Probe for probe card

Abstract

A probe (1) for a probe card according to the present invention has, on a reference surface (1SB) perpendicular to a buckling direction (X), a plurality of deformation regions (8) arranged at intervals and having a circular, elliptical, or polygonal outer edge and a recessed or protruding shape, and skeleton regions (9) provided on the boundaries of the plurality of adjacent deformation regions (8). The plurality of deformation regions (8) are arranged in rows at intervals in a predetermined direction with respect to the longitudinal direction (Z) of the probe (1), and a plurality of rows are arranged at intervals in the longitudinal direction (Z) of the probe (1).

Description

Technical Field

[0001] The present application relates to a probe for a probe card. Background Art

[0002] The probe card is an electrical connection device for conducting an operation test of each semiconductor device formed on a wafer by bringing a probe into contact with an electrode pad of a semiconductor device to perform power supply, signal input / output, and grounding. The probes are provided on the surface of the probe card and are configured to press the tips of the probes against the electrode pads of the semiconductor device with a predetermined pressing force. In order to increase the number of semiconductor devices formed on a wafer, it is necessary to reduce the size of the semiconductor devices. Therefore, the electrode pads of the semiconductor devices are designed to be smaller, and the distance (pitch) between the electrode pads is designed to be smaller. The miniaturization of semiconductor devices requires that the probe be made finer, but when the probe is made finer, there is a problem that the mechanical strength of the probe is weakened.

[0003] Therefore, in order to ensure good electrical and mechanical contact with the electrode pad of the semiconductor device, Patent Document 1, for example, proposes a structure in which a multilayer metal sheet is used in the probe. Prior art literature Patent Literature

[0004] Patent Document 1: Japanese Patent Publication No. 2018-501490 Summary of the invention Technical problem to be solved by the invention

[0005] The probe shown in patent document 1 discloses a contact probe having: at least one multilayer structure, the multilayer structure comprising an overlap of a core and a first inner coating; and an outer coating, the outer coating being made of a material that completely covers the multilayer structure and has a higher hardness than the core, the outer coating completely covering the multilayer structure. As shown in Patent Document 1, in order to achieve good electrical and mechanical contact, a structure in which multiple layers of different materials are stacked is preferred. However, there are limitations in satisfying the requirement of reducing the cross-sectional thickness of the probe, and further breakthroughs are needed.

[0006] In the inspection process using the probe card, in order to ensure contact between the semiconductor device and the electrode pad, after the probe contacts the electrode pad, the probe card is brought closer to the semiconductor wafer (overdrive) to press the probe against the electrode pad of the semiconductor device. Therefore, the probe needs to be strong enough not to be mechanically damaged even if a contact pressure exceeding a specified value is applied. In order to prevent the probe from being damaged, it is necessary to prevent local stress concentration from occurring in the probe. Furthermore, in order to prevent this stress concentration from occurring, the probe surface is required to be as smooth and undamaged as possible.

[0007] However, even if the metal surface is made smooth, there is a limit. As the thickness of the cross section of the probe is thinner, the mechanical strength thereof decreases, and the probe is easily deformed by external forces.

[0008] The present application discloses a technology for solving the above-mentioned problems, and aims to provide a probe which can contact an electrode pad of a semiconductor device with an appropriate needle pressure even if the probe is made fine, and has a strength that will not be broken even if a contact pressure exceeding a specified value is applied. That is, the purpose of the probe card probe of the present application is not to prevent stress concentration, but to provide a probe card probe that can withstand large stress (having high mechanical strength) by forming a structure that intentionally disperses locations where stress concentration occurs. Technical means for solving technical problems

[0009] The probe card probe disclosed in the present application has, on a reference plane perpendicular to the bending direction, a plurality of deformation regions with circular, elliptical or polygonal outer edges and concave or protruding shapes, arranged at intervals, and a skeleton region arranged on the boundaries of adjacent deformation regions, the plurality of deformation regions are arranged in rows at intervals in a predetermined direction relative to the long side direction of the probe, and a plurality of rows are arranged at intervals in the long side direction of the probe. Effects of the Invention

[0010] According to the probe card probe disclosed in the present application, it is possible to provide a probe card probe that disperses the locations where stress concentration occurs even when the plate thickness is reduced and has high mechanical strength, and a method for manufacturing the probe card probe. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a perspective view showing a schematic structure of a probe for use in the probe card according to the first embodiment. Figure 2 This is a diagram showing the relationship between the overdrive amount and the needle pressure of the probe in the first embodiment. Figure 3 This is a diagram showing the relationship between the overdrive amount of the probe and the stress acting on the probe in the first embodiment. Figure 4 It is a cross-sectional view showing the skeleton region when a plurality of recesses are provided in Embodiment 1. Figure 5A It is a diagram showing the manufacturing process of the probe by electroforming according to the first embodiment. Figure 5B It is a diagram showing the manufacturing process of the probe by electroforming according to the first embodiment. Figure 6 It is a figure which shows the manufacturing method of the probe pin by punching in Embodiment 1. Figure 7 This is an enlarged view of a main part of a surface perpendicular to the buckling direction X of the probe according to the second embodiment. Figure 8 This is a diagram showing a surface where a deformation region is provided in a probe according to the second embodiment. Fig. 9 This is an enlarged view of a main part of a surface perpendicular to the buckling direction X of the probe according to the third embodiment. Fig.10 This is an enlarged view of a main part of a surface perpendicular to the buckling direction X of the probe according to the fourth embodiment. Fig.11 This is an enlarged view of a main part of a surface perpendicular to the buckling direction X of the probe according to the fifth embodiment. Fig.12 This is a diagram showing a modification example of the fifth embodiment. Fig.13 This is an enlarged view of a main part of a surface perpendicular to the buckling direction X of the probe according to the sixth embodiment. Fig.14 This is an enlarged view of a main part of a surface perpendicular to the buckling direction X of the probe according to the seventh embodiment. Fig.15A This is an enlarged view of a main part of a surface perpendicular to the buckling direction X of the probe according to the eighth embodiment. Fig. 15B yes Fig.15A BB cross-sectional view. Fig.16 It is a diagram showing a partial cross-sectional shape of a probe according to the ninth embodiment. DETAILED DESCRIPTION

[0012] Implementation method 1. Hereinafter, the probe card probe according to Embodiment 1 will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals. Figure 1 It is a perspective view showing the structure of the probe 1 for a probe card. Figure 2 It is a graph showing the relationship between the overdrive amount of the probe 1 and the needle pressure. Figure 3 This is a diagram showing the relationship between the overdrive amount of the probe and the stress acting on the probe. Figure 4 It is a partial cross-sectional view of the deformation region 8 and the skeleton region 9.

[0013] The probe 1 is a so-called vertical probe and is held substantially vertically by a first guide plate 2 on the upper side and a second guide plate 3 on the lower side. The front end portion 4 of the probe 1 is guided by the second guide plate 3 in such a manner as to contact an electrode pad 5 of a semiconductor device. The rear end portion 6 ( Figure 1 The probe card is guided by the first guide plate 2 in a manner connected to an electrode (not shown) of a circuit substrate connected to the probe card.

[0014] The probe 1 is made of a thin metal plate of a conductive member, and a plurality of deformation regions 8 and a skeleton region 9 are formed on at least one surface 1S (front surface or back surface) of a central portion 7 of the probe 1 perpendicular to a buckling direction X. The buckling direction X refers to a direction in which the probe 1 bends during so-called overdriving of the probe card. The deformed region 8 is a region where the original plane of the probe card, namely the reference plane 1SB, is deformed to form a depression. In addition, the skeleton region 9 represents a region connecting the plurality of deformation regions 8. In addition, the boundary between the deformation region 8 and the skeleton region 9 is represented as an edge line 10.

[0015] exist Figure 1 In the figure, as the deformation region 8, an example of a depression in the shape of a quadrangular prism is shown on the original plane, i.e., the reference plane 1SB. Therefore, when the deformation region 8 is observed in the buckling direction X of the probe 1, its outer edge is a quadrilateral. In addition, the skeleton region 9 corresponds to the plane portion between the deformation regions 8. A plurality of deformation regions 8 are formed into a row at intervals P in a predetermined direction D1 relative to the long side direction Z of the probe 1, and a plurality of such rows are arranged along the long side direction of the probe 1. The interval P is the width of the skeleton region 9. In the present embodiment 1, the direction D1 is a direction perpendicular to the long side direction Z of the probe 1.

[0016] Here, if a probe having no deformation region 8 is compared with a probe having deformation regions 8 on the front and back sides, the following results can be obtained. That is, the measurement result of the probe having no deformation region 8 on the surface is represented as A, and the measurement result of the characteristic of the probe 1 having deformation region 8 is represented as B. After the tip portion 4 of the probe 1 contacts the electrode pad 5, the probe 1 is pressed against the electrode pad 5 by further applying a load (overdrive state). The relationship between the needle pressure and the overdrive amount is as follows: Figure 2 In addition, the relationship between stress and overdrive is shown in Figure 3 shown.

[0017] like Figure 2 As shown in FIG. 1 , the needle pressure when the overdrive amount is 70 μm is 1.72 gf in the probe without the concave deformation region 8, whereas it is 1.19 gf in the probe 1 provided with the concave deformation region 8. Figure 3 As shown, it was confirmed that the maximum stress when the overdrive amount was 110 μm was 670 MPa in the probe without a recess, whereas it was 891 MPa in the probe 1 provided with the recessed deformation region 8 , which was a state that could satisfy the mechanical characteristics as a probe.

[0018] When examining the main cause of the increase in the maximum stress, the difference in the surface area of ​​the probe 1 can be considered as a structural singularity. That is, the surface area is increased by providing the deformed region 8 of the concave shape of a quadrangular prism on the surface of the probe 1. In the case of the concave shape that makes the quadrilateral plane concave (i.e., the concave shape that represents the shape of a quadrangular prism), the surface area of ​​the top of the quadrangular prism is only the original surface pressed down, so the area does not change. In contrast, the area of ​​the inner wall surface portion generated by the concave increases.

[0019] exist Figure 1 The size of the depressions set on the front and back of the probe is a quadrilateral with a side of 20μm, the depth of the depression on the front side is 3.5μm, and the depth of the depression on the back side is 2.5μm. There are 429 depressions of this size on the front side and the back side respectively. As a result, on the front side, 120120μm is added. 2 The area on the back side increased by 85800μm 2 The surface area is increased by an amount corresponding to the area of ​​the inner wall surface of the depression caused by the depression. Here, since the large depression affects the thickness of the probe 1, in order to increase the surface area, it is preferably achieved by setting a plurality of small depressions. By designing the size and configuration of the depression shape, the surface area can be arbitrarily changed.

[0020] In addition, it is analyzed what kind of effect can be obtained by deforming the region 8. For probe A without depression (smooth surface shape), probe B with depressions in the shape of a quadrangular prism arranged in a matrix, probe C with depressions in the shape of a quadrangular prism arranged in a staggered manner, and probe D with circular depressions arranged in a staggered manner, the needle pressure and maximum stress of the probe were calculated based on the finite element method (FEM), as shown in Table 1.

[0021]

Table 1

[0022] As shown in Table 1, in the case of probe A, the needle pressure is 1.72 gf when the overdrive is 70 μm, and the maximum stress is 670 MPa when the overdrive is 110 μm. In contrast, under the same conditions, the needle pressure of probe B is 1.19 gf, the maximum stress is 891 MPa, the needle pressure of probe C is 1.18 gf, the maximum stress is 899 MPa, and the needle pressure of probe D is 1.18 gf, the maximum stress is 1164 MPa.

[0023] In addition, for probes A, B, C, and D, stress contour maps (contour maps are maps that display the calculation results in contour lines) were prepared, and probe A became a state of approximately uniform distribution with a maximum stress of 670 MPa. In probe B, the plane portion of the bottom surface of the deformation region 8 was 74 MPa, the skeleton region 9 was 668 MPa, and the maximum stress was 891 MPa. In probe C, the plane portion of the bottom surface of the deformation region 8 was 74 MPa, the skeleton region 9 was 674 MPa, and the maximum stress was 899 MPa. In probe D, the spherical portion of the bottom surface of the deformation region 8 was 97 MPa, the skeleton region 9 was 873 MPa, and the maximum stress was 1164 MPa.

[0024] Based on this result, when force is applied from the outside to probes A, B, C, and D, it is estimated that stress is concentrated on the ridgeline 10 at the boundary between the deformation region 8 and the skeleton region 9. In addition, by making the bottom surface of the deformation region 8 a flat shape or a spherical shape, stress is concentrated on the ridgeline 10 at the boundary between the deformation region 8 and the skeleton region 9. This means that when the deformation region 8 is formed by a polygonal column depression, stress concentration occurs at each vertex of the polygon, and therefore, when an external force is applied, the stress is dispersed at each vertex.

[0025] Therefore, if the deformation region 8 is formed by a conical or pyramidal depression, not only the vertices of the outer periphery but also the vertices of the cone or pyramid can be included, and stress can be dispersed. In this case, stress concentration occurring at the ridge line 10 at the boundary between the deformation region 8 and the skeleton region 9 can be reduced.

[0026] When the ridge 10 is a polygon, stress concentration occurs at each vertex. However, the greater the number of sides, the smaller the stress concentration borne by each vertex becomes. Therefore, when the periphery of the depression is circular, stress is dispersed at the periphery. Therefore, as described as the probe D, the structure in which a spherical depression is provided as the deformation region 8 is the structure in which stress is most dispersed, and it is estimated to be a probe with a high mechanical strength.

[0027] Next, Figure 1 A method for manufacturing the probe 1 shown will be described. There are three methods for manufacturing the probe 1. First, the first manufacturing method is a manufacturing method using electroforming. Figure 5A , Figure 5B It is a figure which shows the manufacturing process of the probe 1 by electroforming. A protruding shape corresponding to the concave shape of the conductive layer 42 is formed on the surface of the substrate 41, and then a metal layer 43 that becomes a member of the probe 1 is provided on the surface of the conductive layer 42, thereby forming the deformation region 8. The formation of the metal layer 43 can be performed by electroforming, for example. Then, the surface is processed to be flat, a mask is provided, and etching is performed to produce the target probe. Then, the conductive layer 42 is removed, and the probe 1 is removed from the substrate 41.

[0028] The second manufacturing method is a manufacturing method using stamping. Figure 6 It is a figure which shows the method of manufacturing the probe 1 by punching. The metal plate 53 is punched from both sides by a first die 51 and a second die 52 each having a surface corresponding to the concave shape, so that a concave-shaped deformation region 8 is formed on the surface. In this case, there is an effect that the production time can be shortened compared to forming the metal layer by electroforming.

[0029] In the first embodiment, the structure in which the deformed region 8 is formed into a concave shape is described, but even if the shape is formed into a protruding shape, the same effect can be obtained. The manufacturing method is just to reverse each concave and protruding shape.

[0030] Implementation method 2. Hereinafter, the probe card probe of the second embodiment will be described focusing on the parts different from the first embodiment. Figure 7 It is an enlarged view of a main part of a surface 1S perpendicular to the buckling direction X of the probe 1 , and is a view showing another arrangement example of the deformation region 8 . Figure 8 This is a diagram showing the surface of the probe 1 where the deformation region 8 is provided. Similar to the first embodiment, the deformation region 8 is provided on at least one of the surfaces 1S perpendicular to the buckling direction X of the probe 1 .

[0031] The plurality of deformable regions 8 are formed in a row at intervals P in a predetermined direction D2 relative to the longitudinal direction Z of the probe 1 , and a plurality of such rows are arranged along the longitudinal direction Z of the probe 1 . Here, the direction D2 is an inclined direction relative to the longitudinal direction Z of the probe 1 .

[0032] In each deformation region 8, when observed along the buckling direction X, its ridgeline 10 (outer edge) is a quadrilateral. Therefore, the actual shape is a depression or protrusion in the shape of a quadrangular prism, a quadrangular pyramid, a quadrangular truncated pyramid, etc. Moreover, the two opposite sides of the ridgeline 10 of the quadrilateral of the deformation region 8 are arranged in a direction parallel to the predetermined direction D2, and the other two sides are arranged in a direction perpendicular to the direction D2. The interval between adjacent deformation regions 8 arranged in a direction perpendicular to the direction D2 is also the same as the interval P. In the present embodiment 2, the deformation regions 8 are also arranged straight and evenly spaced in the long side direction Z of the probe 1. The shape of the deformation region 8 of a circular truncated cone, an elliptical truncated cone, or a polygonal truncated cone is a shape in which the cross-sectional area gradually increases toward the reference plane 1SB.

[0033] According to the probe card probe of the second embodiment, as in the first embodiment, regular distribution of stress can be achieved by regularly arranging the deformation regions 8 of the same shape, thereby providing a probe card probe having high mechanical strength.

[0034] Implementation method 3. Hereinafter, the probe card probe of the third embodiment will be described focusing on the parts different from the first embodiment. Fig. 9 It is an enlarged view of a main part of a surface 1S perpendicular to the buckling direction X of the probe 1 , and is a view showing another arrangement example of the deformation region 8 .

[0035] The plurality of deformable regions 8 are formed in a row at intervals P in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1 , and a plurality of such rows are arranged along the longitudinal direction Z of the probe 1 . Here, the direction D1 is perpendicular to the longitudinal direction Z of the probe 1 .

[0036] In each deformation region 8, when viewed along the buckling direction X, its ridge 10 (outer edge) is circular (a type of ellipse). Therefore, the actual shape is a depression or protrusion in the shape of a cylinder, cone, truncated cone, sphere, etc. Moreover, the interval between adjacent deformation regions 8 in the length direction Z of the probe 1 is also the same as the above-mentioned interval P.

[0037] According to the probe card probe of the third embodiment, as in the first and second embodiments, regular distribution of stress can be achieved by regularly arranging the deformation regions 8 of the same shape, thereby providing a probe card probe having high mechanical strength.

[0038] Implementation method 4. Hereinafter, the probe card probe of the fourth embodiment will be described centering on the parts different from the second embodiment. Fig.10 It is an enlarged view of a main part of a surface 1S perpendicular to the buckling direction X of the probe 1 , and is a view showing another arrangement example of the deformation region 8 . Similar to the second embodiment, the deformation region 8 is provided on at least one of the surfaces 1S perpendicular to the buckling direction X.

[0039] The plurality of deformable regions 8 are formed in a row at intervals P in a predetermined direction D2 relative to the longitudinal direction Z of the probe 1 , and a plurality of such rows are arranged along the longitudinal direction Z of the probe 1 . Here, the direction D2 is an inclined direction relative to the longitudinal direction Z of the probe 1 .

[0040] In each deformation region 8, when observed along the buckling direction X, its ridgeline 10 (outer edge) is a quadrilateral. Therefore, the actual shape is a depression or protrusion in the shape of a quadrangular prism, a quadrangular pyramid, a quadrangular truncated pyramid, etc. Moreover, the two opposite sides of the ridgeline 10 (outer edge) of the quadrilateral of the deformation region 8 are arranged in a direction parallel to the predetermined direction D2, and the other two sides are arranged in a direction perpendicular to the direction D2. The interval between adjacent deformation regions 8 in the direction perpendicular to the direction D2 is also the same as the interval P. The difference from embodiment 2 is that in embodiment 2, the deformation regions 8 are also arranged straight and evenly spaced in the long side direction Z of the probe 1, but in this embodiment 4, the deformation regions 8 are not arranged straight in the long side direction Z of the probe 1.

[0041] like Fig.10 As shown, the first column L1, the second column L2, the third column L3 and the fourth column L4 are respectively composed of 4 (actually more) deformation regions, but the deformation regions 8 of the first column L1 and the deformation regions 8 of the second column L2 are arranged alternately along the direction D2. The same is true for each deformation region of the second column L2 and the third column L3. Moreover, the center S of all the deformation regions 8 of the first column L1 is not arranged straight with the center S of any deformation region 8 of the second column L2 in the long side direction Z of the probe 1.

[0042] When the deformation regions 8 are arranged in this way, one side of the ridgeline 10 constituting the second and subsequent deformation regions 8 from the beginning of the Nth column, that is, one side of the deformation region 8 of the Nth column opposite to the ridgeline 10 of the deformation region 8 of the N+1th column, is parallel to each side of the ridgeline 10 of the two deformation regions 8 constituting the N+1th column. That is, the corners K of the two deformation regions 8 are close to each other and are adjacent. The intervals between adjacent deformation regions 8 are all the same, which is the same as in the second embodiment.

[0043] According to the probe card probe of Embodiment 4, the corners K of the deformation region 8 where stress is concentrated are close to each other. Compared with Embodiment 2 where four corners K are close to each other, the number of locations where stress is concentrated can be increased by about 2 times. Thus, a probe card probe with further dispersed stress and high mechanical strength can be provided.

[0044] Implementation method 5. Hereinafter, the probe card probe of the fifth embodiment will be described centering on the parts different from the third embodiment. Fig.11 It is an enlarged view of a main part of a surface 1S perpendicular to the buckling direction X of the probe 1 , and is a view showing another arrangement example of the deformation region 8 . Similar to the third embodiment, the deformation region 8 is provided on at least one of the surfaces 1S perpendicular to the buckling direction X.

[0045] The plurality of deformable regions 8 are formed in a row at intervals P in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1 , and a plurality of such rows are arranged along the longitudinal direction Z of the probe 1 . Here, the direction D1 is perpendicular to the longitudinal direction Z of the probe 1 .

[0046] In each deformation region 8, when viewed along the buckling direction X, its ridge 10 (outer edge) is circular. Therefore, the actual shape is a depression or protrusion in the shape of a cylinder, a cone, a truncated cone, etc. Moreover, the intervals between adjacent deformation regions 8 are all the same as the above-mentioned interval P. The difference from embodiment 3 is that in embodiment 3, the centers of the deformation regions 8 are also arranged straight and evenly spaced in the long side direction Z of the probe 1, but in this embodiment 4, the deformation regions 8 are not arranged straight in the long side direction Z of the probe 1.

[0047] like Fig.11 As shown, the first column L1 is composed of two deformation regions (actually more), and the second column L2 is composed of three deformation regions 8. Then, the third column L3 is composed of two deformation regions 8. In this way, the number of deformation regions 8 constituting adjacent columns is different. Fig.11 As shown, the deformation regions 8 of the first row L1 and the deformation regions 8 of the second row L2 are arranged alternately along the direction D1. The same is true for each deformation region of the second row L2 and the third row L3. The intervals between adjacent deformation regions 8 are all the same, which is the same as in the third embodiment. However, by comparing Fig. 9 and Fig.11 It can be seen that the fifth embodiment can arrange the deformation regions 8 at a high density with respect to the same area.

[0048] Fig.12 It is a figure which shows the modification of Embodiment 5. When the deformation area 8 is observed along the buckling direction X, the ridge line 10 (outer edge) thereof may be an ellipse.

[0049] According to the probe card probe of the fifth embodiment, since the deformable regions 8 can be arranged at a high density, it is possible to provide a probe card probe having a high mechanical strength by further dispersing stress.

[0050] Implementation method 6. Hereinafter, the probe card probe of the sixth embodiment will be described focusing on the parts different from the first to fifth embodiments. Fig.13 It is an enlarged view of a main part of a surface 1S perpendicular to the buckling direction X of the probe 1 , and is a view showing another arrangement example of the deformation region 8 .

[0051] The plurality of deformable regions 8 are formed in a row at intervals P in a predetermined direction D2 relative to the longitudinal direction Z of the probe 1 , and a plurality of such rows are arranged along the longitudinal direction Z of the probe 1 . Here, the direction D2 is an inclined direction relative to the longitudinal direction Z of the probe 1 . In this example, the ridges 10 of the deformation regions 8 of each row are rectangular. Also, the centers S of the deformation regions 8 of each row are arranged along the longitudinal direction Z of the probe 1, but at most two corners K are adjacent. In this example, the same effect as in the fourth embodiment is achieved.

[0052] Implementation method 7. Hereinafter, the probe card probe of the seventh embodiment will be described focusing on the parts different from the first to sixth embodiments. Fig.14 This is an enlarged view of a main part of a surface 1S perpendicular to the buckling direction X of the probe 1 provided with a triangular truncated pyramid-shaped recess.

[0053] The plurality of deformable regions 8 are formed in a row at intervals P in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1 , and a plurality of such rows are arranged along the longitudinal direction Z of the probe 1 . Here, the direction D1 is perpendicular to the longitudinal direction Z of the probe 1 .

[0054] The deformation area 8 constituting the first column L1 and the deformation area 8 constituting the second column L2 are Fig.14 In addition, the deformation area 8 is recessed from the reference surface 1SB into a triangular truncated pyramid shape.

[0055] According to the probe card probe of the seventh embodiment, since the deformable regions 8 can be arranged at a high density, it is possible to provide a probe card probe having a high mechanical strength by further dispersing stress. In addition, the strength of the frame region 9 can be enhanced.

[0056] Implementation method 8. Fig.15A This is an enlarged view of a main part of a probe having a truncated cone-shaped protrusion in addition to a truncated cone-shaped depression. Fig. 15B yes Fig.15A BB cross-sectional view. like Fig.15A , Fig. 15BAs shown, the reference surface 1SB of the probe 1 is configured by providing a first deformation region 91 which is a concave shape of a large first diameter truncated cone and a second deformation region 92 which is a protruding shape of a small second diameter truncated cone on the reference surface 1SB.

[0057] On the surface of the probe 1, the first deformation regions 91 are arranged in a staggered manner, and the second deformation regions 92 are arranged in the space between the first deformation regions 91. Through the arrangement of the first deformation regions 91 and the second deformation regions 92, the stress is evenly dispersed, and the probe has a structure with high mechanical strength. In this way, the deformation region can be a shape protruding from the reference plane 1SB or mixed with a concave shape.

[0058] Implementation method 9. Fig.16 : represents a partial cross-sectional shape of the probe 1 according to Embodiment 10. Fig.16 As shown, in this embodiment 9, a covering layer 13 is provided on the surface of the metal plate of the probe 1 shown in embodiments 1 to 8 so that no foreign matter is attached. In addition, the surface of the metal plate is smoothly covered so that even if foreign matter is attached, it can be easily removed. This structure can also solve the problem of foreign matter attachment by providing a covering layer as long as the probe has a deformed area of ​​a concave shape or a protruding shape on the surface of the metal plate.

[0059] As the material of the covering layer 13, a resin layer that does not hinder the deformation of the metal plate is preferably used. In particular, in embodiments 1 to 5, since a plurality of deformation regions 8 having a concave shape or a protruding shape are provided on the surface, there is a concern about the adhesion of foreign matter. Therefore, in order to eliminate this concern, a covering layer 13 for smoothing the surface is effective. The surface of the conductor has a plurality of deformation regions 8 having a concave shape or a protruding shape and a skeleton region 9, and a covering layer 13 is provided on the surface, so that a probe 1 having high mechanical strength and no foreign matter adhesion can be obtained. It is also possible to cover with a member of a material other than a resin and a material different from that of the structural body of the probe 1.

[0060] Although the present application describes various exemplary embodiments and examples, various features, methods, and functions described in one or more embodiments are not limited to application in specific embodiments and may be applied to the embodiments alone or in various combinations. Therefore, numerous modifications not shown in the examples are conceivable within the technical scope disclosed in the present application, including, for example, the case where at least one structural element is modified, added, or omitted, and the case where at least one structural element is extracted and combined with structural elements of other embodiments. Description of symbols

[0061] 1 probe, 1SB reference plane, 10 edge line, 101 area expansion pattern area, 102 stress concentration area, 13 covering layer, 2 first guide plate, 3 second guide plate, 4 front end portion, 41 substrate, 42 conductive layer, 43 metal layer, 5 electrode pad, 51 first mold, 52 second mold, 53 metal plate, 6 rear end portion, 7 central portion, 8 deformation area, 9 skeleton area, 91 first deformation area, 92 second deformation area, 1S surface, X buckling direction, L1 first column, L2 second column, L3 third column, L4 fourth column, K corner, P interval, D1, D2 predetermined direction.

Claims

1. A probe for a probe card, characterized in that: On a reference plane perpendicular to the buckling direction, there are a plurality of deformation regions arranged at intervals, whose outer edges are circular, elliptical or polygonal and which are concave or protruding shapes, and a skeleton region arranged on the boundaries of adjacent deformation regions, wherein the plurality of deformation regions are arranged in rows at intervals in a predetermined direction relative to the long side direction of the probe, and a plurality of rows are arranged at intervals in the long side direction of the probe.

2. The probe card probe according to claim 1, wherein: The predetermined direction is an inclined direction with respect to the long side direction of the probe.

3. The probe for a probe card according to claim 2, wherein: The plurality of deformable regions in the Nth column and the plurality of deformable regions in the N+1th column are alternately arranged along the inclined direction.

4. The probe for a probe card according to claim 1, wherein: The predetermined direction is a perpendicular direction to the long side direction of the probe.

5. The probe for a probe card according to claim 4, wherein: The plurality of deformation regions in the Nth column and the plurality of deformation regions in the N+1th column are alternately arranged along the vertical direction.

6. The probe for a probe card according to claim 1, wherein: The deformation area is any shape selected from the group consisting of a polygonal column shape, a polygonal pyramid shape, a cylindrical shape, an elliptical column shape, a cone shape, an elliptical cone shape, a polygonal truncated cone shape whose cross-sectional area gradually increases toward the reference plane, a truncated cone shape whose cross-sectional area gradually increases toward the reference plane, and an elliptical truncated cone shape whose cross-sectional area gradually increases toward the reference plane.

7. The probe for a probe card according to any one of claims 1 to 6, wherein: The deformation region is covered by a member made of a material different from that of the structure of the probe.

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