Method for preparing charging pile circuit board and charging pile circuit board

Abstract

The present invention provides a preparation method of a charging pile circuit board and a charging pile circuit board. The method comprises: obtaining a copper block to be embedded required for the charging pile circuit board; embedding the copper block to be embedded into a core board to obtain a core board with a copper block; pressing the copper foil, a curing sheet and the core board with the copper block to obtain a pressed board; performing circuit production on the pressed board to obtain a first charging pile circuit board; obtaining thermal parameters of the first charging pile circuit board under a thermal simulation model; inputting the thermal parameters into a preset heat dissipation evaluation model to evaluate the heat dissipation effect of the circuit board to obtain an evaluation result; determining the production parameters of a target charging pile circuit board based on the evaluation result; obtaining a target charging pile circuit board based on the production parameters of the target charging pile circuit board and the target copper block to be embedded, the target core board, the target copper foil and the target curing sheet. The present invention is conducive to improving the heat dissipation performance of the charging pile circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and also to a method for preparing a charging pile circuit board and the charging pile circuit board. Background Art

[0002] In recent years, new energy electric vehicles have become the primary choice for vehicle purchases, thanks to their environmental, energy-saving, and efficient advantages. Charging stations are crucial logistical components for the convenient and smooth operation of new energy vehicles. The main control board (MCU) is the core component of these stations. As the electronic carrier of this core component, the circuit board (PCB) requires high insulation, high current resistance, heat dissipation, and high wear resistance. Therefore, PCBs for charging stations typically use embedded or extra-thick copper blocks for heat dissipation to meet these performance requirements. However, this results in a complex and lengthy manufacturing process, resulting in unstable heat dissipation performance. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a preparation method of a charging pile circuit board and a charging pile circuit board, so as to improve the heat dissipation performance and production efficiency of the charging pile circuit board.

[0004] In order to solve the above technical problems, the technical solutions of the present invention are as follows:

[0005] A first aspect of the present invention provides a method for preparing a charging pile circuit board, comprising:

[0006] Obtain the copper blocks to be embedded in the charging pile circuit board;

[0007] Embedding the copper block to be embedded into the core board to obtain a core board with the copper block;

[0008] Pressing the copper foil, the cured sheet and the core board with the copper block to obtain a pressed board;

[0009] Performing circuit fabrication on the pressed plate to obtain a first charging pile circuit board;

[0010] Obtaining thermal parameters of the first charging pile circuit board under a thermal simulation model;

[0011] Inputting the thermal parameters into a preset heat dissipation evaluation model to evaluate the heat dissipation effect of the circuit board to obtain an evaluation result;

[0012] Determining manufacturing parameters of the target charging pile circuit board based on the evaluation results;

[0013] The target charging pile circuit board is obtained according to the manufacturing parameters of the target charging pile circuit board and the target copper block to be embedded, the target core board, the target copper foil and the target cured sheet.

[0014] Optionally, embedding the copper block to be embedded into the core board to obtain the core board with the copper block includes:

[0015] Embedding the copper block to be embedded into the core board according to preset embedding parameters to obtain a core board with the copper block;

[0016] The copper foil, the cured sheet and the core board with the copper block are pressed together to obtain a pressed board, comprising:

[0017] The copper foil, the cured sheet and the core board with the copper block are pressed together according to a preset lamination sequence to obtain a pressed board.

[0018] Optionally, obtaining thermal parameters of the first charging pile circuit board under a thermal simulation model includes:

[0019] Obtaining preset simulation parameters of the first charging pile circuit board under a thermal simulation model;

[0020] Perform heat dissipation simulation processing on the first charging pile circuit board according to the preset simulation parameters to obtain heat parameters.

[0021] Optionally, the preset simulation parameters include:

[0022] Temperature parameter; the temperature parameter is 20 to 30°C;

[0023] Convection heat transfer coefficient; the convection heat transfer coefficient is 5 to 10 ;

[0024] Radiation heat transfer parameters; the radiation heat transfer parameters are We can get, where Q is the radiation heat transfer parameter, is the emissivity of the first charging pile circuit board, is a constant, A is the surface area of ​​the first charging pile circuit board, is the total energy density radiated to the environment by the first charging pile circuit board, is the total energy density radiated from the environment to the first charging pile circuit board;

[0025] Thermal conductivity of copper block;

[0026] Specifications of copper blocks;

[0027] Position parameters of the copper block;

[0028] Thermal conductivity of the first charging pile circuit board;

[0029] Power input power; the power input power is obtained by P=VI, where P is the power input power, V is the voltage, and I is the current.

[0030] Optionally, the heat parameters are input into a preset heat dissipation evaluation model to evaluate the heat dissipation effect of the circuit board to obtain an evaluation result, including:

[0031] Inputting the thermal parameter into a first sub-model of a preset heat dissipation evaluation model to obtain thermal resistance;

[0032] Inputting the heat parameter into a second sub-model of a preset heat dissipation evaluation model to obtain heat dissipation efficiency;

[0033] Inputting the thermal resistance and the heat dissipation efficiency into a third sub-model of a preset heat dissipation evaluation model to obtain a heat dissipation performance index;

[0034] An evaluation result is obtained according to the heat dissipation performance index and a preset evaluation level.

[0035] Optionally, determining the manufacturing parameters of the target charging pile circuit board based on the evaluation result includes:

[0036] Obtain preset parameter adjustment standards;

[0037] Determine the manufacturing parameters of the target charging pile circuit board based on the evaluation results and the preset parameter adjustment standards.

[0038] Optionally, determining the manufacturing parameters of the target charging pile circuit board according to the evaluation result and the preset parameter adjustment standard includes:

[0039] When the evaluation result is lower than the preset expected level, adjusting the first production parameter according to the preset parameter adjustment standard to obtain the second production parameter;

[0040] Based on the second production parameters, the manufacturing parameters of the target charging pile circuit board are determined.

[0041] Optionally, the method further includes:

[0042] Testing the target charging pile circuit board to obtain a target test result;

[0043] The target charging pile circuit board is screened according to the test results and preset qualification conditions to obtain a qualified charging pile circuit board.

[0044] Optionally, testing the target charging pile circuit board to obtain a target test result includes:

[0045] Performing a thermal shock test on the target charging pile circuit board to obtain a first test result;

[0046] Performing a high temperature placement test on the target charging pile circuit board to obtain a second test result;

[0047] Performing a moisture placement test on the target charging pile circuit board to obtain a third test result;

[0048] Performing a thermal shock test on the target charging pile circuit board to obtain a fourth test result;

[0049] Performing a heat dissipation performance test on the target charging pile circuit board to obtain a fifth test result;

[0050] A target test result is obtained according to the first test result, the second test result, the third test result, the fourth test result and the fifth test result.

[0051] A second aspect of the present invention provides a charging pile circuit board, which is prepared using the method for preparing the charging pile circuit board as described in the first aspect.

[0052] The above solution of the present invention includes at least the following beneficial effects:

[0053] The above-mentioned scheme of the present invention embeds the copper blocks to be embedded required for the charging pile circuit board into the core board to obtain a core board with copper blocks, and then presses the copper foil, the cured sheet and the core board with the copper blocks to obtain a pressed board, and then performs circuit production on the pressed board to obtain a first charging pile circuit board as a sample for heat dissipation simulation processing and circuit board heat dissipation effect evaluation, and determines the production parameters of the target charging pile circuit board according to the evaluation results, and finally produces the target charging pile circuit board according to the production parameters of the target charging pile circuit board and the target copper blocks to be embedded, the target core board, the target copper foil and the target cured sheet, which is not only beneficial to improving the heat dissipation performance of the charging pile circuit board, but also can improve the production efficiency and qualified rate of the charging pile circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a flow chart of a method for preparing a charging pile circuit board in an embodiment of the present invention. DETAILED DESCRIPTION

[0055] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0056] like Figure 1 As shown, an embodiment of the present invention provides a method for preparing a charging pile circuit board, comprising the following steps:

[0057] Step 101: Obtain the copper blocks to be embedded in the charging pile circuit board;

[0058] Step 102: embedding the copper block to be embedded into the core board to obtain a core board with the copper block;

[0059] Step 103, pressing the copper foil, the cured sheet and the core board with the copper block to obtain a pressed board;

[0060] Step 104: fabricating a circuit on the pressed plate to obtain a first charging pile circuit board;

[0061] Step 105: Obtain thermal parameters of the first charging pile circuit board under a thermal simulation model;

[0062] Step 106: Input the thermal parameters into a preset heat dissipation evaluation model to evaluate the heat dissipation effect of the circuit board to obtain an evaluation result;

[0063] Step 107: Determine manufacturing parameters of the target charging pile circuit board based on the evaluation results;

[0064] Step 108 , obtaining the target charging pile circuit board according to the manufacturing parameters of the target charging pile circuit board and the target copper block to be embedded, the target core board, the target copper foil and the target cured sheet.

[0065] The preparation method of the charging pile circuit board proposed in an embodiment of the present invention embeds the copper blocks to be embedded required for the charging pile circuit board into a core board to obtain a core board with copper blocks, and then presses the copper foil, the curing sheet and the core board with the copper blocks to obtain a pressed board, and then performs circuit production on the pressed board to obtain a first charging pile circuit board as a sample for heat dissipation simulation and circuit board heat dissipation effect evaluation, and determines the production parameters of the target charging pile circuit board based on the evaluation results, and finally produces the target charging pile circuit board based on the production parameters of the target charging pile circuit board and the target copper blocks to be embedded, the target core board, the target copper foil and the target curing sheet, which is not only beneficial to improving the heat dissipation performance of the charging pile circuit board, but also can improve the production efficiency and pass rate of the charging pile circuit board.

[0066] In an optional embodiment of the present invention, step 101 includes:

[0067] Step 1011: Obtain the copper blocks to be embedded in the charging pile circuit board;

[0068] Specifically, the copper block has a thickness of at least 2.0 mm.

[0069] Step 1012: Obtain the core board required for the charging pile circuit board;

[0070] Specifically, there can be multiple core plates, and the thickness of the core plates is 2.0 mm or 3.5 mm, and the material is a glass fiber reinforced epoxy resin matrix or a ceramic matrix.

[0071] Step 1013: Obtain the copper foil required for the charging pile circuit board;

[0072] Specifically, the number of copper foils may be multiple, and the weight of the copper foil may be 9.0 OZ (ounces).

[0073] Step 1014: Obtain the cured sheet required for the charging pile circuit board;

[0074] Specifically, the number of the curing sheets can be multiple, and the curing sheet is 7628PP (a semi-cured sheet, the ingredients of which include epoxy resin, curing agent and glass fiber cloth, and the specifications include a weight of 208±5 grams per square meter).

[0075] Step 1015: Obtain first production parameters.

[0076] Specifically, the first production parameters include copper block production parameters and circuit board production parameters, wherein the copper block production parameters may include the length, width, position, shape, etc. of the copper block, and the circuit board production parameters may include the copper block embedding position, line width, line spacing, number of layers, surface treatment method (such as tin spraying, gold plating, organic solderability film or copper protectant, etc.). It should be noted that the first production parameters may also include various parameters or data required to prepare the first charging pile circuit board, such as preset embedding parameters and preset stacking sequence. The purpose of obtaining the first production parameters is to facilitate the subsequent production of the first charging pile circuit board as a sample according to the parameters for heat dissipation performance evaluation, so as to improve the production parameters and improve the heat dissipation performance of the charging pile circuit board finally prepared.

[0077] In actual application, specific first production parameters can be set according to the actual application scenario, and copper blocks, core boards, copper foils, cured sheets, etc. of suitable materials or specifications can be obtained, so as to facilitate the subsequent preparation of the first charging pile circuit board according to the first production parameters and related materials.

[0078] In an optional embodiment of the present invention, step 102 includes:

[0079] The copper block to be embedded is embedded into the core board according to preset embedding parameters to obtain a core board with the copper block.

[0080] Specifically, the embedding process may include: cutting the copper block to be embedded to obtain a cut copper block, wherein the length, width and shape of the cut copper block are consistent with the length, width and shape of the copper block in the first production parameters; pre-treating the cut copper block (such as micro-etching and browning) to obtain a pre-treated copper block, the purpose of the pre-treatment is to improve the corrosion resistance and oxidation resistance of the copper block, remove scratches and stains on the surface of the copper block, improve the flatness of the surface of the copper block, and increase the firmness of the connection between the copper block and the core board; milling a copper buried groove in the copper buried area of ​​the core board to obtain a core board with a groove, where the length, width, depth, shape and height of the copper buried groove need to be adapted to the length, width, thickness and shape of the pre-treated copper block to ensure that the copper block can be tightly embedded therein; browning the core board to improve the bonding force between the core board and the copper block; placing the pre-treated copper block in the core board with a groove to obtain a core board with a copper block. Here, the preset embedding parameters may include:

[0081] The micro-etching processing parameters for the copper block include: the micro-etching liquid composition is pure water or distilled water, dilute ammonia water and hydrogen peroxide, wherein the volume ratio of ammonia water is generally 3% to 10% (about 300cc), and the amount of hydrogen peroxide added is 2 to 3 drops; the micro-etching processing time is 1 to 3 seconds.

[0082] Browning treatment parameters for the copper block include: the browning liquid contains sulfuric acid, hydrogen peroxide and a specific browning agent (such as a mixture of sulfuric acid and nitric acid); the temperature of the browning tank is 35±2°C; the mass fraction of sulfuric acid is 4% to 6%, the mass fraction of hydrogen peroxide is 4% to 6%; and the treatment rate (micro-etching rate) is 50 to 80 micro-inches / second (u″ / s).

[0083] In an optional embodiment of the present invention, step 103 includes:

[0084] The copper foil, the cured sheet and the core board with the copper block are pressed together according to a preset lamination sequence to obtain a pressed board.

[0085] Specifically, a specific preset lamination sequence (which must comply with the number of layers in the first production parameter) can be: copper foil, two cured sheets, a core board with a copper block, two cured sheets, and copper foil; the core board with a copper block, copper foil, and cured sheets are stacked together according to this preset lamination sequence and then riveted together. Thereafter, a pressing process is performed according to the pressing parameters of a pressing temperature of 100 to 175°C, a pressure of 400 to 750 PSI (pounds per square inch), and a heating time of 30 minutes to 2 hours, a holding time of 20 minutes to 1 hour, and a cooling time of 1 hour to 4 hours to produce a pressed board. In actual production, the preset lamination sequence and pressing parameters can be adjusted according to actual conditions. The above is only a specific description of one embodiment.

[0086] Before lamination, the copper foil can be treated as follows:

[0087] The top and bottom layers of the copper foil are both 9.0OZ. Using a CNC drill press and a 2.0mm drill bit, positioning holes are drilled at the preset positions of the copper foil to obtain copper foil with positioning holes, which are used for subsequent stacking alignment and fixation to ensure that the layers will not be misaligned during the lamination process; according to the preset pattern, pattern transfer negatives are made for the top and bottom layers. The negatives are used to block the parts that do not need to be etched during the exposure process to ensure the accuracy and clarity of the pattern transfer negatives and avoid unnecessary defects during the etching process; the prepared pattern transfer negatives are attached to the copper foil with positioning holes and exposed using an exposure device. After exposure, the parts not blocked by the negatives will be exposed to ultraviolet light. The exposed copper foil is placed in an acidic etching solution for etching. The etching solution will selectively remove the parts of the copper foil not exposed to ultraviolet light to form the desired pattern circuit; after the acid etching is completed, the positive side of the top layer and the negative side of the bottom layer are back-etched. Back etching is a process that removes excess metal layers on the surface of the copper foil by chemical or physical methods, which can improve the accuracy and flatness of the circuit and obtain a copper foil with pattern circuits.

[0088] Here, a specific embodiment of obtaining a pressed board by pressing includes:

[0089] Use cutting equipment to cut the copper block to be embedded to obtain the cut copper block, and the cut copper block meets the length, width, thickness (such as 2.0mm) and shape of the copper block in the first production parameters; use a CNC drilling machine and a 2.0mm drill bit to drill a positioning hole at the preset drilling position of the copper block; brown the copper block with the positioning hole drilled to form a dense oxide film on the copper surface to enhance the bonding force between the copper and the core board; clean the copper block after browning to remove debris, oil and other impurities to ensure that the surface of the copper block is clean and free of defects; use cutting equipment to cut the FR-4 board into the required size (meeting the length, width, thickness and shape of the core board in the first production parameters) to obtain the core board, wherein the thickness of the core board is 2.0mm. FR-4 is a glass fiber reinforced epoxy resin laminate with good electrical properties and mechanical properties. Strength; Use a CNC drilling machine to drill 3.2mm diameter positioning holes at the first preset position of the core. These positioning holes are used for subsequent stacking alignment and fixation to ensure that the layers will not be misaligned during the pressing process; Use a gong machine or milling machine to gong out the required slots at the second preset position of the core board (in line with the copper block embedding position in the first production parameter). The slots are used to embed copper blocks to improve the heat dissipation performance of the circuit board; Use an ultrasonic cleaner or other cleaning equipment to remove debris and stains generated during the drilling and gonging process to ensure that the surface of the board is clean and free of oil, dust and other impurities. After cleaning, use compressed air or a dust-free cloth to further clean the surface; Stack the core board, prepreg and copper block in the preset stacking order to ensure that the layers are accurately aligned and the positioning holes and slots correspond correctly; Place the stacked boards into a pressing machine for heating and pressurization to obtain a pressed board.

[0090] In specific implementation, the thickness of the core board can also be 3.5 mm, using 3 curing sheets, which can be set according to user needs.

[0091] In an optional embodiment of the present invention, step 104 includes:

[0092] The circuit of the pressed plate is fabricated according to the first production parameters to obtain a first charging pile circuit board.

[0093] Specifically, a circuit pattern is produced on the laminate according to the line width and spacing in the first production parameter, and a layer of photosensitive film is affixed to the copper foil surface of the laminate so that the expected circuit pattern can be formed through subsequent exposure and development steps. A conductive circuit pattern is made through exposure and development, and a copper layer is added to the conductive circuit pattern to increase the thickness of the copper layer. The copper layer in the non-retained area of ​​the semi-finished board after the additional plating is etched away using alkaline solution to retain the conductive circuit pattern that meets the expected requirements, thereby obtaining the first charging pile circuit board.

[0094] After the lamination process, the edges of the laminate are trimmed to remove burrs, glue overflow and other uneven parts. An ultrasonic cleaner or other cleaning equipment is used to thoroughly remove oil, dust and other impurities on the surface of the laminate to ensure a clean surface and provide a good working environment for subsequent circuit production. A positive or negative film with a circuit pattern is attached to the laminate and exposed. A developer is then used to remove the portion of the pattern transfer material that is not exposed to ultraviolet light. An etching process is then performed to remove the remaining pattern transfer material. The surface of the laminate is cleaned to remove residues generated during etching and film stripping. Solder mask ink is applied to the surface of the circuit to protect the circuit from environmental corrosion and mechanical damage to obtain the first charging pile circuit board.

[0095] It should be noted that the above step numbers are only for exemplary purposes. In the actual production process, the above steps can be adjusted, such as first making circuits on the core board, then embedding copper blocks and pressing them together, or first making circuits on the inner layer of the core board and the copper foil, then embedding copper blocks and pressing them together.

[0096] In an optional embodiment of the present invention, step 105 includes:

[0097] Step 1051: Obtain preset simulation parameters of the first charging pile circuit board under a thermal simulation model;

[0098] Specifically, the preset simulation parameters may include set boundary conditions and related parameters, which may be determined based on the actual working environment of the charging pile circuit board and the specifications of the charging pile.

[0099] Step 1052: Perform heat dissipation simulation processing on the first charging pile circuit board according to the preset simulation parameters to obtain heat parameters.

[0100] Specifically, circuit simulation software or thermal simulation software can be used to model and simulate the first charging pile circuit board. Preset simulation parameters can be input, and thermal parameters can be output through simulation. Thermal parameters can include temperature difference (the difference between the heat source temperature and the ambient temperature), heat dissipation power, heat dissipated by the heat dissipation system, and heat generated by the first charging pile circuit board.

[0101] In an optional embodiment of the present invention, the preset simulation parameters in step 1051 include:

[0102] Temperature parameter; the temperature parameter is 20 to 30°C; specifically, the temperature parameter can be determined according to the working environment of the charging pile. If the charging pile is installed indoors, the ambient temperature can be set between 20°C and 30°C; if the charging pile is installed outdoors, the appropriate temperature range can be set according to the actual geographical location and historical temperature.

[0103] Convection heat transfer coefficient; the convection heat transfer coefficient is 5 to 10 ; Here, the convective heat transfer coefficient can be calculated by h=f(flow rate, fluid properties, object shape, etc.), where h is the convective heat transfer coefficient, which reflects the heat transfer capacity between the fluid and the solid surface. The fluid properties (such as air or water or oil or other coolants) include the density, viscosity, specific heat capacity and thermal conductivity of the fluid, etc. The object shape refers to the shape of the charging pile circuit board, including its length, width, thickness, and surface geometric features (such as fins, grooves, etc.).

[0104] Radiation heat transfer parameters; the radiation heat transfer parameters are We can get, where Q is the radiation heat transfer parameter, is the emissivity of the first charging pile circuit board, is a constant, A is the surface area of ​​the first charging pile circuit board, T is the absolute temperature of the surface of the first charging pile circuit board, It is the fourth power of T, representing the total energy density radiated by the first charging pile circuit board to the environment. is the absolute temperature of the environment The fourth power represents the total energy density radiated from the environment to the first charging pile circuit board;

[0105] Thermal conductivity of copper block; generally between 380 and 400 W / (m·K);

[0106] Specifications of the copper block, such as length, width, thickness, and shape;

[0107] Copper block location parameters; the location of the copper block in the circuit board, such as near the heat source or the area where heat is concentrated.

[0108] The thermal conductivity of the first charging pile circuit board is generally between 0.1 and 2 W / (m·K);

[0109] Power input power: This is calculated as P = V1, where P is the power input, V is the voltage, and I is the current. The power input power depends on the charging station specifications and load requirements. For example, a charging station may have multiple charging modules, each with a different input power.

[0110] Specifically, the preset simulation parameters mentioned above can be selected according to specific needs, so as to simulate the first charging pile circuit board according to the preset simulation parameters to obtain thermal parameters. The thermal parameters may include the temperature difference between the first charging pile circuit board and the ambient temperature when the charging pile system is working normally, the heat dissipation power, the heat dissipated by the heat dissipation system, and the heat generated by the first charging pile circuit board. The heat dissipated by the heat dissipation system is usually equal to the heat dissipation power, but if there are multiple heat dissipation paths on the first charging pile circuit board (such as natural heat dissipation, fan heat dissipation, liquid cooling, etc.), it is necessary to calculate the heat dissipated by each heat dissipation path separately and sum them up to obtain the total heat dissipation; the heat generated by the first charging pile circuit board is the total heat generated by the first charging pile circuit board, which can be obtained by multiplying the heat generation rate of the first charging pile circuit board by the simulation time, wherein the heat generation rate of the entire first charging pile circuit board can be obtained by the power consumption of each component on the first charging pile circuit board and the corresponding heat generation rate.

[0111] In an optional embodiment of the present invention, step 106 includes:

[0112] Step 1061 , inputting the thermal parameters into a first sub-model of a preset heat dissipation evaluation model to obtain thermal resistance;

[0113] Specifically, the first sub-model includes , where R is the thermal resistance, is the temperature difference (the difference between the heat source temperature and the ambient temperature), and P is the heat dissipation power.

[0114] Step 1062: input the heat parameters into a second sub-model of a preset heat dissipation evaluation model to obtain heat dissipation efficiency;

[0115] Specifically, the second sub-model includes , where n is the heat dissipation efficiency, To dissipate the heat of the cooling system, This is the heat generated by the first charging pile circuit board.

[0116] Step 1063 , inputting the thermal resistance and the heat dissipation efficiency into a third sub-model of a preset heat dissipation evaluation model to obtain a heat dissipation performance index;

[0117] Specifically, the third sub-model includes , where S is the heat dissipation performance index, R is the thermal resistance, and n is the heat dissipation efficiency.

[0118] Step 1064 : Obtain an evaluation result according to the heat dissipation performance index and a preset evaluation level.

[0119] Specifically, a smaller heat dissipation performance index indicates better heat dissipation performance. The preset evaluation level may include the heat dissipation performance index value and its corresponding level. For example, if S is 1, the corresponding level is excellent, if S is 5, the corresponding level is good, and if S is 10, the corresponding level is poor. The evaluation result may include the heat dissipation performance index value and the corresponding evaluation level.

[0120] In an optional embodiment of the present invention, step 107 includes:

[0121] Step 1071, obtaining a preset parameter adjustment standard;

[0122] Specifically, the preset parameter adjustment standards include:

[0123] Minimize thermal resistance by reducing the thermal resistance of the circuit board and its components to promote more efficient heat transfer from the heat source to the heat dissipation medium. This can be achieved by at least one of the following methods: increasing the volume of the copper block, placing it close to the heat source, increasing the contact area between the copper block and the core board, selecting a copper block or heat sink with a high thermal conductivity coefficient, and increasing the heat dissipation area.

[0124] Maximize heat dissipation efficiency to increase the ratio of heat dissipated by the heat dissipation system to the heat generated by the circuit board. This can be achieved by any of the following methods: optimizing the heat dissipation structure, such as using heat pipes or heat dissipation covers; improving convection heat transfer conditions, such as adding fans or increasing coolant flow; utilizing radiation heat transfer, such as increasing thermal radiation by coating with high-emissivity materials; increasing the surface area of ​​the copper block (such as adding fins), increasing the line width / spacing, reducing local hot spots, and forcing convection to enhance heat dissipation capabilities.

[0125] Step 1072: Determine the manufacturing parameters of the target charging pile circuit board based on the evaluation result and the preset parameter adjustment standard.

[0126] In an optional embodiment of the present invention, step 1072 includes:

[0127] Step 10721: When the evaluation result is lower than the preset expected level, the first production parameter is adjusted according to the preset parameter adjustment standard to obtain the second production parameter;

[0128] Specifically, if the evaluation result does not meet the preset expected level (such as good or excellent), the copper block production parameters and circuit board production parameters in the first production parameters need to be adjusted according to the preset parameter adjustment standards to obtain the copper block production parameters and circuit board production parameters that minimize thermal resistance and maximize heat dissipation efficiency as the second production parameters for the production of the target charging pile circuit board.

[0129] In a specific embodiment, the first production parameter and the second production parameter are shown in Table 1:

[0130] Table 1 The first production parameters and the second production parameters

[0131] parameter First production parameter Second production parameter Adjustment purpose Copper block volume 20 30 Expand heat dissipation area Copper block location 5mm away from heat dissipation components (such as transistors) Fits to the bottom of heat dissipation components (such as transistors) Shorten the heat conduction path and reduce contact thermal resistance Line width 1.5mm 2.5mm Increase current carrying capacity and reduce Joule heating Line spacing 0.5mm 1mm Reduce electromagnetic interference and thermal coupling with adjacent lines, and reduce local temperature rise Heat dissipation method natural convection Forced convection Improve convective heat transfer coefficient

[0132] By adjusting the first production parameter in the above manner to obtain the second production parameter, the temperature difference between the target charging pile circuit board and the surrounding environment can be reduced, the thermal resistance of the target charging pile circuit board can be reduced, the surface temperature of the copper block can be reduced, and the heat dissipation efficiency of the target charging pile circuit board can be improved.

[0133] Step 10722: Determine the manufacturing parameters of the target charging pile circuit board based on the second production parameters.

[0134] Specifically, the manufacturing parameters of the target charging pile circuit board include second production parameters.

[0135] In an optional embodiment of the present invention, step 108 includes:

[0136] Step 1081, obtaining a target copper block to be embedded, a target core board, a target copper foil, and a target cured sheet according to the manufacturing parameters of the target charging pile circuit board;

[0137] Specifically, the provided raw materials can be cut and manufactured according to the manufacturing parameters of the target charging pile circuit board to obtain the target copper blocks to be embedded, the target core board, the target copper foil and the target cured sheet that meet the manufacturing parameters.

[0138] Step 1082 , obtaining the target charging pile circuit board according to the manufacturing parameters of the target charging pile circuit board and the target copper block to be embedded, the target core board, the target copper foil and the target cured sheet.

[0139] Specifically, according to the preparation process or process of the charging pile circuit board, according to the production parameters of the target charging pile circuit board and the target copper block to be embedded, the target core board, the target copper foil and the target cured sheet, the target charging pile circuit board can be prepared.

[0140] In a specific embodiment, the process of preparing the target charging pile circuit board includes:

[0141] Embed a 2.0mm thick copper block into the preset slot of a 2.0mm thick core board;

[0142] Stack the materials in the following preset stacking order starting from the top layer: TL side (top layer): 9.0OZ (about 0.3mm) copper foil; 7628PP (prepreg): 2 sheets; 2.0mm FR-4 core board with embedded copper blocks; 7628PP: 2 sheets; BL side (bottom layer): 9.0OZ copper foil;

[0143] Use riveting equipment or technology to ensure that each layer of material is accurately aligned and fixed at the alignment holes; place the stacked materials in a press, heat and pressurize them to obtain a pressed board;

[0144] Target holes are punched into the pressboard for subsequent alignment and positioning; these target holes help ensure accuracy and consistency during subsequent machining.

[0145] A photosensitive resist layer is coated on the surface of the copper foil on the laminate; during the exposure process, this resist layer will form the required circuit pattern based on the selective shielding of the pattern transfer material.

[0146] Use an etching process to remove the copper foil portion not blocked by the photoresist layer to form the required circuit pattern and obtain the initial charging pile circuit board;

[0147] Performing a gold treatment on the initial charging pile circuit board to obtain a second charging pile circuit board; to improve the welding performance and corrosion resistance of the circuit; the gold layer may include a thin layer of nickel and a thin layer of gold;

[0148] Countersunk holes are drilled in the second charging pile circuit board to form a third charging pile circuit board; these holes can be used to install components or make other mechanical connections. Countersunk holes can include vias, plug-in holes (for inserting electronic components), and binding holes (for securing or binding circuit boards). Alternatively, the walls of these openings can be copper-plated to form a copper layer through a chemical reaction, or copper electroplating can be used to reduce copper ions to copper on the hole walls under the action of an applied current. This can enhance the connection strength between the hole walls and subsequent conductive circuits and ensure good electrical conductivity.

[0149] Use mechanical or laser cutting equipment to shape the third charging pile circuit board to meet the length, width and shape requirements in the production parameters.

[0150] In an optional embodiment of the present invention, the method further includes:

[0151] Step 109: testing the target charging pile circuit board to obtain a target test result;

[0152] Specifically, according to actual needs, multiple types of tests can be performed on the target charging pile circuit board, and the results of each test constitute the target test result, so that qualified charging pile circuit boards can be screened out based on the target test result to improve product quality.

[0153] Step 1010: Screen the target charging pile circuit board according to the test results and preset qualification conditions to obtain qualified charging pile circuit boards.

[0154] Specifically, target charging pile circuit boards that meet pre-set qualification criteria are packaged and shipped to customers as qualified charging pile circuit boards, improving product quality and customer satisfaction. Pre-set qualification criteria may include: no bubbles, delamination, cracks, cracking, or shedding.

[0155] In an optional embodiment of the present invention, step 109 includes:

[0156] Step 1091: Perform a thermal shock test on the target charging pile circuit board to obtain a first test result.

[0157] Specifically, when conducting a thermal shock test, the target charging pile circuit board can be placed in a -40°C cold temperature tank for 30 minutes, then at room temperature for 5 minutes, then at 125°C for 30 minutes, and then at room temperature for 5 minutes. This constitutes one cycle, for a total of 100 cycles. The first test results can include the thermal shock test process and the appearance and performance of the target charging pile circuit board after the thermal shock test (such as changes in parameters such as resistance, capacitance, and inductance).

[0158] Step 1092: Perform a high-temperature placement test on the target charging pile circuit board to obtain a second test result.

[0159] Specifically, during the high-temperature exposure test, the target charging pile circuit board can be placed in an oven at 100 to 110°C for 120 hours. The second test results can include the high-temperature exposure test process and the appearance and performance (e.g., changes in resistance, capacitance, inductance, and other parameters) of the target charging pile circuit board after the high-temperature exposure test.

[0160] Step 1093: Perform a moisture placement test on the target charging pile circuit board to obtain a third test result.

[0161] Specifically, during the humidity exposure test, the target charging pile circuit board can be placed in a constant temperature humidity oven at a temperature of 60-65°C and a humidity of 90-95°C for 120 hours. The third test results can include the humidity exposure test process and the appearance and performance (e.g., changes in resistance, capacitance, inductance, and other parameters) of the target charging pile circuit board after the humidity exposure test.

[0162] Step 1094: performing a thermal shock test on the target charging pile circuit board to obtain a fourth test result;

[0163] Specifically, during the thermal shock test, the target charging pile circuit board can be placed in a thermal shock test chamber and subjected to three thermal shocks at 288°C for 10 seconds each. The fourth test results can include the thermal shock test process and the appearance and performance of the target charging pile circuit board after the thermal shock test (such as changes in parameters such as resistance, capacitance, and inductance).

[0164] Step 1095: Perform a heat dissipation performance test on the target charging pile circuit board to obtain a fifth test result.

[0165] Specifically, when conducting a heat dissipation performance test, the target charging pile circuit board can be placed in a heat dissipation performance test system and the temperature sensor can be connected. After turning on the heat dissipation performance test system, the load conditions of the target charging pile circuit board in actual use can be simulated, and its temperature changes can be monitored. The temperature distribution, heat dissipation efficiency and possible overheating conditions of the target charging pile circuit board under different load conditions are recorded as the fifth test result.

[0166] Specifically, an insulation resistance test can also be performed on the target charging pile circuit board to obtain a sixth test result; a preset test voltage, usually a DC voltage, is applied to the target charging pile circuit board through an insulation resistance tester, and the insulation resistance tester measures the insulation resistance value on the target charging pile circuit board. The insulation resistance value reflects the insulation performance of the target charging pile circuit board surface and internal insulation layer. The measured insulation resistance value is recorded as the sixth test result.

[0167] Step 1096: Obtain a target test result according to the first test result, the second test result, the third test result, the fourth test result, and the fifth test result.

[0168] Specifically, the target test result may include all contents of the first test result, the second test result, the third test result, the fourth test result, the fifth test result, and the sixth test result.

[0169] A specific embodiment of the method for preparing the charging pile circuit board according to the embodiment of the present invention includes:

[0170] Step 111: Obtain the copper block, core board, copper foil, cured sheet, and first production parameters required for preparing the first charging pile circuit board;

[0171] Step 112: Cut the copper block and insert it into the slot of the core board to obtain a core board with the copper block.

[0172] Step 113, stacking the copper foil, the cured sheet, and the core board with the copper block together according to a preset stacking sequence, and then riveting and pressing them together to obtain a pressed board;

[0173] Step 114: Circuit fabrication is performed on the laminate through exposure, development, and etching to obtain a first charging pile circuit board. The first charging pile circuit board is used as a sample for subsequent heat dissipation performance evaluation and subsequent batch production, which can save production costs and improve the heat dissipation efficiency of the circuit board.

[0174] Step 115: Using circuit board simulation software, perform heat dissipation simulation on the first charging pile circuit board according to preset simulation parameters to obtain thermal parameters. The thermal parameters include temperature difference, heat dissipation power, heat dissipated by the heat dissipation system, and heat generated by the first charging pile circuit board. These thermal parameters are used to subsequently evaluate the heat dissipation effect of the circuit board.

[0175] Step 116: Input the thermal parameters into multiple sub-models of a preset heat dissipation evaluation model to calculate a heat dissipation performance index. Based on the heat dissipation performance index and a preset evaluation level, an evaluation result of the first charging pile circuit board can be obtained;

[0176] Step 117: If the evaluation result does not meet the preset expected level, the copper block production parameters and the circuit board production parameters in the first production parameters need to be adjusted according to the preset parameter adjustment standard to obtain second production parameters (i.e., manufacturing parameters) to minimize the thermal resistance of the circuit board and maximize the heat dissipation efficiency.

[0177] Step 118, cutting and manufacturing the provided raw materials (such as copper blocks, copper foils, core boards, etc.) according to the manufacturing parameters of the target charging pile circuit board to obtain the target copper blocks to be embedded, the target core boards, the target copper foils, and the target cured sheets that meet the manufacturing parameters, and preparing the target charging pile circuit board based on these materials.

[0178] The preparation method of the charging pile circuit board proposed in an embodiment of the present invention evaluates the heat dissipation performance of the first charging pile circuit board and then adjusts the relevant production parameters so that the heat dissipation performance of the final charging pile circuit board meets the expected requirements, which is beneficial to improving the heat dissipation performance and product quality of the charging pile circuit board.

[0179] An embodiment of the present invention further provides a charging pile circuit board, which is manufactured using the method for manufacturing a charging pile circuit board as described in any one of the above embodiments.

[0180] The charging pile circuit board of the embodiment of the present invention is prepared using the method for preparing a charging pile circuit board as described in any one of the above embodiments, has higher heat dissipation performance, and is more adaptable to the use scenarios of the charging pile.

[0181] It should be noted that, in the apparatus and method of the present invention, it is apparent that each component or step can be decomposed and / or recombined. Such decomposition and / or recombination should be considered equivalent solutions of the present invention. Furthermore, the steps of performing the above series of processes can naturally be performed in chronological order according to the order described, but do not necessarily need to be performed in chronological order. Certain steps can be performed in parallel, interleaved, or independently of each other.

[0182] It should be noted that, in the above embodiments, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be pointed out that the scope of the methods and devices in the implementation methods of the above embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0183] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A method for preparing a charging pile circuit board, characterized in that: include: Obtain the copper blocks to be embedded in the charging pile circuit board; Embedding the copper block to be embedded into the core board to obtain a core board with the copper block; Pressing the copper foil, the cured sheet and the core board with the copper block to obtain a pressed board; Performing circuit fabrication on the pressed plate to obtain a first charging pile circuit board; Obtaining thermal parameters of the first charging pile circuit board under a thermal simulation model; Inputting the thermal parameters into a preset heat dissipation evaluation model to evaluate the heat dissipation effect of the circuit board to obtain an evaluation result; Determining manufacturing parameters of the target charging pile circuit board based on the evaluation results; Obtain a target charging pile circuit board according to the manufacturing parameters of the target charging pile circuit board and the target copper block to be embedded, the target core board, the target copper foil and the target cured sheet; Wherein, obtaining the thermal parameters of the first charging pile circuit board under the thermal simulation model includes: Obtaining preset simulation parameters of the first charging pile circuit board under a thermal simulation model; Performing heat dissipation simulation processing on the first charging pile circuit board according to the preset simulation parameters to obtain heat parameters; The preset simulation parameters include: Temperature parameter; the temperature parameter is 20 to 30°C; Convection heat transfer coefficient; the convection heat transfer coefficient is 5 to 10 ; Radiation heat transfer parameters; the radiation heat transfer parameters are We can get, where Q is the radiation heat transfer parameter, is the emissivity of the first charging pile circuit board, is a constant, A is the surface area of ​​the first charging pile circuit board, is the total energy density radiated to the environment by the first charging pile circuit board, is the total energy density radiated from the environment to the first charging pile circuit board; Thermal conductivity of copper block; Specifications of copper blocks; Position parameters of the copper block; Thermal conductivity of the first charging pile circuit board; Power supply input power; the power supply input power is obtained by P=VI, where P is the power supply input power, V is the voltage, and I is the current; The heat parameters are input into a preset heat dissipation evaluation model to evaluate the heat dissipation effect of the circuit board, and an evaluation result is obtained, including: The heat parameter is input into the first sub-model of the preset heat dissipation evaluation model to obtain the thermal resistance; wherein the first sub-model includes , where R is the thermal resistance, is the temperature difference, that is, the difference between the heat source temperature and the ambient temperature, and P is the heat dissipation power; The heat parameters are input into the second sub-model of the preset heat dissipation evaluation model to obtain the heat dissipation efficiency; wherein the second sub-model includes , where n is the heat dissipation efficiency, To dissipate the heat of the cooling system, The heat generated by the first charging pile circuit board; The thermal resistance and the heat dissipation efficiency are input into the third sub-model of the preset heat dissipation evaluation model to obtain the heat dissipation performance index; wherein the third sub-model includes , where S is the heat dissipation performance index, R is the thermal resistance, and n is the heat dissipation efficiency; An evaluation result is obtained according to the heat dissipation performance index and a preset evaluation level, wherein the preset evaluation level includes the value of the heat dissipation performance index and its corresponding level.

2. The method for preparing a charging pile circuit board according to claim 1, characterized in that: Embedding the copper block to be embedded into the core board to obtain the core board with the copper block comprises: Embedding the copper block to be embedded into the core board according to preset embedding parameters to obtain a core board with the copper block; The copper foil, the cured sheet and the core board with the copper block are pressed together to obtain a pressed board, comprising: The copper foil, the cured sheet and the core board with the copper block are pressed together according to a preset lamination sequence to obtain a pressed board.

3. The method for preparing a charging pile circuit board according to claim 1, characterized in that: Based on the evaluation results, the manufacturing parameters of the target charging pile circuit board are determined, including: Obtain preset parameter adjustment standards; Determine the manufacturing parameters of the target charging pile circuit board based on the evaluation results and the preset parameter adjustment standards.

4. The method for preparing a charging pile circuit board according to claim 3, characterized in that: Determining the manufacturing parameters of the target charging pile circuit board based on the evaluation results and the preset parameter adjustment standard, including: When the evaluation result is lower than the preset expected level, adjusting the first production parameter according to the preset parameter adjustment standard to obtain the second production parameter; Based on the second production parameters, the manufacturing parameters of the target charging pile circuit board are determined.

5. The method for preparing a charging pile circuit board according to claim 1, characterized in that: Also includes: Testing the target charging pile circuit board to obtain a target test result; The target charging pile circuit board is screened according to the test results and preset qualification conditions to obtain a qualified charging pile circuit board.

6. The method for preparing a charging pile circuit board according to claim 5, characterized in that: The target charging pile circuit board is tested to obtain target test results, including: Performing a thermal shock test on the target charging pile circuit board to obtain a first test result; Performing a high temperature placement test on the target charging pile circuit board to obtain a second test result; Performing a moisture placement test on the target charging pile circuit board to obtain a third test result; Performing a thermal shock test on the target charging pile circuit board to obtain a fourth test result; Performing a heat dissipation performance test on the target charging pile circuit board to obtain a fifth test result; A target test result is obtained according to the first test result, the second test result, the third test result, the fourth test result and the fifth test result.

7. A charging pile circuit board, characterized in that: The charging pile circuit board is prepared by the method for preparing a charging pile circuit board according to any one of claims 1 to 6.

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