Silicon carbide crystal ingot shaping multi-station processing machine tool

Abstract

The invention relates to a silicon carbide crystal ingot shaping multi-station processing machine tool, and relates to the technical field of numerical control machine tools. Comprising a main body lathe bed, a large rotary table, a workpiece rotary table, an end face grinding module, an outer circle grinding module, a positioning face machining module, a table face washing and blowing module, a crystal orientation measuring module and a workpiece conveying module. The large rotary table is installed in the center of the main body lathe bed, four workpiece rotary tables are evenly distributed on the large rotary table, and an end face grinding module, an outer circle grinding module, a positioning face machining module and a table face washing and blowing module are distributed on the main body lathe bed around the large rotary table along four stations. An auxiliary working platform is fixedly connected to the side face of the main body lathe bed, and a crystal orientation measuring module and a workpiece conveying module are installed on the auxiliary working platform. All the modules synchronously and cooperatively work along with linkage circulation of all the stations, a plurality of workpieces can be synchronously machined at multiple stations, dry-in and dry-out automatic feeding and discharging machining of the workpieces is achieved, and the production efficiency and machining quality of silicon carbide crystal ingots are greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of numerically controlled machine tools, in particular to a multi-station processing machine tool for shaping silicon carbide crystal ingots. Background Art

[0002] The poor processing efficiency of converting silicon carbide ingots into finished ingots for wafer fabrication has long been a problem that has plagued wafer manufacturers.

[0003] There is no industry standard for outdated traditional processes, and there are large differences in processes between different manufacturers. At present, silicon carbide ingots involve at least multiple independent processes, including crystal orientation determination, end face grinding, cylindrical grinding, positioning edge grinding, etc. Each processing step requires a corresponding separate device, and the ingot needs to be glued to the fixture and then debonded from the fixture. The process is cumbersome and requires a lot of manual operations, which greatly limits the output and greatly increases the labor cost and time cost. The multiple clamping of the workpiece also causes great errors, resulting in a high defective rate. In addition, various space-intensive equipment occupies a large amount of space.

[0004] With the increasing demand for silicon carbide ingots in the third-generation semiconductor industry, the global demand for silicon carbide is growing at an alarming rate. Therefore, there is an urgent need to design an automated, highly integrated, efficient and high-precision silicon carbide ingot processing equipment. Summary of the invention

[0005] In order to solve at least one technical problem in the background technology, the present invention provides a multi-station processing machine tool for shaping silicon carbide ingots, which integrates multiple functional modules and can realize one-time clamping of silicon carbide ingot workpieces to complete outer circle and end face crystal orientation measurement, end face grinding, outer circle grinding, positioning edge grinding, workpiece reversing processing, automatic workpiece washing and blowing, and loading and unloading, thereby realizing the automated processing of silicon carbide ingot workpiece materials and dry loading and unloading.

[0006] To achieve the above-mentioned purpose, the present invention provides a multi-station processing machine tool for shaping silicon carbide ingots, comprising: a main bed, a large turntable, a workpiece turntable, an end face grinding module, an external cylindrical grinding module, a positioning surface processing module, a table washing and blowing module, a crystal direction measurement module and a workpiece transmission module; wherein, the large turntable is installed at the center of the main bed, four workpiece turntables are evenly distributed on the large turntable, and the main bed is distributed with end face grinding modules, external cylindrical grinding modules, positioning surface processing modules and table washing and blowing modules along four stations around the large turntable; the side of the main bed is fixedly connected to an auxiliary working platform, and the auxiliary working platform is equipped with a crystal direction measurement module and a workpiece transmission module.

[0007] Furthermore, the large turntable has a turntable structure inside, and a servo motor is installed inside to drive its rotation. Four workpiece turntables are installed on four stations evenly distributed on the end surface of the large turntable. Each workpiece turntable can be independently servo-controlled and operated. The large turntable and the four workpiece turntables constitute a multi-station planetary motion. The rotation of the large turntable drives the four workpiece turntables to perform circular indexing motion between the functional modules.

[0008] Furthermore, each workpiece turntable includes a vacuum suction cup and a table adjustment mechanism, the vacuum suction cup is used to adsorb the workpiece thereon, and there are three table adjustment mechanisms, which are circumferentially arranged at the bottom of the vacuum suction cup and are used to adjust the pitch angle between the vacuum suction cup table and the horizontal plane.

[0009] Furthermore, the auxiliary work platform is also equipped with a workpiece buffering, washing and blowing module, a blank workpiece tray and a finished workpiece tray.

[0010] Furthermore, the grinding wheel grinding electric spindle of the end face grinding module is installed horizontally, and the end face grinding grinding wheel frame is driven by the combined high-precision servo feed motion of the end face grinding horizontal X-axis motion table and the end face grinding vertical Z-axis motion table to grind the end face of the silicon carbide ingot at the workstation.

[0011] Furthermore, the grinding wheel grinding electric spindle of the external cylindrical grinding module is installed vertically, and the external cylindrical grinding wheel frame is driven by the combined high-precision servo feed motion of the external cylindrical grinding horizontal X-axis motion table and the external cylindrical grinding vertical Z-axis motion table to grind the outer cylindrical surface of the silicon carbide ingot at the workstation.

[0012] Furthermore, the positioning surface processing module drives the positioning surface grinding wheel frame to process the silicon carbide crystal positioning edge Notch at the workstation through the combined high-precision servo feed motion of the positioning surface processing horizontal X-axis motion table, the positioning surface plus horizontal longitudinal Y-axis motion table, and the positioning surface processing vertical Z-axis motion table.

[0013] Furthermore, the orienter horizontal lifting motion module of the crystal direction determination module drives the orienter swing seat, and the orienter swing seat drives the X-ray crystal orienter to swing. Through the combined movement of the orienter horizontal lifting motion module and the orienter swing seat, the crystal direction of the outer cylindrical surface and the top end face of the silicon carbide crystal workpiece at the work station is determined.

[0014] Furthermore, the workpiece transfer module realizes workpiece conveying and transportation by clamping the workpiece for loading and unloading, flipping and turning through a robot.

[0015] Furthermore, the cleaning table of the workpiece buffer washing and blowing module is equipped with a lifting shield shell to perform closed cleaning and drying of the workpiece.

[0016] The beneficial effects of the present invention are:

[0017] The present invention provides a multi-station processing machine tool for shaping silicon carbide ingots, which can realize one-time clamping of multiple silicon carbide ingot workpieces to complete the outer circle and end face crystal orientation measurement, end face grinding, outer circle grinding, positioning edge grinding, automatic workpiece washing and blowing, and loading and unloading, and realize the automatic dry in and dry out of silicon carbide ingot workpiece processing materials. The high degree of automation greatly improves the processing efficiency of silicon carbide ingots, avoids the processing errors caused by multiple clamping of silicon carbide ingots, greatly improves the processing accuracy of parts, reduces labor costs, and greatly saves the site space and environmental pollution occupied by multiple equipment. It is suitable for large-scale semiconductor silicon carbide ingot processing production line equipment application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This invention is a three-dimensional schematic diagram Figure 1 ;

[0019] Figure 2 This invention is a three-dimensional schematic diagram Figure 2 ;

[0020] Figure 3 It is a schematic diagram of the planar layout of the present invention.

[0021] In the figure: 1-main bed, 2-large turntable, 3-workpiece turntable, 4-vacuum suction cup, 5-table adjustment mechanism, 6-end grinding module, 7-external cylindrical grinding module, 8-positioning surface processing module, 9-table washing and blowing module, 10-auxiliary working platform, 11-crystal direction determination module, 12-orientation instrument swing seat, 13-X-ray crystal orientation instrument, 14-workpiece transmission module, 15-workpiece buffer washing and blowing module, 16-blank workpiece tray, 17-finished workpiece tray, 18-workpiece. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0024] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0025] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0026] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] To achieve the above purpose, Figure 1-3As shown, the present invention provides a multi-station processing machine tool for shaping silicon carbide ingots, comprising: a main body bed 1, a large turntable 2, a workpiece turntable 3, an end face grinding module 6, an outer cylindrical grinding module 7, a positioning surface processing module 8, a table washing and blowing module 9, a crystal direction measurement module 11 and a workpiece transmission module 14; wherein, the large turntable 2 is installed at the center of the main body bed 1, four workpiece turntables 3 are evenly distributed on the large turntable 2, and the main body bed 1 is distributed with the end face grinding module 6, the outer cylindrical grinding module 7, the positioning surface processing module 8 and the table washing and blowing module 9 along four stations around the large turntable 2; the side of the main body bed 1 is fixedly connected to the auxiliary working platform 10, and the auxiliary working platform 10 is installed with the crystal direction measurement module 11 and the workpiece transmission module 14.

[0028] The above modules of the present invention work synchronously with the connection cycle of each station, and multiple workpieces can be processed synchronously at multiple stations. Multiple silicon carbide ingot workpieces can be clamped at one time to complete X-ray crystal orientation determination, automatic position adjustment, outer circle, end face, positioning edge processing and workpiece cleaning. The dry-in and dry-out automatic loading and unloading processing of the workpiece greatly improves the production efficiency and processing quality of silicon carbide ingots.

[0029] Further optimization, the large turntable 2 has a turntable structure inside, and a servo motor is installed inside to drive it to rotate around the center of the main bed 1. Four workpiece turntables 3 are installed on four stations evenly distributed on the end surface of the large turntable 2. Each workpiece turntable 3 can be independently servo-controlled and operated. The large turntable 2 and the four workpiece turntables 3 constitute a multi-station planetary motion. The large turntable 2 rotates to drive the four workpiece turntables 3 to perform circular indexing motion between the functional modules.

[0030] Further optimization, each workpiece turntable 3 includes a vacuum suction cup 4 and a table adjustment mechanism 5, the vacuum suction cup 4 is used to adsorb the workpiece 18 thereon, and three table adjustment mechanisms 5 are arranged circumferentially at the bottom of the vacuum suction cup 4, and the servo controls the fine adjustment of the position of the vacuum suction cup 4 to change the pitch angle between the workpiece turntable table and the horizontal plane.

[0031] Further optimization, the auxiliary work platform 10 is also equipped with a workpiece buffer washing and blowing module 15, a blank workpiece tray 16 and a finished workpiece tray 17. The cleaning table of the workpiece buffer washing and blowing module 15 is equipped with a lifting shield shell to perform closed cleaning and drying of the workpiece.

[0032] Further optimization, the grinding wheel grinding electric spindle of the end face grinding module 6 is installed horizontally, and the end face grinding grinding wheel frame is driven by the combined high-precision servo feed motion of the end face grinding horizontal X-axis motion table and the end face grinding vertical Z-axis motion table to grind the end face of the silicon carbide ingot at the workstation.

[0033] Further optimization, the grinding wheel grinding electric spindle of the external cylindrical grinding module 7 is installed vertically, and the external cylindrical grinding grinding wheel frame is driven by the combined high-precision servo feed motion of the external cylindrical grinding horizontal X-axis motion table and the external cylindrical grinding vertical Z-axis motion table to grind the outer cylindrical surface of the silicon carbide ingot at the workstation.

[0034] Further optimized, the positioning surface processing module 8 drives the positioning surface grinding wheel frame to process the silicon carbide crystal positioning edge Notch at the work station through the combined high-precision servo feed motion of the positioning surface processing horizontal X-axis motion table, the positioning surface plus horizontal longitudinal Y-axis motion table, and the positioning surface processing vertical Z-axis motion table.

[0035] For further optimization, the table cleaning horizontal motion module of the table cleaning and blowing module 9 drives the table cleaning head to clean and dry the table of the workpiece turntable at the workstation.

[0036] Further optimization, the orientator horizontal lifting motion module of the crystal orientation determination module 11 drives the orientator swing seat to move up and down, and the orientator swing seat drives the X-ray crystal orientator installed on the orientator swing seat to swing, and through the combined movement of the orientator horizontal lifting motion module and the orientator swing seat, the crystal orientation of the outer cylindrical surface and the top end face of the silicon carbide crystal workpiece at the work station is determined.

[0037] Further optimization, the workpiece transfer module 14 realizes workpiece conveying and handling by clamping the workpiece for loading and unloading, flipping and turning through a robot.

[0038] The working process of the present invention is as follows:

[0039] The workpiece gripper of the manipulator in the workpiece transfer module 14 takes the workpiece 18 to be processed from the blank workpiece tray 16 and puts it on the workpiece cleaning table in the workpiece buffer washing and blowing module 15, and its peripheral protection is raised to perform closed cleaning and drying of the workpiece 18; after the washing and blowing process is completed, the peripheral protection falls, and the workpiece transfer module 14 puts the workpiece 18 on the workpiece turntable 3 of the corresponding station of the table washing and blowing module 9, and the vacuum suction cup 4 on it firmly adsorbs the workpiece 18; thereafter, the horizontal lifting motion module of the orientator in the crystal direction determination module 11 drives the orientator The swing seat 12 rises, and the orienter swing seat 12 drives the X-ray crystal orienting instrument 13 to swing, and through their combined movement, the crystal orientation of the outer cylindrical surface and the top end face of the workpiece 18 at the station is measured; then the workpiece turntable 3 at the station corresponding to the table washing and blowing module 9 drives the vacuum suction cup 4 inside it to rotate according to the measured crystal orientation values ​​of the outer cylindrical surface and the end face, and adjusts the pitch of the workpiece turntable 3 and the horizontal plane to the corresponding angle through the table adjustment mechanism 5. After the posture of the workpiece 18 is adjusted, the various components in the crystal orientation measurement module 11 return to the initial position.

[0040] Subsequently, the large turntable 2 is indexed and rotated to the workstation where the end face grinding module 6 is located. The end face grinding grinding wheel frame is driven by the combined high-precision servo feed motion of the end face grinding horizontal X-axis motion table and the end face grinding vertical Z-axis motion table to grind the end face of the workpiece 18 at the workstation. After the process is completed, the end face grinding wheel frame is retracted.

[0041] Next, the large turntable 2 is rotated by indexing to move it to the station where the external cylindrical grinding module 7 is located. The external cylindrical grinding wheel frame is driven by the combined high-precision servo feed motion of the external cylindrical grinding horizontal X-axis motion table and the external cylindrical grinding vertical Z-axis motion table to grind the external cylindrical surface of the workpiece 18 at the station. After the process is completed, the external cylindrical grinding wheel frame is retracted.

[0042] Subsequently, the large turntable 2 is rotated and transferred to the positioning surface processing module 8, and the positioning surface grinding wheel frame is driven by a combination of a horizontal X-axis motion table for positioning surface processing, a horizontal longitudinal Y-axis motion table for positioning surface processing, and a vertical Z-axis motion table for positioning surface processing. The Notch of the positioning edge of the workpiece 18 at the workstation is processed, and the positioning surface grinding wheel frame is withdrawn after the process is completed.

[0043] Next, the large turntable 2 rotates by indexing to transfer it to the station where the table washing and blowing module 9 is located. The workpiece gripper of the manipulator in the workpiece transfer module 14 grips the workpiece 18 to reverse and flip it over, and puts it back into the station. The vacuum suction cup 4 firmly adsorbs it. The large turntable 2 rotates by indexing to transfer it to the station where the end face grinding module 6 is located again, and grinds the other end face. After the process is completed, the end face grinding wheel frame returns. After the workpiece 18 completes the end face grinding process, the vacuum suction cup 4 is relaxed, and the workpiece transfer module 14 clamps and takes out the workpiece 18 at the station. The large turntable 2 continues to rotate and transfers the workpiece turntable 3 at the unloaded station to the station where the table washing and blowing module 9 is located. The table cleaning horizontal motion module drives the table washing and blowing head to the cleaning position, cleans and dries the unloaded workbench at the station, and the table cleaning head returns after the washing and blowing is completed. A processing process ends.

[0044] The workpiece transport module 14 transports the processed workpiece 18 to the workpiece buffer washing and blowing module 15, where it is cleaned and blown dry in the above process. After the cleaning and blowing process is completed, the workpiece transport module 14 transports the processed workpiece 18 to the finished workpiece tray 17 for storage. This constitutes a cycle process of automated phase measurement processing of a silicon carbide ingot from a blank to a finished product.

[0045] When each functional module of the present invention is running, other processes are carried out synchronously. The large turntable 2 rotates to transport four workpiece turntables 3. Each functional module has continuous station input and completes its own operation flow in a cycle. The processes of each functional module are connected in a cycle in sequence. The processing rhythm is compact, and multiple workpieces can be processed synchronously at multiple stations, thereby efficiently realizing automatic loading and unloading of silicon carbide ingot shaping processing.

[0046] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A multi-station processing machine tool for shaping silicon carbide ingots, characterized in that: include: A main bed (1), a large turntable (2), a workpiece turntable (3), an end face grinding module (6), an external cylindrical grinding module (7), a positioning surface processing module (8), a table cleaning and blowing module (9), a crystal orientation measurement module (11) and a workpiece transmission module (14); wherein the large turntable (2) is installed at the center of the main bed (1), four workpiece turntables (3) are evenly distributed on the large turntable (2), and the main bed (1) is distributed with an end face grinding module (6), an external cylindrical grinding module (7), a positioning surface processing module (8) and a table cleaning and blowing module (9) along four workstations around the large turntable (2); the side of the main bed (1) is fixedly connected to an auxiliary working platform (10), and the auxiliary working platform (10) is installed with a crystal orientation measurement module (11) and a workpiece transmission module (14).

2. A multi-station processing machine tool for shaping silicon carbide ingots as claimed in claim 1, characterized in that: The large turntable (2) has a turntable structure inside, and a servo motor is arranged inside to drive its rotation. Four workpiece turntables (3) are installed on four stations evenly distributed on the end surface of the large turntable (2). Each workpiece turntable (3) can be independently servo-controlled to operate. The large turntable (2) and the four workpiece turntables (3) form a multi-station planetary motion. The large turntable (2) rotates to drive the four workpiece turntables (3) to perform circular indexing motion between the functional modules.

3. A multi-station processing machine tool for shaping silicon carbide ingots as claimed in claim 1 or 2, characterized in that: Each workpiece turntable (3) comprises a vacuum suction cup (4) and a table adjustment mechanism (5), wherein the vacuum suction cup (4) is used to absorb the workpiece (18) thereon, and three table adjustment mechanisms (5) are arranged at the bottom of the vacuum suction cup (4) along the circumference of the workpiece turntable (3) and are used to adjust the pitch angle between the table of the vacuum suction cup (4) and the horizontal plane.

4. A multi-station processing machine tool for shaping silicon carbide ingots as claimed in claim 1, characterized in that: The auxiliary work platform (10) is also equipped with a workpiece buffering, washing and blowing module (15), a blank workpiece tray (16) and a finished workpiece tray (17).

5. A multi-station processing machine tool for shaping silicon carbide ingots as claimed in claim 1, characterized in that: The grinding wheel grinding electric spindle of the end face grinding module (6) is installed horizontally, and drives the end face grinding grinding wheel frame to grind the end face of the silicon carbide ingot at the work station through the combined high-precision servo feed movement of the end face grinding horizontal X-axis motion table and the end face grinding vertical Z-axis motion table.

6. A multi-station processing machine tool for shaping silicon carbide ingots as claimed in claim 1, characterized in that: The grinding wheel electric spindle of the cylindrical grinding module (7) is installed vertically, and drives the cylindrical grinding wheel frame to grind the cylindrical surface of the silicon carbide ingot at the workstation through the combined high-precision servo feed motion of the cylindrical grinding horizontal X-axis motion table and the cylindrical grinding vertical Z-axis motion table.

7. A multi-station processing machine tool for shaping silicon carbide ingots as claimed in claim 1, characterized in that: The positioning surface processing module (8) drives the positioning surface grinding wheel frame to process the silicon carbide crystal positioning edge Notch at the work station through the combined high-precision servo feeding motion of the positioning surface processing horizontal X-axis motion table, the positioning surface plus horizontal longitudinal Y-axis motion table, and the positioning surface processing vertical Z-axis motion table.

8. A multi-station processing machine tool for shaping silicon carbide ingots as claimed in claim 1, characterized in that: The orienter horizontal lifting motion module of the crystal orientation measurement module (11) drives the orienter swing seat, and the orienter swing seat drives the X-ray crystal orienter to swing. Through the combined movement of the orienter horizontal lifting motion module and the orienter swing seat, the crystal orientation of the outer cylindrical surface and the top end surface of the silicon carbide crystal workpiece at the work station is measured.

9. A multi-station processing machine tool for shaping silicon carbide ingots as claimed in claim 1, characterized in that: The workpiece transmission module (14) realizes the conveying and handling of the workpiece by clamping the workpiece for loading and unloading, flipping and turning through a robot.

10. A multi-station processing machine tool for shaping silicon carbide ingots as claimed in claim 4, characterized in that: The cleaning table of the workpiece buffer washing and blowing module (15) is equipped with a lifting shield shell to perform closed cleaning and drying of the workpiece.

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