Display device

Abstract

A display device may include: a base substrate including a display area and a non-display area surrounding the display area; a package substrate disposed over the base substrate and covering the display area; a weir portion disposed between the base substrate and the package substrate in the non-display area; a planarization layer covering the display area and extending into the non-display area, the planarization layer being spaced apart from the weir; and an organic light emitting element including a cathode and disposed over the planarization layer. The cathode extends into the non-display area and exposes a top surface of the planarization layer in the non-display area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0138606 filed in the Korean Intellectual Property Office on October 17, 2023, the entire contents of which are hereby expressly incorporated into this application by reference. Technical Field

[0003] The present disclosure relates to a display device having an improved configuration. Background Art

[0004] In the information age, the field of display devices that visually express electrical information signals is rapidly developing, and research continues to improve the performance of various display devices by providing enhanced performance, such as thin thickness, light weight, and low power consumption.

[0005] Representative display devices may include a liquid crystal display device (LCD), a field emission display device (FED), an electrowetting display device (EWD), an organic light emitting display device (OLED), and the like.

[0006] Unlike a liquid crystal display device, an electroluminescent display device such as an organic light emitting display device is a self-luminous display device that does not require a separate light source such as a backlight unit. Therefore, the electroluminescent display device can be manufactured to have a light weight and a small thickness.

[0007] In addition, since the electroluminescent display device is advantageous not only in terms of power consumption due to low voltage driving but also in terms of color realization, response speed, viewing angle, and contrast ratio (CR), it is expected to be applied in various fields.

[0008] In an electroluminescent display device, a plurality of light-emitting diodes including a plurality of organic layers are used, each of which includes a light-emitting layer between two electrodes, an anode and a cathode. In this case, a weir may be provided in the frame region to suppress the penetration of moisture into the display region of the display device. However, the formation of the weir may introduce other problems, such as cracks in the insulating layer.

[0009] In addition, in an electroluminescent display device, a plurality of organic films and inorganic films including an organic layer and a cathode are deposited on top of a base substrate. The organic films and the inorganic films may each have a tolerance for each deposition area / level. However, if the tolerance is exceeded, various defects may be caused in the display device. Summary of the invention

[0010] One object to be achieved by aspects of the present disclosure is to provide a display device that suppresses, minimizes, or prevents cracks of an insulating layer associated with a spacer and a planarization layer of a dam portion of the display device.

[0011] Another object to be achieved by aspects of the present disclosure is to provide a display device that suppresses or minimizes dark spots that may be formed at the outer periphery of a display area due to cracks in an insulating layer, or to provide a display device that prevents the formation of dark spots.

[0012] Another object to be achieved by aspects of the present disclosure is to provide an improved display device that addresses limitations and disadvantages associated with the prior art.

[0013] The objects of the present disclosure are not limited to the above objects, and other objects not mentioned above may be clearly understood by those skilled in the art from the following description.

[0014] To achieve the purpose as described above, according to one aspect of the present disclosure, a display device may include: a substrate (e.g., a base substrate), the substrate including a non-display area on a first side where a first pad unit is provided, a third side where a second pad unit is provided, and a second side opposite to the first side; a packaging substrate, the packaging substrate being disposed above the substrate and exposing the first pad unit; an adhesive film, the adhesive film being disposed between the substrate and the packaging substrate; a dam portion, the dam portion being disposed between the substrate and the packaging substrate at an outer periphery of the adhesive film; a planarization layer, the planarization layer being disposed to cover the second pad unit and being spaced apart from the dam portion by a first distance on the first side and the third side; an organic layer, the organic layer being disposed above the planarization layer to cover a side surface of the planarization layer on the second side; and a passivation layer, the passivation layer being disposed above the planarization layer and the organic layer and extending to the non-display area to overlap with the dam portion.

[0015] Additional details of example embodiments of the disclosure are included in the detailed description and the accompanying drawings.

[0016] According to aspects of the present disclosure, the superimposition between the dam and the planarization layer is suppressed, prevented or minimized, thereby being able to suppress, prevent or minimize cracks in the insulating layer and the inflow of outgassing of the uncured filler. Therefore, it is possible to suppress, prevent or minimize the formation of a dark spot group that may be generated at the outer periphery of the display area of ​​the display device.

[0017] The effects according to aspects of the present disclosure are not limited to the contents of the above examples, and more various effects are included in the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0019] Figure 1 is a plan view of a display device according to an exemplary embodiment of the present disclosure;

[0020] Figure 2 According to the example of the present disclosure Figure 1 A cross-sectional view of a sub-pixel of a display device;

[0021] Figure 3 is an example according to the present disclosure Figure 1 A view showing a portion of a cross section of the display device taken along line AA';

[0022] Figure 4 is an example according to the present disclosure Figure 1 A view of a portion of a cross section of a display device taken along line BB';

[0023] Figure 5 is an example according to the present disclosure Figure 1 A view showing a portion of a cross section of the display device taken along line CC';

[0024] Figure 6 is a plan view of a display device according to another example embodiment of the present disclosure;

[0025] Figure 7 is an example according to the present disclosure Figure 6 A cross-sectional view of the display device taken along line DD';

[0026] Figure 8 is an example according to the present disclosure Figure 6 A cross-sectional view of the display device taken along line EE';

[0027] Fig. 9 is an example according to the present disclosure Figure 6 A cross-sectional view of the display device taken along line FF';

[0028] Fig.10 is a cross-sectional view of a display device according to still another example embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] The advantages and features of the present disclosure and the methods for achieving the advantages and features will be clear by referring to the exemplary embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure.

[0030] The shapes, sizes, ratios, angles, quantities, etc. illustrated in the drawings used to describe the exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. The same reference numerals generally represent the same elements throughout the specification. In addition, in the following description of the present disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "including", "having", "consisting of...", etc. used herein are generally intended to allow the addition of other components unless the term is used together with the term "only". Any reference to the singular may include the plural, unless otherwise expressly stated.

[0031] Additionally, the term "may" fully encompasses the full meaning and coverage of the term "can."

[0032] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0033] When terms such as "on", "above", "lower", "beneath", "immediately adjacent" and the like are used to describe the positional relationship between two parts, one or more parts may be located between the two parts unless the term is used together with the term "immediately" or "directly".

[0034] When an element or layer is referred to as being “on” or “over” another element or layer, the other element or layer or other layers or elements may be directly on the other element or interposed between them.

[0035] Although the terms "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components and may not define an order or sequence. Therefore, the first component to be mentioned below may be the second component in the technical concept of the present disclosure.

[0036] Like reference numbers generally refer to like elements throughout the disclosure.

[0037] The size and thickness of each component illustrated in the drawings are illustrated for convenience of description, and the present disclosure is not limited to the size and thickness of the illustrated components.

[0038] The features of the various embodiments of the present disclosure may be partially or completely combined or combined with each other, and may be technically associated and operated in various ways, and the embodiments may be implemented independently of each other or in association with each other. For example, any feature discussed in conjunction with any embodiment or example herein may be applied to any display device discussed in conjunction with any other embodiment or example herein.

[0039] Hereinafter, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. All components of various display devices according to all embodiments of the present disclosure are operatively coupled and configured.

[0040] Figure 1 is a plan view of a display device according to an example embodiment of the present disclosure.

[0041] Reference Figure 1 The display device 100 according to an example embodiment of the present disclosure may include a substrate 101, a packaging substrate 140, pad units 107 and 108, and a dam portion 180. The substrate 101 and the packaging substrate 140 may be referred to as a first substrate and a second substrate, respectively, or may be referred to as a base substrate and a packaging substrate, respectively.

[0042] The display device 100 is a device for displaying images to a user.

[0043] In the display device 100, a display element for displaying an image, a driving element for driving the display element, and wiring for transmitting various signals to the display element and the driving element may be provided. The display element may be defined in different ways according to the type of the display device 100. For example, when the display device 100 is an organic light-emitting display device, the display element may be an organic light-emitting element (e.g., an organic light-emitting diode) including an anode, an organic light-emitting layer, and a cathode. For example, when the display device 100 is a liquid crystal display device, the display element may be a liquid crystal display element.

[0044] Hereinafter, it is assumed that the display device 100 or any other display device discussed below is an organic light-emitting display device including an organic light-emitting element, but the display device 100, etc. is not limited to an organic light-emitting display device and may be of a different type, such as a liquid crystal display device, a micro LED display device, etc.

[0045] The display device 100 may be a transparent display device, such as a transparent and / or flexible organic light emitting display device. However, the present disclosure is not limited thereto.

[0046] The display device 100 may include a display area AA (or an active area) and a non-display area NA (or a non-active area).

[0047] The display area AA is an area where an image is displayed in the display device 100 .

[0048] In the display area AA, a plurality of sub-pixels forming a plurality of pixels and one or more circuits for driving the plurality of sub-pixels may be provided. The plurality of sub-pixels are the smallest units constituting the display area AA, wherein a display element may be provided in each of the plurality of sub-pixels. A plurality of sub-pixels (or a sub-pixel group) may constitute a pixel.

[0049] In the example, an organic light emitting diode including an anode, an organic light emitting layer and a cathode may be provided in each of the plurality of sub-pixels, but is not limited thereto. In the present disclosure, the organic light emitting diode may be any other type of organic light emitting element, which may be collectively referred to as an organic light emitting element. In addition, the circuit for driving the plurality of sub-pixels may include one or more driving elements, wiring / conducting wires, and the like. For example, the circuit for driving the sub-pixels may be composed of a thin film transistor, a storage capacitor, a gate line, a data line, and the like, but is not limited thereto.

[0050] The non-display area NA is an area where no image is displayed. The non-display area NA may completely or only partially surround or surround the display area AA. The display area AA and the non-display area NA may be in a quadrilateral shape. However, the shape and position of the display area AA and the non-display area NA are not limited to Figure 1 Example shown.

[0051] In other words, the shape and / or arrangement of the display area AA and the non-display area NA may be varied to have a shape and / or arrangement suitable for the design of an electronic device including the display device 100. For example, an example shape of the display area AA may be a pentagon, a hexagon, a circle, an ellipse, etc.

[0052] In the non-display area NA, various wirings and circuits for driving the organic light emitting elements of the display area AA may be provided. For example, in the non-display area NA, a plurality of sub-pixels and circuits or a driver integrated circuit (IC) (e.g., a gate driver IC or a data driver IC) that transmits signals to the display area AA or connection lines of the pad units 107 and 108 may be provided, but the present disclosure is not limited thereto.

[0053] The gate driver IC (or gate driver) may generate gate signals and provide the gate signals to the pixels of the display device 100 , and the data driver IC (or data driver) may generate data signals and provide the data signals to the pixels of the display device 100 .

[0054] The display device 100 may include various additional elements to generate various signals or drive pixels in the display area AA. The additional elements for driving the pixels may include an inverter circuit, a multiplexer, an electrostatic discharge circuit (ESD), and the like.

[0055] For example, the display device 100 may include a timing controller, a power supply, etc. in addition to a gate driver and a data driver for driving the display device 100. The timing controller may receive an image signal and a control signal from an external host system, etc. The image signal may include a plurality of grayscale data. The control signal may include, for example, a vertical synchronization signal, a horizontal synchronization signal, a data enable signal, etc.

[0056] The display device 100 may further include one or more additional elements associated with one or more functions other than the function of driving pixels. For example, the display device 100 may include additional elements that provide a touch sensing function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure sensing function, or a tactile feedback function. The above additional elements may be located in the non-display area NA, and / or the display area AA, and / or in an external circuit connected to the connection interface.

[0057] The display device according to aspects of the present disclosure may be included in or applied to other electronic devices, such as a television, a mobile terminal such as a smart phone, a navigation system, a computer, a game system, an extended reality (XR) system, etc.

[0058] The pad units 107 and 108 may be provided and may be applied with signals from the outside.

[0059] The pad units 107 and 108 are disposed in the non-display area NA of the display device 100 to be electrically connected to various wirings and circuits disposed in the display area AA and the printed circuit board.

[0060] For example, the pad units 107 and 108 are used to transmit signals to the gate lines and the data lines and include a gate pad unit 108 for transmitting gate signals to the gate lines and a data pad unit 107 for transmitting data signals to the data lines, but are not limited thereto. The area where the data pad unit 107 is disposed may be part of the non-display area NA, but may not be.

[0061] The data pad unit 107 may be disposed on one side of the display device 100, for example, in the non-display area NA on the first side of the display device 100, but is not limited thereto. For example, the first side here may represent the upper side / top side of the display device 100. As a variation, the first side here may be the lower side / bottom side of the display device 100.

[0062] The gate pad unit 108 may be disposed at one or more sides of the display device 100. For example, the gate pad unit 108 may be disposed in the non-display area NA of the third side of the display device 100, but is not limited thereto. For example, the third side may refer to a side of the display device 100 adjacent to the upper side and the lower side, such as Figure 1 In the example, the gate pad unit 108 may be disposed on the left or right side of the display device 100, or the gate pad unit 108 may be disposed in each of the left and right sides of the display device 100. However, the present disclosure is not limited thereto.

[0063] For example, the data pad unit 107 is electrically connected to the data driver to supply data voltages to multiple data lines. The data driver receives image data from the timing controller to supply data voltages to multiple data lines, thereby driving multiple data lines. The data driver can be implemented by including one or more source driver integrated circuits. The data driver can be arranged to overlap with the data pad unit 107 or be adjacent to the data pad unit 107. For example, the data driver can be directly arranged above or below the data pad unit 107. In a variation, the data driver can be included in the data pad unit 107. Similarly, the gate driver can be arranged to overlap or be adjacent to the gate pad unit 108 (for example, directly above or below the gate pad unit 108), or the gate pad unit 108 can include a data driver.

[0064] For example, each source driver integrated circuit may include a shift register, a latch circuit, a digital-to-analog converter (DAC), an output buffer, etc. In some cases, the data driver may also include one or more analog-to-digital converters (ADCs) as needed.

[0065] On the other hand, the gate driver outputs a scan signal (gate signal) to a plurality of gate lines to drive the plurality of gate lines. For example, the gate driver sequentially supplies the scan signal to the plurality of gate lines to sequentially drive the plurality of gate lines. The gate driver may sequentially supply a scan signal of an on-voltage or an off-voltage to the plurality of gate lines according to the control of the timing controller.

[0066] The gate driver may be composed of a plurality of gate driving circuits, wherein the plurality of gate driving circuits may correspond to a plurality of gate lines.

[0067] For example, each gate driving circuit may include a shift register, a level shifter, etc.

[0068] Each gate driving circuit may be implemented as a gate in panel (GIP) and embedded in the display device 100. For example, each gate driving circuit may be directly disposed in the gate pad unit 108. The gate driving circuit may be disposed on one or more gate pad units 108 disposed on one side or two opposite sides of the display device 100.

[0069] On the other hand, the display device 100 according to an example embodiment of the present disclosure may include a dam 180 in the non-display area NA to ensure that the substrate 101 and the encapsulation substrate 104 are properly bonded / adhered and to ensure the reliability of the device, for example, to suppress or prevent moisture from penetrating into the display area AA. The dam 180 may include one or more spacers having a specific shape / size (for example, see the spacer 181 in other figures). For example, the dam 180 may have spacers of the same size and / or shape along the non-display area NA, or may have spacers of similar or different sizes and / or shapes along the non-display area NA.

[0070] The dam portion 180 may be provided to surround the display area AA.

[0071] For example, the dam portion 180 may be provided in a quadrangular frame shape which completely surrounds the display area AA and has a predetermined curvature in four corners.

[0072] In addition, in the display device 100 according to the exemplary embodiment of the present disclosure, the planarization layer 105 is arranged to be spaced apart from the dam portion 180 by predetermined intervals G1 and G2 to suppress or avoid any overlap (e.g., overlap) between the dam portion 180 and the planarization layer 105. For example, in the non-display area NA, the planarization layer 105 is spaced apart from the dam portion 180 by intervals G1, G2, so that the dam portion 180 does not contact and overlap (does not overlap) with the planarization layer 105. The intervals G1 and G2 may be the same or may be different, for example, G2>G1, and may be referred to herein as the first distance and the second distance, respectively. Therefore, cracks in the insulating layer and the inflow of exhaust gas of the uncured filler may be suppressed or prevented, which will be described below with reference to various aspects according to the present disclosure. Figures 3 to 10 describe.

[0073] Figure 2 According to the example of the present disclosure Figure 1 A cross-sectional view of a sub-pixel of a display device.

[0074] also, Figure 3 is an example according to the present disclosure Figure 1 A view of a portion of a cross-section of a display device taken along line AA'. Figure 4 is an example according to the present disclosure Figure 1 A view of a portion of a cross section of a display device taken along line BB'. Figure 5 is an example according to the present disclosure Figure 1 A view of a portion of a cross section of a display device taken along line CC'.

[0075] exist Figures 3 to 5In the embodiment, for the convenience of description, the pixel unit 115 in the display area AA is schematically illustrated. The pixel unit 115 may include various configurations below the planarization layer 105. Figure 3 and Figure 4 , for convenience of description, the data pad unit 107 and the gate pad unit 108 in the non-display area NA are schematically illustrated. The gate pad unit 108 may include various configurations including a GIP circuit unit.

[0076] Specifically, Figure 3 Shows Figure 1 A portion of the non-display area NA on the first side of the display device 100 (the first-side non-display area NA) and a portion of the display area AA of the display device 100, Figure 4 Shows Figure 1 A portion of the non-display area NA on the left side of the display device 100 (left non-display area NA) and a portion of the display area AA of the display device 100. In addition, Figure 5 Shows Figure 1 A portion of the non-display area NA on the second side of the display device 100 (second-side non-display area NA) and a portion of the display area AA of the display device 100.

[0077] As described above, the first side refers to the upper side or top side of the display device 100, and the second side may refer to the lower side or bottom side opposite to the upper side. However, other variations are possible. For example, the first side and the second side may be opposite sides or directly adjacent sides (e.g., sides forming a 90 degree or other angle).

[0078] Hereinafter, an example of applying process conditions for normal deposition of an outermost sub-pixel of a display device by reflecting process capabilities during deposition of organic and inorganic films of a display element will be described according to aspects of the present disclosure.

[0079] Reference Figures 2 to 5 , in a display device ( Figure 1 In 100 ), a driving element 110 may be provided on a substrate 101 .

[0080] In addition, the planarization layer 105 may be disposed on the driving element 110 .

[0081] If the dam portion 180 is provided in a quadrangular frame shape surrounding the display area AA, the planarization layer 105 may be provided in a rectangular shape including four corners surrounding the display area AA.

[0082] In addition, an organic light-emitting element (e.g., an organic light-emitting diode) 150 (or a display element) electrically connected to the driving element 110 is disposed on the planarization layer 105, and a passivation layer 120 is disposed on the organic light-emitting element 150 to inhibit or prevent oxygen and moisture from penetrating into the organic light-emitting element 150.

[0083] The adhesive film 130 and the encapsulation substrate 140 may be sequentially disposed on the passivation layer 120. However, the display device 100 according to example embodiments of the present disclosure is not limited to such a stacked structure.

[0084] The dam portion 180 is disposed between the substrate 101 and the encapsulation substrate 140 at the outside of the display device in the non-display area NA. The dam portion 180 may include a plurality of spacers 181 disposed therein, which enhance the reliability of the dam portion 180. The spacers 181 may have the same size and / or shape along the non-display area NA, or may have different sizes and / or shapes along the non-display area NA.

[0085] The substrate 101 may be a glass or plastic substrate. When the substrate 101 is a plastic substrate, a polyimide-based material or a polycarbonate-based material is used so that the substrate can be flexible. Specifically, polyimide can be applied to high temperature processes and is a coatable material, so polyimide can be often used for plastic substrates. In this way, the substrate 101 can be flexible (e.g., bendable, curlable, etc.).

[0086] A buffer layer 102 may be provided on the substrate 101. The buffer layer 102 is a layer that protects various electrodes and wirings from impurities (e.g., alkali ions) that may leak from the substrate 101 or a layer therebelow, and has a multilayer structure formed of a first buffer layer 102a and a second buffer layer 102b, but is not limited thereto. For example, the buffer layer 102 may have a single-layer structure. In addition, the buffer layer 102 may be formed of silicon oxide SiOx, silicon nitride SiNx, or a plurality of layers thereof.

[0087] The buffer layer 102 may delay or prevent the diffusion / movement of moisture and / or oxygen that can penetrate the substrate 101. In addition, the buffer layer 102 may include a multi-buffer and / or an active buffer. The active buffer may perform the function of protecting the active layer 111 of the driving element 110 composed of a semiconductor and blocking various types of defects that may be introduced from the substrate 101. The active buffer may be formed of amorphous silicon (a-Si) or the like.

[0088] As a non-limiting example, the driving element 110 may be formed by sequentially providing an active layer 111, a gate insulating layer 103, a gate 113, an interlayer insulating layer 104, a source electrode 116, and a drain electrode 112. The driving element is electrically connected to the organic light emitting element 150 via a connecting electrode 114 to transmit a current or a signal from the driving element 110 to the organic light emitting element 150. For example, the driving element 110 may be various types of thin film transistors, and the positions of the source electrode 116 and the drain electrode 112 may be switched or changed according to the type of the driving element 110. However, the present disclosure is not limited thereto.

[0089] In addition to the top gate structure, the driving element 110 may be applied to various structures, such as a bottom gate structure in which the gate is located below the active layer, and a coplanar structure in which the gate, source, and drain are arranged on the same plane.

[0090] The active layer 111 may be located on the buffer layer 102. The active layer 111 may be made of polycrystalline silicon (p-Si). In this case, a predetermined region may be doped with impurities. In addition, the active layer 111 may be made of amorphous silicon (a-Si) or an organic semiconductor material such as pentene. In addition, the active layer 111 may be formed of an oxide semiconductor.

[0091] The gate insulating layer 103 may be located on the active layer 111. For example, the gate insulating layer 103 may be formed of an insulating inorganic material such as silicon oxide SiOx or silicon nitride SiNx, or an insulating organic material.

[0092] The gate 113 may be located on the gate insulating layer 103. For example, the gate 113 may be formed of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0093] The interlayer insulating layer 104 may be disposed on the gate electrode 113. For example, the interlayer insulating layer 104 may be formed of an insulating material such as silicon oxide SiOx or silicon nitride SiNx, or an insulating organic material.

[0094] The gate insulating layer 103 and the interlayer insulating layer 104 are selectively removed to form a contact hole through which the source region and the drain region are exposed, wherein the source electrode 116 and the drain electrode 112 may be disposed in such a contact hole. The source electrode 116 and the drain electrode 112 may be formed of a material for an electrode as a single layer or a multilayer structure on the interlayer insulating layer 104. If necessary, an additional passivation layer that may be composed of an inorganic insulating material may be formed to cover the source electrode 116 and the drain electrode 112.

[0095] The planarization layer 105 may be provided on the driving element 110 configured as described above.

[0096] The planarization layer 105 may have a multi-layer structure consisting of at least two layers. For example, the planarization layer 105 may include a first planarization layer 105a and a second planarization layer 105b, but is not limited thereto.

[0097] For example, the first planarization layer 105 a may be provided to cover the driving element 110 , but may be provided to expose a portion of the source 116 or the drain 112 of the driving element 110 .

[0098] The planarization layer 105 may extend to the non-display area NA of the display device 100 .

[0099] The planarization layer 105 may be an overcoat layer, but is not limited thereto.

[0100] On the other hand, according to an example embodiment of the present disclosure, the planarization layer 105 may be spaced apart (separated) from the dam portion 180 by predetermined intervals G1 and G2, so that any overlap (e.g., overlap) between the dam portion 180 and the planarization layer 105 may be suppressed or avoided. For example, the planarization layer 105 extends to the non-display area NA and may be disposed to be spaced apart from the dam portion 180 by predetermined intervals G1 and G2.

[0101] The planarization layer 105 according to an example embodiment of the present disclosure may be spaced and separated from the dam portion 180 by different intervals G1 and G2 according to the location of the display device 100 , but the present disclosure is not limited thereto.

[0102] For example, the planarization layer 105 is spaced apart from the dam portion 180 by a first interval (or a first distance) G1 (see Figure 1 , Figure 3 and Figure 4 ), and is spaced apart from the dam portion 180 by a second interval (or a second distance) G2 (see Figure 1 and Figure 5 ). In addition, the second interval G2 may be larger than the first interval G1. The second side of the display device 100 is an area where the pad units 107 and 108 are not provided. Therefore, various wirings or circuits are not provided, so that the margin or extension of the planarization layer 105 that covers and protects the wirings or circuits may not be required on the second side. Therefore, the second side ( Figure 5 ) may not need to be aligned with the remaining side ( Figure 3 and Figure 4 ) extends as much as the portion of the planarization layer 105 to the non-display area NA, so that a sufficient spacing (or a larger separation distance, Figure 5 Therefore, the relationship of G2>G1 (G2 is greater than G1) applies.

[0103] In addition, on a third side (eg, left or right side) of the display device 100 ( Figure 4 ), the dam portion 180 and the gate pad unit 108 do not overlap each other. On the third side of the display device 100, the gate pad unit 108 is disposed to be spaced apart (separated) from the dam portion 180 at a predetermined interval (e.g., interval G1), and the planarization layer 105 may be disposed to surround the gate pad unit 108.

[0104] In addition, on the third side ( Figure 4 ), since the gate pad unit 108 is disposed in the non-display area NA, the distance from the edge of the pixel unit 115 (eg, the boundary between the display area AA and the non-display area NA) to the Figure 4 The distance d2 from the edge of the planarization layer 105 in the non-display area NA is greater than that in Figure 3 The distance d1 from the edge of the pixel unit 115 at the boundary to the edge of the planarization layer 105 on the first side of the display device 100 is also greater than Figure 5 The distance d3 from the edge of the pixel unit 115 at the boundary to the edge of the planarization layer 105 on the second side of the display device 100 is d2. In this way, the relationship of d2>d1 and d2>d3 applies.

[0105] In addition, for example, the distance d1 from the edge of the pixel unit 115 to the edge of the planarization layer 105 on the first side of the display device 100 is greater than the distance d3 from the edge of the pixel unit 115 to the edge of the planarization layer 105 on the second side of the display device 100. In this way, the relationship of d1>d3 is applied. In this case, the relationship of d2>d1>d3 can be established.

[0106] In addition, for example, on the first side ( Figure 3 ) may partially overlap a power line of a power signal connected to the data pad unit 107.

[0107] In addition, in the display device 100 according to the exemplary embodiment of the present disclosure, the planarization layer 105 is disposed to be spaced apart from the dam portion 180 by predetermined intervals G1 and G2 so that any overlap between the dam portion 180 and the planarization layer 105 can be suppressed or prevented.

[0108] In addition, on the first side and the third side ( Figure 3 and Figure 4 ), the edge region of the planarization layer 105 is wide to suppress or prevent any short circuit between the cathode 153 and the lower wiring present therein. Figure 5), there is no lower wiring, so that the edge area of ​​the planarization layer 105 can be narrow or larger than Figure 3 and Figure 4 For example, between the planarization layer 105 on the second side and the cathode 153 (eg, Figure 5 The distance between the edge of the cathode 153 and the edge of the planarization layer 105 in the non-display area NA in the second side (between the edge of the cathode 153 and the edge of the planarization layer 105 in the non-display area NA in the second side) may be shorter or smaller than the distance between the planarization layer 105 and the cathode 153 at the first side and the third side. In addition, as described above, for example, the distance d3 from the edge of the pixel unit 115 to the edge of the planarization layer 105 at the second side is shorter than the distances d1 and d2 from the edge of the pixel unit 115 to the edge of the planarization layer 105 at the first side and the third side.

[0109] As described above, according to the exemplary embodiment of the present disclosure, the overlap between the dam portion 180 and the planarization layer 105 is suppressed or prevented, so that cracks of the insulating layer and inflow of outgassing of the uncured filler can be suppressed or prevented.

[0110] For example, when the substrate of the display device and the packaging substrate are bonded, the passivation layer above the planarization layer is pressed by the spacer in the dam portion, which may cause cracks in the passivation layer. When such cracks are generated in the passivation layer, uncured filler, outgassing, or external oxygen may flow into it, which may generate dark spot groups or defects.

[0111] To address this limitation, according to an exemplary embodiment of the present disclosure, any overlap between the dam portion 180 and the planarization layer 105 is completely avoided by separating the distances / intervals G1, G2, so that any cracks in the passivation layer 120 and the inflow of outgassing of the uncured filler can be prevented and suppressed. Therefore, no dark spot group or defect is generated at the outer periphery of the display area AA.

[0112] On the other hand, the connection electrode 114 ( Figure 2 ) may be disposed on the first planarization layer 105a. In addition, various metal layers used as wires / electrodes such as data lines or signal lines may be disposed on the first planarization layer 105a.

[0113] In addition, the second planarization layer 105b can be disposed on the first planarization layer 105a and the connecting electrode 114. The planarization layer 105 according to the exemplary embodiment of the present disclosure is composed of two layers because various signal lines are increased according to the increased resolution of the display device 100. Therefore, it may become more challenging to arrange all wirings on one layer while ensuring the minimum spacing. Thus, an additional planarization layer is provided. The additional planarization layer (e.g., the second planarization layer 105b) is added so that there is a margin for arranging wiring, which makes it easier to design and arrange wiring / electrodes. In addition, when a dielectric material is used for the planarization layer 105 composed of a plurality of layers, the planarization layer 105 can be used to form a capacitor between metal layers.

[0114] The second planarization layer 105 b may be formed to expose a portion of the connection electrode 114 , and the drain electrode 112 of the driving element 110 and the anode electrode 151 of the organic light emitting element 150 may be electrically connected via the connection electrode 114 .

[0115] The organic light emitting element 150 may be formed by sequentially providing an anode 151, a plurality of organic layers 152, and a cathode 153. For example, the organic light emitting element 150 may be formed by forming an anode 151 on the planarization layer 105, forming an organic layer 152 on the anode 151, and forming a cathode 153 on the organic layer 152.

[0116] The display device 100 may be implemented as a top emission type or a bottom emission type. In the case of the top emission type, a reflective layer may be formed below the anode 151 so that the light emitted from the organic layer 152 can be reflected by the anode 151 and guided upward, for example, to the cathode 153 above it. The reflective layer may be formed of an opaque conductive material with high reflectivity, such as silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr) or an alloy thereof. In contrast, in the case of the bottom emission type, the anode 151 may be formed only of a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO) or indium gallium zinc oxide (IGZO). In the following, it is assumed that the display device 100 of the present disclosure is a top emission type. However, the present disclosure is not limited thereto.

[0117] Bank 106( Figure 2 ) may be formed on the remaining area except the light emitting area on the planarization layer 105. Therefore, the bank 106 has a bank hole exposing the anode 151 corresponding to the light emitting area. The bank 106 may be formed of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx) or an organic insulating material such as BCB, an acrylic-based resin, or an imide-based resin.

[0118] The organic layer 152 may be disposed on the anode 151 exposed by the bank 106. The organic layer 152 may include a light emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like.

[0119] The organic layer 152 may extend to the non-display area NA. The organic layer 152 may be disposed on the planarization layer 105 in the non-display area NA.

[0120] At this time, for example, Figure 3 and Figure 4 As shown, the edge of the organic layer 152 is arranged to expose the top edge surface of the planarization layer 105 at the first side and the third side of the display device 100, and as shown in FIG. Figure 5 The edge of the organic layer 152 is shown to be disposed to surround and cover the entire planarization layer 105 at the second side of the display device 100 , but is not limited thereto.

[0121] Reference Figure 3 and Figure 4 , at the first side and the third side of the display device 100 where the pad units 107 and 108 are disposed, the planarization layer 105 extends to the non-display area NA more than the organic layer 152 so as to cover and protect various wirings, circuits and gate pad units 108 connected to the data pad unit 107. Therefore, the edge of the organic layer 152 in the non-display area NA may be disposed to be closer to the inner side than the edge of the planarization layer 105 in the non-display area NA. For example, the organic layer 152 is disposed to be spaced apart from the dam portion 180 by a third distance / interval at the first side and the third side of the display device 100, wherein the third distance is greater than the first distance / interval G1.

[0122] In contrast, reference Figure 5 , on the second side of the display device 100 where the pad units 107 and 108 are not provided, the planarization layer 105 does not need to extend to the non-display area NA more than the organic layer 152, so that the organic layer 152 can be provided to surround and cover the planarization layer 105 in the non-display area NA. For example, the top surface and the side surface of the planarization layer 105 are completely covered by the organic layer 152 in the non-display area NA.

[0123] In this case, for example, at the first and third sides of the display device 100, only the passivation layer 120 is disposed between the dam portion 180 and the planarization layer 105. However, at the second side of the display device 100, in addition to the passivation layer 120, the organic layer 152 may be interposed between the dam portion 180 and the planarization layer 105.

[0124] The cathode 153 may be disposed on the organic layer 152 .

[0125] In the case of a top emission type, the cathode 153 may include a transparent conductive material. For example, the cathode 153 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. In the case of a bottom emission type, the cathode 153 may include any one of a group consisting of metal materials such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu) and alloys thereof. Alternatively, the cathode 153 may be formed by laminating a layer formed of a transparent conductive material (e.g., indium tin oxide (ITO), indium zinc oxide (IZO) or indium gallium zinc oxide (IGZO)) and a layer formed of a metal material (e.g., gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu) or alloys thereof), but is not limited thereto.

[0126] The cathode 153 may extend into the non-display area NA. For example, the edge of the cathode 153 may extend less into the non-display area NA than the edge of the organic layer 152 in the non-display area NA. For example, in the non-display area NA, the cathode 153 may be disposed to be spaced inwardly from the end of the organic layer 152 by a predetermined distance, but is not limited thereto. In an example, the cathode 153 may be disposed on the organic layer 152 in the non-display area NA and spaced from the dam portion 180 by a fourth distance greater than the third distance mentioned above.

[0127] For example, on the third side ( Figure 4 ), the planarization layer 105 is configured to completely surround and cover the gate pad unit 108 to suppress or prevent a short circuit between the circuit unit in the gate pad unit 108 configured thereunder and the cathode 153. At the same time, the cathode 153 can be configured to be spaced inwardly from the end of the organic layer 152 by a predetermined distance.

[0128] A capping layer 154 may be disposed on the cathode 153. The capping layer 154 may be formed of a material having a high refractive index and optical absorbance to reduce scattered reflection of external light.

[0129] The covering layer 154 may extend to the non-display area NA. For example, the covering layer 154 may be disposed to surround (e.g., completely cover) the cathode 153 in the non-display area NA. The edge of the covering layer 154 may be disposed to extend further to the non-display area NA than the edge of the cathode 153 in the non-display area NA. The end of the covering layer 154 and the end of the organic layer 152 may be aligned with each other in the non-display area.

[0130] The passivation layer 120 may be disposed on the capping layer 154. The passivation layer 120 may be an inorganic layer and in this case, may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or a plurality of layers thereof. The passivation layer 120 may extend to the non-display area NA. The passivation layer 120 may be disposed to cover the capping layer 154, the cathode 153, the organic layer 152, and the planarization layer 105.

[0131] For example, the passivation layer 120 may be disposed to surround the capping layer 154 , the cathode 153 , the organic layer 152 , and the planarization layer 105 in the non-display area NA.

[0132] In addition, for example, the passivation layer 120 may be disposed under the dam portion 180. In the non-display area NA, a portion of the passivation layer 120 directly contacts the substrate 101. For example, the passivation layer 120 may be disposed to overlap the dam portion 180 between the dam portion 180 and the substrate 101.

[0133] In addition, for example, the edge of the passivation layer 120 may be arranged to extend beyond the outer edge of the dam portion 180, but is not limited thereto. For example, the edge of the passivation layer 120 may end beyond (overtake) the dam portion 180, end at the dam portion 180, or end before the dam portion 180. The edge portion of the passivation layer 120 may have a gradually decreasing shape.

[0134] An adhesive film 130 (eg, a bonding film) and a package substrate 140 may be disposed on the passivation layer 120. The adhesive film 130 may be disposed between the passivation layer 120 and the package substrate 140.

[0135] For example, the adhesive film 130 may be disposed between the passivation layer 120 and the encapsulation substrate 140 inside the dam portion 180 .

[0136] The adhesive film 130 can protect the organic light emitting element 150 of the pixel unit 115 from moisture, oxygen, and external influences together with the passivation layer 120 and the encapsulation substrate 140. The adhesive film 130 may further include an absorbent (also referred to herein as an absorbent material). The absorbent material may be hygroscopic particles and absorb moisture and oxygen from the outside to minimize or prevent moisture and oxygen from penetrating into the pixel unit 115, but is not limited thereto.

[0137] The adhesive film 130 may include a filler. The filler may be formed using a transparent material so that the brightness of light emitted from the organic light emitting element 150 does not decrease during the process of passing through the encapsulation substrate 140. For example, the filler may be composed of epoxy resin or olefin or may include talc, calcium oxide (CaO), barium oxide (BaO), zeolite, silicon oxide (SiO), etc.

[0138] The encapsulation substrate 140 may be disposed on the adhesive film 130 .

[0139] For example, the encapsulation substrate 140 may protect the organic light emitting element 150 of the pixel unit 115 together with the adhesive film 130 and the dam 180. The encapsulation substrate 140 may protect the light emitting element 150 from moisture, oxygen, and external influences. The encapsulation substrate 140 may be disposed above the substrate 101 so as to expose the data pad unit 107 ( Figure 3 ).

[0140] The dam portion 180 is disposed between the substrate 101 and the encapsulation substrate 140 at the edge of the substrate 101 to enhance adhesion between the substrate 101 and the encapsulation substrate 140 and further block moisture.

[0141] The dam 180 may be disposed in the non-display area NA at the outer periphery of the display area AA. For example, the dam 180 is formed to surround or completely surround the pixel unit 115 and the adhesive film 130 when the display device 100 is viewed in a plan view, and facilitates the adhesion / bonding of the substrate 101 and the encapsulation substrate 140 to be more securely sealed.

[0142] As described above, according to example embodiments of the present disclosure, the planarization layer 105 is spaced apart from the dam portion 180 by the predetermined intervals G1 and G2 , so that any overlap or superposition between the dam portion 180 and the planarization layer 105 is suppressed or prevented.

[0143] In this case, the width of the dam 180 may be reduced while maintaining the width of the non-display area NA the same as in the related art, so that the planarization layer 105 is now spaced or separated from the dam 180 by predetermined intervals G1 and G2, but is not limited thereto. For example, the application area of ​​the dam 180 is configured at the outer periphery of the planarization layer 105 to suppress and avoid any overlap / overlap between the dam 180 and the planarization layer 105.

[0144] Figure 6 is a plan view of a display device according to another example embodiment of the present disclosure. Figure 7 It is shown Figure 6 A view of a cross section of the display device taken along line DD'. Figure 8 It is shown Figure 6 A view of a cross section of the display device taken along line EE'. Fig. 9 It is shown Figure 6 A view of a cross section of the display device taken along line FF'.

[0145] In addition to the configuration of the planarization layer 205 and the pixel unit 215, according to this exemplary embodiment of the present disclosure Figures 6 to 9 The display device 200 has Figures 1 to 5The same or substantially the same configuration of the display device 100 is described above. Therefore, redundant descriptions will be omitted or may be briefly provided. The same configurations will be denoted by the same reference numerals. Here, the description of the same reference numerals can be referred to above. Figures 1 to 5 As mentioned above, including the Figures 1 to 5 All descriptions of all variations of each element / layer / structure associated with a specific reference numeral in the Figures 6 to 9 The same elements / layers / structures are associated with specific reference numerals in the drawings. Therefore, such description is not repeated below or may be briefly provided below.

[0146] exist Figures 7 to 9 In the embodiment, for the convenience of description, the pixel unit 215 in the display area AA is schematically illustrated. The pixel unit 215 may include various configurations below the planarization layer 205. Figure 7 and Figure 8 , for convenience of description, the data pad unit 107 and the gate pad unit 108 in the non-display area NA are schematically illustrated. The gate pad unit 108 may include various configurations including a GIP circuit unit.

[0147] In particular, Figure 7 Shows Figure 6 A portion of the non-display area NA of the first side of the display device 200 (first-side non-display area NA) and a portion of the display area AA of the display device 200. Figure 8 Shows Figure 6 A portion of the non-display area NA (left / right non-display area NA) on the third side of the display device 200 and a portion of the display area AA of the display device 200. In addition, Fig. 9 Shows Figure 6 A portion of the non-display area NA on the second side of the display device 200 (second-side non-display area NA) and a portion of the display area AA of the display device 200.

[0148] Reference Figures 6 to 9 , the display device 200 according to the example embodiment of the present disclosure may include a substrate 101 , a package substrate 140 , pad units 107 and 108 , and a dam portion 180 .

[0149] The display device 200 may include a display area AA and a non-display area NA.

[0150] The non-display area NA surrounds the quadrilateral display area AA, however, the shapes and positions of the display area AA and the non-display area NA are not limited to Figure 6 The example shown. Example shapes of the display area AA may be a pentagon, a hexagon, a circle, an ellipse, etc.

[0151] The pad units 107 and 108 may be provided to be applied with signals from the outside.

[0152] For example, the pad units 107 and 108 may include a gate pad unit 108 transmitting a gate signal to a gate line and a data pad unit 107 transmitting a data signal to a data line, but are not limited thereto.

[0153] The data pad unit 107 may be disposed at one side of the display device 200 , for example, may be disposed in the non-display area NA at a first side of the display device 200 , but is not limited thereto.

[0154] The gate pad unit 108 may be disposed at one side of the display device 200 , for example, the gate pad unit 108 may be disposed in the non-display area NA at the third side of the display device 200 , but is not limited thereto.

[0155] For example, the data pad unit 107 is electrically connected to a data driver to supply a data voltage to a plurality of data lines. The data driver may be implemented by including one or more source driver integrated circuits.

[0156] On the other hand, for example, the gate driver sequentially supplies scan signals to the plurality of gate lines to sequentially drive the plurality of gate lines.

[0157] The gate driver may be composed of a plurality of gate driving circuits.

[0158] Each gate driving circuit is implemented as a gate in panel (GIP) to be embedded in the display device 200. For example, each gate driving circuit may be directly provided in the gate pad unit 108.

[0159] The display device 200 according to this example embodiment of the present disclosure may include the dam portion 180 in the non-display area NA to ensure device reliability such as suppressing or preventing moisture from penetrating into the display area AA.

[0160] The dam 180 may be disposed to completely surround the display area AA, but may only partially surround / surround. The dam 180 may include a plurality of spacers 181 disposed therein, which enhance the reliability of the dam 180. The spacers 181 may have the same size and / or shape along the non-display area NA, or may have different sizes and / or shapes along the non-display area NA.

[0161] In the display device 200 according to this example embodiment of the present disclosure, the planarization layer 205 may be disposed to be spaced apart from the dam portion 180 by a predetermined interval G. For example, the separation distance / interval between the dam portion 180 and the planarization layer 205 in the display device 200 is the same on all sides of the display device 200 .

[0162] The planarization layer 205 may extend to the non-display area NA.

[0163] The planarization layer 205 may be an overcoat layer, but is not limited thereto.

[0164] For example, according to this example embodiment of the present disclosure, the planarization layer 205 may extend to the non-display area NA and may be disposed to be separated and spaced apart by a predetermined interval G from the dam portion 180 .

[0165] The planarization layer 205 according to this example embodiment of the present disclosure may be spaced apart from the dam portion 180 by the same interval G (separation distance G) regardless of the position / side of the display device 200 , but the present disclosure is not limited thereto.

[0166] For example, the planarization layer 205 may be spaced apart and separated from the dam portion 180 by the same interval G (or substantially the same as the interval G), not only as Figure 7 and Figure 8 As shown on the first side and the third side of the display device 200, and as Fig. 9 2. As shown in FIG. 2, the pixel unit 215 may be arranged at the second side of the display device 200. Here, the substantially same interval G refers to the same interval in consideration of process errors. According to another exemplary embodiment of the present disclosure, for the second side of the display device 200 where the pad units 107 and 108 are not provided, a margin of the planarization layer 205 is not required. Figure 5 The reduced interval (G2->G) is expanded compared to the exemplary embodiment of the present invention, wherein the capping layer 154, the cathode 153, the organic layer 152 and the planarization layer 205 are further extended to the non-display area NA, but as Fig. 9 It is shown separated from the dam portion 180. Therefore, the effect of reducing the frame area can be achieved.

[0167] As described above, in the display device 200 according to this exemplary embodiment of the present disclosure, any overlap (overlap) between the dam portion 180 and the planarization layer 205 is effectively suppressed and prevented, so that any cracks in the passivation layer 120 and the inflow of the outgassing of the uncured filler can be effectively suppressed and prevented. Therefore, a dark spot group is not generated at the outer periphery of the display area AA.

[0168] Fig.10 is a cross-sectional view of a display device according to still another example embodiment of the present disclosure.

[0169] In addition to the configuration of the dam portion 380 and the adhesive film 330, according to another exemplary embodiment of the present disclosure Fig.10 The display device 300 has Figures 1 to 5The display device 100 of the exemplary embodiment of the present disclosure has the same or substantially the same configuration. Therefore, redundant descriptions will be omitted or may be briefly provided. The same configurations will be denoted by the same reference numerals. Here, the description of the same reference numerals can be referred to above. Figures 1 to 5 As mentioned above, including Figures 1 to 5 All descriptions of all variations of each element / layer / structure associated with a specific reference numeral in the Fig.10 The same elements / layers / structures are associated with specific reference numerals in the drawings. Therefore, such description is not repeated below or may be briefly provided below.

[0170] exist Fig.10 In the embodiment, for the convenience of description, the pixel unit 115 in the display area AA is schematically illustrated. The pixel unit 115 may include various configurations below the planarization layer 105. Fig.10 , for the convenience of description, the data pad unit 107 in the non-display area NA is schematically illustrated.

[0171] In particular, Fig.10 Schematically illustrates a portion of the first side non-display area NA and the display area AA of the display device. In addition to the differences discussed below, Fig.10 The first side shown in is similar to Figure 3 The first side is shown in .

[0172] Reference Fig.10 The display device 300 according to the exemplary embodiment of the present disclosure may include a substrate 101, a package substrate 140, a pad unit 107 ( Figure 1 108) and the weir portion 380.

[0173] The display device according to this example embodiment of the present disclosure may include the dam portion 380 in the non-display area NA to ensure device reliability such as suppressing and preventing moisture from penetrating into the display area AA.

[0174] The dam 380 may be disposed to surround the display area AA. The dam 380 may include a plurality of spacers 181 disposed therein, which enhances the reliability of the dam 380. The spacers 181 may have the same size and / or shape along the non-display area NA, or may have different sizes and / or shapes along the non-display area NA.

[0175] In the display device according to this example embodiment of the present disclosure, the planarization layer 105 may be disposed to be spaced apart and separated from the dam portion 380 by a predetermined interval (separation distance).

[0176] The planarization layer 105 of the display device 300 according to one example of the present disclosure may be spaced apart from the dam portion 380 at different intervals (separation distances) depending on the position / side of the display device. However, the present disclosure is not limited thereto. The planarization layer 105 of the display device 300 according to another example of the present disclosure may be spaced apart from the dam portion 380 at the same interval for all sides of the display device 300 regardless of the position / side of the display device 300.

[0177] According to the exemplary embodiment of the present disclosure, any overlap between the dam portion 380 and the planarization layer 105 in the display device 300 is suppressed and prevented, so that any cracks in the passivation layer 120 and any inflow of outgassing of the uncured filler can be suppressed and prevented. Therefore, no dark spot group is generated at the outer periphery of the display area AA in the display device 300.

[0178] On the other hand, an adhesive film 330 (bonding layer) and a package substrate 140 may be provided on the passivation layer 120 .

[0179] The adhesive film 330 may be disposed between the passivation layer 120 and the encapsulation substrate 140 .

[0180] For example, the adhesive film 330 may be disposed between the passivation layer 120 and the encapsulation substrate 140 inside the dam portion 380 .

[0181] In the display device 300 , the adhesive film 330 may penetrate to the upper end of the dam portion 380 during vacuum bonding or the like.

[0182] For example, the adhesive film 330 may be cured after the dam portion 380 is cured.

[0183] In one exemplary embodiment of the present disclosure described above, the boundary between the dam portion 180 and the adhesive film 130 is substantially vertical, for example, see Figures 1 to 9 However, in yet another exemplary embodiment of the present disclosure, the boundary between the dam portion 380 and the adhesive film 330 may not be vertical during vacuum bonding due to the viscosity difference between the dam portion 380 and the adhesive film 330. Fig.10 As shown in , the adhesive film 330 may penetrate into the upper end (e.g., the upper-inner top region) of the dam 380, in which case, at the upper end of the dam 380, the boundary between the dam 380 and the adhesive film 330 may be concavely shaped toward the dam 380. This is another example of a boundary region between a dam (e.g., 380) and an adhesive film (e.g., 330) adjacent to the dam in the display device of the present disclosure. Such shaping of the dam may be provided on one or more sides of all sides of the display device.

[0184] Thus, all the advantages associated with having a separation distance between the dam and the adhesive film as well as the advantages described above with Figures 1 to 9Other relevant features are equally applicable and exist in Fig.10 in the display device.

[0185] One or more aspects of the present disclosure based on the various examples described above may provide as follows:

[0186] According to one aspect of the present disclosure, a display device is provided. The display device includes: a substrate, the substrate including a non-display area on a first side provided with a first pad unit, a third side provided with a second pad unit, and a second side opposite to the first side; a package substrate, the package substrate is arranged above the substrate and exposes the first pad unit; an adhesive film, the adhesive film is arranged between the substrate and the package substrate; a dam, the dam is arranged between the substrate and the package substrate at the outer periphery of the adhesive film; a planarization layer, the planarization layer is arranged to cover the second pad unit and is spaced apart from the dam by a first distance on the first side and the third side; an organic layer, the organic layer is arranged above the planarization layer and covers the side surface of the planarization layer on the second side; and a passivation layer, the passivation layer is arranged above the planarization layer and the organic layer and extends to the non-display area to overlap with the dam.

[0187] The planarization layer may be disposed to be spaced apart from the dam portion by a first distance at the second side.

[0188] The planarization layer may be disposed to be spaced apart from the dam portion at the second side by a second distance greater than the first distance.

[0189] The passivation layer may extend below the dam portion between the dam portion and the substrate.

[0190] An edge of the passivation layer may be disposed further outside than an outer edge of the dam portion.

[0191] The organic layer may be disposed to be spaced apart from the dam portion at the first side and the third side by a third distance greater than the first distance.

[0192] The display device may further include a cathode disposed over the organic layer, and the cathode may be disposed to be spaced apart from the dam portion by a fourth distance greater than the third distance.

[0193] The display device may further include a cover layer disposed over the cathode, and the cover layer may be disposed to cover a side surface of the cathode.

[0194] A portion of the interface between the dam portion and the adhesive film may not be vertical.

[0195] At an upper end of the dam portion, a boundary between the dam portion and the adhesive film may be recessed into the dam portion.

[0196] The display device may further include a spacer disposed in the dam portion, the spacer not overlapping the planarization layer.

[0197] A distance between one end of the planarization layer and one end of the cathode electrode at the third side may be shorter than a distance between one end of the planarization layer and one end of the cathode electrode at the first and second sides.

[0198] A distance between one end of the pixel unit and one end of the planarization layer at the third side may be shorter than a distance between one end of the pixel unit and one end of the planarization layer at the first and second sides.

[0199] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be embodied in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided only for the purpose of illustration and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto.

[0200] Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: a base substrate, the base substrate comprising a non-display area, the non-display area being arranged on a first side, a second side and a third side of the display device, wherein a first pad unit is arranged on the first side of the display device, a second pad unit is arranged on the third side of the display device, and the second side is opposite to the first side; a packaging substrate, the packaging substrate being disposed above the base substrate and exposing the first pad unit; an adhesive film disposed between the base substrate and the packaging substrate; a dam portion provided between the base substrate and the packaging substrate at an outer periphery of the adhesive film; a planarization layer, the planarization layer being arranged to cover the second pad unit in the non-display area and being spaced apart from the dam portion by a first distance at the first side and the third side of the display device; an organic layer, the organic layer being disposed above the planarization layer and covering a side surface of the planarization layer on the second side; as well as A passivation layer is disposed over the planarization layer and the organic layer and extends to the non-display area to overlap the dam portion.

2. The display device according to claim 1, wherein: The planarization layer is disposed at the second side of the display device and is spaced apart from the dam portion by the first distance.

3. The display device according to claim 1, wherein: The planarization layer is disposed at the second side of the display device and spaced apart from the dam portion by a second distance, the second distance being greater than the first distance.

4. The display device according to claim 1, wherein: The passivation layer extends below the dam portion between the dam portion and the base substrate.

5. The display device according to claim 1, wherein: The edge of the passivation layer is arranged to extend further outward than the outer edge of the dam portion.

6. The display device according to claim 1, wherein: The organic layer is disposed at the first side and the third side of the display device and spaced apart from the dam portion by a third distance, the third distance being greater than the first distance.

7. The display device according to claim 6, further comprising: a cathode, the cathode being disposed above the organic layer in the non-display area; The cathode is arranged to be spaced apart from the dam by a fourth distance, and the fourth distance is greater than the third distance.

8. The display device according to claim 7, wherein: The cathode exposes a top surface of the organic layer in the non-display area.

9. The display device according to claim 7, further comprising: a covering layer, the covering layer being disposed above the cathode, Wherein, the covering layer is arranged to cover the side surface of the cathode in the non-display area.

10. The display device according to claim 1, wherein: A portion of an interface between the dam portion and the adhesive film is not vertical.

11. The display device according to claim 10, wherein: In an upper end region of the dam portion, a boundary between the dam portion and the adhesive film is recessed toward an inner side of the dam portion.

12. The display device according to claim 1, further comprising: a spacer, the spacer being disposed in the weir portion, Wherein, the spacer does not overlap with the planarization layer.

13. The display device according to claim 1, wherein: The distance between one end of the planarization layer on the third side of the display device and the boundary between the non-display area and the display area is greater than the distance between one end of the planarization layer on the first side of the display device and the boundary between the non-display area and the display area, or is greater than the distance between one end of the planarization layer on the second side of the display device and the boundary between the non-display area and the display area.

14. The display device according to claim 1, wherein: The distance between one end of the planarization layer on the first side of the display device and the boundary between the non-display area and the display area is greater than the distance between one end of the planarization layer on the second side of the display device and the boundary between the non-display area and the display area.

15. A display device, comprising: A base substrate, the base substrate comprising a display area and a non-display area surrounding the display area, wherein the non-display area is located on a first side, a second side and a third side of the base substrate, and the first side and the second side are opposite sides; a data pad unit, wherein the data pad unit is disposed in the non-display area on the first side of the base substrate; a packaging substrate, the packaging substrate being disposed above the base substrate and covering the display area while exposing the data pad unit; a dam portion, the dam portion being provided between the base substrate and the packaging substrate in the non-display region and surrounding the display region; a planarization layer covering the display area and extending to the non-display area; and a passivation layer covering the planarization layer and disposed between the dam portion and the base substrate in the non-display area, Wherein, a first separation distance between the planarization layer and the dam portion in the non-display area on the second side of the base substrate is equal to or greater than a second separation distance between the planarization layer and the dam portion in the non-display area on the first side of the base substrate.

16. The display device according to claim 15, further comprising: a gate pad unit, wherein the gate pad unit is disposed in the non-display area on the third side of the base substrate, the third side being located between the first side and the second side of the base substrate, The first separation distance is equal to or greater than a separation distance between the planarization layer and the dam portion in the non-display region of the third side of the base substrate.

17. The display device according to claim 15, wherein: The passivation layer extends beyond the dam portion in the non-display area.

18. The display device according to claim 15, further comprising: an organic layer disposed above the planarization layer and covering a side surface of the planarization layer at the second side of the base substrate; as well as An adhesive film is disposed over the passivation layer and fills a region between the encapsulation substrate, the dam portion, and the passivation layer in the non-display region.

19. The display device according to claim 15, wherein: The distance between one end of the planarization layer on the third side of the base substrate and the boundary between the non-display area and the display area is greater than the distance between one end of the planarization layer on the first side of the base substrate and the boundary between the non-display area and the display area, or is greater than the distance between one end of the planarization layer on the second side of the base substrate and the boundary between the non-display area and the display area.

20. The display device according to claim 15, wherein: A distance between one end of the planarization layer on the first side of the base substrate and a boundary between the non-display area and the display area is greater than a distance between one end of the planarization layer on the second side of the base substrate and a boundary between the non-display area and the display area.

21. A display device, comprising: a base substrate, the base substrate comprising a display area and a non-display area surrounding the display area; A packaging substrate, the packaging substrate is arranged above the base substrate and covers the display area; a dam portion, the dam portion being disposed between the base substrate and the packaging substrate in the non-display region; a planarization layer, the planarization layer covering the display area and extending to the non-display area, the planarization layer being spaced apart from the dam portion; as well as an organic light emitting element, the organic light emitting element comprising a cathode and disposed above the planarization layer, The cathode extends to the non-display area and exposes a top surface of the planarization layer in the non-display area.

22. The display device according to claim 21, further comprising: A passivation layer covers the planarization layer and is disposed between the dam portion and the base substrate in the non-display area.

23. The display device according to claim 22, further comprising: a covering layer, the covering layer being disposed on the cathode and covering an edge region of the cathode in the non-display region, Wherein, the covering layer exposes the top surface of the planarization layer in the non-display area.

24. The display device according to claim 21, wherein: The organic light emitting element further includes an organic layer disposed on the planarization layer, and The organic layer exposes the top surface of the planarization layer in the non-display area.

25. The display device according to claim 21, further comprising: a gate pad unit, wherein the gate pad unit is disposed on the base substrate in the non-display area, Wherein, the planarization layer covers the top surface and the side surface of the gate pad unit in the non-display area.

Images