A one-time lead punching device for multi-station CSOP packaged devices

Abstract

The application discloses a one-time lead punching device for a multi-station CSOP packaging device and belongs to the technical field of integrated circuit packaging. The device comprises an upper die main body and a lower die main body. The top of the upper die main body is provided with an upper positioning guide column hole and an upper equal-height limiting column. The top of the upper die main body is provided with a plurality of upper knife heads which are symmetrically arranged in pairs. The two sides of each upper knife head are provided with a positioning pin hole. The upper knife heads which are symmetrically arranged in pairs are provided with a positioning key. The top of the lower die main body is provided with a lower equal-height limiting column at the position corresponding to the upper positioning guide column hole. The top of the lower die main body is provided with a lower positioning guide column hole at the position corresponding to the upper equal-height limiting column. The top of the lower die main body is provided with a punching module. The punching module is provided with a positioning key groove, a positioning pin and a lower knife edge at positions corresponding to the positioning key, the positioning pin hole and the upper knife head respectively. The application can solve the problem that the prior art can only punch a single device or a single-side lead at a time.

Description

Technical Field

[0001] This invention belongs to the field of integrated circuit packaging technology, specifically relating to a one-time lead punching device for multi-station CSOP packaged devices. Background Technology

[0002] With the increasing market demand for domestically produced electronic components and the rising requirements of users, stricter requirements have been placed on the production capacity, efficiency, and appearance quality of Ceramic Small Outline Package (CSOP) devices. Based on quality and technical requirements, CSOP multi-lead devices are manufactured with a metal outer frame to prevent lead deformation or twisting. Before screening, the metal outer frame with the same potential must be trimmed to create a flat and symmetrical lead configuration to meet the requirements of screening tests such as testing and aging.

[0003] Due to the low strength of the ceramic shell and the small spacing between adjacent leads, CSOP packaged devices are prone to problems such as large dimensional deviations of the leads on both sides, poor dimensional symmetry, and burrs at the lead cuts when cut manually, affecting appearance quality and reliability. Traditional manual cutting methods require high levels of operator skill, operating habits, and high-quality shears, and it is difficult to guarantee the accuracy and consistency of device dimensions after trimming. Currently, existing motorized cutting methods at home and abroad require high precision machining of equipment and tooling and stability of the punching system. They can only punch a single device or a single-sided lead at a time. Completing multi-sided, multi-lead precision dimensional cutting in one go is very difficult and costly. Multiple motorized punching and cutting methods can easily cause lead indentations, burrs at the cuts, and ceramic chipping from the shell, even leading to device appearance failure. This is not only time-consuming and labor-intensive with low production efficiency, but also poses significant risks to appearance quality and yield. Summary of the Invention

[0004] The purpose of this invention is to provide a one-time lead punching device for multi-station CSOP packaged devices, so as to solve the problem that the prior art can only punch a single device or a single-sided lead at a time.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] In a first aspect, a disposable lead punching device for a multi-station CSOP packaged device includes: an upper mold body and a lower mold body, wherein the upper mold body and the lower mold body are respectively installed on the upper mold frame and the lower mold frame of the ceramic flat packaging trimming equipment mold frame;

[0007] The top of the upper mold body is provided with an upper positioning guide post hole and an upper equal height limit post. The top of the upper mold body is provided with several pairs of symmetrical upper cutter heads. Positioning pin holes are provided on both sides of the upper cutter heads. Positioning keys are provided between the pairs of symmetrical upper cutter heads.

[0008] The top of the lower die body is provided with a lower equal height limit post corresponding to the position of the upper positioning guide post hole. The top of the lower die body is provided with a lower positioning guide post hole corresponding to the position of the upper equal height limit post. The top of the lower die body is provided with a punching module. The punching module is provided with a positioning keyway, a positioning pin, and a lower cutting edge corresponding to the positions of the positioning key, the positioning pin hole, and the upper cutting head, respectively.

[0009] In some embodiments, the upper mold body is provided with equal-height spring pillars, and positioning guide pillars are provided at positions corresponding to the positioning guide pillar holes.

[0010] In some embodiments, an upper slide rail is provided at the bottom of the upper mold body, and upper compression spring positioning ball grooves are provided on both sides of the bottom of the upper mold body.

[0011] In some embodiments, a sliding rail is provided at the bottom of the lower mold body, and spring-loaded positioning ball grooves are provided on both sides of the bottom of the lower mold body.

[0012] In some implementations, a ceramic housing clearance area is reserved between adjacent locating keys, and a ceramic housing placement area is reserved between adjacent locating keyways.

[0013] In some embodiments, the positions of the ceramic housing avoidance area and the ceramic housing placement area correspond.

[0014] In some implementations, a clearance area for connecting ribs is reserved between adjacent positioning pin holes, and a placement area for connecting ribs is reserved between adjacent positioning pins.

[0015] In some embodiments, the positions of the connecting rib avoidance area and the connecting rib placement area correspond.

[0016] In some implementations, a space is reserved between the cutting edge and the edge of the punching module for placing a metal outer frame.

[0017] In some embodiments, a disassembly handle is provided at the bottom of the lower mold body, and the pushing and pulling direction of the disassembly handle is consistent with the movement direction of the lower slide rail.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] This invention provides a disposable lead punching device for multi-station CSOP packaged devices, comprising: an upper die body and a lower die body. The top of the upper die body is provided with an upper positioning guide post hole and an upper equal-height limit post. The top of the upper die body is provided with a plurality of symmetrical upper cutters in pairs. Positioning pin holes are provided on both sides of the upper cutters, and positioning keys are provided between the symmetrical upper cutters in pairs. The top of the lower die body is provided with a lower equal-height limit post corresponding to the position of the upper positioning guide post hole, and a lower positioning guide post hole corresponding to the position of the upper equal-height limit post. The top of the lower die body is provided with a punching module. The punching module is provided with positioning keyways, positioning pins, and lower cutting edges corresponding to the positions of the positioning keys, positioning pin holes, and upper cutters, respectively. The upper positioning guide post hole and the lower equal height limit post are precisely meshed, as are the upper equal height limit post and the lower positioning guide post hole. Several symmetrical upper cutting heads work with the lower cutting edge to perform multi-station one-time trimming of the two-sided lead package. The positioning key works with the positioning keyway and the positioning pin works with the positioning pin hole to achieve precise positioning. Therefore, this device can perform multi-station one-time trimming of ceramic flat two-sided lead package. While meeting the product size, appearance and quality standards, it can significantly improve production efficiency and the reliability of the shearing process, and reduce the probability of device appearance damage.

[0020] Furthermore, the present invention provides equal-height spring columns inside the upper mold body, which can buffer and protect the entire device during the shearing process.

[0021] Furthermore, the bottom of the upper mold body of the present invention is provided with an upper slide rail, and the bottom sides of the upper mold body are provided with upper compression spring positioning ball grooves. The bottom of the lower mold body is provided with a lower slide rail, and the bottom sides of the lower mold body are provided with lower compression spring positioning ball grooves. The upper slide rail and the lower slide rail can be compatible with ceramic flat packaging trimming equipment. The upper compression spring positioning ball groove and the lower compression spring positioning ball groove can match the limiting ball of the ceramic flat packaging trimming equipment to achieve precise positioning of the tooling.

[0022] Furthermore, the present invention reserves a ceramic housing clearance area between adjacent positioning keys and a ceramic housing placement area between adjacent positioning keyways. By pressing and fixing the two-sided leads, the tooling does not directly contact the device cover plate and ceramic body during the punching process, thus avoiding mechanical overstress damage to the product.

[0023] Furthermore, the present invention reserves a connecting rib avoidance area between adjacent positioning pin holes and a connecting rib placement area between adjacent positioning pins, which enables the tooling to avoid the connecting rib position of the device during the punching process, ensuring the shearing length of the connecting rib, and preventing ceramic cracking at the connecting rib position.

[0024] Furthermore, a metal outer frame placement area is reserved between the lower blade and the edge of the punching module, which can avoid the position of waste material affecting the positioning of the punching device and the risk of excess material during the shearing process, and facilitates the collection of waste material through an integrated waste box after the edge is trimmed. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the planar structure of the upper die body of a one-time lead punching device for a multi-station CSOP packaged device, provided in an embodiment of the present invention.

[0026] Figure 2 This is a cross-sectional view of the upper die body of a one-time lead punching device for a multi-station CSOP packaged device, provided in an embodiment of the present invention.

[0027] Figure 3 This is a schematic diagram of the planar structure of the lower die body of a one-time lead punching device for a multi-station CSOP packaged device, provided in an embodiment of the present invention.

[0028] Figure 4 This is a cross-sectional view of the lower die body of a one-time lead punching device for a multi-station CSOP packaged device, provided in an embodiment of the present invention.

[0029] In the diagram, 1. Upper positioning guide post hole; 2. Upper equal height limit post; 3. Upper compression spring positioning ball groove; 4. Upper cutter head; 5. Positioning key; 6. Positioning pin hole; 7. Upper slide rail; 8. Equal height spring post; 9. Positioning guide post; 10. Lower slide rail; 11. Lower compression spring positioning ball groove; 12. Disassembly handle; 13. Lower cutting edge; 14. Positioning keyway; 15. Positioning pin; 16. Lower equal height limit post; 17. Lower positioning guide post hole; 18. Punching module. Detailed Implementation

[0030] In the following description, only certain exemplary embodiments are briefly described. The described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and descriptions are considered to be exemplary in nature and not restrictive.

[0031] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0034] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0035] Example 1

[0036] This embodiment provides a one-time lead punching device for multi-station CSOP packaged devices, including an upper mold body and a lower mold body, on which the package model and electroplated markings are designed;

[0037] like Figure 1 and Figure 2 As shown, the top of the upper mold body is provided with upper positioning guide pin holes 1 and upper height limiting pins 2. There are a total of 4 upper height limiting pins 2, which are respectively located at the corners of the upper mold body. There are a total of 4 upper positioning guide pin holes 1, which are respectively located at the corners of the upper mold body.

[0038] The top of the upper mold body is provided with five sets of symmetrical upper cutter heads 4, for a total of 10 upper cutter heads 4; positioning pin holes 6 are provided on both sides of the upper cutter head 4, and the positioning pin holes 6 on both sides are symmetrically arranged with the upper cutter head 4 as the center, for a total of 20 positioning pin holes, with one positioning pin hole on each side of each upper cutter head 4.

[0039] Positioning keys 5 are provided between the two symmetrical upper cutter heads 4, and a total of 10 positioning keys 5 are provided;

[0040] The upper mold body is equipped with equal height spring pillars 8, and positioning guide pillars 9 are set at the positions corresponding to the upper positioning guide pillar holes 1. There are three equal height spring pillars 8 in total, and the spacing between adjacent equal height spring pillars 8 is equal.

[0041] Upper slide rails 7 are provided on the protruding parts on both sides of the bottom of the upper mold body, and upper compression spring positioning ball grooves 3 are provided on both sides of the bottom of the upper mold body.

[0042] like Figure 3 and Figure 4 As shown, the top of the lower die body is provided with lower equal height limit posts 16 corresponding to the position of the upper positioning guide post hole 1, and a total of 4 lower equal height limit posts 16 are provided. The top of the lower die body is provided with lower positioning guide post holes 17 corresponding to the position of the upper equal height limit post 2, and a total of 4 lower positioning guide post holes 17 are provided. The top of the lower die body is provided with a punching module 18. The punching module 18 is provided with positioning keyways 14, positioning pins 15 and lower cutting edges 13 corresponding to the positions of positioning key 5, positioning pin holes 6 and upper cutting head 4, respectively. A total of 10 positioning keyways 14, 20 positioning pins 15 and 10 lower cutting edges 13 are provided.

[0043] The precise positioning and shearing of the symmetrically positioned upper cutter head 4 and lower cutter edge 13 can achieve a punching accuracy of ±0.05mm. The diameter gap error of the upper positioning guide hole 1, the lower positioning guide hole 17 and the positioning pin hole 6 is ±0.01mm, and the positioning accuracy error range is ≤10mil.

[0044] The lower mold body has protruding lower slide rails 10 on both sides of its bottom, and spring-loaded positioning ball grooves 11 on both sides of its bottom. A disassembly handle 12 is located at the bottom of the lower mold body; the pushing and pulling direction of the disassembly handle 12 is consistent with the movement direction of the lower slide rails 10. This disassembly handle 12 helps operators distinguish between the upper and lower mold bodies and facilitates the disassembly and replacement of the lower mold body. The upper mold body is installed above the mold frame of the ceramic flat packaging and trimming equipment and is connected to the upper mold frame of the ceramic flat packaging and trimming equipment via an upper slide rail 7. The lower mold body is installed below the mold frame of the ceramic flat packaging and trimming equipment and is connected to the lower mold frame of the ceramic flat packaging and trimming equipment via a lower slide rail 10.

[0045] A ceramic housing clearance area is reserved between adjacent positioning keys 5, forming a total of 5 ceramic housing clearance areas. A ceramic housing placement area is reserved between adjacent positioning keyways 14, forming a total of 5 ceramic housing placement areas. The positions of the ceramic housing clearance areas and the ceramic housing placement areas correspond.

[0046] A connecting rib avoidance area is reserved between adjacent positioning pin holes 6, forming a total of 10 connecting rib avoidance areas. A connecting rib placement area is reserved between adjacent positioning pins 15, forming a total of 10 connecting rib placement areas. The positions of the connecting rib avoidance areas and the connecting rib placement areas correspond.

[0047] A metal outer frame placement area is reserved between the lower cutting edge 13 and the edge of the punching module 18, forming a total of 10 metal outer frame placement areas;

[0048] The disposable lead wire punching device provided in this embodiment has the following advantages:

[0049] (1) Tooling replacement is simple and quick. The upper slide rail 7 and the lower slide rail 10 are respectively set on the left and right sides of the upper mold body and the lower mold body. The push-pull and card seat extraction method is adopted, which is compatible with ceramic flat packaging edge trimming equipment.

[0050] (2) Four spring-loaded positioning ball grooves are designed on the left and right sides of the upper mold body and the lower mold body, which fit with the limiting ball of the trimming equipment to achieve precise positioning of the tooling and ensure that the compressed air is in normal condition and the pressure is controllable during the operation of the equipment.

[0051] (3) The four upper height limit pins 2 of the upper die body and the four lower positioning guide pin holes 17 of the lower die body, as well as the four upper positioning guide pin holes 1 of the upper die body and the four lower height limit pins 16 of the lower die body, perform precise gearing to ensure the depth of punching, the magnitude of punching force and the stability.

[0052] (4) The upper mold body is equipped with three equal-height spring columns 8, which can buffer and protect the entire device during the shearing process.

[0053] (5) The upper die body and the lower die body are respectively equipped with 20 positioning pin holes 6 and 20 positioning pins 15 symmetrically positioned at the four corners, which can realize the precise placement and positioning of the five adjacent workstations on the punching module 18, and ensure the precise meshing and positioning of the upper cutter head 4 and the lower cutter 13, thus reducing the punching error.

[0054] (6) The upper die body and the lower die body are respectively equipped with two sharp upper cutter heads 4 and lower cutter edges with 5 adjacent workstations in symmetrical positions. Through one-time precise positioning, stamping and shearing, the two-sided lead wires of the 5 devices are cut at the same time to prevent burrs at the lead wire cut.

[0055] (7) The upper mold body and the lower mold body are designed with 5 stations for ceramic shell avoidance area and ceramic shell placement area respectively. By pressing and fixing the two-sided lead wire, the tooling does not directly contact the device cover plate and ceramic body during the punching process, thus avoiding mechanical overstress damage to the product.

[0056] (8) Both the upper and lower die bodies are designed with 5 stations and symmetrical connecting rib avoidance and placement areas on both sides. During the punching process, the tooling avoids the connecting rib position of the device, ensuring the shearing length of the connecting rib, and preventing the ceramic from cracking at the connecting rib position.

[0057] (9) The contact areas of the lead wires on both sides of the five stations in the upper mold body are polished to avoid appearance problems such as lead wire indentation, deformation, and poor coplanarity.

[0058] (10) The lower mold body is equipped with a metal outer frame placement area with 5 stations to avoid the displacement or residue of waste material during the shearing process, and to facilitate the collection of waste material after shearing. It can be easily picked up by magnetic strips and cleaned up in time, so as to avoid affecting the positioning and appearance quality during the process.

[0059] The one-time lead punching device provided in this embodiment can achieve simultaneous cutting of double-sided leads for multi-station (≤5) CSOP packaged devices, overcoming the drawbacks of poor lead dimensional accuracy and consistency in manual cutting methods. It reduces the probability of device surface damage, production time, and cost, significantly improving the production efficiency, effective capacity, lead dimensional accuracy, and consistency of this series of packaged devices, increasing equipment utilization and process reliability, and exhibiting good punching stability. This embodiment can achieve a one-time edge trimming effect for multi-station ceramic flat double-sided lead packages, providing excellent technical guidance for the design and application of one-time punching devices for this series of packages. Furthermore, this embodiment, through precise positioning and meshing of the device, can simultaneously punch and cut double-sided lead devices at 5 stations, increasing production efficiency by at least 10 times compared to traditional manual edge trimming methods, and by at least 5 times compared to single-sided lead or multiple lead punching methods for a single device.

[0060] Example 2

[0061] A disposable lead punching device for multi-station CSOP packaged devices, characterized in that it includes: an upper mold body and a lower mold body, wherein the upper mold body and the lower mold body are respectively installed on the upper mold frame and the lower mold frame of the ceramic flat packaging trimming equipment mold frame;

[0062] The top of the upper mold body is provided with an upper positioning guide post hole 1 and an upper equal height limit post 2. The top of the upper mold body is provided with four sets of two symmetrical upper cutter heads 4. Positioning pin holes 6 are provided on both sides of the upper cutter heads 4. Positioning keys 5 are provided between the two symmetrical upper cutter heads 4.

[0063] The top of the lower die body is provided with a lower equal height limit post 16 corresponding to the position of the upper equal height limit post 2. The top of the lower die body is provided with a lower positioning guide post 17 corresponding to the position of the upper equal height limit post 2. The top of the lower die body is provided with a punching module 18. The punching module 18 is provided with a positioning keyway 14, a positioning pin 15 and a lower cutting edge 13 corresponding to the positions of the positioning key 5, the positioning pin hole 6 and the upper cutting head 4, respectively.

[0064] A ceramic housing clearance area is reserved between adjacent positioning keys 5, and a ceramic housing placement area is reserved between adjacent positioning keyways 14. The positions of the ceramic housing clearance area and the ceramic housing placement area correspond.

[0065] A connecting rib avoidance area is reserved between adjacent positioning pin holes 6, and a connecting rib placement area is reserved between adjacent positioning pins 15. The positions of the connecting rib avoidance area and the connecting rib placement area correspond.

[0066] A metal outer frame placement area is reserved between the lower cutting edge 13 and the edge of the punching module 18.

[0067] This embodiment achieves precise positioning through positioning guide holes and equal-height limiting posts, ensuring dimensional accuracy, consistency, lead coplanarity, and appearance quality of the device after shearing. It realizes a multi-station, one-time trimming effect for ceramic flat double-sided lead packages, providing valuable technical guidance for the design and application of this series of multi-station, one-time punching devices for packaging. This device can perform multi-station, one-time trimming of ceramic flat double-sided lead packages, significantly improving production efficiency and shearing process reliability while meeting product size, appearance, and quality standards, and reducing the probability of device appearance damage.

[0068] As is known from common technical knowledge, the present invention can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative in all respects and are not the only ones; all modifications within the scope of the present invention or equivalent to the scope of the present invention are included in the present invention.

Claims

1. A one-time lead punching device for multi-station CSOP packaged devices, characterized in that, include: The upper mold body and the lower mold body are respectively installed on the upper mold frame and the lower mold frame of the ceramic flat packaging trimming equipment mold frame; The top of the upper mold body is provided with an upper positioning guide post hole (1) and an upper equal height limit post (2). The top of the upper mold body is provided with several pairs of symmetrical upper cutter heads (4). Positioning pin holes (6) are provided on both sides of the upper cutter heads (4). Positioning keys (5) are provided between the pairs of symmetrical upper cutter heads (4). The lower die body has a lower equal height limit post (16) set at the position of the upper positioning guide post hole (1) on the top of the lower die body, a lower positioning guide post hole (17) set at the position of the upper equal height limit post (2) on the top of the lower die body, a punching module (18) set at the top of the lower die body, and a positioning keyway (14), a positioning pin (15) and a lower cutting edge (13) set on the punching module (18) at the positions of the positioning key (5), the positioning pin hole (6) and the upper cutting head (4) respectively.

2. The one-time lead punching device for a multi-station CSOP packaged device according to claim 1, characterized in that, The upper mold body is provided with equal height spring pillars (8), and positioning guide pillars (9) are provided at the positions corresponding to the upper positioning guide pillar holes (1).

3. The one-time lead punching device for a multi-station CSOP packaged device according to claim 1, characterized in that, The bottom of the upper mold body is provided with an upper slide rail (7), and the bottom sides of the upper mold body are provided with upper compression spring type positioning ball grooves (3).

4. The one-time lead punching device for a multi-station CSOP packaged device according to claim 1, characterized in that, The bottom of the lower mold body is provided with a sliding rail (10), and the bottom sides of the lower mold body are provided with spring-loaded positioning ball grooves (11).

5. The one-time lead punching device for a multi-station CSOP packaged device according to claim 1, characterized in that, A ceramic housing clearance area is reserved between adjacent positioning keys (5), and a ceramic housing placement area is reserved between adjacent positioning keyways (14).

6. The one-time lead punching device for a multi-station CSOP packaged device according to claim 5, characterized in that, The positions of the ceramic shell avoidance area and the ceramic shell placement area correspond.

7. The one-time lead punching device for a multi-station CSOP packaged device according to claim 1, characterized in that, A buffer zone is reserved between adjacent positioning pin holes (6) for connecting ribs, and a space for placing connecting ribs is reserved between adjacent positioning pins (15).

8. The one-time lead punching device for a multi-station CSOP packaged device according to claim 7, characterized in that, The positions of the connecting bar avoidance area and the connecting bar placement area correspond.

9. The one-time lead punching device for a multi-station CSOP packaged device according to claim 1, characterized in that, A metal outer frame placement area is reserved between the lower cutting edge (13) and the edge of the punching module (18).

10. A one-time lead punching device for a multi-station CSOP packaged device according to claim 4, characterized in that, The bottom of the lower mold body is provided with a disassembly handle (12), and the pushing and pulling direction of the disassembly handle (12) is consistent with the movement direction of the lower slide rail (10).

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