Display panel

Abstract

The invention provides a display panel, and the display panel comprises an array substrate which is provided with a first side and a second side which are opposite to each other; a display area; a bending area; the bonding area is bent to face the second side through the bending area, the bending area is located between the display area and the bonding area, and the bonding area at least comprises a first part; the bonding area is bent in the bending area, at least part of the bonding area is located between the bonding area and the display area, and the bonding area is bonded with the second side and the bonding area; the conductive part penetrates through the bonding area and is connected with the first part and the first specified metal layer on the first side; and at least part of the negative voltage signal lines are connected with the first part. According to the scheme, cracks in the bending area can be slowed down or avoided, and the display reliability of the display panel is improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of display technology, and in particular to a display panel. Background Art

[0002] With the development of science and technology, more and more display devices are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable tool for people today. The main component of a display device to realize the display function is a display panel.

[0003] In order to reduce the border width of the display panel, the display panel generally folds the bonding part bound with the control chip to the back of the display panel. The folded area of ​​the display panel is also called the bending area. As the display panel is used, the bending area of ​​the display panel is prone to cracks, thereby affecting the normal display of the display panel. Summary of the invention

[0004] The technical problem solved by the embodiments of the present invention is that cracks are prone to appear in the bending area of ​​the display panel, thereby affecting the normal display of the display panel.

[0005] To solve the above technical problems, an embodiment of the present invention provides a display panel, comprising: an array substrate, having a first side and a second side relatively arranged; a display area; a bending area; a bonding area, bent through the bending area to face the second side, wherein the bending area is located between the display area and the bonding area, and the bonding area at least includes a first part; an adhesive area, after the bending area is bent, at least part of the adhesive area is located between the bonding area and the display area, and is bonded to the second side and the bonding area; a conductive part, penetrating the adhesive area, and connected to the first part and the first designated metal layer of the first side; a plurality of negative voltage signal lines, wherein at least part of the negative voltage signal lines are connected to the first part.

[0006] Optionally, the bonding area includes a hollow portion, wherein the conductive portion passes through the hollow portion.

[0007] Optionally, along the direction from the second side to the first side, the bonding area includes: a first supporting film layer, a first adhesive layer, a second adhesive layer and a second supporting film layer stacked in sequence.

[0008] Optionally, the first designated metal layer includes a first metal layer.

[0009] Optionally, the display panel further includes a first via hole, and the first metal layer and the conductive part are electrically connected through the first via hole.

[0010] Optionally, along the direction from the second side to the first side, the array substrate includes a first protective layer, a first barrier layer, a second protective layer, a second barrier layer and a buffer layer, and the first metal layer is embedded in the buffer layer.

[0011] Optionally, the display panel further includes a second via, a third via, a second metal layer and a polysilicon layer, wherein the second via connects the first metal layer and the second metal layer, the third via connects the second metal layer and the polysilicon layer, the second metal layer is an internal negative voltage metal routing of the display area, and the polysilicon layer is connected to the panel control signal generation circuit.

[0012] Optionally, along the direction from the second side to the first side, the display area also includes a gate insulation layer, a capacitor dielectric layer, an insulating dielectric layer and a planarization layer stacked sequentially on the buffer layer, wherein the second metal layer is embedded in the planarization layer, and the polysilicon layer is embedded in the gate insulation layer.

[0013] Optionally, a portion of the multiple negative voltage signal lines is connected to the first portion, and another portion of the multiple negative voltage signal lines enters the display area via the second designated metal layer of the bending area.

[0014] Optionally, from the inner surface to the outer surface of the bending zone, the bending zone includes a first protective layer, a first barrier layer, a second protective layer, a second barrier layer, a buffer layer and an organic layer stacked in sequence, and the second designated metal layer is closer to the inner surface of the bending zone than the outer surface of the bending zone, wherein after the bending zone is bent, the inner surface faces the bonding area.

[0015] Optionally, the second designated metal layer is a first metal layer or a zeroth metal layer, wherein the first metal layer is embedded in the buffer layer, and the zeroth metal layer is embedded in the second protective layer.

[0016] Optionally, the display panel further includes a shielding structure, wherein the shielding structure wraps the second designated metal layer.

[0017] Optionally, the shielding structure is connected to a GND signal.

[0018] Optionally, from the inner surface to the outer surface of the bending zone, the bending zone includes a first protective layer, a first barrier layer, a second protective layer, a second barrier layer, a buffer layer, a fourth metal layer, an organic layer, a third metal layer, a planarization layer, a pixel definition layer, a touch screen buffer layer, a touch screen metal layer and a touch screen protective layer stacked in sequence, and the second designated metal layer is the third metal layer.

[0019] Optionally, the touch screen metal layer and the fourth metal layer form the shielding structure.

[0020] Optionally, the shielding structure is ring-shaped.

[0021] Optionally, all negative voltage signal lines are connected to the first part.

[0022] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0023] After the bending area of ​​the display panel is bent, at least part of the bonding area is located between the bonding area and the display area, the conductive part penetrates the bonding area, and is connected to the first part of the bonding area and the first designated metal layer on the first side, and at least part of the voltage signal lines of the multiple negative voltage signal lines are connected to the first part of the bonding area, so that at least part of the negative voltage signal lines do not pass through the bending area, but directly connect to the first designated metal layer through the bonding area, that is, at least part of the negative voltage signal is input from the control chip to the inside of the screen body of the display area by back bonding. In this way, cracks in the bending area can be slowed down or avoided, and the display reliability of the display panel can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a partial structural schematic diagram of a display panel in an embodiment of the present invention;

[0025] Figure 2 is a cross-sectional view of a portion of a display panel after it is bent;

[0026] Figure 3 is a cross-sectional view of a display panel;

[0027] Figure 4 yes Figure 2 A cross-sectional view along section line AA in one embodiment;

[0028] Figure 5 yes Figure 2 A cross-sectional view along section line AA in another embodiment;

[0029] Figure 6 yes Figure 2 A cross-sectional view along section line AA in yet another embodiment;

[0030] Figure 7 yes Figure 6 Section view along section line BB;

[0031] Figure 8 is a partial structural schematic diagram of another display panel in an embodiment of the present invention;

[0032] Fig. 9is another cross-sectional view showing a portion of the panel after it is bent;

[0033] Fig.10 yes Fig. 9 A cross-sectional view along the section line CC in one embodiment;

[0034] Fig.11 yes Fig. 9 A cross-sectional view along section line CC in another embodiment;

[0035] Fig.12 is a partial structural schematic diagram of another display panel in an embodiment of the present invention;

[0036] Fig.13 yes Fig.12 Section view along section line DD;

[0037] Fig.14 yes Fig.13 Cross-sectional view along section line EE.

[0038] Reference numerals:

[0039] 100-display panel; 10-display area; 103-first metal layer; 104-first via hole; 105-first protective layer; 106-first barrier layer; 107-second protective layer; 108-second barrier layer; 109-buffer layer; 110-second via hole; 111-third via hole; 112-second metal layer; 113-polysilicon layer; 114-gate insulating layer; 115-capacitor dielectric layer; 116-insulating dielectric layer; 117-planarization layer; 20-bending area; 21-organic layer; 22-zero metal layer; 23-fourth metal layer; 24-third metal layer, 25-pixel definition layer; 26-touch layer Touch screen buffer layer; 27-touch screen metal layer; 28-touch screen protective layer; 30-bonding area; 31-hollow part; 32-first supporting film layer; 33-first glue layer; 34-second glue layer; 35-second supporting film layer; 40-bonding area; 41-soldering pad; 50-conductive part; 60-negative voltage signal line; 70-shielding structure; 81-VSR circuit; 82-control chip; 83-positive voltage signal line; 84-cover plate; 85-array substrate; 851-first side; 852-second side; 86-optical glue; 87-polarizer; 88-bending area protective glue; L1-screen center axis; L2-bending area axis. DETAILED DESCRIPTION

[0040] As mentioned above, in order to reduce the border width of the display panel, the display panel generally folds the bonding part with the control chip to the back of the display panel. The folded area of ​​the display panel is also called the bending area. As the display panel is used, cracks are prone to appear in the bending area, thus affecting the display of the display panel. Research has found that the root cause of cracks in the bending area is bending stress. Stress exceeding the tolerance limit of the material or material degeneration and aging during the reliability process may cause cracks, resulting in an open circuit of the product signal line (metal wiring), resulting in no display or abnormal display of the display panel.

[0041] The following methods are usually used to solve the problem of cracks. Method 1: reduce the probability of cracks by increasing the thickness of the organic film layer in the bending area. Method 2: reduce the probability of cracks by replacing new materials or optimizing the process. However, method 1 will increase costs. Method 2 requires verification of the reliability and feasibility of new materials or optimized processes, which increases verification costs and risks.

[0042] To solve the above problem, after the bending area of ​​the display panel is bent, at least part of the bonding area is located between the bonding area and the display area, the conductive part penetrates the bonding area, and is connected to the first part of the bonding area and the first designated metal layer on the first side, and at least part of the negative signal lines of the multiple negative voltage signal lines are connected to the first part of the bonding area, so that at least part of the voltage signal lines do not pass through the bending area, but directly connect to the first designated metal layer through the bonding area, that is, the negative voltage signal is input from the control chip to the inside of the screen body of the display area by back bonding. In this way, the probability of transition metals (such as palladium) in the high-refractive organic compound (OC) material in the microlens pattern (MicroLens Pattern, MLP) being attracted into the organic material of the bending area under the negative voltage of the negative voltage signal line can be effectively reduced, the probability of catalysis of the CF group in the organic material by the transition metal is reduced, the degeneration and aging of the bending area material is slowed down, and cracks in the bending area are slowed down or avoided, and the display reliability of the display panel is improved. In addition, compared with increasing the thickness of the organic film layer, replacing new materials or optimizing the process, this method can also reduce costs and risks.

[0043] In order to make the above-mentioned purposes, features and beneficial effects of the embodiments of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. The described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of this application.

[0044] It is obvious to those skilled in the art that various modifications and changes can be made in the present application without departing from the spirit or scope of the present application. Therefore, the present application is intended to cover modifications and changes of the present application that fall within the scope of the corresponding claims (technical solutions for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present application can be combined with each other without contradiction.

[0045] An embodiment of the present invention provides a display panel. Figure 1 is a partial structural diagram of a display panel in an embodiment of the present invention, Figure 2 It is a cross-sectional view of a portion of the display panel after it is bent. Figure 1 and Figure 2 , the specific structure of the display panel 100 is described. It should be noted that, Figure 1 and Figure 2 Only part of the structure of the display panel is shown in the figure to facilitate intuitive display of the relevant structure, and some structures are not shown in the figure.

[0046] In a specific implementation, the display panel 100 includes: an array substrate 85, a display area 10, a bending area 20, a bonding area 40, an adhesive area 30, a conductive part 50, and a plurality of negative voltage signal lines 60. The array substrate 85 has a first side 851 and a second side 852 that are arranged opposite to each other. The first side 851 may be a side of the display panel 100 where a light-emitting element is arranged. The bonding area 40 is bent toward the second side 852 through the bending area 20, wherein the bending area 20 is located between the display area 10 and the bonding area 40, and the bonding area 40 includes at least a first portion. After the adhesive area 30 is bent at the bending area 20, at least a portion of the adhesive area 30 is located between the bonding area 40 and the display area 10, and is bonded to the second side 852 and the bonding area 40. The conductive part 50 penetrates the adhesive area 30 and is connected to the first portion and the first designated metal layer of the first side 851. At least some of the negative voltage signal lines 60 among the plurality of negative voltage signal lines 60 are connected to the first portion.

[0047] The plurality of negative voltage signal lines 60 may be connected to a control chip 82. The control chip 82 may be an integrated circuit (IC) chip.

[0048] For example, when the display panel 100 is bent, the bending region 20 is bent along the bending region axis L2.

[0049] In some non-limiting embodiments, the bending zone axis L2 is parallel to the width direction of the display panel 100 .

[0050] As can be seen from the above scheme, the conductive part 50 penetrates the bonding area 30 and is connected to the first part of the bonding area 40 and the first designated metal layer of the first side 851, and at least part of the negative voltage signal lines 60 in the plurality of negative voltage signal lines 60 is connected to the first part of the bonding area 40, so that at least part of the negative voltage signal lines 60 pass through the bonding area 30 and directly connect to the first designated metal layer of the first side 851, without passing through the bending area 20, that is, the negative voltage signal is input from the control chip to the inside of the screen body of the display area 10 by back bonding. In this way, the probability of the transition metal (such as palladium) in the high-refractive organic compound (OC) material in the microlens pattern (MLP) being attracted into the organic material of the organic film layer of the bending area 20 under the negative voltage of the negative voltage signal line 60 can be effectively reduced, the probability of the transition metal catalyzing the CF group in the organic material can be reduced, the material degeneration and aging of the bending area 20 can be slowed down, and the generation of cracks in the bending area 20 can be slowed down or avoided, and the display reliability of the display panel 100 can be improved. In addition, compared with increasing the thickness of the organic film layer, replacing new materials or optimizing the process, this method can also reduce costs and risks.

[0051] In a specific implementation, the negative voltage signal transmitted by the negative voltage signal line 60 may be a negative voltage signal all the time, or may be a signal that is at a negative voltage most of the time (e.g., greater than or equal to 50% of the time). The negative voltage signal may be, for example, one or more of the following: gate off voltage (VGL), ELVSS, reference voltage (Vref), electromotive force (EM), etc. ELVSS is the abbreviation of Extra Low Voltage Supply, which is usually used to describe the negative voltage that supplies power to the screen display pixel circuit.

[0052] At least part of the negative voltage signal line 60 that does not pass through the bending area 20 can be routed out through the left and right sides of the control chip 82. The left and right direction refers to the width direction of the display panel, that is, the direction perpendicular to the central axis L1 of the screen body, and the central axis L1 of the screen body is parallel to the length direction of the display panel.

[0053] In some embodiments, the conductive part 50 may be anisotropic conductive film (ACF) or silver paste. The conductive part 50 is used to connect the first designated metal layer and the first portion.

[0054] In some non-limiting embodiments, a bonding pad 41 is disposed on the first designated metal layer and the first portion, wherein the bonding pad 41 may also be referred to as a bonding point, etc. Two ends of the conductive portion 50 are respectively connected to the bonding pad 41 on the first designated metal layer and the bonding pad 41 on the first portion.

[0055] In a specific implementation, the number of the conductive parts 50 can be set according to the number of the negative voltage signal lines 60 entering the display area 10 through the bonding area 30 , and is not limited to the number shown in the figure.

[0056] In some embodiments, in combination Figure 1 and Figure 2 , the bonding area 30 may include a hollow portion 31 . The conductive portion 50 passes through the hollow portion 31 .

[0057] In some non-limiting embodiments, a hollow portion 31 may be formed by hollowing out a corresponding position of the bonding area 30 .

[0058] In some embodiments, along the direction X pointing from the second side 852 to the first side 851 , the bonding area 30 includes: a first supporting film layer 32 , a first adhesive layer 33 , a second adhesive layer 34 and a second supporting film layer 35 stacked in sequence.

[0059] In some non-limiting embodiments, the second supporting film layer 35 is connected to the second side 852, such as by bonding. The second supporting film layer 35, the second adhesive layer 34, the first adhesive layer 33, and the first supporting film layer 32 are sequentially bonded to each other. The second supporting film layer 35 and the first supporting film layer 32 play a supporting role for the bonding area 40. The first adhesive layer 33 and the second adhesive layer 34 play a bonding role, and are used to bond the second supporting film layer 35 and the first supporting film layer 32.

[0060] The first supporting film layer 32, the first adhesive layer 33, the second adhesive layer 34 and the second supporting film layer 35 can be a whole, or they can be separately and independently arranged, or two or three adjacent ones of the first supporting film layer 32, the first adhesive layer 33, the second adhesive layer 34 and the second supporting film layer 35 can be regarded as a whole.

[0061] The first adhesive layer 33 and the second adhesive layer 34 can be structures with adhesive function such as adhesive tapes. The first adhesive layer 33 and the second adhesive layer 34 can be adhesive layers of the same type or adhesive layers of different types.

[0062] In a specific implementation, the first designated metal layer of the first side 851 includes a first metal layer 103. Currently, most of the display panels 100 (such as flexible display screens) have a first metal layer. By using the existing first metal layer 103 as the first designated metal layer, the modification of the display panel 100 can be reduced, and the cost can be reduced. The first metal layer 103 can be made of metals such as molybdenum, aluminum, copper, silver and titanium, or a composite metal including one or more of the above metals.

[0063] See also Figure 3 The cross-sectional view of the display panel is given, referring to Figures 1 to 3The display panel 100 further includes a first via hole 104 , and the first metal layer 103 and the conductive part 50 are electrically connected through the first via hole 104 .

[0064] Along the direction X from the second side 852 to the first side 851, the array substrate 85 may include a flexible substrate (PI) and a buffer layer 109. Along the direction X from the second side 852 to the first side 851, the flexible substrate may include a first protective layer (PI layer 1) 105, a first barrier layer 106, a second protective layer (PI layer 2) 107, and a second barrier layer 108. The first metal layer 103 is embedded in the buffer layer 109. Further, the first metal layer 103 is embedded in the buffer layer 109 and is close to the second barrier layer 108.

[0065] The flexible substrate may be formed of any suitable insulating material having flexibility. For example, the flexible substrate may be formed of a polymer material such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), or fiberglass reinforced plastic (FRP).

[0066] The buffer layer 109 covers the entire upper surface of the flexible substrate, that is, covers the entire upper surface of the second barrier layer 108 .

[0067] The buffer layer 109 may be formed of an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlOx), or aluminum nitride (AlNx), or an organic material, blocks oxygen and moisture, prevents moisture or impurities from diffusing through the flexible substrate, and provides a flat surface on the upper surface of the flexible substrate.

[0068] In a specific implementation, the display panel 100 further includes a second via 110, a third via 111, a second metal layer 112 and a polysilicon layer 113. The second via 110 connects the first metal layer 103 and the second metal layer 112, the third via 111 connects the second metal layer 112 and the polysilicon layer 113, the second metal layer 112 is an internal negative voltage metal wiring of the display area 10, and the polysilicon layer 113 is connected to a panel control signal generating circuit. The panel control signal generating circuit may be a vertical shift register (Vertical Shift Register, VSR) circuit 81.

[0069] Along the direction X pointing from the second side 852 to the first side 851, the array substrate 85 also includes a gate insulation layer 114, a capacitor dielectric layer 115, an insulating dielectric layer 116 and a planarization layer 117 stacked in sequence on the buffer layer 109, wherein the second metal layer 112 is embedded in the planarization layer 117, and the polysilicon layer 113 is embedded in the gate insulation layer 114.

[0070] In some non-limiting embodiments, the second metal layer 112 is embedded in the planarization layer 117 and is close to the insulating dielectric layer 116 .

[0071] In some non-limiting embodiments, the polysilicon layer 113 is embedded in the gate insulating layer 114 and is close to the buffer layer 109 .

[0072] In some non-limiting embodiments, the gate insulating layer 114 may include an inorganic layer of silicon oxide, silicon nitride, or metal oxide, and may include a single layer or multiple layers.

[0073] In some non-limiting embodiments, the capacitor dielectric layer 115 may be formed of an insulating inorganic layer such as silicon oxide or silicon nitride.

[0074] In some non-limiting embodiments, the insulating dielectric layer (also referred to as an interlayer insulating layer) 116 is used to insulate between stacked layers. The insulating dielectric layer 116 may be formed of an insulating inorganic layer such as silicon oxide or silicon nitride.

[0075] In some non-limiting embodiments, the planarization layer 117 includes an organic layer such as acrylic, polyimide (PI), or benzocyclobutene (BCB).

[0076] In some embodiments, a portion of the multiple negative voltage signal lines 60 is connected to the first portion, and another portion of the multiple negative voltage signal lines 60 enters the display area 10 via the second designated metal layer of the bending area 20 .

[0077] In some embodiments, in combination Figure 1 , Figure 4 and Figure 5 From the inner surface to the outer surface of the bending region 20, the bending region 20 includes a flexible substrate, a buffer layer 109 and an organic layer 21 stacked in sequence. From the inner surface to the outer surface of the bending region 20, the flexible substrate includes a first protective layer 105, a first barrier layer 106, a second protective layer 107 and a second barrier layer 108.

[0078] Compared with the outer surface of the bending zone 20 , the second designated metal layer is closer to the bending zone 20 from the inner surface, and the second designated metal layer is far away from the organic layer 21 , wherein after the bending zone 20 is bent, the inner surface faces the bonding zone 30 .

[0079] Combination Figure 4 , the second designated metal layer is the first metal layer 103. Or, in combination Figure 5 , the second designated metal layer is the zero metal layer 22. The first metal layer 103 is embedded in the buffer layer 109, and the zero metal layer 22 is embedded in the second protective layer 107. The first metal layer 103 or the zero metal layer 22 is used as the routing design of the negative voltage signal. On the one hand, the distance between the negative voltage signal and the organic layer on the upper surface is increased, which weakens the influence of the negative electric field on the transition metal in the organic layer; on the other hand, the negative voltage signal routing is kept away from the stress center of the bending area; on the other hand, the path of cracks or corrosion is extended, which prolongs the time when the negative voltage signal routing fails.

[0080] Combination Figure 1 , Figure 2 , Figure 6 and Figure 7 The display panel 100 may further include a shielding structure 70, which wraps the second designated metal layer. The shielding structure 70 shields the negative voltage of the negative voltage signal line to prevent the residual transition metal ions such as Pd on the surface of the TP protective layer from being attracted to the underlying organic film.

[0081] In some embodiments, the shielding structure 70 is connected to a ground (GND) signal.

[0082] From the inner surface to the outer surface of the bending zone 20, the bending zone 20 includes a first protective layer 105, a first barrier layer 106, a second protective layer 107, a second barrier layer 108, a buffer layer 109, a fourth metal layer 23, an organic layer 21, a third metal layer 24, a planarization layer 117, a pixel definition layer 25, a touch screen buffer layer 26, a touch screen metal layer 27 and a touch screen protective layer 28, which are stacked in sequence, and the second designated metal layer is the third metal layer 24.

[0083] The touch screen metal layer 27 and the fourth metal layer 23 form the shielding structure 70 .

[0084] The shielding structure 70 is in a ring shape, or in a quadrilateral shape or other suitable shapes.

[0085] In some embodiments, all negative voltage signal lines 60 are connected to the first portion, that is, all negative voltage signal lines 60 input negative voltage signals from the control chip into the screen of the display area 10 through back bonding.

[0086] In some embodiments, the positive voltage signal line 83 can enter the display area 10 via the bending area 20. For example, the positive voltage signal line 83 can exit from the upper side of the control chip 82 and enter the display area 10 via the bending area 20, that is, enter the internal circuit of the screen. The upper side of the control chip 82 refers to the side of the control chip 82 close to the top of the display line board 100 along the length direction of the display panel 100.

[0087] The bending area protective glue 88 is disposed on the bending portion of the display panel 100 to reduce the bending stress.

[0088] The embodiment of the present invention also provides another display panel, combining Figures 8 to 11 The display panel 100 includes: an array substrate 85, a display area 10, a bending area 20, a bonding area 40, an adhesive area 30, and a plurality of negative voltage signal lines 60. The array substrate 85 has a first side 851 and a second side 852 that are arranged opposite to each other, wherein the first side 851 may be a side of the display panel 100 where a light-emitting element is arranged. The bonding area 40 is bent toward the second side 852 through the bending area 20, wherein the bending area 20 is located between the display area 10 and the bonding area 40. After the adhesive area 30 is bent at the bending area 20, at least part of the adhesive area 30 is located between the bonding area 40 and the display area 10, and is bonded to the second side 852 and the bonding area 40. At least some of the multiple negative voltage signal lines 60 enter the display area 10 through the second designated metal layer of the bending area 20; from the inner surface to the outer surface of the bending area 20, the bending area 20 includes a first protective layer 105, a first blocking layer 106, a second protective layer 107, a second blocking layer 108, a buffer layer 109 and an organic layer 21 stacked in sequence, compared with the outer surface of the bending area 20, the second designated metal layer is closer to the inner surface of the bending area 20, wherein after the bending area 20 is bent, the inner surface faces the bonding area 30.

[0089] In some embodiments, in combination Fig.10 , the second designated metal layer is the first metal layer 103. Wherein, the first metal layer 103 is embedded in the buffer layer 109.

[0090] In other embodiments, in combination Fig.11 , the second designated metal layer is the zeroth metal layer 22. The zeroth metal layer 22 is embedded in the second protection layer 107.

[0091] The first metal layer 103 or the zero metal layer 22 is used as the routing design for the negative voltage signal. On the one hand, the distance between the negative voltage signal and the organic layer on the upper surface is increased, which weakens the influence of the negative electric field on the transition metal in the organic layer; on the other hand, the negative voltage signal routing is kept away from the stress center of the bending zone; on the other hand, the path of cracks or corrosion is extended, which prolongs the time for the negative voltage signal routing to fail. This can reduce the probability of transition metals catalyzing CF groups in organic materials, slow down the material degeneration and aging of the bending zone 20, and then slow down or avoid cracks in the bending zone 20, thereby improving the display reliability of the display panel 100. In addition, compared with increasing the thickness of the organic film layer, replacing new materials or optimizing the process, this method can also reduce costs and risks.

[0092] It should be noted that Figures 8 to 11 For a detailed description of the structure of the display panel 100 provided in the embodiment given and other structures that may also be included, please refer to the above Figures 1 to 7 The introduction in the corresponding embodiments will not be repeated here.

[0093] The embodiment of the present invention also provides another display panel, see Figure 8 , Figure 12 to Figure 14 The display panel 100 includes: the display panel 100 includes: an array substrate 85, a display area 10, a bending area 20, a bonding area 40, an adhesive area 30 and a plurality of negative voltage signal lines 60. The array substrate 85 has a first side 851 and a second side 852 arranged opposite to each other, and the first side 851 is a side of the display panel 100 where the light-emitting element is arranged. The bonding area 40 is bent toward the second side 852 through the bending area 20, wherein the bending area 20 is located between the display area 10 and the bonding area 40. After the adhesive area 30 is bent at the bending area 20, at least part of the adhesive area 30 is located between the bonding area 40 and the display area 10, and is bonded to the second side 852 and the bonding area 40. At least part of the negative voltage signal lines 60 among the plurality of negative voltage signal lines 60 enter the display area 10 via the second designated metal layer of the bending area 20 ; a shielding structure 70 , wherein the shielding structure 70 wraps the second designated metal layer.

[0094] By shielding the negative voltage of the negative voltage signal line through the shielding structure 70, the residual transition metal ions such as Pd on the surface of the touch screen (TP) protection layer are prevented from being attracted to the lower organic film layer, which can reduce the probability of transition metal catalysis on the CF group in the organic material, slow down the material degeneration and aging of the bending area 20, and then slow down or avoid the generation of cracks in the bending area 20, thereby improving the display reliability of the display panel 100. In addition, compared with increasing the thickness of the organic film layer, replacing new materials or optimizing the process, this method can also reduce costs and risks.

[0095] In some embodiments, from the inner surface to the outer surface of the bending zone 20, the bending zone 20 includes a first protective layer 105, a first barrier layer 106, a second protective layer 107, a second barrier layer 108, a buffer layer 109, a fourth metal layer 23, an organic layer 21, a third metal layer 24, a planarization layer 117, a pixel definition layer 25, a touch screen buffer layer 26, a touch screen metal layer 27 and a touch screen protective layer 28, which are stacked in sequence, and the second designated metal layer is the third metal layer 24.

[0096] The touch screen metal layer 27 and the fourth metal layer 23 form the shielding structure 70 .

[0097] The shielding structure 70 is in a ring shape, or in a quadrilateral shape or other suitable shapes.

[0098] It should be noted that Figure 12 to Figure 14 For a detailed description of the structure of the display panel 100 provided in the embodiment given and other structures that may also be included, please refer to the above Figures 1 to 7 The introduction in the corresponding embodiments will not be repeated here.

[0099] It should be noted that the bending area 20 and the bonding area 40 serve as non-display areas of the display panel 100. The non-display area does not display information. The display area 10, the bending area 20, and the bonding area 40 may be integrated, so that the structures included in the display area 10 and the partial areas of the bending area 20 may be the same. Accordingly, according to the different functions of different areas, the display area 10 and the bending area 20 may also have some different structures during preparation, which can be configured according to the specific needs.

[0100] It should be noted that the display panel 100 may further include a cover plate 84 , an optically clear adhesive (OCA) 86 , a polarizer 87 , a bending protection layer (BPL) 88 , and the like.

[0101] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A display panel, characterized in that: include: An array substrate having a first side and a second side arranged opposite to each other; Display area; Bending zone; a bonding area, bent through the bending area to face the second side, wherein the bending area is located between the display area and the bonding area, and the bonding area includes at least a first portion; a bonding area, after the bending area is bent, at least a portion of the bonding area is located between the bonding area and the display area and is bonded to the second side and the bonding area; a conductive portion, penetrating the bonding area and connected to the first portion and the first designated metal layer on the first side; A plurality of negative voltage signal lines are provided, wherein at least some of the negative voltage signal lines are connected to the first portion.

2. The display panel according to claim 1, wherein: The bonding area includes a hollow portion, wherein the conductive portion passes through the hollow portion.

3. The display panel according to claim 2, wherein: Along the direction from the second side to the first side, the bonding area includes: a first supporting film layer, a first adhesive layer, a second adhesive layer and a second supporting film layer stacked in sequence.

4. The display panel according to claim 1, wherein: The first designated metal layer includes a first metal layer.

5. The display panel according to claim 4, wherein: It also includes a first via hole, and the first metal layer and the conductive part are electrically connected through the first via hole.

6. The display panel according to claim 4, wherein: Along the direction from the second side to the first side, the array substrate includes a first protective layer, a first barrier layer, a second protective layer, a second barrier layer and a buffer layer, and the first metal layer is embedded in the buffer layer.

7. The display panel according to claim 6, wherein: It also includes a second via, a third via, a second metal layer and a polysilicon layer, wherein the second via connects the first metal layer and the second metal layer, the third via connects the second metal layer and the polysilicon layer, the second metal layer is the internal negative voltage metal routing of the display area, and the polysilicon layer is connected to the panel control signal generating circuit.

8. The display panel according to claim 7, wherein: Along the direction from the second side to the first side, the array substrate also includes a gate insulation layer, a capacitor dielectric layer, an insulating dielectric layer and a planarization layer stacked sequentially on the buffer layer, wherein the second metal layer is embedded in the planarization layer, and the polysilicon layer is embedded in the gate insulation layer.

9. The display panel according to any one of claims 1 to 8, characterized in that: A portion of the negative voltage signal lines among the plurality of negative voltage signal lines is connected to the first portion, and another portion of the negative voltage signal lines among the plurality of negative voltage signal lines enters the display area via the second designated metal layer of the bending area.

10. The display panel according to claim 9, wherein: From the inner surface to the outer surface of the bending zone, the bending zone includes a first protective layer, a first barrier layer, a second protective layer, a second barrier layer, a buffer layer and an organic layer stacked in sequence, and the second designated metal layer is closer to the inner surface of the bending zone than the outer surface of the bending zone, wherein after the bending zone is bent, the inner surface faces the bonding area.

11. The display panel according to claim 10, wherein: The second designated metal layer is a first metal layer or a zeroth metal layer, wherein the first metal layer is embedded in the buffer layer, and the zeroth metal layer is embedded in the second protection layer.

12. The display panel according to any one of claims 9, characterized in that: Also included is a shielding structure, which wraps the second designated metal layer.

13. The display panel according to claim 12, wherein: The shielding structure is connected to the GND signal.

14. The display panel according to claim 13, wherein: From the inner surface to the outer surface of the bending zone, the bending zone includes a first protective layer, a first barrier layer, a second protective layer, a second barrier layer, a buffer layer, a fourth metal layer, an organic layer, a third metal layer, a planarization layer, a pixel definition layer, a touch screen buffer layer, a touch screen metal layer and a touch screen protective layer stacked in sequence, and the second designated metal layer is the third metal layer.

15. The display panel according to claim 14, wherein: The touch screen metal layer and the fourth metal layer form the shielding structure.

16. The display panel according to claim 12, wherein: The shielding structure is ring-shaped.

17. The display panel according to any one of claims 1 to 8, characterized in that: All negative voltage signal lines are connected to the first portion.

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