Packaging structure of communication interface chip and preparation method thereof

Abstract

The invention discloses a packaging structure of a communication interface chip and a preparation method thereof, the packaging structure comprises a bottom shell, a top shell, a chip body and a moving plate, the outer wall of the bottom of the top shell is provided with a connecting block, the outer wall of the top of the bottom shell is provided with a slot, the connecting block is inserted in the slot, the bottom shell is internally provided with a cavity, and the bottom shell is internally provided with a through hole; and a moving block is slidably connected to the interior of the cavity, an inserting block is fixedly arranged on the outer wall of one side of the moving block, the inserting block is inserted into the connecting block, and a push-back spring connected with the moving block is arranged on the inner wall of the cavity. The device has the beneficial effects that the long-neck screw is rotated to drive the extrusion body to move to extrude the pushing block, the pushing block can drive the moving block and the inserting block to move, the inserting block is inserted into the connecting block, the moving block can be fixed, and then the top shell is fixed, so that the device is very convenient to disassemble due to convenient assembly steps, and the assembly efficiency is improved. The function of conveniently disassembling and assembling the top shell and the bottom shell can be realized, so that the efficiency is higher when electric elements in the packaging structure are overhauled.

Description

Technical Field

[0001] The present invention relates to the technical field of communication interface chips, and in particular to a packaging structure of a communication interface chip and a preparation method thereof. Background Art

[0002] A communication interface chip is an integrated circuit used for communication interface transceiver data communication, which is mainly responsible for sending and receiving data between different devices or systems.

[0003] For example, a communication chip packaging structure and a communication device with application number CN 204792756 U and announcement date 2015.11.18, the communication chip packaging structure includes a carrier body, a communication chip, one or more memory chips and a plurality of peripheral pins arranged outside the carrier body, the communication chip is attached to the carrier body, the communication chip is electrically connected to the peripheral pins, the memory chip is attached to the carrier body or at least partially overlapped on the communication chip, and the memory chip is electrically connected to the communication chip.

[0004] The packaging structure of the communication interface chip mentioned above and in the prior art is not convenient for disassembly and assembly of the shell. When the electrical components inside the packaging structure need to be inspected and repaired, a lot of time needs to be wasted on disassembly and assembly. In addition, the electrical components inside the packaging structure will generate heat during operation. If the heat cannot be dissipated in time, the electrical components inside the packaging structure are easily burned as the temperature rises. Therefore, it is urgent to design a packaging structure of a communication interface chip and a preparation method thereof to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a packaging structure of a communication interface chip and a preparation method thereof, so as to solve the above-mentioned deficiencies in the prior art.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] The invention relates to a packaging structure of a communication interface chip, comprising a bottom shell, a top shell, a chip body and a movable plate, wherein a connecting block is arranged on the outer wall at the bottom of the top shell, a slot is arranged on the outer wall at the top of the bottom shell, the connecting block is plugged into the inside of the slot, a cavity is arranged inside the bottom shell, and a moving block is slidably connected to the inside of the cavity, an inserting block is fixedly arranged on the outer wall on one side of the moving block, and the inserting block is plugged into the inside of the connecting block, a push-back spring connected to the moving block is arranged on the inner wall of the cavity, a push-off block is arranged on the outer wall on the other side of the moving block away from the inserting block, an extrusion body is slidably connected to the inside of the cavity, a long-necked screw is threadedly inserted on the outer wall on one side of the bottom shell, and one end of the long-necked screw located in the cavity is rotatably connected to the extrusion body through a bearing, a guide sleeve is arranged inside the cavity, a guide rod is fixedly arranged on the outer wall on one side of the extrusion body, and the guide rod is slidably inserted into the inside of the guide sleeve;

[0008] A heat sink is fixedly arranged on the top of the top shell, and a plurality of heat sink fins are arranged on the outer wall of the top of the heat sink, a heat conductive block is fixedly arranged on the outer wall of the bottom of the heat sink, the chip body is arranged inside the bottom shell, the bottom outer wall of the heat conductive block is fitted with the top outer wall of the chip body, a support frame is fixedly arranged on the outer wall of the top of the top shell, and a heat sink fan is fixedly arranged on the support frame.

[0009] Furthermore, a fixing seat is arranged on the inner wall of the bottom of the bottom shell, and both ends of the chip body are clamped inside the fixing seat, and a pressing block is rotatably connected to the top of the fixing seat, and the bottom outer wall of the pressing block contacts the top outer wall of the chip body.

[0010] Furthermore, a rotating block is arranged on the outer wall at the bottom of the pressing block, rotating rods are arranged on the outer walls on both sides of the rotating block, a limiting groove is opened on the top of the fixing seat, and the rotating rod is rotatably connected to the inside of the limiting groove through a bearing.

[0011] Furthermore, a torsion spring connected to the rotating block is arranged on the inner wall of the limiting groove, and the torsion spring is sleeved on the outside of the rotating rod.

[0012] Furthermore, an auxiliary block is arranged on the outer wall of the bottom of the pressing block, and the auxiliary block is rotatably connected to the inside of the fixing seat.

[0013] Furthermore, sliding blocks are provided on the outer walls of the bottoms of both ends of the movable plate, and a plurality of cleaning brushes are provided on the outer wall of the bottom of the movable plate. The cleaning brushes and the heat dissipation fins are distributed in an alternating structure.

[0014] Furthermore, a slide rod is fixedly provided on the outer wall of the top shell, and the slider is slidably sleeved on the outside of the slide rod. One end of the slide rod is provided with a push spring connected to the slider, and the push spring is sleeved on the outside of the slide rod.

[0015] Furthermore, a support seat is arranged on the inner wall of the bottom of the bottom shell, and a buffer air bag is arranged inside the support seat, and the top of the buffer air bag is in contact with the chip body.

[0016] Furthermore, the outer walls on both sides of the bottom shell are provided with card slots, and pins are placed inside the card slots, and the pins are electrically connected to the chip body through wires.

[0017] A method for preparing a packaging structure of a communication interface chip, applied to the packaging structure of the communication interface chip, comprises the following preparation steps:

[0018] S1. When preparing the bottom shell, a cavity is set inside the bottom shell, and then the moving block, the insert block, the push back spring, the push block, the extrusion body, the long neck screw, the guide sleeve and the guide rod are installed inside the cavity according to the positions in the figure;

[0019] S2. Plastic weld the fixed seat to the inner wall of the bottom shell, and then install the rotating block, rotating rod, limiting groove, torsion spring and auxiliary block at the corresponding positions of the fixed seat according to the positions in the figure;

[0020] S3, soldering the heat sink to the bottom of the heat conducting block, then soldering the heat sink fin to the top of the heat conducting block, and finally fixing the heat conducting block to the top of the top shell;

[0021] S4, fixing the guide rod with the slider and the push spring on the outer wall of the top of the top shell, and then fixing the cleaning brush on the outer wall of the top of the slider, and making the cleaning brush alternately distributed on the heat dissipation fins, and the cleaning brush contacts the outer wall of the heat dissipation fins;

[0022] S5, fixing the support frame to the outer wall of the top of the top shell, and then fixing the cooling fan to the support frame, the cooling fan is located directly above the center of the cooling fins;

[0023] S6, flip the pressing block, clamp the chip body inside the fixing seat, release the pressing block, the torsion force of the torsion spring will drive the rotating block and the pressing block to rotate, the pressing block presses and fixes the chip body, so that the chip body is fixed inside the fixing seat;

[0024] S7. Cover the top shell on the bottom shell, and insert the connecting block into the slot. Turn the long-neck screw to push the extrusion body to move, so that the extrusion body pushes the inclined surface of the push block to move and the push block moves. When the push block moves, it will drive the moving block and the insert block to move, so that the insert block is inserted into the inside of the moving block, which can fix the moving block and then fix the top shell. The bottom shell and the top shell are installed, and the complete packaging structure is prepared.

[0025] In the above technical solution, the present invention provides a packaging structure of a communication interface chip and a preparation method thereof.

[0026] (1) By providing the bottom shell, top shell, connecting block, slot, cavity, moving block, plug-in block, push-back spring, push block, extrusion body, long-neck screw, guide sleeve and guide rod, the long-neck screw is rotated to drive the extrusion body to move and squeeze the push block, so that the push block can drive the moving block and the plug-in block to move, and the plug-in block is plugged into the inside of the connecting block, so that the moving block can be fixed, and then the top shell is also fixed. Since the assembly steps are convenient, it is also convenient to disassemble, and the function of facilitating the disassembly and assembly of the top shell and the bottom shell can be realized, so that the efficiency is higher when the electrical components inside the packaging structure are inspected and repaired;

[0027] (2) By providing a chip body, a heat sink, heat sink fins, a heat conducting block, a support frame and a heat sink fan, the chip body generates heat during operation, and the heat conducting block can transfer the heat to the heat sink, and the heat sink fins can dissipate the heat to the outside of the top shell, and the heat sink fan blows the heat away from the packaging structure, thereby achieving a heat dissipation function and avoiding the situation where the heat cannot be dissipated in time and the chip body is burned;

[0028] (3) By setting a fixed seat, a pressing block, a rotating block, a rotating rod, a limiting groove, a torsion spring and an auxiliary block, the pressing block is rotated. At this time, the torsion spring stores force, and the chip body is stuck inside the fixed seat. When the pressing block is released, the torsion spring drives the rotating block to rotate, and then drives the pressing block to rotate and hold the top of the chip body, thereby realizing the function of facilitating the fixing of the chip body;

[0029] (4) By providing a movable plate, a cleaning brush, a slider, a slide rod and a pushing spring, the cleaning brush can be pushed by the movable plate to move in contact with the outer wall of the heat sink fin, thereby cleaning the dust on the heat sink fin and preventing the dust from adhering to and affecting the heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0031] Figure 1 A three-dimensional structural schematic diagram is provided for a packaging structure of a communication interface chip and a preparation method thereof according to an embodiment of the present invention.

[0032] Figure 2 A schematic diagram of the top view of the internal structure of a bottom shell provided in an embodiment of a packaging structure of a communication interface chip and a method for preparing the same according to the present invention.

[0033] Figure 3 The present invention provides a schematic diagram of the internal side structure of a communication interface chip packaging structure and a method for preparing the same in an embodiment.

[0034] Figure 4 The present invention provides a schematic diagram of the internal front view structure of a communication interface chip packaging structure and a method for preparing the same in an embodiment.

[0035] Figure 5 A schematic diagram of a top view of a fixing seat provided in an embodiment of a packaging structure of a communication interface chip and a method for preparing the same according to the present invention.

[0036] Figure 6 A schematic diagram of a top view of a compression block provided in an embodiment of a packaging structure of a communication interface chip and a method for preparing the same according to the present invention.

[0037] Description of reference numerals:

[0038] 1. Bottom shell; 2. Top shell; 3. Connecting block; 4. Slot; 5. Cavity; 6. Moving block; 7. Inserting block; 8. Push-back spring; 9. Pushing block; 10. Extrusion body; 11. Long-necked screw; 12. Guide sleeve; 13. Guide rod; 14. Chip body; 15. Fixed seat; 16. Pressing block; 17. Rotating block; 18. Rotating rod; 19. Limiting groove; 20. Torsion spring; 21. Auxiliary block; 22. Heat sink; 23. Heat sink fin; 24. Heat conducting block; 25. Support frame; 26. Heat sink fan; 27. Moving plate; 28. Cleaning brush; 29. ​​Slider; 30. Sliding rod; 31. Pushing spring; 32. Support seat; 33. Buffer airbag; 34. Pin; 35. Card release slot. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0040] like Figure 1-6 As shown, a packaging structure of a communication interface chip provided by an embodiment of the present invention comprises a bottom shell 1, a top shell 2, a chip body 14 and a movable plate 27, a connection block 3 is arranged on the outer wall of the bottom of the top shell 2, a slot 4 is opened on the outer wall of the top of the bottom shell 1, the connection block 3 is plugged into the inside of the slot 4, a cavity 5 is arranged inside the bottom shell 1, and a movable block 6 is slidably connected inside the cavity 5, an inserting block 7 is fixedly arranged on the outer wall of one side of the movable block 6, and the inserting block 7 is plugged into the inside of the connection block 3, and a slot 4 is opened on the outer wall of the top of the bottom shell 1, and the connection block 3 is plugged into the inside of the slot 4, a cavity 5 is arranged inside the bottom shell 1, and a movable block 6 is slidably connected inside the cavity 5, an inserting block 7 is fixedly arranged on the outer wall of one side of the movable block 6, and the inserting block 7 is plugged into the inside of the connection block 3, and a slot 4 is opened on the inner wall of the cavity 5 A push-back spring 8 connected to the moving block 6 is arranged, a push block 9 is arranged on the outer wall of the moving block 6 on the other side away from the insert block 7, an extrusion body 10 is slidably connected to the inside of the cavity 5, a long-necked screw 11 is threadedly inserted on the outer wall of one side of the bottom shell 1, and one end of the long-necked screw 11 located inside the cavity 5 is rotatably connected to the extrusion body 10 through a bearing, a guide sleeve 12 is arranged inside the cavity 5, a guide rod 13 is fixedly arranged on the outer wall of one side of the extrusion body 10, and the guide rod 13 is slidably inserted into the inside of the guide sleeve 12;

[0041] A heat sink 22 is fixedly provided on the top of the top shell 2, and a plurality of heat sink fins 23 are provided on the outer wall of the top of the heat sink 22, a heat conductive block 24 is fixedly provided on the outer wall of the bottom of the heat sink 22, the chip body 14 is arranged inside the bottom shell 1, the bottom outer wall of the heat conductive block 24 is fitted with the top outer wall of the chip body 14, a support frame 25 is fixedly provided on the outer wall of the top of the top shell 2, and a heat sink fan 26 is fixedly provided on the support frame 25.

[0042] A packaging structure of a communication interface chip provided by the present invention comprises a bottom shell 1, a top shell 2, a chip body 14 and a movable plate 27, a connecting block 3 is arranged on the outer wall of the bottom of the top shell 2, a slot 4 is opened on the outer wall of the top of the bottom shell 1, the connecting block 3 is plugged into the inside of the slot 4, a cavity 5 is arranged inside the bottom shell 1, and a moving block 6 is slidably connected inside the cavity 5, an inserting block 7 is fixedly arranged on the outer wall on one side of the moving block 6, and the inserting block 7 is plugged into the inside of the connecting block 3, a push-back spring 8 connected to the moving block 6 is arranged on the inner wall of the cavity 5, a push block 9 is arranged on the outer wall on the other side of the moving block 6 away from the inserting block 7, an extrusion body 10 is slidably connected inside the cavity 5, a long-necked screw 11 is threadedly inserted on the outer wall on one side of the bottom shell 1, and one end of the long-necked screw 11 located inside the cavity 5 is rotatably connected to the extrusion body 10 through a bearing, a guide sleeve 12 is arranged inside the cavity 5, and a guide sleeve 12 is fixedly arranged on the outer wall on one side of the extrusion body 10 Rod 13, guide rod 13 is slidably inserted in the interior of guide sleeve 12; rotating the long neck screw 11 can drive the extrusion body 10 to move the push block 9, and the push block 9 drives the moving block 6 and the plug block 7 to move, so that the plug block 7 is plugged into the interior of the connecting block 3, and the top shell 2 and the bottom shell 1 can be assembled, so as to realize the function of easy assembly and disassembly, which is beneficial to maintenance. A heat sink 22 is fixedly arranged on the top of the top shell 2, and a plurality of heat sink fins 23 are arranged on the outer wall of the top of the heat sink 22, and a heat conducting block 24 is fixedly arranged on the outer wall of the bottom of the heat sink 22, and the chip body 14 is arranged in the interior of the bottom shell 1, and the bottom outer wall of the heat conducting block 24 is fitted with the top outer wall of the chip body 14, and a support frame 25 is fixedly arranged on the outer wall of the top of the top shell 2, and a heat dissipation fan 26 is fixedly arranged on the support frame 25, and the heat conducting block 24 can transfer the heat generated by the chip body 14 to the heat sink 22 and then dissipate it through the heat sink fins 23, so as to realize the function of heat dissipation of the chip body 14.

[0043] In one embodiment of the present invention, a fixing seat 15 is provided on the inner wall of the bottom of the bottom shell 1, and both ends of the chip body 14 are clamped inside the fixing seat 15, a pressing block 16 is rotatably connected to the top of the fixing seat 15, and the bottom outer wall of the pressing block 16 contacts the top outer wall of the chip body 14, a rotating block 17 is provided on the outer wall of the bottom of the pressing block 16, and a rotating rod 18 is provided on the outer walls on both sides of the rotating block 17, a limiting groove 19 is provided on the top of the fixing seat 15, and the rotating rod 18 is rotatably connected to the inside of the limiting groove 19 through a bearing, a torsion spring 20 connected to the rotating block 17 is provided on the inner wall of the limiting groove 19, and the torsion spring 20 is sleeved on the outside of the rotating rod 18, an auxiliary block 21 is provided on the outer wall of the bottom of the pressing block 16, and the auxiliary block 21 is rotatably connected to the inside of the fixing seat 15, and the torsional force of the torsion spring 20 can drive the pressing block 16 to rotate and press and fix the chip body 14.

[0044] In another embodiment provided by the present invention, sliders 29 are provided on the outer walls at the bottom of both ends of the movable plate 27, and a plurality of cleaning brushes 28 are provided on the outer wall at the bottom of the movable plate 27. The cleaning brushes 28 and the heat dissipation fins 23 are distributed in an alternating structure. A slide bar 30 is fixedly provided on the outer wall at the top of the top shell 2, and the slider 29 is slidably sleeved on the outside of the slide bar 30. A pushing spring 31 connected to the slider 29 is provided at one end of the slide bar 30, and the pushing spring 31 is sleeved on the outside of the slide bar 30. Pushing the movable plate 27 to drive the cleaning brush 28 to move can clean the dust on the heat dissipation fins 23.

[0045] In another embodiment provided by the present invention, a support seat 32 is provided on the inner wall of the bottom of the bottom shell 1, and a buffer airbag 33 is provided inside the support seat 32, and the top of the buffer airbag 33 is in contact with the chip body 14, and the buffer airbag 33 can protect the chip body 14.

[0046] In an embodiment provided by the present invention, a card slot 35 is provided on the outer walls on both sides of the bottom shell 1, and a pin 34 is carded inside the card slot 35. The pin 34 is electrically connected to the chip body 14 through a wire, and the card slot 35 is used to limit the pin 34.

[0047] A method for preparing a packaging structure of a communication interface chip, applied to the packaging structure of the communication interface chip, comprises the following preparation steps:

[0048] S1. When preparing the bottom shell 1, a cavity 5 is set inside the bottom shell 1, and then the moving block 6, the insert block 7, the push back spring 8, the push block 9, the extrusion body 10, the long neck screw 11, the guide sleeve 12 and the guide rod 13 are installed inside the cavity 5 according to the positions in the figure;

[0049] S2, plastic-weld the fixing seat 15 to the inner wall of the bottom shell 1, and then install the rotating block 17, the rotating rod 18, the limiting groove 19, the torsion spring 20 and the auxiliary block 21 at the corresponding positions of the fixing seat 15 according to the positions in the figure;

[0050] S3, solder the heat sink 22 to the bottom of the heat conducting block 24, then solder the heat sink fins 23 to the top of the heat conducting block 24, and finally fix the heat conducting block 24 to the top of the top shell 2;

[0051] S4, fix the guide rod with the slide block 29 and the push spring 31 on the outer wall of the top of the top shell 2, and then fix the cleaning brush 28 on the outer wall of the top of the slide block 29, and make the cleaning brush 28 alternately distributed on the heat dissipation fins 23, and the cleaning brush 28 contacts the outer wall of the heat dissipation fins 23;

[0052] S5, fix the support frame 25 to the outer wall of the top of the top shell 2, and then fix the heat dissipation fan 26 to the support frame 25, and the heat dissipation fan 26 is located just above the center of the heat dissipation fin 23;

[0053] S6, flip the pressing block 16, clamp the chip body 14 inside the fixing seat 15, release the pressing block 16, the torsion force of the torsion spring 20 will drive the rotating block 17 and the pressing block 16 to rotate, and the pressing block 16 presses and fixes the chip body 14, so that the chip body 14 is fixed inside the fixing seat 15;

[0054] S7. Cover the top shell 2 on the bottom shell 1, and insert the connecting block 3 into the slot 4. Turn the long-necked screw 11 to push the extrusion body 10 to move, so that the extrusion body 10 pushes the inclined surface of the push block 9 to move, and the push block 9 moves. When the push block 9 moves, it will drive the moving block 6 and the insert block 7 to move, so that the insert block 7 is inserted into the inside of the moving block 6, which can fix the moving block 6, and then fix the top shell 2. The bottom shell 1 and the top shell 2 are installed, and the complete packaging structure is prepared.

[0055] Working principle: put the top shell 2 cover on the bottom shell 1, turn the long neck screw 11 to drive the extrusion body 10 to move the push block 9, the push block 9 drives the moving block 6 and the plug block 7 to move, and can fix the connecting block 3, and can assemble the top shell 2 and the bottom shell 1 to realize the functions of easy assembly and disassembly, and easy maintenance. The chip body 14 will generate heat during operation, and the heat conductive block 24 will transfer the heat to the heat dissipation block 22 and dissipate it through the heat dissipation fins 23, which can have a heat dissipation function for the chip body 14, flip the pressing block 16, so that the pressing block 16 can be rotated to one side from the chip body 14, and the chip body 14 can be removed from the fixing seat 15 for maintenance, and the moving plate 27 is pushed to drive the cleaning brush 28 to move, so as to clean the dust on the heat dissipation fins 23, and prevent the dust from affecting the heat dissipation of the heat dissipation fins 23.

[0056] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A packaging structure of a communication interface chip, comprising a bottom shell (1), a top shell (2), a chip body (14) and a moving plate (27), characterized in that: A connecting block (3) is arranged on the outer wall of the bottom of the top shell (2); a slot (4) is provided on the outer wall of the top of the bottom shell (1); the connecting block (3) is plugged into the slot (4); a cavity (5) is arranged inside the bottom shell (1); a moving block (6) is slidably connected inside the cavity (5); an inserting block (7) is fixedly arranged on the outer wall of one side of the moving block (6); the inserting block (7) is plugged into the connecting block (3); a push-back spring (8) connected to the moving block (6) is arranged on the inner wall of the cavity (5); the moving block (6) is 6) A push block (9) is provided on the outer wall on the other side away from the plug block (7); an extrusion body (10) is slidably connected to the interior of the cavity (5); a long-necked screw (11) is threadedly inserted on the outer wall on one side of the bottom shell (1); and one end of the long-necked screw (11) located inside the cavity (5) is rotatably connected to the extrusion body (10) through a bearing; a guide sleeve (12) is provided inside the cavity (5); a guide rod (13) is fixedly provided on the outer wall on one side of the extrusion body (10); and the guide rod (13) is slidably inserted into the interior of the guide sleeve (12); A heat sink (22) is fixedly arranged on the top of the top shell (2), and a plurality of heat sink fins (23) are arranged on the outer wall of the top of the heat sink (22); a heat conduction block (24) is fixedly arranged on the outer wall of the bottom of the heat sink (22); the chip body (14) is arranged inside the bottom shell (1), and the bottom outer wall of the heat conduction block (24) is in contact with the top outer wall of the chip body (14); a support frame (25) is fixedly arranged on the outer wall of the top of the top shell (2), and a heat dissipation fan (26) is fixedly arranged on the support frame (25).

2. The packaging structure of a communication interface chip according to claim 1, characterized in that: A fixing seat (15) is arranged on the inner wall of the bottom of the bottom shell (1), and both ends of the chip body (14) are clamped inside the fixing seat (15). A pressing block (16) is rotatably connected to the top of the fixing seat (15), and the bottom outer wall of the pressing block (16) is in contact with the top outer wall of the chip body (14).

3. The packaging structure of a communication interface chip according to claim 2, characterized in that: A rotating block (17) is arranged on the outer wall at the bottom of the pressing block (16), rotating rods (18) are arranged on the outer walls on both sides of the rotating block (17), a limiting groove (19) is provided on the top of the fixing seat (15), and the rotating rod (18) is rotatably connected to the inside of the limiting groove (19) through a bearing.

4. The packaging structure of a communication interface chip according to claim 3, characterized in that: A torsion spring (20) connected to the rotating block (17) is arranged on the inner wall of the limiting groove (19), and the torsion spring (20) is sleeved on the outside of the rotating rod (18).

5. The packaging structure of a communication interface chip according to claim 4, characterized in that: An auxiliary block (21) is arranged on the outer wall of the bottom of the pressing block (16), and the auxiliary block (21) is rotatably connected to the inside of the fixing seat (15).

6. The packaging structure of a communication interface chip according to claim 1, characterized in that: Slide blocks (29) are provided on the outer walls at the bottom of both ends of the movable plate (27), and a plurality of cleaning brushes (28) are provided on the outer wall at the bottom of the movable plate (27). The cleaning brushes (28) and the heat dissipation fins (23) are distributed in an alternating structure.

7. The packaging structure of a communication interface chip according to claim 6, characterized in that: A slide bar (30) is fixedly arranged on the outer wall of the top of the top shell (2), and the slider (29) is slidably sleeved on the outside of the slide bar (30). A push spring (31) connected to the slider (29) is arranged at one end of the slide bar (30), and the push spring (31) is sleeved on the outside of the slide bar (30).

8. The packaging structure of a communication interface chip according to claim 1, characterized in that: A support seat (32) is arranged on the inner wall of the bottom of the bottom shell (1), and a buffer air bag (33) is arranged inside the support seat (32), and the top of the buffer air bag (33) is in contact with the chip body (14).

9. The packaging structure of a communication interface chip according to claim 1, characterized in that: The outer walls on both sides of the bottom shell (1) are provided with a card slot (35), and pins (34) are inserted into the card slots (35). The pins (34) are electrically connected to the chip body (14) via wires.

10. A method for preparing a packaging structure of a communication interface chip, applied to a packaging structure of a communication interface chip as claimed in any one of claims 1 to 9, characterized in that: The method comprises the following preparation steps: S1. When preparing the bottom shell (1), a cavity (5) is provided inside the bottom shell (1), and then the moving block (6), the insert block (7), the push-back spring (8), the push block (9), the extrusion body (10), the long-neck screw (11), the guide sleeve (12) and the guide rod (13) are installed inside the cavity (5) according to the positions shown in the figure; S2, plastic welding the fixed seat (15) to the inner wall of the bottom shell (1), and then installing the rotating block (17), the rotating rod (18), the limiting groove (19), the torsion spring (20) and the auxiliary block (21) at the corresponding positions of the fixed seat (15) according to the positions in the figure; S3, soldering the heat sink (22) to the bottom of the heat conducting block (24), then soldering the heat sink fins (23) to the top of the heat conducting block (24), and finally fixing the heat conducting block (24) to the top of the top shell (2); S4, fixing the guide rod on which the slider (29) and the push spring (31) are mounted on the outer wall of the top of the top shell (2), and then fixing the cleaning brush (28) on the outer wall of the top of the slider (29), and making the cleaning brush (28) alternately distributed on the heat dissipation fins (23), so that the cleaning brush (28) contacts the outer wall of the heat dissipation fins (23); S5, fixing the support frame (25) on the outer wall of the top of the top shell (2), and then fixing the heat dissipation fan (26) on the support frame (25), wherein the heat dissipation fan (26) is located directly above the center of the heat dissipation fins (23); S6, flip the pressing block (16) to clamp the chip body (14) inside the fixing seat (15), release the pressing block (16), the torsion force of the torsion spring (20) will drive the rotating block (17) and the pressing block (16) to rotate, and the pressing block (17) will press and fix the chip body (14), so that the chip body (14) is fixed inside the fixing seat (15); S7. Cover the top shell (2) on the bottom shell (1), and insert the connecting block (3) into the slot (4). Turn the long-necked screw (11) to push the extrusion body (10) to move, so that the extrusion body (10) pushes the inclined surface of the push block (9) to move, and the push block (9) moves. When the push block (9) moves, it will drive the moving block (6) and the insert block (7) to move, so that the insert block (7) is inserted into the inside of the moving block (6), which can fix the moving block (6) and further fix the top shell (2). The bottom shell (1) and the top shell (2) are installed, and the complete packaging structure is prepared.

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