Display device
By designing grooves with a width larger than the light emitting element on the top surface of the packaging layer of the display device, the light leakage problem caused by insufficient bonding between the black matrix and the optical element layer is solved, and good brightness and display performance are achieved.
Patent Information
- Application Number
- CN202510007858.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-27
- Filing Date
- 2025-01-03
- Publication Date
- 2025-04-18
AI Technical Summary
In the manufacturing process of the light emitting element, insufficient bonding between the black matrix and the optical element layer leads to light leakage, which in turn causes insufficient brightness of the display device.
The top surface of the designed packaging layer has a first trench, and the width of the trench in the first direction is greater than the width of the light emitting element, thereby effectively solving the light leakage problem.
Through the trench design of the packaging layer, light leakage between the light emitting elements is effectively avoided, and good brightness and display performance are maintained.
Smart Images

Figure CN119855441A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a display device. Background Art
[0002] At present, when a defect occurs in the design of the manufacturing process of the light-emitting element, the barrier layer and optical adhesive layer around the light-emitting element, as well as the black matrix and optical element layer above, need to be removed, and then the optical element is reset. However, if only the optical adhesive layer is backfilled, the light-emitting element may leak light due to insufficient adhesion between the black matrix and the optical element layer, thereby causing the display device to have insufficient brightness. Therefore, it is very important to avoid the above problems. Summary of the invention
[0003] The invention provides a display device with good brightness and display performance.
[0004] The display device of the present invention comprises a substrate, a light-emitting element and a packaging layer. The light-emitting element is arranged on the substrate, the packaging layer is arranged on the substrate and covers the light-emitting element, the light-emitting element has a first width along a first direction, the packaging layer has a top surface, the top surface comprises a first groove, the first groove has a second width along the first direction, and the second width is greater than the first width.
[0005] Based on the above, in the display device of the present invention, the top surface of the encapsulation layer has a first groove, the light-emitting element has a first width along the first direction, and the first groove has a second width along the first direction D1, and the second width is greater than the first width. In this way, when the light-emitting element emits light, since the second width of the first groove is greater than the first width of the light-emitting element, the problem of light leakage in the display device is effectively solved, and good brightness and display performance are maintained. BRIEF DESCRIPTION OF THE DRAWINGS
[0006] Figures 1A to 1F is a cross-sectional schematic diagram of a partial process of a method for manufacturing a display device according to an embodiment of the present invention;
[0007] Figure 2A for Figure 1D A schematic diagram of a partial enlarged cross section of area A;
[0008] Figure 2B for Figure 1E A schematic partial enlarged top view of area A.
[0009] Explanation of symbols
[0010] 100: Display device
[0011] 110:Substrate
[0012] 120a, 120b: Electrode
[0013] 130: Light emitting element
[0014] 140: Optical element layer
[0015] BM: Black Matrix
[0016] BMT: Groove
[0017] D1: First direction
[0018] D2: Second direction
[0019] D3: Third direction
[0020] D2, D3: Depth
[0021] H1, H3, H4: Height
[0022] IJP: Encapsulation Layer
[0023] L1, Lm, Li, Lo: length
[0024] MLT: Groove
[0025] OC: Optical adhesive layer
[0026] SP: Contact hole
[0027] TC, TP: Top surface
[0028] WB: Barrier layer
[0029] W1, W2, W3, Wm, Wi, Wo: Width DETAILED DESCRIPTION
[0030] Figure 1A FIG. 1 is a cross-sectional schematic diagram of a partial process of a method for manufacturing a display device according to an embodiment of the present invention. Figure 1AAs shown, the display device 100 includes a substrate 110, and the light-emitting element 130 is formed on the substrate 110. The material of the substrate 110 can be a plate-like object with support that can reduce the bending, wrinkling and / or deformation of the substrate 110. For example, the material of the substrate 110 may include glass, quartz or other suitable materials, or a combination of the above materials, but the present invention is not limited to this. The substrate 110 can be solidified from a liquid and / or gel-like initial material. In some embodiments, the method for forming the substrate 110 includes applying a liquid and / or gel-like initial material on the substrate 110, and then using a curing process to cure the liquid and / or gel-like initial material to form the flexible substrate 110, wherein the curing process that can be used includes thermal curing, light curing, or a combination of the above curing processes, but the present invention is not limited to this. The material of the substrate 110 may include a single-layer structure of polyimide (PI), polyethylene terephthalate (PET), or other applicable materials, or a stack or mixture of at least two of the above materials, but is not limited thereto. In other words, the flexible substrate 110 may be a single-layer substrate or a multi-layer substrate formed by stacking multiple layers.
[0031] Electrodes 120a and 120b, a light emitting element 130 and a barrier layer WB are sequentially formed on the substrate 110. The optical adhesive layer OC directly contacts and covers the substrate 110, the barrier layer WB and the light emitting element 130 on the substrate 110. The optical element layer 140 is formed on the optical adhesive layer OC and overlaps the light emitting element 130 in the normal direction of the substrate 110. The black matrix BM surrounds the optical element layer 140 and contacts the optical element layer 140. In this way, when the light emitting element 130 emits light, the light is emitted by the optical element layer 140. The black matrix BM contacts the optical element layer 140, which can block light leakage and improve the light emitting efficiency of the display device 100. The optical element layer 140 can be, for example, a lens layer, such as a convex lens layer, but is not limited thereto. In this embodiment, after the display device 100 is manufactured, the substrate 110 can include a plurality of light emitting elements 130 at the same time, and the plurality of light emitting elements 130 can be arranged along the first direction D1 or the second direction D2, but is not limited thereto.
[0032] In some embodiments, the light emitting element 130 may include, for example, an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro LED or a quantum dot light emitting diode (QD, which may be, for example, QLED, QDLED), fluorescence, phosphorescence or other suitable materials, and the materials may be arranged and combined in any way, but are not limited thereto. The barrier layer WB is disposed around the light emitting element 130, and the barrier layer WB may include a multi-layer structure, such as a two-layer structure, but the present invention is not limited thereto, and may also be a single-layer structure. In addition, the optical adhesive layer OC may cover the entire surface of the substrate 110 to increase the effect of blocking water and oxygen.
[0033] Figure 1B FIG. 1 is a cross-sectional schematic diagram of a partial process of a method for manufacturing a display device according to an embodiment of the present invention. Figure 1B As shown, when the light emitting element 130 on the substrate 110 encounters a fault, a contact hole SP is first formed on the optical adhesive layer OC. The location of the contact hole SP substantially corresponds to the location of a single light emitting element 130 on the substrate 110 and the width of the contact hole SP in the first direction D1 is greater than the width of the light emitting element 130 in the first direction, but the contact hole SP overlaps the light emitting element 130 in the normal direction of the substrate 110. In some embodiments, the contact hole SP may extend to the location of another light emitting element 130 to solve the fault conditions of more than two light emitting elements 130 at the same time, but the present invention is not limited thereto. In some embodiments, the design of the contact hole SP may be patterned and distributed in a designated area, but the present invention is not limited thereto. The contact hole SP is patterned and arranged at least partially corresponding to the light emitting element 130. For example, the orthographic projection of the pattern of the contact hole SP on the substrate 110 may overlap the orthographic projection of the pattern of the light emitting element 130 on the substrate 110.
[0034] After forming the contact hole SP, the barrier layer WB and the failed light emitting element 130 are removed and another light emitting element 130 that is not failed is connected to the electrodes 120a and 120b. Figure 1C An encapsulation layer IJP is formed in the contact hole SP. The encapsulation layer IJP extends along the first direction D1 and partially covers the top surface TC of the transparent adhesive layer OC. This can increase the barrier effect of water and oxygen on the light-emitting element 130 and improve the light-emitting efficiency of the display device 100.
[0035] The encapsulation layer IJP is formed by inkjet printing technology, using tiny ink drops to accurately position the area to be sprayed. In this embodiment, the inkjet printing technology and appropriate inkjet materials are used to form the encapsulation layer IJP completely in the contact hole SP and partially cover the top surface TC of the optical adhesive layer OC. In some embodiments, the surface tension value of the inkjet material is, for example, in the range of 20 to 35 millinewtons per meter (mN / m), but is not limited thereto.
[0036] Please refer to Figure 1D The packaging layer IJP has a top surface TP, and a groove MLT and a groove BMT are formed on the top surface TP using laser etching technology. The groove BMT is arranged around the groove MLT and the groove MLT and the groove BMT are not connected to each other. The groove MLT overlaps with the light emitting element 130 along the normal direction of the substrate 110.
[0037] Next, please refer to Figure 1E and Figure 1F , a black matrix BM is formed in the groove BMT and an optical element layer 140 is formed on the groove MLT. The optical element layer 140 completely covers the groove BMT, and the optical element layer 140 overlaps with the light emitting element 130 in the normal direction of the substrate 110. The black matrix BM surrounds the optical element layer 140, and the black matrix BM can block light leakage, so that the light emitted by the light emitting element 130 is completely emitted by the optical element layer 140, thereby improving the light emitting efficiency of the display device 100.
[0038] Figure 2A for Figure 1D A schematic partial enlarged top view of area A. Figure 2B for Figure 1E A schematic partial enlarged top view of area A.
[0039] Please also refer to Figure 2A and Figure 2BThe light emitting element 130 has a width W1 along the first direction D1 and a length L1 along the second direction, and a height H3 between the bottom surface and the top surface of the light emitting element along the third direction D3. The ratio range of the length L1 and the width W1 of the light emitting element 130 is, for example, 20:40, 15:30 or 13:28. When viewed from above, the groove MLT has a width Wm along the first direction and a length Lm along the second direction D2. The width Wm of the groove MLT along the first direction is about 5 microns greater than the width W1 of the light-emitting element 130 along the first direction, that is, the width Wm of the groove MLT is greater than the width W1 of the light-emitting element 130. The depth D3 of the groove MLT can be defined between the bottom of the groove MLT and the top surface TC of the optical adhesive layer OC along the third direction D3, and the depth D3 of the groove MLT can range from 10 to 15 microns, for example. The top surface TP of the groove MLT has a height H3 relative to the top surface TC of the optical adhesive layer OC along the third direction D3, and the height H3 can range from 5 to 10 microns, for example.
[0040] Please refer to Figure 2B , from the top view direction, the groove BMT forms a U-shaped, the inner frame of the groove BMT has a width Wi along the first direction D1, and the inner frame of the groove BMT has a length Li along the second direction D2, the width Wi of the groove BMT along the first direction is about 10 microns more than the width W1 of the light emitting element 130 along the first direction, the ratio range of the length Li and the width Wi of the groove BMT is, for example, 60:60, the outer frame of the groove BMT has a width Wo along the first direction D1, and the outer frame of the groove BMT has a length Lo along the second direction D2, the ratio range of the length Lo and the width Wo of the groove BMT is, for example, 100:100~150:150, the bottom of the groove BMT is adjacent to the optical adhesive layer O C along the third direction D3 can define the depth D2 of the groove BMT, and the depth D2 of the groove BMT can range from 5 to 10 microns, for example. The top surface TP of the encapsulation layer IJP and the top surface of the substrate 110 have a height H4 along the third direction D3. In some embodiments, the sum of the depth D2, the depth D3 and the height H3 is less than the height H4 of the encapsulation layer IJP. In this way, through the design of the size parameters of any of the above-mentioned grooves BMT, grooves MLT and light-emitting elements 130, the optical element layer 140 and the black matrix BM can be well arranged on the light-emitting element 130, which effectively helps the display device 100 to improve the display performance while avoiding light leakage problems.
[0041] In summary, in the display device of the present invention, the top surface of the encapsulation layer has a first groove, the light-emitting element has a first width along the first direction, and the first groove has a second width along the first direction D1, and the second width is greater than the first width. In this way, when the light-emitting element emits light, since the second width of the first groove is greater than the first width of the light-emitting element, the problem of light leakage in the display device is effectively solved, and good brightness and display performance are maintained.
Claims
1. A display device, comprising: substrate; A light emitting element is disposed on the substrate; and A packaging layer is disposed on the substrate and covers the light emitting element. The light emitting element has a first width along a first direction, the encapsulation layer has a top surface, the top surface includes a first groove, the first groove has a second width along the first direction, and the second width is greater than the first width. 2 . The display device according to claim 1 , wherein the first groove overlaps with the light emitting element along a normal direction of the substrate.
3. The display device as claimed in claim 1, further comprising a second groove, the second groove being arranged around the first groove, the first groove having a first depth along a third direction, the second groove having a second depth along the third direction, and the second depth being smaller than the first depth. 4 . The display device as claimed in claim 1 , further comprising a transparent adhesive layer disposed on the substrate, wherein the encapsulation layer extends along the first direction and partially covers a top surface of the transparent adhesive layer. 5 . The display device according to claim 1 , further comprising a first electrode, wherein the first electrode is connected to the light emitting element, and the first electrode overlaps with the first groove along a normal direction of the substrate. 6 . The display device as claimed in claim 1 , further comprising a second groove and a black matrix, wherein the black matrix is disposed in the second groove and the second groove is disposed around the first groove. 7 . The display device according to claim 1 , further comprising an optical element layer, wherein the optical element layer is disposed on the first groove and covers the first groove. 8 . The display device according to claim 7 , wherein the optical element layer, the first groove and the light emitting element overlap along a normal direction of the substrate.