Camera module and electronic device including the same

Abstract

A camera module according to an embodiment may include: a frame; a lens unit movably disposed with respect to the frame and including at least one lens; a first carrier including an AF magnet disposed to face a first direction, and coupled to the lens unit to move the lens unit in the first direction; and a second carrier including a first OIS magnet disposed to the first surface and a second OIS magnet disposed to the second surface, and moving the lens unit in a second direction and / or a third direction different from the second direction. The frame may include: a first AF coil provided to the frame to face the first OIS magnet; a first OIS coil provided to the frame to face the first OIS magnet; and a second OIS coil provided to the frame to face the second OIS magnet. The first carrier may include: a first yoke disposed to face the first OIS magnet; and a second yoke disposed to face the second OIS magnet. Various other embodiments as determined by the present specification are possible.

Description

Technical Field

[0001] Various embodiments of the present disclosure are directed to a camera module and an electronic device including the camera module. Background Art

[0002] In various electronic devices, particularly in portable devices (e.g., smart phones) or mobile communication terminals (e.g., tablet personal computers (PCs), laptop computers), high-performance, ultra-small camera modules are used. In order for the camera module to capture an image, the focus of the lens must be adjusted so that the image is accurately formed on the image sensor included in the camera module. In addition, the smaller the size of the electronic device, the worse the image quality may be due to the movement of the user holding the electronic device when capturing the image.

[0003] An auto focus (AF) function is a function of an optical system to automatically adjust the focus on a subject. The electronic device may move a lens or an image sensor so that the subject is in focus.

[0004] Optical image stabilization (OIS) technology may be applied to improve the image quality of a captured image. An electronic device may detect movement of the electronic device by using a motion sensor included in the electronic device. By driving a lens or an image sensor to move according to the movement of the electronic device, the electronic device may obtain a stable image.

[0005] The above information may be provided as related art to assist in understanding the present disclosure. No claim or determination is made as to whether any of the above content may be applicable as prior art with respect to the present disclosure. Summary of the invention

[0006] Technical Solution

[0007] A camera module according to an embodiment of the present disclosure may include: a frame; a lens unit movably disposed relative to the frame and including at least one lens; a first carrier including an autofocus (AF) magnet disposed to face a first direction and coupled to the lens unit to move the lens unit in the first direction; and a second carrier including a first optical image stabilization (OIS) magnet disposed to a first surface and a second OIS magnet disposed to a second surface, and moving the lens unit in a second direction and / or a third direction different from the second direction. The frame may include: a first AF coil disposed to the frame to face the AF magnet; a first OIS coil disposed to the frame to face the first OIS magnet; and a second OIS coil disposed to the frame to face the second OIS magnet. The first carrier may include: a first yoke disposed to face the first OIS magnet; and a second yoke disposed to face the second OIS magnet.

[0008] An electronic device according to an embodiment of the present disclosure may include: a frame; a lens unit movably disposed relative to the frame and including at least one lens; a first carrier including an AF magnet disposed to face a first direction and coupled to the lens unit to move the lens unit in the first direction; and a second carrier including a first OIS magnet disposed to a first surface and a second OIS magnet disposed to a second surface, and moving the lens unit in a second direction and / or a third direction different from the second direction. The frame may include: a first AF coil disposed to the frame to face the AF magnet; a first OIS coil disposed to the frame to face the first OIS magnet; and a second OIS coil disposed to the frame to face the second OIS magnet. The first carrier may include: a first yoke disposed to face the first OIS magnet; and a second yoke disposed to face the second OIS magnet. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is an exploded view of a camera module according to an embodiment;

[0010] Figure 2 shows a cross-sectional structure of a camera module viewed in the direction of a lens according to an embodiment;

[0011] Figure 3 is a diagram for comparing heights of camera modules according to embodiments;

[0012] Figure 4 shows a cross-sectional structure of a camera module according to an embodiment;

[0013] Figure 5 shows a cross-sectional structure of a camera module viewed in a direction of a lens and a cross-sectional structure of the camera module viewed in another direction according to an embodiment;

[0014] Figure 6 Another cross-sectional structure of the camera module viewed in the direction of the lens and a cross-sectional structure of the camera module viewed in another direction are shown;

[0015] Figure 7 shows a cross-sectional structure of a camera module viewed in a direction of a lens and a cross-sectional structure of the camera module viewed in another direction according to an embodiment;

[0016] Figure 8 is a block diagram of an electronic device in a network environment according to various embodiments; and

[0017] Fig. 9 is a block diagram showing a camera module according to an embodiment.

[0018] With regard to the description of the drawings, the same or similar reference numerals may be used to refer to the same or similar elements. DETAILED DESCRIPTION

[0019] Hereinafter, various embodiments of the present disclosure are described with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the technical features set forth herein to a specific embodiment, but rather includes various modifications, equivalents and / or substitutions to the embodiments of the present disclosure.

[0020] The electronic device according to various embodiments of the present disclosure may include, for example, a smart phone, a tablet personal computer (PC), a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), an MPEG-1 audio layer 3 (MP3) player, a mobile medical device, a camera, and at least one of a wearable device. According to various embodiments, the wearable device may include at least one of an accessory device (e.g., a watch, a ring, a bracelet, an anklet, a necklace, glasses, contact lenses, or a head-mounted device (HMD)), a fabric or clothing integrated device (e.g., an electronic garment), a body-attached device (e.g., a skin pad or a tattoo), and a body-implantable device (e.g., an implantable circuit).

[0021] According to some embodiments, the electronic device may be a household appliance. The household appliance may include, for example, at least one of a television (TV), a digital video disc (DVD) player, an audio player, a refrigerator, an air conditioner, a cleaner, an oven, a microwave oven, a washing machine, an air purifier, a set-top box, a home automation control panel, a security control panel, a TV box, a game console, an electronic dictionary, an electronic key, a camera, and an electronic photo frame.

[0022] According to another embodiment, the electronic device may include various medical devices (for example, various portable medical measuring devices (for example, blood sugar measuring devices, heart rate measuring devices, blood pressure measuring devices, body temperature measuring devices, etc.), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), computed tomography (CT), imaging equipment, ultrasound instruments, etc.), navigation devices, global navigation satellite systems (GNSS), event data recorders (EDR), flight data recorders (FDR), in-vehicle entertainment devices, electronic equipment for ships (for example, ship navigation devices, gyrocompasses, etc.), avionics devices, security devices, in-vehicle central controls, industrial or household robots, automatic teller machines (ATMs) of financial institutions, sales terminals (POS) of stores, and at least one of the Internet of Things (for example, light bulbs, various sensors, electricity meters or gas meters, sprinkler devices, fire alarms, thermostats, street lights, toasters, fitness equipment, hot water tanks, heaters, boilers, etc.).

[0023] According to some embodiments, the electronic device may include at least one of a part of furniture or a building / structure, an electronic board, an electronic signature receiving device, a projector, and various measuring machines (e.g., water supply, electricity, gas, and electric wave measuring machines). In various embodiments, the electronic device may be a combination of one or more of the various devices described above. According to some embodiments, the electronic device may be a flexible electronic device. In addition, the electronic device according to the embodiments of the present disclosure is not limited to the above-mentioned devices, and may include new electronic devices based on technological advances.

[0024] With the trend of miniaturizing electronic devices, camera modules included in the electronic devices also need to be small in size. In particular, when a camera module is provided to a device having a thin thickness, the height of the camera module may significantly affect the thickness of the device. However, a driving unit for providing an auto focus (AF) function and / or an optical image stabilization (OIS) function should be included in the camera module. Therefore, there is a limitation in reducing the height of the camera module to place the driving unit.

[0025] According to an embodiment, the electronic device can refer to Figure 8 Electronic device 801.

[0026] Advantages obtained in the present disclosure are not limited to the above-mentioned advantages, and other advantages not mentioned herein may be clearly understood from the following description by those skilled in the art to which the present disclosure pertains.

[0027] Figure 1 is an exploded view of the camera module 100 according to an embodiment.

[0028] Figure 1 The camera module 100 may refer to Fig. 9 The camera module 880. The electronic device according to the embodiment (eg, Figure 8 The electronic device 801) may include a camera module 100.

[0029] The camera module 100 according to the embodiment may include a cover 110 , a first carrier 120 , a lens unit 121 , a second carrier 130 , and a frame 150 . Figure 1 The structure of the camera module 100 according to the embodiment is described, and may be modified or omitted. Figure 1 At least some of the components of the camera module 100. Optionally, the camera module 100 may further include another component. In an example, when an optical image stabilization (OIS) function or an auto focus (AF) function is performed by moving an image sensor (not shown) included in the camera module 100, the content for the operation of the lens unit 121 may be replaced by the content for the operation of the image sensor (not shown). In an example, the camera module 100 may further include a third carrier 140 disposed between the second carrier 130 and the frame 150.

[0030] In the present disclosure, the first direction may be a direction substantially the same as or parallel to the optical axis of the lens included in the lens unit 121 (e.g., a z-axis direction). The second direction may be a direction substantially perpendicular to the optical axis (e.g., an x-axis direction). The third direction may be a direction substantially perpendicular to the optical axis and the second direction (e.g., a y-axis direction).

[0031] According to an embodiment, the cover 110 may provide a frame for covering another component. The shape of the cover 110 may be changed based on the shape of the camera module 100 or the components included in the camera module 100. For example, the cover 110 may be a housing having a box shape. The cover 110 may protect another component by covering the other component.

[0032] According to an embodiment, the lens unit 121 may include at least one lens so that an image of an object is formed on the image sensor. The position of the lens unit 121 may be moved relative to the frame 150 by means of the first carrier 120 and / or the second carrier 130. In an example, when the camera module 100 includes the third carrier 140, the position of the lens unit 121 may be moved relative to the frame 150 by means of the first carrier 120, the second carrier 130 and / or the third carrier 140. The lens unit 121 according to an embodiment may be provided to the first carrier 120. For example, the lens unit 121 may be coupled to the first carrier 120, or may be fixed to the first carrier 120.

[0033] According to an embodiment, the first carrier 120 may move the lens unit 121 in a first direction (e.g., z-axis direction). According to an embodiment, the first carrier 120 may include an AF actuator configured to move the lens unit 121 for automatic focus adjustment. For example, the first carrier 120 may include an AF magnet 122 disposed to face the first direction. In an embodiment, the first carrier 120 may move the lens unit 121 in a direction of an optical axis of a lens included in the lens unit 121 or in a direction parallel to the optical axis. According to an embodiment, the lens unit 121 may move in a state of being coupled (or fixed) to the first carrier 120.

[0034] According to an embodiment, the second carrier 130 may move the lens unit 121 in a second direction (e.g., an x-axis direction) and / or a third direction (e.g., a y-axis direction). The second direction and the third direction may be directions different from each other. According to an embodiment, the second carrier 130 may include an OIS actuator configured to move the lens unit 121 for optical image stabilization. For example, the second carrier 130 may include a first OIS magnet 131 provided to a first surface and a second OIS magnet 132 provided to a second surface. In an embodiment, the second carrier 130 may move the lens unit 121 in a direction substantially perpendicular to the optical axis of the lens included in the lens unit 121 for optical image stabilization.

[0035] According to an embodiment, the frame 150 may provide a framework for supporting another component. The shape of the frame 150 may vary based on the shape of the camera module 100 or components included in the camera module 100. For example, the frame 150 may be a housing having a box shape.

[0036] According to an embodiment, the frame 150 may include at least one coil disposed to face at least one magnet disposed to the first carrier 120 and / or the second carrier 130. For example, the frame 150 may include at least one OIS coil disposed to face the first OIS magnet 131 (e.g., the first OIS coil 151), at least one OIS coil disposed to face the second OIS magnet 132 (e.g., the second OIS coil 152), and at least one AF coil disposed to face the AF magnet 122 (e.g., the first AF coil 153).

[0037] According to an embodiment, the first OIS coil 151, the second OIS coil 152, and / or the at least one AF coil may be electrically or operatively coupled by means of a flexible printed circuit board. However, the present disclosure is not limited thereto.

[0038] According to an embodiment, the first carrier 120 may be disposed on the second carrier 130. The first carrier 120 may be disposed to be movable relative to the second carrier 130 in a first direction. Figure 1 , the camera module 100 may include at least one first sphere 133 disposed between the first carrier 120 and the second carrier 130. In an implementation, the at least one first sphere 133 may move the first carrier 120 relative to the frame 150 in the first direction.

[0039] According to an embodiment, when the first carrier 120 moves in the first direction by operations of the AF magnet 122 and at least one AF coil (eg, the first AF coil 153 ), the lens unit 121 provided to the first carrier 120 may move in the first direction.

[0040] According to an embodiment, the second carrier 130 may be disposed on the frame 150. The second carrier 130 may be disposed to be movable in the second direction and / or the third direction relative to the frame 150. For example, the camera module 100 may include at least one sphere (e.g., the second sphere 141) disposed between the second carrier 130 and the frame 150. The second carrier 130 may be movable relative to the frame 150 on the frame 150 by means of the at least one sphere.

[0041] According to an embodiment, when the first carrier 130 moves in the second direction and / or the third direction by operation of at least one OIS magnet (e.g., the first OIS magnet 131 or the second OIS magnet 132) and at least one OIS coil (e.g., the first OIS coil 151 or the second OIS coil 152), the lens unit 121 included in the first carrier 120 may move in the second direction and / or the third direction.

[0042] In an embodiment, when the camera module 100 includes the third carrier 140, the second carrier 130 may be disposed on the third carrier 140. The third carrier 140 may be disposed to be movable relative to the frame 150 in the second direction and / or the third direction. Figure 1 , the camera module 100 may include at least one second sphere 141 disposed between the second carrier 130 and the third carrier 140 and at least one third sphere (not shown) disposed between the third carrier 140 and the frame 150. In an embodiment, the at least one second sphere 141 may move the second carrier 130 relative to the frame 150 in the second direction. The at least one third sphere (not shown) may move the third carrier 140 relative to the frame 150 in the third direction.

[0043] According to an embodiment, when the third carrier 140 moves in the second direction and / or the third direction, the second carrier 130 provided to the third carrier 140 may move in the second direction and / or the third direction. When the second carrier 130 moves in the second direction and / or the third direction, the lens unit 121 provided to the first carrier 120 may move in the second direction and / or the third direction.

[0044] According to an embodiment, the first carrier 120 may include at least one yoke disposed to face at least one OIS magnet (eg, the first OIS magnet 131) disposed to the second carrier 130. Figure 1 , the first carrier 120 may include a first yoke 123 disposed to face the first OIS magnet 131 and a second yoke 124 disposed to face the second OIS magnet 132 .

[0045] Figure 2A cross-sectional structure of a camera module viewed in the direction of a lens according to an embodiment is shown.

[0046] Figure 2 The camera module 100 and its components can be referred to Figure 1 For components that are the same or substantially the same as those described above, the same terms and / or the same reference numerals are used, and redundant descriptions will be omitted.

[0047] According to an embodiment, the first OIS magnet 131 may be provided to a first surface facing a second direction (e.g., an x-axis direction or a -x-axis direction). The first OIS magnet 131 may be provided to face the second direction (e.g., an x-axis direction or a -x-axis direction). The first OIS magnet 131 may be provided to face the first OIS coil 151 provided to one side surface of the frame 150. The first carrier 120 and the second carrier 130 may be moved by a second directional force acting on the first OIS magnet 131 due to a magnetic field generated by a current flowing in the first OIS coil 151.

[0048] According to an embodiment, the second OIS magnet 132 may be provided to a second surface facing a third direction (e.g., the y-axis direction or the -y-axis direction). In an embodiment, the second surface may be substantially perpendicular to the first surface. The second OIS magnet 132 may be provided to face the third direction (e.g., the y-axis direction or the -y-axis direction). The second OIS magnet 132 may be provided to face the second OIS coil 152 provided to one side surface of the frame 150. The first carrier 120 and the second carrier 130 (or the third carrier (e.g., Figure 1 The third carrier 140 may be moved by a third directional force acting on the second OIS magnet 132 due to a magnetic force generated by a current flowing in the second OIS coil 152 .

[0049] According to an embodiment, the first yoke 123 may face substantially the same direction as the first OIS coil 151. For example, the first yoke 123 may be arranged to face the second direction (e.g., the x-axis direction) relative to the first OIS coil 151, and the first OIS magnet 131 is between the first yoke 123 and the first OIS coil 151. The second yoke 124 may face substantially the same direction as the second OIS coil 152. For example, the second yoke 124 may be arranged to face the third direction (e.g., the y-axis direction) relative to the second OIS coil 152, and the second OIS magnet 132 is between the second yoke 124 and the second OIS coil 152. However, the present disclosure is not limited thereto.

[0050] According to an embodiment, at least one AF magnet (e.g., the first AF magnet 122) may be provided to a surface opposite to the first yoke 123 with respect to the lens unit 121. For example, at least one AF magnet (e.g., the first AF magnet 122) may be provided to a portion extending from a surface opposite to one surface of the first carrier 120 on which the first yoke 123 is provided.

[0051] According to an embodiment, the first carrier 120 may be moved on the second carrier 130 by means of at least one first sphere 133. For example, the first carrier 120 may be moved on the second carrier 130 along a first direction (eg, Figure 1 The z-axis direction) moves.

[0052] According to an embodiment, the second carrier 130 may include a first ball guide groove formed in a first direction to allow the first carrier 120 to move in the first direction. At least one first sphere 133 may be disposed on the first ball guide groove. At least one first sphere 133 disposed between the first carrier 120 and the second carrier 130 may roll along the first ball guide groove, thereby moving the first carrier 120 in the first direction. When the first carrier 120 moves in the first direction, the lens unit 121 accommodated in the first carrier 120 may move together in the first direction. In an embodiment, the first carrier 120 may include at least one ball guide groove formed at a position corresponding to the first ball guide groove of the second carrier 130.

[0053] According to an embodiment, at least one first sphere 133 may be disposed with a yoke therebetween. For example, the first sphere 133 may include a first group 133a, a second group 133b, and a third group 133c, the first group 133a being disposed to a portion adjacent to one end of the second yoke 124 (or between the second yoke 124 and the AF magnet 122), the second group 133b being disposed between the first yoke 123 and the second yoke 124 (or a portion adjacent to one end of the first yoke 123), and the third group 133c being disposed to a portion adjacent to the other end of the first yoke 123.

[0054] According to an embodiment, the first yoke 123 may be disposed between the second group 133b and the third group 133c, and the second yoke 124 may be disposed between the second group 133b and the first group 133a. However, the present disclosure is not limited thereto. Figure 2 FIG. 1 shows that at least one first sphere 133 includes the first group to the third group, but the total number and / or position of the first sphere 133 is not limited to Figure 2 For example, the camera module 100 may include only the second group 133 b , or may further include a group of at least one first sphere 133 .

[0055] According to an embodiment, due to the attraction between at least one OIS magnet (e.g., the first OIS magnet 131) and at least one yoke (e.g., the first yoke 123), the first carrier 120 may be closely attached to the second carrier 130. For example, due to the attraction between the first OIS magnet 131 and the first yoke 123, the first carrier 120 may be closely attached to the second carrier 130 in the second direction (e.g., the -x-axis direction). Due to the attraction between the second OIS magnet 132 and the second yoke 124, the first carrier 120 may be closely attached to the second carrier 130 in the third direction (e.g., the -y-axis direction). Therefore, the at least one first sphere 133 may be attached to the second carrier 130 in the first direction (e.g., the -y-axis direction) without being separated from between the first carrier 120 and the second carrier 130. Figure 1 The device can move smoothly back and forth in the z-axis direction.

[0056] According to an embodiment, the efficiency of the image stabilization function may be improved by providing at least one yoke (eg, the first yoke 123 or the second yoke 124 ) to concentrate the electromagnetic force between the OIS magnet and the OIS coil.

[0057] Figure 3 is a diagram for comparing heights of camera modules according to embodiments.

[0058] Figure 3 Sub-figure (a) of may be a cross-sectional view of the camera module 100-1. For example, the camera module 100-1 may be a camera module in which an OIS carrier for OIS driving is disposed to an upper end portion (or inside) of an AF carrier for AF driving and an AF magnet for AF driving is disposed to face a second direction (e.g., an x-axis direction) or a third direction (e.g., a y-axis direction). Figure 3 Sub-figure (b) may be a cross-sectional view of the camera module 100 according to an embodiment of the present disclosure.

[0059] Figure 3 The camera module 100 and its components can be referred to Figure 1 and Figure 2 For components that are the same or substantially the same as those described above, the same terms and / or the same reference numerals are used, and redundant descriptions will be omitted.

[0060] The first carrier 120 and the second carrier 130 included in the camera module 100 according to the embodiment may be disposed on the frame 150, and the second carrier 130 (e.g., an OIS carrier) may be disposed to the lower end portion (or the outside) of the first carrier 120, rather than to the upper end portion (or the inside) of the first carrier 120 (e.g., an AF carrier). In addition, at least one AF magnet (e.g., an AF magnet 122) may be disposed to the side surface of the first carrier 120. For example, the first AF magnet 122 may be disposed to face the first direction (e.g., the z-axis direction) in an area protruding from the first carrier 120 in one direction (e.g., the x-axis direction). At least one AF coil (e.g., a first AF coil 153) may be disposed to face the first direction in the frame 150 to face the at least one AF magnet 122. The first carrier 120 for AF driving is located at the upper end (or inside) of the second carrier 130, and the AF magnet (e.g., the first AF magnet 122) is arranged to face the first direction (or the first carrier 120 for AF driving is located at the upper end (or inside) of the second carrier 130 for OIS driving, and the OIS driving is driven in a solenoid driving manner), which can result in a reduction in the height of the camera module 100.

[0061] Specifically, Figure 3 As shown in sub-figure (a) of , when the second carrier 130-1 (e.g., an OIS carrier for OIS driving) is set to the upper end (or inside) of the first carrier 120-1 (e.g., an AF carrier for AF driving), and the AF magnet for AF driving is set to face the second direction (e.g., the x-axis direction) or the third direction (e.g., the y-axis direction), the camera module 100-1 may have a second height h2 (e.g., the distance from the bottom surface of the camera module 100-1 to one end of the lens unit 121-1 in the z-axis direction). In this case, the first height h1 of the camera module 100 according to the embodiment (e.g., the distance from the bottom surface of the camera module 100 to one end of the lens unit 121 in the z-axis direction) may be smaller than the second height h2.

[0062] According to an embodiment, since the first carrier 120 for AF driving is located at the upper end (or inside) of the second carrier 130 for OIS driving, the first carrier 120 can move only the lens unit 121 for AF driving by using the AF magnet 122. Therefore, the burden of the AF driver (e.g., the AF magnet 122) can be reduced, and the volume of the AF magnet 122 can be reduced. Therefore, the height or thickness of the camera module 100 can be reduced.

[0063] According to an embodiment, the first carrier 120 may be moved by a first direction (z-axis direction or -z-axis direction) force acting on the AF magnet 122 due to a magnetic field generated by a current flowing in at least one AF coil (e.g., the first AF coil 153). Since the first carrier 120 moves in the first direction, the lens unit 121 may move in the first direction. Since the lens unit 121 moves in the first direction, a distance from an image sensor (not shown) included in the camera module 100 to at least one lens of the lens unit 121 may change.

[0064] According to an embodiment, the second carrier 130 may move on the third carrier 140 by means of at least one second sphere 141. For example, the second carrier 130 may move on the third carrier 140 along a second direction (eg, x-axis direction) by means of at least one second sphere 141.

[0065] According to an embodiment, the third carrier 140 may include a second ball guide groove formed in the second direction to allow the second carrier 130 to move in the second direction. At least one second sphere 141 may be disposed on the second ball guide groove. At least one second sphere 141 disposed between the second carrier 130 and the third carrier 140 may roll along the second ball guide groove, thereby moving the second carrier 130 in the second direction. When the second carrier 130 moves in the second direction, the first carrier 120 may move in the second direction. When the first carrier 120 moves in the second direction, the lens unit 121 accommodated in the first carrier 120 may move together in the second direction. In an embodiment, the second carrier 130 may include at least one ball guide groove formed at a position corresponding to the second ball guide groove of the third carrier 140.

[0066] refer to Figure 2 and Figure 3 , at least one second sphere 141 according to an embodiment may be disposed with an OIS magnet therebetween. For example, the second sphere 141 may include a first group 141a disposed to a portion adjacent to one end of the second OIS magnet 132 (or between the second OIS magnet 132 and the AF magnet 122), a second group 141b disposed between the first OIS magnet 131 and the second OIS magnet 132 (or a portion adjacent to one end of the first OIS magnet 131), and a third group 141c disposed to a portion adjacent to the other end of the first OIS magnet 131.

[0067] According to an embodiment, the first OIS magnet 131 may be disposed between the second group 141b and the third group 141c, and the second OIS magnet 132 may be disposed between the second group 141b and the first group 141a. However, the present disclosure is not limited thereto. Figure 2 FIG. 1 shows that at least one second sphere 141 includes the first group to the third group, but the total number and / or position of the second sphere 141 is not limited to Figure 2 For example, the camera module 100 may include only the second group 141 b , or may further include a group of at least one second sphere 141 .

[0068] According to an embodiment, the third carrier 140 may move on the frame 150 by means of at least one third sphere 154. For example, the third carrier 140 may move on the frame 150 along a third direction (eg, y-axis direction) by means of at least one third sphere 154.

[0069] According to an embodiment, the frame 150 may include a third ball guide groove formed in the third direction to allow the third carrier 140 to move in the third direction. At least one third sphere 154 may be provided on the third ball guide groove. At least one third sphere 154 provided between the third carrier 140 and the frame 150 may roll along the third ball guide groove, thereby moving the third carrier 140 in the third direction. When the third carrier 140 moves in the third direction, the second carrier 130 operatively coupled to the third carrier 140 may move in the third direction. When the third carrier 140 moves in the third direction, the lens unit 121 accommodated in the first carrier 120 may move together in the third direction. In an embodiment, the third carrier 140 may include at least one ball guide groove formed at a position corresponding to the third ball guide groove of the frame 150.

[0070] refer to Figure 2 and Figure 3 , at least one third sphere 154 according to an embodiment may be disposed with an OIS magnet therebetween. For example, the third sphere 154 may include a first group 154a disposed to a portion adjacent to one end of the second OIS magnet 132 (or between the second OIS magnet 132 and the AF magnet 122), a second group 154b disposed between the first OIS magnet 131 and the second OIS magnet 132 (or a portion adjacent to one end of the first OIS magnet 131), and a third group (not shown) disposed to a portion adjacent to the other end of the first OIS magnet 131.

[0071] According to an embodiment, although Figure 3Although not shown in the figure, the first OIS magnet 131 may be disposed between the second group 154b and the third group (not shown), and the second OIS magnet 132 may be disposed between the second group 154b and the first group 154a. However, the present disclosure is not limited thereto. Figure 3 FIG. 1 shows that at least one third sphere 154 includes a first group and a second group, but the total number and / or position of the third sphere 154 is not limited to Figure 3 For example, the camera module 100 may include only the second group 154 ​​b , or may further include a group of at least one third sphere 154 .

[0072] Figure 4 A cross-sectional structure of a camera module according to an embodiment is shown.

[0073] Figure 4 The camera module 200 and its components can be referred to Figures 1 to 3 For components that are the same or substantially the same as those described above, the same terms and / or the same reference numerals are used, and redundant descriptions will be omitted.

[0074] According to an embodiment, the camera module 200 may include at least one AF coil 253 provided to the frame 250. According to an embodiment, when the AF stroke increases, the camera module 200 may further include at least one coil facing the first AF coil 253a. For example, the at least one AF coil 253 may include a first AF coil 253a and a second AF coil 253b provided to the frame 250 to face the first AF coil 253a.

[0075] refer to Figure 4 , the first AF coil 253a may be arranged to face the +z axis direction, and the second AF coil 253b may be arranged to face the -z axis direction. In an embodiment, the AF magnet 222 may be arranged between the first AF coil 253a and the second AF coil 253b. In the camera module 200, for example, since the frame 250 also includes the second AF coil 253b, the strength of the magnetic field generated by the current flowing in the AF coil may be increased. The first carrier 220 may be moved by a first directional force acting on the AF magnet 222 due to the magnetic field generated by the current flowing in the second AF coil 253b.

[0076] According to an embodiment, at least one sphere 233b may refer to Figure 1 or Figure 2 The first sphere 133. The contents overlapping with the above contents will be omitted. Figure 4Although the first sphere 233b is shown to include three spheres, the number of the first sphere 233b is not limited thereto. For example, the first sphere 233b may omit at least one sphere, or may additionally include at least one sphere.

[0077] According to an embodiment, the plurality of first spheres 233 b may be disposed in a first direction as a length direction. The plurality of first spheres 233 b may be disposed to face the first carrier 220 .

[0078] Figure 5 1 shows a cross-sectional structure of the camera module 300 viewed in the direction of the lens (eg, −z axis direction) according to an embodiment. Figure 5 ) and a cross-sectional structure of a side surface of the camera module 300 observed in another direction (eg, the +x-axis direction) ( Figure 5 Sub-graph (b)).

[0079] Figure 6 Another cross-sectional structure of the camera module 300 viewed in the direction of the lens (eg, −z axis direction) is shown. Figure 6 ) and a cross-sectional structure of a side surface of the camera module 300 viewed in another direction (eg, +y-axis direction) ( Figure 6 Sub-figure (b)).

[0080] Figure 5 and Figure 6 The camera module 300 and its components can be referred to Figures 1 to 3 The camera module 100 and its components and / or Figure 4 The camera module 200 and its components.

[0081] The camera module 300 according to the embodiment may include a cover 310, a first carrier 320 coupled to the lens unit, a second carrier 330, and a frame 350. The image sensor unit may convert light received through at least one lens included in the lens unit into an electrical signal. The image sensor unit may be movable relative to the frame 350. The first carrier 320 may move the image sensor unit in a first direction relative to the frame 350. The second carrier 330 may move the image sensor unit in a second direction and / or a third direction relative to the frame 350. Reference Figure 5 The first direction may be the z-axis direction or the -z-axis direction. The second direction may be the x-axis direction or the -x-axis direction. The third direction may be the y-axis direction or the -y-axis direction.

[0082] According to an embodiment, for OIS driving, a Lorentz driving scheme may be applied to the camera module 300. For example, referring to Figure 5, the second carrier 330 according to the embodiment may include a first OIS magnet 331 and a second OIS magnet 332. The first OIS magnet 331 may be disposed to face the first yoke 323, which is disposed to the first surface facing the second direction (e.g., +x / -x axis direction). The second OIS magnet 332 may be disposed to face the second yoke 324, which is disposed to the second surface facing the third direction (e.g., +y / -y axis direction).

[0083] refer to Figure 6 , the frame 350 may include a first OIS coil 351 disposed to face the first OIS magnet 331 and a second OIS coil 352 disposed to face the second OIS magnet 332. The first OIS coil 351 and / or the second OIS coil 352 may be disposed to face the first direction (e.g., +z-axis direction). The first OIS magnet 331 and / or the second OIS magnet 332 may be disposed to face the first direction (e.g., -z-axis direction).

[0084] According to an embodiment, the first yoke 323 may be disposed substantially perpendicular to the first OIS coil 351 , and the second yoke 324 may be disposed substantially perpendicular to the second OIS coil 352 .

[0085] According to an embodiment, since the camera module 300 includes a Lorentz driving scheme for OIS driving, the height of the camera module 300 (eg, the height in the first direction) may be reduced.

[0086] According to an embodiment, the camera module 300 may include at least one AF coil 353 provided to the frame 350. According to an embodiment, when the AF stroke increases, the camera module 300 may further include at least one coil facing the first AF coil 353a. For example, the at least one AF coil 353 may include a first AF coil 353a and a second AF coil 353b provided to the frame 350 to face the first AF coil 353a.

[0087] refer to Figure 6 , the first AF coil 353a may be arranged to face the +z-axis direction, and the second AF coil 353b may be arranged to face the -z-axis direction. In an embodiment, the AF magnet 322 may be arranged between the first AF coil 353a and the second AF coil 353b. In the camera module 300, for example, since the frame 350 also includes the second AF coil 353b, the strength of the magnetic field generated by the current flowing in the AF coil may be increased. The first carrier 320 may be moved by a first direction (e.g., z-axis direction) force acting on the AF magnet 322 due to the magnetic field generated by the current flowing in the second AF coil 353b.

[0088] According to an embodiment, the OIS driving of the camera module 300 is driven in a Lorentz driving manner, and the AF driving is driven in a solenoid driving manner, which may result in a reduction in the height of the camera module 300 .

[0089] Figure 7 4 shows a cross-sectional structure of a camera module 400 viewed in the direction of a lens (eg, −z axis direction) according to an embodiment. Figure 7 ) and a cross-sectional structure of the camera module 400 observed in another direction (eg, +y-axis direction) ( Figure 7 Sub-graph (b)).

[0090] Figure 7 The camera module 400 and its components can be referred to Figures 1 to 3 Camera module 100 and components thereof, Figure 4 The camera module 200 and / or Figure 6 For components that are the same or substantially the same as those described above, the same terms and / or the same reference numerals are used, and redundant descriptions will be omitted.

[0091] According to an embodiment, the camera module 400 may include a cover 410, a first carrier 420, a second carrier 430, and a frame 450. The cover 410 may provide a framework for covering another component. The first carrier 420 may move the lens unit in a first direction (e.g., z-axis direction). The first carrier 420 according to an embodiment may include an AF actuator configured to move the lens unit for automatic focus adjustment. The second carrier 430 may move the lens unit in a second direction (e.g., x-axis direction) and / or a third direction different from the second direction (e.g., y-axis direction). The second carrier 430 according to an embodiment may include an OIS actuator configured to move the lens unit for optical image stabilization. The frame 450 may provide a framework for supporting another component. However, the structure of the camera module 400 is not limited thereto.

[0092] According to an embodiment, the camera module 400 may omit the third carrier (eg, Figure 1 When the camera module 400 does not include the third carrier, the height of the camera module 400 can be reduced.

[0093] refer to Figure 7, the second carrier 430 according to the embodiment may include at least two OIS magnets on the first surface in the second direction (e.g., the x-axis direction). For example, the second carrier 430 may include a first OIS magnet 431a on the first surface and a third OIS magnet 431b arranged parallel to the first OIS magnet 431a on the first surface. The second carrier 430 may include at least two OIS magnets on the second surface facing the third direction (e.g., the y-axis direction). For example, the second carrier 430 may include a second OIS magnet 432a on the second surface and a fourth OIS magnet 432b arranged parallel to the second OIS magnet 432a on the second surface.

[0094] According to an embodiment, the first OIS magnet 431a and the third OIS magnet 431b may be disposed to face the second direction, and the second OIS magnet 432a and the fourth OIS magnet 432b may be disposed to face the third direction.

[0095] According to an embodiment, the frame 450 may include at least two OIS coils disposed to the frame 450 to face at least two OIS magnets. For example, the frame 450 may include a first OIS coil 451a disposed on one surface in the second direction to face the first OIS magnet 431a and a third OIS coil 451b disposed to face the third magnet 431b. The frame 450 may include a second OIS coil 452a disposed on one surface in the third direction to face the second OIS magnet 432a and a fourth OIS coil 452a disposed to face the fourth OIS magnet 432b.

[0096] According to an embodiment, the first carrier 420 may include at least one yoke disposed to face at least one OIS magnet (e.g., the first OIS magnet 431a) disposed to the second carrier 430. For example, the first carrier 420 may include a first yoke 423 disposed to face the first OIS magnet 431a and the third OIS magnet 431b and a second yoke 424 disposed to face the second OIS magnet 432a and the fourth OIS magnet 432b.

[0097] The first carrier 420 and the second carrier 430 included in the camera module 400 according to the embodiment may be disposed on the frame 450, and the second carrier 430 (e.g., an OIS carrier) may be disposed to the lower end portion (or the outside) of the first carrier 420, rather than to the upper end portion (or the inside) of the first carrier 420 (e.g., an AF carrier). In addition, at least one AF magnet (e.g., a first AF magnet 422) may be disposed to the side surface of the first carrier 420. For example, the first AF magnet 422 may be disposed to face the first direction (e.g., the z-axis direction) in an area protruding from the first carrier 420 in one direction (e.g., the x-axis direction). At least one AF coil (e.g., a first AF coil 453) may be disposed to face the first direction in the frame 450 to face the at least one first AF magnet 422. The first carrier 420 for AF driving may be located at the upper end (or inside) of the second carrier 430, and the AF magnet (e.g., the first AF magnet 422) may be arranged to face the first direction (or the first carrier 420 for AF driving may be located at the upper end (or inside) of the second carrier 430 for OIS driving, and the OIS driving may be driven in a solenoid driving manner), which may result in a reduction in the height of the camera module 400. However, the present disclosure is not limited thereto. For example, the OIS driving of the camera module 400 may be driven in a Lorentz driving manner, and the AF driving may be driven in a solenoid driving manner. Therefore, the height of the camera module 400 may be further reduced.

[0098] Figure 8 is a block diagram of an electronic device 801 in a network environment 800 according to various embodiments. Figure 8 , the electronic device 801 in the network environment 800 may communicate with the electronic device 802 via the first network 898 (e.g., a short-range wireless communication network), or communicate with the electronic device 804 or the server 808 via the second network 899 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 801 may communicate with the electronic device 804 via the server 808. According to an embodiment, the electronic device 801 may include a processor 820, a memory 830, an input module 850, a sound output module 855, a display module 860, an audio module 870, a sensor module 876, an interface 877, a connection terminal 878, a haptic module 879, a camera module 880, a power management module 888, a battery 889, a communication module 890, a user identification module 896, or an antenna module 897. In some embodiments, at least one of the components (e.g., the connection terminal 878) may be omitted from the electronic device 801, or one or more other components may be added. According to some embodiments, some of the components (eg, sensor module 876, camera module 880, or antenna module 897) may be integrated into a single component (eg, display module 860).

[0099] The processor 820 may run, for example, software (e.g., program 840) to control at least one different component (e.g., hardware component or software component) of the electronic device 801 that is connected to the processor 820, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 820 may store a command or data received from another component (e.g., sensor module 876 or communication module 890) in the volatile memory 832, process the command or data stored in the volatile memory 832, and store the resultant data in the non-volatile memory 834. According to an embodiment, the processor 820 may include a main processor 821 (e.g., a central processing unit or an application processor) or an auxiliary processor 823 (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that is independent of or combined with the main processor 821 in operation. For example, when the electronic device 801 includes a main processor 821 and an auxiliary processor 823, the auxiliary processor 823 may be configured to use lower power than the main processor 821 or to be dedicated to a specified function. The auxiliary processor 823 may be implemented separately from the main processor 821 or as part of the main processor 821.

[0100] When the main processor 821 is in an inactive (e.g., sleep) state, the auxiliary processor 823 (rather than the main processor 821) may control at least some of the functions or states related to at least one component among the components of the electronic device 801 (e.g., display module 860, sensor module 876, or communication module 890), or when the main processor 821 is in an active state (e.g., running an application), the auxiliary processor 823 may control at least some of the functions or states related to at least one component among the components of the electronic device 801 (e.g., display module 860, sensor module 876, or communication module 890) together with the main processor 821. According to an embodiment, the auxiliary processor 823 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 880 or a communication module 890) that is functionally related to the auxiliary processor 823. According to an embodiment, the auxiliary processor 823 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning can be performed by an electronic device 801 in which artificial intelligence is executed or via a separate server (e.g., server 808). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0101] The memory 830 may store various data used by at least one component of the electronic device 801 (e.g., the processor 820 or the sensor module 876). The data may include, for example, software (e.g., the program 840) and input data or output data for commands related thereto. The memory 830 may include a volatile memory 832 or a non-volatile memory 834.

[0102] The program 840 may be stored as software in the memory 830 , and may include, for example, an operating system 842 , middleware 844 , or an application 846 .

[0103] The input module 850 may receive commands or data to be used by components (e.g., the processor 820) of the electronic device 801 from outside (e.g., a user) of the electronic device 801. The input module 850 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0104] The sound output module 855 can output sound signals to the outside of the electronic device 801. The sound output module 855 can include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive an incoming call. Depending on the embodiment, the receiver can be implemented as a separate speaker or as part of the speaker.

[0105] The display module 860 can visually provide information to the outside of the electronic device 801 (e.g., a user). The display 860 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display 860 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the strength of the force generated by the touch.

[0106] The audio module 870 can convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 870 can obtain sound via the input module 850, or output sound via the sound output module 855 or an external electronic device (e.g., electronic device 802) (e.g., a speaker or earphone) directly or wirelessly connected to the electronic device 801.

[0107] The sensor module 876 can detect the operating state (e.g., power or temperature) or the external environment state (e.g., the state of the user) of the electronic device 801, and generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 876 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0108] The interface 877 may support one or more specific protocols for directly or wirelessly connecting the electronic device 801 to an external electronic device (e.g., the electronic device 802). Depending on the implementation, the interface 877 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0109] The connection end 878 may include a connector, and the electronic device 801 may be physically connected to an external electronic device (e.g., the electronic device 802) via the connector. Depending on the embodiment, the connection end 878 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0110] The haptic module 879 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via human tactile or kinesthetic sense. According to an embodiment, the haptic module 879 may include, for example, a motor piezoelectric element or an electrical stimulator.

[0111] The camera module 880 may capture still images and moving images. Depending on the embodiment, the camera module 880 may include one or more lenses, image sensors, image signal processors, or flashes.

[0112] The power management module 888 may manage power supplied to the electronic device 801. According to an embodiment, the power management module 888 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0113] The battery 889 may supply power to at least one component of the electronic device 801. According to an embodiment, the battery 889 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0114] The communication module 890 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 801 and an external electronic device (e.g., electronic device 802, electronic device 804, or server 808), and perform communication via the established communication channel. The communication module 890 may include one or more communication processors that can operate independently of the processor 820 (e.g., an application processor), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 890 may include a wireless communication module 892 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 894 (e.g., a local area network (LAN) communication module or a power line communication module). A corresponding one of these communication modules can communicate with the external electronic device 804 via a first network 898 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 899 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 892 can use the user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 896 to identify or authenticate the electronic device 801 in the communication network (such as the first network 898 or the second network 899).

[0115] The wireless communication module 892 can support 5G networks after 4G networks and next-generation communication technologies, such as new radio (NR) access technology. NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC) or ultra-reliable low-latency communication (URLLC). The wireless communication module 892 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 892 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming or massive antennas. The wireless communication module 892 can support various requirements specified in the electronic device 801, an external electronic device (e.g., electronic device 804) or a network system (e.g., a second network 899). Depending on the embodiment, the wireless communication module 892 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0116] The antenna module 897 may send a signal or power to the outside (e.g., an external electronic device) or receive a signal or power from the outside (e.g., an external electronic device). According to an embodiment, the antenna module 897 may include an antenna including a radiator formed by a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 897 may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 898 or a second network 899) may be selected from a plurality of antennas by, for example, the communication module 890. Then, a signal or power may be sent or received between the communication module 890 and the external electronic device via the selected at least one antenna. According to some embodiments, other parts (e.g., a radio frequency integrated circuit (RFIC)) other than the radiator may be further formed as part of the antenna module 897.

[0117] According to various embodiments, the antenna module 897 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0118] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)), and can exchange signals (e.g., commands or data) with each other.

[0119] According to an embodiment, a command or data may be sent or received between the electronic device 801 and the external electronic device 804 via a server 808 connected to the second network 899. Each of the external electronic devices 802 and 804 may be a device of the same type or a different type as the electronic device 801. According to an embodiment, all or some operations to be run at the electronic device 801 may be run at one or more of the external electronic devices 802, 804, and 808. For example, if the electronic device 801 should automatically perform a function or service or perform a function or service in response to a request from a user or another device, the electronic device 801 may request the one or more external electronic devices to perform at least a part of the function or service instead of running the function or service, or the electronic device 801 may request the one or more external electronic devices to perform at least a part of the function or service in addition to running the function or service. The one or more external electronic devices that receive the request may run at least a part of the function or service requested or another function or another service related to the request, and transmit the result of the operation to the electronic device 801. The electronic device 801 can provide the result as at least a part of the reply to the request when the result is further processed or when the result is not further processed. To this end, for example, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology can be used. The electronic device 801 can use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 804 may include an Internet of Things (IoT) device. The server 808 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 804 or the server 808 may be included in the second network 899. The electronic device 801 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0120] The electronic device according to various embodiments of the present disclosure may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0121] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or replacements of the corresponding embodiments. Regarding the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the singular form of the noun corresponding to the project may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of the items listed together in the corresponding phrase in the phrase. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled to”, “coupled to”, “connected to”, “connected to”, “connected to”, “connected to”, or “connected to” another element (e.g., the second element) with or without the terms “operably” or “communicatively”, this means that the element may be directly (e.g., wired) coupled to, wirelessly coupled to, or coupled to another element via a third element.

[0122] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, depending on the implementation, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0123] The various embodiments described herein may be implemented as software (e.g., program 840) including one or more instructions stored in a storage medium (e.g., internal memory 836 or external memory 838) that can be read by a machine (e.g., electronic device 801). For example, a processor (e.g., processor 820) of a machine (e.g., electronic device 801) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction. This enables the machine to operate according to the at least one instruction called to perform at least one function. The one or more instructions may include code generated by a compiler or code run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Herein, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0124] According to the implementation, the method according to various implementations of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., PlayStore). TM ) publishes (e.g., downloads or uploads) the computer program product online, or distributes (e.g., downloads or uploads) the computer program product directly between two user devices (e.g., smart phones). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a relay server).

[0125] According to various embodiments, each component (e.g., module or program) in the above-mentioned components can include a single entity or multiple entities. Some entities in multiple entities can be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components can be omitted, or one or more other components can be added. Alternatively or additionally, multiple components (e.g., module or program) can be integrated into a single component. In this case, according to various embodiments, the integrated component can still perform one or more functions of each component in the multiple components in the same or similar manner as one or more functions performed by a corresponding component in the multiple components before integration. According to various embodiments, the operation performed by a module, program or another component can be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operation can be run in different orders or omitted, or one or more other operations can be added.

[0126] Fig. 9 900 is a block diagram illustrating a camera module 880 according to various embodiments. Fig. 9 , the camera module 880 may include a lens assembly 910, a flash 920, an image sensor 930, an image stabilizer 940, a memory 950 (e.g., a buffer memory), or an image signal processor 960. The lens assembly 910 may collect light emitted or reflected from an object whose image is to be captured. The lens assembly 910 may include one or more lenses. According to an embodiment, the camera module 880 may include a plurality of lens assemblies 910. In this case, the camera module 880 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 910 may have the same lens properties (e.g., viewing angle, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties different from the lens properties of another lens assembly. The lens assembly 910 may include, for example, a wide-angle lens or a telephoto lens.

[0127] The flashlight 920 may emit light, wherein the emitted light is used to enhance the light reflected from the object. According to an embodiment, the flashlight 920 may include one or more light emitting diodes (LEDs) (e.g., red, green, blue (RGB) LEDs, white LEDs, infrared (IR) LEDs, or ultraviolet (UV) LEDs) or xenon lamps. The image sensor 930 may acquire an image corresponding to the object by converting light emitted or reflected from the object and transmitted via the lens assembly 910 into an electrical signal. According to an embodiment, the image sensor 930 may include one image sensor selected from image sensors with different attributes (such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor), a plurality of image sensors with the same attributes, or a plurality of image sensors with different attributes. Each image sensor included in the image sensor 930 may be implemented using, for example, a charge coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

[0128] The image stabilizer 940 may move the image sensor 930 or at least one lens included in the lens assembly 910 in a specific direction, or control an operational property of the image sensor 930 (e.g., adjust the readout timing) in response to the movement of the camera module 880 or the electronic device 801 including the camera module 880. This allows compensation for at least a portion of the negative effects (e.g., image blur) caused by the movement of the image being captured. According to an embodiment, the image stabilizer 940 may sense such movement of the camera module 880 or the electronic device 801 using a gyroscope sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 880. According to an embodiment, the image stabilizer 940 may be implemented as, for example, an optical image stabilizer. The memory 950 may at least temporarily store at least a portion of the image obtained via the image sensor 930 for subsequent image processing tasks. For example, if multiple images are captured quickly or image capture is delayed due to shutter lag, the acquired original image (e.g., Bayer pattern image, high-resolution image) may be stored in the memory 950, and its corresponding copy image (e.g., low-resolution image) may be previewed via the display device 860. Thereafter, if a specified condition is met (e.g., by a user's input or a system command), at least a portion of the original image stored in the memory 950 may be acquired and processed, for example, by the image signal processor 960. According to an embodiment, the memory 950 may be configured as at least a portion of the memory 830, or as a separate memory that operates independently of the memory 830.

[0129] The image signal processor 960 may perform at least one image processing on an image acquired via the image sensor 930 or an image stored in the memory 950. The at least one image processing may include, for example, depth map generation, three-dimensional (3D) modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor 960 may perform control (e.g., exposure time control or readout timing control) on at least one of the components included in the camera module 880 (e.g., image sensor 930). The image processed by the image signal processor 960 may be stored again in the memory 950 for further processing, or the image may be provided to an external component (e.g., memory 830, display device 860, electronic device 802, electronic device 804, or server 808) outside the camera module 880. According to an embodiment, the image signal processor 960 may be configured as at least a part of the processor 820, or as a separate processor that operates independently of the processor 820. If the image signal processor 960 is configured as a processor separate from the processor 820 , at least one image processed by the image signal processor 960 may be displayed by the processor 820 via the display device 860 as it is or after further processing.

[0130] According to an embodiment, the electronic device 801 may include a plurality of camera modules 880 having different properties or functions. In this case, at least one of the plurality of camera modules 880 may form, for example, a wide-angle camera, and at least another of the plurality of camera modules 880 may form a telephoto camera. Similarly, at least one of the plurality of camera modules 880 may form, for example, a front camera, and at least another of the plurality of camera modules 880 may form a rear camera.

[0131] As described above, the camera module (eg, Figure 1 The camera module 100 may include: a frame (eg, Figure 1 150); a lens unit (eg, lens unit 121) movably disposed relative to the frame and comprising at least one lens; a first carrier (eg, Figure 1 A first carrier 120 of the embodiment of the present invention includes an auto focus (AF) magnet disposed to face the first direction and coupled to the lens unit to move the lens unit in the first direction; and a second carrier (e.g., Figure 1The frame may include a first carrier 130 of the embodiment of the present invention, including a first optical image stabilization (OIS) magnet provided to a first surface and a second OIS magnet provided to a second surface, and moving the lens unit in a second direction and / or in a third direction different from the second direction. The frame may include: a first AF coil provided to the frame to face the AF magnet; a first OIS coil provided to the frame to face the first OIS magnet; and a second OIS coil provided to the frame to face the second OIS magnet. The first carrier may include: a first yoke provided to face the first OIS magnet; and a second yoke provided to face the second OIS magnet.

[0132] According to an embodiment, the camera module may include at least one first sphere disposed between a first carrier and a second carrier such that the first carrier is movable on the second carrier.

[0133] According to an embodiment, the second carrier may include a first ball guide groove on a surface facing the first carrier, the first ball guide groove being arranged such that the at least one first ball is movable in the first direction.

[0134] According to an embodiment, the camera module may include a third carrier disposed between the second carrier and the frame.

[0135] According to an embodiment, the camera module may include at least one second sphere disposed between the second carrier and the third carrier such that the second carrier is movable on the third carrier.

[0136] According to an embodiment, the third carrier may include a second ball guide groove on a surface facing the second carrier, the second ball guide groove being arranged such that the at least one second ball is movable in the second direction.

[0137] According to an embodiment, the camera module may include at least one third sphere disposed between the third carrier and the frame so that the third carrier is movable on the frame.

[0138] According to an embodiment, the frame may include a third ball guide groove on a surface facing the third carrier, the third ball guide groove being provided so that the at least one third ball is movable in the third direction.

[0139] According to an embodiment, the frame may further include a second AF coil facing the first AF coil. The AF magnet may be disposed between the first AF coil and the second AF coil.

[0140] According to an embodiment, the first direction may be the same as or parallel to the optical axis of the lens. The second direction may be a direction perpendicular to the optical axis. The third direction may be a direction perpendicular to the optical axis and the second direction.

[0141] According to an embodiment, the first surface of the second carrier may be substantially perpendicular to the second surface.

[0142] According to an embodiment, the AF magnet may be provided to a portion extending from a surface facing one surface of the first carrier on which the first yoke is provided.

[0143] According to an embodiment, the first OIS magnet and / or the second OIS magnet may be disposed to face the first direction. The first OIS coil may be disposed to the frame to face the first OIS magnet. The second OIS coil may be disposed to the frame to face the second OIS magnet.

[0144] According to an embodiment, the first OIS magnet may be disposed to face the second direction, and the second OIS magnet may be disposed to face the third direction. The first OIS coil may be disposed to the frame to face the first OIS magnet, and the second OIS coil may be disposed to the frame to face the second OIS magnet.

[0145] According to an embodiment, the second carrier may further include: a third OIS magnet disposed on the first surface in parallel with the first OIS magnet; and a fourth OIS magnet disposed on the second surface in parallel with the second OIS magnet. The frame may further include: a third OIS coil disposed to the frame to face the third OIS magnet; and a fourth OIS coil disposed to the frame to face the fourth OIS magnet.

[0146] As described above, an electronic device according to an embodiment of the present disclosure may include: a frame; a lens unit movably disposed relative to the frame and including at least one lens; a first carrier including an AF magnet disposed to face a first direction and coupled to the lens unit to move the lens unit in the first direction; and a second carrier including a first OIS magnet disposed to a first surface and a second OIS magnet disposed to a second surface, and moving the lens unit in a second direction and / or a third direction different from the second direction. The frame may include: a first AF coil disposed to the frame to face the AF magnet; a first OIS coil disposed to the frame to face the first OIS magnet; and a second OIS coil disposed to the frame to face the second OIS magnet. The first carrier may include a first yoke disposed to face the first OIS magnet and a second yoke disposed to face the second OIS magnet.

[0147] According to an embodiment, the electronic device may include at least one first ball, the at least one first ball being disposed between a first carrier and a second carrier so that the first carrier can move on the second carrier. The second carrier may include a first ball guide groove on a surface facing the first carrier, the first ball guide groove being disposed so that the at least one first ball can move in a first direction.

[0148] According to an embodiment, the electronic device may include a third carrier disposed between the second carrier and the frame.

[0149] According to an embodiment, the electronic device may include at least one second ball, the at least one second ball being disposed between the second carrier and the third carrier so that the second carrier can move on the third carrier. The third carrier may include a second ball guide groove on a surface facing the second carrier, the second ball guide groove being disposed so that the at least one second ball can move in the second direction.

[0150] According to an embodiment, the electronic device may include at least one third ball, the at least one third ball being arranged between the third carrier and the frame so that the third carrier can move on the frame. The frame may include a third ball guide groove on a surface facing the third carrier, the third ball guide groove being arranged so that the at least one third ball can move in a third direction.

Claims

1. Camera module, including: frame; a lens unit movably disposed relative to the frame and comprising at least one lens; a first carrier including an AF magnet disposed to face a first direction and coupled to the lens unit to move the lens unit in the first direction; as well as a second carrier including a first OIS magnet provided to the first surface and a second OIS magnet provided to the second surface, and moving the lens unit in a second direction and / or a third direction different from the second direction, wherein the frame comprises: a first AF coil, arranged to the frame to face the AF magnet; a first OIS coil, arranged to the frame to face the first OIS magnet; and a second OIS coil, arranged to the frame to face the second OIS magnet, and The first carrier includes a first yoke arranged to face the first OIS magnet and a second yoke arranged to face the second OIS magnet. 2 . The camera module according to claim 1 , further comprising at least one first sphere disposed between the first carrier and the second carrier such that the first carrier can move on the second carrier.

3. The camera module according to claim 2, wherein: The second carrier includes a first ball guide groove on a surface facing the first carrier, the first ball guide groove being arranged to enable the at least one first ball to move in the first direction. 4 . The camera module of claim 1 , further comprising a third carrier disposed between the second carrier and the frame. 5 . The camera module according to claim 4 , further comprising at least one second sphere disposed between the second carrier and the third carrier such that the second carrier can move on the third carrier.

6. The camera module according to claim 5, wherein: The third carrier includes a second ball guide groove on a surface facing the second carrier, the second ball guide groove being arranged to enable the at least one second ball to move in the second direction. 7 . The camera module of claim 4 , further comprising at least one third sphere disposed between the third carrier and the frame such that the third carrier can move on the frame.

8. The camera module according to claim 7, wherein: The frame includes a third ball guide groove on a surface facing the third carrier, the third ball guide groove being configured to enable the at least one third ball to move in the third direction.

9. The camera module according to claim 1, in, The frame further includes a second AF coil facing the first AF coil, and Wherein, the AF magnet is arranged between the first AF coil and the second AF coil.

10. The camera module according to claim 1, in, The first direction is the same as or parallel to the optical axis of the lens, wherein the second direction is a direction perpendicular to the optical axis, and The third direction is a direction perpendicular to the optical axis and the second direction.

11. The camera module according to claim 1, wherein: The first surface of the second carrier is substantially perpendicular to the second surface.

12. The camera module according to claim 1, wherein: The AF magnet is provided to a portion extending from a surface facing one surface of the first carrier on which the first yoke is provided.

13. The camera module according to claim 1, in, The first OIS magnet and / or the second OIS magnet are arranged to face the first direction, and Wherein, the first OIS coil is disposed to the frame to face the first OIS magnet, and the second OIS coil is disposed to the frame to face the second OIS magnet.

14. The camera module according to claim 1, in, The first OIS magnet is arranged to face the second direction, and the second OIS magnet is arranged to face the third direction, and Wherein, the first OIS coil is disposed to the frame to face the first OIS magnet, and the second OIS coil is disposed to the frame to face the second OIS magnet.

15. The camera module according to claim 1, in, The second carrier further includes: a third OIS magnet disposed on the first surface in parallel with the first OIS magnet; and a fourth OIS magnet disposed on the second surface in parallel with the second OIS magnet, and The frame further includes: a third OIS coil, which is arranged on the frame to face the third OIS magnet; and a fourth OIS coil, which is arranged on the frame to face the fourth OIS magnet.

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