Clamping state detection method, clamping device, electronic equipment and storage medium

Abstract

The invention relates to a clamping state detection method, a clamping device, electronic equipment and a storage medium. The clamping state detection method comprises the steps that a chuck assembly is controlled to clamp a to-be-packaged workpiece; when the chuck assembly makes contact with the to-be-packaged workpiece, clamping information between the chuck assembly and the to-be-packaged workpiece is obtained; whether abnormal clamping exists between the chuck assembly and the to-be-packaged workpiece or not is judged according to the clamping information; and if the clamping is abnormal, the chuck assembly is controlled to enter an alarm mode. According to the scheme, the technical problems that due to the fact that a traditional clamping device cannot conduct early warning on the poor clamping state in advance, the clamping precision is low, the inclination degree of the workpiece to be packaged is high, and the product packaging yield is low are effectively solved.

Description

Technical Field

[0001] The present application relates to the technical field of clamping equipment, and in particular to a clamping state detection method, a clamping device, an electronic device and a storage medium. Background Art

[0002] A fixture or clamping device is a device used to fix the object to be processed in the mechanical manufacturing process so that it occupies the correct position for construction or inspection. In the packaging process of the camera module, a fixture is usually required to fix the workpiece to be packaged.

[0003] At present, after clamping the workpiece to be packaged, the fixture will immediately proceed to the next process, such as fixing the workpiece to be packaged to a fixed position or transferring the workpiece to be packaged to a specified position, etc. The clamping state between the fixture and the workpiece to be packaged will not be detected, and the bad clamping state cannot be warned in advance. If there are abnormalities such as deformation of the clamping surface, inaccurate positioning of the chuck and the surface of the workpiece to be packaged, or contamination of the clamping surface, the accurate clamping of the workpiece to be packaged by the fixture cannot be ensured, which affects the inclination of the workpiece to be packaged and the product packaging yield is low. Summary of the invention

[0004] The present application provides a clamping state detection method, a clamping device, an electronic device and a storage medium to solve the technical problems that the traditional clamping device cannot give early warning of bad clamping states, resulting in low clamping accuracy, high inclination of the workpiece to be packaged, and low product packaging yield.

[0005] To this end, in the first aspect, an embodiment of the present application provides a clamping state detection method, which includes: controlling a chuck assembly to clamp the workpiece to be packaged; when the chuck assembly contacts the workpiece to be packaged, obtaining clamping information between the chuck assembly and the workpiece to be packaged; judging whether there is a clamping abnormality between the chuck assembly and the workpiece to be packaged based on the clamping information; if there is a clamping abnormality, controlling the chuck assembly to enter an alarm mode.

[0006] In a possible implementation, the steps of obtaining clamping information between the chuck assembly and the workpiece to be packaged, and determining whether there is a clamping abnormality between the chuck assembly and the workpiece to be packaged according to the clamping information include:

[0007] Obtain a first center point of the workpiece to be packaged, and form an anchor point range with a radius of 0.04 mm to 0.08 mm radiating outward from the first center point;

[0008] obtaining a second center point of the chuck assembly;

[0009] If the second center point is outside the anchor point range, it is determined that there is a clamping abnormality between the chuck assembly and the workpiece to be packaged.

[0010] In a possible implementation manner, if the second center point is outside the anchor point range, then after determining that there is a clamping abnormality between the chuck assembly and the workpiece to be packaged, the method further includes:

[0011] Obtaining the number of clamping positions between the chuck assembly and the workpiece to be packaged;

[0012] If the number of clamping positions is less than the preset clamping position value, it is determined that the alignment between the clamping head assembly and the workpiece to be packaged is abnormal.

[0013] In a possible implementation manner, if the second center point is outside the anchor point range, then after determining that there is a clamping abnormality between the chuck assembly and the workpiece to be packaged, the method further includes:

[0014] Obtaining the clamping area between the chuck assembly and the workpiece to be packaged;

[0015] If the area of ​​the clamping region is not equal to the preset clamping area, it is determined that the clamping head assembly and / or the workpiece to be packaged is abnormally deformed.

[0016] In a possible implementation, the steps of obtaining clamping information between the chuck assembly and the workpiece to be packaged, and determining whether there is a clamping abnormality between the chuck assembly and the workpiece to be packaged according to the clamping information include:

[0017] Acquire first image information of a clamping surface of the chuck assembly;

[0018] judging whether there is dirt on the chuck assembly according to the first image information;

[0019] If yes, it is determined that there is a first dirt anomaly on the chuck assembly; and / or,

[0020] Acquire second image information of the clamping portion of the workpiece to be packaged;

[0021] judging whether there is dirt on the workpiece to be packaged according to the second image information;

[0022] If so, it is determined that a second dirt anomaly exists on the workpiece to be packaged.

[0023] In a possible implementation, if there is a clamping abnormality, the step of controlling the clamp assembly to enter an alarm mode includes:

[0024] If there is an abnormal misalignment, the chuck assembly is controlled to move until it is aligned with the workpiece to be packaged; or, if there is an abnormal deformation of the chuck assembly, the chuck assembly is controlled to enter a parts replacement mode;

[0025] And / or, if there is abnormal deformation of the workpiece to be packaged, the workpiece to be packaged is controlled to enter a recovery mode; or, if there is abnormal contamination, the chuck assembly and / or the workpiece to be packaged is controlled to enter a cleaning mode.

[0026] In a possible implementation manner, before the step of controlling the chuck assembly to move to a specified position of the workpiece to be packaged, the method further includes:

[0027] Obtaining clamping surface information of the chuck assembly;

[0028] Determine whether the chuck assembly is in a calibration state according to the clamping surface information;

[0029] If so, the chuck assembly is controlled to clamp the workpiece to be packaged.

[0030] In the second aspect, the present application also provides a clamping device, including: a first control module, configured to control the chuck assembly to clamp the workpiece to be packaged; an acquisition module, configured to acquire clamping information between the chuck assembly and the workpiece to be packaged when the chuck assembly contacts the workpiece to be packaged; a judgment module, configured to judge whether there is a clamping abnormality between the chuck assembly and the workpiece to be packaged based on the clamping information; and a second control module, configured to control the chuck assembly to enter an alarm mode if there is a clamping abnormality.

[0031] In a third aspect, the present application also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the clamping state detection method as described above when executing the computer program.

[0032] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the clamping state detection method as described above when executed by a processor.

[0033] According to the clamping state detection method, clamping device, electronic device and storage medium provided in the embodiment of the present application, the clamping state detection method includes: controlling the chuck assembly to clamp the workpiece to be packaged; when the chuck assembly contacts the workpiece to be packaged, obtaining the clamping information between the chuck assembly and the workpiece to be packaged; judging whether there is a clamping abnormality between the chuck assembly and the workpiece to be packaged according to the clamping information; if there is a clamping abnormality, controlling the chuck assembly to enter the alarm mode. The technical solution of the present application adds a self-checking process before performing the clamping operation, and intends to detect the clamping abnormality in advance, so as to avoid the poor clamping accuracy of the chuck assembly on the workpiece to be packaged due to the existence of a clamping abnormality between the chuck assembly and the workpiece to be packaged, the tilt of the workpiece to be packaged during the clamping process, resulting in poor subsequent packaging accuracy, and low product yield, effectively improving the clamping accuracy and clamping reliability of the clamping device on the workpiece to be packaged, improving the packaging yield of the product, and avoiding potential risks. Compared with the working mode of the traditional clamping device directly performing the clamping operation, the clamping device provided in this embodiment improves the clamping operation process, fills the gap of being unable to pre-check clamping abnormalities in advance, has a high effective clamping rate for the packaged workpiece, and has a high yield rate for the processed packaged products. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments that conform to the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can also be obtained based on these drawings without paying creative labor. One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplified descriptions do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute a proportional limitation.

[0035] Figure 1 A schematic flow chart of a clamping state detection method is provided for an embodiment of the present application;

[0036] Figure 2 A structural schematic diagram of a clamping device is provided for an embodiment of the present application.

[0037] Description of reference numerals:

[0038] 10. First control module; 20. Acquisition module; 30. Judgment module; 40. Second control module;

[0039] 100. Chuck assembly; 200. Workpiece to be packaged. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0041] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed in itself. In addition, the various specific processes and examples of materials provided by the present application, but those of ordinary skill in the art can appreciate the applicability of other processes and / or the use of other materials.

[0042] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0043] See also Figure 1 The embodiment of the present application provides a clamping state detection method, which includes: step S1, controlling the chuck assembly 100 to clamp the workpiece 200 to be packaged; step S2, when the chuck assembly 100 contacts the workpiece 200 to be packaged, obtaining the clamping information between the chuck assembly 100 and the workpiece 200 to be packaged; step S3, judging whether there is a clamping abnormality between the chuck assembly 100 and the workpiece 200 to be packaged according to the clamping information; step S4, if there is a clamping abnormality, controlling the chuck assembly 100 to enter the alarm mode.

[0044] In this embodiment, a self-checking process is added before the clamping operation is performed, and the clamping abnormality is detected in advance to avoid the clamping abnormality between the clamping head assembly 100 and the workpiece 200 to be packaged, resulting in poor clamping accuracy of the clamping head assembly 100 for the workpiece 200 to be packaged, and the workpiece 200 to be packaged tilts during the clamping process, resulting in poor subsequent packaging accuracy and low product yield. The clamping accuracy and clamping reliability of the clamping device for the workpiece 200 to be packaged are effectively improved, the packaging yield of the product is improved, and potential risks are avoided. Compared with the working mode of the traditional clamping device directly performing the clamping operation, the clamping device provided in this embodiment improves the clamping operation process, fills the gap of being unable to pre-check the clamping abnormality in advance, has a high effective clamping rate for the workpiece 200 to be packaged, and has a high yield of the processed packaged products. It has been verified that compared with the 99.5% product yield of the traditional clamping device, the product yield of the packaged product processed by the clamping device provided in this embodiment can be increased to 99.9%.

[0045] Specifically, the clamping state detection method provided by the present application can pre-check the clamping state between the chuck assembly 100 and the workpiece 200 to be packaged in advance before clamping and fixing or clamping and moving the workpiece 200 to be packaged, so as to avoid the adverse effects such as poor clamping accuracy and clamping inclination caused by the existence of clamping abnormalities between the two, and improve the clamping reliability and product packaging yield. First, it is necessary to control the chuck assembly 100 to move to the workpiece 200 to be packaged, and make it in a clamping relationship with the workpiece 200 to be packaged, so as to facilitate the detection of the clamping state between the chuck assembly 100 and the workpiece 200 to be packaged before the clamping force is applied. Then, as soon as the chuck assembly 100 contacts the workpiece 200 to be packaged, the clamping information between the two is obtained, that is, at this time, the clamping surface of the chuck assembly 100 and the clamping part of the workpiece 200 to be packaged are in a state of just touching / overlapping, and there is no force applied or received between the two. In this way, the interference of the clamping force on the detection result of the clamping state between the two is avoided, and the accuracy of the detection result is improved. Afterwards, it is determined whether there is a clamping abnormality between the two according to the clamping information in the aforementioned non-force contact state. Finally, if there is no clamping abnormality, the chuck assembly 100 can continue the clamping action, and apply a predetermined clamping force to the workpiece 200 to be packaged as agreed, so as to improve the clamping stability and reliability between the two; if there is a clamping abnormality, it is necessary to eliminate the clamping abnormality first, and then perform subsequent clamping actions to avoid the problems of low clamping verticality, poor clamping accuracy, and poor clamping force uniformity caused by the clamping abnormality, and improve the clamping effect. The method for detecting the clamping state of the clamping device provided in this example has a high degree of precision in the detection results and a strong reliability in the detection results. It can effectively avoid the adverse effects of abnormal clamping between the clamping head assembly 100 and the workpiece 200 to be packaged on subsequent packaging. It has high clamping accuracy, high packaging yield, and high quality of packaged products.

[0046] In a possible implementation, the steps of obtaining clamping information between the chuck assembly 100 and the workpiece 200 to be packaged, and determining whether there is a clamping abnormality between the chuck assembly 100 and the workpiece 200 to be packaged according to the clamping information include:

[0047] Step S231, obtaining a first center point of the workpiece 200 to be packaged, and forming an anchor point range with a radius of 0.04 mm to 0.08 mm radiating outward from the first center point;

[0048] Step S232, obtaining a second center point of the chuck assembly 100;

[0049] Step S233: If the second center point is outside the anchor point range, it is determined that there is a clamping abnormality between the chuck assembly 100 and the workpiece 200 to be packaged.

[0050] This embodiment provides a method for determining whether there is a clamping abnormality between the chuck assembly 100 and the workpiece 200 to be packaged. In this method, it is first necessary to obtain the position of the first center point of the workpiece 200 to be packaged. For example, the position image information of the workpiece 200 to be packaged can be obtained by a camera / camera / industrial camera, and its visual center point, that is, the position of the first center point, is obtained according to the position image information; and a circle is formed with the position of the first center point as the center to form an anchor point range, and the radius of the anchor point range is 0.04mm~0.08mm, for example, the anchor point range can be a circular area with a radius of 0.05mm, 0.06mm or 0.07mm with the first center point as the center; it can be understood that before the workpiece 200 to be packaged is clamped by the chuck assembly 100, it should be placed in a designated position, and the general position of the workpiece 200 to be packaged should be fixed first, and then the chuck assembly 100 should be moved and aligned with the workpiece 200 to be packaged, so as to shorten the alignment and clamping time between the two and improve the packaging efficiency. Then, the position of the second center point of the chuck assembly 100 is obtained. For example, the position image information of the workpiece 200 to be packaged can be obtained through a camera / camera / industrial camera, and its visual center point is obtained according to the position image information, which is the position of the second center point. Finally, it is determined whether the position of the second center point is within the anchor point range. For example, the position of the second center point can be infrared marked, and at the same time, the maximum size of the anchor point range is infrared marked. At this time, it is only necessary to determine whether the infrared mark point of the second center point falls on / in the infrared mark circle of the anchor point range to determine whether there is an abnormality between the chuck assembly 100 and the workpiece 200 to be packaged; if the infrared mark point is on or in the infrared mark circle, it means that the alignment between the chuck assembly 100 and the workpiece 200 to be packaged is neat and there is no abnormality; if the infrared mark point is outside the infrared mark circle, it means that the chuck assembly 100 and the workpiece 200 to be packaged are misaligned / displaced, and there is a clamping abnormality between the two. The clamping abnormality judgment method provided in this example has strong executability and controllable cost. It can perform self-inspection on multiple clamping abnormalities on the assembly line at the same time, and has high management efficiency.

[0051] In a possible implementation manner, if the second center point is outside the anchor point range, after determining that there is a clamping abnormality between the clamp assembly 100 and the workpiece to be packaged 200, the method further includes:

[0052] Step S2331, obtaining the number of clamping positions between the clamp assembly 100 and the workpiece 200 to be packaged;

[0053] Step S2332: If the number of clamping positions is less than the preset clamping position value, it is determined that the alignment between the clamping head assembly 100 and the workpiece 200 to be packaged is abnormal.

[0054] This embodiment provides a method for judging the misalignment between the chuck assembly 100 and the component to be packaged. In this method, the second center point of the chuck assembly 100 is outside the anchor point range of the workpiece 200 to be packaged. At this time, it is necessary to first obtain the number of clamping sites between the chuck assembly 100 and the workpiece 200 to be packaged. For example, a distance sensor can be set at the clamping surface of the chuck assembly 100 to obtain the distance between the clamping surface and the surface of the clamping part of the workpiece 200 to be packaged. When the distance between the two is less than the preset distance, it is judged that the clamping surface and the corresponding clamping part are in a clamping state, and a number of clamping sites is recorded; or, a light sensing element can be set at the clamping surface of the chuck assembly 100. When the light sensing element cannot detect light information, it is judged that the clamping surface and the corresponding clamping part are in a clamping state, and a number of clamping sites is recorded. Then, the number of clamping sites obtained is compared with the number of preset clamping sites. For example, the chuck assembly 100 is a double chuck component, each chuck has at least two clamping cantilevers, and each clamping cantilever can clamp at least one clamping site on the workpiece 200 to be packaged. At this time, the number of preset clamping sites is 4. If the number of clamping sites obtained is less than 4, it means that there is no contact relationship between one or more clamping cantilevers and their corresponding clamping sites. In this example, the above-mentioned clamping abnormality is judged as an abnormal misalignment between the chuck assembly 100 and the workpiece 200 to be packaged. In this example, the relationship between the second center position of the chuck assembly 100 and the anchor point range of the workpiece 200 to be packaged, and the comparison result between the actual number of clamping sites between the chuck assembly 100 and the workpiece 200 to be packaged and the preset clamping site value is used to judge whether the chuck assembly 100 and the workpiece 200 to be packaged are misaligned. The judgment result is highly accurate and reliable.

[0055] In a possible embodiment, if there is a clamping abnormality, the step of controlling the chuck assembly 100 to enter the alarm mode includes: step S41, if there is an abnormal misalignment, control the chuck assembly 100 to move until it is aligned with the workpiece 200 to be packaged. This example provides a solution to the abnormal misalignment of the chuck assembly 100. In this solution, since there is a large position information difference between the second center point of the chuck assembly 100 and the anchor point range of the workpiece 200 to be packaged, it is necessary to move the chuck assembly 100 a second time to align its center with the center of the workpiece 200 to be packaged as much as possible, so as to overcome the clamping abnormality caused by the large position difference between the two, which is conducive to improving the accuracy of subsequent clamping abnormality judgment. It should be understood that after completing the alignment between the chuck assembly 100 and the workpiece 200 to be packaged, it is necessary to repeat the above-mentioned step of obtaining the number of clamping sites between the chuck assembly 100 and the workpiece 200 to be packaged until the clamping abnormality is overcome.

[0056] In a possible implementation, after the chuck assembly 100 is moved to align with the workpiece 200 to be packaged, the following further includes: if the position of the second center point falls within the anchor point range after the position of the chuck assembly 100 is adjusted again; then the number of clamping sites between the chuck assembly 100 and the workpiece 200 to be packaged needs to be obtained again; if the number of clamping sites is still less than the preset clamping site value, then it is determined that the chuck assembly 100 / the workpiece 200 to be packaged has a deformation abnormality. After eliminating the misalignment abnormality, this example adds a secondary judgment logic to further determine that the misalignment abnormality is caused by the deformation of one of the components; at this time, the chuck assembly 100 needs to be replaced or the workpiece 200 to be packaged needs to be remelted to reduce the invalid packaging of damaged components or broken workpieces, and improve the packaging efficiency and packaging yield.

[0057] In a possible implementation manner, if the second center point is outside the anchor point range, after determining that there is a clamping abnormality between the clamp assembly 100 and the workpiece to be packaged 200, the method further includes:

[0058] Step S2333, obtaining the clamping area between the chuck assembly 100 and the workpiece 200 to be packaged;

[0059] Step S2334: if the area of ​​the clamping region is not equal to the preset clamping area, it is determined that the clamping head assembly 100 and / or the workpiece 200 to be packaged has abnormal deformation.

[0060] This embodiment provides a method for judging abnormal deformation of the chuck assembly 100. In this method, the second center point of the chuck assembly 100 is outside the anchor point range of the workpiece 200 to be packaged. At this time, it is necessary to first obtain the clamping area between the chuck assembly 100 and the workpiece 200 to be packaged, that is, the contact area between the two. For example, the area size of the contact area between the two can be detected by an infrared sensor. Then, the actual clamping area obtained is compared with the preset clamping area. If the clamping area is equal to the preset clamping area, it means that there is no deformation or other problems on the clamping surface or the clamping part, and the clamping state between the chuck assembly 100 and the workpiece 200 to be packaged is normal, and the chuck assembly 100 can be controlled to continue the next clamping process; if the clamping area is less than or greater than the preset clamping area, it means that the clamping surface of the chuck assembly 100 has convex / concave or the clamping part of the workpiece 200 to be packaged has bulges / pits and other deformation problems, so that the effective contact area between the two changes, and abnormal deformation occurs. This example determines whether there is abnormal deformation between the chuck assembly 100 and the workpiece 200 to be packaged through the relationship between the second center position of the chuck assembly 100 and the anchor point range of the workpiece 200 to be packaged, and the comparison result between the actual clamping area and the preset clamping area between the chuck assembly 100 and the workpiece 200 to be packaged. The judgment result is highly accurate and reliable.

[0061] In a possible embodiment, if there is a clamping anomaly, the step of controlling the chuck assembly 100 to enter the alarm mode includes: step S42, if there is a deformation anomaly of the chuck assembly 100, the chuck assembly 100 is controlled to enter the parts replacement mode; and / or, step S43, if there is a deformation anomaly of the workpiece 200 to be packaged, the workpiece 200 to be packaged is controlled to enter the recovery mode. This example provides a solution when the chuck assembly 100 and / or the workpiece 200 to be packaged is deformed abnormally. In this solution, due to the deformation damage of the chuck assembly 100 and the workpiece 200 to be packaged, it is necessary to replace a new chuck assembly 100 or recycle / remelt the damaged workpiece 200 to be packaged, reduce invalid clamping, and improve processing efficiency and production yield. It should be understood that after completing the replacement of the chuck assembly 100 / recycling of the workpiece 200 to be packaged, it is necessary to repeat the above-mentioned step of obtaining the area of ​​the clamping area between the chuck assembly 100 and the workpiece 200 to be packaged until the clamping anomaly is overcome.

[0062] In a possible implementation, the steps of obtaining clamping information between the chuck assembly 100 and the workpiece 200 to be packaged, and determining whether there is a clamping abnormality between the chuck assembly 100 and the workpiece 200 to be packaged according to the clamping information include:

[0063] Step S234, obtaining first image information of the clamping surface of the chuck assembly 100;

[0064] Step S235, judging whether there is dirt on the chuck assembly 100 according to the first image information;

[0065] Step S236: If yes, determine that there is a first dirt anomaly on the chuck assembly 100; and / or,

[0066] Step S237, obtaining second image information of the clamping portion of the workpiece 200 to be packaged;

[0067] Step S238, judging whether there is dirt on the workpiece 200 to be packaged according to the second image information;

[0068] Step S239: If yes, determine that a second dirt anomaly exists on the workpiece 200 to be packaged.

[0069] This embodiment provides a method for judging whether there is abnormal dirt on the surface of the chuck assembly 100 / the workpiece to be packaged 200. In this judgment method, after the chuck assembly 100 and the workpiece to be packaged 200 are in a clamping state, it is necessary to first obtain the first image information of the clamping surface of the chuck assembly 100 that is in contact with the workpiece to be packaged 200, for example, it can be obtained by a camera / camera / industrial camera, etc. Then, based on the first image information, it is judged whether there is dirt such as glue on the clamping surface. If the area of ​​dirt such as glue on the first image information exceeds 0.05mm 2 , indicating that the dirt block on the clamping surface is large and subsequent inspection operations cannot be performed, it is determined that there is a first dirt abnormality on the clamping head assembly 100. And / or, it is necessary to first obtain the second image information of the clamping part of the workpiece 200 to be packaged that contacts the clamping head assembly 100, for example, it can be obtained by a camera / camera / industrial camera, etc. Then, based on the second image information, it is determined whether there is dirt such as glue on the clamping part. If the area of ​​dirt such as glue on the second image information exceeds 0.05mm 2 , indicating that the dirt block on the clamping part is large and subsequent detection operations cannot be performed, then it is determined that there is a second dirt abnormality on the workpiece to be packaged 200. In this example, after the chuck assembly 100 and the workpiece to be packaged 200 are in a clamping state, the chuck assembly 100 and / or the second image information of the clamping part of the workpiece to be packaged 200 are determined to determine whether there is a dirt abnormality on the chuck assembly 100 and / or the workpiece to be packaged 200, and the judgment result is highly accurate and reliable.

[0070] In a possible embodiment, if there is a clamping abnormality, the step of controlling the chuck assembly 100 to enter the alarm mode includes: step S44, if there is a dirt abnormality, controlling the chuck assembly 100 and / or the workpiece to be packaged 200 to enter the cleaning mode. This example provides a solution when a dirt abnormality occurs between the chuck assembly 100 and the workpiece to be packaged 200. In this solution, since the presence of dirt abnormalities on the chuck assembly 100 / the workpiece to be packaged 200 will affect the accuracy of the clamping information obtained, it is necessary to clean the chuck assembly 100 / the workpiece to be packaged 200 to remove the aforementioned dirt, avoid the problem of low accuracy of clamping abnormality detection caused by dirt problems, reduce invalid self-inspections, and improve processing efficiency. It should be understood that after completing the replacement of the chuck assembly 100 / cleaning of the workpiece to be packaged 200, it is necessary to repeat the above steps of obtaining the first image information of the chuck assembly 100 / the second image information of the workpiece to be packaged 200 until the clamping abnormality is overcome.

[0071] In a possible implementation manner, before the step of controlling the chuck assembly 100 to move to a designated position of the workpiece 200 to be packaged, the method further includes:

[0072] Step S01, obtaining the clamping surface information of the chuck assembly 100;

[0073] Step S02, judging whether the chuck assembly 100 is in a calibration state according to the clamping surface information;

[0074] Step S03: If yes, control the chuck assembly 100 to clamp the workpiece 200 to be packaged.

[0075] In this embodiment, a pre-detection scheme is provided for performing correction on the side of the chuck assembly 100 to reduce subsequent clamping abnormalities. In the pre-detection scheme, before moving the chuck assembly 100, it is necessary to first obtain the clamping surface information on the chuck assembly 100, such as the flatness information or inclination information of the clamping surface. Then, it is determined whether the chuck assembly 100 is in a correction state based on the clamping surface information obtained above. For example, if there is a large deviation between the flatness information of the clamping surface and the preset plane information, it means that there is a convexity / concave situation on the clamping surface of the chuck assembly 100, and the convexity / concave situation will cause subsequent clamping state detection abnormality; for example, if there is a large deviation between the inclination of the clamping surface and the preset inclination self-test, it means that the clamping surface of the chuck assembly 100 is in an abnormal working position, and the abnormal working position will cause the clamping state detection abnormality. Therefore, the above-mentioned abnormal situation on the chuck assembly 100 can be detected in advance to reduce its adverse effect in the subsequent clamping state detection, shorten the self-test time, and improve the self-test efficiency.

[0076] In another example, before the step of controlling the chuck assembly 100 to move to the specified position of the workpiece 200 to be packaged, it also includes: obtaining whether the fillet radius of the clamp arms of the two clamps of the chuck assembly 100 is within the preset radius value, if so, it indicates that the positions of the two clamp arms of the clamp are calibrated, the chuck assembly 100 is in a normal working state, and subsequent operations can continue; if not, it indicates that the positions of the two clamp arms of the clamp are not calibrated, the chuck assembly 100 is in an abnormal working state, and the positions of the two clamp arms need to be further corrected.

[0077] In another example, before the step of controlling the chuck assembly 100 to move to the specified position of the workpiece 200 to be packaged, it also includes: obtaining the position information of the two clamps of the chuck assembly 100, and determining whether the positions of the two clamps are in the same horizontal plane. If so, it indicates that the positions of the two clamps have been calibrated, the chuck assembly 100 is in a normal operating state, and subsequent operations can continue; if not, it indicates that the positions of the two clamps have not been calibrated, the chuck assembly 100 is in an abnormal operating state, and it is necessary to continue and calibrate the positions of the two clamps.

[0078] In addition, if Figure 2As shown, the present application also provides a clamping device, including: a first control module 10, configured to control the chuck assembly 100 to clamp the workpiece 200 to be packaged; an acquisition module 20, configured to acquire clamping information between the chuck assembly 100 and the workpiece 200 to be packaged when the chuck assembly 100 contacts the workpiece 200 to be packaged; a judgment module 30, configured to judge whether there is a clamping abnormality between the chuck assembly 100 and the workpiece 200 to be packaged based on the clamping information; and a second control module 40, configured to control the chuck assembly 100 to enter an alarm mode if there is a clamping abnormality.

[0079] In this embodiment, the clamping device is configured as a combined component including at least a first control module 10, an acquisition module 20, a judgment module 30 and a second control module 40. The first control module 10 can be a chip or a PCB main control board, and the second control module 40 can be a chip or a PCB main control board. The first control module 10 and the second control module 40 can be integrated on a chip or a PCB main control board to form an integrated component to reduce the occupied space; they can also be two separate chips or PCB main control boards to facilitate processing, reduce the production difficulty of the chip or PCB main control board, and reduce costs. The acquisition module 20 may be an image acquisition device such as a camera or a video camera, which is used to acquire the position information between the chuck assembly 100 and the workpiece 200 to be packaged, the first image information of the chuck assembly 100, and the second image information of the workpiece 200 to be packaged; it may also be a distance sensor or a light sensing element, etc., which is used to acquire the number of clamping positions between the chuck assembly 100 and the workpiece 200 to be packaged; it may also be an infrared sensor, etc., which is used to acquire the area information of the clamping region between the chuck assembly 100 and the workpiece 200 to be packaged; and the acquired clamping information is transmitted to the judgment module 30. The judgment module 30 may be a processor, which may be used to receive the clamping information from the acquisition module 20 on the one hand, and process the clamping information; on the other hand, it may transmit the processed clamping information to the second control module 40, so as to provide the second control module 40 with reference information for execution decision.

[0080] In addition, the present application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that the processor implements the clamping state detection method as described above when executing the computer program. The specific structure of the clamping state detection method refers to the above embodiment. Since the electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0081] In addition, the present application also provides a computer-readable storage medium on which a computer program is stored, characterized in that when the computer program is executed by a processor, the clamping state detection method described above is implemented. The specific structure of the clamping state detection method refers to the above embodiment. Since the computer-readable storage medium adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0082] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0083] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0084] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A clamping state detection method, characterized in that: include: Controlling the chuck assembly to clamp the workpiece to be packaged; When the chuck assembly contacts the workpiece to be packaged, obtaining clamping information between the chuck assembly and the workpiece to be packaged; Determining whether there is a clamping abnormality between the clamping head assembly and the workpiece to be packaged according to the clamping information; If there is a clamping abnormality, the clamping head assembly is controlled to enter an alarm mode.

2. The clamping state detection method according to claim 1, characterized in that: The step of obtaining clamping information between the chuck assembly and the workpiece to be packaged, and judging whether there is clamping abnormality between the chuck assembly and the workpiece to be packaged according to the clamping information comprises: Acquire a first center point of the workpiece to be packaged, and form an anchor point range with a radius of 0.04 mm to 0.08 mm radiating outward from the first center point; Obtaining a second center point of the chuck assembly; If the second center point is outside the anchor point range, it is determined that there is a clamping abnormality between the chuck assembly and the workpiece to be packaged.

3. The clamping state detection method according to claim 2, characterized in that: If the second center point is outside the anchor point range, then after determining that there is a clamping abnormality between the chuck assembly and the workpiece to be packaged, the following further comprises: Obtaining the number of clamping positions between the clamp assembly and the workpiece to be packaged; If the number of the clamping positions is less than the preset clamping position value, it is determined that the alignment between the clamping head assembly and the workpiece to be packaged is abnormal.

4. The clamping state detection method according to claim 2, characterized in that: If the second center point is outside the anchor point range, then after determining that there is a clamping abnormality between the chuck assembly and the workpiece to be packaged, the following further comprises: Obtaining the clamping area between the chuck assembly and the workpiece to be packaged; If the area of ​​the clamping region is not equal to the preset clamping area, it is determined that the clamping head assembly and / or the workpiece to be packaged is abnormally deformed.

5. The clamping state detection method according to claim 1, characterized in that: The step of obtaining clamping information between the chuck assembly and the workpiece to be packaged, and judging whether there is clamping abnormality between the chuck assembly and the workpiece to be packaged according to the clamping information comprises: Acquiring first image information of a clamping surface of the clamping head assembly; determining whether there is dirt on the chuck assembly according to the first image information; If yes, it is determined that there is a first dirt anomaly on the chuck assembly; and / or, Acquiring second image information of the clamping portion of the workpiece to be packaged; Determining whether there is dirt on the workpiece to be packaged according to the second image information; If so, it is determined that a second dirt anomaly exists on the workpiece to be packaged.

6. The clamping state detection method according to claim 1, characterized in that: If there is a clamping abnormality, the step of controlling the clamp assembly to enter an alarm mode comprises: If there is an abnormal misalignment, the chuck assembly is controlled to move until it is aligned with the workpiece to be packaged; or, if there is an abnormal deformation of the chuck assembly, the chuck assembly is controlled to enter a parts replacement mode; And / or, if the workpiece to be packaged is abnormally deformed, the workpiece to be packaged is controlled to enter a recovery mode; or, if there is an abnormal contamination, the chuck assembly and / or the workpiece to be packaged is controlled to enter a cleaning mode.

7. The clamping state detection method according to claim 1, characterized in that: Before the step of controlling the chuck assembly to move to the designated position of the workpiece to be packaged, the method further includes: Acquiring clamping surface information of the clamping head assembly; judging whether the chuck assembly is in a calibration state according to the clamping surface information; If so, the clamping head assembly is controlled to clamp the workpiece to be packaged.

8. A clamping device, characterized in that: include: A first control module is configured to control the clamping head assembly to clamp the workpiece to be packaged; an acquisition module, configured to acquire clamping information between the chuck assembly and the workpiece to be packaged when the chuck assembly contacts the workpiece to be packaged; A judging module, configured to judge whether there is a clamping abnormality between the clamping head assembly and the workpiece to be packaged according to the clamping information; as well as The second control module is configured to control the clamping head assembly to enter an alarm mode if there is a clamping abnormality.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the clamping state detection method according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the clamping state detection method according to any one of claims 1 to 7 is implemented.

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