PCB detection board

Abstract

The invention relates to the technical field of radio frequency power detection, in particular to a PCB detection board which comprises a substrate provided with a first through hole and a voltage detection ring, the voltage detection ring surrounds the outer side of the first through hole, a radio frequency conductor penetrates through the first through hole to form parasitic capacitance with the voltage detection ring, and the substrate is further provided with a stamp hole or a V-shaped groove. The stamp hole or the V-shaped groove is arranged between the first through hole and the voltage detection ring; the voltage detection ring is of a single-ring structure and comprises a first wire and an electrode plate, and a stamp hole or a V-shaped groove is formed between the first wire and the electrode plate. Or the voltage detection ring comprises a plurality of nested rings, every two adjacent rings are electrically connected, and the stamp hole or the V-shaped groove is arranged between every two adjacent rings. The electrode plate can be detached through the detachable structure to change the capacitance value of the parasitic capacitor, the adaptability and universality of the detection plate are effectively improved, and the detection plate can be suitable for radio frequency conductors of various sizes.

Description

Technical Field

[0001] The invention relates to the technical field of power detection, and in particular to a PCB detection board. Background Art

[0002] When the existing RF power supply outputs power, it is necessary to collect the power value at the output end and compare it with the power value set by the user to perform PID closed-loop control. At present, the existing technology can detect current and voltage separately through the power detection PCB board, pass the RF conductor through the circular through hole of the PCB board, use the parasitic capacitance formed between the circular voltage sensing copper ring fixed on the side wall and the RF conductor to perform voltage detection, and use the current transformer located on the PCB board to perform current detection.

[0003] However, in the prior art, some voltage sensing copper rings are provided with a large gap inside, and the axis of the RF conductor may deviate from the center of the voltage sensing copper ring during the detection process, resulting in inaccurate voltage detection; although some voltage sensing copper rings are provided with insulating parts inside to fix the RF conductor and ensure the concentricity of the RF conductor and the voltage sensing copper ring, they cannot adapt to RF conductors of different sizes; in addition, the size of the existing voltage sensing copper ring is fixed, and the parasitic capacitance between it and the RF conductor cannot be changed by adjustment, so that the versatility and adaptability of the power detection PCB board are low. Summary of the invention

[0004] The purpose of the present invention is to overcome the technical problems in the prior art that the PCB detection board may not be able to ensure the concentricity of the voltage detection ring and the radio frequency conductor, cannot adapt to radio frequency conductors of different sizes, and cannot adjust the parasitic capacitance value between the voltage sensing copper ring and the radio frequency conductor, and provide a PCB detection board.

[0005] The present invention provides a PCB detection board, comprising a substrate provided with a first through hole and a voltage detection ring, a detection circuit further provided on the substrate, the voltage detection ring surrounds the outer side of the first through hole and is electrically connected to the detection circuit, a radio frequency conductor passes through the first through hole and forms a parasitic capacitor with the voltage detection ring, the detection circuit collects the voltage signal of the radio frequency conductor through the parasitic capacitor, a stamp hole or a V-shaped groove is further provided on the substrate, the stamp hole or the V-shaped groove is arranged between the first through hole and the voltage detection ring; the voltage detection ring is a single-ring structure, comprising a first wire and a second wire connected in series to form a ring, an electrode plate connected in parallel with the first wire, the stamp hole or the V-shaped groove is arranged between the first wire and the electrode plate; or the voltage detection ring comprises a plurality of nested rings, two adjacent rings are electrically connected, and the stamp hole or the V-shaped groove is arranged between two adjacent rings.

[0006] The outer side surface of the RF conductor, the inner side surface of the voltage detection ring, and the insulating medium between the RF conductor and the voltage detection ring together form a parasitic capacitor. During the voltage detection test, it was found that the capacitance values ​​of the parasitic capacitors of the voltage detection rings with different numbers of electrode plates or rings were different. The present application designs the voltage detection ring on the detection plate as a detection ring structure formed by connecting multiple detachable electrode plates, or a detection ring structure formed by multiple nested rings. The electrode plates or rings in the voltage detection ring can be disassembled and removed to reduce the number of electrode plates or rings in the voltage detection ring, thereby changing the capacitance value of the parasitic capacitor to further adapt to the power output detection of different RF power supplies. In addition, by setting a first through hole between the voltage detection ring and the first through hole, The stamp hole or V-shaped groove can also enlarge the aperture of the first through hole, so that the detection board can adapt to larger sized RF conductors; here, the detachable connection structure can be a stamp hole or V-shaped groove or other structure opened on the substrate. When it is necessary to change the parasitic capacitance between the voltage detection ring and the RF conductor, the electrode plate or ring can be removed from the voltage detection ring using a detachable structure such as a stamp hole or V-shaped groove, thereby achieving the purpose of changing the capacitance value of the parasitic capacitance. Compared with the fixed structure of the electrode plate installed on the existing detection board, which makes the electrode plate unable to be removed, the electrode plate or ring of the present application can be removed by a detachable structure to change the parasitic capacitance, which effectively improves the adaptability and versatility of the detection board and can be applicable to RF conductors of various sizes.

[0007] Preferably, the voltage detection ring is a single-ring structure, including a plurality of electrode plates, wherein the plurality of electrode plates are located outside the first through hole and are arranged along the circumference of the first through hole; the second wire is connected between two adjacent electrode plates; the substrate is provided with a second through hole on one side of the electrode plate, and the stamp hole or the V-shaped groove is provided on the other side of the electrode plate.

[0008] The voltage detection ring can be a single-ring structure, which can be formed by multiple circumferentially arranged electrode plates, a second wire connected in series between the electrode plates, and a first wire connected in parallel with the electrode plates. The electrode plates can be installed in the voltage detection ring through a variety of detachable structures, and the capacitance value of the parasitic capacitance can be changed by removing the electrode plates from the voltage detection ring. After the electrode plates are removed, the second wire and the first wire can maintain the conduction of the circuit on the voltage detection ring; here, the electrode plates can be in a variety of shapes, such as arc plates, flat plates, etc., wherein the arc plates can be arc plates with the same diameter as the voltage detection ring, or arc plates with different diameters than the voltage detection ring.

[0009] Preferably, the stamp holes are arranged along the electrode plate; or the V-shaped grooves are parallel to the electrode plate.

[0010] Here, the stamp hole can be formed by arranging multiple small holes, and the setting direction of the stamp hole and the V-shaped groove can be arranged along the electrode plate. When the electrode plate is disassembled, the electrode plate can be broken off along the position of the stamp hole or the V-shaped groove, thereby reducing the number of electrode plates in the voltage detection ring to change the parasitic capacitance.

[0011] Preferably, the voltage detection ring is a multi-ring structure, including a plurality of rings, the plurality of rings all surround the first through hole and are sequentially sleeved from the inside to the outside, and two adjacent rings are connected by a third wire.

[0012] The voltage detection ring can also be a multi-ring structure, that is, it is composed of multiple ring structures nested together, and the multiple rings are separated by a substrate. A detachable structure is set on the substrate to facilitate the removal of the ring structure from the inside to the outside, that is, the number of ring layers is changed to change the capacitance value of the parasitic capacitor. In addition, after removing the inner ring, the inner diameter of the first through hole can also be changed, which can adapt to RF conductors with larger diameters.

[0013] Preferably, the outermost ring is electrically connected to the detection circuit via a third wire.

[0014] Preferably, the ring includes a plurality of electrode plates, which are located outside the first through hole and arranged along the circumference of the first through hole. The ring also includes a second wire and a first wire, the second wire is connected between two adjacent electrode plates, and the two ends of the first wire are respectively connected to two adjacent second wires; the substrate is provided with a second through hole on one side of the electrode plate, and the stamp hole or the V-shaped groove is provided on the other side of the electrode plate.

[0015] Each ring in the multi-layer ring structure can also be formed into a petal-shaped electrode plate structure similar to the single-ring structure, that is, multiple electrode plates are arranged on the ring, and the parasitic capacitance value between each ring and the RF conductor can be adjusted by changing the number of electrode plates on each ring.

[0016] Preferably, a capacitor connected in series with the voltage detection loop is provided on the substrate.

[0017] A parasitic capacitor is formed between the voltage detection loop and the RF conductor. The capacitor is connected in series with the parasitic capacitor and divides the voltage. During voltage detection, the voltage value of the RF current flowing through the RF conductor is calculated by detecting the voltage of the series capacitor.

[0018] Preferably, it further comprises a current transformer arranged on the substrate, and the current transformer is located outside the voltage detection loop.

[0019] The current transformer generates an induced current by means of magnetic field coupling, and the current sampling signal is obtained by collecting the current signals at both ends of the current transformer.

[0020] Preferably, a shielding ring is provided between the current transformer and the voltage detection ring.

[0021] The shielding ring is mainly used to reduce the mutual influence between the current transformer and the voltage detection loop on the substrate.

[0022] Preferably, the first through hole is located at the center of the voltage detection ring, and the radio frequency conductor can be matched with the first through hole.

[0023] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a PCB detection board. On the one hand, by setting a stamp hole or a V-shaped groove on the substrate, the aperture size of the first through hole can be easily changed by using a detachable structure such as the stamp hole or the V-shaped groove to adapt to radio frequency conductors of different sizes, which effectively improves the adaptability and versatility of the PCB detection board and can be applied to current and voltage detection of radio frequency conductors of various sizes. On the other hand, the voltage detection ring on the detection board is designed as a detection ring structure formed by connecting a plurality of detachable electrode plates or rings, and the electrode plates or ring structures in the voltage detection ring can be disassembled and removed to reduce the number of electrode plates or rings in the voltage detection ring, thereby changing the capacitance value of the parasitic capacitance formed between the voltage detection ring and the radio frequency conductor, so as to further adapt to the power output detection of different radio frequency power supplies. Here, the detachable connection structure can be a structure such as a stamp hole or a V-groove. When it is necessary to change the parasitic capacitance between the voltage detection ring and the RF conductor, the detachable structure such as the stamp hole or the V-groove can be used to remove the electrode plate or ring from the voltage detection ring, thereby achieving the purpose of changing the capacitance value of the parasitic capacitance. Compared with the electrode plate that cannot be removed installed on the existing detection board, the electrode plate or ring structure of the present application can be removed through the detachable structure to change the parasitic capacitance, which effectively improves the adaptability and versatility of the detection board and can be applicable to RF conductors of various sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic structural diagram of a first voltage detection loop provided on a PCB detection board of the present invention.

[0025] Figure 2 This is a schematic diagram of the detachable structure of the stamp hole corresponding to the first voltage detection ring.

[0026] Figure 3 This is a schematic diagram of the detachable V-groove structure corresponding to the first type of voltage detection ring.

[0027] Figure 4 for Figure 3 Cross-sectional view at “AA” in the figure.

[0028] Figure 5 for Figure 3 Cross-sectional view at "BB" in the figure.

[0029] Figure 6 This is a three-dimensional schematic diagram of the first voltage detection loop.

[0030] Figure 7 It is a schematic structural diagram of a second voltage detection loop provided on the PCB detection board of the present invention.

[0031] Figure 8 This is a schematic diagram of the detachable structure of the stamp hole corresponding to the second voltage detection ring.

[0032] Fig. 9 It is a schematic structural diagram of a third voltage detection loop provided on the PCB detection board of the present invention.

[0033] Fig.10 for Fig. 9 A partial enlarged view of point “C” in the middle.

[0034] Markings in the figure: 1. Substrate, 11. First through hole, 12. Stamp hole, 13. V-shaped groove, 14. Second through hole, 2. Voltage detection ring, 21. Electrode plate, 22. Second wire, 23. First wire, 24. Ring, 25. Third wire, 3. Radio frequency conductor, 4. Capacitor, 5. Current transformer, 6. Detection circuit. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below in conjunction with specific embodiments. However, this should not be understood as the scope of the above subject matter of the present invention being limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention.

[0036] Unless otherwise specified, in the description of the specific embodiments of the present invention, the terms indicating the orientation or position relationship such as "up", "down", "left", "right", "center", "inside", "outside", etc. are all expressions based on the orientation or position relationship shown in the drawings, or are the orientation or position relationship when the invented product / equipment / device is usually used. These terms of orientation or position relationship are only for the convenience of describing the scheme of the present invention or simplifying the description in the specific embodiments, so as to facilitate the technicians to quickly understand the scheme, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific position relationship, and therefore cannot be understood as a limitation on the present invention.

[0037] In addition, if the terms "horizontal", "vertical", "overhanging", "parallel" and the like appear, it does not mean that the corresponding devices / components / elements are required to be absolutely horizontal or vertical or overhanging or parallel, but may be slightly tilted or have deviations. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but may be slightly tilted. Alternatively, it can be simplified to mean that the corresponding devices / components / elements are set in directions such as "horizontal", "vertical", "overhanging", "parallel", etc., and can have an error / deviation of ±10% relative to the corresponding direction setting, more preferably an error / deviation within ±8%, more preferably an error / deviation within ±6%, more preferably an error / deviation within ±5%, and more preferably an error / deviation within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its role in the scheme of the present invention.

[0038] In addition, the expressions “first”, “second”, “third”, etc., which appear in the terms, are merely used to distinguish the description of the same or similar components and should not be understood as emphasizing or implying the relative importance of specific components.

[0039] In addition, in the description of the embodiments of the present invention, "several", "plurality" and "a number" represent at least 2. It can be any number such as 2, 3, 4, 5, 6, 7, 8, 9, and even more than 9.

[0040] In addition, in the description of the technical solution of the present invention, unless otherwise clearly specified / defined / restricted, the terms "set", "install", "connect", "connected", "provided with", "laid", and "arranged" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, and can be welding, riveting, bolting, threading, and other commonly used connection means in the field. This connection can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements.

[0041] Example This embodiment provides a PCB detection board.

[0042] Figure 1 It is a structural schematic diagram of a first voltage detection ring provided on a PCB detection board of the present invention; Figure 2 It is a schematic diagram of the detachable structure of the stamp hole corresponding to the first voltage detection ring; Figure 3 This is a schematic diagram of the V-groove detachable structure corresponding to the first voltage detection ring; Figure 4 for Figure 3 Cross-sectional view at "AA" in the figure; Figure 5 for Figure 3 Cross-section at "BB" in the middle; Figure 6 is a three-dimensional schematic diagram of a first voltage detection loop; Figure 7 It is a structural schematic diagram of a second voltage detection ring provided on a PCB detection board of the present invention; Figure 8 It is a schematic diagram of the detachable structure of the stamp hole corresponding to the second voltage detection ring; Fig. 9 It is a structural schematic diagram of a third voltage detection ring provided on the PCB detection board of the present invention; Fig.10 for Fig. 9 A partial enlarged view of point “C” in the middle.

[0043] like Figure 1 As shown, the PCB detection board includes a substrate 1 and a voltage detection ring 2 connected to the substrate 1. The substrate 1 is provided with a first through hole 11 concentric with the voltage detection ring 2. The RF conductor 3 passes through the first through hole 11 and forms a parasitic capacitor with the voltage detection ring 2. In order to make the PCB detection board adaptable to RF conductors 3 of different sizes and to make the concentricity of the RF conductor 3 and the voltage detection ring 2 higher, a plurality of groups of stamp holes 12 arranged in an annular shape are provided on the substrate 1 between the first through hole 11 and the voltage detection ring 2. The substrate 1 can be broken along a group of stamp holes 12 to expand the aperture of the first through hole 11 so that the PCB detection board can adapt to RF conductors of different sizes. Similarly, the above function can also be achieved by providing a plurality of groups of annular V-grooves.

[0044] like Figures 1 to 6 The figure shows the first voltage detection ring 2 of the present embodiment and the PCB detection board installed with the first voltage detection ring 2. The first voltage detection ring 2 includes a plurality of circumferentially arranged electrode plates 21. The plurality of electrode plates 21 are located outside the first through hole 11 and are arranged circumferentially along the first through hole 11. A second wire 22 is connected between two adjacent electrode plates 21. That is, the electrode plates 21 and the second wire 22 are alternately arranged circumferentially of the voltage detection ring 2. The electrode plates 21 and the second wire 22 can form a complete annular structure after being circumferentially connected. The voltage detection ring 2 can be arranged on the substrate 1. The substrate 1 is provided with a first through hole 11. The first through hole 11 is located in the voltage detection ring 2. That is, the voltage detection ring 2 Surrounding the outside of the first through hole 11, the voltage detection ring 2 is also electrically connected to the detection circuit 6 arranged on the substrate 1; the RF conductor 3 and the voltage detection ring 2 can be separated by the substrate 1 or the air, and a parasitic capacitor can be formed between the RF conductor 3 and the voltage detection ring 2; a first wire 23 is connected in parallel to one side of the electrode plate 21, and the first wire 23 is located outside the parasitic capacitor, that is, the first wire 23 is not between the RF conductor 3 and the electrode plate 21, but is located on the other side of the electrode plate 21 relative to the RF conductor 3, that is, the outside of the ring structure formed by connecting multiple electrode plates 21 shown in the figure, and the two ends of the first wire 23 are respectively connected to the two second wires 22 on both sides of the parallel electrode plate 21.

[0045] Specifically, the shape of the electrode plate 21 can be an arc-shaped plate as shown in the figure, and the inner arc surface of the arc-shaped plate faces the center of the voltage detection ring 2, that is, the position where the RF conductor 3 is inserted, and the first wire 23 is connected in parallel to one side of the outer arc surface of the arc-shaped plate, and the first wire 23 can also be formed into an arc-shaped structure concentric with the electrode plate 21; of course, the electrode plate 21 can also be other shapes, such as a flat plate, and the plate surface on one side of the flat plate faces the center of the voltage detection ring 2, and the first wire 23 can be formed into a broken line shape and connected in parallel to the other side of the flat plate; or the electrode plate 21 can also be an arc-shaped plate with the same inner diameter as the voltage detection ring 2, and when the electrode plate 21 is an arc-shaped plate, the direction of the arc-shaped plate can also be opposite to that shown in the figure, that is, the outer arc surface faces the center of the voltage detection ring 2, and the first wire 23 is connected in parallel to one side of the inner arc surface of the arc plate; the present invention does not specifically limit the shape of the electrode plate 21 and the first wire 23, the direction of the plate surfaces on both sides of the electrode plate 21, and the number of electrode plates 21 in the voltage detection ring 2.

[0046] In this embodiment, if Figures 1 to 6 The first voltage detection ring 2 shown in the figure is arranged on the substrate 1, wherein the electrode plate 21 and the first parallel wire 23 can be insulated by the substrate 1, and a stamp hole 12 is opened on the substrate 1 between the electrode plate 21 and the first parallel wire 23, and the stamp hole 12 can be arranged along the electrode plate 21 and the stamp hole is close to the electrode plate 21, that is, the connection line formed by the multiple small holes in the stamp hole 12 is parallel to the plate surface of the electrode plate 21. For example, the electrode plate 21 in the figure is an arc plate, and the stamp hole 12 is arranged to form a connection line with the arc. When it is necessary to reduce the number of electrode plates 21 in the voltage detection ring 2 to change the parasitic capacitance, the substrate 1 between the electrode plate 21 and the first wire 23 is simply broken along the corresponding stamp hole 12 to remove the electrode plate 21 from the voltage detection ring 2 as a whole; of course, the arrangement shape of the stamp holes 12 is also related to the shape of the electrode plate 21. If the electrode plate 21 is a flat plate, the connecting line between the stamp holes 12 can also be formed as a straight line parallel to the flat plate. Here, the present invention does not specifically limit the arrangement of the stamp holes.

[0047] The detachable connection structure of the electrode plate 21 may also be other than the stamp hole 12. Figure 3In the V-groove structure shown in the figure, the V-groove 13 can be opened at the same position on the substrate 1 as the stamp hole 12. It can be understood that the thickness of the substrate 1 is reduced at the position of the V-groove 13. When the substrate 1 on both sides of the V-groove 13 is bent, the stress can be concentrated at the V-groove 13, so that the position where the substrate 1 is disconnected is formed in the V-groove 13. Through the V-groove 13 structure, it is also convenient to remove the electrode plate 21 to change the parasitic capacitance; after the electrode plate 21 is removed through the detachable structure of the stamp hole or the V-groove 13, the first wire 23 connected in parallel with the electrode plate 21 can maintain the connection with the second wire 22, and the annular electrical path of the voltage detection ring 2 can be maintained for voltage detection.

[0048] A second through hole 14 is formed on the substrate 1 on the other side of the electrode plate 21 relative to the stamp hole 12 . The second through hole 14 can leave space for the electrode plate 21 to be broken off along the stamp hole 12 .

[0049] like Figure 7 and Figure 8 Shown in the figure are the second voltage detection ring of this embodiment and the PCB detection board installed with the second voltage detection ring. The second voltage detection ring includes a plurality of rings 24 which are sequentially arranged from the inside to the outside. The plurality of rings 24 can be connected by a third wire 25, and the plurality of rings 24 are insulated by the substrate 1. The RF conductor 3 can be passed through the first through hole 11 and located in the innermost ring 24, and a distance is maintained between the rings 24 to generate parasitic capacitance.

[0050] Specifically, a corresponding detachable structure may also be provided on the substrate 1 between the multiple rings 24 so that the ring 24 can be removed from the voltage detection ring 2. For example, a plurality of stamp holes 12 arranged in a ring shape and surrounding the first through hole 11 may be provided on the substrate 1 between the multiple rings 24. The substrate 1 may be broken and removed at the stamp hole 12 of any layer. If the stamp hole 12 between the innermost ring 24 and the first through hole 11 is broken, the aperture of the first through hole 11 can be enlarged, and a radio frequency conductor 3 with a larger diameter can be adapted. If the stamp hole 12 between the multiple rings 24 is broken, the inner ring 24 can be separated from the outer ring 24, that is, the inner ring 24 can be removed from the voltage detection ring 2, thereby achieving the expansion of the aperture of the first through hole 11 while changing the distance between the radio frequency conductor 3 and the closest ring 24, thereby changing the capacitance value of the parasitic capacitor.

[0051] Of course, the multi-layer stamp holes 12 opened between the multiple rings 24 can also be replaced by a V-groove structure (not shown in the figure). Here, the V-groove can also be used as another detachable structure to facilitate the disassembly of the ring 24 and the substrate 1 in the voltage detection ring 2. The opening position of the V-groove and the layout shape on the substrate 1 are consistent with the above-mentioned multi-layer stamp holes 12. The specific structure of the V-groove and the principle of disconnection and disassembly here are consistent with the V-groove in the first voltage detection ring 2, and will not be described in detail here.

[0052] like Fig. 9 and Fig.10 The third voltage detection ring of this embodiment and the PCB detection board installed with the third voltage detection ring are shown in the figure. The third voltage detection ring includes a plurality of rings 24 sleeved together, and a plurality of electrode plates 21 ( Fig. 9 In the embodiment, only the electrode plate 21 is arranged on the outermost ring 24, and the plurality of electrode plates 21 are located outside the first through hole 11 and arranged along the circumference of the first through hole 11. It can be understood that the third voltage detection ring scheme is formed by combining the first voltage detection ring and the second voltage detection ring. The plurality of electrode plates 21 and the plurality of rings 24 in the third voltage detection ring are correspondingly provided with a detachable structure, for example, a stamp hole is opened on the substrate 1 between the electrode plate 21 and the first parallel wire 23, and a multi-layer stamp hole is opened between the plurality of rings 24, which can facilitate the electrode plate 21 to be respectively , ring 24 and substrate 1 can be removed to change the parasitic capacitance. Similarly, the stamp hole structure can be replaced by a V-groove structure, which can also achieve convenient removal of the electrode plate 21, ring 24 and substrate 1 to change the parasitic capacitance. In the third voltage detection ring scheme, the change of parasitic capacitance can be achieved in the following ways, such as removing only the electrode plate 21 on the ring 24, or removing the ring 24 with the electrode plate 21 as a whole, or removing only the substrate 1 in the innermost ring 24, etc. The specific removal method can be selected as needed in the actual voltage detection operation, and the present invention does not make specific limitations on this.

[0053] In this embodiment, if Figure 1 , Figure 7 and Fig. 9 In the three PCB detection boards shown in the figure, a capacitor 4 connected in series with the voltage detection ring 2 can also be set on the substrate 1, and a parasitic capacitor is formed between the voltage detection ring 2 and the RF conductor 3. The capacitor 4 is connected in series with the parasitic capacitor and divides the voltage. In the actual detection process, the actual voltage of the RF conductor is calculated by detecting the voltage value of the series capacitor; in addition, a current transformer 5 can be set on the substrate 1. The current transformer 5 can be a ring structure and is wound outside the voltage detection ring 2. The current transformer 5 can generate an induced current by magnetic field coupling, and the current detection can be performed by collecting the induced current signal at both ends of the current transformer 5 to obtain a current sampling signal.

[0054] A shielding ring (not shown in the figure) may be further provided between the current transformer 5 and the voltage detection ring 2 , and the shielding ring may isolate the current signal on the current transformer 5 and the voltage signal on the voltage detection ring 2 from each other to avoid crosstalk.

[0055] In summary, the PCB detection board of the present invention can be provided with a stamp hole or a V-shaped groove on the substrate, and the aperture size of the first through hole can be changed by means of a detachable structure such as the stamp hole or the V-shaped groove to adapt to RF conductors of different sizes and sizes, thereby effectively improving the adaptability and versatility of the PCB detection board, and can be applied to current and voltage detection of RF conductors of various sizes; at the same time, the voltage detection ring on the detection board can be designed as a detection ring structure formed by connecting a plurality of detachable electrode plates or rings, and the electrode plates or ring structures in the voltage detection ring can be disassembled and removed to reduce the number of electrode plates or rings in the voltage detection ring, thereby changing the parasitic voltage formed between the voltage detection ring and the RF conductor. The capacitance value of the capacitor can be further adapted to the power output detection of different RF power supplies; here, the detachable connection structure can be a structure such as a stamp hole or a V-groove. When the parasitic capacitance between the voltage detection ring and the RF conductor needs to be changed, the detachable structure such as the stamp hole or the V-groove can be conveniently used to remove the electrode plate or ring from the voltage detection ring, thereby achieving the purpose of changing the capacitance value of the parasitic capacitance. Compared with the fixed structure of the electrode plate installed on the existing detection board, which makes the electrode plate unable to be removed, the electrode plate or ring structure of the present application can be disassembled through the detachable structure to change the parasitic capacitance, which effectively improves the adaptability and versatility of the detection board, and can be applicable to RF conductors of various sizes.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A PCB detection board, comprising a substrate (1) provided with a first through hole (11) and a voltage detection ring (2), the substrate (1) further provided with a detection circuit (6), the voltage detection ring (2) surrounding the outside of the first through hole (11) and being electrically connected to the detection circuit (6), a radio frequency conductor (3) passing through the first through hole (11) and forming a parasitic capacitance with the voltage detection ring (2), the detection circuit (6) collecting a voltage signal of the radio frequency conductor (3) through the parasitic capacitance, characterized in that: The substrate (1) is also provided with a stamp hole (12) or a V-shaped groove (13), and the stamp hole (12) or the V-shaped groove (13) is arranged between the first through hole (11) and the voltage detection ring (2); The voltage detection ring (2) is a single-ring structure, comprising a first wire (23) and a second wire (22) connected in series to form a ring, an electrode plate (21) connected in parallel with the first wire (23), and the stamp hole (12) or the V-shaped groove (13) is provided between the first wire (23) and the electrode plate (21); Alternatively, the voltage detection ring (2) comprises a plurality of nested rings (24), two adjacent rings (24) are electrically connected, and the stamp hole (12) or the V-shaped groove (13) is arranged between two adjacent rings (24).

2. The PCB detection board according to claim 1, characterized in that: The voltage detection ring (2) is a single-ring structure, comprising a plurality of electrode plates (21), wherein the plurality of electrode plates (21) are located outside the first through hole (11) and are arranged along the circumference of the first through hole (11); the second wire (22) is connected between two adjacent electrode plates (21); the substrate (1) is provided with a second through hole (14) on one side of the electrode plate (21), and the stamp hole (12) or the V-shaped groove (13) is provided on the other side of the electrode plate (21).

3. The PCB detection board according to claim 2, characterized in that: The stamp holes (12) are arranged along the electrode plate (21); or the V-shaped grooves (13) are parallel to the electrode plate (21).

4. The PCB detection board according to claim 1, characterized in that: The voltage detection ring (2) is a multi-ring structure, comprising a plurality of rings (24), wherein the plurality of rings (24) surround the first through hole (11) and are sequentially sleeved from the inside to the outside, and two adjacent rings (24) are connected via a third wire (25).

5. The PCB detection board according to claim 4, characterized in that: The outermost ring (24) is electrically connected to the detection circuit (6) via a third wire (25).

6. The PCB detection board according to claim 4, characterized in that: The ring (24) comprises a plurality of electrode plates (21), the plurality of electrode plates (21) being located outside the first through hole (11) and arranged along the circumference of the first through hole (11), the ring (24) further comprising a second wire (22) and the first wire (23), the second wire (22) being connected between two adjacent electrode plates (21), and the two ends of the first wire (23) being respectively connected to two adjacent second wires (22); the substrate (1) is provided with a second through hole (14) on one side of the electrode plate (21), and is provided with the stamp hole (12) or the V-shaped groove (13) on the other side of the electrode plate (21).

7. The PCB detection board according to any one of claims 1 to 6, characterized in that: The substrate (1) is provided with a capacitor (4) which is connected in series with the voltage detection ring (2).

8. The PCB detection board according to any one of claims 1 to 6, characterized in that: It also comprises a current transformer (5) arranged on the substrate (1), wherein the current transformer (5) is located outside the voltage detection loop (2).

9. The PCB detection board according to claim 8, characterized in that: A shielding ring is provided between the current transformer (5) and the voltage detection ring (2).

10. The PCB detection board according to any one of claims 1 to 6, characterized in that: The first through hole (11) is located at the center of the voltage detection ring (2), and the radio frequency conductor (3) is capable of matching with the first through hole (11).

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