Display panel, preparation method thereof and display device

Abstract

Embodiments of the present application provide a display panel, a preparation method thereof and a display device. The display panel comprises a substrate and a first metal wire located on one side of the substrate. The first metal wire comprises a first layer, a second layer and a third layer which are stacked. The second layer is located between the first layer and the third layer. The second layer comprises a main body part and a protection part. The protection part comprises a metal compound and covers at least part of the sidewall of the main body part in a first direction. The first direction is parallel to the plane in which the display panel is located and points from the main body part to the protection part. The anti-corrosion property of the metal compound can be used to protect the sidewall of the main body part, which is conducive to improving the structural stability and the conductive performance of the first metal wire.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] In existing display panels, electrical signal traces are typically configured as multilayer metal structures. Due to limitations in manufacturing processes and the location of these traces, some traces in display panels are prone to corrosion, affecting their performance and structural stability. Therefore, a solution is urgently needed. Summary of the Invention

[0003] In view of this, embodiments of this application provide a display panel and a method for manufacturing the same, as well as a display device, to solve the above-mentioned problems.

[0004] In a first aspect, embodiments of this application provide a display panel, including a substrate and a first metal line located on one side of the substrate. The first metal line includes a first layer, a second layer, and a third layer stacked together, with the second layer located between the first layer and the third layer. The second layer includes a main body portion and a protective portion, the protective portion including a metal compound, and the protective portion covering at least a portion of the sidewall of the main body portion along a first direction. The first direction is parallel to the plane where the display panel is located and extends from the main body portion to the protective portion.

[0005] Secondly, embodiments of this application provide a method for manufacturing a display panel, used to manufacture the display panel as provided in the first aspect; the method includes:

[0006] A substrate is provided, and a first metal layer, a second metal layer and a third metal layer are stacked on one side of the substrate to form the third layer, the initial second layer and the first layer of the first metal line, respectively.

[0007] Gas is injected into the sidewall of the initial second layer, and the gas reacts with the metal in the second metal layer to form a metal compound, thus forming the second layer.

[0008] Thirdly, embodiments of this application provide a display device, including a display panel as provided in the first aspect.

[0009] In this embodiment of the application, by providing a protective part containing a metal compound to cover at least part of the sidewall of the main body in the second layer, the anti-corrosion properties of the metal compound can be used to protect the sidewall of the main body, reduce the erosion of the main body by corrosive materials from the side of the second layer, thereby improving the structural stability and conductivity of the first metal wire. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0012] Figure 2 This is a schematic diagram of the structure of another display panel provided in an embodiment of this application;

[0013] Figure 3 This is a schematic diagram of the structure of another display panel provided in an embodiment of this application;

[0014] Figure 4 This is a schematic diagram of the structure of another display panel provided in an embodiment of this application;

[0015] Figure 5 This is a plan view of a display panel provided in an embodiment of this application;

[0016] Figure 6 for Figure 5 A schematic diagram of one possible structure of the display panel shown;

[0017] Figure 7 This is a schematic diagram of the structure of another display panel provided in an embodiment of this application;

[0018] Figure 8 This is a schematic diagram of the structure of another display panel provided in an embodiment of this application;

[0019] Figure 9 This is a schematic diagram of the structure of another display panel provided in an embodiment of this application;

[0020] Figure 10 A process flow diagram for manufacturing a display panel is provided as an embodiment of this application;

[0021] Figure 11 A process flow diagram for the fabrication of another display panel provided in this application embodiment;

[0022] Figure 12 This is a schematic diagram of a display device provided in an embodiment of this application. Detailed Implementation

[0023] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0024] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0025] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0026] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0027] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of another display panel provided in an embodiment of this application.

[0028] This application embodiment provides a display panel 01, such as Figure 1 and Figure 2 As shown, the display panel 01 includes a substrate 10 and a first metal line 20 located on one side of the substrate 10. The first metal line 20 can be used to transmit electrical signals. The first metal line 20 includes a first layer 21, a second layer 22 and a third layer 23 stacked together, with the second layer 22 located between the first layer 21 and the third layer 23.

[0029] For example, such as Figure 1 and Figure 2 As shown, the first layer 21 is located on the side of the third layer 23 away from the substrate 10. That is, in the direction Z perpendicular to the plane where the display panel 01 is located, the third layer 23, the second layer 22, and the first layer 21 can be arranged in sequence.

[0030] For example, such as Figure 1 and Figure 2 As shown, the thickness H2 of the second layer 22 is greater than the thickness H1 of the first layer 21, and is also greater than the thickness H3 of the third layer 23.

[0031] The second layer 22 includes a main body 221 and a protective layer 222, the protective layer 222 comprising a metal compound. Along a first direction X, the protective layer 222 covers at least a portion of the sidewall 221A of the main body 221. The first direction X is parallel to the plane containing the display panel 01 and extends from the main body 221 towards the protective layer 222.

[0032] In other words, in the first direction X, at least a portion of the sidewall 221A of the main body 221 is covered by a protective portion 222 containing a metal compound.

[0033] Optional, such as Figure 1 As shown, in the first direction X, the protective part 222 covers all the sidewalls 221A of the main body part 221.

[0034] Optional, such as Figure 2 As shown, in the first direction X, the protective part 222 covers part of the sidewall 221A of the main body part 221.

[0035] It is understandable that metal compounds usually have certain anti-corrosion properties, especially certain specific metal compounds, which have excellent anti-oxidation and anti-corrosion properties.

[0036] The inventors of this application have discovered through research that the second layer of the first metal wire is typically used as the main material for transmitting electrical signals, and the performance of the second layer often determines the conductivity of the first metal wire. However, in the prior art, no protective layer is provided on the sidewalls of the second layer, which makes it easy for etching solutions used in the display panel manufacturing process and / or some corrosive ions present in the display panel to penetrate into the second layer from the sidewalls, corroding the metal in the second layer and affecting the conductivity and structural stability of the first metal wire.

[0037] In view of this, in the embodiments of this application, a protective part 222 containing a metal compound is provided to cover at least part of the sidewall 221A of the main body 221 in the second layer 22. This can utilize the anti-corrosion properties of the metal compound to protect the sidewall 221A of the main body 221, reduce the erosion of the main body 221 by corrosive materials from the side of the second layer 22, thereby improving the structural stability and conductivity of the first metal line 20.

[0038] Optional, such as Figure 1 As shown, the protective part 222 is located outside the main body 221, and the protective part 222 is in contact with the side wall 221A of the main body 221. That is, the second layer 22 may include an inner layer and an outer layer, with the main body 221 located in the inner layer and the protective part 222 located in the outer layer.

[0039] Since the protective part 222 includes a metal compound, and the protective part 222 is connected to the side wall 221A of the main body 221, the protective part 222 can be formed by injecting gas into the metal in the second layer 22 during the preparation of the second layer 22. There is no need to prepare an additional protective material on the side of the second layer 22, which helps to simplify the preparation process of the protective part 222 and reduce the preparation cost of the first metal line 20.

[0040] Optionally, the protective layer 222 includes at least one of a metal nitride and a metal fluoride. During the preparation of the second layer 22, a nitrogen-containing gas or a fluorine-containing gas can be injected into the metal in the second layer 22, and the nitrogen ions or fluorine ions react with the metal in the second layer 22 to generate the protective layer 222.

[0041] For example, in the second layer 22, the main body 221 includes aluminum, and the protective part 222 includes at least one of aluminum nitride or aluminum fluoride.

[0042] Because aluminum has good electrical conductivity and is economical, including aluminum in the main body 221 ensures good conductivity of the first metal wire 20 while reducing costs. Aluminum nitride and aluminum fluoride both have high chemical stability and are resistant to high temperatures and acid / alkali corrosion. Including at least one of aluminum nitride or aluminum fluoride in the protective part 222 improves its ability to isolate corrosive materials, thereby enhancing its protection of the main body 221.

[0043] During the preparation of the second layer 22, nitrogen (N2) or fluorine-containing gas can be injected into the side of the second layer 22. The nitrogen gas reacts chemically with the metallic aluminum (Al) on the side of the second layer 22 to form aluminum nitride. The chemical reaction formula is: 2Al + N2 → 2AlN. Fluoride ions (F...) - The aluminum (Al) on the second layer 22 can react chemically with the aluminum (Al) on the side to produce aluminum fluoride. The chemical reaction formula is: Al + F - →ALF3.

[0044] For example, fluorine-containing gases can be gases such as carbon tetrafluoride or sulfur hexafluoride.

[0045] Please continue to refer to this. Figure 1 In one implementation of this application, the protective portion 222 covers the sidewall 221A of the main body portion 221 along the first direction X. Thus, the protective portion 222 can completely cover the sidewall 221A of the main body portion 221, which is beneficial for achieving comprehensive protection of the sidewall 221A of the main body portion 221, thereby improving the corrosion resistance of the first metal wire 20 and further ensuring the structural stability and conductivity of the first metal wire 20.

[0046] Furthermore, providing comprehensive protection for the sidewall 221A of the main body 221 helps to avoid deep grooves appearing on the side of the second layer 22. When preparing subsequent film layers on the first metal line 20, it can prevent the subsequent film layers from breaking due to their inability to adhere to the side of the second layer 22.

[0047] Figure 3 This is a schematic diagram of the structure of another display panel provided in an embodiment of this application.

[0048] In one implementation of this application, such as Figure 3 As shown, the second layer 22 includes a first sublayer 2201 and a second sublayer 2202, which are connected in a direction Z perpendicular to the plane of the display panel 01. The first sublayer 2201 is located on the side of the second sublayer 2202 away from the substrate 10. The main body portion 221 in both the first sublayer 2201 and the second sublayer 2202 may be made of the same material, such as the aluminum described above.

[0049] In the first direction X, the sidewall of the second sublayer 2202 protrudes from the sidewall of the first sublayer 2201.

[0050] For example, such as Figure 3 As shown, in the first direction X, the two opposite sidewalls of the second sublayer 2202 protrude from the two opposite sidewalls of the first sublayer 2201.

[0051] In this embodiment, the sidewall of the second sublayer 2202 protrudes beyond the sidewall of the first sublayer 2201. Therefore, the sidewalls of the second sublayer 2202 and the first sublayer 2201 are not on the same straight line, and the second sublayer 2202 and the first sublayer 2201 can form a "step-like" structure, that is, the side of the second layer 22 can form a "step". Based on this arrangement, the side of the second layer 22 is relatively flat. When preparing subsequent films on the first metal wire 20, the subsequent films can climb along the sidewall of the second sublayer 2202 to the sidewall of the first sublayer 2201, which is beneficial to improving the adhesion between the subsequent films and the side of the second layer 22, avoiding breakage of the subsequent films on the side of the second layer 22, and thus further improving the film quality of the subsequent films.

[0052] Optional, such as Figure 3 As shown, the second sublayer 2202 includes a main body 221 and a protective part 222. Along the first direction X, the protective part 222 covers at least a portion of the sidewall 221A of the main body 221. Based on this arrangement, in the above embodiment, the sidewall of the second sublayer 2202 can refer to the sidewall of the protective part 222 in the second sublayer 2202.

[0053] Of course, such as Figure 3 As shown, in the first direction X, the sidewall 221A of the main body 221 in the second sublayer 2202 may also protrude from the sidewall 221A of the main body 221 in the first sublayer 2201.

[0054] For example, such as Figure 3 As shown, in the first direction X, the protective part 222 covers all the sidewalls 221A of the main body part 221 in the second sublayer 2202.

[0055] For example, such as Figure 4 As shown, Figure 4 This is a schematic diagram of another display panel structure provided in an embodiment of this application. In the first direction X, the protective portion 222 covers a portion of the sidewall 221A of the main body portion 221 in the second sublayer 2202. At this time, the protective portion 222 covers the sidewall 221A of the main body portion 221 in the second sublayer 2202 near the substrate 10.

[0056] Since the second sublayer 2202 is closer to the substrate 10 than the first sublayer 2201, i.e. the second layer 22 has a "narrower at the top and wider at the bottom" structure, the second sublayer 2202 includes a protective portion 222 that can protect the sidewall 221A of the main body portion 221. This helps to avoid the appearance of grooves on the side of the second sublayer 2202 that are blocked by the main body portion 221. When preparing subsequent film layers on the first metal line 20, it helps to avoid the subsequent film layers from breaking on the side of the second sublayer 2202.

[0057] Optional, such as Figure 3 and Figure 4 As shown, the first sublayer 2201 includes a main body 221 but does not include a protective part 222. That is, the protective part 222 is not provided on the outside of the main body 221 in the first sublayer 2201. Based on this arrangement, the sidewall of the first sublayer 2201 in the above embodiment can refer to the sidewall 221A of the main body 221 in the first sublayer 2201.

[0058] Since there is no protective portion 222 on the side wall 221A of the main body portion 221 in the first sub-layer 2201, the side wall 221A of the main body portion 221 in the first sub-layer 2201 can be etched to make the side wall 221A of the main body portion 221 in the first sub-layer 2201 shrink inward relative to the side wall of the second sub-layer 2202, thereby forming a "step" structure on the side of the second layer 22.

[0059] In preparation such as Figure 3 and Figure 4 During the process of creating the second layer 22, a protective portion 222 of uneven thickness can be prepared on the side wall 221A of the main body 221 of the second layer 22. The thickness of the protective portion 222 can gradually increase along the direction from the first layer 21 to the third layer 23.

[0060] By flexibly adjusting the thickness of the protective portion 222 at different locations, the protection strength at different positions of the sidewall 221A of the main body portion 221 can be adjusted. This results in the sidewall of the main body portion 221 near the first layer 21 being less protected and thus more susceptible to etching, while the sidewall of the main body portion 221 near the third layer 23 is more protected and thus avoids etching. This facilitates a larger etching amount on the sidewall of the first sublayer 2201, thereby ensuring that the sidewall of the second sublayer 2202 protrudes beyond the sidewall of the first sublayer 2201 in the first direction X. Furthermore, by controlling the thickness of the protective portion 222, the etching amount on the sidewall of the first sublayer 2201 can be controlled, thereby controlling the degree to which the first sublayer 2201 is recessed relative to the second sublayer 2202.

[0061] In preparation such as Figure 1 During the second layer 22 process shown, the protective portions 222 on the sidewalls 221A of the main body 221 can be made relatively thick, so that all sidewalls 221A of the main body 221 can be well protected, preventing the sidewalls 221A of the main body 221 from being etched in subsequent etching processes. Of course, along the direction from the first layer 21 to the third layer 23, the thickness of the protective portions 222 can also be gradually increased, as long as it ensures that all sidewalls 221A of the main body 221 can be well protected.

[0062] For example, when fabricating the protective portion 222, the center thickness of the protective portion 222 is greater than 20 nm. Here, center thickness refers to the thickness of the protective portion 222 located at the middle position of the second layer along the direction from the first layer 21 to the third layer 23. By flexibly adjusting the thickness of the protective portion 222 near the first layer 21, the desired effect can be achieved. Figure 1 or Figure 3 The second layer structure shown.

[0063] In one embodiment of this application, such as Figure 1 As shown, the first layer 21 is located on the side of the third layer 23 away from the substrate 10, and in the first direction X, the third layer 23 protrudes beyond the edge of the first layer 21. That is, the first metal line 20 can have a "narrow at the top and wide at the bottom" structure.

[0064] It is understandable that other film layers usually need to be fabricated on the first metal line 20. In this embodiment, by making the third layer 23 near the substrate 10 protrude from the first layer 21 away from the substrate 10, the side surface of the first metal line 20 can be made relatively flat, which helps to avoid breakage of subsequent film layers on the side surface of the first metal line 20, thereby improving the film formation quality of subsequent film layers.

[0065] Optionally, both the first layer 21 and the third layer 23 are made of titanium. In the Z direction perpendicular to the plane of the display panel 01, the first layer 21 and the third layer 23 are located on opposite sides of the second layer 22. The first layer 21 and the third layer 23 are in contact with other film layers in the display panel 01 and also protect the second layer 22, which is the main conductive material. Because titanium has extremely high chemical stability, making both the first layer 21 and the third layer 23 made of titanium not only improves the protection of the second layer 22 but also reduces damage to the first metal line 20 during the display panel manufacturing process.

[0066] Please continue to refer to this. Figure 1 In one embodiment of this application, the first layer 21 is located on the side of the third layer 23 away from the substrate 10, and the thickness D of the protective portion 222 gradually increases along the first direction X in the direction from the first layer 21 to the third layer 23.

[0067] As the foregoing analysis shows, in the direction Z perpendicular to the plane of the display panel 01, the first metal line 20 can have a "narrower at the top and wider at the bottom" structure, that is, along the direction from the first layer 21 to the third layer 23, the length of the second layer 22 protruding from the first layer 21 can gradually increase. Furthermore, the protective portion 222 can be formed by injecting gas into the metal material in the second layer 22. Therefore, by injecting gas into the second layer 22 in the direction Z perpendicular to the plane of the display panel 01, the thickness D of the protective portion 222 can be gradually increased, which simplifies the fabrication process of the protective portion 222 and reduces its fabrication difficulty.

[0068] Furthermore, by gradually increasing the size of the protective portion 222, the thickness of the protective portion 222 at different locations can be flexibly adjusted, thereby controlling the etching degree at different locations of the main body 221, which is beneficial for achieving... Figure 3 , Figure 4 The second layer structure shown.

[0069] Optional, such as Figure 1 As shown, the center thickness of the protective portion 222 is d1, where d1 > 20 nm. Here, center thickness refers to the thickness of the protective portion 222 located at the middle position of the second layer, along the direction from the first layer 21 to the third layer 23. This arrangement helps ensure the corrosion resistance of the protective portion 222, reduces the erosion of the main body 221 by corrosive materials from the side of the second layer 22, and thus helps ensure the structural stability and electrical conductivity of the first metal wire 20.

[0070] Figure 5 This is a plan view of a display panel provided in an embodiment of this application.

[0071] In one embodiment of this application, such as Figure 5As shown, the display panel 01 includes a display area AA and a non-display area NA. The non-display area NA surrounds at least a portion of the display area AA. The non-display area NA includes a first non-display area NA1 located on one side of the display area AA. The first non-display area NA1 may include a fan-out area NA11 and a bonding area NA12 located on the side of the fan-out area away from the display area AA. The first non-display area NA1 may be the "bottom bezel" of the display panel 01.

[0072] The first metal line 20 is located in the first non-display area NA1.

[0073] The inventors of this application have discovered through research that the bonding area NA12 can be used to electrically connect a driver chip (not shown in the figure). The driver chip uses signal traces in the first non-display area NA1 to provide display signals to the display area AA. These signal traces can be directly connected to the pins of the driver chip. Therefore, the conductivity and structural stability of these signal traces are particularly important for the transmission of display signals to the display area AA.

[0074] In this embodiment of the application, the first metal line 20 is located in the first non-display area NA1, so the display signal can be transmitted using the first metal line 20. As can be seen from the above analysis, the first metal line 20 can reduce the risk of corrosion, has good conductivity and structural stability, and is conducive to improving the reliability and timeliness of the display signal transmission.

[0075] Optional, combined Figure 5 and Figure 6 As shown, Figure 6 for Figure 5 The diagram shows a schematic of a display panel. The display panel 01 further includes an organic layer 30, which is located on the side of the first metal line 20 away from the substrate 10. The display panel also includes an organic layer clearance area 31, which is located in the first non-display area NA1.

[0076] For example, such as Figure 6 As shown, the display panel 01 also includes a transistor array layer 40, which is located on the side of the organic layer 30 closest to the substrate 10. The organic layer 30 may include a planarization layer 301 and a pixel definition layer 302. A light-emitting device FG can be disposed in the opening of the pixel definition layer 302. The transistor array layer 40 may simultaneously include low-temperature polycrystalline silicon thin-film transistors T1 and oxide thin-film transistors T2, meaning that the display panel 01 can be a display panel 01 using LTPO (low-temperature polycrystalline oxide) technology. In this way, the advantages of both low-temperature polycrystalline silicon and oxide can be combined to improve the performance of the display panel 01. No organic layer is disposed in the organic layer clearance area 31. For example, the aforementioned planarization layer 301 and pixel definition layer 302 will both terminate in this area, and other organic layers located on the substrate will also terminate in this area.

[0077] The first metal line 20 is located on the same layer as the source of the low-temperature polycrystalline silicon thin-film transistor T1 and the source of the oxide thin-film transistor T2.

[0078] For example, the first metal line 20 is a power signal line, which can be used to transmit power supply voltage PVDD or power supply voltage PVEE.

[0079] At least a portion of the first metal wire 20 is located in the organic layer clearance area 31. That is, the first metal wire 20 can extend through the organic layer clearance area 31.

[0080] As can be seen from the above analysis, the first metal line 20 can reduce the erosion of the main body 221 by the etching material from the side of the second layer 22, that is, it can reduce the risk of the second layer 22 being etched from the side, which helps to avoid the formation of grooves on the side of the first metal line 20.

[0081] Therefore, when the first metal line 20 extends through the organic layer clearance area 31, it helps to avoid organic materials remaining on the side of the first metal line 20, thereby preventing the organic materials from forming a channel for water vapor erosion along the side of the first metal line 20. This helps to prevent external water and oxygen from invading the interior of the display panel 01 along the side of the first metal line 20, which can improve the reliability and lifespan of the display panel 01.

[0082] Please continue to refer to this. Figure 6 The display panel 01 also includes an encapsulation layer 50, which is located on the side of the first metal line 20 away from the substrate 10. Along the direction Z perpendicular to the plane where the display panel 01 is located, the encapsulation layer 50 and the first metal line 20 at least partially overlap.

[0083] For example, such as Figure 6 As shown, the encapsulation layer 50 includes a first inorganic encapsulation layer 51, an organic encapsulation layer 52, and a second inorganic encapsulation layer 53 stacked together, with the organic encapsulation layer 52 disposed between the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53. In this embodiment, the encapsulation layer 50 overlapping the first metal line 20 is at least one of the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53. Along the direction Z perpendicular to the plane where the display panel 01 is located, the organic encapsulation layer 52 does not overlap with the first metal line 20.

[0084] It should be noted that, Figure 6 The image only illustrates the case where both the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 overlap with the first metal line 20.

[0085] For example, such as Figure 6As shown, in the organic layer clearance area 31, the encapsulation layer 50 is in contact with the first metal line 20. That is, in the first non-display area NA1, there is a situation where the encapsulation layer 50 is in direct contact with the first metal line 20.

[0086] Combination Figure 6 and Figure 7 As shown, Figure 7 This is a schematic diagram of another display panel structure provided in an embodiment of this application. In one implementation of this application, the protective portion 222 covers the sidewall 221A of the main body portion 221 along the first direction X. Thus, the protective portion 222 can completely cover the sidewall 221A of the main body portion 221, which is beneficial for achieving comprehensive protection of the sidewall 221A of the main body portion 221 and avoiding deep grooves on the side of the second layer 22. When the encapsulation layer 50 is prepared on the first metal line 20, the encapsulation layer 50 can be tightly encapsulated along the side of the second layer 22, which is beneficial for forming a tight encapsulation effect.

[0087] Combination Figure 6 and Figure 8 As shown, Figure 8 This is a schematic diagram of another display panel structure provided in an embodiment of this application. In another implementation of this application, the second layer 22 includes a first sublayer 2201 and a second sublayer 2202, with the first sublayer 2201 located on the side of the second sublayer 2202 away from the substrate 10. In the first direction X, the second sublayer 2202 protrudes beyond the first sublayer 2201, and the side surface of the second layer 22 can form a "step". When the encapsulation layer 50 is fabricated on the first metal line 20, the encapsulation layer 50 can be formed by climbing up the "step" side surface of the second layer 22, which is beneficial to further improve the encapsulation effect of the encapsulation layer 20.

[0088] It should be noted that, as Figure 8 As shown, although the first sublayer 2201 is recessed relative to the second sublayer 2202, since the first sublayer 2201 is located on the side of the second sublayer 2201 away from the substrate 10, the void Q created by its recess will not be blocked by the second sublayer 2201. Moreover, the degree of recess of the first sublayer 2201 relative to the second sublayer 2202 is controllable, and the blocking effect of the first layer 21 on the void Q is limited. In the organic layer clearance area 31, the organic material in the void Q can be reliably removed, and it will not cause the organic material to form a channel for water and oxygen erosion along the side of the first metal line 20.

[0089] Figure 9 This is a schematic diagram of the structure of another display panel provided in an embodiment of this application.

[0090] In one embodiment of this application, such as Figure 9As shown, the display panel 01 also includes a light-emitting layer 60, which includes a plurality of light-emitting devices FG, and a first metal line 20 is located on the side of the light-emitting layer 60 away from the substrate 10.

[0091] Optionally, the first metal line 20 is a touch signal line.

[0092] For example, such as Figure 9 As shown, along the direction Z perpendicular to the plane where the display panel 01 is located, the first metal line 20 does not overlap with the light-emitting device FG. In this way, the first metal line 20 can avoid blocking the light emitted by the light-emitting device FG, which is beneficial to improving the luminous efficiency of the light-emitting device FG.

[0093] The inventors of this application have discovered through research that, in order to increase the functional diversity of display panels, in addition to display functions, display panels typically integrate other specific functions, such as touch functions. To avoid interference between the signals used to implement these specific functions and the display signals, the signal traces required to implement these specific functions are usually located on the side of the light-emitting layer 60 away from the substrate 10. The reliability of these signal traces often determines whether the specific functions can be implemented.

[0094] In view of this, in the embodiments of this application, the first metal line 20 is located on the side of the light-emitting layer 60 away from the substrate 10. Then, the signal used to realize a specific function can be transmitted using the first metal line 20. As can be seen from the above analysis, the first metal line 20 can reduce the risk of corrosion and has good conductivity and structural stability, which is beneficial to improving the reliability of the display panel in realizing a specific function.

[0095] Of course, any one of the signal traces located on the side of the light-emitting layer 60 away from the substrate 10 can be the first metal line 20.

[0096] Please continue to refer to this. Figure 9 In one embodiment of this application, the display panel 01 further includes a polarizer POL, which is located on the side of the first metal line 20 away from the light-emitting layer 60. That is, a polarizer POL is also disposed on the side of the light-emitting layer 60 away from the substrate 10.

[0097] The inventors of this application discovered through research that under high temperature and high humidity conditions, iodine (I2) in a polarizer (POL) will precipitate, and iodine reacts with hydroxide ions (OH-). - The reaction produces strongly oxidizing iodate ions (IO3). - The chemical reaction formula is: 3I₂ + 6OH⁻ - →5I - +IO3 - +3H₂O. Iodate ion (IO₃⁻) -It can be converted into iodic acid (HIO3), which easily corrodes aluminum in nearby metal traces. The chemical reaction formula is: 2Al + HIO3 → Al2O3 + HI (g).

[0098] As can be seen from the foregoing analysis, the protective portion 222 in the first metal line 20 is resistant to acid corrosion. Therefore, positioning the first metal line 20 between the light-emitting layer 60 and the polarizer POL (any metal trace close to the polarizer POL can be the first metal line 20) helps reduce the erosion of the main body portion 221 of the first metal line 20 by iodic acid and ensures the structural stability of the first metal line 20.

[0099] For example, when the first metal line 20 is a touch signal line, it can prevent problems such as changes in touch capacitance caused by iodic acid corrosion, or even breakage of the touch signal line, which is conducive to ensuring the realization of the touch function of the display panel 01.

[0100] Figure 10 This is a process flow diagram of a display panel manufacturing process provided in an embodiment of this application.

[0101] This application embodiment also provides a method for preparing a display panel 01, used to prepare the display panel 01 as described above, the structure of which can be as follows: Figures 1-9 As shown. Figure 10 As shown, the preparation method includes:

[0102] Step S1: Provide a substrate 10, and stack a first metal layer M1, a second metal layer M2 and a third metal layer M3 on one side of the substrate 10 to form the third layer 23, the initial second layer 22C and the first layer 21 of the first metal line 20, respectively.

[0103] That is, the first metal layer M1 can be used as the third layer 23 of the first metal line 20, the second metal layer M2 can be used as the initial second layer 22C of the first metal line 20, and the third metal layer M3 can be used as the first layer 21 of the first metal line 20.

[0104] Optionally, the first metal layer M1 and the third metal layer M3 are made of titanium, and the second metal layer M2 is made of aluminum.

[0105] Step S2: Inject gas into the sidewall of the initial second layer 22C. The gas reacts with the metal in the second metal layer M2 to form a metal compound, thus forming the second layer 22.

[0106] In this layer, a metal compound forms the protective portion 222 in the second layer 22, and the metal in the second metal layer M2 that has not reacted with the gas forms the main body portion 221 of the second layer 22.

[0107] Since the gas reacts with the metal at the sidewall of the initial second layer 22C to form a metal compound, the protective part 222 formed by the metal compound can cover at least part of the sidewall of the main body 221.

[0108] Optionally, in step S2, the center thickness of the metal compound is d1, where d1 > 20 nm. Here, the center thickness refers to the thickness of the metal compound at the middle position of the second metal layer M2 along the direction from the third metal layer M3 to the first metal layer M1.

[0109] Optionally, the gas can be a nitrogen-containing and / or fluorine-containing gas. For example, nitrogen, carbon tetrafluoride, sulfur hexafluoride, etc.

[0110] For example, since the second metal layer M2 may include aluminum as a material, the metal compound may be aluminum nitride or aluminum fluoride.

[0111] In the preparation method provided in the embodiments of this application, a protective part 222 containing a metal compound is provided to cover at least part of the sidewall 221A of the main body 221 in the second layer 22. The anti-corrosion properties of the metal compound can be used to protect the sidewall 221A of the main body 221, reduce the erosion of the main body 221 by corrosive materials from the side of the second layer 22, thereby improving the structural stability and conductivity of the first metal line 20.

[0112] Moreover, during the preparation of the second layer 22, the protective part 222 can be formed by injecting gas into the metal in the second layer 22, without the need to prepare an additional protective material on the side of the second layer 22. This simplifies the preparation process of the protective part 222 and reduces the preparation cost of the first metal line 20.

[0113] In one embodiment of this application, such as Figure 3 , Figure 4 As shown, the second layer 22 includes a first sublayer 2201 and a second sublayer 2202, which are connected in a direction Z perpendicular to the plane of the display panel 01. The first sublayer 2201 is located on the side of the second sublayer 2202 away from the substrate 10. The main body portion 221 of the first sublayer 2201 and the second sublayer 2202 may be made of the same material, such as the aforementioned aluminum. In the first direction X, the sidewall of the second sublayer 2202 protrudes beyond the sidewall of the first sublayer 2201.

[0114] like Figure 11 As shown, Figure 11 A process flow diagram for fabricating a display panel provided in this application embodiment, wherein before forming the second layer 22, the fabrication method further includes:

[0115] Step S21: Along the direction from the first layer 21 to the third layer 23, the gas reacts with the metal in the second metal layer M2 to form a metal compound of uneven thickness, forming an initial first sublayer 2201C and an initial second sublayer 2202C.

[0116] Specifically, the thickness D2 of the metal compound in the initial second sublayer 2202C is greater than the thickness D1 of the metal compound in the initial first sublayer 2201C. Of course, the minimum thickness of the metal compound in the initial second sublayer 2202C can be greater than the maximum thickness of the metal compound in the initial first sublayer 2201C. Here, the thickness of the metal compound refers to its thickness in the first direction X.

[0117] Optionally, the thickness of the metal compound gradually increases along the direction from the first layer 21 to the third layer 23. In step S21, the center thickness of the metal compound can be greater than 20 nm. Here, the center thickness refers to the thickness of the metal compound at the middle position of the second metal layer M2 along the direction from the first layer 21 to the third layer 23.

[0118] Step S22: Etch the initial first sublayer 2201C and the initial second sublayer 2202C to form the first sublayer 2201 and the second sublayer 2202.

[0119] In step S22, since the metal compound in the initial second sublayer 2202C is thicker, the metal in the initial second sublayer 2202C can be well protected by the metal compound, while the metal compound in the initial first sublayer 2201C is thinner, and the metal in the initial first sublayer 2201C can be etched in small amounts, so that the second sublayer 2202 formed in the first direction X protrudes from the first sublayer 2201.

[0120] In this embodiment, only a small amount of metal in the initial first sublayer 2201C is etched. In this way, the amount of metal etched in the second layer 22 can also be reduced, thereby improving the structural stability and conductivity of the first metal line 20.

[0121] Furthermore, the sidewalls of the second sublayer 2202 and the first sublayer 2201 are not on the same straight line. The second sublayer 2202 and the first sublayer 2201 can form a "step-like" structure, that is, the side of the second layer 22 can form a "step". Based on this arrangement, the side of the second layer 22 is relatively flat. When preparing subsequent film layers on the first metal line 20, the subsequent film layers can climb up the sidewall of the second sublayer 2202 to the sidewall of the first sublayer 2201, which is beneficial to improving the adhesion effect between the subsequent film layers and the side of the second layer 22, thereby further improving the film quality of the subsequent film layers.

[0122] Figure 12 This is a schematic diagram of a display device provided in an embodiment of this application.

[0123] This application embodiment also provides a display device 02, such as Figure 12 As shown, the display device 02 includes the display panel 01 as provided in the above embodiments. The display device 02 provided in this application embodiment can be as follows: Figure 12 The mobile phone shown can also be a computer, television, in-vehicle display, or other electronic device; this application does not impose any specific limitations.

[0124] In the display device 02, a protective part 222 containing a metal compound is provided to cover at least a portion of the sidewall 221A of the main body 221 in the second layer 22. This allows the anti-corrosion properties of the metal compound to protect the sidewall 221A of the main body 221, reducing the erosion of the main body 221 by corrosive materials from the side of the second layer 22. This, in turn, helps to improve the structural stability and conductivity of the first metal line 20.

[0125] Moreover, during the preparation of the second layer 22, the protective part 222 can be formed by injecting gas into the metal in the second layer 22, without the need to prepare an additional protective material on the side of the second layer 22. This simplifies the preparation process of the protective part 222 and reduces the preparation cost of the first metal line 20.

[0126] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A display panel, characterized in that, The device includes a substrate and a first metal line located on one side of the substrate. The first metal line includes a first layer, a second layer, and a third layer stacked together, with the second layer located between the first layer and the third layer. The second layer includes a main body and a protective portion, the protective portion comprising a metal compound, and along a first direction, the protective portion covers at least a portion of the sidewalls of the main body; Wherein, the first direction is parallel to the plane where the display panel is located, and points from the main body to the protective part; The first layer is located on the side of the third layer away from the substrate, and the thickness of the protective portion gradually increases along the first direction from the first layer to the third layer.

2. The display panel according to claim 1, characterized in that, The protective part includes at least one of metal nitride and metal fluoride.

3. The display panel according to claim 2, characterized in that, The main body comprises aluminum, and the protective part comprises at least one of aluminum nitride or aluminum fluoride.

4. The display panel according to claim 1, characterized in that, The protective part is located on the outside of the main body and is in contact with the side wall of the main body.

5. The display panel according to claim 4, characterized in that, Along the first direction, the protective portion covers the sidewall of the main body portion.

6. The display panel according to claim 1, characterized in that, The second layer includes a first sub-layer and a second sub-layer, the first sub-layer and the second sub-layer being connected in a direction perpendicular to the plane of the display panel, and the first sub-layer being located on the side of the second sub-layer away from the substrate; In the first direction, the sidewall of the second sublayer protrudes beyond the sidewall of the first sublayer.

7. The display panel according to claim 6, characterized in that, The second sublayer includes the main body and the protective portion, and along the first direction, the protective portion covers at least a portion of the sidewall of the main body.

8. The display panel according to claim 7, characterized in that, The first sub-layer includes the main body portion but does not include the protective portion.

9. The display panel according to claim 1, characterized in that, Both the first layer and the third layer are made of titanium.

10. The display panel according to claim 1, characterized in that, The first layer is located on the side of the third layer away from the substrate, and in the first direction, the third layer protrudes beyond the edge of the first layer.

11. The display panel according to claim 1, characterized in that, The center thickness of the protective part is d1, where d1 > 20 nm.

12. The display panel according to claim 1, characterized in that, It includes a display area and a non-display area, the non-display area surrounding at least a portion of the display area; the non-display area includes a first non-display area located on one side of the display area; The first metal line is located in the first non-display area.

13. The display panel according to claim 12, characterized in that, The first non-display area includes an organic layer clearance area, and at least a portion of the first metal line is located in the organic layer clearance area.

14. The display panel according to claim 12, characterized in that, The display panel further includes an encapsulation layer located on the side of the first metal line away from the substrate, along a direction perpendicular to the plane of the display panel, and the encapsulation layer at least partially overlaps with the first metal line.

15. The display panel according to claim 12, characterized in that, The first metal wire is a power signal wire.

16. The display panel according to claim 1, characterized in that, The display panel further includes a light-emitting layer, and the first metal line is located on the side of the light-emitting layer away from the substrate.

17. The display panel according to claim 16, characterized in that, The display panel also includes a polarizer located on the side of the first metal line away from the light-emitting layer.

18. The display panel according to claim 16, characterized in that, The first metal line is a touch signal line.

19. A method for manufacturing a display panel, characterized in that, The method for preparing a display panel as described in any one of claims 1-18 includes: The substrate is provided, and a first metal layer, a second metal layer and a third metal layer are stacked on one side of the substrate to form the third layer, the initial second layer and the first layer of the first metal line, respectively. Gas is injected into the sidewall of the initial second layer, and the gas reacts with the metal in the second metal layer to form a metal compound, thus forming the second layer.

20. The method according to claim 19, characterized in that, The gas is a nitrogen-containing and / or fluorine-containing gas.

21. The method according to claim 19, characterized in that, The second layer includes a first sublayer and a second sublayer, the first sublayer and the second sublayer being connected in a direction perpendicular to the plane of the display panel, the first sublayer being located on the side of the second sublayer away from the substrate, and in the first direction, the sidewall of the second sublayer protruding from the sidewall of the first sublayer; Before forming the second layer, the method further includes: Along the direction from the first layer to the third layer, the gas reacts with the metal in the second metal layer to form a metal compound of uneven thickness, forming an initial first sublayer and an initial second sublayer; the thickness of the metal compound in the initial second sublayer is greater than the thickness of the metal compound in the initial first sublayer; The initial first sublayer and the initial second sublayer are etched to form the first sublayer and the second sublayer.

22. A display device, characterized in that, Includes the display panel as described in any one of claims 1-18.

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