Display device

Abstract

A display device according to one embodiment is provided with: a substrate having a display region on which an image is displayed and a peripheral region around the display region; an organic insulating layer disposed above the substrate; a rib layer covering the organic insulating layer and having a plurality of pixel openings in the display area; and a plurality of display elements overlapping the plurality of pixel openings, respectively. The substrate has a first side. The organic insulating layer has a second side located between the first side and the display region in a planar view, and a protruding portion protruding from the second side toward the first side in a planar view and provided at a position away from an end portion of the second side. The second side has a first linear portion parallel to the first side, and a recessed portion located between the first linear portion and the protruding portion and recessed in a direction away from the first side.

Description

[0001] Cross-references of related applications

[0002] This application claims priority based on Japanese Patent Application No. 2023-179397 filed on October 18, 2023, and cites all the contents described in the Japanese Patent Application. Technical Field

[0003] An embodiment of the present invention relates to a display device. Background Art

[0004] In recent years, display devices using organic light emitting diodes (OLEDs) as display elements have been put into practical use. In such display devices, a technology capable of improving the yield is required. Summary of the invention

[0005] Generally speaking, according to an embodiment, a display device includes: a substrate having a display area for displaying an image and a peripheral area around the display area; an organic insulating layer formed of an organic insulating material and disposed above the substrate; a rib layer formed of an inorganic insulating material, covering the organic insulating layer and having a plurality of pixel openings in the display area; and a plurality of display elements overlapping the plurality of pixel openings. The substrate has a first side. The organic insulating layer has a second side located between the first side and the display area in plan view, and a convex portion protruding from the second side toward the first side and disposed at a position away from the end of the second side in plan view. Furthermore, the second side has a first straight portion parallel to the first side, and a concave portion located between the first straight portion and the convex portion and concave in a direction away from the first side.

[0006] According to such a structure, the yield of the display device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 This is a diagram showing a configuration example of a display device according to an embodiment.

[0008] Figure 2 It is a schematic plan view showing an example of the layout of sub-pixels.

[0009] Figure 3 It is along Figure 2 A schematic cross-sectional view of the display device taken along line III-III in FIG.

[0010] Figure 4 This is a schematic plan view of a display device according to one embodiment.

[0011] Figure 5 yes Figure 4A schematic enlarged plan view of the vicinity of a protrusion of an organic insulating layer is shown.

[0012] Figure 6 It is a schematic plan view of the substrate, the organic insulating layer, and the slit near the protrusion.

[0013] Figure 7 It is along Figure 5 A schematic cross-sectional view of the display device taken along line VII-VII in FIG.

[0014] Figure 8 yes Figure 5 A schematic enlarged plan view of area VIII in FIG.

[0015] Fig. 9 This is a schematic plan view of a mother substrate according to one embodiment.

[0016] Fig. 10A It is a schematic cross-sectional view showing a process of forming a panel portion on a mother substrate.

[0017] Fig. 10B It means next Fig. 10A A schematic cross-sectional view of the process.

[0018] Fig. 10C It means next Fig. 10B A schematic cross-sectional view of the process.

[0019] Fig. 10D It means next Fig. 10C A schematic cross-sectional view of the process.

[0020] Fig. 10E It means next Fig. 10D A schematic cross-sectional view of the process.

[0021] Fig.10F It means next Fig. 10E A schematic cross-sectional view of the process.

[0022] Figure 10G It means next Fig.10F A schematic cross-sectional view of the process.

[0023] Fig.11 This is a schematic plan view of a panel portion cut out from a mother substrate.

[0024] Fig.12 It is a schematic enlarged plan view of the vicinity of the convex portion in the panel portion.

[0025] Fig.13 This is a schematic plan view of a substrate, a slit, and an organic insulating layer in a panel portion.

[0026] Fig.14It is a schematic cross-sectional view showing a part of a panel portion on which a laminated film is formed by vapor deposition.

[0027] Fig.15 It is a diagram showing a comparative example with respect to the embodiment.

[0028] Fig.16 It is a diagram showing a modified example of the embodiment.

[0029] Fig.17 It is a diagram showing another modified example of the embodiment. DETAILED DESCRIPTION

[0030] Several embodiments are described with reference to the accompanying drawings.

[0031] The disclosed content is only an example, and appropriate changes that can be easily thought of by those skilled in the art while maintaining the main idea of ​​the invention are of course included in the scope of the present invention. In addition, in order to make the description clearer, there are cases where the width, thickness, shape, etc. of each part are schematically shown in the drawings compared with the actual state, but this is only an example and does not limit the interpretation of the present invention. In addition, in this specification and each figure, the same figure mark is sometimes used to mark the structural elements that have the same or similar functions as the aforementioned structural elements with respect to the figures that have appeared, and repeated detailed descriptions are appropriately omitted.

[0032] In addition, in the drawings, mutually orthogonal X-axis, Y-axis and Z-axis are recorded as needed for easy understanding. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction of the plane including the X-direction and the Y-direction. In addition, the case of observing various elements parallel to the Z-direction is called plane observation.

[0033] The display device of each embodiment is an organic electroluminescent display device having an organic light emitting diode (OLED) as a display element, and can be mounted on various electronic devices such as televisions, personal computers, vehicle-mounted equipment, tablet terminals, smartphones, mobile phone terminals, and wearable terminals.

[0034] Figure 1 1 is a diagram showing a configuration example of a display device DSP according to an embodiment. The display device DSP includes an insulating substrate 10. The substrate 10 includes a display area DA for displaying an image and a peripheral area SA surrounding the display area DA. The substrate 10 may be glass or a flexible resin film.

[0035] In the present embodiment, the shape of the substrate 10 when viewed from above is a rectangle, but the shape of the substrate 10 when viewed from above is not limited to a rectangle, and may be other shapes such as a square, a circle, or an ellipse.

[0036] The display area DA includes a plurality of pixels PX arranged in a matrix in the X direction and the Y direction. The pixel PX includes a plurality of sub-pixels SP that display different colors. In the present embodiment, it is assumed that the pixel PX includes a blue sub-pixel SP1, a green sub-pixel SP2, and a red sub-pixel SP3. However, the pixel PX may include a sub-pixel SP of another color such as white together with the sub-pixels SP1, SP2, and SP3, or instead of one of the sub-pixels SP1, SP2, and SP3.

[0037] The sub-pixel SP includes a pixel circuit 1 and a display element DE driven by the pixel circuit 1. The pixel circuit 1 includes a pixel switch 2, a driving transistor 3, and a capacitor 4. The pixel switch 2 and the driving transistor 3 are switching elements formed of, for example, thin film transistors.

[0038] In the display area DA, a plurality of scanning lines GL for supplying scanning signals to the pixel circuits 1 of the sub-pixels SP, a plurality of signal lines SL for supplying video signals to the pixel circuits 1 of the sub-pixels SP, and a plurality of power supply lines PL are arranged. Figure 1 In the example of FIG. 5 , the scanning lines GL and the power lines PL extend in the X direction, and the signal lines SL extend in the Y direction.

[0039] The gate electrode of the pixel switch 2 is connected to the scanning line GL. One of the source electrode and the drain electrode of the pixel switch 2 is connected to the signal line SL, and the other is connected to the gate electrode of the driving transistor 3 and the capacitor 4. In the driving transistor 3, one of the source electrode and the drain electrode is connected to the power line PL and the capacitor 4, and the other is connected to the display element DE.

[0040] In addition, the structure of the pixel circuit 1 is not limited to the example shown in the figure. For example, the pixel circuit 1 may include more thin film transistors and capacitors.

[0041] Figure 2 1 is a schematic plan view showing an example of the layout of sub-pixels SP1, SP2, and SP3. Figure 2 In the example of FIG. 1 , the sub-pixels SP2 and SP3 are arranged in the X direction with the sub-pixel SP1 . Furthermore, the sub-pixel SP2 and the sub-pixel SP3 are arranged in the Y direction.

[0042] When the sub-pixels SP1, SP2, and SP3 are arranged in this way, in the display area DA, there are columns in which the sub-pixels SP2 and SP3 are alternately arranged in the Y direction, and columns in which a plurality of sub-pixels SP1 are repeatedly arranged in the Y direction. These columns are alternately arranged in the X direction. In addition, the layout of the sub-pixels SP1, SP2, and SP3 is not limited to Figure 2 Example.

[0043] The rib layer 5 is disposed in the display area DA. The rib layer 5 has pixel openings AP1, AP2, and AP3 in the sub-pixels SP1, SP2, and SP3, respectively. Figure 2 In the example, the pixel opening AP1 is larger than the pixel opening AP2, and the pixel opening AP2 is larger than the pixel opening AP3. That is, among the sub-pixels SP1, SP2, and SP3, the sub-pixel SP1 has the largest aperture ratio, and the sub-pixel SP3 has the smallest aperture ratio.

[0044] The sub-pixel SP1 includes a lower electrode LE1, an upper electrode UE1, and an organic layer OR1 respectively overlapping with the pixel opening AP1. The sub-pixel SP2 includes a lower electrode LE2, an upper electrode UE2, and an organic layer OR2 respectively overlapping with the pixel opening AP2. The sub-pixel SP3 includes a lower electrode LE3, an upper electrode UE3, and an organic layer OR3 respectively overlapping with the pixel opening AP3.

[0045] The lower electrode LE1, the upper electrode UE1, and the portion of the organic layer OR1 that overlaps with the pixel opening AP1 constitute the display element DE1 of the sub-pixel SP1. The lower electrode LE2, the upper electrode UE2, and the portion of the organic layer OR2 that overlaps with the pixel opening AP2 constitute the display element DE2 of the sub-pixel SP2. The lower electrode LE3, the upper electrode UE3, and the portion of the organic layer OR3 that overlaps with the pixel opening AP3 constitute the display element DE3 of the sub-pixel SP3. The display elements DE1, DE2, and DE3 may also include an overlying layer described later. The rib layer 5 surrounds each of these display elements DE1, DE2, and DE3.

[0046] A conductive partition wall 6A (first partition wall) is disposed above the rib layer 5. The partition wall 6A overlaps the rib layer 5 as a whole and has the same planar shape as the rib layer 5. That is, the partition wall 6A has openings in the sub-pixels SP1, SP2, and SP3, respectively. From another point of view, the rib layer 5 and the partition wall 6A are lattice-shaped when viewed in a plan view, and surround the display elements DE1, DE2, and DE3, respectively. The partition wall 6A has the function of serving as a wiring for supplying a common voltage to the upper electrodes UE1, UE2, and UE3.

[0047] Figure 3 It is along Figure 2 A schematic cross-sectional view of the display device DSP taken along line III-III in FIG. A circuit layer 11 is disposed on the substrate 10. The circuit layer 11 includes Figure 1 The circuit layer 11 is covered with an organic insulating layer 12. The organic insulating layer 12 functions as a planarizing film that planarizes the unevenness generated in the circuit layer 11.

[0048] The lower electrodes LE1, LE2, and LE3 are disposed on the organic insulating layer 12. The rib layer 5 is disposed on the organic insulating layer 12 and the lower electrodes LE1, LE2, and LE3. The ends of the lower electrodes LE1, LE2, and LE3 are covered by the rib layer 5. Figure 3 Although not shown in the cross section, the lower electrodes LE1, LE2, and LE3 are respectively connected to the pixel circuit 1 of the circuit layer 11 through contact holes provided in the organic insulating layer 12.

[0049] The partition wall 6A includes a conductive lower portion 61 disposed on the rib layer 5, and an upper portion 62 disposed on the lower portion 61. The upper portion 62 has a greater width than the lower portion 61. Thus, both ends of the upper portion 62 protrude from the side surfaces of the lower portion 61. Such a shape of the partition wall 6A is called an overhang.

[0050] exist Figure 3 In the example of , the lower portion 61 has a bottom layer 63 disposed on the rib layer 5 and a shaft layer 64 disposed on the bottom layer 63. For example, the bottom layer 63 is formed thinner than the shaft layer 64. Figure 3 In the example, both ends of the bottom layer 63 protrude from the side surfaces of the shaft layer 64 .

[0051] The organic layer OR1 passes through the pixel opening AP1 and covers the lower electrode LE1. The upper electrode UE1 covers the organic layer OR1 and is opposite to the lower electrode LE1. The organic layer OR2 passes through the pixel opening AP2 and covers the lower electrode LE2. The upper electrode UE2 covers the organic layer OR2 and is opposite to the lower electrode LE2. The organic layer OR3 passes through the pixel opening AP3 and covers the lower electrode LE3. The upper electrode UE3 covers the organic layer OR3 and is opposite to the lower electrode LE3. The upper electrodes UE1, UE2, and UE3 are in contact with the side of the lower portion 61 of the partition wall 6A.

[0052] The display element DE1 includes an upper cover layer CP1 covering the upper electrode UE1. The display element DE2 includes an upper cover layer CP2 covering the upper electrode UE2. The display element DE3 includes an upper cover layer CP3 covering the upper electrode UE3. The upper cover layers CP1, CP2, and CP3 respectively function as optical adjustment layers to improve the extraction efficiency of light emitted from the organic layers OR1, OR2, and OR3.

[0053] In the following description, the multilayer body including the organic layer OR1, the upper electrode UE1 and the upper covering layer CP1 is referred to as the stacked film FL1, the multilayer body including the organic layer OR2, the upper electrode UE2 and the upper covering layer CP2 is referred to as the stacked film FL2, and the multilayer body including the organic layer OR3, the upper electrode UE3 and the upper covering layer CP3 is referred to as the stacked film FL3.

[0054] A portion of the laminate film FL1 is located above the upper portion 62. This portion is separated from the portion of the laminate film FL1 located around the partition wall 6A (the portion constituting the display element DE1). Similarly, a portion of the laminate film FL2 is located above the upper portion 62, and this portion is separated from the portion of the laminate film FL2 located around the partition wall 6A (the portion constituting the display element DE2). Furthermore, a portion of the laminate film FL3 is located above the upper portion 62, and this portion is separated from the portion of the laminate film FL3 located around the partition wall 6A (the portion constituting the display element DE3).

[0055] Seal layers SE11, SE12, and SE13 are respectively disposed on sub-pixels SP1, SP2, and SP3. The seal layer SE11 continuously covers the overcoat layer CP1 and the partition wall 6A around the sub-pixel SP1. The seal layer SE12 continuously covers the overcoat layer CP2 and the partition wall 6A around the sub-pixel SP2. The seal layer SE13 continuously covers the overcoat layer CP3 and the partition wall 6A around the sub-pixel SP3.

[0056] exist Figure 3 In the example, the laminated film FL1 and the sealing layer SE11 on the partition wall 6A between the sub-pixels SP1 and SP2 are separated from the laminated film FL2 and the sealing layer SE12 on the partition wall 6A. In addition, the laminated film FL1 and the sealing layer SE11 on the partition wall 6A between the sub-pixels SP1 and SP3 are separated from the laminated film FL3 and the sealing layer SE13 on the partition wall 6A.

[0057] The sealing layers SE11, SE12, and SE13 are covered by the resin layer RS1. The resin layer RS1 is covered by the sealing layer SE2. The sealing layer SE2 is covered by the resin layer RS2. The resin layers RS1, RS2, and the sealing layer SE2 are continuously provided at least in the entire display area DA, and a part of them also reaches the peripheral area SA.

[0058] A cover member such as a polarizing plate, a touch panel, a protective film or a cover glass may be further disposed on the resin layer RS2. Such a cover member may be bonded to the resin layer RS2 via an adhesive layer such as OCA (Optical Clear Adhesive).

[0059] The organic insulating layer 12 is formed of an organic insulating material such as polyimide. The rib layer 5 and the sealing layers SE11, SE12, SE13, SE2 are formed of inorganic insulating materials such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON) or aluminum oxide (Al2O3). In one example, the rib layer 5 is formed of silicon oxynitride, and the sealing layers SE11, SE12, SE13, SE2 are formed of silicon nitride. The resin layers RS1 and RS2 are formed of a resin material (organic insulating material) such as epoxy resin or acrylic resin.

[0060] The lower electrodes LE1, LE2, and LE3 include a reflective layer formed of, for example, silver, and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. Each conductive oxide layer can be formed of, for example, a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide).

[0061] The upper electrodes UE1, UE2, UE3 are formed of a metal material such as an alloy of magnesium and silver (MgAg), etc. For example, the lower electrodes LE1, LE2, LE3 correspond to anodes, and the upper electrodes UE1, UE2, UE3 correspond to cathodes.

[0062] The organic layers OR1, OR2, and OR3 are composed of a plurality of thin films including a light-emitting layer. In one example, the organic layers OR1, OR2, and OR3 have a structure in which a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer are stacked in the Z direction. However, the organic layers OR1, OR2, and OR3 may also have other structures such as a so-called column structure including a plurality of light-emitting layers.

[0063] The overlying layers CP1, CP2, and CP3 have a stacked structure formed by, for example, overlapping multiple transparent layers. These transparent layers can include layers formed by inorganic materials and layers formed by organic materials. In addition, these transparent layers have different refractive indices. For example, the refractive indices of these transparent layers are different from the refractive indices of the upper electrodes UE1, UE2, and UE3 and the refractive indices of the sealing layers SE11, SE12, and SE13. In addition, at least one of the overlying layers CP1, CP2, and CP3 may be omitted.

[0064] The bottom layer 63 and the shaft layer 64 of the partition wall 6 are formed of metal materials. As the metal material of the bottom layer 63, for example, molybdenum, titanium, titanium nitride (TiN), molybdenum-tungsten alloy (MoW) or molybdenum-niobium alloy (MoNb) can be used. As the metal material of the shaft layer 64, for example, aluminum, aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY) or aluminum-silicon alloy (AlSi) can be used. In addition, the shaft layer 64 can also be formed of an insulating material.

[0065] For example, the upper portion 62 of the partition wall 6 has a laminated structure of a lower layer formed of a metal material and an upper layer formed of a conductive oxide. As the metal material forming the lower layer, for example, titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy or molybdenum-niobium alloy can be used. As the conductive oxide forming the upper layer, for example, ITO or IZO can be used. In addition, the upper portion 62 may also have a single-layer structure of a metal material. Moreover, the upper portion 62 may also include a layer formed of an insulating material.

[0066] A common voltage is supplied to the partition wall 6. The common voltage is supplied to the upper electrodes UE1, UE2, and UE3 respectively in contact with the side surface of the lower portion 61. The lower electrodes LE1, LE2, and LE3 are supplied with pixel voltages corresponding to the video signals of the signal lines SL through the pixel circuits 1 of the sub-pixels SP1, SP2, and SP3 respectively.

[0067] The organic layers OR1, OR2, and OR3 emit light in response to the application of voltage. Specifically, when a potential difference is formed between the lower electrode LE1 and the upper electrode UE1, the light-emitting layer of the organic layer OR1 emits light in a blue wavelength region. When a potential difference is formed between the lower electrode LE2 and the upper electrode UE2, the light-emitting layer of the organic layer OR2 emits light in a green wavelength region. When a potential difference is formed between the lower electrode LE3 and the upper electrode UE3, the light-emitting layer of the organic layer OR3 emits light in a red wavelength region.

[0068] As another example, the light-emitting layers of the organic layers OR1, OR2, and OR3 may emit light of the same color (for example, white). In this case, the display device DSP may include a color filter that converts the light emitted by the light-emitting layer into light of a color corresponding to the sub-pixels SP1, SP2, and SP3. In addition, the display device DSP may also include a layer including quantum dots that are excited by the light emitted by the light-emitting layer to generate light of a color corresponding to the sub-pixels SP1, SP2, and SP3.

[0069] Figure 4 1 is a schematic plan view of the display device DSP. The dotted portion in the figure shows a region where the organic insulating layer 12 is arranged. That is, the organic insulating layer 12 is arranged not only in the display region DA but also in the peripheral region SA.

[0070] The organic insulating layer 12 has a slightly smaller outer shape than the substrate 10 . Thus, a blank area BA which does not overlap with the organic insulating layer 12 is formed at the edge of the substrate 10 .

[0071] The substrate 10 has a first side S1 (lower side in the figure) extending in the X direction. The organic insulating layer 12 has a second side S2 located between the first side S1 and the display area DA. The second side S2 is, for example, parallel to the first side S1.

[0072] The organic insulating layer 12 has a pair of protrusions PT1 and PT2 protruding from the second side S2 toward the first side S1. The protrusion PT1 is located near the end E1 of the second side S2 (the end on the left side in the figure). The protrusion PT2 is located near the end E2 of the second side S2 (the end on the right side in the figure). In the present embodiment, the protrusion PT1 is provided at a position away from the end E1. In addition, the protrusion PT2 is provided at a position away from the end E2.

[0073] Figure 2 and Figure 3 The rib layer 5 shown is not only arranged in the display area DA, but also in the peripheral area SA. For example, the outer shape of the rib layer 5 is consistent with the outer shape of the substrate 10. The rib layer 5 has a slit 51 (first slit). The slit 51 overlaps with the organic insulating layer 12 as a whole. The slit 51 is continuously formed along the outer shape of the organic insulating layer 12, and surrounds the display area DA except for the second side S2. One end of the slit 51 overlaps with the protrusion PT1. The other end of the slit 51 overlaps with the protrusion PT2.

[0074] exist Figure 4 In the example of , four terminal portions T1 and four terminal portions T2 are arranged in the peripheral area SA. These terminal portions T1 and T2 are located between the display area DA and the second side S2. Each terminal portion T2 is located between the terminal portion T1 and the display area DA.

[0075] A flexible circuit board for supplying voltage and signals to the display device DSP is mounted on each terminal portion T1. An IC chip (driver) for controlling image display is mounted on each terminal portion T2. ​​These flexible circuit boards and IC chips are examples of electronic components.

[0076] A plurality of wirings W are also arranged in the peripheral area SA. Figure 4 In the example of FIG. 1 , four wires W extend from each terminal portion T1 in the Y direction. One end of each wire W is connected to the terminal portion T1, and the other end is located at the first side S1. Each wire W intersects the second side S2 between the protrusions PT1 and PT2. Although the details will be described later, in the manufacturing process of the display device DSP, an inspection pad is connected to each wire W.

[0077] In addition, the arrangement positions and numbers of the terminal portions T1, T2, and the wirings W are not limited to Figure 4 In addition, the display device DSP may not include the terminal portion T2. ​​In this case, the above-mentioned IC chip may be mounted on other parts such as a flexible circuit substrate.

[0078] Figure 5 1 is a schematic enlarged plan view of the vicinity of the convex portion PT1. As described above, the convex portion PT1 is separated from the end E1 of the second side S2. The distance Dx in the X direction between the end E1 and the convex portion PT1 is, for example, 2 mm or more.

[0079] The rib layer 5 further has grid-like slits 52 (second slits) in the peripheral area SA. A large number of partition walls 6B (second partition walls) are arranged around the slits 52. The slits 52 are located, for example, between each side of the organic insulating layer 12 including the second side S2 and the display area DA.

[0080] The plurality of partition walls 6B are arranged at intervals along the outer shape of the substrate 10, the outer shape of the organic insulating layer 12, and the slit 51. For example, the plurality of partition walls 6B are respectively located in the region between the first side S1 and the second side S2, the region between the second side S2 and the slit 51, and the region between the slit 51 and the slit 52. Figure 5 In the example, a part of the plurality of partition walls 6B overlaps with the protrusion PT1.

[0081] A pair of L-shaped alignment marks M1 and a cross-shaped alignment mark M2 are arranged near the protrusion PT1. The alignment marks M1 and M2 can be formed of, for example, the metal layer included in the circuit layer 11 described above.

[0082] The pair of alignment marks M1 are located between the protrusion PT1 and the end E1 in the X direction and overlap with the margin area BA and the second side S2. The slit 51 has a curved portion 51a curved along the alignment marks M1. Thus, the slit 51 does not overlap with the alignment marks M1.

[0083] The alignment mark M2 is located in the region where the slit 52 is arranged. Figure 5 In the example of FIG. 5 , the lattice of the slits 52 is opened in a rectangular shape around the alignment mark M2. Thus, the slits 52 do not overlap with the alignment mark M2.

[0084] The second side S2 has a straight portion L1 (first straight portion) parallel to the first side S1 and a recessed portion V located between the straight portion L1 and the protrusion PT1 in the X direction. The recessed portion V is recessed in a direction away from the first side S1 (upward in the figure). The slit 51 further has a curved portion 51b curved along the recessed portion V.

[0085] The margin area BA surrounded by the first side S1, the second side S2, and the convex portion PT1 includes a first area A1 located between the first side S1 and the straight portion L1 in the Y direction, and a second area A2 located between the first side S1 and the concave portion V in the Y direction. Figure 5 In the example, the width of the first region A1 in the X direction is greater than the width of the second region A2 in the X direction. Not limited to this example, the width of the second region A2 in the X direction may be greater than the width of the first region A1 in the X direction.

[0086] exist Figure 5 In the example of , also on the right side of the convex portion PT1, the second side S2 has the concave portion V. That is, the convex portion PT1 is located between the pair of second areas A2.

[0087] Figure 6 1 is a schematic plan view of the substrate 10, the organic insulating layer 12, and the slit 51 in the vicinity of the protrusion PT1. In this figure, the partition wall 6B and the alignment mark M1 are omitted.

[0088] exist Figure 6 In the example of , the convex portion PT1 has a straight portion L2 (second straight portion) orthogonal to the first side S1. The straight portion L2 corresponds to the side of the convex portion PT1 facing the second area A2. In addition, the concave portion V of the second side S2 has straight portions L3a, L3b, and L3c (third straight portion). The straight portions L3a and L3c are inclined relative to, for example, the X direction and the Y direction. The straight portion L3b is parallel to the X direction, for example.

[0089] The straight line portions L1 and L3a form an angle θ1, the straight line portions L3a and L3b form an angle θ2, the straight line portions L3b and L3c form an angle θ3, and the straight line portions L3c and L2 form an angle θ4. The angles θ1, θ2, θ3, and θ4 are all equivalent to the inner angles of the blank area BA. Figure 6 In the example, angles θ1, θ2, θ3, and θ4 are all obtuse angles (90° < θ1, θ2, θ3, θ4). However, any one of the angles θ1, θ2, θ3, and θ4 may be a right angle or an acute angle.

[0090] exist Figure 6 In the example, the straight portions L1 and L3a are connected by the curved portion C1, the straight portions L3a and L3b are connected by the curved portion C2, the straight portions L3b and L3c are connected by the curved portion C3, and the straight portions L3c and L2 are connected by the curved portion C4. The curved portions C1, C2, C3, and C4 are all arc-shaped.

[0091] The width Wy1 of the first region A1 in the Y direction is smaller than the width Wy2 of the second region A2 in the Y direction (Wy1<Wy2). The width Wy1 corresponds to the distance between the first side S1 and the straight portion L1. The width Wy2 corresponds to the distance between the first side S1 and the straight portion L3b.

[0092] The width Wy1 is, for example, 0.2 mm or less. The width Wy2 is, for example, 0.5 mm or more larger than the width Wy1. The width Wp of the projection PT1 in the X direction is, for example, smaller than the width Wy2 (Wp<Wy2).

[0093] In the vicinity of the convex portion PT2, it is possible to apply Figure 5 and Figure 6 The structure near the convex portion PT1 shown is the same as that shown in FIG.

[0094] Figure 7 It is along Figure 5 1 is a schematic cross-sectional view of the display device DSP taken along line VII-VII in FIG. In this figure, a part of the substrate 10 and the circuit layer 11 are omitted.

[0095] exist Figure 7 In the example of FIG. 1 , an organic insulating layer 13 is disposed below the organic insulating layer 12. Furthermore, an inorganic insulating layer 14 is disposed below the organic insulating layer 13. The organic insulating layer 13 and the inorganic insulating layer 14 are, for example, a part of the circuit layer 11.

[0096] The organic insulating layer 13 is formed of an organic insulating material such as polyimide, etc. The inorganic insulating layer 14 is formed of an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxynitride.

[0097] exist Figure 7 In the example, the width of the organic insulating layer 13 is greater than the width of the organic insulating layer 12. Both ends of the organic insulating layer 13 protrude compared to both ends of the organic insulating layer 12. Figure 7 The organic insulating layers 12 and 13 shown in the figure constitute the projection PT1. The projection PT2 can also be constituted by the organic insulating layers 12 and 13 in the same manner.

[0098] The rib layer 5 covers the organic insulating layers 12, 13 and the inorganic insulating layer 14. Figure 7 In the cross section of FIG. 1 , a pair of partition walls 6B are arranged above the protrusion PT1 , and a slit 51 is provided between these partition walls 6B.

[0099] The partition wall 6B is Figure 3 The partition wall 6A shown is formed by the same process and has the same structure as the partition wall 6A. That is, the partition wall 6B has a lower portion 61 and an upper portion 62. Furthermore, the lower portion 61 of the partition wall 6B has a bottom layer 63 and a shaft layer 64.

[0100] The upper surface of the organic insulating layer 12 is exposed from the rib layer 5 through the slits 51. Figure 7In the example of , the upper surface of the organic insulating layer 12 has a groove 120 overlapping the slit 51. A portion of the groove 120 reaches below the rib layer 5. Thus, the edge of the rib layer 5 along the slit 51 protrudes above the groove 120. That is, an overhang structure is formed by the edge and the groove 120.

[0101] exist Figures 4 to 6 The organic insulating layer 13 is also disposed below the substantially entire organic insulating layer 12 shown in FIG. Therefore, the slits 51 and 52 overlap the organic insulating layers 12 and 13 in a plan view. Figure 7 The position shown in the cross section is also formed in a manner that integrally overlaps with the slit 51.

[0102] Figure 8 yes Figure 5 A schematic enlarged plan view of region VIII in FIG. In the peripheral region SA, a plurality of partition walls 6C (third partition walls) are arranged in a region surrounded by the slits 52 .

[0103] For example, the partition wall 6C is formed by the same process as the partition walls 6A and 6B and has the same structure as the partition walls 6A and 6B. That is, the partition wall 6C has a lower portion 61 and an upper portion 62. The lower portion 61 of the partition wall 6C has a bottom layer 63 and a shaft layer 64.

[0104] exist Figure 8 In the example of FIG. 6A , the partition wall 6C has three openings APa, APb, and APc. These openings APa, APb, and APc have Figure 2 The openings of the partition walls 6A surrounding the sub-pixels SP1, SP2, and SP3 are of the same shape as shown. That is, the openings APb and APc are arranged with the opening APa in the X direction, respectively, and the opening APb and the opening APc are arranged in the Y direction. Moreover, the opening APa is larger than the opening APb, and the opening APb is larger than the opening APc.

[0105] In addition, the partition wall 6C may have an opening having a shape different from that of the openings APa, APb, and APc. The number of openings of the partition wall 6C is not limited to three, and may be two or less, or may be four or more.

[0106] The cross-sectional structure near the slit 52 is Figure 7 The cross-sectional structure near the slit 51 shown is the same. That is, the groove 120 also exists below the slit 52, and the edge of the slit 52 and the groove 120 form an overhanging structure.

[0107] Next, an example of a method for manufacturing the display device DSP is described. When manufacturing the display device DSP, a mother substrate is prepared on which a plurality of regions (panel portions) each corresponding to the display device DSP are formed.

[0108] Fig. 9 1 is a schematic plan view of the mother substrate MB of the present embodiment. The mother substrate MB is, for example, in a rectangular shape as shown in the figure, but is not limited to this example.

[0109] The mother substrate MB has a large substrate 10a. The substrate 10a is formed of the same material as the substrate 10. A plurality of panel portions PP arranged in a matrix are formed on the substrate 10a.

[0110] Each panel portion PP includes, for example, a display area DA, etc. Figures 1 to 8 The various elements of the display device DSP are described. Fig. 9 In the example of FIG. 1 , the mother substrate MB has eight panel parts PP, but the present invention is not limited to this example.

[0111] The outer shape of each panel portion PP corresponds to a cutting line CL1 for cutting each panel portion PP from the mother substrate MB. In addition, each panel portion PP has a cutting line CL2. The cutting line CL2 corresponds to the first side S1 of the substrate 10 described above.

[0112] FIG. 10A to FIG. 10G 2 is a schematic cross-sectional view showing a process of forming the panel portion PP on the mother substrate MB. FIG. 10A to FIG. 10G In the figure, elements below the organic insulating layer 12 are omitted.

[0113] When forming the panel part PP, first prepare Fig. 9 The substrate 10a shown in FIG. 1 is formed with a circuit layer 11 and an organic insulating layer 12 on the substrate 10a. Fig. 10A As shown, lower electrodes LE1 , LE2 , and LE3 are formed on the organic insulating layer 12 .

[0114] Then, if Fig. 10B As shown, the rib layer 5 and the partition wall 6A are formed. The pixel openings AP1, AP2, and AP3 of the rib layer 5 can be provided after the partition wall 6A is formed, or can be provided before the partition wall 6A is formed. For example, the above-mentioned slits 51 and 52 are formed together with the formation of the pixel openings AP1, AP2, and AP3. In addition, the above-mentioned partition walls 6B and 6C are formed together with the formation of the partition wall 6A.

[0115] After forming the rib layer 5 and the partition walls 6A, 6B, and 6C, a process for forming the display elements DE1, DE2, and DE3 is performed. In this embodiment, it is assumed that the display element DE1 is formed first, the display element DE2 is formed next, and the display element DE3 is formed last. However, the order of forming the display elements DE1, DE2, and DE3 is not limited to this example.

[0116] When forming the display element DE1, first Fig. 10CAs shown in FIG. 1 , a laminate film FL1 and a sealing layer SE11 are formed. Figure 3 As shown, it includes an organic layer OR1 contacting the lower electrode LE1 through the pixel opening AP1, an upper electrode UE1 covering the organic layer OR1, and an upper cover layer CP1 covering the upper electrode UE1.

[0117] The organic layer OR1, the upper electrode UE1, and the upper cover layer CP1 are formed by vapor deposition. In addition, the sealing layer SE11 is formed by CVD (Chemical Vapor Deposition).

[0118] The laminate film FL1 and the sealing layer SE11 are formed not only in the display area DA of each panel part PP, but also in the entire substrate 10a including the peripheral area SA and the area between the adjacent panel parts PP. The laminate film FL1 is cut into a plurality of parts by the overhanging partition walls 6A, 6B, and 6C. The sealing layer SE11 continuously covers the cut parts of the laminate film FL1 and the partition walls 6A, 6B, and 6C.

[0119] Next, the laminate film FL1 and the sealing layer SE11 are patterned. Fig. 10D As shown, a resist R is disposed on the sealing layer SE11. The resist R covers the sub-pixel SP1 and a part of the partition wall 6A around it.

[0120] After that, by etching with the resist R as a mask, as Fig. 10E As shown, the portions of the laminated film FL1 and the sealing layer SE11 exposed from the resist R are removed. In other words, the portions of the laminated film FL1 and the sealing layer SE11 overlapping with the lower electrode LE1 remain, and the other portions are removed. Thus, a display element DE1 is formed in the sub-pixel SP1. For example, the etching includes dry etching and wet etching sequentially performed on the sealing layer SE11, the overlying layer CP1, the upper electrode UE1, and the organic layer OR1. After these etchings, the resist R is removed.

[0121] The display element DE2 is formed in the same order as the display element DE1. That is, when forming the display element DE2, the laminated film FL2 and the sealing layer SE12 are formed on the entire substrate 10a. Figure 3 As shown, it includes an organic layer OR2 contacting the lower electrode LE2 through the pixel opening AP2, an upper electrode UE2 covering the organic layer OR2, and an upper cover layer CP2 covering the upper electrode UE2.

[0122] The organic layer OR2, the upper electrode UE2 and the upper cover layer CP2 are formed by evaporation. In addition, the sealing layer SE12 is formed by CVD. The laminate film FL2 is cut into a plurality of parts by the overhanging partition walls 6A, 6B, and 6C. The sealing layer SE12 continuously covers the cut parts of the laminate film FL2 and the partition walls 6A, 6B, and 6C. By patterning such a laminate film FL2 and the sealing layer SE2, as shown in FIG. Fig.10F As shown, a display element DE2 is formed in the sub-pixel SP2.

[0123] The display element DE3 is formed in the same order as the display elements DE1 and DE2. That is, when forming the display element DE3, the laminated film FL3 and the sealing layer SE13 are formed on the entire substrate 10a. Figure 3 As shown, it includes an organic layer OR3 contacting the lower electrode LE3 through the pixel opening AP3, an upper electrode UE3 covering the organic layer OR3, and an overlying layer CP3 covering the upper electrode UE3.

[0124] The organic layer OR3, the upper electrode UE3 and the upper cover layer CP3 are formed by evaporation. In addition, the sealing layer SE13 is formed by CVD. The laminate film FL3 is cut into a plurality of parts by the overhanging partition walls 6A, 6B, and 6C. The sealing layer SE13 continuously covers the cut parts of the laminate film FL3 and the partition walls 6A, 6B, and 6C. By patterning such a laminate film FL3 and the sealing layer SE13, as shown in FIG. Figure 10G As shown, a display element DE3 is formed in the sub-pixel SP3.

[0125] After forming the display elements DE1, DE2, and DE3, Figure 3 The resin layer RS1, the sealing layer SE2 and the resin layer RS2 are shown. Then, each panel portion PP is cut out from the mother substrate MB along the cutting line CL1.

[0126] Fig.11 1 is a schematic plan view of a panel portion PP cut out from the mother substrate MB. The panel portion PP includes a substrate 10b which is a part of the substrate 10a described above. The substrate 10b includes a main body portion 101 and a pad portion 102 which are separated by a cut line CL2.

[0127] The main body 101 includes Figure 4 The display area DA, the peripheral area SA, the terminal portion T1 and the terminal portion T2 are shown. The pad portion 102 includes a plurality of inspection pads PD. Each inspection pad PD is connected to the terminal portion T1 via a wiring W. Each wiring W crosses the cutting line CL2.

[0128] The organic insulating layer 12 includes a first portion 121 formed in the body portion 101 and a second portion 122 formed in the pad portion 102. The first portion 121 and the second portion 122 are separated by a gap along the cut line CL2 and connected by protrusions PT1 and PT2.

[0129] The first portion 121 and the second portion 122 each have an outer shape slightly smaller than the main body portion 101 and the pad portion 102. Thus, a blank area BA that does not overlap with the organic insulating layer 12 is formed at the edge of the substrate 10b.

[0130] The rib layer 5 is formed on, for example, the entire body portion 101 and the pad portion 102. The slits 51 of the rib layer 5 are formed not only on the body portion 101 but also on the pad portion 102.

[0131] exist Fig.11 In the example of FIG. 5 , the slit 51 is formed along the outer shape of the first portion 121 and the second portion 122 of the organic insulating layer 12, and overlaps with the protrusions PT1 and PT2. That is, the organic insulating layer 12 is integrally provided below the slit 51. For example, the above-mentioned organic insulating layer 13 is integrally provided below the organic insulating layer 12. The slit 51 surrounds the display area DA, the terminal portion T1, the terminal portion T2, the wiring W, and the inspection pad PD.

[0132] The inspection pad PD is used in an inspection process of image display. In this inspection process, for example, an inspection probe is brought into contact with the inspection pad PD, and a voltage is applied to each of the display elements DE1, DE2, and DE3 in the display area DA via the wiring W and the terminal portion T1.

[0133] After the inspection process, the panel portion PP is cut along the cutting line CL2. When cutting, a scribe line is first formed along the cutting line CL2 using a scribe tool (e.g., a scribe wheel). Then, the panel portion PP is cut along the scribe line. The main body portion 101 cut out from the pad portion 102 is equivalent to the main body portion 101 cut out using the scribe wheel. Figures 1 to 8 A display device DSP is described.

[0134] Fig.12 1 is a schematic enlarged plan view of the vicinity of the protrusion PT1 in the panel portion PP. After the panel portion PP is cut, the first side S1 described above is formed along the cutting line CL2.

[0135] The structure of the main body 101 near the cutting line CL2 is similar to Figure 5The structure of the display device DSP near the first side S1 shown in FIG. 1 is the same as that of the main body 101 near the cutting line CL2. In addition, the structure of the pad portion 102 near the cutting line CL2 is the same as that of the main body 101 near the cutting line CL2. That is, the pad portion 102 has a plurality of partition walls 6B, a pair of alignment marks M1, and slits 51 and 52 in the same manner as the main body 101. Fig.12 5. However, in the pad portion 102, in the area surrounded by the slit 52, there is provided Figure 8 The partition wall 6C is shown.

[0136] exist Fig.12 In the example of FIG. 1 , the main body 101 and the pad 102 are linearly symmetrical about the cutting line CL2 near the cutting line CL2. The cutting line CL2 passes between a pair of alignment marks M1 of the main body 101 and a pair of alignment marks M1 of the pad 102. From the viewpoint of forming a good scribe line, it is preferred that the partition wall 6B is not arranged at a position overlapping with the cutting line CL2.

[0137] Fig.13 1 is a schematic plan view of the substrate 10b, the slit 51, and the first and second portions 121 and 122 of the organic insulating layer 12 in the vicinity of the protrusion PT1. In this figure, the partition wall 6B and the alignment mark M1 are omitted.

[0138] That is, the scribing tool first contacts the starting point ST of the substrate 10b near the protrusion PT1, passes between the first portion 121 and the second portion 122 of the organic insulating layer 12, and reaches the end point of the substrate 10b near the protrusion PT2.

[0139] The cut line CL2 is perpendicular to the straight line portion L2 of the convex portion PT1. That is, the dicing direction CD is perpendicular to the straight line portion L2. The same is true for the convex portion PT2.

[0140] Fig.12 The four alignment marks M1 shown are used for positioning of a dicing tool. In addition, the two alignment marks M1 of the main body 101 can also be used to check for deviation of the cutting position after the pad portion 102 is cut out.

[0141] Here, some effects of this embodiment are described. When forming the display elements DE1, DE2, and DE3, the laminated films FL1, FL2, and FL3 are also formed in the peripheral area SA and the pad portion 102. The laminated films FL1, FL2, and FL3 formed by evaporation have weak adhesion to the substrate, so there is a possibility of peeling off from the substrate during the manufacture of the display device DSP. If the peeling expands, the laminated films FL1, FL2, and FL3 and the sealing layers SE11, SE12, and SE13 thereon will peel off and may become undesirable particles.

[0142] In the display area DA, the laminated films FL1, FL2, and FL3 are divided into thin layers by the grid-shaped partition walls 6A. Therefore, the laminated films FL1, FL2, and FL3 are difficult to peel off from the substrate. In addition, as described below, in this embodiment, the laminated films FL1, FL2, and FL3 in the peripheral area SA and the pad portion 102 are prevented from peeling off by the partition walls 6B, the partition walls 6C, the slits 51, and the slits 52.

[0143] Fig.14 1 is a schematic cross-sectional view showing a portion of the panel portion PP on which the laminate film FL1 is formed. Figure 7 The convex portion PT1 is cut across in the same manner.

[0144] The laminate film FL1 is cut by the overhanging partition wall 6B. In the present embodiment, an overhanging structure is formed by the slits 51 of the rib layer 5 and the grooves 120 of the organic insulating layer 12. Therefore, the laminate film FL1 is also cut at the slits 51.

[0145] Although in Fig.14 Although not shown, the laminated film FL1 is also cut by the partition wall 6C and the slit 52. In this way, in the present embodiment, the laminated film FL1 is also cut in the peripheral area SA and the pad portion 102, so that the laminated film FL1 is unlikely to peel off. The same is true for the laminated films FL2 and FL3.

[0146] The groove 120 can be formed by performing etching at a faster rate for the organic insulating layer 12 than for the rib layer 5 after forming the slits 51 and 52. This etching may be etching only for forming the groove 120 or etching when forming the partition walls 6A, 6B, and 6C.

[0147] If Fig.11 As shown in FIG. 1 , if the slit 51 is formed along the outer shape of the panel portion PP, the laminated films FL1, FL2, FL3 formed on the panel portion PP can be cut away from the laminated films FL1, FL2, FL3 formed around the laminated films FL1, FL2, FL3 as a whole. Figure 8 and Fig.12 As shown, when a large number of partition walls 6B and 6C are arranged with gaps therebetween, diffusion of a patterning resist placed in a step after forming the partition walls 6B and 6C is less likely to be hindered by the partition walls 6B and 6C.

[0148] Fig.15 is a diagram showing a comparative example relative to the present embodiment, and Fig.13Similarly, the schematic structure of the vicinity of the protrusion PT1 is shown. In this comparative example, the protrusion PT1 connects the ends of the first portion 121 and the second portion 122 of the organic insulating layer 12 in the X direction. Thus, the distance between the protrusion PT1 and the starting point ST is greater than Fig.13 The examples are short.

[0149] During the scribing, the scribing tool cuts off the protrusions PT1 and PT2. The scribing tool is in the process of accelerating near the starting point ST. If the scribing tool hits the protrusion PT1 in this state, the scribing tool will move, and there is a possibility that a good scribing street cannot be formed.

[0150] In contrast, in the present embodiment, the protrusion PT1 is away from the end E1 of the second side S2. Thus, the acceleration distance before the dicing tool hits the protrusion PT1 is ensured, and the movement of the dicing tool can be suppressed to form a good dicing track. If the distance Dx in the X direction between the end E1 of the second side S2 and the protrusion PT1 is, for example, 2 mm or more as described above, a sufficient effect of suppressing the movement of the dicing tool can be obtained.

[0151] Fig.16 and Fig.17 are diagrams showing modified examples of the present embodiment, and Fig.13 The schematic structure near the convex portion PT1 is similarly shown. In these modified examples, the convex portion PT1 is separated from the end E1. Therefore, the above-mentioned acceleration distance can be ensured to form a good scribe line. However, in these modified examples, the second side S2 is linear in its entirety. That is, the second side S2 does not have a concave portion V.

[0152] exist Fig.16 In the modified example, the second side S2 is orthogonal to the side (straight line portion L2) of the convex portion PT1. When forming the partition walls 6A, 6B, and 6C, the materials of the bottom layer 63, the shaft layer 64, and the upper portion 62 are formed at Fig. 9 The entire substrate 10a shown is then patterned into the shape of partition walls 6A, 6B, 6C. Fig.16 In this way, when the second side S2 is perpendicular to the straight line portion L2, the materials of the partition walls 6A, 6B, and 6C are not completely removed at the corners formed by them, and are likely to remain as residues 6x. Since the residues 6x are conductive, they may cause electrostatic damage.

[0153] exist Fig.17 In the modified example, the side of the protrusion PT1 is an arc shaped with the cutting line CL2 as the center. With such a structure, it is difficult to generate residue 6x. However, if the dicing tool is slightly offset from the cutting line CL2 in the Y direction, the dicing tool will be tilted and touch the side of the protrusion PT1. In this case, there is a possibility of movement of the dicing tool.

[0154] In this embodiment, for example Figure 6 As shown in FIG. 1 , the second side S2 has a concave portion V. Moreover, the internal angles formed in the concave portion V are all obtuse angles. Even with such a structure, Fig.17 The modified example is also unlikely to produce residue 6x.

[0155] Furthermore, in the present embodiment, the recessed portion V and the surrounding straight line portions L1, L2, L3a, L3b, and L3c are connected by arc-shaped curved portions C1, C2, C3, and C4. With such a structure, the residue 6x can be suppressed more effectively.

[0156] In addition, in this embodiment, by providing the recessed portion V, a relatively long straight portion L2 can be formed on the side of the protruding portion PT1. Thus, even if the dicing tool deviates from the cutting line CL2, the dicing tool can easily touch the side of the protruding portion PT1 vertically. As a result, the movement of the dicing tool can be suppressed.

[0157] As described above, according to the display device of this embodiment, electrostatic damage caused by peeling of the stacked films FL1, FL2, and FL3 or residue 6x can be suppressed, and good cutting along the cutting line CL2 can be achieved. As a result, the yield of the display device DSP is improved. In addition, various good effects can be obtained from this embodiment.

[0158] Based on the display device and the manufacturing method thereof described above as the embodiments of the present invention, all display devices and manufacturing methods that can be implemented by those skilled in the art after making appropriate design changes also belong to the scope of the present invention as long as they include the gist of the present invention.

[0159] Within the scope of the present invention, those skilled in the art can think of various variations, which are also interpreted as belonging to the scope of the present invention. For example, for the above-mentioned embodiments, those skilled in the art can appropriately add, delete, or design changes to structural elements, or add, omit, or change conditions to process, as long as they have the gist of the present invention, they are included in the scope of the present invention.

[0160] In addition, regarding other effects brought about by the methods described in the above embodiments, effects that are clear from the description of this specification or effects that can be appropriately imagined by those skilled in the art are of course interpreted as being brought about by the present invention.

Claims

1. A display device, characterized in that: have: A substrate having a display area for displaying an image and a peripheral area around the display area; an organic insulating layer, formed of an organic insulating material and disposed above the substrate; a rib layer, which is formed of an inorganic insulating material, covers the organic insulating layer, and has a plurality of pixel openings in the display area; and a plurality of display elements, which overlap with the plurality of pixel openings respectively; The substrate has a first side, The organic insulating layer has: A second side located between the first side and the display area when viewed in plan; and a convex portion that protrudes from the second side toward the first side and is provided at a position away from an end of the second side in plan view, The second side has: a first straight line portion parallel to the first side; and A concave portion is located between the first straight portion and the convex portion and is concave in a direction away from the first side.

2. The display device according to claim 1, characterized in that The side of the convex portion has a second straight line portion that is orthogonal to the first side.

3. The display device according to claim 2, characterized in that: The concave portion has a plurality of third straight line portions, Among the first straight line portion, the second straight line portion, and the plurality of third straight line portions, two adjacent straight line portions form an obtuse angle.

4. The display device according to claim 3, characterized in that: In the first straight line portion, the second straight line portion, and the plurality of third straight line portions, two adjacent straight line portions are connected by an arc-shaped curved line portion.

5. The display device according to claim 1, characterized in that: The rib layer has a first slit overlapping the convex portion.

6. The display device according to claim 5, characterized in that: The first slit surrounds the display area.

7. The display device according to claim 5, characterized in that: The organic insulating layer has a groove overlapping with the first slit.

8. The display device according to claim 7, characterized in that: The edge portion of the rib layer along the first slit protrudes upward from the groove.

9. The display device according to claim 5, characterized in that: Each of the plurality of display elements comprises: Lower electrode; an upper electrode located above the lower electrode; and An organic layer is located between the lower electrode and the upper electrode and emits light according to application of voltage.

10. The display device according to claim 9, characterized in that: Also available: a first partition wall disposed between adjacent display elements in the display region; and a plurality of second partition walls arranged around the first slit in the peripheral region, The first partition wall and the second partition wall each include: a conductive lower portion disposed above the rib layer; and An upper portion has an end portion protruding from a side of the lower portion.

11. The display device according to claim 10, characterized in that: The upper electrode is in contact with the lower portion of the first partition wall.

12. The display device according to claim 10, characterized in that: At least one of the plurality of second partition walls is located above the convex portion.

13. The display device according to claim 5, characterized in that The organic insulating layer has a pair of protrusions. The first slit overlaps with each of the pair of convex portions.

14. The display device according to claim 13, characterized in that: A terminal portion is further provided, which is located between the display region and the second side and on which an electronic component can be mounted.

15. The display device according to claim 14, characterized in that: further comprising a wiring having one end connected to the terminal portion and the other end located on the first side, The wiring crosses the second side between the pair of protrusions in a plan view.

16. The display device according to claim 5, characterized in that: The rib layer further has a grid-shaped second slit located between the second side and the display area.

17. The display device according to claim 16, characterized in that: Also available: a first partition wall disposed between adjacent display elements in the display region; and a third partition wall disposed in the peripheral region in a region surrounded by the second slit, The first partition wall and the third partition wall each include: a conductive lower portion disposed above the rib layer; and An upper portion has an end portion protruding from a side of the lower portion.

18. The display device according to claim 17, characterized in that: The third partition wall has an opening.

19. The display device according to claim 5, characterized in that: An alignment mark overlapping the second side is also provided.

20. The display device according to claim 19, characterized in that The first slit is bent along the alignment mark.

Images