Display panel, manufacturing method of display panel and display device
By designing a conductive reflection unit in the OLED display panel electrically connected to the first electrode and positioning the light emitting unit on the side where the first electrode is far away from the driving substrate, the problem of increasing power consumption of the display panel is solved, and the effect of reducing power consumption at the same brightness is achieved.
Patent Information
- Application Number
- CN202311349314.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-17
- Publication Date
- 2025-04-18
AI Technical Summary
As the size of the OLED display panel increases, power consumption also increases. How to reduce the power consumption of the display panel has become an urgent need for technicians.
A display panel is designed in which a conductive reflective unit is distributed on a side wall of a pixel defining layer forming a pixel opening and electrically connected to the first electrode, and the light emitting unit is located in the pixel opening and located on the side of the first electrode away from the driving substrate. This design increases the luminous area and light output rate during display, thereby reducing the driving voltage at the same luminous brightness, achieving the purpose of reducing power consumption.
By increasing the light emitting area and light output rate, the driving voltage supplied to the first electrode can be reduced under the premise of the same light emitting brightness, thereby effectively reducing the power consumption of the display panel.
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Figure CN119855427A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and a display device. Background Art
[0002] Organic Light-Emitting Diode (OLED) has the characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, etc., so it has attracted widespread attention. As a new generation of display method, it has gradually replaced traditional liquid crystal displays and is widely used in mobile phone screens, computer monitors, full-color TVs, etc. With the development of display technology, the size of display panels based on OLED technology continues to increase, and the power consumption of display panels also continues to increase. How to reduce the power consumption of display panels is a technical problem that technicians in this field urgently need to solve. Summary of the invention
[0003] In order to overcome the technical problems mentioned in the above technical background, embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device.
[0004] In a first aspect of the present application, a display panel is provided, the display panel comprising:
[0005] A driving substrate comprising a plurality of first electrodes;
[0006] A pixel device layer, wherein the pixel device layer is located on the driving substrate;
[0007] The pixel device layer includes a pixel defining layer, a light-emitting unit and a conductive reflecting unit; a plurality of pixel openings are opened on the pixel defining layer, the pixel openings expose the first electrode, the conductive reflecting unit is located on the side wall of the pixel opening and is electrically connected to the first electrode, the light-emitting unit is located in the pixel opening, and the light-emitting unit is located on a side of the first electrode away from the driving substrate.
[0008] In the above design, the conductive reflective unit is distributed on the side wall of the pixel opening formed by the pixel defining layer and is electrically connected to the first electrode. On the one hand, when the display panel is displayed, the light-emitting unit located on the conductive reflective unit and the first electrode can emit light, so that the light-emitting area can be increased; on the other hand, the light emitted by the light-emitting unit can be reflected by the conductive reflective unit and then emitted from the light-emitting side of the display panel, thereby increasing the light-emitting rate of the display panel. Based on the above two factors, the driving voltage provided to the first electrode can be reduced under the premise of the same light-emitting brightness, thereby achieving the purpose of reducing the power consumption of the display panel.
[0009] In a possible embodiment of the present application, the light-emitting unit includes a first light-emitting layer and a second light-emitting layer located on a side of the first light-emitting layer away from the driving substrate;
[0010] The first light-emitting layer includes a first sub-light-emitting layer located at the bottom wall of the pixel opening and a second sub-light-emitting layer located at the side wall of the pixel opening;
[0011] The first light-emitting layer comprises an organic light-emitting material layer;
[0012] The second light-emitting layer includes a quantum dot light-emitting material layer;
[0013] Preferably, the second light-emitting layer includes one of a transparent adhesive layer, a first quantum dot material layer and a second quantum dot material layer;
[0014] Preferably, the pixel opening includes a first pixel opening, a second pixel opening and a third pixel opening;
[0015] The transparent adhesive layer is located in the first pixel opening and on a side of the first light emitting layer away from the driving substrate;
[0016] The first quantum dot material layer is located in the second pixel opening and on a side of the first light-emitting layer away from the driving substrate;
[0017] The second quantum dot material layer is located in the third pixel opening and on a side of the first light emitting layer away from the driving substrate;
[0018] Preferably, the first light-emitting layer is a blue light-emitting unit, the first quantum dot material layer is a green light quantum dot material layer, and the second quantum dot material layer is a red light quantum dot material layer; preferably, in a direction perpendicular to the driving substrate, the thickness of the first light-emitting layer ranges from greater than or equal to 300 nm to less than or equal to 700 nm.
[0019] In a possible embodiment of the present application, the display panel further includes a second electrode layer, the second electrode layer is located on a side of the second light-emitting layer close to the driving substrate, and the second electrode layer covers the first light-emitting layer;
[0020] Preferably, the second electrode layer also covers the pixel defining layer;
[0021] Preferably, the display panel further includes a first encapsulation layer and a second encapsulation layer;
[0022] Preferably, the display panel further includes a first encapsulation layer and a second encapsulation layer;
[0023] The first encapsulation layer is located on a side of the second light-emitting layer close to the driving substrate, and the first encapsulation layer covers the second electrode layer;
[0024] The second encapsulation layer is located on a side of the second light-emitting layer away from the driving substrate, and the second encapsulation layer extends above the pixel defining layer; preferably, in a direction perpendicular to the driving substrate, the thickness of the second light-emitting layer ranges from greater than or equal to 8 um to less than or equal to 12 um;
[0025] Preferably, in a direction perpendicular to the driving substrate, a thickness range of the first encapsulation layer and a thickness range of the second encapsulation layer are both greater than or equal to 0.8 um and less than or equal to 1.2 um.
[0026] In a possible embodiment of the present application, the display panel further includes a color filter layer;
[0027] The color filter layer is located at the pixel opening position and is located on a side of the second encapsulation layer away from the driving substrate;
[0028] The color filter layer comprises a plurality of filter parts, the filter parts are located in the pixel opening and are arranged on a side of the second light-emitting layer away from the driving substrate, and the color of the filter parts is the same as the color of the second light-emitting layer or the first light-emitting layer located below the filter parts;
[0029] Preferably, the filter section includes a first filter section, a second filter section and a third filter section, the first filter section is located above the transparent adhesive layer, the color of the first filter section is the same as the color of the first light-emitting layer, the color of the second filter section is the same as the color of the second light-emitting layer located below the second filter section, and the color of the third filter section is the same as the color of the second light-emitting layer located below the third filter section;
[0030] Preferably, in a direction perpendicular to the driving substrate, a thickness range of the first filter portion, a thickness range of the second filter portion, and a thickness range of the third filter portion are all greater than or equal to 1.5 um and less than or equal to 2.5 um.
[0031] In a possible embodiment of the present application, the display panel further includes a third encapsulation layer;
[0032] The third encapsulation layer is located at a side of the pixel device layer away from the driving substrate, and is used to encapsulate the pixel device layer;
[0033] The third encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer, wherein the first inorganic encapsulation layer is located on a side of the pixel device layer away from the driving substrate, the organic encapsulation layer is located on a side of the first inorganic encapsulation layer away from the driving substrate, and the second inorganic encapsulation layer is located on a side of the organic encapsulation layer away from the driving substrate;
[0034] Preferably, in a direction perpendicular to the driving substrate, a thickness range of the first inorganic encapsulation layer and a thickness range of the second inorganic encapsulation layer are both greater than or equal to 0.8 um and less than or equal to 1.2 um;
[0035] Preferably, in a direction perpendicular to the driving substrate, the thickness of the organic encapsulation layer ranges from greater than or equal to 8 um to less than or equal to 12 um;
[0036] Preferably, the color filter layer is located on a side of the third encapsulation layer away from the driving substrate, the color filter layer includes a filtering portion and a light absorbing portion, the filtering portion is located above the light emitting unit, the orthographic projection of the filtering portion on the driving substrate covers the orthographic projection of the light emitting unit on the driving substrate, and the orthographic projection of the light absorbing portion on the driving substrate overlaps with the orthographic projection of the pixel defining layer on the driving substrate.
[0037] Preferably, the first light-emitting layer further includes a third sub-light-emitting layer, the third sub-light-emitting layer is located on the pixel defining layer, and the first encapsulation layer covers the first sub-light-emitting layer, the second sub-light-emitting layer and the third sub-light-emitting layer.
[0038] In a possible embodiment of the present application, the material of the pixel defining layer includes a light absorbing material;
[0039] Preferably, the material of the pixel defining layer is black organic glue;
[0040] Preferably, in a direction perpendicular to the driving substrate, the thickness of the pixel defining layer is 10 um to 15 um.
[0041] In a possible embodiment of the present application, the conductive reflection unit includes a metal reflection layer;
[0042] The material of the metal reflective layer includes at least one of aluminum, titanium, molybdenum, silver and a transparent metal oxide-silver combination;
[0043] Preferably, the surface of the metal reflective layer on a side facing away from the pixel defining layer is uneven;
[0044] Preferably, the metal reflective layer and the first electrode are made of the same material.
[0045] A second aspect of the present application provides a method for manufacturing a display panel, the method comprising:
[0046] Providing a driving substrate, wherein the driving substrate comprises a plurality of first electrodes;
[0047] Manufacturing a pixel device layer on the driving substrate, wherein the pixel device layer includes a pixel defining layer, a light emitting unit and a conductive reflecting unit;
[0048] The step of manufacturing a pixel device layer on the driving substrate comprises:
[0049] A plurality of pixel openings are formed on the pixel defining layer, wherein the pixel openings expose the first electrode;
[0050] forming the conductive reflection unit electrically connected to the first electrode on the side wall of the pixel opening;
[0051] The light emitting unit is formed in the pixel opening and is located on a side of the first electrode away from the driving substrate.
[0052] In a possible embodiment of the present application, the light-emitting unit includes a first light-emitting layer and a second light-emitting layer located on a side of the first light-emitting layer away from the driving substrate;
[0053] The display panel further includes a second electrode layer, a first encapsulation layer and a second encapsulation layer;
[0054] The step of forming the light emitting unit located at a side of the first electrode away from the driving substrate in the pixel opening comprises:
[0055] forming a first light emitting layer in the pixel opening covering the first electrode and the conductive reflecting unit;
[0056] forming the second electrode layer on the surface of the first light-emitting layer;
[0057] forming the first encapsulation layer on the surface of the second electrode layer;
[0058] forming a second light emitting layer in the pixel opening and located on the first encapsulation layer;
[0059] The second encapsulation layer is formed on the surface of the second light-emitting layer.
[0060] According to a third aspect of the present application, a display device is provided, wherein the display device comprises a display panel in any possible embodiment of the first aspect.
[0061] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. In the display panel, a conductive reflective unit is distributed on the side wall of the pixel opening formed by the pixel defining layer and is electrically connected to the first electrode. On the one hand, when the display panel is displayed, the light-emitting unit located on the conductive reflective unit and the first electrode can emit light, so that the light-emitting area can be increased; on the other hand, the light emitted by the light-emitting unit can be reflected by the conductive reflective unit and then emitted from the light-emitting side of the display panel, thereby increasing the light-emitting rate of the display panel. Based on the above two factors, the driving voltage provided to the first electrode can be reduced under the premise of the same light-emitting brightness, thereby achieving the purpose of reducing the power consumption of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS
[0062] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0063] Figure 1 This is a schematic diagram of a partial film layer structure of a display panel provided in this embodiment;
[0064] Figure 2 The second schematic diagram of a partial film layer structure of a display panel provided in this embodiment;
[0065] Figure 3 The third schematic diagram of a partial film layer structure of a display panel provided in this embodiment;
[0066] Figure 4 The fourth schematic diagram of a partial film layer structure of a display panel provided in this embodiment;
[0067] Figure 5 A fifth schematic diagram of a partial film layer structure of a display panel provided in this embodiment;
[0068] Figure 6 One of the flowcharts of the method for manufacturing a display panel provided in this embodiment;
[0069] Figure 7 for Figure 6 The corresponding process diagram;
[0070] Figure 8 A second schematic flow chart of the method for manufacturing a display panel provided in this embodiment;
[0071] Fig. 9 for Figure 8 The corresponding process diagram;
[0072] Fig.10 A third flow chart of the method for manufacturing a display panel provided in this embodiment;
[0073] Fig.11 for Fig.10 Corresponding process flow chart.
[0074] Icons: 10-display panel; 110-driving substrate; 120-pixel device layer; 1201-first electrode; 1202-pixel defining layer; 1203-light-emitting unit; 1204-conductive reflective unit; 1205-pixel opening; 12051-first pixel opening; 12052-second pixel opening; 12053-third pixel opening; 1206-second electrode layer; 12071-transparent adhesive layer; 12071-first quantity Quantum dot material layer; 12072-second quantum dot material layer; 1208-first encapsulation layer; 1209-second encapsulation layer; 130-color filter layer; 1301-filtering part; 13011-first filter part; 13012-second filter part; 13013-third filter part; 1302-light absorption part; 140-third encapsulation layer; 1401-first inorganic encapsulation layer, 1402-organic encapsulation layer; 1403-second inorganic encapsulation layer. DETAILED DESCRIPTION
[0075] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0076] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0077] In the related art, the production of OLED display panels usually adopts vacuum evaporation to evaporate the organic light-emitting material layer. Specifically, the organic light-emitting material is heated in a vacuum chamber, and the substrate to be evaporated is shielded by a high-precision metal mask (Fine Metal Mask, referred to as FMM), and the organic light-emitting materials of corresponding colors are deposited in the pixel openings corresponding to the sub-pixels of different colors (for example, red sub-pixels, green sub-pixels and blue sub-pixels).
[0078] However, as the size of display panels continues to increase, the size of the required high-precision metal mask also continues to increase. As the size of the high-precision metal mask increases, there will inevitably be a problem of mask deformation, which will cause the opening of the high-precision metal mask and the position to be evaporated to be misaligned, and the luminescent material cannot be accurately evaporated at the position to be evaporated, which will eventually cause color mixing and reduce the display yield.
[0079] In order to solve the color mixing problem caused by the evaporation process of large-size display panels, a solution for making an organic light-emitting material layer by inkjet printing is provided in the related art, such as Q-LED and QD-OLED solutions. Taking the QD-OLED solution as an example, in the QD-OLED solution, the light emitted by the sub-pixel will be emitted in all directions, and only the light emitted toward the light-emitting side of the display panel will be observed, and the light emitted in other directions will be dissipated inside the display panel, which will result in a lower luminous efficiency of the display panel and a higher power consumption to achieve the required luminous brightness.
[0080] In order to solve the above problems, the inventor innovatively designed the following technical solution, and the specific implementation scheme of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the above solutions in the prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed in this embodiment below for the above problems should all be the contributions made by the inventor to the present application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.
[0081] Please refer to Figure 1 , Figure 1 A possible film layer structure schematic diagram of the display panel provided in this embodiment is illustrated. In this embodiment, the display panel 10 includes a driving substrate 110 and a pixel device layer 120, the pixel device layer 120 is located on the driving substrate 110, and a pixel circuit for driving sub-pixels in the pixel device layer 120 is formed in the driving substrate 110.
[0082] The driving substrate 110 includes a plurality of first electrodes 1201 , the pixel device layer 120 includes a pixel defining layer 1202 , a light emitting unit 1203 and a conductive reflecting unit 1204 , and the plurality of first electrodes 1201 may be distributed in an array on the driving substrate 110 .
[0083] The pixel defining layer 1202 may define a pixel opening 1205 on the first electrode 1201 . The conductive reflective unit 1204 is located on the pixel defining layer 1202 to form a sidewall of the pixel opening 1205 . The conductive reflective unit 1204 is electrically connected to the first electrode 1201 .
[0084] The light emitting unit 1203 is located in the pixel opening 1205 and is located on a side of the first electrode 1201 away from the driving substrate 110 .
[0085] In the above design, the conductive reflective unit 1204 is distributed on the side wall of the pixel opening 1205 formed by the pixel defining layer 1202 and is electrically connected to the first electrode 1201, and the light emitting unit 1203 is located on the side of the conductive reflective unit 1204 away from the pixel opening 1205, and on the side of the first electrode 1301 away from the driving substrate 110. On the one hand, when the display panel is displayed, the light emitting unit 1203 located on the conductive reflective unit 1204 and the first electrode 1201 can both be used as a light emitting surface, so that the light emitting area can be increased; on the other hand, the light emitted by the light emitting unit 1203 can be reflected by the conductive reflective unit 1204 and then emitted from the light emitting side of the display panel 10, thereby increasing the light emission rate of the display panel 10. Based on the above two factors, the driving voltage provided to the first electrode can be reduced under the premise of the same light emitting brightness, thereby achieving the purpose of reducing the power consumption of the display panel 10.
[0086] For further information, please refer to Figure 2 In this embodiment, the light-emitting unit 1203 includes a first light-emitting layer 12031 and a second light-emitting layer 12032, wherein the second light-emitting layer 12032 is located on a side of the first light-emitting layer 12031 away from the driving substrate 110. The first light-emitting layer 12031 includes a first sub-light-emitting layer 120311 and a second sub-light-emitting layer 120312, wherein the first sub-light-emitting layer 120311 is located at the bottom wall of the pixel opening 1205 and covers the first electrode 1201, and the second sub-light-emitting layer is located at the side wall of the pixel opening 1205 and covers the conductive reflective unit 1204. In this embodiment, the first light-emitting layer 12031 includes an organic light-emitting material layer, and the second light-emitting layer 12032 includes a quantum dot light-emitting material layer, wherein the second light-emitting layer 12032 may also include other film layers, and illustratively, the second light-emitting layer 12032 may include one of a transparent glue layer 12071, a first quantum dot material layer 12072, and a second quantum dot material layer 12073.
[0087] In this embodiment, the pixel opening 1205 includes a first pixel opening 12051, a second pixel opening 12052, and a third pixel opening 12053 for forming different color light-emitting pixels. The transparent adhesive layer 12071 is located in the first pixel opening 12051 and is located on the side of the first light-emitting layer 12031 away from the driving substrate 110; the first quantum dot material layer 12072 is located in the second pixel opening 12052 and is located on the side of the first light-emitting layer 12031 away from the driving substrate 110; the second quantum dot material layer 12073 is located in the third pixel opening 12053 and is located on the side of the first light-emitting layer 12031 away from the driving substrate 110. The first quantum dot material layer 12072 and the second quantum dot material layer 12073 emit light under the irradiation of the light emitted by the first light-emitting layer 12031.
[0088] Through the above design, the light generated by the sub-pixel formed by the first pixel opening 12051 is the same as the light emitted by the first light-emitting layer 12031, the light generated by the sub-pixel formed by the second pixel opening 12052 is the same as the light emitted by the first quantum dot material layer 12072, and the light generated by the sub-pixel formed by the third pixel opening 12053 is the same as the light emitted by the second quantum dot material layer 12073.
[0089] Exemplarily, in this embodiment, the first light-emitting layer 12031 is a blue light organic light-emitting material layer, the first quantum dot material layer 12072 is a green light quantum dot material layer, and the second quantum dot material layer 12073 is a red light quantum dot material layer. The sub-pixel formed by the first pixel opening 12051 generates blue light, the sub-pixel formed by the second pixel opening 12052 generates green light, and the sub-pixel formed by the third pixel opening 12053 generates red light. It can be understood that the above is only an example provided by this embodiment. In other implementations of this embodiment, the first light-emitting layer 12031 can also be a blue-green organic light-emitting material layer, that is, the first light-emitting layer 12031 is composed of a stacked blue light organic light-emitting material layer and a green light organic light-emitting material layer.
[0090] In this embodiment, the thickness of the first light emitting layer 12031 ranges from greater than or equal to 300 nm to less than or equal to 700 nm in a direction perpendicular to the driving substrate 110. For example, the thickness of the first light emitting layer 12031 includes 300 nm, 305 nm, 320 nm, 370 nm, 450 nm, 500 nm, 550 nm, 580 nm, 610 nm, 632 nm, 650 nm, 685 nm, and 700 nm.
[0091] Further, please refer again to Figure 2In the present embodiment, the display panel 10 further includes a second electrode layer 1206, the second electrode layer 1206 covers the first light-emitting layer 12031, the second electrode layer 1206 forms the cathode of the sub-pixel device, when the cathode of the sub-pixel device is an independent cathode, the second electrode layer 1206 can only cover the first light-emitting layer 12031 located at the bottom wall and the side wall of the pixel opening 1205; when the cathode of the sub-pixel device is a whole-surface cathode, the second electrode layer 1206 also covers the pixel defining layer 1202, and the second electrode layer 1206 is vapor-deposited on the surface of the pixel defining layer 1202.
[0092] For further information, please refer to Figure 3 , the display panel 10 further includes a first encapsulation layer 1208 and a second encapsulation layer 1209. The first encapsulation layer 1208 is located on the side of the second light-emitting layer 12032 close to the driving substrate 110, and the first encapsulation layer 1208 covers the second electrode layer 1206. In detail, in the first pixel opening 12051, the first encapsulation layer 1208 is at least located between the second electrode layer 1206 and the transparent adhesive layer 12071; in the second pixel opening 12052, the first encapsulation layer 1208 is at least located between the second electrode layer 1206 and the first quantum dot material layer 12072; in the third pixel opening 12053, the first encapsulation layer 1208 is at least located between the second electrode layer 1206 and the second quantum dot material layer 12073, and the first encapsulation layer 1208 is used to encapsulate the first light-emitting layer 12031 and the second electrode layer 1206 to prevent the material of the first light-emitting layer 1203 from being disturbed by the outside world.
[0093] The second encapsulation layer 1209 is located on a side of the second light emitting layer 12032 away from the driving substrate 110 , and the second encapsulation layer 1209 extends to above the pixel defining layer 1202 . The second encapsulation layer 1209 is used to encapsulate the second light emitting layer 12032 .
[0094] In this embodiment, in the direction perpendicular to the driving substrate 110, the thickness of the second light emitting layer 12032 ranges from greater than or equal to 8um to less than or equal to 12um. For example, the thickness of the second light emitting layer 12032 includes 8um, 8.2um, 8.7um, 9.3um, 9.6um, 9.8um, 10.4um, 10.7um, 10.9um, 11.2um, 11.3um, 11.7um and 12um.
[0095] In this embodiment, in the direction perpendicular to the driving substrate 110, the thickness range of the first encapsulation layer 1208 and the thickness range of the second encapsulation layer 1209 are both greater than or equal to 0.8um and less than or equal to 1.2um. Exemplarily, the thickness of the first encapsulation layer 1208 and the thickness of the second encapsulation layer 1209 include 0.8um, 0.81um, 0.85um, 0.88um, 0.91um, 0.95um, 0.98um, 1.02um, 1.05um, 1.09um, 1.1um, 1.11um, 1.13um, 1.15um and 1.2um, etc.
[0096] Please refer to Figure 4 In a possible implementation manner of this embodiment, the display panel 10 further includes a color filter layer, and the color filter layer is located at a side of the second encapsulation layer 1209 away from the driving substrate 110 .
[0097] In this embodiment, the color filter layer includes multiple filter parts 1301, the filter part 1301 is located in the pixel opening 1205, and is arranged on the side of the second light-emitting layer 12032 away from the driving substrate 110. The color of the filter part 1301 is the same as the light-emitting color of the second light-emitting layer 12032 or the first light-emitting layer 12031 located below the filter part 1301.
[0098] Exemplarily, the filter section 1301 includes a first filter section 13011, a second filter section 13012, and a third filter section 13013. The first filter section 13011 is located above the transparent adhesive layer 12071, the color of the first filter section 13011 is the same as the color of the first light-emitting layer 12031, the color of the second filter section 13012 is the same as the color of the second light-emitting layer 12032 (first quantum dot material layer 12072) located below the second filter section 13012, and the color of the third filter section 13013 is the same as the color of the second light-emitting layer 12032 (second quantum dot material layer 12073) located below the third filter section 13013. The above design can make the light color of each pixel opening unique, ensuring the display effect of the display panel 10.
[0099] Exemplarily, when the first light-emitting layer 12031 is a blue light organic light-emitting material layer, the first filter unit 13011 is a blue light filter unit; when the first quantum dot material layer 12072 is a green light quantum dot material layer, the second filter unit 13012 is a green light filter unit; when the second quantum dot material layer 12073 is a red light quantum dot material layer, the third filter unit 13013 is a red light filter unit.
[0100] In this embodiment, in the direction perpendicular to the driving substrate 110, the thickness range of the first filter part 13011, the thickness range of the second filter part 13012 and the thickness range of the third filter part 13013 are all greater than or equal to 1.5um to less than or equal to 2.5um. Exemplarily, the thickness of the first filter part 13011, the thickness of the second filter part 13012 and the thickness of the third filter part 13013 all include 1.5um, 1.52um, 1.61um, 1.68um, 1.75um, 1.82um, 1.89um, 1.92um, 2.05um, 2.12um, 2.18um, 2.25um, 2.34um, 2.45um and 2.5um, etc.
[0101] Further, in another possible implementation of this embodiment, please refer to Figure 5 The display panel 10 further includes a third encapsulation layer 140 . The third encapsulation layer 140 is located on a side of the pixel device layer 120 away from the driving substrate 110 , and is used to encapsulate the pixel device layer 120 .
[0102] The third encapsulation layer 140 includes a first inorganic encapsulation layer 1401, an organic encapsulation layer 1402 and a second inorganic encapsulation layer 1403. The first inorganic encapsulation layer 1401 is located on a side of the pixel device layer 120 away from the driving substrate 110, the organic encapsulation layer 1402 is located on a side of the first inorganic encapsulation layer 1401 away from the driving substrate 110, and the second inorganic encapsulation layer 1403 is located on a side of the organic encapsulation layer 1402 away from the driving substrate 110.
[0103] In a direction perpendicular to the driving substrate 110, the thickness range of the first inorganic encapsulation layer 1401 and the thickness range of the second inorganic encapsulation layer 1402 are both greater than or equal to 0.8um and less than or equal to 1.2um. Exemplarily, the thickness of the first inorganic encapsulation layer 1401 and the thickness of the second inorganic encapsulation layer 1402 include 0.8um, 0.83um, 0.86um, 0.88um, 0.94um, 0.95um, 0.98um, 1.02um, 1.06um, 1.09um, 1.1um, 1.12um, 1.14um, 1.18um and 1.2um, etc.
[0104] In a direction perpendicular to the driving substrate 110, the thickness of the organic encapsulation layer 1402 ranges from greater than or equal to 8um to less than or equal to 12um. For example, the thickness of the organic encapsulation layer 1402 includes 8um, 8.1um, 8.6um, 9.5um, 9.6um, 9.9um, 10.3um, 10.7um, 10.9um, 11.1um, 11.3um, 11.8um and 12um.
[0105] Furthermore, the color filter layer 130 may be located on a side of the third encapsulation layer 140 away from the driving substrate 110, and the color filter layer 130 includes a filter portion 1301 and a light absorbing portion 1302, the filter portion 1301 is located above the light-emitting unit, and the orthographic projection of the filter portion 1301 on the driving substrate 110 covers the orthographic projection of the light-emitting unit 1203 on the driving substrate 110, the light absorbing portion 1302 is located on the pixel defining layer 1202, and the orthographic projection of the light absorbing portion 1302 on the driving substrate 110 at least partially overlaps with the orthographic projection of the pixel defining layer 1202 on the driving substrate 110, the light absorbing portion 1302 may be made of a light absorbing material, and the setting of the light absorbing portion 1302 effectively absorbs the interference of ambient light on the light-emitting unit, thereby improving the light output efficiency.
[0106] Furthermore, in this embodiment, the first light-emitting layer 12031 also includes a third sub-light-emitting layer 120313, and the third sub-light-emitting layer 12033 is located on the side of the pixel defining layer 1202 away from the driving substrate, and the first encapsulation layer 1208 covers the first sub-light-emitting layer 120311, the second sub-light-emitting layer 120312 and the third sub-light-emitting layer 120313.
[0107] Furthermore, in this embodiment, the material of the pixel defining layer 1202 includes a light absorbing material. Preferably, the material of the pixel defining layer 1202 is a black organic glue.
[0108] In the direction perpendicular to the driving substrate 110, the thickness of the pixel defining layer 1202 ranges from greater than or equal to 10um to less than or equal to 15um. By way of example, the thickness of the pixel defining layer 1202 includes 10um, 10.5um, 11.2um, 11.6um, 12.5um, 12.8um, 13.1um, 13.6um, 13.9um, 14.1um, 14.3um, 14.6um, 14.8um and 15um, etc.
[0109] With such a configuration, the pixel defining layer 1202 is not only used to define the pixel opening, but also acts as a printing dam when printing the quantum dot material layer, which can reduce the panel process and reduce production costs. In addition, the pixel defining layer 1202 uses a black organic glue process to avoid the problem of light crosstalk between adjacent sub-pixels when the quantum dot material layer is excited to emit light, which is beneficial to improving the color gamut of the display panel.
[0110] Furthermore, the conductive reflective unit 1204 includes a metal reflective layer, and the material of the metal reflective layer includes at least one of aluminum, titanium, molybdenum, silver and a transparent metal oxide-silver combination.
[0111] In order to improve the reflection effect, in this embodiment, the surface of the metal reflection layer on the side away from the pixel defining layer is uneven.
[0112] Preferably, the metal reflective layer and the first electrode 1201 have the same material. Such a design can reduce the connection resistance between the metal reflective layer and the first electrode 1201, facilitate the metal reflective layer and the first electrode 1201 to form an equipotential surface, reduce power consumption and facilitate the increase of the light-emitting surface.
[0113] Based on the same inventive concept, the present application also provides a method for manufacturing a display panel, which is used to manufacture the display panel described above. Figure 6 and Figure 7 , Figure 6 The flowchart of the method for manufacturing a display panel provided in this embodiment is illustrated. Figure 7 The process flow diagram provided in this embodiment is illustrated below. Figure 6 and Figure 7 The manufacturing method of the display panel provided in this embodiment is described in detail.
[0114] Step S11 , providing a driving substrate 110 .
[0115] The driving substrate 110 includes a plurality of first electrodes 1201 .
[0116] Step S12 , manufacturing a pixel device layer 120 on the driving substrate 110 .
[0117] In this embodiment, the pixel device layer 1201 includes a pixel defining layer 1202, a light emitting unit 1203 and a conductive reflecting unit 1204;
[0118] A plurality of pixel openings 1205 are provided on the pixel defining layer 1202, the pixel openings 1205 expose the first electrode 1201, the conductive reflective unit 1204 is located on the side wall of the pixel opening 1205 and is electrically connected to the first electrode 1201, the light-emitting unit 1203 is located in the pixel opening 1205, and the light-emitting unit 1203 is located on the side of the first electrode 1201 away from the driving substrate 110.
[0119] In this embodiment, please refer to Figure 8 and Fig. 9 , step S12 can be implemented by the following steps.
[0120] Step S121 , manufacturing a pixel defining layer 1202 on the driving substrate 110 , and providing a plurality of pixel openings 1205 on the pixel defining layer 1202 , wherein the pixel openings 1205 expose the first electrodes 1201 .
[0121] Step S122 , forming a conductive reflection unit 1204 electrically connected to the first electrode 1201 on the side of the pixel definition layer 1202 where the pixel opening 1205 is formed.
[0122] In step S123 , a light emitting unit 1203 is formed in the pixel opening 1205 and is located on a side of the first electrode 1201 away from the driving substrate 110 .
[0123] In detail, the light emitting unit 1203 includes a first light emitting layer 12031 and a second light emitting layer 12032 located on a side of the first light emitting layer 12031 away from the driving substrate 110;
[0124] The display panel further includes a second electrode layer 1206 , a first encapsulation layer 1208 and a second encapsulation layer 1209 .
[0125] Step 123 can be implemented by the following steps:
[0126] Step 1231 , manufacturing a first light emitting layer 12031 on the surface of the first electrode 1201 and the conductive reflective unit 1204 .
[0127] In step S1232 , a second electrode layer 1206 is formed on a surface of the first light emitting layer 12031 which is away from the driving substrate 110 .
[0128] Step S1233 , forming a first encapsulation layer 1208 on a surface of the second electrode layer 1206 that is away from the driving substrate 110 . The first encapsulation layer 1208 may be formed by chemical vapor deposition.
[0129] Step S1234 , forming a second light emitting layer 12032 on a surface of the first packaging layer 1208 in the pixel opening away from the driving substrate 110 .
[0130] Step S1235 , forming a second encapsulation layer 1209 on the surface of the second light-emitting layer 12032 .
[0131] In this embodiment, the second light-emitting layer 12032 includes a transparent glue layer 12071, a first quantum dot material layer 12072 and a second quantum dot material layer 12073, and the pixel opening 1205 includes a first pixel opening 12051, a second pixel opening 12052 and a third pixel opening 12053 for forming light-emitting pixels of different colors. In this embodiment, step S1234 and step S1235 can be implemented in the following manner:
[0132] A transparent adhesive layer 12071 is manufactured in the first pixel opening 12051 .
[0133] Next, a first quantum dot material layer 12072 is fabricated in the second pixel opening 12052 .
[0134] Then, a second quantum dot material layer 12073 is fabricated in the third pixel opening 12053 .
[0135] Among them, the transparent adhesive layer 12071, the first quantum dot material layer 12072 and the second quantum dot material layer 12073 can be manufactured by inkjet printing, and the manufacturing order of the three can be swapped.
[0136] Finally, a second encapsulation layer 1209 is formed at least on one side of the transparent adhesive layer 12071, the first quantum dot material layer 12072, and the second quantum dot material layer 12073 away from the driving substrate 110. The second encapsulation layer 1209 covers the transparent adhesive layer 12071, the first quantum dot material layer 12072, and the second quantum dot material layer 12073; or the second encapsulation layer 1209 covers the first quantum dot material layer 12072 and the second quantum dot material layer 12073.
[0137] The second encapsulation layer 1209 can be manufactured by chemical vapor deposition.
[0138] Step S1234 and step S1235 may also be implemented in the following manner:
[0139] A transparent adhesive layer 12071 is formed in the first pixel opening 12051;
[0140] Next, a first quantum dot material layer 12072 is formed in the second pixel opening 12052 , and a second encapsulation layer 1209 is formed on the first quantum dot material layer 12072 . The second encapsulation layer 1209 covers the first quantum dot material layer 12072 and extends to a side of the pixel defining layer 1202 away from the driving substrate.
[0141] Then, a second quantum dot material layer 12073 is formed in the third pixel opening 12053, and a second encapsulation layer 1209 is formed on the second quantum dot material layer 12073, the second encapsulation layer 1209 covers the second quantum dot material layer 12073 and extends to a side of the pixel defining layer 1202 away from the driving substrate;
[0142] Among them, the transparent adhesive layer 12071, the first quantum dot material layer 12072 and the second quantum dot material layer 12073 can be manufactured by inkjet printing, and the manufacturing order of the three can be swapped.
[0143] In this embodiment, please refer to Fig.10 and Fig.11 The method for manufacturing the display panel provided in this embodiment further includes:
[0144] Step S13, forming a color filter layer 130 at the pixel opening position.
[0145] In this embodiment, the color filter layer 130 includes a first filter portion 13011, a second filter portion 13012 and a third filter portion 13013. The first filter portion 13011 allows light from the light-emitting unit 12032 to pass through, the second filter portion 13012 allows light from the first quantum dot material layer 12072 to pass through, and the third filter portion 13013 allows light from the second quantum dot material layer 12073 to pass through.
[0146] In this step, the first filter 13011 is made at the position of the first pixel opening 12051, the second filter 13012 is made at the position of the second pixel opening 12052, and the third filter 13013 is made at the position of the third pixel opening 12053. Exemplarily, the first filter 13011, the second filter 13012 and the third filter 13013 can be made by photolithography or printing.
[0147] Step S14, manufacturing a third encapsulation layer 140 on the pixel device layer.
[0148] In this step, the third encapsulation layer 140 may include a first inorganic encapsulation layer 1401, an organic encapsulation layer 1402 and a third inorganic encapsulation layer 1403. The first inorganic encapsulation layer 1401, the organic encapsulation layer 1402 and the third inorganic encapsulation layer 1403 may be sequentially fabricated on the pixel device layer, wherein the first inorganic encapsulation layer 1401 and the third inorganic encapsulation layer 1403 may be fabricated by chemical vapor deposition, and the organic encapsulation layer 1402 may be fabricated by inkjet printing.
[0149] Based on the same inventive concept, an embodiment of the present application also provides a display device, which may include the display panel described above. The above-mentioned display panel can reduce power consumption while ensuring display brightness, which is beneficial to improving the battery life of the display device, improving user experience, and increasing product market competitiveness.
[0150] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. In the display panel, a conductive reflective unit is distributed on the side wall of the pixel opening formed by the pixel defining layer and is electrically connected to the first electrode. On the one hand, when the display panel is displayed, the light-emitting unit located on the conductive reflective unit and the first electrode can emit light, so that the light-emitting area can be increased; on the other hand, the light emitted by the light-emitting unit can be reflected by the conductive reflective unit and then emitted from the light-emitting side of the display panel, thereby increasing the light-emitting rate of the display panel. Based on the above two factors, the driving voltage provided to the first electrode can be reduced under the premise of the same light-emitting brightness, thereby achieving the purpose of reducing the power consumption of the display panel.
[0151] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A display panel, characterized in that: The display panel comprises: A driving substrate comprising a plurality of first electrodes; A pixel device layer, wherein the pixel device layer is located on the driving substrate; The pixel device layer includes a pixel defining layer, a light-emitting unit and a conductive reflecting unit; a plurality of pixel openings are opened on the pixel defining layer, the pixel openings expose the first electrode, the conductive reflecting unit is located on the side wall of the pixel opening and is electrically connected to the first electrode, the light-emitting unit is located in the pixel opening, and the light-emitting unit is located on a side of the first electrode away from the driving substrate.
2. The display panel according to claim 1, wherein: The light-emitting unit comprises a first light-emitting layer and a second light-emitting layer located on a side of the first light-emitting layer away from the driving substrate; The first light-emitting layer includes a first sub-light-emitting layer located at the bottom wall of the pixel opening and a second sub-light-emitting layer located at the side wall of the pixel opening; The first light-emitting layer comprises an organic light-emitting material layer; The second light-emitting layer includes a quantum dot light-emitting material layer; Preferably, the second light-emitting layer includes one of a transparent adhesive layer, a first quantum dot material layer and a second quantum dot material layer; Preferably, the pixel opening includes a first pixel opening, a second pixel opening and a third pixel opening; The transparent adhesive layer is located in the first pixel opening and on a side of the first light emitting layer away from the driving substrate; The first quantum dot material layer is located in the second pixel opening and on a side of the first light-emitting layer away from the driving substrate; The second quantum dot material layer is located in the third pixel opening and on a side of the first light emitting layer away from the driving substrate; Preferably, the first light-emitting layer is a blue light organic light-emitting material layer, the first quantum dot material layer is a green light quantum dot material layer, and the second quantum dot material layer is a red light quantum dot material layer; Preferably, in a direction perpendicular to the driving substrate, the thickness of the first light-emitting layer ranges from greater than or equal to 300 nm to less than or equal to 700 nm.
3. The display panel according to claim 2, wherein: The display panel further includes a second electrode layer, wherein the second electrode layer covers the first light-emitting layer; Preferably, the second electrode layer also covers the pixel defining layer; Preferably, the display panel further includes a first encapsulation layer and a second encapsulation layer; The first encapsulation layer is located on a side of the second light-emitting layer close to the driving substrate, and the first encapsulation layer covers the second electrode layer; The second encapsulation layer is located on a side of the second light-emitting layer away from the driving substrate, and the second encapsulation layer extends above the pixel defining layer; preferably, in a direction perpendicular to the driving substrate, the thickness of the second light-emitting layer ranges from greater than or equal to 8 um to less than or equal to 12 um; Preferably, in a direction perpendicular to the driving substrate, a thickness range of the first encapsulation layer and a thickness range of the second encapsulation layer are both greater than or equal to 0.8 um and less than or equal to 1.2 um.
4. The display panel according to claim 3, wherein: The display panel also includes a color filter layer; The color filter layer is located at the pixel opening position and is located on a side of the second encapsulation layer away from the driving substrate; The color filter layer comprises a plurality of filter parts, the filter parts are located in the pixel opening and are arranged on a side of the second light-emitting layer away from the driving substrate, and the color of the filter parts is the same as the color of the second light-emitting layer or the first light-emitting layer located below the filter parts; Preferably, the filter section includes a first filter section, a second filter section and a third filter section, the first filter section is located above the transparent adhesive layer, the color of the first filter section is the same as the color of the first light-emitting layer, the color of the second filter section is the same as the color of the second light-emitting layer located below the second filter section, and the color of the third filter section is the same as the color of the second light-emitting layer located below the third filter section; Preferably, in a direction perpendicular to the driving substrate, a thickness range of the first filter portion, a thickness range of the second filter portion, and a thickness range of the third filter portion are all greater than or equal to 1.5 um and less than or equal to 2.5 um.
5. The display panel according to claim 4, wherein: The display panel further includes a third encapsulation layer; The third encapsulation layer is located at a side of the pixel device layer away from the driving substrate, and is used to encapsulate the pixel device layer; The third encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer, wherein the first inorganic encapsulation layer is located on a side of the pixel device layer away from the driving substrate, the organic encapsulation layer is located on a side of the first inorganic encapsulation layer away from the driving substrate, and the second inorganic encapsulation layer is located on a side of the organic encapsulation layer away from the driving substrate; Preferably, in a direction perpendicular to the driving substrate, a thickness range of the first inorganic encapsulation layer and a thickness range of the second inorganic encapsulation layer are both greater than or equal to 0.8 um and less than or equal to 1.2 um; Preferably, in a direction perpendicular to the driving substrate, the thickness of the organic encapsulation layer ranges from greater than or equal to 8 um to less than or equal to 12 um; Preferably, the color filter layer is located on a side of the third encapsulation layer away from the driving substrate, the color filter layer comprises a filter portion and a light absorbing portion, the filter portion is located above the light emitting unit, the orthographic projection of the filter portion on the driving substrate covers the orthographic projection of the light emitting unit on the driving substrate, and the orthographic projection of the light absorbing portion on the driving substrate overlaps with the orthographic projection of the pixel defining layer on the driving substrate; Preferably, the first light-emitting layer further includes a third sub-light-emitting layer, the third sub-light-emitting layer is located on a side of the pixel defining layer away from the driving substrate, and the first encapsulation layer covers the first sub-light-emitting layer, the second sub-light-emitting layer and the third sub-light-emitting layer.
6. The display panel according to any one of claims 1 to 5, characterized in that: The material of the pixel defining layer includes a light absorbing material; Preferably, the material of the pixel defining layer is black organic glue; Preferably, in a direction perpendicular to the driving substrate, the thickness of the pixel defining layer is 10 um to 15 um.
7. The display panel according to any one of claims 1 to 5, characterized in that: The conductive reflective unit comprises a metal reflective layer; The material of the metal reflective layer includes at least one of aluminum, titanium, molybdenum, silver and a transparent metal oxide-silver combination; Preferably, the surface of the metal reflective layer on a side facing away from the pixel defining layer is uneven; Preferably, the metal reflective layer and the first electrode are made of the same material.
8. A method for manufacturing a display panel, characterized in that: The method comprises: Providing a driving substrate, wherein the driving substrate comprises a plurality of first electrodes; Manufacturing a pixel device layer on the driving substrate, wherein the pixel device layer includes a pixel defining layer, a light emitting unit and a conductive reflecting unit; The step of manufacturing a pixel device layer on the driving substrate comprises: A plurality of pixel openings are formed on the pixel defining layer, wherein the pixel openings expose the first electrode; The conductive reflection unit electrically connected to the first electrode is formed on the side wall of the pixel opening; The light emitting unit is formed in the pixel opening and is located on a side of the first electrode away from the driving substrate.
9. The method of claim 8, wherein: The light-emitting unit comprises a first light-emitting layer and a second light-emitting layer located on a side of the first light-emitting layer away from the driving substrate; The display panel further includes a second electrode layer, a first encapsulation layer and a second encapsulation layer; The step of forming the light emitting unit located at a side of the first electrode away from the driving substrate in the pixel opening comprises: Fabricate the first light-emitting layer on the surface of the first electrode and the conductive reflective unit; The second electrode layer is formed on a surface of the first light-emitting layer which is away from the driving substrate; The first encapsulation layer is formed on a surface of the second electrode layer on a side away from the driving substrate; The second light-emitting layer is formed on a surface of the first encapsulation layer in the pixel opening which is away from the driving substrate; The second encapsulation layer is formed on the surface of the second light-emitting layer.
10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 7.
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