Micro-channel porous heat dissipation structure with Thiessen polygonal protrusions

Abstract

The invention belongs to the technical field of heat dissipation, and particularly relates to a micro-channel porous heat dissipation structure with Thiessen polygonal protrusions. The structure comprises a shell and a micro-channel porous heat dissipation core wrapped in the shell. The micro-channel porous heat dissipation core body is formed by a plurality of Gyandroid type porous cell elements in an array mode, and each Gyandroid type porous cell element comprises a Gyandroid type porous framework and Thiessen polygonal protrusions distributed on the wall face of the Gyandroid type porous framework. The upper side wall and the lower side wall of the micro-channel porous heat dissipation core make sealed contact with the inner wall of the shell, the left side wall and the right side wall make sealed contact with the inner wall of the shell at intervals to form a first flow channel, the front side wall and the rear side wall make sealed contact with the inner wall of the shell at intervals to form a second flow channel, and the first flow channel and the second flow channel intersect with each other but do not communicate with each other. The two flow channels are used for flowing of cold fluid and hot fluid respectively. While the contact area is obviously increased, the Thiessen polygonal protrusions play a role in disturbing fluid flowing, the speed boundary layer and the temperature boundary layer of fluid are effectively damaged, and the convection heat exchange effect is enhanced.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of semiconductor equipment, and in particular to a micro-channel porous heat dissipation structure with Thiessen polygon protrusions. Background Art

[0002] High-performance electronic devices such as integrated circuits and semiconductor chips generate a lot of heat when operating at high frequency and high power. If the heat cannot be dissipated in a timely and effective manner, the equipment will not only face problems such as performance degradation and shortened life, but may even suffer thermal failure, leading to serious malfunctions. Although traditional microchannel radiators have improved the heat transfer performance to a certain extent by increasing the surface area of ​​the channel, due to the inherent limitations of their structural design, it is still difficult to achieve ideal heat transfer effects under high power density conditions. Specifically, the unevenness of fluid flow and the excessive thickness of the thermal boundary layer significantly restrict the improvement of heat transfer efficiency, which not only leads to uneven heat dissipation and easily gathers into hot spots on the surface of the equipment, but also limits the stability and reliability of the overall heat dissipation system, making its application in high-performance electronic equipment less than satisfactory.

[0003] As a three-periodic minimal surface, the Gyroid porous structure has a high degree of symmetry and complex three-dimensional geometric characteristics. It can achieve a large surface area to volume ratio in a limited space, provide excellent fluid guidance and uniform flow path, and thus theoretically have significant heat dissipation potential. Although the Gyroid porous structure can increase the heat exchange area, the unevenness and low flow rate of the fluid in the tiny heat dissipation channel can easily lead to a thicker thermal boundary layer, thereby increasing the resistance to heat transfer and limiting the heat dissipation effect. High power density means that the heat generated per unit area is very concentrated, which is easy to form local hot spots, resulting in uneven heat distribution, which will seriously affect the heat dissipation effect. Therefore, the traditional Gyroid porous radiator still cannot achieve satisfactory results under high power density conditions. For example, the invention application with application number 202410166457.3 discloses a lattice structure power module radiator. Although its original design intention is to improve the heat dissipation efficiency by increasing the surface area, in actual applications, due to the failure to effectively destroy the thermal boundary layer, the heat transfer efficiency is still low, especially in high power density application environments, the heat dissipation effect is still insufficient. Therefore, the present invention proposes a micro-channel porous heat dissipation structure with Thiessen polygon protrusions. Summary of the invention

[0004] In view of the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a micro-channel porous heat dissipation structure with Thiessen polygon protrusions.

[0005] The technical solution adopted by the present invention to solve the technical problem is:

[0006] A microchannel porous heat dissipation structure with Thiessen polygon protrusions comprises a shell and a microchannel porous heat dissipation core wrapped in the shell; the microchannel porous heat dissipation core is formed by a plurality of Gyroid porous cell arrays, and the Gyroid porous cell comprises a Gyroid porous skeleton and Thiessen polygon protrusions distributed on the wall surface of the Gyroid porous skeleton; the upper and lower side walls of the microchannel porous heat dissipation core are in sealed contact with the inner wall of the shell, the left and right side walls are in sealed contact with the inner wall of the shell to form a first flow channel, and the front and rear side walls are in sealed contact with the inner wall of the shell to form a second flow channel, the first flow channel and the second flow channel intersect with each other but are not connected to each other, and the two flow channels are respectively used for the flow of cold and hot fluids.

[0007] Furthermore, the porosity of the microchannel porous heat dissipation core is 0.75-0.95, and the wall thickness is 0.8-1.0 mm.

[0008] Furthermore, the height of the Thiessen polygon protrusion is 0.2-0.4 mm.

[0009] Compared with the prior art, the present invention has the following beneficial effects:

[0010] The present invention is an improvement on the Gyroid-type porous heat dissipation structure. Thiessen polygon protrusions are added to the surface of the original structure, which greatly increases the specific surface area of ​​the heat dissipation structure, significantly increases the contact area between the fluid and the wall, and improves the heat dissipation efficiency. The special geometric shape of the Thiessen polygon protrusions can effectively promote the turbulence and mixing effects of the fluid, increase the heat transfer rate, and achieve more efficient heat exchange. At the same time, the Thiessen polygon protrusions have a disturbing effect on the fluid flow, accelerate the fluid to flush the wall of the heat dissipation structure, thereby increasing the frontal area, effectively destroying the velocity boundary layer and the temperature boundary layer, and strengthening the convective heat transfer effect, thereby improving the overall heat exchange efficiency.

[0011] The microchannel porous heat dissipation structure of the present invention not only has efficient heat exchange performance, but also has the advantages of structural safety and light weight. It is suitable for the heat dissipation needs of various high-power density electronic equipment, such as semiconductor devices, power modules and high-performance computing equipment, etc. It can effectively solve the problem of local temperature rise, extend the service life of the equipment, and improve the stability and reliability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is the overall structure diagram of the present invention;

[0013] Figure 2 It is a structural diagram of the microchannel porous heat dissipation core of the present invention;

[0014] Figure 3 is a structural diagram of the Gyroid type porous cell of the present invention;

[0015] Figure 4 Schematic diagram of fluid flow at Z=6 mm in an embodiment of the present invention;

[0016] Figure 5 Schematic diagram of fluid flow at Y=6 mm in an embodiment of the present invention;

[0017] Figure 6 Schematic diagram of fluid flow at X=6 mm in an embodiment of the present invention;

[0018] Figure 7 is a comparison diagram of convective heat transfer coefficients of the embodiment of the present invention and the prior art at different Reynolds numbers;

[0019] In the figure, 1-Gyroid type porous skeleton; 2-Thiessen polygon protrusion; 3-shell; 4-cold fluid; 5-hot fluid. DETAILED DESCRIPTION

[0020] Specific embodiments are given below in conjunction with the accompanying drawings. The specific embodiments are only used to introduce the technical solutions of the present invention in detail, but are not intended to limit the protection scope of the present application.

[0021] See also Figures 1 to 7 The present invention provides a microchannel porous heat dissipation structure with Thiessen polygon protrusions, comprising a shell 3 and a microchannel porous heat dissipation core wrapped in the shell 3; the microchannel porous heat dissipation core is formed by a plurality of Gyroid-type porous cells arrayed in space, the Gyroid-type porous cells comprising a Gyroid-type porous skeleton 1 and Thiessen polygon protrusions 2 distributed on the wall surface of the Gyroid-type porous skeleton 1; the upper and lower side walls of the microchannel porous heat dissipation core are in sealed contact with the inner wall of the shell 3, the left and right side walls are in sealed contact with the inner wall of the shell 3 to form a first flow channel, the front and rear side walls are in sealed contact with the inner wall of the shell 3 to form a second flow channel, the first flow channel and the second flow channel intersect with each other but are not connected to each other, the first flow channel is used for the flow of a cold fluid 4, and the second flow channel is used for the flow of a hot fluid 5.

[0022] The porosity of the microchannel porous heat dissipation core is 0.75-0.95, which is designed to optimize fluid flow and heat exchange efficiency while ensuring structural strength. A higher porosity can not only increase the effective heat exchange area, improve fluid flow characteristics, and reduce flow resistance, but also enhance heat conduction capacity, ensuring that the radiator still maintains good heat dissipation performance in a compact design.

[0023] The wall thickness of the microchannel porous heat dissipation core is 0.8 to 1.0 mm. In semiconductor equipment, the radiator needs to withstand high temperature and high pressure working conditions, and the wall thickness of the microchannel porous heat dissipation core is one of the key factors to ensure the overall structural strength and durability of the radiator. Therefore, the wall thickness needs to ensure sufficient mechanical strength to resist external pressure, and avoid thermal stress concentration and premature failure caused by too thin a wall.

[0024] The height of the Thiessen polygon protrusion 2 is 0.2-0.4 mm; the Thiessen polygon protrusion 2 can increase the heat exchange area and promote the contact between the fluid and the wall of the microchannel porous heat dissipation core. Considering that a higher protrusion will cause the fluid to produce a greater flow resistance, when designing the protrusion height, while considering enhancing the heat exchange effect, it is also necessary to maintain a lower flow resistance so as not to hinder the smooth flow of the fluid.

[0025] The working principle and workflow of the present invention are:

[0026] Gyroid porous surface is a three-periodic minimal surface with characteristics such as periodicity, self-similarity and minimal surface. Gyroid porous surface can form a complex topological structure in three-dimensional space in the form of cells, and has the advantages of lightweight and high surface-to-body ratio, so it can improve the heat dissipation efficiency of the radiator. The Thiessen polygon protrusions have the characteristics of irregular shape and non-uniform directionality, which not only increases the heat exchange area, but also the fluid constantly collides with the Thiessen polygon protrusions during the flow process, which promotes the turbulence and mixing effect of the fluid, enhances the disturbance of the fluid, and further enhances the ability to destroy the thermal boundary layer, which can significantly enhance the convective heat exchange between the fluid and the flow channel wall, and effectively improve the heat exchange efficiency.

[0027] Example

[0028] like Figure 2 As shown, the microchannel porous heat dissipation core of this embodiment is composed of Gyroid type porous cells arranged in a 3×3×1 manner, the length, width and height of the Gyroid type porous cells are all 16 mm, the porosity of the microchannel porous heat dissipation core is 0.82, the wall thickness of the microchannel porous heat dissipation core is 0.9 mm, and the height of the Thiessen polygon protrusion 2 is 0.3 mm.

[0029] The heat exchange control method of the microchannel porous heat dissipation structure is:

[0030] Get the inlet temperature T of the cold fluid cold,in , outlet temperature T cold,out and mass flow rate m cold , the inlet temperature of the hot fluid T hot,in , outlet temperature T hot,out and mass flow rate m hot ; Calculate the heat transfer rate Q of the cold fluid according to the following formula cold and the heat transfer rate Q of the hot fluid hot :

[0031] Q cold =C cold ×m cold ×|T cold,in -T cold,out|

[0032] Q hot =C hot ×m hot ×|T hot,in -T hot,out |

[0033] In the formula, C cold , C hot denote the specific heat capacity of cold and hot fluids respectively;

[0034] The average heat transfer rate Q of the microchannel porous heat dissipation core is calculated according to the following formula avg :

[0035]

[0036] The logarithmic mean temperature difference LMTD of the microchannel porous heat dissipation core is calculated according to the following formula:

[0037]

[0038] Finally, the convective heat transfer coefficient U of the microchannel porous heat dissipation core is calculated according to the following formula:

[0039]

[0040] Where A represents the total heat exchange area of ​​the microchannel porous heat dissipation core.

[0041] Figure 7 The figure compares the convective heat transfer coefficients of the microchannel porous heat dissipation core of the present invention and the prior art at different Reynolds numbers. The prior art refers to a microchannel porous heat dissipation core that adopts a Gyroid-type porous structure but has no protrusions designed on the core. As can be seen from the figure, when the Reynolds number of the cold fluid is a constant, as the Reynolds number of the hot fluid increases, the convective heat transfer coefficient gradually increases, and the maximum convective heat transfer coefficient is obtained at a hot fluid Reynolds number of 8900. The maximum convective heat transfer coefficient of the present invention is significantly higher than that of the prior art, and the improvement rate of the maximum convective heat transfer coefficient is 8.3%, indicating that the microchannel porous heat dissipation core of the present invention has a better heat dissipation effect.

[0042] Any matters not described in the present invention are applicable to the prior art.

Claims

1. A microchannel porous heat dissipation structure with Thiessen polygon protrusions, comprising a shell and a microchannel porous heat dissipation core wrapped in the shell; characterized in that: The microchannel porous heat dissipation core is composed of a plurality of Gyroid porous cell arrays, wherein the Gyroid porous cell includes a Gyroid porous skeleton and Thiessen polygonal protrusions distributed on the wall surface of the Gyroid porous skeleton; the upper and lower side walls of the microchannel porous heat dissipation core are in sealed contact with the inner wall of the shell, the left and right side walls are in sealed contact with the inner wall of the shell at intervals to form a first flow channel, and the front and rear side walls are in sealed contact with the inner wall of the shell at intervals to form a second flow channel, the first flow channel and the second flow channel intersect with each other but are not connected to each other, and the two flow channels are respectively used for the flow of cold and hot fluids.

2. The microchannel porous heat dissipation structure with Thiessen polygon protrusions according to claim 1, characterized in that: The porosity of the microchannel porous heat dissipation core is 0.75-0.95, and the wall thickness is 0.8-1.0 mm.

3. The microchannel porous heat dissipation structure with Thiessen polygon protrusions according to claim 1, characterized in that: The height of the Thiessen polygon protrusion is 0.2-0.4 mm.

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