Antenna support, manufacturing method thereof and electronic equipment

Abstract

The invention relates to an antenna support and a manufacturing method thereof and electronic equipment, the antenna support comprises a support body and an antenna part, the support body comprises at least one supporting part and a plastic part wrapping the supporting part, the supporting part comprises a metal body part and an insulating layer, the surface of the metal body part comprises at least one exposed area which is not covered by the plastic part, and the insulating layer is arranged in the exposed area. The insulating layer covers at least part of the exposed area; the antenna part is arranged on the surface of the plastic part. According to the design, the manufacturing process for manufacturing the antenna part on the surface of the plastic part does not cause pollution to the exposed area, so that the cleanliness of the metal body part is ensured, and the use experience of a user is effectively improved.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic equipment, and in particular to an antenna bracket and a manufacturing method thereof, and electronic equipment. Background Art

[0002] An antenna bracket for carrying an antenna is usually arranged in an electronic device. However, the antenna bracket manufactured by related technology has the problem of surface dirtiness, which affects the user experience. Summary of the invention

[0003] In order to overcome the problems existing in the related art, the present disclosure provides an antenna bracket and a manufacturing method thereof, and an electronic device.

[0004] According to a first aspect of the present disclosure, an antenna bracket is provided, which includes a bracket body, the bracket body includes at least one supporting part and a plastic part covering the supporting part, the supporting part includes a metal body part and an insulating layer, the surface of the metal body part includes at least one exposed area not covered by the plastic part, and the insulating layer covers at least part of the exposed area; the antenna part is arranged on the surface of the plastic part.

[0005] In some embodiments of the present disclosure, the at least one supporting portion includes a first supporting portion, the exposed area of ​​the first supporting portion includes a first exposed area, the insulating layer covers a portion of the first exposed area, and the first exposed area not covered by the insulating layer constitutes a grounding area.

[0006] In some embodiments of the present disclosure, the first exposed area is in the shape of an elongated strip, the grounding area includes a first grounding sub-area and a second grounding sub-area located at both ends of the first exposed area, and a recessed portion is provided on the surface of the metal body between the first grounding sub-area and the second grounding sub-area.

[0007] In some embodiments of the present disclosure, the resistance between any two points in the first exposed area not covered by the insulating layer is less than or equal to 0.2 ohms.

[0008] In some embodiments of the present disclosure, the at least one supporting portion includes a second supporting portion, the exposed area of ​​the second supporting portion includes a second exposed area, and the insulating layer covers the second exposed area.

[0009] In some embodiments of the present disclosure, the second supporting portion constitutes a device cover, an outer surface of a middle region of the device cover constitutes the second exposed area, and the plastic portion covers an edge region of the device cover.

[0010] In some embodiments of the present disclosure, the surface of the metal body portion covered by the plastic portion is covered with the insulating layer.

[0011] In some embodiments of the present disclosure, the thickness of the insulating layer is 8 to 12 μm.

[0012] In some embodiments of the present disclosure, the metal body portion includes an aluminum alloy structural member; and / or the plastic portion includes an ultra-light plastic structural member.

[0013] In some embodiments of the present disclosure, the insulating layer is formed on the surface of the metal body portion by an electrophoresis process; and / or the antenna portion is formed on the surface of the plastic portion by a laser induced chemical plating process.

[0014] According to a second aspect of the present disclosure, a method for manufacturing an antenna bracket is provided, the method for manufacturing the antenna bracket comprising: forming an initial bracket body, the initial bracket body comprising at least one initial supporting portion and a plastic portion covering the initial supporting portion, the initial supporting portion comprising a metal body portion and an initial insulating layer, the surface of the metal body portion comprising at least one exposed area not covered by the plastic portion, and the initial insulating layer at least covering the exposed area; forming an antenna portion on the surface of the plastic portion of the initial bracket body to obtain the antenna bracket.

[0015] In some embodiments of the present disclosure, the forming of the initial bracket body includes: performing electrophoresis treatment on the metal body portion to form the initial insulating layer on the surface of the metal body portion to obtain the initial supporting portion; and forming the plastic portion on the initial supporting portion to obtain the initial bracket body.

[0016] In some embodiments of the present disclosure, the forming of the antenna portion on the surface of the plastic portion of the initial bracket body includes: forming the antenna portion on the plastic portion using a laser induced chemical plating process.

[0017] In some embodiments of the present disclosure, after the antenna part is formed on the surface of the plastic part of the initial bracket body, the method for manufacturing the antenna bracket also includes: removing a portion of the initial insulating layer covering the exposed area to obtain an insulating layer, the metal body part and the insulating layer constitute a supporting part, and the supporting part and the plastic part constitute the bracket body of the antenna bracket, wherein the exposed area exposed through the insulating layer is used for grounding.

[0018] In some embodiments of the present disclosure, the metal body portion includes an aluminum alloy structural member; and / or the plastic portion includes an ultra-light plastic structural member.

[0019] According to a third aspect of the present disclosure, an electronic device is provided, comprising the antenna bracket as described in the first aspect of the present disclosure.

[0020] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0021] In the antenna bracket provided by the present disclosure, the support part of the bracket body includes a metal body part and an insulating layer, and the surface of the metal body part has at least one exposed area not covered by the plastic part, and at least part of the exposed area is covered by the insulating layer. With such a design, the manufacturing process of manufacturing the antenna part on the surface of the plastic part will not cause pollution to the exposed area, thereby ensuring the cleanliness of the metal body part, thereby effectively improving the user experience.

[0022] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0024] Figure 1 is a schematic structural diagram of an antenna bracket according to an exemplary embodiment;

[0025] Figure 2 yes Figure 1 A partial enlarged view of the middle A;

[0026] Figure 3 is a partial cross-sectional view of an antenna bracket at a second supporting portion according to an exemplary embodiment;

[0027] Figure 4 is a schematic flow chart of a manufacturing process of an antenna bracket according to an exemplary embodiment;

[0028] Figure 5 It is a schematic flow chart of a manufacturing process of an antenna bracket according to another exemplary embodiment.

[0029] In the figure:

[0030] 1- bracket body; 11- first supporting portion; 111- first exposed area; 1111- first grounding sub-area; 1112- second grounding sub-area; 1113- inner recess; 12- second supporting portion; 121- second exposed area; 13- insulating layer; 14- metal body portion; 15- plastic portion; 2- antenna portion. DETAILED DESCRIPTION

[0031] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0032] An antenna bracket for carrying an antenna is usually arranged in an electronic device. However, the antenna bracket made by the related technology has the problem of surface dirtiness, which affects the user experience. The inventor of the present disclosure found that the surface dirtiness of the antenna bracket is caused by the synchronous reaction of the metal components in the antenna bracket when the antenna is made.

[0033] In order to solve the above technical problems, the present disclosure provides an antenna bracket, wherein the support portion of the bracket body includes a metal body portion and an insulating layer, and the surface of the metal body portion has at least one exposed area not covered by the plastic portion, and at least a portion of the exposed area is covered by the insulating layer. With such a design, the manufacturing process of manufacturing the antenna portion on the surface of the plastic portion will not cause pollution to the exposed area, thereby ensuring the cleanliness of the metal body portion, thereby effectively improving the user experience.

[0034] An exemplary embodiment of the present disclosure provides an antenna bracket, such as Figure 1 and Figure 3 As shown, the antenna bracket includes a bracket body 1 and an antenna part 2, and the bracket body 1 includes at least one supporting part and a plastic part 15 covering the supporting part. For example, the bracket body 1 can be provided with one supporting part or multiple supporting parts, and the plastic part 15 covers each supporting part, for example, the plastic part 15 can be covered outside the supporting part by injection molding. Figure 3 As shown, the support portion includes a metal body portion 14, and the surface of the metal body portion 14 includes at least one exposed area not covered by the plastic portion 15. The exposed area can be used for grounding to ensure the performance of the antenna portion 2, and can also be used for connecting with other devices.

[0035] The antenna part 2 is arranged on the surface of the plastic part 15. For example, the antenna can be processed on the surface of the plastic part 15 by laser direct structuring (LDS), laser induced chemical plating (LEP), or printing direct structure (PDS), or the antenna can be directly formed by a flexible printed circuit (FPC) and arranged on the surface of the plastic part 15. For the antenna bracket, the antenna part 2 is arranged by LDS or LEP process, which can improve the convenience of arrangement and reduce the weight of the antenna bracket. However, the support part in the related art is usually made of conductive metal material. When the antenna part 2 is arranged by LDS or LEP process, a large amount of debris that cannot be removed will be attached to the support part. These debris will not only cause the antenna bracket to be dirty, but also cause the surface of the support part to be uneven, thereby causing the exposed area of ​​the support part to be unstable in grounding. Therefore, it is difficult to manufacture the antenna part 2 by LDS or LEP process.

[0036] Based on this, in the present embodiment, the support portion further includes an insulating layer 13 disposed on the exposed area of ​​the metal body portion 14, and the insulating layer 13 covers at least part of the exposed area. Exemplarily, the insulating layer 13 may cover the entire exposed area, or may cover part of the exposed area. When the insulating layer 13 covers part of the exposed area, the exposed area not covered by the insulating layer 13 may be used to connect with other devices, for example, may be used for grounding, and then the insulating layer 13 may first cover the entire exposed area, for example, an insulating layer 13 may be attached to the surface of the exposed area by an electrophoresis process, or the insulating layer 13 may be formed by coating a layer of insulating glue on the surface of the exposed area. Thereafter, according to the grounding requirements, the insulating layer 13 on the area to be grounded may be removed, for example, by laser engraving, so that the area to be grounded on the exposed area is exposed to achieve grounding, while the surface of the remaining area is still covered by the insulating layer 13. In this way, the convenience of setting the insulating layer 13 may be improved.

[0037] By providing the insulating layer 13, when the antenna part 2 is manufactured on the surface of the plastic part 15, debris cannot adhere to the exposed area and will not pollute the exposed area, thereby ensuring the cleanliness of the metal body part 14, thereby not only improving the user experience, but also improving the stability of grounding.

[0038] like Figure 1 , Figure 2 and Figure 3As shown, in one embodiment, at least one support portion includes a first support portion 11, and the exposed area of ​​the first support portion 11 includes a first exposed area 111, and the insulating layer 13 covers part of the first exposed area 111. Exemplarily, when the insulating layer 13 covers part of the first exposed area 111, the insulating layer 13 can first cover the entire first exposed area 111, and then remove the insulating layer 13 at the required position according to the grounding requirement; or the insulating layer 13 can be directly provided on the corresponding area. The first exposed area 111 not covered by the insulating layer 13 constitutes a grounding area, and the grounding area is used for grounding. Exemplarily, the bracket body 1 is used to be provided on an electronic device, and an antenna radiator is provided on the electronic device. The bracket body 1 includes a frame adjacent to the antenna radiator, and a through hole for installing a structure such as a camera module can be provided on the bracket body 1, and a frame is formed between one side edge of the through hole and the edge of the bracket body 1 facing the antenna radiator. Since the antenna radiator generates a strong current when working, when a conductive member is provided on the camera module, the conductive member can be, for example, a metal decorative frame of the camera module. The metal decorative frame will couple some current, thus causing the antenna performance to deteriorate. Therefore, the metal decorative frame needs to be grounded so that the current on the metal decorative frame can return to the ground as quickly as possible. Based on this, the first exposed area 111 is located on the surface of the frame facing the metal decorative frame, the insulating layer 13 covers part of the first exposed area 111, and the first exposed area 111 not covered by the insulating layer 13 is used to connect with the metal decorative frame, and can be connected to the grounding part in the electronic device through a conductive connector. The grounding part can be, for example, the grounding part on the mainboard of the electronic device, thereby achieving grounding of the metal decorative frame.

[0039] With such a design, debris generated when manufacturing the antenna part 2 cannot adhere to the first exposed area 111 and will not cause pollution to the first exposed area 111, thereby ensuring the cleanliness of the metal body part 14, which can not only improve the user experience, but also improve the stability of grounding.

[0040] like Figure 2 and Figure 3As shown, in one embodiment, the first exposed area 111 is in the shape of an elongated strip, and the grounding area includes a first grounding sub-area 1111 and a second grounding sub-area 1112 located at both ends of the first exposed area 111. Exemplarily, the first grounding sub-area 1111 is used to connect with the metal decorative frame. For example, a conductive part can be provided on the first grounding sub-area 1111. The conductive part can be composed of a metal main body 14 located on the first grounding sub-area 1111, or the conductive part can be connected to the metal main body 14 located on the first grounding sub-area 1111 by welding or the like. One end of the conductive part is connected to the first grounding sub-area 1111, and the other end of the conductive part extends toward the metal decorative frame to be connected with the metal decorative frame. Exemplarily, the conductive part can be, for example, an elastic structural part. In this way, when the metal decorative frame is pressed against the elastic structural part, the elastic structural part undergoes elastic deformation to react on the metal decorative frame, thereby improving the tightness of the contact between the elastic structural part and the metal decorative frame and improving the stability of the grounding.

[0041] The second grounding sub-region 1112 is used to connect to the grounding part in the electronic device. For example, the second grounding sub-region 1112 can be connected to the grounding part in the electronic device by setting a conductive connector. The conductive connector can be, for example, a metal foil. The first contact part and the second contact part are formed by bending the metal foil. The first contact part and the second contact part are connected. The first contact part can be, for example, bonded with a conductive adhesive to achieve connection with the second grounding sub-region 1112. The second contact part is connected to the grounding part of the electronic device. The second contact part can be, for example, pressed on a pressure plate of a BTB (Board To Board) connector on the mainboard of the electronic device. In this way, while achieving the grounding of the metal decorative frame, the connection stability between the conductive connector and the first grounding sub-region 1111 and the grounding part of the electronic device is effectively improved, thereby further improving the stability of the grounding.

[0042] By dividing the grounding area formed by the first exposed area 111 not covered by the insulating layer 13 into the first grounding sub-area 1111 and the second grounding sub-area 1112, interference between the first grounding sub-area 1111 and the second grounding sub-area 1112 during grounding can be effectively avoided, which facilitates processing and assembly and makes the structural layout more reasonable.

[0043] The surface of the metal body 14 is provided with an inner recess 1113 between the first grounding sub-region 1111 and the second grounding sub-region 1112, and the inner recess 1113 is recessed into the support body so that the plastic part 15 covers it. In this way, on the one hand, the structural strength of the bracket body 1 can be effectively improved, and the long length of the first exposed area 111 can be avoided to affect the structural strength of the antenna bracket. On the other hand, by providing the inner recess 1113 so that the exposed area of ​​the inner recess 1113 is not exposed, it can also prevent debris from adhering to the exposed area, thereby improving the stability of the grounding and improving the cleanliness of the metal body 14.

[0044] In one embodiment, in the first exposed area 111 not covered by the insulating layer 13 , the resistance between any two points is less than or equal to 0.2 ohms, so that the grounding performance of the exposed area can be effectively improved.

[0045] like Figure 1 and Figure 3 As shown, in one embodiment, at least one supporting portion includes a second supporting portion 12, the exposed area of ​​the second supporting portion 12 includes a second exposed area 121, and the insulating layer 13 covers the second exposed area 121. By providing the insulating layer 13 on the second exposed area 121, the debris generated when the antenna portion 2 is manufactured on the plastic portion 15 cannot adhere to the second exposed area 121, and will not cause pollution to the second exposed area 121, thereby ensuring the cleanliness of the metal body portion 14 and improving the user experience.

[0046] In one embodiment, the second support portion 12 constitutes a device cover, which may be, for example, a cover of a speaker. The outer surface of the middle region of the device cover constitutes a second exposed area 121, and the plastic portion 15 covers the edge region of the device cover. By covering the edge region of the device cover with the plastic portion 15, the device cover is fixed and the convenience of fixing the device cover is improved. By providing the insulating layer 13 on the second exposed area 121, the surface flatness and cleanliness of the second exposed area 121 are improved, thereby improving the tightness of the connection between the device cover and the device.

[0047] like Figure 3 As shown, in one embodiment, the surface of the metal body part 14 covered by the plastic part 15 is covered with an insulating layer 13. For example, a layer of insulating layer 13 is first covered on the surface of the metal body part 14, and then the plastic part 15 is formed by injection molding. After the injection molding is completed, the insulating layer 13 on the exposed area of ​​the metal body part 14 can be removed or not removed according to the needs. With such a setting form, the convenience of setting the insulating layer 13 can be effectively improved, and the production efficiency of the antenna bracket is improved.

[0048] In one embodiment, the thickness of the insulating layer 13 is 8 to 12 μm. This design ensures that the grounding stability of the exposed area is improved while preventing the thickness of the insulating layer 13 from affecting the weight reduction of the antenna bracket.

[0049] In one embodiment, compared with stainless steel, aluminum alloy is lighter, and the metal body 14 includes an aluminum alloy structure, and the aluminum alloy is, for example, a high-strength aluminum alloy. Such a design is conducive to further reducing the weight of the antenna bracket.

[0050] In one embodiment, the plastic part 15 includes an ultra-light plastic structural member, which is also conducive to further reducing the weight of the antenna bracket. It is understood that ultra-light plastic is a plastic with a density lower than water, generally referring to a density less than 1g / cm 3 In this embodiment, the ultra-light plastic may be, for example, a Pa+23GF material, wherein Pa refers to nylon, GF refers to glass fiber, and Pa+23GF refers to adding 23% of glass fiber to nylon.

[0051] In one embodiment, the insulating layer 13 is formed on the surface of the metal body 14 by an electrophoresis process. The electrophoresis process refers to the process in which charged resin particles in a solution move under the action of an electric field and are deposited on the metal surface to form a protective coating. The insulating layer 13 is formed on the surface of the metal body 14 by the electrophoresis process. While improving the convenience of setting the insulating layer 13, it can also improve the uniformity of the insulating layer 13 covering the surface of the metal body 14, thereby further avoiding the adhesion of debris, improving the cleanliness and flatness of the metal body 14, and further improving the stability of grounding.

[0052] Since the LDS process has certain restrictions on the material of the plastic part, it cannot be applied to some ultra-light plastic structural parts. Based on this, in one embodiment, the antenna part 2 is formed on the surface of the plastic part 15 by a laser-induced chemical plating process. In this way, the plastic part 15 of the antenna bracket can be formed by an ultra-light plastic structural part, which is conducive to further reducing the weight of the antenna bracket.

[0053] An exemplary embodiment of the present disclosure provides a method for manufacturing an antenna bracket, such as Figure 4 As shown, the manufacturing method of the antenna bracket includes the following steps:

[0054] S100, forming an initial support body, the initial support body comprising at least one initial support portion and a plastic portion covering the initial support portion, the initial support portion comprising a metal body portion and an initial insulating layer, the surface of the metal body portion comprising at least one exposed area not covered by the plastic portion, and the initial insulating layer at least covering the exposed area.

[0055] In this step, if Figure 3As shown, the plastic part can be covered outside the support part by injection molding. The initial insulating layer at least covers the exposed area. For example, the initial insulating layer can only cover the exposed area, or can cover the exposed area and the surface of the metal body part 14 covered by the plastic part 15.

[0056] S200, forming an antenna portion on the surface of the plastic portion of the initial bracket body to obtain an antenna bracket.

[0057] In this step, if Figure 1 As shown, the antenna part 2 is formed on the surface of the plastic part of the initial bracket body. For example, the antenna part 2 can be formed on the plastic part by using the LEP process.

[0058] In this embodiment, by making the initial insulating layer cover at least the exposed area, the manufacturing process of manufacturing the antenna part 2 on the surface of the plastic part 15 will not cause pollution to the exposed area, thereby ensuring the cleanliness of the metal body part 14 and effectively improving the user experience.

[0059] In one embodiment, if Figure 5 As shown, the forming of the initial stent body in step S100 specifically includes the following steps:

[0060] S110, performing electrophoresis treatment on the metal body portion to form an initial insulating layer on the surface of the metal body portion to obtain an initial supporting portion.

[0061] In this step, if Figure 3 As shown, the metal body 14 is subjected to electrophoresis treatment. For example, the metal body 14 is first degreased, and then subjected to surface conditioning and phosphating steps to form a uniform and dense phosphating film on the surface of the metal body 14. The metal body 14 formed with the phosphating film is placed in a container containing an electrophoretic liquid, and a direct current is passed between the metal body 14 and the corresponding electrode. Under the action of the electric field, the particles in the electrophoretic liquid are adsorbed onto the surface of the metal body 14 and deposited on the surface. When the deposited coating reaches a preset thickness, the current delivery is stopped. The preset thickness can be, for example, 8 to 12 μm. Thereafter, the metal body 14 formed with the coating is taken out of the container, and after rinsing and curing, the coating on the surface of the metal body 14 constitutes an initial insulating layer.

[0062] S120, forming a plastic part on the initial support part to obtain an initial bracket body.

[0063] In this step, if Figure 3 As shown, for example, a plastic part 15 can be formed outside a metal body part 14 having an insulating layer 13 formed on the surface thereof by injection molding, thereby obtaining an initial bracket body.

[0064] In this embodiment, an initial insulating layer is formed on the surface of the metal main body 14 by electrophoresis treatment to obtain an initial supporting portion, and then a plastic portion 15 is formed on the initial supporting portion. This manufacturing method can effectively improve the convenience of setting the insulating layer 13, thereby improving the processing efficiency of the initial bracket body.

[0065] Since the LDS process has certain restrictions on the material of the plastic part, it cannot be applied to ultra-light plastic structural parts. Based on this, in one embodiment, the antenna part 2 is formed on the surface of the plastic part of the initial bracket body in step S200, which can be formed by the following method:

[0066] The antenna part is formed on the plastic part by using a laser induced chemical plating process.

[0067] In this embodiment, Figure 1 As shown, the antenna part 2 is formed on the plastic part 15 by using a laser induced chemical plating process. In this way, the plastic part 15 can be made of an ultra-light plastic material, which is beneficial to further reduce the weight of the antenna bracket.

[0068] In one embodiment, after the antenna portion is formed on the surface of the plastic portion of the initial bracket body, the method for manufacturing the antenna bracket further includes the following steps:

[0069] Part of the initial insulating layer covering the exposed area is removed to obtain an insulating layer. The metal body part and the insulating layer constitute a supporting part. The supporting part and the plastic part constitute the support body of the antenna support. The exposed area exposed through the insulating layer is used for grounding.

[0070] In this step, part of the initial insulating layer covering the exposed area can be removed according to grounding requirements, so that the exposed area exposed through the insulating layer 13 can be grounded.

[0071] In this embodiment, Figure 1 and Figure 3 As shown, by setting the initial insulating layer, in the process of forming the antenna part 2, no debris will adhere to the surface of the exposed area, thereby effectively improving the surface flatness of the exposed area. Afterwards, the initial insulating layer covering the exposed area is removed to obtain the insulating layer 13, so that the exposed area exposed by the insulating layer 13 can be grounded. Such a design can effectively improve the stability of grounding, thereby ensuring the performance of the antenna part 2. The metal body part 14 and the insulating layer 13 in this embodiment constitute the support part, and the support part and the plastic part 15 constitute the bracket body 1 of the antenna bracket. In this way, the manufacturing process of making the antenna part 2 on the surface of the plastic part 15 will not cause pollution to the exposed area, thereby ensuring the cleanliness and flatness of the metal body part 14, which can not only effectively improve the user experience, but also improve the stability of grounding.

[0072] In one embodiment, compared with stainless steel, aluminum alloy is lighter, and the metal body 14 includes an aluminum alloy structure, and the aluminum alloy is, for example, a high-strength aluminum alloy. Such a design is conducive to further reducing the weight of the antenna bracket.

[0073] In one embodiment, the plastic part 15 includes an ultra-light plastic structural member, which is also conducive to further reducing the weight of the antenna bracket. It is understandable that ultra-light plastic is a plastic with a density lower than water, generally referring to a plastic with a density less than 1g / cm3. In this embodiment, the ultra-light plastic can be, for example, Pa+23GF material, where Pa refers to nylon, GF refers to glass fiber, and Pa+23GF refers to adding 23% glass fiber to nylon.

[0074] An exemplary embodiment of the present disclosure provides an electronic device, which may be, for example, a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and may also be a non-mobile device such as a personal computer (PC), a television (TV), a teller machine, or a self-service machine.

[0075] The electronic device includes the antenna bracket as described above. Figure 1 and Figure 3 As shown, the antenna bracket includes a bracket body 1 and an antenna part 2, and the bracket body 1 includes at least one supporting part and a plastic part 15 covering the supporting part. Exemplarily, the bracket body 1 can be provided with one supporting part or multiple supporting parts, and the plastic part 15 covers each supporting part. For example, the plastic part 15 can be covered outside the supporting part by injection molding. The surface of the metal body part 14 includes at least one exposed area not covered by the plastic part 15, and the exposed area can be used for grounding to ensure the performance of the antenna part 2, and can also be used for connection with other devices.

[0076] The antenna part 2 is arranged on the surface of the plastic part 15. For example, the antenna can be processed on the surface of the plastic part 15 by LDS, LEP, or PDS processes, or the antenna can be directly formed by an FPC board and arranged on the surface of the plastic part 15. For the antenna bracket, the antenna part 2 is arranged by LDS or LEP process, which can improve the convenience of setting while reducing the weight of the antenna bracket. However, the support part in the related art is usually made of conductive metal material. When the antenna part 2 is arranged by LDS or LEP process, a large amount of debris that cannot be removed will be attached to the support part. These debris will not only cause the antenna bracket to be dirty, but also cause the surface of the support part to be uneven, thereby causing unstable grounding of the exposed area of ​​the support part. Therefore, it is difficult to manufacture the antenna part 2 by LDS or LEP process.

[0077] Based on this, the support part in the present embodiment also includes an insulating layer 13 disposed on the exposed area of ​​the metal body part 14, and the insulating layer 13 covers at least part of the exposed area. Exemplarily, the insulating layer 13 may cover the entire exposed area, or may cover part of the exposed area. When the insulating layer 13 covers part of the exposed area, the exposed area not covered by the insulating layer 13 can be used to connect with other devices, for example, it can be used for grounding, and then the insulating layer 13 can first cover the entire exposed area, for example, a layer of insulating layer 13 can be attached to the surface of the exposed area by an electrophoresis process, or the insulating layer 13 can be formed by coating a layer of insulating glue on the surface of the exposed area. Afterwards, according to the grounding requirements, the insulating layer 13 on the area that needs to be grounded can be removed, for example, it can be removed by laser engraving, so that the area on the exposed area that needs to be grounded is exposed to achieve grounding, and the surface of the remaining area is still covered by the insulating layer 13. In this way, the convenience of setting the insulating layer 13 can be improved.

[0078] By providing the insulating layer 13, when the antenna part 2 is manufactured on the surface of the plastic part 15, debris cannot adhere to the exposed area and will not pollute the exposed area, thereby ensuring the cleanliness of the metal body part 14, thereby not only improving the user experience, but also improving the stability of grounding.

[0079] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0080] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An antenna bracket, characterized in that: The antenna bracket comprises: A bracket body, the bracket body comprising at least one supporting portion and a plastic portion covering the supporting portion, the supporting portion comprising a metal body portion and an insulating layer, a surface of the metal body portion comprising at least one exposed area not covered by the plastic portion, and the insulating layer covering at least a portion of the exposed area; The antenna part is arranged on the surface of the plastic part.

2. The antenna bracket according to claim 1, characterized in that: The at least one supporting portion includes a first supporting portion, the exposed area of ​​the first supporting portion includes a first exposed area, the insulating layer covers a portion of the first exposed area, and the first exposed area not covered by the insulating layer constitutes a grounding area.

3. The antenna bracket according to claim 2, characterized in that: The first exposed area is in a strip shape, the grounding area includes a first grounding sub-area and a second grounding sub-area located at two ends of the first exposed area, and a concave portion is provided on the surface of the metal body between the first grounding sub-area and the second grounding sub-area.

4. The antenna bracket according to claim 2, characterized in that: In the first exposed area not covered by the insulating layer, the resistance between any two points is less than or equal to 0.2 ohms.

5. The antenna bracket according to claim 1, characterized in that: The at least one supporting portion includes a second supporting portion, the exposed area of ​​the second supporting portion includes a second exposed area, and the insulating layer covers the second exposed area.

6. The antenna bracket according to claim 5, characterized in that: The second supporting portion constitutes a device cover plate, an outer surface of a middle region of the device cover plate constitutes the second exposed area, and the plastic portion covers an edge region of the device cover plate.

7. The antenna support according to any one of claims 1 to 6, characterized in that: The surfaces of the metal body part covered by the plastic part are all covered with the insulating layer.

8. The antenna support according to any one of claims 1 to 6, characterized in that: The thickness of the insulating layer is 8 to 12 μm.

9. The antenna support according to any one of claims 1 to 6, characterized in that: The metal body portion includes an aluminum alloy structural member; and / or, The plastic part includes an ultra-light plastic structural member.

10. The antenna bracket according to any one of claims 1 to 6, characterized in that: The insulating layer is formed on the surface of the metal body by an electrophoresis process; and / or, The antenna part is formed on the surface of the plastic part by laser induced chemical plating process.

11. A method for manufacturing an antenna bracket, characterized in that: include: forming an initial support body, the initial support body comprising at least one initial support portion and a plastic portion covering the initial support portion, the initial support portion comprising a metal body portion and an initial insulating layer, the surface of the metal body portion comprising at least one exposed area not covered by the plastic portion, and the initial insulating layer at least covering the exposed area; An antenna portion is formed on the surface of the plastic portion of the initial bracket body to obtain the antenna bracket.

12. The method for manufacturing the antenna bracket according to claim 11, characterized in that: The forming of the initial stent body comprises: Performing electrophoresis treatment on the metal body portion to form the initial insulating layer on the surface of the metal body portion to obtain the initial supporting portion; The plastic part is formed on the initial support part to obtain the initial bracket body.

13. The method for manufacturing the antenna bracket according to claim 11, characterized in that: The antenna portion is formed on the surface of the plastic portion of the initial bracket body, comprising: The antenna part is formed on the plastic part by using a laser induced chemical plating process.

14. The method for manufacturing the antenna bracket according to claim 11, characterized in that: After the antenna portion is formed on the surface of the plastic portion of the initial bracket body, the manufacturing method of the antenna bracket further includes: The portion of the initial insulating layer covering the exposed area is removed to obtain an insulating layer, the metal main body and the insulating layer constitute a supporting portion, the supporting portion and the plastic portion constitute a support body of the antenna support, wherein the exposed area exposed through the insulating layer is used for grounding.

15. The method for manufacturing an antenna bracket according to any one of claims 11 to 14, characterized in that: The metal body portion includes an aluminum alloy structural member; and / or, The plastic part includes an ultra-light plastic structural member.

16. An electronic device, characterized in that: The electronic device comprises the antenna bracket according to any one of claims 1 to 10.

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