Frame type equipment and cabinet equipment

Abstract

The invention provides frame type equipment and cabinet equipment, and belongs to the technical field of communication. The frame type equipment comprises a machine frame and a plurality of wind resistance plates, the machine frame is provided with a plurality of slot positions, and the slot bottom of each slot position is provided with a connector interface; the end portion, used for stretching into the groove position, of the wind resistance plate is provided with a dustproof pad, the dustproof pad has flexibility, and when the wind resistance plate is installed in the groove position, the dustproof pad seals a connector interface of the groove position. With the adoption of the air resistance plate, when the air resistance plate is inserted into the idle slot position, the dustproof pad on the air resistance plate can seal the connector interface at the bottom of the slot position, so that dust can be prevented from entering the connector interface. Therefore, when the single board is subsequently inserted into the idle slot position, good connection between the single board and the slot position can be ensured, and good communication quality of the frame type equipment is ensured.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technology, and in particular to a frame-type device and a cabinet device. Background Art

[0002] The frame-type device, for example, may specifically be a communication device (such as an optical communication device, an electrical communication device, or an optoelectronic communication device, etc.) and an electronic device (such as a server device or a storage device, etc.).

[0003] The frame-type equipment structurally includes a machine frame and multiple single boards. The machine frame has multiple slots, and the single boards are installed in the slots. The bottom of each slot has a connector interface, and each single board has a connector joint. When the single board is located in the slot, the connector joint of the single board is connected to the connector interface of the slot.

[0004] Frame-type devices are usually not fully configured. There are multiple idle slots without boards inserted to prepare for future expansion. The connector interfaces of the idle slots are exposed and easily get dusty. When these dusty connector interfaces are subsequently connected to the connector connectors of the boards, the communication quality of the frame-type devices will be reduced. Summary of the invention

[0005] The present disclosure provides a frame-type device and a cabinet device, which can prevent dust from entering the connector interface of an idle slot, thereby ensuring that the communication quality of the frame-type device is not affected by the dust in the connector interface.

[0006] In a first aspect, the present disclosure provides a frame-type device, the frame-type device comprising a machine frame and a plurality of wind resistance plates, the machine frame having a plurality of slots, and a bottom of each slot having a connector interface;

[0007] The end of the wind resistance plate that is used to extend into the slot is provided with a dustproof pad, and the dustproof pad is flexible. When the wind resistance plate is installed in the slot, the dustproof pad seals the connector interface of the slot.

[0008] In the disclosed embodiment, the wind baffle plate of the frame-type device has a flexible dustproof pad. When the wind baffle plate is inserted into an empty slot, the dustproof pad on the wind baffle plate can seal the connector interface at the bottom of the slot, thereby preventing dust from entering the connector interface. In this way, when a single board is subsequently inserted into the empty slot, a good connection between the single board and the slot can be ensured, thereby ensuring good communication quality of the frame-type device.

[0009] In a possible implementation, the wind resistance plate includes a front plate, an insert plate and a dustproof plate, the insert plate is connected between the front plate and the dustproof plate, the front plate and the dustproof plate are parallel, and the dustproof pad is located on a surface of the dustproof plate that is opposite to the front plate;

[0010] When the wind resistance plate is installed in the slot, the front plate is located at the slot opening of the slot, and the dustproof plate is close to the bottom of the slot.

[0011] In the disclosed embodiment, when the wind resistance plate is inserted into the slot, the front plate is located at the notch of the slot, the dustproof plate is close to the bottom of the slot, and the dustproof pad is located on the outer surface of the dustproof plate facing away from the front plate, so by setting the length of the insertion plate along the plugging and unplugging direction, the dustproof pad can be sealed to the connector interface, such as the dustproof pad covers the connector interface, or the dustproof pad is inserted into the connector interface.

[0012] In one possible implementation, the connector interface includes a conductive part, a guide plate and a surrounding plate, the length of the conductive part extending from the bottom of the slot is less than the length of the guide plate and the surrounding plate extending from the bottom of the slot, and the guide plate and the surrounding plate surround the conductive part.

[0013] In the disclosed embodiment, the conductive part may be, for example, a gold finger. The guide plate plays a guiding role on the one hand, such as guiding the connector joint of the single board to dock with the connector interface. On the other hand, it seals the conductive part together with the dustproof pad. For example, the dustproof pad is used to seal the top of the conductive part, and the guide plate and the enclosure are used to seal the surrounding areas of the conductive part.

[0014] In a possible implementation, a first slot among the plurality of slots includes a plurality of connector interfaces, and the plurality of connector interfaces are sequentially arranged side by side;

[0015] Each of the plurality of connector interfaces comprises a conductive portion and two guide plates located opposite to each other, and the outermost first connector interface and the second connector interface of the plurality of connector interfaces each comprise a surrounding plate, and the length of the conductive portion extending from the bottom of the first slot is less than the length of the guide plate and the surrounding plate extending from the bottom of the first slot;

[0016] The enclosure of the first connector interface, the guide plates of all connector interfaces, and the enclosure of the second connector interface surround the conductive parts of all connector interfaces.

[0017] In the embodiment of the present disclosure, in the case where multiple connector interfaces are closely arranged in a single slot, it is only necessary to add a new enclosure to the two outermost connector interfaces to reduce the modification of the connector interfaces.

[0018] In the embodiment of the present disclosure, in the case where multiple connector interfaces are closely arranged in a single slot, the enclosures of the two outermost connector interfaces and the guide plates of all the connector interfaces form a closed area. Then, these connector interfaces can share a dustproof pad, and the dustproof pad covers all the connector interfaces or is plugged into all the connector interfaces to seal all the connector interfaces.

[0019] In a possible implementation, when the wind resistance plate is installed in the slot, the dustproof pad covers the connector interface.

[0020] In the disclosed embodiment, when the wind resistance plate is inserted into the slot, the dustproof pad can cover the connector interface to seal the conductive part in the connector interface. For example, the area of ​​the dustproof pad is larger than the area of ​​a single connector interface, and thus can cover a single connector interface. For another example, the area of ​​the dustproof pad is larger than the area of ​​all closely arranged connector interfaces in the same slot, and thus can cover all connector interfaces.

[0021] In a possible implementation, the thickness of the dustproof pad is greater than the distance between the dustproof plate and the guide plate of the connector interface, and when the wind resistance plate is installed in the slot, the dustproof pad tightly covers the guide plate of the connector interface.

[0022] In the disclosed embodiment, since the thickness of the dustproof pad is greater than the distance between the dustproof plate and the connector interface, when the wind resistance plate is located in the slot, the dustproof pad interference covers the guide plate and the enclosure of the connector interface, thereby enhancing the sealing of the conductive parts (such as gold fingers).

[0023] In a possible implementation, when the wind resistance plate is installed in the slot, the dustproof pad is located in the connector interface.

[0024] In the disclosed embodiment, since the thickness of the dustproof pad is slightly greater than or equal to the distance between the dustproof plate and the connector interface, when the wind resistance plate is located in the slot, the dustproof pad is interference fit in the space enclosed by the guide plate of the connector interface, thereby enhancing the sealing of the conductive part (such as the gold finger).

[0025] In one possible implementation, the thickness of the dustproof pad is smaller than the distance between the dustproof plate and the conductive portion of the connector interface, and when the wind resistance plate is installed in the slot, there is a gap between the dustproof pad and the conductive portion of the connector interface.

[0026] In the disclosed embodiment, since the thickness of the dustproof pad is smaller than the spacing between the dustproof plate and the conductive part of the connector interface, although the dustproof pad and the guide plate of the connector interface are interference fit, there is a gap between the dustproof pad and the conductive part (such as the gold finger). This ensures that the dustproof pad will not touch the conductive part, thereby achieving the effect of sealing the conductive part without damaging the conductive part.

[0027] In a possible implementation manner, the dustproof pad is made of rubber or foam.

[0028] In the disclosed embodiment, in order to achieve an interference fit between the dustproof pad and the connector interface, the dustproof pad is made of rubber or foam or a flexible material similar to rubber and foam.

[0029] In the disclosed embodiment, the interference fit between the dustproof pad and the guide plate of the connector interface can, on the one hand, enhance the sealing of the dustproof pad to the conductive part of the connector interface, and on the other hand, absorb the processing error of the wind resistance plate.

[0030] In a possible implementation, the dustproof plate has a guide hole, and when the wind resistance plate is installed in the slot, the guide column on the bottom of the slot is located in the guide hole.

[0031] In the disclosed embodiment, a guide column is generally arranged on the bottom of the slot to guide the single board to be inserted into the slot. Then, the dust shield of the wind resistance plate may have a guide hole, and the position of the guide hole is relative to the position of the guide column. In this way, when the wind resistance plate is inserted into the slot, the guide column on the bottom of the slot passes through the guide hole on the dust shield to play a guiding and limiting role, thereby facilitating the insertion of the wind resistance plate into the slot.

[0032] In a second aspect, a cabinet device is provided, the cabinet device comprising a cabinet and the frame device described in the first aspect, the frame device being located in the cabinet.

[0033] In the disclosed embodiment, the cabinet device may include one or more of the frame devices described above. For each frame device, as described above, the wind baffle of the frame device has a flexible dustproof pad. When the wind baffle is inserted into an empty slot, the dustproof pad on the wind baffle can seal the connector interface at the bottom of the slot, thereby preventing dust from entering the connector interface. In this way, when a single board is subsequently inserted into an empty slot, a good connection between the single board and the slot can be ensured, ensuring good communication quality of the frame device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a schematic diagram of the architecture of a machine frame device provided by an exemplary embodiment of the present disclosure;

[0035] Figure 2is a logical schematic diagram of a chassis device provided by an exemplary embodiment of the present disclosure;

[0036] Figure 3 is a schematic diagram of the architecture of a machine frame device provided by an exemplary embodiment of the present disclosure;

[0037] Figure 4 is a structural schematic diagram of a wind resistance plate of a frame device provided by an exemplary embodiment of the present disclosure;

[0038] Figure 5 It is a structural schematic diagram of a connector interface on a backplane of a chassis device provided by an exemplary embodiment of the present disclosure;

[0039] Figure 6 is a schematic diagram of a wind baffle plate of a frame device provided by an exemplary embodiment of the present disclosure being inserted into a slot;

[0040] Figure 7 is a schematic diagram of the architecture of a machine frame device provided by an exemplary embodiment of the present disclosure;

[0041] Figure 8 yes Figure 7 Schematic diagram of the arrangement of the connector interface in the first slot 11A.

[0042] Reference numerals

[0043] 1. Machine frame; 11. Slot; 12. Back panel; 111. Connector interface; 112. Conductive part; 113. Guide plate; 114. Enclosure.

[0044] 2. Wind resistance plate; 21. Front plate; 22. Insert plate; 23. Dustproof plate; 24. Dustproof pad.

[0045] 3. Single board.

[0046] 11A, first slot; 111A, first connector interface; 111B, second connector interface. DETAILED DESCRIPTION

[0047] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0048] This embodiment relates to a frame-type device, which may be a communication device, such as a switch or a router, etc., or an electronic device, such as a server device or a storage device, etc.

[0049] To better understand chassis-type devices, this article first introduces the main features of chassis-type devices before introducing dust prevention solutions.

[0050] like Figure 1The schematic diagram of the structure of the frame device is shown, and the frame device includes a main control board 110, a switch board 120 ( Figure 1 The main control board 110 is used to manage the switch board 120 and the service board 130, and the number of the main control board 110 can be one or more, such as 2. The service board 130 is responsible for receiving and sending data, and the number of the service board 130 can be multiple, such as 16. The switch board 120 is used for forwarding data, and the number of the switch board 120 can be multiple, such as 8.

[0051] The frame-type device is described below in more detail.

[0052] like Figure 2 , a logical schematic diagram of a frame-type device 100 is shown. The frame-type device 100 includes: a main control board 110 , a switch board 120 and a service board 130 .

[0053] The main control board 110 is also called a main processing unit (MPU) or a route processor card. The main control board 110 is used to control and manage various components in the frame device 100, including route calculation, device management, device maintenance, and protocol processing functions. The main control board 110 includes: a main control board central processor 111 and a memory 112.

[0054] The switch board 120 may also be referred to as a switch fabric unit (SFU) or a fabric board. When the frame device 100 has multiple service boards 130, the switch board 120 is used to complete data exchange between the service boards 130. For example, Figure 2 The two service boards 130 in the system can communicate with each other through the switch board 120 .

[0055] The service board 130 is also called an interface board, a line processing unit (LPU) or a line card. The service board 130 is used to provide various service interfaces and implement data packet forwarding. Service interfaces include but are not limited to Ethernet interfaces, POS (Packet over SONET / SDH) interfaces, etc., and Ethernet interfaces are, for example, Flexible Ethernet Clients (FlexE Clients). The service board 130 includes: a central processor 131, a service chip 132 (the service chip can also be called a network chip), a forwarding table entry memory 134 and a physical interface card (PIC) 133.

[0056] The central processor 131 on the service board 130 is used to control and manage the service board 130 and communicate with the main control board central processor 111 on the main control board 110 .

[0057] The service chip 132 is used to implement the forwarding processing of the message. The service chip 132 can be in the form of a forwarding chip. Specifically, the service chip 132 is used to forward the received message based on the forwarding table stored in the forwarding table entry memory 134. If the destination address of the message is the address of the frame device 100, the message is sent to the CPU (such as the main control board central processor 111) for processing; if the destination address of the message is not the address of the frame device 100, the next hop and output interface corresponding to the destination address are found from the forwarding table according to the destination address, and the message is forwarded to the output interface corresponding to the destination address. Among them, the processing of the uplink message includes: processing of the message input interface, forwarding table search; processing of the downlink message: forwarding table search, etc.

[0058] The physical interface card 133 is used to implement the physical layer docking function, from which the original traffic enters the service board 130, and the processed message is sent from the physical interface card 133. The physical interface card 133, also known as a daughter card, can be installed on the service board 130, and is responsible for converting the optical signal into a message and forwarding the message to the service chip 132 for processing after checking the legitimacy of the message. In some embodiments, the central processor can also perform the functions of the service chip 132, such as implementing software forwarding based on a general-purpose CPU, so that the service chip 132 is not required in the physical interface card 133.

[0059] In some examples, the frame device 100 includes multiple service boards 130 .

[0060] The main control board 110 is coupled to the service board 130. For example, the main control board 110 and the two service boards 130, as well as the switch board 120, are connected to the backplane of the chassis through a system bus to achieve intercommunication. In some examples, an inter-process communication (IPC) channel is established between the main control board 110 and the service board 130, and the main control board 110 and the service board 130 communicate through the IPC channel.

[0061] Logically, the frame device 100 includes a control plane and a forwarding plane. The control plane includes a main control board 110 and a central processor 131. The forwarding plane includes various components that perform forwarding, such as a forwarding table entry memory 134, a physical interface card 133, and a network chip 132. The control plane performs functions such as a router, generates a forwarding table, processes signaling and protocol messages, and configures and maintains the status of the device. The control plane sends the generated forwarding table to the forwarding plane. On the forwarding plane, the service chip 132 forwards the message received by the physical interface card 133 based on the forwarding table sent by the control plane. The forwarding table sent by the control plane can be stored in the forwarding table entry memory 134. In some embodiments, the control plane and the forwarding plane can be completely separated and not on the same device.

[0062] It is worth noting that there may be one or more main control boards 110, and when there are multiple boards, they may include a primary main control board and a backup main control board. There may be one or more service boards 130. The stronger the data processing capability of the frame-type device, the more service boards 130 are provided. There may also be one or more physical interface cards on the service board 130. There may also be one or more switch boards 120, and when there are multiple boards, they can jointly realize load sharing and redundant backup. Under the distributed forwarding architecture, the frame-type device can have at least one switch board 120, and the data exchange between multiple service boards 130 is realized through the switch board 120, providing large-capacity data exchange and processing capabilities. Therefore, the data access and processing capabilities of the frame-type devices with a distributed architecture are greater than those of the devices with a centralized architecture.

[0063] The above is an introduction to the main structural features of chassis-type devices. The following section introduces the dust prevention solution for the connector interfaces of the free slots of chassis-type devices.

[0064] As described above, the frame-type device includes a frame, a main control board, a service board and a switch board, etc., wherein the main control board, the service board and the switch board can be collectively referred to as a single board, which is represented by the figure mark 3.

[0065] like Figure 3 The structure diagram of the frame device is shown, the frame 1 has a plurality of slots 11, and the single board 3 is installed in the slot 11. The bottom of the slot 11 has a connector interface 111, and the bottom end of the single board 3 has a connector joint. When the single board 3 is inserted into the slot 11, the connector joint of the single board 3 is inserted into the connector interface 111 of the slot 11.

[0066] The backplane 12 of the frame 1 serves as the bottom of the plurality of slots 11 , and the connector interface 111 on the bottom of each slot 11 is arranged on the surface of the backplane 12 .

[0067] In this way, the single board is inserted into the slot 11, and the connector of the single board is inserted into the connector interface 111 of the slot 11, thereby realizing the connection between the single board and the backplane 12, so that the single boards inside the frame device are interconnected through the backplane 12.

[0068] Usually, the frame device is not fully configured, that is, Figure 3 As shown, there are many idle slots in the frame-type device that are not inserted with single boards 3, and the connector interfaces 111 of these idle slots are exposed to the outside, and dust is easily deposited on the conductive parts (such as gold fingers) of the connector interfaces 111. The dust deposited in the connector interfaces 111 will affect the communication between the single board and the backplane after the subsequent connection with the connector joint of the single board, for example, bit errors will occur. Moreover, according to research, the higher the transmission rate of the frame-type device, the higher the bit error rate.

[0069] For example, through theoretical simulation and actual measurement evaluation, for frame devices with a transmission rate below 20G, the dust on the connector interface 111 of the frame device has a negligible impact on the communication quality. However, for frame devices with a transmission rate above 20G, the dust on the connector interface 111 causes a higher bit error rate, which has a greater impact on the communication quality of the frame device.

[0070] The bandwidth demand of current communication equipment is constantly increasing. Take the large-scale deployed passive optical network (PON) as an example. The current one is GPON, which will be upgraded to 10GPON, 50GPON, or even hundreds of GPON in the future. Then, the transmission rate of the backplane will evolve towards 10Gbps, 25Gbps, 50Gbps, or even hundreds of Gbps. As the transmission rate of the backplane continues to increase, the dust deposited on the connector interface cannot be ignored.

[0071] At present, the dust prevention solution for the connector interface of the vacant slot is to place a dust net in the cabinet where the chassis device is located, for example, at the door or bottom of the cabinet where the air enters. This solution of placing a dust net at the air inlet of the cabinet has poor dust prevention efficiency, and if the cabinet door is not closed, the dust net is useless.

[0072] Alternatively, the current dust prevention solution is to place dustproof cotton at the air inlet position of the frame equipment to prevent dust at the frame level. However, this solution requires maintenance personnel to regularly remove the dustproof cotton and clean the dust on it. For large-scale deployed frame equipment, the workload of cleaning the dustproof cotton is relatively large, which increases the maintenance cost of the frame equipment. Moreover, for frame equipment deployed in remote areas, the maintenance cost of the dustproof cotton is even higher.

[0073] Alternatively, the current dustproof solution can also be to process a connector joint that is compatible with the connector interface of the slot, and the connector joint can be inserted into the connector interface of the vacant slot to seal the connector interface. However, both the connector interface and the connector joint are precision devices, which require precise guidance and precise positioning, otherwise it will affect the normal use of the connector interface, which results in a high processing cost for the connector joint. Therefore, although this solution can enhance the dustproof effect of the connector interface, the cost of processing the connector joint is high. If it is used in large-scale deployed frame equipment, it will greatly increase the application cost of the frame equipment.

[0074] In order to prevent dust from entering the connector interface of the vacant slot at a low cost, the present embodiment provides a frame-type device, which seals the connector interface through a wind baffle plate. For example, the wind baffle plate has a dustproof pad. When the wind baffle plate is inserted into the vacant slot, the dustproof pad on the wind baffle plate is sealed in the connector interface, thereby preventing dust from entering the connector interface. It can be seen that the frame-type device prevents dust from entering the connector interface in a relatively simple way.

[0075] The frame-type device shown in this embodiment will be introduced below.

[0076] refer to Figure 3 As shown, the frame-type device includes a frame 1, which is a rectangular box in appearance, including a bottom plate at the bottom, a top plate at the top, a left side plate at the left side, and a right side plate at the right side, and also includes a back plate 12 at the back. The back plate 12 is an interconnection circuit board of the frame device, which is used to realize the interconnection between internal modules, so the inner surface of the back plate 12 located inside the frame 1 has a large number of interfaces (such as connector interfaces for connecting to single boards).

[0077] It should be noted that the backplane 12 of some chassis devices is located inside the chassis, rather than at the back of the chassis, and interfaces are provided on both the first and second surfaces of the backplane 12. For example, the service board and the switch board are located on both sides of the backplane, and the interface on the first surface of the backplane 12 is used to connect to the service board, while the interface on the second surface is used to connect to the switch board. In this embodiment, the specific position of the backplane 12 in the chassis 1 is not limited, and the backplane 12 can be used as an example of being located at the back of the chassis 1 in the accompanying drawings.

[0078] Continue to refer Figure 3 As shown, the frame 1 includes a slot 11 for inserting a single board, wherein the slot 11 is surrounded by a left side plate, a right side plate and a back plate 12 of the frame 1, the back plate 12 serves as the bottom of the slot 11, and the left side plate and the right side plate serve as the walls of the slot 11.

[0079] In order to enable the single board inserted into slot 11 to be connected to the backplane, slot 11 has a connector interface 111 at the bottom of the slot, and the bottom end of the single board has a connector connector. In this way, when the single board is inserted into slot 11 and inserted to the bottom, the connector connector of the single board is inserted into the connector interface on the bottom of the slot, thereby realizing the interconnection between the single board and the backplane.

[0080] The slot 11 may have at least one connector interface 111, for example, Figure 3 As shown, the slot 11 includes two connector interfaces 111 .

[0081] However, a frame-type device usually has many single boards, so the frame 1 has many slots 11. The multiple slots 11 can be arranged in sequence between the top plate and the bottom plate, that is, the multiple slots 11 are arranged up and down in the vertical direction, or the multiple slots 11 can be arranged in sequence between the left plate and the right plate, that is, the multiple slots 11 are arranged left and right in the horizontal direction. Among them, this embodiment does not limit the arrangement of the multiple slots 11 in the frame 1, and the drawings can be illustrated with the up-and-down arrangement.

[0082] Since the frame-type equipment generates heat during operation, in order to dissipate the heat of the frame-type equipment, the frame 1 will be arranged with air inlets and air outlets accordingly. For example, for slots arranged up and down, the air inlet can be arranged at the bottom of the frame, and the air outlet can be arranged at the top of the frame. In this way, the wind will pass through the boards in each slot when flowing between the air inlet and the air outlet, thereby dissipating the heat of each board. Of course, for slots arranged left and right, the air inlet can be arranged on the left side of the frame, and the air outlet can be arranged on the right side of the frame.

[0083] Since there are many idle slots without single boards in the frame-type device, in order to prevent the wind from flowing out from the slots of the idle slots and failing to dissipate heat for the single boards between the idle slots and the air outlets, the frame-type device also includes a wind resistance plate 2, such as Figure 4 The figure shows a schematic diagram of the structure of the wind baffle plate 2 of the present embodiment. The wind baffle plate 2 can be inserted into an idle slot so that the wind does not flow out from the slot of the idle slot, but guides the wind to flow toward the air outlet. Therefore, the wind baffle plate 2 can also be called a wind guide plate to guide the wind to the air outlet.

[0084] Since the wind baffle plate 2 is inserted into an empty slot, and dust is accumulated on the connector interface of the empty slot, the wind baffle plate 2 can also have a dustproof function.

[0085] Correspondingly, such as Figure 4 As shown, the end of the wind resistance plate 2 for extending into the slot 11 has a dustproof pad 24 . The dustproof pad 24 has a certain flexibility. When the wind resistance plate 2 is installed in the vacant slot 11 , the dustproof pad 24 seals the connector interface 111 of the slot 11 .

[0086] The dustproof pad may be made of rubber or foam, or may be made of a flexible material similar to rubber, or may be made of a flexible material similar to foam.

[0087] In this way, when the wind baffle plate 2 is inserted into the vacant slot, the dustproof pad 24 of the wind baffle plate 2 can seal the connector interface 111, thereby preventing dust and the like from entering the connector interface 111 of the vacant slot.

[0088] It can be seen that this dustproof solution does not require regular maintenance and can save maintenance costs. This dustproof solution only requires the flexible dustproof pad 24 to be arranged on the wind resistance plate 2, which is easy to implement and has low cost, and will not increase the cost of the frame-type equipment.

[0089] Regarding the specific position of the dustproof pad 24 on the wind resistance plate 2, as shown in FIG. Figure 4 As shown, the wind resistance plate 2 includes a front plate 21, an insert plate 22 and a dustproof plate 23, the insert plate 22 is vertically connected between the front plate 21 and the dustproof plate 23, and the front plate 21 and the dustproof plate 23 are parallel. When the wind resistance plate 2 is inserted into the slot 11, the front plate 21 is located at the slot of the slot 11, the dustproof plate 23 is close to the bottom of the slot 11, the dustproof pad 24 can be located on the surface of the dustproof plate 23 facing away from the front plate 21, and when the wind resistance plate 2 is installed in the slot 11, the position of the dustproof pad 24 is opposite to the position of the connector interface 111 of the slot 11, so as to seal the connector interface 111.

[0090] In one example, the insert plate 22 and the dustproof plate 23 can be integrally formed, for example, the dustproof plate 23 is a folded edge formed by bending the insert plate 22 upward or downward 90 degrees. In another example, the insert plate 22 and the dustproof plate 23 can also be two independent plates connected vertically by welding.

[0091] In one example, in order to facilitate the staff to insert the wind deflector 2 into the slot 11 and pull the wind deflector 2 out of the slot 11, the front panel 21 has a handle bar, and the staff can hold the handle bar to insert the wind deflector 2 into the slot 11 and pull the wind deflector 2 out of the slot 11.

[0092] In one example, the wind baffle plate 2 can be locked in the slot 11 by a snap to prevent the wind baffle plate 2 from falling off from the vacant slot 11 , wherein the wind baffle plate 2 can be locked in the slot 11 , and the dustproof pad 24 also keeps the connector interface 111 sealed.

[0093] In one example, in order to facilitate the connector connection of the single board, it is easier to insert it into the connector interface of the backplane. Figure 5As shown, the connector interface 111 may include two guide plates 113, and the length of the conductive portion 112 extending from the bottom of the slot is less than the length of the guide plate 113 extending from the bottom of the slot, wherein the two guide plates 113 may be adjacent, or the two guide plates 113 may also be located opposite to each other. Figure 5 As shown, one guide plate 113 is located on one side of the conductive portion 112 of the connector interface, and the other guide plate 113 is located on the opposite side of the conductive portion 112. Under the guidance of the two guide plates 113, the connector connector of the single board can be easily inserted into the connector interface 111.

[0094] The inner surface of the guide plate 113 (ie, the surface facing the conductive portion 112) may have a guide groove ( Figure 5 (not shown) to guide the connector connector of the single board and insert it into the connector interface 111 of the slot.

[0095] In one example, in order to make the dustproof pad 24 better seal the connector interface 111, accordingly, as Figure 5 As shown, the connector interface 111 includes not only a conductive portion 112 and a guide plate 113, but also a surrounding plate 114. The guide plate 113 and the surrounding plate 114 surround the conductive portion 112, and the length of the conductive portion 112 extending from the bottom of the slot 11 is less than the length of the surrounding plate 114 extending from the bottom of the slot 11.

[0096] The enclosure 114 may be a plate-like structure with a flat inner surface (ie, a surface facing the conductive portion 112 ) so as not to affect the insertion of the connector.

[0097] In one example, if the two guide plates 113 are positioned relative to each other, the two enclosures 114 are also positioned relative to each other. For example, the two guide plates 113 that are positioned relative to each other can be arranged vertically, and the two enclosures 114 that are positioned relative to each other can be arranged horizontally, or the two guide plates 113 that are positioned relative to each other can be arranged horizontally, and the two enclosures 114 that are positioned relative to each other can be arranged vertically.

[0098] In another example, if the two guide plates 113 are located adjacent to each other, the two enclosure plates 114 are also located adjacent to each other.

[0099] The length of the enclosure plate 114 extending from the bottom of the slot 11 may be equal to the length of the guide plate 113 extending from the bottom of the slot.

[0100] In this way, the guide plate 113 and the enclosure 114 can form a closed area, and the conductive part 112 is surrounded in the closed area. When the wind resistance plate 2 is inserted into the slot, the dustproof pad 24 of the wind resistance plate 2 can cover the guide plate 113 and the enclosure 114, or be plugged into the closed area surrounded by the guide plate 113 and the enclosure 114. It can be seen that the conductive part of the connector interface is sealed on all sides by the guide plate 113 and the enclosure 114, and the top is sealed by the dustproof pad 24, thereby significantly enhancing the dustproof effect of the connector interface.

[0101] For example, the area of ​​the dustproof pad 24 is larger than the area of ​​the connector interface 111, that is, the area of ​​the dustproof pad 24 is larger than the area of ​​the area surrounded by the guide plate 113 and the enclosure 114. Figure 6 As shown, when the wind resistance plate 2 is inserted into the slot, the dustproof pad 24 covers the guide plate 113 and the enclosure 114 , and the conductive part 112 of the connector interface 111 is sealed in the closed space formed by the dustproof pad 24 , the guide plate 113 and the enclosure 114 .

[0102] in, Figure 6 This is a schematic diagram showing that the wind resistance plate 2 is inserted into the slot 11, but not inserted to the bottom of the slot 11, that is, Figure 6 The dustproof pad 24 in the connector has not covered the connector interface 111. When the wind resistance plate 2 continues to be inserted inward and inserted to the bottom, and the wind resistance plate 2 is buckled in the slot 11, the dustproof pad 24 will cover the connector interface 111 to seal the connector interface. It should be noted that Figure 6 It is a partial schematic diagram.

[0103] In one example, the thickness of the dustproof pad 24 is greater than the distance between the dustproof plate 23 and the guide plate 113 of the connector interface 111 when the wind resistance plate 2 is inserted into the slot 11. In this way, when the wind resistance plate 2 is inserted into the slot, the flexible dustproof pad 24 can interfere with and cover the guide plate 113 and the enclosure 114 of the connector interface 111, thereby further enhancing the dustproof effect of the connector interface.

[0104] In one example, the thickness of the dustproof pad 24 is smaller than the distance between the dustproof plate 23 and the top of the conductive portion 112 of the connector interface 111. In this way, when the wind resistance plate 2 is installed in the slot, the dustproof pad 24 and the guide plate 113, as well as the dustproof pad 24 and the enclosure 114 are tightly fitted, but there is a gap between the dustproof pad 24 and the conductive portion 112. In this way, the dustproof pad 24 will not touch the conductive portion 112, and thus will not affect the precision of the connector interface 111.

[0105] In the above, the dustproof pad 24 seals the conductive part 112 in the connector interface 111 by tightly covering the top of the connector interface 111 to achieve the dustproof effect. In another example, the dustproof pad 24 can also be plugged into the connector interface 111 to seal the conductive part 112 to achieve the dustproof effect.

[0106] For example, the area of ​​the dustproof pad 24 is slightly larger than or equal to the area of ​​the connector interface 111, so that when the wind resistance plate 2 is inserted into the slot, the dustproof pad 24 can be inserted into the connector interface 111 with interference fit to seal the conductive portion 112 in the connector interface 111. For example, when the wind resistance plate 2 is inserted into the slot, the dustproof pad 24 can be inserted into the closed area surrounded by the two guide plates 113 and the two enclosure plates 114 with interference fit to seal the conductive portion 112 in the closed area.

[0107] Among them, when the wind resistance plate 2 is fully inserted into the slot, the dustproof pad 24 is lower than the guide plate 113 and also lower than the enclosure 114 , which can be understood as the dustproof pad 24 extending into the connector interface 111 , and can be understood as the dustproof pad 24 being plugged in the connector interface 111 .

[0108] In one example, the thickness of the dustproof pad 24 is greater than the distance between the dustproof plate 23 and the guide plate 113 of the connector interface 111 when the wind resistance plate 2 is inserted into the slot 11. In this way, when the wind resistance plate 2 is inserted into the slot, the flexible dustproof pad 24 can be inserted into the connector interface 111 to further enhance the dustproof effect of the connector interface.

[0109] In one example, the thickness of the dustproof pad 24 is smaller than the distance between the dustproof plate 23 and the top of the conductive portion 112 of the connector interface 111. In this way, when the wind resistance plate 2 is installed in the slot and the dustproof pad 24 is inserted in the connector interface 111, although the outer wall of the dustproof pad 24 and the inner wall of the guide plate 113 are tightly fitted, there is a gap between the dustproof pad 24 and the conductive portion 112. In this way, the dustproof pad 24 will not touch the conductive portion 112, and thus will not affect the precision of the connector interface 111.

[0110] In the above case, each connector interface 111 in the slot 11 includes a conductive portion 112, two guide plates 113 and two enclosure plates 114. The dustproof pad 24 can cover a single connector interface 111 or be inserted into a single connector interface 111 to seal the single connector interface 111. The case where the dustproof pad 24 seals a single connector interface 111 can be applied to a slot 11 with fewer connector interfaces 111, such as one connector interface 111, or a slot 11 with multiple connector interfaces 111, but the connector interfaces 111 are spaced relatively large and are dispersedly arranged in the slot 11.

[0111] In another application, such as Figure 7 And refer to Figure 8 As shown, one or some slots 11 (referred to as the first slot 11A) include multiple connector interfaces 111, and these connector interfaces 111 are arranged side by side in sequence, and two adjacent connector interfaces 111 are relatively close, such as being arranged one by one. In this scenario, these connector interfaces 111 each include a conductive portion 112 and two guide plates 113 located opposite to each other, and the arrangement direction of the multiple connector interfaces 111 is perpendicular to the arrangement direction of the two guide plates 113 of a single connector interface 111. For example, Figure 8 As shown, the multiple connector interfaces 111 of the first slot 11A are arranged one by one in the horizontal direction, and the two guide plates 113 of each connector interface 111 are arranged up and down in the vertical direction. Figure 8 As shown, the first connector interface 111A and the second connector interface 111B located at the outermost side include the conductive portion 112 ( Figure 8 In addition to the conductive portion 112 (not shown) and two guide plates 113 located opposite to each other, each connector further includes a panel 114, and the panel 114 of the first connector interface 111A is located at the outermost side of all connector interfaces 111, and the panel 114 of the second connector interface 111B is also located at the outermost side of all connector interfaces 111. Figure 8 As shown, the enclosure 114 of the first connector interface 111A, the guide plates 113 of all the connector interfaces 111 , and the enclosure 114 of the second connector interface 111B form a closed area, enclosing the conductive parts 112 of all the connector interfaces 111 in the closed area.

[0112] in, Figure 8 yes Figure 7 An enlarged schematic diagram of all connector interfaces 111 of the first slot 11A in FIG. Figure 8 The conductive portion 112 in the connector interface 111 is not shown. Figure 8 The guide plates 113 of two adjacent connector interfaces 111 may be adjacent to each other or have a relatively small gap therebetween.

[0113] In such Figure 7 In the illustrated embodiment, the length of the conductive portion 112 extending from the bottom of the first slot 11A is less than the length of the enclosure 114 extending from the bottom of the first slot 11A. The length of the enclosure 114 extending from the bottom of the slot is equal to the length of the guide plate 113 extending from the bottom of the slot.

[0114] In such Figure 7In the illustrated solution, the area of ​​the dustproof pad 24 may be larger than the area of ​​all connector interfaces in the first slot 11A, and thus, the dustproof pad 24 can cover all connector interfaces in the first slot 11A. Then, when the wind resistance plate 2 is fully inserted into the first slot 11A, the dustproof pad 24 can cover the top of all connector interfaces 111. For example, all connector interfaces 111 in the first slot 11A are covered by one dustproof pad 24.

[0115] In such Figure 7 In the illustrated solution, the area of ​​the dustproof pad 24 can be slightly larger than or equal to the area of ​​all connector interfaces in the first slot 11A, and thus, the dustproof pad 24 can be inserted into all connector interfaces. Then, when the wind resistance plate 2 is fully inserted into the first slot 11A, the dustproof pad 24 can be inserted into (i.e., located in) all connector interfaces 111 of the first slot 11A. For example, all connector interfaces 111 of the first slot 11A are inserted therein by a dustproof pad 24, wherein the dustproof pad 24 is lower than the guide plates 113 of all connector interfaces 111, so the dustproof pad 24 is inserted into all connector interfaces 111.

[0116] Whether the dustproof pad 24 covers all the connector interfaces 111 or plugs all the connector interfaces 111 , the thickness setting of the dustproof pad 24 may refer to the above description.

[0117] In one example, as described above, the dustproof pad 24 is made of a flexible material, for example, the dustproof pad 24 may be made of rubber or foam, or the dustproof pad 24 may be made of a flexible material similar to rubber, or a flexible material similar to foam.

[0118] In one example, since the dustproof pad 24 is flexible, when processing the wind baffle plate 2, it does not matter if the length of the wind baffle plate 2 extending into the slot 11, that is, the length between the front plate 21 and the dustproof plate 23, is slightly larger or smaller, because the flexibility of the dustproof pad 24 can facilitate a tight fit between the dustproof pad 24 and the connector interface 111, so the flexible dustproof pad 24 can absorb the processing error of the wind baffle plate 2.

[0119] Similarly, because the dustproof pad 24 is flexible, it does not matter whether the height of the dustproof plate 23 is larger or smaller when processing the wind resistance plate 2, because the area of ​​the dustproof pad 24 can be adjusted to make the dustproof pad 24 seal and cover the connector interface 111, or seal and plug it in the connector interface 111. Therefore, the flexible dustproof pad 24 can absorb the processing error of the wind resistance plate 2.

[0120] In one example, a guide column is generally arranged on the bottom of the slot 11 to guide the single board to be inserted into the slot. Then, the dustproof plate 23 of the wind resistance plate 2 may have a guide hole, and the position of the guide hole is opposite to the position of the guide column. In this way, when the wind resistance plate 2 is inserted into the slot, the guide column on the bottom of the slot 11 passes through the guide hole on the dustproof plate 23 to play a guiding and limiting role, thereby facilitating the insertion of the wind resistance plate 2 into the slot 11.

[0121] In this embodiment, the wind resistance plate of the frame-type device has a flexible dustproof pad. When the wind resistance plate is inserted into an empty slot, the dustproof pad on the wind resistance plate can seal the connector interface at the bottom of the slot, thereby preventing dust from entering the connector interface. In this way, when a single board is subsequently inserted into the empty slot, a good connection between the single board and the slot can be ensured, thereby ensuring good communication quality of the frame-type device.

[0122] This embodiment further provides a cabinet device, which may include a cabinet and the frame-type device described above. The frame-type device may be one or more, and these frame-type devices are installed in the cabinet.

Claims

1. A frame-type device, characterized in that: The frame-type device comprises a machine frame (1) and a plurality of wind resistance plates (2); the machine frame (1) has a plurality of slots (11); the bottom of each slot (11) has a connector interface (111); The end of the wind resistance plate (2) that is used to extend into the slot (11) has a dustproof pad (24), and the dustproof pad (24) is flexible. When the wind resistance plate (2) is installed in the slot (11), the dustproof pad (24) seals the connector interface (111) of the slot (11).

2. The frame-type device according to claim 1, characterized in that: The wind resistance plate (2) comprises a front plate (21), an insert plate (22) and a dustproof plate (23), wherein the insert plate (22) is connected between the front plate (21) and the dustproof plate (23), the front plate (21) and the dustproof plate (23) are parallel, and the dustproof pad (24) is located on a surface of the dustproof plate (23) that is opposite to the front plate (21); When the wind resistance plate (2) is installed in the slot (11), the front plate (21) is located at the slot opening of the slot (11), and the dustproof plate (23) is close to the bottom of the slot (11).

3. The frame-type device according to claim 1 or 2, characterized in that: The connector interface (111) comprises a conductive portion (112), a guide plate (113) and a surrounding plate (114); the length of the conductive portion (112) extending from the bottom of the slot (11) is smaller than the length of the guide plate (113) and the surrounding plate (114) extending from the bottom of the slot (11); the guide plate (113) and the surrounding plate (114) surround the conductive portion (112).

4. The frame-type device according to claim 1 or 2, characterized in that: A first slot (11A) among the plurality of slots (11) comprises a plurality of connector interfaces (111), and the plurality of connector interfaces (111) are sequentially arranged side by side; Each connector interface (111) of the plurality of connector interfaces (111) comprises a conductive portion (112) and two guide plates (113) located opposite to each other, and the outermost first connector interface (111A) and the second connector interface (111B) of the plurality of connector interfaces (111) each further comprise a surrounding plate (114), wherein the length of the conductive portion (112) extending from the bottom of the first slot (11A) is less than the length of the guide plate (113) and the surrounding plate (114) extending from the bottom of the first slot (11A); The enclosure (114) of the first connector interface (111A), the guide plates (113) of all the connector interfaces (111), and the enclosure (114) of the second connector interface (111B) surround the conductive parts (112) of all the connector interfaces (111).

5. The frame-type device according to any one of claims 1 to 4, characterized in that: When the wind resistance plate (2) is installed in the slot (11), the dustproof pad (24) covers the connector interface (111).

6. The frame-type device according to claim 5, characterized in that: The thickness of the dustproof pad (24) is greater than the distance between the dustproof plate (23) and the guide plate (113) of the connector interface (111); when the wind resistance plate (2) is installed in the slot (11), the dustproof pad (24) tightly covers the connector interface (111).

7. The frame-type device according to any one of claims 1 to 4, characterized in that: When the wind resistance plate (2) is installed in the slot (11), the dustproof pad (24) is located in the connector interface (111).

8. The frame-type device according to claim 6 or 7, characterized in that: The thickness of the dustproof pad (24) is smaller than the distance between the dustproof plate (23) and the conductive portion (112) of the connector interface (111); when the wind resistance plate (2) is installed in the slot (11), there is a gap between the dustproof pad (24) and the conductive portion (112) of the connector interface (111).

9. The frame-type device according to any one of claims 1 to 8, characterized in that: The material of the dustproof pad (24) is rubber or foam.

10. A cabinet device, characterized in that: The cabinet device comprises a cabinet and a frame device according to any one of claims 1 to 9, and the frame device is located in the cabinet.

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