Heating ceramic plate for semiconductor test

Abstract

A semiconductor test heating ceramic plate disclosed by the present invention comprises a lower fixing plate and a ceramic heating plate, the lower fixing plate is fixedly provided with the ceramic heating plate, the ceramic heating plate comprises a ceramic plate body, the ceramic plate body is internally provided with a heating loop, one side of the ceramic plate body is fixedly provided with a rapid interface device, and the rapid interface device is connected with the lower fixing plate. The two ends of the heating loop respectively extend to the quick interface device, a heating resistor is arranged in the heating loop, a heating medium is filled in a gap between the heating resistor and the heating loop, and the two ends of the heating resistor are respectively and fixedly connected with the quick interface device. Heat of the heating resistor is rapidly dispersed to the ceramic plate body through cooperation of the heating medium and the heating resistor, the uniform heating effect is achieved, meanwhile, through adding of the heating medium, the situation that the heating resistor is pressed by the ceramic plate body due to the fact that the ceramic plate body wraps the heating resistor under the action of thermal expansion and cold contraction can be prevented, and the situation that the heat-conducting resistor is pressed and becomes thin is prevented.

Description

Technical Field

[0001] The invention relates to the field of heating ceramic plates, in particular to a heating ceramic plate for semiconductor testing. Background Art

[0002] Ceramic heating plates are often used in semiconductor temperature simulation tests in the semiconductor industry. During the heating process, the existing ceramic plates are easily affected by the thermal expansion coefficient of the ceramic plates, which can cause the internal heating resistor wires to be squeezed and become thinner with use, affecting the heating effect. It also affects the service life of the heating resistor, thereby increasing production costs. Summary of the invention

[0003] The main purpose of the present invention is to provide a heating ceramic plate for semiconductor testing.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] A heating ceramic plate for semiconductor testing comprises a lower fixed plate and a ceramic heating plate, the ceramic heating plate being fixedly mounted on the lower fixed plate, the ceramic heating plate comprising a ceramic plate body, a plurality of interconnected heating circuits being provided in the ceramic plate body, a quick interface device being fixedly mounted on one side of the ceramic plate body, the two ends of the heating circuit respectively extending to the quick interface device, a heating resistor being arranged in the heating circuit, a heating medium being filled in the gap between the heating resistor and the heating circuit, and the two ends of the heating resistor being fixedly connected to the quick interface device respectively.

[0006] Furthermore, a plurality of medium passages for circulating heating medium are fixedly provided between the heating circuits. The medium passages extend into the ceramic plate body between the heating circuits, and the other end of the medium passages is closed and not connected to other medium passages or heating circuits.

[0007] Furthermore, an expansion groove extending into the ceramic plate body is fixedly opened on the upper end surface of the heating loop, and when the ceramic plate body is placed horizontally, the highest height of the heating medium is lower than 1 / 3 of the height of the expansion groove.

[0008] Furthermore, a plurality of support members for supporting the heating resistor are fixedly provided on the inner wall of the lower end surface of the heating loop, and the heating resistor is in a suspended state in the heating loop.

[0009] Furthermore, the heating medium includes one of conventional heat-conducting liquid, liquid metal heat-conducting material, super heat-conducting liquid and heat-conducting glue.

[0010] Furthermore, the conventional heat-conducting liquid includes a mixture of one or more of silicone oil, diethylene glycol, water and BP high-quality heat-conducting liquid.

[0011] Furthermore, the liquid metal thermal conductive material includes one of gallium-based alloy, mercury, lead and bismuth.

[0012] Furthermore, the lower fixing plate is made of a heat-insulating material, and the surface area of ​​the lower fixing plate used for connecting to the ceramic heating plate is larger than the surface area of ​​the ceramic heating plate.

[0013] Furthermore, a high thermal conductivity metal is fixedly installed in the medium passage, and the high thermal conductivity metal includes an alloy of one or more of copper, silver, aluminum, tungsten and nickel.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] The present invention realizes rapid dispersion of the heat of the heating resistor to the ceramic plate body through the cooperation of the heating medium and the heating resistor, thereby achieving uniform heating effect. At the same time, the addition of the heating medium can prevent the ceramic plate body from wrapping the heating resistor and compressing the heating resistor under the action of thermal expansion and contraction, thereby preventing the thermal conductive resistor from becoming thinner due to pressure. At the same time, the design of the expansion groove can further prevent the heating medium from expanding due to heat, thereby preventing the problem of excessive pressure in the device. The thermal conductivity effect of the device is also improved by the setting of the medium passage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A top view including a partial cross section of Embodiment 1 of the present invention;

[0017] Figure 2 A three-dimensional diagram including a partial cross section of Embodiment 2 of the present invention;

[0018] Figure 3 This is a front view cross-sectional view of embodiment 3 of the present invention.

[0019] Reference numerals

[0020] 1. Lower fixing plate; 21. Ceramic plate body; 22. Heating circuit; 3. Quick interface device; 23. Heating resistor; 24. Medium passage; 25. Expansion groove. DETAILED DESCRIPTION

[0021] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0022] Example 1

[0023] See also Figure 1As shown, a heating ceramic plate for semiconductor testing includes a lower fixed plate 1 and a ceramic heating plate, the lower fixed plate 1 is fixedly mounted with a ceramic heating plate, the ceramic heating plate includes a ceramic plate body 21, a plurality of interconnected heating circuits 22 are provided in the ceramic plate body 21, a quick interface device 3 is fixedly mounted on one side of the ceramic plate body 21, both ends of the heating circuit 22 extend to the quick interface device 3 respectively, a heating resistor 23 is provided in the heating circuit 22, a gap between the heating resistor 23 and the heating circuit 22 is filled with a heating medium, and both ends of the heating resistor 23 are fixedly connected to the quick interface device 3 respectively.

[0024] The present invention enlarges the diameter of the heating loop 22 so that when the heating loop 22 expands due to heat, the inner diameter of the heating loop 22 will not shrink and squeeze the heating resistor 23, thereby ensuring the service life of the heating resistor. At the same time, the heating medium is used to fill the gap in the heating loop 22 in the ceramic plate body 21. Because the heating medium will not be deformed by the expansion of the heating loop 22 and affect its service life, filling the gap with the heating medium can not only reduce the impact of the gap on heat conduction, but also prevent the thermal expansion of the ceramic plate body 21 from deforming the heating resistor 23.

[0025] A plurality of support members for supporting the heating resistor 23 are fixedly disposed on the inner wall of the lower end surface of the heating loop 22 , and the heating resistor 23 is in a suspended state in the heating loop 22 .

[0026] The heating medium includes one of conventional heat-conducting liquid, liquid metal heat-conducting material, super heat-conducting liquid and heat-conducting glue.

[0027] The conventional heat-conducting liquid includes a mixture of one or more of silicone oil, diethylene glycol, water and BP high-quality heat-conducting liquid.

[0028] The liquid metal thermal conductive material includes one of gallium-based alloy, mercury, lead and bismuth.

[0029] The lower fixing plate 1 is made of a heat-insulating material, and the surface area of ​​the lower fixing plate 1 used for connecting the ceramic heating plate is larger than the surface area of ​​the ceramic heating plate.

[0030] A plurality of support members for supporting the heating resistor 23 are fixedly disposed on the inner wall of the lower end surface of the heating loop 22 , and the heating resistor 23 is in a suspended state in the heating loop 22 .

[0031] Example 2

[0032] See also Figure 2As shown, the technical scheme of this embodiment is roughly the same as that of Embodiment 1, and the distinguishing feature is that a plurality of medium passages 24 for circulating the heating medium are fixedly opened between the heating circuits 22, and the medium passages 24 extend into the ceramic plate body 21 between the heating circuits 22, and the other end of the medium passages 24 is closed and not connected to other medium passages 24 or heating circuits 22.

[0033] A high thermal conductivity metal is fixedly installed in the medium passage 24, and the high thermal conductivity metal includes an alloy of one or more of copper, silver, aluminum, tungsten and nickel.

[0034] The medium passage 24 can make the heat conduction more uniform, and can reduce the uneven heating of the ceramic plate body 21 and the influence on the heating effect.

[0035] A high thermal conductivity metal is arranged in the medium passage 24, and the heat conduction effect can be further improved through the rapid heat conduction effect of the high thermal conductivity metal.

[0036] Example 3

[0037] See also Figure 3 As shown, the technical solutions of this embodiment are substantially the same as those of Embodiment 2, with the difference being that an expansion groove 25 extending into the ceramic plate body 21 is fixedly provided on the upper end surface of the heating circuit 22, and the maximum height of the heating medium is lower than 1 / 3 of the height of the expansion groove 25 when the ceramic plate body 21 is placed horizontally.

[0038] The expansion coefficient of the heating medium is relatively high. In order to prevent excessive pressure inside the ceramic plate body 21, an expansion groove 25 is provided to reserve a decompression space, thereby increasing the service life of the device.

[0039] Furthermore, during the preparation process of the device, it is always in a vacuum environment, and the function of the expansion groove 25 can be further enhanced through processing in a vacuum environment.

[0040] It should be noted that the diameter of the heating loop 22 in Examples 1-3 is determined according to the diameter of the heating resistor 23 , the thermal expansion coefficients of the ceramic plates made of different materials, and the thermal expansion coefficients of the heating resistor 23 .

[0041] The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment. Any equivalent modifications or changes made by ordinary technicians in this field based on the contents disclosed by the present invention should be included in the protection scope recorded in the claims.

Claims

1. A heating ceramic plate for semiconductor testing, comprising a lower fixing plate (1) and a ceramic heating plate, wherein the ceramic heating plate is fixedly mounted on the lower fixing plate (1), characterized in that: The ceramic heating plate comprises a ceramic plate body (21), a plurality of interconnected heating circuits (22) are provided in the ceramic plate body (21), a quick interface device (3) is fixedly mounted on one side of the ceramic plate body (21), two ends of the heating circuit (22) respectively extend to the quick interface device (3), a heating resistor (23) is provided in the heating circuit (22), a gap between the heating resistor (23) and the heating circuit (22) is filled with a heating medium, and two ends of the heating resistor (23) are respectively fixedly connected to the quick interface device (3).

2. The heating ceramic plate for semiconductor testing according to claim 1, characterized in that: A plurality of medium passages (24) for circulating heating medium are fixedly provided between the heating circuits (22); the medium passages (24) extend into the ceramic plate body (21) between the heating circuits (22); and the other end of the medium passages (24) is closed and not connected to other medium passages (24) or the heating circuits (22).

3. The heating ceramic plate for semiconductor testing according to claim 1, characterized in that: An expansion groove (25) extending into the ceramic plate body (21) is fixedly provided on the upper end surface of the heating circuit (22), and the maximum height of the heating medium is lower than 1 / 3 of the height of the expansion groove (25) when the ceramic plate body (21) is placed horizontally.

4. The semiconductor testing heating ceramic plate according to claim 1, characterized in that: A plurality of support members for supporting the heating resistor (23) are fixedly arranged on the inner wall of the lower end surface of the heating circuit (22), and the heating resistor (23) is in a suspended state in the heating circuit (22).

5. The semiconductor testing heating ceramic plate according to claim 1, characterized in that: The heating medium includes one of conventional heat-conducting liquid, liquid metal heat-conducting material, super heat-conducting liquid and heat-conducting glue.

6. The heating ceramic plate for semiconductor testing according to claim 5, characterized in that: The conventional heat-conducting liquid includes a mixture of one or more of silicone oil, diethylene glycol, water and BP high-quality heat-conducting liquid.

7. The heating ceramic plate for semiconductor testing according to claim 5, characterized in that: The liquid metal thermal conductive material includes one of gallium-based alloy, mercury, lead and bismuth.

8. The heating ceramic plate for semiconductor testing according to claim 1, characterized in that: The lower fixing plate (1) is made of a heat-insulating material, and the surface area of ​​the lower fixing plate (1) used for connecting to the ceramic heating plate is larger than the surface area of ​​the ceramic heating plate.

9. The heating ceramic plate for semiconductor testing according to claim 2, characterized in that: A high thermal conductivity metal is fixedly installed in the medium passage (24), and the high thermal conductivity metal includes an alloy of one or more of copper, silver, aluminum, tungsten and nickel.

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