Display device and method for manufacturing display device

Abstract

The invention relates to a display device and a method for manufacturing the same. The display device includes a display panel, a coating window disposed on the display panel, and a functional layer disposed on the coating window and formed of a thermosetting coating solution. The functional layer may include an ultraviolet (UV) absorber in an amount of about 1 wt% to about 10 wt% relative to a total weight of the functional layer, and the UV absorber may include an organic material.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0141000, filed on October 20, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present invention relates to a display device, and more particularly, to a display device including a coated window and a method for manufacturing the display device. Background Art

[0004] Various display devices for multimedia devices such as televisions, mobile phones, tablet computers, and game consoles are being developed. The display device may include a display panel that generates images and videos and a window member for protecting the display panel. The window member disposed on the uppermost portion of the display device should be configured to maintain reliability in consideration of the use environment of the display device. Summary of the invention

[0005] The present invention provides a display device having improved reliability and a method for manufacturing the display device.

[0006] An embodiment of the present invention provides a display device, comprising: a display panel; a coating window disposed on the display panel; and a functional layer disposed on the coating window and formed of a thermosetting coating solution, wherein the functional layer comprises an ultraviolet (UV) absorber, the amount of the UV absorber is approximately 1 wt % to approximately 10 wt % relative to the total weight of the functional layer, and the UV absorber comprises an organic material.

[0007] In an embodiment, the functional layer may further include a base resin and a fluorine-containing compound.

[0008] In an embodiment, the base resin may include an acrylic resin.

[0009] In an embodiment, the UV absorber may include at least one of stilbene derivatives, phenylene vinyl derivatives, benzoxazole derivatives, benzotriazole derivatives, benzophenone derivatives, and triazine derivatives.

[0010] In an embodiment, the functional layer may have a pencil hardness of about 6H or higher.

[0011] In an embodiment, the functional layer may have a yellowness index of about 1 or less.

[0012] In an embodiment, the functional layer may have a transmittance of about 90% or more with respect to light having a visible light wavelength range.

[0013] In an embodiment, the functional layer may be a single layer.

[0014] In an embodiment, the functional layer may be disposed directly on the coated window.

[0015] In an embodiment, the coated window may include an epoxy-based resin.

[0016] In an embodiment of the present invention, a method for manufacturing a display device includes preparing a display panel, forming a coating window on the display panel, and forming a functional layer by disposing a thermosetting coating solution on the coating window, wherein the thermosetting coating solution includes a UV absorber, the amount of the UV absorber is about 1wt% to about 10wt% relative to the total weight of the thermosetting coating solution, and the UV absorber includes an organic material.

[0017] In an embodiment, the thermosetting coating solution may be disposed directly on the coating window.

[0018] In an embodiment, the thermosetting coating solution may further include a base resin and a fluorine-containing compound.

[0019] In an embodiment, the base resin may include an acrylic resin.

[0020] In an embodiment, the UV absorber may include at least one of stilbene derivatives, phenylene vinyl derivatives, benzoxazole derivatives, benzotriazole derivatives, benzophenone derivatives, and triazine derivatives.

[0021] In an embodiment, forming the functional layer may include: forming a preliminary functional layer by disposing a thermosetting coating solution on the coating window; and forming the functional layer by curing the preliminary functional layer, wherein the curing of the preliminary functional layer is performed at a temperature of about 20°C to about 80°C.

[0022] In an embodiment, in the formation of the preliminary functional layer, the curing rate may be about 90% or more.

[0023] In an embodiment, the thermosetting coating solution may be provided by roller coating, screen printing coating, spray coating, or slot coating.

[0024] In an embodiment, the coating window may be formed by disposing a coating composition on the display panel.

[0025] In an embodiment, the coating composition may include an epoxy-based resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present invention and together with the description serve to explain the principles of the present invention. In the drawings:

[0027] Figure 1 is a perspective view showing a display device according to an embodiment;

[0028] Figure 2 is an exploded perspective view of a display device according to an embodiment;

[0029] Figure 3 is a diagram showing the Figure 2 A cross-sectional view of a portion of a window member of a display device and a display module corresponding to line II';

[0030] Figure 4 is a cross-sectional view showing a portion (eg, a display module) of a display device according to an embodiment;

[0031] Figure 5 is a flowchart illustrating a method for manufacturing a display device according to an embodiment;

[0032] Figure 6 is a view schematically showing steps of manufacturing a display device according to an embodiment;

[0033] Figure 7 is a view schematically showing steps of manufacturing a display device according to an embodiment;

[0034] Figure 8 is a view schematically showing steps of manufacturing a display device according to an embodiment; and

[0035] Fig. 9 2 is a view schematically showing steps of manufacturing a display device according to an embodiment. DETAILED DESCRIPTION

[0036] The present invention can be implemented in various modifications and has various forms, and specific embodiments are shown in the drawings and described in detail in the text. However, it should be understood that the present invention is not intended to be limited to the specific form disclosed, but on the contrary, it is intended to cover all modifications, equivalents and substitutions that fall within the spirit and scope of the present invention.

[0037] In the present specification, it will be understood that when an element (or region, layer, part, etc.) is referred to as being "on", "connected to" or "coupled to" another element, the element may be directly disposed / connected / coupled to the other element or intervening elements may be disposed therebetween.

[0038] The same reference numerals or symbols always indicate the same elements. In addition, in the accompanying drawings, the thickness, proportion and size of the elements may be exaggerated for the effective description of the technical content. The term "and / or" includes any and all combinations of one or more related listed elements.

[0039] Although the terms "first", "second", etc. can be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the present invention, a first element can be referred to as a second element, and similarly, a second element can also be referred to as a first element. Unless the context clearly indicates otherwise, the singular also includes the plural.

[0040] In addition, terms such as "below", "lower", "above", and "upper" may be used in description to describe the relationship of one element to another element shown in the drawings. It will be understood that these terms have relative concepts and are described based on the orientations depicted in the drawings.

[0041] It will be understood that when used in this specification, the terms “include” or “comprises” indicate the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

[0042] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those of ordinary skill in the art to which the present disclosure belongs. In addition, unless explicitly defined as such herein, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formalized sense.

[0043] Hereinafter, a display device according to an embodiment will be described with reference to the accompanying drawings. Figure 1 is a perspective view showing a display device DD according to the embodiment. Figure 2 is an exploded perspective view of a display device DD according to an embodiment.

[0044] according to Figure 1 In the embodiment shown in , the display device DD can be activated in response to an electrical signal. For example, the display device DD can be a personal computer (e.g., a laptop computer), a personal digital terminal, a game console, a portable electronic device, a television, a monitor, an outdoor billboard, a car navigation unit, or a wearable device, but the present invention is not limited thereto. Figure 1 In FIG. 8 , the display device DD is exemplarily shown as a mobile phone.

[0045] According to an embodiment, the display device DD may display an image IM through a display area DA. The display area DA may include a flat surface defined by a first direction axis DR1 and a second direction axis DR2. The display area DA may include a curved surface bent from at least one side of the flat surface defined by the first direction axis DR1 and the second direction axis DR2. Figure 1 The display device DD of the embodiment shown in FIG. 1 includes two curved surfaces, which are respectively bent from both sides of a flat surface defined by the first direction axis DR1 and the second direction axis DR2. However, this is presented as an example, and the shape of the display area DA is not limited thereto. For example, in other embodiments, the display area DA may include only a flat surface defined by the first direction axis DR1 and the second direction axis DR2, or may further include at least two curved surfaces, for example, four curved surfaces respectively bent from four side surfaces of the flat surface defined by the first direction axis DR1 and the second direction axis DR2.

[0046] According to an embodiment, the display device DD may be flexible. The term "flexible" refers to having a bendable property, and may include all completely foldable structures and structures that can be bent to a few nanometers. For example, the display device DD may be foldable. In addition, the display device DD may be rigid.

[0047] In an embodiment, the non-display area NDA may be provided adjacent to the display area DA. The non-display area NDA may surround the display area DA. Accordingly, the shape of the display area DA may be substantially defined by the non-display area NDA. However, this is illustrative. The non-display area NDA may be provided adjacent to only one side of the display area DA, or may be omitted. The display area DA may be provided to have various shapes and is not limited to any one embodiment.

[0048] exist Figure 1 In the following drawings, the first direction axis DR1 to the third direction axis DR3 are shown, and the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 described in this document may have relative concepts and may therefore be changed to other directions. In addition, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be referred to as the first direction, the second direction, and the third direction, and may be represented by the same figure mark or symbol. In this specification, the first direction axis DR1 and the second direction axis DR2 may be orthogonal to each other, and the third direction axis DR3 may be parallel to the normal direction of the plane defined by the first direction axis DR1 and the second direction axis DR2.

[0049] The thickness direction of the display device DD can be indicated as being parallel to the third directional axis DR3, which is the normal direction of the plane defined by the first directional axis DR1 and the second directional axis DR2. In the present specification, the front surface (or upper surface, top surface, upper side) and the rear surface (or lower surface, bottom surface, lower side) of each component constituting the display device DD can be defined based on the third directional axis DR3. In the present specification, the direction in which the third directional axis DR3 extends is parallel to the thickness direction. The front surface (or upper surface, top surface, upper side) refers to the surface adjacent to the surface on which the image IM is displayed (or the direction approaching it), and the rear surface (or lower surface, bottom surface, lower side) refers to the surface spaced apart from the surface on which the image IM is displayed (or the direction away from it).

[0050] In the examples and with reference to Figure 2 The display device DD may include a display module DM and a window member WP disposed on the display module DM. In addition, the display device DD may further include an optical layer RPL disposed between the display module DM and the window member WP and a housing HAU accommodating the display module DM.

[0051] In an embodiment, Figure 1 and Figure 2 In the display device DD shown in , the window member WP and the housing HAU can be coupled together to constitute the appearance of the display device DD. The housing HAU can be arranged below the display module DM. The housing HAU may include a material with relatively high rigidity. For example, the housing HAU may include a plurality of frames and / or plates composed of glass, plastic or metal. The housing HAU may provide a predetermined accommodating space. The display module DM can be accommodated inside the accommodating space and protected from external impacts.

[0052] In an embodiment, the display module DM may be activated in response to an electrical signal. The display module DM may be activated to display a display area DA (see Figure 1 ) displays the image IM (see Figure 1 ). An active area AA-DM and a peripheral area NAA-DM may be defined in the display module DM. The active area AA-DM may be activated in response to an electrical signal. The peripheral area NAA-DM may be positioned adjacent to at least one side of the active area AA-DM. A circuit or wiring for driving the active area AA-DM may be disposed in the peripheral area NAA-DM.

[0053] In an embodiment, the optical layer RPL may be an anti-reflection layer that reduces the reflectivity of external light incident from the outside of the display module DM. The optical layer RPL may be formed on the display module DM by a continuous process. The optical layer RPL may include a polarizer or a color filter layer. For example, the optical layer RPL may include at least one of a retarder, a polarizer, a polarizing film, and a polarizing filter. In another embodiment, the optical layer RPL may include a plurality of color filters arranged in a predetermined arrangement. For example, the optical layer RPL may include a plurality of color filters included in the display panel DP (see FIG. 1 ) described later. Figure 3 and Figure 4 ) to arrange the color filters according to the emission colors of the pixels in the optical layer. In addition, the optical layer RPL may further include a black matrix disposed adjacent to the color filters. Different from that shown, in another embodiment, the optical layer RPL may be omitted.

[0054] In an embodiment, the window member WP may include a transmissive area TA and a frame area BZA. The transmissive area TA may overlap at least a portion of the active area AA-DM of the display module DM. The transmissive area TA may be an optically transparent area. Figure 1 ) can be provided to the user through the transmissive area TA.

[0055] In an embodiment, the bezel area BZA may be an area having a relatively lower light transmittance than the transmission area TA. The bezel area BZA may define the shape of the transmission area TA. The bezel area BZA may be disposed adjacent to the transmission area TA and may surround the transmission area TA.

[0056] In an embodiment, the border area BZA may have a predetermined color. The border area BZA may cover the peripheral area NAA-DM of the display module DM and block the peripheral area NAA-DM from being viewed from the outside. However, the present invention is not limited to the contents shown in the drawings. In another embodiment, the border area BZA may be disposed adjacent to only one side of the transmissive area TA, or at least a portion of the border area BZA may be omitted.

[0057] Figure 3 is a diagram showing the Figure 2 The line II' corresponds to a cross-sectional view of a portion of the window member WP of the display device DD, and for convenience of description, the outer housing HAU is omitted. Figure 3 is a cross-sectional view showing a display module DM according to an embodiment.

[0058] In the examples and with reference to Figure 3 The display module DM may include a display panel DP and an input sensing layer ISP disposed on the display panel DP. The display panel DP may be configured to substantially generate an image.

[0059] In an embodiment, the display panel DP may include a base layer BS, a circuit layer DP-CL, a display element layer DP-ED, and an encapsulation layer TFE stacked sequentially. Different from the illustration, in another embodiment, an additional component may be further disposed between two adjacent layers among the base layer BS, the circuit layer DP-CL, the display element layer DP-ED, and the encapsulation layer TFE.

[0060] In an embodiment, the base layer BS may provide a base surface on which the circuit layer DP-CL is disposed. The base layer BS may be a flexible base that is bendable, foldable, or rollable, etc. The base layer BS may be a glass base, a metal base, or a polymer base, etc. However, the present invention is not limited thereto, and the base layer BS may include an inorganic layer, an organic layer, or a composite material layer.

[0061] In an embodiment, the base layer BS may have a single-layer structure or a multi-layer structure. For example, the base layer BS may include a first synthetic resin layer, a multi-layer inorganic layer or a single-layer inorganic layer, or a second synthetic resin layer disposed on a multi-layer inorganic layer or a single-layer inorganic layer. The first synthetic resin layer and the second synthetic resin layer may each include a polyimide resin. In addition, the first synthetic resin layer and the second synthetic resin layer may each include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyamide resin, and a perylene resin. In this specification, a "~~" type resin may be regarded as including a "~~" functional group.

[0062] In an embodiment, the circuit layer DP-CL may be disposed on the base layer BS. The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, etc. The display element layer DP-ED may be disposed on the circuit layer DP-CL. The display element layer DP-ED may include a light emitting element ED described later (see Figure 4 For example, the light emitting element ED (see Figure 4 ) may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro light-emitting diodes (LEDs) or nano LEDs.

[0063] In an embodiment, the encapsulation layer TFE may be disposed on the display element layer DP-ED. The encapsulation layer TFE may protect the display element layer DP-ED from moisture, oxygen, and foreign matter such as dust particles. The encapsulation layer TFE may include at least one inorganic layer. For example, the encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer stacked sequentially.

[0064] In an embodiment, the input sensing layer ISP may be disposed on the display panel DP. The input sensing layer ISP may be disposed directly on the encapsulation layer TFE. In another embodiment, an adhesive member may be disposed between the input sensing layer ISP and the display panel DP.

[0065] In this specification, when an element is referred to as being directly disposed / provided on another element, there is no intervening element disposed between the element and the other element. That is, the phrase "an element is 'directly disposed' on 'another element'" may mean "an element 'is in contact with 'another element'".

[0066] In an embodiment, the input sensing layer ISP may detect an external input, change the detected external input into a predetermined input signal, and provide the input signal to the display panel DP. For example, the input sensing layer ISP may be a touch sensing layer that detects a touch. The input sensing layer ISP may recognize a direct touch by a user, an indirect touch by a user, a direct touch by an object, an indirect touch by an object, and the like.

[0067] In an embodiment, the input sensing layer ISP may detect at least one of the position and strength (pressure) of a touch applied from the outside. The input sensing layer ISP may have various structures or be composed of various materials, but is not limited to any one embodiment. For example, in an embodiment, the input sensing layer ISP may detect external input in a capacitive manner. The display panel DP may receive an input signal from the input sensing layer ISP and generate an image corresponding to the input signal. For example, the optical layer RPL may be formed on the input sensing layer ISP by a continuous process.

[0068] In an embodiment, the window member WP may include a coated window CW and a functional layer FL disposed on the coated window CW. The coated window CW may be disposed on the display panel DP, and the functional layer FL may be disposed on the coated window CW.

[0069] Although not shown, in the embodiment, the window member WP may further include a frame area BZA (see Figure 2 ) A corresponding printing layer. The printing layer may be provided on the lower surface of the coating window CW and may be disposed in an edge region of the coating window CW. The printing layer may be formed by providing a pigment or a dye.

[0070] In an embodiment, the coating window CW may include an optically transparent insulating material. For example, the coating window CW may include an epoxy resin. In a method for manufacturing a display device described later, according to an embodiment, the coating window CW may be provided by providing a liquid coating composition CAW (see Figure 6 ). The coating window CW is formed by applying a liquid coating composition CAW (see Figure 6) and may not include a glass substrate. A typical display device is manufactured by providing a window including a glass substrate on a display panel. The window including a glass substrate is attached to the display panel by a lamination process, and an adhesive member for attaching the window is required. In contrast, in another embodiment, a coating window CW can be formed by providing a coating composition CAW that does not require an attachment process, an adhesive member, etc., thereby helping to improve manufacturing efficiency and reduce the thickness of the display device.

[0071] In an embodiment, the functional layer FL may be directly disposed on the coating window CW. The functional layer FL may be a component disposed on the uppermost portion of the display device DD. The functional layer FL may perform functions of hard coating and anti-fingerprint, etc. The functional layer FL may be a single layer.

[0072] In an embodiment, the functional layer FL may be optically transparent. The functional layer FL may have a transmittance of about 90% or more with respect to light having a visible light wavelength range. The functional layer FL may have a transmittance of about 90% or more with respect to light having a wavelength range of about 380nm to about 780nm.

[0073] In an embodiment, the functional layer FL may have a pencil hardness of about 6H or more. For example, the pencil hardness of the functional layer FL may be measured according to the ASTM D3363 method. The functional layer FL may have a yellowness index of about 1 or less. For example, the yellowness index of the functional layer FL may be measured according to the ASTM E313 method.

[0074] In an embodiment, the functional layer FL having a pencil hardness of 6H or more and a yellowness index of 1 or less may exhibit excellent wear resistance and scratch resistance. Therefore, the display device DD including the functional layer FL may exhibit excellent reliability.

[0075] In an embodiment, the functional layer FL may be formed by providing a thermosetting coating solution ECL (see Figure 7 ) to form. Thermosetting coating solution ECL (see Figure 7 ) may include a base resin, a fluorine-containing compound, and an ultraviolet (UV) absorber. The UV absorber may be included in an amount relative to the thermosetting coating solution ECL (see Figure 7 ) has a total weight of about 1 wt % to about 10 wt %. The thermosetting coating solution ECL (see Figure 7) may include a UV absorber in an amount of about 1 wt % to about 10 wt % relative to the total weight of the functional layer FL. For example, the functional layer FL may include the UV absorber in an amount of about 2 wt % to about 5 wt % or about 3 wt % to about 4 wt % relative to the total weight of the functional layer FL. The functional layer FL may be formed of not a photocurable coating solution but a thermosetting coating solution, and may include the UV absorber in an amount of about 1 wt % or more.

[0076] In an embodiment, when a functional layer is formed by providing a thermosetting coating solution including a UV absorber (the amount of the UV absorber is less than about 1 wt % relative to the total weight of the functional layer), yellowing of the coated window and the like is caused, and thus the reliability of the display device is reduced. Yellowing refers to the yellowing of the color of a component (or member) over time. Meanwhile, when a functional layer is formed by providing a thermosetting coating solution including a UV absorber (the amount of the UV absorber is greater than about 10 wt % relative to the total weight of the functional layer), the acrylic resin and / or the fluorine-containing compound is reduced in weight, and thus the performance of the functional layer (e.g., wear resistance, anti-fingerprint property, etc.) is deteriorated. On the other hand, in an embodiment, by providing a thermosetting coating solution including a UV absorber (the amount of the UV absorber is greater than about 10 wt % relative to the total weight of the functional layer), the coating window and the like are yellowed, and thus the reliability of the display device is reduced. Figure 7 ) with a total weight of about 1 wt % to about 10 wt % of a thermosetting coating solution ECL (see Figure 7 ) and the display device DD including the functional layer FL, so that excellent reliability can be ensured.

[0077] In the examples, the thermosetting coating solution ECL (see Figure 7 ) by heat HT (see Figure 8 ) is cured and is substantially non-reactive to light. The term "substantially non-reactive" means that no reaction occurs that results in substantial changes in physical and / or chemical properties.

[0078] In the embodiment, the thermosetting coating solution ECL (see Figure 7 ) may include a base resin, a fluorine-containing compound, and a UV absorber. The base resin may include an acrylic resin. The functional layer FL including the fluorine-containing compound may exhibit excellent anti-fingerprint performance. The functional layer FL including the acrylic resin may exhibit excellent wear resistance, chemical resistance, and scratch resistance.

[0079] The UV absorber may absorb light having a wavelength range of about 300 nm to about 400 nm. In an embodiment, the UV absorber may include an organic material. The UV absorber may not include an inorganic material. For example, the UV absorber may include at least one of a stilbene derivative, a phenylene vinyl derivative, a benzoxazole derivative, a benzotriazole derivative, a benzophenone derivative, and a triazine derivative.

[0080] In an embodiment, in a typical display device, a functional layer performing an anti-fingerprint and / or hard coating function is formed by providing a photocurable coating solution that is cured by light. Since a coating window including an epoxy resin has weak hardness and is easily yellowed, the functional layer is formed of a functional material including an acrylic resin, a UV absorber, etc., thereby improving the hardness of the coating window and preventing the coating window from yellowing. The functional material is cured by ultraviolet rays, and the UV absorber is limited to an amount of less than about 1 wt % relative to the total weight of the functional material. Since the UV absorber absorbs light provided for curing the functional material, when the UV absorber is included in an amount of about 1 wt % or more, the functional layer FL is not formed. On the other hand, in an embodiment, since the functional layer FL is made of a thermosetting coating solution ECL that is cured by heat (see Figure 7 ), the UV absorber may be provided in an amount of about 1 wt % or more. In an embodiment, since the functional layer FL including the UV absorber in an amount of about 1 wt % or more is formed directly on the coating window CW, the coating window CW is prevented from yellowing, and thus the display device DD may have improved reliability.

[0081] Figure 4 is a cross-sectional view showing a portion of a display device DD (eg, a display module DM) according to an embodiment. Figure 4 Can be described in more detail Figure 3 2 is a cross-sectional view of the configuration of the display module DM shown in FIG.

[0082] In an embodiment, the display panel DP may include pixels PX (see Figure 2 ). Pixel PX (see Figure 2 ) may include a transistor TR and a light emitting element ED. The transistor TR and the light emitting element ED may be disposed on the base layer BS. Figure 4 One transistor TR is shown, but the pixel PX (see Figure 2 ) may basically include at least one capacitor and a plurality of transistors for driving the light emitting element ED.

[0083] In an embodiment, the circuit layer DP-CL may be disposed on the base layer BS. The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connection electrode CNE, and a plurality of insulating layers BFL and INS1 to INS6. The plurality of insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and first to sixth insulating layers INS1 to INS6, respectively. However, Figure 4 The stacking structure of the circuit layers DP-CL shown in FIG. 1 is presented as an example, and the stacking structure of the circuit layers DP-CL may be based on the pixel PX (see FIG. 1 ). Figure 2 ) configuration and the process used for the circuit layer DP-CL.

[0084] In an embodiment, the shielding electrode BML may be disposed on the base layer BS. The shielding electrode BML may overlap the transistor TR. The shielding electrode BML may block light incident on the transistor TR from below the display panel DP to protect the transistor TR. The shielding electrode BML may include a conductive material. When a voltage is applied to the shielding electrode BML, a threshold voltage of the transistor TR disposed on the shielding electrode BML may be maintained. However, the present invention is not limited thereto, and the shielding electrode BML may be a floating electrode. In another embodiment, the shielding electrode BML may be omitted.

[0085] In an embodiment, the buffer layer BFL may be disposed on the base layer BS and cover the shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL may improve a bonding force between the base layer BS and a semiconductor pattern or a conductive pattern disposed on the buffer layer BFL.

[0086] In an embodiment, the transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, the channel C1, and the drain D1 of the transistor TR may be formed by a semiconductor pattern. The semiconductor pattern of the transistor TR may include polysilicon, amorphous silicon, or a metal oxide. However, any material having semiconductor characteristics may be used without any limitation, but is not limited to any one embodiment.

[0087] In an embodiment, the semiconductor pattern may include a plurality of regions divided according to the conductivity level. In the semiconductor pattern, the region doped with a dopant or in which the metal oxide is reduced may have high conductivity and may be substantially used as the source electrode and the drain electrode of the transistor TR. The high conductivity region of the semiconductor pattern may correspond to the source S1 and the drain D1 of the transistor TR. In the semiconductor pattern, the region that is undoped or lightly doped or has low conductivity due to the unreduced metal oxide may correspond to the channel C1 (or active region) of the transistor TR.

[0088] In an embodiment, the first insulating layer INS1 may cover the semiconductor pattern of the transistor TR and may be disposed on the buffer layer BFL. The gate G1 of the transistor TR may be disposed on the first insulating layer INS1. The gate G1 may overlap the channel C1 of the transistor TR. The gate G1 may be used as a mask during a process of doping the semiconductor pattern of the transistor TR.

[0089] In an embodiment, the second insulating layer INS2 may cover the gate G1 and may be disposed on the first insulating layer INS1. The third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0090] In an embodiment, the connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 electrically connecting the transistor TR to the light emitting element ED. However, the embodiment of the connection electrode CNE electrically connecting the transistor TR to the light emitting element ED is not limited to the above configuration. In another embodiment, either of the first connection electrode CNE1 and the second connection electrode CNE2 may be omitted, or an additional connection electrode may be further included.

[0091] In an embodiment, the first connection electrode CNE1 may be disposed on the third insulating layer INS3. The first connection electrode CNE1 may be connected to the drain electrode D1 via a first contact hole CH1 passing through the first insulating layer INS1 to the third insulating layer INS3, respectively. The fourth insulating layer INS4 may cover the first connection electrode CNE1 and may be disposed on the third insulating layer INS3. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0092] In an embodiment, the second connection electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 via a second contact hole CH2 passing through the fourth insulating layer INS4 and the fifth insulating layer INS5, respectively. The sixth insulating layer INS6 may cover the second connection electrode CNE2 and may be disposed on the fifth insulating layer INS5.

[0093] In an embodiment, the first to sixth insulating layers INS1 to INS6 may each include an inorganic layer or an organic layer. For example, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and perylene resin.

[0094] In an embodiment, the display element layer DP-ED may include a pixel defining layer PDL and a light emitting element ED. The light emitting element ED may include a first electrode AE, a hole control layer HCL, a light emitting layer EML, an electron control layer TCL and a second electrode CE.

[0095] In an embodiment, the first electrode AE ​​may be disposed on the sixth insulating layer INS6. The first electrode AE ​​may be connected to the second connection electrode CNE2 via a third contact hole CH3 passing through the sixth insulating layer INS6. The first electrode AE ​​may be electrically connected to the drain D1 of the transistor TR via the first connection electrode CNE1 and the second connection electrode CNE2, respectively.

[0096] In an embodiment, the first electrode AE ​​may be formed of a metal material, a metal alloy, or a conductive compound. The first electrode AE ​​may be an anode or a cathode. However, the present invention is not limited thereto. In addition, the first electrode AE ​​may be a pixel electrode. The first electrode AE ​​may be a transmissive electrode, a semi-transmissive semi-reflective electrode, or a reflective electrode. The first electrode AE ​​may include: at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; a compound of two or more materials selected from the above metal materials; a mixture of two or more materials selected from the above metal materials; or an oxide of the above metal material.

[0097] In an embodiment, when the first electrode AE ​​is a transmissive electrode, the first electrode AE ​​may include a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. When the first electrode AE ​​is a semi-transmissive and semi-reflective electrode or a reflective electrode, the first electrode AE ​​may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, or a compound or mixture thereof (e.g., a mixture of Ag and Mg), or a multilayer structure material such as LiF / Ca (a stacking structure of LiF and Ca) or LiF / Al (a stacking structure of LiF and Al). In another embodiment, the first electrode AE ​​may have a multilayer structure, the multilayer structure including a reflective film or a semi-transmissive and semi-reflective film formed of the above materials, and a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but is not limited thereto. In addition, the present invention is not limited thereto, and the first electrode AE ​​may include the above-mentioned metal material, a combination of two or more metal materials selected from the above-mentioned metal materials, or an oxide of the above-mentioned metal material, etc.

[0098] In an embodiment, a pixel defining film PDL may be disposed on the sixth insulating layer INS6. A light emitting opening PX_OP exposing a portion of the first electrode AE ​​may be defined in the pixel defining film PDL. A portion of the first electrode AE ​​exposed by the light emitting opening PX_OP may be defined as a light emitting area LA.

[0099] In an embodiment, the region in which the pixel defining film PDL is disposed may correspond to the light blocking region NLA. The light blocking region NLA may surround the light emitting region LA in the active region AA-DM.

[0100] In an embodiment, the hole control layer HCL may be disposed on the first electrode AE ​​and the pixel definition film PDL. The hole control layer HCL may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA. The hole control layer HCL may include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer HCL may include a typical hole injection material and / or a typical hole transport material.

[0101] In an embodiment, the light emitting layer EML may be disposed on the hole control layer HCL. The light emitting layer EML may be disposed in a region corresponding to the light emitting opening PX_OP. In another embodiment, the light emitting layer EML may be provided as a common layer. The light emitting layer EML may include an organic light emitting material and / or an inorganic light emitting material. The light emitting layer EML may emit light having one color of red, green, or blue.

[0102] In an embodiment, the electron control layer TCL may be disposed on the light emitting layer EML. The electron control layer TCL may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA. The electron control layer TCL may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The electron control layer TCL may include a typical electron injection material and / or a typical electron transport material.

[0103] In an embodiment, the second electrode CE may be disposed on the electronic control layer TCL. The second electrode CE may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA. The second electrode CE may be commonly disposed in the pixel PX (see Figure 2 ) and can be applied to the pixel PX (see Figure 2 ) applies voltage.

[0104] In an embodiment, the second electrode CE may be a common electrode. The second electrode CE may be a cathode or an anode, but the present invention is not limited thereto. For example, when the first electrode AE ​​is an anode, the second electrode CE may be a cathode, and when the first electrode AE ​​is a cathode, the second electrode CE may be an anode.

[0105] In an embodiment, the second electrode CE may be a transmissive electrode, a semi-transmissive and semi-reflective electrode, or a reflective electrode. When the second electrode CE is a transmissive electrode, the second electrode CE may include a transparent metal oxide, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.

[0106] In an embodiment, when the second electrode CE is a semi-transmissive and semi-reflective electrode or a reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, Yb, W or a compound or mixture thereof (e.g., AgMg, AgYb or MgYb), or a multilayer structure material such as LiF / Ca or LiF / Al. In another embodiment, the second electrode CE may have a multilayer structure including a reflective film or a semi-transmissive and semi-reflective film formed of the above materials, and a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the second electrode CE may include the above metal materials, a combination of two or more metal materials selected therefrom, or an oxide of the above metal materials, etc.

[0107] In an embodiment, the encapsulation layer TFE may be disposed on the second electrode CE and may cover the light emitting element ED. The encapsulation layer TFE may include a plurality of thin films. For example, the encapsulation layer TFE may include an inorganic film disposed on the second electrode CE, and an organic film may be disposed between the inorganic films. The inorganic film may protect the light emitting element ED from moisture / oxygen, and the organic film may protect the light emitting element ED from foreign matter such as dust particles.

[0108] In an embodiment, the input sensing layer ISP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing layer ISP may include at least one conductive layer disposed on the sensing insulating layers IL1, IL2, IL3. The input sensing layer ISP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0109] In an embodiment, the first sensing insulating layer IL1 may be disposed on the encapsulation layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the encapsulation layer TFE. In another embodiment, the first sensing insulating layer IL1 may be omitted, and in this case, the first conductive layer CDL1 may be in contact with the encapsulation layer TFE.

[0110] In an embodiment, the first conductive layer CDL1 may be disposed on the first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sensing insulating layer IL1. The second sensing insulating layer IL2 may be disposed on the first sensing insulating layer IL1 to cover at least a portion of the first conductive layer CDL1.

[0111] In an embodiment, the second conductive layer CDL2 may be disposed on the second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. The plurality of second conductive patterns may be connected to the plurality of first conductive patterns via contact holes formed in the second sensing insulating layer IL2, respectively.

[0112] In an embodiment, the plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may each be disposed to correspond to the light blocking area NLA. The plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may each correspond to a mesh pattern.

[0113] In an embodiment, the third sensing insulating layer IL3 may be disposed on the second sensing insulating layer IL2 and cover the second conductive layer CDL2. The second sensing insulating layer IL2 and the third sensing insulating layer IL3 may each include an inorganic insulating layer or an organic insulating layer.

[0114] In an embodiment, the first conductive layer CDL1 and the second conductive layer CDL2 may each have a single-layer structure or a multilayer structure in which a plurality of layers are stacked along a third directional axis DR3. The conductive layers CDL1 and CDL2 having a single-layer structure may each include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum or an alloy thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) and indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include conductive polymers such as poly 3,4-ethylenedioxythiophene (PEDOT), metal nanowires, graphene, and the like.

[0115] In an embodiment, the conductive layers CDL1 and CDL2 having a multi-layer structure may include a metal layer. For example, the metal layer may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti). The conductive layers CDL1 and CDL2 having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0116] In an embodiment, the display device DD (see Figure 3 ) can be formed by a method for manufacturing a display device. Figure 5is a flowchart illustrating a method for manufacturing a display device according to an embodiment. Figures 6 to 9 Schematically shows a display device manufacturing step according to an embodiment. Figures 5 to 9 Description of the reference Figures 1 to 4 The contents that are repeated in the description will not be explained again, and the following description will mainly focus on the differences.

[0117] In the examples and with reference to Figure 5 , the method for manufacturing a display device may include: a step of preparing a display panel (S100), a step of forming a coating window (S200), and a step of forming a functional layer by providing a thermosetting coating solution (S300). Coating window CW (see Figure 7 ) can be used on the display panel DP (see Figure 7 ) is formed on the functional layer FL (see Fig. 9 ) can be formed on the coating window CW (see Fig. 9 )superior.

[0118] In the examples and with reference to Figure 6 , a coating composition CAW may be provided to form a coating window CW on a display module DM including a display panel DP (see Figure 7 ). Specifically, the coating composition CAW may be directly disposed on the optical layer RPL disposed on the display module DM. In another embodiment, when the optical layer RPL is omitted, the coating composition CAW may be directly disposed on the display module DM. The coating composition CAW may be directly disposed on the display device DD (see Figure 3 ) on a member (eg, an optical layer) of the display device. The method for manufacturing a display device according to an embodiment may include directly disposing the coating composition CAW on a member constituting the display device DD (see Figure 3 ) to form a coating window CW (see Figure 7 ) steps, thereby simplifying the manufacturing process and reducing the manufacturing cost. Therefore, the method for manufacturing a display device according to the embodiment can exhibit excellent manufacturing efficiency.

[0119] In an embodiment, the coating composition CAW may include an epoxy-based resin. Figure 6 The coating composition CAW is shown to be provided through the nozzle NZ, but the device for providing the coating composition CAW is not limited thereto. Light is provided to the coating composition CAW applied on the display module DM, and the coating composition CAW is photocured to form a coating window CW (see Figure 7 ). Although not shown, the method for manufacturing a display device according to an embodiment may further include a step of forming a printing layer before providing the coating composition CAW. As described above, the printing layer may be formed to overlap with the frame area BZA (see Figure 2 ) corresponding to.

[0120] In the examples and with reference to Figure 7 , the thermosetting coating solution ECL may be disposed on the coating window CW. The thermosetting coating solution ECL may be directly disposed on the coating window CW.

[0121] In an embodiment, the thermosetting coating solution ECL may be provided by roller coating, screen printing coating, spray coating, or slot coating. Figure 7 It is exemplarily shown that the thermosetting coating solution ECL is provided by the sprayer SY, but the present invention is not limited thereto.

[0122] In an embodiment, the thermosetting coating solution ECL may include a UV absorber in an amount of about 1 wt % to about 10 wt % relative to the total weight of the thermosetting coating solution ECL. The functional layer FL (see Fig. 9 ) can demonstrate excellent reliability.

[0123] In an embodiment, the UV absorber may include an organic material. For example, the UV absorber may include at least one of stilbene derivatives, phenylene vinyl derivatives, benzoxazole derivatives, benzotriazole derivatives, benzophenone derivatives, and triazine derivatives.

[0124] In an embodiment, the thermosetting coating solution ECL may include a base resin and a fluorine-containing compound. The thermosetting coating solution ECL may include an acrylic resin as the base resin. However, the present invention is not limited thereto, and the thermosetting coating solution ECL may further include additives known in the art, etc., as long as they do not reduce the performance of the functional layer FL (e.g., wear resistance and scratch resistance, etc.).

[0125] In the examples and with reference to Figure 8 , can be provided by providing a thermosetting coating solution ECL (see Figure 7 ) The preliminary functional layer P-FL formed provides heat HT. Figure 8 and Fig. 9 , the functional layer FL may be formed by curing the preliminary functional layer P-FL. The degree of curing of the preliminary functional layer P-FL may be about 90% or more. The functional layer FL may be formed by curing the preliminary functional layer P-FL to a degree of curing of about 90% or more. The preliminary functional layer P-FL may be cured at a temperature of about 20°C to about 80°C. Heat HT may be provided to set a temperature condition of about 20°C to about 80°C. When a temperature condition of about 20°C to about 80°C has been set before providing the heat HT, the heat HT may not be provided.

[0126] In an embodiment, at a temperature below about 20° C., curing of the preliminary functional layer P-FL may not be easily performed, and at a temperature above about 80° C., a component of a display device (e.g., a display panel) disposed below the preliminary functional layer P-FL is damaged. In another embodiment, a method for manufacturing a display device may include a step of curing the preliminary functional layer P-FL at a temperature of about 20° C. to about 80° C., thereby easily curing the preliminary functional layer P-FL and preventing components such as the display panel DP from being damaged during the manufacturing process.

[0127] In an embodiment, a method for manufacturing a display device may include a step of forming a functional layer FL by providing a thermosetting coating solution on a coating window CW. The thermosetting coating solution may include a UV absorber in an amount of about 1wt% to about 10wt%, and the UV absorber may be an organic material. The method for manufacturing a display device according to an embodiment may include a step of forming a functional layer FL from a thermosetting coating solution cured by heat, and thus ensure excellent reliability. A display device manufactured by a method for manufacturing a display device according to an embodiment, including a step of forming a functional layer FL from a thermosetting coating solution cured by heat, may exhibit excellent reliability. The functional layer FL formed by the thermosetting coating solution may include a UV absorber in an amount of about 1wt% or more, thereby enabling the coating window CW, etc. to be prevented from being damaged by ultraviolet rays.

[0128] In an embodiment, the display device may include the functional layer FL including the UV absorber, thereby exhibiting excellent reliability.

[0129] In an embodiment, a method for manufacturing a display device may include forming a functional layer FL from a thermosetting coating solution including a UV absorber, thereby exhibiting excellent reliability.

[0130] Although various embodiments of the present invention have been described, it should be understood that the present invention should not be limited to these embodiments, but a person skilled in the art may make various changes and modifications within the spirit and scope of the present invention.

[0131] The technical scope of the inventive concept is not limited to the contents described in the detailed description of this specification. In addition, the embodiments or part of the embodiments may be combined in whole or in part without departing from the scope of the present invention.

Claims

1. A display device, wherein: The display device comprises: Display panel; a coating window disposed on the display panel; and a functional layer disposed on the coating window and formed of a thermosetting coating solution, wherein the functional layer comprises an ultraviolet absorber, the amount of the ultraviolet absorber relative to the total weight of the functional layer is 1wt% to 10wt%, and Wherein, the ultraviolet absorber comprises organic material.

2. The display device according to claim 1, wherein: The functional layer further comprises a matrix resin and a fluorine-containing compound, and Wherein, the base resin includes acrylic resin.

3. The display device according to claim 1, wherein: The ultraviolet absorber includes at least one of stilbene derivatives, phenylene vinyl derivatives, benzoxazole derivatives, benzotriazole derivatives, benzophenone derivatives and triazine derivatives.

4. The display device according to claim 1, wherein: The functional layer has: 6H or higher pencil hardness; A yellowness index of 1 or less; and With respect to light having a visible light wavelength range, a transmittance of 90% or more.

5. The display device according to claim 1, wherein: The functional layer is disposed directly on the coated window.

6. The display device according to claim 1, wherein: The coated window includes epoxy resin.

7. A method for manufacturing a display device, wherein: The method comprises: preparing a display panel; forming a coating window on the display panel; and forming a functional layer by providing a thermosetting coating solution on the coating window, wherein the thermosetting coating solution comprises an ultraviolet absorber, the amount of the ultraviolet absorber is 1 wt % to 10 wt % relative to the total weight of the thermosetting coating solution, and Wherein, the ultraviolet absorber comprises organic material.

8. The method according to claim 7, wherein: The thermosetting coating solution is disposed directly on the coating window.

9. The method according to claim 7, wherein: The thermosetting coating solution further includes a base resin and a fluorine-containing compound.

10. The method according to claim 7, wherein: The coating window is formed by disposing a coating composition on the display panel, and Wherein, the coating composition includes epoxy resin.

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