Electrolyte automatic dosing device for electroplating

Abstract

The invention relates to the technical field of electroplating equipment, in particular to an automatic electrolyte dosing device for electroplating. The segmented feeding mechanism is used for feeding materials into the electroplating tank; the feeding mechanism is used for feeding the proportioned electroplating solution stock solution; the automatic proportioning mechanism is used for automatically proportioning the electroplating liquid; the automatic proportioning mechanism is arranged at the top end of the outer side of the electroplating pool, the feeding mechanism is arranged at the bottom end of the automatic proportioning mechanism, and the segmented feeding mechanism is arranged at the bottom end of the interior of the electroplating pool. According to the segmented feeding mechanism, the feeding pipe can be filled with the electroplating solution stock solution in the feeding process, and the electroplating solution stock solution in the feeding pipe is sequentially fed into the electroplating pool from one end to the other end, so that the electroplating solution stock solution can be uniformly fed into different areas of the electroplating pool, and the supplementing efficiency of the electroplating solution is improved.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating equipment, in particular to an automatic dosing device for electroplating electrolyte. Background Art

[0002] Electroplating solution refers to a liquid that can expand the cathode current density range of metals, improve the appearance of the coating, and increase the anti-oxidation stability of the solution. During the electroplating process of the product, the reagents inside the electroplating tank will be lost and gradually reduced, and it is necessary to add reagents into the electroplating tank. However, most of the existing electroplating tanks are manually added with liquid medicine, which is not only time-consuming and labor-intensive, but also difficult to master the proportion of liquid medicine added. The proportion of liquid medicine will directly affect the electroplating effect of the product, and the liquid medicine directly added into the electroplating tank will be difficult to blend with other liquid medicines, thus affecting the electroplating effect of the liquid medicine.

[0003] Therefore, in the prior art, a reagent dispensing device is used to automatically dispense the electroplating solution, such as an automatic electroplating reagent adding device disclosed in Publication No. CN220132398U, and an automatic electroplating solution feeding device disclosed in Publication No. CN206916249U. In the above schemes, the electroplating solution is automatically replenished by the dispensing device. Although the above scheme can automatically replenish the electroplating solution, the above scheme can only replenish the electroplating solution in the electroplating pool at a single point. The electroplating pool is relatively long as a whole, so the electroplating solution stock solution dispensed at a single point takes a long time to be diluted to both ends of the electroplating pool, and the replenishment efficiency of the electroplating solution is low. In view of this, we propose an automatic electrolyte dosing device for electroplating. Summary of the invention

[0004] The purpose of the present invention is to provide an automatic dosing device for electroplating electrolyte, which solves the problems mentioned in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] An automatic dosing device for electroplating electrolyte, comprising an electroplating cell;

[0007] The segmented feeding mechanism is used to feed materials into the electroplating tank;

[0008] A feeding mechanism is used to feed the prepared electroplating solution;

[0009] Automatic proportioning mechanism, used for automatically proportioning the electroplating solution;

[0010] The automatic proportioning mechanism is arranged at the top end of the outer side of the electroplating pool, the feeding mechanism is arranged at the bottom end of the automatic proportioning mechanism, and the segmented feeding mechanism is arranged at the bottom end inside the electroplating pool.

[0011] Preferably, the segmented feeding mechanism includes a feeding pipe, which is symmetrically connected to both sides of the bottom end of the electroplating pool, a feeding port is opened on the side of the feeding pipe, a sealing cover is connected to the outside of the feeding port, and a ventilation pipe and a feed pipe are fixedly connected to one end of the feeding pipe.

[0012] Preferably, a limiting block is fixedly connected inside the feeding pipe, the limiting block is an annular structure, a sealing plug is slidably connected to the inner side of the limiting block, and leakage grooves are provided on the inner sides of the sealing plug and the limiting block.

[0013] Preferably, the sealing plug is a stage-shaped structure, one end of the limit block is provided with a groove corresponding to the sealing plug structure, the sealing plug is connected to a positioning assembly, the positioning assembly includes a limit rod, and the limit rod is fixedly connected to the outside of the sealing plug.

[0014] Preferably, the limit rod is slidably connected inside the limit block, magnets are fixedly connected to the inner side of the sealing plug and the limit block, the positions of the magnets correspond to each other and the polarities of the corresponding surfaces of the magnets are opposite, and the sealing plug is connected to the sealing cover through a connecting rod.

[0015] Preferably, the automatic proportioning mechanism includes a bracket, the top of the bracket is fixedly connected to a storage tank, the bottom of the storage tank is fixedly connected to a hopper, the bottom of the bracket is fixedly connected to a batching tank, the bottom of the hopper is connected to the inside of the batching tank through a pipe, and the inside of the batching tank is connected to a stirring device.

[0016] Preferably, the storage tank is internally connected with an adjustment assembly, and the adjustment assembly includes a baffle fixedly connected to the storage tank, the top of the baffle is rotatably connected with an adjustment plate, the top of the adjustment plate is fixedly connected with an adjustment rod, and the top of the adjustment rod is set through the storage tank.

[0017] Preferably, the bottom end of the baffle is connected to a quantitative component, and the quantitative component includes a discharge plate rotatably connected to the bottom end of the baffle, the bottom end of the discharge plate is fixedly connected to a driving rod, the end of the driving rod is fixedly connected to a driving gear, the outer side of the driving gear is meshed with a gear ring, and the gear ring is rotatably connected to the top of the mixing tank.

[0018] Preferably, the feeding mechanism includes a feeding tank and a driving device, the feeding tank is fixedly connected to the bottom end of the outer side of the electroplating pool, a feeding piston is slidably connected inside the feeding tank, the top of the feeding piston is fixedly connected to a sealing plate via a steel cable, and the top of the sealing plate is fixedly connected to a buffer spring.

[0019] Preferably, the bottom end of the batching tank is fixedly connected to a fixed tube, the top end of the fixed tube is connected to a solenoid valve, the top end of the feeding piston is fixedly connected to a pressure limiting tube, a safety piston is slidably connected inside the pressure limiting tube, the safety piston is fixedly connected to the output end of the driving device, and the side wall of the pressure limiting tube is fixedly connected to a pressure relief valve.

[0020] By means of the above technical solution, the present invention provides an automatic dosing device for electroplating electrolyte, which has at least the following beneficial effects:

[0021] (1) The present invention can fill the electroplating liquid into the feeding pipe through the segmented feeding mechanism during the feeding process, and sequentially feed the electroplating liquid in the feeding pipe into the electroplating tank from one end to the other end, so that the electroplating liquid raw material can be evenly fed into different areas of the electroplating tank, thereby improving the replenishment efficiency of the electroplating liquid.

[0022] (2) The feeding mechanism of the present invention is provided as a booster structure to increase the pressure of the electroplating solution in the feeding pipe during the feeding process, so that the electroplating solution can be sprayed into the electroplating pool during the feeding process, so that the electroplating solution can quickly contact, mix and diffuse with the electroplating solution in the electroplating pool, thereby further improving the replenishment efficiency of the electroplating solution in the electroplating pool.

[0023] (3) The automatic proportioning mechanism provided in the present invention can automatically add corresponding proportions of solid reagent particles or powders according to the proportions of raw materials in the electroplating solution during the proportioning process, thereby improving the efficiency of reagent proportioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0025] Figure 1 The structure of the present invention is schematically shown Figure 1 ;

[0026] Figure 2 The structure of the present invention is schematically shown Figure 2 ;

[0027] Figure 3 The internal structure of the present invention is shown in FIG. Figure 1 ;

[0028] Figure 4 It is an enlarged schematic diagram of point A of the present invention;

[0029] Figure 5 The internal structure of the present invention is shown in FIG. Figure 2 ;

[0030] Figure 6 It is a schematic diagram of the feeding pipe structure of the present invention;

[0031] Figure 7 Schematic diagram of the internal structure of the feeding pipe of the present invention Figure 1 ;

[0032] Figure 8 It is an enlarged schematic diagram of point B of the present invention;

[0033] Fig. 9 Schematic diagram of the internal structure of the feeding pipe of the present invention Figure 2 ;

[0034] Fig.10 It is a schematic diagram of the limit block structure of the present invention.

[0035] In the figure: 1. electroplating tank; 2. segmented feeding mechanism; 21. feeding pipe; 22. feeding port; 23. sealing cover; 24. vent pipe; 25. feeding pipe; 26. stopper; 27. sealing plug; 28. leakage tank; 29. ​​positioning assembly; 291. stopper rod; 293. magnet; 294. connecting rod; 3. feeding mechanism; 31. feeding tank; 32. feeding piston; 33. steel cable; 34. sealing plate; 35. buffer spring Spring; 36, driving device; 37, fixing tube; 38, pressure limiting tube; 39, safety piston; 4, automatic proportioning mechanism; 41, bracket; 42, storage tank; 43, hopper; 44, batching tank; 45, stirring device; 46, adjusting component; 461, baffle; 462, adjusting plate; 463, adjusting rod; 47, quantitative component; 471, unloading plate; 472, driving rod; 473, driving gear; 474, gear ring. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Example 1

[0038] An automatic dosing device for electroplating electrolyte, such as Figure 1-Figure 10 As shown, it includes an electroplating pool 1; a segmented feeding mechanism 2 is provided at the bottom end of the electroplating pool 1 for feeding into the electroplating pool 1, and the segmented feeding mechanism 2 can divide the bottom end of the electroplating pool 1 into a plurality of adjacent feeding areas and perform feeding operations in sequence, so that the same concentration and the same volume of plating solution can be fed into different areas, so that the plating solution can diffuse quickly after being fed and the concentration of the plating solution in the electroplating pool 1 can be kept uniform.

[0039] Specifically, the segmented feeding mechanism 2 includes a feeding pipe 21, which is symmetrically connected to both sides of the bottom of the electroplating pool 1. The feeding pipe 21 structure can input a high-concentration electroplating solution into the bottom of the electroplating pool 1, thereby replenishing the electroplating solution inside the electroplating pool 1. A feeding port 22 is provided on the side of the feeding pipe 21, and the feeding port 22 structure can conveniently input the electroplating solution inside the feeding pipe 21 into the electroplating pool 1. A sealing cover 23 is connected to the outside of the feeding port 22, and the sealing cover 23 structure can block the feeding port 22, thereby increasing the internal pressure of the feeding pipe 21 when feeding, and improving the efficiency of the electroplating solution when feeding. A vent pipe 24 and a feed pipe 25 are fixedly connected at one end of the feeding pipe 21. The vent pipe 24 can conveniently discharge the air inside the feeding pipe 21 when feeding, and the feed pipe 25 can facilitate the feeding operation inside the feeding pipe 21.

[0040] On this basis, a limiting block 26 is fixedly connected inside the feeding tube 21. The limiting block 26 can space the inside of the feeding tube 21, so that equidistant delivery compartments are formed inside the feeding tube 21, so that the electroplating solution can be evenly delivered and the delivery amount of the electroplating solution can be kept the same. The limiting block 26 is an annular structure, and a sealing plug 27 is slidably connected inside the limiting block 26. The limiting block 26 with an annular structure can cooperate with the sealing plug 27, and the sealing plug 27 is used to seal and space different areas in the delivery tube. A leakage groove 28 is provided on the inner side of the sealing plug 27 and the inner side of the limiting block 26. The leakage groove 28 structure can facilitate the flow of the internal electroplating solution when the sealing plug 27 is in the open state.

[0041] Furthermore, the sealing plug 27 is a stage-shaped structure, and a groove corresponding to the structure of the sealing plug 27 is provided at one end of the limiting block 26. The sealing plug 27 of the stage-shaped structure can cooperate with the groove on the limiting block 26 to achieve a sealing effect. A positioning assembly 29 is connected to the sealing plug 27, and the positioning assembly 29 can position the sealing plug 27 so that the position of the positioned sealing plug 27 remains fixed during sealing. The positioning assembly 29 includes a limiting rod 291, which is fixedly connected to the outside of the sealing plug 27. The limiting rod 291 structure can limit the adjacent sealing plugs 27 so that the sealing plugs 27 can achieve the effect of moving one by one.

[0042] It is worth noting that the limiting rod 291 is slidably connected inside the limiting block 26, and the leakage groove 28 structure can limit the limiting rod 291. Magnets 293 are fixedly connected to the inner side of the sealing plug 27 and the limiting block 26. The positions of the magnets 293 correspond to each other and the polarities of the corresponding surfaces of the magnets 293 are opposite. The magnet 293 structure can position the moving sealing plug 27. The sealing plug 27 is connected to the sealing cover 23 through a connecting rod 294, and the connecting rod 294 structure can make the sealing plug 27 and the sealing cover 23 in transmission connection.

[0043] Example 2

[0044] like Figure 1-Figure 5 As shown, on the basis of Example 1, an automatic proportioning mechanism 4 is provided at the top of the outer side of the electroplating pool 1 for automatically proportioning the electroplating solution.

[0045] In this embodiment, the automatic proportioning mechanism 4 includes a bracket 41, and a storage tank 42 is fixedly connected to the top of the bracket 41, and the storage tank 42 can store different raw materials. A hopper 43 is fixedly connected to the bottom of the storage tank 42, and the hopper 43 can guide the solid raw materials in the storage tank 42 to the batching tank 44. The bottom end of the bracket 41 is fixedly connected to the batching tank 44, and the bottom end of the hopper 43 is connected to the inside of the batching tank 44 through a pipeline. The inside of the batching tank 44 is connected to a stirring device 45, and the stirring device 45 can stir and mix the raw materials in the batching tank 44 during the batching process.

[0046] Furthermore, the storage tank 42 is internally connected with an adjustment component 46, which can adjust the feeding structure in the storage tank 42, so that the storage tank 42 can automatically feed the raw materials inside. The adjustment component 46 includes a baffle 461 fixedly connected to the inside of the storage tank 42, and the top of the baffle 461 is rotatably connected to an adjustment plate 462, and the baffle 461 and the adjustment plate 462 are both 1 / 2 disc-shaped structures. The top of the adjustment plate 462 is fixedly connected to an adjustment rod 463, and the top of the adjustment rod 463 is set through the storage tank 42, and the adjustment rod 463 structure can drive the adjustment plate 462.

[0047] It is worth noting that the bottom end of the baffle 461 is connected to a quantitative component 47, and the quantitative component 47 can quantitatively load the solid raw materials inside the storage tank 42. The quantitative component 47 includes a feed plate 471 rotatably connected to the bottom end of the baffle 461, a driving rod 472 is fixedly connected to the bottom end of the feed plate 471, a driving gear 473 is fixedly connected to the end of the driving rod 472, and a gear ring 474 is meshed and connected to the outer side of the driving gear 473, and the gear ring 474 is rotatably connected to the top of the batching tank 44. The gear ring 474 structure can drive the driving gear 473, so that the driving gear 473 at the bottom end of the storage tank 42 rotates synchronously, and the feed plate 471 rotates synchronously by the same number of circles. The feed hole opened on the feed plate 471 can cooperate with the adjustment plate 462, and the adjustment of the angle between the adjustment plate 462 and the baffle 461 can control the feeding amount of the raw materials inside the storage tank 42.

[0048] Example 3

[0049] like Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6As shown, on the basis of Example 2, a feeding mechanism 3 is provided at the bottom of the automatic proportioning mechanism 4 for feeding the proportioned electroplating solution. The feeding mechanism 3 can feed the electroplating solution into the feeding pipe 21 .

[0050] In this embodiment, the feeding mechanism 3 includes a feeding tank 31, which is fixedly connected to the bottom end of the outer side of the electroplating pool 1. A feeding piston 32 is slidably connected inside the feeding tank 31. The feeding pipe is a cylindrical structure. At the same time, the feeding pipe can cooperate with the feeding piston 32 to form a structure similar to a piston cylinder and a piston rod, which is convenient for feeding operations. The top of the feeding piston 32 is fixedly connected to a sealing plate 34 through a steel cable 33. The end of the vent pipe 24 is arranged between the feeding piston 32 and the sealing plate 34. The air inside the feeding pipe can be sucked out or squeezed in by the relative movement of the feeding piston 32 and the sealing plate 34. At the same time, the sealing plate 34 can close the vent pipe 24 during the feeding process, which is convenient for continuously increasing the pressure inside the feeding pipe 21. A buffer spring 35 is fixedly connected to the top of the sealing plate 34. The buffer spring 35 can buffer and reset the movement of the sealing plate 34, so that the sealing plate 34 can automatically rebound to the initial position. A driving device 36 is fixedly connected to the side of the electroplating tank 1. The driving device 36 is one of a cylinder, a hydraulic cylinder, and an electric push rod.

[0051] On this basis, a fixed pipe 37 is fixedly connected to the bottom of the batching tank 44, and a solenoid valve is connected to the top of the fixed pipe 37. The structure of the fixed pipe 37 can easily move the electroplating solution from the batching tank to the feeding tank 31, and the solenoid valve can automatically close the fixed pipe 37. A pressure limiting pipe 38 is fixedly connected to the top of the feeding piston 32, and a safety piston 39 is slidably connected inside the pressure limiting pipe 38. The safety piston 39 is fixedly connected to the output end of the driving device 36. A pressure relief valve and a vent hole are fixedly connected to the side wall of the pressure limiting pipe 38. The pressure limiting pipe 38 can provide a buffer structure between the driving device 36 and the feeding piston 32, thereby avoiding damage to the device due to excessive pressure during the feeding process.

[0052] When the automatic dosing device for electroplating electrolyte of the present invention is used, first, different raw material powders of electroplating solution are stored in the storage tank 42 respectively, and the adjustment plate 462 in the storage tank 42 is rotated and adjusted according to the feeding ratio of the raw materials, and the gap between the adjustment plate 462 and the baffle 461 is adjusted to a set angle. Then, the gear ring 474 is rotated, and the unloading plate 471 is driven to rotate through the driving gear 473. The unloading plate 471 rotates at the same speed. When the unloading hole rotates through the gap between the adjustment plate 462 and the baffle 461, the raw materials in the storage tank 42 are moved to the dosing tank 44. After adding a set amount of water to the dosing tank 44, the stirring device 45 is started, and the stirring device 45 stirs the raw materials in the dosing tank 44 and stirs the raw materials into the electroplating liquid. The solenoid valve is started to transport the electroplating liquid to the loading tank 31. Then the driving device 36 starts and pushes the feeding piston 32 to move downward. The electroplating liquid in the feeding tank 31 is fed from the feeding pipe 25 to the feeding pipe 21 under the drive of the feeding piston 32. At the same time, since the distance between the feeding piston 32 and the sealing plate 34 increases after the movement, the air pressure above the feeding piston 32 decreases accordingly, and the air inside the feeding pipe 21 is extracted through the vent pipe 24, so that the electroplating liquid raw material can fill the feeding pipe 21. When the feeding piston 32 moves to the end, the steel cable 33 is tightened, and the air in the feeding pipe 21 is completely discharged. The feeding piston 32 that continues to move drives the sealing plate 34 to move synchronously and close the vent pipe 24. At this time, the continuously moving feeding piston 32 causes the liquid pressure in the feeding pipe 21 to continue to increase. The increased pressure pushes the sealing cover 23 outward. Since the inner sealing plug 27 is restricted by the adjacent limit rod 291, only the sealing plug 27 at the end of the feeding pipe 21 can move. At this time, the sealing cover 23 at the end moves outward under the action of pressure and drives the sealing plug 27 to move through the connecting rod 294. When the sealing cover 23 moves to a state close to the open state, the sealing plug 27 moves to a state where the magnets 293 are close to each other. At the same time, since the pressure in the feeding pipe 21 is the same, the movement of the sealing plug 27 will not be restricted, and the magnets 293 close to each other attract each other under the action of magnetism and make the sealing plug 27 seal the limit block 26. When the sealing plug 27 is moved by the suction force of the magnet 293, the sealing plug 27 reacts to the sealing cover 23 through the connecting rod 294 and pushes the sealing cover 23 outward. The feeding port 22 is then opened, and the high-pressure electroplating solution in the feeding pipe 21 is then sprayed into the inside of the electroplating pool 1. When the sealing cover 23 is opened, a pressure difference is formed on both sides of the sealing plug 27, and the sealing plug 27 is further pressed on the limit block 26 by hydraulic pressure to improve the sealing performance of the sealing plug 27. After the sealing plug 27 moves, the limiting rod 291 on the sealing plug 27 moves synchronously, and the adjacent sealing plug 27 loses its restriction and sprays the internal electroplating liquid into the electroplating pool 1 in the same way.This is repeated until all the plating solutions in the feeding tube 21 are fed. At this time, the feeding tube 21 is in a sealed state, and the continuously moving loading piston 32 continues to press the plating solution in the loading tank 31 downward. The loading piston 32 is buffered by the pressure limiting tube 38 when being driven, that is, the driving device 36 first drives the safety piston 39 downward continuously when driving, and the safety piston 39 continuously compresses the air inside the pressure limiting tube 38 after moving, and pushes the limit tube and the loading piston 32 downward by the gas pressure. When the pressure in the loading tank 31 continues to increase, the increased pressure reacts to the pressure limiting tube 38, and the air pressure in the pressure limiting tube 38 increases synchronously. When the air pressure in the pressure limiting tube 38 rises to a critical value, the gas in the pressure limiting tube 38 is discharged from the pressure relief valve. When the output end of the driving device 36 moves to the end, it moves back and drives the loading piston 32 to move synchronously, and at the same time, the outside air flows from the air vent to the inside of the pressure limiting tube 38 and restores the gas pressure inside the pressure limiting tube 38 to the initial state. After the feeding piston 32 continues to rise, since part of the electroplating liquid in the feeding tank 31 is discharged from the feeding pipe 21, the feeding piston 32 sucks the electroplating liquid raw material in the feeding pipe 21 back into the feeding tank 31 during the process of rising and moving to the initial state, and makes the bottom of the feeding tank 31 and the inside of the feeding pipe 21 in a negative pressure state. The negative pressure state will open the sealing plug 27. Since the feeding port 22 remains open, the remaining electroplating liquid in the feeding pipe 21 contacts the electroplating liquid in the electroplating pool 1 and dilutes the high-concentration electroplating liquid into the electroplating pool 1. When the thrust of the negative pressure and the liquid pressure in the feeding pipe 21 on the sealing plug 27 is greater than the magnetic force between the magnets 293, the sealing plug 27 moves accordingly and opens the limit block 26. The sealing cover 23 outside the feeding port 22 is closed accordingly, and the low-concentration electroplating liquid in the feeding pipe 21 flows from the middle of the limit block 26. The remaining sealing plugs 27 are opened in the same way. As the feeding piston 32 rises, the sealing plate 34 rises under the action of the buffer spring 35. When the sealing plate 34 moves to the initial state, the vent pipe 24 opens synchronously. At the same time, the feeding piston 32 that continues to move squeezes the air between the feeding piston 32 and the sealing plate 34 from the vent pipe 24 into the feeding pipe 21, and the air above the feeding pipe 21 continues to increase. The continuously increasing gas pressure squeezes the low-concentration plating solution in the feeding pipe 21 into the feeding tank 31, and mixes the low-concentration plating solution with the plating solution stock solution. A single feeding operation is then completed. The driving device 36 then continues to run repeatedly until the concentration of the plating solution raw material in the feeding tank 31 remains the same as that in the electroplating pool 1. After the feeding operation is completed, the remaining plating solution in the feeding tank 31 can be manually passed into the electroplating pool 1, or directly discharged into the waste liquid collection equipment.

[0053] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0054] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic dosing device for electroplating electrolyte, characterized in that: comprising an electroplating bath (1); A segmented feeding mechanism (2) is used for feeding materials into the electroplating pool (1); A feeding mechanism (3) is used to feed the prepared electroplating solution; An automatic proportioning mechanism (4) for automatically proportioning the electroplating solution; The automatic proportioning mechanism (4) is arranged at the top end of the outer side of the electroplating pool (1), the feeding mechanism (3) is arranged at the bottom end of the automatic proportioning mechanism (4), and the segmented feeding mechanism (2) is arranged at the bottom end inside the electroplating pool (1).

2. The automatic dosing device for electroplating electrolyte according to claim 1, characterized in that: The segmented feeding mechanism (2) comprises a feeding pipe (21), the feeding pipe (21) being symmetrically connected to both sides of the bottom end of the electroplating tank (1), a feeding port (22) being provided on the side of the feeding pipe (21), a sealing cover (23) being connected to the outside of the feeding port (22), and a ventilation pipe (24) and a feed pipe (25) being fixedly connected to one end of the feeding pipe (21).

3. The automatic dosing device for electroplating electrolyte according to claim 2, characterized in that: A limiting block (26) is fixedly connected to the inside of the feeding pipe (21); the limiting block (26) is an annular structure; a sealing plug (27) is slidably connected to the inside of the limiting block (26); and a liquid leakage groove (28) is provided on the inside of the sealing plug (27) and the inside of the limiting block (26).

4. The automatic dosing device for electroplating electrolyte according to claim 3, characterized in that: The sealing plug (27) is a platform-shaped structure. One end of the limiting block (26) is provided with a groove corresponding to the structure of the sealing plug (27). The sealing plug (27) is connected to a positioning assembly (29). The positioning assembly (29) comprises a limiting rod (291). The limiting rod (291) is fixedly connected to the outside of the sealing plug (27).

5. The automatic dosing device for electroplating electrolyte according to claim 4, characterized in that: The limiting rod (291) is slidably connected to the inside of the limiting block (26); magnets (293) are fixedly connected to the inner side of the sealing plug (27) and the limiting block (26); the positions of the magnets (293) correspond to each other and the polarities of the corresponding surfaces of the magnets (293) are opposite; and the sealing plug (27) is connected to the sealing cover (23) via a connecting rod (294).

6. The automatic dosing device for electroplating electrolyte according to claim 1, characterized in that: The automatic proportioning mechanism (4) comprises a bracket (41), the top end of the bracket (41) is fixedly connected to a storage tank (42), the bottom end of the storage tank (42) is fixedly connected to a hopper (43), the bottom end of the bracket (41) is fixedly connected to a batching tank (44), the bottom end of the hopper (43) is connected to the inside of the batching tank (44) through a pipeline, and the inside of the batching tank (44) is connected to a stirring device (45).

7. The automatic dosing device for electroplating electrolyte according to claim 6, characterized in that: The storage tank (42) is internally connected to an adjusting assembly (46), and the adjusting assembly (46) comprises a baffle (461) fixedly connected to the inside of the storage tank (42), the top end of the baffle (461) is rotatably connected to an adjusting plate (462), the top end of the adjusting plate (462) is fixedly connected to an adjusting rod (463), and the top end of the adjusting rod (463) is arranged to pass through the storage tank (42).

8. The automatic dosing device for electroplating electrolyte according to claim 7, characterized in that: The bottom end of the baffle (461) is connected to a quantitative component (47), and the quantitative component (47) includes a discharge plate (471) rotatably connected to the bottom end of the baffle (461), and the bottom end of the discharge plate (471) is fixedly connected to a driving rod (472), and the end of the driving rod (472) is fixedly connected to a driving gear (473), and the outer side of the driving gear (473) is meshedly connected to a gear ring (474), and the gear ring (474) is rotatably connected to the top end of the batching tank (44).

9. The automatic dosing device for electroplating electrolyte according to claim 6, characterized in that: The feeding mechanism (3) comprises a feeding tank (31) and a driving device (36); the feeding tank (31) is fixedly connected to the bottom end of the outer side of the electroplating tank (1); a feeding piston (32) is slidably connected inside the feeding tank (31); the top end of the feeding piston (32) is fixedly connected to a sealing plate (34) via a steel cable (33); the top end of the sealing plate (34) is fixedly connected to a buffer spring (35).

10. The automatic dosing device for electroplating electrolyte according to claim 9, characterized in that: The bottom end of the batching tank (44) is fixedly connected to a fixed tube (37), the top end of the fixed tube (37) is connected to a solenoid valve, the top end of the feeding piston (32) is fixedly connected to a pressure limiting tube (38), the inside of the pressure limiting tube (38) is slidably connected to a safety piston (39), the safety piston (39) is fixedly connected to the output end of the driving device (36), and the side wall of the pressure limiting tube (38) is fixedly connected to a pressure relief valve.

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