Semiconductor refrigerating and heating linkage device and preparation method thereof

Abstract

The semiconductor refrigerating and heating linkage device comprises a shell system and a refrigerating system, the shell system is of a multi-layer heat insulation structure and is composed of an outer layer foam heat insulation material (foamed polypropylene, foamed polyurethane and the like), an inner layer foam heat insulation material (foamed polypropylene, foamed polyurethane and the like) and a middle layer vacuum heat insulation plate, the inner layer is provided with a vertical channel groove, and the bottom and a top cover are designed to be concave. The refrigerating system comprises a semiconductor, a heat dissipation device, a battery and an intelligent temperature control system, the semiconductor can refrigerate and heat, the heat dissipation device is arranged on the top cover, and the battery is a rechargeable lithium battery and is charged through a type-c interface. If the device is refrigeration and heating linkage equipment, the device comprises 2-5 storage chambers, cold and heat are separated, and the sealing cover can be covered with a photovoltaic film; if the carriage is a cold chain transport carriage, a corresponding heat insulation, refrigeration and temperature control system is provided. Through the reasonable structure and system design, efficient temperature control is achieved, and the system is suitable for various scenes such as storage, transfer, camping and long-distance transportation.

Description

Technical Field

[0001] The invention relates to a refrigeration and heating linkage device and a preparation method thereof, and in particular to a semiconductor refrigeration and heating linkage device and a preparation method thereof. Background Art

[0002] The medical industry has very strict requirements for temperature control of items in the transportation of vaccines and blood products, the food industry has very strict requirements for the distribution of fresh and quick-frozen foods, and the scientific research field has very strict requirements for the storage of special samples. These industries need to ensure that the items are kept within a specific temperature range during transportation or storage to ensure their quality and effectiveness. However, the cold storage equipment currently available on the market has many shortcomings in meeting these strict requirements.

[0003] China's invention patent, a double-layer vacuum stainless steel heat preservation and cold preservation box, application number 2024108321979, discloses a double-layer vacuum stainless steel heat preservation and cold preservation box. The present invention comprises a stainless steel shell, the outer surface of the stainless steel shell is provided with creases, the stainless steel shell is provided with a stainless steel liner and a stainless steel bottom plate, and a vacuum layer is formed between the stainless steel shell, the stainless steel liner and the stainless steel bottom plate. In the present invention, since the shell and the liner are both made of stainless steel material, the strength of the shell and the liner is relatively high, so the heat preservation and cold preservation box is not easy to be damaged, and a vacuum layer is provided, so that the heat preservation and cold preservation effect of the heat preservation and cold preservation box is improved, and the heat preservation and cold preservation time is improved, and the user does not need to use high temperature or low temperature medium to maintain the temperature of the items in the box, avoiding the decrease of the box capacity, and a gas adsorption layer is provided between the stainless steel shell and the liner, which can adsorb the gas in the vacuum layer to prevent the gas from destroying the vacuum layer. .

[0004] Chinese utility model patent, a cold-keeping box for logistics transportation with intelligent temperature control function, application number 2023221804572, discloses a cold-keeping box for logistics transportation with intelligent temperature control function, including a cold-keeping box body, the inner cavity of the cold-keeping box body is installed with a buffer pressure holding component, the buffer pressure holding component includes a placement plate, a temperature sensor is fixedly installed at the bottom of the inner cavity of the cold-keeping box body, a semiconductor refrigerator is fixedly inlaid on the left side of the inner wall of the cold-keeping box body, and mounting seats are fixedly installed on the top of the left and right sides of the cold-keeping box body, and a U-shaped frame is movably installed on the top of the mounting seat on the right side. The utility model can fix the transported goods by using a placement plate, a threaded rod, a guide rod, a mounting plate, a pressure holding plate and a first compression spring, thereby improving the stability of the goods during transportation; by using a first connecting frame, a second connecting frame and a fixed limiting component, the first connecting frame and the second connecting frame can be limited by a positioning block to ensure the installation stability between the two cold-keeping box bodies.

[0005] In summary, the existing cold storage equipment cannot meet the increasingly diverse temperature control needs. It is of great practical significance to develop a cold storage box that can not only efficiently cool but also accurately heat, and has intelligent control and flexible space utilization. Summary of the invention

[0006] The object of the present invention is to provide a semiconductor refrigeration and heating linkage device and a preparation method thereof to solve the problems existing in existing cold preservation equipment. The device and the preparation method are described as follows.

[0007] 1. A semiconductor refrigeration and heating linkage device and a preparation method thereof, characterized in that the device comprises a shell system and a refrigeration system, the shell system adopts a multi-layer insulation structure, including an outer layer, an inner layer of foam insulation material and an intermediate layer of insulation components, which are used to reduce the influence of the external environment on the temperature inside the box, the outer and inner layers of foam insulation materials are foamed polypropylene and foamed polyurethane, the intermediate layer of insulation components is a vacuum insulation panel, and the surface of the inner layer of foam insulation material has vertical grooves; the bottom and top cover of the shell system are recessed, and the protruding frame at the edge of the recessed area is an intermittent non-continuous structure; the refrigeration system comprises a semiconductor, a heat dissipation device, a battery and an intelligent temperature control system; The semiconductor is used for cooling and heating, the heat sink is used to dissipate the heat generated by the semiconductor, the battery is used to power the semiconductor, the intelligent temperature control system is connected to the semiconductor and the battery, monitors the internal temperature in real time and automatically adjusts the working state of the semiconductor; the heat sink includes large-area heat sink fins and a low-noise fan, which are arranged on the top cover of the shell; the total thickness of the semiconductor and the corresponding heat sink is 20-50mm, embedded in foamed polypropylene, and the heat sink protrudes from the top cover recessed area by 5-8mm; the battery is a rechargeable lithium battery, which is charged through a type-c interface; a digital display module is provided on the outside of the cabin for observing the internal temperature.

[0008] 2. The device according to claim 1 and its preparation method are characterized in that the device is a cooling and heating linkage equipment, including 2 to 5 storage chambers, with a high-efficiency heat-insulating isolation layer between the storage chambers, and an independent sealing cover on the top of each storage body, and a high-performance sealing strip is provided at the edge of the cover; multiple storage chambers are separated by cold and hot intervals, one side is a cold storage chamber, and the other side is a hot storage chamber, the cooling and heating system is sealed in the high-efficiency heat-insulating isolation layer, the semiconductor N type faces the cold storage chamber, and the semiconductor P type faces the hot storage chamber, and the power supply is from N type to P type; the surface of the sealing cover is preferably covered with a photovoltaic film, and the generated electricity is stored in the battery and connected to the cooling and heating semiconductor in the insulation layer.

[0009] 3. The device according to claim 1 and its preparation method are characterized in that the device is a cold chain transport carriage, the floor of which is paved with foamed polystyrene boards, and the surrounding and top surfaces are covered with nano-airbag heat insulation covers; semiconductor refrigeration plates are installed on the side panels and front panels of the carriage to form a refrigeration array, and cold air is transmitted through cold air pipes; temperature sensors are evenly arranged in the carriage and the fresh food box, and the temperature control system adjusts the operation of the semiconductor refrigeration module within the range of -8°C to +8°C; lithium batteries and solid-state batteries are used for power supply, and multiple battery installation compartments are set; in the cold air delivery system, the cold end metal heat sink corresponds to the semiconductor refrigeration plate, and the cold air is delivered to the gap in the fresh food box through a hose, and the hot end of the semiconductor refrigeration plate is in direct contact with the atmosphere outside the carriage, and the heat is naturally and efficiently dissipated during movement.

[0010] Beneficial Effects

[0011] (1) Two-way temperature adjustment function: It can achieve precise cooling and heating according to the needs of the items, meeting the transportation and storage needs of different items under different temperature conditions.

[0012] (2) High-precision temperature control: Through high-precision temperature sensors and intelligent algorithms, the temperature inside the box can be accurately controlled, with a small temperature fluctuation range, effectively ensuring the quality of temperature-sensitive items.

[0013] (3) High efficiency insulation: The special insulation box structure and materials greatly reduce the heat transfer, improve the insulation effect and reduce energy consumption.

[0014] (4) Flexible and versatile: The replaceable inner liner module design enables the cooler to accommodate items of different sizes and shapes, improving its flexibility and versatility.

[0015] (5) Convenient mobile use: The battery module supports fast charging, which is convenient for use in mobile scenarios, meeting the requirements of cold chain transportation, outdoor operations, etc. for equipment portability and endurance. DETAILED DESCRIPTION

[0016] Example 1: Small blood refrigerator

[0017] The outer dimensions of this blood refrigerator are 500X400X400mm. The shell adopts a three-layer structure. The outer and inner layers are both foamed polypropylene with a thermal conductivity of 0.02W / mK. The inner foamed polypropylene board has vertical grooves with a spacing of 50mm and a groove depth of 5mm. The middle layer uses a vacuum insulation board with a thermal conductivity of 0.002W / mK and a thickness of 20mm to further enhance the thermal insulation effect. After comprehensive consideration, the total thickness of the shell is designed to be 50mm to balance the thermal insulation effect and internal space requirements. The bottom of the box is a recessed design, and the top cover of the box is a recessed design. The size of the recessed area is 450X350X10mm, and the depth is 10mm. The protruding frame on the edge of the recessed area is an intermittent non-continuous structure with a spacing of 10mm.

[0018] The refrigerator is cooled by semiconductor chips. Considering the cooling demand and space limitation, 4 groups of semiconductor chips with a maximum cooling capacity of 5W are selected. The size is 30X30X2mm, which is easy to install and can meet the cooling power requirements. The heat dissipation position is set on the top cover of the refrigerator. A large area of ​​heat dissipation fins is used with a low-noise fan for active heat dissipation. The total thickness of the semiconductor chip and the corresponding heat dissipation device is 50mm, embedded in the foamed polypropylene, and the heat dissipation device protrudes from the top cover recessed area by 5-8mm. 4 groups of rechargeable lithium batteries with a capacity of 5000Ah are configured. Each group of batteries powers a group of semiconductor chips, which can be charged through the type-c interface. The type-c interface is convenient and universal and has a certain fast charging capability. The semiconductor chip is connected to the battery through an intelligent temperature control system. The system can monitor the internal temperature in real time and automatically adjust the working state of the semiconductor chip. When the internal temperature rises, the chip increases the cooling power; when the temperature drops to a certain level, the chip reduces the power or stops working to save power, ensuring that the internal low temperature environment of -20℃ is maintained within 48 hours to ensure the safe storage and transportation of blood.

[0019] Example 2: Medium-sized hot and cold food delivery box

[0020] The box body is 1000mmX500mmX500mm, and adopts a unique sandwich structure of polyurethane foam and vacuum insulation panels. It has excellent thermal insulation performance and can effectively block heat transfer. The two layers of materials are tightly combined and the middle sandwich design ensures that the box body has excellent thermal insulation and cold preservation performance while ensuring strength, effectively reducing the impact of the external environment on the temperature inside the box.

[0021] The box is rationally divided into two independent compartments, namely the cold storage room and the hot storage room. There are digital display modules on the outside of each compartment to observe the internal temperature. The volume of the cold storage room is twice that of the hot storage room. There is a high-efficiency polyurethane foam insulation layer between the two. The thermal resistance of the insulation layer is as high as 15-20 (m 2·K) / W, further reducing the heat conduction between the two cabins. Each cabin has an independent sealing cover on the top. The high-performance sealing strip installed on the edge of the cover can form a good airtight environment when the cover is closed, so that the air leakage rate of the cabin is controlled at 0.05m 3 / h; the surface is covered with photovoltaic film, and the electricity generated is stored in the top battery that crosses the isolation layer and is connected to the cooling and heating semiconductor chip in the thermal insulation layer.

[0022] According to the volume and usage requirements of the cabin, 20 semiconductor cooling and heating chips are configured. The size of each chip is 50mmX50mmX20mm, embedded in the thermal insulation layer, and the edge is tightly sealed with the foam to prevent air leakage. The wires carried pass through the foam and are connected to the power supply on the top of the insulation layer. The N-type surface of each group of semiconductors faces the cold storage room, and the P-type surface faces the hot storage room. The current enters from the N side and exits from the P side. On the side of the cold storage room, the cooling chip can work stably and maintain the cold end temperature in the ideal range of -10℃±1℃, which is enough to meet the low temperature requirements for storing cold drinks and perishable foods; on the side of the hot storage room, the heating chip can work stably, and the thermal efficiency can reach more than 92%. Depending on the amount of items stored in the hot storage room, the temperature is between 20 and 50℃, meeting the needs of hot drinks, hot water, hot meals, hot coffee, etc. In order to ensure uniform temperature in the storage room, a small fan is equipped, which can be snapped on the surface of the semiconductor chip for forced heat dissipation and cooling. The box is also equipped with a USB port with an output voltage of 5V and an output current of 2A, which is convenient for emergency charging of electronic devices.

[0023] The delivery box can only set the temperature of the refrigerator compartment, with a setting range of -20℃ to -5℃. The temperature of the hot compartment is not controlled and varies between 20-50℃ according to the working status of the refrigerator compartment and the number of items in the hot compartment. The maximum temperature difference between the hot compartment and the refrigerator compartment can reach 60℃. The delivery box can be used for food delivery, camping, and picnics.

[0024] Example 3: Large cold chain transport box

[0025] my country's fresh food transportation market is huge and continues to grow, but the traditional cold chain vehicle compressor refrigeration method has problems such as large size, high energy consumption, and complex maintenance. In order to improve the current situation, the following semiconductor refrigeration fresh food cold chain vehicle solution is specially designed.

[0026] The transport vehicle is 12 meters long, 2.5 meters wide and 2.3 meters high. The bottom of the carriage is paved with foamed polystyrene boards, and the surrounding and top surfaces are covered with nano airbag heat insulation covers to keep fresh food cold in the box. Semiconductor refrigeration chips are installed on the side panels and front panels of the carriage. The side installation area is 7 meters long and 2 meters high, and the front panel installation area is 2.5 meters wide and 2 meters high. 40mm×40mm×4mm refrigeration chips are selected, 200 chips are installed on each side panel, 100 chips are installed on the front panel, and a total of 500 chips form a refrigeration array. There are 50 groups of cold air pipes on each side, and 100 groups of cold air pipes on both sides. The length of the cold air pipe is 2 meters, which is laid from one side to the other for cold air transmission. There are 10 groups of cold air pipes on the front panel, with a length of 12 meters, which are laid from the front panel to the rear panel. The temperature sensor uses a thermistor wireless resistor with a measurement accuracy of ±0.5℃. Ten sensors are evenly arranged in the car, and one is arranged in each fresh food box. The temperature control system adjusts the semiconductor refrigeration module to work in the range of -8℃ to +8℃ to ensure the quality of fresh food transportation and reduce energy consumption and maintenance costs. The algorithm system calculates the temperature sensor measurement data, and then controls the working surface temperature of 500 refrigeration plates in the car and the wind speed in 110 sets of cold air pipes to achieve a balanced temperature in the car.

[0027] The power supply adopts 10000Ah lithium battery and solid-state battery, and 5 battery installation compartments are set up, each compartment can accommodate 1 battery, and the battery management system monitors the battery status in real time. The battery can be charged multiple times and can also be replaced at the highway service area.

[0028] In the cold air delivery system, the metal heat sink at the cold end has a size of 50mm×50mm×3mm, with one piece corresponding to each semiconductor refrigeration plate. There is a fan on the surface of the refrigeration plate. Ten refrigeration plates are grouped together to deliver cold air to the connected hose. The hose has a diameter of 10mm and is connected from the heat sink to the gap of the fresh food box. The size of the fresh food box is 600mm×400mm×300mm. The size of the external porous plate is adapted to the side of the box, with a hole diameter of 5mm and a hole spacing of 20mm for cold air diffusion.

[0029] The hot end of each semiconductor refrigeration plate is in direct contact with the atmosphere outside the vehicle. When the vehicle moves at high speed, the atmosphere and the semiconductor hot surface quickly exchange heat, and the hot surface dissipates heat efficiently and naturally.

[0030] This system is used to transport fresh produce in summer. Compared with traditional methods, it saves 50% of energy and the ethylene content in each cubic meter of air in the carriage does not exceed 0.05 microliters.

Claims

1. A semiconductor refrigeration and heating linkage device and a preparation method thereof, characterized in that: The device includes a shell system and a refrigeration system. The shell system adopts a multi-layer insulation structure, including an outer layer, an inner layer of foam insulation material and an intermediate layer of insulation components, which are used to reduce the impact of the external environment on the temperature inside the box. The outer and inner layers of foam insulation materials are foamed polypropylene and foamed polyurethane, and the intermediate layer of insulation components is a vacuum insulation panel. The surface of the inner layer of foam insulation material has vertical grooves; the bottom and top cover of the shell system are recessed, and the protruding frame at the edge of the recessed area is an intermittent non-continuous structure; the refrigeration system includes semiconductors, a heat dissipation device, a battery and an intelligent temperature control system; the semiconductors are used for cooling and heating, and the The heat dissipation device is used to dissipate the heat generated by the semiconductor. The battery powers the semiconductor. The intelligent temperature control system is connected to the semiconductor and the battery to monitor the internal temperature in real time and automatically adjust the working state of the semiconductor. The heat dissipation device includes large-area heat dissipation fins and a low-noise fan, which are arranged on the top cover of the shell. The total thickness of the semiconductor and the corresponding heat dissipation device is 20-50mm, embedded in foamed polypropylene, and the heat dissipation device protrudes from the top cover recessed area by 5-8mm. The battery is a rechargeable lithium battery, which is charged through a type-c interface. A digital display module is provided on the outside of the cabin to observe the internal temperature.

2. The device and preparation method thereof according to claim 1, characterized in that: The device is a refrigeration and heating linkage device, including 2 to 5 storage rooms, with a high-efficiency heat-insulating isolation layer between the storage rooms, an independent sealing cover on the top of each storage body, and a high-performance sealing strip at the edge of the cover; multiple storage rooms are separated by cold and hot intervals, one side is a cold storage room, and the other side is a hot storage room. The refrigeration and heating system is sealed in the high-efficiency heat-insulating isolation layer, the semiconductor N type faces the cold storage room, and the semiconductor P type faces the hot storage room, and power is supplied from the N type to the P type; the surface of the sealing cover is preferably covered with a photovoltaic film, and the generated electricity is stored in the battery and connected to the refrigeration and heating semiconductor in the insulation layer.

3. The device and preparation method thereof according to claim 1, characterized in that: The device is a cold chain transport carriage, the floor of which is paved with foamed polystyrene boards, and the surrounding and top surfaces are covered with nano-airbag insulation covers; semiconductor refrigeration plates are installed on the side panels and front panels of the carriage to form a refrigeration array, and cold air is transmitted through cold air pipes; temperature sensors are evenly arranged in the carriage and the fresh food box, and the temperature control system adjusts the operation of the semiconductor refrigeration module within the range of -8°C to +8°C; lithium batteries and solid-state batteries are used for power supply, and multiple battery installation compartments are provided; in the cold air delivery system, the cold-end metal heat sink corresponds to the semiconductor refrigeration plate, and the cold air is delivered to the gap in the fresh food box through a hose, and the hot end of the semiconductor refrigeration plate is in direct contact with the atmosphere outside the carriage, and naturally and efficiently dissipates heat during movement.