Ink jet chip packaging structure

Abstract

In order to improve the condition of poor yield during ink jet chip packaging in the prior art, the invention provides a novel ink jet chip packaging structure, which comprises a flexible circuit board; the circuit board contact is arranged on the flexible circuit board and is used for transmitting a printer control signal; the ink-jet chip is arranged on the flexible circuit board, the ink-jet chip is provided with a plurality of ink-jet chip contacts, the ink-jet chip contacts are respectively arranged at the upper end and the lower end of the ink-jet chip, and the circuit board contacts are connected with the corresponding ink-jet chip contacts through connecting wires; in the ink-jet chip packaging structure, at least two circuit board contacts are connected with a plurality of ink-jet chip contacts respectively according to the connection mode of the circuit board contacts and the ink-jet chip contacts.

Description

Technical Field

[0001] The present invention relates to an inkjet chip packaging structure, and more specifically, to provide a new inkjet chip packaging structure to solve the problem of poor overall yield in the conventional packaging structure. Background Art

[0002] Inkjet printing technology, commonly known as "Inkjet Printing", is a widely used printing technology. Its history can be traced back to the 1950s when the British company Hewlett-Packard invented inkjet printing technology. Since then, inkjet printing technology has developed rapidly, making inkjet printers the mainstream technology for home and commercial printing. Inkjet printers have many advantages, including: low cost, especially economic advantages for home and small business use; high printing quality, which can provide high-resolution and high-quality images, especially in photos or pictures; convenient to use, inkjet printers are easy to install, and most inkjet printers can print through computers or mobile devices. When combined with the recent rise of multi-in-one functions (including fax, photocopying, scanning) of business machines, it can quickly expand the flexibility of paperwork in the office.

[0003] See also Figure 1 , which describes the matching and control method between the ink cartridge 10 and the printer in the prior art. Figure 1 In the figure, it can be seen that the ink cartridge 10 includes a flexible circuit board 110, on which an inkjet chip 120 is provided, and an ink supply hole 121 (such as Figure 2A As shown), and a corresponding inkjet chip 120 and used to transmit printer control signals. The inkjet chip 120 stores the above-mentioned ink cartridge serial number, ink type, inkjet head-printer matching information and other information and simultaneously controls the ejection of ink droplets for printing.

[0004] However, as the current inkjet printing technology is becoming increasingly complex, the requirements for printing speed, resolution, etc. in inkjet printing technology are becoming increasingly sophisticated, which also leads to the increasing complexity of the circuit of the inkjet chip 120, and the required process steps and process levels are also becoming higher and higher. However, the corresponding packaging structure has not changed in response to the increasing sophistication of the inkjet chip 120, resulting in an increased failure rate during packaging. Please refer to Figure 2A and Figure 2B ,exist Figure 2A, which illustrates the situation that in the normal structure of the conventional chip package, the inkjet chip 120 is arranged on the flexible circuit board 110, and the several chip contacts 122 on the inkjet chip 120 are connected to the corresponding connection points 111 arranged on the flexible circuit board 110 through the connection lines 123. The above packaging structure enables the inkjet chip 120 to transmit and receive the printer control signal from the printer as mentioned above during operation. However, during the packaging process of the inkjet chip 120, due to errors in the packaging process (the errors may come from human or machine), the connection lines 123 on the chip contacts 122 or the connection points 111 are not connected as they should be. Figure 2B As shown in the dotted circle frame, the printer control signal cannot be normally transmitted to the inkjet chip 120, resulting in a poor yield of the packaging process, thereby reducing the industrial applicability. Summary of the invention

[0005] Based on the above reasons, the present invention proposes an inkjet chip packaging structure. By improving the circuit connection method in the known inkjet chip packaging structure, in addition to maintaining the printing speed, resolution, printable range, color quality, etc. of inkjet printing required by the market in the advanced process of the inkjet chip, it can also improve the yield of the inkjet chip packaging and simultaneously improve the fault tolerance rate in the inkjet chip packaging process. Due to the improvement of the yield, the economic cost utilization efficiency in the industry can also be made higher.

[0006] The present invention proposes an inkjet chip packaging structure, which includes: a flexible circuit board; circuit board contacts, which are arranged on the flexible circuit board and transmit printer control signals; an inkjet chip, which is arranged on the flexible circuit board, wherein the inkjet chip has a plurality of inkjet chip contacts, which are respectively arranged at the upper end and the lower end of the inkjet chip, and the circuit board contacts are connected to the corresponding inkjet chip contacts via connecting wires; wherein, in the inkjet chip packaging structure, the circuit board contacts and the inkjet chip contacts are connected in a manner that at least two circuit board contacts are respectively connected to the plurality of inkjet chip contacts.

[0007] According to the embodiment of the present invention, the inkjet chip contacts of the inkjet chip are not only disposed at the upper end and the lower end of the inkjet chip, but also can be disposed at the left end and the right end of the inkjet chip according to application requirements.

[0008] According to an embodiment of the present invention, in the aforementioned connection method between the circuit board contacts and the inkjet chip contacts, a single circuit board contact can be connected to multiple inkjet chip contacts located on the upper left side, upper right side, lower left side, and lower right side of the inkjet chip through the same connecting line, or any combination of the upper position and the number of inkjet chip contacts.

[0009] According to the embodiment of the present invention, the inkjet chip package structure after the circuit architecture improvement can correspond to a resolution DPI range of 150 to 48,000 DPI, and a printing swath range of 0.25 inches to 12 inches.

[0010] MJ24A-1314CN_248086 1TWCN_Simplified Chinese version BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The detailed description of the present invention and the schematic diagram of the embodiments described below should enable a more complete understanding of the present invention; however, it should be understood that this is only a reference for understanding the application of the present invention, rather than limiting the present invention to a specific embodiment.

[0012] Figure 1 The structure of a known ink cartridge and the configuration of a flexible circuit board and an inkjet chip are described.

[0013] Figure 2A The invention describes the state of the circuits in the conventional inkjet chip packaging structure under normal packaging.

[0014] Figure 2B The present invention describes the circuit state of the inkjet chip packaging structure in the prior art under abnormal packaging.

[0015] Figure 3A One embodiment of the inkjet chip packaging structure of the present invention is described.

[0016] Figure 3B One embodiment of the inkjet chip packaging structure of the present invention is described.

[0017] Figure 3C One embodiment of the inkjet chip packaging structure of the present invention is described.

[0018] Figure 3D One embodiment of the inkjet chip packaging structure of the present invention is described.

[0019] Figure 4 The advantages of the inkjet chip packaging structure of the present invention over the prior art are described.

[0020]

Explanation of symbols

[0021] 10: Ink cartridge

[0022] 110: Flexible circuit board

[0023] 111: Connection Point

[0024] 120: Inkjet chip

[0025] 121, 221: ink supply hole

[0026] 123, 224: connecting line

[0027] 122: Chip contacts

[0028] 200: Inkjet chip packaging structure

[0029] 210: Flexible printed circuit board

[0030] 211: Circuit board contacts

[0031] 220: Inkjet chip

[0032] 222: Inkjet chip contacts DETAILED DESCRIPTION

[0033] The present invention will be described in detail with preferred embodiments and viewpoints. The following description provides specific implementation details of the present invention so that the reader can thoroughly understand the implementation methods of these embodiments. However, those skilled in the art in this field must understand that the present invention can also be implemented without these details. In addition, the present invention can also be used and implemented by other specific embodiments. The various details described in this specification can also be applied based on different needs, and various modifications or changes can be made without departing from the spirit of the present invention. Therefore, the present invention will be described with preferred embodiments and viewpoints. Such descriptions are to explain the structure of the present invention and are only used for illustration rather than to limit the scope of the patent application of the present invention. The terms used in the following description will be interpreted in the broadest reasonable way so that they can be used together with the detailed description of a specific embodiment of the present invention. Those skilled in the art can adjust the structure of the present invention according to the needs of manufacturing or application to meet the needs of the actual industry.

[0034] See also Figure 3A , Figure 3B , Figure 3C , Figure 3D and Figure 4The present invention proposes an inkjet chip packaging structure 200, comprising: a flexible circuit board 210; a circuit board contact 211, which is arranged on the flexible circuit board 210 and transmits a printer control signal; an inkjet chip 220, which is arranged on the flexible circuit board 210 and has an ink supply hole 221, and the inkjet chip 220 has a plurality of inkjet chip contacts 222, which are respectively arranged at the upper end and the lower end of the inkjet chip 220, and the circuit board contacts 211 and the corresponding inkjet chip contacts 222 are connected to each other through connecting wires 224; wherein, in the inkjet chip packaging structure 200, the connection method of the circuit board contacts 211 and the inkjet chip contacts 222 is that at least two circuit board contacts 211 are respectively connected to the plurality of inkjet chip contacts 222 by the same connecting wire 224. According to the embodiment of the present invention, the circuit board contact 211 for transmitting the printer control signal is connected to two or more inkjet chip contacts 222 located at the upper end or the lower end of the inkjet chip 220 through the connection line 224 in the inkjet chip package structure 200. Figure 3A In the embodiment of FIG. 1 , the inkjet chip 220 is located at the upper left side and the lower right side, and each has two inkjet chip contacts 222 connected to the corresponding circuit board contacts 211 respectively; and Figure 3B In the embodiment, the inkjet chip 220 is located at the left side of the upper end and the right side of the lower end, and each of the two inkjet chip contacts 222 is connected to the corresponding circuit board contacts 211. The advantage of such a configuration is that the same connecting line 224 can withstand a stronger pulling stress at one end of the inkjet chip contact 222. In addition to having a higher tolerance for machine or human errors during the packaging process, because the same circuit board contact 211 is connected to at least one inkjet chip contact 222, even if Figure 4 As shown in the figure, the connection line 224 of one of the inkjet chip contacts 222 at the upper left end of the inkjet chip 220 is not properly connected (packaged) during packaging, or a line failure occurs during subsequent use, but the other inkjet chip contact 222 is still connected to the predetermined corresponding circuit board contact 211, so the original printer control signal can still be correctly transmitted through the spare inkjet chip contact 222 to control printing. In this way, the key or main functional contact part of the inkjet chip packaging structure 200 can have a dual redundancy (redundancy) or a multiple redundant architecture to increase the device reliability and service life of the inkjet chip packaging structure 200.

[0035] See also Figure 3A , Figure 3B , Figure 3C and Figure 3DAccording to an embodiment of the present invention, the circuit board contact 211 can be connected to multiple inkjet chip contacts 222 located on the upper left side, upper right side, lower left side, and lower right side of the inkjet chip 220 through the same connecting line 224, or any combination of the above positions and quantities, that is, the same circuit board contact 211 is connected to n inkjet chip contacts 222 through the same connecting line 224, and if the connection method of the above-mentioned single circuit board contact 211 and multiple inkjet chip contacts 222 is regarded as a group, there can be m groups in the inkjet chip packaging structure, wherein in one embodiment of the present invention, n, m≥2, it should be noted that in the present invention, the number of n, m can be arbitrarily set or modified according to the actual application.

[0036] According to the embodiment of the present invention, the inkjet chip package structure 200 with the improved circuit architecture can correspond to a resolution DPI (Dots Per Inch) ranging from 150 to 48,000 DPI, and a printing swath ranging from 0.25 inches to 12 inches.

[0037] According to an embodiment of the present invention, when the inkjet chip package structure 200 is applied to the structure of the ink cartridge 10, one to six colors of ink can be provided. If it is one color, the one color of ink can be cyan (C: Cyan), magenta (M: Megenta), yellow (Y: Yellow), and black (K: Black) ink. If it is six colors, black (K: Black), cyan (C: Cyan), magenta (M: Megenta), yellow (Y: Yellow), light cyan (LC: Light Cyan) and light magenta (LM: Light Megenta) six colors of ink can be provided respectively. Of course, in another embodiment, it can also be four colors, respectively providing cyan (C: Cyan), magenta (M: Megenta), yellow (Y: Yellow), and black (K: Black) four colors of ink. The quantity of the above-mentioned ink supply or the colors provided can be replaced or modified according to the actual application requirements.

[0038] In summary, the present invention proposes an inkjet chip packaging structure for use in inkjet printing technology. By improving the connection method between the circuit board contacts and the inkjet chip contacts, the connection between the inkjet chip and the printer has a fairly redundant structure. In addition to being able to maintain the printing speed, resolution, printable range, color quality, etc. of inkjet printing required by the market in the advanced process of the inkjet chip, it can also improve the yield rate of the inkjet chip packaging and simultaneously improve the fault tolerance rate in the inkjet chip packaging process. When one of the inkjet chip contacts is sealed,

[0039] MJ24A-1314CN_248086 1TWCN_Simplified Chinese Version When the installation fails or fails, the overall inkjet chip can still operate normally, which has great industrial value. It should be noted that the above technical proposals can be modified by people familiar with the technology, but they do not deviate from the protection scope defined by the attached claims.

Claims

1. An inkjet chip packaging structure, comprising: A flexible printed circuit board; Multiple circuit board contacts; as well as, An inkjet chip is disposed on the flexible circuit board, and includes a plurality of inkjet chip contacts, the plurality of inkjet chip contacts are disposed on the inkjet chip, and the plurality of circuit board contacts are respectively connected to the corresponding plurality of inkjet chip contacts through a connecting line; Among the plurality of circuit board contacts, at least two are respectively connected to at least two of the plurality of inkjet chip contacts.

2. In the inkjet chip packaging structure as described in claim 1, the multiple circuit board contacts are arranged on the upper left side, upper right side, lower left side, lower right side of the inkjet chip, or any combination of the above positions and quantities by at least two of the multiple circuit board contacts being respectively connected to at least two of the multiple inkjet chip contacts.

3. The inkjet chip packaging structure as claimed in claim 1, wherein the resolution DPI (Dots Per Inch, the number of dots per inch) corresponding to the inkjet chip packaging structure ranges from 150 to 48000 DPI. 4 . The inkjet chip packaging structure as claimed in claim 1 , wherein the printing swath corresponding to the inkjet chip packaging structure is between 0.25 inches and 12 inches.

5. The inkjet chip packaging structure as claimed in claim 1 is applied to an ink cartridge with one to six colors, wherein the six colors of ink are selected from black, cyan, magenta, yellow, light cyan, or light magenta.

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