Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel has a display area and a non-display area surrounding at least part of the display area. The display panel comprises a substrate, a pixel definition layer located on one side of the substrate, the pixel definition layer extending from the display area to the non-display area, an encapsulation structure located on the side of the pixel definition layer away from the substrate, the encapsulation structure comprising a first encapsulation layer, and a touch structure located on the side of the encapsulation structure away from the substrate, the touch structure comprising a first insulating layer. The first encapsulation layer and the first insulating layer both extend from the display area to the non-display area, and the edge of the first insulating layer is beyond the edge of the first encapsulation layer and in contact with the pixel definition layer. The technical solution of the application can improve the encapsulation reliability.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] With the development of display technology, Organic Light-Emitting Diodes (OLEDs) have been widely used in display products due to their advantages such as low power consumption, high brightness, wide viewing angle, and high contrast. In the traditional display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also has limitations such as limited precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance aspects, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant content regarding the technology of eliminating fine metal masks, and are provided for reference.

[0003] To prevent water and oxygen from damaging OLED devices, an encapsulation structure is usually placed above the OLED. However, the reliability of the encapsulation structure needs to be further improved. Summary of the Invention

[0004] To address the aforementioned issues, embodiments of this application provide a display panel, a method for manufacturing the same, and a display device.

[0005] In a first aspect, embodiments of this application provide a display panel, comprising: a display area and a non-display area surrounding at least a portion of the display area; the display panel comprising: a substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer extending from the display area to the non-display area; an encapsulation structure located on the side of the pixel definition layer away from the substrate, the encapsulation structure comprising a first encapsulation layer; and a touch structure located on the side of the encapsulation structure away from the substrate, the touch structure comprising a first insulating layer; wherein both the first encapsulation layer and the first insulating layer extend from the display area to the non-display area, and the edge of the first insulating layer extends beyond the edge of the first encapsulation layer and contacts the pixel definition layer.

[0006] In conjunction with the first aspect, in the non-display area, the first encapsulation layer and the pixel definition layer are in contact; preferably, the encapsulation structure further includes a second encapsulation layer, which is located on the side of the first encapsulation layer near the substrate and is located in the display area; preferably, the pixel definition layer encloses a plurality of pixel openings in the display area; the display panel further includes a plurality of light-emitting devices, at least a portion of which is located within the pixel openings; preferably, the second encapsulation layer includes a plurality of spaced-apart encapsulation units, each corresponding to a pixel opening, and the orthographic projection of the encapsulation unit on the substrate covers the orthographic projection of the light-emitting device on the substrate; preferably, the display panel further includes a dam, which is located in the non-display area and between the substrate and the pixel definition layer, and surrounds the display area; the encapsulation structure further includes a third encapsulation layer, which is located between the first and second encapsulation layers, and the orthographic projection of the third encapsulation layer on the substrate covers the orthographic projection of the second encapsulation layer on the substrate, and the third encapsulation layer extends from the display area to the non-display area and terminates at the side of the dam near the display area; preferably, the materials of the first and second encapsulation layers include inorganic materials, and the material of the third encapsulation layer includes organic materials.

[0007] In conjunction with the first aspect, the touch structure further includes a second insulating layer located on the side of the first insulating layer away from the substrate, extending from the display area to the non-display area; the edge of the second insulating layer is aligned with the edge of the first insulating layer, or the distance from the edge of the second insulating layer to the edge of the display area is less than the distance from the edge of the first insulating layer to the edge of the display area; preferably, the material of the first insulating layer and / or the second insulating layer includes an inorganic material; preferably, the touch structure further includes a first touch metal layer and a second touch metal layer, the first touch metal layer being located between the first and second insulating layers, and the second touch metal layer being located on the side of the second insulating layer away from the substrate; preferably, the first touch metal layer includes a plurality of first connecting portions, the second touch metal layer includes a plurality of first touch electrode blocks, a plurality of second touch electrode blocks, and a plurality of second connecting portions, the second insulating layer is provided with a first via, two adjacent first touch electrode blocks are electrically connected to the first connecting portion through the first via, and two adjacent second touch electrode blocks are electrically connected through the second connecting portion.

[0008] In conjunction with the first aspect, the display panel also includes multiple touch traces, which are located on the side of the pixel definition layer near the substrate and in the non-display area; the orthographic projection of the touch traces on the substrate is within the range of the orthographic projection of the first insulating layer on the substrate, and the orthographic projection of the touch traces on the substrate does not overlap with the orthographic projection of the first encapsulation layer on the substrate.

[0009] In conjunction with the first aspect, the touch structure further includes a second touch metal layer, which includes multiple first touch electrode blocks, multiple second touch electrode blocks, multiple first leads, and multiple second leads. The first leads are connected to the first touch electrode blocks, and the second leads are connected to the second touch electrode blocks. A first insulating layer is provided with a second via, and a pixel definition layer is provided with a third via. The orthographic projection of the third via on the substrate at least partially overlaps with the orthographic projection of the second via on the substrate. The first leads and / or the second leads are electrically connected to the touch traces through the second and third vias. Preferably, the display panel further includes a third insulating layer located on the side of the touch trace layer away from the substrate. The third insulating layer is provided with a fourth via. The orthographic projection of the fourth via on the substrate at least partially overlaps with the orthographic projection of the second or third via on the substrate. The first leads and / or the second leads are electrically connected to the touch traces through the second, third, and fourth vias.

[0010] In conjunction with the first aspect, the panel further includes at least one dam located between the substrate and the pixel definition layer, and situated in a non-display area. The dam surrounds the display area, and the pixel definition layer contacts and covers the dam. Preferably, the orthographic projection of the first insulating layer on the substrate covers the orthographic projection of the dam on the substrate; the orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the dam on the substrate. Preferably, the display panel further includes multiple touch traces, the orthographic projections of which are located on the side of the orthographic projection of the dam on the substrate away from the display area. Preferably, the display panel further includes a gate driving circuit located on the side of the pixel definition layer near the substrate and situated in a non-display area, the orthographic projection of which is located on the side of the orthographic projection of the dam on the substrate near the display area. The display panel has two dams, including a first dam and a second dam spaced apart. The first dam surrounds the display area, and the second dam surrounds the first dam. Preferably, the display panel further includes a third insulating layer located on the side of the pixel definition layer near the substrate. The dams and the third insulating layer are fabricated in the same layer. Preferably, the material of the dams is the same as the material of the third insulating layer. Preferably, the display panel further includes a fourth insulating layer located on the side of the third insulating layer near the substrate. The dams include a first sub-part and a second sub-part stacked sequentially in a direction away from the substrate. The first sub-part and the fourth insulating layer are fabricated in the same layer, and the second sub-part and the third insulating layer are fabricated in the same layer. Preferably, the material of the first sub-part is the same as the material of the fourth insulating layer, and the material of the second sub-part is the same as the material of the third insulating layer.

[0011] In conjunction with the first aspect, the display panel further includes an isolation structure located on the side of the pixel definition layer away from the substrate, the isolation structure enclosing multiple isolation openings; the display panel also includes multiple light-emitting devices located within the isolation openings; preferably, the isolation structure includes a first part and a second part stacked sequentially along the direction away from the substrate, the orthographic projection of the second part on the substrate covering the orthographic projection of the first part on the substrate; preferably, the isolation structure further includes a third part located on the side of the first part closer to the substrate, the orthographic projection of the first part on the substrate being located within the orthographic projection of the third part on the substrate; preferably, the material of the first part includes a conductive material, the light-emitting device includes a first electrode, the first electrode and the first part overlapping, or the first electrode contacting the sidewall of the first part; preferably, the light-emitting device further includes a second electrode and a light-emitting functional layer, the second electrode, the light-emitting functional layer and the first electrode being stacked sequentially along the direction away from the substrate.

[0012] Secondly, embodiments of this application also provide a display panel having a display area and a non-display area surrounding at least a portion of the display area. The display panel includes: a substrate; a pixel definition layer located on one side of the substrate, extending from the display area to the non-display area; an encapsulation structure located on the side of the pixel definition layer away from the substrate, the encapsulation structure including a first encapsulation layer; and a touch structure located on the side of the encapsulation structure away from the substrate, the touch structure including a first insulating layer. Both the first encapsulation layer and the first insulating layer extend from the display area to the non-display area. In the non-display area, the orthographic projection of the first insulating layer on the substrate covers the orthographic projection of the first encapsulation layer on the substrate, and a portion of the first insulating layer contacts the pixel definition layer.

[0013] Thirdly, embodiments of this application also provide a method for manufacturing a display panel, the display panel having a display area and a non-display area surrounding at least a portion of the display area, the manufacturing method comprising: manufacturing a pixel definition layer on a substrate, the pixel definition layer extending from the display area to the non-display area; manufacturing a first encapsulation layer on a side of the pixel definition layer away from the substrate; and manufacturing a touch structure on a side of the first encapsulation layer away from the substrate, the touch structure including a first insulating layer; wherein both the first encapsulation layer and the first insulating layer extend from the display area to the non-display area, and the edge of the first insulating layer extends beyond the edge of the first encapsulation layer and contacts the pixel definition layer.

[0014] In conjunction with the third aspect, a touch structure is fabricated on the side of the first encapsulation layer away from the substrate, comprising: fabricating a first film layer on the side of the first encapsulation layer away from the substrate; fabricating a first metal layer on the side of the first film layer away from the substrate, and patterning the first metal layer to obtain a first touch metal layer; fabricating a second film layer on the side of the first touch metal layer away from the substrate, and patterning the first film layer and the second film layer to obtain a first insulating layer and a second insulating layer respectively; fabricating a second metal layer on the side of the second insulating layer away from the substrate, and patterning the second metal layer to obtain a second touch metal layer, wherein the first insulating layer, the first touch metal layer, the second insulating layer, and the second touch metal layer constitute a touch structure.

[0015] In conjunction with the third aspect, before the step of fabricating the pixel definition layer on the substrate, the method further includes: forming a fourth film layer on the substrate, patterning the fourth film layer to obtain a fourth insulating layer and a first sub-part of a dam; forming a third film layer on the side of the fourth insulating layer away from the substrate, patterning the third film layer to obtain a third insulating layer and a second sub-part of a dam; the first sub-part and the second sub-part constitute a dam, and the dam is located in a non-display area; preferably, before the step of forming the third film layer on the side of the fourth insulating layer away from the substrate, the method further includes: fabricating a third metal layer on the side of the fourth insulating layer away from the substrate, patterning the third metal layer to obtain multiple touch traces, the touch traces being located in a non-display area, and the orthographic projection of the touch traces on the substrate being located on the side of the orthographic projection of the dam on the substrate away from the display area.

[0016] In conjunction with the third aspect, before the step of fabricating the pixel definition layer on the substrate, the method further includes: sequentially forming a fourth insulating layer and a third insulating layer on the substrate, and patterning the third insulating layer and the fourth insulating layer to obtain a dam, the dam being located in a non-display area; preferably, after forming the fourth insulating layer and before forming the third insulating layer, the method further includes: fabricating a third metal layer on the side of the fourth insulating layer away from the substrate, and patterning the third metal layer to obtain multiple touch traces, the touch traces being located in a non-display area, and the orthographic projection of the touch traces on the substrate being located on the side of the orthographic projection of the dam on the substrate away from the display area.

[0017] In conjunction with the third aspect, before the step of fabricating the pixel definition layer on the substrate, the method further includes: fabricating a second electrode layer on the substrate, the second electrode layer including a plurality of second electrodes, the pixel definition layer enclosing a plurality of pixel openings, the pixel openings exposing a portion of the second electrodes; after the step of fabricating the pixel definition layer on the substrate, the method further includes: fabricating an isolation structure on the side of the pixel definition layer away from the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation openings communicating with the pixel openings; sequentially fabricating a light-emitting layer, a first electrode layer, and a second encapsulation layer on the side of the pixel definition layer away from the substrate, the second electrode layer, the light-emitting layer, and the first electrode layer forming a plurality of light-emitting devices, the light-emitting devices being located at least within the pixel openings, the second encapsulation layer including a plurality of spaced-apart encapsulation units, the encapsulation units corresponding one-to-one with the pixel openings, the orthographic projection of the encapsulation units on the substrate covering the orthographic projection of the light-emitting devices on the substrate; preferably, after the step of sequentially fabricating the light-emitting layer, the first electrode layer, and the second encapsulation layer on the side of the pixel definition layer away from the substrate, the method further includes: fabricating a third encapsulation layer on the side of the second encapsulation layer away from the substrate, the orthographic projection of the third encapsulation layer on the substrate covering the orthographic projection of the second encapsulation layer on the substrate, the third encapsulation layer ending at the side of the dam near the display area.

[0018] Fourthly, embodiments of this application also provide a display device, including the display panel described above, or a display panel prepared by the preparation method described above.

[0019] Through the above technical solution, the first insulating layer covers the surface of the first encapsulation layer, protecting it and preventing damage. Furthermore, even if the first encapsulation layer is damaged, the first insulating layer still provides encapsulation protection. Secondly, since the edge of the first insulating layer contacts the pixel definition layer, there is an encapsulation boundary between the first insulating layer and the pixel definition layer, and between the pixel definition layer and the first encapsulation layer. Encapsulation failure only occurs when both encapsulation boundaries fail simultaneously, thus significantly improving encapsulation reliability. Attached Figure Description

[0020] Figure 1 This is a top view of the display panel provided in one embodiment of this application.

[0021] Figure 2 This is a schematic cross-sectional view of a display panel provided in an embodiment of this application.

[0022] Figure 3 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0023] Figure 4 This is a top view structural diagram of a display panel provided in another embodiment of this application.

[0024] Figure 5 yes Figure 3 A magnified view of region N in the image.

[0025] Figure 6 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0026] Figure 7 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0027] Figure 8 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0028] Figure 9 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0029] Figure 10 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0030] Figure 11 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] When manufacturing a display panel, the functional film layer in the light-emitting device needs to be formed by vapor deposition. When using a fine metal mask (FMM) to vapor deposit the functional film layer, multiple alignments are required. In order to solve the positional offset caused by alignment error, sufficient space needs to be reserved between different light-emitting devices. This results in a low aperture ratio of the light-emitting device, making it difficult to improve the pixel density of the display panel.

[0033] In this application, no photomask is required; instead, a full-area vapor deposition process is used to individually vapor-deposit and encapsulate light-emitting devices (also known as different sub-pixels) of different colors. Alignment accuracy during vapor deposition is not a concern, allowing for smaller gaps between light-emitting devices and thus increasing pixel density. The inventors discovered that after individually encapsulating light-emitting devices of different colors, the first inorganic encapsulation film layer exists only in the display area, while the non-display area only has one inorganic encapsulation film layer. When this inorganic encapsulation film layer is damaged, moisture can penetrate the organic encapsulation film layer, and subsequently, moisture can continue to penetrate the display area, causing dark spots in the display area.

[0034] To address the aforementioned technical problems, in a first aspect, embodiments of this application provide a display panel. The display panel has a display area and a non-display area surrounding at least a portion of the display area. The display panel includes a substrate; a pixel definition layer located on one side of the substrate, extending from the display area to the non-display area; an encapsulation structure located on the side of the pixel definition layer away from the substrate, the encapsulation structure including a first encapsulation layer; and a touch structure located on the side of the encapsulation structure away from the substrate, the touch structure including a first insulating layer. Both the first encapsulation layer and the first insulating layer extend from the display area to the non-display area, and the edge of the first insulating layer extends beyond the edge of the first encapsulation layer and contacts the pixel definition layer. In this embodiment, the first insulating layer covers the surface of the first encapsulation layer, protecting it and preventing damage. Furthermore, even if the first encapsulation layer is damaged, the first insulating layer still provides encapsulation protection. In a second aspect, since the edge of the first insulating layer contacts the pixel definition layer, an encapsulation boundary exists between the first insulating layer and the pixel definition layer. Encapsulation failure only occurs when both encapsulation boundaries fail simultaneously, thus improving encapsulation reliability.

[0035] Figure 1 This is a top view of the display panel provided in one embodiment of this application. Figure 2 This is a schematic cross-sectional view of a display panel provided in an embodiment of this application. Specifically, Figure 2 yes Figure 1 The diagram shows an exemplary cross-sectional structure of the display panel along line B1B2. Figure 1 and Figure 2 As shown, the display panel has a display area AA and a non-display area NA surrounding at least a portion of the display area AA. The display panel includes a substrate 10, a pixel definition layer 20, an encapsulation structure 50, and a touch structure 60.

[0036] In the embodiments of this application, the substrate 10 includes a rigid substrate, such as a glass substrate; or the substrate 10 includes a flexible substrate, such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc.

[0037] A pixel definition layer 20 is located on one side of the substrate 10, extending from the display area AA to the non-display area NA. The pixel definition layer 20 encloses a plurality of pixel openings 201 in the display area AA. The display panel also includes a plurality of light-emitting devices 30, at least a portion of which are located within the pixel openings 201. In this embodiment, the material of the pixel definition layer 20 includes inorganic materials, such as inorganic insulating materials.

[0038] In this embodiment, the light-emitting device 30 includes a second electrode 310, a light-emitting functional layer 320, and a first electrode 330 stacked sequentially along a direction away from the substrate 10. Specifically, the second electrode 310 is located between the substrate 10 and the pixel definition layer 20, and a portion of the second electrode 310 is exposed by the pixel opening 201. The light-emitting functional layer 320 at least covers the bottom wall and sidewalls of the pixel opening 201; for example, the light-emitting functional layer 320 covers the bottom wall and sidewalls of the pixel opening 201 and extends to cover a portion of the pixel definition layer 20 surface facing away from the substrate 10. The first electrode 330 covers the light-emitting functional layer 320. In this embodiment, the second electrode 310 is an anode and the first electrode 330 is a cathode; or, the second electrode 310 is a cathode and the first electrode 330 is an anode. The light-emitting functional layer 320 includes a first injection layer, a first transport layer, a first barrier layer, a light-emitting layer, a second barrier layer, a second transport layer, and a second injection layer stacked sequentially. Optionally, when the second electrode 310 is the anode and the first electrode 330 is the cathode, the light-emitting functional layer 320 includes a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer stacked sequentially.

[0039] The display panel also includes an isolation structure 40, located on the side of the pixel definition layer 20 facing away from the substrate 10. The isolation structure 40 encloses a plurality of isolation openings 401, which communicate with the pixel openings 201, and the light-emitting device 30 is at least partially located within the isolation openings 401. Optionally, the isolation structure 40 includes a first part 410 and a second part 420 stacked sequentially along the direction facing away from the substrate 10, with the orthographic projection of the second part 420 on the substrate 10 covering the orthographic projection of the first part 410 on the substrate 10. Optionally, the material of the first part 410 includes a conductive material, and the first part 410 overlaps with the first electrode 330, or the sidewall of the first part 410 contacts the first electrode 330, such as... Figure 2 As shown, this allows for full-area conductivity of the first electrode 330, preventing voltage drops and thus avoiding uneven brightness on the display panel. Optionally, both the first part 410 and the second part 420 are made of conductive materials. For example, the first part 410 is made of aluminum, and the second part 420 is made of titanium. In other embodiments, the isolation structure further includes a third part 430, located on the side of the first part 410 near the substrate 10, with the orthographic projection of the first part 410 on the substrate 10 falling within the orthographic projection of the third part 430 on the substrate 10. Optionally, the third part 430 is made of a conductive material. The first electrode 330 can overlap with either the first part 410 or the third part 430, or the first electrode 330 can contact the sidewall of the first part 410 or the sidewall of the third part 430. Optionally, the first part 410 is made of aluminum.

[0040] The encapsulation structure 50 is located on the side of the pixel definition layer 20 facing away from the substrate 10. Along the direction away from the substrate 10, the encapsulation structure 50 includes a second encapsulation layer 520, a third encapsulation layer 530, and a first encapsulation layer 510 stacked sequentially. The first encapsulation layer 510 and the second encapsulation layer 520 are made of inorganic materials, while the third encapsulation layer 530 is made of organic materials. The first encapsulation layer 510 extends from the display area AA to the non-display area NA, and in the non-display area NA, the first encapsulation layer 510 contacts the pixel definition layer 20. The orthographic projection of the third encapsulation layer 530 onto the substrate 10 covers the orthographic projection of the second encapsulation layer 520 onto the substrate 10.

[0041] In this embodiment, the second encapsulation layer 520 is located in the display area AA. The second encapsulation layer 520 includes a plurality of encapsulation units 521 spaced apart. Each encapsulation unit 521 corresponds to a pixel opening 201. The orthographic projection of the encapsulation unit 521 on the substrate 10 covers the orthographic projection of the light-emitting device 30 on the substrate 10.

[0042] Continue to refer to Figure 2 The display panel also includes a dam 80, located in the non-display area NA and between the substrate 10 and the pixel definition layer 20, surrounding the display area AA. The pixel definition layer 20 contacts and covers the dam 80. In this embodiment, the third encapsulation layer 530 extends from the display area AA to the non-display area NA and terminates at the side of the dam 80 closest to the display area AA. The orthographic projection of the first encapsulation layer 510 on the substrate 10 covers the orthographic projection of the dam 80 on the substrate 10. Optionally, there are two dams 80, including a first dam 801 and a second dam 802 spaced apart, with the first dam 801 surrounding the display area AA and the second dam 802 surrounding the first dam 801. By providing two dams 80, material overflow from the third encapsulation layer 530 can be avoided, thus preventing it from affecting the encapsulation performance.

[0043] like Figure 2 As shown, the display panel also includes a third insulating layer 70, which is located on the side of the pixel definition layer 20 near the substrate 10. The third insulating layer 70 and the dam 80 are fabricated in the same layer; for example, the dam 80 is formed by drilling holes in the third insulating layer 70. Optionally, the material of the third insulating layer 70 includes an organic material.

[0044] The touch structure 60 is located on the side of the encapsulation structure 50 opposite to the substrate 10. The touch structure 60 includes a first insulating layer 610, which extends from the display area AA to the non-display area NA, and the edge of the first insulating layer 610 extends beyond the edge of the first encapsulation layer 510 and contacts the pixel definition layer 20. Figure 2As shown, the orthographic projection of the first insulating layer 610 on the substrate 10 covers the orthographic projection of the dam 80 on the substrate 10. The material of the first insulating layer 610 includes inorganic materials. In this embodiment, the edge of the first insulating layer 610 extends beyond the edge of the first encapsulation layer 510 and contacts the pixel definition layer 20, forming a first encapsulation boundary between the first insulating layer 610 and the pixel definition layer 20, and a second encapsulation boundary between the first encapsulation layer 510 and the pixel definition layer 20, thereby significantly improving encapsulation performance.

[0045] Figure 3 This is a schematic cross-sectional view of a display panel provided in another embodiment of this application. Specifically, Figure 3 yes Figure 1 The diagram shows another exemplary cross-sectional structure of the display panel along line B1B2. Figure 4 This is a top view structural diagram of a display panel provided in another embodiment of this application.

[0046] Figure 3 The display panel shown is Figure 2 The difference in the display panel shown is that the touch structure 60 further includes a second insulating layer 620. The second insulating layer 620 is located on the side of the first insulating layer 610 facing away from the substrate 10. The second insulating layer 620 extends from the display area AA to the non-display area NA. The distance from the edge of the second insulating layer 620 to the edge of the display area AA is less than the distance from the edge of the first insulating layer 610 to the edge of the display area AA. That is, in the non-display area NA, the second insulating layer 620 does not completely cover the first insulating layer 610. In this embodiment, the material of the second insulating layer 620 includes inorganic materials.

[0047] like Figure 3 and Figure 4 As shown, the touch structure 60 also includes a first touch metal layer 630 and a second touch metal layer 640. The first touch metal layer 630 is located between the first insulating layer 610 and the second insulating layer 620, and the second touch metal layer 640 is located on the side of the second insulating layer 620 facing away from the substrate 10. Figure 4 As shown, the first touch metal layer 630 includes a plurality of first connecting portions 631, and the second touch metal layer 640 includes a plurality of first touch electrode blocks 641, a plurality of second touch electrode blocks 642, and a plurality of second connecting portions 643. The second insulating layer 620 is provided with a first via 621. Two adjacent first touch electrode blocks 641 are electrically connected to the first connecting portions 631 through the first via 621, and two adjacent second touch electrode blocks 642 are electrically connected through the second connecting portions 643. It can be understood that in other embodiments, the first touch metal layer 630 may include a plurality of first touch electrode blocks, a plurality of second touch electrode blocks, and a plurality of second connecting portions, and the second touch metal layer 640 may include a plurality of first connecting portions.

[0048] Optionally, such as Figure 3 and Figure 4 As shown, the display panel also includes multiple touch traces 90, which are located on the pixel definition layer 20 near the substrate 10 and in the non-display area NA. The orthographic projection of the touch traces 90 on the substrate 10 is located on the side of the orthographic projection of the dam 80 on the substrate 10 away from the display area AA. The orthographic projection of the touch traces 90 on the substrate 10 is within the range of the orthographic projection of the first insulating layer 610 on the substrate 10, and the orthographic projection of the touch traces 90 on the substrate 10 does not overlap with the orthographic projection of the first encapsulation layer 510 on the substrate 10. That is, the touch traces 90 are located on the edge of the first encapsulation layer 510 away from the display area AA. In this embodiment, it is not necessary to drill holes in the first encapsulation layer 510, which can improve the encapsulation performance of the first encapsulation layer 510.

[0049] Optionally, the second touch metal layer 640 further includes multiple first leads 644 and multiple second leads 645. The first leads 644 are connected to the first touch electrode block 641, and the second leads 645 are connected to the second touch electrode block 642. The first leads 644 and the second leads 645 extend from the display area AA to the non-display area NA and are electrically connected to the touch trace 90. Figure 5 yes Figure 3 A magnified view of region N in the image. (See image below.) Figure 5 As shown, the first insulating layer 610 is provided with a second via 611, and the pixel definition layer 20 is provided with a third via 211. The orthographic projection of the third via 211 on the substrate 10 at least partially overlaps with the orthographic projection of the second via 611 on the substrate 10. The third insulating layer 70 is provided with a fourth via 711, and the orthographic projection of the fourth via 711 on the substrate 10 at least partially overlaps with the orthographic projection of either the second via 611 or the third via 211 on the substrate 10. Optionally, the first lead 644 is electrically connected to the touch trace 90 through the second via 611, the third via 211, and the fourth via 711. Figure 3 and Figure 5 The diagram only shows the connection between the first lead 644 and the touch trace 90. It can be understood that the second lead 645 can also be electrically connected to the touch trace 90 through the second via 611, the third via 211 and the fourth via 711.

[0050] Figure 6 This is a schematic cross-sectional view of a display panel provided in another embodiment of this application. Specifically, Figure 6 yes Figure 1 The diagram shows another exemplary cross-sectional structure of the display panel along line B1B2. Figure 6 The display panel shown is Figure 3The difference in the display panel shown is that the edge of the second insulating layer 620 is aligned with the edge of the first insulating layer 610. This allows the second insulating layer 620 to protect the first insulating layer 610, further improving the encapsulation effect. In this case, a fifth via (not shown) needs to be formed on the second insulating layer 620, allowing the first lead 644 and / or the second lead 645 to sequentially pass through the fifth via, the second via 611, the third via 211, and the fourth via 711 to electrically connect to the touch trace 90. It is understood that the touch structure also includes a protective layer (not shown) located on the side of the second touch metal layer 640 facing away from the substrate 10. The protective layer protects the first touch electrode block 641, the second touch electrode block 642, the second connection portion 643, the first lead 644, and / or the second lead 645, etc. Optionally, the material of the protective layer includes organic materials.

[0051] Figure 7 This is a schematic cross-sectional view of a display panel provided in another embodiment of this application. Specifically, Figure 7 yes Figure 1 The diagram shows another exemplary cross-sectional structure of the display panel along line B1B2. Figure 7 The display panel shown is Figure 2 The difference in the display panel shown is that it further includes a fourth insulating layer 100, which is located on the side of the third insulating layer 70 closest to the substrate 10. The dam 80 includes a first sub-part 810 and a second sub-part 820 sequentially stacked along a direction away from the substrate 10. The first sub-part 810 and the fourth insulating layer 100 are fabricated in the same layer, and the second sub-part 820 and the third insulating layer 70 are fabricated in the same layer. Optionally, the material of the first sub-part 810 is the same as the material of the fourth insulating layer 100, and the material of the second sub-part 820 is the same as the material of the third insulating layer 70. In this embodiment, when fabricating the fourth insulating layer 100, a first hole is drilled to form the first sub-part 810, and when fabricating the third insulating layer 70, a second groove is drilled to form the second sub-part 820. The two perforations can be formed during the patterning processes of the fourth insulating layer 100 and the third insulating layer 70, respectively, without requiring additional preparation steps. However, when preparing the third insulating layer 70, impurities may remain at the location of the perforation from the previous step. To avoid impurity residue, alternatively, in other embodiments, a single perforation can be performed after preparing the fourth insulating layer 100 and the third insulating layer 70 to form a dam, resulting in a structure like... Figure 8 The dam structure shown.

[0052] Figure 9 This is a schematic cross-sectional view of a display panel provided in another embodiment of this application. Specifically, Figure 9 yes Figure 1 The diagram shows an exemplary cross-sectional structure of the display panel along line B1B2. Figure 9The display panel shown is Figure 2 The difference in the display panel shown is that the display panel also includes a gate driving circuit 110, which is located on the side of the pixel definition layer 20 near the substrate 10 and in the non-display area NA. The orthographic projection of the gate driving circuit 110 on the substrate 10 is located on the side of the orthographic projection of the dam 80 on the substrate 10 near the display area AA.

[0053] Secondly, embodiments of this application also provide a display panel having a display area and a non-display area surrounding at least a portion of the display area. The display panel includes: a substrate; a pixel definition layer located on one side of the substrate, extending from the display area to the non-display area; an encapsulation structure located on the side of the pixel definition layer away from the substrate, the encapsulation structure including a first encapsulation layer; and a touch structure located on the side of the encapsulation layer away from the substrate, the touch structure including a first insulating layer. Both the first encapsulation layer and the first insulating layer extend from the display area to the non-display area. In the non-display area, the orthographic projection of the first insulating layer on the substrate covers the orthographic projection of the first encapsulation layer on the substrate, and a portion of the first insulating layer contacts the pixel definition layer. In this embodiment, the contact between the first insulating layer and the pixel definition layer constitutes a first encapsulation boundary, and the contact between the first encapsulation layer and the pixel definition layer constitutes a second encapsulation boundary. By setting two encapsulation boundaries, the encapsulation effect of the display panel is improved.

[0054] Thirdly, embodiments of this application provide a method for preparing a display panel, used to prepare the aforementioned display panel.

[0055] Figure 10 This is a schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application. Figure 10 As shown, the method includes the following steps.

[0056] Step S1010: Prepare a pixel definition layer on the substrate.

[0057] In this embodiment, the pixel definition layer extends from the display area to the non-display area.

[0058] In this embodiment, before step S1010, the method further includes: forming a fourth film layer on the substrate, patterning the fourth film layer to obtain a fourth insulating layer and a first sub-part of the dam; forming a third film layer on the side of the fourth insulating layer away from the substrate, patterning the third film layer to obtain a third film layer and a second sub-part of the dam, wherein the first sub-part and the second sub-part constitute the dam, and the dam is located in a non-display area. Optionally, before the step of forming the third film layer on the side of the fourth insulating layer away from the substrate, the method further includes: preparing a third metal layer on the side of the fourth insulating layer away from the substrate, patterning the third metal layer to obtain multiple touch traces, wherein the touch traces are located in a non-display area, and the orthographic projection of the touch traces on the substrate is located on the side of the orthographic projection of the dam on the substrate away from the display area. In this embodiment, the dam is prepared by two-step patterning (i.e., hole drilling), without adding a new fabrication process, simplifying the process steps.

[0059] In other embodiments, the dam can also be obtained through a one-step patterning process. Optionally, before step S1010, the method includes sequentially forming a fourth insulating layer and a third insulating layer on the substrate, and patterning the third insulating layer and the fourth insulating layer to obtain the dam, which is located in the non-display area. In this method, the fourth insulating layer and the third insulating layer are formed first, and then a patterning process is added to form the dam. This avoids impurity deposition and improves the reliability of the display panel. In this embodiment, after forming the fourth insulating layer and before forming the third insulating layer, the method further includes: preparing a third metal layer on the side of the fourth insulating layer away from the substrate, and patterning the third metal layer to obtain multiple touch traces.

[0060] Optionally, before the step of fabricating the pixel definition layer on the substrate, the method further includes: fabricating a second electrode layer on the substrate. The second electrode layer includes a plurality of second electrodes, and the pixel definition layer encloses a plurality of pixel openings, with the pixel openings exposing a portion of the second electrodes. After the step of fabricating the pixel definition layer on the substrate, the method further includes: fabricating an isolation structure on the side of the pixel definition layer facing away from the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation openings communicating with the pixel openings; and sequentially fabricating a light-emitting layer, a first electrode layer, and a second encapsulation layer on the side of the pixel definition layer facing away from the substrate. The second electrode layer, the light-emitting layer, and the first electrode layer form a plurality of light-emitting devices, the light-emitting devices being located at least within the pixel openings. The second encapsulation layer includes a plurality of spaced-apart encapsulation units, each encapsulation unit corresponding to a pixel opening, the orthographic projection of the encapsulation unit on the substrate covering the orthographic projection of the light-emitting device on the substrate.

[0061] Optionally, after the steps of sequentially preparing the light-emitting layer, the first electrode layer, and the second encapsulation layer, the method further includes: preparing a third encapsulation layer on the side of the second encapsulation layer away from the substrate, wherein the orthographic projection of the third encapsulation layer on the substrate covers the orthographic projection of the second encapsulation layer on the substrate, and the third encapsulation layer terminates on the side of the dam near the display area.

[0062] Step S1020: Prepare a first encapsulation layer on the side of the pixel definition layer away from the substrate.

[0063] Optionally, after the step of fabricating the third encapsulation layer, the method includes: fabricating a first encapsulation layer on the side of the pixel definition layer facing away from the substrate. The first encapsulation layer, the second encapsulation layer, and the third encapsulation layer constitute an encapsulation structure. The first encapsulation layer extends from the display area to the non-display area, and in the non-display area, the first encapsulation layer contacts the pixel definition layer.

[0064] Step S1030: A touch structure is prepared on the side of the first encapsulation layer away from the substrate.

[0065] In this embodiment, the first insulating layer extends from the display area to the non-display area, and the edge of the first insulating layer extends beyond the edge of the first encapsulation layer and contacts the pixel definition layer.

[0066] Optionally, step S1030 specifically includes: preparing a first film layer on the side of the first encapsulation layer away from the substrate; preparing a first metal layer on the side of the first film layer away from the substrate, and patterning the first metal layer to obtain a first touch metal layer; preparing a second film layer on the side of the first touch metal layer away from the substrate, and patterning the first film layer and the second film layer to obtain a first insulating layer and a second insulating layer respectively; preparing a second metal layer on the side of the second insulating layer away from the substrate, and patterning the second metal layer to obtain a second touch metal layer, wherein the first insulating layer, the first touch metal layer, the second insulating layer, and the second touch metal layer constitute a touch structure. In this embodiment, the patterning process includes etching, such as dry etching, laser etching, etc. In this embodiment, the first touch metal layer includes a plurality of first connecting portions; the second touch metal layer includes a plurality of second connecting portions, a first touch electrode block, a second touch electrode block, etc. In this embodiment, forming the first insulating layer and the second insulating layer through a one-step patterning process can simplify the fabrication process and improve fabrication efficiency. In other embodiments, the first film layer and the second film layer can be patterned separately to obtain the first insulating layer and the second insulating layer, respectively. In this case, the edges of the first insulating layer and the edges of the second insulating layer may not be aligned.

[0067] Fourthly, embodiments of this application provide a display device, which includes the display panel described in the above embodiments.

[0068] Figure 11This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 11 As shown, display device 1100 is a product with image display function. For example, display device 1100 can be used to display static images, such as pictures or photographs. Display device 1100 can also be used to display moving images, such as videos.

[0069] Display device 1100 may be a laptop, mobile phone, handheld or portable computer, camera, camcorder, in-vehicle smart central control screen, calculator, smartwatch, GPS navigator, electronic photo, electronic billboard or sign, projector, etc.

[0070] The display device 1100 includes the display panel provided in any of the above embodiments. The display panel may be an organic light-emitting diode display panel or a quantum dot electroluminescent display panel.

[0071] In addition, the display device 1100 can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device 1100 also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0072] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0073] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0074] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0075] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0076] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area surrounding at least a portion of the display area. substrate; A pixel definition layer is located on one side of the substrate, and the pixel definition layer extends from the display area to the non-display area; An encapsulation structure is located on the side of the pixel definition layer opposite to the substrate, and the encapsulation structure includes a first encapsulation layer; A touch structure is located on the side of the packaging structure opposite to the substrate, and the touch structure includes a first insulating layer; Wherein, both the first encapsulation layer and the first insulating layer extend from the display area to the non-display area, and the edge of the first insulating layer extends beyond the edge of the first encapsulation layer and contacts the pixel definition layer; The touch structure further includes a second insulating layer located on the side of the first insulating layer away from the substrate, extending from the display area to the non-display area; the edge of the second insulating layer is aligned with the edge of the first insulating layer, or the distance from the edge of the second insulating layer to the edge of the display area is less than the distance from the edge of the first insulating layer to the edge of the display area.

2. The display panel according to claim 1, characterized in that, In the non-display area, the first encapsulation layer and the pixel definition layer are in contact.

3. The display panel according to claim 1, characterized in that, The packaging structure further includes a second packaging layer, which is located on the side of the first packaging layer near the substrate and is located in the display area.

4. The display panel according to claim 3, characterized in that, The pixel definition layer encloses multiple pixel openings in the display area; the display panel also includes multiple light-emitting devices, at least a portion of which are located within the pixel openings.

5. The display panel according to claim 4, characterized in that, The second encapsulation layer includes a plurality of encapsulation units spaced apart, each encapsulation unit corresponding to a pixel opening, and the orthographic projection of the encapsulation unit on the substrate covers the orthographic projection of the light-emitting device on the substrate.

6. The display panel according to claim 3, characterized in that, The display panel further includes a dam located in the non-display area and between the substrate and the pixel definition layer, the dam surrounding the display area; the encapsulation structure further includes a third encapsulation layer located between the first encapsulation layer and the second encapsulation layer, the orthographic projection of the third encapsulation layer on the substrate covering the orthographic projection of the second encapsulation layer on the substrate, the third encapsulation layer extending from the display area to the non-display area and ending at the side of the dam closest to the display area.

7. The display panel according to claim 6, characterized in that, The materials of the first and second encapsulation layers include inorganic materials, and the material of the third encapsulation layer includes organic materials.

8. The display panel according to claim 1, characterized in that, The materials of the first insulating layer and / or the second insulating layer include inorganic materials.

9. The display panel according to claim 1, characterized in that, The touch structure further includes a first touch metal layer and a second touch metal layer, wherein the first touch metal layer is located between the first insulating layer and the second insulating layer, and the second touch metal layer is located on the side of the second insulating layer opposite to the substrate.

10. The display panel according to claim 9, characterized in that, The first touch metal layer includes a plurality of first connecting portions, the second touch metal layer includes a plurality of first touch electrode blocks, a plurality of second touch electrode blocks and a plurality of second connecting portions, the second insulating layer is provided with a first via, two adjacent first touch electrode blocks are electrically connected to the first connecting portions through the first via, and two adjacent second touch electrode blocks are electrically connected through the second connecting portions.

11. The display panel according to claim 1, characterized in that, The display panel also includes multiple touch traces, which are located on the side of the pixel definition layer near the substrate and in the non-display area; The orthographic projection of the touch trace on the substrate is within the range of the orthographic projection of the first insulating layer on the substrate, and the orthographic projection of the touch trace on the substrate does not overlap with the orthographic projection of the first encapsulation layer on the substrate.

12. The display panel according to claim 11, characterized in that, The touch structure further includes a second touch metal layer, which includes a plurality of first touch electrode blocks, a plurality of second touch electrode blocks, a plurality of first leads and a plurality of second leads, wherein the first leads are connected to the first touch electrode blocks and the second leads are connected to the second touch electrode blocks; The first insulating layer is provided with a second via, and the pixel definition layer is provided with a third via. The orthographic projection of the third via on the substrate at least partially overlaps with the orthographic projection of the second via on the substrate. The first lead and / or the second lead and the touch trace are electrically connected through the second via and the third via.

13. The display panel according to claim 12, characterized in that, The display panel further includes a third insulating layer located on the side of the touch trace layer away from the substrate. The third insulating layer is provided with a fourth via. The orthographic projection of the fourth via on the substrate at least partially overlaps with the orthographic projection of the second via or the third via on the substrate. The first lead and / or the second lead are electrically connected to the touch trace through the second via, the third via, and the fourth via.

14. The display panel according to claim 1, characterized in that, It also includes at least one dam located between the substrate and the pixel definition layer and in the non-display area, the dam being disposed around the display area, and the pixel definition layer contacting and covering the dam.

15. The display panel according to claim 14, characterized in that, The orthographic projection of the first insulating layer on the substrate covers the orthographic projection of the dam on the substrate; the orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the dam on the substrate.

16. The display panel according to claim 14, characterized in that, The display panel also includes multiple touch traces, the orthographic projection of which is located on the side of the dam on the substrate away from the display area.

17. The display panel according to claim 14, characterized in that, The display panel further includes a gate driving circuit, which is located on the side of the pixel definition layer near the substrate and in the non-display area. The orthogonal projection of the gate driving circuit on the substrate is located on the side of the orthogonal projection of the dam on the substrate near the display area.

18. The display panel according to claim 14, characterized in that, The number of dams is two, and the dams include a first dam and a second dam set at an interval. The first dam surrounds the display area, and the second dam surrounds the first dam.

19. The display panel according to claim 14, characterized in that, The display panel further includes a third insulating layer, which is located on the side of the pixel definition layer near the substrate; the dam and the third insulating layer are fabricated in the same layer.

20. The display panel according to claim 19, characterized in that, The dam is made of the same material as the third insulating layer.

21. The display panel according to claim 19, characterized in that, The display panel further includes a fourth insulating layer, which is located on the side of the third insulating layer close to the substrate; the dam includes a first sub-part and a second sub-part stacked sequentially in a direction away from the substrate, wherein the first sub-part and the fourth insulating layer are fabricated in the same layer, and the second sub-part and the third insulating layer are fabricated in the same layer.

22. The display panel according to claim 21, characterized in that, The material of the first sub-part is the same as the material of the fourth insulating layer, and the material of the second sub-part is the same as the material of the third insulating layer.

23. The display panel according to claim 1, characterized in that, It also includes an isolation structure located on the side of the pixel definition layer opposite to the substrate, the isolation structure enclosing multiple isolation openings; the display panel also includes multiple light-emitting devices, the light-emitting devices being located within the isolation openings.

24. The display panel according to claim 23, characterized in that, The isolation structure includes a first part and a second part stacked sequentially along a direction away from the substrate, wherein the orthographic projection of the second part on the substrate covers the orthographic projection of the first part on the substrate.

25. The display panel according to claim 24, characterized in that, The isolation structure further includes a third part, which is located on the side of the first part closer to the substrate, and the orthographic projection of the first part on the substrate is located within the orthographic projection of the third part on the substrate.

26. The display panel according to claim 24, characterized in that, The material of the first part includes a conductive material, and the light-emitting device includes a first electrode. The first electrode overlaps with the first part, or the first electrode contacts the sidewall of the first part.

27. The display panel according to claim 26, characterized in that, The light-emitting device further includes a second electrode and a light-emitting functional layer, wherein the second electrode, the light-emitting functional layer and the first electrode are stacked sequentially along the direction away from the substrate.

28. A display panel, characterized in that, The display panel includes a display area and a non-display area surrounding at least a portion of the display area. substrate; A pixel definition layer is located on one side of the substrate, and the pixel definition layer extends from the display area to the non-display area; An encapsulation structure is located on the side of the pixel definition layer opposite to the substrate, and the encapsulation structure includes a first encapsulation layer; A touch structure is located on the side of the packaging structure opposite to the substrate, and the touch structure includes a first insulating layer; Wherein, both the first encapsulation layer and the first insulating layer extend from the display area to the non-display area. In the non-display area, the orthographic projection of the first insulating layer on the substrate covers the orthographic projection of the first encapsulation layer on the substrate, and a portion of the first insulating layer contacts the pixel definition layer. The touch structure further includes a second insulating layer located on the side of the first insulating layer away from the substrate, extending from the display area to the non-display area; the edge of the second insulating layer is aligned with the edge of the first insulating layer, or the distance from the edge of the second insulating layer to the edge of the display area is less than the distance from the edge of the first insulating layer to the edge of the display area.

29. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a non-display area surrounding at least a portion of the display area, and the manufacturing method includes: A pixel definition layer is fabricated on a substrate, the pixel definition layer extending from the display area to the non-display area; A first encapsulation layer is prepared on the side of the pixel definition layer opposite to the substrate; A touch structure is fabricated on the side of the first encapsulation layer opposite to the substrate, and the touch structure includes a first insulating layer; Wherein, both the first encapsulation layer and the first insulating layer extend from the display area to the non-display area, and the edge of the first insulating layer extends beyond the edge of the first encapsulation layer and contacts the pixel definition layer; The touch structure further includes a second insulating layer located on the side of the first insulating layer away from the substrate, extending from the display area to the non-display area; the edge of the second insulating layer is aligned with the edge of the first insulating layer, or the distance from the edge of the second insulating layer to the edge of the display area is less than the distance from the edge of the first insulating layer to the edge of the display area.

30. The preparation method according to claim 29, characterized in that, The step of fabricating a touch structure on the side of the first encapsulation layer opposite to the substrate includes: A first film layer is prepared on the side of the first encapsulation layer opposite to the substrate; A first metal layer is prepared on the side of the first film layer away from the substrate, and the first metal layer is patterned to obtain a first touch metal layer; A second film layer is prepared on the side of the first touch metal layer away from the substrate, and the first film layer and the second film layer are respectively patterned to obtain the first insulating layer and the second insulating layer. A second metal layer is prepared on the side of the second insulating layer away from the substrate, and the second metal layer is patterned to obtain a second touch metal layer. The first insulating layer, the first touch metal layer, the second insulating layer, and the second touch metal layer constitute the touch structure.

31. The preparation method according to claim 29, characterized in that, Prior to the step of fabricating the pixel definition layer on the substrate, the method further includes: A fourth film layer is formed on the substrate, and the fourth film layer is patterned to obtain a fourth insulating layer and the first sub-part of the dam. A third film layer is formed on the side of the fourth insulating layer away from the substrate, and the third film layer is patterned to obtain the third insulating layer and the second sub-part of the dam; the first sub-part and the second sub-part constitute the dam, and the dam is located in the non-display area.

32. The preparation method according to claim 31, characterized in that, Before the step of forming the third film layer on the side of the fourth insulating layer away from the substrate, the method further includes: preparing a third metal layer on the side of the fourth insulating layer away from the substrate, and patterning the third metal layer to obtain multiple touch lines, wherein the touch lines are located in the non-display area, and the orthogonal projection of the touch lines on the substrate is located on the side of the orthogonal projection of the dam on the substrate away from the display area.

33. The preparation method according to claim 29, characterized in that, Prior to the step of fabricating the pixel definition layer on the substrate, the method further includes: A fourth insulating layer and a third insulating layer are sequentially formed on the substrate. The third insulating layer and the fourth insulating layer are patterned to obtain a dam, which is located in the non-display area.

34. The preparation method according to claim 33, characterized in that, After forming the fourth insulating layer and before forming the third insulating layer, the method further includes: preparing a third metal layer on the side of the fourth insulating layer away from the substrate, and patterning the third metal layer to obtain multiple touch traces, wherein the touch traces are located in the non-display area, and the orthographic projection of the touch traces on the substrate is located on the side of the orthographic projection of the dam on the substrate away from the display area.

35. The preparation method according to claim 29, characterized in that, Before the step of preparing a pixel definition layer on the substrate, the method further includes: preparing a second electrode layer on the substrate, the second electrode layer including a plurality of second electrodes, the pixel definition layer enclosing a plurality of pixel openings, the pixel openings exposing a portion of the second electrodes; After the step of fabricating a pixel definition layer on the substrate, the method further includes: fabricating an isolation structure on the side of the pixel definition layer away from the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation openings being in communication with the pixel openings; A light-emitting layer, a first electrode layer, and a second encapsulation layer are sequentially fabricated on the side of the pixel definition layer away from the substrate. The second electrode layer, the light-emitting layer, and the first electrode layer form a plurality of light-emitting devices. The light-emitting devices are located at least within the pixel opening. The second encapsulation layer includes a plurality of encapsulation units arranged at intervals. The encapsulation units correspond one-to-one with the pixel openings. The orthographic projection of the encapsulation unit on the substrate covers the orthographic projection of the light-emitting device on the substrate.

36. The preparation method according to claim 35, characterized in that, After the step of sequentially fabricating the light-emitting layer, the first electrode layer, and the second encapsulation layer on the side of the pixel definition layer away from the substrate, the method further includes: fabricating a third encapsulation layer on the side of the second encapsulation layer away from the substrate, wherein the orthographic projection of the third encapsulation layer on the substrate covers the orthographic projection of the second encapsulation layer on the substrate, and the third encapsulation layer terminates on the side of the dam near the display area.

37. A display device, characterized in that, Includes the display panel according to any one of claims 1 to 28, or the display panel prepared by the preparation method according to any one of claims 29 to 36.

Images