Packaging structure and packaging method of perovskite assembly

Abstract

The invention relates to the technical field of perovskite components, in particular to a packaging structure and a packaging method of a perovskite component. The packaging structure comprises first glass, a first adhesive film, a perovskite assembly, a buffer material, a barrier material, a second adhesive film and second glass which are sequentially arranged in a layered manner. Through combination of the modified polyacrylamide buffer material and the modified alkyd resin barrier material, the mechanical property and long-term stability of the perovskite assembly are optimized, it is ensured that the perovskite assembly still has good stability under the action of external force, and meanwhile good water and oxygen barrier property and assembly oxidation resistance are maintained in long-term use.

Description

Technical Field

[0001] The present invention relates to the technical field of perovskite components, and in particular to a packaging structure and a packaging method of a perovskite component. Background Art

[0002] As the demand for clean energy continues to increase, traditional silicon-based photovoltaic technology can no longer meet the needs of modern society. Perovskite modules have attracted much attention in theory because of their low manufacturing cost and high theoretical efficiency. However, existing perovskite solar cell modules face some challenges in practical applications, especially in long-term use. Due to the influence of environmental factors (such as light, temperature changes, and external forces), the long-term operation stability of the modules may be seriously affected.

[0003] The common double-glass packaging structure usually uses an encapsulation film to ensure the sealing and mechanical strength of the module. However, under the action of external forces, such as IEC61215:2021 uses a dynamic mechanical load accelerated aging test to simulate the operation of the module under the action of external forces in outdoor operation. The different adhesion and thermal expansion coefficients of the encapsulation film and the metal back electrode will be affected by the external load, resulting in irregular deformation at various points, thereby causing the internal film layer or glass of the module to break and the back electrode to fall off. Such problems will significantly reduce the service life and stability of perovskite modules. Therefore, a new packaging structure and method are urgently needed to enhance the mechanical stability and durability of perovskite solar modules in long-term use. Summary of the invention

[0004] The object of the present invention is to provide a packaging structure and a packaging method of a perovskite component to solve the above-mentioned technical problems.

[0005] To achieve the above-mentioned object, the present invention provides a packaging structure of a perovskite component, wherein the packaging structure comprises a first glass, a first adhesive film, a perovskite component, a buffer material, a barrier material, a second adhesive film and a second glass arranged in layers in sequence.

[0006] The present invention also provides a packaging method for a perovskite component, the method comprising:

[0007] Depositing a buffer material on the back side of the perovskite component to form a buffer layer;

[0008] coating a barrier material on the buffer layer and forming a barrier layer by curing;

[0009] Butyl adhesive is pasted around the upper surface of the first glass to form a three-dimensional structure with a hollow center, and the perovskite component containing a buffer layer and a barrier layer is placed inside the three-dimensional structure;

[0010] The first adhesive film and the second adhesive film are filled on both sides of the perovskite component containing the buffer layer and the barrier layer, and the packaging is completed after the second adhesive film is covered with the second glass.

[0011] Technical effects and advantages of the present invention:

[0012] The present invention optimizes the mechanical properties and long-term stability of the perovskite component by combining a modified polyacrylamide buffer layer and a modified alkyd resin high barrier layer, ensuring that it still has good stability under the action of external forces, while maintaining good water and oxygen barrier properties and component antioxidant ability during long-term use.

[0013] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 This is a schematic diagram of the packaging structure of the perovskite component in Example 1;

[0016] Figure 2 Schematic diagram of the packaging structure of the perovskite component in the control example;

[0017] Figure 3 The efficiency decay diagram of the control example and Example 1 after 200 cycles of TC;

[0018] Figure 4 The efficiency decay diagram of the control example and Example 1 after 1000 cycles of dynamic mechanical load;

[0019] Figure 5 This is a comparison diagram of the appearance of the components of the control example and embodiment 1 after 1000 cycles of dynamic mechanical load test;

[0020] Figure 6 It is a comparison chart of the components of Examples 1 and 2 after 200 TC cycles. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0023] The present invention provides a packaging structure of a perovskite component, wherein the packaging structure comprises a first glass, a first adhesive film, a perovskite component, a buffer material, a barrier material, a second adhesive film and a second glass which are arranged in layers in sequence.

[0024] Wherein, the buffer material is modified polyacrylamide; the deposition thickness of the buffer material is 10-20um.

[0025] Wherein, the barrier material is a modified alkyd resin; and the deposition thickness of the barrier material is 50-100 um.

[0026] The sizes of the first adhesive film, the perovskite component, the buffer material, the barrier material and the second adhesive film are all smaller than the first glass and the second glass, and butyl adhesive is applied around the first adhesive film, the perovskite component, the buffer material, the barrier material and the second adhesive film.

[0027] The present invention also provides a packaging method for a perovskite component, the method comprising: depositing a buffer material on the back of the perovskite component to form a buffer layer; coating a barrier material on the buffer layer and forming a barrier layer by curing; pasting butyl glue around the upper surface of a first glass to form a three-dimensional structure with a hollow center, and placing the perovskite component containing the buffer layer and the barrier layer inside the three-dimensional structure; filling a first adhesive film and a second adhesive film on both sides of the perovskite component containing the buffer layer and the barrier layer, and completing the packaging after covering the second adhesive film with a second glass.

[0028] Specifically, the preparation of the perovskite component includes: obtaining cleaned conductive glass; and sequentially depositing a transmission layer, a perovskite layer, and a metal electrode layer on the conductive glass to obtain the perovskite component.

[0029] Specifically, the buffer material is modified polyacrylamide; and the barrier material is modified alkyd resin.

[0030] Specifically, the preparation of the modified polyacrylamide includes: mixing iron nitrite and nickel nitrite powders, adding the mixture to PMMA powder and acrylamide powder, and stirring evenly; adding azobisisobutyronitrile and 2-hydroxyethyl phosphate to the evenly stirred powder system, and initiating acrylamide polymerization to obtain the modified polyacrylamide.

[0031] The mass ratio of the iron nitrite, the nickel nitrite powder, the PMMA powder, the acrylamide powder, the azobisisobutyronitrile and the 2-hydroxyethyl phosphate is in the range of (1-1.5): (0.2-0.5): (5-25): (25-150): (0.5-1.5): (2.5-15). The temperature range of the acrylamide polymerization reaction is 60-80°C.

[0032] Specifically, the temperature range of the deposited buffer material is 60-80°C.

[0033] Specifically, the modified alkyd resin is prepared based on polyurethane acrylate, trimethylolpropane triacrylate, 1-hydroxy-1-methylethyl phenyl ketone, and 3-glycidylpropyltrimethoxysilane.

[0034] The reaction mechanism is as follows: in the process of preparing modified alkyd resin, polyurethane acrylate is used as the main resin matrix to provide the basic structure and properties of the resin. Trimethylolpropane triacrylate is used as a modifier, and the multiple acrylate groups in its molecule can react with the active groups in polyurethane acrylate to form a cross-linked structure, thereby enhancing the hardness, weather resistance and chemical stability of the resin. 1-Hydroxy-1-methylethylphenyl ketone is used as a photoinitiator, and under the action of light, it can generate free radicals to initiate the polymerization reaction in the resin system. These free radicals can react with the double bonds in polyurethane acrylate and trimethylolpropane triacrylate to promote the cross-linking and curing of the resin. 3-Glycidylpropyltrimethoxysilane is used as a coupling agent, and the silane group in its molecule can react with the hydroxyl group or other active groups in the resin system to enhance the adhesion between the resin and the substrate or other materials. At the same time, the silane coupling agent can also participate in the cross-linking reaction of the resin, further improving the overall performance of the resin. When preparing the modified alkyd resin, the reaction temperature is controlled at 20° C. to 30° C., the stirring speed is set at 100 to 500 rpm, and the mixing time is maintained at 10 to 30 minutes.

[0035] Wherein, the mass ratio of the polyurethane acrylate, the trimethylolpropane triacrylate, the 1-hydroxy-1-methylethyl phenyl ketone, and the 3-glycidylpropyl trimethoxysilane is 1:10-30:0.5-5:0.5-5. If the polyurethane acrylate is the main component, the dosage is 100g (fixed amount). Trimethylolpropane triacrylate is a modifier, and the dosage range is about 10-30wt% of the polyurethane acrylate. 1-Hydroxy-1-methylethyl phenyl ketone is a photoinitiator, and the dosage range is about 0.5-5wt% of the polyurethane acrylate. 3-Glycidylpropyl trimethoxysilane is a coupling agent, and the dosage range is about 0.5%-5%.

[0036] Specifically, the curing is UV lamp curing, and the UV lamp curing conditions include: wavelength of 395nm, curing time of 30s-60s, curing energy density of greater than or equal to 200mJ / cm 2 .

[0037] Specifically, after covering the second glass on the second adhesive film, the packaging is completed by heat lamination; wherein the conditions of the heat lamination include: temperature of 120-130° C., pressure of 60-90 kPa, and time of 10-15 min.

[0038] Example 1

[0039] A method for packaging a perovskite component, the method comprising:

[0040] 1. Prepare perovskite components.

[0041] On the cleaned conductive glass, the transmission layer and the perovskite layer are prepared separately, and then a layer of metal electrode is evaporated, and the perovskite component is divided into several sub-cells using laser etching equipment.

[0042] 2. Deposit a modified polyacrylamide buffer layer with a thickness of 10-20um on the back of the perovskite component.

[0043] Mix 3g of ferric nitrite and 1g of nickel nitrite powder, and add to 20g of PMMA powder and 100g of acrylamide powder. Use a high-speed mixer for preliminary stirring to ensure that the powder is dispersed. Then add 2g of initiator azobisisobutyronitrile and 10g of 2-hydroxyethyl phosphate, stir slowly, and heat the mixture at 60°C to initiate acrylamide polymerization to form a uniform modified polyacrylamide. Then, at 80°C, apply a layer of modified polyacrylamide as a buffer layer.

[0044] The main interaction between the 2-hydroxyethyl phosphate in this layer and the metal electrode is formed through metal-oxygen coordination bonds and chemical adsorption, which can enhance the bonding force between the metal surface and the phosphate layer, improve surface stability, reduce metal oxidation, and protect the metal surface from corrosion to a certain extent. In addition, hydrogen bonding may also enhance the stability of this layer. Iron nitrite or nickel nitrite has a certain reducing ability and can react with the oxide layer on the metal surface through redox reactions, thereby reducing or inhibiting metal oxidation. At the same time, due to the magnetic damping effect of iron nitrite and nickel nitrite, as additives, they can reduce the glass transition temperature of polyacrylamide, turning it into an elastic state, thereby preventing the component from tearing the metal electrode under dynamic mechanical loads.

[0045] 3. Forming an encapsulation barrier layer modified alkyd resin.

[0046] 100g of polyurethane acrylate oligomer was mixed with 20g of trimethylolpropane triacrylate, 2g of initiator 1-hydroxy-1-methylethyl phenyl ketone, and 2g of additive 3-glycidylpropyl trimethoxysilane. The mixture was coated on the surface of the modified polyacrylamide buffer layer, and the coating thickness was about 90μm. UV lamp was used for curing at a wavelength of 395nm, the curing time was 30 seconds, and the curing energy density was 200mJ / cm 2 , forming a second encapsulation barrier layer of modified alkyd resin.

[0047] Among them, the additive 3-glycidylpropyltrimethoxysilane can make the modified alkyd resin of this layer have strong adhesion with POE adhesive film, and also with polyacrylamide. The silane group (Si-O) of 3-glycidylpropyltrimethoxysilane can form covalent bonds with oxygen-containing functional groups such as polyacrylamide, and enhance the interfacial bonding force through surface chemical reactions. The hydroxyl (-OH) or epoxy group (-OCH2) in the silane group can react with the amino (-NH2) or carboxyl (-COOH) in polyacrylamide to enhance the adhesion between the coating and the buffer layer, and provide better mechanical strength and crack resistance. Prevent the adhesive film from delaminating.

[0048] 4. Packaging of perovskite components.

[0049] Butyl adhesive is attached around the glass, the module is placed inside the butyl adhesive, the module and the glass as well as the module and the butyl adhesive are filled with POE adhesive film, and then covered with a glass backplane, and finally hot laminated at 120℃ and 90kPa for 10 minutes. In this way, the preparation of the double-glass perovskite module is completed. Figure 1 shown.

[0050] In order to illustrate that the perovskite component packaging structure in Example 1 has better mechanical stability and durability, the following related experiments are also conducted. Figure 2 shown.

[0051] The thermal cycle (TC) test was performed on Example 1 and the control example. The test results are as follows: Figure 3 As shown in Table 1. According to the graph, the control example was broken at the 100th TC cycle, while the example was not damaged after 200 TC cycles, that is, the attenuation rate of the control example was 23.74%, while that of the example was only 3.85%.

[0052] Table 1 Efficiency attenuation data of the control example and Example 1 after 200 cycles of TC

[0053]

[0054] A dynamic mechanical load test was also performed on Example 1 and the control example. The test results are as follows: Figure 4 As shown in Table 2. According to the chart, after 1000 dynamic mechanical load tests, the embodiment successfully passed 1000 cycles, while the control example was damaged at 400 cycles, and the attenuation rate of the control example after 1000 cycles was 17.71%, while that of the embodiment was only 3.80%.

[0055] Table 2 Efficiency attenuation data of the control example and Example 1 after 1000 cycles of dynamic mechanical load

[0056]

[0057] Comparison of Example 1 and the control example shows the changes in the appearance of the components after 1000 cycles of dynamic mechanical load test. It is found that the adhesive film and glass bonding of the control example component is very weak, and the glass has cracks, such as Figure 5 The components on the left are shown. The components of Example 1 are in good condition. Figure 5 The components are shown in the picture on the right.

[0058] Example 2

[0059] Example 2 is similar to Example 1, but 2-hydroxyethyl phosphate is not added to the modified polyacrylamide buffer layer. Under dynamic load, the adhesion of the encapsulation layer in Example 2 is weak, and the metal back electrodes of some components fall off. After the TC-200 accelerated aging test, the encapsulation layer shows obvious cracking and falling off, resulting in poor stability of the components. In Example 1, 2-hydroxyethyl phosphate is added, and no falling off occurs after TC-200. Figure 6As shown, the left side is Example 2, and the right side is Example 1. Therefore, the addition of 2-hydroxyethyl phosphate plays a key role in improving the stability and adhesion of the encapsulation layer.

[0060] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A packaging structure of a perovskite component, characterized in that: The packaging structure includes a first glass, a first adhesive film, a perovskite component, a buffer material, a barrier material, a second adhesive film and a second glass which are arranged in layers in sequence.

2. The packaging structure of the perovskite component according to claim 1, characterized in that: The buffer material is modified polyacrylamide; the deposition thickness of the buffer material is 10-20um.

3. The packaging structure of the perovskite component according to claim 1, characterized in that: The barrier material is a modified alkyd resin; the deposition thickness of the barrier material is 50-100 um.

4. The packaging structure of the perovskite component according to claim 1, characterized in that: The sizes of the first adhesive film, the perovskite component, the buffer material, the barrier material and the second adhesive film are all smaller than the first glass and the second glass, and butyl adhesive is applied around the first adhesive film, the perovskite component, the buffer material, the barrier material and the second adhesive film.

5. A packaging method for a perovskite component, characterized in that: The method comprises: Depositing a buffer material on the back side of the perovskite component to form a buffer layer; coating a barrier material on the buffer layer and forming a barrier layer by curing; Butyl adhesive is pasted around the upper surface of the first glass to form a three-dimensional structure with a hollow center, and the perovskite component containing a buffer layer and a barrier layer is placed inside the three-dimensional structure; The first adhesive film and the second adhesive film are filled on both sides of the perovskite component containing the buffer layer and the barrier layer, and the packaging is completed after the second adhesive film is covered with the second glass.

6. The packaging method of the perovskite component according to claim 5, characterized in that: The preparation of the perovskite component comprises: obtaining the cleaned conductive glass; A perovskite component is obtained by sequentially depositing a transmission layer, a perovskite layer and a metal electrode layer on the conductive glass.

7. The packaging method of the perovskite component according to claim 5, characterized in that: The buffer material is modified polyacrylamide; the barrier material is modified alkyd resin.

8. The packaging method of the perovskite component according to claim 7, characterized in that: The modified polyacrylamide is prepared, comprising: Mix the iron nitrite and nickel nitrite powders, add them into the PMMA powder and acrylamide powder, and stir evenly; Azobisisobutyronitrile and 2-hydroxyethyl phosphate are added to the uniformly stirred powder system to initiate a polymerization reaction of acrylamide to obtain modified polyacrylamide.

9. The packaging method of the perovskite component according to claim 8, characterized in that: The mass ratio of the ferric nitrite, the nickel nitrite powder, the PMMA powder, the acrylamide powder, the azobisisobutyronitrile and the 2-hydroxyethyl phosphate is in the range of (1-1.5): (0.2-0.5): (5-25): (25-150): (0.5-1.5): (2.5-15).

10. The packaging method of a perovskite component according to claim 8, characterized in that: The temperature range of the acrylamide polymerization reaction is 60-80°C.

11. The packaging method of a perovskite component according to claim 5, characterized in that: The temperature range of the deposition buffer material is 60-80°C.

12. The packaging method of a perovskite component according to claim 7, characterized in that: The modified alkyd resin is prepared based on polyurethane acrylate, trimethylolpropane triacrylate, 1-hydroxy-1-methylethyl phenyl ketone and 3-glycidylpropyltrimethoxysilane.

13. The packaging method of the perovskite component according to claim 12, characterized in that: The mass ratio of the polyurethane acrylate, the trimethylolpropane triacrylate, the 1-hydroxy-1-methylethyl phenyl ketone, and the 3-glycidylpropyltrimethoxysilane is 1:10-30:0.5-5:0.5-5.

14. The packaging method of a perovskite component according to claim 5, characterized in that: The curing is UV lamp curing, and the conditions of the UV lamp curing include: wavelength of 395nm, curing time of 30s-60s, curing energy density of greater than or equal to 200mJ / cm 2 .

15. The packaging method of a perovskite component according to claim 5, characterized in that: After covering the second glass on the second adhesive film, the packaging is completed by thermal lamination; The conditions for thermal lamination include: temperature of 120-130° C., pressure of 60-90 kPa, and time of 10-15 min.

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