Antenna module

Abstract

The second positive main surface is in contact with the first negative main surface. The one or more first ground conductor layers are positioned on the front side of the signal conductor layer in the Z axis. The one or more first ground conductor layers are not located on the second front main surface. When viewed in the negative direction of the Z-axis, in a first substrate region where the first substrate is provided, there is a ground conductor layer non-formation region where the one or more first ground conductor layers are not provided. The signal conductor layer overlaps the ground conductor layer non-forming region when viewed in the negative direction of the Z-axis. In the ground conductor layer non-forming region, there is no conductor that covers the entire ground conductor layer non-forming region except for the radiation conductor layer on the front side of the signal conductor layer toward the Z axis.

Description

Technical Field

[0001] The invention relates to an antenna module. Background Art

[0002] As a previous invention about an antenna module, for example, there is a known built-in antenna described in Patent Document 1. The built-in antenna includes a dielectric substrate and a printed substrate. An antenna pattern is provided on the upper main surface of the printed substrate. In addition, the dielectric substrate is fixed to the upper main surface of the printed substrate so as to cover the antenna pattern.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2003-179427 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] In addition, in the internal antenna described in Patent Document 1, there is a desire to suppress the formation of a gap between the dielectric substrate and the printed circuit board.

[0008] Therefore, an object of the present invention is to provide an antenna module capable of suppressing the formation of a gap between a first substrate and a second substrate.

[0009] Technical solutions to solve problems

[0010] An antenna module according to one embodiment of the present invention includes a first substrate and a second substrate, wherein:

[0011] The first substrate comprises:

[0012] The first substrate body includes a first insulating material; and

[0013] a radiation conductor layer provided on the first substrate body;

[0014] The second substrate comprises:

[0015] The second substrate body has a structure in which a plurality of second insulating layers including a second insulating material are stacked in a direction along the Z axis;

[0016] a signal conductor layer, provided on the second substrate body; and

[0017] One or more first ground conductor layers are provided on the second substrate body,

[0018] At least one of the first insulating material or the second insulating material is a thermoplastic resin,

[0019] The first substrate body has a first front main surface and a first negative main surface located on the negative side of the Z axis relative to the first front main surface.

[0020] The second substrate body has a second front main surface and a second negative main surface located on the negative side of the Z axis relative to the second front main surface.

[0021] The second positive main surface is in contact with the first negative main surface,

[0022] The one or more first ground conductor layers are located on the positive side of the Z axis than the signal conductor layer.

[0023] The one or more first ground conductor layers are not located on the second main surface,

[0024] When viewed in the negative direction of the Z-axis, a portion of each of the one or more first ground conductor layers overlaps with the radiation conductor layer.

[0025] When viewed in the negative direction of the Z axis, a ground conductor layer non-formed region where the one or more first ground conductor layers are not provided exists in the first substrate region where the first substrate is provided,

[0026] When viewed in the negative direction of the Z axis, the signal conductor layer overlaps with the ground conductor layer non-formation region.

[0027] In the ground conductor layer non-formation region, on the positive side of the Z axis relative to the signal conductor layer, no conductor other than the radiation conductor layer covers the entire ground conductor layer non-formation region.

[0028] Effects of the Invention

[0029] According to the antenna module according to the present invention, it is possible to suppress the formation of a gap between the first substrate and the second substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is an exploded perspective view of the antenna module 10 .

[0031] Figure 2 is a top view of the antenna module 10 .

[0032] Figure 3 is a cross-sectional view of the antenna module 10 .

[0033] Figure 4 is a cross-sectional view of the antenna module 10 a.

[0034] Figure 5 is a cross-sectional view of the antenna module 10 b.

[0035] Figure 6 is a cross-sectional view of the antenna module 10c.

[0036] Figure 7 is a cross-sectional view of the antenna module 10d.

[0037] Figure 8 is a cross-sectional view of the antenna module 10e.

[0038] Fig. 9 is a cross-sectional view of the antenna module 10f.

[0039] Fig.10 is a cross-sectional view of the antenna module 10g.

[0040] Fig.11 is a cross-sectional view of the antenna module 10h.

[0041] Fig.12 It is an exploded perspective view of the antenna module 10i.

[0042] Fig.13 is a cross-sectional view of the antenna module 10j.

[0043] Fig.14 It is a top view of the first substrate 12 .

[0044] Fig.15 is a top view of the antenna module 101. DETAILED DESCRIPTION

[0045] (Implementation Method)

[0046] [Structure of antenna module]

[0047] Hereinafter, the structure of the antenna module 10 according to the embodiment of the present invention will be described with reference to the drawings. Figure 1 is an exploded perspective view of the antenna module 10 . Figure 2 is a top view of the antenna module 10 . Figure 3 is a cross-sectional view of the antenna module 10 . Figure 3 yes Figure 2 Cross-sectional view at AA.

[0048] In this specification, directions are defined as follows. The direction in which the second insulating layers 16a to 16d are arranged in sequence is defined as a downward direction. The downward direction coincides with the negative direction of the Z axis. When viewed in the downward direction, two sides of the first substrate 12 extend along the front-to-back axis. The front-to-back axis coincides with the Y axis. The remaining two sides of the first substrate 12 extend along the left-to-right axis. The left-to-right axis coincides with the X axis. The up-down axis (Z axis), the front-to-back axis (Y axis), and the left-to-right axis (X axis) are orthogonal to each other. In addition, the up-down axis, the front-to-back direction, and the left-to-right axis in this embodiment may not coincide with the up-down axis, the front-to-back axis, and the left-to-right axis when the antenna module 10 is in use.

[0049] First, refer to Figures 1 to 3The structure of the antenna module 10 is described. The antenna module 10 is built into an electronic device such as a wireless communication terminal. Figure 1 As shown, the antenna module 10 includes a first substrate 12 and a second substrate 14 .

[0050] The first substrate 12 includes a first substrate body 40 and a radiation conductor layer 42. The first substrate body 40 has a plate shape. Therefore, the first substrate body 40 has a first positive main surface S1 and a first negative main surface S2. The first negative main surface S2 is located below the first positive main surface S1 (negative side of the Z axis). When viewed from the bottom, the first substrate body 40 has a rectangular shape. When viewed from the bottom, two sides of the first substrate body 40 extend along the front-back axis. The remaining two sides of the first substrate body 40 extend along the left-right axis. The first substrate body 40 includes a first insulating material. The first insulating material is not a thermoplastic resin. The first insulating material is, for example, LTCC (Low Temperature Co-fired Ceramics).

[0051] The radiation conductor layer 42 is provided on the first substrate body 40. In the present embodiment, the radiation conductor layer 42 is located on the first main surface S1 of the first substrate body 40. The radiation conductor layer 42 has a rectangular shape when viewed from below. Two sides of the radiation conductor layer 42 extend along the front-rear axis when viewed from below. The remaining two sides of the radiation conductor layer 42 extend along the left-right axis. The material of such a radiation conductor layer 42 is metal. For example, the metal is copper.

[0052] The second substrate 14 is located below the first substrate 12. The second substrate 14 includes a second substrate body 15, a signal conductor layer 18, a first ground conductor layer 20, a second ground conductor layer 22, and a first interlayer connection conductor v1. The second substrate body 15 has a plate shape. Therefore, the second substrate body 15 has a second positive main surface S11 and a second negative main surface S12. The second negative main surface S12 is located below the second positive main surface S11 (negative side of the Z axis). The thickness of the second substrate 14 in the direction along the up-down axis (Z axis) is smaller than the thickness of the first substrate 12 in the direction along the up-down axis (Z axis). In addition, when viewed from the bottom, the area of ​​the second substrate body 15 is larger than the area of ​​the first substrate body 40. When viewed from the bottom, the outer edge of the first substrate body 40 is contained within the outer edge of the second substrate body 15.

[0053] The second substrate body 15 has a structure in which second insulating layers 16a to 16d including a second insulating material are stacked in a direction along the up-down axis (Z axis). The second insulating layers 16a to 16d are arranged in sequence in the downward direction. In the second insulating layers 16a to 16d, adjacent second insulating layers are welded to each other. The second insulating material is a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. The dielectric constant of the second insulating material is lower than the dielectric constant of the first insulating material. Furthermore, the Young's modulus of the second insulating material is lower than the Young's modulus of the first insulating material.

[0054] Here, the first substrate body 40 is fixed to the second substrate body 15. More specifically, the second positive main surface S11 is in contact with the first negative main surface S2. Furthermore, the first substrate body 40 is fixed to the second substrate body 15 by heat treatment and pressure treatment. During the heat treatment and heating treatment, the melted second insulator layer 16a intrudes into the unevenness of the surface of the first substrate body 40. Thus, the first substrate body 40 is in close contact with the second substrate body 15 and fixed to the second substrate body 15.

[0055] The signal conductor layer 18 is provided on the second substrate body 15. In this embodiment, the signal conductor layer 18 is located on the upper main surface of the second insulating layer 16c. The signal conductor layer 18 has a linear shape extending along the horizontal axis (X axis). High-frequency signals are transmitted in the signal conductor layer 18 as described above.

[0056] The first ground conductor layer 20 is provided on the second substrate body 15. In the present embodiment, the first ground conductor layer 20 is located on the upper main surface of the second insulator layer 16b. Thus, the first ground conductor layer 20 is located above the signal conductor layer 18 (on the positive side of the Z axis). However, the first ground conductor layer 20 is not located on the second main surface S11. Therefore, the first ground conductor layer 20 is located inside the second substrate body 15.

[0057] The first ground conductor layer 20 covers most of the upper main surface of the second insulating layer 16b. Thus, the first ground conductor layer 20 overlaps with the signal conductor layer 18 when viewed from the bottom. However, the first ground conductor layer 20 is not electrically connected to the signal conductor layer 18. In addition, a portion of the first ground conductor layer 20 overlaps with the radiation conductor layer 42 when viewed from the bottom (negative direction of the Z axis). The first ground conductor layer 20 has a portion that does not overlap with the radiation conductor layer 42 when viewed from the bottom (negative direction of the Z axis). The first ground conductor layer 20 as described above is connected to the ground potential.

[0058] The second ground conductor layer 22 is provided on the second substrate body 15. In the present embodiment, the second ground conductor layer 22 is located on the upper main surface of the second insulating layer 16d. Thus, the second ground conductor layer 22 is located below the signal conductor layer 18 (on the negative side of the Z axis).

[0059] The second ground conductor layer 22 covers most of the upper main surface of the second insulating layer 16d. Thus, when viewed from the bottom, the second ground conductor layer 22 overlaps the signal conductor layer 18. Also, when viewed from the bottom (negative direction of the Z axis), the second ground conductor layer 22 overlaps the radiation conductor layer 42. The second ground conductor layer 22 as described above is connected to the ground potential.

[0060] The signal conductor layer 18 , the first ground conductor layer 20 , and the second ground conductor layer 22 as described above have a stripline structure.

[0061] The signal conductor layer 18 , the first ground conductor layer 20 , and the second ground conductor layer 22 are formed by patterning a metal foil adhered to the upper main surfaces of the second insulating layers 16 b to 16 d . The metal foil is, for example, a copper foil.

[0062] The first interlayer connection conductor v1 electrically connects the first ground conductor layer 20 and the second ground conductor layer 22. The first interlayer connection conductor v1 penetrates the second insulating layers 16b and 16c along the vertical axis. The upper end of the first interlayer connection conductor v1 contacts the first ground conductor layer 20. The lower end of the first interlayer connection conductor v1 contacts the second ground conductor layer 22.

[0063] The first interlayer connection conductor v1 is formed by filling a through hole penetrating the second insulating layers 16 b and 16 c along the vertical axis with a conductive paste and curing the conductive paste by heat treatment and pressure treatment.

[0064] In addition, if Figure 2As shown, when viewed in the downward direction (negative direction of the Z axis), the area where the first substrate 12 is provided is defined as the first substrate area A1. When viewed in the downward direction (negative direction of the Z axis), in the first substrate area A1, there are ground conductor layer non-formation areas A0a, A0b, and A0c where the first ground conductor layer 20 is not provided. When viewed in the downward direction, the ground conductor layer non-formation area A0a has a rectangular shape. The two long sides of the ground conductor layer non-formation area A0a extend in the front-to-back direction. The two short sides of the ground conductor layer non-formation area A0a extend in the left-to-right direction. Thus, when viewed in the downward direction (negative direction of the Z axis), the signal conductor layer 18 overlaps with the ground conductor layer non-formation area A0a. In more detail, when viewed in the downward direction, the ground conductor layer non-formation area A0a intersects with the signal conductor layer 18. In the present embodiment, when viewed in the downward direction, the ground conductor layer non-formation area A0a is orthogonal to the signal conductor layer 18. Furthermore, when viewed in the downward direction (negative direction of the Z axis), the ground conductor layer non-formed region A0a is surrounded by the first ground conductor layer 20. The length of the ground conductor layer non-formed region A0a in the direction along the front-back axis (Y axis) is less than half the wavelength of the high-frequency signal transmitted in the signal conductor layer 18.

[0065] When viewed in the downward direction (negative direction of the Z axis), in the ground conductor layer non-formed region A0a, the signal conductor layer 18 overlaps with the radiation conductor layer 42. Figure 3 As shown, in the ground conductor layer non-formed area A0a, above the signal conductor layer 18 (on the positive side of the Z axis), there is no conductor covering the entire ground conductor layer non-formed area A0a except the radiation conductor layer 42. As a result, the signal conductor layer 18 and the radiation conductor layer 42 are electromagnetically coupled. In the present embodiment, the signal conductor layer 18 and the radiation conductor layer 42 are mainly magnetically coupled. As a result, the high-frequency signal transmitted in the signal conductor layer 18 is transmitted to the radiation conductor layer 42 through the ground conductor layer non-formed area A0a by the electromagnetic field. In addition, a standing wave of the high-frequency signal is generated in the radiation conductor layer 42. The radiation conductor layer 42 radiates the electromagnetic wave of the high-frequency signal in the upward direction. Based on the same principle, the radiation conductor layer 42 receives the electromagnetic wave.

[0066] [Effect]

[0067] According to the antenna module 10, it is possible to suppress the formation of a gap between the first substrate 12 and the second substrate 14. In more detail, the first grounding conductor layer 20 is not located on the second front main surface S11. That is, the first grounding conductor layer 20 is located inside the second substrate body 15. As a result, the contact area between the second front main surface S11 and the first negative main surface S2 becomes larger. The first grounding conductor layer 20 having a large area does not hinder the bonding of the first substrate 12 and the second substrate 14. As a result, according to the antenna module 10, it is possible to suppress the formation of a gap between the first substrate 12 and the second substrate 14.

[0068] Furthermore, at least one of the first insulating material or the second insulating material is a thermoplastic resin. In the present embodiment, the second insulating material is a thermoplastic resin. Thus, if the first substrate body 40 and the second substrate body 15 are subjected to heat treatment and pressure treatment, the molten second insulating layer 16a invades the surface unevenness of the first substrate body 40. As a result, the first substrate body 40 is in close contact with the second substrate body 15 and is fixed to the second substrate body 15. As described above, the second positive main surface S11 and the first negative main surface S2 are in contact with a large area, and the second positive main surface S11 and the first negative main surface S2 are in close contact. Therefore, according to the antenna module 10, it is possible to suppress the formation of a gap between the first substrate 12 and the second substrate 14.

[0069] In addition, the first ground conductor layer 20 overlaps with the radiation conductor layer 42 and overlaps with the signal conductor layer 18. Therefore, the first ground conductor layer 20 exists in the first substrate area A1 and also exists outside the first substrate area A1. In this case, it is conceivable to provide the first ground conductor layer 20 on the first substrate 12 and provide the first ground conductor layer 20 on the second substrate 14. However, the first ground conductor layer 20 is divided and arranged on a plurality of insulating layers.

[0070] Therefore, the first ground conductor layer 20 is not located in the first substrate 12 but in the second substrate 14. Therefore, the first ground conductor layer 20 does not straddle the first substrate 12 and the second substrate 14. Thus, the first ground conductor layer 20 is located on the upper main surface of one second insulating layer 16b.

[0071] According to the antenna module 10, the radiating conductor layer 42 can be miniaturized. More specifically, the dielectric constant of the second insulating material is lower than the dielectric constant of the first insulating material. In other words, the dielectric constant of the first insulating material is higher than the dielectric constant of the second insulating material. Therefore, in the first substrate body 40 provided with the radiating conductor layer 42, a wavelength shortening effect is produced. As a result, the radiating conductor layer 42 can be miniaturized.

[0072] According to the antenna module 10, the radiation efficiency of the antenna module 10 is improved. More specifically, the thickness of the second substrate 14 in the direction along the vertical axis is smaller than the thickness of the first substrate 12 in the direction along the vertical axis. In other words, the thickness of the first substrate 12 in the direction along the vertical axis is larger than the thickness of the second substrate 14 in the direction along the vertical axis. As a result, the distance between the radiation conductor layer 42 and the first ground conductor layer 20 is increased. As a result, the electromagnetic field near the radiation conductor layer 42 becomes easy to leak from the first substrate 12. As a result, the radiation efficiency of the antenna module 10 is improved.

[0073] In the antenna module 10 , the radiation conductor layer 42 is located on the first front principal surface S1 . This increases the distance between the radiation conductor layer 42 and the first ground conductor layer 20 . As a result, the radiation efficiency of the antenna module 10 is improved.

[0074] According to the antenna module 10, it is possible to suppress the distance between the radiation conductor layer 42 and the first ground conductor layer 20 from being varied. More specifically, the Young's modulus of the second insulating material is lower than that of the first insulating material. In other words, the Young's modulus of the first insulating material is higher than that of the second insulating material. As a result, the first substrate body 40 is less likely to be deformed. As a result, it is possible to suppress the distance between the radiation conductor layer 42 and the first ground conductor layer 20 from being varied.

[0075] According to the antenna module 10, the second substrate 14 is larger than the first substrate 12. Thus, the second substrate 14 can be curved, and thus the antenna module 10 can be arranged in a gap having a curved shape.

[0076] In the antenna module 10, solder is not used for joining the first substrate 12 and the second substrate 14. Therefore, the thickness of the antenna module 10 in the direction along the vertical axis is determined by the thickness of the first substrate 12 in the vertical direction and the thickness of the second substrate 14 in the vertical direction. As a result, the variation in the distance between the radiation conductor layer 42 and the signal conductor layer 18 can be suppressed, and the variation in the radiation characteristics of the antenna module 10 can be reduced.

[0077] In the antenna module 10 , the first insulating material and the second insulating material are different. Therefore, an inexpensive material can be used for either the first insulating material or the second insulating material. As a result, according to the antenna module 10 , the manufacturing cost of the antenna module 10 can be reduced.

[0078] (First Modification)

[0079] Hereinafter, an antenna module 10a according to a first modification will be described with reference to the drawings. Figure 4 is a cross-sectional view of the antenna module 10 a.

[0080] The antenna module 10a is different from the antenna module 10 in that it further includes a third ground conductor layer 23 and a second interlayer connection conductor v2. The third ground conductor layer 23 is located on the upper main surface of the second insulating layer 16a. However, when viewed from below, the third ground conductor layer 23 is not provided in the first substrate area A1 where the first substrate body 40 is provided.

[0081] The second interlayer connection conductor v2 electrically connects the first ground conductor layer 20 and the third ground conductor layer 23. The second interlayer connection conductor v2 penetrates the second insulating layer 16a along the vertical axis. The upper end of the second insulating layer 16a is in contact with the third ground conductor layer 23. The lower end of the second insulating layer 16a is in contact with the first ground conductor layer 20.

[0082] The first ground conductor layer 20 has a third positive main surface S31 and a third negative main surface S32. The third negative main surface S32 is located below the third positive main surface S31 (negative side of the Z axis). The surface roughness of the third positive main surface S31 is smaller than that of the third negative main surface S32.

[0083] The signal conductor layer 18 has a fourth front main surface S41 and a fourth negative main surface S42. The fourth negative main surface S42 is located below the fourth front main surface S41. The surface roughness of the fourth front main surface S41 is smaller than the surface roughness of the fourth negative main surface S42.

[0084] In addition, the second grounding conductor layer 22 is located on the lower main surface of the second insulating layer 16d. The second grounding conductor layer 22 has a fifth positive main surface S51 and a fifth negative main surface S52. The fifth negative main surface S52 is located below the fifth positive main surface S51. Moreover, the surface roughness of the fifth negative main surface S52 is smaller than the surface roughness of the fifth positive main surface S51.

[0085] The third ground conductor layer 23 has a sixth positive principal surface S61 and a sixth negative principal surface S62. The sixth negative principal surface S62 is located below the sixth positive principal surface S61. Moreover, the surface roughness of the sixth positive principal surface S61 is smaller than the surface roughness of the sixth negative principal surface S62. The other structures of the antenna module 10a are the same as those of the antenna module 10, so the description is omitted. The antenna module 10a can achieve the same effect as the antenna module 10.

[0086] According to the antenna module 10a, the surface roughness of the third front main surface S31 is smaller than the surface roughness of the third negative main surface S32. Therefore, the radiation conductor layer 42 and the third front main surface S31 having a smaller surface roughness face each other. Therefore, the power loss in the radiation conductor layer 42 can be reduced. In addition, when resonance occurs in the radiation conductor layer 42, the loss caused by the resonance current flowing near the third front main surface S31 can be reduced.

[0087] (Second modification)

[0088] Hereinafter, an antenna module 10b according to a second modification will be described with reference to the drawings. Figure 5 is a cross-sectional view of the antenna module 10 b.

[0089] The difference between the antenna module 10b and the antenna module 10 is that a recessed portion G is formed in the second substrate body 15, and the first substrate 12 is located in the recessed portion G. More specifically, when the first substrate 12 is fixed to the second substrate 14, the first substrate 12 and the second substrate 14 are subjected to a heating process and a pressurizing process. At this time, the second substrate 14 is pressed downward by the first substrate 12 and deformed. As a result, a recessed portion G is formed in the second substrate body 15, and the first substrate 12 is located in the recessed portion G.

[0090] Here, the first substrate body 40 has a first side surface S3 connecting the first front main surface S1 and the first negative main surface S2 . Since the first substrate 12 is located in the recessed portion G, the first side surface S3 is in contact with the second substrate body 15 .

[0091] In addition, the second substrate body 15 has a first section A11 that overlaps with the first substrate 12 when viewed in the downward direction (negative direction of the Z axis) and second sections A12a and A12b that do not overlap with the first substrate 12 when viewed in the downward direction (negative direction of the Z axis). Moreover, the first main surface S1 and the second main surface S11 in the second sections A12a and A12b are included in one plane. That is, the position of the vertical axis of the first main surface S1 is the same as the position of the vertical axis of the second main surface S11 in the second sections A12a and A12b.

[0092] In addition, a portion of the first ground conductor layer 20 in the second sections A12a and A12b is located above the first negative main surface S2 (on the positive side of the Z axis). The other structures of the antenna module 10b are the same as those of the antenna module 10, so the description thereof is omitted. The antenna module 10b can achieve the same effects as the antenna module 10.

[0093] According to the antenna module 10b, the gain of the antenna module 10b is improved. More specifically, the first ground conductor layer 20 is present in front of and behind and to the left and right of the space between the radiation conductor layer 42 and the first ground conductor layer 20. That is, when viewed from the bottom, the space between the radiation conductor layer 42 and the first ground conductor layer 20 is surrounded by the first ground conductor layer 20. Thus, it is possible to suppress the leakage of the electromagnetic field from the space between the radiation conductor layer 42 and the first ground conductor layer 20. As a result, the gain of the antenna module 10b is improved.

[0094] In the antenna module 10b, a portion of the first ground conductor layer 20 in the second sections A12a and A12b is located above the first negative main surface S2 (on the positive side of the Z axis). As a result, when viewed from below, the space between the radiation conductor layer 42 and the first ground conductor layer 20 is surrounded by the first ground conductor layer 20. Therefore, when there are a plurality of radiation conductor layers 42, electromagnetic field coupling between the plurality of radiation conductor layers 42 can be suppressed.

[0095] In the antenna module 10b, the portion of the first ground conductor layer 20 located below the radiation conductor layer 42 and the portions of the first ground conductor layer 20 located before, after, and to the left and right of the radiation conductor layer 42 are continuously connected. Thus, an interlayer connection conductor having an inductance component is not required. As a result, the antenna module 10b can be widened. In addition, the first ground conductor layer 20 surrounds the first substrate 12 when viewed from below. Thus, leakage of the electric field from the first side surface S3 of the first substrate 12 can be suppressed, and generation of noise can be suppressed.

[0096] In the antenna module 10b, the first main surface S1 and the second main surface S11 in the second sections A12a and A12b are included in one plane. Thus, the upper main surface of the antenna module 10b is nearly flat. As a result, other components can be arranged near the upper main surface of the antenna module 10b.

[0097] (Third Modification)

[0098] Hereinafter, an antenna module 10c according to a third modification will be described with reference to the drawings. Figure 6 is a cross-sectional view of the antenna module 10c.

[0099] The difference between the antenna module 10c and the antenna module 10b is that the thickness of the first substrate body 40 along the vertical axis is greater. Therefore, the first substrate body 40 protrudes upward from the second main surface S11 of the second substrate body 15. The other structures of the antenna module 10c are the same as those of the antenna module 10b, so the description is omitted. The antenna module 10c can achieve the same effect as the antenna module 10b.

[0100] In the antenna module 10c, the thickness of the first substrate body 40 in the direction along the vertical axis is large. This increases the distance between the radiation conductor layer 42 and the first ground conductor layer 20. As a result, the radiation efficiency of the antenna module 10 is improved.

[0101] (Fourth Modification)

[0102] Hereinafter, an antenna module 10d according to a fourth modification will be described with reference to the drawings. Figure 7 is a cross-sectional view of the antenna module 10d.

[0103] The difference between the antenna module 10d and the antenna module 10b is that the corner between the first side surface S3 and the first negative main surface S2 is chamfered. In this embodiment, the corner between the first side surface S3 and the first negative main surface S2 is C-chamfered. The other structures of the antenna module 10d are the same as those of the antenna module 10b, so the description is omitted. The antenna module 10d can achieve the same effect as the antenna module 10b.

[0104] In the antenna module 10d, the corners between the first side surface S3 and the first negative main surface S2 are chamfered, thereby reducing the deformation amount of the second substrate body 15. In addition, the first substrate body 40 and the second substrate body 15 are more closely bonded.

[0105] (Fifth Modification)

[0106] Hereinafter, an antenna module 10e according to a fifth modification will be described with reference to the drawings. Figure 8 is a cross-sectional view of the antenna module 10e.

[0107] The difference between the antenna module 10e and the antenna module 10b is that a step is provided at the corner between the first side surface S3 and the first negative main surface S2. The other structures of the antenna module 10e are the same as those of the antenna module 10b, so the description is omitted. The antenna module 10e can achieve the same effect as the antenna module 10b.

[0108] In the antenna module 10e, a step is provided at the corner between the first side surface S3 and the first negative main surface S2, thereby reducing the deformation amount of the second substrate body 15. In addition, the first substrate body 40 and the second substrate body 15 are more closely bonded.

[0109] (Sixth Modification)

[0110] Hereinafter, an antenna module 10f according to a sixth modification will be described with reference to the drawings. Fig. 9 is a cross-sectional view of the antenna module 10f.

[0111] The difference between the antenna module 10f and the antenna module 10b is that the corner between the first side surface S3 and the first negative main surface S2 is chamfered. In this embodiment, the corner between the first side surface S3 and the first negative main surface S2 is R-chamfered. The other structures of the antenna module 10f are the same as those of the antenna module 10b, so the description is omitted. The antenna module 10f can achieve the same effect as the antenna module 10b.

[0112] In the antenna module 10f, the corners between the first side surface S3 and the first negative main surface S2 are chamfered, thereby reducing the deformation amount of the second substrate body 15. In addition, the first substrate body 40 and the second substrate body 15 are more closely bonded.

[0113] (Seventh Modification)

[0114] Hereinafter, an antenna module 10g according to a seventh modification will be described with reference to the drawings. Fig.10 is a cross-sectional view of the antenna module 10g.

[0115] The difference between the antenna module 10g and the antenna module 10f is that the first insulating material is a thermoplastic resin. When the first insulating material is a thermoplastic resin, when the first substrate 12 and the second substrate 14 are subjected to a pressurization process and a heat treatment, the corners of the first side surface S3 and the first negative main surface S2 are deformed. As a result, the corners of the first side surface S3 and the first negative main surface S2 are R-chamfered. The other structures of the antenna module 10g are the same as those of the antenna module 10f, so the description is omitted. The antenna module 10g can achieve the same effect as the antenna module 10f.

[0116] In the antenna module 10g, the first insulating material is a thermoplastic resin. Therefore, when the first substrate 12 and the second substrate 14 are subjected to a pressurization process and a heat treatment, the angles of the first side surface S3 and the first negative main surface S2 are deformed. Therefore, the deformation amount of the second substrate body 15 can be reduced. In addition, the first substrate body 40 and the second substrate body 15 are more closely bonded.

[0117] (Variant 8)

[0118] Hereinafter, an antenna module 10h according to an eighth modification will be described with reference to the drawings. Fig.11 is a cross-sectional view of the antenna module 10h.

[0119] The difference between the antenna module 10h and the antenna module 10b is that the second section A12b of the second substrate 14 is curved when viewed in the front direction (direction perpendicular to the Z axis). The other structures of the antenna module 10h are the same as those of the antenna module 10b, so the description thereof is omitted. The antenna module 10h can achieve the same effects as the antenna module 10b.

[0120] (9th variant)

[0121] Hereinafter, an antenna module 10i according to a ninth modification will be described with reference to the drawings. Fig.12 It is an exploded perspective view of the antenna module 10i.

[0122] The antenna module 10i is different from the antenna module 10 in the following respects.

[0123] · Radiating conductor layers 42 a and 42 b are provided instead of the radiating conductor layer 42 .

[0124] The first substrate 12 further includes external electrodes 43 a and 43 b and interlayer connection conductors v11 and v12 .

[0125] The second substrate 14 further includes interlayer connection conductors v7 and v8.

[0126] The radiation conductor layers 42a and 42b are located on the first main surface S1 of the first substrate body 40. The radiation conductor layers 42a and 42b have a rectangular shape when viewed from below. The radiation conductor layer 42a is located on the left side of the ground conductor layer non-formed area A0a when viewed from below. The radiation conductor layer 42b is located on the right side of the ground conductor layer non-formed area A0a when viewed from below.

[0127] The external electrodes 43a and 43b are located on the first negative main surface S2 of the first substrate body 40. The external electrodes 43a and 43b have a rectangular shape when viewed from the bottom. The external electrode 43a overlaps with the radiation conductor layer 42a when viewed from the bottom. The external electrode 43b overlaps with the radiation conductor layer 42b when viewed from the bottom. The entirety of the external electrodes 43a and 43b overlaps with the first ground conductor layer 20 when viewed from the bottom.

[0128] The interlayer connection conductor v11 electrically connects the radiation conductor layer 42a and the external electrode 43a. The interlayer connection conductor v11 penetrates the first substrate body 40 along the vertical axis. The upper end of the interlayer connection conductor v11 contacts the radiation conductor layer 42a. The lower end of the interlayer connection conductor v11 contacts the external electrode 43a.

[0129] The interlayer connection conductor v12 electrically connects the radiation conductor layer 42b and the external electrode 43b. The interlayer connection conductor v12 penetrates the first substrate body 40 along the vertical axis. The upper end of the interlayer connection conductor v12 contacts the radiation conductor layer 42b. The lower end of the interlayer connection conductor v12 contacts the external electrode 43b.

[0130] The interlayer connection conductor v7 electrically connects the first grounding conductor layer 20 and the external electrode 43a. The interlayer connection conductor v7 penetrates the second insulating layer 16a along the vertical axis. The upper end of the interlayer connection conductor v7 is exposed on the upper main surface of the second insulating layer 16a. Moreover, the upper end of the interlayer connection conductor v7 is in contact with the external electrode 43a. The lower end of the interlayer connection conductor v7 is in contact with the first grounding conductor layer 20.

[0131] The interlayer connection conductor v8 electrically connects the first grounding conductor layer 20 and the external electrode 43b. The interlayer connection conductor v8 penetrates the second insulating layer 16b along the vertical axis. The upper end of the interlayer connection conductor v8 is exposed on the upper main surface of the second insulating layer 16a. Moreover, the upper end of the interlayer connection conductor v8 is in contact with the external electrode 43b. The lower end of the interlayer connection conductor v8 is in contact with the first grounding conductor layer 20.

[0132] The other structures of the antenna module 10i are the same as those of the antenna module 10b, and thus the description thereof is omitted. The antenna module 10i can achieve the same effects as those of the antenna module 10b.

[0133] The antenna module 10i is provided with the interlayer connection conductors v11 and v12. This improves the degree of freedom in designing the antenna including the radiation conductor layer 42. As a result, the degree of freedom in designing the directivity of the antenna module 10i is increased.

[0134] (10th variant)

[0135] Hereinafter, an antenna module 10j according to a tenth modification will be described with reference to the drawings. Fig.13 is a cross-sectional view of the antenna module 10j.

[0136] The antenna module 10j is different from the antenna module 10b in that the antenna module 10j includes three first substrates 12. As described above, the antenna module 10j may include a plurality of radiation conductor layers 42.

[0137] (11th variant)

[0138] Hereinafter, an antenna module 10k according to an eleventh modified example will be described with reference to the drawings. Fig.14 It is a top view of the first substrate 12 .

[0139] The antenna module 10k is different from the antenna module 10b in the shape of the first substrate body 40. When viewed from below, four corners of the first substrate body 40 are chamfered. More specifically, when viewed from below, four corners of the first substrate body 40 are R-chamfered. The other structures of the antenna module 10k are the same as those of the antenna module 10b, so the description thereof is omitted. The antenna module 10k can achieve the same effects as the antenna module 10b.

[0140] In the antenna module 10k, the four corners of the first substrate body 40 are chamfered when viewed from below. This can reduce the deformation of the second substrate body 15. In addition, the first substrate body 40 and the second substrate body 15 are more closely bonded.

[0141] (12th Modification)

[0142] Hereinafter, an antenna module 101 according to a twelfth modification will be described with reference to the drawings. Fig.15 is a top view of the antenna module 101. Fig.15 The state before the first substrate 12 is fixed to the second substrate 14 is shown.

[0143] The difference between the antenna module 101 and the antenna module 10b is that the first ground conductor layer 20 is provided with notches C1 to C4. The notch C1 is provided near the left front corner of the first substrate body 40. The notch C2 is provided near the right front corner of the first substrate body 40. The notch C3 is provided near the left rear corner of the first substrate body 40. The notch C4 is provided near the right rear corner of the first substrate body 40. The other structures of the antenna module 101 are the same as those of the antenna module 10b, so the description thereof is omitted. The antenna module 101 can achieve the same effects as the antenna module 10b.

[0144] In the antenna module 101 , the notches C1 to C4 are provided in the first ground conductor layer 20 . This can prevent wrinkles from being generated near the four corners of the first substrate body 40 in the first ground conductor layer 20 when the first substrate 12 is fixed to the second substrate 14 .

[0145] (Other Implementations)

[0146] The antenna module according to the present invention is not limited to the antenna modules 10 and 10a to 101, and can be modified within the scope of the gist thereof. In addition, the structures of the antenna modules 10 and 10a to 101 can be arbitrarily combined.

[0147] In addition, at least one of the first insulating material and the second insulating material may be a thermoplastic resin. Therefore, the second insulating material may not be a thermoplastic resin, and the first insulating material may be a thermoplastic resin.

[0148] In addition, the first insulating material and the second insulating material may be the same material. In this case, the first substrate 12 and the second substrate 14 can be prevented from warping.

[0149] In addition, the number of the first ground conductor layer is not limited to one. The number of the first ground conductor layer can be more than one. When the number of the first ground conductor layer is two, a ground conductor layer non-forming area A0a is formed between the two first ground conductor layers. In this case, the ground conductor layer non-forming area A0a is not surrounded by the first ground conductor layer. For example, when viewed from the bottom, the first ground conductor layer does not exist in front of and behind the ground conductor layer non-forming area A0a. In addition, when viewed from the bottom, a portion of each of the two first ground conductor layers overlaps with the radiation conductor layer 42.

[0150] The dielectric constant of the second insulating material may be equal to or greater than the dielectric constant of the first insulating material. In this case, the capacitance between the radiation conductor layer 42 and the first ground conductor layer 20 can be reduced. As a result, the radiation efficiency of the antenna module is improved.

[0151] In addition, the surface roughness of the third positive main surface S31 may be equal to or greater than the surface roughness of the third negative main surface S32 .

[0152] In addition, the thickness of the second substrate 14 in the direction along the vertical axis may be greater than the thickness of the first substrate 12 in the direction along the vertical axis.

[0153] In addition, the Young's modulus of the second insulating material may be equal to or greater than the Young's modulus of the first insulating material.

[0154] In addition, the radiation conductor layer 42 may be located inside the first substrate body 40 . In this case, the radiation conductor layer 42 is protected by the first substrate body 40 .

[0155] In addition, the radiation conductor layer 42 may be located on the first negative main surface S2 of the first substrate body 40. In this case, the electromagnetic field coupling between the radiation conductor layer 42 and the signal conductor layer 18 is strengthened.

[0156] In addition, the thickness of the first substrate body 40 in the direction along the vertical axis is greater than the thickness of the second substrate body 15 in the direction along the vertical axis. Therefore, when the first substrate body 40 has a structure in which a plurality of first insulating layers are stacked, the number of sheets can be reduced by making the thickness of the first insulating layer greater than the thickness of the second insulating layers 16a to 16d.

[0157] In addition, the second ground conductor layer 22 is not an essential component.

[0158] Furthermore, in the antenna modules 10 and 10a to 101, a plurality of first interlayer connecting conductors v1 may be provided.

[0159] The present invention has the following structures. (1)

[0161] An antenna module includes a first substrate and a second substrate, wherein:

[0162] The first substrate comprises:

[0163] The first substrate body includes a first insulating material; and

[0164] a radiation conductor layer provided on the first substrate body;

[0165] The second substrate comprises:

[0166] The second substrate body has a structure in which a plurality of second insulating layers including a second insulating material are stacked in a direction along the Z axis;

[0167] a signal conductor layer, provided on the second substrate body; and

[0168] One or more first ground conductor layers are provided on the second substrate body,

[0169] At least one of the first insulating material or the second insulating material is a thermoplastic resin,

[0170] The first substrate body has a first front main surface and a first negative main surface located on the negative side of the Z axis relative to the first front main surface.

[0171] The second substrate body has a second front main surface and a second negative main surface located on the negative side of the Z axis relative to the second front main surface.

[0172] The second positive main surface is in contact with the first negative main surface,

[0173] The one or more first ground conductor layers are located on the positive side of the Z axis than the signal conductor layer.

[0174] The one or more first ground conductor layers are not located on the second main surface,

[0175] When viewed in the negative direction of the Z-axis, a portion of each of the one or more first ground conductor layers overlaps with the radiation conductor layer.

[0176] When viewed in the negative direction of the Z axis, a ground conductor layer non-formed region where the one or more first ground conductor layers are not provided exists in the first substrate region where the first substrate is provided,

[0177] When viewed in the negative direction of the Z axis, the signal conductor layer overlaps with the ground conductor layer non-formation region.

[0178] In the ground conductor layer non-formation region, on the positive side of the Z axis relative to the signal conductor layer, no conductor other than the radiation conductor layer covers the entire ground conductor layer non-formation region. (2)

[0180] The antenna module according to (1), wherein:

[0181] The dielectric constant of the second insulating material is lower than the dielectric constant of the first insulating material. (3)

[0183] The antenna module according to any one of (1) or (2), wherein:

[0184] The first ground conductor layer has a third front main surface and a third negative main surface located on the negative side of the Z axis relative to the third front main surface.

[0185] The surface roughness of the third front main surface is smaller than the surface roughness of the third negative main surface. (4)

[0187] The antenna module according to any one of (1) to (3), wherein:

[0188] The thickness of the second substrate in the direction along the Z axis is smaller than the thickness of the first substrate in the direction along the Z axis. (5)

[0190] The antenna module according to any one of (1) to (4), wherein:

[0191] The Young's modulus of the second insulating material is lower than the Young's modulus of the first insulating material. (6)

[0193] The antenna module according to any one of (1) to (5), wherein:

[0194] The first substrate body has a first side surface connecting the first front main surface and the first negative main surface.

[0195] The first side surface is in contact with the second substrate body. (7)

[0197] The antenna module according to (6), wherein:

[0198] The second substrate body comprises:

[0199] The first section overlaps with the first substrate when viewed in the negative direction of the Z axis; and

[0200] The second section does not overlap with the first substrate when viewed in the negative direction of the Z axis,

[0201] A portion of the first ground conductor layer in the second section is located on the positive side of the Z axis with respect to the first negative main surface. (8)

[0203] The antenna module according to (6) or (7), wherein:

[0204] The second substrate body comprises:

[0205] The first section overlaps with the first substrate when viewed in the negative direction of the Z axis; and

[0206] The second section does not overlap with the first substrate when viewed in the negative direction of the Z axis,

[0207] The first main surface and the second main surface in the second section are included in one plane. (9)

[0209] The antenna module according to any one of (6) to (8), wherein:

[0210] A corner between the first side surface and the first negative main surface is chamfered. (10)

[0212] The antenna module according to any one of (6) to (8), wherein:

[0213] A step is provided at a corner between the first side surface and the first negative main surface. (11)

[0215] The antenna module according to any one of (1) to (10), wherein:

[0216] The first insulating material is a thermoplastic resin. (12)

[0218] The antenna module according to any one of (1) to (10), wherein:

[0219] The second insulating material is a thermoplastic resin. (13)

[0221] The antenna module according to any one of (1) to (12), wherein:

[0222] The second substrate has:

[0223] The first section overlaps with the first substrate when viewed in the negative direction of the Z axis; and

[0224] The second section does not overlap with the first substrate when viewed in the negative direction of the Z axis,

[0225] The second section of the second substrate is curved when viewed in a direction perpendicular to the Z axis. (14)

[0227] The antenna module according to any one of (1) to (13), wherein:

[0228] The signal conductor layer extends along the X-axis,

[0229] The Y axis is orthogonal to the X axis and the Z axis,

[0230] The length of the ground conductor layer non-formed region in the direction along the Y-axis is equal to or less than half the wavelength of a high-frequency signal transmitted through the signal conductor layer. (15)

[0232] The antenna module according to any one of (1) to (14), wherein:

[0233] The signal conductor layer extends along the X-axis,

[0234] The Y axis is orthogonal to the X axis and the Z axis,

[0235] The ground conductor layer non-formed region is surrounded by the first ground conductor layer when viewed in the negative direction of the Z-axis. (16)

[0237] The antenna module according to any one of (1) to (15), wherein:

[0238] The second substrate further comprises:

[0239] a second ground conductor layer provided on the second substrate body;

[0240] The second ground conductor layer is located on the negative side of the Z axis than the signal conductor layer.

[0241] The second ground conductor layer overlaps the radiation conductor layer when viewed in the negative direction of the Z-axis.

[0242] Description of Reference Numerals

[0243] 10, 10a~10l: antenna module;

[0244] 12: 1st substrate;

[0245] 14: 2nd substrate;

[0246] 15: The second substrate main body;

[0247] 16a-16d: second insulating layer;

[0248] 18: signal conductor layer;

[0249] 20: 1st ground conductor layer;

[0250] 22: second ground conductor layer;

[0251] 23: The third ground conductor layer;

[0252] 40: 1st substrate main body;

[0253] 42, 42a, 42b: radiation conductor layer;

[0254] 43a, 43b: external electrodes;

[0255] A0a: ground conductor layer non-formation area;

[0256] A1: 1st substrate area;

[0257] A11: Interval 1;

[0258] A12a, A12b: Interval 2;

[0259] G: concave part;

[0260] S1: The first main surface;

[0261] S11: 2nd main surface;

[0262] S12: 2nd negative main surface;

[0263] S2: 1st negative main surface;

[0264] S3: side 1;

[0265] S31: 3rd main surface;

[0266] S32: 3rd negative main surface;

[0267] S41: 4th front;

[0268] S42: 4th negative main surface;

[0269] S51: The fifth front;

[0270] S52: 5th negative main surface;

[0271] S61: The 6th front;

[0272] S62: The 6th negative main surface.

Claims

1. An antenna module comprising a first substrate and a second substrate, wherein: The first substrate comprises: The first substrate body includes a first insulating material; and a radiation conductor layer provided on the first substrate body; The second substrate comprises: The second substrate body has a structure in which a plurality of second insulating layers including a second insulating material are stacked in a direction along the Z axis; a signal conductor layer, provided on the second substrate body; and One or more first ground conductor layers are provided on the second substrate body, At least one of the first insulating material or the second insulating material is a thermoplastic resin, The first substrate body has a first front main surface and a first negative main surface located on the negative side of the Z axis relative to the first front main surface. The second substrate body has a second front main surface and a second negative main surface located on the negative side of the Z axis relative to the second front main surface. The second positive main surface is in contact with the first negative main surface, The one or more first ground conductor layers are located on the positive side of the Z axis than the signal conductor layer. The one or more first ground conductor layers are not located on the second main surface, When viewed in the negative direction of the Z-axis, a portion of each of the one or more first ground conductor layers overlaps with the radiation conductor layer. When viewed in the negative direction of the Z axis, a ground conductor layer non-formed region where the one or more first ground conductor layers are not provided exists in the first substrate region where the first substrate is provided, When viewed in the negative direction of the Z axis, the signal conductor layer overlaps with the ground conductor layer non-formation region. In the ground conductor layer non-formation region, on the positive side of the Z axis relative to the signal conductor layer, no conductor other than the radiation conductor layer covers the entire ground conductor layer non-formation region.

2. The antenna module according to claim 1, wherein: The dielectric constant of the second insulating material is lower than the dielectric constant of the first insulating material.

3. The antenna module according to any one of claim 1 or claim 2, wherein: The first ground conductor layer has a third front main surface and a third negative main surface located on the negative side of the Z axis relative to the third front main surface. The surface roughness of the third front main surface is smaller than the surface roughness of the third negative main surface.

4. The antenna module according to any one of claims 1 to 3, wherein: The thickness of the second substrate in the direction along the Z axis is smaller than the thickness of the first substrate in the direction along the Z axis.

5. The antenna module according to any one of claims 1 to 4, wherein: The Young's modulus of the second insulating material is lower than the Young's modulus of the first insulating material.

6. The antenna module according to any one of claims 1 to 5, wherein: The first substrate body has a first side surface connecting the first front main surface and the first negative main surface. The first side surface is in contact with the second substrate body.

7. The antenna module according to claim 6, wherein: The second substrate body comprises: The first section overlaps with the first substrate when viewed in the negative direction of the Z axis; and The second section does not overlap with the first substrate when viewed in the negative direction of the Z axis, A portion of the first ground conductor layer in the second section is located on the positive side of the Z axis with respect to the first negative main surface.

8. The antenna module according to claim 6 or claim 7, wherein: The second substrate body comprises: The first section overlaps with the first substrate when viewed in the negative direction of the Z axis; and The second section does not overlap with the first substrate when viewed in the negative direction of the Z axis, The first main surface and the second main surface in the second section are included in one plane.

9. The antenna module according to any one of claims 6 to 8, wherein: A corner between the first side surface and the first negative main surface is chamfered.

10. The antenna module according to any one of claims 6 to 8, wherein: A step is provided at a corner between the first side surface and the first negative main surface.

11. The antenna module according to any one of claims 1 to 10, wherein: The first insulating material is a thermoplastic resin.

12. The antenna module according to any one of claims 1 to 10, wherein: The second insulating material is a thermoplastic resin.

13. The antenna module according to any one of claims 1 to 12, wherein: The second substrate has: The first section overlaps with the first substrate when viewed in the negative direction of the Z axis; as well as The second section does not overlap with the first substrate when viewed in the negative direction of the Z axis, The second section of the second substrate is curved when viewed in a direction perpendicular to the Z axis.

14. The antenna module according to any one of claims 1 to 13, wherein: The signal conductor layer extends along the X-axis, The Y axis is orthogonal to the X axis and the Z axis, The length of the ground conductor layer non-formed region in the direction along the Y-axis is equal to or less than half the wavelength of a high-frequency signal transmitted through the signal conductor layer.

15. The antenna module according to any one of claims 1 to 14, wherein: The signal conductor layer extends along the X-axis, The Y axis is orthogonal to the X axis and the Z axis, The ground conductor layer non-formed region is surrounded by the first ground conductor layer when viewed in the negative direction of the Z-axis.

16. The antenna module according to any one of claims 1 to 15, wherein: The second substrate further comprises: a second ground conductor layer provided on the second substrate body; The second ground conductor layer is located on the negative side of the Z axis than the signal conductor layer. The second ground conductor layer overlaps the radiation conductor layer when viewed in the negative direction of the Z-axis.

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