High performance image sensor package structure

Abstract

The application provides a high-performance image sensor packaging structure, and belongs to the field of semiconductor packaging.The high-performance image sensor packaging structure is characterized in that a high-reflective coating is coated on the upper surface of a substrate, so that light not captured by a photosensitive area can be reflected and reused, and the light utilization rate of the photosensitive area is improved; an inwardly inclined substrate fence wall is arranged, so that light can be maximally collected to the photosensitive area, and photoelectric conversion efficiency is improved; the upper surface of a glass cover plate is provided with a micro-convex surface structure, which functions as a lens to collect more light to the photosensitive area, and further improve the photoelectric conversion efficiency of the image sensor; and an anti-reflection coating is coated on the lower surface of the glass cover plate, so that light loss caused by reflection is reduced, and the photosensitive performance of the image sensor is further improved.The technical scheme of the application improves the photoelectric conversion efficiency of the image sensor and enhances the use effect of the image sensor.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor packaging, and in particular to a high-performance image sensor packaging structure. BACKGROUND

[0002] An image sensor is based on the photoelectric effect, and uses a photoelectric device to convert a light image on a photosensitive surface into an electric signal in a corresponding proportional relationship. After the light is shot through the lens, it hits the photosensitive unit on the photosensitive element, causing electron release and gathering at the chip output end to form a voltage signal, which is then converted into a digital signal by a processing chip for generating an image. Among them, the CMOS image sensor is an active pixel sensor using CMOS semiconductor, and each photosensor has a corresponding circuit near it to directly convert light energy into a voltage signal. It has the advantages of low cost, low power consumption, high integration, fast data throughput speed, etc., and has become mainstream in many fields today.

[0003] However, when used in night shooting, weak light environment monitoring and other scenes, the photoelectric conversion efficiency is often low due to weak external light, which further leads to ineffective use of the image sensor, resulting in ineffective shooting or monitoring of the picture in the night or weak light environment. SUMMARY

[0004] In view of the above problems, the present application provides a high-performance image sensor packaging structure, which improves the packaging structure to solve the problem of ineffective use of the image sensor due to low photoelectric conversion efficiency of the image sensor in the night or weak light environment in the prior art, thereby improving the photoelectric conversion efficiency of the image sensor and enhancing the use effect of the image sensor.

[0005] To achieve the above purpose, the technical scheme adopted by the present application is:

[0006] A high-performance image sensor packaging structure comprises:

[0007] A substrate comprising an upper surface and a lower surface, the upper surface of the substrate being coated with a high-reflective coating;

[0008] An image sensor fixed to the substrate and located on the upper surface of the substrate, the image sensor comprising a photosensitive area, one side of the image sensor on which the photosensitive area is arranged being an upper surface, and the other side opposite to the upper surface being a lower surface; the image sensor is electrically connected to the substrate through a lead wire;

[0009] A substrate fence is arranged around the substrate, and the substrate fence is inclined towards the image sensor;

[0010] A glass cover plate, wherein the upper surface of the glass cover plate is slightly convex and the lower surface of the glass cover plate is coated with an anti-reflective coating, the glass cover plate is disposed on the substrate wall, and the lower surface of the glass cover plate contacts and is fixed to the substrate wall.

[0011] In the aforementioned high-performance image sensor packaging structure, the inner surface of the substrate enclosure is coated with a high-reflectivity coating.

[0012] In the aforementioned high-performance image sensor packaging structure, a plurality of grooves are distributed around the top perimeter of the substrate wall, and a plurality of protrusions corresponding to the grooves are provided around the lower surface of the glass cover, the protrusions fitting into the grooves.

[0013] In the aforementioned high-performance image sensor packaging structure, the substrate enclosure is tilted at an angle of 10-15° toward the image sensor.

[0014] In the aforementioned high-performance image sensor packaging structure, the upper surface of the glass cover is further coated with a nano-self-cleaning film.

[0015] In the aforementioned high-performance image sensor packaging structure, the upper surface of the photosensitive area of ​​the image sensor is coated with an anti-reflective coating.

[0016] The above technical solution has the following advantages or beneficial effects:

[0017] The high-performance image sensor packaging structure provided by this invention improves the light utilization rate of the photosensitive area by coating a high-reflectivity coating on the upper surface of the substrate, thereby reflecting and reusing light that is not captured by the photosensitive area. By setting an inwardly inclined substrate enclosure, it ensures that light can be concentrated to the photosensitive area to the greatest extent, improving photoelectric conversion efficiency. By setting the upper surface of the glass cover to a micro-convex structure, it acts as a lens, concentrating more light onto the photosensitive area, thus improving the photoelectric conversion efficiency of the image sensor. Furthermore, by coating the lower surface of the glass cover with an anti-reflective coating, it reduces light loss due to reflection, further enhancing the photosensitive performance of the image sensor. This high-performance image sensor packaging structure, through improvements in packaging structure, solves the problem in existing technologies where the low photoelectric conversion efficiency of image sensors in nighttime or low-light environments prevents effective use of the image sensor, thereby improving the photoelectric conversion efficiency and enhancing the image sensor's performance. Attached Figure Description

[0018] The invention, its features, shape, and advantages will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference numerals denote like parts throughout the drawings. The drawings are not intentionally drawn to scale; the focus is on illustrating the spirit of the invention.

[0019] Figure 1 This is a cross-sectional view of the high-performance image sensor packaging structure provided in Embodiment 1 of the present invention. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but these are not intended to limit the scope of the invention.

[0021] Example 1:

[0022] like Figure 1 As shown, the high-performance image sensor packaging structure provided in Embodiment 1 of the present invention includes: a substrate 1, the substrate 1 including an upper surface and a lower surface, the upper surface of the substrate 1 being coated with a high-reflectivity coating 1.1; the high-reflectivity coating 1.1 is an aluminum oxide coating or a silver coating;

[0023] Image sensor 2 is fixed on substrate 1 and located on the upper surface of substrate 1. Image sensor 2 includes photosensitive area 3. The side of image sensor 2 on which photosensitive area 3 is set is the upper surface, and the side opposite to the upper surface is the lower surface. Image sensor 2 and substrate 1 are electrically connected through lead wire 4.

[0024] The substrate enclosure 5 is disposed around the substrate 1, and the substrate enclosure 5 is inclined toward the image sensor 2.

[0025] The glass cover plate 6 has a slightly convex upper surface and an anti-reflective coating 6.1 on its lower surface. The glass cover plate 6 is mounted on the substrate enclosure 5, and its lower surface contacts and is fixed to the substrate enclosure 5. The anti-reflective coating may be a silicate coating (SiO2 coating) or a magnesium fluoride coating (MgF2 coating).

[0026] In the high-performance image sensor packaging structure provided in Embodiment 1 of the present invention, the inner surface of the substrate enclosure 5 is coated with a high-reflectivity coating 5.1. The high-reflectivity coating 5.1 is an aluminum oxide or silver coating. The high-reflectivity coating 5.1 enables the light reflected through the substrate 1 to be reflected again to the photosensitive area 3 of the image sensor 2, ensuring that the light can be concentrated in the photosensitive area to the maximum extent, thereby enhancing the light sensitivity of the image sensor and improving the photoelectric conversion efficiency.

[0027] In the high-performance image sensor packaging structure provided in Embodiment 1 of the present invention, a plurality of grooves 7 are distributed around the top perimeter of the substrate wall 5, and a plurality of protrusions 8 corresponding to the grooves 7 are provided around the lower surface of the glass cover plate 6, with the protrusions 8 fitting into the grooves 7. The fitting arrangement of the grooves 7 and the protrusions 8 makes the glass cover plate 6 more firmly fixed to the substrate wall 5, thereby enhancing the structural strength of the packaged image sensor.

[0028] In the high-performance image sensor packaging structure provided in Embodiment 1 of the present invention, the substrate wall 5 is tilted at an angle of 13° towards the image sensor. The limited tilt angle allows the substrate wall 5 to reflect light into the corresponding photosensitive area 3, thereby ensuring that the light is concentrated in the photosensitive area to the maximum extent, thereby enhancing the light sensitivity of the image sensor and improving the photoelectric conversion efficiency.

[0029] In the high-performance image sensor packaging structure provided in Embodiment 1 of this invention, the upper surface of the glass cover 6 is further coated with a nano self-cleaning film 6.2. The coating of the nano self-cleaning film makes it easier for dust, liquids, etc., to slide off the surface of the glass cover, reducing contamination accumulation and enhancing the performance and lifespan of the image sensor. The nano self-cleaning film is a special film manufactured using nanotechnology. Materials such as silicon dioxide (SiO2) are commonly used as the main component of nano self-cleaning films. Through nanotechnology processing, it can form a superhydrophobic surface, enabling water droplets to form a contact angle greater than 150 degrees on the surface, achieving waterproof and anti-fouling functions.

[0030] In the high-performance image sensor packaging structure provided in Embodiment 1 of the present invention, the upper surface of the photosensitive area 3 of the image sensor is coated with an anti-reflective coating 3.1. The anti-reflective coating 3.1 enables the light passing through the photosensitive area 3 to be concentrated within the photosensitive area 3 to the maximum extent, thereby improving the photoelectric conversion efficiency and thus enhancing the quality and performance of the image sensor.

[0031] In summary, the high-performance image sensor packaging structure provided by this invention improves the light utilization rate of the photosensitive area by coating a high-reflectivity coating on the upper surface of the substrate, thereby reflecting and reusing light that is not captured by the photosensitive area; by setting an inwardly inclined substrate enclosure, it ensures that light can be concentrated to the photosensitive area to the greatest extent, improving photoelectric conversion efficiency; by setting the upper surface of the glass cover to a micro-convex structure, it acts as a lens, concentrating more light to the photosensitive area, thereby improving the photoelectric conversion efficiency of the image sensor; and by coating the lower surface of the glass cover with an anti-reflective coating, it can reduce light loss caused by reflection, thereby further improving the photosensitivity of the image sensor. The high-performance image sensor packaging structure provided by this invention improves the packaging structure to solve the problem in the prior art where the low photoelectric conversion efficiency of the image sensor in nighttime or low-light environments prevents its effective use, thus improving the photoelectric conversion efficiency of the image sensor and enhancing its performance.

[0032] Those skilled in the art should understand that variations can be implemented by combining existing technology and the above embodiments, and will not be elaborated here. Such variations do not affect the essence of the present invention, and will not be elaborated here.

[0033] The preferred embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and structures not described in detail should be understood as being implemented in a manner common to the art. Any person skilled in the art can make many possible variations and modifications, or equivalent embodiments, without departing from the technical solution of the present invention, which do not affect the essential content of the present invention. Therefore, any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A high-performance image sensor packaging structure, characterized in that, include: A substrate, the substrate including an upper surface and a lower surface, the upper surface of the substrate being coated with a high-reflectivity coating; An image sensor is fixed on a substrate and located on the upper surface of the substrate. The image sensor includes a photosensitive area, with the side of the image sensor containing the photosensitive area being the upper surface and the side opposite the upper surface being the lower surface. The image sensor is electrically connected to the substrate via leads. A substrate enclosure is disposed around the perimeter of the substrate and is inclined toward the image sensor. A glass cover plate, wherein the upper surface of the glass cover plate is slightly convex and the lower surface of the glass cover plate is coated with an anti-reflective coating, the glass cover plate is disposed on the substrate wall, and the lower surface of the glass cover plate contacts and is fixed to the substrate wall. The upper surface of the photosensitive area of ​​the image sensor is coated with an anti-reflective coating.

2. The high-performance image sensor packaging structure as described in claim 1, characterized in that, The inner surface of the substrate enclosure is coated with a high-reflectivity coating.

3. The high-performance image sensor packaging structure as described in claim 1, characterized in that, The top perimeter of the substrate wall has several grooves, and the lower surface of the glass cover has several protrusions corresponding to the grooves, which fit into the grooves.

4. The high-performance image sensor packaging structure as described in claim 1, characterized in that, The substrate enclosure is tilted at an angle of 10-15° toward the image sensor.

5. The high-performance image sensor packaging structure as described in claim 1, characterized in that, The upper surface of the glass cover is also coated with a nano self-cleaning film.

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