Display device

Abstract

The invention relates to a display device. A display device is provided with: a substrate having a display region on which an image is displayed and a peripheral region around the display region; an organic insulating layer formed of an organic insulating material and disposed above the substrate; a rib layer formed of an inorganic insulating material, covering the organic insulating layer, and having a plurality of pixel openings in the display area; and a plurality of display elements overlapping the plurality of pixel openings, respectively. The substrate has a first side. The organic insulating layer has: a second side positioned between the first side and the display region in plan view; and a protruding portion that protrudes from the second side toward the first side in plan view and is provided at a position separated from an end portion of the second side. In addition, the rib layer has a first slit that overlaps the convex portion.

Description

[0001] Cross-references to related applications

[0002] This application claims priority based on Japanese Patent Application No. 2023-179396 filed on October 18, 2023, and cites all the contents described in the Japanese Patent Application. Technical Field

[0003] An embodiment of the present invention relates to a display device. Background Art

[0004] In recent years, display devices using organic light emitting diodes (OLEDs) as display elements have been put into practical use. In such display devices, a technology capable of improving yield is required. Summary of the invention

[0005] In summary, according to an embodiment, a display device includes: a substrate having a display area for displaying an image and a peripheral area around the display area; an organic insulating layer formed of an organic insulating material and arranged above the substrate; a rib layer formed of an inorganic insulating material, covering the organic insulating layer and having a plurality of pixel openings in the display area; and a plurality of display elements overlapping the plurality of pixel openings. The substrate has a first side. The organic insulating layer has: a second side located between the first side and the display area when viewed from above; and a convex portion protruding from the second side toward the first side when viewed from above and disposed at a position away from an end of the second side. In addition, the rib layer has a first slit overlapping the convex portion.

[0006] According to the above-described configuration, the yield of the display device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 This is a diagram showing a configuration example of a display device according to an embodiment.

[0008] Figure 2 It is a schematic plan view showing an example of the layout of sub-pixels.

[0009] Figure 3 It is along Figure 2 A schematic cross-sectional view of a display device taken along line III-III in FIG.

[0010] Figure 4 This is a schematic plan view of a display device according to an embodiment.

[0011] Figure 5 yes Figure 4 A schematic enlarged plan view of the vicinity of a convex portion of an organic insulating layer is shown.

[0012] Figure 6 It is a schematic top view of the substrate, the organic insulating layer, and the slit near the protrusion.

[0013] Figure 7 It is along Figure 5 A schematic cross-sectional view of the display device taken along line VII-VII in FIG.

[0014] Figure 8 yes Figure 5 Schematic enlarged top view of region VIII in FIG.

[0015] Fig. 9 This is a schematic top view of a mother substrate according to one embodiment.

[0016] Fig. 10A It is a schematic cross-sectional view showing a process of forming a panel portion on a mother substrate.

[0017] Fig. 10B It shows that Fig. 10A A schematic cross-sectional diagram of the process.

[0018] Fig. 10C It shows that Fig. 10B A schematic cross-sectional diagram of the process.

[0019] Fig. 10D It shows that Fig. 10C A schematic cross-sectional diagram of the process.

[0020] Fig.10E It shows that Fig. 10D A schematic cross-sectional diagram of the process.

[0021] Fig.10F It shows that Fig.10E A schematic cross-sectional diagram of the process.

[0022] Figure 10G It shows that Fig.10F A schematic cross-sectional diagram of the process.

[0023] Fig.11 This is a schematic plan view of a panel portion cut out from a mother substrate.

[0024] Fig.12 It is a schematic enlarged plan view of the vicinity of the convex portion in the panel portion.

[0025] Fig.13 This is a schematic top view of a substrate, a slit, and an organic insulating layer in a panel portion.

[0026] Fig.14 It is a schematic cross-sectional view showing a part of a panel unit on which a laminated film is formed by vapor deposition.

[0027] Fig.15It is a diagram showing a comparative example with the embodiment. DETAILED DESCRIPTION

[0028] Several embodiments are described with reference to the accompanying drawings.

[0029] The disclosed content is only an example, and appropriate changes that can be easily thought of by those skilled in the art while maintaining the main idea of ​​the invention are certainly included in the scope of the present invention. In addition, in order to make the description clearer, the drawings sometimes roughly show the width, thickness, shape, etc. of each part compared with the actual way, but it is only an example and does not limit the interpretation of the present invention. In addition, in this specification and each figure, the same reference numerals are marked for the constituent elements that perform the same or similar functions as the constituent elements previously described in the figures that have appeared, and repeated detailed descriptions are sometimes appropriately omitted.

[0030] It should be noted that in the drawings, mutually orthogonal X-axis, Y-axis and Z-axis are recorded as needed for easy understanding. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction of the plane including the X-direction and the Y-direction. In addition, observing various elements parallel to the Z-direction is called a top view.

[0031] The display device involved in each embodiment is an organic electroluminescent display device having an organic light emitting diode (OLED) as a display element, and can be mounted on various electronic devices such as televisions, personal computers, vehicle-mounted equipment, tablet terminals, smartphones, mobile phone terminals, wearable terminals, etc.

[0032] Figure 1 1 is a diagram showing a configuration example of a display device DSP according to an embodiment. The display device DSP includes an insulating substrate 10. The substrate 10 includes a display area DA for displaying an image and a peripheral area SA around the display area DA. The substrate 10 may be glass or a flexible resin film.

[0033] In the present embodiment, the shape of the substrate 10 in plan view is a rectangle, but the shape of the substrate 10 in plan view is not limited to a rectangle, and may be other shapes such as a square, a circle, or an ellipse.

[0034] The display area DA has a plurality of pixels PX arranged in a matrix in the X direction and the Y direction. The pixel PX includes a plurality of sub-pixels SP that display different colors. In the present embodiment, it is assumed that the pixel PX includes a blue sub-pixel SP1, a green sub-pixel SP2, and a red sub-pixel SP3. However, the pixel PX may also include a sub-pixel SP of another color such as white together with the sub-pixels SP1, SP2, and SP3 or instead of any of the sub-pixels SP1, SP2, and SP3.

[0035] The sub-pixel SP includes a pixel circuit 1 and a display element DE driven by the pixel circuit 1. The pixel circuit 1 includes a pixel switch 2, a driving transistor 3, and a capacitor 4. The pixel switch 2 and the driving transistor 3 are switching elements composed of, for example, thin film transistors.

[0036] In the display area DA, a plurality of scanning lines GL for supplying scanning signals to the pixel circuits 1 of the sub-pixels SP, a plurality of signal lines SL for supplying video signals to the pixel circuits 1 of the sub-pixels SP, and a plurality of power supply lines PL are arranged. Figure 1 In the example of FIG. 5 , the scanning lines GL and the power lines PL extend in the X direction, and the signal lines SL extend in the Y direction.

[0037] The gate electrode of the pixel switch 2 is connected to the scanning line GL. One of the source electrode and the drain electrode of the pixel switch 2 is connected to the signal line SL, and the other is connected to the gate electrode of the driving transistor 3 and the capacitor 4. In the driving transistor 3, one of the source electrode and the drain electrode is connected to the power line PL and the capacitor 4, and the other is connected to the display element DE.

[0038] It should be noted that the configuration of the pixel circuit 1 is not limited to the illustrated example. For example, the pixel circuit 1 may include more thin film transistors and capacitors.

[0039] Figure 2 is a schematic top view showing an example of the layout of sub-pixels SP1, SP2, and SP3. Figure 2 In the example of FIG. 1 , the sub-pixels SP2 and SP3 are arranged in the X direction with the sub-pixel SP1. In addition, the sub-pixel SP2 and the sub-pixel SP3 are arranged in the Y direction.

[0040] When the sub-pixels SP1, SP2, and SP3 are arranged in this way, columns in which the sub-pixels SP2 and SP3 are alternately arranged in the Y direction and columns in which a plurality of sub-pixels SP1 are repeatedly arranged in the Y direction are formed in the display area DA. These columns are alternately arranged in the X direction. It should be noted that the layout of the sub-pixels SP1, SP2, and SP3 is not limited to Figure 2 Example.

[0041] The rib layer 5 is disposed in the display area DA. The rib layer 5 has pixel openings AP1, AP2, and AP3 in the sub-pixels SP1, SP2, and SP3, respectively. Figure 2 In the example, the pixel opening AP1 is larger than the pixel opening AP2, and the pixel opening AP2 is larger than the pixel opening AP3. That is, among the sub-pixels SP1, SP2, and SP3, the sub-pixel SP1 has the largest aperture ratio, and the sub-pixel SP3 has the smallest aperture ratio.

[0042] The sub-pixel SP1 includes a lower electrode LE1, an upper electrode UE1, and an organic layer OR1 respectively overlapping with the pixel opening AP1. The sub-pixel SP2 includes a lower electrode LE2, an upper electrode UE2, and an organic layer OR2 respectively overlapping with the pixel opening AP2. The sub-pixel SP3 includes a lower electrode LE3, an upper electrode UE3, and an organic layer OR3 respectively overlapping with the pixel opening AP3.

[0043] The lower electrode LE1, the upper electrode UE1, and the portion of the organic layer OR1 that overlaps with the pixel opening AP1 constitute the display element DE1 of the sub-pixel SP1. The lower electrode LE2, the upper electrode UE2, and the portion of the organic layer OR2 that overlaps with the pixel opening AP2 constitute the display element DE2 of the sub-pixel SP2. The lower electrode LE3, the upper electrode UE3, and the portion of the organic layer OR3 that overlaps with the pixel opening AP3 constitute the display element DE3 of the sub-pixel SP3. The display elements DE1, DE2, and DE3 may also include a cover layer described later. The rib layer 5 surrounds each of these display elements DE1, DE2, and DE3.

[0044] A conductive partition wall 6A (first partition wall) is disposed above the rib layer 5. The partition wall 6A overlaps the rib layer 5 as a whole and has the same planar shape as the rib layer 5. That is, the partition wall 6A has openings in the sub-pixels SP1, SP2, and SP3, respectively. From another point of view, the rib layer 5 and the partition wall 6A are lattice-shaped when viewed from above, and surround each of the display elements DE1, DE2, and DE3. The partition wall 6A has the function of serving as a wiring for supplying a common voltage to the upper electrodes UE1, UE2, and UE3.

[0045] Figure 3 It is along Figure 2 A schematic cross-sectional view of a display device DSP taken along line III-III in FIG. A circuit layer 11 is disposed on the substrate 10. The circuit layer 11 includes Figure 1 The circuit layer 11 is covered with an organic insulating layer 12. The organic insulating layer 12 functions as a planarizing film that planarizes the unevenness generated by the circuit layer 11.

[0046] The lower electrodes LE1, LE2, and LE3 are disposed on the organic insulating layer 12. The rib layer 5 is disposed on the organic insulating layer 12 and the lower electrodes LE1, LE2, and LE3. The ends of the lower electrodes LE1, LE2, and LE3 are covered by the rib layer 5. The lower electrodes LE1, LE2, and LE3 are connected to the pixel circuit 1 of the circuit layer 11 through contact holes provided in the organic insulating layer 12. Figure 3 The cross section is not shown.

[0047] The partition wall 6A includes a conductive lower portion 61 disposed on the rib layer 5 and an upper portion 62 disposed on the lower portion 61. The upper portion 62 has a greater width than the lower portion 61. Thus, both ends of the upper portion 62 protrude from the side surfaces of the lower portion 61. Such a shape of the partition wall 6A is called an overhang.

[0048] exist Figure 3 In the example of the embodiment, the lower portion 61 has a bottom layer 63 disposed on the rib layer 5, and a shaft layer 64 disposed on the bottom layer 63. For example, the bottom layer 63 is formed thinner than the shaft layer 64. Figure 3 In the example, both ends of the bottom layer 63 protrude from the side surfaces of the shaft layer 64 .

[0049] The organic layer OR1 passes through the pixel opening AP1 and covers the lower electrode LE1. The upper electrode UE1 covers the organic layer OR1 and is opposite to the lower electrode LE1. The organic layer OR2 passes through the pixel opening AP2 and covers the lower electrode LE2. The upper electrode UE2 covers the organic layer OR2 and is opposite to the lower electrode LE2. The organic layer OR3 passes through the pixel opening AP3 and covers the lower electrode LE3. The upper electrode UE3 covers the organic layer OR3 and is opposite to the lower electrode LE3. The upper electrodes UE1, UE2, and UE3 are in contact with the side surface of the lower portion 61 of the partition wall 6A.

[0050] The display element DE1 includes a cover layer CP1 covering the upper electrode UE1. The display element DE2 includes a cover layer CP2 covering the upper electrode UE2. The display element DE3 includes a cover layer CP3 covering the upper electrode UE3. The cover layers CP1, CP2, and CP3 respectively function as optical adjustment layers for improving the extraction efficiency of light emitted from the organic layers OR1, OR2, and OR3.

[0051] In the following description, the multilayer body including the organic layer OR1, the upper electrode UE1 and the cover layer CP1 is referred to as the stacked film FL1, the multilayer body including the organic layer OR2, the upper electrode UE2 and the cover layer CP2 is referred to as the stacked film FL2, and the multilayer body including the organic layer OR3, the upper electrode UE3 and the cover layer CP3 is referred to as the stacked film FL3.

[0052] A portion of the laminate film FL1 is located above the upper portion 62. This portion is separated from the portion of the laminate film FL1 located around the partition wall 6A (the portion constituting the display element DE1). Similarly, a portion of the laminate film FL2 is located above the upper portion 62, and this portion is separated from the portion of the laminate film FL2 located around the partition wall 6A (the portion constituting the display element DE2). In addition, a portion of the laminate film FL3 is located above the upper portion 62, and this portion is separated from the portion of the laminate film FL3 located around the partition wall 6A (the portion constituting the display element DE3).

[0053] Seal layers SE11, SE12, and SE13 are respectively arranged in sub-pixels SP1, SP2, and SP3. Seal layer SE11 continuously covers cap layer CP1 and partition walls 6A around sub-pixel SP1. Seal layer SE12 continuously covers cap layer CP2 and partition walls 6A around sub-pixel SP2. Seal layer SE13 continuously covers cap layer CP3 and partition walls 6A around sub-pixel SP3.

[0054] exist Figure 3 In the example, the laminated film FL1 and the sealing layer SE11 on the partition wall 6A between the sub-pixels SP1 and SP2 are separated from the laminated film FL2 and the sealing layer SE12 on the partition wall 6A. In addition, the laminated film FL1 and the sealing layer SE11 on the partition wall 6A between the sub-pixels SP1 and SP3 are separated from the laminated film FL3 and the sealing layer SE13 on the partition wall 6A.

[0055] The sealing layers SE11, SE12, and SE13 are covered by the resin layer RS1. The resin layer RS1 is covered by the sealing layer SE2. The sealing layer SE2 is covered by the resin layer RS2. The resin layers RS1, RS2, and the sealing layer SE2 are continuously provided at least over the entire display area DA, and a part of them also reaches the peripheral area SA.

[0056] A cover member such as a polarizing plate, a touch panel, a protective film or a cover glass may be further disposed on the resin layer RS2. Such a cover member may be bonded to the resin layer RS2 via an adhesive layer such as OCA (Optical Clear Adhesive).

[0057] The organic insulating layer 12 is formed of an organic insulating material such as polyimide. The rib layer 5 and the sealing layers SE11, SE12, SE13, SE2 are formed of inorganic insulating materials such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON) or aluminum oxide (Al2O3). In one example, the rib layer 5 is formed of silicon oxynitride, and the sealing layers SE11, SE12, SE13, SE2 are formed of silicon nitride. The resin layers RS1 and RS2 are formed of resin materials (organic insulating materials) such as epoxy resin and acrylic resin.

[0058] The lower electrodes LE1, LE2, and LE3 include a reflective layer formed of, for example, silver, and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. Each conductive oxide layer may be formed of, for example, a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide).

[0059] The upper electrodes UE1, UE2, UE3 are formed of a metal material such as an alloy of magnesium and silver (MgAg), etc. For example, the lower electrodes LE1, LE2, LE3 correspond to anodes, and the upper electrodes UE1, UE2, UE3 correspond to cathodes.

[0060] The organic layers OR1, OR2, and OR3 are composed of a plurality of thin films including a light-emitting layer. In one example, the organic layers OR1, OR2, and OR3 have a structure in which a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer are sequentially stacked along the Z direction. However, the organic layers OR1, OR2, and OR3 may also have other structures such as a so-called tandem structure including a plurality of light-emitting layers.

[0061] The cover layers CP1, CP2, and CP3, for example, have a stacked structure formed by overlapping multiple transparent layers. These transparent layers may include layers formed by inorganic materials and layers formed by organic materials. In addition, these transparent layers have different refractive indices from each other. For example, the refractive indices of these transparent layers are different from the refractive indices of the upper electrodes UE1, UE2, and UE3 and the refractive indices of the sealing layers SE11, SE12, and SE13. It should be noted that at least one of the cover layers CP1, CP2, and CP3 may also be omitted.

[0062] The bottom layer 63 and the shaft layer 64 of the next wall 6A are formed of metal materials. As the metal material of the bottom layer 63, for example, molybdenum, titanium, titanium nitride (TiN), molybdenum-tungsten alloy (MoW) or molybdenum-niobium alloy (MoNb) can be used. As the metal material of the shaft layer 64, for example, aluminum, aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY) or aluminum-silicon alloy (AlSi) can be used. It should be noted that the shaft layer 64 can also be formed of an insulating material.

[0063] For example, the upper portion 62 of the partition wall 6A has a laminated structure of a lower layer formed of a metal material and an upper layer formed of a conductive oxide. As the metal material forming the lower layer, for example, titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy or molybdenum-niobium alloy can be used. As the conductive oxide forming the upper layer, for example, ITO or IZO can be used. It should be noted that the upper portion 62 may also have a single-layer structure of a metal material. In addition, the upper portion 62 may include a layer formed of an insulating material.

[0064] The common voltage is supplied to the partition wall 6A. The common voltage is supplied to the upper electrodes UE1, UE2, UE3 in contact with the side surface of the lower portion 61. The lower electrodes LE1, LE2, LE3 are supplied with pixel voltages corresponding to the video signals of the signal lines SL through the pixel circuits 1 of the sub-pixels SP1, SP2, SP3, respectively.

[0065] The organic layers OR1, OR2, and OR3 emit light in response to the application of voltage. Specifically, when a potential difference is formed between the lower electrode LE1 and the upper electrode UE1, the light-emitting layer of the organic layer OR1 emits light in the blue band. When a potential difference is formed between the lower electrode LE2 and the upper electrode UE2, the light-emitting layer of the organic layer OR2 emits light in the green band. When a potential difference is formed between the lower electrode LE3 and the upper electrode UE3, the light-emitting layer of the organic layer OR3 emits light in the red band.

[0066] As another example, the light-emitting layers of the organic layers OR1, OR2, and OR3 may also emit light of the same color (for example, white). In this case, the display device DSP may also include a color filter that converts the light emitted by the light-emitting layer into light of a color corresponding to the sub-pixels SP1, SP2, and SP3. In addition, the display device DSP may also include a layer including quantum dots that are excited by the light emitted by the light-emitting layer to generate light of a color corresponding to the sub-pixels SP1, SP2, and SP3.

[0067] Figure 4 1 is a schematic plan view of the display device DSP. The dotted portion in the figure indicates a region where the organic insulating layer 12 is disposed. That is, the organic insulating layer 12 is disposed not only in the display region DA but also in the peripheral region SA.

[0068] The organic insulating layer 12 has a slightly smaller shape than the substrate 10 . Thus, a blank area BA which does not overlap with the organic insulating layer 12 is formed at the edge of the substrate 10 .

[0069] The substrate 10 has a first side S1 (lower side in the figure) extending in the X direction. The organic insulating layer 12 has a second side S2 located between the first side S1 and the display area DA. The second side S2 is, for example, parallel to the first side S1.

[0070] The organic insulating layer 12 has a pair of protrusions PT1 and PT2 protruding from the second side S2 toward the first side S1. The protrusion PT1 is located near the end E1 of the second side S2 (the end on the left side in the figure). The protrusion PT2 is located near the end E2 of the second side S2 (the end on the right side in the figure). In the present embodiment, the protrusion PT1 is arranged at a position away from the end E1. In addition, the protrusion PT2 is arranged at a position away from the end E2.

[0071] Figure 2 and Figure 3The rib layer 5 shown is not only arranged in the display area DA, but also in the peripheral area SA. For example, the outer shape of the rib layer 5 is consistent with the outer shape of the substrate 10. The rib layer 5 has a slit 51 (first slit). The slit 51 overlaps with the organic insulating layer 12 as a whole. The slit 51 is continuously formed along the outer shape of the organic insulating layer 12, and surrounds the display area DA except for the second side S2. One end of the slit 51 overlaps with the protrusion PT1. The other end of the slit 51 overlaps with the protrusion PT2.

[0072] exist Figure 4 In the example of , four terminal portions T1 and four terminal portions T2 are arranged in the peripheral area SA. These terminal portions T1 and T2 are located between the display area DA and the second side S2. Each terminal portion T2 is located between the terminal portion T1 and the display area DA.

[0073] A flexible circuit board for supplying voltage and signal to the display device DSP is mounted on each terminal portion T1. An IC chip (driver) for controlling image display is mounted on each terminal portion T2. ​​These flexible circuit boards and IC chips are examples of electronic components.

[0074] A plurality of wirings W are also arranged in the peripheral area SA. Figure 4 In the example of FIG. 1 , four wires W extend from each terminal portion T1 in the Y direction. One end of each wire W is connected to the terminal portion T1, and the other end is located at the first side S1. Each wire W intersects the second side S2 between the protrusions PT1 and PT2. During the manufacturing process of the display device DSP, an inspection pad is connected to each wire W, which will be described in detail later.

[0075] It should be noted that the arrangement positions and numbers of the terminal portions T1, T2, and the wiring W are not limited to Figure 4 In addition, the display device DSP may not include the terminal portion T2. ​​In this case, the IC chip may be mounted on other parts such as a flexible circuit substrate.

[0076] Figure 5 1 is a schematic enlarged top view of the vicinity of the protrusion PT1. The rib layer 5 also has a grid-shaped slit 52 (second slit) in the peripheral area SA. In addition, a plurality of partitions 6B (second partitions) are arranged around the slit 52. The slit 52 is, for example, located between each side of the organic insulating layer 12 including the second side S2 and the display area DA.

[0077] The plurality of partition walls 6B are arranged at intervals along the outer shape of the substrate 10, the outer shape of the organic insulating layer 12, and the slit 51. For example, the plurality of partition walls 6B are respectively located in the region between the first side S1 and the second side S2, the region between the second side S2 and the slit 51, and the region between the slit 51 and the slit 52. Figure 5In the example, a part of multiple partition walls 6B overlaps with the convex portion PT1.

[0078] A pair of L-shaped alignment marks M1 and cross-shaped alignment marks M2 are arranged near the convex portion PT1. The alignment marks M1 and M2 can be formed, for example, by a metal layer included in the above-mentioned circuit layer 11.

[0079] A pair of alignment marks M1 are located between the convex portion PT1 and the end portion E1 in the X direction, and overlap with the blank area BA and the second side S2. The slit 51 has a bent portion 51a that bends along these alignment marks M1. Thus, the slit 51 does not overlap with the alignment marks M1.

[0080] The alignment marks M2 are located in the area where the slit 52 is arranged. In Figure 5 the example, the lattice of the slit 52 is opened in a rectangular shape around the alignment marks M2. Thus, the slit 52 does not overlap with the alignment marks M2.

[0081] Figure 6 is a schematic plan view of the substrate 10, the organic insulating layer 12, and the slit 51 near the convex portion PT1. In this figure, the partition wall 6B and the alignment marks M1 are omitted.

[0082] As described above, the convex portion PT1 is separated from the end portion E1 of the second side S2. The distance Dx in the X direction between the end portion E1 and the convex portion PT1 is, for example, 2 mm or more.

[0083] The first side S1 and the second side S2 are, for example, parallel. The distance Dy in the Y direction between the first side S1 and the second side S2 is less than the distance Dx (Dy < Dx). The distance Dy is, for example, 0.2 mm or less. The width Wp of the convex portion PT1 in the X direction is, for example, less than the distance Dy (Wp < Dy).

[0084] Near the convex portion PT2, a configuration similar to that near the convex portion PT1 shown in Figure 5 and Figure 6 can be applied. For example, the distance in the X direction between the convex portions PT1 and PT2 is greater than the distance Dx.

[0085] Figure 7 is a schematic cross-sectional view of the display device DSP along the VII-VII line in Figure 5 . In this figure, the illustration of a part of the substrate 10 and the circuit layer 11 is omitted.

[0086] In Figure 7 the example, an organic insulating layer 13 is arranged below the organic insulating layer 12. In addition, an inorganic insulating layer 14 is arranged below the organic insulating layer 13. These organic insulating layer 13 and inorganic insulating layer 14 are, for example, a part of the circuit layer 11.

[0087] The organic insulating layer 13 is formed of an organic insulating material such as polyimide, etc. The inorganic insulating layer 14 is formed of an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxynitride.

[0088] exist Figure 7 In the example of , the width of the organic insulating layer 13 is greater than the width of the organic insulating layer 12. Both ends of the organic insulating layer 13 protrude compared to both ends of the organic insulating layer 12. It should be noted that, Figure 7 The organic insulating layers 12 and 13 shown in the figure constitute the projection PT1. The projection PT2 can also be constituted by the organic insulating layers 12 and 13 in the same manner.

[0089] The rib layer 5 covers the organic insulating layers 12, 13 and the inorganic insulating layer 14. Figure 7 In the cross section of , a pair of partition walls 6B are arranged above the protrusion PT1, and a slit 51 is provided between these partition walls 6B.

[0090] Next door 6B passes through Figure 3 The partition wall 6A shown is formed by the same process and has the same structure as the partition wall 6A. That is, the partition wall 6B has a lower portion 61 and an upper portion 62. In addition, the lower portion 61 of the partition wall 6B has a bottom layer 63 and a shaft layer 64.

[0091] The upper surface of the organic insulating layer 12 is exposed from the rib layer 5 through the slits 51. Figure 7 In the example of , the upper surface of the organic insulating layer 12 has a groove 120 overlapping the slit 51. A portion of the groove 120 reaches below the rib layer 5. Thus, the edge of the rib layer 5 along the slit 51 protrudes above the groove 120. That is, the edge and the groove 120 form an overhang structure.

[0092] exist Figures 4 to 6 The organic insulating layer 13 is also disposed below the substantially entire organic insulating layer 12 shown in FIG. Therefore, the slits 51 and 52 overlap the organic insulating layers 12 and 13 in a plan view. Figure 7 The position is shown in the cross section of , and is formed in a manner that integrally overlaps with the slit 51.

[0093] Figure 8 yes Figure 5 Schematic enlarged plan view of region VIII in FIG. In the peripheral region SA, a plurality of partition walls 6C (third partition walls) are arranged in a region surrounded by the slits 52 .

[0094] For example, the partition wall 6C is formed by the same process as the partition walls 6A and 6B and has the same structure as the partition walls 6A and 6B. That is, the partition wall 6C has a lower portion 61 and an upper portion 62. In addition, the lower portion 61 of the partition wall 6C has a bottom layer 63 and a shaft layer 64.

[0095] exist Figure 8 In the example, the partition wall 6C has three openings APa, APb, and APc. These openings APa, APb, and APc have the same Figure 2 The openings of the partition walls 6A surrounding the sub-pixels SP1, SP2, and SP3 are of the same shape. That is, the openings APb and APc are arranged in the X direction with the opening APa, respectively, and the opening APb is arranged in the Y direction with the opening APc. In addition, the opening APa is larger than the opening APb, and the opening APb is larger than the opening APc.

[0096] It should be noted that the partition wall 6C may have an opening having a shape different from that of the openings APa, APb, and APc. The number of openings of the partition wall 6C is not limited to three, and may be two or less, or may be four or more.

[0097] The cross-sectional structure near the slit 52 is Figure 7 The cross-sectional structure near the slit 51 shown is the same. That is, the groove 120 also exists below the slit 52, and the edge of the slit 52 and the groove 120 form an overhang structure.

[0098] Next, an example of a method for manufacturing the display device DSP is described. When manufacturing the display device DSP, a mother substrate is prepared on which a plurality of regions (panel portions) each corresponding to the display device DSP are formed.

[0099] Fig. 9 2 is a schematic plan view of the mother substrate MB of the present embodiment. The mother substrate MB is, for example, rectangular as shown in the figure, but is not limited to this example.

[0100] The mother substrate MB has a large substrate 10a. The substrate 10a is formed of the same material as the substrate 10. A plurality of panel portions PP arranged in a matrix are formed on the substrate 10a.

[0101] Each panel portion PP includes, for example, a display area DA and other Figures 1 to 8 The various elements of the display device DSP are described. Fig. 9 In the example of FIG. 1 , the mother substrate MB has eight panel portions PP, but the present invention is not limited to this example.

[0102] The outer shape of each panel portion PP corresponds to a cutting line CL1 that cuts each panel portion PP out from the mother substrate MB. In addition, each panel portion PP has a cutting line CL2. The cutting line CL2 corresponds to the first side S1 of the substrate 10 described above.

[0103] FIG. 10A to FIG. 10G 2 is a schematic cross-sectional view showing a process of forming a panel portion PP on a mother substrate MB. FIG. 10A to FIG. 10G In the figure, elements below the organic insulating layer 12 are omitted.

[0104] In the formation of the panel part PP, first prepare Fig. 9 The substrate 10a shown in FIG. 1 is formed with a circuit layer 11 and an organic insulating layer 12 on the substrate 10a. Fig. 10A As shown, lower electrodes LE1 , LE2 , and LE3 are formed on the organic insulating layer 12 .

[0105] Then, if Fig. 10B As shown, the rib layer 5 and the partition 6A are formed. The pixel openings AP1, AP2, and AP3 of the rib layer 5 can be provided after the formation of the partition 6A, or can be provided before the formation of the partition 6A. For example, the slits 51 and 52 are formed together with the formation of the pixel openings AP1, AP2, and AP3. In addition, the partitions 6B and 6C are formed together with the formation of the partition 6A.

[0106] After the rib layer 5 and the partitions 6A, 6B, and 6C are formed, a process for forming display elements DE1, DE2, and DE3 is performed. In this embodiment, it is assumed that the display element DE1 is formed first, the display element DE2 is formed next, and the display element DE3 is formed last. However, the order of forming the display elements DE1, DE2, and DE3 is not limited to this example.

[0107] In forming the display element DE1, first, as Fig. 10C As shown in FIG. 1 , a laminated film FL1 and a sealing layer SE11 are formed. Figure 3 As shown, the stacked film FL1 includes an organic layer OR1 contacting the lower electrode LE1 through the pixel opening AP1 , an upper electrode UE1 covering the organic layer OR1 , and a cap layer CP1 covering the upper electrode UE1 .

[0108] The organic layer OR1, the upper electrode UE1, and the cap layer CP1 are formed by vapor deposition. In addition, the sealing layer SE11 is formed by CVD (Chemical Vapor Deposition).

[0109] The laminate film FL1 and the sealing layer SE11 are formed not only in the display area DA of each panel unit PP, but also in the entire substrate 10a including the peripheral area SA and the area between the adjacent panel units PP. The laminate film FL1 is cut into a plurality of parts by the overhanging partitions 6A, 6B, and 6C. The sealing layer SE11 continuously covers the cut parts of the laminate film FL1 and the partitions 6A, 6B, and 6C.

[0110] Next, the laminate film FL1 and the sealing layer SE11 are patterned. In this patterning, Fig. 10D As shown in FIG. 1 , a resist R is disposed on the sealing layer SE11 . The resist R covers the sub-pixel SP1 and a part of the partition wall 6A around it.

[0111] Then, by etching with the resist R as a mask, as Fig.10E As shown, the portions of the laminated film FL1 and the sealing layer SE11 exposed from the resist R are removed. In other words, the portions of the laminated film FL1 and the sealing layer SE11 overlapping with the lower electrode LE1 remain, and the other portions are removed. Thus, a display element DE1 is formed in the sub-pixel SP1. For example, the etching includes wet etching and dry etching sequentially performed on the sealing layer SE11, the cap layer CP1, the upper electrode UE1, and the organic layer OR1. After these etchings, the resist R is removed.

[0112] The display element DE2 is formed in the same steps as the display element DE1. That is, in the formation of the display element DE2, the laminated film FL2 and the sealing layer SE12 are formed on the entire substrate 10a. Figure 3 As shown, the stacked film FL2 includes an organic layer OR2 in contact with the lower electrode LE2 through the pixel opening AP2, an upper electrode UE2 covering the organic layer OR2, and a cap layer CP2 covering the upper electrode UE2.

[0113] The organic layer OR2, the upper electrode UE2 and the cap layer CP2 are formed by evaporation. In addition, the sealing layer SE12 is formed by CVD. The laminate film FL2 is cut into a plurality of parts by the overhanging partition walls 6A, 6B, and 6C. The sealing layer SE12 continuously covers the cut parts of the laminate film FL2 and the partition walls 6A, 6B, and 6C. By patterning the laminate film FL2 and the sealing layer SE12, as shown in FIG. Fig.10F As shown, a display element DE2 is formed in the sub-pixel SP2.

[0114] The display element DE3 is formed in the same steps as the display elements DE1 and DE2. That is, in the formation of the display element DE3, the laminated film FL3 and the sealing layer SE13 are formed on the entire substrate 10a. Figure 3 As shown, the stacked film FL3 includes an organic layer OR3 in contact with the lower electrode LE3 through the pixel opening AP3, an upper electrode UE3 covering the organic layer OR3, and a cap layer CP3 covering the upper electrode UE3.

[0115] The organic layer OR3, the upper electrode UE3 and the cap layer CP3 are formed by evaporation. In addition, the sealing layer SE13 is formed by CVD. The laminate film FL3 is cut into a plurality of parts by the overhanging partition walls 6A, 6B, and 6C. The sealing layer SE13 continuously covers the cut parts of the laminate film FL3 and the partition walls 6A, 6B, and 6C. By patterning the laminate film FL3 and the sealing layer SE13, as shown in FIG. Figure 10G As shown, a display element DE3 is formed in the sub-pixel SP3.

[0116] After forming the display elements DE1, DE2, and DE3, Figure 3 The resin layer RS1, the sealing layer SE2 and the resin layer RS2 are shown. Furthermore, each panel portion PP is cut out from the mother substrate MB along the cutting line CL1.

[0117] Fig.11 1 is a schematic plan view of a panel portion PP cut out from the mother substrate MB. The panel portion PP includes a substrate 10b which is a part of the substrate 10a. The substrate 10b includes a main body portion 101 and a pad portion 102 which are separated by a cut line CL2.

[0118] The main body 101 includes Figure 4 The display area DA, the peripheral area SA, the terminal portion T1 and the terminal portion T2 are shown. The pad portion 102 includes a plurality of inspection pads PD. Each inspection pad PD is connected to the terminal portion T1 via a wiring W. Each wiring W crosses the cutting line CL2.

[0119] The organic insulating layer 12 includes a first portion 121 formed in the body portion 101 and a second portion 122 formed in the pad portion 102. The first portion 121 and the second portion 122 are separated by a gap along the dicing line CL2 and connected by protrusions PT1 and PT2.

[0120] The first portion 121 and the second portion 122 each have an outer shape slightly smaller than the main body portion 101 and the pad portion 102. Thus, a blank area BA that does not overlap with the organic insulating layer 12 is formed at the edge of the substrate 10b.

[0121] For example, the rib layer 5 is formed in the entire body portion 101 and the pad portion 102. The slits 51 of the rib layer 5 are formed not only in the body portion 101 but also in the pad portion 102.

[0122] exist Fig.11 In the example of FIG. 5 , the slit 51 is formed along the outer shape of the first portion 121 and the second portion 122 of the organic insulating layer 12, and overlaps with the protrusions PT1 and PT2. That is, the organic insulating layer 12 is provided as a whole below the slit 51. For example, the above-mentioned organic insulating layer 13 is provided as a whole below the organic insulating layer 12. The slit 51 surrounds the display area DA, the terminal portion T1, the terminal portion T2, the wiring W, and the inspection pad PD.

[0123] The inspection pad PD is used in an inspection process of image display. In this inspection process, for example, an inspection probe is brought into contact with the inspection pad PD, and a voltage is applied to each of the display elements DE1, DE2, and DE3 in the display area DA via the wiring W and the terminal portion T1.

[0124] After the inspection process, the panel portion PP is cut along the cutting line CL2. When cutting, a scribing tool (such as a scribing wheel) is used to form a scribing line along the cutting line CL2. Then, the panel portion PP is cut along the scribing line. The main body portion 101 with the pad portion 102 cut off is equivalent to the main body portion 101 cut off by the pad portion 102. Figures 1 to 8 A display device DSP is described.

[0125] Fig.12 1 is a schematic enlarged plan view of the vicinity of the convex portion PT1 in the panel portion PP. After the panel portion PP is cut, the first side S1 is formed along the cutting line CL2.

[0126] The structure of the main body 101 near the cutting line CL2 is similar to Figure 5 The structure of the display device DSP near the first side S1 shown is the same. In addition, the structure of the pad portion 102 near the cutting line CL2 is the same as the structure of the main body portion 101 near the cutting line CL2. That is, the pad portion 102 has a plurality of partitions 6B, a pair of alignment marks M1, and slits 51 and 52 in the same manner as the main body portion 101. Fig.12 5. As not shown in FIG. 5, the area surrounded by the slit 52 in the pad portion 102 is configured Figure 8 The partition wall 6C is shown.

[0127] exist Fig.12 In the example of FIG. 1 , near the cut line CL2, the main body 101 and the pad 102 have a linearly symmetrical structure about the cut line CL2. The cut line CL2 passes between a pair of alignment marks M1 of the main body 101 and a pair of alignment marks M1 of the pad 102. From the viewpoint of forming a good scribe line, it is preferred that the partition wall 6B is not arranged at a position overlapping with the cut line CL2.

[0128] Fig.13 1 is a schematic plan view of the substrate 10b, the slit 51, and the first and second portions 121 and 122 of the organic insulating layer 12 in the vicinity of the protrusion PT1. In this figure, the partition 6B and the alignment mark M1 are omitted.

[0129] That is, the scribing tool first contacts the starting point ST of the substrate 10b near the protrusion PT1, passes between the first portion 121 and the second portion 122 of the organic insulating layer 12, and reaches the end point of the substrate 10b near the protrusion PT2.

[0130] Fig.12 The four alignment marks M1 shown are used for the alignment of the scribing tool. In addition, the two alignment marks M1 of the main body 101 can also be used to check the deviation of the cutting position after the pad portion 102 is cut.

[0131] Here, some effects achieved by this embodiment are described. When forming the display elements DE1, DE2, and DE3, the laminated films FL1, FL2, and FL3 are also formed in the peripheral area SA and the pad portion 102. The laminated films FL1, FL2, and FL3 formed by evaporation have weak adhesion to the substrate, so they may peel off from the substrate during the manufacturing process of the display device DSP. If the peeling is extended, the laminated films FL1, FL2, and FL3 and the sealing layers SE11, SE12, and SE13 thereon may peel off and may become undesirable particles.

[0132] In the display area DA, the laminated films FL1, FL2, and FL3 are finely cut by the grid-shaped partition walls 6A. Therefore, the laminated films FL1, FL2, and FL3 are not easily peeled off from the substrate. In addition, as described below, in this embodiment, the peeling of the laminated films FL1, FL2, and FL3 in the peripheral area SA and the pad portion 102 is suppressed by the partition walls 6B, the partition walls 6C, the slits 51, and the slits 52.

[0133] Fig.14 1 is a schematic cross-sectional view showing a portion of the panel portion PP on which the laminate film FL1 is formed. Figure 7 The convex portion PT1 is similarly crossed.

[0134] The laminate film FL1 is divided by the overhanging partition wall 6B. In the present embodiment, an overhanging structure is formed by the slits 51 of the rib layer 5 and the grooves 120 of the organic insulating layer 12. Therefore, the laminate film FL1 is also divided at the slits 51.

[0135] Although Fig.14 Although not shown, the laminate film FL1 is also divided by the partition wall 6C and the slit 52. In this way, in the present embodiment, since the laminate film FL1 is also divided in the peripheral area SA and the pad portion 102, the laminate film FL1 is not easily peeled off. The same is true for the laminate films FL2 and FL3.

[0136] It should be noted that after forming the slits 51 and 52, the groove 120 may be formed by etching the organic insulating layer 12 at a faster rate than the rib layer 5. This etching may be only for forming the groove 120 or may be etching for forming the partitions 6A, 6B, and 6C.

[0137] like Fig.11 As shown in FIG. 1 , if the slit 51 is formed along the outer shape of the panel portion PP, the laminated films FL1, FL2, FL3 formed on the panel portion PP can be cut away from the laminated films FL1, FL2, FL3 formed around the laminated films FL1, FL2, FL3 as a whole. Figure 8 and Fig.12As shown, if a plurality of partitions 6B and 6C are arranged with gaps therebetween, the spread of a patterning resist disposed in a step after the formation of the partitions 6B and 6C is less likely to be hindered by the partitions 6B and 6C.

[0138] Fig.15 is a diagram showing a comparative example of the present embodiment, and Fig.13 Similarly, the schematic structure of the vicinity of the protrusion PT1 is shown. In this comparative example, the protrusion PT1 connects the ends of the first portion 121 and the second portion 122 of the organic insulating layer 12 in the X direction. Thus, the distance between the protrusion PT1 and the starting point ST is greater than Fig.13 The examples are short.

[0139] During the scribing, the scribing tool cuts the convex portions PT1 and PT2. The scribing tool is accelerating near the starting point ST. If the scribing tool hits the convex portion PT1 in this state, the scribing tool will vibrate and may not form a good scribing line.

[0140] In contrast, in the present embodiment, the convex portion PT1 is separated from the end portion E1 of the second side S2. Thus, the acceleration distance until the scribing tool hits the convex portion PT1 can be ensured, and the shaking of the scribing tool can be suppressed to form a good scribing line. As described above, if the distance Dx in the X direction between the end portion E1 of the second side S2 and the convex portion PT1 is, for example, 2 mm or more, a sufficient effect of suppressing the shaking of the scribing tool can be obtained.

[0141] Thus, according to the display device of this embodiment, the laminated films FL1, FL2, and FL3 can be prevented from peeling off, and good cutting along the cutting line CL2 can be achieved. As a result, the yield of the display device DSP is improved. In addition, according to this embodiment, various preferred effects can be obtained.

[0142] Based on the display device and the manufacturing method thereof described above as the embodiments of the present invention, all display devices and manufacturing methods that can be implemented by those skilled in the art through appropriate design changes also belong to the scope of the present invention as long as they include the gist of the present invention.

[0143] Within the scope of the present invention, those skilled in the art can think of various variations, which also belong to the scope of the present invention. For example, for the above-mentioned embodiments, those skilled in the art appropriately perform an embodiment in which constituent elements are added, deleted or the design is changed, or perform an embodiment in which a process is added, omitted or the condition is changed, and as long as they have the gist of the present invention, they are included in the scope of the present invention.

[0144] In addition, regarding other effects brought about by the methods described in the above embodiments, effects that are clear from the description of this specification, or effects that can be appropriately conceived by those skilled in the art are of course understood as effects brought about by the present invention.

Claims

1. A display device comprising: A substrate having a display area for displaying an image and a peripheral area around the display area; an organic insulating layer, formed of an organic insulating material and disposed above the substrate; a rib layer, which is formed of an inorganic insulating material, covers the organic insulating layer, and has a plurality of pixel openings in the display area; and a plurality of display elements respectively overlapping the plurality of pixel openings, The substrate has a first side, The organic insulating layer has: a second side located between the first side and the display area in a plan view; and a convex portion protruding from the second side toward the first side in a plan view and arranged at a position away from an end of the second side, The rib layer has a first slit overlapping the protrusion.

2. The display device according to claim 1, wherein: The first slit surrounds the display area.

3. The display device according to claim 1, wherein: The organic insulating layer has a groove overlapping with the first slit.

4. The display device according to claim 3, wherein: An edge portion of the rib layer along the first slit protrudes upward from the groove.

5. The display device according to claim 1, wherein: A distance between the end of the second side and the convex portion is 2 mm or more.

6. The display device according to claim 1, wherein: The width of the convex portion is smaller than the distance between the first side and the second side.

7. The display device according to claim 1, wherein: Each of the plurality of display elements comprises: Lower electrode; an upper electrode located above the lower electrode; and The organic layer, which is located between the lower electrode and the upper electrode, emits light in response to application of voltage.

8. The display device according to claim 7, further comprising: A first partition wall disposed between adjacent display elements in the display region; and a plurality of second partition walls arranged around the first slit in the peripheral region, in, Each of the first partition wall and the second partition wall includes: a conductive lower portion disposed above the rib layer; and The upper portion has an end portion protruding from a side surface of the lower portion.

9. The display device according to claim 8, wherein: The upper electrode is in contact with the lower portion of the first partition wall.

10. The display device according to claim 8, wherein: Each of the plurality of display elements further includes an optical adjustment layer covering the upper electrode.

11. The display device according to claim 10, further comprising: The sealing layer is formed of an inorganic insulating material and continuously covers the optical adjustment layer and the first partition wall.

12. The display device according to claim 8, wherein: At least one of the plurality of second partition walls is located above the protrusion.

13. The display device according to claim 1, wherein: The organic insulating layer has a pair of protrusions. The first slit overlaps with each of the pair of protrusions. 14 . The display device according to claim 13 , further comprising a terminal portion on which an electronic component can be mounted, wherein the terminal portion is located between the display region and the second side.

15. The display device according to claim 14, further comprising a wiring having one end connected to the terminal portion and the other end located on the first side, The wiring intersects the second side between the pair of protrusions in a plan view.

16. The display device according to claim 1, wherein: The rib layer further has second slits in a grid pattern located between the second side and the display region.

17. The display device according to claim 16, further comprising: A first partition wall disposed between adjacent display elements in the display region; and a third partition wall disposed in the peripheral region in a region surrounded by the second slit, in, Each of the first partition wall and the third partition wall comprises: a conductive lower portion disposed above the rib layer; and The upper portion has an end portion protruding from a side surface of the lower portion.

18. The display device according to claim 17, wherein: The third partition wall has an opening.

19. The display device according to claim 1, further comprising an alignment mark overlapping the second side.

20. The display device according to claim 19, wherein: The first slit is bent along the alignment mark.

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