Distributed state monitoring system for airborne multifunctional display equipment

Abstract

The invention provides a distributed state monitoring system for airborne multifunctional display equipment, and belongs to the technical field of system monitoring, and the system specifically comprises a plurality of board card level monitoring modules which are located on all board cards to which the equipment belongs, and are used for monitoring the operation states of the board cards and outputting monitoring data; the equipment-level monitoring module is located on one board card to which the equipment belongs, the equipment-level monitoring module is used for monitoring the running state of the board card where the equipment-level monitoring module is located, and meanwhile the equipment-level monitoring module is used for collecting monitoring data of the board card-level monitoring module of the equipment where the equipment-level monitoring module is located; and the system-level monitoring module is used for collecting monitoring data of the device-level detection module on each device and evaluating the working performance and state of the system. While the system monitoring is realized, the workload of the main system is reduced, the coupling between the working application and the monitoring application is reduced, and the diagnosis efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of system monitoring, and in particular to a distributed status monitoring system for airborne multi-function display devices. Background Art

[0002] At present, the board-level monitoring of airborne displays is based on existing circuits, adding discrete quantity indications, and collecting and collecting through the main control CPU to feedback the functional status of the module, and then obtain the working status of the whole machine. With the increasing complexity of airborne display systems and equipment, the diversification of functional modules, and the specificity of functions, the requirements for system self-diagnosis, auxiliary diagnosis and diagnosis time are further deepened. Simple discrete quantity information collection and feedback can no longer meet the system-level information status collection and system rapid diagnosis requirements. Summary of the invention

[0003] In view of this, the present application provides a distributed status monitoring system for airborne multi-function display devices, which solves the problems in the prior art, realizes system monitoring, reduces the workload of the main system, reduces the coupling between working applications and monitoring applications, and improves diagnostic efficiency.

[0004] The present application provides a distributed status monitoring system for airborne multi-function display devices using the following technical solutions:

[0005] A distributed status monitoring system for airborne multi-function display equipment, comprising:

[0006] A plurality of board-level monitoring modules are located on each board to which the device belongs, and the board-level monitoring modules are used to monitor the running status of the board and output monitoring data;

[0007] A device-level monitoring module is located on one of the boards to which the device belongs. The device-level detection module is used to monitor the operating status of the board to which it belongs, and is used to collect monitoring data of the board-level monitoring module of the device to which it belongs;

[0008] The system-level monitoring module is used to collect the monitoring data of the device-level detection modules on each device, and classify and store the collected information according to different protocols and addresses. The system-level monitoring module evaluates the system working performance and status based on the monitoring data and working status reported by each device-level monitoring module;

[0009] Each board-level monitoring module and device-level monitoring module has an independent address code.

[0010] Optionally, the board-level monitoring module and the device-level detection module both include an information monitoring processing core, a sensor group, a control group, and a communication group;

[0011] The sensor group is used to monitor the operating status of each device on the board and output the operating status to the information monitoring processing core;

[0012] The information monitoring processing core analyzes the collected operating status information and issues control instructions to the control group. The information monitoring processing core of the board-level monitoring module is used to issue control instructions to the control group after receiving control instructions from the upper-level module.

[0013] The control group receives the control instructions of the information monitoring processing core of the board or the control instructions of the main control CPU of the board to control the operating parameters of the corresponding device;

[0014] The communication group of the board-level monitoring module and the communication group of the device-level detection module communicate to realize data transmission between the board-level monitoring module and the device-level detection module;

[0015] The device-level detection module communication group is used to communicate with the system-level monitoring module, and the device-level detection module communication group is used to send monitoring data to the system-level monitoring module.

[0016] Optionally, the information monitoring processing core communicates with the main control CPU of the board through a serial port, and the information monitoring processing core obtains the performance status of the main control CPU.

[0017] Optionally, the board-level monitoring module and the device-level detection module both further include an inherent information group, and the inherent information group is used to store product information of the board.

[0018] Optionally, the sensor group includes a temperature sensor, a current sensor, a voltage sensor, a vibration sensor and a rotation speed sensor.

[0019] Optionally, the control group includes a power control unit and a temperature control unit.

[0020] Optionally, the information monitoring processing core includes two processing cores, the two processing cores are interconnected, the two processing cores are communicated with the sensor group on the board where they are located, the two processing cores are communicated with the main control CPU on the board where they are located, the two processing cores are communicated with the control group on the board where they are located, and the two processing cores of the board-level monitoring module are communicated with the communication group on the board where they are located.

[0021] Optionally, one of the processing cores is used as the main processing core, and the other processing core is used as the backup processing core. After the system is powered on, the main processing core and the backup processing core communicate with the main control CPU on the board through the communication bus. If there is no abnormality, the main processing core and the backup processing core negotiate, and the main processing core completes the communication with the main control CPU, and sends the running status information of the board to the outside through the communication group;

[0022] If the communication between the main processing core and the main control CPU is abnormal;

[0023] The standby processing core takes over the main processing core, completes the communication with the main control CPU, and sends the running status information of the board to the outside through the communication group.

[0024] Optionally, one of the processing cores is used to collect information from the sensor group and send the collected information to another processing core, and the other processing core is used to package the data and send the data outward through the communication group.

[0025] In summary, this application includes the following beneficial technical effects:

[0026] This application proposes a board-level distributed monitoring system based on a modular architecture and independent of the main system functions. The system uses an embedded MCU as the processing core to form an intelligent monitoring core based on multiple sensors and simple control functions. Through bus multiplexing technology, a distributed monitoring network distributed throughout the entire machine or even the entire system is formed. Without occupying the resources of the main control system, the working status of each board and device can be obtained in real time and accurately, thereby realizing system status monitoring, auxiliary fault location and diagnosis, system performance evaluation and other functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 This is a principle block diagram of a distributed status monitoring system for airborne multi-function display equipment in this application;

[0029] Figure 2 This is a block diagram of the communication principle between the board-level monitoring module and the device-level monitoring module of this application;

[0030] Figure 3 This is a block diagram of the communication principle of the two processing cores of the device-level monitoring module of this application. DETAILED DESCRIPTION

[0031] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0032] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0033] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0034] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The illustrations only show the components related to the present application rather than being drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0035] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0036] An embodiment of the present application provides a distributed status monitoring system for an airborne multi-function display device.

[0037] like Figure 1 As shown, a distributed status monitoring system for airborne multi-function display equipment includes:

[0038] A plurality of board-level monitoring modules are located on each board belonging to the device, and the board-level monitoring modules are used to monitor the running status of the board and output monitoring data.

[0039] The device-level monitoring module is located on one of the boards to which the device belongs. The device-level detection module is used to monitor the operating status of the board to which it is located. At the same time, the device-level detection module is used to collect monitoring data of the board-level monitoring module of the device.

[0040] The system-level monitoring module is used to collect the monitoring data of the device-level detection modules on each device, and classify and store the collected information according to different protocols and addresses. The system-level monitoring module evaluates the system working performance and status based on the monitoring data and working status reported by each device-level monitoring module.

[0041] Each board-level monitoring module and device-level monitoring module has an independent address code.

[0042] The board-level monitoring module and the device-level detection module both include an information monitoring processing core, a sensor group, a control group and a communication group.

[0043] like Figure 2 As shown, the monitoring circuit of the card-level monitoring module and the device-level detection module is based on the MCU. The data collection and simple function control of the main function circuit are realized through the sensors and control interfaces deep into the main function circuit of the board. The increase or decrease of related collection circuits will not affect the main function circuit.

[0044] The information monitoring processing core analyzes the collected running status information and issues control instructions to the control group. The information monitoring processing core of the board-level monitoring module is used to issue control instructions to the control group after receiving the control instructions of the upper module; the information monitoring processing core and the main control CPU of the board communicate through the serial port, and the information monitoring processing core obtains the performance status of the main control CPU. Finally, the information monitoring processing core of the board-level monitoring module sends the collected detection data to the device-level monitoring module through the board-level communication bus according to the communication protocol, that is, the monitoring data collected by the board-level monitoring module enters the monitoring communication network, and the device-level monitoring module sends the collected monitoring data to the monitoring of the system-level monitoring module through the communication bus, that is, the monitoring data collected by the device-level monitoring module enters the monitoring communication network. In one embodiment, the processor of the information monitoring processing core uses the HWD32 processor, the core of which uses the Cortex-M3, the highest main frequency reaches 72MHz, has a hardware divider, a built-in 256KB memory, 2 12-bit digital-to-analog converters, 16 channels, etc. These characteristics of the processor can fully support its requirements as the main processor of the board-level monitoring circuit. Secondly, the processor has communication interfaces such as SPI, IIC, and UART, and uses a 64-pin small package chip, which is conducive to its integrated wiring with the monitored circuit. The interface expansion part only needs simple circuit processing to complete the function, among which pins 26 and 27 are used as address identification bits through pull-up and pull-down resistors.

[0045] Among them, the serial communication in the embodiment of the present application adopts an extended two-way RS232 interface, one for debugging, and the other for the information monitoring processing core to communicate with the main control CPU to obtain the working status, load conditions, etc. of the main control CPU.

[0046] The sensor group is used to monitor the operating status of each device on the board and output the operating status to the information monitoring processing core. The sensor group includes a temperature sensor, a current sensor, a voltage sensor, a vibration sensor and a speed sensor. Among them, the temperature sensor is responsible for collecting temperature data of sensitive areas on the board, and the current and voltage sensor is responsible for collecting the input current and voltage of the board and the current and voltage of the core components. The temperature sensor adopts the domestic JF590, which can provide temperature measurement from -55°C to 125°C, and the error is not more than ±5°C. This design provides two-way temperature measurement, one for board-level ambient temperature measurement, and one for the temperature measurement of the board main control CPU or the main heating period. The voltage sensor is a voltage acquisition circuit. Taking the 12V voltage acquisition circuit as an example, the voltage divider circuit is used to divide the 12V voltage proportionally, and the post-stage follower circuit ensures the stability of the voltage. The stabilized voltage is output to the AD of HWD32 for quantitative sampling. The sampling accuracy requirement is ±0.1V. The embodiment of the present application is designed with 4 voltage acquisition interfaces, of which three are conventional voltage acquisition interfaces, namely 12V, 5V and 3.3V of the power supply circuit, and one is reserved for collecting the core voltage of the main control CPU. The current sensor is a current acquisition circuit. Taking 5V current as an example, the embodiment of the present application adopts a domestic Hall sensor to collect the board-level current and uses the Hall sensor for current measurement. First, it will not affect the measurement circuit. Secondly, its power consumption loss can be ignored. Finally, its current measurement principle determines that a very small device can be used to complete the measurement of large currents, and device damage will not affect the operation of the main circuit.

[0047] The control group receives the control instructions of the information monitoring processing core of the board or the control instructions of the main control CPU of the board to control the operating parameters of the corresponding device; the control group includes a power control unit and a temperature control unit. Among them, the power control GPIO can realize the power on and off operation at the module level.

[0048] The communication group of the board-level monitoring module and the communication group of the device-level detection module communicate to realize data transmission between the board-level monitoring module and the device-level detection module; the communication group of the device-level detection module is used to communicate with the system-level monitoring module, and the communication group of the device-level detection module is used to send monitoring data to the system-level monitoring module.

[0049] In this application, the board-level monitoring module serves as the basis of the entire distributed monitoring network. It has an independent address code and is deployed on each board-level functional module. The card-level monitoring module has basic functions such as temperature measurement, voltage and current monitoring, and power control. It can output control action instructions or alarm prompt instructions based on the instruction requirements of the upper-level module node or the monitoring results of this level. At the same time, the information monitoring processing core of the card-level monitoring module has a communication interface with the main control processor on the board-level functional module, which can obtain the load status of the main control CPU, the consumption of system resources, and whether the main functions of the board-level module are complete in real time.

[0050] The device-level monitoring module can be mounted on a certain functional board, or a dedicated board can be added independently; the device-level monitoring module and the board-level monitoring module have the same design and also have independent address coding; the main difference between the device-level monitoring module and the board-level monitoring module is that the device-level monitoring module, while collecting the working information of the board where it is located, also needs to feed back the working information of this board and other boards to the system-level monitoring module through the bus network. Therefore, the interface design of the device-level monitoring module adds an external data exchange bus interface compared to the board-level monitoring module. In addition, the device-level monitoring node can increase or decrease the number of external monitoring targets as needed.

[0051] The system-level monitoring module is used to collect, store, and analyze the monitoring data summarized by each node. It classifies and stores the collected information according to different protocols and addresses, and evaluates the system's working performance and status based on the monitoring data and working status reported by each node.

[0052] The board-level monitoring module and the device-level detection module both include an inherent information group, which is used to store the product information of the board. The board-level monitoring module and the device-level detection module are provided with an EEPROM with an IIC interface for storing the inherent information of the board. Through relevant instructions, the main control CPU can obtain the inherent information of the board.

[0053] The board-level monitoring module and the device-level detection module both further include a reference voltage circuit, which provides a high-precision 2.5V reference voltage for an AD conversion circuit of a processor HWD32 of the information monitoring processing core.

[0054] like Figure 3 As shown, in one embodiment, the information monitoring processing core includes two processing cores, the two processing cores are monitoring CPU1 and monitoring CPU2, the two processing cores are interconnected, the two processing cores are both communicated with the sensor group on the board where they are located, the two processing cores are both communicated with the main control CPU on the board where they are located, the two processing cores are both communicated with the control group on the board where they are located, and the two processing cores of the board-level monitoring module are both communicated with the communication group on the board where they are located.

[0055] For the two processing cores of the board-level monitoring module, external communication is only carried out between boards through the board-level communication bus of the communication group.

[0056] For the two processing cores of the device-level monitoring module, external communication includes communication between boards through the board-level communication bus of the communication group, which is responsible for collecting information sent by the board-level monitoring module. It also includes communication with the system-level monitoring module through the device-level communication bus of the communication group, and sending the operating status information of all boards to the system-level monitoring module.

[0057] One of the processing cores is used as the main processing core, and the other processing core is used as the standby processing core. After the system is powered on, the main processing core and the standby processing core communicate with the main control CPU on the board through the communication bus. If there is no abnormality, the main processing core and the standby processing core negotiate, and the main processing core completes the communication with the main control CPU, and sends the running status information of the board through the communication group. If the communication between the main processing core and the main control CPU is abnormal, the standby processing core takes over the main processing core, and the standby processing core completes the communication with the main control CPU, and sends the running status information of the board through the communication group. In one embodiment, initially, the monitoring CPU1 is used as the main processing core, and the monitoring CPU2 is used as the standby processing core.

[0058] One of the processing cores is used to collect information from the sensor group and send the collected information to another processing core, and the other processing core is used to package the data and send it out through the communication group.

[0059] In the embodiment of the present application, the information monitoring and processing core has four working modes, namely: 1. The monitoring CPU1 works as the main processing core, and the monitoring CPU2 works as the backup processing core in hot standby; 2. The monitoring CPU2 works as the main processing core, and the monitoring CPU1 works as the backup processing core in hot standby; 3. The monitoring CPU1 performs data packaging and uploads data, and the monitoring CPU2 collects the board operation status information and transmits it to the monitoring CPU1; 4. The monitoring CPU2 performs data packaging and uploads data, and the monitoring CPU1 collects the board operation status information and transmits it to the monitoring CPU2.

[0060] The system defaults to the single CPU working mode of the information monitoring processing core, and other working modes are configured by the board-level main control CPU.

[0061] In order to reduce the debugging difficulties and code encoding problems caused by device differences during system deployment, a unified MCU, sensor and peripheral memory are used, and the interface is agreed upon. The basic agreement is shown in Table 1.

[0062] Table 1 Board-level monitoring module interface conventions

[0063]

[0064] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A distributed status monitoring system for airborne multi-function display equipment, characterized in that: include: A plurality of board-level monitoring modules are located on each board to which the device belongs, and the board-level monitoring modules are used to monitor the running status of the board and output monitoring data; A device-level monitoring module is located on one of the boards to which the device belongs. The device-level detection module is used to monitor the operating status of the board to which it belongs, and is used to collect monitoring data of the board-level monitoring module of the device to which it belongs; The system-level monitoring module is used to collect the monitoring data of the device-level detection modules on each device, and classify and store the collected information according to different protocols and addresses. The system-level monitoring module evaluates the system working performance and status based on the monitoring data and working status reported by each device-level monitoring module; Each board-level monitoring module and device-level monitoring module has an independent address code.

2. The distributed status monitoring system for airborne multi-function display devices according to claim 1, characterized in that: The board-level monitoring module and the device-level detection module both include an information monitoring processing core, a sensor group, a control group, and a communication group; The sensor group is used to monitor the operating status of each device on the board and output the operating status to the information monitoring processing core; The information monitoring processing core analyzes the collected operating status information and issues control instructions to the control group. The information monitoring processing core of the board-level monitoring module is used to issue control instructions to the control group after receiving control instructions from the upper-level module. The control group receives the control instructions of the information monitoring processing core of the board or the control instructions of the main control CPU of the board to control the operating parameters of the corresponding device; The communication group of the board-level monitoring module and the communication group of the device-level detection module communicate to realize data transmission between the board-level monitoring module and the device-level detection module; The device-level detection module communication group is used to communicate with the system-level monitoring module, and the device-level detection module communication group is used to send monitoring data to the system-level monitoring module.

3. The distributed status monitoring system for airborne multi-function display devices according to claim 2, characterized in that: The information monitoring processing core communicates with the main control CPU of the board through a serial port, and the information monitoring processing core obtains the performance status of the main control CPU.

4. The distributed status monitoring system for airborne multi-function display devices according to claim 2, characterized in that: The board-level monitoring module and the device-level detection module both further include an inherent information group, and the inherent information group is used to store product information of the board.

5. The distributed status monitoring system for airborne multi-function display devices according to claim 2, characterized in that: The sensor group includes a temperature sensor, a current sensor, a voltage sensor, a vibration sensor and a rotation speed sensor.

6. The distributed status monitoring system for airborne multi-function display devices according to claim 2, characterized in that: The control group includes a power control unit and a temperature control unit.

7. According to claim 2, the distributed status monitoring system for airborne multi-function display equipment, the information monitoring processing core includes two processing cores, the two processing cores are interconnected, the two processing cores are both communicated with the sensor group on the board where they are located, the two processing cores are communicated with the main control CPU on the board where they are located, the two processing cores are both communicated with the control group on the board where they are located, and the two processing cores of the board-level monitoring module are both communicated with the communication group on the board where they are located.

8. According to the distributed status monitoring system for airborne multi-function display devices as claimed in claim 7, one of the processing cores is used as the main processing core, and the other processing core is used as the backup processing core. After the system is powered on, the main processing core and the backup processing core communicate with the main control CPU on the board through the communication bus. If there is no abnormality, the main processing core and the backup processing core negotiate, and the main processing core completes the communication with the main control CPU, and sends the running status information of the board to the outside through the communication group; If the communication between the main processing core and the main control CPU is abnormal; The standby processing core takes over the main processing core, completes the communication with the main control CPU, and sends the running status information of the board to the outside through the communication group.

9. According to the distributed status monitoring system for airborne multi-function display devices as described in claim 7, one processing core is used to collect information from the sensor group and send the collected information to another processing core, and the other processing core is used to package the data and send the data outward through the communication group.

Images