Vacuum hole connector, substrate support, and substrate processing apparatus

Abstract

The invention provides a vacuum hole connector, a substrate support and a substrate processing apparatus. A vacuum hole connector according to an embodiment of the present disclosure includes: a first connection member fixed to a lower portion of a first vacuum hole of a heating plate and in which a first connection hole is formed; and a second connection member installed in a second vacuum hole of a heater cup, attached to the first connection member, and in which a second connection hole is formed, in which the first connection member and the second connection member comprise a metal material, and when the first connection member and the second connection member are assembled, the first connection member and the second connection member are connected to each other. And the first vacuum hole is communicated with the second vacuum hole through the first connecting hole and the second connecting hole.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0153391 filed in the Korean Intellectual Property Office on November 8, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a vacuum hole connector connecting a vacuum hole of a heating plate and a vacuum hole of a heater cup, a substrate supporter including the vacuum hole connector, and a substrate processing apparatus including the substrate supporter. Background Art

[0004] In order to manufacture a semiconductor device, various processes may be performed such as a photolithography process, an etching process, a deposition process, an ion implantation process, a cleaning process, etc. Among these processes, the photolithography process may be a process for forming a pattern and may play an important role in achieving high integration of the semiconductor device.

[0005] The photolithography process may generally include a coating process, an exposure process, and a development process, and a baking process may be performed before and after the exposure process. The baking process may be a process of heat-treating the substrate. When the substrate is disposed on a heating plate, the substrate may be heat-treated by a heater disposed inside the heating plate.

[0006] A silicone rubber member may be provided between the heating plate and the heater cup to connect the vacuum holes of the heating plate and the heater cup. However, such a silicone rubber member may have limitations in its use in a high temperature substrate processing process (eg, a high temperature baking process). Summary of the invention

[0007] An aspect of the present disclosure is to provide a vacuum hole connector, a substrate supporter, and a substrate processing apparatus which can be used without thermal damage even in a high-temperature substrate processing process.

[0008] According to aspects of the present disclosure, a vacuum hole connector includes: a first connecting member fixed to a lower portion of a first vacuum hole of a heating plate, and a first connecting hole is formed in the first connecting member; and a second connecting member installed in a second vacuum hole of a heater cup, attached to the first connecting member, and a second connecting hole is formed in the second connecting member, wherein the first connecting member and the second connecting member include a metal material, and when the first connecting member and the second connecting member are assembled, the first vacuum hole is connected to the second vacuum hole through the first connecting hole and the second connecting hole.

[0009] The first connection member formed of the metal material may be joined to the heating plate formed of a ceramic material by active metal brazing (AMB) to form a joined portion of heterogeneous materials.

[0010] The first connection member may include: a top coupled to the heating plate; and an insertion rod extending from the top and inserted into the second connection hole of the second connection member, wherein the first connection hole may be formed to pass through the top and the insertion rod.

[0011] The second connecting member may include: a shell fastened to the second vacuum hole, disposed toward the first connecting member, and having a shell hole formed in the shell; and a fixing pipe installed in the shell hole and having a fixing hole, through which the insertion rod of the first connecting member is inserted and press-fitted.

[0012] The housing may be formed of a steel material, and the fixing pipe may be formed of a silicone material.

[0013] A fixing inlet connected to the fixing hole may be formed in the fixing pipe, and an inner space of the fixing inlet may be tapered toward the fixing hole.

[0014] A curved protrusion may be formed on an inner side surface of the fixing hole.

[0015] According to another aspect of the present disclosure, a substrate supporter includes: a heating plate in which a heater and an electrical terminal connected to the heater are installed; a heater cup in which a bottom having a supporting pin for supporting the heating plate is formed; and a vacuum hole connector that connects the heating plate and the heater cup and supports the heating plate, wherein the vacuum hole connector may include: a first connecting member fixed to a lower portion of a first vacuum hole of the heating plate, and a first connecting hole is formed in the first connecting member; and a second connecting member installed in a second vacuum hole of the heater cup, and a second connecting hole is formed in the second connecting member, wherein the first connecting member and the second connecting member may include a metal material, and when the first connecting member and the second connecting member are assembled, the first vacuum hole may be connected to the second vacuum hole through the first connecting hole and the second connecting hole.

[0016] According to another aspect of the present disclosure, a substrate processing apparatus may include: a processing chamber including an upper body and a lower body to form a processing space in the processing chamber; a substrate supporter disposed in the processing space and supporting and heating a substrate; and a substrate lifting / lowering unit including a lifting / lowering pin that is lifted or lowered while passing through the substrate supporter, and a pin driving member that lifts or lowers the lifting / lowering pin, wherein the substrate supporter may include: a heating plate in which a heater and an electrical terminal connected to the heater are installed; a heater cup in which a bottom having a supporting pin that supports the heating plate is formed; and a vacuum hole A connector connects the heating plate and the heater cup and supports the heating plate, wherein the vacuum hole connector may include: a first connecting member fixed to a lower portion of a first vacuum hole of the heating plate, and a first connecting hole is formed in the first connecting member; and a second connecting member installed in a second vacuum hole of the heater cup, and a second connecting hole is formed in the second connecting member, wherein the first connecting member and the second connecting member may include a metal material, and when the first connecting member and the second connecting member are assembled, the first vacuum hole may be communicated with the second vacuum hole through the first connecting hole and the second connecting hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a view showing a silicone rubber member provided between a heater cup and a heating plate according to the prior art.

[0019] Figure 2 is a perspective view showing a substrate processing apparatus according to an embodiment of the present disclosure.

[0020] Figure 3 It is observed from above Figure 2 View of a substrate processing device.

[0021] Figure 4 Observed in the AA direction Figure 3 View of a substrate processing device.

[0022] Figure 5 Observed in the BB direction Figure 3 View of a substrate processing device.

[0023] Figure 6 is a view showing a process chamber including a substrate supporter according to an embodiment of the present disclosure.

[0024] Figure 7is a view showing an upper portion of a substrate supporter according to an embodiment of the present disclosure.

[0025] Figure 8 is shown in the heating plate assembled to Figure 7 A cross-sectional view of the state of the substrate support before the heater cup.

[0026] Fig. 9 It is shown Figure 8 View of the heater cup.

[0027] Fig.10 It is shown Figure 8 A longitudinal cross-sectional view of a vacuum port connector disposed between a heater cup and a heater plate.

[0028] Fig.11 It is shown Fig.10 A cross-sectional view of a heating plate assembled to a heater cup and a first connecting member of the heating plate inserted into and fixed to a second connecting member of the heater cup. DETAILED DESCRIPTION

[0029] Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily practice the present disclosure. However, when describing the preferred embodiments of the present disclosure in detail, and determining that the detailed description of the related known functions or configurations may unnecessarily obscure the main points of the present disclosure, the detailed description will be omitted. In addition, for components that perform similar functions and actions, the same symbols may be used throughout the accompanying drawings. In addition, in this specification, terms such as "upper", "upper part", "upper surface", "below", "lower part", "lower surface", etc. can be based on the accompanying drawings and can actually change according to the direction in which the element or component is set.

[0030] Furthermore, throughout the specification, when a part is referred to as being “connected” to a different part, this may be not only a case where the part is “directly connected” to the different part, but also a case where the part is “indirectly connected” to the different part with another component interposed between the part and the different part. Furthermore, “comprising” a certain component means that other elements may also be included, rather than excluding another component, unless clearly stated otherwise.

[0031] Figures 2 to 5 is a view schematically showing a substrate processing apparatus according to an embodiment of the present disclosure. Figure 2 is a perspective view showing a substrate processing apparatus, Figure 3 Yes, from above. Figure 2 A view of a substrate processing device, Figure 4 Observed in the AA direction Figure 3 A view of a substrate processing device, and Figure 5 Observed in the BB direction Figure 3 View of a substrate processing device.

[0032] refer to Figures 2 to 5 The substrate processing apparatus SA may include a loading port 100, an index module 200, a buffer module 300, an applying / developing module 400, an interface module 600, and a cleaning module. The loading port 100, the index module 200, the buffer module 300, the applying / developing module 400, and the interface module 600 may be sequentially arranged in a row in one direction.

[0033] Hereinafter, the direction in which the loading port 100, the indexing module 200, the buffer module 300, the coating / developing module 400 and the interface module 600 are arranged may be referred to as a first direction Y, when viewed from above, a direction perpendicular to the first direction Y may be referred to as a second direction X, and a direction perpendicular to the first direction Y and the second direction X may be referred to as a third direction Z.

[0034] The substrate S may be moved in a state of being accommodated in a wafer cassette 110. The wafer cassette 110 may have a structure that may be sealed from the outside. For example, a front opening unified pod (FOUP) having a door in a front direction may be used as the wafer cassette 110.

[0035] Hereinafter, the load port 100 , the index module 200 , the buffer module 300 , the coating / developing module 400 , and the interface module 600 will be described in detail.

[0036] The load port 100 may have a placement stage 120 on which a wafer carrier 110 is placed, and a substrate S is accommodated in the wafer carrier 110 . The placement stage 120 may be provided in plural, and the plurality of placement stages 120 may be arranged in a row in the second direction X. Figure 3 An example in which four placement tables 120 are provided is shown, but the number thereof may be changed.

[0037] The indexing module 200 may transfer the substrate S between the wafer carrier 110 disposed on the placement table 120 of the loading port 100 and the buffer module 300. The indexing module 200 may include a frame 210, an indexing robot 220, and a guide rail 230. The frame 210 may generally be configured to have a rectangular hexahedron shape with an empty interior, and may be disposed between the loading port 100 and the buffer module 300. The frame 210 of the indexing module 200 may be disposed at a height lower than the frame 310 of the buffer module 300. The indexing robot 220 and the guide rail 230 may be arranged in the frame 210. The indexing robot 220 may be configured so that a gripper 221 that directly manipulates the substrate S may move and rotate in a first direction Y, a second direction X, and a third direction Z. The indexing robot 220 may include a gripper 221, an arm 222, a supporter 223, and a pedestal 224. The gripper 221 may be fixedly mounted on the arm 222. The arm 222 may be provided as a retractable structure or a rotatable structure. The longitudinal direction of the support 223 may be provided in the third direction Z. The arm 222 may be coupled to the support 223 so as to be movable along the support 223. The support 223 may be fixedly coupled to the base 224. The guide rail 230 may be provided so that its longitudinal direction is provided in the second direction X. The base 224 may be coupled to the guide rail 230 so as to move linearly along the guide rail 230. In addition, although not shown, the frame 210 may also be provided with a door opener for opening and closing the door of the wafer carrier 110.

[0038] The buffer module 300 may include a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 may be configured to have a rectangular hexahedron shape with an empty interior, and may be disposed between the indexing module 200 and the coating / developing module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 may be located in the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 may be arranged sequentially from below in the third direction Z. The first buffer 320 may be located at a height corresponding to the coating module 401 of the coating / developing module 400, and the second buffer 330 and the cooling chamber 350 may be located at a height corresponding to the developing module 402 of the coating / developing module 400. The first buffer robot 360 may be located at a distance from the second buffer 330, the cooling chamber 350, and the first buffer 320 in the second direction X. The first buffer 320 and the second buffer 330 may temporarily store a plurality of substrates S, respectively. The second buffer 330 may have a housing 331 and a plurality of supports 332. The supports 332 may be disposed in the housing 331 and may be spaced apart from each other in the third direction Z. One substrate S may be disposed on each of the supports 332. The housing 331 may have openings in the direction in which the transfer robot 220 is disposed and in the direction in which the first buffer robot 360 is disposed, so that the transfer robot 220 and the first buffer robot 360 may load the substrate S into the support 332 in the housing 331 or unload the substrate S from the support 332 in the housing 331. The first buffer 320 may have a structure substantially similar to that of the second buffer 330. The housing 321 of the first buffer 320 may have an opening in a direction in which the first buffer robot 360 is disposed and in a direction in which an application robot 432 located in the coating module 401 is disposed. The number of the supporters 322 disposed in the first buffer 320 may be the same as or different from the number of the supporters 332 disposed in the second buffer 330. According to an example, the number of the supporters 332 disposed in the second buffer 330 may be greater than the number of the supporters 322 disposed in the first buffer 320.

[0039] The first buffer robot 360 may transport the substrate S between the first buffer 320 and the second buffer 330. Figure 3As shown in . The first cache robot 360 may include a gripper 361, an arm 362 and a supporter 363. The gripper 361 may be fixedly mounted on the arm 362. The arm 362 may be configured as a retractable structure so that the gripper 361 can move in the second direction X. The arm 362 may be connected to the supporter 363 to move linearly along the supporter 363 in the third direction Z. The supporter 363 may have a length extending from a position corresponding to the second cache 330 to a position corresponding to the first cache 320. The supporter 363 may be configured to be longer in the upward direction or the downward direction. The first cache robot 360 may be configured so that the gripper 361 can be driven only in two axes in the second direction X and the third direction Z.

[0040] The cooling chamber 350 can cool the substrate S separately, such as Figure 4 As shown in . The cooling chamber 350 may include a housing 351 and a cooling plate 352. The cooling plate 352 may have an upper surface on which a substrate S is disposed and a cooling tool 353 for cooling the substrate S. As the cooling tool 353, various methods such as cooling using a coolant, cooling using a thermoelectric element, etc. may be used. In addition, the cooling chamber 350 may be provided with a lifting pin assembly for positioning the substrate S on the cooling plate 352. The housing 351 may have an opening in a direction in which the indexing robot 220 is disposed and in a direction in which a developing robot is disposed, and the developing robot is disposed in the developing module 402, so that the indexing robot 220 and the developing robot disposed in the developing module 402 load the substrate S onto the cooling plate 352 or unload the substrate S from the cooling plate 352. In addition, the cooling chamber 350 may be provided with a door for opening and closing the above-mentioned opening.

[0041] The coating module 401 may include a process of coating a photosensitive liquid such as a photoresist to the substrate S and a heat treatment process such as heating and cooling the substrate S before and after the resist coating process. The coating module 401 may have a coating chamber 410, a baking chamber unit 500, and a transfer chamber 430. The coating chamber 410, the transfer chamber 430, and the baking chamber unit 500 may be arranged sequentially in the second direction X. For example, based on the transfer chamber 430, the coating chamber 410 may be disposed on one side of the transfer chamber 430, and the baking chamber unit 500 may be disposed on the other side of the transfer chamber 430.

[0042] The coating chamber 410 may be provided in plurality, and may be provided in plurality in the first direction Y and the third direction Z, respectively. The baking chamber unit 500 may include a plurality of baking chambers 510, and the plurality of baking chambers 510 may be provided in plurality in the first direction Y and the third direction Z, respectively. The transfer chamber 430 may be positioned parallel to the first buffer 320 of the buffer module 300 in the first direction Y. The coating robot 432 and the guide rail 433 may be located in the transfer chamber 430. The transfer chamber 430 may have a substantially rectangular shape. The coating robot 432 may transfer the substrate S between the baking chamber 510, the coating chamber 410, and the first buffer 320 of the buffer module 300.

[0043] The guide rail 433 may be arranged such that its longitudinal direction is parallel to the first direction Y. The guide rail 433 may guide the coating robot 432 to move linearly in the first direction Y. Figure 5 As shown in , the coating robot 432 may have a gripper 434, an arm 435, a supporter 436, and a base 437. The gripper 434 may be fixedly mounted on the arm 435. The arm 435 may be provided with a retractable structure so that the gripper 434 may move in a horizontal direction. The supporter 436 may be provided so that its longitudinal direction is provided in a third direction Z. The arm 435 may be coupled to the supporter 436 to move linearly in a third direction Z along the supporter 436. The supporter 436 may be fixedly coupled to the base 437, and the base 437 may be coupled to the guide rail 433 so as to be movable along the guide rail 433.

[0044] All coating chambers 410 may have the same structure, but the types of processing liquids used in the coating chambers 410 may be different. As the processing liquid, a processing liquid for forming a photoresist film or an anti-reflection film may be used.

[0045] The coating chamber 410 may apply the treatment liquid onto the substrate S. The coating chamber 410 may have a cup 411, a substrate support 412, and a nozzle 413. The cup 411 may have a shape that is open in an upward direction. The substrate support 412 may be located in the cup 411 and may support the substrate S. The substrate support 412 may be configured to be rotatable. The nozzle 413 may supply the treatment liquid to the substrate S disposed on the substrate support 412. The treatment liquid may be applied to the substrate S using a spin coating method. In addition, the coating chamber 410 may include a nozzle 414 for supplying a cleaning liquid such as deionized water (DIW) to clean the surface of the substrate S on which the treatment liquid is applied, and a backwash nozzle (not shown) for cleaning the lower surface of the substrate S may also be optionally provided in the coating chamber 410.

[0046] In the baking chamber 510, a substrate supporter 511 and a heater 512 built in the substrate supporter 511 may be installed in a processing space in the baking chamber 510, and when the substrate S is placed on the substrate supporter 511, the coating robot 432 may thermally process the substrate S. For example, in the baking chamber 510, a pre-baking process for removing organic matter or moisture from the surface of the substrate S by heating the substrate S to a predetermined temperature before coating the photoresist, a soft baking process performed after coating the photoresist to the substrate S, etc., and a cooling process performed after each heating process to cool the substrate S, etc. may be performed.

[0047] The interface module 600 may connect the coating / developing module 400 to an external exposure device 700. The interface module 600 may include an interface frame 610, a first interface buffer 620, a second interface buffer 630, and a transfer robot 640, and after completing the operation of the coating / developing module 400, the transfer robot 640 may transfer the substrate S returned to the first interface buffer 620 and the second interface buffer 630 to the exposure device 700. The first interface buffer 620 may include a housing 621 and a supporter 622, and the transfer robot 640 may load / unload the substrate S into / from the supporter 622.

[0048] Figure 6 is a view showing a process chamber including a substrate supporter according to an embodiment of the present disclosure.

[0049] 1. Referring to the drawings, the substrate processing apparatus SA of the present disclosure may include a processing chamber 10, a substrate supporter 20, and a substrate elevating / lowering unit 30.

[0050] A processing space for heat-treating a substrate S may be formed in the processing chamber 10. The processing chamber 10 may include an upper body 11 and a lower body 12 to form the processing space. A sealing member 13 may be installed on one of the upper body 11 and the lower body 12, and a body lifting / lowering member 14 may be installed on the upper body 11. A gas supply line g may be connected to an upper hole 11a of the upper body 11 to supply gas to the substrate S. During heating of the substrate S, gas may be supplied to the processing space to improve the adhesion rate of the photoresist (photosensitive solution) to the substrate. As described above, such a processing chamber 10 may be a baking chamber ( Figure 5 510 in, but is not limited to the above description, and can be used in any process of heating the substrate.

[0051] In addition, a substrate supporter 20 may be disposed in the processing space, and may support and heat the substrate S, which will be described later.

[0052] The substrate lifting / lowering unit 30 may include a lifting / lowering pin 31 and a pin driving member 32. The lifting / lowering pin 31 may be lifted or lowered while passing through the substrate supporter 20 through the hole 20a of the substrate supporter 20, and the pin driving member 32 may be connected to the lifting / lowering pin 31 to lift and lower the lifting / lowering pin 31. When the lifting / lowering pin 31 is lifted by the pin driving member 32, the lifting / lowering pin 31 may lift the substrate S while supporting the substrate S.

[0053] Figure 7 is a view showing an upper portion of a substrate supporter according to an embodiment of the present disclosure, Figure 8 is shown in the heating plate assembled to Figure 7 A cross-sectional view of a state before the heater cup in the substrate support, and Fig. 9 It is shown Figure 8 View of the heater cup.

[0054] Referring to the drawings, the substrate supporter 20 may include a heating plate 21 , a heater cup 22 , and a vacuum hole connector 1000 .

[0055] The heating plate 21 may have a circular plate shape, may be a portion on which a substrate is mounted on an upper surface thereof, and may be used to heat the substrate mounted thereon and having a heater disposed thereon.

[0056] The heating plate 21 may be formed of a ceramic material. Generally, in a baking process at 200° C. or less, a ceramic member having a thickness of about 2 mm to 4 mm may be used, and in a baking process at a relatively high temperature of about 400° C., a ceramic member having a thickness of about 5 mm to 20 mm may be used. In addition, a pin hole 21 a may be formed in the heating plate 21, and the pin hole 21 a may be a ceramic member such as Figure 6 The first vacuum hole 21h may be formed in the heating plate 21 to fix the substrate. The first vacuum hole 21h may be provided in plurality to have a concentric circle shape. The first vacuum hole 21h may be a channel through which air is sucked and may be used to adsorb the substrate.

[0057] The heater cup 22 may be a structure that supports and surrounds the heating plate 21, and may have a bottom 22c, through which a bore 22a is installed to communicate with the pin hole 21a of the heating plate 21. A supporting pin 22b that supports the heating plate 21 may be installed on the bottom 22c. In addition, a second vacuum hole 22h may be formed in the heater cup 22 to fix the substrate. The second vacuum hole 22h may be provided in plurality to have a concentric circle shape to correspond to the first vacuum hole 21h of the heating plate 21. The second vacuum hole 22h may be a channel through which air is sucked, and together with the first vacuum hole 21h, may be used to adsorb the substrate, and may be connected to a vacuum line (not shown) provided below the heater cup 22.

[0058] The vacuum hole connector 1000 may be provided between the heating plate 21 and the heater cup 22. Since the first vacuum hole 21h and the second vacuum hole 22h are provided closer to the center of the heating plate 21 than the support pin 22b, the vacuum hole connector 1000 is provided relatively closer to the center of the heating plate 21 than the support pin 22b, so that the support pin 22b can support the edge of the heating plate 21, and the vacuum hole connector 1000 can support the center side of the heating plate 21. In addition, the vacuum hole connector 1000 may be used to connect the first vacuum hole 21h and the second vacuum hole 22h. Therefore, a channel through which air is sucked and including the vacuum line, the second vacuum hole 22h of the heater cup 22, the vacuum hole connector 1000, and the first vacuum hole 21h of the heating plate 21 may be formed to adsorb and fix the substrate provided on the heating plate 21.

[0059] In this way, the curved substrate can be unfolded in a flat state by vacuum adsorbing the substrate through the vacuum hole connector 1000. When the photoresist is used with high viscosity, the substrate may shrink and bend. While the curved shape of the substrate is converted into a flat shape by vacuum adsorption, the substrate can be fixed to the heating plate 21.

[0060] Before providing a detailed description of the vacuum hole connector according to the present disclosure, a silicone rubber tube connecting a first vacuum hole and a second vacuum hole in the related art will be described as follows.

[0061] Figure 1 is a view showing a silicone rubber member provided between a heater cup and a heating plate according to the prior art.

[0062] Referring to the drawings, a first vacuum hole 1a may be formed in the heating plate 1, and a second vacuum hole (not shown) may be formed in the heater cup 2. In this case, the first vacuum hole 1a may be formed in plurality in the heating plate 1 to have a concentric circle shape, and correspondingly, the second vacuum hole (not shown) may be formed in plurality in the heater cup 2 to have a concentric circle shape.

[0063] A silicone rubber tube 3 may be provided between the heating plate 1 and the heater cup 2 .

[0064] Specifically, the silicone rubber tube 3 may have a structure that closely contacts the lower surface of the heating plate 1 by placing the heating plate 1 on the heater cup 2 while the silicone rubber tube 3 is mounted on the bottom 2 a of the heater cup 2 .

[0065] The silicone rubber tube 3 may be provided between the first vacuum hole 1 a of the heating plate 1 and the second vacuum hole (not shown) of the heater cup 2 to communicate between the first vacuum hole 1 a and the second vacuum hole.

[0066] When the silicone rubber tube 3 is used in a high temperature substrate processing process, the silicone rubber tube 3 may have defects. For example, due to the heat resistance limit temperature of silicone, when used in a high temperature substrate processing process (e.g., a high temperature baking process), the silicone rubber tube 3 may have various problems.

[0067] Specifically, when the silicone rubber tube 3 is used in a high-temperature substrate processing process, the silicone rubber tube 3 may melt and be damaged. Therefore, a leakage phenomenon may occur, which hinders smooth vacuum adsorption and reduces its life, and the silicone rubber tube 3 should be frequently replaced. In addition, the silicone rubber tube 3 may cause the generation of particles that cause process defects when it is cured after a high-temperature process.

[0068] In order to overcome the above-mentioned problems, the vacuum hole connector according to an embodiment of the present disclosure may be configured as follows.

[0069] Fig.10 It is shown Figure 8 A longitudinal cross-sectional view of a vacuum port connector disposed between the heater cup and the heater plate, and Fig.11 It is shown Fig.10 A cross-sectional view of a heating plate assembled to a heater cup and a first connecting member of the heating plate inserted into and fixed to a second connecting member of the heater cup.

[0070] 1. Referring to the drawings, a vacuum hole connector 1000 according to an embodiment of the present disclosure may include a first connection member 1100 and a second connection member 1200.

[0071] The first connection member 1100 may be fixed to a lower portion of the first vacuum hole 21 h of the heating plate 21 , and a first connection hole 1100 a may be formed therein.

[0072] The second connection member 1200 may be installed in the second vacuum hole 22 h of the heater cup 22 , and may be attached to the first connection member 1100 , and may form a second connection hole 1200 a therein.

[0073] The first and second connection members 1100 and 1200 may include a metal material, and when the first and second connection members 1100 and 1200 are assembled, the first and second connection holes 1100 a and 1200 a may be connected to each other through the first and second vacuum holes 21 h and 22 h .

[0074] In this way, the first connection member 1100 and the second connection member 1200 communicating with the first vacuum hole 21h and the second vacuum hole 22h may include a metal material to be used in a high temperature substrate processing process without being damaged by high heat. For example, since the metal material of the first connection member 1100 and the metal material of the second connection member 1200 have a higher heat resistance limit temperature than a conventional silicone rubber tube, the vacuum hole connector 1000 of the present disclosure can be used in a high temperature substrate processing process without problems.

[0075] Therefore, the vacuum hole connector 1000 of the present disclosure can prevent leakage caused by heat damage to fully maintain the vacuum adsorption function and to relatively increase its lifespan. In addition, unlike the conventional silicone rubber tube 3, the generation of particles can also be prevented.

[0076] In addition, the first connection member 1100 formed of a metal material and the heating plate 21 formed of a ceramic material can be joined to each other by active metal brazing (AMB) to form a joint of heterogeneous materials. The active metal brazing method can add active elements to the brazing material to heat the brazing material in a vacuum, thereby forming a reaction layer on the surface of the heating plate 21 formed of the ceramic material. Therefore, the wettability and adhesion of the brazing material can be improved, and the first connection member 1100 formed of a metal material and the heating plate 21 formed of a ceramic material can be joined to each other.

[0077] Therefore, in the vacuum hole connector 1000 of the present disclosure, the first connecting member 1100 formed of a metal material can be firmly fixed to the heating plate 21 formed of a ceramic material to prevent leakage between the heating plate 21 and the vacuum hole connector 1000 due to external force or high temperature.

[0078] The vacuum hole connector 1000 of the present disclosure may have a structure in which the first connection member 1100 is inserted into and fixed to the second connection member 1200 .

[0079] The first connection member 1100 may include a head 1110 and an insertion rod 1120 .

[0080] First, the top portion 1110 may be joined to the heating plate 21. For example, as described above, the top portion 1110 of the first connection member 1100 may be a portion joined to the heating plate 21 by active metal brazing.

[0081] In addition, the insertion rod 1120 may extend from the top portion 1110 and may be inserted into the second connection hole 1200 a of the second connection member 1200 .

[0082] In addition, the first connection hole 1100 a of the first connection member 1100 may have a structure formed to penetrate the top 1110 and the insertion rod 1120 .

[0083] The second connection member 1200 may include a housing 1210 and a fixing pipe 1220 .

[0084] First, the housing 1210 may be fastened to the second vacuum hole 22h. As an example, a thread may be formed on the inner circumferential surface of the second vacuum hole 22h of the heater cup 22, and correspondingly, a thread may be formed on the outer circumferential surface of the lower portion of the housing 1210. Therefore, the housing 1210 may be firmly fixed by being screwed into the second vacuum hole 22h of the heater cup 22.

[0085] The housing 1210 may be disposed toward the first connection member 1100, and the housing hole 1210a may be formed in the housing 1210. For example, in the drawings, the housing 1210 may have a structure extending upward in a state of being fastened to the second vacuum hole 22h, so that when the heating plate 21 is placed, the housing 1210 may be attached to the first connection member 1100 disposed thereon.

[0086] In addition, the fixing pipe 1220 can be installed in the housing hole 1210a of the housing 1210. As an example, the fixing pipe 1220 can be inserted into the housing hole 1210a and can be installed in a pressure-fitting manner. As another example, when the housing 1210 is formed of a steel material and the fixing pipe 1220 is formed of a silicone material, after the housing 1210 formed of the steel material is manufactured, the fixing pipe 1220 can be formed by injecting into the housing 1210. In addition, the mounting structure of the fixing pipe 1220 to the housing hole 1210a is not limited to the present disclosure, and any conventional mounting structure can be used as long as the fixing pipe 1220 is firmly fixed.

[0087] A fixing hole 1220a into which the insertion rod 1120 of the first connection member 1100 is inserted and press-fitted may be formed in the fixing tube 1220. Therefore, when the insertion rod 1120 of the first connection member 1100 is inserted into the second connection member 1200, the insertion rod 1120 may be inserted into and press-fitted into the fixing hole 1220a of the fixing tube 1220 installed in the housing 1210 of the second connection member 1200, so that the first connection member 1100 and the second connection member 1200 are assembled and fixed to each other.

[0088] In this case, the second connection hole 1200a of the second connection member 1200 may include a housing hole 1210a and a fixing hole 1220a.

[0089] In addition, the housing 1210 may be formed of a steel material, and the fixing pipe 1220 may be formed of a silicone material.

[0090] The silicone material of the fixing tube 1220 may be an elastic material, and when the insertion rod 1120 of the first connecting member 1100 is inserted into and press-fitted into the fixing hole 1220a of the fixing tube 1220, the insertion rod 1120 may be smoothly and easily inserted into the fixing hole 1220a. In addition, the fixing force of the insertion rod 1120 relative to the fixing tube 1220 may be improved.

[0091] In this case, the fixing pipe 1220 formed of the silicone material may have a structure surrounded by the housing 1210 formed of the steel material and the first connecting member 1100 formed of the steel material so as not to be thermally damaged even during a high-temperature substrate handling process. For example, the fixing pipe 1220 formed of the silicone material may be substantially only affected by relatively low temperatures because the high temperature during the substrate handling process is blocked by the housing 1210 and the first connecting member 1100 formed of the steel material.

[0092] In addition, heat-resistant silicone may be used as the silicone material of the fixing pipe 1220 .

[0093] In addition, a fixing inlet 1220 b connected to the fixing hole 1220 a may be formed in the fixing pipe 1220 , and an inner space of the fixing inlet 1220 b may be tapered toward the fixing hole 1220 a .

[0094] The fixing inlet 1220 b formed in a tapered shape in this manner may guide the insertion rod 1120 of the first connection member 1100 into the fixing hole 1220 a .

[0095] In addition, a curved protrusion 1221 may be formed on an inner side surface of the fixing hole 1220 a .

[0096] The curved protrusion 1221 may be formed to protrude from the inner side surface of the fixing hole 1220a and may have a surface having a curved shape instead of an angular shape. As an example, the curved protrusion 1221 may be formed in a convex shape on the inner side surface of the fixing hole 1220a.

[0097] In this manner, when the insertion rod 1120 of the first connection member 1100 is inserted into the fixing hole 1220a, the curved protrusion 1221 may also improve the fixing force of the insertion rod 1120 with respect to the fixing hole 1220a while the insertion rod 1120 is smoothly inserted.

[0098] As a result, the vacuum hole connector 1000 of the present disclosure can be used in a high temperature substrate processing process without being damaged due to high heat because the first connecting member 1100 and the second connecting member 1200 include a metal material. Therefore, the vacuum hole connector 1000 of the present disclosure can prevent leakage caused by heat damage to fully maintain the vacuum adsorption function and to relatively increase its lifespan. In addition, unlike the conventional silicone rubber tube 3, the vacuum hole connector 1000 of the present disclosure can prevent the generation of particles.

[0099] In addition, in the present disclosure, the first connecting member 1100 formed of a metal material and the heating plate 21 formed of a ceramic material can be joined to each other by active metal brazing (AMB) to form a joint of heterogeneous materials. To this end, in the vacuum hole connector 1000 of the present disclosure, the first connecting member 1100 formed of a metal material can be firmly fixed to the heating plate 21 formed of a ceramic material to prevent leakage between the heating plate 21 and the vacuum hole connector 1000 due to external force or high temperature.

[0100] In addition, according to the present disclosure, the insertion rod 1120 of the first connecting member 1100 can be inserted into and press-fitted into a fixing tube 1220 formed of a silicone material built into a shell 1210 formed of a steel material, so as to smoothly and easily insert the insertion rod 1120 into the fixing tube 1220, and further, to improve the fixing force of the insertion rod 1120 relative to the fixing tube 1220.

[0101] The vacuum hole connector of the present disclosure can be used in a high temperature substrate processing process without being damaged by high heat because the first connecting member and the second connecting member include metal materials. As a result, the vacuum hole connector of the present disclosure can prevent leakage caused by heat damage to maintain the vacuum adsorption function, increase the life span, and prevent the generation of particles.

[0102] In addition, according to the present disclosure, the first connection member formed of a metal material and the heating plate formed of a ceramic material can be joined to each other by active metal brazing (AMB) to form a joint of heterogeneous materials. Therefore, the occurrence of leakage between the heating plate and the vacuum hole connector can be prevented.

[0103] In addition, in the present disclosure, the insertion rod of the first connecting member can be inserted and press-fitted into a fixing tube formed of a silicone material built into a shell formed of a steel material, so as to smoothly and easily insert the insertion rod into the fixing tube, and further, to improve the fixing force of the insertion rod relative to the fixing tube.

[0104] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A vacuum hole connector, comprising: a first connecting member fixed to a lower portion of the first vacuum hole of the heating plate, and a first connecting hole formed in the first connecting member; as well as a second connecting member installed in the second vacuum hole of the heater cup, attached to the first connecting member, and a second connecting hole formed in the second connecting member, The first connecting member and the second connecting member include metal materials, and when the first connecting member and the second connecting member are assembled, the first vacuum hole is connected to the second vacuum hole through the first connecting hole and the second connecting hole.

2. The vacuum hole connector according to claim 1, wherein: The first connection member formed of the metal material is joined to the heating plate formed of the ceramic material by active metal brazing to form a joint of heterogeneous materials.

3. The vacuum hole connector according to claim 1, wherein: The first connecting member comprises: a top portion joined to the heating plate; and an insertion rod extending from the top and inserted into the second connection hole of the second connection member, Wherein, the first connecting hole is formed to pass through the top and the insertion rod.

4. The vacuum hole connector according to claim 3, wherein: The second connecting member comprises: a housing fastened to the second vacuum hole, disposed toward the first connection member, and having a housing hole formed in the housing; and a fixing pipe installed in the housing hole and having a fixing hole through which the insertion rod of the first connecting member is inserted and press-fitted, Wherein, the second connecting hole includes the shell hole and the fixing hole.

5. The vacuum hole connector according to claim 4, wherein: The housing is formed of a steel material, and the fixing pipe is formed of a silicone material.

6. The vacuum port connector according to claim 4, wherein: A fixing inlet connected to the fixing hole is formed in the fixing pipe, and an inner space of the fixing inlet is tapered toward the fixing hole.

7. The vacuum hole connector according to claim 4, wherein: A curved protrusion is formed on an inner side surface of the fixing hole.

8. A substrate support, comprising: a heating plate in which a heater and an electrical terminal connected to the heater are mounted; a heater cup in which a bottom portion having support pins for supporting the heating plate is formed; as well as a vacuum port connector, connecting the heating plate and the heater cup, and supporting the heating plate, Wherein, the vacuum hole connector comprises: a first connection member fixed to a lower portion of the first vacuum hole of the heating plate, and in which a first connection hole is formed; and a second connecting member installed in the second vacuum hole of the heater cup, and a second connecting hole is formed in the second connecting member, The first connecting member and the second connecting member include metal materials, and when the first connecting member and the second connecting member are assembled, the first vacuum hole is connected to the second vacuum hole through the first connecting hole and the second connecting hole.

9. The substrate support according to claim 8, wherein: The first connection member formed of the metal material is joined to the heating plate formed of the ceramic material by active metal brazing to form a joint of heterogeneous materials.

10. The substrate support according to claim 8, wherein: The first connecting member comprises: a top portion joined to the heating plate; and an insertion rod extending from the top and inserted into the second connection hole of the second connection member, Wherein, the first connecting hole is formed to pass through the top and the insertion rod.

11. The substrate support according to claim 10, wherein: The second connecting member comprises: a housing fastened to the second vacuum hole, disposed toward the first connection member, and having a housing hole formed in the housing; and a fixing pipe installed in the housing hole and having a fixing hole through which the insertion rod of the first connecting member is inserted and press-fitted, Wherein, the second connecting hole includes the shell hole and the fixing hole.

12. The substrate support according to claim 11, wherein: The housing is formed of a steel material, and the fixing pipe is formed of a silicone material.

13. The substrate support according to claim 11, wherein: A fixing inlet connected to the fixing hole is formed in the fixing pipe, and an inner space of the fixing inlet is tapered toward the fixing hole.

14. The substrate support according to claim 11, wherein: A curved protrusion is formed on an inner side surface of the fixing hole.

15. A substrate processing device comprising: a processing chamber, comprising an upper body and a lower body to form a processing space in the processing chamber; a substrate supporter disposed in the processing space and supporting and heating the substrate; as well as a substrate lifting / lowering unit including a lifting / lowering pin that is lifted or lowered while passing through the substrate supporter, and a pin driving member that lifts or lowers the lifting / lowering pin, Wherein, the substrate support comprises: a heating plate in which a heater and an electrical terminal connected to the heater are mounted; a heater cup in which a bottom having support pins for supporting the heater plate is formed; and a vacuum port connector, connecting the heating plate and the heater cup, and supporting the heating plate, Wherein, the vacuum hole connector comprises: a first connection member fixed to a lower portion of the first vacuum hole of the heating plate, and in which a first connection hole is formed; and a second connecting member installed in the second vacuum hole of the heater cup, and a second connecting hole is formed in the second connecting member, The first connecting member and the second connecting member include metal materials, and when the first connecting member and the second connecting member are assembled, the first vacuum hole is connected to the second vacuum hole through the first connecting hole and the second connecting hole.

16. The substrate processing apparatus according to claim 15, wherein: The first connection member formed of the metal material is joined to the heating plate formed of the ceramic material by active metal brazing to form a joint of heterogeneous materials.

17. The substrate processing apparatus according to claim 15, wherein: The first connecting member comprises: a top portion joined to the heating plate; and an insertion rod extending from the top and inserted into the second connection hole of the second connection member, Wherein, the first connecting hole is formed to pass through the top and the insertion rod.

18. The substrate processing apparatus according to claim 17, wherein: The second connecting member comprises: a housing fastened to the second vacuum hole, disposed toward the first connection member, and having a housing hole formed in the housing; and a fixing pipe installed in the housing hole and having a fixing hole through which the insertion rod of the first connecting member is inserted and press-fitted, Wherein, the second connecting hole includes the shell hole and the fixing hole.

19. The substrate processing apparatus according to claim 18, wherein: The housing is formed of a steel material, and the fixing pipe is formed of a silicone material.

20. The substrate processing apparatus according to claim 18, wherein: A fixing inlet connected to the fixing hole is formed in the fixing pipe, and an inner space of the fixing inlet is tapered toward the fixing hole, and A curved protrusion is formed on an inner side surface of the fixing hole.

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