Crossed spliced FPC gummed paper and manufacturing process thereof

Through the cross-plating process of cross-plating FPC tape paper, the material waste problem of FPC tape paper in the X/Y direction is solved, and the material utilization rate is significantly improved, which greatly improves production efficiency and reduces costs.

CN119875525APending Publication Date: 2025-04-25SHENZHEN HEMINGCHENG IND CO LTD
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Patent Information

Application Number
CN202510072869.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-17
Publication Date
2025-04-25

AI Technical Summary

Technical Problem

The material waste problem of existing FPC tape in X/Y directions leads to low production efficiency and difficulty in cost control.

Method used

Cross-split FPC adhesive paper and its production process are used. Through cross-split, the base film and the first-time part of the removable film, blue film, colloid and top bearing film are combined. The interlaced blue film and stamping holes are used to achieve efficient bonding of adhesive paper.

Benefits of technology

The utilization rate of materials has been greatly improved, and the utilization rate has been increased by more than 2.5 times compared with the production method of uniform strips, and the utilization rate has been improved by more than 2 times compared with the use of asynchronous machines, effectively avoiding the problem of material waste.

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Abstract

The invention provides crossed spliced FPC (Flexible Printed Circuit) gummed paper and a manufacturing process thereof. The FPC gummed paper is formed by combining a whole bottom film, a release film for avoiding a first-time fitting part, a blue film, a colloid and a top bearing film. According to the cross splicing FPC gummed paper, a cross splicing mode is adopted, in the production process, an operator tears off a whole bottom release film, namely a bottom film, first-time bonding is carried out through a jig, and only half gummed paper is bonded firstly due to the existence of the release film avoiding the first-time bonding part. And the operator tears off the release film of the position avoiding first-time bonding part and bonds the remaining half part, so that the bonding process of the gummed paper of the whole product is completed. In the whole process, areas needing to be wasted previously are utilized, the problem of material waste is greatly avoided, the utilization rate is increased by more than 2.5 times compared with a unified strip manufacturing mode, the utilization rate is increased by more than 2 times compared with asynchronous machine production, and the utilization rate of materials is greatly increased.
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Description

Technical Field

[0001] The invention relates to the technical field of FPC adhesive tape, in particular to a cross-piece FPC adhesive tape and a manufacturing process thereof. Background Art

[0002] At present, adhesive tape plays an indispensable role in many industries due to its flexibility and adhesion. However, there is often material waste in its production process, especially in the layout of FPC (flexible circuit board), which is mainly reflected in the unreasonable layout design.

[0003] See: Figure 6 As shown in the figure, products with too large layout spacing will have the problem of extremely wasted materials. When the layout spacing is designed to be too large, it will cause a large number of unused areas of FPC tape in actual applications, the so-called "dead areas". These ineffectively used materials directly cause extremely serious waste problems. As a result, this type of strip sticker method cannot be used for production, resulting in low production efficiency.

[0004] The current solution to material waste in the industry is to use asynchronous machines to save materials, see Figure 7 shown.

[0005] Asynchronous machines can indeed reduce the waste of materials in a single direction to a certain extent, and improve material utilization by optimizing the cutting path and reducing the generation of scraps. However, the limitations of asynchronous machines are also obvious. They can only solve the problem of material waste in a single direction.

[0006] The problem of material waste in the X / Y direction cannot be solved. This problem has become a key factor restricting production efficiency and cost control.

[0007] In summary, the above methods do not fundamentally solve this key factor that restricts production efficiency and cost control. Therefore, how to comprehensively and effectively solve the problem of material waste is still a technical problem that needs to be overcome in the current industry. Summary of the invention

[0008] In view of this, in order to solve the problem of material waste of FPC tape in the X / Y directions, the present invention proposes a cross-piece FPC tape and a manufacturing process thereof. The specific technical solution is as follows:

[0009] A cross-piece FPC adhesive tape comprises, from bottom to top, a base film, a release film for avoiding the first lamination part, a colloid, a blue film and a top carrier film. The release film for avoiding the first lamination part is adhered with a blue film by the colloid, and the two adjacent blue films are placed horizontally and vertically alternately.

[0010] Furthermore, the base film is a complete bottom release film, a plurality of horizontally placed blue films are equidistantly arranged on the base film, a plurality of vertically placed blue films are equidistantly arranged on the release film for avoiding the first bonding part, the release film for the first bonding part is covered on the upper surface of the base film, and the areas of the horizontally placed blue films on the release film for avoiding the first bonding part corresponding to the horizontally placed blue films are punched into holes so that the horizontally placed blue films are located within the punched hole positions.

[0011] A manufacturing process of a cross-block FPC adhesive tape comprises the following steps:

[0012] S1, the staff will first lay the adhesive tape of the colloid flat on the workbench, and make sure that the sticky side of the tape is facing up, and use the precise first die to perform the positioning punching operation, which accurately punches out the outline of the colloid tearing position from the surface of the tape, laying the foundation for subsequent operations;

[0013] S2, replace the adhesive tape that comes with the colloid with a blue film weighing between 30-40 grams, and attach a micro-sticky film, i.e., a top supporting film, to the surface of the blue film. Use a second die to control the punching depth, punch out the shape of the adhesive tape, and the required positioning holes on the supporting film, and eliminate waste;

[0014] S3, after inserting the base film, use the third die to punch the release paper. The punching must be thorough to ensure that the release paper is completely separated from the colloid, while the carrier film remains intact and is not punched through;

[0015] S4, remove the waste on the release film, and replace it with a new base film to complete the entire cross-block FPC tape production process.

[0016] Furthermore, during the outer shape punching in step S2, the colloid and the blue film are punched out, and the carrier film is not broken.

[0017] Furthermore, when punching the positioning holes in step S2, the carrier film, the blue film and the colloid are all punched through.

[0018] Furthermore, the base film is a milky white base film weighing within 10 grams.

[0019] The above technical solution has the following beneficial effects:

[0020] The FPC adhesive tape in the present invention includes a whole bottom film, a release film for avoiding the first bonding, a blue film, a colloid, and a top bearing film. The cross-block FPC adhesive tape of the present invention adopts a cross-plate method. During the production process, the operator tears off the entire bottom release film, i.e., the bottom film, and performs the first bonding through a jig. Because of the existence of the release film for avoiding the first bonding, only half of the adhesive tape will be pasted first. The operator then tears off the release film for avoiding the first bonding and bonds the remaining half of the strip, thus completing the bonding process of the adhesive tape of the entire product. The area that was previously wasted is utilized, which greatly avoids the problem of material waste. This method improves the utilization rate by more than 2.5 times compared to the production method of uniform strip pasting, and by more than 2 times compared to the production using asynchronous machines, which greatly improves the utilization rate of materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of a cross-block FPC adhesive tape of the present invention;

[0022] Figure 2 It is a schematic diagram of the exploded structure of a cross-piece FPC adhesive tape of the present invention;

[0023] Figure 3 It is a structural schematic diagram of a first cutting die of a cross-piece FPC adhesive tape of the present invention;

[0024] Figure 4 It is a structural schematic diagram of a second cutting die of a cross-piece FPC adhesive tape of the present invention;

[0025] Figure 5 It is a structural schematic diagram of a third cutting die of a cross-piece FPC adhesive tape of the present invention;

[0026] Figure 6 It is a structural schematic diagram of FPC adhesive tape made in the prior art;

[0027] Figure 7 A schematic diagram of the structure of FPC adhesive tape using an asynchronous mechanism in the prior art is provided;

[0028] Figure 8 It is a structural schematic diagram of the first cutting die, the second cutting die and the third cutting die of the cross-piece FPC adhesive tape of the present invention when in use;

[0029] In the figure: 1-base film; 2-release film; 3-colloid; 4-blue film; 5-top supporting film; 6-punching hole. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Example 1: See Figure 1 As shown, a cross-block FPC tape comprises, from bottom to top, a base film 1, a release film 2, a colloid 3, a blue film 4 and a top carrier film 5. A blue film 4 is adhered to the release film 2 by the colloid 3 to avoid the first bonding part, and the two adjacent blue films 4 are placed horizontally and vertically alternately.

[0032] The base film 1 is a complete bottom release film, and a plurality of horizontally placed blue films 4 are equidistantly arranged on the base film 1, and a plurality of vertically placed blue films 4 are equidistantly arranged on the release film 2. The first bonding portion of the release film covers the upper surface of the base film 1, and the area of ​​the release film 2 corresponding to the horizontally placed blue film 4 is punched into a punching hole 6, and the shape of the punching hole 6 is the same as that of the blue film, so that the horizontally placed blue film 4 is located in the punching hole position.

[0033] The shape of the blue film in this embodiment is shown in FIG. Figure 1 As shown (irregular shape), in other embodiments, the shape of the blue film can be designed into different shapes as needed to meet different usage requirements.

[0034] Blue film has appropriate bonding strength and retention for various adhesive items such as metal, plastic, glass, etc. Anti-static = Blue film can effectively protect electronic components from damage caused by excessive static voltage. Blue film can reduce the adsorption of dust in the air. Blue film keeps the product surface clean.

[0035] See also Figure 2 As shown, a manufacturing process of a cross-block FPC adhesive tape includes the following steps:

[0036] S1, the staff first lays the adhesive tape of colloid 3 flat on the workbench, and ensures that the adhesive surface of the adhesive tape faces upward, using a precision steel mold material such as Figure 3 and Figure 8 The first die cutter shown in the figure performs a set punching operation (with a tolerance of ±0.05MM), which accurately punches out the outline of the hand-tear position of the colloid 3 from the surface of the adhesive tape, see Figure 1 As shown, the outer contour is the same as the shape of the blue film, laying the foundation for subsequent operations;

[0037] S2, replace the adhesive tape of the colloid 3 with a blue film 4 weighing between 30-40 grams, and attach a top supporting film 5 to the surface of the blue film 4. Figure 4 and Figure 8 As shown, the second cutting die is used to control the punching depth, punch out the shape of the adhesive paper and the required positioning holes on the carrier film, and eliminate waste;

[0038] S3, after the release film is covered on the base film 1, the release film is punched out by a third cutting die, and the punching must be thorough to ensure that the release paper and the colloid 3 are completely separated, while the carrier film remains intact and is not punched out.

[0039] S4, remove the waste on the release film, and replace it with a new base film 1 to complete the entire cross-piece FPC adhesive tape manufacturing process.

[0040] In this embodiment, when the outer shape is punched in step S2, the colloid 3 and the blue film 4 are punched out, and the carrier film is not broken. When the positioning hole is punched in step S2, the carrier film, the blue film 4, and the colloid 3 are all punched through. The base film 1 is a milky white base film 1 weighing less than 10 grams.

[0041] like Figure 6 The figure shows the structure diagram of FPC adhesive tape produced by common process in the industry. However, it is limited by the layout of FPC and the different adhesive tape materials, which will cause serious waste of materials for laminating the entire page of adhesive tape.

[0042] like Figure 7 As shown, the current solution to material waste in the existing industry is to use asynchronous machines to save materials. However, asynchronous machines can only solve the material waste in one direction and cannot solve the material waste problem in the X / Y directions.

[0043]

[0044] In summary, taking the illustrated product as a reference, the present invention improves the utilization rate by more than 2.5 times compared with the traditional strip sticker production method, and improves the utilization rate by more than 2 times compared with the production using an asynchronous machine, which greatly improves the utilization rate of materials.

[0045] The present invention can still use the strip pasting solution for products that cannot use the strip pasting solution due to the large spacing between product panels, thereby improving the strip pasting efficiency. The strip pasting solution selected by the present invention, because it belongs to cross paneling, utilizes the area that would have been wasted before, greatly avoiding the problem of material waste.

[0046] The cross-piece FPC adhesive tape of the present invention adopts a cross-piece pattern. During the production process, the operator tears off the entire bottom release film, i.e., the bottom film 1, and performs the first bonding through a jig. Because of the presence of the first bonding avoidance release film 2, only half of the adhesive tape will be pasted first. The operator then tears off the first bonding avoidance release film 2 and bonds the remaining half of the strip, thus completing the bonding process of the adhesive tape of the entire product.

[0047] The basic principles and main features of the present invention are described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrating the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which shall fall within the scope of the present invention to be protected. The scope of protection of the invention shall be defined by the attached claims and their equivalents.

Claims

1. A cross-block FPC adhesive tape, characterized in that: From bottom to top, it includes a base film, a release film, a colloid, a blue film and a top carrier film, the release film is adhered with a blue film by the colloid, and two adjacent blue films are placed horizontally and vertically in an alternating manner; The base film is a complete bottom release film, a plurality of horizontally placed blue films are arranged at equal distances on the base film, a plurality of vertically placed blue films are arranged at equal distances on the release film, the first bonding portion of the release film covers the upper surface of the base film, and the areas of the release film corresponding to the horizontally placed blue films are punched into holes so that the horizontally placed blue films are located within the punched hole positions.

2. A process for making cross-block FPC adhesive tape, characterized in that: The following steps are involved: S1, the staff first lays the adhesive tape of the colloid flat on the workbench, and ensures that the sticky side of the tape is facing up, and uses the precise first die to perform the punching operation, which accurately punches out the outline of the tearing position of the colloid from the surface of the tape, laying the foundation for subsequent operations; S2, replace the adhesive tape that comes with the colloid with a blue film weighing between 30-40 grams, and attach a micro-sticky film, i.e., a top supporting film, to the surface of the blue film. Use a second die to control the punching depth, punch out the shape of the adhesive tape, and the required positioning holes on the supporting film, and eliminate waste; S3, after inserting the base film, use the third die to punch the release paper. The punching is required to be thorough to ensure that the release paper is completely separated from the colloid, while the carrier film remains intact and is not punched through; S4, remove the waste on the release film, and replace it with a new base film to complete the entire cross-block FPC tape production process.

3. The manufacturing process of the cross-block FPC tape according to claim 2, characterized in that: During the outer shape punching in step S2, the colloid and the blue film are punched out, and the carrier film is not broken.

4. The manufacturing process of the cross-block FPC tape according to claim 2 is characterized in that: When punching the positioning holes in step S2, the carrier film, the blue film and the colloid are all punched through.

5. The manufacturing process of the cross-block FPC tape according to claim 2, characterized in that: The base film is a milky white base film weighing less than 10 grams.

6. The manufacturing process of the cross-block FPC tape according to claim 2, characterized in that: In step S2, the punching depth is controlled to be the thickness of the adhesive tape.