A fire-retardant and heat-insulating adhesive, its preparation method and application

Abstract

This invention relates to the field of fireproof and heat-insulating materials, and discloses a fireproof and heat-insulating adhesive, its preparation method, and its application. The fireproof and heat-insulating adhesive comprises component A and component B; component A comprises the following raw materials in parts by weight: 90-110 parts of polydiphenylsiloxane; 50-180 parts of silicone resin; and 90-210 parts of filler; component B comprises the following raw materials in parts by weight: 90-110 parts of polydiphenylsiloxane; 50-170 parts of crosslinking agent; 10-80 parts of adhesion promoter; 5-60 parts of thixotropic agent; and 1-8 parts of catalyst; the filler includes ceramic powder, hollow glass microspheres, and hollow silica microspheres. The fireproof and heat-insulating adhesive provided by this invention has the advantages of fire resistance, heat insulation, lightweight, easy molding, and controllable coating thickness, and can be used as a thermal protection material for battery casings, reducing the risk of battery combustion and explosion.

Description

Technical Field

[0001] This invention relates to the field of fireproof and heat-insulating materials technology, and in particular to a fireproof and heat-insulating adhesive, its preparation method, and its application. Background Technology

[0002] With the increasing energy density of new energy batteries, the risk of battery combustion and explosion is also increasing. Currently, the thermal protection materials used in the field of new energy batteries mainly include mica sheets and coatings. These materials can reduce the harm of battery thermal runaway to a certain extent, but they still have the following defects: (1) Traditional processes use 1-2mm thick mica sheets inside the battery casing for fireproofing and heat insulation, but mica sheets are heavy and difficult to form; (2) Existing fireproof materials only have fireproofing properties and cannot meet the heat insulation requirements; (3) Insulation materials have heat insulation properties at room temperature, but they are prone to collapse and lose fireproofing and heat insulation capabilities under flame combustion, and cannot be applied to battery fireproofing and heat insulation; (4) Intumescent fireproof materials achieve fireproofing and heat insulation through expansion and have good fireproofing and heat insulation properties, but they are not suitable for the limited space of battery casings; (5) Ceramicized foamed organosilicon achieves fireproofing and heat insulation through foaming reaction, but its thickness is difficult to control. Therefore, developing lightweight, easily formable materials that have both fireproofing and heat insulation functions is of great significance for reducing the risk of battery combustion and explosion and improving the safety factor. Summary of the Invention

[0003] The present invention aims to at least solve one of the aforementioned technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a fire-retardant and heat-insulating adhesive; a second objective is to provide a method for preparing such a fire-retardant and heat-insulating adhesive; and a third objective is to provide applications of such a fire-retardant and heat-insulating adhesive.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] A first aspect of the present invention provides a fire-retardant and heat-insulating adhesive, comprising component A and component B;

[0006] Component A comprises the following raw materials in parts by weight:

[0007] 90-110 parts of polydiphenylsiloxane;

[0008] 50-180 parts of silicone resin;

[0009] 90-210 parts of filler;

[0010] Component B comprises the following raw materials in parts by weight:

[0011]

[0012]

[0013] In component A, the filler includes ceramic powder, hollow glass microspheres, and hollow silica microspheres.

[0014] In some embodiments of the present invention, component A comprises the following raw materials in parts by weight:

[0015] 95-100 parts of polydiphenylsiloxane;

[0016] 80-150 parts of silicone resin;

[0017] 100-200 parts of filler;

[0018] Component B comprises the following raw materials in parts by weight:

[0019]

[0020] In some embodiments of the present invention, the mass ratio of component A to component B is (9-12):1.

[0021] In some specific embodiments of the present invention, the mass ratio of component A to component B is (10-11):1.

[0022] In some embodiments of the present invention, the organosilicon resin has the structure shown in Formula I:

[0023]

[0024] R is selected from one of -CH3, -C2H5, and -Si(CH3)3; x+y+z=1, 0≤x<1, 0<y≤1, and 0≤z<1.

[0025] In some embodiments of the present invention, the solid content of the organosilicon resin is 50-70 wt%.

[0026] In this invention, the organosilicon resin is a phenyl silicone resin, which has good flame retardant and high temperature resistance properties and can delay combustion. When the combustion temperature reaches above 450°C, the polymer begins to decompose and produces SiO2 as the temperature rises.

[0027] In some embodiments of the present invention, the viscosity of the polydiphenylsiloxane at 25°C is 50-100 mPa·s; the test standard is GB / T 9751.1-2008 "Paints and varnishes. Determination of viscosity by rotational viscometer. Part 1: Cone-plate viscometer operating at high shear rates".

[0028] In some specific embodiments of the present invention, the viscosity of the polydiphenylsiloxane at 25°C is 50-70 mPa·s.

[0029] In some embodiments of the present invention, the mass ratio of the ceramic powder, hollow glass microspheres and hollow silica microspheres is 10:(1-4):(2-10).

[0030] In some specific embodiments of the present invention, the mass ratio of the ceramic powder, hollow glass microspheres and hollow silica microspheres is 10:(1.5-3):(2.5-8).

[0031] In some embodiments of the present invention, the ceramic powder comprises silicates and metal oxides in a mass ratio of (40-200):1.

[0032] In some specific embodiments of the present invention, the ceramic powder comprises silicates and metal oxides in a mass ratio of (49-199):1.

[0033] In some embodiments of the present invention, the particle size Dn50 of the silicate is 5-25 μm.

[0034] In some specific embodiments of the present invention, the particle size Dn50 of the silicate is 5-20 μm.

[0035] In some embodiments of the present invention, the silicate is selected from at least one of mica powder, kaolin, wollastonite, bentonite, aluminum silicate, and magnesium silicate.

[0036] In some embodiments of the present invention, the particle size Dn50 of the metal oxide is 3-25 μm.

[0037] In some specific embodiments of the present invention, the particle size Dn50 of the metal oxide is 5-20 μm.

[0038] In some specific embodiments of the present invention, the loss on ignition of the metal oxide is ≤5%.

[0039] In some embodiments of the present invention, the metal oxide is selected from at least one of aluminum oxide, magnesium oxide, and zinc oxide.

[0040] In some embodiments of the present invention, the melting point of the hollow glass microspheres is 600-800°C.

[0041] In some embodiments of the present invention, the particle size Dn50 of the hollow glass microspheres is 5-25 μm.

[0042] In some specific embodiments of the present invention, the particle size Dn50 of the hollow glass microspheres is 5-20 μm.

[0043] In some embodiments of the present invention, the particle size Dn50 of the hollow silica microspheres is 10-25 μm.

[0044] In some specific embodiments of the present invention, the particle size Dn50 of the hollow silica microspheres is 10-20 μm.

[0045] In this invention, a composite filler consisting of ceramic powder, hollow glass microspheres, and hollow silica microspheres is selected. The hollow glass microspheres can gradually soften at 600-800℃, forming gaps in the flux filling material. Together with the ceramic powder, they form a dense ceramicized layer at a high temperature of 900-1000℃, ensuring the fireproof performance of the fireproof and heat-insulating adhesive. The hollow structure of the hollow silica microspheres can maintain its hollow structure without collapsing at a high temperature of 1000℃, ensuring the heat insulation performance of the material under flame. In addition, the use of hollow structure filler can reduce the specific gravity of the material, meeting the requirements of lightweight design.

[0046] In some embodiments of the present invention, the crosslinking agent is selected from at least one of methyltrimethoxysilane, methyltriethoxysilane, methyltriethoxysilane oligomer, propyltrimethoxysilane, vinyltrimethoxysilane, tetraethoxysilane, tetramethoxysilane, tetraethoxysilane oligomer, and tetramethoxysilane oligomer.

[0047] In some embodiments of the present invention, the adhesion promoter is selected from at least one of γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, aminoethylaminopropyltrimethoxysilane, aminoethylaminopropyltriethoxysilane, aminoethylaminopropylmethyldimethoxysilane, and aminoethylaminopropylmethyldiethoxysilane.

[0048] In some embodiments of the present invention, the thixotropic agent comprises maleic anhydride-functionalized liquid polybutadiene.

[0049] In some embodiments of the present invention, the catalyst is selected from at least one of dibutyltin dilaurate, dioctyltin dilaurate, stannous octoate, and dibutyltin diacetate.

[0050] In some embodiments of the present invention, the method of using the fireproof and heat-insulating adhesive is as follows: 30-50 minutes before use, the components A and B are mechanically mixed at a mass ratio of (9-12):1 to obtain the fireproof and heat-insulating adhesive before coating.

[0051] In some embodiments of the present invention, the specific gravity of the fireproof and heat-insulating adhesive is 1-1.2 mg / L.

[0052] In some embodiments of the present invention, the fireproof and heat-insulating adhesive is applied by airless spraying.

[0053] In some embodiments of the present invention, the fireproof and heat-insulating adhesive is applied to form a coating.

[0054] In some embodiments of the present invention, the thickness of the fireproof and heat-insulating adhesive coating is 1-1.2 mm.

[0055] In some embodiments of the present invention, the curing temperature of the coating is 40-60°C.

[0056] In some embodiments of the present invention, the curing time of the coating is 25-35 minutes.

[0057] The second aspect of the present invention provides a method for preparing the fire-retardant and heat-insulating adhesive described in the first aspect of the present invention, comprising the following steps:

[0058] The polydiphenylsiloxane in component A is mixed with organosilicon resin at 80-130°C and vacuum conditions of -0.090 to -0.1 MPa for 2-5 hours. After cooling, filler is added and vacuum mixing is continued for 1-3 hours to obtain component A.

[0059] The polydiphenylsiloxane in component B was heated and dehydrated at 110-130℃ and under vacuum conditions of -0.90 to -0.1MPa. After cooling to below 40℃, a crosslinking agent, an adhesion promoter, a thixotropic agent, and a catalyst were added in sequence, and the mixture was dispersed under pressure for 20-30 minutes to obtain component B.

[0060] The third aspect of the present invention provides the application of the fire-retardant and heat-insulating adhesive described in the first aspect of the present invention in new energy batteries.

[0061] In some embodiments of the present invention, the fire-retardant and heat-insulating adhesive is applied to the outer casing of the new energy battery.

[0062] In some embodiments of the present invention, the new energy battery is a high energy density battery.

[0063] Compared with the prior art, the beneficial effects of the present invention are:

[0064] 1) The fireproof and heat-insulating adhesive provided by the present invention provides excellent fireproof and heat-insulating performance by adding ceramic powder, hollow glass microspheres and hollow silica microspheres composite filler. The coating can resist the combustion of flames at a high temperature of 1000℃. The hollow filler reduces the specific gravity of the material while providing heat insulation performance under fire-resistant conditions. The coating is easy to form and the thickness is easy to control.

[0065] 2) The fireproof and heat-insulating adhesive provided by this invention, with the addition of polydiphenylsiloxane and phenyl-containing silicone resin, provides better flame retardant and high-temperature resistance properties, and can delay combustion;

[0066] 3) The preparation method of the fireproof and heat-insulating adhesive provided by the present invention has simple steps, mild process conditions, and is easy to realize industrial production;

[0067] 4) The fireproof and heat-insulating adhesive provided by this invention has the advantages of fireproofing, heat insulation, lightweighting, easy molding, and controllable coating thickness. It can be used as a thermal protection material for battery casings to reduce the risk of battery combustion and explosion. Detailed Implementation

[0068] The present invention will be further described in detail below through specific embodiments. Unless otherwise specified, the raw materials, reagents, or apparatus used in the embodiments and comparative examples are all available from conventional commercial sources or can be obtained by existing technical methods. Unless otherwise specified, the test or experimental methods are conventional methods in the art.

[0069] 1. The silicone resins used in the following examples and comparative examples have the structure shown in Formula I:

[0070]

[0071] R is selected from one of -CH3, -C2H5, and -Si(CH3)3; x+y+z=1, 0≤x<1, 0<y≤1, and 0≤z<1.

[0072] 2. Unless otherwise specified, "parts" in the following text refers to "parts by weight".

[0073] Example 1

[0074] This embodiment prepares a fireproof and heat-insulating adhesive, the components and contents of which are shown in Table 1:

[0075] Table 1. Components and content of the fireproof and heat-insulating adhesive in Example 1

[0076]

[0077]

[0078] The preparation steps are as follows:

[0079] The polydiphenylsiloxane in component A was mixed with organosilicon resin and heated under vacuum at -0.09MPa to -0.1MPa and 100℃ for 3 hours to remove the solvent from the organosilicon resin. After cooling, filler was added and vacuum mixing was continued for 2 hours to obtain component A.

[0080] The polydiphenylsiloxane in component B was dehydrated under vacuum at -0.09 MPa to -0.1 MPa and 120 °C for 2 h. After cooling to below 40 °C, crosslinking agent, adhesion promoter, thixotropic agent and catalyst were added in sequence, and the mixture was stirred and dispersed under pressure for 20 min to obtain component B.

[0081] Example 2

[0082] This embodiment prepares a fireproof and heat-insulating adhesive, the components and contents of which are shown in Table 2:

[0083] Table 2. Components and content of the fireproof and heat-insulating adhesive in Example 2

[0084]

[0085] The preparation steps are as follows:

[0086] The polydiphenylsiloxane in component A was mixed with organosilicon resin and reacted under vacuum at -0.09MPa to -0.1MPa and 85℃ for 5 hours to remove the solvent from the organosilicon resin. After cooling, filler was added and vacuum mixing was continued for 2 hours to obtain component A.

[0087] The polydiphenylsiloxane in component B was dehydrated under vacuum at -0.09 MPa to -0.1 MPa and 120 °C for 2 h, then cooled to below 40 °C. Crosslinking agent, adhesion promoter, thixotropic agent and catalyst were added in sequence, and the mixture was stirred and dispersed under pressure for 25 min to obtain component B.

[0088] Example 3

[0089] This embodiment prepares a fireproof and heat-insulating adhesive, the components and contents of which are shown in Table 3:

[0090] Table 3. Components and content of the fireproof and heat-insulating adhesive in Example 3

[0091]

[0092] The preparation steps are as follows:

[0093] The polydiphenylsiloxane in component A was mixed with organosilicon resin and heated under vacuum at -0.09MPa to -0.1MPa and 120℃ for 3 hours to remove the solvent from the organosilicon resin. After cooling, filler was added and vacuum mixing was continued for 2 hours to obtain component A.

[0094] The polydiphenylsiloxane in component B was dehydrated under vacuum at -0.09MPa to -0.1MPa and 130℃ for 1.5h, then cooled to below 40℃. Crosslinking agent, adhesion promoter, thixotropic agent and catalyst were added in sequence, and the mixture was stirred and dispersed under pressure for 30min to obtain component B.

[0095] Example 4

[0096] This embodiment prepares a fireproof and heat-insulating adhesive, the components and contents of which are shown in Table 4:

[0097] Table 4. Components and content of the fireproof and heat-insulating adhesive in Example 4

[0098]

[0099]

[0100] The preparation steps are as follows:

[0101] The polydiphenylsiloxane in component A was mixed with organosilicon resin and heated under vacuum at -0.09MPa to -0.1MPa and 130℃ for 2 hours to remove the solvent from the organosilicon resin. After cooling, filler was added and vacuum mixing was continued for 2 hours to obtain component A.

[0102] The polydiphenylsiloxane in component B was dehydrated under vacuum at -0.09 MPa to -0.1 MPa and 120 °C for 2 h. After cooling to below 40 °C, crosslinking agent, adhesion promoter, thixotropic agent and catalyst were added in sequence, and the mixture was stirred and dispersed under pressure for 30 min to obtain component B.

[0103] Example 5

[0104] This embodiment prepares a fireproof and heat-insulating adhesive, the components and contents of which are shown in Table 5:

[0105] Table 5. Components and content of the fireproof and heat-insulating adhesive in Example 5

[0106]

[0107]

[0108] The preparation steps are as follows:

[0109] The polydiphenylsiloxane in component A was mixed with organosilicon resin and heated under vacuum at -0.09MPa to -0.1MPa and 130℃ for 2 hours to remove the solvent from the organosilicon resin. After cooling, filler was added and vacuum mixing was continued for 2 hours to obtain component A.

[0110] The polydiphenylsiloxane in component B was dehydrated under vacuum at -0.09 MPa to -0.1 MPa and 120 °C for 2 h. After cooling to below 40 °C, crosslinking agent, adhesion promoter, thixotropic agent and catalyst were added in sequence, and the mixture was stirred and dispersed under pressure for 30 min to obtain component B.

[0111] Comparative Example 1

[0112] A fire-retardant and heat-insulating adhesive was prepared in this comparative example. The components and contents are shown in Table 6.

[0113] Table 6. Components and content of fire-retardant and heat-insulating adhesive in Comparative Example 1

[0114]

[0115] The preparation steps are as follows:

[0116] The polydiphenylsiloxane in component A was mixed with MQ resin and heated under vacuum at -0.09MPa to -0.1MPa and 130℃ for 2 hours to remove the solvent from the resin. After cooling, filler was added and vacuum mixing was continued for 2 hours to obtain component A.

[0117] The polydiphenylsiloxane in component B was dehydrated under vacuum at -0.09 MPa to -0.1 MPa and 120 °C for 2 h. After cooling to below 40 °C, crosslinking agent, adhesion promoter, thixotropic agent and catalyst were added in sequence, and the mixture was stirred and dispersed under pressure for 30 min to obtain component B.

[0118] Comparative Example 2

[0119] A fire-retardant and heat-insulating adhesive was prepared in this comparative example. The components and contents are shown in Table 7.

[0120] Table 7. Components and content of fire-retardant and heat-insulating adhesive in Comparative Example 2

[0121]

[0122] The preparation steps are as follows:

[0123] The polydiphenylsiloxane in component A was mixed with organosilicon resin and heated under vacuum at -0.09MPa to -0.1MPa and 130℃ for 2 hours to remove the solvent from the organosilicon resin. After cooling, filler was added and vacuum mixing was continued for 2 hours to obtain component A.

[0124] The polydiphenylsiloxane in component B was dehydrated under vacuum at -0.09 MPa to -0.1 MPa and 120 °C for 2 h. After cooling to below 40 °C, crosslinking agent, adhesion promoter, thixotropic agent and catalyst were added in sequence, and the mixture was stirred and dispersed under pressure for 30 min to obtain component B.

[0125] Comparative Example 3

[0126] A fire-retardant and heat-insulating adhesive was prepared in this comparative example. The components and contents are shown in Table 8.

[0127] Table 8. Components and content of fire-retardant and heat-insulating adhesive in Comparative Example 3

[0128]

[0129]

[0130] The preparation steps are as follows:

[0131] The polydiphenylsiloxane in component A was mixed with organosilicon resin and heated under vacuum at -0.09MPa to -0.1MPa and 130℃ for 2 hours to remove the solvent from the organosilicon resin. After cooling, filler was added and vacuum mixing was continued for 2 hours to obtain component A.

[0132] The polydiphenylsiloxane in component B was dehydrated under vacuum at -0.09 MPa to -0.1 MPa and 120 °C for 2 h. After cooling to below 40 °C, crosslinking agent, adhesion promoter, thixotropic agent and catalyst were added in sequence, and the mixture was stirred and dispersed under pressure for 30 min to obtain component B.

[0133] Performance testing

[0134] Components A and B from Examples 1-5 and Comparative Examples 1-3 were mechanically mixed at a mass ratio of 10:1 to obtain a fire-retardant and heat-insulating adhesive. The specific gravity of the fire-retardant and heat-insulating adhesive was tested. The adhesive was then sprayed onto a 1mm thick aluminum plate using airless spraying and cured at 50°C for 30 minutes to form a coating. The coating thickness, hardness, adhesion, flame retardancy, voltage resistance, voltage resistance after combustion, fire resistance, and acid and alkali resistance were tested. The test methods or reference standards are as follows:

[0135] 1. Hardness: Tested according to GB / T 531.1-2008 "Vulcanized rubber or thermoplastic rubber - Indentation hardness test method", HD;

[0136] 2. Adhesion: Tested according to GB / T 5210-2006 "Paints and Varnishes - Pull-off Test", MPa;

[0137] 3. Flame retardancy (1mm): Tested according to GB / T 2408-2008 "Determination of flammability of plastics - Horizontal and Vertical Methods";

[0138] 4. Withstand voltage (≤1mA, 1kVDC, 60s): Tested according to GB / T 1695-2005 "Determination of breakdown strength and withstand voltage of vulcanized rubber at power frequency";

[0139] 5. Voltage withstand after combustion (≤1mA, 1kVDC, 60s): After horizontal combustion at 1000℃ for 10min using a butane spray gun, the test is performed according to GB / T 1695-2005 "Determination of breakdown strength and withstand voltage of vulcanized rubber at power frequency".

[0140] 6. Fire resistance: The temperature of the unexposed surface was tested after horizontal combustion at 1000℃ for 10 minutes using a butane spray gun, ℃.

[0141] 7. Acid / alkali resistance: Tested according to GB23864-2023 "Fireproof Sealing Materials".

[0142] The performance test results of the fireproof and heat-insulating adhesives in Examples 1-5 and Comparative Examples 1-3 are shown in Table 9 below:

[0143] Table 9 Performance test results of the fireproof and heat-insulating adhesives in Examples 1-5 and Comparative Examples 1-3

[0144]

[0145] As shown in Table 9, the fire-retardant and heat-insulating adhesives prepared in Examples 1-5 possess fire-retardant, heat-insulating, and flame-retardant properties. After horizontal burning at 1000°C for 10 minutes, the temperature of the unexposed surface of the sprayed coating is less than or equal to 190°C, and the coating does not crack, still exhibiting good voltage resistance. In Comparative Example 1, the use of MQ resin resulted in a decrease in the flame-retardant properties of the coating. In Comparative Example 2, the absence of metal oxide ceramic powder and hollow glass microspheres led to a decrease in the fire-retardant properties of the coating; after horizontal burning at 1000°C for 10 minutes, the temperature of the unexposed surface reached 350°C, the coating cracked, and it lacked strength after burning. In Comparative Example 3, the absence of hollow silica microspheres resulted in a decrease in the heat-insulating properties of the coating; after horizontal burning at 1000°C for 10 minutes, the temperature of the unexposed surface reached 550°C, the coating cracked, and it lacked strength after burning.

[0146] As can be seen, in the fireproof and heat-insulating adhesive provided by this invention, the organosilicon resin can provide good flame retardancy and high temperature resistance, which can delay combustion; in the filler, the composite ceramic powder, hollow glass microspheres and hollow silica microspheres work synergistically to provide heat insulation and fireproofing, so that the coating still has a low back-exposed surface temperature after high-temperature flame combustion and does not crack. In addition, the fireproof and heat-insulating adhesive has a low specific gravity, can be applied by airless spraying, the coating is easy to form and the thickness is easy to control. Compared with existing fireproof and heat-insulating materials, the coating hardness, adhesion, acid and alkali resistance and other properties are also at a better level. It can be applied to the thermal protection of high energy density batteries, reduce the risk of battery combustion and explosion and improve safety performance.

Claims

1. A fireproof and heat-insulating adhesive, characterized in that, Includes component A and component B; Component A comprises the following raw materials in parts by weight: 90-110 parts of polydiphenylsiloxane; 50-180 parts of silicone resin; 90-210 parts of filler; Component B comprises the following raw materials in parts by weight: 90-110 parts of polydiphenylsiloxane; 50-170 parts of crosslinking agent; 10-80 parts of adhesion accelerator; 5-60 parts of thixotropic agent; 1-8 parts catalyst; In component A, the filler comprises ceramic powder, hollow glass microspheres, and hollow silica microspheres; the organosilicon resin has the structure shown in Formula I: Formula I; Where R is selected from -CH3, -C2H5, -Si(CH3)3; x+y+z=1, 0≤x<1, 0<y≤1, 0≤z<1; The mass ratio of component A to component B is (9-12):

1.

2. The fireproof and heat-insulating adhesive according to claim 1, characterized in that, The viscosity of the polydiphenylsiloxane at 25°C is 50-100 mPa·s.

3. The fireproof and heat-insulating adhesive according to claim 1, characterized in that, The mass ratio of the ceramic powder, hollow glass microspheres, and hollow silica microspheres is 10:(1-4):(2-10).

4. The fireproof and heat-insulating adhesive according to claim 1 or 3, characterized in that, The ceramic powder comprises silicates and metal oxides in a mass ratio of (40-200):

1.

5. The fireproof and heat-insulating adhesive according to claim 4, characterized in that, The particle size Dn50 of the silicate is 5-25 μm; And / or, the particle size Dn50 of the metal oxide is 3-25 μm; And / or, the loss on ignition of the metal oxide is ≤5%.

6. The fireproof and heat-insulating adhesive according to claim 1 or 3, characterized in that, The hollow glass microspheres have a melting point of 600-800℃; And / or, the particle size Dn50 of the hollow glass microspheres is 5-25 μm; And / or, the particle size Dn50 of the hollow silica microspheres is 10-25 μm.

7. The method for preparing the fire-retardant and heat-insulating adhesive according to any one of claims 1-6, characterized in that, Includes the following steps: The polydiphenylsiloxane in component A is mixed with organosilicon resin at 80~130℃ and vacuum conditions of -0.090~-0.1MPa for 2-5 hours. After cooling, filler is added and vacuum mixing is continued for 1-3 hours to obtain component A. The polydiphenylsiloxane in component B was heated and dehydrated at 110-130℃ and under vacuum conditions of -0.90~-0.1MPa, then cooled to below 40℃, and a crosslinking agent, adhesion promoter, thixotropic agent and catalyst were added in sequence. The mixture was then dispersed under pressure for 20-30 minutes to obtain component B.

8. The application of the fire-retardant and heat-insulating adhesive according to any one of claims 1-6 in new energy batteries.

Images