Miniature TEC temperature control chip structure

Abstract

The invention relates to a small TEC temperature control chip structure, which relates to the field of circuit communication and comprises a receiving amplification module, a transmitting module, a control circuit module, a power supply module and a core processing unit. The receiving and amplifying module is used for receiving and collecting temperature signals and performing corresponding filtering and amplifying processing; the transmitting module is used for carrying out reprocessing and regulation and control output on the signals processed by the receiving and amplifying module; the control circuit module is used for receiving the signal processed by the transmitting module and receiving and executing a corresponding temperature control signal instruction; the power supply module is externally connected with a corresponding input interface, is in telecommunication communication with the receiving amplification module, the transmitting module and the control circuit module, and is used for providing corresponding power supply; and the core processing unit is a microcontroller, is in telecommunication communication with the receiving and amplifying module, the transmitting module, the control circuit module and the power supply module, and is used for controlling and monitoring the running states of the corresponding modules. The system is specifically composed of an ADN8834 control circuit, a power supply voltage stabilizing circuit, a receiving and amplifying circuit and a core processing unit STM32. Miniaturization and multiple functions of the digital temperature control circuit are realized.

Description

Technical Field

[0001] The invention relates to the field of circuit communication, and in particular to a small TEC temperature control chip structure. Background Art

[0002] TEC (Thermoelectric Cooler) temperature control system is an electronic device that uses the Peltier effect to control temperature through electric current. This system consists of one or more pairs of thermocouples. When current passes through these thermocouples, one end absorbs heat and the other end releases heat, thereby achieving heat transfer and achieving the effect of cooling or heating. In practical applications, TEC temperature control systems are often used in micro-cooling and precise temperature control, such as laboratory instruments, semiconductor testing, laser temperature control, biomedicine and other fields.

[0003] In the prior art, the temperature control system based on temperature sensor and TEC (thermoelectric cooler) is mostly composed of PID (proportional-integral-differential) control unit + power drive unit, which has relatively simple functions and large size. Summary of the invention

[0004] Purpose of the invention: To provide a small TEC temperature control chip structure to solve the above problems existing in the prior art.

[0005] Technical solution: A small TEC temperature control chip structure, including a receiving and amplifying module, a transmitting module, a control circuit module, a power supply module and a core processing unit; the receiving and amplifying module is used to receive and collect temperature signals, and perform corresponding filtering and amplifying processing; the transmitting module is used to reprocess and regulate the output of the signal processed by the receiving and amplifying module; the control circuit module is used to receive the signal processed by the transmitting module, and receive and execute the corresponding temperature control signal instructions; the power supply module is externally connected to the corresponding input interface, and is electrically connected with the receiving and amplifying module, the transmitting module and the control circuit module to provide corresponding power supply; the core processing unit is a microcontroller, which is electrically connected with the receiving and amplifying module, the transmitting module, the control circuit module and the power supply module to control and monitor the operating status of the corresponding modules.

[0006] In a further embodiment, the receiving amplification module is composed of multiple operational amplifiers, and the multiple operational amplifiers are all second-order operational amplifiers; and one end of the receiving amplification module is connected to the temperature sensor through a corresponding interface; and the other end is connected to the reference resistance circuit through a corresponding interface.

[0007] In a further embodiment, the transmitting module includes an operation processing chip and a transistor, and the operation processing chip includes a corresponding operational amplifier; and the transistor is a common emitter amplifier circuit, and the output voltage value is regulated by the operation processing chip to change the signal duty cycle, and can output a PWN signal to control the TEC.

[0008] In a further embodiment, the control circuit module integrates multiple self-correcting and automatic zeroing amplifiers; and the self-correcting amplifiers are connected to the thermistor input amplifiers of the external temperature measurement analog-to-digital converter, and the automatic zeroing amplifiers are used as buffers for the external DAC to control the temperature set value.

[0009] In a further embodiment, the power supply module is provided with a positive voltage regulator, and is externally connected to an analog ground and a +5V input interface; and its output circuit is summarized, and high-frequency noise and clutter in the power supply are filtered out by using a combination of capacitors and inductors. The inductor can store magnetic field energy in the circuit, playing the role of energy storage, so that the power supply circuit can output a smooth voltage.

[0010] In a further embodiment, the collector junction of the transistor is connected to the positive electrode of the TEC, the negative electrode of the TEC is grounded, and the capacitor and inductor between the power supply and the chip VDD pin play a filtering role and avoid drastic voltage fluctuations.

[0011] In a further embodiment, the operation processing chip is a GS8551-TR chip and includes an operational amplifier.

[0012] Beneficial effect: The present invention relates to a small TEC temperature control chip structure, which relates to the field of circuit communication, including a receiving and amplifying module, a transmitting module, a control circuit module, a power supply module and a core processing unit; the receiving and amplifying module is used to receive and collect temperature signals, and perform corresponding filtering and amplifying processing; the transmitting module is used to reprocess and regulate the output of the signal processed by the receiving and amplifying module; the control circuit module is used to receive the signal processed by the transmitting module, and receive and execute the corresponding temperature control signal instruction; the power supply module is externally connected to the corresponding input interface, and is in telecommunication communication with the receiving and amplifying module, the transmitting module and the control circuit module, and is used to provide corresponding power supply; the core processing unit is a microcontroller, which is in telecommunication communication with the receiving and amplifying module, the transmitting module, the control circuit module and the power supply module, and is used to control and monitor the operating status of the corresponding modules. The present invention is specifically composed of an ADN8834 control circuit, a power supply voltage stabilizing circuit, a receiving and amplifying circuit and a core processing unit STM32. The miniaturization and multi-function of the digital temperature control circuit are realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall architecture of the present invention.

[0014] Figure 2 The figure is a circuit diagram of the receiving and amplifying module of the present invention.

[0015] Figure 3 The figure is a circuit diagram of the transmitting module of the present invention.

[0016] Figure 4 It is a circuit diagram of the control circuit module of the present invention.

[0017] Figure 5 The figure is a circuit diagram of the power module of the present invention.

[0018] Figure 6 The figure is a circuit diagram of the core processing unit of the present invention. DETAILED DESCRIPTION

[0019] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is apparent to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0020] The applicant believes that the temperature control system based on temperature sensor and TEC (thermoelectric cooler) in the prior art mostly adopts PID (proportional-integral-differential) control unit + power drive unit, which has relatively simple functions and large size.

[0021] To this end, the applicant designed a small TEC temperature control chip structure, which is specifically composed of an ADN8834 control circuit, a power supply voltage regulator circuit, a receiving amplifier circuit, and a core processing unit STM32, thereby realizing the miniaturization and multi-function of a digital temperature control circuit.

[0022] The small TEC temperature control chip structure involved in the present invention mainly includes a receiving and amplifying module, a transmitting module, a control circuit module, a power supply module and a core processing unit; the receiving and amplifying module is used to receive and collect temperature signals, and perform corresponding filtering and amplifying processing; the transmitting module is used to reprocess and regulate the output of the signal processed by the receiving and amplifying module; the control circuit module is used to receive the signal processed by the transmitting module, and receive and execute the corresponding temperature control signal instruction; the power supply module is externally connected to the corresponding input interface, and is electrically connected with the receiving and amplifying module, the transmitting module and the control circuit module to provide corresponding power supply; the core processing unit is a microcontroller, which is electrically connected with the receiving and amplifying module, the transmitting module, the control circuit module and the power supply module to control and monitor the operating status of the corresponding modules.

[0023] The receiving amplifier module is composed of a plurality of operational amplifiers, and the plurality of operational amplifiers are all second-order operational amplifiers; one end of the receiving amplifier module is connected to the temperature sensor through a corresponding interface; and the other end is connected to the reference resistance circuit through a corresponding interface.

[0024] The transmitting module includes an operation processing chip and a triode, and the operation processing chip includes a corresponding operational amplifier; and the triode is a common emitter amplifier circuit, and the output voltage value is regulated by the operation processing chip, changing the signal duty cycle, and can output a PWN signal to control the TEC.

[0025] The control circuit module integrates multiple self-correcting and automatic zeroing amplifiers; and the self-correcting amplifiers are connected to the thermistor input amplifiers of the external temperature measurement analog-to-digital converter, and the automatic zeroing amplifiers are used as buffers for external DACs to control the temperature setting value.

[0026] The power module is provided with a positive voltage regulator, and is externally connected to an analog ground and a +5V input interface; and its output circuit is summarized, and high-frequency noise and clutter in the power supply are filtered out by using a combination of capacitors and inductors. The inductor can store magnetic field energy in the circuit and play a role in energy storage, so that the power circuit can output a smooth voltage.

[0027] The collector junction of the transistor is connected to the positive electrode of the TEC, the negative electrode of the TEC is grounded, and the capacitor and inductor between the power supply and the chip VDD pin play a filtering role and avoid drastic voltage fluctuations.

[0028] The operation processing chip is a GS8551-TR chip, and includes an operational amplifier.

[0029] In a further preferred embodiment, as shown in the attached Figure 1 As shown, the leftmost module is the receiving amplifier module and the transmitting module, the middle is the STM32 microcontroller, and the rightmost is the TEC control module and power supply voltage stabilization circuit composed of ADN8824.

[0030] As attached Figure 2As shown, the receiving amplifier circuit consists of four operational amplifiers, which can be divided into two parts, the upper and lower parts, both of which are second-order amplifiers, and can filter and amplify the collected temperature signal to facilitate the processing of the single-chip microcomputer. The capacitor plays a filtering role, which can perform preliminary noise reduction on the collected signal and optimize the subsequent signal processing. The upper part can be connected to a temperature sensor such as NTC, thermocouple or thermal resistor through the interface Ande_CH4. The lower part can be connected to the reference resistor circuit through the interface Ande_Ref. STM32 reads and processes the collected data through the PC1 and PC0 pins. Since this module will use four operational amplifiers, the precision operational amplifier chip GS8554-TR can be selected. This chip contains four amplifiers and the operating temperature is between -45℃ and +125℃, which meets the TEC temperature control requirements.

[0031] As attached Figure 3 As shown, after the microcontroller processes the signal, the signal output from the PB1 pin is amplified and controls the transistor. The transistor is designed as a common emitter amplifier circuit. The output voltage value is regulated by the microcontroller. By changing the signal duty cycle, a PWM signal can be output to control the TEC. The collector junction of the transistor can be connected to the positive pole of the TEC, and the negative pole of the TEC is grounded. The capacitor and inductor between the power supply and the chip VDD pin play a filtering role and avoid drastic voltage fluctuations. The GS8551-TR chip is selected, which only contains one operational amplifier.

[0032] As attached Figure 4 As shown in Figure 1, when using a digital control loop, that is, STM32 to control the ADN8834, the OUT2 pin is connected to IN2N, the compensation amplifier is configured as a unity gain follower, and then the control signal of the DAC is applied to the IN2P input.

[0033] The ADN8834 integrates two self-correcting, auto-zeroing amplifiers (Chopper 1 and Chopper 2). When the software controls the PID loop, Chopper 1 is configured as a thermistor input amplifier connected to an external temperature measurement analog-to-digital converter (ADC). The Chopper 2 amplifier is used as a buffer for an external DAC to control the temperature setpoint. Connect the DAC to IN2P, that is, input the digital signal output by the STM32 from the IN2P pin and short the IN2N and OUT2 pins together. Since the PWM switching frequency of the ADN 8834 can be synchronized with an external clock from 1.85MHz to 3.25MHz, the microcontroller can control the PWM switching frequency through the EN / SY input pin. VTEC is an analog voltage output pin whose voltage is proportional to the actual voltage across the TEC. ITEC is an analog voltage output pin whose voltage is proportional to the actual current through the TEC. The maximum TEC voltage is set by applying a voltage divider on the VLIM / SD pin to protect the TEC. The voltage limiter operates bidirectionally and allows the cooling limit to be different from the heating limit. To protect the TEC, a separate maximum TEC current limit in the cooling and heating directions can be set by applying a voltage combination on the ILIM pin. Since the OUT1 voltage is proportional to the object temperature, OUT1 is connected to an external interface, which allows real-time monitoring of the OUT1 voltage to better evaluate the effect of temperature control. The LDR and PGNDS pins are connected to the positive and negative poles of the TEC through the interface. This allows high-precision control of the TEC.

[0034] As attached Figure 5 As shown in the figure, the power module uses SPX3819, a positive voltage regulator with low voltage drop and low noise output, external analog ground and +5V input interface. Among them, the voltage regulator can play the role of anti-interference isolation and prevent reverse connection. In the output circuit, the combination of capacitors and inductors can filter out high-frequency noise and clutter in the power supply. The inductor can store magnetic field energy in the circuit and play the role of energy storage, so that the power circuit can output a smooth voltage.

[0035] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes may be made to it in form and detail without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A small TEC temperature control chip structure, characterized in that: It includes a receiving and amplifying module, a transmitting module, a control circuit module, a power supply module and a core processing unit; the receiving and amplifying module is used to receive and collect temperature signals, and perform corresponding filtering and amplifying processing; the transmitting module is used to reprocess and regulate the output of the signal processed by the receiving and amplifying module; the control circuit module is used to receive the signal processed by the transmitting module, and receive and execute the corresponding temperature control signal instructions; the power supply module is externally connected to the corresponding input interface, and is electrically connected with the receiving and amplifying module, the transmitting module and the control circuit module to provide corresponding power supply; the core processing unit is a microcontroller, which is electrically connected with the receiving and amplifying module, the transmitting module, the control circuit module and the power supply module to control and monitor the operating status of the corresponding modules.

2. The small TEC temperature control chip structure according to claim 1, characterized in that: The receiving amplifier module is composed of a plurality of operational amplifiers, and the plurality of operational amplifiers are all second-order operational amplifiers; one end of the receiving amplifier module is connected to the temperature sensor through a corresponding interface; and the other end is connected to the reference resistance circuit through a corresponding interface.

3. The small TEC temperature control chip structure according to claim 2, characterized in that: The transmitting module includes an operation processing chip and a triode, and the operation processing chip includes a corresponding operational amplifier; and the triode is a common emitter amplifier circuit, and the output voltage value is regulated by the operation processing chip, changing the signal duty cycle, and can output a PWN signal to control the TEC.

4. The small TEC temperature control chip structure according to claim 3, characterized in that: The control circuit module integrates multiple self-correcting and automatic zeroing amplifiers; and the self-correcting amplifiers are connected to the thermistor input amplifiers of the external temperature measurement analog-to-digital converter, and the automatic zeroing amplifiers are used as buffers for external DACs to control the temperature setting value.

5. The small TEC temperature control chip structure according to claim 3, characterized in that: The power module is provided with a positive voltage regulator, and is externally connected to an analog ground and a +5V input interface; and its output circuit is summarized, and high-frequency noise and clutter in the power supply are filtered out by using a combination of capacitors and inductors. The inductor can store magnetic field energy in the circuit and play a role in energy storage, so that the power circuit can output a smooth voltage.

6. The small TEC temperature control chip structure according to claim 3, characterized in that: The collector junction of the transistor is connected to the positive electrode of the TEC, the negative electrode of the TEC is grounded, and the capacitor and inductor between the power supply and the chip VDD pin play a filtering role and avoid drastic voltage fluctuations.

7. The small TEC temperature control chip structure according to claim 3, characterized in that: The operation processing chip is a GS8551-TR chip, and includes an operational amplifier.

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