Display module, preparation method thereof and display device

Abstract

Embodiments of the present application provide a display module, a preparation method thereof and a display device. The display module comprises a back plate, a display panel and a circuit board assembly. The back plate has a first side and a second side in the thickness direction thereof; the display panel comprises a display area, a bending area and a non-display area connected in sequence; the display area is arranged on the first side of the back plate, and the non-display area is arranged on the second side of the back plate through the bending area; the circuit board assembly is arranged on the second side of the back plate and comprises a transition circuit board and a circuit board assembly component; the transition circuit board is arranged on the side of the non-display area away from the bending area and connected with the non-display area; the circuit board assembly component comprises a main circuit board, which is laminated on the side of the transition circuit board and the non-display area away from the back plate and connected with the transition circuit board; the orthographic projection of the main circuit board on the back plate has an overlapping area with the orthographic projection of the non-display area on the back plate, so that the space occupied by the circuit board assembly on the non-display side of the display panel is reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module, a preparation method thereof, and a display device. Background Art

[0002] The flexible printed circuit (FPC) in a display module is typically connected to the display panel through a bonding process. After bonding, a pad bending process is required. This process bends the end of the display panel bound to the FPC toward the non-display side of the display panel, where other components, such as a battery, are typically located. In display modules of related art, the FPC occupies a significant amount of space on the non-display side of the display panel, resulting in low internal space utilization for the display device. Summary of the Invention

[0003] The purpose of the embodiments of the present invention is to provide a display module, a method for manufacturing the same, and a display device to reduce the space occupied by the circuit board assembly on the non-display side of the display panel, thereby improving the utilization of the internal space of the display device. The specific technical solution is as follows:

[0004] An embodiment of the first aspect of the present application proposes a display module, which includes a backplane, a display panel, and a circuit board assembly. The backplane has a first side and a second side in its thickness direction; the display panel includes a display area, a bending area, and a non-display area connected in sequence; the display area is arranged on the first side of the backplane, and the non-display area is arranged on the second side of the backplane through the bending area; the circuit board assembly is arranged on the second side of the backplane, and includes a transition circuit board and a circuit board assembly; the transition circuit board is arranged on a side of the non-display area away from the bending area and connected to the non-display area; the circuit board assembly includes a main circuit board, which is stacked on the transition circuit board and on a side of the non-display area away from the backplane, and connected to the transition circuit board; the orthographic projection of the main circuit board on the backplane has an overlapping area with the orthographic projection of the non-display area on the backplane.

[0005] In some embodiments of the present application, the minimum distance between the side of the main circuit board close to the backplane and the backplane and the difference between the distance between the side of the non-display area away from the backplane and the backplane are in the range of 0-400 μm.

[0006] In some embodiments of the present application, the non-display area has a first binding area; the first binding area is located on a side of the non-display area away from the bending area;

[0007] The transition circuit board includes: a first main body and a first connecting part; the first main body is spaced apart from the non-display area and is connected to the main circuit board; the first connecting part extends from the first main body to a side of the non-display area away from the back panel; the first connecting part has a second binding area, and the second binding area is bound to the first binding area.

[0008] In some embodiments of the present application, a first adhesive layer is provided between the first main body and the back plate.

[0009] In some embodiments of the present application, the first main body has a third binding area; the third binding area is located on a side of the first main body away from the bending area;

[0010] The main circuit board includes a fourth binding area; the fourth binding area is located on a side of the main circuit board away from the bending area, and the fourth binding area is bound to the third binding area.

[0011] In some embodiments of the present application, the main circuit board has a hollow area; the orthographic projection of the hollow area on the back panel is located within the range of the orthographic projection of the non-display area on the back panel, and is spaced apart from the orthographic projection of the transition circuit board on the back panel;

[0012] A first component is provided on a side of the non-display area away from the display area; the first component is arranged in the hollow area.

[0013] In some embodiments of the present application, a second adhesive layer is provided between a side of the main circuit board close to the bending area and the non-display area;

[0014] The second adhesive layer is spaced apart from the first component.

[0015] In some embodiments of the present application, the main circuit board includes: a second main body portion and a second connecting portion;

[0016] The second main body portion has the fourth binding area and the hollow area;

[0017] The second connecting portion is connected to the second main body portion, and its orthographic projection on the back panel is spaced apart from the orthographic projections of the non-display area and the bending area on the back panel.

[0018] In some embodiments of the present application, the distance between the side of the second main body of the main circuit board away from the bending zone and the bending zone is less than or equal to the distance between the side of the transition circuit board away from the bending zone and the bending zone.

[0019] In some embodiments of the present application, the distance between the second main body portion of the main circuit board and the bending zone is in the range of 13-20 mm.

[0020] The minimum distance between the first component and the third binding area has a value range of 1.2-1.6 mm.

[0021] In some embodiments of the present application, the first binding area is provided with a plurality of first pins; the second binding area is provided with a plurality of second pins; the first pins and the second pins are bound;

[0022] The third binding area is provided with a plurality of third pins; the fourth binding area is provided with a plurality of fourth pins; the third pins are bound to the fourth pins;

[0023] The second main body has a device area, and the device area is located on a side of the hollow area close to the bending area;

[0024] The circuit board assembly includes a second component, which is arranged in the component area and located on a side of the second main body away from the back plate;

[0025] A connector is provided on a side of the second connecting portion away from the back plate.

[0026] In some embodiments of the present application, the transition circuit board is a double-layer board;

[0027] The main circuit board is a double-layer board or a multi-layer board.

[0028] In some embodiments of the present application, the display module further includes:

[0029] a first backing film, disposed between the back plate and the display area;

[0030] a third adhesive layer, disposed between the back plate and the first back film;

[0031] a second back film, disposed between the back plate and the non-display area;

[0032] a fourth adhesive layer, disposed between the back plate and the second back film;

[0033] The protective adhesive layer covers a side of the bending area away from the display area and the non-display area, and extends from the bending area to the display area and the non-display area.

[0034] An embodiment of the second aspect of the present application provides a method for preparing a display module, which is used to prepare the display module of any embodiment of the first aspect, comprising:

[0035] providing the display panel;

[0036] connecting the transition circuit board of the circuit board assembly to the display panel;

[0037] connecting the circuit board assembly of the circuit board assembly to the transition circuit board;

[0038] Fixing the back plate to the display panel;

[0039] The display panel is bent so that the non-display area and the circuit board assembly are located on the second side of the backplane, and the orthographic projection of the main circuit board on the backplane has an overlapping area with the orthographic projection of the non-display area on the backplane.

[0040] An embodiment of the third aspect of the present application provides a display device, comprising the display module of any embodiment of the first aspect.

[0041] Beneficial effects of the embodiments of the present invention:

[0042] The display module of the embodiment of the present application includes a backplane, a display panel and a circuit board assembly. The display panel includes a display area, a bending area and a non-display area connected in sequence, the display area is arranged on the first side a of the backplane, and the non-display area is arranged on the second side b of the backplane through the bending area, that is, one end of the display panel in the first direction is bent from the first side a of the backplane to the second side b of the backplane to form the display area, the bending area and the non-display area; the circuit board assembly is arranged on the second side b of the backplane, including a transition circuit board and a circuit board assembly; the transition circuit board is arranged on the side of the non-display area away from the bending area and is connected to the non-display area, that is, the transition circuit board, the non-display area and the bending area are arranged in sequence in the first direction; the circuit board assembly includes a main circuit The circuit board and the main circuit board are stacked on the side of the transition circuit board and the non-display area away from the back panel, and are connected to the transition circuit board; the orthographic projection of the main circuit board on the back panel has an overlapping area with the orthographic projection of the non-display area on the back panel, that is, in the first direction, the main circuit board can extend toward the area where the non-display area is located, and the main circuit board and the non-display area are overlapped, thereby saving the space occupied by the circuit board assembly extending away from the display area in the first direction, making the structure of the non-display side of the display panel more compact, thereby reducing the space occupied by the circuit board assembly on the non-display side of the display panel, and thereby improving the utilization rate of the internal space of the display device.

[0043] The display module prepared by the preparation method of the display module of the embodiment of the present application has an overlapping area between the orthographic projection of the main circuit board on the back panel and the orthographic projection of the non-display area on the back panel, that is, in the first direction, the main circuit board can extend toward the area where the non-display area is located, and the main circuit board and the non-display area are arranged to overlap, thereby saving the space occupied by the circuit board assembly extending away from the display area in the first direction, making the structure of the non-display side of the display panel more compact, thereby reducing the space occupied by the circuit board assembly on the non-display side of the display panel, and thereby improving the utilization rate of the internal space of the display device.

[0044] The display device of an embodiment of the present application includes a display module of any of the above-mentioned embodiments, and the orthographic projection of the main circuit board of the display module on the back panel has an overlapping area with the orthographic projection of the non-display area on the back panel, that is, in the first direction, the main circuit board can extend toward the area where the non-display area is located, and the main circuit board and the non-display area are arranged to overlap, thereby saving the space occupied by the circuit board assembly extending away from the display area in the first direction, making the structure of the non-display side of the display panel more compact, thereby reducing the space occupied by the circuit board assembly on the non-display side of the display panel, and thereby improving the utilization rate of the internal space of the display device.

[0045] Of course, it is not necessary to achieve all of the advantages described above simultaneously in order to implement any product or method of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0047] Figure 1 This is a schematic diagram of the structure of the display module of an embodiment of the present application (pins are not shown);

[0048] Figure 2 for Figure 1 AA cross-sectional view;

[0049] Figure 3 This is a schematic structural diagram of a transition circuit board in an embodiment of the present application;

[0050] Figure 4 This is a schematic structural diagram of the main circuit board in an embodiment of the present application;

[0051] Figure 5 for Figure 1 BB cross-sectional view;

[0052] Figure 6This is a schematic diagram of the structure of the display module according to an embodiment of the present application (showing the pins);

[0053] Figure 7 A dimensioned diagram of a display module according to an embodiment of the present application;

[0054] Figure 8 This is a flow chart of a method for preparing a display module according to an embodiment of the present application;

[0055] Figure 9 1. A process flow chart (top view) of a method for preparing a display module according to an embodiment of the present application;

[0056] Figure 10 FIG. 1 is a process flow chart (cross section) of a method for preparing a display module according to an embodiment of the present application.

[0057] Description of reference numerals:

[0058] Backplane 100; first side 100a; second side 100b; display panel 200; display area 210; bending area 220; non-display area 230; first binding area A1; first pin 231; circuit board assembly 300; transition circuit board 310; first main body 311; third binding area A3; third pin 3111; first connecting portion 312; second binding area A2; second pin 3121; substrate layer 301; trace layer 302; circuit board assembly 320; main circuit board 321; second main body 3211; fourth pin 32111; fourth binding area A4; hollow area A5; device area A6; second connection part 3212; window structure 32121; second component 322; connector 323; first adhesive layer 400; first component 500; second adhesive layer 600; first back film 710; third adhesive layer 720; second back film 730; fourth adhesive layer 740; protective adhesive layer 750; back film 760. DETAILED DESCRIPTION

[0059] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field based on this application are within the scope of protection of the present invention.

[0060] The flexible printed circuit (FPC) in a display module is typically connected to the display panel through a bonding process. After bonding, a pad bending process is required. This process bends the end of the display panel bound to the FPC toward the non-display side of the display panel, where other components, such as a battery, are typically located. In display modules of related art, the FPC occupies a significant amount of space on the non-display side of the display panel, resulting in low internal space utilization for the display device.

[0061] In order to solve the above technical problems, the embodiments of the present application provide a display module, a preparation method thereof, and a display device.

[0062] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of the display module of an embodiment of the present application (pins are not shown). Figure 2 for Figure 1 The embodiment of the present application provides a display module, which includes a back plate 100 (BKT), a display panel 200 (panel, PNL), and a circuit board assembly 300. The back plate 100 has a first side 100a and a second side 100b in its thickness direction; the display panel 200 includes a display area 210, a bending area 220, and a non-display area 230 connected in sequence. Figure 2 The display area 210, the bending area 220 and the non-display area 230 are divided by dotted lines; the display area 210 is arranged on the first side 100a of the back panel 100, and the non-display area 230 is arranged on the second side 100b of the back panel 100 through the bending area 220; the circuit board assembly 300 is arranged on the second side 100b of the back panel 100, including a transition circuit board 310 and a circuit board assembly 320; the transition circuit board 310 is arranged on the side of the non-display area 230 away from the bending area 220, and is connected to the non-display area 230; the circuit board assembly 320 includes a main circuit board 321, which is stacked on the transition circuit board 310 and the side of the non-display area 230 away from the back panel 100, and is connected to the transition circuit board 310; the orthographic projection of the main circuit board 321 on the back panel 100 has an overlapping area with the orthographic projection of the non-display area 230 on the back panel 100.

[0063] For ease of description, we define the first direction, the second direction, and the thickness direction of the display panel 200 as being perpendicular to each other. The first direction may be the length direction or the width direction of the display panel 200 .

[0064] The display module of the embodiment of the present application includes a backplane 100, a display panel 200 and a circuit board assembly 300. The display panel 200 includes a display area 210, a bending area 220 and a non-display area 230 connected in sequence, the display area 210 is arranged on the first side 100a of the backplane 100, and the non-display area 230 is arranged on the second side 100b of the backplane 100 through the bending area 220, that is, one end of the display panel 200 in the first direction is bent from the first side 100a of the backplane 100 to the second side 100b of the backplane 100 to form the display area 210, the bending area 220 and the non-display area 230; the circuit board assembly 300 is arranged on the second side 100b of the backplane 100, and includes a transition circuit board 310 and a circuit board assembly 320; the transition circuit board 310 is arranged on the side of the non-display area 230 away from the bending area 220 and is connected to the non-display area 230, that is, the transition circuit board 310, the non-display area 230 and the bending area 220 in the first direction The circuit board assembly 320 includes a main circuit board 321, which is stacked on the transition circuit board 310 and the side of the non-display area 230 away from the back plate 100, and is connected to the transition circuit board 310; the orthographic projection of the main circuit board 321 on the back plate 100 has an overlapping area with the orthographic projection of the non-display area 230 on the back plate 100, that is, in the first direction, the main circuit board 321 can extend toward the area where the non-display area 230 is located, and the main circuit board 321 and the non-display area 230 are overlapped, thereby saving the space occupied by the circuit board assembly 300 extending in the first direction away from the display area 210, making the structure of the non-display side of the display panel 200 more compact, thereby reducing the space occupied by the circuit board assembly 300 on the non-display side of the display panel 200, and thereby improving the utilization rate of the internal space of the display device.

[0065] It should be noted that the display panel 200 has a display side and a non-display side. The display side refers to the side of the display panel 200 used to display images, that is, the side of the display area 210 away from the backplane 100, and the non-display side refers to the side of the display panel 200 away from the display side, that is, the side of the display area 210 close to the backplane 100.

[0066] For example, a battery (not shown in the figure) can be arranged on the second side 100b of the back panel 100 and on the side of the circuit board assembly 300 away from the non-display area 230 in the first direction. The main circuit board 321 of the display module of the embodiment of the present application and the non-display area 230 are overlapped, thereby saving the space occupied by the circuit board assembly 300 extending in the first direction away from the display area 210, thereby effectively releasing the battery space inside the entire machine and making more space for the battery or other important components.

[0067] Meanwhile, the transition circuit board 310 itself may not contain any circuits or components and is used only for routing. Its primary function is to serve as a transition board, allowing routing adjustments to be made through this transition circuit board 310 without requiring complex wiring directly on the display panel 200. The flexible printed circuit assembly (FPCA) 320 serves as the main FPC (MFPC), containing actual circuitry and SMT (Surface-Mount Technology) components. Serving as an intermediate layer, the transition circuit board 310 simplifies the wiring complexity of the circuit board assembly 320 and reduces the space required for binding the circuit board assembly 320, thereby lowering the manufacturing complexity of the circuit board assembly 320. The transition circuit board 310 provides greater flexibility for routing the circuit board assembly 320. The routing path can be adjusted as needed, optimizing the internal layout and ensuring that the wiring of the main circuit board 321 on the non-display side of the display panel 200 is both compact and rational, avoiding unnecessary bends or intersections, thereby reducing internal space usage. This flexibility not only facilitates current product design but also facilitates future upgrades and maintenance. A properly planned routing path can reduce signal interference and improve signal transmission quality. The design of the transition circuit board 310 allows for better control of the routing of the circuit board assembly 320, thereby optimizing signal transmission performance. Furthermore, the design of the transition circuit board 310 is relatively simple, requiring no complex processing steps, which helps control production costs.

[0068] Furthermore, the display module of the embodiment of the present application does not need to increase the length of the display panel 200 in the first direction, and will not affect the layout utilization of the display panel 200 (panel). This means that the display module of the embodiment of the present application frees up space without sacrificing the size and layout efficiency of the display panel 200, thereby maintaining the compactness of the display device and the consistency of the design.

[0069] The display panel 200 can be a flexible OLED (Flexible Organic Light Emitting Diode). Flexible OLED is a display screen based on organic light-emitting diode technology. It uses a flexible base material instead of a traditional rigid glass substrate, making the entire display panel 200 light, soft and flexible. It can be designed to be foldable or rollable, greatly expanding the design space and application scenarios of the display device, such as being applicable to smartphones, smart watches, wearable or deformable electronic products.

[0070] In some embodiments of the present application, the transition circuit board 310 may be a double-layer board, and the main circuit board 321 may be a double-layer board or a multi-layer board, which can be selected based on the wiring and layout requirements, and is not limited in this application. Figure 2 In the illustrated embodiment, the transition circuit board 310 and the main circuit board 321 are both double-layer FPCs. The FPC has a stacked substrate layer 301 and a routing layer 302, and the double-layer FPC has two routing layers 302, which are separated by the substrate layer 301. The material of the transition circuit board 310 should have good flexibility and mechanical strength to ensure that it is not easily damaged during repeated bending, so a design with polyimide (PI) as the substrate is generally adopted. According to the number of routings and space requirements, a double-layer board with a thickness of ≤0.1mm is generally selected. In order to reduce the length of the main circuit board 321 as much as possible and save the space it occupies in the non-display area 230, a multi-layer board can be selected according to the actual number of routings and the complexity of the space. A 6-layer board or a 4-layer board can be selected.

[0071] FPC is an electronic circuit board that can be bent, folded, or even curled. In the application of flexible OLED, FPC plays a vital role. It uses flexible materials such as polyester film or polyimide as a substrate and etches conductive circuits on it to transmit electrical signals. Due to its high flexibility, FPC can adapt to the dynamic deformation of the flexible OLED screen during folding and unfolding, ensuring the continuity and reliability of signal transmission within the display module.

[0072] The main circuit board 321 can also be a rigid-flex board. A rigid-flex PCB (RFPCB) is a special type of printed circuit board (PCB) that combines the advantages of a rigid circuit board and a flexible circuit board to form a hybrid circuit board with both a rigid part and a flexible area. This allows it to adapt to the needs of complex three-dimensional layout designs within a limited space and achieve reliable connections between electronic components.

[0073] In some embodiments of the present application, Figures 1 to 3 As shown, Figure 3 This is a structural schematic diagram of the transition circuit board 310 in an embodiment of the present application, wherein the non-display area 230 has a first binding area A1; the first binding area A1 is located on the side of the non-display area 230 away from the bending area 220; the transition circuit board 310 includes a first main body portion 311 and a first connecting portion 312; the first main body portion 311 is spaced apart from the non-display area 230 and is connected to the main circuit board 321; the first connecting portion 312 extends from the first main body portion 311 to the side of the non-display area 230 away from the back panel 100; the first connecting portion 312 has a second binding area A2, and the second binding area A2 is bound to the first binding area A1. Figure 3The dotted line in the figure is used to divide the first main body portion 311 and the first connecting portion 312. With this arrangement, the first connecting portion 312 is bound to the side of the first main body portion 311 away from the non-display area 230, which can reduce the space occupied by the transition circuit board 310 in the non-display area 230 and provide more layout space for other components; the wiring extends from the second binding area A2 to the first main body portion 311 and is reasonably distributed on the first main body portion 311, which also facilitates the wiring design of the main circuit board 321.

[0074] The first binding area A1 can be located on the side of the non-display area 230 away from the back panel 100, and the second binding area A2 can be located on the side of the first connection portion 312 close to the back panel 100, so that the first binding area A1 and the second binding area A2 can be arranged relative to each other for easy binding.

[0075] The size of the transition circuit board 310 should be as small as possible to reduce the impact on the layout of the display panel 200. Its width in the second direction generally needs to be similar to the size of the first binding area A1 in the second direction to facilitate the binding process; in order to facilitate routing, welding or binding, the length of the transition circuit board 310 should be greater than or equal to 20 mm, and should be designed to be as short as possible based on the routing.

[0076] In some embodiments of the present application, Figure 2 As shown, a first adhesive layer 400 is provided between the first main body portion 311 and the back plate 100. The first adhesive layer 400 serves to fix the first main body portion 311 and elevate the circuit board assembly 300. By controlling the thickness of the first adhesive layer 400, the distance between the first main body portion 311 and the back plate 100, as well as the distance between the main circuit board 321 and the back plate 100, can be controlled. This ensures that a large step difference is not generated when the transition circuit board 310 and the main circuit board 321 extend from the side away from the non-display area 230 to the top of the non-display area 230, thereby preventing the first connecting portion 312 from breaking due to the large step difference.

[0077] Optionally, the first adhesive layer 400 may be a pressure sensitive adhesive (PSA).

[0078] In some embodiments of the present application, Figures 1 to 4 As shown, Figure 4This is a schematic diagram of the structure of the main circuit board 321 in an embodiment of the present application. The first main body 311 has a third binding area A3; the third binding area A3 is located on the side of the first main body 311 away from the bending area 220. The main circuit board 321 includes a fourth binding area A4; the fourth binding area A4 is located on the side of the main circuit board 321 away from the bending area 220 and is bound to the third binding area A3. The third binding area A3 is located on the side of the first main body 311 away from the bending area 220, reserving more space for the wiring on the first main body 311. The fourth binding area A4 is located on the side of the main circuit board 321 away from the bending area 220, reserving more space for the wiring on the main circuit board 321. This allows the main circuit board 321 to extend from the position where it is bound to the first main body 311 toward the bending area 220, thereby increasing the overlap area between the main circuit board 321 and the non-display area 230.

[0079] The configuration of the transition circuit board 310 allows it to be pulled forward from the front of the display panel 200. Forward pulling refers to the transition circuit board 310 pulling the wire from the first binding area A1 of the non-display area 230 along a first direction away from the non-display area 230, thereby avoiding complex wiring processing directly on the non-display area 230, making the reverse pulling of the main circuit board 321 simpler and more reliable. Through the above-mentioned configuration, the reverse pulling of the main circuit board 321 is achieved. Reverse pulling refers to the main circuit board 321 pulling the wire from the third binding area A3 of the transition circuit board 310 along the first direction toward the non-display area 230, allowing the main circuit board 321 to be wired along the back of the non-display area 230 without occupying space in areas such as the battery. This not only frees up battery space but also ensures smooth and neat routing of the circuit board assembly 300.

[0080] The third binding area A3 can be located on the side of the first main body 311 away from the back panel 100, and the fourth binding area A4 can be located on the side of the main circuit board 321 close to the back panel 100, so that the third binding area A3 and the fourth binding area A4 can be relatively set to facilitate binding.

[0081] In some embodiments of the present application, Figures 1 to 4 As shown, the main circuit board 321 has a hollow area A5; the orthographic projection of the hollow area A5 on the back panel 100 is located within the range of the orthographic projection of the non-display area 230 on the back panel 100, and is spaced apart from the orthographic projection of the transition circuit board 310 on the back panel 100; a first component 500 is provided on the side of the non-display area 230 away from the display area 210; the first component 500 is arranged in the hollow area A5, so that the first component 500 occupies the layout space of the main circuit board 321 without occupying other space in the non-display area 230, so that the layout of the non-display side of the display panel 200 is more compact.

[0082] Optionally, the first component 500 may be an IC (integrated circuit).

[0083] In some embodiments of the present application, Figure 2 As shown, a second adhesive layer 600 is provided between the side of the main circuit board 321 close to the bending area 220 and the non-display area 230; the second adhesive layer 600 is spaced apart from the first component 500. The second adhesive layer 600 fixes the main circuit board 321, ensuring its stability during use, reducing the risk of disconnection due to vibration or external forces, and improving the overall reliability of the product. The second adhesive layer 600 is spaced apart from the first component 500 to prevent affecting the performance of the first component 500. The second adhesive layer 600 is provided on the side of the main circuit board 321 close to the bending area 220, and the fourth binding area A4 is located on the side of the main circuit board 321 away from the bending area 220, and is bound to the third binding area A3. The mutual cooperation can fix both ends of the main circuit board 321 in the first direction to achieve a better fixing effect.

[0084] Furthermore, the thickness of the second adhesive layer 600 can be greater than or equal to 0.03 mm, and the bonding strength can be greater than 10 N / cm 2 , to ensure that it will not shift or fall off during long-term use. The second adhesive layer 600 should be made of a material with good bonding properties and durability to adapt to different temperature and humidity conditions.

[0085] Optionally, the second adhesive layer 600 may be a pressure sensitive adhesive (PSA).

[0086] In some embodiments of the present application, Figure 1 、 Figure 5 and Figure 6 As shown, Figure 5 for Figure 1 BB cross-sectional view, Figure 6 This is a schematic diagram of the structure of the display module (pins are shown) of an embodiment of the present application. The main circuit board 321 includes a second main portion 3211 and a second connecting portion 3212. The second main portion 3211 has a fourth binding area A4 and a hollow area A5. The second connecting portion 3212 is connected to the second main portion 3211, and its orthographic projection on the back panel 100 is spaced from the orthographic projections of the non-display area 230 and the bending area 220 on the back panel 100. In other words, the second connecting portion 3212 does not extend toward the non-display area 230, allowing for flexible bending and fastening to the terminal motherboard. Figure 6 In the embodiment shown, the second connection portion 3212 extends in a direction away from the non-display area 230. Figure 6The two dotted boxes in the middle show the remaining setting positions of the second connection portion 3212, that is, located on either side of the second main body portion 3211 in the second direction, which is not limited in this application.

[0087] In some embodiments of the present application, Figures 3 to 6 As shown, it should be noted that in order to more clearly show the setting method of the pins, Figure 3 The transparency of the transition circuit board 310 is processed. Figure 4 The transparency of the main circuit board 321 is processed. Figure 6 The circuit board assembly 300 has been enhanced for transparency. A first binding area A1 is provided with a plurality of first pins 231; a second binding area A2 is provided with a plurality of second pins 3121, with the first pins 231 and the second pins 3121 being bonded together; a third binding area A3 is provided with a plurality of third pins 3111; and a fourth binding area A4 is provided with a plurality of fourth pins 32111, with the third pins 3111 and the fourth pins 32111 being bonded together; the second body portion 3211 has a device area A6, which is located on the side of the hollow area A5 near the bend area 220; the circuit board assembly 320 includes a second component 322, which is located in device area A6 and on the side of the second body portion 3211 away from the backplane 100; and a connector 323 (Board-to-Board, BTB) is provided on the side of the second connection portion 3212 away from the backplane 100. The use of bonded pins for connection improves connection precision; the provision of connector 323 improves connection reliability and reduces assembly time.

[0088] Alternatively, as Figure 5 As shown, a window structure 32121 can be provided on the substrate layer 301 of the backplane 100 away from the second connection portion 3212, so that the second connection portion 3212 is exposed away from the routing layer 302 of the backplane 100, and the connector 323 is provided in the window structure 32121 and connected to the routing layer 302.

[0089] The dimensions of the third binding area A3 and the fourth binding area A4 can be 10mm x 2mm, and the pins are pins, using a double-row pin (gold finger) design, with a spacing of 0.5mm between adjacent pins. In some other embodiments of the present application, the pins can also be designed as bumps, which is not limited in this application.

[0090] In some embodiments of the present application, Figure 7 As shown, Figure 7This is a dimensioned diagram of the display module of an embodiment of the present application. The distance a between the second main portion 3211 of the main circuit board 321, which is located away from the bending zone 220, and the bending zone 220 is in the range of 13-20 mm. The minimum distance b between the first component 500 and the third binding zone A3 is in the range of 1.2-1.6 mm. This range ensures a reasonable layout of components while reducing the space occupied by the circuit board assembly 300, leaving ample room for wiring.

[0091] In some embodiments of the present application, Figure 7 As shown, the difference between the minimum distance c between the side of the main circuit board 321 closest to the backplane 100 and the backplane 100 and the distance d between the side of the non-display area 230 away from the backplane 100 and the backplane 100 is in the range of 0-400μm. The main circuit board 321 extends from the transition circuit board 310 to the non-display area 230 of the display panel 200, creating a natural transition. The fourth binding area A4 corresponds to the position closest to the backplane 100. Setting this within the above numerical range prevents a large step difference, thereby reducing the occurrence of poor contact and breakage of the routing layer 302 caused by a large step difference.

[0092] It is understood that the side of the main circuit board 321 away from the non-display area 230 and the side close to the back plate 100 can be lower or higher than the side of the non-display area 230 away from the back plate 100, or the two can be flush. Figure 7 In the illustrated embodiment, the side of the main circuit board 321 away from the non-display area 230 and the side close to the back plate 100 are higher than the side of the non-display area 230 away from the back plate 100 .

[0093] In some embodiments of the present application, Figure 6 and Figure 7 As shown, the distance a between the second main portion 3211 of the main circuit board 321 and the bending region 220 on the side away from the bending region 220 is less than or equal to the distance e between the side of the transition circuit board 310 and the bending region 220 on the side away from the bending region 220. This arrangement ensures that the main circuit board 321 only occupies the space between the transition circuit board 310 and the non-display area 230 in the first direction, and does not occupy any additional space. This saves space occupied by the circuit board assembly 300 on the non-display side of the display panel 200, thereby improving the utilization of the internal space of the display device.

[0094] In some embodiments of the present application, Figure 7As shown, the display module also includes a first backing film 710 (U-Film), a third adhesive layer 720 (PI adhesive), a second backing film 730 (U-Film), a fourth adhesive layer 740 (Bending tape), and a protective adhesive layer 750 (MCL). The first backing film 710 is disposed between the backplane 100 and the display area 210; the third adhesive layer 720 is disposed between the backplane 100 and the first backing film 710; the second backing film 730 is disposed between the backplane 100 and the non-display area 230; the fourth adhesive layer 740 is disposed between the backplane 100 and the second backing film 730; and the protective adhesive layer 750 is coated on the side of the bending area 220 away from the display area 210 and the non-display area 230, and extends from the bending area 220 to the display area 210 and the non-display area 230. Among them, the third adhesive layer 720 and the fourth adhesive layer 740 play the role of bonding and fixing, the first back film 710 and the second back film 730 play the role of protection against scratches and wear; the protective adhesive layer 750 plays the role of anti-collision, anti-impact and stress balancing.

[0095] The display module of the present embodiment not only saves space occupied by the circuit board assembly 300 on the non-display side of the display panel 200, thereby improving the utilization rate of the display device's internal space, but also reduces manufacturing difficulty and cost, improves product reliability and design flexibility, and provides an effective solution for efficient use of the device's internal space. Compared to traditional solutions, the display module of the present embodiment, through the design of the circuit board assembly 300, can save 10-15mm of space in the first direction, freeing up more space for the battery or other important components.

[0096] An embodiment of the present application provides a display device, which includes the display module of any of the above embodiments.

[0097] The display device of the embodiment of the present application includes the display module of any of the above-mentioned embodiments, and the orthographic projection of the main circuit board 321 of the display module on the back panel 100 has an overlapping area with the orthographic projection of the non-display area 230 on the back panel 100, that is, in the first direction, the main circuit board 321 can extend toward the area where the non-display area 230 is located, and the main circuit board 321 and the non-display area 230 are arranged to overlap, thereby saving the space occupied by the circuit board assembly 300 extending in the first direction away from the display area 210, making the structure of the non-display side of the display panel 200 more compact, thereby reducing the space occupied by the circuit board assembly 300 on the non-display side of the display panel 200, and thereby improving the utilization rate of the internal space of the display device.

[0098] like Figure 8 As shown, Figure 8 This is a flow chart of a method for preparing a display module according to an embodiment of the present application. This embodiment of the present application provides a method for preparing a display module, which is used to prepare the display module according to any of the above embodiments, including:

[0099] S1. Provide a display panel 200;

[0100] S2, connecting the transition circuit board 310 of the circuit board assembly 300 to the display panel 200;

[0101] S3, connecting the circuit board assembly 320 of the circuit board assembly 300 to the transition circuit board 310;

[0102] S4, fixing the back plate 100 and the display panel 200;

[0103] S5. Bend the display panel 200 so that the non-display area 230 and the circuit board assembly 300 are located on the second side 100b of the back panel 100, and the orthographic projection of the main circuit board 321 on the back panel 100 has an overlapping area with the orthographic projection of the non-display area 230 on the back panel 100.

[0104] In the display module prepared by the method for preparing a display module according to the embodiment of the present application, the orthographic projection of the main circuit board 321 on the back panel 100 has an overlapping area with the orthographic projection of the non-display area 230 on the back panel 100, that is, in the first direction, the main circuit board 321 can extend toward the area where the non-display area 230 is located, and the main circuit board 321 and the non-display area 230 are arranged to overlap, thereby saving the space occupied by the circuit board assembly 300 extending in the first direction away from the display area 210, making the structure of the non-display side of the display panel 200 more compact, thereby reducing the space occupied by the circuit board assembly 300 on the non-display side of the display panel 200, and thereby improving the utilization rate of the internal space of the display device.

[0105] The following is a detailed description of the method for preparing the display module according to the embodiment of the present application.

[0106] like Figure 9 and Figure 10 As shown, Figure 9 : is a process flow chart (top view) of a method for preparing a display module according to an embodiment of the present application. Figure 10 This is a process flow chart (cross section) of a method for manufacturing a display module according to an embodiment of the present application. The method for manufacturing a display module includes:

[0107] S1. Provide a display panel 200;

[0108] A backing film 760 may be provided on the non-display side of the display panel 200. The display panel 200 will subsequently undergo padbending. To balance stress, a protective adhesive layer 750 may be applied to the side of the display panel 200 not provided with the backing film 760. The protective adhesive layer 750 covers the bending region 220 to be formed later. A plurality of first pins 231 are provided at one end of the display panel 200 in the first direction. An IC (first component 500) is provided between the first pins 231 and the protective adhesive layer 750.

[0109] S2, connecting the transition circuit board 310 of the circuit board assembly 300 to the display panel 200;

[0110] The transition circuit board 310 has a first main portion 311 and a first connecting portion 312. The first connecting portion 312 is provided with a plurality of second pins 3121, which are bonded to the first pins 231. Anisotropic conductive film (ACF) can be used for bonding to ensure that the conductive particles of the ACF form a conductive path in the vertical direction during the heating and pressurizing process. The bonding parameters can be: temperature 180°C, pressure 30N, and time 3 seconds.

[0111] A plurality of third pins 3111 are provided on a side of the first main body portion 311 away from the first connection portion 312 ; a first adhesive layer 400 is prepared on a side of the transition circuit board 310 where the third pins 3111 are not provided;

[0112] S3, connecting the circuit board assembly 320 of the circuit board assembly 300 to the transition circuit board 310;

[0113] The main circuit board 321 has a second main body portion 3211 and a second connecting portion 3212. A plurality of fourth pins 32111 are provided on one side of the second main body portion 3211, and the fourth pins 32111 are bound to the third pins 3111. ACF can also be used for binding to ensure a reliable connection. The binding parameters can be: temperature 180°C, pressure 30N, and time 3 seconds.

[0114] The second main body portion 3211 is provided with a second component 322. The second component 322 is located on a side of the main circuit board 321 away from the fourth pin 32111 and on a side of the main circuit board 321 away from the display panel 200. The second main body portion 3211 has a hollow area A5 located between the second component 322 and the fourth pin 32111, so that the first component 500 is located in the hollow area A5. The second connecting portion 3212 is connected to the second main body portion 3211 and can extend in a direction away from the display panel 200. The second connecting portion 3212 can be provided with a connector 323. The side of the main circuit board 321 not provided with the fourth pin 32111 is bonded to the display panel 200 via a second adhesive layer 600.

[0115] S4, fixing the back plate 100 and the display panel 200;

[0116] The back film 760 is processed to remove the back film corresponding to the bending area 220 to form a first back film 710 and a second back film 730 ; the back plate 100 and the first back film 710 are bonded together by the third adhesive layer 720 ;

[0117] S5, bending the display panel 200 so that the non-display area 230 and the circuit board assembly 300 are located at the second side 100b of the back plate 100, and the orthographic projection of the main circuit board 321 on the back plate 100 has an overlapping area with the orthographic projection of the non-display area 230 on the back plate 100;

[0118] pad bending is performed to bend along the preset position so that the display panel 200 has the display area 210, the bending area 220 and the non-display area 230 connected in sequence, and the circuit board assembly 300 is bent to the second side 100b of the back plate 100; the transition circuit board 310 is fixed to the back plate 100 through the first adhesive layer 400, and the second back film 730 is fixed to the back plate 100 through the fourth adhesive layer 740.

[0119] The preparation method of the display module of the embodiment of the application first binds the transition circuit board 310 (Transition FPC) so that the transition circuit board 310 can be pulled out from the first pin 231 of the display panel 200 in a forward direction, and then reversely binds the circuit board assembly 320 (FPC Assembly) containing SMT devices on the transition FPC, which simplifies the assembly process. This step-by-step binding method not only makes the operation more convenient, but also reduces the possibility of errors in a single step, improves the assembly efficiency, releases the battery space inside the whole machine, does not affect the layout utilization rate of the panel, reduces the manufacturing process difficulty and cost, and improves the overall performance of the product.

[0120] It should be noted that, in this document, the terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0121] Each embodiment in the specification is described in a related manner, and the same and similar parts between each embodiment can be referred to each other. Each embodiment focuses on the difference from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the part of the method embodiment.

[0122] The above merely describes the preferred embodiments of the present application, but is not used to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display module, characterized in that: include: a back plate having a first side and a second side in a thickness direction thereof; The display panel comprises a display area, a bending area and a non-display area connected in sequence; the display area is arranged on a first side of the back plate, and the non-display area is arranged on a second side of the back plate through the bending area; a circuit board assembly, disposed on the second side of the backplane, comprising a transition circuit board and a circuit board assembly; the transition circuit board is disposed on a side of the non-display area away from the bending area and connected to the non-display area; the circuit board assembly comprises a main circuit board, the main circuit board being stacked on the transition circuit board and on a side of the non-display area away from the backplane, and connected to the transition circuit board; an orthographic projection of the main circuit board on the backplane having an overlapping area with an orthographic projection of the non-display area on the backplane; The non-display area has a first binding area; The first binding area is located on a side of the non-display area away from the bending area; The transition circuit board includes: a first main body portion and a first connecting portion; the first main body portion is spaced apart from the non-display area and connected to the main circuit board; the first connecting portion extends from the first main body portion to a side of the non-display area away from the back plate; the first connecting portion has a second binding area, the second binding area being bound to the first binding area; The first main body has a third binding area; the third binding area is located on a side of the first main body away from the bending area; The main circuit board includes a fourth binding area; the fourth binding area is located on a side of the main circuit board away from the bending area, and the fourth binding area is bound to the third binding area.

2. The display module according to claim 1, wherein: The difference between the minimum distance between the side of the main circuit board close to the backplane and the backplane and the distance between the side of the non-display area away from the backplane and the backplane is in the range of 0-400 μm.

3. The display module according to claim 1, wherein: A first adhesive layer is provided between the first main body and the back plate.

4. The display module according to claim 1, wherein: The main circuit board has a hollow area; the orthographic projection of the hollow area on the back panel is located within the range of the orthographic projection of the non-display area on the back panel, and is spaced apart from the orthographic projection of the transition circuit board on the back panel; A first component is provided on a side of the non-display area away from the display area; the first component is arranged in the hollow area.

5. The display module according to claim 4, wherein: A second adhesive layer is provided between the side of the main circuit board close to the bending area and the non-display area; The second adhesive layer is spaced apart from the first component.

6. The display module according to claim 4, wherein: The main circuit board includes: a second main body portion and a second connecting portion; The second main body portion has the fourth binding area and the hollow area; The second connecting portion is connected to the second main body portion, and its orthographic projection on the back panel is spaced apart from the orthographic projections of the non-display area and the bending area on the back panel.

7. The display module according to claim 6, wherein: The distance between the side of the second main body of the main circuit board away from the bending zone and the bending zone is less than or equal to the distance between the side of the transition circuit board away from the bending zone and the bending zone.

8. The display module according to claim 6, wherein: The second main body of the main circuit board is away from the bending zone, and the distance between the second main body and the bending zone is in the range of 13-20 mm. The minimum distance between the first component and the third binding area has a value range of 1.2-1.6 mm.

9. The display module according to claim 6, wherein: The first binding area is provided with a plurality of first pins; the second binding area is provided with a plurality of second pins; the first pins and the second pins are bound together; The third binding area is provided with a plurality of third pins; the fourth binding area is provided with a plurality of fourth pins; the third pins are bound to the fourth pins; The second main body has a device area, and the device area is located on a side of the hollow area close to the bending area; The circuit board assembly includes a second component, which is arranged in the component area and located on a side of the second main body away from the back plate; A connector is provided on a side of the second connecting portion away from the back plate.

10. The display module according to claim 1, wherein: The transition circuit board is a double-layer board; The main circuit board is a double-layer board or a multi-layer board.

11. The display module according to claim 1, wherein: The display module further includes: a first backing film, disposed between the back plate and the display area; a third adhesive layer, disposed between the back plate and the first back film; a second back film, disposed between the back plate and the non-display area; a fourth adhesive layer, disposed between the back plate and the second back film; The protective adhesive layer covers a side of the bending area away from the display area and the non-display area, and extends from the bending area to the display area and the non-display area.

12. A method for preparing a display module, characterized in that: Used to prepare the display module according to any one of claims 1 to 11, comprising: providing the display panel; connecting the transition circuit board of the circuit board assembly to the display panel; connecting the circuit board assembly of the circuit board assembly to the transition circuit board; Fixing the back plate to the display panel; The display panel is bent so that the non-display area and the circuit board assembly are located on the second side of the backplane, and the orthographic projection of the main circuit board on the backplane has an overlapping area with the orthographic projection of the non-display area on the backplane.

13. A display device, characterized in that: include: The display module according to any one of claims 1 to 11.

Images