High-temperature-resistant acrylic glue, preparation method and application thereof, high-temperature-resistant adhesive tape and preparation method thereof

Abstract

The invention relates to high-temperature-resistant acrylic acid glue and a preparation method and application thereof as well as a high-temperature-resistant adhesive tape and a preparation method thereof, and relates to the technical field of adhesives, the high-temperature-resistant acrylic acid glue comprises the following components in parts by weight: 15-30 parts of a hard monomer, 40-60 parts of a soft monomer, 10-20 parts of a functional monomer, 10-20 parts of a weather-resistant monomer and 1-2 parts of an initiator, the solvent accounts for 60% of the total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the anhydride curing agent. The invention provides the high-temperature-resistant acrylic acid glue with high temperature resistance and high viscosity, and the high-temperature-resistant adhesive tape capable of resisting high temperature of 200 DEG C or above is prepared from the high-temperature-resistant acrylic acid glue and can meet the use requirements in the fields of modern electronic products, photoelectric products, batteries and the like.

Description

Technical Field

[0001] The invention relates to the technical field of adhesives, and in particular to a high temperature resistant acrylic glue and a preparation method and application thereof, a high temperature resistant adhesive tape and a preparation method thereof. Background Art

[0002] In the application fields of electronic products, optoelectronic products and batteries, since these products generate a lot of heat during operation, the bonding of parts usually needs to rely on high-temperature resistant glue or tape. The peeling force of traditional glue or tape tends to decrease significantly in high temperature environments, which may not only lead to reduced product performance, but also cause safety hazards. Especially in some high-end application fields, such as chip manufacturing and battery product manufacturing, the required operating temperature or junction temperature often exceeds 100°C, which places extremely high demands on the high temperature resistance of glue or tape.

[0003] However, conventional high-temperature resistant glues or tapes on the market often have difficulty balancing heat resistance and viscosity. Although some technologies have tried to improve the high-temperature resistance of glues through different methods, the results are not ideal. For example, some technologies use specific synthetic resins to improve the temperature resistance of acrylic glues. Although they can improve the temperature resistance to above 70°C to a certain extent, it is still difficult to meet the application requirements in higher temperature environments. In addition, although some epoxy resin high-temperature resistant glues have introduced special fillers to improve temperature resistance, their ability to maintain viscosity at high temperatures still needs to be improved.

[0004] In addition, existing high-temperature resistant tapes also face similar challenges. Although some tapes have improved their temperature resistance by using special material combinations and preparation processes, their temperature resistance range is usually limited to 80-120°C. For application scenarios that need to withstand higher temperatures, the temperature resistance of these tapes is obviously insufficient.

[0005] In summary, the existing high temperature resistant glue or tape still has many deficiencies in terms of high temperature resistance, clarity of temperature resistance performance, and balance between temperature resistance performance and viscosity. Therefore, developing a glue or tape that has both excellent high temperature resistance and good viscosity is of great significance to meet the high requirements of modern electronic products, optoelectronic products, batteries and other fields. Summary of the invention

[0006] In order to solve the above problems, the present invention provides a high temperature resistant acrylic glue and a preparation method and application thereof, a high temperature resistant adhesive tape and a preparation method thereof.

[0007] In a first aspect, the present invention provides a high temperature resistant acrylic glue, which comprises the following components in parts by weight:

[0008] 15-30 parts of hard monomer, 40-60 parts of soft monomer, 10-20 parts of functional monomer, 10-20 parts of weather-resistant monomer, 1-2 parts of initiator, 0.3-1 parts of anhydride curing agent and 60% of the total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the anhydride curing agent;

[0009] Among them, the hard monomer includes at least one of methyl methacrylate and styrene, the soft monomer includes at least one of isooctyl acrylate and butyl acrylate, the functional monomer includes at least one of acrylic acid, hydroxypropyl acrylate and 2-carboxyethyl acrylate, the weather-resistant monomer includes at least one of polysilazane, polytetrafluoroethylene and polyamic acid, the initiator includes dibenzoyl peroxide, and the solvent includes ethyl acetate.

[0010] Furthermore, the high temperature resistant acrylic glue comprises the following components in parts by weight:

[0011] 20 parts of hard monomer, 48 parts of soft monomer, 10 parts of functional monomer, 20 parts of weather-resistant monomer, 1 part of initiator, 1 part of acid anhydride curing agent and 60% of the total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the acid anhydride curing agent.

[0012] Furthermore, the total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the anhydride curing agent is 100 parts; and the heat-resistant temperature of the high-temperature resistant acrylic glue is ≥140°C.

[0013] In a second aspect, the present invention provides a method for preparing the high temperature resistant acrylic glue according to any one of the first aspects, the method for preparing the high temperature resistant acrylic glue comprising the following steps:

[0014] Stir and mix part of the solvent, the soft monomer and the functional monomer, and then heat to 65-75° C. and keep warm for 1-2 hours to obtain a mixed monomer 1;

[0015] Add an initiator to the mixed monomer 1, then raise the temperature to 78-85° C. to start a polymerization reaction, and keep the temperature for 1.5-2.5 hours after the reaction system turns yellow to obtain a solution 1;

[0016] The remaining solvent, hard monomer and weather-resistant monomer are stirred and mixed, and then the temperature is raised to 65-75° C. and kept for 1.5-2.5 hours to obtain a mixed monomer 2;

[0017] The solution 1, the mixed monomer 2 and the curing agent are stirred and mixed, and kept at 78 to 85° C. for 1.5 to 2.5 hours, and then heated to 90 to 100° C. and kept for 0.5 to 1.5 hours to obtain a solution 2;

[0018] The solution 2 is cooled and filtered to obtain the high temperature resistant acrylic glue.

[0019] In a third aspect, the present invention provides use of the high temperature resistant acrylic glue described in any one of the first aspect and / or the high temperature resistant acrylic glue prepared by the preparation method described in any one of the second aspect in preparing an adhesive tape.

[0020] In a fourth aspect, the present invention provides a high temperature resistant tape, comprising a base material, a glue layer, a surface material, a primer coating and a surface coating, the base material comprising at least one of a release film and a release paper, the glue layer being formed by the high temperature resistant acrylic glue described in any one of the first aspect and / or the high temperature resistant acrylic glue prepared by the preparation method described in any one of the second aspect, the surface material comprising at least one of a PI film and a PET film, the primer coating and the surface coating being both formed by a coating containing a high temperature resistant filler and a resin.

[0021] Furthermore, the primer coating is formed by using a coating whose product model is TC22 produced by Nano-Electric (Guangdong) Materials Technology Co., Ltd., and the surface coating is formed by using a coating whose product model is TC34 produced by Nano-Electric (Guangdong) Materials Technology Co., Ltd.

[0022] Furthermore, the thickness of the base material is 60-80 μm, the total thickness of the glue layer and the surface material is 20-30 μm, the thickness of the primer coating is 2-4 μm, and the thickness of the surface coating is 8-10 μm; the heat-resistant temperature of the high-temperature resistant tape is ≥200°C.

[0023] In a fifth aspect, the present invention provides a method for preparing the high temperature resistant tape according to any one of the fourth aspects, the method for preparing the high temperature resistant tape comprising the following steps:

[0024] Applying high temperature resistant acrylic glue on the base material, and then attaching the surface material to the surface of the high temperature resistant acrylic glue and curing it to obtain a first intermediate;

[0025] Performing corona treatment on the surface of the surface material of the first intermediate, and then coating the surface material with a primer coating to obtain a second intermediate;

[0026] The surface of the primer coating of the second intermediate is subjected to corona treatment, and then a surface coating is applied and hot pressed to obtain the high temperature resistant adhesive tape.

[0027] Furthermore, the working condition parameters of the curing include: temperature of 95-105°C and time of 1-5 min; the working voltage of the corona treatment is 5-10 kV; the working condition parameters of the hot pressing include: temperature of 115-125°C and time of 0.5-2 min.

[0028] The above technical solution provided by the embodiment of the present invention has at least the following advantages compared with the prior art:

[0029] The embodiment of the present invention provides a high temperature resistant acrylic glue with both high temperature resistance and high viscosity, and the high temperature resistant acrylic glue is used to prepare a high temperature resistant tape resistant to 200°C and above, which can meet the use requirements of modern electronic products, optoelectronic products, batteries and other fields. Specifically:

[0030] 1) The present invention provides an acrylic glue with high temperature resistance and high viscosity, with a room temperature viscosity of 2489-2885 mPa·s. Under a high temperature condition of 140°C, the viscosity of the acrylic glue can still maintain 73%-95% of that at room temperature, and has good high temperature resistance.

[0031] 2) The present invention provides a tape with both high temperature resistance and high viscosity. The viscosity at room temperature is 34.5-40.2N / 25mm. Under high temperature conditions of 200°C, the viscosity of the tape can still be maintained at 62%-92% of that at room temperature, and the high temperature resistance is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0034] Figure 1 A schematic flow chart of a method for preparing high temperature resistant glue provided in an embodiment of the present invention.

[0035] Figure 2 A schematic structural diagram of a high temperature resistant adhesive tape provided in an embodiment of the present invention.

[0036] Figure 3 A schematic flow chart of a method for preparing a high temperature resistant adhesive tape provided in an embodiment of the present invention.

[0037] Figure 2 Middle: 1 is base material, 2 is glue layer, 3 is surface material, 4 is primer coating, and 5 is surface coating. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Unless otherwise specified, various raw materials, reagents, instruments and equipment used in the present invention can be purchased from the market or prepared by existing methods.

[0040] In a first aspect, the present invention provides a high temperature resistant acrylic glue, which comprises the following components in parts by weight:

[0041] 15-30 parts of hard monomer, 40-60 parts of soft monomer, 10-20 parts of functional monomer, 10-20 parts of weather-resistant monomer, 1-2 parts of initiator, 0.3-1 parts of anhydride curing agent and 60% of the total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the anhydride curing agent;

[0042] Among them, the hard monomer includes at least one of methyl methacrylate and styrene, the soft monomer includes at least one of isooctyl acrylate and butyl acrylate, the functional monomer includes at least one of acrylic acid, hydroxypropyl acrylate and 2-carboxyethyl acrylate, the weather-resistant monomer includes at least one of polysilazane, polytetrafluoroethylene and polyamic acid, the initiator includes dibenzoyl peroxide, and the solvent includes ethyl acetate.

[0043] The embodiment of the present invention provides a high temperature resistant acrylic glue with both high temperature resistance and high viscosity, and the high temperature resistant acrylic glue is used to prepare a high temperature resistant tape that can withstand 200°C and above, which can meet the use requirements of modern electronic products, optoelectronic products, batteries and other fields.

[0044] In some specific embodiments, the high temperature resistant acrylic glue comprises the following components in parts by weight:

[0045] 20 parts of hard monomer, 48 parts of soft monomer, 10 parts of functional monomer, 20 parts of weather-resistant monomer, 1 part of initiator, 1 part of acid anhydride curing agent and 60% of the total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the acid anhydride curing agent.

[0046] In some specific embodiments, the total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the anhydride curing agent is 100 parts; the heat-resistant temperature of the high-temperature resistant acrylic glue is ≥140°C.

[0047] In a second aspect, the present invention provides a method for preparing the high temperature resistant acrylic glue according to any one of the first aspects, the method for preparing the high temperature resistant acrylic glue comprising the following steps:

[0048] Stir and mix part of the solvent, the soft monomer and the functional monomer, and then heat to 65-75° C. and keep warm for 1-2 hours to obtain a mixed monomer 1;

[0049] Add an initiator to the mixed monomer 1, then raise the temperature to 78-85° C. to start a polymerization reaction, and keep the temperature for 1.5-2.5 hours after the reaction system turns yellow to obtain a solution 1;

[0050] The remaining solvent, hard monomer and weather-resistant monomer are stirred and mixed, and then the temperature is raised to 65-75° C. and kept for 1.5-2.5 hours to obtain a mixed monomer 2;

[0051] The solution 1, the mixed monomer 2 and the curing agent are stirred and mixed, and kept at 78 to 85° C. for 1.5 to 2.5 hours, and then heated to 90 to 100° C. and kept for 0.5 to 1.5 hours to obtain a solution 2;

[0052] The solution 2 is cooled and filtered to obtain the high temperature resistant acrylic glue.

[0053] In some specific embodiments, Figure 1 As shown, the preparation method of the high temperature resistant glue provided by the embodiment of the present invention includes the following process:

[0054] A1. First, the solvent (accounting for 1 / 2 of the total solvent weight), soft monomer and functional monomer are mixed and stirred evenly, and the temperature is raised to 70°C and kept for 1 hour to obtain mixed monomer 1. Then, an initiator is added, and the temperature is raised to 80°C to start the polymerization reaction. The reaction changes in the flask are observed. After a yellow color change occurs, the temperature is kept for 2 hours to obtain solution 1;

[0055] A2. The solvent (remaining solvent), hard monomer and weather-resistant monomer are mixed and stirred evenly, and the temperature is raised to 70°C and kept for 2h to obtain a mixed monomer 2;

[0056] A3. The solution 1, the mixed monomer 2 and the curing agent were mixed and stirred evenly, and kept at 80°C for 2h, gradually heated to 95°C and kept for 1h to obtain a viscous solution 2, cooled, and filtered with 100 mesh and 300 mesh filter screens to obtain the high temperature resistant glue.

[0057] In a third aspect, the present invention provides use of the high temperature resistant acrylic glue described in any one of the first aspect and / or the high temperature resistant acrylic glue prepared by the preparation method described in any one of the second aspect in preparing an adhesive tape.

[0058] In a fourth aspect, the present invention provides a high temperature resistant adhesive tape, such as Figure 2 As shown, the high temperature resistant tape includes a base material 1, a glue layer 2, a surface material 3, a primer coating 4 and a surface coating 5, the base material 1 includes at least one of a release film and a release paper, the glue layer 2 is formed by the high temperature resistant acrylic glue described in any one of the first aspect and / or the high temperature resistant acrylic glue prepared by the preparation method described in any one of the second aspect, the surface material 3 includes at least one of a PI film and a PET film, and the primer coating 4 and the surface coating 5 are both formed by a coating containing a high temperature resistant filler and a resin.

[0059] In some specific embodiments, the primer coating 4 is formed by using a coating whose product model is TC22 produced by NanoDian (Guangdong) Materials Technology Co., Ltd., and the surface coating 5 is formed by using a coating whose product model is TC34 produced by NanoDian (Guangdong) Materials Technology Co., Ltd.

[0060] In some specific embodiments, the thickness of the base material 1 is 60-80 μm, the total thickness of the glue layer 2 and the surface material 3 is 20-30 μm, the thickness of the primer coating 4 is 2-4 μm, and the thickness of the surface coating 5 is 8-10 μm; the temperature resistance of the high temperature resistant tape is ≥200°C.

[0061] In a fifth aspect, the present invention provides a method for preparing the high temperature resistant tape according to any one of the fourth aspects, the method for preparing the high temperature resistant tape comprising the following steps:

[0062] Applying high temperature resistant acrylic glue on the base material, and then attaching the surface material to the surface of the high temperature resistant acrylic glue and curing it to obtain a first intermediate;

[0063] Performing corona treatment on the surface of the surface material of the first intermediate, and then coating the surface material with a primer coating to obtain a second intermediate;

[0064] The surface of the primer coating of the second intermediate is subjected to corona treatment, and then a surface coating is applied and hot pressed to obtain the high temperature resistant adhesive tape.

[0065] In some specific embodiments, the working condition parameters of the curing include: temperature of 95-105°C and time of 1-5 min; the working voltage of the corona treatment is 5-10 kV; the working condition parameters of the hot pressing include: temperature of 115-125°C and time of 0.5-2 min.

[0066] In some specific embodiments, Figure 3 As shown, the preparation method of the high temperature resistant tape includes the following process:

[0067] A1. Apply the high temperature resistant acrylic glue obtained in the present invention on the substrate 1, and then attach the surface material to the surface of the glue and cure it at 100°C for 2min;

[0068] A2. On the surface of the corona material, then use a 200 mesh anilox roller to print the primer;

[0069] A3. Corona primer surface, surface coating with 70 mesh anilox roller, hot pressing at 120℃ for 1min to obtain high temperature resistant tape.

[0070] It should be noted that the raw materials involved in the high-temperature resistant acrylic glue and its preparation method and application, the high-temperature resistant tape and its preparation method provided in the embodiments of the present invention, unless otherwise specified or specified, can directly use commercially available products or make them themselves according to the process disclosed in the prior art; at the same time, the operating steps involved, unless otherwise specified or specified, can be carried out according to the process steps and condition parameters disclosed in the prior art or directly using existing equipment, and the present invention document will not describe them one by one.

[0071] The present invention will be further described below in conjunction with specific examples. It should be understood that these examples are intended only to illustrate the present invention and are not intended to limit the scope of the present invention. The experimental methods in the following examples that do not specify specific conditions are usually measured according to national standards. If there is no corresponding national standard, then the conditions recommended by the manufacturer are followed.

[0072] The sources and uses of the main raw materials involved in the following examples and comparative examples are shown in Table 1.

[0073] Table 1

[0074]

[0075] The glue formulas provided in Examples 1 to 4 and Comparative Examples 1 to 4 are shown in Table 2, and the glue preparation process is as follows: Figure 1 The tape preparation process is shown in Figure 3 As shown, a series of acrylic glues and adhesive tapes are obtained. Comparative Example 1 is compared with Example 1. Compared with Example 1, Comparative Example 1 changes the hard monomer, soft monomer and functional monomer, and other conditions remain unchanged; Comparative Example 2 replaces the weather-resistant monomer with polyamic acid, and other conditions remain unchanged; Comparative Example 3 does not contain a weather-resistant monomer in the formula, and other conditions remain unchanged. Comparative Example 4 changes the weather-resistant monomer to silicon dioxide, and other conditions remain unchanged.

[0076] Table 2 The formula of each embodiment and comparative example glue (by weight)

[0077]

[0078]

[0079] Test Case

[0080] The glue and tape obtained in the above-mentioned embodiments and comparative examples were subjected to performance tests, and the test methods included: 1) The glue viscosity test was conducted according to the rotational viscometer method in the GB-T2794-1995 standard, and the specific steps were to place the container containing the glue in a constant temperature bath, balance the glue temperature with the test temperature, and keep the temperature uniform. The rotor was vertically immersed in the center of the glue, and the liquid level reached the rotor liquid level mark, and the rotational viscometer was turned on to read the reading when the pointer did not change on the disc during rotation. Each sample was measured three times and the average value was taken. The normal temperature viscosity test of the glue was conducted at 25°C, and the high temperature viscosity test was conducted in a constant temperature oil bath at 140°C. 2) The adhesiveness of the tape is tested using an adhesiveness tester according to GB / T2792-2014. The specific steps are to stick a test sample of 300mm×25mm horizontally on a steel plate, use a 2kg roller to roll back and forth three times (each back and forth counts as one time), the rolling speed is 300mm / min, let it stand for 20min, and then use a peeling device to perform a 180° peeling test at a speed of 300±10mm / min, record the readout value, measure each sample three times, and take the average value. The room temperature adhesiveness of the tape is tested at 25℃, and the room temperature adhesiveness of the tape is tested at 200℃, specifically on a steel plate heated to 200℃ by a heating table.

[0081] The test results are shown in Table 3.

[0082] Table 3 Performance test results

[0083]

[0084] As can be seen from Table 3, the content of weather-resistant monomers will significantly affect the temperature resistance of glue and tape. Under high temperature conditions of 140°C, the viscosity of acrylic glue can still maintain 73%-95% of that at room temperature. When the weather-resistant monomer is 0, the viscosity of glue and tape at 140°C and 200°C will decrease significantly. It should be noted that the temperature resistance of glue depends on the combined effect of hard monomers, functional monomers and weather-resistant monomers, rather than just relying on weather-resistant monomers. For example, the glass transition temperatures of hard monomers methyl methacrylate and styrene are both over 100°C. Although the use of inorganic fillers such as silica can significantly improve the temperature resistance of glue and tape, it will cause a significant decrease in viscosity. Replacing hard monomers, soft monomers, and functional monomers with other conventional acrylic glue monomer raw materials has little effect on the performance of the obtained acrylic glue. The content of soft monomers has some effect on the viscosity of the glue. When the content of soft monomers is high, the viscosity of the glue is greater. The tape can withstand higher temperatures of 200°C due to the combined effects of the heat-resistant glue and the heat-resistant coating, but its viscosity is lower than that of glue alone.

[0085] Various embodiments of the present invention may be presented in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be understood as a rigid limitation on the scope of the present invention; therefore, the range description should be considered to have specifically disclosed all possible sub-ranges and single numerical values ​​within the range. For example, the range description from 1 to 6 should be considered to have specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which apply regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any cited number (fractional or integer) within the indicated range.

[0086] The foregoing is merely a specific embodiment of the present invention, which enables those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A high temperature resistant acrylic glue, characterized in that: The high temperature resistant acrylic glue comprises the following components in parts by weight: 15-30 parts of hard monomer, 40-60 parts of soft monomer, 10-20 parts of functional monomer, 10-20 parts of weather-resistant monomer, 1-2 parts of initiator, 0.3-1 parts of anhydride curing agent and 60% of the total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the anhydride curing agent; Among them, the hard monomer includes at least one of methyl methacrylate and styrene, the soft monomer includes at least one of isooctyl acrylate and butyl acrylate, the functional monomer includes at least one of acrylic acid, hydroxypropyl acrylate and 2-carboxyethyl acrylate, the weather-resistant monomer includes at least one of polysilazane, polytetrafluoroethylene and polyamic acid, the initiator includes dibenzoyl peroxide, and the solvent includes ethyl acetate.

2. The high temperature resistant acrylic glue according to claim 1, characterized in that: The high temperature resistant acrylic glue comprises the following components in parts by weight: 20 parts of hard monomer, 48 parts of soft monomer, 10 parts of functional monomer, 20 parts of weather-resistant monomer, 1 part of initiator, 1 part of acid anhydride curing agent and 60% of the total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the acid anhydride curing agent.

3. The high temperature resistant acrylic glue according to claim 1 or 2, characterized in that: The total weight of the hard monomer, the soft monomer, the functional monomer, the weather-resistant monomer, the initiator and the anhydride curing agent is 100 parts; the heat-resistant temperature of the high-temperature resistant acrylic glue is ≥140°C.

4. A method for preparing the high temperature resistant acrylic glue according to any one of claims 1 to 3, characterized in that: The preparation method of the high temperature resistant acrylic glue comprises the following steps: Stir and mix part of the solvent, the soft monomer and the functional monomer, and then heat to 65-75° C. and keep warm for 1-2 hours to obtain a mixed monomer 1; Add an initiator to the mixed monomer 1, then raise the temperature to 78-85° C. to start a polymerization reaction, and keep the temperature for 1.5-2.5 hours after the reaction system turns yellow to obtain a solution 1; The remaining solvent, hard monomer and weather-resistant monomer are stirred and mixed, and then the temperature is raised to 65-75° C. and kept for 1.5-2.5 hours to obtain a mixed monomer 2; The solution 1, the mixed monomer 2 and the curing agent are stirred and mixed, and kept at 78 to 85° C. for 1.5 to 2.5 hours, and then heated to 90 to 100° C. and kept for 0.5 to 1.5 hours to obtain a solution 2; The solution 2 is cooled and filtered to obtain the high temperature resistant acrylic glue.

5. Use of the high temperature resistant acrylic glue according to any one of claims 1 to 3 and / or the high temperature resistant acrylic glue prepared by the preparation method according to claim 4 in the preparation of adhesive tapes.

6. A high temperature resistant tape, characterized in that: The high temperature resistant tape comprises a base material, a glue layer, a surface material, a primer coating and a surface coating, the base material comprises at least one of a release film and a release paper, the glue layer is formed by the high temperature resistant acrylic glue described in any one of claims 1 to 3 and / or the high temperature resistant acrylic glue prepared by the preparation method described in claim 4, the surface material comprises at least one of a PI film and a PET film, and the primer coating and the surface coating are both formed by coatings containing high temperature resistant fillers and resins.

7. The high temperature resistant adhesive tape according to claim 6, characterized in that: The primer coating is formed by using the product model TC22 coating of Nanodian (Guangdong) Materials Technology Co., Ltd., and the surface coating is formed by using the product model TC34 coating of Nanodian (Guangdong) Materials Technology Co., Ltd.

8. The high temperature resistant adhesive tape according to claim 6, characterized in that: The thickness of the base material is 60-80 μm, the total thickness of the glue layer and the surface material is 20-30 μm, the thickness of the primer coating is 2-4 μm, and the thickness of the surface coating is 8-10 μm; the heat-resistant temperature of the high-temperature resistant tape is ≥200°C.

9. A method for preparing a high temperature resistant adhesive tape according to any one of claims 6 to 8, characterized in that: The preparation method of the high temperature resistant adhesive tape comprises the following steps: Applying high temperature resistant acrylic glue on the base material, and then attaching the surface material to the surface of the high temperature resistant acrylic glue and curing it to obtain a first intermediate; Performing corona treatment on the surface of the surface material of the first intermediate, and then coating the surface material with a primer coating to obtain a second intermediate; The surface of the primer coating of the second intermediate is subjected to corona treatment, and then a surface coating is applied and hot pressed to obtain the high temperature resistant adhesive tape.

10. The method for preparing a high temperature resistant adhesive tape according to claim 9, characterized in that: The working condition parameters of the curing include: temperature of 95-105° C., time of 1-5 min; the working voltage of the corona treatment is 5-10 kV; the working condition parameters of the hot pressing include: temperature of 115-125° C., time of 0.5-2 min.

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