Semiconductor manufacturing equipment distribution method and device, server and storage medium

Abstract

The embodiment of the invention provides a semiconductor manufacturing equipment distribution method and device, a server and a storage medium, and relates to the technical field of semiconductor manufacturing, and the method comprises the steps: obtaining the number of to-be-controlled semiconductor manufacturing equipment in a current working period, according to the number of the semiconductor manufacturing devices to be controlled and the corresponding leading and releasing survival rate of each operator in the last working period, the number of the devices distributed to each operator is obtained, and the larger the leading and releasing survival rate of each operator in the last working period is, the larger the number of the distributed devices is; and from the to-be-controlled semiconductor manufacturing equipment in the current working period, distributing the to-be-controlled semiconductor manufacturing equipment with the equipment number for each operator. According to the method, the to-be-controlled semiconductor manufacturing equipment is allocated to each operator according to the historical representation of each operator, so that more to-be-controlled semiconductor manufacturing equipment can be controlled by the operator with higher leading and releasing survival rate, and the leading and releasing survival rate of the whole workshop is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor manufacturing equipment allocation method, device, server and storage medium. Background Art

[0002] In the process of pulling a single crystal, it is necessary to go through the steps of welding, seeding, shoulder release, equalizing diameter, and finishing. Among them, seeding and shoulder release are extremely important as the key links of early survival. At present, semiconductor manufacturing equipment for seeding and shoulder release operations adopts a zone management mode. Each zone operates independently. Seeding and shoulder release operations are performed by operators in each zone, and equalizing diameter and subsequent steps are the responsibility of on-site personnel. This management method with fixed operators in each zone makes it difficult to achieve a comprehensive improvement in the survival rate of seeding and release in the entire workshop. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor manufacturing equipment allocation method, device, server and computer-readable storage medium to solve the problem of difficulty in achieving a comprehensive improvement in the lead-out survival rate of the entire workshop.

[0004] In a first aspect, the present invention provides a semiconductor manufacturing equipment allocation method, which is applied to a server, wherein the server is in communication connection with a plurality of control devices, and the server stores the release survival rate of each operator after performing a control operation on the semiconductor manufacturing equipment during the previous working period; the method comprises:

[0005] Obtaining the number of semiconductor manufacturing equipment to be controlled during the current working period;

[0006] According to the number of the semiconductor manufacturing equipment to be controlled and the corresponding lead-out survival rate of each operator during the previous working period, the number of equipment allocated to each operator is obtained; wherein, the greater the corresponding lead-out survival rate of each operator during the previous working period, the greater the number of equipment allocated;

[0007] From the semiconductor manufacturing equipment to be controlled during the current working period, respectively allocating the number of semiconductor manufacturing equipment to be controlled to each operator;

[0008] The device control interface corresponding to the semiconductor manufacturing device to be controlled assigned to each operator is sent to the control device corresponding to the operator, so that the control device controls the corresponding semiconductor manufacturing device to be controlled according to the operation of the operator in the device control interface.

[0009] In an optional embodiment, the method further comprises:

[0010] After the current working period ends, obtaining the release survival rate after each operator performs the control operation on each semiconductor manufacturing equipment to be controlled;

[0011] The corresponding release survival rate of each operator during the current working period is determined according to the release survival rate after each operator performs control operations on each semiconductor manufacturing equipment to be controlled.

[0012] In an optional implementation manner, obtaining the number of equipment assigned to each operator according to the number of semiconductor manufacturing equipment to be controlled and the corresponding release survival rate of each operator during the previous work period includes:

[0013] Sorting the release survival rates corresponding to all the operators during the previous working period to obtain sorting information;

[0014] The number of devices assigned to each operator is determined according to the number of the semiconductor manufacturing devices to be controlled and the sorting information.

[0015] In an optional embodiment, the method further comprises:

[0016] Determine the number of times the release survival rate is lower than a preset threshold value according to the release survival rate corresponding to the current working period and the release survival rate corresponding to each working period before the current working period for each operator;

[0017] If the number of times that the lead-in survival rate is lower than the preset threshold exceeds the preset number, a learning notification message is generated, and the allocation of the semiconductor manufacturing equipment to be controlled to the corresponding operator is stopped;

[0018] The learning notification information is sent to the control device corresponding to the operator to notify the corresponding operator to perform learning.

[0019] In an optional embodiment, the method further comprises:

[0020] Obtaining the learning time and assessment score of the operator;

[0021] If the learning time of the operator is greater than the preset learning time, and the assessment score is greater than the passing score, the semiconductor manufacturing equipment to be controlled is assigned to the operator.

[0022] In an optional implementation manner, the server stores standard operating specifications, and the method further includes:

[0023] Monitoring the operation of the operator on the device control interface;

[0024] If the operation of the operator on the device control interface does not conform to the standard operation specification, an operation prompt message is generated and sent to the corresponding control device to prompt the corresponding operator to perform the standard operation.

[0025] In a second aspect, the present invention provides a semiconductor manufacturing equipment allocation device, which is applied to a server, the server is communicatively connected to a plurality of control devices, and the server stores the release survival rate of each operator after performing control operations on the semiconductor manufacturing equipment during the previous working period; the device comprises:

[0026] The equipment quantity acquisition module is used to obtain the number of semiconductor manufacturing equipment to be controlled during the current working period; according to the number of semiconductor manufacturing equipment to be controlled and the corresponding release survival rate of each operator during the previous working period, the number of equipment allocated to each operator is obtained; wherein, the greater the corresponding release survival rate of each operator during the previous working period, the greater the number of equipment allocated;

[0027] The device allocation module is used to allocate the number of semiconductor manufacturing devices to be controlled to each operator from the semiconductor manufacturing devices to be controlled during the current working period; and send the device control interface corresponding to the semiconductor manufacturing devices to be controlled allocated to each operator to the control device corresponding to the operator, so that the control device controls the corresponding semiconductor manufacturing equipment to be controlled according to the operation of the operator in the device control interface.

[0028] In an optional embodiment, the semiconductor manufacturing equipment allocation device further includes a lead-in survival rate acquisition module;

[0029] The release survival rate acquisition module is used to obtain the release survival rate of each operator after performing control operations on each assigned semiconductor manufacturing equipment to be controlled after the current working period ends; according to the release survival rate of each operator after performing control operations on each assigned semiconductor manufacturing equipment to be controlled, determine the release survival rate corresponding to each operator during the current working period.

[0030] In a third aspect, the present invention provides a server, comprising a processor and a memory, wherein the memory stores a computer program executable by the processor, and the computer program executable by the processor is used to implement the semiconductor manufacturing equipment allocation method described in any of the aforementioned embodiments.

[0031] In a fourth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, the semiconductor manufacturing equipment allocation method as described in any one of the aforementioned embodiments is implemented.

[0032] The semiconductor manufacturing equipment allocation method, device, server and storage medium provided by the embodiment of the present invention include: obtaining the number of semiconductor manufacturing equipment to be controlled during the current working period, obtaining the number of equipment allocated to each operator according to the number of semiconductor manufacturing equipment to be controlled and the corresponding lead-out survival rate of each operator during the previous working period; wherein, the greater the lead-out survival rate corresponding to each operator during the previous working period, the greater the number of equipment allocated, and from the semiconductor manufacturing equipment to be controlled during the current working period, respectively allocating the number of semiconductor manufacturing equipment to be controlled to each operator, sending the device control interface corresponding to the semiconductor manufacturing equipment to be controlled allocated to each operator to the control device corresponding to the operator, so that the control device controls the corresponding semiconductor manufacturing equipment to be controlled according to the operation of the operator in the device control interface. By allocating semiconductor manufacturing equipment to be controlled to each operator according to the historical performance of each operator, the operator with a greater lead-out survival rate controls more semiconductor manufacturing equipment to be controlled, thereby improving the lead-out survival rate of the entire workshop. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 A schematic diagram showing an application environment of a semiconductor manufacturing equipment method provided by an embodiment of the present invention is shown;

[0035] Figure 2 A schematic flow chart of a semiconductor manufacturing equipment method provided by an embodiment of the present invention is shown;

[0036] Figure 3 Another schematic diagram of a process of a semiconductor manufacturing device method provided by an embodiment of the present invention is shown;

[0037] Figure 4 Another schematic flow chart of a semiconductor manufacturing equipment method provided by an embodiment of the present invention is shown;

[0038] Figure 5 Another schematic diagram of a process of a semiconductor manufacturing device method provided by an embodiment of the present invention is shown;

[0039] Figure 6 A module block diagram of a semiconductor manufacturing equipment allocation device provided by an embodiment of the present invention is shown;

[0040] Figure 7 A block diagram of a server provided by an embodiment of the present invention is shown.

[0041] Icons: 100 - server; 110 - memory; 120 - processor; 130 - communication module; 200 - control device; 300 - semiconductor manufacturing equipment; 400 - semiconductor manufacturing equipment allocation device; 410 - equipment quantity acquisition module; 420 - equipment allocation module. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0043] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0045] See also Figure 1 , Figure 1A schematic diagram of an application environment of the semiconductor manufacturing equipment allocation method provided by an embodiment of the present invention is shown. The server 100, multiple control devices 200, and multiple semiconductor manufacturing equipment 300 are all located in a network, and the server 100 can communicate and connect with the multiple control devices 200 to achieve data interaction between the server 100 and the multiple control devices 200. As a way, the server 100 and multiple control devices 200 can be connected via WIFI, ZigBee, 2G / 3G / 4G / 5G, which is not limited here.

[0046] The control device 200 may include a computer, a programmable logic controller, a tablet computer, or other device that can control semiconductor manufacturing equipment, which is not limited here.

[0047] Each control device 200 can be connected to multiple semiconductor manufacturing equipment 300 for communication, so that the control device 200 sends control instructions to the semiconductor manufacturing equipment 300. As a way, the control device 200 and the multiple semiconductor manufacturing equipment 300 can be connected via WIFI, ZigBee, 2G / 3G / 4G / 5G, which is not limited here.

[0048] The semiconductor manufacturing equipment 300 may include a single crystal furnace, a crucible, and a chemical vapor deposition equipment, etc., which are not limited here. The semiconductor manufacturing equipment to be controlled is the semiconductor manufacturing equipment 300 that the operator needs to control during the current working period.

[0049] See also Figure 2 , Figure 2 A schematic diagram of a process flow of a semiconductor manufacturing equipment allocation method provided by an embodiment of the present invention is shown. The semiconductor manufacturing equipment allocation method can be applied to a server, which is in communication connection with a plurality of control devices. The server stores the release survival rate of each operator after performing control operations on the semiconductor manufacturing equipment during the previous working period. The specific process of this embodiment is described below using the server as an example. Figure 2 The process shown is described in detail, and the semiconductor manufacturing equipment allocation method may specifically include the following steps:

[0050] Step 110: Obtain the number of semiconductor manufacturing equipment to be controlled during the current working period.

[0051] The working period may be the shift time of the operator. For example, if one shift of the operator is 12 hours, the current working period may be from 8:00 to 20:00.

[0052] In some implementations, the operator may input the number of semiconductor manufacturing equipment to be controlled during the current working period into the server, and the server acquires the number of semiconductor manufacturing equipment to be controlled during the current working period.

[0053] In some embodiments, the server may be in communication connection with a plurality of semiconductor manufacturing devices, and the server may detect the status of each semiconductor manufacturing device. The server determines the semiconductor manufacturing devices detected as being in the startup state during the current working period as the semiconductor manufacturing devices to be controlled, and the server counts the number of semiconductor manufacturing devices to be controlled to obtain the number of semiconductor manufacturing devices to be controlled during the current working period.

[0054] Step 120: According to the number of semiconductor manufacturing equipment to be controlled and the corresponding lead-out survival rate of each operator during the previous work period, the number of equipment allocated to each operator is obtained.

[0055] Among them, the greater the corresponding release survival rate of each operator during the previous work period, the more equipment is allocated.

[0056] It is understandable that allocating more semiconductor manufacturing equipment to be controlled to operators with higher release survival rates can ensure that these semiconductor manufacturing equipment to be controlled are controlled by operators with more experience and technical level. In addition, operators with low release survival rates are allocated fewer semiconductor manufacturing equipment to be controlled and the value obtained by the operators is lower. Therefore, it can promote competition among operators within the workshop, thereby improving the operating level of the operators and then improving the overall production efficiency.

[0057] The seeding survival rate reflects the probability of successfully growing high-quality single crystals during the seeding and shouldering process. Specifically, the seeding survival rate measures the proportion of operators who can successfully introduce seed crystals into molten silicon and smoothly grow single crystals that meet quality standards during the working period. That is, the seeding survival rate corresponding to the operator's previous working period is the ratio of the number of crystals successfully grown during the previous working period to the total number of crystals grown during the previous working period.

[0058] For example, an operator attempts to grow single crystals 10 times in a work cycle, and successfully grows single crystals that meet quality standards 8 times. The operator's placement survival rate is 80%.

[0059] In some methods, the server can calculate the equipment quantity weight corresponding to each operator based on the corresponding release survival rate of each operator during the previous work period, and obtain the equipment quantity allocated to each operator based on the equipment quantity weight of each operator and the number of semiconductor manufacturing equipment to be controlled.

[0060] For example, the number of semiconductor manufacturing equipment to be controlled is 10, the lead-in and release survival rate of operator A during the previous working period is 85%, the lead-in and release survival rate of operator B during the previous working period is 70%, and the lead-in and release survival rate of operator C during the previous working period is 90%. The equipment quantity weight corresponding to each operator is calculated. The equipment quantity weight of operator A is 0.3 (85 / (85+70+90)≈0.3), the equipment quantity weight of operator B is 0.3 (70 / (85+70+90)≈0.3), and the equipment quantity weight of operator C is 0.3 (90 / (85+70+90)≈0.4). Then, the number of equipment allocated to operator A is 3 (10*0.3=3), the number of equipment allocated to operator B is 3 (10*0.3=3), and the number of equipment allocated to operator C is 4 (10*0.4=4).

[0061] Step 130: Allocate a number of semiconductor manufacturing equipment to be controlled to each operator from the semiconductor manufacturing equipment to be controlled during the current working period.

[0062] For example, the semiconductor manufacturing equipment to be controlled during the current working period includes semiconductor manufacturing equipment 1 to be controlled, semiconductor manufacturing equipment 2 to be controlled, and semiconductor manufacturing equipment 3 to be controlled. The number of equipment allocated to operator A is 2. Two equipments are selected from semiconductor manufacturing equipment 1 to be controlled, semiconductor manufacturing equipment 2 to be controlled, and semiconductor manufacturing equipment 3 to be controlled, and semiconductor manufacturing equipment 1 to be controlled and semiconductor manufacturing equipment 3 to be controlled are allocated to operator A; the number of equipment allocated to operator B is 1. One equipment is selected from semiconductor manufacturing equipment 1 to be controlled, semiconductor manufacturing equipment 2 to be controlled, and semiconductor manufacturing equipment 3 to be controlled, and semiconductor manufacturing equipment 2 to be controlled is allocated to operator B.

[0063] Step 140: Send the device control interface corresponding to the semiconductor manufacturing device to be controlled assigned to each operator to the control device corresponding to the operator, so that the control device controls the corresponding semiconductor manufacturing device to be controlled according to the operator's operation in the device control interface.

[0064] In some embodiments, the server sends the device control interface corresponding to the semiconductor manufacturing equipment to be controlled assigned to each operator to the control device corresponding to the operator, and at the same time sends the device address of the semiconductor manufacturing equipment to be controlled corresponding to the device control interface to the control device corresponding to the operator. The control device can control the semiconductor manufacturing equipment to be controlled corresponding to the device address of the device control interface controlled by the operator.

[0065] The semiconductor manufacturing equipment allocation method provided by the embodiment of the present invention obtains the number of semiconductor manufacturing equipment to be controlled during the current working period, obtains the number of equipment allocated to each operator according to the number of semiconductor manufacturing equipment to be controlled and the corresponding lead-out survival rate of each operator during the previous working period, wherein the greater the lead-out survival rate corresponding to each operator during the previous working period, the greater the number of equipment allocated, and allocates the number of semiconductor manufacturing equipment to be controlled to each operator from the semiconductor manufacturing equipment to be controlled during the current working period, and sends the device control interface corresponding to the semiconductor manufacturing equipment to be controlled allocated to each operator to the control device corresponding to the operator, so that the control device controls the corresponding semiconductor manufacturing equipment to be controlled according to the operation of the operator in the device control interface. By allocating semiconductor manufacturing equipment to be controlled to each operator according to the historical performance of each operator, the operator with a greater lead-out survival rate is assigned a greater number of semiconductor manufacturing equipment to be controlled, thereby improving the lead-out survival rate of the entire workshop.

[0066] To increase the flexibility of semiconductor manufacturing equipment allocation, such as Figure 3 As shown, the semiconductor manufacturing equipment allocation method further includes the following steps:

[0067] Step 150: After the current working period ends, the release survival rate after each operator performs the control operation on each assigned semiconductor manufacturing equipment to be controlled is obtained.

[0068] In some embodiments, a plurality of sensors are provided on the semiconductor manufacturing equipment, and these sensors are used to monitor various data when the semiconductor manufacturing equipment to be controlled performs seeding and shouldering operations in real time. The sensors installed on each semiconductor manufacturing equipment transmit the data collected during operation to the server in real time, and the server can calculate the seeding and shouldering survival rate of each operator after finishing controlling the semiconductor manufacturing equipment assigned to them based on these data.

[0069] Step 160: Determine the lead-in survival rate corresponding to each operator during the current work period according to the lead-in survival rate after each operator performs the control operation on each semiconductor manufacturing equipment to be controlled.

[0070] In some embodiments, the server can calculate the release survival rate of each operator after performing control operations on all assigned semiconductor manufacturing equipment to be controlled, obtain the mean survival rate corresponding to each operator during the current work period, and determine the mean survival rate corresponding to each operator during the current work period as the release survival rate corresponding to each operator during the current work period.

[0071] For example, the semiconductor manufacturing equipment to be controlled assigned to operator A are semiconductor manufacturing equipment 1 to be controlled and semiconductor manufacturing equipment 2 to be controlled, and the semiconductor manufacturing equipment to be controlled assigned to operator B is semiconductor manufacturing equipment 3 to be controlled. The release survival rate of operator A after performing a control operation on semiconductor manufacturing equipment 1 to be controlled is 80%, the release survival rate of operator A after performing a control operation on semiconductor manufacturing equipment 2 to be controlled is 82%, and the release survival rate of operator B after performing a control operation on semiconductor manufacturing equipment 3 to be controlled is 90%. The corresponding average survival rate during the current working period of operator A is 81% ((80%+82%) / 2=81%), and the corresponding average survival rate during the current working period of operator B is 90%. Therefore, the release survival rate of operator A during the current working period is 81%, and the release survival rate of operator B during the current working period is 90%.

[0072] It can be understood that by evaluating the performance of the operator after the end of the current working period, the next allocation of semiconductor manufacturing equipment to be controlled will be made according to the performance of each operator during the current working period. The number of semiconductor manufacturing equipment to be controlled allocated to each operator can be dynamically adjusted at the beginning of each new working period, thereby improving the flexibility of semiconductor manufacturing equipment allocation and achieving improved overall performance.

[0073] In order to improve the fairness of semiconductor manufacturing equipment allocation, such as Figure 4 As shown, step 120: specifically also includes:

[0074] Step 121: sorting the release survival rates corresponding to all operators during the previous working period to obtain sorting information.

[0075] Step 122: Determine the number of equipment assigned to each operator based on the number of semiconductor manufacturing equipment to be controlled and the sorting information.

[0076] In some implementations, the corresponding lead-out survival rates of all operators during the previous working period are sorted in descending order to obtain sorting information, and the number of devices assigned to each operator is determined according to the number of semiconductor manufacturing devices to be controlled and the sorting information. The operator who is at the front in the sorting information is assigned a larger number of devices.

[0077] For example, the number of semiconductor manufacturing equipment to be controlled is 8, the lead-in and release survival rate of operator A in the last working period is 83%, the lead-in and release survival rate of operator B in the last working period is 75%, the lead-in and release survival rate of operator C in the last working period is 90%, and the lead-in and release survival rate of operator D in the last working period is 65%. The lead-in and release survival rates corresponding to all operators in the last working period are sorted in descending order, and the sorting information obtained is the lead-in and release survival rate of operator C in the last working period is 90%, the lead-in and release survival rate of operator A in the last working period is 83%, the lead-in and release survival rate of operator B in the last working period is 70%, and the lead-in and release survival rate of operator D in the last working period is 65%. The number of equipment allocated to operator C (90%) is 4, the number of equipment allocated to operator A (83%) is 3, the number of equipment allocated to operator B (75%) is 2, and the number of equipment allocated to operator D (65%) is 1.

[0078] In some implementations, the corresponding lead-out survival rates of all operators during the previous working period are sorted in ascending order to obtain sorting information, and the number of devices assigned to each operator is determined according to the number of semiconductor manufacturing devices to be controlled and the sorting information. The later the operator in the sorting information is, the more devices are assigned.

[0079] It is understandable that by introducing a ranking mechanism to allocate the number of equipment, the ranking mechanism provides a clear standard so that operators can clearly know how their performance affects the allocation of the number of equipment, reducing the uncertainty of subjective judgment and thus improving the fairness of semiconductor manufacturing equipment allocation.

[0080] In order to improve the survival rate of the operators, the operators with lower survival rate can be notified to learn, such as Figure 5 As shown, the semiconductor manufacturing equipment allocation method further includes the following steps:

[0081] Step 210: Determine the number of times the release survival rate is lower than a preset threshold value according to the release survival rate corresponding to each operator in the current working period and the release survival rate corresponding to each working period before the current working period.

[0082] For example, assuming that the preset threshold is 80%, the release survival rate corresponding to the operator in the current working period (24Q4) and the release survival rate corresponding to each working period before the current working period (24Q4) are shown in Table 1, then the number of times the release survival rate of the operator is lower than the preset threshold is 1 time.

[0083] Table 1

[0084] During work Release survival rate 24Q1 87％ 24Q2 82％ 24Q3 88％ 24Q4 79％

[0085] Step 220: If the number of times that the release survival rate is lower than the preset threshold exceeds the preset number, a learning notification message is generated, and the allocation of the semiconductor manufacturing equipment to be controlled to the corresponding operator is stopped.

[0086] It is understandable that if the number of times that the lead-out survival rate of the operator during multiple working periods is lower than the preset threshold exceeds the preset number, it indicates that the operator may have a low lead-out survival rate during multiple working periods due to non-standard operation. Therefore, the operator is promptly stopped from being assigned the semiconductor manufacturing equipment to be controlled, and the operator is notified to learn the operation. This improves the overall production efficiency and product quality. It also helps to improve the skills of the operator and promote the continuous improvement of product quality.

[0087] Step 230: Send the learning notification information to the control device corresponding to the operator to notify the corresponding operator to learn.

[0088] In some embodiments, the learning time and assessment score of the operator are obtained. If the learning time of the operator is greater than the preset learning time and the assessment score is greater than the passing score, the semiconductor manufacturing equipment to be controlled is assigned to the operator.

[0089] In some embodiments, each control device stores an operation learning video, and the device operator can watch the operation learning video in the corresponding control device. The control device counts the time the corresponding operator watches the operation learning video, obtains the operator's learning time, and sends the operator's learning time to the server.

[0090] In some implementations, an operator may perform an operation assessment in a corresponding control device, and the control personnel may generate an assessment score for the assessment and send the score to a server.

[0091] In order to improve the accuracy of detection personnel during the operation process, thereby improving the corresponding release survival rate of the operator, standard operating specifications are stored in the server. The above-mentioned semiconductor manufacturing equipment allocation method specifically also includes the following steps: monitoring the operator's operation on the equipment control interface. If the operator's operation on the equipment control interface does not conform to the standard operating specifications, an operation prompt message is generated and the operation prompt message is sent to the corresponding control device to prompt the corresponding operator to perform standardized operations.

[0092] The operation prompt information includes specific operations that do not comply with the specifications and correct operations.

[0093] For example: "Error: The operation parameter setting of operation A is out of the allowable range. Please set the parameter between 50-100."; "Error: The operation sequence is wrong. Please perform operation A first, then operation B.".

[0094] In some implementations, the control device may generate and display an operation prompt interface according to the received operation prompt information, and the prompt information is displayed in the operation prompt interface.

[0095] In some implementations, the control device is provided with a speaker, and the control device can generate an operation prompt voice according to the received operation prompt information, and the control device controls the effect to play the operation prompt voice.

[0096] In order to execute the corresponding steps in the above embodiments and various possible methods, a method for implementing a semiconductor manufacturing equipment allocation device is provided below. Figure 6 , FIG. 1 is a functional module diagram of a semiconductor manufacturing equipment allocation device provided by an embodiment of the present invention. It should be noted that the basic principle and technical effects of the semiconductor manufacturing equipment allocation device provided by this embodiment are the same as those of the above-mentioned embodiments. For the sake of brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding contents in the above-mentioned embodiments. The semiconductor manufacturing equipment allocation device 400 includes: an equipment quantity acquisition module 410 and an equipment allocation module 420, wherein:

[0097] The equipment quantity acquisition module 410 is used to obtain the number of semiconductor manufacturing equipment to be controlled during the current working period; according to the number of semiconductor manufacturing equipment to be controlled and the corresponding lead-in survival rate of each operator during the previous working period, the number of equipment allocated to each operator is obtained; wherein, the greater the corresponding lead-in survival rate of each operator during the previous working period, the greater the number of equipment allocated.

[0098] The equipment allocation module 420 is used to allocate a number of semiconductor manufacturing equipment to be controlled to each operator from the semiconductor manufacturing equipment to be controlled during the current working period; and send the equipment control interface corresponding to the semiconductor manufacturing equipment to be controlled allocated to each operator to the control device corresponding to the operator, so that the control device controls the corresponding semiconductor manufacturing equipment to be controlled according to the operator's operation in the equipment control interface.

[0099] Optionally, the semiconductor manufacturing equipment allocation device 400 further includes a lead-in and release survival rate acquisition module, wherein:

[0100] The lead-in survival rate acquisition module is used to obtain the operation success rate corresponding to the lead-in survival rate after each operator performs a control operation on each assigned semiconductor manufacturing equipment to be controlled after the current working period ends; according to the lead-in survival rate after each operator performs a control operation on each assigned semiconductor manufacturing equipment to be controlled, determine the lead-in survival rate corresponding to each operator in the current working period.

[0101] Optionally, the equipment quantity acquisition module 410 is further used to sort the corresponding release survival rates of all operators during the previous work period to obtain sorting information; and determine the number of equipment allocated to each operator according to the number of semiconductor manufacturing equipment to be controlled and the sorting information.

[0102] Optionally, the semiconductor manufacturing equipment allocation device 400 further includes: a learning notification module, wherein:

[0103] A learning notification module is used to determine the number of times the lead-in survival rate is lower than a preset threshold value based on the lead-in survival rate corresponding to each operator in the current working period and the lead-in survival rate corresponding to each working period before the current working period; if the number of times the lead-in survival rate is lower than the preset threshold value exceeds the preset number, a learning notification message is generated, and the allocation of the semiconductor manufacturing equipment to be controlled to the corresponding operator is stopped; and the learning notification message is sent to the control device corresponding to the operator to notify the corresponding operator to learn.

[0104] Optionally, the semiconductor manufacturing equipment allocation device 400 further includes: an operation detection module, wherein:

[0105] The operation detection module is also specifically used to obtain the operator's learning time and assessment score; if the operator's learning time is greater than the preset learning time and the assessment score is greater than the passing score, the operator is assigned to the semiconductor manufacturing equipment to be controlled.

[0106] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described devices and modules can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here.

[0107] In several embodiments provided by the present invention, the coupling between modules may be electrical, mechanical or other forms of coupling.

[0108] In addition, each functional module in each embodiment of the present invention may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of software functional modules.

[0109] Please refer to Figure 7 , is a block diagram of a server 100 provided in an embodiment of the present invention. The server 100 includes a memory 110, a processor 120, and a communication module 130. The memory 110, the processor 120, and the communication module 130 are electrically connected to each other directly or indirectly to achieve data transmission or interaction. For example, these components can be electrically connected to each other through one or more communication buses or signal lines.

[0110] The memory 110 is used to store programs or data. The memory 110 may be, but is not limited to, a random access memory (RAM), a read only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), etc.

[0111] The processor 120 is used to read / write data or programs stored in the memory and execute corresponding functions. For example, when the computer program stored in the memory 110 is executed by the processor 120, the semiconductor manufacturing equipment allocation method disclosed in the above embodiments can be implemented.

[0112] The communication module 130 is used to establish a communication connection between the server 100 and the control device through a network, and to send and receive data through the network.

[0113] It should be understood that Figure 7 The structure shown is only a schematic diagram of the server structure. The server may also include Figure 7 More or fewer components may be shown. Figure 7 Each component shown in the figure can be implemented by hardware, software or a combination thereof.

[0114] An embodiment of the present invention further provides a computer-readable storage medium, in which a computer program is stored. When the computer program can be executed by a processor, the semiconductor manufacturing equipment allocation method described in the above method embodiment is implemented.

[0115] The computer-readable storage medium may be an electronic memory such as a flash memory, an EEPROM (electrically erasable programmable read-only memory), an EPROM, a hard disk, or a ROM. Optionally, the computer-readable storage medium includes a non-transitory computer-readable storage medium. The computer-readable storage medium has storage space for program codes that execute any of the method steps in the above method. These program codes can be read from or written to one or more computer program products. The program code can be compressed, for example, in an appropriate form.

[0116] In several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and a module, a program segment or a part of the code contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0117] If the function is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0118] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor manufacturing equipment allocation method, characterized in that: The method is applied to a server, the server is in communication connection with a plurality of control devices, and the server stores the release survival rate after each operator performs control operations on the semiconductor manufacturing equipment during the previous working period; the method comprises: Obtaining the number of semiconductor manufacturing equipment to be controlled during the current working period; According to the number of the semiconductor manufacturing equipment to be controlled and the corresponding lead-out survival rate of each operator during the previous working period, the number of equipment allocated to each operator is obtained; wherein, the greater the corresponding lead-out survival rate of each operator during the previous working period, the greater the number of equipment allocated; From the semiconductor manufacturing equipment to be controlled during the current working period, respectively allocating the number of semiconductor manufacturing equipment to be controlled to each operator; The device control interface corresponding to the semiconductor manufacturing device to be controlled assigned to each operator is sent to the control device corresponding to the operator, so that the control device controls the corresponding semiconductor manufacturing device to be controlled according to the operation of the operator in the device control interface.

2. The method according to claim 1, characterized in that The method further comprises: After the current working period ends, obtaining the release survival rate after each operator performs the control operation on each semiconductor manufacturing equipment to be controlled; The corresponding release survival rate of each operator during the current working period is determined according to the release survival rate after each operator performs control operations on each semiconductor manufacturing equipment to be controlled.

3. The method according to claim 1, characterized in that The step of obtaining the number of equipment assigned to each operator according to the number of the semiconductor manufacturing equipment to be controlled and the corresponding release survival rate of each operator during the previous working period includes: Sorting the release survival rates corresponding to all the operators during the previous working period to obtain sorting information; The number of devices assigned to each operator is determined according to the number of semiconductor manufacturing devices to be controlled and the sorting information.

4. The method according to claim 2, characterized in that: The method further comprises: Determine the number of times the release survival rate is lower than a preset threshold value according to the release survival rate corresponding to the current working period and the release survival rate corresponding to each working period before the current working period for each operator; If the number of times that the lead-in survival rate is lower than the preset threshold exceeds the preset number, a learning notification message is generated, and the allocation of the semiconductor manufacturing equipment to be controlled to the corresponding operator is stopped; The learning notification information is sent to the control device corresponding to the operator to notify the corresponding operator to perform learning.

5. The method according to claim 4, characterized in that The method further comprises: Obtaining the learning time and assessment score of the operator; If the learning time of the operator is greater than the preset learning time, and the assessment score is greater than the passing score, the semiconductor manufacturing equipment to be controlled is assigned to the operator.

6. The method according to claim 1, characterized in that The server stores standard operating specifications, and the method further includes: Monitoring the operation of the operator on the device control interface; If the operation of the operator on the device control interface does not conform to the standard operation specification, an operation prompt message is generated and sent to the corresponding control device to prompt the corresponding operator to perform the standard operation.

7. A semiconductor manufacturing equipment distribution device, characterized in that: Applied to a server, the server is connected to a plurality of control devices in communication, and the server stores the release survival rate of each operator after performing control operations on semiconductor manufacturing equipment during the previous working period; the device comprises: The equipment quantity acquisition module is used to obtain the number of semiconductor manufacturing equipment to be controlled during the current working period; according to the number of semiconductor manufacturing equipment to be controlled and the corresponding release survival rate of each operator during the previous working period, the number of equipment allocated to each operator is obtained; wherein, the greater the corresponding release survival rate of each operator during the previous working period, the greater the number of equipment allocated; The device allocation module is used to allocate the number of semiconductor manufacturing devices to be controlled to each operator from the semiconductor manufacturing devices to be controlled during the current working period; and send the device control interface corresponding to the semiconductor manufacturing devices to be controlled allocated to each operator to the control device corresponding to the operator, so that the control device controls the corresponding semiconductor manufacturing equipment to be controlled according to the operation of the operator in the device control interface.

8. The device according to claim 7, characterized in that The semiconductor manufacturing equipment allocation device also includes a lead-in survival rate acquisition module; The release survival rate acquisition module is used to obtain the release survival rate of each operator after performing control operations on each assigned semiconductor manufacturing equipment to be controlled after the current working period ends; according to the release survival rate of each operator after performing control operations on each assigned semiconductor manufacturing equipment to be controlled, determine the release survival rate corresponding to each operator during the current working period.

9. A server, characterized in that: The invention comprises a processor and a memory, wherein the memory stores a computer program executable by the processor, and the computer program executable by the processor is used to implement the semiconductor manufacturing equipment allocation method according to any one of claims 1 to 6.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the semiconductor manufacturing equipment allocation method according to any one of claims 1 to 6 is implemented.

Images