A combined modular 5g communication unit and method of installation thereof

Abstract

This invention relates to the field of 5G communication unit technology, and more particularly to a modular 5G communication unit and its installation method. The unit includes a module body, an antenna, a heat sink, and a heat fin. An antenna for signal transmission and reception is mounted on one side of the module body. A heat sink is fixedly connected to the upper end of the module body via connecting screws. A heat sink is integrally formed on the upper end of the heat sink. Shock-absorbing separation mechanisms are mounted on both sides of the heat sink. A cooling fan is mounted on the upper end of the shock-absorbing separation mechanism. A noise-absorbing hole is opened on the inner side of the cooling fan's outer shell. A flow-guiding mechanism is mounted in the middle of the upper end of the cooling fan. The flow-guiding mechanism includes a flow-guiding plate with a flow-guiding groove on its inner side. The shock-absorbing separation mechanism includes a threaded rod. In this invention, when the 5G communication unit is not working, the connecting column is positioned by an adjusting block, causing the shock-absorbing spring to separate from the cooling fan. This ensures that the shock-absorbing spring is in normal condition when the 5G communication unit is not working, effectively improving the service life of the shock-absorbing spring.

Description

Technical Field

[0001] This invention relates to the field of 5G communication unit technology, specifically to a modular 5G communication unit and its installation method. Background Technology

[0002] A modular 5G communication unit is a 5G communication device that combines multiple functional modules (such as communication modules, processing modules, antenna modules, and power modules) through modular design to meet specific application requirements. This design is highly flexible and allows modules to be replaced or upgraded according to different application scenarios, enabling rapid customization and expansion of functions.

[0003] For example, in the fields of industrial IoT, smart cities or autonomous driving, users can choose high-performance communication modules or add edge computing modules to process large amounts of data in real time. At the same time, the unit is easy to maintain and update. The modular design makes the system easy to replace or upgrade in the event of hardware failure or technology updates, extending the service life of the equipment and reducing the overall cost.

[0004] During operation, modular 5G communication units rely on cooling fans for heat dissipation. However, the vibration of these fans can affect the stability of the 5G communication unit and even damage it. Therefore, a vibration damping mechanism is used to connect the cooling fan to the 5G communication unit to address this issue. However, some 5G communication units installed on industrial testing equipment do not require continuous operation. Furthermore, the vibration damping springs inside the vibration damping mechanism are compressed even when the 5G communication unit is not in operation, affecting their lifespan. Therefore, this paper proposes a modular 5G communication unit and its installation method to address these problems. Summary of the Invention

[0005] The purpose of this invention is to provide a modular 5G communication unit and its installation method to solve the problem that during operation, the modular 5G communication unit uses a cooling fan for heat dissipation. However, the vibration of the cooling fan during operation can affect the stability of the 5G communication unit and even damage it. Therefore, a vibration damping mechanism is used to connect the cooling fan to the 5G communication unit to solve the above problem. However, some 5G communication units installed on industrial testing equipment do not need to operate continuously, and the vibration damping springs inside the vibration damping mechanism are in a compressed state when the 5G communication unit is not working, which affects the service life of the vibration damping springs.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A modular 5G communication unit and its installation method are disclosed, comprising a module body, an antenna, a heat sink, and a heat fin. An antenna for signal transmission and reception is mounted on one side of the module body. A heat sink is fixedly connected to the upper end of the module body via connecting screws. A heat sink is integrally formed on the upper end of the heat sink. Shock-absorbing separation mechanisms are mounted on both sides of the heat sink. A cooling fan is mounted on the upper end of each shock-absorbing separation mechanism. A noise reduction hole is formed on the inner side of the cooling fan's outer shell. A flow guiding mechanism is mounted in the middle of the upper end of the cooling fan. The flow guiding mechanism includes a flow guiding plate, and a flow guiding groove is formed on the inner side of the flow guiding plate. The vibration separation mechanism includes a threaded rod, which is fixedly connected to the main shafts at both ends of a dual-output shaft motor. The lower end of the dual-output shaft motor is fixedly connected to a positioning frame via bolts. The end of the threaded rod away from the dual-output shaft motor is connected to an adjustment mechanism. The adjustment mechanism includes an adjustment block, one end of which has a first inclined surface, and the other end of which has a second inclined surface. A threaded hole is provided at the lower end of the first inclined surface. A connecting column is provided at the upper end of the second inclined surface. A shock-absorbing spring is installed on the outer side of the upper end of the connecting column. The top end of the connecting column is fixedly connected to a shock-absorbing plate. The upper end of the shock-absorbing plate is fixedly connected to the outer shell of the cooling fan.

[0008] As a further optimization of the present invention, the flow guide groove opened on the inner side of the flow guide plate is located on the side close to the heat dissipation fan, the flow guide plate is U-shaped, and the upper end of the flow guide groove is arc-shaped.

[0009] As a further optimization of the present invention, the heat dissipation plate is provided in multiple parallel positions. Square holes are provided inside the heat dissipation plate on both sides. There are four square holes. A return spring is fixedly connected to the bottom end of each square hole. The upper end of the return spring is fixedly connected to the lifting rod. The lifting rod is welded and fixed to both sides of the cleaning mechanism.

[0010] As a further optimization of the present invention, the cleaning mechanism includes a cleaning frame with a connection hole inside, and the cleaning frame is adapted to the heat sink through the connection hole.

[0011] As a further optimization of the present invention, there are four lifting rods, each corresponding to a square hole. The lifting rod is in close contact with the adjusting block through a first inclined surface. The lifting rod is slidably connected to the square hole. Two reset springs are provided inside any one of the square holes.

[0012] As a further optimization of the present invention, the threaded rod is helically connected to the adjusting block through a threaded hole, the bottom of the adjusting block is slidably connected to the positioning frame, there are four threaded rods, the threaded rods are distributed on both sides of the heat sink, and there is a one-to-one correspondence between the threaded rods and the adjusting blocks.

[0013] As a further optimization of the present invention, the positioning frame has a U-shaped lateral projection, and the positioning frame has bends at both ends. The bends at both ends of the positioning frame are slidably connected to the connecting column, and the connecting column has a T-shaped lateral projection.

[0014] As a further optimization of the present invention, four shock-absorbing springs are provided, each corresponding to a connecting column, and the bottom end of each shock-absorbing spring is fixedly connected to the positioning frame.

[0015] As a further optimization of the present invention, the shock-absorbing plate has a circular hole in the middle, the center point of the shock-absorbing plate and the cooling fan are set on the same vertical plane, and the circular hole in the middle of the shock-absorbing plate is equal in size to the inner diameter of the air inlet of the cooling fan.

[0016] As a further optimization of the present invention, the following steps are included: Step I: Connect the module body and the heat sink: Connect the heat sink to the module body with connecting screws. During the connection process, it is necessary to ensure that the heat dissipation surface of the module body is in close contact with the heat sink.

[0017] Step II: Test the lifting of the cooling fan: Power on the external power supply of the entire device. After powering on, control the dual-shaft motor to drive the threaded rod to rotate, so as to control the adjustment block to move towards the center point of the module body. During the movement of the adjustment block, the connecting column slides down from the second inclined plane and disengages from the adjustment block. When the adjustment block is disengaged from the connecting column, the connecting column drives the shock-absorbing plate and the cooling fan to move downward synchronously, so that the bottom end of the shock-absorbing plate is in close contact with the top end of the shock-absorbing spring. This allows the cooling fan to be damped by the shock-absorbing plate and the shock-absorbing spring during operation. In addition, during operation, the guide plate set at the top of the cooling fan splits the airflow to both sides, so that the airflow has a downward force on the cooling fan, ensuring that the fixed connection between the shock-absorbing plate at the bottom of the cooling fan and the top end of the shock-absorbing spring are in close contact.

[0018] Step 3: Test the cleaning mechanism: During the movement of the adjusting block, the lifting rod moves upward synchronously through the first inclined plane, which in turn moves the cleaning frame synchronously. During the movement of the cleaning frame, the inner wall of the connecting hole can clean the outer wall of the heat sink. When the cooling fan is working, the airflow generated by the cooling fan can remove the dust cleaned in this part, thereby ensuring the heat dissipation effect of the heat sink.

[0019] Step IV: Install the module body in the location where it will be used: After the test is completed, install the entire device on the industrial testing equipment. During the installation process, ensure that the cooling fan is located directly above the module body.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. In this invention, by setting a shock absorption separation mechanism, when the 5G communication unit is not working, the connecting column is positioned by adjusting the block to separate the shock absorption spring from the cooling fan. This ensures that the shock absorption spring is in normal condition when the 5G communication unit is not working, which can effectively improve the service life of the shock absorption spring. At the same time, during the shock absorption process, the wind pressure is used to ensure that the cooling fan is in close contact with the shock absorption spring through the shock absorption plate, which can ensure the shock absorption effect and stability.

[0022] 2. In this invention, through the cleaning mechanism, during the operation of the 5G communication unit, the heat dissipation airflow of the cooling fan and the cleaning rack are used to scrape off and remove stubborn stains attached to the surface of the heat sink, thereby improving the heat dissipation effect of the heat sink during the operation of the 5G communication unit and thus improving the stability of the operation of the 5G communication unit.

[0023] 3. In this invention, the heat dissipation structure is connected and adapted to the 5G communication unit through a modular design, which facilitates independent replacement and maintenance in the future, effectively reducing the investment in later maintenance. At the same time, the connection screws are used for fixing, which further improves the convenience of later replacement and maintenance. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 For the present invention Figure 1 Schematic diagram of the structure at point A in the middle;

[0026] Figure 3 This is a schematic diagram of the flow guiding mechanism of the present invention;

[0027] Figure 4 This is a schematic diagram of the shock absorption and separation mechanism of the present invention;

[0028] Figure 5 This is a schematic diagram of the adjustment mechanism structure of the present invention;

[0029] Figure 6 This is a schematic diagram of the cleaning mechanism structure of the present invention.

[0030] In the diagram: 1. Main module; 2. Antenna; 3. Cooling fan;

[0031] 4. Flow guiding mechanism; 41. Flow guide plate; 42. Flow guide groove;

[0032] 5. Heat sink;

[0033] 6. Shock absorption and separation mechanism; 61. Threaded rod; 62. Adjustment mechanism; 621. Adjustment block; 622. First inclined plane; 623. Second inclined plane; 624. Threaded hole; 63. Positioning frame; 64. Dual output shaft motor;

[0034] 7. Noise-absorbing holes; 8. Vibration-damping plate; 9. Connecting screws; 10. Heat sink;

[0035] 11. Cleaning mechanism; 111. Cleaning rack; 112. Connection hole;

[0036] 12. Lifting rod; 13. Shock-absorbing spring; 14. Square hole; 15. Return spring; 16. Connecting column. Detailed Implementation

[0037] Please see Figure 1-6 The present invention provides a technical solution:

[0038] A modular 5G communication unit and its installation method include a module body 1, an antenna 2, a heat sink 5, and a heat fin 10. The antenna 2 for signal transmission and reception is installed on one side of the module body 1. The heat sink 5 is fixedly connected to the upper end of the module body 1 by connecting screws 9. A heat sink 10 is integrally formed on the upper end of the heat sink 5. Shock-absorbing separation mechanisms 6 are installed on both sides of the heat sink 10. A cooling fan 3 is installed on the upper end of the shock-absorbing separation mechanism 6. A noise-absorbing hole 7 is opened inside the outer shell of the cooling fan 3. A flow guiding mechanism 4 is installed in the middle of the upper end of the cooling fan 3. The flow guiding mechanism 4 includes a flow guiding plate 41, and a flow guiding groove 42 is opened inside the flow guiding plate 41. The shock-absorbing separation mechanism 6 includes a threaded rod 6. 1. The threaded rod 61 is fixedly connected to the main shafts at both ends of the dual-output shaft motor 64. The lower end of the dual-output shaft motor 64 is fixedly connected to the positioning frame 63 by bolts. The end of the threaded rod 61 away from the dual-output shaft motor 64 is connected to the adjustment mechanism 62. The adjustment mechanism 62 includes an adjustment block 621. One end of the adjustment block 621 is provided with a first inclined surface 622, and the other end of the adjustment block 621 is provided with a second inclined surface 623. The lower end of the first inclined surface 622 is provided with a threaded hole 624. The upper end of the second inclined surface 623 is provided with a connecting post 16. A shock-absorbing spring 13 is installed on the outer side of the upper end of the connecting post 16. The top end of the connecting post 16 is fixedly connected to the shock-absorbing plate 8. The upper end of the shock-absorbing plate 8 is fixedly connected to the outer shell of the cooling fan 3.

[0039] As a further implementation of this solution, the guide groove 42 opened on the inner side of the guide plate 41 is located on the side close to the cooling fan 3. The guide plate 41 is U-shaped and the upper end of the guide groove 42 is arc-shaped, which can make the airflow have a downward force on the cooling fan 3, so as to ensure that the fixed connection between the damping plate 8 at the bottom of the cooling fan 3 and the upper end of the damping spring 13 are tightly attached.

[0040] As a further implementation of this solution, multiple heat dissipation plates 5 are provided, and the heat dissipation plates 5 are parallel to each other. Square holes 14 are provided inside the heat dissipation plates 5 on both sides. There are four square holes 14. A return spring 15 is fixedly connected to the bottom of each square hole 14. The upper end of the return spring 15 is fixedly connected to the lifting rod 12. The lifting rod 12 is welded and fixed to both sides of the cleaning mechanism 11. The above-mentioned arrangement can further improve the stability of the cleaning mechanism 11 during the up and down movement process in actual application.

[0041] As a further implementation of this solution, the cleaning mechanism 11 includes a cleaning frame 111. The cleaning frame 111 has a connection hole 112 inside. The cleaning frame 111 is adapted to the heat sink 10 through the connection hole 112. The above configuration can clean the dust attached to the surface of the heat sink 10.

[0042] As a further implementation of this solution, four lifting rods 12 are provided, and each lifting rod 12 corresponds to a square hole 14. The lifting rod 12 is in close contact with the adjusting block 621 through the first inclined surface 622. The lifting rod 12 is slidably connected to the square hole 14. Two return springs 15 are provided inside any square hole 14. The above arrangement can ensure the stability of the lifting rod 12 during the up and down movement, thereby ensuring the stability of the cleaning rack 111 during the up and down movement.

[0043] As a further implementation of this solution, the threaded rod 61 is spirally connected to the adjusting block 621 through the threaded hole 624. The bottom of the adjusting block 621 is slidably connected to the positioning frame 63. There are four threaded rods 61, which are distributed on both sides of the heat sink 10. The threaded rods 61 and the adjusting block 621 correspond one-to-one. In actual application, the above settings can simultaneously and stably limit the two ends of the cooling fan 3.

[0044] As a further implementation of this solution, the lateral projection of the positioning frame 63 is U-shaped, and the two ends of the positioning frame 63 are bent. The two ends of the positioning frame 63 are slidably connected to the connecting column 16. The lateral projection of the connecting column 16 is T-shaped. Through the above settings, the entire shock absorption and separation mechanism 6 can be stably limited.

[0045] As a further technical solution for this scheme, four shock-absorbing springs 13 are provided. Each shock-absorbing spring 13 corresponds to a connecting column 16. The bottom end of the shock-absorbing spring 13 is fixedly connected to the positioning frame 63, which can ensure that the cooling fan 3 can stably absorb shock during operation.

[0046] As a further implementation of this solution, the shock absorber 8 has a circular hole in the middle. The center points of the shock absorber 8 and the cooling fan 3 are set on the same vertical plane. The circular hole in the middle of the shock absorber 8 is equal in size to the inner diameter of the air inlet of the cooling fan 3, which can ensure that the cooling fan 3 can stably dissipate heat from the heat sink 10 during operation.

[0047] As a further implementation of this solution, the technical solution includes the following steps: Step I: Connect the module body 1 and the heat sink 5: Connect the heat sink 5 to the module body 1 with connecting screws 9. During the connection process, it is necessary to ensure that the heat dissipation surface of the module body 1 is in close contact with the heat sink 5.

[0048] Step II: Test the lifting of the cooling fan 3: Power on the external power supply of the whole equipment. After powering on, control the dual output shaft motor 64 to drive the threaded rod 61 to rotate, so as to control the adjustment block 621 to move towards the center point of the module body 1. During the movement of the adjustment block 621, the connecting column 16 slides down from the second inclined surface 623 and disengages from the adjustment block 621. After the adjustment block 621 disengages from the connecting column 16, the connecting column 16 drives the shock-absorbing plate 8 and the cooling fan 3 to move downward synchronously, so that the bottom end of the shock-absorbing plate 8 is in close contact with the upper end of the shock-absorbing spring 13. This allows the cooling fan 3 to be damped by the shock-absorbing plate 8 and the shock-absorbing spring 13 during operation. During operation, the guide plate 41 set at the upper end of the cooling fan 3 splits the airflow to both sides, which can make the airflow have a downward force on the cooling fan 3, so as to ensure that the fixed connection between the shock-absorbing plate 8 at the bottom of the cooling fan 3 and the upper end of the shock-absorbing spring 13 is in close contact.

[0049] Step III: Test the cleaning mechanism 11: During the movement of the adjusting block 621, the lifting rod 12 is moved upward synchronously through the first inclined surface 622, which in turn drives the cleaning frame 111 to move synchronously. During the movement of the cleaning frame 111, the inner wall of the connecting hole 112 can clean the outer wall of the heat sink 10. When the cooling fan 3 is working, the airflow generated by the cooling fan 3 can remove the dust cleaned in this part, thereby ensuring the heat dissipation effect of the heat sink 10.

[0050] Step IV: Install the module body 1 in the location where it will be used: After the test is completed, install the entire device on the industrial testing equipment. During the installation process, ensure that the cooling fan 3 is located directly above the module body 1.

[0051] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A modular 5G communication unit, comprising a module body (1), an antenna (2), a heat sink (5), and a heat dissipation plate (10), characterized in that: An antenna (2) for signal transmission and reception is installed on one side of the module body (1). A heat sink (5) is fixedly connected to the upper end of the module body (1) by connecting screws (9). A heat sink (10) is integrally formed on the upper end of the heat sink (5). A shock-absorbing separation mechanism (6) is installed on both sides of the heat sink (10). A cooling fan (3) is installed on the upper end of the shock-absorbing separation mechanism (6). A noise reduction hole (7) is opened on the inner side of the outer shell of the cooling fan (3). A flow guiding mechanism (4) is installed in the middle of the upper end of the cooling fan (3). The flow guiding mechanism (4) includes a flow guiding plate (41), and a flow guiding groove (42) is provided on the inner side of the flow guiding plate (41). The shock absorption separation mechanism (6) includes a threaded rod (61), which is fixedly connected to the main shafts at both ends of a dual-output shaft motor (64). The lower end of the dual-output shaft motor (64) is fixedly connected to a positioning frame (63) by bolts. The end of the threaded rod (61) away from the dual-output shaft motor (64) is connected to an adjustment mechanism (62). The adjustment mechanism (62) includes an adjustment block (621), which has a first inclined surface (622) at one end and a second inclined surface (623) at the other end. A threaded hole (624) is opened at the lower end of the first inclined surface (622). The second inclined plane (623) has a connecting post (16) at its upper end. A shock-absorbing spring (13) is installed on the outer side of the upper end of the connecting post (16). The top of the connecting post (16) is fixedly connected to the shock-absorbing plate (8). The upper end of the shock-absorbing plate (8) is fixedly connected to the outer shell of the cooling fan (3). The guide groove (42) opened on the inner side of the guide plate (41) is set on the side close to the cooling fan (3). The guide plate (41) is U-shaped. The upper end of the guide groove (42) is arc-shaped. There are multiple cooling plates (5). The cooling plates (5) are parallel to each other. Square holes (14) are opened inside the cooling plates (5) on both sides. There are four square holes (14). The bottom end of each square hole (14) is fixedly connected to a return spring (15). The upper end of the reset spring (15) is fixedly connected to the lifting rod (12). The lifting rod (12) is welded and fixed on both sides of the cleaning mechanism (11). The cleaning mechanism (11) includes a cleaning frame (111). The cleaning frame (111) has a connecting hole (112) inside. The cleaning frame (111) is adapted to the heat sink (10) through the connecting hole (112). There are four lifting rods (12). The lifting rods (12) correspond one-to-one with the square holes (14). The lifting rods (12) are in close contact with the adjusting block (621) through the first inclined surface (622). The lifting rods (12) are slidably connected to the square holes (14). There are two reset springs (15) inside any one of the square holes (14).

2. The modular 5G communication unit according to claim 1, characterized in that: The threaded rod (61) is spirally connected to the adjusting block (621) through the threaded hole (624). The bottom of the adjusting block (621) is slidably connected to the positioning frame (63). There are four threaded rods (61), which are distributed on both sides of the heat sink (10), and the threaded rods (61) correspond one-to-one with the adjusting blocks (621).

3. The modular 5G communication unit according to claim 2, characterized in that: The lateral projection of the positioning frame (63) is U-shaped, and the two ends of the positioning frame (63) are bent. The two ends of the positioning frame (63) are slidably connected to the connecting column (16). The lateral projection of the connecting column (16) is T-shaped.

4. A modular 5G communication unit according to claim 3, characterized in that: There are four shock-absorbing springs (13), and each shock-absorbing spring (13) corresponds to a connecting column (16). The bottom end of each shock-absorbing spring (13) is fixedly connected to the positioning frame (63).

5. A modular 5G communication unit according to claim 4, characterized in that: The shock-absorbing plate (8) has a round hole in the middle. The center point of the shock-absorbing plate (8) and the cooling fan (3) are set on the same vertical plane. The round hole in the middle of the shock-absorbing plate (8) is equal to the inner diameter of the air inlet of the cooling fan (3).

6. An installation method for a modular 5G communication unit as described in claim 5, characterized in that: The steps include: Step I: Connect the module body (1) and the heat sink (5): Connect the heat sink (5) to the module body (1) with connecting screws (9). During the connection process, it is necessary to ensure that the heat dissipation surface of the module body (1) is in close contact with the heat sink (5). Step II: Test the lifting of the cooling fan (3): Power on the external power supply of the entire equipment. After powering on, control the dual-shaft motor (64) to drive the threaded rod (61) to rotate, so as to control the adjusting block (621) to move towards the center point of the module body (1). During the movement of the adjusting block (621), the connecting column (16) slides down from the second inclined plane (623) and disengages from the adjusting block (621). When the adjusting block (621) disengages from the connecting column (16), the connecting column (16) drives the shock absorber ( 8) Move downwards synchronously with the cooling fan (3), so that the bottom end of the damping plate (8) is in close contact with the top end of the damping spring (13), so that the cooling fan (3) can be damped by the damping plate (8) and the damping spring (13) during operation. During operation, the guide plate (41) set at the top of the cooling fan (3) splits the airflow to both sides, so that the airflow has a downward force on the cooling fan (3), so as to ensure that the bottom end of the cooling fan (3) is fixedly connected to the damping plate (8) and the top end of the damping spring (13) are in close contact. Step III: Test the cleaning mechanism (11): During the movement of the adjusting block (621), the lifting rod (12) is moved upward through the first inclined surface (622), which in turn drives the cleaning frame (111) to move synchronously. During the movement of the cleaning frame (111), the inner wall of the connecting hole (112) can clean the outer wall of the heat sink (10). When the cooling fan (3) is working, the airflow formed by the cooling fan (3) can remove the dust cleaned in this part together, thereby ensuring the heat dissipation effect of the heat sink (10). Step IV: Install the module body (1) in the position where it is to be used: After the test is completed, install the entire device on the industrial testing equipment. During the installation process, it is necessary to ensure that the cooling fan (3) is located directly above the module body (1).

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