Panel bottom member, display device including the same, and method for manufacturing the display device

Abstract

The invention relates to a panel bottom member, a display device including the panel bottom member, and a method for manufacturing the display device. The panel bottom member includes a base layer, a first adhesive layer disposed on the base layer, and a heat dissipation layer disposed in the first adhesive layer. The first adhesive layer includes a light blocking material, a first surface of the first adhesive layer faces the base layer, and an embossed pattern is defined on a second surface of the first adhesive layer opposite the first surface.

Description

Technical Field

[0001] Embodiments relate to a panel bottom member, a display device including the panel bottom member, and a method for manufacturing the display device. Background Art

[0002] A display device is a device that displays an image to provide visual information to a user. Among display devices, an organic light emitting diode display has recently attracted attention.

[0003] The display device may include a display panel and a panel bottom member. The display panel may include a plurality of pixels. Each of the plurality of pixels may emit light. The panel bottom member may perform various functions, such as protecting the display panel from external impact and dissipating heat generated from the display panel. Summary of the invention

[0004] The embodiment provides a panel bottom member having a simplified structure and reduced manufacturing cost.

[0005] An embodiment provides a display device including a panel bottom member.

[0006] An embodiment provides a method for manufacturing a display device.

[0007] According to an embodiment, the panel bottom component includes: a base layer; a first adhesive layer arranged on the base layer, wherein the first adhesive layer includes a light-blocking material, a first surface of the first adhesive layer faces the base layer, and an embossed pattern is defined on a second surface of the first adhesive layer opposite to the first surface; and a heat dissipation layer arranged in the first adhesive layer.

[0008] In an implementation, a plurality of openings may be defined in the heat dissipation layer and the first adhesive layer fills the plurality of openings of the heat dissipation layer.

[0009] In an embodiment, the heat dissipation layer may include graphite.

[0010] In an implementation, the heat dissipation layer may be spaced apart from each of the first surface of the first adhesive layer and the second surface of the first adhesive layer in a cross-sectional view.

[0011] In an implementation, a distance between the heat dissipation layer and the first surface of the first adhesive layer may be smaller than a distance between the heat dissipation layer and the second surface of the first adhesive layer.

[0012] In an embodiment, the light blocking material may include carbon black.

[0013] In an implementation, the content of the light blocking material in the first adhesive layer may be about 1.5 weight percent or more and about 2 weight percent or less.

[0014] In an embodiment, the optical density of the first adhesive layer may be about 3.0 or greater.

[0015] In an embodiment, the base layer may include an acrylic foam material or a urethane foam material.

[0016] In an embodiment, the panel bottom member may further include a metal layer disposed under the base layer and a second adhesive layer disposed between the base layer and the metal layer.

[0017] In an embodiment, the metal layer may include copper.

[0018] A display device according to an embodiment includes a display panel including a plurality of pixels and a panel bottom member disposed under the display panel.

[0019] In this embodiment, the panel bottom component includes a base layer, a first adhesive layer arranged between the base layer and the display panel, and a heat dissipation layer arranged in the first adhesive layer, wherein the first adhesive layer includes a light-blocking material, a first surface of the first adhesive layer faces the base layer, and the embossed pattern is defined on a second surface of the first adhesive layer opposite to the first surface.

[0020] In an embodiment, a plurality of openings may be defined in the heat dissipation layer, the first adhesive layer may fill the plurality of openings of the heat dissipation layer, and the heat dissipation layer may be spaced apart from each of the first surface of the first adhesive layer and the second surface of the first adhesive layer in a cross-sectional view.

[0021] A method for manufacturing a display device includes forming a panel bottom member and attaching the panel bottom member to a lower portion of a display panel.

[0022] In this embodiment, forming the panel bottom member includes forming a heat dissipation layer defining a plurality of openings on a first adhesive resin layer, forming a second adhesive resin layer on the first adhesive resin layer to cover the heat dissipation layer, forming an embossed pattern on an upper surface of the second adhesive resin layer, and forming a base layer under the first adhesive resin layer.

[0023] In an implementation, each of the first adhesive resin layer and the second adhesive resin layer may include a light blocking material.

[0024] In an embodiment, in forming the second adhesive resin layer, the second adhesive resin layer may fill the plurality of openings of the heat dissipation layer.

[0025] In an implementation, the first adhesive resin layer may be formed on the first release film.

[0026] In an embodiment, forming the base layer under the first adhesive resin layer may include attaching the base layer to a lower portion of the first adhesive resin layer after removing the first release film from the first adhesive resin layer.

[0027] In an embodiment, forming the embossed pattern on the upper surface of the second adhesive resin layer may include attaching a second release film including a plurality of protrusions protruding toward the second adhesive resin layer to the second adhesive resin layer.

[0028] In an embodiment, forming the embossed pattern on the upper surface of the second adhesive resin layer may further include aging the second adhesive resin layer to which the second release film is attached for a preset time.

[0029] In an embodiment, forming the embossed pattern on the upper surface of the second adhesive resin layer may further include removing the second release film from the second adhesive resin layer before attaching the panel bottom member to the lower portion of the display panel.

[0030] According to an embodiment, the panel bottom component includes a base layer, a first adhesive layer arranged on the base layer, and a heat dissipation layer arranged in the first adhesive layer, wherein the first adhesive layer includes a light-blocking material, a first surface of the first adhesive layer faces the base layer, and an embossed pattern is defined on a second surface of the first adhesive layer opposite to the first surface.

[0031] Accordingly, the first adhesive layer can reduce the amount of light incident on the lower surface of the display panel. In addition, the first adhesive layer can dissipate heat generated from the display panel. In addition, when the panel bottom member is attached to the lower portion of the display panel, bubbles are not generated. In addition, the structure of the panel bottom member including the first adhesive layer can be simplified, and the manufacturing cost of the panel bottom member can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0033] Figure 1 A plan view for explaining a display device according to an embodiment.

[0034] Figure 2 To explain Figure 1 A cross-sectional view of a stacked structure of a display device.

[0035] Figure 3 To explain the inclusion of Figure 2 A cross-sectional view of a panel bottom member in a display device.

[0036] Figure 4 To explain the inclusion of Figure 3 Cross-sectional view of the first adhesive layer in the panel bottom member.

[0037] Figure 5 To explain Figure 4 A plan view of the first adhesive layer.

[0038] Figure 6 To explain Figure 1 Cross-sectional view of a pixel.

[0039] Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 , Fig.13 and Fig.14 To illustrate the use of manufacturing Figure 2 A cross-sectional view of an embodiment of a method for displaying a device. DETAILED DESCRIPTION

[0040] The present invention will now be described more fully hereinafter with reference to the attached drawings in which various embodiments are shown. However, the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete and will fully convey the scope of the present invention to those skilled in the art. The same reference numerals refer to the same elements throughout.

[0041] It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present.

[0042] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings herein, the first element, component, region, layer or part discussed below may be referred to as a second element, component, region, layer or part.

[0043] The terms used in this article are only used for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, as used in this article, "a", "an", "the" and "at least one" do not represent quantitative limitations and are intended to include both singular and plural forms. Therefore, in the claims, mentioning an element ("an" element) followed by mentioning "the" element ("the" element) includes one element as well as multiple elements. For example, "element" has the same meaning as "at least one element", unless the context clearly indicates otherwise. "At least one" is not interpreted as being limited to "a" or "an". "Or" means "and / or". As used in this article, the term "and / or" includes any and all combinations of one or more related enumerated items. It will be further understood that the terms “comprises” and / or “comprising” or “includes” and / or “including” when used in the present specification, indicate the presence of stated features, regions, integers, steps, operations, elements, components and / or groups thereof, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and / or groups thereof.

[0044] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as illustrated in the figures. It will be understood that relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, the element described as being on the "lower" side of another element will be oriented on the "upper" side of the other element. Therefore, depending on the specific orientation of the figure, the term "lower" can encompass both "lower" and "upper" orientations. Similarly, if the device in one of the figures is turned over, the element described as being "below" or "under" another element will be oriented as being "above" another element. Therefore, the term "below" or "under" can encompass both upper and lower orientations.

[0045] As used herein, "about" or "approximately" includes the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0046] Unless otherwise defined, all terms (including technical and scientific terms) used in this article have the same meaning as those commonly understood by ordinary technicians in the field to which the present disclosure belongs. It will be further understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field and the present disclosure, and will not be interpreted in an ideal or overly formal sense unless explicitly defined as such in this article.

[0047] Embodiments are described herein with reference to schematically illustrated cross-sectional views of ideal embodiments. As such, variations in the illustrated shapes caused by, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the zones as illustrated herein, but should include deviations in shape caused, for example, by manufacturing. For example, a zone illustrated or described as flat may typically have rough and / or nonlinear features. Moreover, the illustrated sharp corners may be rounded. Therefore, the zones illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shape of the zones and are not intended to limit the scope of the claims.

[0048] Hereinafter, a display device according to an embodiment will be described in more detail with reference to the accompanying drawings. In the drawings, the same or similar reference numerals are used for the same or similar components, and any repeated detailed description of the same or similar components will be omitted.

[0049] Figure 1 A plan view for explaining a display device according to an embodiment.

[0050] refer to Figure 1 According to an embodiment, a display device DD may include a display area DA and a non-display area NDA. The display area DA may be defined as an area capable of displaying an image by generating light or adjusting the transmittance of light provided from an external light source. The non-display area NDA may be an area where an image is not displayed. In an embodiment, the non-display area NDA may surround at least a portion of the display area DA.

[0051] A plurality of pixels PX may be disposed in the display area DA. In an embodiment, for example, the pixels PX may be disposed in the display area DA. The plurality of pixels PX may be repeatedly arranged in a first direction DR1 and a second direction DR2 crossing the first direction DR1.

[0052] The driving unit may be disposed in the non-display area NDA. The driving unit may provide a signal or voltage to the plurality of pixels PX. In an embodiment, for example, the driving unit may include a data driving unit or a gate driving unit, etc.

[0053] In the present disclosure, the first direction DR1 and the second direction DR2 crossing the first direction DR1 may be directions defined on a plane displaying an image. In addition, the third direction DR3 perpendicular to the plane formed by the first direction DR1 and the second direction DR2 may be a thickness direction of the display device DD. Throughout the specification, the phrase "in a plan view" means when an object portion is observed from above, and the phrase "in a cross-sectional view" means when a cross section taken by vertically cutting the object portion is observed from the side.

[0054] Figure 2 To explain Figure 1 A cross-sectional view of a stacked structure of a display device. Figure 3 To explain the inclusion of Figure 2 A cross-sectional view of a panel bottom member (or panel bottom unit) in a display device.

[0055] refer to Figure 2 In an embodiment, the display device DD may include a plurality of pixels PX (see Figure 1 ) of the display panel PNL. In an embodiment, for example, the display panel PNL may include pixels (eg, Figure 1 Pixel PX). Multiple pixels PX (see Figure 1 ) can emit light.

[0056] In an embodiment, the display device DD may include a panel bottom member CP disposed under the display panel PNL. The panel bottom member CP may include a first adhesive layer AD1, a base layer FM, a second adhesive layer AD2, and a metal layer MT.

[0057] The base layer FM may be disposed under the display panel PNL. The base layer FM may mitigate impact applied to the lower surface of the display panel PNL. In an embodiment, for example, the base layer FM may include an acrylic foam material or a urethane foam material, etc. These materials may be used alone or in combination with each other.

[0058] The first adhesive layer AD1 may be disposed on the base layer FM. In an embodiment, for example, the first adhesive layer AD1 may be disposed between the display panel PNL and the base layer FM. The first adhesive layer AD1 may provide adhesive force to the lower surface of the display panel PNL.

[0059] The metal layer MT may be disposed under the base layer FM. The metal layer MT may protect the lower surface of the display panel PNL. In addition, the metal layer MT may dissipate heat generated from the display panel PNL. In an embodiment, for example, the metal layer MT may include copper. However, the present disclosure is not limited thereto, and the metal layer MT may include a metal material different from copper.

[0060] The second adhesive layer AD2 may be disposed between the base layer FM and the metal layer MT. The second adhesive layer AD2 may provide adhesive force to the lower surface of the base layer FM. In an embodiment, for example, the second adhesive layer AD2 may include an optically clear adhesive ("OCA"), an optically clear resin ("OCR"), or a pressure-sensitive adhesive ("PSA"), etc. These materials may be used alone or in combination with each other.

[0061] Further references Figure 3 , the first adhesive layer AD1 may include a first surface S1 and a second surface S2. The first surface S1 may face the base layer FM. The second surface S2 may face the display panel PNL. That is, the second surface S2 may be a surface opposite to the first surface S1. In an embodiment, for example, the second surface S2 may be spaced apart from the first surface S1 in the third direction DR3.

[0062] The first adhesive layer AD1 may include an embossed pattern defined on the second surface S2 thereof. In an embodiment, for example, the embossed pattern may protrude toward the display panel PNL. That is, the embossed pattern may protrude in the third direction DR3. Since the first adhesive layer AD1 includes the embossed pattern on the second surface S2, bubbles are not generated when the panel bottom member CP is bonded to the lower portion of the display panel PNL.

[0063] In an embodiment, the first adhesive layer AD1 may include a resin material. The resin material may include acrylic resin, epoxy resin, silicone resin, etc. These materials may be used alone or in combination with each other. However, the present disclosure is not limited thereto, and the first adhesive layer AD1 may include other types of resin materials.

[0064] In an embodiment, the first adhesive layer AD1 may further include a light blocking material. The light blocking material may be uniformly dispersed in the resin material. That is, the light blocking material may be uniformly dispersed in the resin material by a disperser or the like. In an embodiment, for example, the disperser may include a high frequency disperser or the like.

[0065] In an embodiment, the light blocking material may include a black pigment or a black dye, etc. In an embodiment, for example, the light blocking material may include carbon black. Since the first adhesive layer AD1 includes the light blocking material, the first adhesive layer AD1 may have a light blocking property. In an embodiment, for example, the first adhesive layer AD1 may reduce the amount of light incident on the lower surface of the display panel PNL.

[0066] In an embodiment, the content of the light-blocking material in the first adhesive layer AD1 may be about 1.5 weight percent or more and about 2 weight percent or less. When the content of the light-blocking material in the first adhesive layer AD1 is less than about 1.5 weight percent, the light-blocking performance of the first adhesive layer AD1 may be reduced. Accordingly, the first adhesive layer AD1 may not be able to sufficiently reduce the amount of light incident on the lower surface of the display panel PNL. When the content of the light-blocking material in the first adhesive layer AD1 exceeds about 2 weight percent, the first adhesive layer AD1 may not provide sufficient adhesion to the lower surface of the display panel PNL. Accordingly, the panel bottom member CP may not be properly attached to the lower surface of the display panel PNL.

[0067] In an embodiment, the optical density of the first adhesive layer AD1 may be about 3.0 or more. The higher the optical density, the lower the light transmittance. In an embodiment, for example, the optical density of the first adhesive layer AD1 may be determined by the content of the light-blocking material in the first adhesive layer AD1. That is, when the content of the light-blocking material in the first adhesive layer AD1 is about 1.5 weight percent or more, the optical density of the first adhesive layer AD1 may be about 3.0 or more.

[0068] In an embodiment, for example, the thickness of the first adhesive layer AD1 in the third direction DR3 (eg, Figure 4 The thickness W1) may be about 50 micrometers or more and about 70 micrometers or less. In one embodiment, for example, the thickness of the first adhesive layer AD1 may be about 60 micrometers. However, this is only an example, and the thickness of the first adhesive layer AD1 may be variously changed.

[0069] Figure 4 To explain the inclusion of Figure 3 Cross-sectional view of the first adhesive layer in the panel bottom member. Figure 5 To explain Figure 4 Specifically, Figure 4 for Figure 5 FIG. 4 is a cross-sectional view of the first adhesive layer taken along line II′.

[0070] refer to Figure 4 and Figure 5 In an embodiment, the heat dissipation layer RD may be disposed in the first adhesive layer AD1. In a cross-sectional view, the heat dissipation layer RD may be spaced apart from each of the first surface S1 and the second surface S2 of the first adhesive layer AD1. In an embodiment, for example, the heat dissipation layer RD may be spaced apart from the first surface S1 of the first adhesive layer AD1 in the third direction DR3. In addition, the heat dissipation layer RD may be spaced apart from the second surface S2 of the first adhesive layer AD1 in a direction opposite to the third direction DR3.

[0071] In an embodiment, a distance H1 between the heat dissipation layer RD and the first surface S1 of the first adhesive layer AD1 may be smaller than a distance H2 between the heat dissipation layer RD and the second surface S2 of the first adhesive layer AD1. That is, the first surface S1 of the first adhesive layer AD1 may be disposed closer to the heat dissipation layer RD than the second surface S2 of the first adhesive layer AD1.

[0072] The heat dissipation layer RD may include a lower surface facing the first surface S1 of the first adhesive layer AD1 and an upper surface facing the second surface S2 of the first adhesive layer AD1. The distance H1 between the heat dissipation layer RD and the first surface S1 of the first adhesive layer AD1 may be the distance between the lower surface of the heat dissipation layer RD and the first surface S1 of the first adhesive layer AD1. In addition, the distance H2 between the heat dissipation layer RD and the second surface S2 of the first adhesive layer AD1 may be the distance between the upper surface of the heat dissipation layer RD and the highest point of the second surface S2 of the first adhesive layer AD1. Specifically, the distance H2 between the heat dissipation layer RD and the second surface S2 of the first adhesive layer AD1 may be the distance between the upper surface of the heat dissipation layer RD and the most protruding portion of the second surface S2 of the first adhesive layer AD1 in the third direction DR3.

[0073] However, the present disclosure is not limited thereto, and in another embodiment, a distance H1 between the heat dissipation layer RD and the first surface S1 of the first adhesive layer AD1 may be greater than a distance H2 between the heat dissipation layer RD and the second surface S2 of the first adhesive layer AD1. In such an embodiment, the second surface S2 of the first adhesive layer AD1 may be disposed closer to the heat dissipation layer RD than the first surface S1 of the first adhesive layer AD1.

[0074] In an embodiment, the heat dissipation layer RD may define a plurality of openings OP. In an embodiment, for example, each of the plurality of openings OP may be an empty (or removed) portion extending from the upper surface of the heat dissipation layer RD to the lower surface of the heat dissipation layer RD. The plurality of openings OP may be repeatedly disposed in the first direction DR1 and the second direction DR2. The first adhesive layer AD1 may fill the plurality of openings OP.

[0075] In an embodiment, each of the plurality of openings OP may have a circular shape in a plan view or when viewed in the third direction DR3. However, the present disclosure is not limited thereto, and each of the plurality of openings OP may have various shapes in a plan view, such as a polygonal shape or an elliptical shape.

[0076] In an embodiment, each of the plurality of openings OP may have a rectangular shape in a cross-sectional view. However, the present disclosure is not limited thereto, and each of the plurality of openings OP may have various shapes in a cross-sectional view, such as a tapered shape or an inverted tapered shape.

[0077] In an embodiment, for example, the thickness W2 of the heat dissipation layer RD in the third direction DR3 may be about 10 micrometers or more and about 20 micrometers or less. In one embodiment, for example, the thickness W2 of the heat dissipation layer RD may be about 17 micrometers. However, this is only an example and the thickness W2 of the heat dissipation layer RD may be variously changed.

[0078] In an embodiment, the heat dissipation layer RD may include graphite. However, the present disclosure is not limited thereto, and the heat dissipation layer RD may include various materials, such as a metal material (eg, aluminum).

[0079] In an embodiment, since the heat dissipation layer RD is disposed in the first adhesive layer AD1, the first adhesive layer AD1 may dissipate heat from the display panel (eg, Figure 2 The heat generated by the display panel PNL).

[0080] In an embodiment, as described above, the first adhesive layer AD1 may have a light blocking property. In addition, the first adhesive layer AD1 may dissipate heat generated from the display panel. That is, the first adhesive layer AD1 according to an embodiment may have both a light blocking property and a heat dissipation property. Accordingly, in such an embodiment, the panel bottom member (e.g., Figure 3 The panel bottom member CP) has multiple stacked structures with excellent light blocking performance and heat dissipation characteristics. Accordingly, the structure of the panel bottom member can be simplified and the manufacturing cost of the panel bottom member can be reduced.

[0081] However, the present disclosure is not limited thereto, and in another embodiment, the heat dissipation layer RD may be omitted. That is, the heat dissipation layer RD may not be provided in the first adhesive layer AD1.

[0082] Figure 6 To explain Figure 1 Cross-sectional view of a pixel.

[0083] refer to Figure 6 The pixel PX may include (or be defined by) a substrate SUB, a buffer layer BUF, a gate insulating layer GI, an interlayer insulating layer ILD, a through-hole insulating layer VIA, an active layer ACT, a source electrode SE, a gate electrode GE, a drain electrode DE, a pixel electrode PE, a pixel defining layer PDL, a light-emitting layer EML, a common electrode CE and an encapsulation layer TFE.

[0084] The transistor TR may include (or be defined as follows) an active layer ACT, a source electrode SE, a gate electrode GE, and a drain electrode DE.

[0085] The substrate SUB may include a transparent material or an opaque material. The substrate SUB may include a transparent resin substrate or be formed of a transparent resin substrate. Examples of the transparent resin substrate may include a polyimide substrate. In this case, the polyimide substrate may include a first organic layer, a first isolation layer, a second organic layer, and the like.

[0086] Alternatively, the substrate SUB may include a quartz substrate (eg, a synthetic quartz substrate, a fluorine-doped quartz substrate), a calcium fluoride substrate, a soda lime substrate, or an alkali-free glass substrate, etc. These materials may be used alone or in combination with each other.

[0087] The buffer layer BUF may be disposed on the substrate SUB. The buffer layer BUF may prevent metal atoms or impurities from diffusing from the substrate SUB to the transistor TR. In addition, when the surface of the substrate SUB is uneven, the buffer layer BUF may improve the flatness of the surface of the substrate SUB.

[0088] In an implementation, for example, the buffer layer BUF may include an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride, etc. These materials may be used alone or in combination with each other.

[0089] The active layer ACT may be disposed on the buffer layer BUF. The active layer ACT may include an inorganic semiconductor (e.g., amorphous silicon, polycrystalline silicon, metal oxide semiconductor) and an organic semiconductor, etc. These materials may be used alone or in combination with each other. The active layer ACT may include a source region, a drain region, and a channel region disposed between the source region and the drain region.

[0090] The metal oxide semiconductor may include a binary compound (AB) containing indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), or magnesium (Mg). x ), ternary compounds (AB x C y ) and quaternary compounds (AB x C y D z )wait.

[0091] In an embodiment, for example, the metal oxide semiconductor may include zinc oxide (ZnO x ), gallium oxide (GaO x ), tin oxide (SnO x ), indium oxide (InO x ), indium gallium oxide ("IGO"), indium zinc oxide ("IZO"), indium tin oxide ("ITO"), indium zinc tin oxide ("IZTO"), and indium gallium zinc oxide ("IGZO"). These materials may be used alone or in combination with each other.

[0092] The gate insulating layer GI may be disposed on the buffer layer BUF. The gate insulating layer GI may fully cover the active layer ACT and may have a substantially flat upper surface without generating steps around the active layer ACT. Alternatively, the gate insulating layer GI may cover the active layer ACT and may be disposed along the contour of the active layer ACT.

[0093] In an embodiment, for example, the gate insulating layer GI may include an inorganic material such as silicon oxide (SiO x ), Silicon Nitride (SiN x ), Silicon Carbide (SiC x ), silicon oxynitride (SiO x N y ) or silicon oxycarbide (SiO x C y ) etc. These materials may be used alone or in combination with each other.

[0094] The gate electrode GE may be disposed on the gate insulating layer GI. The gate electrode GE may overlap the channel region of the active layer ACT.

[0095] The gate electrode GE may include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. Examples of the metal may include silver (Ag), molybdenum (Mo), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), titanium (Ti), tantalum (Ta), platinum (Pt), or scandium (Sc), etc. These materials may be used alone or in combination with each other.

[0096] Examples of conductive metal oxides may include indium tin oxide or indium zinc oxide, etc. In addition, examples of metal nitrides may include aluminum nitride (AlN x ), tungsten nitride (WN x ) or chromium nitride (CrN x ) etc. These materials may be used alone or in combination with each other.

[0097] The interlayer insulating layer ILD may be disposed on the gate insulating layer GI. The interlayer insulating layer ILD may fully cover the gate electrode GE and may have a substantially flat upper surface without generating steps around the gate electrode GE. Alternatively, the interlayer insulating layer ILD may cover the gate electrode GE and may be disposed along the contour of the gate electrode GE.

[0098] In an implementation, for example, the interlayer insulating layer ILD may include an inorganic material such as silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, silicon oxycarbide, etc. These materials may be used alone or in combination with each other.

[0099] The source electrode SE may be disposed on the interlayer insulating layer ILD. The source electrode SE may be connected to the source region of the active layer ACT through a contact hole defined by the gate insulating layer GI and the interlayer insulating layer ILD.

[0100] The drain electrode DE may be disposed on the interlayer insulating layer ILD. The drain electrode DE may be connected to a drain region of the active layer ACT through a contact hole defined by the gate insulating layer GI and the interlayer insulating layer ILD.

[0101] In an embodiment, for example, the source electrode SE may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These materials may be used alone or in combination with each other. The drain electrode DE may be formed by the same process as that of the source electrode SE and may include the same material as that of the source electrode SE.

[0102] The via insulating layer VIA may be disposed on the interlayer insulating layer ILD. The via insulating layer VIA may fully cover the source electrode SE and the drain electrode DE. The via insulating layer VIA may include an organic material. For example, the via insulating layer VIA may include an organic material such as a phenolic resin, an acrylic resin, a polyimide resin, a polyamide resin, a siloxane resin, or an epoxy resin. These materials may be used alone or in combination with each other.

[0103] The pixel electrode PE may be disposed on the via hole insulating layer VIA. The pixel electrode PE may be connected to the drain electrode DE through a contact hole defined by the via hole insulating layer VIA.

[0104] The pixel electrode PE may include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. These materials may be used alone or in combination with each other. In an embodiment, the pixel electrode PE may have a stacked structure including ITO / Ag / ITO. In an embodiment, for example, the pixel electrode PE may operate as an anode.

[0105] The pixel defining layer PDL may be disposed on the via insulating layer VIA. The pixel defining layer PDL may cover a side portion of the pixel electrode PE. In addition, an opening exposing a portion of an upper surface of the pixel electrode PE may be defined in the pixel defining layer PDL.

[0106] In an embodiment, for example, the pixel defining layer PDL may include an inorganic material or an organic material. In an embodiment, the pixel defining layer PDL may include an organic material, such as an epoxy resin or a silicone resin. These materials may be used alone or in combination with each other. In another embodiment, the pixel defining layer PDL may further include a light blocking material containing a black pigment or a black dye.

[0107] The light emitting layer EML may be disposed on the pixel electrode PE. The light emitting layer EML may include an organic material that emits light of a predetermined color. In an embodiment, for example, the light emitting layer EML may include an organic material that emits red light. However, the present disclosure is not limited thereto, and the light emitting layer EML may emit light of a color different from the color of red light.

[0108] The common electrode CE may be disposed on the light emitting layer EML and the pixel defining layer PDL. The common electrode CE may include metal, alloy, metal nitride, conductive metal oxide or transparent conductive material, etc. These materials may be used alone or in combination with each other. The common electrode CE may operate as a cathode.

[0109] The encapsulation layer TFE may be disposed on the common electrode CE. The encapsulation layer TFE may prevent impurities and moisture from penetrating from the outside into the pixel electrode PE, the light emitting layer EML, and the common electrode CE. The encapsulation layer TFE may include at least one inorganic layer and at least one organic layer.

[0110] In an embodiment, for example, the inorganic layer may include silicon oxide, silicon nitride, silicon oxynitride, etc. These materials may be used alone or in combination with each other. The organic layer may include a polymer cured product such as polyacrylate.

[0111] Although the above reference Figure 6 The embodiments of the pixel PX are described, but the pixel PX is not limited to Figure 6 That is, the pixel PX may include any structure that receives an electrical signal and emits light having a brightness corresponding to the intensity of the electrical signal.

[0112] Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 , Fig.13 and Fig.14 To illustrate the use of manufacturing Figure 2 A cross-sectional view of an embodiment of a method for displaying a device.

[0113] refer to Figure 7 , the first adhesive resin layer RS1 may be provided or formed on the first release film LN1. In an embodiment, for example, the first release film LN1 may include silicon or fluorine. These materials may be used alone or in combination with each other. In an embodiment, for example, the first adhesive resin layer RS1 may include acrylic resin, epoxy resin, or silicone resin, etc. These materials may be used alone or in combination with each other.

[0114] In an embodiment, the first adhesive resin layer RS1 may further include a light blocking material. The light blocking material may be uniformly dispersed in the first adhesive resin layer RS1. The light blocking material may include a black pigment or a black dye, etc. The light blocking material may include carbon black.

[0115] refer to Figure 8 , the heat dissipation layer RD may be provided or formed on the first adhesive resin layer RS1. The heat dissipation layer RD may define a plurality of openings OP or a plurality of openings OP may be formed by the heat dissipation layer RD. In an embodiment, for example, the heat dissipation layer RD may include graphite.

[0116] refer to Fig. 9, the second adhesive resin layer RS2 may be provided or formed on the first adhesive resin layer RS1. The second adhesive resin layer RS2 may be formed to cover the heat dissipation layer RD. In an embodiment, for example, the second adhesive resin layer RS2 may fill the plurality of openings OP. In an embodiment, for example, the second adhesive resin layer RS2 may include acrylic resin, epoxy resin, silicone resin, etc. These materials may be used alone or in combination with each other.

[0117] In an embodiment, the second adhesive resin layer RS2 may further include a light-blocking material. The light-blocking material may be uniformly dispersed in the second adhesive resin layer RS2. The light-blocking material may include a black pigment or a black dye, etc. The light-blocking material may include carbon black.

[0118] The bump RL may be provided or formed on the upper surface of the second adhesive resin layer RS2. In an embodiment, for example, the bump RL may be a portion protruding from the upper surface of the second adhesive resin layer RS2 in the third direction DR3. The bump RL may be formed along the edge of the second adhesive resin layer RS2. This may be because the second adhesive resin layer RS2 includes an adhesive material, such as an acrylic resin.

[0119] refer to Fig. 9 and Fig.10 , a portion of the first adhesive resin layer RS1 and the second adhesive resin layer RS2 may be cut along a cutting line CT to remove the bump RL.

[0120] refer to Fig.11 , the second release film LN2 may be attached to the second adhesive resin layer RS2. In an embodiment, for example, the second release film LN2 may be attached to the second surface S2 of the second adhesive resin layer RS2. The second release film LN2 may include a plurality of protrusions PD. The plurality of protrusions PD may protrude toward the second adhesive resin layer RS2. That is, the plurality of protrusions PD may protrude in a direction opposite to the third direction DR3. In an embodiment, for example, the plurality of protrusions PD may have a triangular shape in a cross-sectional view. In an embodiment, for example, the second release film LN2 may include a material substantially the same as that of the first release film LN1.

[0121] The second adhesive resin layer RS2 may be aged in a state where the second release film LN2 including the plurality of protrusions PD is attached to the second surface S2 of the second adhesive resin layer RS2. In an embodiment, for example, the second adhesive resin layer RS2 may be aged at a temperature of about 50° C. or higher and about 70° C. or lower. In one embodiment, for example, the second adhesive resin layer RS2 may be aged at a temperature of about 60° C. However, this is only an example, and the second adhesive resin layer RS2 may be aged at various temperatures.

[0122] In an embodiment, for example, the second adhesive resin layer RS2 may be aged at a pressure of about 0.1 bar or more and about 0.5 bar or less. In an embodiment, for example, the second adhesive resin layer RS2 may be aged at a pressure of about 0.3 bar. However, this is only an example, and the second adhesive resin layer RS2 may be aged at various pressures.

[0123] In an embodiment, for example, the second adhesive resin layer RS2 may be aged for about 48 hours to about 96 hours. In an embodiment, for example, the second adhesive resin layer RS2 may be aged for about 72 hours. However, this is only an example, and the aging time of the second adhesive resin layer RS2 may be variously set.

[0124] As the second adhesive resin layer RS2 ages, an embossed pattern may be formed on the second surface S2 of the second adhesive resin layer RS2.

[0125] refer to Fig.11 and Fig.12 , after removing the first release film LN1, a base layer FM may be provided or formed on the lower portion of the first adhesive resin layer RS1. In an embodiment, for example, the base layer FM may be attached to the first surface S1 of the first adhesive resin layer RS1. In an embodiment, for example, the base layer FM may include an acrylic foam material or a urethane foam material.

[0126] The second adhesive layer AD2 may be provided or formed below the base layer FM. The second adhesive layer AD2 may provide adhesive force to the lower surface of the base layer FM. In an embodiment, for example, the second adhesive layer AD2 may include OCA, OCR, or PSA, etc. These materials may be used alone or in combination with each other.

[0127] A metal layer MT may be provided or formed under the second adhesive layer AD2. The metal layer MT may include a metal material such as copper.

[0128] refer to Fig.13 , the second release film LN2 may be removed so that the embossed pattern may be formed (or may be exposed) on the second surface S2 of the second adhesive resin layer RS2. Figure 3 The first adhesive layer AD1 may include Fig.13 The first adhesive resin layer RS1 and the second adhesive resin layer RS2.

[0129] Accordingly, a first adhesive layer ( Figure 3 The panel bottom member CP includes a first adhesive layer AD1, a heat dissipation layer RD, a base layer FM, a second adhesive layer AD2 and a metal layer MT.

[0130] refer to Fig.14 , the panel bottom member CP may be attached to the lower portion of the display panel PNL. Accordingly, the display device DD may be formed.

[0131] The embodiments of the present disclosure may be applied to various display devices, such as display devices for vehicles, ships, and aircraft, portable communication devices, display devices for exhibitions or information transmission, or medical display devices, etc.

[0132] The present invention should not be interpreted as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the present invention to those skilled in the art.

[0133] While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the claims.

Claims

1. A panel bottom member, comprising: basal layer; a first adhesive layer disposed on the base layer, wherein the first adhesive layer includes a light blocking material, a first surface of the first adhesive layer faces the base layer, and an embossed pattern is defined on a second surface of the first adhesive layer opposite to the first surface; and A heat dissipation layer is disposed in the first adhesive layer.

2. The panel bottom member according to claim 1, wherein: A plurality of openings are defined in the heat dissipation layer, and The first adhesive layer fills the plurality of openings of the heat dissipation layer. The panel bottom member of claim 1 , wherein the heat dissipation layer comprises graphite. 4 . The panel bottom member according to claim 1 , wherein the heat dissipation layer is spaced apart from each of the first surface of the first adhesive layer and the second surface of the first adhesive layer in a cross-sectional view. 5 . The panel bottom member according to claim 4 , wherein a distance between the heat dissipation layer and the first surface of the first adhesive layer is smaller than a distance between the heat dissipation layer and the second surface of the first adhesive layer.

6. The panel bottom member of claim 1, wherein the light blocking material comprises carbon black. 7 . The panel bottom member according to claim 1 , wherein a content of the light blocking material in the first adhesive layer is 1.5 weight percent or more and 2 weight percent or less.

8. The panel bottom member according to claim 1, wherein the optical density of the first adhesive layer is 3.0 or greater.

9. The panel bottom member of claim 1, wherein the base layer comprises an acrylic foam material or a urethane foam material.

10. The panel bottom member according to claim 1, further comprising: a metal layer disposed below the base layer; as well as A second adhesive layer is disposed between the base layer and the metal layer.

11. The panel bottom member of claim 10, wherein the metal layer comprises copper.

12. A display device, comprising: A display panel including a plurality of pixels; as well as A panel bottom member according to any one of claims 1 to 11 is disposed below the display panel.

13. A method for manufacturing a display device, the method comprising: forming a panel bottom member; as well as attaching the panel bottom member to the lower portion of the display panel, The panel bottom member is formed as follows: forming a heat dissipation layer having a plurality of openings defined therein on the first adhesive resin layer; forming a second adhesive resin layer on the first adhesive resin layer to cover the heat dissipation layer; forming an embossed pattern on an upper surface of the second adhesive resin layer; and A base layer is formed under the first adhesive resin layer. 14 . The method of claim 13 , wherein each of the first adhesive resin layer and the second adhesive resin layer comprises a light blocking material. 15 . The method according to claim 13 , wherein in forming the second adhesive resin layer, the second adhesive resin layer fills the plurality of openings of the heat dissipation layer.

16. The method of claim 13, wherein: The first adhesive resin layer is formed on the first release film, and Forming the base layer below the first adhesive resin layer includes attaching the base layer to a lower portion of the first adhesive resin layer after removing the first release film from the first adhesive resin layer.

17. The method according to claim 13, wherein forming the embossed pattern on the upper surface of the second adhesive resin layer comprises: A second release film including a plurality of protrusions protruding toward the second adhesive resin layer is attached to the second adhesive resin layer.

18. The method according to claim 17, wherein forming the embossed pattern on the upper surface of the second adhesive resin layer further comprises: The second adhesive resin layer to which the second release film is attached is aged for a preset time.

19. The method according to claim 17, wherein forming the embossed pattern on the upper surface of the second adhesive resin layer further comprises: Before attaching the panel bottom member to the lower portion of the display panel, the second release film is removed from the second adhesive resin layer.

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