Display panel mother board, preparation method of display panel and display panel

Abstract

The invention provides a display panel mother board, a preparation method of the display panel and the display panel, relates to the technical field of display, and aims to improve the preparation efficiency and the preparation quality of the display panel mother board and further improve the yield of the display panel mother board. The display panel mother board comprises a rigid carrier plate; the flexible substrate is located on one side of the rigid carrier plate, and the flexible substrate comprises a screen body area and a cutting area; the screen body function layer is located on the side, away from the rigid carrier plate, of the flexible substrate, and the screen body function layer is located in the screen body area; the supporting structure and the screen body function layer are located on the same side of the flexible substrate, the supporting structure is located in the cutting area, and the supporting structure is located in the thickness direction of the flexible substrate. The maximum distance between the surface of the side, away from the flexible substrate, of the supporting structure and the flexible substrate is larger than the maximum distance between the surface of the side, away from the flexible substrate, of the screen body function layer and the flexible substrate.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a display panel motherboard, a method for preparing a display panel, and a display panel. Background Art

[0002] With the development and progress of display technologies such as flexible display panels, the requirements for the production efficiency and production quality of display panels and display devices have increased. The substrate of a flexible display panel is usually formed of a flexible material. The traditional production process of a flexible display panel is complex and costly. Summary of the invention

[0003] Based on this, the embodiments of the present application provide a display panel motherboard, a method for manufacturing a display panel, and a display panel, which can simplify the process and reduce costs.

[0004] According to a first aspect of an embodiment of the present application, a display panel motherboard is provided, comprising:

[0005] Rigid carrier board;

[0006] A flexible substrate is located on one side of the rigid carrier, and the flexible substrate includes a screen area and a cutting area;

[0007] A screen body functional layer is located on a side of the flexible substrate away from the rigid carrier, and the screen body functional layer is located in the screen body area;

[0008] A support structure, wherein the support structure and the screen functional layer are located on the same side of the flexible substrate, the support structure is located in the cutting area, and in the thickness direction of the flexible substrate, the maximum distance between the surface of the support structure away from the flexible substrate and the flexible substrate is greater than the maximum distance between the surface of the screen functional layer away from the flexible substrate and the flexible substrate.

[0009] In some embodiments, the support structure is located on the peripheral side of the screen functional layer.

[0010] In some embodiments, the support structure includes a plurality of spaced-apart sub-support structures;

[0011] Each of the sub-support structures is arranged around the screen body functional layer;

[0012] Optionally, each of the sub-support structures is evenly distributed around the screen body functional layer;

[0013] Optionally, the screen body functional layer includes at least one set of corners, and the sub-support structures are distributed at positions close to the corners;

[0014] Optionally, the support structure is an annular structure, and the annular structure is arranged around the screen body functional layer.

[0015] In some embodiments, the material of the support structure includes an organic material.

[0016] In some embodiments, the screen body functional layer includes a first encapsulation layer, an organic encapsulation layer, and a second encapsulation layer stacked in sequence along the thickness direction of the flexible substrate, the organic encapsulation layer is located on a side of the first encapsulation layer away from the flexible substrate, wherein the material of the organic encapsulation layer includes an organic material, and the viscosity of the organic material of the organic encapsulation layer is less than the viscosity of the organic material of the support structure;

[0017] Optionally, the screen body functional layer further includes an array film layer and a light-emitting layer, and the light-emitting layer is located between the array film layer and the first encapsulation layer.

[0018] In some implementations, the display panel motherboard further includes:

[0019] a first cofferdam structure, wherein the first cofferdam structure and the support structure are located on the same side of the flexible substrate, the first cofferdam structure is located in the cutting area, and the first cofferdam structure is arranged around the support structure;

[0020] Optionally, in the thickness direction of the flexible substrate, the orthographic projection of a surface of the first cofferdam structure away from the flexible substrate on the flexible substrate falls within the orthographic projection edge of a surface of the first cofferdam structure close to the flexible substrate on the flexible substrate.

[0021] In some implementations, the display panel motherboard further includes:

[0022] a second cofferdam structure, wherein the second cofferdam structure and the screen body functional layer are located on the same side of the flexible substrate, the second cofferdam structure is located in the screen body region, the second cofferdam structure is located between the first encapsulation layer of the screen body functional layer and the flexible substrate, an orthographic projection of the second cofferdam structure on the flexible substrate and an orthographic projection of the organic encapsulation layer of the screen body functional layer on the flexible substrate do not overlap, wherein the organic encapsulation layer is located on a side of the first encapsulation layer away from the flexible substrate;

[0023] Optionally, the second cofferdam structure includes a first sub-cofferdam structure and a second sub-cofferdam structure, the second sub-cofferdam structure is located at a side of the first sub-cofferdam structure close to the cutting area, a gap is provided between the first sub-cofferdam structure and the second sub-cofferdam structure, and in a thickness direction of the flexible substrate, a size of the first sub-cofferdam structure is smaller than a size of the second sub-cofferdam structure;

[0024] Optionally, in the thickness direction of the flexible substrate, a size of the first sub-dam structure is equal to a size of the second sub-dam structure.

[0025] According to a second aspect of an embodiment of the present application, a method for preparing a display panel motherboard is provided, comprising:

[0026] Provide a rigid carrier plate;

[0027] A flexible substrate is arranged on one side of the rigid carrier, wherein the flexible substrate comprises a screen area and a cutting area;

[0028] A screen body function layer and a support structure are formed on one side of the flexible substrate, the screen body function layer is located in the screen body area, the support structure and the screen body function layer are located on the same side of the flexible substrate, the support structure is located in the cutting area, and in the thickness direction of the flexible substrate, the maximum distance between the surface of the support structure away from the flexible substrate and the flexible substrate is greater than the maximum distance between the surface of the screen body function layer away from the flexible substrate and the flexible substrate;

[0029] turning over the flexible substrate;

[0030] Cutting and removing the flexible substrate and the supporting structure in the cutting area;

[0031] The rigid carrier plate is removed.

[0032] In some embodiments, forming a screen function layer on one side of the flexible substrate includes:

[0033] forming an array film layer on one side of the flexible substrate, wherein the array film layer is located in the screen body area;

[0034] forming a light-emitting functional layer on a side of the array film layer away from the flexible substrate;

[0035] forming a first encapsulation layer on a side of the light-emitting functional layer away from the flexible substrate;

[0036] forming an organic encapsulation layer on a side of the first encapsulation layer away from the flexible substrate;

[0037] A second encapsulation layer is formed on a side of the organic encapsulation layer away from the flexible substrate.

[0038] Optionally, forming a support structure on one side of the flexible substrate includes:

[0039] forming the supporting structure while forming an organic encapsulation layer on a side of the first encapsulation layer away from the flexible substrate;

[0040] The organic encapsulation layer and the support structure are formed by inkjet printing.

[0041] A third aspect of the embodiments of the present application provides a display panel, which is manufactured using the display panel motherboard as described in any one of the first aspects above, or manufactured using the display panel manufacturing method as described in any one of the second aspects above.

[0042] The display panel motherboard, the preparation method of the display panel and the display panel provided in the embodiment of the present application divide the flexible substrate into a screen area and a cutting area, and form a support structure in the cutting area, so that in the thickness direction of the flexible substrate, the maximum distance between the surface of the support structure away from the flexible substrate and the flexible substrate is greater than the maximum distance between the surface of the screen body functional layer away from the flexible substrate and the flexible substrate, so that when the flexible substrate is turned over for cutting, the flexible substrate can be supported by the support structure, so that the screen body functional layer is suspended relative to the cutting machine to avoid scratching the screen body functional layer. In addition, by dividing the flexible substrate into the screen body area and the cutting area, the support structure can be directly removed while cutting the cutting area, so that the process of the display panel motherboard can be saved, the preparation efficiency and preparation quality of the display panel motherboard can be improved, and the yield rate of the display panel motherboard can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 A schematic structural diagram of a display panel motherboard provided in an embodiment of the present application;

[0045] Figure 2 A schematic structural diagram of another display panel motherboard provided in an embodiment of the present application;

[0046] Figure 3 A schematic structural diagram of another display panel motherboard provided in an embodiment of the present application;

[0047] Figure 4 A schematic structural diagram of another display panel motherboard provided in an embodiment of the present application;

[0048] Figure 5 A schematic flow chart of a method for preparing a display panel motherboard provided in an embodiment of the present application;

[0049] Figure 6 A schematic structural diagram of a display panel provided in an embodiment of the present application.

[0050] Description of reference numerals:

[0051] 00-rigid carrier, 100-flexible substrate, 101-screen area, 102-cutting area, 200-screen functional layer, 201-array film layer, 202-light-emitting layer, 203-first encapsulation layer, 204-organic encapsulation layer, 205-second encapsulation layer, 300-support structure, 400-first cofferdam structure, 500-second cofferdam structure, 501-first sub-cofferdam structure, 502-second sub-cofferdam structure, L1-the maximum distance between the surface of the screen functional layer away from the flexible substrate and the flexible substrate, L2-the maximum distance between the surface of the support structure away from the flexible substrate and the flexible substrate, H1-the size of the first sub-cofferdam structure in the thickness direction of the flexible substrate, H2-the size of the second sub-cofferdam structure in the thickness direction of the flexible substrate, H3-the size of the first cofferdam structure in the thickness direction of the flexible substrate. DETAILED DESCRIPTION

[0052] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are provided in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0053] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0054] In this document, spatially related terms such as "upper" and "lower" are defined with reference to the accompanying drawings. Therefore, it will be understood that "upper" and "lower" are used interchangeably. It will be understood that when a layer is referred to as being "on" another layer, it can be directly formed on the other layer, or intervening layers may also be present. Therefore, it will be understood that when a layer is referred to as being "directly on" another layer, there are no intervening layers interposed therebetween.

[0055] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as being "on" another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be intervening layers. In addition, it is also understood that when a layer is referred to as being "between" two layers, the layer may be the only layer between the two layers, or there may be one or more intervening layers. In addition, the same reference numerals always represent the same elements.

[0056] Hereinafter, although terms such as "first", "second", etc. may be used to describe various components, these components are not necessarily limited to the above terms. The above terms are only used to distinguish one component from another component. It will also be understood that expressions used in the singular form include plural expressions, unless the expression in the singular form has a significantly different meaning in the context. In addition, in the following embodiments, it will also be understood that the terms "comprising" and / or "having" used herein illustrate the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0057] In the following embodiments, when a layer, region, or element is "connected", it can be interpreted that the layer, region, or element is not only directly connected but also connected through other constituent elements placed therebetween. For example, when a layer, region, element, etc. is described as being connected or electrically connected, the layer, region, element, etc. can be connected or electrically connected not only directly or directly, but also through another layer, region, element, etc. placed therebetween.

[0058] As used in the application documents, the term "and / or" includes any and all combinations of one or more of the related listed items. When a statement such as "at least one (one) of..." is placed after a list of elements (elements), it modifies the entire list of elements (elements), rather than modifying the individual elements (elements) in the list (elements).

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention pertains. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0060] It should also be understood that the terms “include / comprises” or “having” and the like specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0061] Although exemplary embodiments of display modules and display devices including display modules have been specifically described herein, many modifications and variations will be apparent to those skilled in the art. Therefore, it will be understood that display modules and display devices including display modules constructed in accordance with the principles of the present invention may be implemented in addition to those specifically described herein. The present application is also defined in the claims and their equivalents.

[0062] It should be noted that the substrate of the flexible display panel is usually formed of a flexible material. In the process of preparing the flexible display panel, a glass substrate formed of a hard material is usually used to provide support for the flexible substrate to improve the yield rate of subsequent film layer preparation. In order to further improve the preparation efficiency, a plurality of screen body functional layers are usually formed in different regions on the surface of a composite substrate formed by a larger hard substrate and a flexible substrate to obtain a display panel motherboard, and then the display panel motherboard is cut to obtain a plurality of separate display panels, thereby improving the preparation efficiency of the display panel. However, in the above-mentioned cutting process, it is usually necessary to flip the entire display panel motherboard, which will cause friction between the surface of the display panel motherboard and the cutting machine, thereby increasing the risk of scratches on the surface of the display panel motherboard.

[0063] Therefore, after the packaging layer is evaporated, a traditional display panel motherboard usually attaches a protective film to the surface of the packaging layer. After the display panel motherboard is cut, the protective film is mechanically peeled off. In addition, before cutting the display panel motherboard, it is usually necessary to use a carbon dioxide laser cutting process and an ultraviolet laser cutting process to cut the protective film in the cutting area in turn, and then turn the display panel motherboard over to obtain an independent display panel motherboard using a cutter wheel cutting process. However, the above method to prevent the packaging layer from being scratched will cause carbonization during the carbon dioxide laser cutting process, causing the screen to burn during the second laser cutting, affecting the preparation quality of the display panel motherboard, and also increasing the preparation process of preparing the protective film and peeling off the protective film, affecting the preparation efficiency of the display panel motherboard.

[0064] In view of this, the embodiments of the present application provide a display panel motherboard and a method for preparing the display panel motherboard, which can improve the preparation efficiency and preparation quality of the display panel motherboard, and further improve the yield rate of the display panel motherboard.

[0065] like Figure 1As shown, in the first aspect of the embodiment of the present application, a display panel motherboard is provided, comprising: a rigid carrier board 100, a flexible substrate 100, a screen body function layer 200 and a support structure 300. The flexible substrate 100 comprises a screen body area 101 and a cutting area 102; the screen body function layer 200 is located on one side of the flexible substrate 100, and the screen body function layer 200 is located in the screen body area 101; the support structure 300 and the screen body function layer 200 are located on the same side of the flexible substrate 100, and the support structure 300 is located in the cutting area 102. In the thickness direction of the flexible substrate 100, the maximum distance L2 between the surface of the support structure 300 on the side away from the flexible substrate 100 and the flexible substrate 100 is greater than the maximum distance L1 between the surface of the screen body function layer 200 on the side away from the flexible substrate 100 and the flexible substrate 100.

[0066] Exemplarily, in the thickness direction of the flexible substrate 100, the difference between the maximum distance L2 between the surface of the support structure 300 away from the flexible substrate 100 and the flexible substrate 100 and the maximum distance L1 between the surface of the screen body function layer 200 away from the flexible substrate 100 and the flexible substrate 100 is less than a preset threshold. This can prevent the screen body function layer 200 from being excessively suspended after flipping, resulting in poor stability of the display panel motherboard during the cutting process, thereby improving the cutting quality of the display panel motherboard, and can also prevent the distance between the surface of the screen body function layer 200 and the machine platform after flipping from being too close, resulting in an increased risk of scratching the surface of the screen body function layer 200.

[0067] The display panel motherboard provided in the embodiment of the present application divides the flexible substrate 100 into a screen body area 101 and a cutting area 102, forms a screen body function layer 200 in the screen body area 101, and forms a support structure 300 in the cutting area 102, so that in the thickness direction of the flexible substrate 100, the maximum distance L2 between the surface of the support structure 300 on the side away from the flexible substrate 100 and the flexible substrate 100 is greater than the maximum distance L1 between the surface of the screen body function layer 200 on the side away from the flexible substrate 100 and the flexible substrate 100, so that when the flexible substrate 100 is turned over for cutting, the flexible substrate 100 can be supported by the support structure 300, so that the screen body function layer 200 is suspended relative to the cutting machine table to avoid scratching the screen body function layer 200. In addition, by dividing the flexible substrate 100 into the screen area 101 and the cutting area 102, the support structure 300 can be directly removed while cutting the cutting area 102, thereby saving the display panel manufacturing process, improving the display panel manufacturing efficiency and manufacturing quality, and improving the display panel yield.

[0068] In some feasible implementations, the support structure 300 is located on the peripheral side of the screen body functional layer 200 .

[0069] The display panel motherboard provided in the embodiment of the present application can shorten the distance between the support structure 300 and the screen function layer 200 by setting the support structure 300 on the peripheral side of the screen function layer 200, further improve the supporting capacity of the support structure 300, and avoid the screen function layer 200 from being scratched by contact with the cutting machine during the flipping process, thereby improving the preparation quality and yield rate of the display panel motherboard.

[0070] like Figure 2 As shown, in some feasible implementations, the support structure 300 includes a plurality of sub-support structures that are spaced apart from each other; each sub-support structure is disposed around the screen body functional layer 200 .

[0071] The display panel motherboard provided in the embodiment of the present application can save the manufacturing cost of the display panel motherboard by arranging the sub-support structures at intervals, thereby further improving the economy of the display panel motherboard.

[0072] like Figure 2 As shown, in some feasible implementations, each sub-support structure is evenly distributed around the screen body functional layer 200 .

[0073] The display panel motherboard provided in the embodiment of the present application can improve the stability of the support structure 300 supporting the screen functional layer 200 by evenly arranging the sub-support structures, and can further improve the cutting quality of the display panel motherboard during the cutting process, thereby improving the preparation quality and preparation efficiency of the display panel motherboard.

[0074] like Figure 3 As shown, in some feasible implementations, the screen body functional layer 200 includes at least one group of corners, and the sub-support structures are distributed at positions close to the corners.

[0075] It should be noted that the display panel usually has a chamfer, and the sub-support structure can be arranged opposite to the chamfer of the screen body function layer 200 .

[0076] The display panel motherboard provided in the embodiment of the present application further reduces the number of sub-support structures, reduces the area of ​​the cutting area 102, and improves the space utilization rate of the flexible substrate 100 based on the structural hardness of the screen body function layer 200, thereby improving the economy of the display panel motherboard. At the same time, it can avoid the angle formed by the intersecting adjacent edges of the screen body function layer 200 from being suspended during the cutting process, improve the stability during the cutting process, and improve the preparation quality of the display panel.

[0077] like Figure 4 As shown, in some feasible implementations, the support structure 300 is an annular structure, and the annular structure is arranged around the screen body functional layer 200.

[0078] The display panel motherboard provided in the embodiment of the present application can improve the supporting effect of the support structure 300 by surrounding the screen functional layer 200 through the annular support structure 300, so that the stress on both sides of different positions of the cutting area 102 is the same, avoiding uneven force at different positions in the cutting area 102 during the cutting process, thereby further improving the stability during the cutting process and improving the preparation quality of the display panel.

[0079] In some possible implementations, the material of the support structure 300 includes an organic material.

[0080] The display panel motherboard provided in the embodiment of the present application forms a support structure 300 through organic materials, which can make the support structure 300 have a certain flexibility, further improve the stability during the cutting process, and balance the vibration of the screen functional layer 200 caused by the cutting process, thereby improving the preparation quality of the display panel motherboard.

[0081] In some feasible embodiments, the screen body functional layer 200 includes a first encapsulation layer 203, an organic encapsulation layer 204, and a second encapsulation layer 205 stacked in sequence along the thickness direction of the flexible substrate 100, and the organic encapsulation layer 204 is located on the side of the first encapsulation layer 203 away from the flexible substrate 100, wherein the material of the organic encapsulation layer 204 includes an organic material, and the viscosity of the organic material of the organic encapsulation layer 204 is less than the viscosity of the organic material of the support structure 300, and the screen body functional layer 200 also includes an array film layer 201 and a light-emitting layer 202, and the light-emitting layer 202 is located between the array film layer 201 and the first encapsulation layer 203.

[0082] In the display panel motherboard provided in the embodiment of the present application, the viscosity of the organic material of the organic encapsulation layer 204 is less than the viscosity of the organic material of the support structure 300. Under the action of surface tension, the maximum distance L2 between the surface of the support structure 300 formed by the organic material away from the flexible substrate 100 and the flexible substrate 100 can be greater than the maximum distance L1 between the surface of the screen function layer 200 away from the flexible substrate 100 and the flexible substrate 100, so that the organic encapsulation layer 204 and the support structure 300 can be formed simultaneously, which can reduce the difficulty of preparing the display panel motherboard and improve the preparation quality and efficiency of the display panel motherboard.

[0083] In some feasible embodiments, the display panel motherboard also includes: a first cofferdam structure 400 , the first cofferdam structure 400 and the support structure 300 are located on the same side of the flexible substrate 100 , the first cofferdam structure 400 is located in the cutting area 102 , and the first cofferdam structure 400 is arranged around the support structure 300 .

[0084] The display panel motherboard provided in the embodiment of the present application can limit the support structure 300 by setting the first cofferdam structure 400, so that the support structure 300 can be formed by inkjet printing or the like. At the same time, when the support structure 300 is formed by inkjet printing or the like, the surface tension of the liquid can be used to form a support structure 300 in which the maximum distance L1 between the surface of the screen body functional layer 200 on the side away from the flexible substrate 100 and the flexible substrate 100 is greater than the dimension H3 of the first cofferdam structure 400 in the thickness direction of the flexible substrate 100, thereby improving the preparation efficiency and preparation quality of the display panel motherboard.

[0085] In some feasible embodiments, in the thickness direction of the flexible substrate 100 , the orthographic projection of the surface of the first cofferdam structure 400 away from the flexible substrate 100 on the flexible substrate 100 falls within the orthographic projection edge of the surface of the first cofferdam structure 400 close to the flexible substrate 100 on the flexible substrate 100 .

[0086] The display panel motherboard provided in the embodiment of the present application can increase the surface area of ​​the support structure 300 away from the flexible substrate 100 by setting a first cofferdam structure 400 that is small at the top and large at the bottom, thereby increasing the supporting capacity of the support structure 300, further increasing the stability during the cutting process, improving the preparation quality of the display panel motherboard, and reducing the volume of the support structure 300 within the first cofferdam structure 400, saving the preparation cost of the support structure 300, and further improving the economy of the display panel motherboard.

[0087] In some feasible embodiments, the display panel motherboard also includes: a second cofferdam structure 500, the second cofferdam structure 500 and the screen body functional layer 200 are located on the same side of the flexible substrate 100, the second cofferdam structure 500 is located in the screen body area 101, the second cofferdam structure 500 is located between the first encapsulation layer 203 of the screen body functional layer 200 and the flexible substrate 100, the orthographic projection of the second cofferdam structure 500 on the flexible substrate 100 and the orthographic projection of the organic encapsulation layer 204 of the screen body functional layer 200 on the flexible substrate 100 do not overlap, wherein the organic encapsulation layer 204 is located on the side of the first encapsulation layer 203 away from the flexible substrate 100.

[0088] The display panel motherboard provided in the embodiment of the present application can limit the organic encapsulation layer 204 through the second cofferdam structure 500 to prevent the organic material used to prepare the organic encapsulation layer 204 from overflowing, thereby improving the preparation quality of the display panel motherboard.

[0089] In some feasible embodiments, the second cofferdam structure 500 includes a first sub-cofferdam structure 501 and a second sub-cofferdam structure 502, wherein the second sub-cofferdam structure 502 is located on a side of the first sub-cofferdam structure 501 close to the cutting area 102, and there is a gap between the first sub-cofferdam structure 501 and the second sub-cofferdam structure 502, and in the thickness direction of the flexible substrate 100, the size H1 of the first sub-cofferdam structure 501 is smaller than the size H2 of the second sub-cofferdam structure 502.

[0090] The display panel motherboard provided in the embodiment of the present application limits the organic encapsulation layer 204 through the first sub-cofferdam structure 501, and can further prevent overflow of the organic material through the second sub-cofferdam structure 502, which can further improve the preparation quality of the display panel motherboard.

[0091] In some feasible implementations, in the thickness direction of the flexible substrate 100 , a size H3 of the first cofferdam structure 400 is equal to a size H2 of the second sub-cofferdam structure 502 .

[0092] The display panel motherboard provided in the embodiment of the present application can simultaneously form a first cofferdam structure 400 and a second sub-cofferdam structure 502. The second sub-cofferdam structure 502 can be used to prevent the organic material of the organic encapsulation layer 204 from overflowing. The first cofferdam structure 400 can be used to limit the support structure 300. At the same time, the first cofferdam structure 400 can be used to provide an initial height for the support structure 300, so as to utilize the surface tension of the organic material to form a support structure 300 having a size larger than that of the screen body functional layer 200 in the thickness direction of the flexible substrate 100, thereby improving the preparation quality and preparation efficiency of the display panel motherboard.

[0093] According to a second aspect of an embodiment of the present application, a method for preparing a display panel motherboard is provided, comprising:

[0094] Step S110: providing a rigid carrier board.

[0095] Step S120: Dispose a flexible substrate on one side of the rigid carrier board, wherein the flexible substrate includes a screen area and a cutting area.

[0096] Step S130: forming a screen function layer and a support structure on one side of the flexible substrate, wherein the screen function layer is located in the screen area, the support structure and the screen function layer are located on the same side of the flexible substrate, the support structure is located in the cutting area, and in the thickness direction of the flexible substrate, the maximum distance between the surface of the support structure away from the flexible substrate and the flexible substrate is greater than the maximum distance between the surface of the screen function layer away from the flexible substrate and the flexible substrate.

[0097] Step S140: turning over the flexible substrate.

[0098] Step S150: cutting and removing the flexible substrate and the supporting structure in the cutting area.

[0099] Step S160: removing the rigid carrier board.

[0100] It should be noted that, in the process of forming the screen body functional layer and the supporting structure on one side of the flexible substrate, the preparation order of the screen body functional layer and the supporting structure does not distinguish between the first and the last order.

[0101] The method for preparing a display panel provided in an embodiment of the present application divides a flexible substrate 100 into a screen body area 101 and a cutting area 102, forms a screen body function layer 200 in the screen body area 101, and forms a support structure 300 in the cutting area 102, so that in the thickness direction of the flexible substrate 100, the size of the support structure 300 is larger than the size of the screen body function layer 200, so that when the flexible substrate 100 is turned over for cutting, the flexible substrate 100 can be supported by the support structure 300, so that the screen body function layer 200 is suspended relative to the cutting machine table to avoid scratching the screen body function layer 200. In addition, by dividing the flexible substrate 100 into the screen body area 101 and the cutting area 102, the support structure 300 can be directly removed while cutting the cutting area 102, so that the process of the display panel motherboard can be saved, the preparation efficiency and preparation quality of the display panel motherboard can be improved, and the yield rate of the display panel motherboard can be improved.

[0102] In some feasible implementations, a screen function layer is formed on one side of the flexible substrate, including:

[0103] Step S210 , forming an array film layer 201 on one side of the flexible substrate 100 , wherein the array film layer 201 is located in the screen body area 101 .

[0104] Step S220 , forming a light-emitting functional layer on a side of the array film layer 201 away from the flexible substrate 100 .

[0105] Step S230 , forming a first encapsulation layer 203 on a side of the light-emitting functional layer away from the flexible substrate 100 .

[0106] Step S240 , forming an organic encapsulation layer 204 on a side of the first encapsulation layer 203 away from the flexible substrate 100 .

[0107] Step S250 , forming a second encapsulation layer 205 on a side of the organic encapsulation layer 204 away from the flexible substrate 100 .

[0108] For example, the materials of the first encapsulation layer 203 and the second encapsulation layer 205 may include inorganic materials.

[0109] The method for preparing a display panel provided in an embodiment of the present application can prevent external water and oxygen from entering the interior of the display panel motherboard by forming a first encapsulation layer 203, thereby avoiding affecting the light-emitting elements, conductive structures, transistors, etc. of the display panel motherboard, thereby improving the reliability, safety, and stability of the display panel motherboard, and improving the display effect of the display screen and the display performance of the display panel motherboard. The organic encapsulation layer 204 formed by organic materials can form a flexible package of the display panel motherboard, and the second encapsulation layer 205 can prevent external water vapor and oxygen from entering the organic encapsulation layer 204, thereby improving the encapsulation quality of the display panel motherboard.

[0110] In some feasible embodiments, the support structure 300 is formed on one side of the flexible substrate 100, including: forming the organic encapsulation layer 204 and the support structure 300 at the same time on the side of the first encapsulation layer 203 away from the flexible substrate 100; the organic encapsulation layer 204 and the support structure 300 are formed by inkjet printing.

[0111] The method for preparing a display panel provided in an embodiment of the present application forms a support structure 300 by inkjet printing, and can utilize the surface tension of the liquid to naturally form the support structure 300 on one side of the flexible substrate 100, thereby reducing the difficulty of preparing the support structure 300 and further improving the preparation efficiency of the display panel motherboard.

[0112] In some feasible implementations, the support structure 300 and the organic encapsulation layer 204 are prepared simultaneously.

[0113] The method for preparing a display panel provided in an embodiment of the present application can reduce the difficulty of preparing a display panel motherboard, save the preparation process of the display panel motherboard, and improve the preparation efficiency of the display panel motherboard by simultaneously preparing the support structure 300 and the organic encapsulation layer 204.

[0114] like Figure 6 As shown, a third aspect of an embodiment of the present application provides a display panel, which is made using a display panel motherboard as described in any one of the first aspects above, or is made using a display panel making method as described in any one of the second aspects above.

[0115] The display panel provided in the embodiment of the present application is formed by dividing the flexible substrate 100 into a screen body area 101 and a cutting area 102, forming a screen body function layer 200 in the screen body area 101, and forming a support structure 300 in the cutting area 102, so that in the thickness direction of the flexible substrate 100, the size of the support structure 300 is larger than the size of the screen body function layer 200, so that when the flexible substrate 100 is turned over for cutting, the flexible substrate 100 can be supported by the support structure 300, so that the screen body function layer 200 is suspended relative to the cutting machine table to avoid scratching the screen body function layer 200. In addition, by dividing the flexible substrate 100 into the screen body area 101 and the cutting area 102, the support structure 300 can be directly removed while cutting the cutting area 102, so that the process of the display panel can be saved, the preparation efficiency and preparation quality of the display panel can be improved, and the yield rate of the display panel can be improved.

[0116] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0117] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0118] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A display panel motherboard, characterized in that: include: Rigid carrier board; A flexible substrate is located on one side of the rigid carrier, and the flexible substrate includes a screen area and a cutting area; A screen body functional layer is located on a side of the flexible substrate away from the rigid carrier, and the screen body functional layer is located in the screen body area; A support structure, wherein the support structure and the screen functional layer are located on the same side of the flexible substrate, the support structure is located in the cutting area, and in the thickness direction of the flexible substrate, the maximum distance between the surface of the support structure away from the flexible substrate and the flexible substrate is greater than the maximum distance between the surface of the screen functional layer away from the flexible substrate and the flexible substrate.

2. The display panel motherboard according to claim 1, characterized in that: The supporting structure is located on the peripheral side of the screen body functional layer.

3. The display panel motherboard according to claim 2, characterized in that: The support structure includes a plurality of sub-support structures arranged at intervals; Each of the sub-support structures is arranged around the screen body functional layer; Optionally, each of the sub-support structures is evenly distributed around the screen body functional layer; Optionally, the screen body functional layer includes at least one set of corners, and the sub-support structures are distributed at positions close to the corners; Optionally, the support structure is an annular structure, and the annular structure is arranged around the screen body functional layer.

4. The display panel motherboard according to claim 1, characterized in that: The material of the support structure includes organic material.

5. The display panel motherboard according to claim 4, characterized in that: The screen body functional layer comprises a first encapsulation layer, an organic encapsulation layer, and a second encapsulation layer which are sequentially stacked along the thickness direction of the flexible substrate, wherein the organic encapsulation layer is located on a side of the first encapsulation layer away from the flexible substrate, wherein the material of the organic encapsulation layer comprises an organic material, and the viscosity of the organic material of the organic encapsulation layer is less than the viscosity of the organic material of the support structure; Optionally, the screen body functional layer further includes an array film layer and a light-emitting layer, and the light-emitting layer is located between the array film layer and the first encapsulation layer.

6. The display panel motherboard according to claim 1, characterized in that: Also includes: a first cofferdam structure, wherein the first cofferdam structure and the support structure are located on the same side of the flexible substrate, the first cofferdam structure is located in the cutting area, and the first cofferdam structure is arranged around the support structure; Optionally, in the thickness direction of the flexible substrate, the orthographic projection of a surface of the first cofferdam structure away from the flexible substrate on the flexible substrate falls within the orthographic projection edge of a surface of the first cofferdam structure close to the flexible substrate on the flexible substrate.

7. The display panel motherboard according to claim 6, characterized in that: Also includes: a second cofferdam structure, wherein the second cofferdam structure and the screen body functional layer are located on the same side of the flexible substrate, the second cofferdam structure is located in the screen body region, the second cofferdam structure is located between the first encapsulation layer of the screen body functional layer and the flexible substrate, an orthographic projection of the second cofferdam structure on the flexible substrate and an orthographic projection of the organic encapsulation layer of the screen body functional layer on the flexible substrate do not overlap, wherein the organic encapsulation layer is located on a side of the first encapsulation layer away from the flexible substrate; Optionally, the second cofferdam structure includes a first sub-cofferdam structure and a second sub-cofferdam structure, the second sub-cofferdam structure is located at a side of the first sub-cofferdam structure close to the cutting area, a gap is provided between the first sub-cofferdam structure and the second sub-cofferdam structure, and in a thickness direction of the flexible substrate, a size of the first sub-cofferdam structure is smaller than a size of the second sub-cofferdam structure; Optionally, in the thickness direction of the flexible substrate, a size of the first sub-dam structure is equal to a size of the second sub-dam structure.

8. A method for preparing a display panel, characterized in that: include: Provide a rigid carrier plate; A flexible substrate is arranged on one side of the rigid carrier, wherein the flexible substrate comprises a screen area and a cutting area; A screen body function layer and a support structure are formed on one side of the flexible substrate, the screen body function layer is located in the screen body area, the support structure and the screen body function layer are located on the same side of the flexible substrate, the support structure is located in the cutting area, and in the thickness direction of the flexible substrate, the maximum distance between the surface of the support structure away from the flexible substrate and the flexible substrate is greater than the maximum distance between the surface of the screen body function layer away from the flexible substrate and the flexible substrate; turning over the flexible substrate; Cutting and removing the flexible substrate and the supporting structure in the cutting area; The rigid carrier plate is removed.

9. The method for preparing a display panel according to claim 8, characterized in that: The screen function layer is formed on one side of the flexible substrate, comprising: forming the supporting structure while forming an organic encapsulation layer on a side of the first encapsulation layer away from the flexible substrate; The organic encapsulation layer and the support structure are formed by inkjet printing.

10. A display panel, characterized in that: include: The display panel is manufactured by using the display panel motherboard according to any one of claims 1 to 7, or manufactured by using the display panel manufacturing method according to any one of claims 8 to 9.

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