Electronic device including structure for dissipating heat generated in electronic device

Abstract

An electronic device according to an embodiment includes: a hinge structure including a first hinge plate, a second hinge plate, and a hinge bracket; a display; a plurality of reinforcing members including a first reinforcing member and a second reinforcing member and attached to the display; and a first heat dissipation member including a first region, a second region, and a third region connecting the first region and the second region to each other and being deformable by movement of the first hinge plate and the second hinge plate, in an expanded state of the electronic device in which one surface of the first hinge plate faces the same direction as one surface of the second hinge plate, at least a portion of the third region passes through a gap between side surfaces of the first hinge plate and the second hinge plate that face each other.

Description

Technical Field

[0001] Various embodiments of the present disclosure are directed to an electronic device including a structure for dissipating heat generated in the electronic device. Background Art

[0002] There is an increasing need for electronic devices in which the size of a display for displaying content can be changed so that various contents can be provided to a user through the electronic device. For example, the electronic device may provide a structure in which the size of a display for displaying content can be changed because it includes a flexible display that can be folded. Summary of the invention

[0003] Technical Solution

[0004] According to an embodiment, an electronic device may include a hinge structure, the hinge structure including a hinge bracket, a first hinge plate rotatably connected to the hinge bracket, and a second hinge plate that is different from the first hinge plate and rotatably connected to the hinge bracket. According to an embodiment, the electronic device may include a display arranged on the first hinge plate and the second hinge plate across the hinge structure. According to an embodiment, the electronic device may include a plurality of reinforcing members attached to the display, the plurality of reinforcing members including a first reinforcing member facing a surface of the first hinge plate and spaced apart from the first hinge plate, and a second reinforcing member facing a surface of the second hinge plate and spaced apart from the second hinge plate. According to an embodiment, the electronic device may include a first heat dissipation member, the first heat dissipation member including a first area interposed between the first reinforcing member and the surface of the first hinge plate, a second area interposed between the second reinforcing member and the surface of the second hinge plate, and a third area connecting the first area and the second area and deformable by movement of the first hinge plate and the second hinge plate. According to an embodiment, in an unfolded state of the electronic device in which the direction facing the surface of the first hinge plate is the same as the direction facing the surface of the second hinge plate, at least a portion of the third area can pass through a gap between the side surfaces of the first hinge plate and the second hinge plate facing each other.

[0005] According to an embodiment, the electronic device may include a first housing. According to an embodiment, the electronic device may include a second housing rotatable relative to the first housing. According to an embodiment, the electronic device may include a hinge structure rotatably coupling the first housing and the second housing, the hinge structure including a first hinge plate, a hinge bracket, a first hinge plate rotatably coupled relative to the hinge bracket, and a second hinge plate that is different from the first hinge plate and rotatably coupled relative to the hinge bracket. According to an embodiment, the electronic device may include a display disposed on the first housing and the second housing across the hinge structure. According to an embodiment, the electronic device may include a plurality of waterproof members separating the display from the first hinge plate and the second hinge plate, the plurality of waterproof members including a first waterproof member disposed between the display and the first housing and a second waterproof member disposed between the display and the second housing. According to an embodiment, the electronic device may include a first heat dissipation member disposed between the first waterproof member and the second waterproof member, the first heat dissipation member having a thickness less than or equal to the thickness of each of the plurality of waterproof members. According to an embodiment, the first heat dissipation member may include a first area disposed on a surface of the first hinge plate facing the display. According to an embodiment, the first heat dissipation member may include a second area disposed on a surface of the second hinge plate facing the display. According to an embodiment, the first heat dissipation member may include a third area connecting the first area and the second area, and the third area is deformable by movement of the first hinge plate and the second hinge plate. According to an embodiment, in an unfolded state of the electronic device in which the direction facing the surface of the first hinge plate is the same as the direction facing the surface of the second hinge plate, at least a portion of the third area may pass through a gap between the side surfaces of the first hinge plate and the side surfaces of the second hinge plate facing each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] Figure 2a An example of an unfolded state of an exemplary electronic device according to an embodiment is shown.

[0008] Figure 2b An example of a folded state of an exemplary electronic device according to an embodiment is shown.

[0009] Figure 2c is an exploded view of an exemplary electronic device according to an embodiment.

[0010] Figure 3a is a top plan view of an exemplary electronic device according to an embodiment.

[0011] Figure 3b It is shown along Figure 3a A cross-sectional view of an example of an exemplary electronic device in an unfolded state is cut along line AA′.

[0012] Figure 3c It is shown along Figure 3a A cross-sectional view of an example of an exemplary electronic device in a folded state is cut along line AA′.

[0013] Figure 4a is a cross-sectional view showing an example cut along an exemplary electronic device in an unfolded state.

[0014] Figure 4b is a cross-sectional view showing an example cut along an exemplary electronic device in a folded state.

[0015] Figure 5a is a cross-sectional view showing an example cut along an exemplary electronic device in an unfolded state.

[0016] Figure 5b is a cross-sectional view showing an example cut along an exemplary electronic device in a folded state. DETAILED DESCRIPTION

[0017] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0018] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0019] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0020] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning can be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN) or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0021] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0022] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0023] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0024] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented as a separate part from the speaker, or as part of the speaker.

[0025] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0026] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0027] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0028] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0029] The connection end 178 may include a connector, via which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0030] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation recognizable by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0031] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0032] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0033] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently with the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (for example, a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (for example, a LAN or a wide area network (WAN)))) to communicate with an external electronic device. These various types of communication modules can be implemented as a single component (for example, a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (for example, multiple chips). The wireless communication module 192 can use the user information (for example, the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and authenticate the electronic device 101 in the communication network (such as the first network 198 or the second network 199).

[0035] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0036] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element, the radiating element being composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Then, a signal or power may be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0037] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or is adjacent to the first surface and is capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or is adjacent to the second surface and is capable of transmitting or receiving signals of the specified high frequency band.

[0038] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0039] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic devices 102 or 104 may be a device of the same type or a different type as the electronic device 101. According to an embodiment, all or some operations to be run in the electronic device 101 may be run in one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of running the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service in addition to running the function or service. The one or more external electronic devices that receive the request may perform the requested at least part of the function or service, or perform another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request when the result is further processed or when the result is not further processed. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0040] Figure 2a shows an example of an unfolded state of an electronic device according to an embodiment, Figure 2b shows an example of a folded state of an electronic device according to an embodiment, Figure 2c is an exploded view of an electronic device according to an embodiment.

[0041] Reference Figure 2a , Figure 2b and Figure 2c , the electronic device 200 (eg, Figure 1 The electronic device 101 may include a first housing 210, a second housing 220, and a display 230 (eg, Figure 1a display module 160 ), at least one camera 240 , a hinge structure 250 and / or at least one electronic component 260 .

[0042] The first housing 210 and the second housing 220 may form at least a portion of the outer surface of the electronic device 200 that may be grasped by the user. When the user uses the electronic device 200, at least a portion of the outer surface of the electronic device 200 defined by the first housing 210 and the second housing 220 may contact a portion of the user's body. According to an embodiment, the first housing 210 may include a first surface 211, a second surface 212 facing the first surface 211 and spaced apart from the first surface 211, and a first side surface 213 surrounding at least a portion of the first surface 211 and the second surface 212. The first side surface 213 may connect the periphery of the first surface 211 and the periphery of the second surface 212. The first surface 211, the second surface 212, and the first side surface 213 may define an internal space of the first housing 210. According to an embodiment, the first housing 210 may provide a space formed by the first surface 211, the second surface 212, and the first side surface 213 as a space for arranging components of the electronic device 101.

[0043] According to an embodiment, the second housing 220 may include a third surface 221, a fourth surface 222 facing the third surface 221 and spaced apart from the third surface 221, and a second side surface 223 surrounding at least a portion of the third surface 221 and the fourth surface 222. The second side surface 223 may connect the periphery of the third surface 221 and the periphery of the fourth surface 222. The third surface 221, the fourth surface 222, and the second side surface 223 may define an internal space of the second housing 220. According to an embodiment, the second housing 220 may provide a space formed by the third surface 221, the fourth surface 222, and the second side surface 223 surrounding at least a portion of the third surface 221 and the fourth surface 222 as a space for mounting components of the electronic device 101. According to an embodiment, the second housing 220 may be coupled to the first housing 210 so as to be rotatable relative to the first housing 210.

[0044] According to an embodiment, each of the first housing 210 and the second housing 220 may include each of the first protective member 214 and the second protective member 224. The first protective member 214 and the second protective member 224 may be provided on the first surface 211 and the third surface 221 along the periphery of the display 230. According to an embodiment, the first protective member 214 and the second protective member 224 may prevent foreign matter (e.g., dust or moisture) from flowing in through the gap between the display 230, the first housing 210 and the second housing 220. For example, the first protective member 214 may surround the periphery of the first display area 231 of the display 230, and the second protective member 224 may surround the periphery of the second display area 232 of the display 230. The first protective member 214 may be formed by being attached to the first side surface 213 of the first housing 210, or may be formed integrally with the first side surface 213. The second protective member 224 may be formed by being attached to the second side surface 223 of the second housing 220, or may be formed integrally with the second side surface 223.

[0045] According to an embodiment, the first side surface 213 and the second side surface 223 may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side surface 223 may include at least one conductive member 225 and at least one non-conductive member 226. At least one conductive member 225 may include a plurality of conductive members spaced apart from each other. At least one non-conductive member 226 may be disposed between a plurality of conductive members. A plurality of conductive members may be disconnected from each other by at least one non-conductive member 226 disposed between a plurality of conductive members. According to an embodiment, a plurality of conductive members and a plurality of non-conductive members may form an antenna radiator together. The electronic device 200 may communicate with an external electronic device through an antenna radiator formed by a plurality of conductive members and a plurality of non-conductive members.

[0046] The display 230 may be configured to display visual information. According to an embodiment, the display 230 may be arranged on the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 across the hinge structure 250. For example, the display 230 may include a first display area 231 arranged on the first surface 211 of the first housing, a second display area 232 arranged on the third surface 221 of the second housing, and a third display area 233 arranged between the first display area 231 and the second display area 232. The first display area 231, the second display area 232, and the third display area 233 may form the front surface of the display 230. According to an embodiment, the display 230 may further include a sub-display panel 235 arranged in the fourth surface 222 of the second housing 220. For example, the display 230 may be referred to as a flexible display 230. According to an embodiment, the display 230 may include a window exposed toward the outside of the electronic device 200. The window may protect the outer surface of the display 230 and transmit the visual information provided by the display 230 to the outside of the electronic device 200 by including a substantially transparent material. For example, the window may include glass (eg, ultra-thin glass (UTG)) and / or polymer (eg, polyimide (PI)), but is not limited thereto.

[0047] At least one camera 240 may be configured to obtain an image based on receiving light from an external object of the electronic device 200. According to an embodiment, the at least one camera 240 may include a first camera 241, a second camera 242, and a third camera 243. The first camera 241 may be disposed in the first housing 210. For example, the first camera 241 may be disposed within the first housing 210, and at least a portion of the first camera 241 may be visible through the second surface 212 of the first housing 210. The first camera 241 may be supported by a bracket (not shown) in the first housing 210. The first housing 210 may include at least one opening 241a overlapping the first camera 241 when the electronic device 200 is viewed from above. The first camera 241 may obtain an image based on receiving light from the outside of the electronic device 200 through the at least one opening 241a.

[0048] According to an embodiment, the second camera 242 may be provided in the second housing 220. For example, the second camera 242 may be provided inside the second housing 220 and may be visible through the sub-display panel 235. The second housing 220 may include at least one opening 242a overlapping the second camera 242 when the electronic device 200 is viewed from above. The second camera 242 may obtain an image based on receiving light from the outside of the electronic device 200 through the at least one opening 242a.

[0049] According to an embodiment, the third camera 243 may be provided in the first housing 210. For example, the third camera 243 may be provided in the first housing 210, and at least a portion of the third camera 243 may be visible through the first surface 211 of the first housing 210. For another example, the third camera 243 may be provided in the first housing 210, and at least a portion of the third camera 243 may be visible through the first display area 231 of the display 230. The first display area 231 of the display 230 may include at least one opening overlapping with the third camera 243 when the display 230 is viewed from above. The third camera 243 may obtain an image based on receiving light from the outside of the display 230 through the at least one opening.

[0050] According to an embodiment, the second camera 242 and the third camera 243 may be disposed below the display 230 (e.g., in a direction facing the inside of the first housing 210 or the inside of the second housing 220). For example, the second camera 242 and the third camera 243 may be under-display cameras (UDC). In the case where the second camera 242 and the third camera 243 are under-display cameras, the area of ​​the display 230 corresponding to the position of each of the second camera 242 and the third camera 243 may not be an inactive area. The inactive area of ​​the display 230 may mean an area of ​​the display 230 that does not include pixels or does not emit light to the outside of the electronic device 200. For another example, the second camera 242 and the third camera 243 may be perforated cameras. In the case where the second camera 242 and the third camera 243 are perforated cameras, the area of ​​the display 230 corresponding to the position of each of the second camera 242 and the third camera 243 may be an inactive area.

[0051] According to an embodiment, the hinge structure 250 may rotatably connect the first housing 210 and the second housing 220. The hinge structure 250 may be disposed between the first housing 210 and the second housing 220 of the electronic device 101 so that the electronic device 200 may be bent, curved or folded. For example, the hinge structure 250 may be disposed between a portion of the first side surface 213 and a portion of the second side surface 223 facing each other. The hinge structure 250 may change the electronic device 200 to an unfolded state or a folded state, in which the first surface 211 of the first housing 210 faces substantially the same direction as the third surface 221 of the second housing 220 faces, and in the folded state, the first surface 211 and the third surface 221 face each other. When the electronic device 200 is in the folded state, the first housing 210 and the second housing 220 may be stacked or overlapped by facing each other.

[0052] According to an embodiment, when the electronic device 200 is in a folded state, the direction facing the first surface 211 and the direction facing the third surface 221 may be different from each other. For example, when the electronic device 200 is in a folded state, the direction facing the first surface 211 and the direction facing the third surface 221 may be opposite to each other. For another example, when the electronic device 200 is in a folded state, the direction facing the first surface 211 and the direction facing the third surface 221 may be tilted relative to each other. In the case where the direction facing the first surface 211 is tilted relative to the direction facing the third surface 221, the first housing 210 may be tilted relative to the second housing 220.

[0053] According to an embodiment, the electronic device 200 may be foldable based on a folding axis f. The folding axis f may mean a direction parallel to the longitudinal direction of the electronic device 200 (eg, Figure 2a and Figure 2b The folding axis f may be a virtual line extending through the hinge cover 251 on the folding axis d1, but is not limited thereto. For example, the folding axis f may be a virtual line extending through the hinge cover 251 on the folding axis d2 (eg, Figure 2a and Figure 2b In the case where the folding axis f extends in a direction perpendicular to the longitudinal direction of the electronic device 200, the hinge structure 250 can connect the first housing 210 and the second housing 220 by extending in a direction parallel to the folding axis f. The first housing 210 and the second housing 220 can be rotatable by the hinge structure 250 extending in a direction perpendicular to the longitudinal direction of the electronic device 200.

[0054] According to an embodiment, the hinge structure 250 may include a hinge cover 251, a first hinge plate 252, a second hinge plate 253, and a hinge module 254. The hinge cover 251 may surround the inner components of the hinge structure 250 and form the outer surface of the hinge structure 250. According to an embodiment, when the electronic device 200 is in a folded state, at least a portion of the hinge cover 251 surrounding the hinge structure 250 may be exposed to the outside of the electronic device 200 through the space between the first housing 210 and the second housing 220. According to another embodiment, when the electronic device 200 is in an unfolded state, the hinge cover 251 may be covered by the first housing 210 and the second housing 220 without being exposed to the outside of the electronic device 200.

[0055] According to an embodiment, the first hinge plate 252 and the second hinge plate 253 may rotatably connect the first housing 210 and the second housing 220 by being respectively coupled to the first housing 210 and the second housing 220. For example, the first hinge plate 252 may be coupled to the first front bracket 215 of the first housing 210, and the second hinge plate 253 may be coupled to the second front bracket 227 of the second housing 220. Since the first hinge plate 252 and the second hinge plate 253 are respectively coupled to the first front bracket 215 and the second front bracket 227, the first housing 210 and the second housing 220 may be rotatable according to the rotation of the first hinge plate 252 and the second hinge plate 253.

[0056] The hinge module 254 can rotate the first hinge plate 252 and the second hinge plate 253. For example, the hinge module 254 can rotate the first hinge plate 252 and the second hinge plate 253 based on the folding axis f by including a gear that can be meshed and rotated. According to an embodiment, the hinge module 254 can be multiple. For example, the multiple hinge modules 254 can be respectively provided by being spaced apart from each other at both ends of the first hinge plate 252 and the second hinge plate 253.

[0057] According to an embodiment, the first housing 210 may include a first front bracket 215 and a rear bracket 216, and the second housing 220 may include a second front bracket 227. The first front bracket 215 and the rear bracket 216 may be disposed in the first housing 210 and support components of the electronic device 200. The second front bracket 227 may be disposed in the second housing 220 and support components of the electronic device 200. For example, the display 230 may be disposed on a surface of the first front bracket 215 and a surface of the second front bracket 227. The rear bracket 216 may be disposed on the other surface of the first front bracket 215 facing the surface of the first front bracket 215. The sub-display panel 235 may be disposed in the rear bracket 216.

[0058] According to an embodiment, a portion of the first front bracket 215 may be surrounded by the first side surface 213, and a portion of the second front bracket 227 may be surrounded by the second side surface 223. For example, the first front bracket 215 may be formed integrally with the first side surface 213, and the second front bracket 227 may be formed integrally with the second side surface 223. For another example, the first front bracket 215 may be formed separately from the first side surface 213, and the second front bracket 227 may be formed separately from the second side surface 223.

[0059] At least one electronic component 260 may implement various functions for providing to a user. According to an embodiment, at least one electronic component 260 may include a first printed circuit board 261, a second printed circuit board 262, a flexible printed circuit board 263, a battery 264, and / or an antenna 265. Each of the first printed circuit board 261 and the second printed circuit board 262 may form an electrical connection of components in the electronic device 200. For example, a component for implementing the overall function of the electronic device 200 (e.g., Figure 1 The processor 120 of the fourth surface 222 may be disposed on the first printed circuit board 261, and the electronic components for implementing part of the functions of the first printed circuit board 261 may be disposed on the second printed circuit board 262. For another example, the components for operating the sub-display panel 235 disposed on the fourth surface 222 may be disposed on the second printed circuit board 262.

[0060] According to an embodiment, the first printed circuit board 261 may be disposed in the first housing 210. For example, the first printed circuit board 261 may be disposed on the surface of the first front bracket 215. According to an embodiment, the second printed circuit board 262 may be disposed in the second housing 220. For example, the second printed circuit board 262 may be spaced apart from the first printed circuit board 261 and disposed on the surface of the second front bracket 227. The flexible printed circuit board 263 may connect the first printed circuit board 261 and the second printed circuit board 262. For example, the flexible printed circuit board 263 may extend from the first printed circuit board 261 to the second printed circuit board 262.

[0061] The battery 264 as a device for supplying power to at least one component of the electronic device 200 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 264 may be disposed on substantially the same plane as the first printed circuit board 261 or the second printed circuit board 262.

[0062] The antenna 265 may be configured to receive power or signals from outside the electronic device 200. According to an embodiment, the antenna 265 may be disposed between the rear bracket 216 and the battery 264. For example, the antenna 265 may include a near field communication (NFC) antenna, an antenna module, and / or a magnetic secure transmission (MST) antenna. For example, the antenna 265 may perform short-range communication with an external device, or wirelessly transmit and receive power required for charging.

[0063] Figure 3a is a top plan view of an exemplary electronic device according to an embodiment, Figure 3b It is shown along Figure 3a A cross-sectional view of an example of an exemplary electronic device in an unfolded state cut along line AA′, Figure 3c It is shown along Figure 3aA cross-sectional view of an example of an exemplary electronic device in a folded state is cut along line AA′.

[0064] Reference Figure 3a , Figure 3b and Figure 3c According to an embodiment, the electronic device 300 (eg, Figure 1 The electronic device 101 and / or Figure 2a , Figure 2b and Figure 2c The electronic device 200 may include a first housing 310 (eg, Figure 2a , Figure 2b and Figure 2c The first shell 210), the second shell 320 (for example, Figure 2a , Figure 2b and Figure 2c The second housing 220), the display 330 (for example, Figure 2a , Figure 2b and Figure 2c 230), hinge structure 340 (eg, Figure 2a , Figure 2b and Figure 2c The first housing 310 may be movable relative to the second housing 320, and the second housing 310 may include a hinge structure 250, a plurality of reinforcing members 350, a plurality of waterproof members 360, a first heat dissipation member 370, and / or a plurality of adhesive members 380.

[0065] According to an embodiment, the first housing 310 may support a portion of the display 330. The first housing 310 may be movable relative to the second housing 320. For example, the first housing 310 may be rotatable relative to the second housing 320. According to an embodiment, the first housing 310 may include a first surface 311 (e.g., Figure 2a , Figure 2b and Figure 2c The first surface 211 and the second surface 312 (eg, Figure 2a , Figure 2b and Figure 2c The first surface 311 may support a portion of the display 330. The first surface 311 may be an inner surface of the portion of the first housing 310 that faces the display 330. The second surface 312 may be opposite to the first surface 311. For example, the direction facing the second surface 312 may be opposite to the direction facing the first surface 311. The second surface 312 may mean an outer surface of the first housing 310 that is opposite to the first surface 311.

[0066] According to an embodiment, the second housing 320 may support another portion of the display 330. The second housing 320 may be movable relative to the first housing 310. For example, the second housing 320 may be rotatable relative to the first housing 310. According to an embodiment, the second housing 320 may include a third surface 321 (e.g., Figure 2a , Figure 2b and Figure 2c The third surface 321) and the fourth surface 322 (for example, Figure 2a , Figure 2b and Figure 2c The third surface 321 may support the other part of the display 330. The third surface 321 may be an inner surface of the second housing 320 facing the other part of the display 330. The fourth surface 322 may be opposite to the third surface 321. For example, the direction facing the fourth surface 322 may be opposite to the direction facing the third surface 321. The fourth surface 322 may mean an outer surface of the second housing 320 opposite to the third surface 321.

[0067] According to an embodiment, the display 330 may be supported by the first housing 310 and the second housing 320. The display 330 may be arranged on the first housing 310 and the second housing 320 across the hinge structure 340. It should be understood that when an element is referred to as "on" another element, it may be directly on the other element, or there may be an intervening element therebetween. In contrast, when an element is referred to as "directly on" another element, there is no intervening element. According to an embodiment, the display 330 may be foldable by the movement of the second housing 320 relative to the first housing 310. For example, as the state of the electronic device 300 changes from an unfolded state in which the direction facing the first surface 311 is substantially the same as the direction facing the third surface 321 to a folded state in which the first surface 311 and the third surface 321 face each other, the display 330 may be folded. In the folded state of the electronic device 300, at least a portion of the display 330 is bent with a curvature. For example, as the state of the electronic device 300 changes from a folded state to an unfolded state, the display 330 may be unfolded. In the unfolded state of the electronic device 300 , the display 330 may be substantially parallel to the first surface 311 of the first housing 310 and the third surface 321 of the second housing 320 .

[0068] According to an embodiment, the hinge structure 340 may rotatably couple the first housing 310 and the second housing 320. For example, the first housing 310 may be coupled to the second housing 320 to be rotatable relative to the second housing 320 through the hinge structure 340. For example, the second housing 320 may be coupled to the first housing 310 to be rotatable relative to the first housing 310 through the hinge structure 340. The hinge structure 340 may fold or unfold the display 330 based on receiving a driving force from the first housing 310 or the second housing 320. According to an embodiment, the hinge structure 340 may include a hinge cover 341, a hinge bracket 342, a first hinge plate 343, a second hinge plate 344, and / or an inner space 345.

[0069] The hinge cover 341 may define an outer surface of the hinge structure 340. For example, the hinge cover 341 may surround the hinge bracket 342, the first hinge plate 343, and the second hinge plate 344. According to an embodiment, the hinge cover 341 may be covered by the first housing 310 and the second housing 320 in the unfolded state of the electronic device 300. The hinge cover 341 may be exposed to the outside of the electronic device 300 in the folded state of the electronic device 300.

[0070] The hinge bracket 342 may support the first hinge plate 343 and the second hinge plate 344. According to an embodiment, the hinge bracket 342 may be coupled to the first hinge plate 343 and the second hinge plate 344. For example, the first hinge plate 343 may be coupled to the hinge bracket 342 to be rotatable relative to the hinge bracket 342. For example, the second hinge plate 344 may be coupled to the hinge bracket 342 to be rotatable relative to the hinge bracket 342. According to an embodiment, the hinge bracket 342 may provide a rotation axis of each of the first hinge plate 343 and the second hinge plate 344. For example, the hinge bracket 342 may include a groove to accommodate each of the first hinge plate 343 and the second hinge plate 344. In the case where the hinge bracket 342 includes a groove, each of the first hinge plate 343 and the second hinge plate 344 may be rotatable along the groove of the hinge bracket 342. According to an embodiment, the hinge bracket 342 may be provided in the hinge cover 341. For example, the hinge bracket 342 may be surrounded by the hinge cover 341 .

[0071] The first hinge plate 343 may be rotatable relative to the hinge cover 341. The first hinge plate 343 may be rotatable relative to the hinge bracket 342. According to an embodiment, the first hinge plate 343 may fold the display 330. For example, the display 330 may be disposed on the first hinge plate 343 across the hinge structure 340. For example, the display 330 may be disposed above the first hinge plate 343 across the hinge structure 340. When the first housing 310 rotates, the first hinge plate 343 may rotate together with the first housing 310. When the first housing 310 rotates, as the first hinge plate 343 rotates relative to the hinge bracket 342, the first hinge plate 343 may fold the display 330 disposed above the first hinge plate 343. According to an embodiment, the angle range of the first hinge plate 343 rotatable relative to the hinge bracket 342 may correspond to the angle range of the first housing 310 rotatable relative to the second housing 320. For example, the angle range of the first hinge plate 343 rotatable relative to the hinge bracket 342 may be the same as the angle range of the first housing 310 rotatable relative to the second housing 320. For example, the angle range of the first hinge plate 343 rotatable relative to the hinge bracket 342 and the angle range of the first housing 310 rotatable relative to the second housing 320 may be 0 degrees to 90 degrees. However, it is not limited thereto. For example, the angle range of the first hinge plate 343 rotatable relative to the hinge bracket 342 may be different from the angle range of the first housing 310 rotatable relative to the second housing 320. The angle range of the first hinge plate 343 rotatable relative to the hinge bracket 342 may be greater than the angle range of the first housing 310 rotatable relative to the second housing 320. For example, the angle range of the first hinge plate 343 rotatable relative to the hinge bracket 342 may be 0 degrees to 100 degrees, and the angle range of the first housing 310 rotatable relative to the second housing 320 may be 0 degrees to 90 degrees.

[0072] The second hinge plate 344 may be rotatable relative to the hinge cover 341. The second hinge plate 344 may be rotatable relative to the hinge bracket 342. According to an embodiment, the second hinge plate 344 may fold the display 330. For example, the display 330 may be disposed on the second hinge plate 344 across the hinge structure 340. For example, the display 330 may be disposed above the second hinge plate 344 across the hinge structure 340. When the second housing 320 rotates, the second hinge plate 344 may rotate together with the second housing 320. When the second housing 320 rotates, as the second hinge plate 344 rotates relative to the hinge bracket 342, the second hinge plate 344 may fold the display 330 disposed above the second hinge plate 344. According to an embodiment, the angle range of the second hinge plate 344 rotatable relative to the hinge bracket 342 may correspond to the angle range of the second housing 320 rotatable relative to the first housing 310. For example, the angle range of the second hinge plate 344 rotatable relative to the hinge bracket 342 may be the same as the angle range of the second housing 320 rotatable relative to the first housing 310. For example, the angle range of the second hinge plate 344 rotatable relative to the hinge bracket 342 and the angle range of the second housing 320 rotatable relative to the first housing 310 may be 0 degrees to 90 degrees. However, it is not limited thereto. For example, the angle range of the second hinge plate 344 rotatable relative to the hinge bracket 342 may be different from the angle range of the second housing 320 rotatable relative to the first housing 310. The angle range of the second hinge plate 344 rotatable relative to the hinge bracket 342 may be greater than the angle range of the second housing 320 rotatable relative to the first housing 310. For example, the angle range of the second hinge plate 344 rotatable relative to the hinge bracket 342 may be 0 degrees to 100 degrees, and the angle range of the second housing 320 rotatable relative to the first housing 310 may be 0 degrees to 90 degrees. According to an embodiment, the second hinge plate 344 may be rotatable on the hinge bracket 342 independently of the first hinge plate 343. For example, since the second hinge plate 344 is spaced apart from the first hinge plate 343 , the second hinge plate 344 may be rotatable independently of the first hinge plate 343 .

[0073] According to an embodiment, in the unfolded state of the electronic device 300, the direction facing the surface 343a of the first hinge plate 343 may be substantially the same as the direction facing the surface 344a of the second hinge plate 344. For example, in the unfolded state of the electronic device 300, the direction facing the surface 343a of the first hinge plate 343 (e.g., +z direction) may be the same as the direction facing the surface 344a of the second hinge plate 344 (e.g., +z direction). The surface 343a of the first hinge plate 343 may face the inner surface 330a of the display 330. The surface 343a of the first hinge plate 343 may be spaced apart from the inner surface 330a of the display 330. The surface 344a of the second hinge plate 344 may face the inner surface 330a of the display 330. The surface 344a of the second hinge plate 344 may be spaced apart from the inner surface 330a of the display 330.

[0074] According to an embodiment, in the unfolded state of the electronic device 300, the direction (e.g., -z direction) facing the other surface 343b of the first hinge plate 343 may be substantially the same as the direction (e.g., -z direction) facing the other surface 344b of the second hinge plate 344. For example, in the unfolded state of the electronic device 300, the direction facing the other surface 343b of the first hinge plate 343 may be the same as the direction facing the other surface 344b of the second hinge plate 344. The other surface 343b of the first hinge plate 343 may be opposite to the surface 343a of the first hinge plate 343. For example, the direction facing the other surface 343b of the first hinge plate 343 may be opposite to the direction facing the surface 343a of the first hinge plate 343. The other surface 344b of the second hinge plate 344 may be opposite to the surface 344a of the second hinge plate 344. For example, the direction facing the other surface 344b of the second hinge plate 344 may be opposite to the direction facing the surface 344a of the second hinge plate 344.

[0075] According to an embodiment, in the unfolded state of the electronic device 300, the side surface 343c of the first hinge plate 343 may face the side surface 344c of the second hinge plate 344. For example, in the unfolded state of the electronic device 300, the direction facing the side surface 343c of the first hinge plate 343 (e.g., -x direction) may be opposite to the direction facing the side surface 344c of the second hinge plate 344 (e.g., +x direction). The side surface 343c of the first hinge plate 343 may connect the surface 343a of the first hinge plate 343 and the other surface 343b of the first hinge plate 343. For example, the side surface 343c of the first hinge plate 343 may be perpendicular to the surface 343a of the first hinge plate 343. The side surface 344c of the second hinge plate 344 may connect the surface 344a of the second hinge plate 344 and the other surface 344b of the second hinge plate 344. For example, the side surface 344 c of the second hinge plate 344 may be perpendicular to the surface 344 a of the second hinge plate 344 .

[0076] According to an embodiment, as the state of the electronic device 300 changes from the unfolded state to the folded state, the distance between the first hinge plate 343 and the second hinge plate 344 may increase. For example, as the state of the electronic device 300 changes from the unfolded state to the folded state, the distance between the surface 343a of the first hinge plate 343 and the surface 344a of the second hinge plate 344 may increase.

[0077] According to an embodiment, in the folded state of the electronic device 300, the surface 343a of the first hinge plate 343 may face the surface 344a of the second hinge plate 344. For example, in the folded state of the electronic device 300, the direction facing the surface 343a of the first hinge plate 343 may be opposite to the direction facing the surface 344a of the second hinge plate 344 (e.g., -x direction). According to an embodiment, in the folded state of the electronic device 300, the direction facing the other surface 343b of the first hinge plate 343 may be opposite to the direction facing the other surface 344b of the second hinge plate 344 (e.g., +x direction). According to an embodiment, in the folded state of the electronic device 300, the direction facing the side surface 343c of the first hinge plate 343 (e.g., -z direction) may correspond to the direction facing the side surface 344c of the second hinge plate 344 (e.g., -z direction). For example, in the folded state of the electronic device 300 , the direction that the side surface 343 c of the first hinge plate 343 faces may be the same as the direction that the side surface 344 c of the second hinge plate 344 faces.

[0078] The inner space 345 of the hinge structure 340 may be provided between the first housing 310 and the second housing 320. According to an embodiment, the inner space 345 of the hinge structure 340 may mean an empty space provided between the first hinge plate 343 and the second hinge plate 344 and the hinge cover 341. For example, in the unfolded state of the electronic device 300, the inner space 345 of the hinge structure 340 may be provided on the other surface 343b of the first hinge plate 343 and the other surface 344b of the second hinge plate 344. According to an embodiment, the electronic device 300 may include a flexible printed circuit board 301. The flexible printed circuit board 301 may extend from the first housing 310 to the second housing 320 across the hinge structure 340. The flexible printed circuit board 301 may form an electrical connection between electronic components in the first housing 310 and electronic components in the second housing 320. According to an embodiment, the flexible printed circuit board 301 may pass through the inner space 345 of the hinge structure 340. For example, in the unfolded state of the electronic device 300, the flexible printed circuit board 301 may be disposed on the other surface 343b of the first hinge plate 343 and the other surface 344b of the second hinge plate 344. For example, at least a portion of the flexible printed circuit board 301 may be in contact with the other surface 343a of the first hinge plate 343 and the other surface 344a of the second hinge plate 344. For example, at least a portion of the flexible printed circuit board 301 may be spaced apart from the other surface 343a of the first hinge plate 343 and the other surface 344a of the second hinge plate 344.

[0079] A plurality of reinforcing members 350 may support the display 330. According to an embodiment, a plurality of reinforcing members 350 may be attached to the display 330. For example, according to an embodiment, a plurality of reinforcing members 350 may be attached to the inner surface 330a of the display 330. Because a plurality of reinforcing members 350 are attached to the inner surface 330a of the display 330 and are disposed above the hinge structure 340, a plurality of reinforcing members 350 may be spaced apart from the hinge structure 340. According to an embodiment, a plurality of reinforcing members 350 may strengthen the rigidity of the display 330. For example, a plurality of reinforcing members 350 may be made of a material having rigidity (e.g., metal). For example, a plurality of reinforcing members 350 may be referred to as reinforcing members. According to an embodiment, a plurality of reinforcing members 350 may include a first reinforcing member 351 and a second reinforcing member 352.

[0080] The first reinforcement member 351 may be provided on the first hinge plate 343 and the first housing 310. According to an embodiment, the first reinforcement member 351 may be spaced apart from the first hinge plate 343. For example, the first reinforcement member 351 may be spaced apart from the surface 343a of the first hinge plate 343 in the direction in which the surface 343a of the first hinge plate 343 faces. According to an embodiment, the first reinforcement member 351 may be located in the direction (e.g., +z direction) in which the surface 343a of the first hinge plate 343 faces. For example, the surface of the first reinforcement member 351 may be provided on the inner surface 330a of the display 330, and the other surface of the first reinforcement member 351 opposite to the surface of the first reinforcement member 351 may face the surface 343a of the first hinge plate 343.

[0081] The second reinforcement member 352 may be disposed on the second hinge plate 344 and the second housing 320. According to an embodiment, the second reinforcement member 352 may be spaced apart from the second hinge plate 344. For example, the second reinforcement member 352 may be spaced apart from the surface 344a of the second hinge plate 344 in the direction in which the surface 344a of the second hinge plate 344 faces. According to an embodiment, the second reinforcement member 352 may be located in the direction (e.g., +z direction) in which the surface 344a of the second hinge plate 344 faces. For example, the surface of the second reinforcement member 352 may be disposed on the inner surface 330a of the display 330, and another surface of the second reinforcement member 352 opposite to the surface of the second reinforcement member 352 may face the surface 344a of the second hinge plate 344. According to an embodiment, the second reinforcement member 352 may be spaced apart from the first reinforcement member 351. For example, the second reinforcement member 352 and the first reinforcement member 351 may be separated from each other. For example, in the case where a plurality of reinforcement members 350 are integrally formed, the plurality of reinforcement members 350 may be damaged by folding the display 330. According to an embodiment, the electronic device 300 may provide a structure capable of reducing damage to a plurality of reinforcement members 350 due to the folding of the display 330 through the first reinforcement member 351 and the second reinforcement member 352 spaced apart from each other.

[0082] The plurality of waterproof members 360 may reduce the inflow of moisture into the interior of the electronic device 300. According to an embodiment, the plurality of waterproof members 360 may be disposed on the first housing 310 and the second housing 320. For example, the plurality of waterproof members 360 may be disposed along the periphery of the first housing 310 and the periphery of the second housing 320. According to an embodiment, the plurality of waterproof members 360 may attach the display 330 to the first housing 310 and the second housing 320. For example, the plurality of waterproof members 360 may be attached to the plurality of reinforcement members 350 disposed on the inner surface 330a of the display 330. For example, the plurality of waterproof members 360 may be a tape including an adhesive material, but is not limited thereto. According to an embodiment, the plurality of waterproof members 360 may include a first waterproof member 361 and a second waterproof member 362. The first waterproof member 361 may be disposed on the first housing 310. According to an embodiment, the first waterproof member 361 may be disposed between the display 330 and the first housing 310. For example, the first waterproof member 361 may be disposed between the first reinforcement member 351 and the first housing 310. The second waterproof member 362 may be disposed on the second housing 320. According to an embodiment, the second waterproof member 362 may be disposed between the display 330 and the second housing 320. For example, the second waterproof member 362 may be disposed between the second reinforcement member 352 and the second housing 320. According to an embodiment, the second waterproof member 362 may be spaced apart from the first waterproof member 361. For example, the hinge structure 340 may be disposed between the first waterproof member 361 and the second waterproof member 362.

[0083] According to an embodiment, a plurality of waterproof members 360 may separate the display 330 from the first hinge plate 343 and the second hinge plate 344. For example, the display 330 may be spaced apart from the first hinge plate 343 and the second hinge plate 344 by the thickness of each of the plurality of waterproof members 360. In the unfolded state of the electronic device 300, the thickness of a component may mean a distance extending in a direction parallel to the direction in which the inner surface 330a of the display 330 faces (e.g., -z direction), and corresponding expressions may be used in the same manner below unless otherwise specified. The first waterproof member 361 may separate the display 330 from the first hinge plate 343. The second waterproof member 362 may separate the display 330 from the second hinge plate 344.

[0084] The first heat dissipation member 370 may dissipate heat generated inside the electronic device 300. For example, the first heat dissipation member 370 may transfer heat generated in the first housing 310 to the second housing 320, or transfer heat generated in the second housing 320 to the first housing 310. As the first heat dissipation member 370 dissipates heat generated inside the electronic device 300, the heat may not be concentrated inside the electronic device 300. For example, in the case where the heat generated in the first housing 310 is concentrated inside the first housing 310, the heat may deteriorate the performance of the electronic components in the first housing 310 by being transferred to the electronic components in the first housing 310. According to an embodiment, the electronic device 300 may provide a structure capable of ensuring the performance of the electronic components of the electronic device 300 by the first heat dissipation member 370 for dissipating the heat generated in the electronic device 300. According to an embodiment, the first heat dissipation member 370 may be made of a material having high thermal conductivity. For example, the first heat dissipation member 370 may include graphite, but is not limited thereto.

[0085] According to an embodiment, the first heat dissipation member 370 may extend from the first housing 310 to the second housing 320 across the hinge structure 340. For example, the first heat dissipation member 370 may be disposed between the first waterproof member 361 disposed on the first housing 310 and the second waterproof member 362 disposed on the second housing 320. For example, the first heat dissipation member 370 may extend between the first waterproof member 361 and the second waterproof member 362 across the hinge structure 340. According to an embodiment, the first heat dissipation member 370 may include a first area 371, a second area 372, and / or a third area 373.

[0086] The first region 371 may be disposed on the first hinge plate 343. For example, the first region 371 may be interposed between the first reinforcement member 351 and the surface 343a of the first hinge plate 343. According to an embodiment, when the display 330 is observed from above (e.g., in the +z direction), the first region 371 may overlap with the first hinge plate 343. For example, when the display 330 is observed from above, the first region 371 may overlap with the surface 343a of the first hinge plate 343. According to an embodiment, when the state of the electronic device 300 changes, the first region 371 may move together with the first hinge plate 343. For example, when the first hinge plate 343 moves, the first region 371 may maintain a shape parallel to the surface 343a of the first hinge plate 343. For example, the shape of the first region 371 may not be deformed by the movement of the first hinge plate 343.

[0087] The second area 372 may be disposed on the second hinge plate 344. For example, the second area 372 may be interposed between the second reinforcement member 352 and the surface 344a of the second hinge plate 344. According to an embodiment, when the display 330 is observed from above (e.g., in the +z direction), the second area 372 may overlap with the second hinge plate 344. For example, when the display 330 is observed from above, the second area 372 may overlap with the surface 344a of the second hinge plate 344. According to an embodiment, when the state of the electronic device 300 changes, the second area 372 may move with the second hinge plate 344. For example, when the second hinge plate 344 moves, the second area 372 may maintain a shape parallel to the surface 344a of the second hinge plate 344. For example, the shape of the second area 372 may not be deformed by the movement of the second hinge plate 344.

[0088] The third region 373 may connect the first region 371 and the second region 372. The second region 373 may be disposed between the first region 371 and the second region 372. According to an embodiment, in the unfolded state of the electronic device 300, the third region 373 may pass through a gap between a side surface 343c of the first hinge plate 343 and a side surface 344c of the second hinge plate 344 facing each other. For example, in the unfolded state of the electronic device 300, at least a portion of the third region 373 may be disposed in the inner space 345 of the hinge structure 340 by passing through a gap between the side surface 343c of the first hinge plate 343 and the side surface 344c of the second hinge plate 344. For example, in the unfolded state of the electronic device 300, at least a portion of the third region 373 may face the flexible printed circuit board 301 disposed in the inner space 345 of the hinge structure 340. For example, in the unfolded state of the electronic device 300, at least a portion of the third region 373 may contact the flexible printed circuit board 301. For example, in the unfolded state of the electronic device 300, at least a portion of the third region 373 may be spaced apart from the flexible printed circuit board 301. According to an embodiment, as the state of the electronic device 300 changes, the third region 373 may be deformable. For example, the third region 373 may be foldable by the movement of the first hinge plate 343 and the second hinge plate 344. According to an embodiment, the third region 373 may be bent in the unfolded state of the electronic device 300. For example, in the unfolded state of the electronic device 300, at least a portion of the third region 373 may be bent between the side surface 343c of the first hinge plate 343 and the side surface 344c of the second hinge plate 344. In the unfolded state of the electronic device 300, at least a portion of the third region 373 may be bent within the internal space 345 of the hinge structure 340. As the state of the electronic device 300 changes from the unfolded state to the folded state, the third region 373 may be unfolded. For example, the third region 373 may have a linearly extending shape in the folded state of the electronic device 300. According to an embodiment, as the state of the electronic device 300 changes from the folded state to the unfolded state, the third region 373 may be folded. For example, as the state of the electronic device 300 changes from the unfolded state to the folded state, the distance between the surface 343a of the first hinge plate 343 and the surface 344a of the second hinge plate 344 may increase. When the distance between the surface 343a of the first hinge plate 343 and the surface 344a of the second hinge plate 344 increases, stress may be applied to the third region 373 because the distance between the first region 371 and the second region 372 increases. When the third region 373 is not deformable, the third region 373 may be damaged by stress generated by repeated state changes of the electronic device 300.According to the embodiment, the electronic device 300 may provide a structure capable of reducing damage to the first heat dissipation member 370 caused by repeated state changes of the electronic device 300 through the deformable third region 373 .

[0089] According to an embodiment, in the unfolded state of the electronic device 300, the distance between the first reinforcement member 351 and the second reinforcement member 352 is shorter than the distance between the first hinge plate 343 and the second hinge plate 344. For example, in the case where the first heat dissipation member 370 is disposed between the plurality of reinforcement members 350 and the display 330, in the unfolded state of the electronic device 300, the third region 373 of the first heat dissipation member 370 may pass through the gap between the first reinforcement member 351 and the second reinforcement member 352. In the case where the third region 373 passes between the first reinforcement member 351 and the second reinforcement member 352, the size of the gap between the first reinforcement member 351 and the second reinforcement member 352 may be greater than or equal to the size of the third region 373. For example, in the case where the heat dissipation member 370 is disposed between the plurality of reinforcement members 350 and the display 330, in the unfolded state of the electronic device 300, the size of the gap between the first reinforcement member 351 and the second reinforcement member 352 may be greater than or equal to the thickness of the third region 373 disposed between the first hinge plate 343 and the second hinge plate 343. As the size of the gap between the first reinforcement member 351 and the second reinforcement member 352 increases, the area of ​​the display 330 corresponding to the gap between the first reinforcement member 351 and the second reinforcement member 352 may be vulnerable to impact damage applied from the outside of the electronic device 300. According to an embodiment, the electronic device 300 may provide a structure capable of reducing damage to the display 330 due to impact by the first heat dissipation member 370 disposed under the plurality of reinforcement members 350. For example, because the first heat dissipation member 370 is disposed under the plurality of reinforcement members 350, the distance between the first reinforcement member 351 and the second reinforcement member 352 may be reduced compared to the case where the first heat dissipation member 370 is disposed between the display 330 and the plurality of reinforcement members 350. As the distance between the first reinforcement member 351 and the second reinforcement member 352 is reduced, the display 330 may have a robust structure against external impact.

[0090] According to an embodiment, in the folded state of the electronic device 300, the third region 373 of the first heat dissipation member 370 may be spaced apart from the first reinforcement member 351 and the second reinforcement member 352. For example, in the folded state of the electronic device 300, the third region 373 may be spaced apart from the first reinforcement member 351 and the second reinforcement member 352 and face the first reinforcement member 351 and the second reinforcement member 352. For example, in the folded state of the electronic device 300, in the case where the third region 373 contacts the first reinforcement member 351 and the second reinforcement member 352, the third region 373 may be damaged by the first reinforcement member 351 and the second reinforcement member 352. According to an embodiment, since the third region 373 is spaced apart from the first reinforcement member 351 and the second reinforcement member 352, the electronic device 300 may provide a structure capable of reducing damage to the first heat dissipation member 370 generated as the state change of the electronic device 300 is repeated. According to an embodiment, in the folded state of the electronic device 300, at least a portion of the third region 373 may face the flexible printed circuit board 301. For example, in the folded state of the electronic device 300, at least a portion of the third region 373 may be in contact with the flexible printed circuit board 301. For example, in the folded state of the electronic device 300, at least a portion of the third region 373 may be spaced apart from the flexible printed circuit board 301. According to an embodiment, the thickness of the first heat dissipation member 370 may be less than or equal to the thickness of each of the plurality of waterproof members 361. For example, the thickness of the first heat dissipation member 370 may be less than or equal to the thickness of each of the first waterproof member 361 and the second waterproof member 362. According to an embodiment, the thickness of the first region 371 may be less than or equal to the thickness of the first waterproof member 361. For example, the thickness of the first region 371 may correspond to the thickness of the first waterproof member 361. For example, the thickness of the first region 371 may be thinner than the thickness of the first waterproof member 361. According to an embodiment, the thickness of the second region 372 may be less than or equal to the thickness of the second waterproof member 362. For example, the thickness of the second region 372 may correspond to the thickness of the second waterproof member 362. For example, the thickness of the second region 372 may be thinner than the thickness of the second waterproof member 362. According to an embodiment, the thickness of the third area 373 may correspond to the thickness of the first area 371 and the thickness of the second area 372, but is not limited thereto. For example, the thickness of the third area 373 may be thinner than the thickness of each of the first area 371 and the second area 372. For example, in the case where the thickness of the first heat dissipation member 370 is thicker than the thickness of each of the plurality of waterproof members 360, the thickness of the electronic device 300 may be increased by the thickness of the first heat dissipation member 370. According to an embodiment, the electronic device 300 may provide a structure capable of reducing the increase in the thickness of the electronic device 300 due to the first heat dissipation member 370 by means of the first heat dissipation member 370 having a thickness less than or equal to the thickness of each of the plurality of waterproof members 360.

[0091] A plurality of adhesive members 380 may attach the first heat dissipation member 370 to the first hinge plate 343 and the second hinge plate 344. For example, the plurality of adhesive members 380 may include an adhesive material for coupling the first heat dissipation member 370, the first hinge plate 343, and the second hinge plate 344. For example, the plurality of adhesive members 380 may include a pressure sensitive adhesive (PSA), but is not limited thereto. According to an embodiment, the plurality of adhesive members 380 may include a first adhesive member 381 and a second adhesive member 382. The first adhesive member 381 may couple the first region 371 and the first hinge plate 343. According to an embodiment, the first adhesive member 381 may be disposed between the surface 343a of the first hinge plate 343 and the first region 371. For example, the first adhesive member 381 may contact the surface 343a of the first hinge plate 343 and the first region 371. The second adhesive member 382 may couple the second region 372 to the second hinge plate 344. According to an embodiment, the second adhesive member 382 may be disposed between the surface 344a of the second hinge plate 344 and the second region 372. For example, the second adhesive member 382 may contact the surface 344 a of the second hinge plate 344 and the second region 372 .

[0092] According to an embodiment, in the unfolded state of the electronic device 300, the side surface 343c of the first hinge plate 343 and the side surface 344c of the second hinge plate 344 may be spaced apart from the plurality of adhesive members 380. For example, the position of the end 381a of the first adhesive member 381 may correspond to the position of the end of the surface 343a of the first hinge plate 343. For example, the first adhesive member 381 may be in contact with only the surface 343a of the first hinge plate 343, and may not be in contact with the side surface 343c of the first hinge plate 343. For example, the position of the end 382a of the second adhesive member 382 may correspond to the position of the end of the surface 344a of the second hinge plate 344. For example, the second adhesive member 382 may be in contact with only the surface 344a of the second hinge plate 344, and may not be in contact with the side surface 344c of the second hinge plate 344. In the case where the plurality of adhesive members 380 are in contact with the side surface 343c of the first hinge plate 343 and the side surface 344c of the second hinge plate 344 in the unfolded state of the electronic device 300, the plurality of adhesive members 380 may be in contact with or separated from the third region 373 when the state change of the electronic device 300 is repeated. As the contact and separation between the plurality of adhesive members 380 and the third region 373 are repeated, noise may be generated from the third region 373. According to an embodiment, in the unfolded state of the electronic device 300, since the side surface 343c of the first hinge plate 343 and the side surface 344c of the second hinge plate 344 are spaced apart from the plurality of adhesive members 380, the electronic device 300 may provide a structure capable of reducing noise that may be generated due to the state change of the electronic device 300.

[0093] As described above, according to the embodiment, the electronic device 300 can provide a structure capable of dissipating heat in the first housing 310 and the second housing 320 while reducing damage to the display 330 due to external impact by the first heat dissipation member 370 disposed under the plurality of reinforcement members 350 .

[0094] Figure 4a is a cross-sectional view showing an example cut along an exemplary electronic device in an unfolded state, Figure 4b is a cross-sectional view showing an example cut along an exemplary electronic device in a folded state.

[0095] Reference Figure 4a and Figure 4b According to an embodiment, the electronic device 300 may further include a plurality of second heat dissipation members 390. The plurality of second heat dissipation members 390 may transfer heat generated in the first housing 310 to the first heat dissipation member 370. The plurality of second heat dissipation members 390 may transfer heat generated in the second housing 320 to the first heat dissipation member 370. According to an embodiment, the plurality of second heat dissipation members 390 may be disposed between the first heat dissipation member 370 and the plurality of reinforcement members 350. For example, each of the plurality of second heat dissipation members 390 may include graphite, but is not limited thereto. According to an embodiment, the plurality of second heat dissipation members 390 disposed on the first heat dissipation member 370 may improve heat exchange efficiency in the first housing 310 and the second housing 320. Since the size of a path through which heat generated in the electronic device 300 may move is significantly expanded by the plurality of second heat dissipation members 390 disposed on the first heat dissipation member 370, the heat exchange efficiency in the first housing 310 and the second housing 320 may be improved. According to an embodiment, the plurality of second heat dissipation members 390 may include a second heat dissipation member 391 and a third heat dissipation member 392.

[0096] The second heat dissipation member 391 may be disposed on the surface 343a of the first hinge plate 343. According to an embodiment, the second heat dissipation member 391 may be disposed between the first region 371 and the first reinforcement member 351. When the first hinge plate 340 moves, the second heat dissipation member 391 may move together with the first hinge plate 343. For example, when the first hinge plate 343 moves, the second heat dissipation member 391 may maintain a shape parallel to the first region 371. For example, the shape of the second heat dissipation member 391 may not be deformed by the movement of the first hinge plate 343.

[0097] The third heat dissipation member 392 may be disposed on the surface 344a of the second hinge plate 344. According to an embodiment, the third heat dissipation member 392 may be disposed between the second region 372 and the second reinforcement member 352. When the second hinge plate 344 moves, the third heat dissipation member 392 may move together with the second hinge plate 344. For example, when the second hinge plate 344 moves, the third heat dissipation member 392 may maintain a shape parallel to the second region 372. For example, the shape of the third heat dissipation member 392 may not be deformed by the movement of the second hinge plate 344. The third heat dissipation member 392 may be spaced apart from the second heat dissipation member 391. For example, the third region 373 of the first heat dissipation member 370 may be disposed between the third heat dissipation member 392 and the second heat dissipation member 391.

[0098] According to an embodiment, the second heat dissipation member 391 and the third heat dissipation member 392 may not be disposed on the third region 373 of the first heat dissipation member 370. For example, when the third region 373 is folded, a compressive force may be applied to a surface 373a of the third region 373, and a tensile force may be applied to another surface 373b of the third region 373 opposite to the surface 373a of the third region 373. Because the difference between the compressive force applied to the surface 373a of the third region 373 and the tensile force applied to the other surface 373b of the third region 373 increases as the thickness of the third region 373 increases, the possibility of damage to the third region 373 may increase as the thickness of the third region 373 increases. According to an embodiment, the electronic device 300 may provide a structure capable of heat exchange between the first housing 310 and the second housing 320 while reducing damage to the first heat dissipation member 370 by the second heat dissipation member 391 disposed on the first region 371 and the third heat dissipation member 392 disposed on the second region 372. For example, since the second heat dissipation member 391 and the third heat dissipation member 392 are not disposed in the third region 373 , the third region 373 , which is vulnerable to damage, may have a relatively thin thickness.

[0099] According to an embodiment, in the unfolded state of the electronic device 300, the side surface 391a of the second heat dissipation member 391 and the side surface 392a of the third heat dissipation member 392 may face each other. For example, in the unfolded state of the electronic device 300, the direction facing the side surface 391a of the second heat dissipation member 391 (e.g., +x direction) may be opposite to the direction facing the side surface 392a of the third heat dissipation member 392 (e.g., -x direction). According to an embodiment, in the folded state of the electronic device 300, the second heat dissipation member 391 and the third heat dissipation member 392 may be substantially perpendicular to the third region 373.

[0100] As described above, according to an embodiment, the electronic device 300 can provide a structure that can perform heat exchange between the first shell 310 and the second shell 320 while increasing the life of the first heat dissipation member 370 by setting the second heat dissipation member 391 on the first area 371 and the third heat dissipation member 392 on the second area 372.

[0101] Figure 5a is a cross-sectional view showing an example cut along an exemplary electronic device in an unfolded state, Figure 5b is a cross-sectional view showing an example cut along an exemplary electronic device in a folded state.

[0102] because Figure 5a and Figure 5b The electronic device 300 may be a structure in which the hinge structure 340 is Figure 3a , Figure 3b and Figure 3c The electronic device 300 has been changed, so redundant description is omitted.

[0103] Reference Figure 5a and Figure 5b According to an embodiment, the display 330 may include a first display area 331 (eg, Figure 2a The first display area 231), the second display area 332 (for example, Figure 2a The second display area 232) and the third display area 333 (for example, Figure 2a The first display area 331 may be disposed on the first housing 310. For example, the first display area 331 may be disposed on the first surface 311 of the first housing 310. The second display area 332 may be disposed on the second housing 320. The second display area 332 may be spaced apart from the first display area 331. For example, the second display area 332 may be disposed on the third surface 321 of the second housing 310. The third display area 333 may be disposed between the first display area 331 and the second display area 332. For example, the third display area 333 may be disposed on the hinge structure 340.

[0104] According to an embodiment, the rotation angle range of the first housing 310 rotatable relative to the second housing 320 may be smaller than that relative to the hinge bracket (eg, Figure 3aThe rotation angle range of the first hinge plate 343 that can rotate relative to the hinge bracket 342 of the electronic device 300 can be smaller than the rotation angle range of the second hinge plate 344 that can rotate relative to the hinge bracket 342. For example, when the state of the electronic device 300 changes from the unfolded state to the folded state, the first housing 310 and the second housing 320 can be rotated 90 degrees respectively, and the first hinge plate 343 and the second hinge plate 344 can be rotated 100 degrees respectively. According to an embodiment, because the rotation angle ranges of the first hinge plate 343 and the first housing 310 are different, the electronic device 300 can provide a structure in which the curvature of at least a portion of the third display area 330 changes smoothly. For example, in the case where the first hinge plate 343 faces the second hinge plate 344 in the folded state of the electronic device 300, the curvature of the third display area 333 can be quickly changed between the first hinge plate 343 and the second hinge plate 344. According to an embodiment, since the first hinge plate 343 is inclined relative to the second hinge plate 344 in the unfolded state of the electronic device 300, the electronic device 300 provides a structure in which the curvature of the third display area 333 changes gently. According to an embodiment, since the curvature of the third display area 333 changes gently, the electronic device 300 can provide a structure that reduces the formation of wrinkles on the display 330.

[0105] According to an embodiment, in the folded state of the electronic device 300, the surface 343a of the first hinge plate 343 may be inclined relative to the first surface 311 of the first housing 310. In the folded state of the electronic device 300, the surface 344a of the second hinge plate 344 may be inclined relative to the third surface 321 of the second housing 320. According to an embodiment, in the folded state of the electronic device 300, the surface 343a of the first hinge plate 343 may be inclined relative to the surface 344a of the second hinge plate 344. Since the surface 343a of the first hinge plate 343 is inclined relative to the first surface 311, the first display area 331 disposed on the first surface 311 may be inclined relative to a portion 333a of the third display area 333 disposed on the surface 343a of the first hinge plate 343. Since the surface 344 a of the second hinge plate 344 is inclined relative to the third surface 321 , the second display area 331 disposed on the third surface 321 may be inclined relative to another portion 333 b of the third display area 333 disposed on the surface 344 a of the second hinge plate 344 .

[0106] According to an embodiment, the hinge structure 340 may include a third hinge plate 346. The third hinge plate 346 may support the display 330. For example, the third hinge plate 346 may support a third display area 333 of the display 330 disposed on the third hinge plate 346. According to an embodiment, the third hinge plate 346 may be coupled to a hinge bracket (e.g., Figure 3a The third hinge plate 346 may be fixed to the hinge bracket 342. For example, the third hinge plate 346 may be fixed to the hinge bracket 342. Since the third hinge plate 346 is fixed to the hinge bracket 342, when the first hinge plate 343 and the second hinge plate 344 move, the third hinge plate 346 may not move. According to an embodiment, the third hinge plate 346 may be disposed between the first hinge plate 343 and the second hinge plate 344. According to an embodiment, the third region 373 of the first heat dissipation member 370 may include a fixed portion 373c, a first extension portion 373d, and a second extension portion 373e.

[0107] The fixing portion 373c may be disposed on the third hinge plate 346. For example, the fixing portion 373c may be disposed on the surface 346a of the third hinge plate 346. According to an embodiment, the fixing portion 373c may be fixed to the third hinge plate 346. For example, the fixing portion 373c may be fixed to the surface 346a of the third hinge plate 346. According to an embodiment, the fixing portion 373c may be spaced apart from the first area 371 and the second area 372.

[0108] The first extension portion 373d may be disposed between the first hinge plate 343 and the third hinge plate 346. For example, the first extension portion 373d may connect the first region 371 to the fixed portion 373c. According to an embodiment, in the unfolded state of the electronic device 300, the first extension portion 373d is disposed in a gap between the side surface 343c of the first hinge plate 343 and the first side surface 346b of the third hinge plate 346 facing the side surface 343c of the first hinge plate 343. For example, in the unfolded state of the electronic device 300, the first extension portion 373d may pass through the gap between the side surface 343c of the first hinge plate 343 and the first side surface 346b of the third hinge plate 346. For example, in the unfolded state of the electronic device 300, at least a portion of the first extension portion 373d may be disposed in the internal space 345 of the hinge structure 340. According to an embodiment, at least a portion of the first extension portion 373d may be deformable by movement of the first hinge plate 343 and the second hinge plate 344. In the unfolded state of the electronic device 300, at least a portion of the first extension portion 373d may be bent between the side surface 343c of the first hinge plate 343 and the first side surface 346b of the third hinge plate 346. As the state of the electronic device 300 changes from the unfolded state to the folded state, the first extension portion 373d may be unfolded. As the state of the electronic device 300 changes from the folded state to the unfolded state, the first extension portion 373d may be folded.

[0109] The second extension portion 373e may be disposed between the second hinge plate 344 and the third hinge plate 346. For example, the second extension portion 373e may connect the second region 372 to the fixed portion 373c. According to an embodiment, in the unfolded state of the electronic device 300, the second extension portion 373e is disposed in a gap between the side surface 344c of the second hinge plate 344 and the second side surface 346c of the third hinge plate 346 facing the side surface 344c of the second hinge plate 344. For example, in the unfolded state of the electronic device 300, the second extension portion 373e may pass through the gap between the side surface 343c of the second hinge plate 344 and the second side surface 346c of the third hinge plate 346. For example, in the unfolded state of the electronic device 300, at least a portion of the second extension portion 373e may be disposed in the internal space 345 of the hinge structure 340. According to an embodiment, at least a portion of the second extension portion 373e may be deformable by movement of the second hinge plate 344 and the second hinge plate 344. In the unfolded state of the electronic device 300, at least a portion of the second extension portion 373e may be bent between the side surface 344c of the second hinge plate 344 and the second side surface 346c of the third hinge plate 346. As the state of the electronic device 300 changes from the unfolded state to the folded state, the second extension portion 373e may be unfolded. As the state of the electronic device 300 changes from the folded state to the unfolded state, the second extension portion 373e may be folded.

[0110] According to an embodiment, the electronic device 300 may include a buffer member 334. The buffer member 334 may buffer the impact transmitted from the third hinge plate 346 to the display 330. The buffer member 334 may have flexibility. For example, the buffer member 334 may include thermoplastic polyurethane (TPU), but is not limited thereto. According to an embodiment, the buffer member 334 may be disposed on the third area 333 of the display 330. For example, the buffer member 334 may be attached to the inner surface 330a of the display 330. According to an embodiment, the buffer member 334 may be disposed between the first reinforcement member 351 and the second reinforcement member 352. For example, the buffer member 334 may face the first heat dissipation member 370. According to an embodiment, the buffer member 334 may be disposed between a plurality of second heat dissipation members 390 spaced apart from each other. For example, the buffer member 334 may be disposed between the second heat dissipation member 391 and the third heat dissipation member 392, the second heat dissipation member 391 is disposed between the first reinforcement member 351 and the first area 371, and the third heat dissipation member 392 is disposed between the second reinforcement member 352 and the second area 372. According to an embodiment, the buffer member 334 may be deformable by movement of the first hinge plate 343 and the second hinge plate 344 for folding the display 330. For example, it may be parallel to the third hinge plate 346 in the unfolded state of the electronic device 300. As the state of the electronic device 300 changes from the unfolded state to the folded state, the buffer member 334 may be bent with a curvature corresponding to the shape of the third region 333 of the display 330.

[0111] As described above, according to an embodiment, the electronic device 300 can provide a structure capable of reducing damage to the first heat dissipation member 370 caused by repeated state changes of the electronic device 300 by deforming the first extension portion 373d and the second extension portion 373e of the folding display 330 through the movement of the first hinge plate 343 and the second hinge plate 344.

[0112] An electronic device may include housings that are rotatable relative to each other. An electronic component may be disposed within each housing. Because the housings are separated from each other, heat generated from an electronic component in one housing may not be transferred to another housing and may be concentrated in the housing. In the event that heat is concentrated in the housing, the performance of the electronic component may deteriorate or the life of the electronic component may be shortened. The electronic device may require a structure capable of dissipating the heat generated in the housing to another housing.

[0113] According to an embodiment, an electronic device (e.g., Figure 3a , Figure 3b and Figure 3c The electronic device 300 may include a hinge structure (eg, Figure 3a , Figure 3b and Figure 3cThe hinge structure 340 includes a first hinge plate (eg, Figure 3a , Figure 3b and Figure 3c A first hinge plate 343 of the embodiment of the present invention, a second hinge plate different from the first hinge plate (for example, Figure 3a , Figure 3b and Figure 3c The second hinge plate 344 of the embodiment of the present invention is provided, and a hinge bracket (for example, a hinge bracket) rotatably connecting the first hinge plate and the second hinge plate. Figure 3a According to an embodiment, the electronic device may include a display (eg, Figure 3a , Figure 3b and Figure 3c According to an embodiment, the electronic device may include a plurality of reinforcing members (eg, Figure 3b and Figure 3c A plurality of reinforcing members 350), the plurality of reinforcing members including a first reinforcing member (eg, Figure 3b and Figure 3c The first reinforcing member 351 and the second reinforcing member (eg, Figure 3b and Figure 3c The second reinforcing member 352 of the first hinge plate is provided, and the first reinforcing member faces the surface of the first hinge plate (eg, Figure 3b and Figure 3c The second reinforcing member faces a surface 343a of the second hinge plate and is spaced apart from the first hinge plate. Figure 3b and Figure 3c According to an embodiment, the electronic device may include a first heat dissipation member (eg, Figure 3b and Figure 3c The first heat dissipation member 370 includes a first region (eg, Figure 3b and Figure 3c The first area 371 of the second reinforcing member and the second area between the surfaces of the second hinge plate (eg, Figure 3b and Figure 3c The second region 372 of the hinge plate 370 is connected to the first region and the second region and is deformable by the movement of the first hinge plate and the second hinge plate. Figure 3b and Figure 3c According to an embodiment, in the unfolded state of the electronic device in which the direction facing the surface of the first hinge plate corresponds to the direction facing the surface of the second hinge plate, at least a portion of the third area may be provided on the side surfaces of the first hinge plates facing each other (e.g., Figure 3b and Figure 3cThe side surface 343c of the hinge plate and the side surface of the second hinge plate (eg, Figure 3b and Figure 3c within the gap between the side surfaces 344).

[0114] According to the embodiment, the electronic device can provide a structure capable of dissipating heat in the first housing and the second housing while reducing damage to the display due to external impact through the first heat dissipation member disposed under the plurality of reinforcement members.

[0115] According to an embodiment, in the unfolded state, a size of a gap between the first reinforcement member and the second reinforcement member may be smaller than a size of a gap between the first hinge plate and the second hinge plate.

[0116] According to the embodiment, since the size of the gap between the first reinforcement member and the second reinforcement member is minimized, the electronic device may provide a structure capable of reducing damage to the display due to an external impact.

[0117] According to an embodiment, the electronic device may include a first housing (eg, Figure 3a , Figure 3b and Figure 3c According to an embodiment, the electronic device may include a second housing (eg, Figure 3a , Figure 3b and Figure 3c The second housing 320 is connected to the first housing to be rotatable relative to the first housing through a hinge structure. According to an embodiment, the electronic device may include a first waterproof member (eg, Figure 3b and Figure 3c According to an embodiment, the electronic device may include a second waterproof member (eg, Figure 3b and Figure 3c According to an embodiment, the first heat dissipation member may be disposed between the first waterproof member and the second waterproof member.

[0118] Since the first heat dissipation member is disposed between the first waterproof member and the second waterproof member, the electronic device according to the embodiment may provide a structure capable of reducing an increase in thickness of the electronic device due to the first heat dissipation member.

[0119] According to an embodiment, a thickness of the first heat dissipation member may be less than or equal to a thickness of each of the first waterproof member and the second waterproof member.

[0120] According to an embodiment, the electronic device may provide a structure capable of reducing an increase in thickness of the electronic device due to the first heat dissipation member 370 by the first heat dissipation member having a thickness less than or equal to that of each of the plurality of waterproof members.

[0121] According to an embodiment, in a folded state of the electronic device in which the surface of the first hinge plate faces the surface of the second hinge plate, the third region may be spaced apart from the first reinforcement member and the second reinforcement member.

[0122] According to the embodiment, since the first heat dissipation member is spaced apart from the first reinforcement member and the second reinforcement member, the electronic device may provide a structure capable of reducing damage to the first heat dissipation member due to a plurality of reinforcement members.

[0123] According to an embodiment, in the unfolded state, at least a portion of the third region may be disposed in the inner space of the hinge structure (eg, Figure 3b and Figure 3c The inner space 345 is disposed in another surface of the first hinge plate opposite to the surface of the first hinge plate (eg, Figure 3b and Figure 3c The other surface 343b of the second hinge plate and the other surface of the second hinge plate opposite to the surface of the second hinge plate (for example, Figure 3b and Figure 3c on another surface 344b).

[0124] According to the embodiment, since the third region of the first heat dissipation member is deformable, the electronic device may provide a structure capable of reducing damage to the first heat dissipation member due to repeated state changes of the electronic device.

[0125] According to an embodiment, the third area can be unfolded as the state of the electronic device changes from the unfolded state to the folded state of the electronic device where the surface of the first hinge plate faces the surface of the second hinge plate, and folded as the state of the electronic device changes from the folded state to the unfolded state.

[0126] According to the embodiment, since the third region of the first heat dissipation member is deformable, the electronic device may provide a structure capable of reducing damage to the first heat dissipation member due to repeated state changes of the electronic device.

[0127] According to an embodiment, the electronic device may include a first housing (eg, Figure 3a , Figure 3b and Figure 3c According to an embodiment, the electronic device may include a second housing (eg, Figure 3a , Figure 3b and Figure 3cThe second housing 320 is connected to the first housing to be rotatable relative to the first housing through the hinge structure. According to an embodiment, the electronic device may include a flexible printed circuit board (e.g., Figure 3b and Figure 3c According to an embodiment, at least a portion of the third region may be spaced apart from the flexible printed circuit board in the inner space of the hinge structure.

[0128] According to the embodiment, since the third region and the flexible printed circuit board are spaced apart from each other, the electronic device may provide a structure capable of minimizing interference between the flexible printed circuit board and the first heat dissipation member.

[0129] According to an embodiment, the electronic device may include a first adhesive member (eg, Figure 3b and Figure 3c According to an embodiment, the electronic device may include a second adhesive member (eg, Figure 3b and Figure 3c of the second bonding member 382).

[0130] According to an embodiment, the electronic device may provide a structure in which the first region and the second region of the first heat dissipation member are attached to the first hinge plate and the second hinge plate through the first adhesive member and the second adhesive member, respectively.

[0131] According to an embodiment, the end portion of the first bonding member (eg, Figure 3b The position of the end 381a) may correspond to the position of the end of the surface of the first hinge plate.

[0132] According to the embodiment, since the first adhesive member is attached only on the surface of the first hinge plate, the electronic device may provide a structure capable of reducing noise generated due to the first adhesive member.

[0133] According to an embodiment, the electronic device may include a second heat dissipation member (eg, Figure 4a and Figure 4b According to an embodiment, the electronic device may include a third heat dissipation member (eg, Figure 4a and Figure 4b A third heat dissipation member 392).

[0134] According to the embodiment, the electronic device can provide a structure capable of improving heat exchange efficiency between the first case and the second case through the second heat dissipation member and the third heat dissipation member.

[0135] According to an embodiment, the side surface (eg, Figure 4a and Figure 4b and a side surface 392a of the second heat dissipation member (eg, Figure 4a and Figure 4b The side surfaces 391a) of the first hinge plate may face each other in the unfolded state, and may face the third area in the folded state of the electronic device in which the surface of the first hinge plate faces the surface of the second hinge plate.

[0136] According to the embodiment, the electronic device can provide a structure capable of improving heat exchange efficiency between the first case and the second case through the second heat dissipation member and the third heat dissipation member.

[0137] According to an embodiment, the hinge structure may include a third hinge plate (eg, Figure 5a and Figure 5b The third hinge plate 346 is provided between the first hinge plate and the second hinge plate, fixed to the hinge bracket, and supports the display. According to an embodiment, the third region may include a fixed portion (e.g., Figure 5a and Figure 5b According to an embodiment, the third region may include a first extending portion (eg, Figure 5a and Figure 5b The first extension portion 371d of the third hinge plate is disposed in a gap between a side surface of the first hinge plate and a first side surface of the third hinge plate facing the side surface of the first hinge plate in the unfolded state. According to an embodiment, the third region may include a second extension portion (e.g., Figure 5a and Figure 5b The second extending portion 371e) is disposed in a gap between a side surface of the second hinge plate and a second side surface of the third hinge plate facing the side surface of the second hinge plate in the unfolded state.

[0138] According to an embodiment, the electronic device may provide a structure capable of reducing damage to the first heat dissipation member caused by repeated state changes of the electronic device 300 through first and second extending portions that are deformable by movement of first and second hinge plates for folding a display.

[0139] According to an embodiment, the electronic device may include a buffer member (eg, Figure 5a and Figure 5bA buffer member 334 is provided, the buffer member being attached to the surface of the display between the first reinforcement member and the second reinforcement member. According to an embodiment, the buffer member may be deformable by movement of the first hinge plate and the second hinge plate to fold the display.

[0140] According to the embodiment, the electronic device may provide a structure capable of reducing damage to the display due to the third hinge plate by the buffer member provided on the inner surface of the display.

[0141] According to an embodiment, the electronic device may include a first housing supporting a portion of a display. According to an embodiment, the electronic device may include a second housing supporting another portion of the display, the second housing being coupled to the first housing to be rotatable relative to the first housing through a hinge structure. According to an embodiment, a rotation angle range of the second housing rotatable relative to the first housing may be smaller than a rotation angle range of a second hinge plate rotatable relative to a hinge bracket.

[0142] Since the rotation angle ranges of the second hinge plate and the second housing are different, according to the embodiment, the electronic device can provide a structure in which the curvature of the display changes gently in the folded state of the electronic device.

[0143] According to an embodiment, an electronic device (e.g., Figure 3a , Figure 3b and Figure 3c The electronic device 300 may include a first housing (eg, Figure 3a , Figure 3b and Figure 3c According to an embodiment, the electronic device may include a second housing rotatable relative to the first housing (eg, Figure 3a , Figure 3b and Figure 3c The electronic device may include a hinge structure (eg, a hinge structure) that rotatably connects the first housing and the second housing. Figure 3a , Figure 3b and Figure 3c The hinge structure 340 includes a first hinge plate (eg, Figure 3a , Figure 3b and Figure 3c A first hinge plate 343 of the embodiment of the present invention, a second hinge plate different from the first hinge plate (for example, Figure 3a , Figure 3b and Figure 3c The second hinge plate 344 of the first housing and the hinge bracket (eg, Figure 3a According to an embodiment, the electronic device may include a display (eg, Figure 3a , Figure 3b and Figure 3c According to an embodiment, the electronic device may include a plurality of waterproof members (eg, Figure 3b and Figure 3c A plurality of waterproof members 360), wherein the plurality of waterproof members includes a first waterproof member (eg, Figure 3b and Figure 3c A first waterproof member 361) and a second waterproof member (eg, Figure 3b and Figure 3c According to an embodiment, the electronic device may include a first heat dissipation member (eg, a second waterproof member 362) disposed between the first waterproof member and the second waterproof member. Figure 3b and Figure 3c According to an embodiment, the first heat dissipation member may include a first area (eg, Figure 3b and Figure 3c According to an embodiment, the first heat dissipation member may include a second area (eg, Figure 3b and Figure 3c According to an embodiment, the first heat dissipation member may include a third region connecting the first region and the second region (eg, Figure 3b and Figure 3c The third area 373 of the first hinge plate is deformable by the movement of the first hinge plate and the second hinge plate. According to an embodiment, in the unfolded state of the electronic device in which the direction facing the surface of the first hinge plate corresponds to the direction facing the surface of the second hinge plate, at least a portion of the third area can pass through the side surfaces of the first hinge plates facing each other (for example, Figure 3b and Figure 3c The side surface 343c of the hinge plate and the side surface of the second hinge plate (eg, Figure 3b and Figure 3c The gap between the side surfaces 344c).

[0144] According to the embodiment, the electronic device can provide a structure capable of dissipating heat in the first housing and the second housing while reducing damage to the display due to external impact through the first heat dissipation member disposed under the plurality of reinforcement members.

[0145] According to an embodiment, the electronic device may include a plurality of reinforcement members (eg, Figure 3b and Figure 3cA plurality of reinforcing members 350), the plurality of reinforcing members including a first reinforcing member (eg, Figure 3b and Figure 3c The first reinforcing member 351) and the second reinforcing member (eg, Figure 3b and Figure 3c of the second reinforcing member 352).

[0146] According to the embodiment, since the size of the gap between the first reinforcement member and the second reinforcement member is minimized, the electronic device may provide a structure capable of reducing damage to the display due to an external impact.

[0147] According to an embodiment, in the unfolded state, at least a portion of the third region may be disposed in the inner space of the hinge structure (eg, Figure 3b and Figure 3c The inner space 345 is disposed in another surface of the first hinge plate opposite to the surface of the first hinge plate (eg, Figure 3b and Figure 3c The other surface 343b of the second hinge plate and the other surface of the second hinge plate opposite to the surface of the second hinge plate (for example, Figure 3b and Figure 3c on another surface 344b).

[0148] According to the embodiment, since the third region of the first heat dissipation member is deformable, the electronic device may provide a structure capable of reducing damage to the first heat dissipation member due to repeated state changes of the electronic device.

[0149] According to an embodiment, the electronic device may include a first adhesive member (eg, Figure 3b and Figure 3c According to an embodiment, the electronic device may include a second adhesive member (eg, Figure 3b and Figure 3c of the second bonding member 382).

[0150] According to an embodiment, the electronic device may provide a structure in which the first region and the second region of the first heat dissipation member are attached to the first hinge plate and the second hinge plate through the first adhesive member and the second adhesive member, respectively.

[0151] According to an embodiment, the electronic device may include a second heat dissipation member (eg, Figure 4a and Figure 4bAccording to an embodiment, the electronic device may include a third heat dissipation member (eg, Figure 4a and Figure 4b A third heat dissipation member 392).

[0152] According to the embodiment, the electronic device can provide a structure capable of improving heat exchange efficiency between the first case and the second case through the second heat dissipation member and the third heat dissipation member.

[0153] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0154] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or replacement forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the project may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrases in the phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding parts from another part, and do not limit the parts in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "coupled to" or "connected to" another element (e.g., a second element) when the terms "operationally" or "communicatively" are used or when the terms "operationally" or "communicatively" are not used, it means that the element can be directly (e.g., wired) coupled to the other element or coupled to the other element via a third element.

[0155] As used in connection with various embodiments of the present disclosure, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0156] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This allows the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0157] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a forwarding server).

[0158] According to various embodiments, each component (for example, module or program) in the above-mentioned components can include a single entity or multiple entities, and some entities in multiple entities can be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components can be omitted, or one or more other components can be added. Alternatively or additionally, multiple components (for example, module or program) can be integrated into a single component. In this case, according to various embodiments, the integrated component can still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operation performed by a module, program or another component can be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operation can be run or omitted in different orders, or one or more other operations can be added.

Claims

1. An electronic device (101; 200; 300), comprising: A hinge structure (340), comprising a hinge bracket (342), a first hinge plate (343) rotatable relative to the hinge bracket (342), and a second hinge plate (344) different from the first hinge plate (343) and rotatable relative to the hinge bracket (342); A display (330) is arranged on the first hinge plate (343) and the second hinge plate (344) across the hinge structure (340); a plurality of reinforcing members (350) attached to the display (330), including a first reinforcing member (351) and a second reinforcing member (352), the first reinforcing member facing a surface (343a) of the first hinge plate (343) and being spaced apart from the first hinge plate (343), and the second reinforcing member facing a surface (344a) of the second hinge plate (344) and being spaced apart from the second hinge plate (344); as well as A first heat dissipation member (370) includes a first region (371), a second region (372) and a third region (373), the first region being interposed between the first reinforcing member (351) and the surface (343a) of the first hinge plate (343), the second region being interposed between the second reinforcing member (352) and the surface (344a) of the second hinge plate (344), the third region connecting the first region (371) and the second region (372) and being deformable by movement of the first hinge plate (343) and the second hinge plate (344), Wherein, in the unfolded state of the electronic device (101; 200; 300) in which the direction facing the surface (343a) of the first hinge plate (343) is the same as the direction facing the surface (344a) of the second hinge plate (344), at least a portion of the third area (373) passes through a gap between the side surface (343c) of the first hinge plate (343) and the side surface (344c) of the second hinge plate (344) facing each other.

2. The electronic device (101; 200; 300) according to claim 1, in, In the unfolded state, the distance between the first reinforcing member (351) and the second reinforcing member (352) is shorter than the distance between the first hinge plate (343) and the second hinge plate (344).

3. The electronic device (101; 200; 300) according to claim 1, further comprising: A first housing (310) supporting a portion of the display (330); A second housing (320), supporting another portion of the display (330), coupled to the first housing (310) so as to be rotatable relative to the first housing (310) via the hinge structure (340); A first waterproof member (361) is disposed between the first shell (310) and the first reinforcing member (351); as well as a second waterproof member (362), disposed between the second shell (320) and the second reinforcing member (352), and spaced apart from the first waterproof member (361); Wherein, the first heat dissipation component (370) is arranged between the first waterproof component (361) and the second waterproof component (362).

4. The electronic device (101; 200; 300) according to claim 3, in, The thickness of the first heat dissipation member (370) is less than or equal to the thickness of each of the first waterproof member (361) and the second waterproof member (362).

5. The electronic device (101; 200; 300) according to claim 1, in, In the folded state of the electronic device (101; 200; 300) with the surface (343a) of the first hinge plate (343) facing the surface (344a) of the second hinge plate (344), the third area (373) is spaced apart from the first reinforcing member (351) and the second reinforcing member (352).

6. The electronic device (101; 200; 300) according to claim 1, in, In the unfolded state, at least a portion of the third area (373) is arranged in an internal space (345) of the hinge structure (340), and the internal space is arranged on another surface (343b) of the first hinge plate (343) opposite to the surface (343a) of the first hinge plate (343) and another surface (344b) of the second hinge plate (344) opposite to the surface (344a) of the second hinge plate (344).

7. The electronic device (101; 200; 300) according to claim 1, in, The third region (373): The electronic device (101; 200; 300) unfolds as the state of the electronic device (101; 200; 300) changes from the unfolded state to the folded state of the electronic device (101; 200; 300) in which the surface (343a) of the first hinge plate (343) faces the surface (344a) of the second hinge plate (344); as well as The electronic device (101; 200; 300) is folded as the state of the electronic device (101; 200; 300) changes from the folded state to the unfolded state.

8. The electronic device (101; 200; 300) according to claim 6, further comprising: A first housing (310) supporting a portion of the display (330); A second housing (320), supporting another portion of the display (330), coupled to the first housing (310) so as to be rotatable relative to the first housing (310) via the hinge structure (340); as well as a flexible printed circuit board (301) extending from the first housing (310) to the second housing (320) across the inner space of the hinge structure (340), Wherein, at least a portion of the third region (373) is spaced apart from the flexible printed circuit board (301) in the internal space of the hinge structure (340).

9. The electronic device (101; 200; 300) according to claim 1, further comprising: a first adhesive member (381) disposed between the surface (343a) of the first hinge plate (343) and the first region (371); as well as A second adhesive member (382) is disposed between the surface (344a) of the second hinge plate (344) and the second region (372).

10. The electronic device (101; 200; 300) according to claim 9, in, The position of the end portion (381a) of the first adhesive member (381) corresponds to the position of the end portion of the surface (343a) of the first hinge plate (343).

11. The electronic device (101; 200; 300) according to claim 1, further comprising: a second heat dissipation member (391) disposed between the first region (371) and the first reinforcing member (351); as well as The third heat dissipation member (392) is disposed between the second region (372) and the second reinforcing member (352), and is spaced apart from the second heat dissipation member (391).

12. The electronic device (101; 200; 300) according to claim 11, in, The side surface of the third heat dissipation member (392) and the side surface of the second heat dissipation member (391): facing each other in said unfolded state, and In a folded state of the electronic device (101; 200; 300), the surface (343a) of the first hinge plate (343) faces the surface (344a) of the second hinge plate (344) to face the third area (373).

13. The electronic device (101; 200; 300) according to claim 1, in, The hinge structure (340) further includes a third hinge plate, which is disposed between the first hinge plate (343) and the second hinge plate (344), fixed to the hinge bracket (342), and supports the display (330). Wherein, the third area (373) includes: A fixing portion (373c), fixed on the third hinge plate; a first extending portion (373d) disposed in a gap between the side surface (343c) of the first hinge plate (343) and a first side surface of the third hinge plate facing the side surface (343c) of the first hinge plate (343) in the unfolded state; and The second extension portion (373e) is arranged in the gap between the side surface (344c) of the second hinge plate (344) and the second side surface of the third hinge plate facing the side surface (344c) of the second hinge plate (344) in the unfolded state.

14. The electronic device (101; 200; 300) according to claim 13, further comprising: a buffer member (334) attached to the surface of the display (330) between the first reinforcing member (351) and the second reinforcing member (352), The buffer member (334) is deformable by the movement of the first hinge plate (343) and the second hinge plate (344) to fold the display (330).

15. The electronic device (101; 200; 300) according to claim 13, further comprising: A first housing (310) supporting a portion of the display (330); as well as a second housing (320), supporting another portion of the display (330), coupled to the first housing (310) so as to be rotatable relative to the first housing (310) through the hinge structure (340), Wherein, a rotation angle range of the second shell (320) rotatable relative to the first shell (310) is smaller than a rotation angle range of the second hinge plate (344) rotatable relative to the hinge bracket (342).

Images