AD, and the light emitting element 120 contacting the non-adhesion area AD3 may remain in a state of being attached to the donor DN.

[0157] The thickness of each of the plurality of first portions AD1 of the adhesive layer AD to which the plurality of light emitting elements 120 are attached is greater than the thickness of the second portion AD2 of the adhesive layer AD. Therefore, the adhesion of the first portion AD1 can be further improved. The adhesion of the adhesive layer AD can be affected by factors such as the thickness of the adhesive layer AD and the separation speed between the donor DN and the display panel PN. For example, as the thickness of the adhesive layer AD increases, the adhesion of the adhesive layer AD can increase. Therefore, each of the plurality of first portions AD1 of the adhesive layer AD in contact with the plurality of light emitting elements 120 is thicker than the rest of the adhesive layer AD, so that the plurality of light emitting elements 120 can be more stably fixed to the display panel PN. The thickness of the adhesive layer AD in the non-adhesive region AD3 can be equal to the thickness of the adhesive layer AD in the first portion AD1 as the adhesive region. In this way, the adhesion of the non-adhesive region AD3 can be equal to the adhesion of the first portion AD1 as the adhesive region. However, when a step forming layer DC is provided below the non-adhesive region AD3 so that the vertical level of the top surface of the adhesive layer AD in the non-adhesive region AD3 is equal to the vertical level of the top surface of the second portion AD2, a problem may arise. For example, in the process of transferring the light-emitting element 120 from the donor DN to the display panel PN under applied pressure, the upper part of the adhesive layer AD in the non-adhesive area AD3 that has lost its adhesive force due to curing under the irradiation of light LT is broken, so that the lower part of the adhesive layer AD with adhesive force is exposed, so that the light-emitting element that should not be transferred can be transferred to the non-adhesive area AD3. In order to prevent this from happening, in a display device 600 according to another embodiment of the present disclosure, the vertical level of the top surface of the adhesive layer AD3 in the non-adhesive area AD3 is lower than the vertical level of the top surface of the second part AD2. Therefore, the upper part can be prevented from being broken due to pressure. In addition, the adhesion of the adhesive layer AD in the non-adhesive area AD3 can be removed by irradiating light LT thereto. The area size of the non-adhesive area AD3 may be greater than, less than, or equal to the area size of the opening DCO.

[0158] Figure 7B yes Fig. 7A Cross-sectional view of area AA' in FIG. Figure 7C yes Fig. 7A Cross-sectional view of area BB' in FIG.

[0159] Reference Figure 7BIn the process of transferring the light emitting element 120 from the donor DN to the display panel PN, the light emitting element 120 is not transferred to the non-adhesion area AD3 provided in the AA' area, but remains on the donor DN. Figure 7C , in the process of transferring the light emitting element 120 from the donor DN to the display panel PN, the light emitting element 120 is not transferred to the non-adhesion area AD3 provided in the BB' area, but remains on the donor DN. In another embodiment of the present disclosure, each of the plurality of first portions AD1 of the adhesive layer AD and each of the plurality of non-adhesion areas AD3 may have different area sizes. For example, the first area size of each of the plurality of non-adhesion areas AD3 of the adhesive layer AD may be greater than the second area size of each of the first portions AD1 of the adhesive layer AD. Therefore, the adhesive layer AD may be formed so that the thickness of the first portion AD1 is equal to or greater than its thickness in the non-adhesion area AD3.

[0160] Figure 8 is a top view of a display device according to yet another embodiment of the present disclosure. Figure 8 The display device 1000 and Figures 1 to 5E The display device 100 in FIG. 1 is different only in the plurality of sub-pixels SP and the adhesive layer AD. The other components thereof are substantially the same as each other. Therefore, a repeated description thereof is omitted. For the sake of convenience, Figure 8 Only the adhesive layer AD and the plurality of sub-pixels SP are shown.

[0161] Reference Figure 8 , an additional sub-pixel SPA is further disposed on the substrate 110. The additional sub-pixel SPA is a component for repairing a defective sub-pixel SP by additionally transferring the light-emitting element 120 to the additional sub-pixel SPA when the transfer process of transferring the light-emitting element 120 is defective. The additional sub-pixel SPA may be disposed adjacent to some of the plurality of sub-pixels SP. For example, the additional sub-pixel SPA may be disposed between adjacent sub-pixels among the plurality of sub-pixels SP in each row among the plurality of rows. However, Figure 8 The arrangement of the additional sub-pixels SPA shown in FIG. 1 is exemplary and is not limited thereto.

[0162] After the donor DN and the display panel PN are combined with each other to transfer the light emitting element 120 to the plurality of sub-pixels SP, it may be identified whether there is a sub-pixel SP in which a transfer failure occurs. When the light emitting element 120 is not transferred to the first sub-pixel SP1 among the plurality of sub-pixels SP, or when the light emitting element 120 is transferred to a position other than its target position, the light emitting element 120 may be additionally transferred to an additional sub-pixel SPA adjacent to the first sub-pixel SP1 so that the defective sub-pixel SP is replaced.

[0163] In order to transfer the light emitting element 120 to the additional sub-pixel SPA, a portion of the adhesive layer AD corresponding to the additional sub-pixel SPA may also be formed as the first portion AD1. For example, before transferring the plurality of light emitting elements 120 to the display panel PN, a mask MASK covering the plurality of sub-pixels SP and the additional sub-pixel SPA may be placed, and then the non-adhesive region AD3 of the adhesive layer AD may be removed by irradiating light LT thereto (see Fig. 7A ). The plurality of first portions AD1 not irradiated with light LT, that is, the plurality of portions of the adhesive layer AD overlapping the plurality of sub-pixels SP and the plurality of additional sub-pixels SPA, may still have adhesion. Therefore, after detecting a transfer failure in the display panel PN, the light emitting element 120 may be transferred to the first portion AD1 using the adhesion corresponding to the additional sub-pixel SPA, so that the defective sub-pixel SP may be repaired. After the repair is completed, the entire adhesive layer AD may be cured by irradiating the plurality of first portions AD1, the non-adhesion area AD3, and the second area AD2 with light LT again.

[0164] Therefore, in the display device 1000 according to another embodiment of the present disclosure, when forming the additional sub-pixel SPA for repair, the first portion AD1 of the adhesive layer AD corresponding to the additional sub-pixel SPA may be further formed. In the additional transfer process, the light emitting element 120 may be transferred to the display panel PN via the first portion AD1. Therefore, the adhesive layer AD may be designed into various structures in consideration of the repair process, etc.

[0165] A display device and a method of manufacturing the display device according to various embodiments of the present disclosure may be described as follows.

[0166] A first aspect of the present disclosure provides a display device, comprising: a substrate, on which pixels are defined, each pixel comprising a plurality of sub-pixels; a step-forming layer, the step-forming layer being disposed on the substrate; an adhesive layer, the adhesive layer being disposed on the step-forming layer; and a plurality of light-emitting elements, the plurality of light-emitting elements being respectively disposed in the plurality of sub-pixels and on the adhesive layer, wherein the adhesive layer comprises: a plurality of first portions, the plurality of first portions respectively overlapping the light-emitting elements, a plurality of non-adhesive regions, the plurality of non-adhesive regions respectively disposed adjacent to the first portions; and a second portion outside the plurality of first portions and the plurality of non-adhesive regions.

[0167] According to some features of the display device, the step-forming layer has an opening defined therein in a region overlapping each of the first portion and the non-adhesion region.

[0168] According to some features of the display device, a thickness of each of the plurality of first portions of the adhesive layer is greater than a thickness of the second portion of the adhesive layer.

[0169] According to some features of the display device, a thickness of each of the plurality of non-adhesion regions of the adhesive layer is equal to a thickness of the first portion of the adhesive layer.

[0170] According to some features of the display device, the light emitting element does not overlap with each of the plurality of non-adhesion regions of the adhesive layer.

[0171] According to some features of the display device, each of the plurality of non-adhesion regions of the adhesive layer includes a portion that is irradiated with light and thereby cured.

[0172] According to some features of the display device, an adhesive force of each of the plurality of first portions of the adhesive layer is greater than an adhesive force of each of the plurality of non-adhesive regions of the adhesive layer.

[0173] According to some features of the display device, an area size of each of the multiple non-adhesive areas of the adhesive layer is larger than an area size of each of the first parts of the adhesive layer, and a thickness of the first part of the adhesive layer is equal to or greater than a thickness of each of the multiple non-adhesive areas of the adhesive layer.

[0174] According to some features of the display device, a vertical level of a top surface of each of the plurality of non-adhesive regions of the adhesive layer is lower than a vertical level of a top surface of the second portion of the adhesive layer.

[0175] According to some features of the display device, a vertical level of a top surface of each of the plurality of first portions of the adhesive layer is lower than a vertical level of a top surface of the second portion of the adhesive layer.

[0176] A second aspect of the present disclosure provides a method for manufacturing a display device, comprising: transferring a plurality of light-emitting elements on a chip to a donor; providing a step-forming layer on a substrate of a display panel; patterning the step-forming layer to form an opening defined therein; providing an adhesive layer on the step-forming layer; providing a mask on the adhesive layer and irradiating light thereto; and transferring the plurality of light-emitting elements on the donor to the display panel, wherein the adhesive layer includes a plurality of first portions overlapping with the mask, and a plurality of non-adhesive areas that do not overlap with the mask and are exposed to light, wherein the opening overlaps with each of the plurality of first portions and each of the plurality of non-adhesive areas, and wherein only the light-emitting elements among the plurality of light-emitting elements that are respectively in contact with the plurality of first portions are transferred to the display panel.

[0177] According to some features of the method, a mask is set on the adhesive layer and light is irradiated thereto, including: blocking the light from traveling to the multiple first portions so that the multiple first portions are not cured; and irradiating the light to the non-adhesive area so that the non-adhesive area is cured.

[0178] According to some features of the method, the method further includes irradiating light to the adhesive layer to cure the entire adhesive layer after the plurality of light emitting elements are transferred to the display panel.

[0179] According to some features of the method, the thickness of each of the plurality of first parts is equal to the thickness of each of the non-adhesive regions and is less than the thickness of the second part, wherein the second part is the remaining area of ​​the adhesive layer outside the plurality of first parts and the non-adhesive regions, and wherein the adhesion force of each of the plurality of first parts is greater than the adhesion force of the second part.

[0180] According to some features of the method, the display panel includes a plurality of sub-pixels, wherein the plurality of first portions of the adhesive layer correspond to the plurality of sub-pixels, respectively.

[0181] According to some features of the method, the plurality of light-emitting elements transferred from the chip to the donor are divided into a plurality of groups, wherein when the plurality of light-emitting elements on the donor are transferred to the display panel, each of the plurality of groups is arranged to overlap with each of the plurality of sub-pixels and an area adjacent to each of the plurality of sub-pixels.

[0182] According to some features of the method, each of at least one of the multiple light-emitting elements included in each of the multiple groups overlaps with a corresponding one in the first part, and each of the remaining light-emitting elements of the multiple light-emitting elements included in each of the multiple groups overlaps with a corresponding one in the non-adhesion area.

[0183] According to some features of the method, the display panel further includes an additional sub-pixel disposed between adjacent sub-pixels of the plurality of sub-pixels, wherein one of the plurality of first portions of the adhesive layer corresponds to the additional sub-pixel.

[0184] According to some features of the method, the method further includes: after transferring the multiple light-emitting elements to the display panel, detecting a transfer failure when transferring the multiple light-emitting elements; transferring the light-emitting elements to the additional sub-pixels adjacent to the sub-pixels where the transfer failure occurred; and curing the entire adhesive layer.

[0185] Although the embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not necessarily limited to these embodiments and can be modified in various ways within the scope of the technical spirit of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are intended to illustrate rather than limit the technical concept of the present disclosure, and the scope of the technical concept of the present disclosure is not limited to these embodiments. Therefore, it should be understood that the above-mentioned embodiments are not restrictive in all aspects, but illustrative.

Claims

1. A display device, comprising: a substrate on which pixels are defined, each pixel including a plurality of sub-pixels; a step-forming layer, the step-forming layer being disposed on the substrate; an adhesive layer disposed on the step-forming layer; as well as a plurality of light emitting elements, the plurality of light emitting elements being respectively disposed in the plurality of sub-pixels and disposed on the adhesive layer, The adhesive layer comprises: a plurality of first portions, each of which overlaps with the light emitting element; a plurality of non-adhesive regions, wherein the plurality of non-adhesive regions are respectively disposed adjacent to the first portion; and The plurality of first portions and the second portion outside the plurality of non-adhesive areas. 2 . The display device according to claim 1 , wherein the step-forming layer has an opening defined therein in a region overlapping each of the first portion and the non-adhesion region. 3 . The display device according to claim 2 , wherein a thickness of each of the plurality of first portions of the adhesive layer is greater than a thickness of the second portion of the adhesive layer. 4 . The display device according to claim 3 , wherein a thickness of each of the plurality of non-adhesion regions of the adhesive layer is equal to a thickness of the first portion of the adhesive layer. 5 . The display device according to claim 4 , wherein the light emitting element does not overlap with each of the plurality of non-adhesion regions of the adhesive layer. 6 . The display device according to claim 4 , wherein each of the plurality of non-adhesion regions of the adhesive layer includes a portion that is irradiated with light and thereby cured. 7 . The display device according to claim 4 , wherein an adhesive force of each of the plurality of first portions of the adhesive layer is greater than an adhesive force of each of the plurality of non-adhesive regions of the adhesive layer.

8. The display device according to claim 3, wherein an area size of each of the plurality of non-adhesive areas of the adhesive layer is larger than an area size of each of the first portions of the adhesive layer, and wherein a thickness of the first portion of the adhesive layer is equal to or greater than a thickness of each of the plurality of non-adhesive regions of the adhesive layer. 9 . The display device of claim 4 , wherein a vertical level of a top surface of each of the plurality of non-adhesion regions of the adhesive layer is lower than a vertical level of a top surface of the second portion of the adhesive layer. 10 . The display device of claim 3 , wherein a vertical level of a top surface of each of the plurality of first portions of the adhesive layer is lower than a vertical level of a top surface of the second portion of the adhesive layer.

11. A method for manufacturing a display device, the method comprising: transferring a plurality of light emitting elements on the wafer to a donor; providing a step-forming layer on a substrate of a display panel; patterning the step-forming layer to form an opening defined therein; providing an adhesive layer on the step-forming layer; placing a mask on the adhesive layer and irradiating light thereto; as well as transferring the plurality of light emitting elements on the donor to the display panel, wherein the adhesive layer includes a plurality of first portions overlapping the mask, and a plurality of non-adhesive regions not overlapping the mask and subjected to light irradiation, wherein the opening overlaps with each of the plurality of first portions and each of the plurality of non-adhesive regions, and Only the light emitting elements among the plurality of light emitting elements respectively contacting the plurality of first portions are transferred to the display panel.

12. The method according to claim 11, wherein disposing a mask on the adhesive layer and irradiating light thereto comprises: blocking the light from traveling to the plurality of first portions so that the plurality of first portions are not cured; and irradiating the light to the non-adhesion area to cure the non-adhesion area. 13 . The method according to claim 12 , wherein the method further comprises irradiating light to the adhesive layer to cure the entire adhesive layer after the plurality of light emitting elements are transferred to the display panel.

14. The method according to claim 12, wherein the thickness of each of the plurality of first portions is equal to the thickness of each of the non-adhesive regions and is smaller than the thickness of the second portion, wherein the second portion is the remaining area of ​​the adhesive layer other than the plurality of first portions and the non-adhesive area, and The adhesion force of each of the plurality of first portions is greater than the adhesion force of the second portion.

15. The method according to claim 11, wherein the display panel comprises a plurality of sub-pixels, and The plurality of first portions of the adhesive layer respectively correspond to the plurality of sub-pixels.

16. The method of claim 15, wherein the plurality of light emitting elements transferred from the wafer to the donor are divided into a plurality of groups, and When the plurality of light-emitting elements on the donor are transferred to the display panel, each of the plurality of groups is arranged to overlap with each of the plurality of sub-pixels and a region adjacent to each of the plurality of sub-pixels.

17. The method of claim 16, wherein each of at least one of the plurality of light-emitting elements included in each of the plurality of groups overlaps with a corresponding one of the first portions, and each of the remaining light-emitting elements of the plurality of light-emitting elements included in each of the plurality of groups overlaps with a corresponding one of the non-adhesion regions.

18. The method according to claim 15, wherein the display panel further comprises an additional sub-pixel disposed between adjacent sub-pixels among the plurality of sub-pixels, and Wherein one of the plurality of first portions of the adhesive layer corresponds to the additional sub-pixel.

19. The method according to claim 18, wherein the method further comprises: After transferring the plurality of light emitting elements to the display panel, detecting a transfer failure when transferring the plurality of light emitting elements; transferring the light emitting element to the additional sub-pixel adjacent to the sub-pixel in which the transfer failure occurs; as well as The entire adhesive layer is cured.

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