Gradient coil system, magnetic resonance imaging system and cooling device

Abstract

The embodiment of the invention discloses a gradient coil system, a magnetic resonance imaging system and a cooling device, the gradient coil system comprises the cooling device and a coil wire, and the cooling device comprises a water current insulation device, an insulation pipeline and a heat exchange device; the coil wire is provided with a cavity, a medium used for heat exchange flows in the cavity, the coil wire is provided with a medium inlet and a medium outlet, the water current electricity insulation devices are arranged at the medium inlet and the medium outlet respectively, one side of each water current electricity insulation device is connected with the coil wire through a connector, and the other side of each water current electricity insulation device is connected with the coil wire through a connector. The other side of the water current electricity insulation device is connected with the insulation pipeline; the insulating pipeline is connected with the heat exchange device, and the heat exchange device is used for conducting heat exchange on the medium.

Description

Technical Field

[0001] The present invention relates to the field of magnetic resonance, and in particular to a gradient coil system, a magnetic resonance imaging system and a cooling device. Background Art

[0002] The key parts with high heat flux density in medical equipment usually need to be cooled to ensure the normal operation of the equipment. The commonly used cooling measures are air cooling, water cooling and electronic fluoride liquid immersion cooling. Among them, the convection heat transfer coefficient of the air cooling system is relatively small. Once the heat consumption of the electronic device is large, a fan is required for forced convection heat transfer. The fan will cause noise when working at full load. In addition, the specific heat capacity of the air itself is low. In the magnetic field of medical equipment with high non-magnetic requirements, the fan will also cut the magnetic field. This makes the air cooling system have the characteristics of large size, high noise, low heat dissipation power, and inability to work in the magnetic field. Therefore, air cooling measures are usually not used in medical equipment with meticulous structural distribution and non-magnetic requirements. The non-conductive working fluid used in the electronic fluoride liquid immersion cooling system can solve the risk of short circuit of electronic devices, but the working fluid is relatively expensive, and the compatibility of the fluoride liquid working fluid makes the requirements for the material of the loop pipeline relatively high. Water cooling systems are often used because of the large specific heat capacity of water, high heat exchange efficiency and low working fluid cost. They are often placed in the form of water cooling plates close to high heat flux density working parts for efficient heat dissipation. However, there are also problems such as high heat generation, the risk of pipeline leakage and short circuit of adjacent electrical components caused by water cooling plate heat dissipation, and limited space for water cooling plates. Summary of the invention

[0003] One or more embodiments of the present specification provide a gradient coil system, the gradient coil system comprising a cooling device and a coil wire, the cooling device comprising a water current isolation device, an insulating pipe and a heat exchange device; the coil wire has a cavity, in which a medium for heat exchange flows, the coil wire has a medium inlet and a medium outlet, the water current isolation device is respectively arranged at the medium inlet and the medium outlet, one side of the water current isolation device is connected to the coil wire through a joint, and the other side of the water current isolation device is connected to the insulating pipe; the insulating pipe is connected to the heat exchange device, and the heat exchange device is used to perform heat exchange on the medium.

[0004] In some embodiments, the insulating pipe includes a first portion and a second portion, the first portion and the second portion are connected by a first metal connector, and the first metal connector is grounded.

[0005] In some embodiments, the second portion and the heat exchange device are connected via a second metal connector, and the second metal connector is grounded.

[0006] In some embodiments, the cooling device includes a resistivity sensor, which is connected to a heat exchange pipe of the heat exchange device and is used to obtain the resistivity of a medium in the heat exchange pipe.

[0007] In some embodiments, an alarm device is provided in the resistivity sensor.

[0008] In some embodiments, the cooling device includes a deionization tank, the deionization tank is connected to the heat exchange pipe of the heat exchange device, and the deionization tank is used to remove ions in the medium.

[0009] In some embodiments, a first area of ​​a dielectric flow cross section of the water current isolating device is smaller than a second area of ​​a hollow cross section of the coil conductor.

[0010] In some embodiments, the water current isolation device is a spiral structure, and the length of the spiral structure is greater than a preset length threshold.

[0011] In some embodiments, the cooling device includes a temperature-controlled three-way valve, and the three-way valve is arranged at the outlet end of the chiller of the heat exchange device.

[0012] In some embodiments, the material of the coil wire is the same as the material of the connector in contact with the coil wire.

[0013] In some embodiments, the cooling device includes a leakage protection device arranged at the outlet position of the insulating pipe.

[0014] Some embodiments of the present specification further provide a magnetic resonance imaging system, the magnetic resonance imaging system comprising a gradient coil system as described in any embodiment of the present specification, and the cooling device is used for cooling the magnetic resonance imaging system.

[0015] Some embodiments of the present specification also provide a cooling device for cooling a heating device, the cooling device comprising a water current isolation device, an insulating pipe and a heat exchange device; the heating device has a cavity, in which a medium for heat exchange flows, the heating device has a medium inlet and a medium outlet, the water current isolation device is respectively arranged at the medium inlet and the medium outlet, one side of the water current isolation device is connected to the heating device via a joint, and the other side of the water current isolation device is connected to the insulating pipe; the insulating pipe is connected to the heat exchange device, and the heat exchange device is used to perform heat exchange on the medium. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] This specification will be further described in the form of exemplary embodiments, which will be described in detail by the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein:

[0017] Figure 1 is an exemplary framework diagram of a cooling device according to some embodiments of the present specification;

[0018] Figure 2 is an exemplary structural diagram of a cooling device according to some embodiments of this specification;

[0019] Figure 3 is an exemplary structural diagram of a coil conductor according to some embodiments of this specification;

[0020] Figure 4 is a schematic cross-sectional view of a coil conductor according to some embodiments of the present specification;

[0021] Figure 5 is an exemplary internal structure diagram of a water current isolation device according to some embodiments of the present specification;

[0022] Figure 6 is another exemplary internal structure diagram of the water current isolation device shown in some embodiments of the present specification. DETAILED DESCRIPTION

[0023] In order to more clearly illustrate the technical solutions of the embodiments of this specification, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of this specification. For ordinary technicians in this field, this specification can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0024] As shown in this specification and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "comprise" and "include" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0025] The embodiment of the present specification provides a gradient coil system, which includes a cooling device and a coil wire, and the cooling device can be used for heat dissipation of a heating device (for example, a magnetic resonance imaging device). In some embodiments, the wire coil can be located in the heating device, the coil wire is connected to the cooling device, and the hollow part of the coil wire (also called the cavity of the coil wire) is immersed in a medium, and the medium can flow in the cavity to take away the heat of the coil wire and perform heat exchange in the cooling device, thereby achieving heat dissipation of the coil wire. In some embodiments, the medium in the coil wire may include but is not limited to water, Freon, fluorinated liquid, and phase change liquid. The cooling device is connected to the coil wire, and the cooling device can attenuate the voltage of the medium of the coil wire once or multiple times to make the voltage of the medium low enough, and then heat the medium, thereby reducing the risk of electrical conduction of the device during the heat exchange process. In addition, by using the cooling device provided in the embodiment of the present specification to dissipate heat for the magnetic resonance imaging device, the performance requirements of the magnetic field strength, climbing speed, and stability of the magnetic resonance imaging device can be guaranteed, while also improving the heat dissipation efficiency.

[0026] Figure 1 is an exemplary framework diagram of a cooling device according to some embodiments of the present specification. Figure 2 is an exemplary structural diagram of a cooling device according to some embodiments of the present specification. Figure 3 is an exemplary structural diagram of a coil wire according to some embodiments of the present specification. Figure 4 is a schematic cross-sectional view of a coil wire according to some embodiments of the present specification.

[0027] See also Figure 1 and Figure 2 , the cooling device 100 is connected to the heating device 200, and the cooling device 100 can dissipate heat for the heating device 200. In some embodiments, Figure 3 As shown, the coil wire 210 can be located in the heating device 200. The coil wire 210 is wound to form multiple sets of coils, and the multiple sets of coils are combined to form a cavity (for example, Figure 3The circular cavity structure shown in the figure can realize the coil function. Since the coil wire 210 is a high thermal conductivity material (for example, copper), when the heating device 200 is working, the coil wire 210 generates heat more significantly. In order to dissipate the heat of the coil wire 210, in some embodiments, the cross section of the coil wire 210 can be hollowed out to form a cavity inside the coil wire 210, and the medium is immersed in the cavity of the coil wire 210. The heat of the coil wire 210 can be conducted to the medium through direct contact between its own high thermal conductivity material and the medium. Under the driving action of the cooling device 100 (for example, a pump), the medium flows in the cavity of the coil wire 210, thereby taking away the heat of the coil wire 210 and performing heat exchange in the cooling device 100, thereby realizing the heat dissipation of the coil wire 210. In some embodiments, the coil wire 210 may have a medium inlet and a medium outlet. The medium in the coil wire 210 flows from the medium outlet to the cooling device 100 for heat exchange. The medium after heat exchange or new medium may flow from the medium inlet into the inner cavity of the coil wire 210. The medium circulates between the inner cavity of the coil wire 210 and the cooling device 100, thereby achieving heat dissipation of the coil wire 210.

[0028] In some embodiments, the cross-sectional shape of the hollow portion of the coil wire 210 may include regular and / or irregular shapes such as rectangle, circle, wedge, etc. For example, Figure 4 As shown, the cross-section of the hollow part of the coil wire 210 is rectangular. The cross-section of the hollow part of the coil wire 210 can be reasonably set according to actual needs, such as cooling performance, structural strength of the coil wire 210, connection difficulty of the joint, and maturity of the processing technology. In some embodiments, the thickness of the side wall of the hollow coil wire 210 can affect the heat dissipation efficiency of the coil wire 210. As an exemplary illustration only, the smaller the thickness of the side wall of the hollow coil wire 210, the larger the cross-sectional area of ​​the inner cavity, the larger the volume of the medium immersed in the inner cavity, the more heat is taken away when the medium flows, and the higher the heat dissipation efficiency of the coil wire 210. However, considering the structural strength and manufacturing process requirements of the coil wire 210, the thickness of the side wall of the coil wire 210 cannot be too small. Therefore, the thickness of the side wall of the coil wire 210 can be reasonably set according to actual needs (for example, heat dissipation efficiency, structural strength, manufacturing process, etc.), and this specification does not make specific limitations on this.

[0029] In some embodiments, the cooling device 100 may include a water current isolating device 110, an insulating pipe 120, and a heat exchange device 130. The water current isolating device 110 is respectively arranged at the medium inlet and the medium outlet of the coil conductor 210, one side of the water current isolating device 110 is connected to the hollow coil conductor 210 through a joint, and the other side of the water current isolating device 110 is connected to the insulating pipe 120, and the insulating pipe 120 is connected to the heat exchange device 130. In some embodiments, the water current isolating device 110 may include a first water current isolating device and a second water current isolating device, and the insulating pipe 120 includes a first insulating pipe and a second insulating pipe. Among them, the first water current isolating device is arranged at the medium inlet, and the first water current isolating device is connected to the first insulating pipe; the second water current isolating device is arranged at the medium outlet, and the second water current isolating device is connected to the second insulating pipe; the first insulating pipe and the second insulating pipe are both connected to the heat exchange device 130. The flow direction of the medium can be: the medium in the coil conductor 210 flows through the second water-current isolation device through the medium outlet, and then flows to the second insulating pipe, and further flows to the heat exchange device 130 for heat exchange; the medium after heat exchange flows back to the first insulating pipe, and then flows back to the coil conductor 210 through the first water-current isolation device and the medium inlet. The outlets or inlets of the components involved in this specification are described according to the flow direction of the medium. For example, the medium inlet of the coil conductor 210 refers to the port where the medium flows into the coil conductor 210. For another example, the outlet end of the chiller 133 in the following text refers to the port where the medium flows out of the chiller 133.

[0030] The water current isolation device 110 can be used to isolate the electricity in the medium of the coil wire 210 from the medium in the insulating pipe 120. In some embodiments, since the coil wire 210 is conductive, this will cause the medium of the coil wire 210 to be charged, and the charged medium directly flowing into the insulating pipe 120 may be dangerous (such as electric shock, equipment damage, etc.), therefore, it is necessary to remove the electricity in the medium before the medium flows into the insulating pipe 120. In some embodiments, the water current isolation device 110 can be used as a water current attenuation isolation protector to attenuate the electricity in the medium flowing through the water current isolation device 110, so that the voltage of the medium flowing into the insulating pipe 120 is less than a threshold voltage. In some embodiments, the threshold voltage may refer to a voltage that will not be dangerous when touched by a human body. For example, the threshold voltage may be 24V.

[0031] In some embodiments, the water current isolation device 110 may have a flow channel structure inside, and after the medium flows into the water current isolation device 110, it needs to flow through the flow channel structure to flow to the insulating pipe 120. The flow channel structure may have resistance, so the flow channel structure can divide the voltage of the electricity in the medium, thereby achieving attenuation of the electricity in the medium.

[0032] Figure 5 is an exemplary internal structure diagram of a water current isolation device according to some embodiments of this specification. Figure 5 In some embodiments, the flow channel structure inside the water current isolation device 110 can be a first spiral flow channel 111. The first spiral flow channel 111 is a structure similar to a "spring". One end of the first spiral flow channel 111 is connected to the coil wire 210 through a joint, and the other end of the first spiral flow channel 111 is connected to the insulating pipe 120. The first spiral flow channel 111 has a certain resistance. When the medium flows from the coil wire 210 into the first spiral flow channel 111, the first spiral flow channel 111 can divide the voltage of the electricity in the medium, thereby achieving the attenuation of the electricity in the medium. In some embodiments, the greater the resistance of the first spiral flow channel 111, the higher the attenuation degree of the electricity in the medium by the first spiral flow channel 111; the smaller the resistance of the first spiral flow channel 111, the lower the attenuation degree of the electricity in the medium by the first spiral flow channel 111. The size of the resistance of the first spiral flow channel 111 is related to the cross-sectional area of ​​the port of the first spiral flow channel 111 (which is also the area of ​​the medium flow cross-section). Exemplarily, the smaller the area of ​​the medium flow cross section of the first spiral flow channel 111, the greater the resistance of the first spiral flow channel 111; the larger the area of ​​the medium flow cross section of the first spiral flow channel 111, the smaller the resistance of the first spiral flow channel 111. Based on this, in order to ensure that the first spiral flow channel 111 has a sufficiently high degree of attenuation of the electricity of the medium so that the voltage of the electricity in the medium flowing from the first spiral flow channel 111 to the insulating pipe 120 is less than the threshold voltage, the area of ​​the medium flow cross section of the first spiral flow channel 111 (also called the first area) can be set to be smaller than the area of ​​the hollow cross section of the coil conductor 210 (also called the second area). It can also be understood that when the medium flows from the coil conductor 210 to the first spiral flow channel 111, and the medium transitions between the two flow cross sections, the attenuation of the electricity in the medium by the first spiral flow channel 111 can be achieved by setting the size of the two flow cross sections (i.e., the first area and the second area).

[0033] Figure 6 FIG. 2 is another exemplary internal structure diagram of a water current isolation device according to some embodiments of the present specification. Figure 6 In some embodiments, the flow channel structure inside the water current isolation device 110 can be a second spiral flow channel 112. The second spiral flow channel 112 is flat, similar to a "mosquito coil" structure. Similar to the connection method of the first spiral flow channel 111, one end of the second spiral flow channel 112 is connected to the coil wire 210 through a joint, and the other end of the second spiral flow channel 112 is connected to the insulating pipe 120. Figure 5The first spiral flow channel 111 attenuates the electricity in the medium, and the second spiral flow channel 112 has a certain resistance. During the flow of the medium in the second spiral flow channel 112, the second spiral flow channel 112 divides the electricity in the medium, thereby achieving the attenuation of the electricity in the medium. In some embodiments, the magnitude of the resistance of the second spiral flow channel 112 is related to the length of the second spiral flow channel 112. The length of the second spiral flow channel 112 may refer to the length of the path through which the medium flows in the second spiral flow channel 112. Exemplarily, the greater the length of the second spiral flow channel 112, the greater the resistance of the second spiral flow channel 112; the smaller the length of the second spiral flow channel 112, the smaller the resistance of the second spiral flow channel 112. Based on this, in order to ensure that the second spiral flow channel 112 has a sufficiently high degree of attenuation of the electricity of the medium so that the voltage of the electricity in the medium flowing from the second spiral flow channel 112 to the insulating pipe 120 is less than the threshold voltage, the length of the second spiral flow channel 112 may be set to be greater than the preset length threshold. In some embodiments, the size of the preset length threshold can be set according to actual needs (for example, the size of the water current isolation device 110, the degree of electrical attenuation in the medium, etc.), and is not specifically limited here.

[0034] In some embodiments, the coil wire 210 is connected to the water current isolation device 110 through a joint, and the joint can be made of a non-magnetic material. As an example only, the material of the joint can be brass or aluminum with a higher purity to ensure that the joint is non-magnetic. In some embodiments, the material of the coil wire 210 can be the same as the material of the joint to avoid electrochemical corrosion of the coil wire 210 and / or the joint. In some embodiments, when the coil wire 210 is high-purity copper, the copper is in direct contact with the medium, which can cause the thermal resistance of the copper to drop sharply, thereby improving the heat dissipation efficiency of the coil wire 210. In addition, while improving the heat dissipation efficiency, the supply of the medium can be reduced, thereby reducing the temperature gradient of the heating components in the heating device 200, thereby improving the working performance of the temperature-sensitive heating device 200. In some embodiments, the position where the joint contacts the coil wire 210 and / or the water current isolation device 110 can be sealed to prevent the medium from flowing out. For example, a rubber sealing ring or a gasket can be used for sealing.

[0035] After the electricity in the medium is attenuated by the water current isolation device 110, it flows to the insulating pipe 120. The voltage of the medium in the insulating pipe 120 is below the threshold voltage or is zero. In some cases, some voltage may remain due to the change in the resistivity of the medium. In order to prevent danger, the remaining voltage in the medium in the insulating pipe 120 can be further processed to basically remove the electricity in the medium. In some embodiments, see Figure 2, the insulating pipe 120 may include a first part 121 and a second part 122, the first part 121 is connected to the water current isolation device 110, and the second part 122 is connected to the heat exchange device 130. The first part 121 and the second part 122 are connected by a first metal connector 123, and the first metal connector 123 is grounded. In some embodiments, the first metal connector 123 may be a hollow structure with an inner cavity, and the medium can flow in the inner cavity of the first metal connector 123. The first metal connector 123 is grounded, and when the medium flows through the first metal connector 123, the remaining part of the electricity in the medium can be conducted to the ground through the first metal connector 123, thereby substantially removing the remaining voltage in the medium. The first metal connector 123 may be disposed in the wall of two chambers (such as the scanning chamber A and the cooling chamber C described below) to avoid being touched.

[0036] In some embodiments, the second portion 122 and the heat exchange device 130 may be connected via a second metal connector 124, and the second metal connector 124 may be grounded. By grounding the second metal connector 124, it may be further ensured that the electricity in the medium in the insulating pipe 120 is substantially removed.

[0037] In some embodiments, the insulating pipe 120 may be made of a high-insulation rubber material. As an example, the insulating pipe 120 may be made of high-purity polyurethane (PU) or ethylene propylene diene monomer (EPDM).

[0038] The heat exchange device 130 may include a pump 131, a heat exchanger 132, and a chiller 133 connected in sequence. The pump 131 may drive the medium to circulate between the coil wire 210 and the cooling device 100. The heat exchanger 132 and the chiller 133 may perform heat exchange treatment on the medium. For example, a medium with heat (i.e., a high-temperature medium) may be heat exchanged through the heat exchanger 132 and the chiller 133, so that the heat in the medium is transferred to the water of the chiller 133. The chiller 133 exchanges heat between the high-temperature medium of the heat exchanger 132 and the cooling medium (such as Freon) of the chiller 133 through its own heat exchanger, thereby taking away the heat in the high-temperature medium, and exchanging heat with the outside air through the condenser, so that the heat is dissipated in the air. In some embodiments, the type of the heat exchanger 132 may include a tube-fin type, a plate-fin type, a microchannel, a titanium tube type, etc. The chiller 133 may include air-cooled, water-cooled, field water, and other cooling methods.

[0039] In some embodiments, the cooling device 100 may include a resistivity sensor 140, and the resistivity sensor 140 is connected to a heat exchange pipe of the heat exchange device 130. The heat exchange pipe refers to a pipe in the heat exchange device 130 for medium circulation. Figure 2The arrows are used to indicate the flow direction of the medium. Different components in the cooling device 100 (e.g., the insulating pipe 120, the pump 131, the heat exchanger 132, the chiller 133, the deionization tank 150, and the three-way valve 160) are connected by heat exchange pipes. In some embodiments, Figure 2 As shown, the resistivity sensor 140 can be connected to the heat exchange pipe between the pump 131 and the insulating pipe 120. In other embodiments, the resistivity sensor 140 can also be connected to other heat exchange pipes, such as the heat exchange pipe between the insulating pipe 120 at the outlet of the medium and the heat exchanger 132.

[0040] In some embodiments, the resistivity sensor 140 can be used to obtain the resistivity of the medium in the heat exchange pipe. The resistivity of the medium can be used to characterize the purity of the medium. For example, the greater the resistivity of the medium, the higher the purity of the medium; the smaller the resistivity of the medium, the lower the purity of the medium. In some embodiments, multiple preset resistivity thresholds can be set, and when the resistivity of the acquired medium is lower than different preset resistivity thresholds, the cooling device 100 performs corresponding preset operations. For example, a first preset resistivity threshold and a second preset resistivity threshold (less than the first preset resistivity threshold) can be set. In some embodiments, an alarm device can be provided in the resistivity sensor 140. When the resistivity of the medium is lower than the first preset resistivity threshold (such as 1MΩ*CM), the alarm device can alarm to prompt the operator to replace the medium in time; if the medium is not replaced, when the resistivity of the medium is detected to be lower than the second preset resistivity threshold (such as 0.5MΩ*CM), the cooling device 100 automatically stops. In other embodiments, the alarm device can also be set at other locations of the gradient coil system, for example, on an insulating pipe. By providing an alarm device in the gradient coil system, an alarm can be issued when the resistivity of the medium is lower than a preset resistivity threshold, thereby improving the safety of the cooling device 100 .

[0041] In some embodiments, the cooling device 100 may include a deionization tank 150, and the deionization tank 150 is connected to a heat exchange pipe of the heat exchange device 130. Figure 2 As shown, the deionization tank 150 is connected between the two heat exchange pipes. In some embodiments, the deionization tank 150 can be used to remove ions in the medium (i.e., improve the purity of the medium) so that the resistivity of the medium meets the requirements. For example, the resistivity of the medium is not less than a preset resistivity threshold. In some embodiments, the deionization tank 150 may include a filter membrane, which can filter out ions (e.g., conductive impurities) in the medium, thereby improving the purity of the medium. Since the filtered ions are adsorbed on the filter membrane, in order to ensure that the deionization tank 150 can effectively filter the ions in the medium and ensure the insulation safety of the cooling device 100, the deionization tank 150 can be replaced regularly.

[0042] In some embodiments, the cooling device 100 may include a temperature-controlled three-way valve 160, which is disposed at the outlet end of the chiller 133 of the heat exchange device 130. The three-way valve 160 is disposed at the outlet end of the chiller 133 and is not directly connected to the insulating pipe 120, which can reduce the generation of ions in the medium of the cooling device 100. In some embodiments, the three-way valve 160 can be used to control the temperature of the medium in the cooling device 100. For example, the three-way valve 160 can maintain the temperature of the medium at the outlet end of the pump 131 at about room temperature (e.g., 15° to 25°), so that the temperature of the medium flowing back to the coil wire 210 is more appropriate, thereby ensuring the working performance of the coil wire 210. In some embodiments, the three-way valve 160 can control the temperature of the medium by controlling the heat exchanger 132. In some embodiments, the three-way valve 160 can include an electromagnetic three-way valve, an electronic three-way valve, etc.

[0043] In some embodiments, the cooling device 100 may include a valve 170, and the valve 170 is connected to the heat exchange pipe of the heat exchange device 130. Figure 2 As shown, the valve 170 can be connected to the heat exchange pipe between the pump 131 and the insulating pipe 120 at the medium inlet. The valve 170 can be used to adjust the flow rate of the circulating medium.

[0044] In some embodiments, the cooling device 100 may include a leakage protection device 180 disposed at the outlet position of the insulating pipe 120 (the insulating pipe 120 is disposed at the outlet of the medium). When the medium is charged (for example, the resistivity change of the medium causes the medium to be charged), the leakage protection device 180 can perform a preset control operation. The preset control operation may include, but is not limited to, stopping heat exchange, issuing a warning signal, and stopping one or more of the magnetic resonance operation. For example, the leakage protection device 180 may include a control panel, and the control panel can control the working state of the pump 131. When it is detected that the medium in the cooling device 100 is charged, the control panel can control the pump 131 to stop working, the medium no longer flows, and the heat exchange stops. For another example, the leakage protection device 180 may also include an alarm (for example, an LED light, a horn), and the alarm is electrically connected to the control panel. When it is detected that the medium in the cooling device 100 is charged, the control panel can control the alarm to send a warning signal (for example, LED flashing, horn voice warning). For another example, the control board of the leakage protection device 180 can directly control the working state of the heating device 200. When it is detected that the medium in the cooling device 100 is charged, the control board can directly control the heating device 200 to stop scanning. It is understandable that the type of preset control operation performed by the leakage protection device 180 can be set according to the degree of charge of the medium in the cooling device 100.

[0045] In some embodiments, when the cooling device 100 and the heating device 200 are actually used, the components of the cooling device 100 and the heating device 200 are placed in different rooms. For example, the heating device 200 (for example, the coil wire 210) can be placed in the scanning room A, some components of the cooling device 100 (for example, the water current isolation device 110, part of the insulating pipe 120) are placed in the scanning room A, the chiller 133 of the cooling device 100 is placed outdoors B, and some components of the cooling device 100 (for example, part of the insulating pipe 120, the pump 131, the heat exchanger 132, the resistivity sensor 140, the deionization tank 150, the three-way valve 160, the valve 170, the leakage protection device 180) are placed in the cooling room C. By setting the water current isolation device 110 and the two metal parts (the first metal connector 123 and the second metal connector 124) to be grounded, it is possible to prevent the medium from carrying electricity from one room to another room when flowing, thereby reducing the risk of conduction caused by the medium heat exchange.

[0046] Some embodiments of the present specification also provide a magnetic resonance imaging system, the magnetic resonance imaging system includes the gradient coil system in any embodiment of the present specification, and the cooling device can be used to cool the magnetic resonance imaging system. In some embodiments, the magnetic resonance imaging system may include a scanner, and the scanner is configured to scan in a scanning space. When the scanner is working, a first magnetic field (also called a main magnetic field) is generated, and a second magnetic field (also called a secondary magnetic field) is generated when the current flows through the coil wire. The secondary magnetic field constitutes a gradient field superimposed on the main magnetic field. The heating of the coil wire in the gradient field will cause the temperature of the magnetic resonance imaging system to rise. Using the cooling device described in the embodiment of the present specification, the coil wire can be dissipated to achieve the cooling process of the magnetic resonance imaging system, and the risk of conduction caused by the cooling process can also be reduced. It should be noted that the cooling device provided in the embodiment of the present specification can not only be used for cooling the magnetic resonance imaging system, but also for cooling other heating devices, as long as the heating device has a cavity that can be used for flowing heat exchange medium, and the medium used for heat exchange circulates between the heating device and the cooling device to achieve the cooling process of the heating device, and the risk of conduction caused by the cooling process can also be reduced.

[0047] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this specification. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

[0048] At the same time, this specification uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures or characteristics in one or more embodiments of this specification can be appropriately combined.

[0049] Similarly, it should be noted that in order to simplify the description disclosed in this specification and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this specification, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the subject matter of this specification are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0050] Finally, it should be understood that the embodiments described in this specification are only used to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Therefore, as an example and not a limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly introduced and described in this specification.

Claims

1. A gradient coil system, characterized in that: The gradient coil system comprises a cooling device and a coil wire, wherein the cooling device comprises a water current isolating device, an insulating pipe and a heat exchanging device; The coil conductor has a cavity, in which a medium for heat exchange flows, and the coil conductor has a medium inlet and a medium outlet, at which the water current isolation device is respectively arranged, one side of the water current isolation device is connected to the coil conductor via a joint, and the other side of the water current isolation device is connected to the insulating pipe; The insulating pipe is connected to the heat exchange device, and the heat exchange device is used to perform heat exchange on the medium.

2. The gradient coil system according to claim 1, characterized in that The insulating pipe includes a first portion and a second portion, wherein the first portion and the second portion are connected by a first metal connector, and the first metal connector is grounded.

3. The gradient coil system according to claim 2, characterized in that: The second part and the heat exchange device are connected via a second metal connector, and the second metal connector is grounded.

4. The gradient coil system according to claim 1, characterized in that: The cooling device comprises a resistivity sensor, which is connected to a heat exchange pipe of the heat exchange device and is used to obtain the resistivity of a medium in the heat exchange pipe.

5. The gradient coil system according to claim 4, characterized in that The resistivity sensor is provided with an alarm device.

6. The gradient coil system according to claim 1, characterized in that: The cooling device comprises a deionization tank, the deionization tank is connected to the heat exchange pipeline of the heat exchange device, and the deionization tank is used to remove ions in the medium.

7. The gradient coil system according to claim 1, characterized in that: A first area of ​​a medium flow cross section of the water current isolating device is smaller than a second area of ​​a hollow cross section of the coil conductor.

8. The gradient coil system according to claim 1, characterized in that: The water current isolation device is a spiral structure, and the length of the spiral structure is greater than a preset length threshold.

9. The gradient coil system according to claim 1, characterized in that: The cooling device comprises a temperature-control three-way valve, and the three-way valve is arranged at the outlet end of the chiller of the heat exchange device.

10. The gradient coil system according to claim 1, characterized in that: The material of the coil conductor is the same as the material of the connector in contact with the coil conductor.

11. The gradient coil system according to claim 1, characterized in that: The cooling device comprises a leakage protection device arranged at the outlet position of the insulating pipe.

12. A magnetic resonance imaging system, characterized in that: The magnetic resonance imaging system comprises the gradient coil system according to any one of claims 1 to 11, and the cooling device is used for cooling the magnetic resonance imaging system.

13. A cooling device for cooling a heat generating device, characterized in that: The cooling device comprises a water current isolating device, an insulating pipe and a heat exchanging device; The heating device has a cavity, in which a medium for heat exchange flows, and the heating device has a medium inlet and a medium outlet, at which the water current isolation device is respectively arranged, one side of the water current isolation device is connected to the heating device via a joint, and the other side of the water current isolation device is connected to the insulating pipe; The insulating pipe is connected to the heat exchange device, and the heat exchange device is used to perform heat exchange on the medium.

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