Film forming method, device, electronic equipment and storage medium for flexible circuit board

Abstract

The application discloses a film covering method and device of a flexible circuit board, electronic equipment and a storage medium, relates to the technical field of battery energy sources, and first controls a welding module to weld a nickel sheet to a flexible circuit board; controls a film pasting module to paste a protective film to an end surface of the flexible circuit board; controls a conveying module to convey a first auxiliary material, a backing plate, the flexible circuit board, oil absorption paper and a second auxiliary material to a lower mold plate in sequence to form a composite, and the flexible circuit board is pressed and heated through an upper mold plate and the lower mold plate, so that the flux in the end surface of the flexible circuit board melts and overflows to flow to the oil absorption paper; the oil absorption paper absorbs the flux, and meanwhile, the connection between the protective film and the end surface of the flexible circuit board can be reinforced. The film covering of the flexible circuit board is automatically completed, the flux is absorbed through the oil absorption paper in the pressing process, ultrasonic cleaning and manual wiping are not needed, and the production efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of battery energy, in particular to a film coating method and device of a flexible circuit board, an electronic device and a storage medium. BACKGROUND

[0002] In the battery energy industry, the flexible circuit board in the power battery module is generally electrically connected to other components through a nickel sheet. For example, the flexible circuit board on the battery cell is electrically connected to the busbar through a nickel sheet. Therefore, the nickel sheet needs to be welded to the flexible circuit board first, and then a protective film is coated on the surface of the flexible circuit board to protect the copper foil circuit of the flexible circuit board from being oxidized and damaged, and to avoid the adverse effects of the external environment (such as moisture, dust, mechanical damage, etc.) on the copper foil circuit. In the related art, since the flexible circuit board and the nickel sheet need to use a flux when welding, the flux will contaminate the flexible circuit board and the nickel sheet. To remove the contamination, the flexible circuit board needs to be ultrasonically cleaned before coating the film, and then the flexible circuit board needs to be manually wiped to remove the flux before coating the film, which is very low in production efficiency. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a film coating method and device of a flexible circuit board, an electronic device and a storage medium, which realizes automatic film coating without ultrasonic cleaning and manual wiping, and improves production efficiency.

[0004] The film coating method of the flexible circuit board according to the first aspect of the present application is applied to a film coating device, and the film coating device includes a welding module, a film attaching module, a pressing module, a conveying module, a separating module and a curing module; the pressing module includes an upper die plate, a lower die plate, an upper die driving assembly, an upper die heating assembly and a lower die heating assembly;

[0005] The method includes:

[0006] controlling the welding module to weld a nickel sheet to a flexible circuit board;

[0007] controlling the film attaching module to attach a protective film to an end surface of the flexible circuit board;

[0008] controlling the conveying module to place a first auxiliary material on an end surface of the lower die plate, controlling the conveying module to place a backing plate on an end surface of the first auxiliary material, controlling the conveying module to place an oil absorption paper on an end surface of the backing plate, controlling the conveying module to place the flexible circuit board on an end surface of the oil absorption paper, and one side of the flexible circuit board provided with the protective film faces away from the oil absorption paper, and controlling the conveying module to place a second auxiliary material on an end surface of the flexible circuit board to obtain a composite body;

[0009] controlling the upper mold heating assembly to heat the upper mold plate so that the temperature of the upper mold plate reaches a first preset temperature, and controlling the lower mold heating assembly to heat the lower mold plate so that the temperature of the lower mold plate reaches the first preset temperature;

[0010] controlling the upper mold driving assembly to drive the upper mold plate to press the composite;

[0011] controlling the separation module to separate the flexible circuit board from the composite;

[0012] controlling the curing module to heat and cure the flexible circuit board.

[0013] According to some embodiments of the first aspect of the application, the controlling the separation module to separate the flexible circuit board from the composite comprises:

[0014] controlling the upper mold driving assembly to drive the upper mold plate to descend so that the upper mold plate contacts the second auxiliary material in the composite and the upper mold plate continuously applies a first preset pressure to the second auxiliary material within a first preset time length;

[0015] controlling the upper mold driving assembly to drive the upper mold plate to continuously apply a second preset pressure to the second auxiliary material within a second preset time length after the first preset time length, wherein the second preset time length is greater than the first preset time length, and the second preset pressure is greater than the first preset pressure.

[0016] According to some embodiments of the first aspect of the application, the welding module comprises a welding platform, a welding assembly, a flux nozzle, a pressing assembly, a first driving assembly, and a first clamping assembly.

[0017] The controlling the welding module to weld the nickel sheet to the flexible circuit board comprises:

[0018] controlling the first driving assembly to drive the first clamping assembly to carry the flexible circuit board to the pad platform;

[0019] controlling the first driving assembly to drive the first clamping assembly to carry the nickel sheet to the end surface of the flexible circuit board;

[0020] controlling the pressing assembly to press the nickel sheet against the flexible circuit board;

[0021] controlling the flux nozzle to spray flux at the connection between the flexible circuit board and the nickel sheet, and controlling the welding assembly to weld the nickel sheet to the flexible circuit board.

[0022] According to some embodiments of the first aspect of the present application, the film pasting module comprises a film pasting platform, a film unwinding assembly, a cutting assembly, a second driving assembly, a second clamping assembly, a third driving assembly, a suction assembly, a suction driving assembly, and a third clamping assembly;

[0023] The control of the film pasting module to paste the protective film to the end surface of the flexible circuit board comprises:

[0024] The control of the second driving assembly to drive the second clamping assembly to clamp the flexible circuit board from the welding platform and to carry the flexible circuit board to the film pasting platform, and to make the side of the flexible circuit board provided with the circuit face upward;

[0025] The control of the film unwinding assembly to release the protective film, when the protective film is released to a preset length, the control of the film unwinding assembly to stop releasing, and the control of the suction driving assembly to drive the suction assembly to approach and suck one side of the protective film;

[0026] The control of the cutting assembly to cut the protective film to make the protective film separate from the film unwinding assembly;

[0027] The control of the third driving assembly to drive the third clamping assembly to clamp the release paper away from the side of the protective film of the suction assembly, and the control of the third driving assembly to drive the third clamping assembly to move away from the protective film to make the release paper separate from the protective film;

[0028] The control of the suction driving assembly to drive the suction assembly to paste the side of the protective film not provided with the release paper to the end surface of the flexible circuit board.

[0029] According to some embodiments of the first aspect of the present application, the separation module comprises a material taking robot, a pressing assembly, a separation platform, a fourth clamping assembly, a fourth driving assembly, a fifth clamping assembly, and a fifth driving assembly;

[0030] The control of the separation module to separate the flexible circuit board from the composite body comprises:

[0031] The control of the material taking robot to carry the composite body from the lower mold plate to the separation platform;

[0032] The control of the pressing assembly to extend into the second auxiliary material and the backing plate in the composite body, and the control of the pressing assembly to contact the backing plate to press the backing plate to the separation platform;

[0033] The control of the fourth driving assembly to drive the fourth clamping assembly to extend into the second auxiliary material and the backing plate in the composite body, and the control of the fourth clamping assembly to clamp both sides of the flexible circuit board;

[0034] controlling the fifth driving assembly to drive the fifth clamping assembly to clamp the second auxiliary material, and controlling the fifth driving assembly to drive the fifth clamping assembly to move the second auxiliary material away from the flexible circuit board;

[0035] controlling the fourth driving assembly to drive the fourth clamping assembly to move the flexible circuit board away from the pad plate.

[0036] According to some embodiments of the first aspect of the present application, the control of the separation module to separate the flexible circuit board from the composite includes:

[0037] detecting the temperature of the composite by a temperature sensor;

[0038] in the case that the temperature of the composite is greater than a second preset temperature, controlling the separation module to separate the flexible circuit board from the composite;

[0039] in the case that the temperature of the composite is less than the second preset temperature, controlling the upper die heating assembly to heat the upper die plate, and controlling the lower die heating assembly to heat the lower die plate, so that the temperature of the composite is greater than the second preset temperature.

[0040] According to some embodiments of the first aspect of the present application, the curing module includes a heating box;

[0041] the control of the curing module to heat and cure the flexible circuit board includes:

[0042] controlling the fourth driving assembly to drive the fourth clamping assembly to transport the flexible circuit board to the heating box;

[0043] controlling the heating box to heat the flexible circuit board, the heating temperature being 150 degrees Celsius, and the heating duration being 60 minutes.

[0044] The second aspect of the present application provides a laminating device for a flexible circuit board, which is applied to a laminating apparatus, the laminating apparatus including a welding module, a laminating module, a pressing module, a transporting module, a separating module and a curing module; the pressing module including an upper die plate, a lower die plate, an upper die driving assembly, an upper die heating assembly and a lower die heating assembly;

[0045] The device includes:

[0046] a welding unit configured to control the welding module to weld a nickel sheet to a flexible circuit board;

[0047] a laminating unit configured to control the laminating module to laminate a protective film to an end surface of the flexible circuit board;

[0048] The carrying unit is configured to control the carrying module to place the first auxiliary material on the end surface of the lower mold plate, control the carrying module to place the backing plate on the end surface of the first auxiliary material, control the carrying module to place the oil absorption paper on the end surface of the backing plate, control the carrying module to place the flexible circuit board on the end surface of the oil absorption paper, and one side of the flexible circuit board provided with the protective film faces away from the oil absorption paper, control the carrying module to place the second auxiliary material on the end surface of the flexible circuit board, and obtain a composite body.

[0049] The heating unit is configured to control the upper mold heating assembly to heat the upper mold plate to reach a first preset temperature, and control the lower mold heating assembly to heat the lower mold plate to reach the first preset temperature.

[0050] The pressing unit is configured to control the upper mold driving assembly to drive the upper mold plate to perform a pressing process on the composite body.

[0051] The separating unit is configured to control the separating module to separate the flexible circuit board from the composite body.

[0052] The curing unit is configured to control the curing module to perform a heating curing process on the flexible circuit board.

[0053] The third aspect of the present application provides an electronic device, the electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the film coating method of the flexible circuit board in any one of the first aspect embodiments when executing the computer program.

[0054] The fourth aspect of the present application provides a computer readable storage medium, the storage medium stores a computer program, and the computer program is executed by a processor to implement the film coating method of the flexible circuit board in any one of the first aspect embodiments.

[0055] The film covering method, device, electronic equipment and storage medium of the flexible circuit board of the embodiment of the present application first control the welding module to weld the nickel sheet to the flexible circuit board, and the flux is used in the welding process; the film pasting module is controlled to paste the protective film to the end surface of the flexible circuit board; after pasting, the first auxiliary material, the backing plate, the flexible circuit board, the oil absorption paper and the second auxiliary material are sequentially transported to the lower mold plate by controlling the conveying module to form a composite body, and then the upper mold heating assembly and the lower mold heating assembly are controlled to heat, so that the temperature of the upper mold plate and the lower mold plate reaches the first preset temperature, and the upper mold driving assembly is controlled to drive the upper mold plate to press the composite body, in the pressing process, the flexible circuit board is pressed and heated by the upper mold plate and the lower mold plate, so that the flux in the end surface of the flexible circuit board melts and flows to the oil absorption paper, the oil absorption paper absorbs the flux, and at the same time, the connection between the protective film and the end surface of the flexible circuit board is reinforced, the backing plate is used to support the flexible circuit board, so that the connection between the flexible circuit board and the nickel sheet remains flat during the pressing process; after the pressing process, the separation module is controlled to separate the flexible circuit board from the composite body; the curing module is controlled to heat and cure the flexible circuit board, so that the protective film is fixed to the end surface of the flexible circuit board. In this way, the film covering of the flexible circuit board is automatically completed, and the flux is absorbed by the oil absorption paper during the pressing process, which can avoid the pollution of the nickel sheet or the flexible circuit board by the flux, and does not need to be cleaned by ultrasonic wave and manually wiped, so that the production efficiency can be improved.

[0056] Additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0057] The present application will be further described below in combination with the drawings and examples, wherein:

[0058] Figure 1 The step flow diagram of the film covering method of the flexible circuit board of the embodiment of the present application;

[0059] Figure 2 The schematic structure diagram of the pressing module of the embodiment of the present application;

[0060] Figure 3 The schematic structure diagram of the welding module of the embodiment of the present application;

[0061] Figure 4 The schematic structure diagram of the film pasting module of the embodiment of the present application;

[0062] Figure 5 The schematic structure diagram of the separation module of the embodiment of the present application;

[0063] Figure 6 The structure diagram of the film covering device of the flexible circuit board of the embodiment of the present application;

[0064] Figure 7 Structure schematic diagram of electronic equipment for an embodiment of the present application.

[0065] Reference signs:

[0066] Upper die fixing plate 210; upper die plate 220; upper die heating assembly 230; lower die fixing plate 240; lower die plate 250; lower die heating assembly 260; heat insulation layer 270; upper die driving assembly 280; first driving assembly 310; first clamping assembly 320; welding platform 330; pressing assembly 340; pressing driving assembly 350; flux nozzle 360; welding assembly 370; film pasting platform 410; second clamping assembly 420; second driving assembly 430; third clamping assembly 440; third driving assembly 450; suction assembly 460; suction driving assembly 470; unwinding assembly 480; cutting assembly 490; separation platform 510; fifth clamping assembly 520; fifth driving assembly 530; abutting assembly 540; fourth clamping assembly 550; fourth driving assembly 560. DETAILED DESCRIPTION

[0067] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary, only for explaining the present application, and cannot be understood as a limitation of the present application.

[0068] In the description of the present application, it is understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, only for the purpose of describing the present application and simplifying the description, and therefore cannot be understood as a limitation of the present application.

[0069] In the description of the present application, if the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than, etc. is understood as not including the number, above, below, etc. is understood as including the number. If it is described that the first, second is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features.

[0070] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be understood in a broad sense, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0071] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0072] The first aspect embodiment of the present application provides a laminating method of a flexible circuit board. The method is applied to a laminating device, which comprises a welding module, a laminating module, a pressing module, a conveying module, a separating module and a curing module. The pressing module comprises an upper die plate 220, a lower die plate 250, an upper die driving assembly 280, an upper die heating assembly 230 and a lower die heating assembly 260. For reference Figure 1 , Figure 1 The laminating method of the flexible circuit board can include, but is not limited to, steps S110 to S170.

[0073] Step S110, control the welding module to weld the nickel sheet to the flexible circuit board;

[0074] In an embodiment, the flexible circuit board is a flexible circuit board in the field of battery energy technology, for example, it can be a flexible circuit board on a battery cell, which is provided with a circuit for monitoring the running state of the battery cell. The flexible circuit board needs to be electrically connected to the busbar through the nickel sheet, and the busbar is a key component, which mainly functions to connect multiple battery cells in parallel to realize the collection and transmission of electric energy.

[0075] It should be noted that when welding the nickel sheet to the flexible circuit board, in order to ensure the welding quality, flux needs to be injected into the connection between the nickel sheet and the flexible circuit board. Therefore, after welding is completed, the end face of the flexible circuit board and the nickel sheet will have residual flux.

[0076] Step S120, control the laminating module to laminate the protective film to the end face of the flexible circuit board;

[0077] In an embodiment, the protective film is a PI film. By laminating the PI film to the end face of the flexible circuit board, the copper foil circuit of the end face of the flexible circuit board can be protected, avoiding the adverse effects of external environment (such as humidity, dust, mechanical damage, etc.) on the copper foil circuit. Moreover, the shape of the PI film matches the shape of the flexible circuit board and the nickel sheet, and the protective film is provided with a window, which is used for electrical connection between the nickel sheet and other circuits.

[0078] Step S130, the control carrying module is placed in the end surface of the first auxiliary material, the control carrying module is placed in the end surface of the first auxiliary material, the control carrying module is placed in the end surface of the pad, the control carrying module is placed in the end surface of the pad, the control carrying module is placed in the end surface of the flexible circuit board, and the flexible circuit board is provided with a protective film. One side of the flexible circuit board faces away from the oil absorbing paper, and the control carrying module is placed in the end surface of the second auxiliary material, and the composite body is obtained;

[0079] In an embodiment, referring to Figure 2 , Figure 2 is a schematic diagram of the pressing module of the embodiment of the application. The control carrying module further comprises an upper mold fixed plate 210, a lower mold fixed plate 240, the upper mold fixed plate 210 is connected with an upper mold driving assembly 280, an upper mold plate 220 is installed on the upper mold fixed plate 210, and a heat insulation layer 270 is arranged between the upper mold fixed plate 210 and the upper mold plate 220; the lower mold plate 250 is installed on the lower mold fixed plate 240, and a heat insulation layer 270 is arranged between the lower mold fixed plate 240 and the lower mold plate 250. An upper mold heating assembly 230 is installed inside the upper mold plate 220, and a lower mold heating assembly 260 is installed inside the lower mold plate 250. The upper mold plate 220 and the lower mold plate 250 are both iron plates, and the upper mold heating assembly 230 and the lower mold heating assembly 260 are both heating rods. The heating rods are heated when powered on.

[0080] In an embodiment, one side of the upper mold plate 220 opposite to the lower mold plate 250 is provided with a silicon aluminum foil, and one side of the lower mold plate 250 opposite to the upper mold plate 220 is provided with a silicon aluminum foil. The silicon aluminum foil is used for heat transfer.

[0081] In an embodiment, the first auxiliary material is a thin fiber cloth, and the second auxiliary material is a TPX adhesive film. In the subsequent pressing process, the TPX adhesive film is used to protect the glue in the film and the soldering flux from overflowing and polluting the upper mold plate 220. The thin fiber cloth has good thermoplasticity and is used for heat transfer.

[0082] In an embodiment, the pad is FR4, and in the subsequent pressing process, the pad is used to support the flexible circuit board, so that the connection between the flexible circuit board and the nickel sheet remains flat during the pressing process.

[0083] Step S140, control the upper mold heating assembly to heat the upper mold plate, so that the temperature of the upper mold plate reaches a first preset temperature, and control the lower mold heating assembly to heat the lower mold plate, so that the temperature of the lower mold plate reaches the first preset temperature;

[0084] In an embodiment, the first preset temperature is 180 degrees Celsius. Those skilled in the art can set the first preset temperature based on the actual situation.

[0085] Step S150, control the upper mold driving assembly to drive the upper mold plate to press the composite body;

[0086] Step S160, control the separation module to separate the flexible circuit board from the composite;

[0087] Step S170, control the curing module to heat and cure the flexible circuit board.

[0088] The film covering method of the flexible circuit board of the embodiment of the present application, through the above steps S110 to S170, first controls the welding module to weld the nickel sheet to the flexible circuit board, and uses the flux during the welding process; controls the film pasting module to paste the protective film to the end face of the flexible circuit board; after pasting, controls the carrying module to carry the first auxiliary material, the backing plate, the flexible circuit board, the oil absorption paper and the second auxiliary material to the lower mold plate 250 in sequence to form a composite, and then controls the upper mold heating assembly 230 and the lower mold heating assembly 260 to heat, so that the temperature of the upper mold plate 220 and the lower mold plate 250 reaches the first preset temperature, and then controls the upper mold driving assembly 280 to drive the upper mold plate 220 to press the composite, during the pressing process, the upper mold plate 220 and the lower mold plate 250 press and heat the flexible circuit board, so that the flux in the end face of the flexible circuit board melts and flows out to the oil absorption paper, the oil absorption paper absorbs the flux, and at the same time can reinforce the connection between the protective film and the end face of the flexible circuit board, so that the protective film is tightly pasted to the end face of the flexible circuit board; the backing plate is used to support the flexible circuit board, so that the connection between the flexible circuit board and the nickel sheet remains flat during the pressing process; after the pressing process, the separation module separates the flexible circuit board from the composite; the curing module heats and cures the flexible circuit board to fix the protective film to the end face of the flexible circuit board. In this way, the film covering of the flexible circuit board is automatically completed, and the flux is absorbed by the oil absorption paper during the pressing process, which can avoid the pollution of the nickel sheet or the flexible circuit board by the flux, and does not need to be cleaned by ultrasonic wave and manually wiped, which can improve the production efficiency.

[0089] In an embodiment, step S150 can include but is not limited to step S151 and step S152.

[0090] Step S151, control the upper mold driving assembly to drive the upper mold plate to descend, so that the upper mold plate contacts the second auxiliary material in the composite, and the upper mold plate continuously applies the first preset pressure to the second auxiliary material within the first preset time length;

[0091] It is worth noting that the process of step S151 is only a pre-pressing process, and within the first preset time length, since the temperature of the upper mold plate 220 and the lower mold plate is the first preset temperature, the flexible circuit board is heated, so that the flux on the flexible circuit board and the nickel sheet melts and is extruded, and the flux flows from the end face of the flexible circuit board to the oil absorption paper, and the oil absorption paper absorbs the flux.

[0092] In an embodiment, the first preset time length is 10 seconds, and the first preset pressure is 49 N. Those skilled in the art can set the first preset time length and the first preset pressure according to actual conditions.

[0093] In step S152, after the first preset time length, the upper die driving assembly is controlled to drive the upper die plate to continuously apply the second preset pressure to the second auxiliary material within a second preset time length; the second preset time length is greater than the first preset time length, and the second preset pressure is greater than the first preset pressure.

[0094] It is worth noting that during step S152, the upper die plate 220 continuously applies the second preset pressure to the second auxiliary material within the second preset time length, so that the protective film can be tightly attached to the end face of the flexible circuit board.

[0095] In an embodiment, the second preset time length is 200 seconds, and the second preset pressure is 98 N. Those skilled in the art can set the first preset time length and the first preset pressure according to actual conditions.

[0096] Through steps S151 to S152, the flux is first melted, and the flux is squeezed out from between the end face of the flexible circuit board and the protective film, and then the flux is absorbed by the oil absorption paper, and then the protective film is tightly attached to the end face of the flexible circuit board, so that the flux is removed, without the need for ultrasonic cleaning and manual wiping, and the production efficiency can be improved.

[0097] In an embodiment, with reference to Figure 3 , Figure 3 is a schematic diagram of a brief structure of a welding module of an embodiment of the present application. The welding module includes a welding platform 330, a welding assembly 370, a flux nozzle 360, a pressing assembly 340, a first driving assembly 310, and a first clamping assembly 320; the first driving assembly 310 is a mechanical arm capable of moving in multiple directions, and capable of driving the first clamping assembly 320 to move in multiple directions; the first clamping assembly 320 is provided with two clamping arms and a pneumatic cylinder, and the pneumatic cylinder is used to drive the two clamping arms to move close to or away from each other. The welding module further includes a pressing driving assembly 350, and the structure of the pressing driving assembly 350 is the same as that of the first driving assembly 310. The welding assembly 370 can be a laser welding device, or other welding devices in the prior art.

[0098] Step S110 can include but is not limited to the following steps:

[0099] In step S111, the first driving assembly is controlled to drive the first clamping assembly to carry the flexible circuit board to the pad platform.

[0100] In step S112, the first driving assembly is controlled to drive the first clamping assembly to carry the nickel sheet to the end face of the flexible circuit board.

[0101] In an embodiment, the film coating device further comprises a first storage tray (not shown in the figure) and a second storage tray (not shown in the figure), the first storage tray and the second storage tray are arranged on one side of the welding platform 330; the first storage tray is used for storing the flexible circuit board, and the second storage tray is used for storing the nickel sheet. The first driving assembly 310 first drives the first clamping assembly 320 to clamp the flexible circuit board from the first storage tray, and drives the first clamping assembly 320 to carry the flexible circuit board from the first storage tray to the welding platform; then controls the first driving assembly 310 to drive the first clamping assembly 320 to clamp the nickel sheet from the second storage tray, and carries the nickel sheet to the end face of the flexible circuit board, and the nickel sheet is in contact with the welding pad on the end face of the flexible circuit board, facilitating subsequent welding.

[0102] Step S113, control the pressing assembly to press the nickel sheet against the flexible circuit board;

[0103] In an embodiment, the pressing assembly 340 comprises a pressing part and a pressing driving part, the pressing driving part is a mechanical arm capable of moving in multiple directions, and the pressing driving part can drive the pressing part to move in multiple directions. The pressing driving part drives the pressing part to abut against the nickel sheet, so as to press the nickel sheet against the flexible circuit board, avoiding shaking between the nickel sheet and the flexible circuit board in the subsequent welding process.

[0104] Step S114, control the flux nozzle to spray flux at the connection between the flexible circuit board and the nickel sheet, and control the welding assembly to weld the nickel sheet and the flexible circuit board.

[0105] In an embodiment, the flux nozzle 360 is connected with a nozzle driving part, the nozzle driving part is a mechanical arm capable of moving in multiple directions, and the nozzle driving part is used to drive the flux nozzle 360 to approach the nickel sheet and the flexible circuit board. Then the flux nozzle 360 sprays flux at the connection between the flexible circuit board and the nickel sheet, and controls the welding assembly 370 to weld the nickel sheet and the flexible circuit board, so as to improve the welding quality through the flux.

[0106] In an embodiment, referring to Figure 4 , Figure 4 A schematic structure diagram of a film pasting module of an embodiment of the present application is shown. The film pasting module comprises a film pasting platform 410, a unwinding assembly 480, a cutting assembly 490, a second driving assembly 430, a second clamping assembly 420, a third driving assembly 450, a suction assembly 460, a suction driving assembly 470 and a third clamping assembly 440; it is worth noting that the suction driving assembly 470, the second driving assembly 430 and the third driving assembly 450 are all mechanical arms capable of moving in multiple directions. The second clamping assembly 420 comprises two clamping arms and a cylinder used to drive the two clamping arms to approach or move away from each other. The third clamping assembly 440 has the same structure as the second clamping assembly 420.

[0107] Step S120 can include but is not limited to the following steps:

[0108] Step S121, control the second drive assembly to drive the second clamping assembly to clamp the flexible circuit board from the welding platform, and carry the flexible circuit board to the film pasting platform, and make the flexible circuit board provided with the circuit side up;

[0109] Step S122, control the unwinding assembly to release the protective film, when the protective film is released to the preset length, control the unwinding assembly to stop releasing, and control the suction drive assembly to drive the suction assembly to approach and suck one side of the protective film;

[0110] It is worth noting that the suction assembly 460 includes a plurality of suction nozzles, which can fix the protective film relative to the suction nozzles.

[0111] In an embodiment, the film pasting module is provided with a color sensor (not shown in the figure), when the color sensor senses the preset color, it indicates that the protective film is released to the preset length, at this time, control the unwinding assembly 480 to stop releasing, and control the suction drive assembly 470 to drive the suction assembly 460 to approach and suck one side of the protective film.

[0112] Step S123, control the cutting assembly to cut the protective film, so that the protective film is separated from the unwinding assembly;

[0113] Step S124, control the third drive assembly to drive the third clamping assembly to clamp the release paper on the side of the protective film away from the suction assembly, and control the third drive assembly to drive the third clamping assembly away from the protective film, so that the release paper is separated from the protective film;

[0114] In an embodiment, the body of the protective film is polyimide (PI) material, and the two sides of the PI material are respectively provided with release paper, one side of the release paper is provided with a convex part, and the convex part is located on one side of the protective film body, control the third drive assembly 450 to drive the third clamping assembly 440 to clamp the convex part of the release paper, and then control the third drive assembly 450 to drive the third clamping assembly 440 away from the body of the protective film, so as to tear off the release paper on one side of the protective film.

[0115] Step S125, control the suction drive assembly to drive the suction assembly to paste one side of the protective film without release paper to the end surface of the flexible circuit board.

[0116] It is worth noting that the suction drive assembly 470 is first controlled to drive the suction assembly 460 to drive the protective film, so that the protective film is located directly above the flexible circuit board, and the protective film is parallel to the flexible circuit board, and the side of the protective film with the release paper is opposite to the flexible circuit board, and then the suction drive assembly 470 is controlled to drive the suction assembly 460 to lower the protective film, so that one side of the protective film without release paper is pasted to the end surface of the flexible circuit board.

[0117] In this embodiment of the application, through steps S121 to S125, the protective film is first cut from the unwinding assembly 480, then the release paper on one side of the protective film is detached from the protective film, and the side of the protective film without the release paper is attached to the end face of the flexible circuit board, thereby realizing automated film application and improving production efficiency.

[0118] In one embodiment, reference is made to Figure 5 , Figure 5 This is a simplified structural diagram of the separation module according to an embodiment of this application. The separation module includes a material-grabbing robotic arm (not shown in the figure), a clamping assembly 540, a separation platform 510, a fourth clamping assembly 550, a fourth drive assembly 560, a fifth clamping assembly 520, and a fifth drive assembly 530; the fourth drive assembly 560 and the fifth drive assembly 530 are both robotic arms capable of moving in multiple directions. The fourth clamping assembly 550 includes two long clamping arms and a cylinder for driving the two long clamping arms to move closer or further apart. The fifth clamping assembly 520 has the same structure as the third clamping assembly 440.

[0119] Step S160 may include the following steps:

[0120] Step S161: Control the robotic arm to transport the composite from the lower template to the separation platform;

[0121] Step S162: Control the clamping component to extend between the second auxiliary material and the pad in the composite, and control the clamping component 540 to contact the pad, pressing the pad against the separation platform;

[0122] Step S163: Control the fourth driving component to drive the fourth clamping component to extend into the composite between the second auxiliary material and the pad, and control the fourth clamping component to clamp both sides of the flexible circuit board.

[0123] It is worth noting that the dimensions of the second auxiliary material, the first auxiliary material, and the pad are all larger than the dimensions of the flexible circuit board. Therefore, the fourth driving component 560 can be controlled to drive the fourth clamping component 550 to extend between the second auxiliary material and the pad, thereby controlling the fourth clamping component 550 to clamp both sides of the circuit board.

[0124] Step S164: Control the fifth driving component to drive the fifth clamping component to clamp the second auxiliary material, and control the fifth driving component to drive the fifth clamping component to move the second auxiliary material away from the flexible circuit board.

[0125] Step S165: Control the fourth drive component to drive the fourth clamping component to move the flexible circuit board away from the pad.

[0126] The embodiment of the present application separates the flexible circuit board from the composite through steps S161 to S165, so as to facilitate subsequent heating and curing of the flexible circuit board.

[0127] In an embodiment, step S160 further includes the following steps:

[0128] Step S166: detecting the temperature of the composite through a temperature sensor;

[0129] Step S167: in the case where the temperature of the composite is greater than the second preset temperature, controlling the separation module to separate the flexible circuit board from the composite;

[0130] Step S168: in the case where the temperature of the composite is less than the second preset temperature, controlling the upper mold heating assembly 230 to heat the upper mold plate, and controlling the lower mold heating assembly to heat the lower mold plate, so that the temperature of the composite is greater than the second preset temperature.

[0131] It can be understood that if the separation is performed when the temperature of the composite is less than the second preset temperature, the protective film may be damaged. Therefore, through steps S166 to S168, the flexible circuit board is separated from the composite only when the temperature of the composite reaches the second preset temperature. If the temperature of the composite is less than the second preset temperature, the upper mold heating assembly 230 is controlled to heat the upper mold plate 220, and the lower mold heating assembly 260 is controlled to heat the lower mold plate 250, so that the temperature of the composite is greater than the second preset temperature.

[0132] In an embodiment, the temperature sensor is an infrared temperature sensor.

[0133] In an embodiment, the curing module includes a heating box (not shown in the figure);

[0134] Step S170 includes the following steps:

[0135] Step S171: controlling the fourth driving assembly 560 to drive the fourth clamping assembly 550 to carry the flexible circuit board to the heating box;

[0136] Step S172: controlling the heating box to heat the flexible circuit board, and the heating temperature is 150 degrees Celsius, and the heating duration is 60 minutes.

[0137] Specifically, the protective film is a PI film, and the PI film has good heat curing performance. Through steps S171 to S172, the flexible circuit board and the protective film are heated, so as to enhance the strength and stability of the protective film.

[0138] The second aspect embodiment of the present application provides a film coating device for flexible circuit boards, which is applied to the film coating equipment described above; for details, please refer toFigure 6 , Figure 6 FIG. 1 is a structural schematic diagram of a film laminating device for a flexible circuit board according to an embodiment of the present application.

[0139] The device comprises:

[0140] a welding unit 610 configured to control a welding module to weld the nickel sheet to the flexible circuit board;

[0141] a laminating unit 620 configured to control a film laminating module to laminate the protective film to the end surface of the flexible circuit board;

[0142] a conveying unit 630 configured to control a conveying module to place the first auxiliary material on the end surface of the lower mold plate 250, to place the cushion plate on the end surface of the first auxiliary material, to place the oil absorption paper on the end surface of the cushion plate, to place the flexible circuit board on the end surface of the oil absorption paper, with the side of the flexible circuit board provided with the protective film facing away from the oil absorption paper, and to place the second auxiliary material on the end surface of the flexible circuit board, to obtain a composite;

[0143] a heating unit 640 configured to control the upper mold heating assembly 230 to heat the upper mold plate 220 to a first preset temperature, and to control the lower mold heating assembly 260 to heat the lower mold plate 250 to the first preset temperature;

[0144] a pressing unit 650 configured to control the upper mold driving assembly 280 to drive the upper mold plate 220 to perform a pressing process on the composite;

[0145] a separating unit 660 configured to control a separating module to separate the flexible circuit board from the composite;

[0146] a curing unit 670 configured to control a curing module to perform a heating curing process on the flexible circuit board.

[0147] The film coating device of the flexible circuit board of the embodiment of the present application is used to execute the film coating method of the flexible circuit board of the first aspect of the present application. When the film coating method is executed, the nickel sheet is first welded to the flexible circuit board by controlling the welding module, and the flux is used in the welding process; the protective film is attached to the end surface of the flexible circuit board by controlling the film attaching module; after the attachment, the first auxiliary material, the backing plate, the flexible circuit board, the oil absorption paper, and the second auxiliary material are sequentially transported to the lower mold plate 250 by controlling the conveying module to form a composite body, and then the upper mold heating assembly 230 and the lower mold heating assembly 260 are controlled to heat, so that the temperature of the upper mold plate 220 and the lower mold plate 250 reaches the first preset temperature, and then the upper mold driving assembly 280 is controlled to drive the upper mold plate 220 to perform the pressing process on the composite body. In the pressing process, the flexible circuit board is pressed and heated by the upper mold plate 220 and the lower mold plate 250, so that the flux in the end surface of the flexible circuit board melts and flows to the oil absorption paper, the oil absorption paper absorbs the flux, and at the same time, the connection between the protective film and the end surface of the flexible circuit board is reinforced. The backing plate is used to support the flexible circuit board, so that the connection between the flexible circuit board and the nickel sheet remains flat during the pressing process; after the pressing process, the flexible circuit board is separated from the composite body by controlling the separating module; and the flexible circuit board is heated and solidified by controlling the solidifying module, so that the protective film is fixed to the end surface of the flexible circuit board. In this way, the film coating of the flexible circuit board is automatically completed, and the flux is absorbed by the oil absorption paper during the pressing process, which can avoid the pollution of the nickel sheet or the flexible circuit board by the flux, and does not need to be cleaned by ultrasonic wave and manually wiped, thereby improving the production efficiency.

[0148] It should be noted that the specific embodiments of the film coating device of the flexible circuit board are basically the same as the above-mentioned specific embodiments of the film coating method of the flexible circuit board, and will not be repeated here. The film coating device of the flexible circuit board can also be provided with other functional units to realize the film coating method of the flexible circuit board in the above-mentioned embodiments under the premise of meeting the requirements of the embodiments of the present application.

[0149] The third aspect of the present application provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to realize the film coating method of the flexible circuit board of any one of the first aspect of the present application. The electronic device can be any intelligent terminal including a tablet computer, a vehicle-mounted computer, etc.

[0150] Reference Figure 7 , Figure 7 is a structural schematic diagram of an electronic device of an embodiment. The electronic device includes:

[0151] The processor 701 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an ASIC (Application Specific Integrated Circuit), or one or more integrated circuits, and is configured to execute related programs to implement the technical solutions provided by the embodiments of the present application.

[0152] The memory 702 can be implemented by a ROM (ReadOnly Memory), a static storage device, a dynamic storage device, or a RAM (Random Access Memory), and the like. The memory 702 can store an operating system and other application programs. When the technical solutions provided by the embodiments of the present application are implemented by software or firmware, the related program codes are stored in the memory 702 and are called and executed by the processor 701 to implement the flexible circuit board film coating method of the embodiments of the present application.

[0153] The input / output interface 703 is configured to implement information input and output.

[0154] The communication interface 704 is configured to implement the communication interaction between the device and other devices. The communication can be implemented by a wired manner (for example, a USB, a network cable, and the like) or a wireless manner (for example, a mobile network, WIFI, Bluetooth, and the like).

[0155] The bus 705 is configured to transmit information between various components (for example, the processor 701, the memory 702, the input / output interface 703, and the communication interface 704) of the device.

[0156] The processor 701, the memory 702, the input / output interface 703, and the communication interface 704 are connected to each other through the bus 705 to realize the communication connection between the devices.

[0157] The fourth aspect of the present application is a computer readable storage medium, which stores a computer program. When the computer program is executed by a processor, the flexible circuit board film coating method of any one of the first aspect embodiments is implemented.

[0158] The memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory can include a high-speed random access memory, and can also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state memory device. In some embodiments, the memory can optionally include a memory disposed remotely with respect to the processor, and these remote memories can be connected to the processor through a network. Examples of the above network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0159] The embodiments described in the embodiments of the present application are used to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art can know that, with the evolution of technology and the appearance of new application scenarios, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0160] Those skilled in the art can understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and can include more or fewer steps than shown in the figures, or combine certain steps, or different steps.

[0161] The device embodiments described above are only schematic, and the units described as separate components can or can not be physically separate, that is, can be located in one place, or can be distributed on multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiments of the present application.

[0162] Those skilled in the art can understand that all or some of the steps in the above disclosed method, the functional modules / units in the system and the device can be implemented as software, firmware, hardware and their appropriate combinations.

[0163] The terms "first", "second", "third", "fourth" and the like used in the specification of the present application and the above-described drawings (if any) are used to distinguish similar objects, and do not necessarily have to describe a particular order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0164] It should be understood that in the application, "at least one" refers to one or more, and "multiple" refers to two or more. "And / or" is used to describe the mapping relationship of the mapping object, which means that there can be three relationships, for example, "A and / or B" can represent three cases: only A, only B, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the front and rear mapping objects. "At least one of the following" or similar expressions means any combination of these items, including any combination of single or multiple items. For example, at least one of a, b or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0165] In several embodiments provided in the application, it should be understood that the disclosed system and method can be implemented in other ways. For example, the system embodiments described above are only illustrative, for example, the division of the above units is only a logical functional division, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed units can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0166] The units described above as separate components can or can not be physically separated, and the components displayed as units can or can not be physical units, that is, they can be located in one place, or they can be distributed on multiple network units. According to actual needs, part or all of the units can be selected to achieve the purpose of the embodiment scheme.

[0167] In addition, the functional units in each embodiment of the application can be integrated in one processing unit, or each unit can be physically present alone, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0168] The integrated unit, if implemented in the form of a software function unit and sold or used as an independent product, can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application, essentially or in other words, the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes multiple instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods of the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various program storage media.

[0169] The preferred embodiments of the embodiments of the present application are described above with reference to the accompanying drawings, and are not limited to the scope of the embodiments of the present application. Any modifications, equivalent replacements and improvements made by those skilled in the art without departing from the scope and essence of the embodiments of the present application shall be within the scope of the embodiments of the present application.

Claims

1. A film coating method for a flexible circuit board, characterized by, The application is applied to a film covering device, which comprises a welding module, a film pasting module, a pressing module, a carrying module, a separating module and a curing module; the pressing module comprises an upper die plate, a lower die plate, an upper die driving assembly, an upper die heating assembly and a lower die heating assembly; The method comprises: controlling the welding module to weld a nickel sheet to a flexible circuit board, wherein the connection between the nickel sheet and the flexible circuit board is sprayed with a soldering flux; controlling the film pasting module to paste a protective film to the end surface of the flexible circuit board; controlling the carrying module to place a first auxiliary material on the end surface of the lower die plate, controlling the carrying module to place a cushion plate on the end surface of the first auxiliary material, controlling the carrying module to place oil absorption paper on the end surface of the cushion plate, controlling the carrying module to place the flexible circuit board on the end surface of the oil absorption paper, and the side of the flexible circuit board provided with the protective film faces away from the oil absorption paper, and controlling the carrying module to place a second auxiliary material on the end surface of the flexible circuit board to obtain a composite body; controlling the upper die heating assembly to heat the upper die plate so that the temperature of the upper die plate reaches a first preset temperature, and controlling the lower die heating assembly to heat the lower die plate so that the temperature of the lower die plate reaches the first preset temperature; controlling the upper die driving assembly to drive the upper die plate to perform a pressing process on the composite body, wherein the soldering flux is absorbed by the oil absorption paper during the pressing process; controlling the separating module to separate the flexible circuit board from the composite body; controlling the curing module to heat and cure the flexible circuit board.

2. The method of claim 1, wherein The control of the separating module to separate the flexible circuit board from the composite body comprises: controlling the upper die driving assembly to drive the upper die plate to descend so that the upper die plate is in contact with the second auxiliary material in the composite body, and the upper die plate continuously applies a first preset pressure to the second auxiliary material within a first preset time length; after the first preset time length, controlling the upper die driving assembly to drive the upper die plate to continuously apply a second preset pressure to the second auxiliary material within a second preset time length; wherein the second preset time length is greater than the first preset time length, and the second preset pressure is greater than the first preset pressure.

3. The method of claim 1, wherein The welding module comprises a welding platform, a welding assembly, a soldering flux nozzle, a pressing assembly, a first driving assembly and a first clamping assembly; The control of the welding module to weld a nickel sheet to a flexible circuit board comprises: controlling the first driving assembly to drive the first clamping assembly to carry the flexible circuit board to the welding platform; controlling the first driving assembly to drive the first clamping assembly to carry the nickel sheet to the end surface of the flexible circuit board; controlling the pressing assembly to press the nickel sheet against the flexible circuit board; controlling the soldering flux nozzle to spray soldering flux at the connection between the flexible circuit board and the nickel sheet, and controlling the welding assembly to weld the nickel sheet and the flexible circuit board.

4. The method of claim 3, wherein The film pasting module comprises a film pasting platform, a unwinding assembly, a cutting assembly, a second driving assembly, a second clamping assembly, a third driving assembly, a suction assembly, a suction driving assembly and a third clamping assembly; The control of the film pasting module pastes the protective film to the end surface of the flexible circuit board, and the control includes: controlling the second driving assembly to drive the second clamping assembly to clamp the flexible circuit board from the welding platform and transport the flexible circuit board to the film pasting platform, and make the side of the flexible circuit board provided with the circuit face upward; controlling the unwinding assembly to release the protective film, when the protective film is released to a preset length, controlling the unwinding assembly to stop releasing, and controlling the suction driving assembly to drive the suction assembly to approach and suck one side of the protective film; controlling the cutting assembly to cut the protective film, so that the protective film is separated from the unwinding assembly; controlling the third driving assembly to drive the third clamping assembly to clamp the release paper away from the side of the protective film, and controlling the third driving assembly to drive the third clamping assembly away from the protective film, so that the release paper is separated from the protective film; controlling the suction driving assembly to drive the suction assembly to paste the side of the protective film without the release paper to the end surface of the flexible circuit board.

5. The method of claim 1, wherein The separation module includes a material taking mechanical arm, a pressing assembly, a separation platform, a fourth clamping assembly, a fourth driving assembly, a fifth clamping assembly and a fifth driving assembly; The control of the separation module separates the flexible circuit board from the composite body, and the control includes: controlling the material taking mechanical arm to transport the composite body from the lower mold plate to the separation platform; controlling the pressing assembly to extend into the composite body between the second auxiliary material and the backing plate, and controlling the pressing assembly to contact the backing plate to press the backing plate against the separation platform; controlling the fourth driving assembly to drive the fourth clamping assembly to extend into the composite body between the second auxiliary material and the backing plate, and controlling the fourth clamping assembly to clamp both sides of the flexible circuit board; controlling the fifth driving assembly to drive the fifth clamping assembly to clamp the second auxiliary material, and controlling the fifth driving assembly to drive the fifth clamping assembly to drive the second auxiliary material away from the flexible circuit board; controlling the fourth driving assembly to drive the fourth clamping assembly to drive the flexible circuit board away from the backing plate.

6. The method of claim 1, wherein The control of the separation module separates the flexible circuit board from the composite body, and the control includes: detecting the temperature of the composite body by a temperature sensor; in the case that the temperature of the composite body is greater than a second preset temperature, controlling the separation module to separate the flexible circuit board from the composite body; in the case that the temperature of the composite body is less than the second preset temperature, controlling the upper mold heating assembly to heat the upper mold plate, and controlling the lower mold heating assembly to heat the lower mold plate, so that the temperature of the composite body is greater than the second preset temperature.

7. The method of claim 5, wherein the flexible circuit board is a flexible printed circuit board. The curing module includes a heating box; The control of the curing module to heat and cure the flexible circuit board includes: controlling the fourth driving assembly to drive the fourth clamping assembly to transport the flexible circuit board to the heating box; The heating box controls heating of the flexible circuit board, and the heating temperature is 150 DEG C and the heating time is 60 minutes.

8. A film laminating apparatus for a flexible circuit board, characterized by comprising: The film coating device comprises a welding module, a film pasting module, a pressing module, a conveying module, a separating module and a curing module. The device comprises: The welding unit controls the welding module to weld the nickel sheet to the flexible circuit board, wherein the connection between the nickel sheet and the flexible circuit board is sprayed with a flux; The pasting unit controls the film pasting module to paste the protective film to the end surface of the flexible circuit board; The conveying unit controls the conveying module to place the first auxiliary material on the end surface of the lower die plate, controls the conveying module to place the pad plate on the end surface of the first auxiliary material, controls the conveying module to place the oil absorption paper on the end surface of the pad plate, controls the conveying module to place the flexible circuit board on the end surface of the oil absorption paper, and the side of the flexible circuit board provided with the protective film faces away from the oil absorption paper, controls the conveying module to place the second auxiliary material on the end surface of the flexible circuit board, and obtains a composite body; The heating unit controls the upper die heating assembly to heat the upper die plate, so that the temperature of the upper die plate reaches a first preset temperature, and controls the lower die heating assembly to heat the lower die plate, so that the temperature of the lower die plate reaches the first preset temperature; The pressing unit controls the upper die driving assembly to drive the upper die plate to perform pressing treatment on the composite body, wherein the flux is absorbed by the oil absorption paper during the pressing treatment; The separating unit controls the separating module to separate the flexible circuit board from the composite body; The curing unit controls the curing module to heat and cure the flexible circuit board.

9. An electronic device, comprising: The electronic device comprises a memory and a processor, the memory stores a computer program, and the processor implements the film coating method of the flexible circuit board in any one of claims 1 to 7 when executing the computer program.

10. A computer readable storage medium, the storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the film coating method of the flexible circuit board in any one of claims 1 to 7.

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