Method for manufacturing joined body, joined body, and heat sink

Abstract

The invention relates to a method for manufacturing a joined body, a joined body, and a heat sink. The purpose of the present invention is to provide a bonded body having good bonding quality. This method for producing a bonded body comprises a bonding step in which a sintered body containing an alloy is brought into direct contact with an object and heat-treated to obtain a bonded body.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a joint body, a joint body and a radiator Background Art

[0002] As a method for joining parts made of metal, various methods have been conventionally used, such as brazing, friction stir joining, laser welding, diffusion joining, etc. For example, Patent Document 1 discloses a method for producing a joined body by joining rolled plates of an aluminum material.

[0003] Patent Document 1: Japanese Patent No. 6218903 Summary of the invention

[0004] An object of the present invention is to provide a joined body having good joining quality.

[0005] To achieve the above object, a method for producing a joined body according to one aspect of the present invention includes a joining step of bringing a sintered body into direct contact with an object and subjecting the object to heat treatment to obtain the joined body, wherein the sintered body contains an alloy.

[0006] The effect of the present invention is described below:

[0007] According to one aspect of the present invention, a bonded body having good bonding quality can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a flowchart showing a method for producing a bonded body according to the first embodiment of the present invention.

[0009] Figure 2 This is a schematic diagram of a molding system for a sintered body used in a method for producing a joined body according to an embodiment of the present invention.

[0010] Figure 3 This is a schematic diagram of a molding device for a precursor used in a method for producing a bonded body according to an embodiment of the present invention.

[0011] Figure 4 This is a schematic diagram of a control unit of a molding device for manufacturing a precursor used in a method for manufacturing a bonded body according to an embodiment of the present invention.

[0012] Figure 5 This is a schematic diagram showing an optical microscope photograph of a cross section of a sintered body used in the method for producing a joined body according to the first embodiment of the present invention.

[0013] Figure 6 This is a diagram showing a bonded body according to one embodiment of the present invention.

[0014] Figure 7This is a schematic diagram showing an optical microscope photograph of a cross section near a bonded boundary portion of a bonded body according to one embodiment of the present invention.

[0015] Figure 8 This is a schematic diagram showing an optical microscope photograph of a cross section of an object according to one embodiment of the present invention.

[0016] Fig. 9 It is a figure which shows the bonded body which concerns on another embodiment of this invention.

[0017] Fig.10 This is a flow chart showing a method for producing a bonded body according to a second embodiment of the present invention.

[0018] Fig.11 This is a diagram showing a bonded body according to one embodiment of the present invention.

[0019] Fig.12 This is a schematic diagram showing an optical microscope photograph of a cross section near a joining boundary portion of a joined body formed by joining a sintered body and an object according to an embodiment of the present invention.

[0020] Fig.13 This is a schematic diagram showing an optical microscope photograph of a cross section near a joining boundary portion of a joined body in which sintered bodies are joined together according to one embodiment of the present invention.

[0021] Fig.14 This is a schematic diagram showing an optical microscope photograph of a cross section near a joining boundary portion of a joined body in which sintered bodies are joined together according to a second embodiment of the present invention.

[0022] Fig.15 This is a flow chart showing a method for producing a bonded body according to a third embodiment of the present invention.

[0023] Fig.16 This is a flow chart showing a method for producing a bonded body according to a fourth embodiment of the present invention.

[0024] Fig.17 This is a diagram showing an example of an object used in the method for producing a bonded body according to the fourth embodiment of the present invention.

[0025] Fig.18 It means in Fig.17 A cross-sectional view of a joined body in which a sintered body is joined to an object.

[0026] Fig.19 This is a diagram showing another example of an object used in the method for producing a bonded body according to the fourth embodiment of the present invention.

[0027] Fig. 20This is a diagram showing still another example of an object used in the method for producing a bonded body according to the fourth embodiment of the present invention.

[0028] Fig.21 It means in Fig. 20 A cross-sectional view of a joined body in which a sintered body is joined to an object.

[0029] Fig. 22 It is a cross-sectional view showing a state before a lid is joined to a container in a joined body according to a fourth embodiment of the present invention.

[0030] Fig.23 It means in Fig. 22 A cross-sectional view of a state in which a lid is joined to a container in a joined body.

[0031] Fig.24 This is a flow chart showing a method for producing a bonded body according to a fifth embodiment of the present invention.

[0032] Fig.25 It is a figure which shows the joined body which concerns on 5th Embodiment of this invention.

[0033] Fig.26 This is an enlarged view of a sintered body according to one embodiment of the present invention.

[0034] Fig. 27 It is a diagram showing a first modified example of the bonded body according to one embodiment of the present invention.

[0035] Fig.28 It is a diagram showing a second modified example of the bonded body according to the embodiment of the present invention.

[0036] Fig.29 It is a diagram showing a third modified example of the bonded body according to the embodiment of the present invention.

[0037] Fig.30 This is a schematic diagram showing an optical microscope photograph of a cross section near a bonding boundary portion of a bonded body according to still another embodiment of the present invention.

[0038] The symbols in the figure are explained as follows:

[0039] 1 Modeling system

[0040] 100 Modeling Devices

[0041] 400 Sintering device

[0042] 2, 2A, 2B, 2C, 2D joint

[0043] 3 Sintered body

[0044] 4 Objects

[0045] 5 Joint

[0046] 6 Sintered body

[0047] 7 Container

[0048] Step 7A

[0049] 7B Protrusion

[0050] 8 Cover

[0051] 9 Solder

[0052] 10 Joint

[0053] C Grain

[0054] E Eutectic part

[0055] G Gyro Structure

[0056] Specific implementation form

[0057] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, common parts are sometimes denoted by the same or corresponding reference numerals in the drawings and their description is omitted.

[0058] <Method for producing a bonded body>

[0059] 《First Implementation Form》

[0060] Reference Figures 1 to 4 A method for producing a joined body according to the first embodiment of the present invention and an example of a molding system and a molding device used in the method for producing a joined body according to the present embodiment will be described.

[0061] Figure 1 1 is a flowchart showing a method for manufacturing a bonded body according to the first embodiment. The method for manufacturing a bonded body according to the first embodiment of the present invention includes a bonding step. In addition, the method for manufacturing a bonded body according to the first embodiment includes a sintering step before the bonding step.

[0062] In the sintering step, a sintered body is obtained. In the sintering step, for example, there is a method of sintering a precursor to obtain a sintered body. Here, sintering means heating a molded object containing powder or a compact obtained by compressing the powder at a temperature below the melting point of the components constituting the powder to sinter. Figure 1 The sintering step S1 is shown.

[0063] A sintered body can be obtained by sintering a precursor. A sintered body includes an alloy. In this specification, a "sintered body" includes an alloy, preferably having grains with an average diameter of 10μ or more. Here, it is preferred that the grains are covered by a eutectic portion. A "rolled body" is a metal object formed by sintering or casting, etc., which is formed by rolling. However, even if it is sintered, the average diameter of the grains becomes smaller after the subsequent rolling process, and therefore, such a rolled body is not a sintered body.

[0064] The elements contained in the alloy are not particularly limited, and may be a combination of two or more metal elements, or a combination of one or more metal elements and one or more non-metal elements. The metal elements contained in the alloy are, for example, metal elements selected from aluminum (Al), iron (Fe), titanium (Ti), copper (Cu), silver (Ag), gold (Au), magnesium (Mg), calcium (Ca), zinc (Zn), etc. In addition, the alloy is preferably an Al alloy. The Al alloy is more preferably an AlSi alloy or an AlSiMg alloy.

[0065] The precursor is a molded body before sintering that becomes a sintered body by sintering. The precursor includes powder. The powder contained in the precursor contains two or more elements, at least one of which is a metal element.

[0066] The precursor may include any of a powder of a single element or a powder of an alloy mixed with the element. In addition, in consideration of the accuracy of the bonded body, the two or more elements contained in the precursor are more preferably elements constituting an Al alloy.

[0067] The particle size of the powder contained in the precursor is not particularly limited, but is preferably 1 μm to 500 μm, more preferably 3 μm to 200 μm, and further preferably 5 μm to 100 μm. Here, the particle size refers to the average particle size defined by the median diameter (d50).

[0068] The particle size of the powder contained in the precursor is determined by considering not only the ease of densification in the sintering process but also the workability when making the precursor. For example, in the case of a layered molding method, the particle size of the powder is determined by the ease of forming a powder layer.

[0069] The method for preparing the precursor is arbitrary and examples of the method for preparing the precursor include lamination molding, press molding, metal injection molding (MIM), casting, and the like.

[0070] The stacking modeling method is a method of using a 3D printer to stack powder layers containing powder to produce a three-dimensional object (three-dimensional object or solid object). In addition, the object obtained by the stacking modeling method is called a blank. The blank is an example of a precursor.

[0071] In addition, the stamping molding method is a method of filling the powder into the mold and then stamping the movable mold to obtain a powder compact. The metal powder injection molding method (MIM) is a method of adding a binder to the metal powder to make particles, and then injecting them into the mold to make a molded body. The casting molding method is a method of adding a binder to the metal powder to make a slurry, casting it into the mold to demold it, and drying it to make a molded body.

[0072] As a method for making a precursor, a stacking molding method is preferably used. That is, the precursor is preferably a molded object molded by the stacking molding method. In addition, the method for making a joint body of the first embodiment may also include a precursor making step for making a precursor. For example, the precursor making step is Figure 1 The sintering step S1 shown is performed before.

[0073] Examples of the layered modeling method include a fused deposition modeling method (FDM: Fused Deposition Modeling) and a binder jetting method (BJT: Binder Jetting).

[0074] The melt deposition method (FDM) is a method of molding a green body by extruding a rod made by mixing resin and metal from a fine nozzle and stacking them.

[0075] Binder jetting (BJT) is a method of molding a green body by applying a binder as a molding liquid to a powder layer containing powder, solidifying the powder with the binder, and stacking the powders. In BJT, the solvent component of the binder contained in the obtained green body is dried and degreased.

[0076] As the stacking molding method, BJT is preferably used from the viewpoint of obtaining a green body having a complex shape that cannot be achieved by molding with a die.

[0077] The heating temperature of the sintering step (hereinafter referred to as the sintering temperature) is not particularly limited. The sintering temperature is, for example, 300°C to 2500°C, preferably 400°C to 2000°C, and more preferably 500°C to 1000°C. By setting the sintering temperature to 300°C to 2500°C, a sintered body in which the precursor is fully sintered can be obtained.

[0078] The heating time of the sintering process (hereinafter referred to as the sintering time) is not particularly limited. For example, the sintering time is 15 minutes or more and 24 hours or less, preferably 30 minutes or more and 18 hours or less, and more preferably 1 hour or more and 12 hours or less. By setting the sintering time to 15 minutes or more and 24 hours or less, a sintered body in which the precursor is fully sintered can be obtained.

[0079] In the sintering process, a sintered body having a specific sintered structure is produced. The sintered body has a eutectic portion containing two or more elements and crystal grains composed of one metal element. Here, the so-called eutectic portion refers to a region where two solid phases of two compositions are crystallized. The crystal grains are surrounded by the eutectic portion. The so-called "surrounded by the eutectic portion" means that the eutectic portion exists around the crystal grains, and the entire periphery of the crystal grains does not need to be surrounded by the eutectic portion. The eutectic portion is preferably unevenly present in the sintered body.

[0080] The average diameter of the crystal grains of the sintered body is 10 μm or more, preferably 50 μm or more, more preferably 90 μm or more, and the average diameter of the crystal grains is 500 μm or less, preferably 400 μm or less, more preferably 200 μm or less.

[0081] Here, regarding the molding system of preparing a precursor and sintering the precursor to obtain a sintered body, for example, using Figure 2 The case where BJT is applied is described. Figure 2 1 is a schematic diagram of a molding system for producing a sintered body used in a method for producing a bonded body according to an embodiment of the present invention. The molding system 1 includes a molding device 100 , a drying device 200 , an excess powder removing device 300 , and a sintering device 400 .

[0082] The molding device 100 molds a molded object. The drying device 200 dries the molded object molded by the molding device 100. The excess powder removing device 300 removes excess powder attached to the molded object dried by the drying device 200. The sintering device 400 sinters the molded object from which the excess powder has been removed. In the sintering device 400, the molded object may be degreased before sintering. In addition, in the sintering device 400, the sintering step of the method for manufacturing a joint body of the present embodiment is implemented.

[0083] The molding system 1 may be composed of four devices, namely, the molding device 100, the drying device 200, the excess powder removing device 300, and the sintering device 400, as separate bodies, or may be composed of the four devices as one body, or may be composed of a part of the functions mounted on the molding device 100 or the sintering device 400. In addition, at least a part of the functions of the drying device 200 or the excess powder removing device 300 may be omitted as appropriate.

[0084] Next, the molding device 100 will be described. Figure 3 This is a schematic diagram of a molding device for a precursor used in a method for manufacturing a bonded body according to one embodiment of the present invention. Figure 4 This is a schematic diagram of a control unit of a molding device for manufacturing a precursor used in a method for manufacturing a bonded body according to an embodiment of the present invention.

[0085] The molding device 100 includes a molding unit 10 and an imparting unit 20. The molding unit 10 molds a powder layer 111 including a powder 11. The powder 11 is an example of a powder including two or more elements included in a precursor in one embodiment of the present invention. The imparting unit 20 imparts a molding liquid 21 to the powder layer 111 to form a molding layer 112. In the molding device 100, a plurality of molding layers 112 are stacked to mold the above-mentioned molding object.

[0086] The molding section 10 includes a powder tank 12 and a stacking unit 13. The powder tank 12 includes a supply tank 121, a molding tank 122, a supply table 123, a molding table 124, and a residual powder tank 125. The powder tank 12 is box-shaped. The supply tank 121, the molding tank 122, and the residual powder tank 125 are open on the top. The stacking unit 13 has a flat portion 131 and a powder removal portion 132.

[0087] The supply tank 121 is a tank for supplying the powder 11 to the molding tank 122. In addition, the supply tank 121 holds the powder 11 for supplying to the molding tank 122. A supply table 123 is provided at the bottom of the supply tank 121. The supply table 123 is raised and lowered in the vertical direction (Z direction). The side surface of the supply table 123 is arranged in contact with the inner side surface of the supply tank 121.

[0088] The molding tank 122 is supplied with the powder 11 required for molding from the supply tank 121. The molding tank 122 is formed with the powder layer 111 and the molding layer 112. Furthermore, in the molding tank 122, a plurality of molding layers 112 are stacked to mold the above-mentioned molded object.

[0089] A supply table 123 and a molding table 124 are respectively provided at the bottom of the supply tank 121 and the molding tank 122, and are raised and lowered in the vertical direction (Z direction). The side of the molding table 124 is arranged in contact with the inner side of the molding tank 122. The tops of the supply table 123 and the molding table 124 are kept horizontal.

[0090] The remaining powder tank 125 is a tank for holding the remaining powder 11 in the powder 11 flattened by the flat portion 131 when forming the powder layer 111. A mechanism for sucking the powder 11 may be provided at the bottom of the remaining powder tank 125, and the remaining powder tank 125 may also be used as a mechanism for taking out the remaining powder tank 125. The remaining powder tank 125 is arranged next to the molding tank 122. The remaining powder 11 held in the remaining powder tank 125 may be returned to the supply tank 121, or may be returned to the supply tank 121 via the powder supply device.

[0091] The powder supply device may also be arranged on the upper part of the supply tank 121, and the powder 11 may be supplied to the supply tank 121 before molding begins or when the amount of the powder 11 in the supply tank 121 decreases. In addition, the powder tank 12 is provided with two tanks, the supply tank 121 and the molding tank 122, but it may be provided only with the molding tank 122, and powder may be supplied to the molding tank 122 from the powder supply device.

[0092] Examples of a method for conveying the powder 11 from the powder supply device to the supply tank 121 include a screw conveyor method using a screw and an air conveying method using air.

[0093] The flattening unit 131 flattens the modeling layer 112 and the powder layer 111. The flattening unit 131 flattens the modeling layer 112 by rotating the re-coater as a rotating body. The flattening unit 131 supplies the powder 11 from the supply table 123 of the supply tank 121 to the modeling tank 122 by rotational driving, thereby forming the powder layer 111.

[0094] The flat portion 131 reciprocates in the Y direction along the table surface (the surface on which the powder 11 is placed) of the molding table 124. More specifically, the flat portion 131 moves horizontally from the outside of the supply tank 121 through the tops of the supply tank 121 and the molding tank 122.

[0095] Thus, the powder 11 is transferred and supplied to the molding groove 122, and the flat portion 131 flattens the powder 11 while passing over the molding groove 122, thereby forming a powder layer 111. The flat portion 131 is a member longer than the inner dimensions of the molding groove 122 and the supply groove 121. In addition, the flat portion 131 may use a scraper or a rod as a plate-shaped member.

[0096] The powder removing unit 132 removes the powder attached to the flat portion 131. The powder removing unit 132 moves together with the flat portion 131 while being in contact with the peripheral surface of the flat portion 131.

[0097] The applying section 20 includes a carriage 211 and a head 212 . The head 212 applies the modeling liquid 21 to the powder layer 111 .

[0098] The head 212 is, for example, an inkjet head, and is provided with a nozzle array in which a plurality of nozzles are arranged. A colored object can be formed by applying a cyan modeling liquid, a magenta modeling liquid, a yellow modeling liquid, and a black modeling liquid, or a modeling liquid of a single color can be applied from a plurality of nozzles. The modeling liquid can be applied by an inkjet method or a dispenser method.

[0099] At least one head 212 is mounted on the carriage 211 and reciprocates in the X (main scanning), Y (sub scanning), and Z directions by a motor and a guide member.

[0100] The molding device 100 includes a control unit 30. Figure 4 As shown, the control unit 30 includes a CPU (Central Processing Unit) 301, a ROM (Read Only Memory) 302 for storing programs for executing control and other fixed data, and a RAM (Random Access Memory) 303 for temporarily storing modeling data, etc.

[0101] The molding data is received from the molding data generating device 304 of an external computer or the like. The molding data generating device 304 generates molding data for slicing the molding object of the final form into molding layers 112. The control unit 30 causes each molding layer 112 to perform a molding operation. The molding data generating device 304 may be separate from the molding device 100 or may be integrated therewith. In addition, the control unit 30 may be inside the molding device 100 or outside the molding device 100.

[0102] The above is a description of the method of manufacturing a precursor and a sintered body, for example, when applying BJT. Figure 1 , a method for manufacturing a bonded body according to the first embodiment is described.

[0103] The joining process joins the sintered body to the object. The so-called "joining the sintered body to the object" means joining the two joined parts, one of which is the sintered body and the other is the object. In this specification, the so-called "joined parts" refers to the parts to be joined, and the sintered body and the object correspond to the joined parts. The joining process is Figure 1 The bonding process is performed in step S2 shown.

[0104] The object is another joined part that is different from the sintered body that constitutes one joined part, but may also be a sintered body obtained in the same manner as the sintered body that constitutes one joined part. The object is, for example, a rolled body, a cast body, a forged body, an extruded body, etc. A rolled body does not include a sintered body, and means that a cast body obtained by melting powder is rolled, etc.

[0105] In addition, in the bonding process, it is preferred to heat the sintered body within a temperature range where a liquid phase is generated in the sintered body. This temperature range is further preferably a temperature range where the metal crystals (hereinafter referred to as metal crystal parts) generated in the sintered body do not generate a liquid phase. When the temperature during bonding (hereinafter sometimes referred to as bonding temperature or bonding processing temperature) is too high, the metal crystals liquidate, which may cause deformation of the parts. In addition, if the bonding temperature is too low, the liquidation of the eutectic part is not fully carried out, which may result in poor bonding.

[0106] By heating the vicinity of the joining surface of the sintered body with the object, a liquid phase is generated from the sintered body. In this embodiment, after the liquid phase is generated in the sintering process, the region generated by crystallization of two solid phases corresponds to the eutectic portion.

[0107] The temperature range in which the sintered body generates a liquid phase varies depending on the metal element contained in the sintered body. For example, when the sintered body includes an aluminum alloy, the temperature range in which the liquid phase is generated in the sintered body is 300°C to 2500°C, preferably 400°C to 2000°C, more preferably 500°C to 1000°C, and even more preferably 550°C to 700°C.

[0108] In addition, in the joining step, it is preferred to heat in a temperature region where a liquid phase of 5% to less than 50% by mass is generated in the sintered body containing the alloy. In particular, in the case of a sintered body containing an aluminum alloy, it is preferred to heat in a temperature region where a liquid phase of 5% to 35% by mass is generated in the sintered body containing the aluminum alloy, more preferably in a temperature region where a liquid phase of 10% to 30% by mass is generated, and further preferably in a temperature region where a liquid phase of 15% to 25% by mass is generated.

[0109] When the liquid phase generated in the sintered body containing the aluminum alloy is less than 5 mass %, the liquid phase is insufficient and the joining does not proceed, which may result in poor joining. In addition, when the liquid phase generated in the sintered body containing the aluminum alloy exceeds 35 mass %, the liquid phase is excessively advanced and the sintered body is difficult to maintain its shape.

[0110] In the case where the sintered body includes an aluminum alloy, the crystal grains included in the bonded body are composed of aluminum, and the eutectic portion is composed of elements constituting the aluminum alloy. The composition of the metals in the crystal grains and the eutectic portion is different. For example, in the case of using a sintered body containing an alloy of silicon and aluminum, the crystal grains included in the bonded body contain aluminum elements, and the eutectic portion contains aluminum elements and silicon elements.

[0111] In the bonding process, the time required for bonding (hereinafter referred to as bonding time) is arbitrary, but preferably the time for liquid phase to be generated from the eutectic portion is 5 minutes or more. By setting the bonding time to the time for liquid phase to be generated from the eutectic portion to 5 minutes or more, the liquid phase can be fully filled in the boundary surface.

[0112] In the joining process, the joining environment is arbitrary. In the joining process, for example, it is preferred to join in a vacuum, a rare gas atmosphere such as nitrogen, argon, or a reducing atmosphere such as hydrogen. In the joining process, the sintered body and the object are joined and completely cooled, thereby completing the manufacturing method of the joined body of the first embodiment of the present invention.

[0113] Figure 5Schematic diagram of an optical microscope photograph showing a cross section of a sintered body used in the method for manufacturing a joint body according to the first embodiment of the present invention. As a cross section of the sintered body in the first embodiment of the present invention, the joint between the sintered body and the object includes a eutectic portion. Through the sintering process, the sintered body containing the alloy generates a eutectic portion unevenly at the boundary portion of the metal crystal. In addition, Figure 5 In FIG. 1 , a part of the eutectic portion is indicated by an arrow.

[0114] Figure 6 A bonded body according to one embodiment of the present invention is shown. Figure 7 This is a schematic diagram of an optical microscope photograph of a cross section near a joining boundary of a joined body (when the object joined to the sintered body is a metal or an alloy) according to one embodiment of the present invention. Figure 7 In, with Figure 5 Similarly, a part of the eutectic portion is indicated by an arrow. Figure 8 This is a schematic diagram showing an optical microscope photograph of a cross section of an object (in the case of a metal or an alloy) according to one embodiment of the present invention.

[0115] Figure 6 The bonded body 2 shown includes a sintered body 3 and an object 4. The sintered body 3 is placed on the object 4 through a bonding step. The sintered body 3 and the object 4 are bonded to each other via a bonding portion 5.

[0116] The sintered body 3 is obtained by sintering a precursor containing two or more elements. The precursor is an object produced by a manufacturing method such as BJT or MIM.

[0117] The object 4 may be the same as or different from the sintered body 3. In the same case, for example, the sintered body 3 and the object 4 may be made of BJT, or the sintered body 3 may be made of BJT and the object 4 may be made of MIM, or the sintered body 3 may be made of MIM and the object 4 may be made of BJT. In different cases, for example, the sintered body 3 may be made of BJT and the object 4 may be a rolled body or a cast body containing a metal or an alloy, a formed body of ceramics, etc.

[0118] In addition, the object 4 may have the same shape as that of the sintered body 3, or may have a different shape. In addition, the object 4 may have the same size as that of the sintered body 3, or may have a different size.

[0119] In the case where the object 4 includes a metal or an alloy, in the joined body 2 obtained by joining the sintered body 3 and the object 4, when the sintered body 3 is reheated in the joining process, the eutectic portion (hereinafter referred to as the eutectic portion) included in the sintered body 3 is locally and preferentially liquidized. And the eutectic portion promotes joining by diffusing to the object 4 side that is in physical contact with the sintered body 3. As a cross section of the joined body of the present embodiment, the joined portion between the sintered body and the object includes the eutectic portion.

[0120] exist Figure 7 In the figure, the cross section near the joining boundary of the joined body is shown in such a way that the upper part of the figure is a sintered body and the lower part of the figure is an object containing metal or alloy. Figure 7 In FIG. 4 , since the eutectic portion indicated by the arrow exists in the lower part of the drawing, it can be seen that the eutectic portion diffuses from the sintered body 3 to the object 4 side.

[0121] At this time, since the metal crystal part remains in a solid phase in the sintered body, the sintered body as a whole will not be deformed, and the joining can be performed while maintaining the shape of the sintered body. Figure 8 As shown, the eutectic portion of the rolled body is scattered throughout. Therefore, when the rolled bodies are to be joined together in this embodiment, the metal crystal portion cannot remain in a solid phase within the rolled body, which may cause deformation of the entire rolled body.

[0122] On the other hand, in the manufacturing method of the bonded body of the first embodiment, by including the sintering step and the bonding step, it is possible to provide a bonded body in which the shapes of the bonded members are maintained without using the conventional manufacturing method of the bonded body.

[0123] In conventional bonding methods, flux is applied for the purpose of destroying the oxide film on the metal surface and allowing the liquid phase to penetrate into the boundary surface.

[0124] On the other hand, in the sintered body used in the present embodiment, when the eutectic part unevenly present in the sintered body is liquidized, the oxide film present on the metal surface and being the main cause of the sintering obstruction is destroyed, so it is not necessary to apply flux. Therefore, in the manufacturing method of the joint body of the first embodiment, it is not necessary to remove the flux after sintering. In addition, by not using flux in this way, it is possible to provide a joint body that does not generate flux residues that cause poor sintering.

[0125] In addition, conventional joining methods used in the production method of a joined body include brazing, friction stir welding, laser welding, diffusion welding, and the like.

[0126] Brazing is a method of heating a metal with a lower melting point than the parts to be joined so that it melts and fills the gap between the parts to be joined.

[0127] Friction stir welding is a method of overlapping the objects to be joined and performing joining by utilizing frictional heat generated by a rotating tool pressing at or around the boundary.

[0128] Laser welding is a method of joining objects by overlapping them and focusing laser light on the boundary or its surroundings to melt them locally. Since the range that can be joined is limited to the range that can be irradiated with laser light, it is not suitable for complex shapes. In addition, the joining range is the joining at the point or line that can be irradiated with laser light, so it is not suitable for joining on a wide surface.

[0129] Diffusion bonding is a method of bonding base materials by bringing them into close contact, applying pressure to a level below the melting point of the base materials to substantially prevent plastic deformation, and utilizing the diffusion of atoms occurring between the bonding surfaces.

[0130] However, conventional bonded bodies obtained by these bonding methods have poor bonding quality.

[0131] On the other hand, in the method for producing a bonded body according to the first embodiment, by including the sintering step and the bonding step, it is possible to provide a bonding method with good bonding quality.

[0132] In addition, in the method for manufacturing a bonded body of the first embodiment, by heating the sintered body in a temperature range where a liquid phase is generated in the sintered body during the bonding process, the bonding temperature is not too high, thereby preventing deformation of the bonded body caused by liquid phase transformation of metal crystals. In addition, by heating the sintered body in such a temperature range, the bonding temperature is not too low, thereby fully liquid phase transformation of the eutectic part proceeds, thereby preventing bonding defects.

[0133] Thus, in the method for manufacturing a joined body of the first embodiment, even when joining a sintered body to an object, the sintered body and the object can be joined by direct contact without using brazing material, etc. Therefore, according to this embodiment, a method for manufacturing a joined body with good joining quality can be provided.

[0134] In the method for producing a joined body according to the first embodiment, the precursor is a molded object molded by the layered molding method, thereby making it possible to produce a sintered body and a joined body having a complex shape that cannot be achieved by die molding.

[0135] Fig. 9 1 is a diagram showing a bonded body according to another embodiment of the present invention. Fig. 9 In, with Figure 6 The same parts are used as Figure 6 The same or corresponding symbols are used and their descriptions are omitted.

[0136] Fig. 9 The bonded body 2A shown includes a sintered body 3, an object 4, and a bonded portion 5. The sintered body 3 includes a gyro structure G. That is, the sintered body including the gyro structure G is bonded to the object 4.

[0137] Since the stacking molding method is a binder injection method, it is possible to reliably mold a sintered body and a joined body having a complex shape that cannot be realized by die molding. Therefore, according to this embodiment, a joined body 2 formed by joining a sintered body 3 having a gyro structure and an object 4 can be provided.

[0138] In the method for producing a joined body of the first embodiment, by containing an aluminum (Al) alloy in the sintered body, Al reduces the temperature at which the liquid phase of the alloy is generated, thereby reducing the influence on the structure of the object to be joined by the sintered body.

[0139] In the method for manufacturing a joined body of the first embodiment, in the joining process, by heating in a temperature region where a liquid phase of 5% to 50% by mass is generated in the sintered body, a sufficient liquid phase can be generated from the eutectic portion to prevent poor joining. In addition, since excessive liquid phase is suppressed, the shape of the sintered body or the joined body can be maintained. In addition, the liquid phase generation rate can be calculated by thermodynamic calculation based on the alloy composition.

[0140] Second Implementation

[0141] Fig.10 1 is a flow chart showing a method for manufacturing a bonded body according to a second embodiment of the present invention. Figure 1 The same or corresponding symbols are marked in the figure, and their description is omitted.

[0142] The method for manufacturing a joint body of the second embodiment further includes a smoothing step. The smoothing step is performed before the joining step. The smoothing step smoothes the joining surface of at least one of the sintered body and the object. Here, the joining surface refers to the surface where the joined component of one side and the joined component of the other side contact each other. In addition, the smoothing step is performed before the joining step. Fig.10 The smoothing step S11 is shown.

[0143] The processing method of the smoothing process is not particularly limited. As the processing method of the smoothing process, for example, cutting processing using a tool such as a milling cutter, grinding processing using a tool such as a grindstone, polishing grinding, electrolytic grinding and other grinding processing can be cited. By smoothing the bonding surface in this way, the surface roughness of the surface treated before and after the smoothing process can be reduced.

[0144] The surface roughness Ra of the smoothed joining surface is arbitrary, preferably 12.5 μm or less, more preferably 8.4 μm or less, and further preferably 6.3 μm or less. When the surface roughness Ra of the joining surface is 12.5 μm or less, the gap generated between the joining surface of one joined component and the joining surface of another joined component during joining can be reduced.

[0145] In addition, the surface roughness Ra can be measured using a laser microscope (KEYENCE, shape analysis laser microscope VK-X1000). When using a laser microscope, as measurement conditions, within the range of 2.74×2.06 mm, 14 measurement lines (7 horizontal lines with a line spacing of 0.40 mm and 7 vertical lines with a line spacing of 0.27 mm) are drawn with a lens magnification of 5 times, a Z-direction measurement spacing of 12 μm, and the average value of the roughness is taken as the surface roughness Ra.

[0146] In the method for producing a bonded body according to the second embodiment, by including the smoothing step, it is possible to provide better bonding quality.

[0147] Fig.11 This is a diagram showing a bonded body according to one embodiment of the present invention. Fig.12 This is a schematic diagram showing an optical microscope photograph of a cross section near a joining boundary portion of a joined body formed by joining a sintered body and an object according to an embodiment of the present invention. Fig.13 This is a schematic diagram showing an optical microscope photograph of a cross section near a joining boundary portion of a joined body in which sintered bodies are joined together according to one embodiment of the present invention. Fig.14 FIG. 1 is a schematic diagram showing an optical microscope photograph of a cross section near a joining boundary of a joint body of sintered bodies joined together according to a second embodiment of the present invention. Fig.12 , Fig.13 In, with Fig.11 Common parts are marked with Fig.11 The same or corresponding symbols are marked in the figure, and their description is omitted.

[0148] Here, Figure 12 to Figure 14 express Fig.11 AA cross-sectional view of the joint body 2 shown. Fig.12 and Fig.13 No smoothing process is performed in Fig.14 A smoothing process is performed.

[0149] For example, Fig.12 As shown in FIG. 2 , in the joint body 2 formed by joining the sintered body 3 and the object 4, the joint portion 5 which is the boundary between the sintered body 3 and the object 4 can be visually recognized. Fig.12 In the figure, the crystal grains C can be visually identified in the white part, and the eutectic E can be visually identified in the black part. In the joined body 2, the eutectic E is visible not only in the sintered body 3 but also in the object 4. The eutectic E dissolved from the sintered body 3 enters the object 4, and the sintered body 3 and the object 4 are joined.

[0150] Fig.13 Likewise, when the sintered bodies are joined together, the boundary of the joint 5 can be visually recognized. Fig.14 In the case where the sintered bodies shown are smoothed and joined, the boundary of the joint 5 is hardly visible.

[0151] Furthermore, by performing the smoothing step in this way, the joint portion 5 of the obtained joint body can be in close contact, so the joint strength of the joint portion 5 of the joint body is further increased.

[0152] 《Third Implementation Form》

[0153] Fig.15 1 is a flow chart showing a method for manufacturing a bonded body according to a third embodiment of the present invention. Figure 1 and Fig.10 The same or corresponding symbols are marked in the figure, and their description is omitted.

[0154] The method for manufacturing a bonded body according to the third embodiment further includes a pressurizing step. The pressurizing step may be performed before the bonding step or during the bonding step, preferably during the bonding step. The pressurizing step applies pressure in the direction in which the sintered body and the object are bonded. The direction in which the sintered body and the object are bonded is the direction in which the bonding surface of the sintered body and the bonding surface of the object are relative to each other during bonding. Fig.15 The pressurization step S12 is shown.

[0155] The pressurizing method performed in the pressurizing step is arbitrary. As a pressurizing method, for example, there is a method of placing a heavy object on two members to be joined that overlap during joining to apply surface pressure.

[0156] The pressure during pressurization is arbitrary. In addition, if the pressure during pressurization is too large, it may cause deformation depending on the shape of the joined parts.

[0157] In the method for producing a bonded body of the third embodiment, since a pressurizing step is included, the bonded members are in close contact with each other during bonding, the wetting and spreading of the liquid phase is good, and the number of pores at the boundary interface of the bonded portion of the bonded body is reduced, thereby improving the bondability.

[0158] 《Fourth Implementation Form》

[0159] Fig.16 1 is a flow chart showing a method for manufacturing a bonded body according to a fourth embodiment of the present invention. Figure 1 , Fig.10 as well as Fig.15 The symbols marked in the figure are the same as or correspond to the symbols, and their descriptions are omitted.

[0160] The joint body of the fourth embodiment comprises a sintered body, an object and a brazing member. In the manufacturing method of the joint body of the fourth embodiment, in the joining step, joining by brazing between the contacting surfaces of the object and the brazing member is also performed. Specifically, Fig.16 As shown, in the joining step S21, while the sintered body is heated in a temperature region where the sintered body generates a liquid phase, the sintered body and the object are brought into direct contact and joined, and the object and the brazing member are joined in parallel.

[0161] In the fourth embodiment, the object and the brazing member are joined in a region different from the joining region where the sintered body and the object are joined by the heat treatment in the joining process. In the fourth embodiment, the region in the object where the object and the brazing member are joined is a region different from the joining region where the sintered body and the object are joined. That is, the object and the brazing member are brought into contact in a region different from the joining region where the sintered body and the object are brought into direct contact.

[0162] In addition, the brazing member can be coated with brazing material, or a brazing member to which the brazing material is applied can be used. The brazing material is appropriately selected according to the object to be brazed and the brazing member. As aluminum brazing material, for example, there are Toyal Hyper Braze (registered trademark) (manufactured by Toyo Aluminum Co., Ltd.) and XuperBraze 190 PA (manufactured by Castolin eutectic Co., Ltd.). The brazing material can also contain flux, and in the case of using a brazing material containing flux, it is not necessary to apply flux on the brazing member.

[0163] The manufacturing method of the joint body of the fourth embodiment uses an object cut in accordance with the size of the sintered body. After the sintering step S1, a dimension measuring step and a cutting step may also be included. In the dimension measuring step, the size of the sintered body is measured. As a measuring means (equipment) for measuring the size of the sintered body, for example, a caliper, a non-contact three-dimensional measuring machine (manufactured by KEYENCE, VL-500) and the like can be cited. In the cutting step, the object is cut according to the size of the sintered body measured in the dimension measuring step.

[0164] In the cutting process, Figure 17 to Figure 19 As shown, a step 7A may be provided on a metal container 7 as an example of an object in accordance with the size of the sintered body 6 to be joined. By providing the step 7A, the sintered body 6 can be fixed to the step 7A of the metal container 7.

[0165] For example, Fig.17 , Fig.18 As shown, steps 7A may be provided on the entirety of two opposite sides of the substantially rectangular container 7, or as shown in FIG. Fig.19 As shown in FIG. 1 , a step 7A is provided on a portion of the side constituting the container 7. Fig.17 and Fig.19 In the embodiment, a step 7A is provided on each side, but the number, the location and the shape thereof can be appropriately selected according to the shape and the size of the sintered body. Fig.18 Container 7 for Fig.17 The AA cross-sectional view of FIG. 1 shows that the sintered body 6 is fixed by the step 7A.

[0166] In addition, in the cutting process, Fig. 20 , Fig.21 As shown, a plurality of protrusions 7B may be provided on a metal container 7 as an example of an object corresponding to the joining positions of the sintered body 6 , and the recesses 6A provided in advance on the sintered body 6 may be fitted with the protrusions 7B of the metal container 7 . Fig.21 Container 7 for Fig. 20 The BB cross-sectional view shows that the sintered body 6 is fixed by the protrusion 7B.

[0167] The shape, number and arrangement of the protrusions 7B can be appropriately selected according to the shape and size of the recesses provided in the sintered body. By providing two or more recesses of the sintered body, the same number of recesses as the sintered body is provided on the container 7, so that the joining can be performed more accurately. By providing the step 7A and the protrusion 7B, the sintered body 6 can be joined to the target position of the container 7, and as a result, the designed function of the joined component can be realized.

[0168] In the brazing process, Fig. 22 As shown in FIG. 1 , the brazing member 8 and the brazing material 9 constituting the cover are brought into contact with the upper surface of the container 7 and are placed in the furnace. Fig.23 As shown, a bonded body in which the sintered body 6 is surrounded and sealed by the container 7 and the cover 8 is obtained.

[0169] Fig.23 The coated joint body shown can be used, for example, in a heat sink. A heat sink is a device that cools by radiating (dissipating) absorbed heat into the air. Fig.23 When the covered joint body shown is used for a radiator, a coolant such as water may be injected into the radiator and circulated.

[0170] In the joining method of the fourth embodiment, the joining of the object and the brazing part is performed in parallel with the joining of the sintered body and the object by direct contact, so that the target joined body can be manufactured in one process. As a result, it is not necessary to prepare two heating devices for the joining of the sintered body 6 and the container 7 and the brazing of the container 7 and the lid 8, respectively, and they can be performed using one heating device. In addition, since only one heat treatment is required, the process time is also minimized.

[0171] By using such a coated joint body for a heat sink, the internal structure of the heat sink can be designed to be a complex structure, thereby improving the cooling efficiency of the heat sink.

[0172] 《Fifth Implementation Form》

[0173] A method for manufacturing a bonded body according to a fifth embodiment of the present invention is as follows Fig.16 The manufacturing method of the joint body of the fifth embodiment is different from that of the fourth embodiment in that an object obtained by stamping is used. In the fifth embodiment, the same parts as those of the first, second, third and fourth embodiments are used. Figure 1 , 10 , 15 and 16 are represented by the same or corresponding figure marks, and their description is omitted.

[0174] The joint body of the fifth embodiment also comprises a sintered body, an object and a brazing member. The method for manufacturing the joint body of the fifth embodiment is also similar to Fig.16 In the fourth embodiment, in the joining step, the object and the brazing member are joined by brazing between the surfaces in contact. The region of the object where the object and the brazing member are joined is a region different from the region where the sintered body and the object are joined. That is, the object and the brazing member are brought into contact in a region different from the region where the sintered body and the object are joined by direct contact.

[0175] In the fifth embodiment, Fig.16 As shown, in the joining step S2, when the sintered body is heated in a temperature region where a liquid phase is generated in the sintered body, the object and the brazing member are joined in parallel with the sintered body and the object are brought into direct contact and joined. The object and the brazing member are in contact via the brazing material. In the joining step, the brazing joining is performed between the contacting surfaces of the object and the brazing member.

[0176] In the fifth embodiment, the object and the brazing member are joined in a region different from the joining region where the sintered body and the object are joined by heat treatment in the joining process. The manufacturing method of the joined body of the fifth embodiment uses an object formed by stamping a metal plate. Before the sintering process S1, a sheet metal forming process, a strain measuring process, and a precursor manufacturing process may be included.

[0177] In the sheet metal forming process, the sheet metal is subjected to stamping to produce an object. In the stamping process, an object with steps or protrusions can be produced. The stamping process is performed, for example, by bending. In the strain measurement process, the size of the object obtained by the stamping process is measured. In the precursor production process, a precursor is produced based on the strain of the object measured in the strain measurement process.

[0178] By using an object formed by pressing a sheet metal, the cost can be reduced compared to manufacturing an object by cutting. In addition, the object and the brazing member used in the manufacturing method of the joint body of the fifth embodiment may be the same. Fig.25Detailed Description of the Invention In the figure, as a joint body according to the fifth embodiment, a form in which the object and the brazing member are integrated is shown.

[0179] Fig.24 Yes means Fig.25 Flow chart of the method for manufacturing a joint body shown in FIG. Fig.25 In the process of joining, a region of the object and another region of the object are joined by brazing in a region different from the joining region where the sintered body and the object are joined, by heat treatment in the joining process. Fig.25 In the fifth embodiment of Fig.24 As shown, in the joining step S22, in parallel with the joining of the sintered body and the object, a region of the object and another region are also brazed. The region to be brazed is different from the region to be joined between the sintered body and the object. In the sheet metal forming step, the object and the brazing part can be made identical by integrally forming the container 7 and the cover 8. Fig.25 In the combined body, the sintered body 6 is surrounded by a container 7 integrally formed with a lid.

[0180] In the joining method of the fifth embodiment, the object and the brazing member are joined in parallel with the direct contact between the sintered body and the object, so that the target joined body can be formed in a short process. Thus, a plurality of heat treatments that cost a lot can be performed with one device, thereby preventing a huge increase in manufacturing cost.

[0181] <Joint body>

[0182] A joined body according to one embodiment of the present invention is a joined body in which a sintered body and an object are directly joined. The joined body of this embodiment is obtained by the above-mentioned method for producing a joined body of this embodiment.

[0183] The sintered body of the joint body of the present embodiment comprises an alloy. The elements contained in the alloy are not particularly limited, and are, for example, metal elements selected from aluminum (Al), iron (Fe), titanium (Ti), copper (Cu), silver (Ag), gold (Au), magnesium (Mg), calcium (Ca), zinc (Zn), etc. In addition, the alloy is preferably an Al alloy. The Al alloy is more preferably an AlSi alloy or an AlSiMg alloy.

[0184] Fig.26 This is an enlarged view of a sintered body according to one embodiment of the present invention. Fig.26 Corresponds to Figure 6 FIG. 2 is an enlarged view of a cross section of a sintered body 3 included in a bonded body 2. The sintered body included in the bonded body has crystal grains C surrounded by eutectic E. The average diameter of the crystal grains C included in the bonded body is 10 μm or more, preferably 50 μm or more, and more preferably 90 μm or more. In addition, the average diameter of the crystal grains C is 500 μm or less, preferably 400 μm or less, and more preferably 200 μm or less.

[0185] Here, the average diameter of the grains contained in the joint body is the average of the grain sizes of the grains. In addition, the method for confirming the grain size of the grains is arbitrary. For example, for the cross section in the thickness direction, observation using an optical microscope, a scanning electron microscope (SEM: Scanning Electron Microscope) or a transmission electron microscope (TEM: Transmission Electron Microscope), or analysis using electron backscattered diffraction (EBSD: Electron Backscattered Diffraction) can be performed.

[0186] By setting the average diameter of the crystal grains in the sintered body included in the joined body to be 90 μm or more and 500 μm or less, the sintered bodies can be joined with good joining quality. In addition, deformation of the objects during joining can be suppressed.

[0187] Fig. 27 It is a diagram showing a first modified example of the bonded body according to one embodiment of the present invention. Fig.28 It is a diagram showing a second modified example of the bonded body according to the embodiment of the present invention. Fig.29 FIG. 2 is a diagram showing a third modified example of a joint body according to an embodiment of the present invention. Figure 27 to Figure 29 In, with Figure 6 Common parts are marked with Figure 6 The same or corresponding symbols are used and the description is omitted.

[0188] Fig. 27 The junction body 2B and Fig.28 The joined bodies 2C shown are all joined in a state where the sintered body 3 is inserted into the object 4 having the recessed portion. Fig.28 The junction body 2C shown is Fig. 27 The bonded body 2B shown is different in that the sintered body 3 is also bonded to the upper surface of the recessed portion of the object 4 . Fig.29 The joined body 2D shown has a cavity inside the body, and the sintered body is inserted into the cavity.

[0189] and Fig.12 Likewise, in Figure 27 to Figure 29 The junction 5 which is the boundary between the sintered body 3 and the object 4 is also included. In addition, the eutectic E melted out from the sintered body 3 enters the object 4, and the sintered body 3 and the object 4 are joined.

[0190] The bonded body of this embodiment has a sintered body containing two or more metal elements, and has crystal grains surrounded by a crystal part and a eutectic part. Thus, the solid phase of the metal crystal part is maintained during sintering, so that the entire sintered body is difficult to deform and the shape of the sintered body is maintained.

[0191] Furthermore, by setting the average diameter of the crystal grains to be 10 μm or more, the entire sintered body becomes more difficult to deform, and the shape of the sintered body is maintained.

[0192] Furthermore, since the crystal grains contain aluminum and the eutectic portion contains aluminum and silicon, the sintered body as a whole is more difficult to deform, and the shape of the sintered body is maintained.

[0193] In addition, when the eutectic part unevenly present in the sintered body is liquidized, the oxide film present on the metal surface and being the main cause of the sintering obstruction is destroyed, so it is not necessary to apply flux for the purpose of removing the oxide film. Therefore, the joint body of this embodiment does not contain impurities such as flux at the interface. In addition, since the joint body of this embodiment does not have flux or the like between the sintered body and the object, the bonding strength between the sintered body and the object is excellent.

[0194] <Object>

[0195] In the joint body involved in one embodiment of the present invention, the object refers to a structure joined to the sintered body, and the object is given a shape, strength, etc. suitable for the desired use of the joint body by joining with the sintered body. Preferably, the melting point of the object is equal to or higher than the melting point of the sintered body. By making the melting point of the object equal to or higher than the melting point of the sintered body, deformation of the object during joining can be suppressed.

[0196] The phrase "or higher than the melting point of the sintered body" preferably means that the melting point of the object is or higher than the melting point of the alloy constituting the sintered body.

[0197] In this specification, the melting point means the temperature at which a liquid phase begins to appear as determined by thermodynamic calculation. Thermodynamic calculation can be performed using, for example, thermodynamic equilibrium calculation software (CaTCalc, manufactured by Computational Thermodynamics Research Institute).

[0198] As materials constituting the object, metals or ceramics can be cited. As metals, for example, aluminum (Al), iron (Fe), titanium (Ti), copper (Cu), silver (Ag), gold (Au), magnesium (Mg), calcium (Ca), zinc (Zn), etc. can be cited. As ceramics, for example, there are aluminum oxide (Al2O3), silicon nitride (Si3N4), zirconium oxide (ZrO2), aluminum nitride (AlN), etc. In addition, in the case where the sintered body includes an aluminum alloy, it is preferred that the object includes an aluminum alloy. The object includes an aluminum alloy, allowing bonding with good bonding quality.

[0199] The joint body according to one embodiment of the present invention includes a shell having at least one object and a sintered body enclosed therein. Fig.23 The container 7 and the cover 8 constituting the sealed joint body correspond to each other. Fig.23 The coated joint is shown.

[0200] The bonded body of the present embodiment can be used as a heat sink by enclosing the sintered body in a case having at least an object.

[0201] The heat sink formed of the bonded body of this embodiment can have a complex internal structure, thereby improving the cooling efficiency of the heat sink.

[0202] Fig.30 This is a schematic diagram showing an optical microscope photograph of a cross section near a joining boundary of a joined body (when the object joined to the sintered body is a ceramic) according to another embodiment of the present invention. Fig.30 In Fig.11 The corresponding part is given in Fig.11 The symbols given in the above are added with 100, and the explanation is omitted. Fig.30 In the figure, the lower part of the figure is an object composed of a ceramic plate relative to the sintered body in the upper part, and shows a cross section near the bonding boundary of the bonded body.

[0203] like Fig.30 As shown, in the joining of the sintered body 103 and the object 104 (ceramic), the eutectic part also liquidizes and diffuses toward the ceramic side. That is, in the joining of the ceramic and the sintered body, similar to the joining of the object containing metal or alloy and the sintered body, the sintered body is preferentially liquidized, and the joining is performed while maintaining the shape of the joined body.

[0204] When the object joined to the sintered body contains a metal or an alloy, as described above, the diffusion of eutectic E can also be seen inside the object. However, when the object joined to the sintered body is a ceramic, the eutectic E does not diffuse into the interior of the ceramic, and at the boundary 105 between the sintered body 103 and the object 104, the liquid phase is limited to entering the surface bumps of the ceramic.

[0205] Thus, in the joint body of another embodiment of the present invention, the shape of the sintered body 103 is maintained while the sintered body 103 is fixed to the surface of the object 104 by the anchoring effect. Therefore, even when the sintered body and the ceramic are joined, the sintered body as a whole will not be deformed, and the joining can be performed while the shape of the sintered body is maintained. Example

[0206] The following examples are provided to illustrate the present invention in more detail, but the present invention is not limited to these examples. Unless otherwise specified, "%" is a mass reference. In addition, various tests and evaluations were performed according to the following methods.

[0207] <Production of joint body>

[0208] As the joint bodies, the joint bodies formed by joining the sintered body formed by sintering the precursor and the rolled body (Examples 1 to 5, 8 to 13), the joint bodies formed by joining the sintered bodies to each other (Examples 6 and 7), the joint bodies formed by joining the sintered body and the ceramic (Examples 14 and 15), and the joint bodies formed by joining the rolled bodies to each other (Comparative Examples 1 to 4) were prepared. The conditions and joint quality of each joint body are shown in Tables 1 and 2.

[0209] Table 1

[0210] Joint (alloy composition) Sintering time Average grain diameter Smoothing Bonding temperature Liquid phase generation rate during bonding Joining quality Example 1 BJT sintered body (AlSi alloy) - rolled body (AlSiMg alloy) Medium (4 hours) 200µm have 575-610℃ Medium (20%) excellent Example 2 BJT sintered body (AlSi alloy) - rolled body (AlSiMg alloy) Short (2 hours) 100µm have 575-610℃ Medium (20%) excellent Example 3 BJT sintered body (AlSi alloy) - rolled body (AlSiMg alloy) Long (10 hours) 400µm have 575-610℃ Medium (20%) excellent Example 4 BJT sintered body (AlSi alloy) - rolled body (AlSiMg alloy) Medium (4 hours) 200µm have 620-640℃ Large (50%) good Example 5 BJT sintered body (AlSi alloy) - rolled body (Copper 1100) Medium (4 hours) 200µm have 575-610℃ Medium (20%) excellent Example 6 BJT sintered body (AlSi alloy) - BJT sintered body (AlSi alloy) Medium (4 hours) 200µm have 575-610℃ Medium (20%) excellent Example 7 BJT sintered body (AlSi alloy) - BJT sintered body (AlSi alloy) Medium (4 hours) 200µm none 575-610℃ Medium (20%) good Example 8 BJT sintered body (AlSiMg alloy) - rolled body (AlSiMg alloy) Medium (4 hours) 200µm have 565-600℃ Medium (20%) excellent Example 9 MIM sintered body (AlSiMg alloy) - rolled body (AlSiMg alloy) Medium (4 hours) 200µm have 565-600℃ Medium (20%) excellent Example 10 BJT sintered body (AlSi alloy) - rolled body (AlMg alloy) sheet stamping products Medium (4 hours) 200µm have 575-610℃ Medium (20%) excellent Embodiment 11 BJT sintered body (AlSi alloy), shell: rolled body (AlSiMg alloy) cover: rolled body (pure Al) + brazing material Medium (4 hours) 200µm have 575-610℃ Medium (20%) excellent Example 12 BJT sintered body (AlSi alloy), shell: rolled body (pure Al), cover: brazing sheet + brazing material layer made of AlMn alloy coated with AlSi alloy Medium (4 hours) 200µm have 575-610℃ Medium (20%) excellent Embodiment 13 BJT sintered body (AlSi alloy), Shell: Rolled body (AlMn alloy) Plate stamping product, Cover: Brazing sheet + brazing material layer made by coating the surface of AlMn alloy with AlSi alloy Medium (4 hours) 200µm have 575-610℃ Medium (20%) excellent Embodiment 14 <![CDATA[BJT Sintered Body (AlSi Alloy) - Alumina Plate (Al2O3)]]> Medium (4 hours) 200µm have 575-610℃ Medium (20%) excellent Embodiment 15 <![CDATA[BJT Sintered Body (AlSi Alloy) - Silicon Nitride Plate (Si3N4)]]> Medium (4 hours) 200µm have 575-610℃ Medium (20%) excellent

[0211] Table 2

[0212] Joint (alloy composition) Sintering time Average grain diameter Smoothing Bonding temperature Liquid phase generation rate during bonding Joining quality Comparative Example 1 Rolled body (AlSiMg alloy)-Rolled body (AlSiMg alloy) Medium (4 hours) Difficult to distinguish grains less than 10µm have 565-600℃ Medium (20%) No Comparative Example 2 Rolled body (AlSiMg alloy)-Rolled body (AlSiMg alloy) Medium (4 hours) Difficult to distinguish grains less than 10µm have 610-630℃ Large (50%) No Comparative Example 3 Rolled body (AlSiMg alloy)-Rolled body (AlSiMg alloy) Medium (4 hours) Difficult to distinguish grains less than 10µm have 575-610℃ Medium (20%) No Comparative Example 4 Rolled body (AlSiMg alloy)-Rolled body (AlSiMg alloy) Medium (4 hours) Difficult to distinguish grains less than 10µm have 620-640℃ Large (50%) No

[0213] <Average grain diameter>

[0214] The average diameter of the crystal grains of the sintered body is mainly measured by optical microscope observation. The average diameter of the crystal grains is measured by selecting 20 crystal grains from a cross-sectional photograph obtained by an optical microscope and measuring the dimensions in the X direction and the Y direction, which are two orthogonal directions. The sizes of the crystal grains are similarly measured from 10 microscopic photographs, and the average value of the sizes of a total of 200 crystal grains is obtained as the average diameter of the crystal grains.

[0215] <Liquid phase generation rate during joining>

[0216] The liquid phase generation rate is calculated by thermodynamic calculation based on the alloy composition. The thermodynamic calculation is to calculate the liquid phase generation rate by inputting the powder composition and the bonding treatment temperature into thermodynamic equilibrium calculation software (CaTCalc, manufactured by the Institute of Computational Thermodynamics).

[0217] <Joining quality>

[0218] The quality of the bonded product was evaluated based on the following criteria.

[0219] Good: No deformation of the bonded body or gaps in the bonded part were observed.

[0220] Good: A small gap was found in the joint, but no deformation was found in the joint, or a small deformation was found in the joint, but no gap was found in the joint.

[0221] Not acceptable: Not joined, or a gap or large deformation is observed at the joint.

[0222] [Example 1]

[0223] A joint body is produced by joining a sintered body obtained by sintering a precursor and a rolled body as an object. The sizes of the sintered body and the rolled body are 50 mm × 50 mm × 10 mm, respectively. Figure 3The molding device shown uses BJT to mold aluminum-silicon (AlSi) alloy powder (produced by Toyo Aluminum Co., Ltd.). The sintering time of the precursor is medium (4 hours). The average grain diameter of the sintered body is 200μm. The casting obtained by melting aluminum-silicon-magnesium (AlSiMg) alloy powder (produced by Misumi Co., Ltd., aluminum plate-free A6061) is rolled to obtain a rolled body. The joint surfaces of the sintered body and the rolled body are cut (smoothed) using a milling cutter. The joining process temperature is 575°C to 610°C. The liquid phase generation rate during joining is medium (20% by mass).

[0224] [Example 2]

[0225] A bonded body was produced and evaluated in the same manner as in Example 1 except that the sintering time of the precursor was short (2 hours) and the average diameter of the crystal grains of the sintered body was 100 μm.

[0226] [Example 3]

[0227] A bonded body was produced and evaluated in the same manner as in Example 1, except that the sintering time of the precursor was long (10 hours) and the average diameter of the crystal grains of the sintered body was 400 μm.

[0228] [Example 4]

[0229] A bonded body was prepared and evaluated in the same manner as in Example 1 except that the bonding treatment temperature was 620° C. to 640° C. and the liquid phase generation rate during bonding was large (50% by mass).

[0230] [Example 5]

[0231] A joined body was produced and evaluated in the same manner as in Example 1 except that copper (C1100) powder was used as the rolled body.

[0232] [Example 6]

[0233] A joined body was produced and evaluated in the same manner as in Example 1 except that sintered bodies were joined together instead of joining a sintered body and a rolled body.

[0234] [Example 7]

[0235] A joined body was produced and evaluated in the same manner as in Example 6 except that the joining surfaces of the sintered bodies to be joined were not subjected to the smoothing treatment.

[0236] [Example 8]

[0237] A joined body was produced and evaluated in the same manner as in Example 1 except that powder of an aluminum-silicon-magnesium (AlSiMg) alloy was used as the sintered body and the joining process temperature was 565° C. to 600° C.

[0238] [Example 9]

[0239] A joined body was produced and evaluated in the same manner as in Example 8 except that a sintered body obtained by sintering a precursor obtained by molding aluminum-silicon-magnesium (AlSiMg) alloy powder (manufactured by Toyo Aluminum Co., Ltd.) by MIM was used as the sintered body.

[0240] [Example 10]

[0241] A joined body was produced and evaluated in the same manner as in Example 1 except that powder of an aluminum-magnesium (AlMg) alloy was used as the rolled body.

[0242] [Example 11]

[0243] The sintered body formed by sintering the precursor is joined with the rolled body as the shell part and the rolled body as the cover part to produce a joined body. The size of the sintered body is 45 mm × 45 mm × 6 mm, the size (external dimensions) of the rolled body of the shell part is 60 mm × 60 mm × 8 mm, and the size of the rolled body of the cover part is 60 mm × 60 mm × 1.5 mm. Figure 3 The molding device shown is obtained by molding aluminum-silicon (AlSi) alloy powder (manufactured by Toyo Aluminum Co., Ltd.) using BJT. The sintering time of the precursor is medium (4 hours). The average grain diameter of the sintered body is 200μm. The rolled body of the shell part is a rolled body obtained by rolling a cast body obtained by melting aluminum-silicon-magnesium (AlSiMg) alloy powder (manufactured by Misumi Co., Ltd., aluminum-free A6061), and the rolled body of the cover part is a rolled body made of rolled aluminum. The joint surfaces of the sintered body and the rolled body are cut (smoothed) using a milling cutter. The joining treatment temperature is 575°C to 610°C. The liquid phase generation rate during joining is medium (20% by mass). The sintered body is brought into direct contact with the rolled body of the shell part, and the rolled body of the shell part and the rolled body of the cover part are given brazing filler metal for joining. The rolled bodies are brazed using brazing filler metal (manufactured by Toyo Aluminum Co., Ltd., Toyal Hyper Braze).

[0244] [Example 12]

[0245] A joint body was prepared and evaluated in the same manner as in Example 11, except that an aluminum rolled body was used in the shell portion (container 7) of the rolled body, and a brazing layer was provided on the cover portion (cover 8) using a brazing sheet made of an aluminum-silicon (AlSi) alloy coated on the surface of an aluminum-manganese (AlMn) alloy.

[0246] [Example 13]

[0247] A joined body was produced and evaluated in the same manner as in Example 12 except that a pressed product of a plate material of an aluminum-manganese (AlMn) alloy was used for the shell portion (container 7) of the rolled body.

[0248] [Example 14]

[0249] A joined body was produced and evaluated in the same manner as in Example 1 except that an alumina (Al 2 O 3 ) plate was joined to the sintered body instead of the rolled body.

[0250] [Example 15]

[0251] A joined body was produced and evaluated in the same manner as in Example 1 except that a silicon nitride (Si3N4) plate was joined to the sintered body instead of the rolled body.

[0252] [Comparative Example 1]

[0253] Instead of joining the sintered body and the rolled body, the rolled bodies were joined together, and a joined body was produced in the same manner as in Example 8 and evaluated.

[0254] [Comparative Example 2]

[0255] A bonded body was produced and evaluated in the same manner as in Comparative Example 1 except that the bonding process temperature was set at 610° C. to 630° C. and the liquid phase generation rate during bonding was large (50% by mass).

[0256] [Comparative Example 3]

[0257] A bonded body was produced and evaluated in the same manner as in Comparative Example 1 except that the bonding process temperature was changed to 575°C to 610°C.

[0258] [Comparative Example 4]

[0259] A bonded body was produced and evaluated in the same manner as in Comparative Example 2 except that the bonding process temperature was set at 620°C to 640°C.

[0260] According to Table 1, the average grain diameter of the sintered bodies obtained by sintering the precursor composed of powders containing two or more elements, as in Examples 1 to 15, is 10 μm or more. In addition, the joining quality of the sintered bodies of Examples 6 and 7, the sintered bodies of Examples 1 to 5 and 8 to 13 and the rolled bodies, and the sintered bodies of Examples 14 and 15 and the ceramics are all good.

[0261] On the other hand, according to Table 2, when the rolled bodies were joined as in Comparative Examples 1 to 4, the rolled bodies were not joined, and the deformation of the joined rolled bodies was large, resulting in poor joining quality.

[0262] Furthermore, according to Table 1, in Examples 11 to 13, since bonding using brazing material can be performed simultaneously, the target bonded body can be formed in a short process.

[0263] Embodiments of the present invention include, for example, the following embodiments:

[0264] <1>

[0265] A method for manufacturing a joint body, characterized in that:

[0266] The method comprises the following steps: bringing the sintered body into direct contact with the object and performing a heating treatment to obtain a joined body;

[0268] The sintered body contains an alloy.

[0269] <2>

[0270] According to the method for producing a bonded body described in <1>, the heat treatment is a treatment for heating the sintered body in a temperature range where a liquid phase is generated in the sintered body.

[0271] <3>

[0272] The method for producing a joined body according to <1> or <2>, further comprising, before the joining step, a smoothing step of smoothing a joining surface of at least one of the sintered body and the object.

[0273] <4>

[0274] The method for producing a joined body according to any one of <1> to <3>, further comprising, before or during the joining step, a pressurizing step of pressurizing the sintered body and the object in a direction in which the sintered body and the object are joined.

[0275] <5>

[0276] The method for producing a joined body according to any one of <1> to <4> above,

[0277] Prior to the bonding step, a sintering step is performed to sinter a precursor containing two or more elements including at least one metal element.

[0278] The precursor is a modeled object formed by a layer-by-layer modeling method.

[0279] <6>

[0280] According to the method for producing a joined body as described in <5>, the lamination molding method is a binder spraying method.

[0281] <7>

[0282] The method for producing a joined body according to any one of <1> to <6>, wherein the alloy is an aluminum alloy.

[0283] <8>

[0284] According to the method for producing a joined body as described in any one of <1> to <7>, in the joining step, heating is performed in a temperature range where 5 mass % to 50 mass % of a liquid phase is generated in the sintered body.

[0285] <9>

[0286] The method for producing a joined body according to any one of <1> to <8> above,

[0287] The sintered body includes a eutectic portion and crystal grains surrounded by the eutectic portion.

[0288] The crystal grains have aluminum elements,

[0289] The eutectic portion includes aluminum elements and silicon elements.

[0290] <10>

[0291] According to the method for producing a joined body according to any one of <1> to <9>, the melting point of the object is equal to or higher than the melting point of the sintered body.

[0292] <11>

[0293] According to the method for producing a joined body described in any one of <1> to <10>, the heat treatment in the joining step joins the object and the brazing member in a region different from a joining region where the sintered body and the object are joined.

[0294] <12>

[0295] According to the method for manufacturing a joined body described in any one of <1> to <10>, the heat treatment in the joining step joins one region of the object to another region of the object in a region different from a joining region where the sintered body and the object are joined.

[0296] <13>

[0297] A joint body, which directly joins a sintered body to an object, characterized in that:

[0298] The sintered body contains an alloy and has crystal grains surrounded by a eutectic portion.

[0299] The average diameter of the crystal grains is greater than 10 μm.

[0300] <14>

[0301] According to the bonded body described in <13>, the average diameter of the crystal grains is 10 μm or more and 500 μm or less.

[0302] <15>

[0303] The joined body according to <13> or <14>, wherein the alloy is an aluminum alloy.

[0304] <16>

[0305] The bonded body according to any one of <13> to <15>, wherein the sintered body is enclosed in a housing including at least the object.

[0306] <17>

[0307] The conjugate according to any one of <13> to <16> above,

[0308] The sintered body includes a eutectic portion and crystal grains surrounded by the eutectic portion.

[0309] The crystal grains have aluminum elements,

[0310] The eutectic portion includes aluminum elements and silicon elements.

[0311] <18>

[0312] The joined body according to any one of <13> to <17>, wherein the melting point of the object is equal to or higher than the melting point of the sintered body.

[0313] <19>

[0314] A radiator, characterized in that:

[0315] A joined body comprising any one of <13> to <18> above.

[0316] The present invention is not limited to the above-mentioned embodiments, and the addition, change or deletion of other embodiments may be changed within the scope that can be conceived by those skilled in the art. No matter in which form, as long as the function and effect of the present invention are achieved, it is included in the scope of the present invention.

[0317] <20>

[0318] A method for manufacturing a joint body, characterized in that it comprises:

[0319] a contacting step, wherein the sintered body containing the alloy is brought into direct contact with the object; and

[0320] A heating step of heating the sintered body while the sintered body is in direct contact with the object.

[0321] body, so that the sintered body and the object are joined to obtain a joined body.

[0322] <21>

[0323] A conjugate, characterized in that it comprises:

[0324] A sintered body comprising an alloy and crystal grains surrounded by a eutectic portion and having an average diameter of 10 μm or more; and

[0325] An object directly joined to the sintered body.

Claims

1. A method for manufacturing a joint body, characterized in that : The method comprises the following steps: bringing the sintered body into direct contact with the object and performing a heating treatment to obtain a joined body; The sintered body contains an alloy.

2. The method for manufacturing a joint body according to claim 1, characterized in that: The heating treatment is a treatment for heating the sintered body in a temperature range in which a liquid phase is generated in the sintered body.

3. The method for manufacturing a joint body according to claim 1, characterized in that: The method includes, before the joining step, a smoothing step of smoothing a joining surface of at least one of the sintered body and the object.

4. The method for manufacturing a joint body according to claim 1, characterized in that: The method includes a pressurizing step of applying pressure in a direction in which the sintered body and the object are joined before or during the joining step.

5. The method for manufacturing a joint body according to claim 1, characterized in that: Prior to the bonding step, a sintering step is performed to sinter a precursor containing two or more elements including at least one metal element. The precursor is a modeled object formed by a layer-by-layer modeling method.

6. The method for manufacturing a joint body according to claim 5, characterized in that: The stacking molding method is a binder jetting method.

7. The method for manufacturing a joint body according to claim 1, characterized in that: The alloy is an aluminum alloy.

8. The method for manufacturing a joint body according to claim 2, characterized in that: The joining step performs heating in a temperature range where 5 mass % to 50 mass % of a liquid phase is generated in the sintered body.

9. The method for manufacturing a joint body according to claim 7, characterized in that: The sintered body includes a eutectic portion and crystal grains surrounded by the eutectic portion. The crystal grains have aluminum elements, The eutectic portion includes aluminum elements and silicon elements.

10. The method for manufacturing a joint body according to claim 1, characterized in that: The melting point of the object is equal to or higher than the melting point of the sintered body.

11. The method for manufacturing a joint body according to claim 1, characterized in that: By the heat treatment in the joining step, the object and the brazing member are joined in a region different from a joining region where the sintered body and the object are joined.

12. The method for manufacturing a joint body according to claim 1, characterized in that: By the heat treatment in the joining step, one region of the object and another region of the object are joined in a region different from a joining region where the sintered body and the object are joined.

13. A joint body in which a sintered body is directly joined to an object, characterized in that : The sintered body contains an alloy and has crystal grains surrounded by a eutectic portion. The average diameter of the crystal grains is greater than 10 μm.

14. The joint according to claim 13, characterized in that : The average diameter of the crystal grains is not less than 10 μm and not more than 500 μm.

15. The joint according to claim 13, characterized in that : The alloy is an aluminum alloy.

16. The joint according to claim 13, characterized in that : The sintered body is enclosed in a housing including at least the object.

17. A radiator, characterized in that : A joined body according to any one of claims 13 to 16.

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